JP2018041877A - Device for adhering adhesive sheet to substrate and adhesion method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adhere an adhesion tape such as a protective tape without being contacted to an inner peripheral surface of a wafer.SOLUTION: An adhesion tape attachment device comprises an adhesion tape conveying body g that holds an adhesion tape T cut in a form of a substrate W to a suction table 59 in an upper chamber 50, transmits the v onto a lower chamber 9, and adheres the adhesion tape onto the substrate W held by an adhesion table 8 of the lower chamber 9. The adhesion table 8 comprises: a table concave part 8b in which a gas introduction hole 24 is provided; and an external peripheral holding part 15 that holds an external peripheral edge part of the substrate W. A vacuum chamber is formed by the upper chamber 50 and the lower chamber 9. After a pressure of the vacuum chamber is reduced and the adhesion tape T is adhered onto the substrate W, a gas is introduced from the gas introduction hole 24 when opening the pressure. Thus, the pressure of the substrate W is applied to the suction table 59 from a back surface side.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an attaching device and an attaching method for attaching an adhesive sheet such as a protective tape to a substrate such as a wafer.

  Conventionally, a circuit pattern is formed on the surface of a semiconductor wafer (hereinafter simply referred to as a wafer), a protective tape is applied to the circuit pattern on the wafer surface, and then the back surface of the wafer is ground to thin the wafer. Has been done.

  As a method of attaching the protective tape to the wafer, there is known a protective tape attaching device that applies the adhesive under reduced pressure so that wrinkles and bubbles do not enter (for example, Patent Document 1).

  In the protective tape attaching apparatus, the protective tape, which has been cut in the shape of a wafer in advance, is adsorbed and held on an adsorbing carrier integrated with the upper chamber, and the wafer is held on the adhering table in the lower chamber. A vacuum chamber is formed by lowering the upper chamber. Then, the inside of the vacuum chamber is depressurized, and the protective tape held on the suction conveyance body is pressed against the wafer in the vacuum chamber so as to be attached to the wafer. Therefore, wrinkles and bubbles are prevented from entering the protective tape to be attached.

  Recently, along with the miniaturization of portable terminals and the like, it has been attempted to reduce the size by forming a thinner wafer. With the thinning of the wafer, handling of the wafer has become difficult. Therefore, in order to facilitate the handling of the wafer, a concave wafer is used in which only the outer periphery of the wafer is left and the inner peripheral portion is ground to form an annular convex portion (for example, Patent Documents). 2).

  FIG. 10 shows an example of the wafer W on which the annular convex portion 80 is formed. The wafer W is viewed from the back surface (partially cut away for easy understanding). In the wafer W, the inner peripheral portion of the wafer W surrounded by the annular convex portion 80 is ground, leaving the annular convex portion 80, and a concave surface 81 is formed.

  FIG. 11 shows an example of the process of forming the wafer W on which the annular convex portion is formed and processing the wafer W. Hereinafter, the processing steps for the wafer W will be described with reference to FIGS. 11A to 11H.

  A wafer W having a circuit pattern (not shown) formed on the surface is prepared as shown in FIG. 11A, and a protective tape T is attached to the circuit pattern as shown in FIG. 11B.

  Next, as shown in FIG. 11C, the inner peripheral portion of the wafer W surrounded by the annular convex portion 80 is ground, leaving the annular convex portion 80, and a concave surface 81 is formed. Next, as shown in FIG. 11D, the protective tape T is peeled off by an appropriate means.

  A metal surface is formed on the concave surface 81 by metal vapor deposition or sputtering as shown in FIG. 11E, and the protective tape T is affixed to the surface of the wafer W again as shown in FIG.

  Next, as shown in FIG. 11G, the annular convex portion 80 is ground and removed. Subsequently, it is mounted on the dicing frame DF via the dicing tape DT as shown in FIG. Thereafter, although not shown, the wafer W is diced into chips after the protective tape T is peeled off.

JP 2001-148212 A JP 2008-034709 A

  By the way, the protective tape attaching apparatus of Patent Document 1 is premised on attaching a protective tape to the circuit pattern surface of a normal planar wafer. When the protective tape is attached to the planar wafer, The back surface of the wafer is sucked and held on a flat table, and a protective tape held on the suction carrier is attached to the circuit pattern surface of the flat wafer under reduced pressure in a vacuum chamber.

  However, when a protective tape is affixed to a wafer whose inner peripheral portion having an annular convex portion is ground (hereinafter simply referred to as a concave wafer), the concave surface of the concave wafer bends or warps, and the suction carrier Since the held protective tape and the concave surface of the concave wafer are difficult to adhere, there is a problem that bubbles and wrinkles are generated on the pasting surface.

  Further, when the concave surface is subjected to metal vapor deposition or the like, there is a request that the concave wafer does not want to touch the concave surface, and there is a request that the concave wafer should be held hollow so as not to touch the concave surface.

  Therefore, an apparatus as disclosed in Patent Document 2 is disclosed as an apparatus for holding a concave wafer without touching the concave surface. In the apparatus of Patent Document 2, a release tape is attached on a protective tape attached to the surface of a concave wafer, and the protective tape is peeled off integrally with the release tape. At this time, while holding the annular convex portion of the concave wafer by suction, the concave surface is held hollow, and compressed air is supplied to the hollow portion so that the concave surface protrudes to the surface side.

  However, the apparatus of Patent Document 2 introduces compressed air into the hollow portion of the table and the concave wafer while supporting only a part of the upper surface of the concave wafer when the release tape is applied to the protective tape. Since the surface protrudes upward, there is a problem that cracks are likely to occur at the boundary between the annular convex portion and the concave surface of the concave wafer.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to hold a wafer without damaging the wafer and without touching the inner peripheral surface of the wafer, and to attach a protective tape to the wafer with high accuracy without generating wrinkles or bubbles. .

  The configuration of the present invention employs the following configuration.

The present invention
A lower chamber provided with an attaching table for holding a substrate;
An adhesive tape transporter that adsorbs and holds an adhesive tape cut to a size suitable for the outer shape of the substrate and transfers it onto the lower chamber, and affixes the adhesive tape on the substrate, and
The adhesive tape carrier is combined with the lower chamber to form a vacuum chamber, and is accommodated in the upper chamber so as to be swingable. The adhesive tape is attracted and held on the adhesive surface and lowered onto the lower chamber in an inclined state, so that the portion on the inclined side of the adhesive tape is overlapped on the substrate, and the substrate swings around the inclined downward side as a base point. In an adhesive tape affixing device to a substrate having a suction table for affixing an adhesive tape thereon,
The affixing table is formed so as to face the back surface of the substrate, is provided with a table recess provided with a gas introduction hole for introducing gas, and an outer peripheral surface surrounding the table recess, and the outer peripheral edge of the substrate An outer periphery holding part that holds the part,
A vacuum chamber is formed by the upper chamber and the lower chamber, and after the adhesive tape is applied to the substrate with the vacuum chamber in a reduced pressure state, when the reduced pressure is released, gas is introduced from the gas introduction hole. An adhesive tape affixing device to a substrate that operates by adopting a configuration in which the substrate is pressed from the back side to the suction table by being introduced.

  The present invention employs a configuration in which, in the above invention, a gas discharge hole is provided in the table recess, and a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. It is an apparatus for attaching an adhesive tape to a substrate.

  In the present invention, the substrate is an apparatus for attaching an adhesive tape to a substrate, wherein the substrate is a concave wafer provided with an annular convex portion and whose inner peripheral surface surrounded by the annular convex portion is ground. .

  According to the present invention, a plurality of substrate holding pins are provided in the table recess so as to protrude and retract, an opening is provided at the tip of the substrate holding pin, and the opening is adsorbed by intake or ejected gas by exhaust. In this way, the adhesive tape sticking device to the substrate adopts a configuration in which the gas can be exhausted from the periphery of the holding pin.

Further, the present invention provides a lower chamber provided with a pasting table for holding a substrate;
An upper chamber that combines with the lower chamber to form a vacuum chamber;
An adsorbing table for adsorbing and holding an adhesive tape cut to a size corresponding to the outer shape of the substrate is provided in the upper chamber, and the adhering tape held on the adsorbing table is reduced under reduced pressure in the vacuum chamber. In the method of attaching the adhesive tape to the substrate to be attached to the substrate,
A recess is formed in the affixing table so as to face the back surface of the substrate, a gas introduction hole for introducing gas is provided in the recess, and an outer peripheral edge of the substrate is formed on an outer peripheral surface surrounding the table recess. Provide and configure the outer periphery holding part to hold,
After holding the outer peripheral edge of the substrate with the outer peripheral holding portion, forming a vacuum chamber with the upper chamber and the lower chamber, and applying the adhesive tape on the substrate in a vacuum state of the vacuum chamber, This is a method of attaching an adhesive tape to a substrate that employs a configuration in which the substrate is pressed against the suction table from the back surface side by introducing a gas from the gas introduction hole when releasing the pressure reduction.

  Moreover, this invention employ | adopts the structure which provided the gas exhaust hole in the said table recessed part, and discharged some gas from the said gas exhaust hole when introduce | transducing gas from the said gas introduction hole. A method for attaching an adhesive tape to a substrate according to claim 1.

  According to the present invention, since various adhesive tapes are affixed under vacuum, the adhesive tape can be affixed to the substrate without generation of bubbles or wrinkles. Furthermore, even if it is a wafer which does not want to touch an inner peripheral part, or a concave wafer in which the annular convex part was formed, an adhesive tape can be affixed accurately, without touching an inner peripheral part. Further, even when the substrate is bent when the adhesive tape is applied to the substrate, the adhesive tape can be applied without touching the inner peripheral portion. Also, since the substrate is pressed with gas from the back side of the substrate while supporting the substrate via the adhesive tape on the suction table when the adhesive tape is attached to the substrate, the substrate is not damaged. Adhesive tape can be attached to the substrate. Further, if a gas discharge hole is provided in the table recess and a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole, an excessive load is applied to the substrate. Therefore, the substrate is not damaged.

These are top views of the adhesive tape sticking apparatus which concerns on one Embodiment of this invention. These are AA direction cross-sectional arrow views of FIG. These are the BB direction cross-section arrow directional views of FIG. These are top views showing one Embodiment of the sticking table used for this invention. These are sectional explanatory drawing of the sticking table used for this invention. (A) And (b) is explanatory drawing showing the state which affixes and peels an adhesive tape on a perforated table in an adhesive tape cutting part. (A)-(c) is explanatory drawing showing the adhesive tape sticking operation | movement of the adhesive tape sticking apparatus of this invention. (D)-(f) is explanatory drawing showing the adhesive tape sticking operation | movement of the adhesive tape sticking apparatus of this invention. (G)-(i) is explanatory drawing showing the adhesive tape sticking operation | movement of the adhesive tape sticking apparatus of this invention. FIG. 5 is a partially cutaway perspective view of a concave wafer in which an annular convex portion is formed and an inner peripheral surface surrounded by the annular convex portion is ground. (A) to (h) is an explanatory view showing formation and processing examples of the concave wafer of FIG. FIG. 3 is a perspective view of a slit wafer on which slits are formed.

  Hereinafter, an embodiment of an apparatus for attaching an adhesive tape to a substrate of the present invention will be described with reference to FIGS.

  1 is a plan view of an adhesive tape attaching apparatus 1 according to the present invention, FIG. 2 is a cross-sectional view taken along a line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along a line BB in FIG. FIG.

  The adhesive tape attaching apparatus 1 of the present invention includes a wafer supply / storage part a for storing a substrate W (hereinafter referred to as a wafer W), a positioning part b, and wafers W stored in multiple stages in the wafer supply / storage part a. Wafer transfer section c for picking up one by one and transferring it to positioning section b; adhesive tape attaching section d for receiving and supporting wafer W positioned by positioning section b; and bonding wafer W on positioning section b Wafer transporting section e to be transferred to tape attaching section d, and adhesive tape cutting that is located adjacent to the adhesive tape attaching section d and cuts the adhesive tape T to be almost the same as or slightly smaller in diameter than the wafer W. Moving between the part f, the adhesive tape attaching part d, and the adhesive tape cutting part f, adsorbing and holding the adhesive tape T cut by the adhesive tape cutting part f, and applying the adhesive tape While transferring the attaching portion d, and a adhesive tape carrier g such paste adhesive tape T on the wafer W with the adhesive tape sticking section d.

  For example, as shown in FIG. 10, a wafer W used in the present invention is a concave wafer W in which an annular convex portion 80 is provided on the outer periphery and an inner peripheral surface surrounded by the annular convex portion is ground. In addition, not only the concave wafer W but also a wafer that is requested not to touch the inner peripheral surface is preferably used. For example, the present invention can be applied to a slit wafer SW in which a slit 85 is formed in a pattern 82 of a wafer W as shown in FIG. In this case, the slit wafer SW can be applied to the double-sided adhesive tape T attached to the back surface of the slit wafer SW with the pattern forming surface (front surface) of the slit wafer SW as the bottom surface. Thereafter, a support substrate such as glass is pasted through the double-sided adhesive tape T.

  A positioning notch 82 or an orientation flat (not shown) may be formed on a part of the outer periphery of the wafer W.

  As shown in FIG. 1, the wafer supply / storage unit a is located in front of the machine base 2 and has a storage cassette 3 capable of storing wafers W in a multi-stage manner so as to be replaceable. The storage cassette 3 can be moved up and down by a drive source (not shown), and the wafers W can be taken out and stored sequentially.

  The positioning part b is installed on a support base 28 arranged at a position adjacent to the transfer robot 4. On the support table 28, the outer periphery of the transferred wafer W (in this embodiment, the annular convex portion 80 of the concave wafer W) is sucked and held, and the rotary table 5 is rotated. A sensor 6 is provided for detecting the notch 82 or orientation flat of the wafer W by means.

  Further, as shown in FIG. 2, the turntable 5 is configured to be rotatable by a motor 7 and rotates a held wafer W to irradiate light to a notch 82 provided on the outer periphery of the wafer W. The notch 82 is detected by the sensor 6.

  The wafer transfer section c is located on the left side of the storage cassette 3 and is provided with a transfer robot 4 for taking out the wafers W stored in the storage cassette 3 one by one. The transfer robot 4 can freely extend and retract. The outer peripheral part of the wafer W is adsorbed by the lower surface of the tip of the hand, and the positioning part b is transferred onto the rotary table 5. The tip of the hand can be a non-contact type such as a Bernoulli chuck as appropriate. Further, the transfer robot 4 is configured to transfer the wafer W after the adhesive tape T is pasted to the storage cassette 3.

  As shown in FIG. 1, an adhesive tape attaching part d is provided in the center of the machine base 2 between the positioning part b and the adhesive tape cutting part f. The adhesive tape attaching part d is composed of a lower chamber 9 installed on the machine base 2 and an attaching table 8 provided inside the lower chamber 9.

  As shown in FIG. 2, the sticking table 8 is supported by a guide 11 at the bottom, and the guide 11 is slidably inserted into the lower chamber 9 and supported by a support plate 12. A support frame 13 is provided below the lower chamber 9. An elevating cylinder 14 is provided on the lower surface of the support frame 13, and the support plate 12 is connected to the tip of the cylinder shaft 14 a of the elevating cylinder 14. Therefore, the support plate 12 can be moved up and down by the lift cylinder 14, and the sticking table 8 can be lifted and lowered with respect to the lower chamber 9 by expansion and contraction of the cylinder shaft 14 a of the lift cylinder 14. It is free.

  Further, the bonding table 8 has a concave portion 8b (see FIG. 5) formed on the upper surface thereof so that the inner peripheral surface of the back surface of the wafer W does not contact the bonding table 8. The affixing table 8 is provided with a plurality of suction holes 15 on the convex portion 8a surrounding the concave portion 8b to form an outer peripheral holding portion. The suction hole 15 is connected to a suction hose 16 that can be suctioned independently of suction in a vacuum chamber described later. The suction hose 16 is connected to a vacuum pump 18 via a switching valve 17. A suction force is applied to the suction hole 15 by starting the vacuum pump 18 and opening the switching valve 17.

  The suction hole 15 as the outer periphery holding portion sucks a portion that does not have an influence even if it contacts the outer periphery of the wafer W. For example, in the case of the concave wafer W having the annular protrusion 80 formed on the outer periphery, the annular protrusion 80 is sucked and held. Further, in the case of the slit wafer SW, a portion that does not have an influence even if contacted at the outer peripheral portion of the pattern forming surface is sucked and held.

  Further, the recesses 8b of the affixing table 8 are provided with openings 19 at four locations, and communicate with the inside of the vacuum chamber. Further, four support pins 20 are inserted through the openings 19 respectively. The support pin 20 is provided with a suction portion at the tip, and the wafer W can be sucked and held at the tip. The opening 19 discharges part of the air when venting into a recess 8b of the affixing table 8 described later.

  The support pin 20 is supported by the support frame 21 at the lower end below the attachment table 8. A cylinder 25 is provided on the lower surface of the support frame 12, and the shaft of the cylinder 25 is connected to the support frame 21. By operating the cylinder 25, the support pin 20 protrudes from the recess 8b of the attaching table 8. When the support pins 20 protrude from the attaching table 8, the back side of the wafer W can be sucked and held. Note that the support pins 20 are in a standby state without being operated when there is a request not to touch the inner peripheral surface, such as the concave wafer W (appropriately used in the case of a wafer that may touch the inner peripheral surface). It can be done.) Therefore, by changing the use / non-use of the support pins 20 in accordance with various types of wafers W, processing suitable for the characteristics of the various types of wafers W can be appropriately performed.

  The support pins 20 are each provided with a vent hole 22 and communicate with each other within the support frame 21. A vent pipe 23 is connected to the support frame 21 and is connected to the vacuum pump 18 via a switching valve 24.

  The concave portion 8b of the affixing table 8 has a vent hole 24 in the center, and further has a plurality of vent holes 24 that surround the opening 19 in a circumferential shape. The vent hole 24 is connected to a vent pump 26 through a vent pipe 25. Instead of the ventilation pump 26, a switching valve may be provided and connected to a ventilation line such as a cylinder as appropriate. By operating the ventilation pump 26, it is possible to introduce the atmosphere into the recess 8b.

  The wafer transfer unit e is composed of a rail 29 provided in the horizontal direction on the back side of the positioning unit b and the adhesive tape attaching unit d, a suction hand 27 movable along the rail 29, and the like. Yes.

  In the present embodiment, the suction hand 27 sucks and holds from the upper surface of the wafer W, and sucks and holds portions other than the pattern forming surface on the outer periphery of the wafer W. The suction hand 27 may be a non-contact type.

  The rail 29 is laid along the positioning part b and the adhesive tape attaching part d. The rear end of the support part of the suction hand 27 is slidably fitted to the rail 26, and the suction hand 27 is connected to the positioning part b and the adhesive tape attaching part by an appropriate drive source (not shown). It moves between d. Accordingly, the suction hand 27 sucks and holds the wafer W positioned by the positioning portion b, and transfers the wafer W onto the attachment table 8 of the adhesive tape attaching portion d.

  The adhesive tape cutting part f is located on the opposite side of the positioning part b across the adhesive tape attaching part d, and is affixed to attach the perforating table 30 and the adhesive tape T onto the perforated table 30. And a cutter unit 33 provided below the perforating table 30.

  On both sides of the perforated table 30, side plates 36 and 36 are erected from the back of the adhesive tape applicator 1 to the front of the apparatus. Between the side plates 36, 36, the pasting unit 37 is provided.

  The affixing unit 37 includes a supply reel 38 around which a wide adhesive tape T is wound, a recovery reel 39 that winds up the used adhesive tape T, and a plurality of guide rollers 40 that guide the supplied adhesive tape T. A pinch roller 43 for peeling the separator S from the adhesive tape T, a separator collection reel 41 for winding the separator S peeled from the adhesive tape T, and pressing the adhesive tape T against the perforated table 30 An affixing roller 42 to be affixed, a peeling roller 44 for peeling off excess portions of the adhesive tape T affixed to the perforating table 30, and the like are provided.

  The supply reel 38 is pivotally supported on the front side of the apparatus between the side plates 36 and 36. For example, an adhesive tape T such as a protective tape for protecting the pattern forming surface of the wafer W is wound around the supply reel 38. In addition to the protective tape, various adhesive tapes such as a die attach film and a double-sided tape for attaching a support substrate to the wafer W can be used. The supply reel 38 is provided with an appropriate drive source and stopper, and can feed the adhesive tape T freely.

  The adhesive tape T fed from the supply reel 38 is guided by the guide roller 40, and after the separator S temporarily attached to the adhesive surface side is peeled off by the pinch roller 43, the adhesive surface is in a state of being down. It passes under the sticking roller 42 and is guided onto the perforating table 30. Thereafter, the adhesive tape T is guided to the guide roller 40 via the upper part of the peeling roller 44 and is wound around the collection reel 39 via the pinch roller 45. Further, the separated separator S is wound around the separator collection reel 41. The pinch roller 45 and the collection reel 39 are provided with appropriate drive sources (not shown).

  Rails 47, 47 are laid on the sides of the side plates 36, 36 along the perforated table 30. The affixing roller 42 is pivotally supported by a bearing member 46 and is slidably fitted to the rails 47 and 47. The bearing member 46 is provided with a slider 49, and the slider 49 is slidably fitted to a rail 47. The bearing member 46 is horizontally movable integrally with the attaching roller 42 along the rail 47 by an appropriate driving source (not shown). The affixing roller 42 rolls while pressing the adhesive tape T, and affixes the adhesive tape T on the perforated table 30.

  Further, a peeling roller 44 is provided on the side of the perforating table 30. The peeling roller 44 is pivotally supported by the bearing member 48. The bearing member 48 is slidably fitted to the rails 47 and 47. The bearing member 48 is horizontally movable integrally with the peeling roller 44 along the rail 47 by an appropriate driving source (not shown). The peeling roller 44 rolls between the upper surface of the perforated table 30 and the adhesive surface of the adhesive tape T, so that the excess portion of the cut adhesive tape T is peeled off from the perforated table 30. It is like that. Since the peeling roller 44 is in contact with the adhesive surface of the adhesive tape T, an appropriate release treatment (for example, fluorine treatment) is performed.

  The perforated table 30 is formed in a rectangular shape larger than the outer shape of the wafer W, and a circular hole 32 having a diameter substantially the same as or slightly smaller than the outer diameter of the wafer W is formed. Further, the upper surface of the perforated table 30 is substantially the same height as the upper end of the pasting table 8. A retraction hole 72 is provided on the upper surface of the perforated table 30 so that the support portion of the suction table 59 does not interfere when the upper chamber 50 is brought together. A cutter unit 33 is provided below the perforated table 30 for cutting the adhesive tape T attached to the perforated table 30 in the circumferential direction along the inner periphery of the circular hole 32.

  The cutter unit 33 has a circumferential cutter 34, and the circumferential cutter 34 is connected to a motor 35 via a belt 36 so that the cutter unit 33 can rotate freely. The circumferential cutter 34 can be moved up and down by an appropriate drive source. Depending on the shape of the positioning portion of the wafer W, an orientation flat cutter or a notch cutter may be separately provided as appropriate.

  The adhesive tape T affixed to the perforated table 30 is configured such that the circumferential cutter 34 is pierced from below the circular hole 32. The circumferential cutter 34 pierces the adhesive tape T, and then rotates to cut out the adhesive tape T to have a diameter that is substantially the same as or slightly smaller than the outer shape of the wafer W. In addition, what is necessary is just to cut | disconnect the part corresponding to the notch and orientation flat of the wafer W of the adhesive tape T with the cutter which is not shown in figure. The circumferential cutter 34 is configured to be movable according to the shape of the notch or orientation flat of the wafer W, and the notch or orientation flat is cut by controlling the movement of the circumferential cutter 34 to the shape of the notch or orientation flat. You may do it.

  The adhesive tape transport body g is provided directly above the adhesive tape cutting portion f. The adhesive tape transport body g includes an upper chamber 50, a suction table 51 provided in the upper chamber 50, and an attaching roller 52 provided on the adhesive tape attaching portion d side of the upper chamber 50 (see FIG. 2). ) Etc.

  The side plate 36 is partially cut away to form a notch 36a, and a support frame 53 is provided in a direction perpendicular to the notch 36a. The support frame 53 is suspended from the adhesive tape cutting part f to the adhesive tape attaching part d, and rails 54 and 54 are laid inside the support walls on both sides. A support frame 55 is stretched between the rails 54 and 54, and the support frame 55 is movably supported by the rails 54 and 54 via sliders 58 and 58 provided at both ends. The support frame 55 is movable along the rails 54 and 54 by an appropriate drive source (not shown).

  The upper chamber 50 is supported on the support frame 55 by a plurality of guide members 56 erected on the support frame 55 so as to be movable up and down. An elevating cylinder 57 is provided on the support frame 55, and the upper chamber 50 can be raised and lowered with respect to the support frame 55 by the elevating cylinder 57.

  A vacuum adapter 68 is provided on the upper chamber 50, and the vacuum adapter 68 is connected to a vacuum pump (not shown). By evacuating from the vacuum adapter 68 through a vacuum pump, the vacuum chamber formed by the upper chamber 50 and the lower chamber 9 can be depressurized to be in a vacuum state.

  The upper chamber 50 includes a suction table 59 therein, and the suction table 59 sucks and holds the adhesive tape T cut by the adhesive tape cutting portion f from the back side. The suction table 59 is formed of, for example, a porous body, and is slightly smaller than the outer shape of the wafer W (for example, smaller than the wafer outer shape by about 1 to 2 mm). The porous body of the suction table 59 is surrounded by a non-breathable member, leaving the lower suction surface, and generates a suction force on the suction surface.

  The suction table 59 is supported by a fixed frame 60 on the upper surface side. The suction table 59 is connected to a suction hose 61 that can suck independently of the suction in the vacuum chamber, so that a differential pressure can be generated between the vacuum chamber and the suction table 59. Accordingly, the adhesive tape T can be held on the suction table 59 even when the vacuum chamber is in a vacuum state.

  The fixed frame 60 has a tip connected to the upper chamber 50 via a spring member 62. A support frame extends downward from the rear end of the fixed frame 60, and the support frame is pivotally supported via a shaft 63 on a fixed frame 64 fixed to the upper chamber 50.

  A rail 66 is laid on the inner upper wall of the upper chamber 50, and a slider is slidably fitted to the rail 66. A swing roller 67 is rotatably supported on the slider via a support frame. A rail 65 is laid on the upper surface of the fixed frame 60, and the swing roller 67 rolls on the rail 65.

Further, the fixed frame 60 is urged upward by the spring member 62, and in the initial state, the suction table 59 is in an upwardly inclined state. When the swing roller 67 travels on the rail 66, the suction table 59 swings around the shaft 63, and the suction table 59 is kept horizontal.

  The upper chamber 50 sucks and holds the adhesive tape T cut by the adhesive tape cutting portion f by the suction table 59 and transports the adhesive tape T onto the adhesive tape attaching portion d and the adhesive tape attaching portion d. Together with the lower chamber 9, a vacuum chamber is formed.

  A support plate 70 is extended on the adhesive tape attaching part d side of the upper chamber 50, and a roller frame 71 is provided on the lower surface of the support plate 70. A presser roller 52 is pivotally supported on the roller frame 71. A cylinder 72 is erected on the support plate 70, and a cylinder shaft of the cylinder 72 is connected to the roller frame 71. Further, guides 73 are provided upright on both sides of the cylinder 72, and the presser roller 52 is moved up and down by operating the cylinder 72. The pressing roller 52 acts after the adhesive tape T is attached to the wafer W to prevent the adhesive tape T from being lifted.

  The above is the configuration of the adhesive tape applicator 1 according to one embodiment of the present invention. Next, the operation of the adhesive tape applicator 1 will be described with reference to FIGS.

  FIGS. 6A and 6B are explanatory views showing the operation of attaching and peeling the adhesive tape T to the perforating table 30 at the adhesive tape cutting portion f.

  FIG. 6A shows the operation of attaching the adhesive tape T to the perforated table 30. First, the adhesive tape T from which the separator S has been peeled is supplied onto the perforated table 30 with the adhesive surface down. Subsequently, the affixing roller 42 affixes the adhesive tape T on the perforated table 30 while pressing and rolling the back side of the adhesive tape T. Thereafter, as will be described later, the adhesive tape T is cut into the outer shape of the wafer W, and an attaching operation to the wafer W is performed.

  FIG. 6B is an explanatory diagram illustrating a state in which an excess portion of the adhesive tape T after the adhesive tape T has been punched by the perforated table 30 is peeled off. The peeling roller 44 rolls in contact with the adhesive surface side of the adhesive tape T. The peeling roller 44 reaches the surplus portion of the adhesive tape T attached to the outer portion of the circular hole 32 of the perforated table 30. Subsequently, the peeling roller 44 enters between the excess portion of the adhesive tape T and the perforated table 30, and the adhesive tape T is peeled off from the perforated table 30.

  Next, an attaching operation for attaching the adhesive tape T to the wafer W will be described with reference to FIGS.

  As shown in FIG. 7A, the upper chamber 50 as the adhesive tape transport body g is located on the perforated table 30 on the adhesive tape cutting part f. At this time, the adhesive tape T is affixed on the perforated table 30 as shown in FIG. Further, the swing roller 67 in the upper chamber 50 moves horizontally as shown in the figure, and the suction table 59 is made flat.

  Next, the upper chamber 50 is lowered onto the perforated table 30 so that the suction table 59 comes into contact with the back side of the adhesive tape T, and in this state, the suction force is applied to the suction table 59. The adhesive tape T is sucked and held on the suction table 59. In the adhesive tape attaching part d, the positioned wafer W is transported by the suction hand 27 and placed on the attaching table 8. On the wafer W placed on the pasting table 8, the annular convex portion 80 on the lower surface is sucked and held by the suction holes 15. At this time, the inner peripheral portion of the bonding table 8 is formed in a concave shape, so that the back surface of the wafer W does not touch the bonding table 8.

  As shown in FIG. 7B, the circumferential cutter 34 is lifted, stabbed into the gap between the perforated table 30 and the suction table 59, and the circumferential cutter 34 turns to The adhesive tape T is cut through the same or slightly larger.

  As shown in FIG. 7C, the upper chamber 50 is raised and the circumferential cutter 34 is lowered. In addition, the suction table 59 in the upper chamber 50 is in a forward rising and inclined state as the swing roller 67 moves. On the other hand, in the adhesive tape attaching part d, the attaching table 8 is lowered and positioned at the lowered position.

  As shown in FIG. 8D, the upper chamber 50 moves from the adhesive tape cutting part f to the adhesive tape attaching part d, and then the upper chamber 50 is moved to the adhesive tape attaching part d. A vacuum chamber is formed together with the lower chamber 9 of d. After the formation of the vacuum chamber, the inside of the vacuum chamber is sucked with a vacuum pump (not shown) through the vacuum adapter 68 to reduce the pressure, and the vacuum chamber is brought into a vacuum state. When the inside of the vacuum chamber is in a vacuum state, the affixing table 8 rises and is held on the affixing table 8 at the lower end of the adhesive tape T held on the suction table 59 that is inclined upward. Wafer W is brought into contact. At this time, the contact point at which the adhesive tape T abuts on the wafer W is a portion of the annular protrusion 80 of the wafer W supported by the affixing table 8, so that the wafer W is damaged. There is no.

  As shown in FIG. 8E, the suction table 59 tilted forward is swung by the movement of the swing roller 67 to be in a horizontal state, so that the adhesive tape T is sequentially pressed against the wafer W and pasted. wear. By doing in this way, it can prevent that the said adhesive tape T precedes the wafer W and a bubble and a wrinkle enter.

  As shown in FIG. 8 (f), by introducing the atmosphere from the vacuum adapter 68, the vacuum state is released and venting through the vent pump 26 introduces compressed air through the vent hole 24. The concave surface is pressed against the adhesive tape T held on the suction table 59. That is, the adhesive tape T is sandwiched between the wafer W and the suction table 59, and the adhesive tape T is in close contact with the wafer W. In addition, when introducing the compressed air from the vent hole 24, if a part of the air is discharged from the opening 19 formed around the support pin 20, the wafer W and the pasting are more than necessary. The pressure in the space formed by the concave portion of the table 8 does not increase too much. The amount of air discharged from the opening 19 can be adjusted by appropriately closing the opening 19. Moreover, it can replace with the air introduce | transduced by a pressurized air and can also introduce | transduce inert gas, such as argon gas and nitrogen gas.

  As shown in FIG. 9G, the upper chamber 50 is raised and the vacuum chamber is opened.

  As shown in FIG. 9H, the upper chamber 50 moves horizontally, and the adhering roller 52 beside the upper chamber 50 is positioned on the end of the wafer W.

  As shown in FIG. 9I, the attaching roller 52 descends and the upper chamber 50 moves horizontally while pressing the attaching start end portion of the wafer W, so that the attaching roller 52 is The wafer W is pressed and rolled, and in particular, the outer peripheral end portion of the adhesive tape T is well bonded to the wafer W. Note that the attaching operation by the attaching roller 52 may be appropriately performed according to the adhesive state between the adhesive tape T and the wafer W.

  The above is one embodiment in which the adhesive tape is applied to a wafer with the adhesive tape application apparatus of the present invention, but can be changed as appropriate within the scope of the invention. For example, in the present embodiment, the concave wafer having an annular convex portion formed on the outer periphery has been described. However, the above-described slit wafer SW and various wafers can be used, and even a flat wafer can be applied. Further, as the adhesive tape, not only a protective tape but also various adhesive tapes such as a die attach film and a double-sided tape can be used.

W substrate (wafer)
Wa Concave wafer SW Slit wafer T Adhesive tape S Separator DT Dicing tape DF Dicing frame a Wafer supply / storage part b Positioning part c Wafer conveyance part d Adhesive tape attaching part e Wafer conveyance part f Adhesive tape cutting part g Adhesive tape conveyance body DESCRIPTION OF SYMBOLS 1 Adhesive tape sticking apparatus 2 Machine stand 3 Storage cassette 4 Transfer robot 5 Rotary table 6 Sensor 7 Rotating motor 8 Sticking table 8a Convex part 8b Concave part 9 Lower chamber 10 Upper chamber 11 Guide 12 Support plate 13 Support frame 14 Lifting cylinder 14a Cylinder shaft 15 Suction hole 16 Suction hose 17 Switching valve 18 Vacuum pump 19 Open hole 20 Support pin 21 Support frame 22 Vent hole 23 Vent pipe 24 Vent hole 25 Cylinder 26 Vent pump 27 Suction hand 28 Support base 29 Rail 30 Hole-opening table 31 Support frame 32 Circular hole 33 Cutter unit 34 Circumferential cutter 35 Motor 36 Side plate 37 Adhering unit 38 Supply reel 39 Recovery reel 40 Guide roller 41 Separator recovery reel 42 Adhesion roller 43 Pinch roller 44 Peel roller 45 Pinch roller 46 Bearing member 47 Rail 48 Bearing member 49 Slider 50 Upper chamber 51 Adsorption table 52 Adhering roller 53 Support frame 54 Rail 55 Support frame 56 Guide member 57 Lifting cylinder 58 Slider 59 Adsorption table 60 Fixed frame 61 Suction hose 62 Spring member 63 Support frame 64 Fixed Frame 65 Rail 66 Rail 67 Swing roller 68 Vacuum adapter 70 Support plate 71 Roller frame 72 Retraction hole 80 Annular convex part 81 Concave surface 82 Notch 83 Metal film 84 Circuit 85 Slit

Claims (7)

A lower chamber provided with a bonding table for holding the substrate on its upper surface;
An adhesive tape cut to a size suitable for the outer shape of the substrate is sucked and held from the non-adhesive surface side and transferred onto the lower chamber, and an adhesive tape transport body for attaching the adhesive tape on the substrate, and
The adhesive tape carrier is
An upper chamber that forms a vacuum chamber by being combined with the lower chamber, and is supported in the upper chamber so as to be swingable, and descends onto the lower chamber in an inclined state, whereby a portion on the inclined downward side of the adhesive tape is a substrate In an adhesive tape affixing device to a substrate, comprising a suction table that affixes the adhesive tape on the substrate by swinging around the tilted and lowered side as a base point,
The affixing table is formed so as to face the back surface of the substrate and has a table recess provided with a gas introduction hole for introducing gas;
An outer peripheral holding portion that is provided on an outer peripheral surface surrounding the table concave portion and holds an outer peripheral edge portion of the substrate;
A vacuum chamber is formed by the upper chamber and the lower chamber, and after the adhesive tape is applied to the substrate with the vacuum chamber in a reduced pressure state, when the reduced pressure is released, gas is introduced from the gas introduction hole. An adhesive tape affixing device to a substrate, wherein the substrate is pressed from the back side to the suction table by being introduced.   The substrate according to claim 1, wherein a gas discharge hole is provided in the table recess, and a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. Adhesive tape applicator.   A plurality of substrate holding pins are provided in the table recess so as to be able to project and retract, and an opening is provided at the tip of the substrate holding pin so that the opening can be switched to perform suction by suction or gas ejection by exhaust. The apparatus for attaching an adhesive tape to a substrate according to any one of claims 1 to 3, wherein the adhesive tape is applied to the substrate.   4. The gas discharge hole according to claim 1, wherein the gas discharge hole is an opening formed in an outer periphery of the holding pin, and is configured to be able to discharge gas. 5. Equipment for attaching adhesive tape to substrates.   3. The substrate according to claim 1, wherein the substrate is a concave wafer provided with an annular convex portion, and an inner peripheral surface surrounded by the annular convex portion is ground. 4. Equipment for attaching adhesive tape to substrates. A lower chamber provided with a bonding table for holding the substrate on its upper surface;
An upper chamber that combines with the lower chamber to form a vacuum chamber;
An adsorbing table for adsorbing and holding an adhesive tape cut to a size corresponding to the outer shape of the substrate is provided in the upper chamber, and the adhering tape held on the adsorbing table is reduced under reduced pressure in the vacuum chamber. In the method of attaching the adhesive tape to the substrate to be attached to the substrate,
A recess is formed in the affixing table so as to face the back surface of the substrate, a gas introduction hole for introducing gas is provided in the recess, and an outer peripheral edge of the substrate is formed on an outer peripheral surface surrounding the table recess. Provide and configure the outer periphery holding part to hold,
After holding the outer peripheral edge of the substrate with the outer peripheral holding portion, forming a vacuum chamber with the upper chamber and the lower chamber, and applying the adhesive tape on the substrate in a vacuum state of the vacuum chamber, A method for attaching an adhesive tape to a substrate, wherein the substrate is pressed against the suction table from the back side by introducing a gas from the gas introduction hole when releasing the pressure reduction.   The gas discharge hole is provided in the table recess, and a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. A method of attaching adhesive tape to a substrate.

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