JP6944625B2 - Adhesive sheet sticking device and sticking method to the board - Google Patents

Description

The present invention relates to a sticking device and a sticking method for sticking an adhesive sheet such as a protective tape to a substrate such as a wafer.

Conventionally, a circuit pattern is formed on the surface of a semiconductor wafer (hereinafter, simply referred to as a wafer), a protective tape is attached to the circuit pattern on the surface of the wafer, and then the back surface of the wafer is ground to make the wafer thinner. Is being done.

As a method of attaching the protective tape to a wafer, there is known a device for attaching the protective tape under reduced pressure so that wrinkles and air bubbles do not enter (for example, Patent Document 1).

In the protective tape affixing device, the protective tape previously cut into the shape of a wafer is adsorbed and held by a suction carrier integrated with the upper chamber, and the protective tape is held on the wafer held by the affixing table in the lower chamber. The lower chamber lowers to form a vacuum chamber. Then, the pressure inside the vacuum chamber is reduced, and the protective tape held by the suction carrier is pressed against the wafer in the vacuum chamber to be attached to the wafer. Therefore, wrinkles and air bubbles do not enter the protective tape to be attached.

Further, recently, with the miniaturization of mobile terminals and the like, wafers have been formed thinner to reduce the size. With the thinning of the wafer, it has become difficult to handle the wafer. Therefore, in order to facilitate the handling of this wafer, a concave wafer in which only the outer periphery of the wafer is left and the inner peripheral portion is ground to form an annular convex portion has been used (for example, Patent Documents). 2).

FIG. 10 is an example of a wafer W on which the annular convex portion 80 is formed, and the wafer W is viewed from the back surface (partially cut out for easy understanding). In the wafer W, the inner peripheral portion of the wafer W surrounded by the annular convex portion 80 is ground to form a concave surface 81, leaving the annular convex portion 80.

FIG. 11 shows an example of the process of forming the wafer W on which the annular convex portion is formed and processing the wafer W. Hereinafter, the processing process of the wafer W will be described with reference to FIGS. 11 (a) to 11 (h).

As shown in FIG. 11A, a wafer W having a circuit pattern (not shown) formed on its surface is prepared, and as shown in FIG. 11B, a protective tape T is attached to the circuit pattern.

Next, as shown in FIG. 11C, the inner peripheral portion of the wafer W surrounded by the annular convex portion 80 is ground to form the concave surface 81, leaving the annular convex portion 80. Next, as shown in FIG. 11D, the protective tape T is peeled off by an appropriate means.

As shown in FIG. 11 (e), a metal surface is formed on the concave surface 81 by metal vapor deposition, sputtering, or the like, and the protective tape T is again attached to the surface of the wafer W as shown in FIG. 11 (f).

Next, the annular convex portion 80 is ground and removed as shown in FIG. 11 (g). Subsequently, as shown in FIG. 11 (h), the dicing frame DF is mounted via the dicing tape DT. After that, although not shown, the wafer W is diced into chips after the protective tape T is peeled off.

Japanese Unexamined Patent Publication No. 2001-148421 Japanese Unexamined Patent Publication No. 2008-034709

By the way, the protective tape affixing device of Patent Document 1 is premised on attaching the protective tape to the circuit pattern surface of a normal flat wafer, and when the protective tape is attached to the flat wafer, it is flat. The back surface of the shaped wafer is sucked and held on a flat table, and the protective tape held by the suction carrier is attached to the circuit pattern surface of the flat wafer under reduced pressure in a vacuum chamber.

However, when the protective tape is attached to a wafer whose inner peripheral portion having an annular convex portion is ground (hereinafter, simply referred to as a concave wafer), the concave surface of the concave wafer bends or warps and becomes an adsorption carrier. Since it is difficult for the held protective tape and the concave surface of the concave wafer to adhere to each other, there is a problem that air bubbles or wrinkles are generated on the attachment surface.

Further, when the concave surface of the concave wafer is metal-deposited or the like, there is a request that the concave surface is not touched, and there is a request that the concave wafer be held hollow so as not to touch the concave surface.

Therefore, a device such as Patent Document 2 is disclosed as a device for holding the concave wafer without touching the concave surface. The apparatus of Patent Document 2 is adapted to attach a release tape on a protective tape attached to the surface of a concave wafer to remove the protective tape integrally with the release tape. At this time, while holding the annular convex portion of the concave wafer by adsorption, the concave surface is held hollow, and compressed air is supplied to the hollow portion to project the concave surface toward the surface side.

However, in the apparatus of Patent Document 2, when the release tape is attached to the protective tape, pressure is introduced into the hollow portion of the table and the concave wafer in a state where only a part of the upper surface of the concave wafer is supported, and the concave wafer is concave. Since the surface is projected upward, there is a problem that cracks are likely to occur at the boundary between the annular convex portion and the concave surface of the concave wafer.

Therefore, an object of the present invention is to hold the wafer without damaging the wafer and without touching the inner peripheral surface of the wafer, and to accurately attach the protective tape to the wafer without generating wrinkles or air bubbles. ..

The configuration of the present invention adopts the following configuration.

The present invention
A lower chamber with a sticking table that holds the board on its top surface,
An adhesive tape carrier, which sucks and holds an adhesive tape cut to a size suitable for the outer shape of the substrate from the non-adhesive surface side and transfers it onto the lower chamber, and attaches the adhesive tape on the substrate, is provided.
The adhesive tape carrier is
The upper chamber, which forms a vacuum chamber when combined with the lower chamber, and the upper chamber, which is swingably supported in the upper chamber and descends onto the lower chamber in an inclined state, forms a portion of the adhesive tape on the inclined lowering side of the adhesive tape. In a device for attaching an adhesive tape to a substrate, which comprises a suction table for attaching the adhesive tape on the substrate by stacking the layers and swinging from the inclined lowering side as a base point.
The pasting table has a table recess formed so as to face the back surface of the substrate and provided with a gas introduction hole for introducing gas.
An outer peripheral holding portion provided on an outer peripheral surface surrounding the table recess and holding an outer peripheral edge portion of the substrate is provided.
A plurality of substrate holding pins are provided in the table recess so as to be retractable, and a hole is provided at the tip of the substrate holding pin so that the hole can be switched so as to be adsorbed by intake air or gas ejected by exhaust gas. ,
A vacuum chamber was formed by the upper chamber and the lower chamber, and after the vacuum chamber was placed in a reduced pressure state and the adhesive tape was attached onto the substrate, the vacuum chamber was introduced through the gas introduction hole when the reduced pressure was released. This is an adhesive tape sticking device to a substrate, characterized in that a gas presses the substrate from the back surface side onto the suction table so that the substrate and the suction table sandwich the adhesive tape.

In the present invention, the present invention employs a configuration in which a gas discharge hole is provided in the table recess so that a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. It is a device for attaching adhesive tape to a substrate.

Further, in the present invention, the substrate is an adhesive tape affixing device to a substrate adopting a configuration in which an annular convex portion is provided and an inner peripheral surface surrounded by the annular convex portion is ground to be a concave wafer. ..

A lower chamber with a sticking table that holds the board on its top surface,
An upper chamber that combines with the lower chamber to form a vacuum chamber,
A suction table for sucking and holding the adhesive tape cut to a size corresponding to the outer shape of the substrate is provided in the upper chamber, and the adhesive tape held on the suction table is held under reduced pressure in the vacuum chamber. In the method of attaching the adhesive tape to the substrate to be attached to the substrate,
A recess is formed in the pasting table so as to face the back surface of the substrate, a gas introduction hole for introducing gas is provided in the recess, and an outer peripheral edge of the substrate is provided on an outer peripheral surface surrounding the table recess. An outer peripheral holding portion for holding is provided and configured.
A plurality of substrate holding pins are provided in the recesses of the table so as to be retractable, and holes are provided at the tips of the substrate holding pins so that the holes can be switched so as to be adsorbed by intake air or gas ejected by exhaust gas.
The outer peripheral edge portion of the substrate is held by the outer peripheral holding portion, a vacuum chamber is formed by the upper chamber and the lower chamber, the vacuum chamber is decompressed, and the adhesive tape is attached onto the substrate, and then the adhesive tape is attached. substrate when releasing the vacuum, a gas introduced from the gas introduction hole, which presses to the suction table of the substrate from the back side, the substrate and the suction table is characterized in that so as to sandwich the adhesive tape It is a method of attaching an adhesive tape to.

Further, the present invention employs a configuration in which a gas discharge hole is provided in the recess of the table so that a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. How to attach adhesive tape to.

According to the present invention, since various adhesive tapes are attached under vacuum, the adhesive tape can be attached to the substrate without generating air bubbles or wrinkles. Further, even if the wafer is requested not to touch the inner peripheral portion or the concave wafer having the annular convex portion formed, the adhesive tape can be accurately attached without touching the inner peripheral portion. Further, even if the substrate is bent when the adhesive tape is attached to the substrate, the adhesive tape can be attached without touching the inner peripheral portion. In addition, when the adhesive tape is attached to the substrate, the substrate is supported by the adsorption table via the adhesive tape, and the substrate is pressed with gas from the back surface of the substrate, so that the substrate is not damaged. , Adhesive tape can be attached to the substrate. Further, if a gas discharge hole is provided in the recess of the table and a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole, an unreasonable load is applied to the substrate. The board will not be damaged.

Is a plan view of the adhesive tape affixing device according to the embodiment of the present invention. Is a cross-sectional view taken along the line AA in FIG. Is a cross-sectional view taken along the line BB in FIG. Is a plan view showing an embodiment of the pasting table used in the present invention. Is a cross-sectional explanatory view of the pasting table used in the present invention. (A) and (b) are explanatory views showing a state in which the adhesive tape is attached to and peeled off from the perforated table at the adhesive tape cutting portion. (A) to (c) are explanatory views showing the adhesive tape sticking operation of the adhesive tape sticking apparatus of this invention. (D) to (f) are explanatory views which show the adhesive tape sticking operation of the adhesive tape sticking apparatus of this invention. (G) to (i) are explanatory views showing the adhesive tape sticking operation of the adhesive tape sticking apparatus of this invention. Is a partially cutaway perspective view of a concave wafer in which an annular convex portion is formed and an inner peripheral surface surrounded by the annular convex portion is ground. (A) to (h) are explanatory views showing an example of forming and processing the concave wafer of FIG. Is a perspective view of a slit wafer in which a slit is formed.

Hereinafter, an embodiment of the adhesive tape attaching device to the substrate of the present invention will be described with reference to FIGS. 1 to 6.

FIG. 1 is a plan view of the adhesive tape attaching device 1 of the present invention, FIG. 2 is a cross-sectional arrow view in the AA direction of FIG. 1, and FIG. 3 is a cross-sectional arrow in the BB direction of FIG. It is a visual view.

The adhesive tape affixing device 1 of the present invention has a wafer supply / storage unit a for storing a substrate W (hereinafter referred to as a wafer W), a positioning unit b, and a wafer W stored in multiple stages in the wafer supply / storage unit a. Adhesion of the wafer transfer section c, which is taken out one by one and conveyed to the positioning section b, the adhesive tape sticking section d, which receives and supports the wafer W positioned by the positioning section b, and the wafer W on the positioning section b. Adhesive tape cutting that is located adjacent to the wafer transfer section e to be transferred to the tape sticking section d and the adhesive tape sticking section d, and cuts the adhesive tape T to a diameter substantially equal to or slightly smaller than the outer shape of the wafer W. The adhesive tape affixing portion d moves between the adhesive tape affixing portion d, the adhesive tape affixing portion d, and the adhesive tape cutting portion f, and sucks and holds the adhesive tape T cut by the adhesive tape cutting portion f. It is composed of an adhesive tape carrier g or the like that attaches the adhesive tape T on the wafer W at the adhesive tape attaching portion d.

As the wafer W used in the present invention, for example, as shown in FIG. 10, a concave wafer W in which an annular convex portion 80 is provided on the outer periphery and the inner peripheral surface surrounded by the annular convex portion is ground is used. In addition to the concave wafer W, a wafer that is requested not to touch the inner peripheral surface is preferably used. For example, it can be applied to a slit wafer SW in which a slit 85 is formed in a wafer W pattern 82 as shown in FIG. In this case, the pattern forming surface of the slit wafer SW (
It can be applied to attach the double-sided adhesive tape T to the back surface of the slit wafer SW with the front surface) as the lower surface, and the slit wafer SW to which the double-sided adhesive tape T is attached is subsequently passed through the double-sided adhesive tape T. A support substrate such as glass is attached.

A notch 82 for positioning and an orientation flat (not shown) may be formed on a part of the outer periphery of the wafer W.

As shown in FIG. 1, the wafer supply / storage unit a is located on the right front side of the machine base 2, and a storage cassette 3 capable of storing the wafer W in a multi-stage manner is replaceably installed. The storage cassette 3 can be raised and lowered by a drive source (not shown), and the wafer W can be sequentially taken out and stored.

The positioning portion b is installed on a support base 28 arranged at a position adjacent to the transfer robot 4. On the support base 28, a rotary table 5 that attracts and holds the outer periphery of the conveyed wafer W (the annular convex portion 80 of the concave wafer W in the present embodiment) and rotates the wafer W, and an optical means or the like is appropriately placed above the rotary table 5 in the vicinity thereof. A sensor 6 for detecting the notch 82 of the wafer W or the orientation flat is provided by means.

Further, as shown in FIG. 2, the rotary table 5 is rotatably configured by a motor 7, and the wafer W held is rotated to irradiate a notch 82 provided on the outer periphery of the wafer W with light. The notch 82 is detected by the sensor 6.

The wafer transfer unit c is located on the left side of the storage cassette 3, and is provided with a transfer robot 4 that takes out the wafers W stored in the storage cassette 3 one by one. The transfer robot 4 can be freely expanded and contracted and swiveled. The outer peripheral portion of the wafer W is attracted by the lower surface of the tip of the hand, and the positioning portion b is transferred onto the rotary table 5. As the tip of the hand, a non-contact type such as a Bernoulli chuck can be used as appropriate. Further, the transfer robot 4 transfers the wafer W to the storage cassette 3 after the adhesive tape T is attached.

As shown in FIG. 1, an adhesive tape sticking portion d is provided in the center of the machine base 2 between the positioning portion b and the adhesive tape cutting portion f. Further, the adhesive tape sticking portion d is composed of a lower chamber 9 installed on the machine base 2 and a sticking table 8 or the like provided inside the lower chamber 9.

The lower part of the sticking table 8 is supported by the guide 11 as shown in FIG. 2, and the guide 11 slides into the lower chamber 9 and is supported by the support plate 12. Further, a support frame 13 is provided below the lower chamber 9. Further, an elevating cylinder 14 is provided on the lower surface of the support frame 13, and the support plate 12 is connected to the tip of the cylinder shaft 14a of the elevating cylinder 14. Therefore, the support plate 12 can be moved up and down by the elevating cylinder 14, and the sticking table 8 can be moved up and down with respect to the lower chamber 9 due to the expansion and contraction of the cylinder shaft 14a of the elevating cylinder 14. It is free.

Further, the sticking table 8 has a recess 8b (see FIG. 5) formed on the upper surface thereof so that the inner peripheral surface of the back surface of the wafer W does not come into contact with the sticking table 8. Further, the pasting table 8 is provided with a plurality of suction holes 15 on the convex portion 8a surrounding the concave portion 8b to form an outer peripheral holding portion. A suction hose 16 capable of sucking independently of the suction in the vacuum chamber, which will be described later, is connected to the suction hole 15, and the suction hose 16 is connected to the vacuum pump 18 via a switching valve 17. By starting the vacuum pump 18 and opening the switching valve 17, a suction force acts on the suction hole 15.

The suction hole 15 as the outer peripheral holding portion is adapted to suck a portion of the outer peripheral portion of the wafer W that is not affected by contact. For example, in the case of a concave wafer W having an annular convex portion 80 formed on the outer periphery, the annular convex portion 80 is attracted and held. Further, in the case of the slit wafer SW, a portion of the outer peripheral portion of the pattern forming surface that is not affected by contact is attracted and held.

Further, the recesses 8b of the pasting table 8 are provided with holes 19 at four locations and communicate with the inside of the vacuum chamber. Further, four support pins 20 are inserted into the openings 19 respectively. The support pin 20 is provided with a suction portion at the tip portion thereof, and the wafer W can be sucked and held at the tip portion thereof. The opening 19 is designed to discharge a part of air when the air is ventilated into the recess 8b of the pasting table 8, which will be described later.

The lower end of the support pin 20 is supported by the support frame 21 below the sticking table 8. A cylinder 25 is provided on the lower surface of the support frame 12, and the shaft of the cylinder 25 is connected to the support frame 21. By acting the cylinder 25, the support pin 20 is projected from the recess 8b of the sticking table 8. When the support pin 20 protrudes from the sticking table 8, the back surface side of the wafer W can be sucked and held. The support pin 20 stands by without operating when there is a request that the inner peripheral surface is not touched, such as the concave wafer W (used appropriately in the case of a wafer that may touch the inner peripheral surface). You can do it.) Therefore, by switching whether or not the support pin 20 is used according to the various wafers W, it is possible to appropriately perform the processing according to the characteristics of the various wafers W.

Further, each of the support pins 20 is provided with a ventilation hole 22 inside, and communicates with each other in the support frame 21. A ventilation pipe 23 is connected to the support frame 21, and is connected to the vacuum pump 18 via a switching valve 24.

The recess 8b of the pasting table 8 is perforated with a vent hole 24 at the center thereof, and is further perforated with a plurality of vent holes 24 in a circumferential shape surrounding the opening 19. The ventilation hole 24 is connected to the ventilation pump 26 via a ventilation pipe 25. Instead of the ventilation pump 26, a switching valve may be provided and connected to a ventilation line such as a cylinder as appropriate. By operating the ventilation pump 26, it is possible to introduce the atmosphere into the recess 8b.

The wafer transfer portion e is composed of a rail 29 provided in the horizontal direction on the back side of the positioning portion b and the adhesive tape attaching portion d, a suction hand 27 that can move along the rail 29, and the like. There is.

In the present embodiment, the suction hand 27 is designed to suck and hold from the upper surface of the wafer W, and sucks and holds a portion other than the pattern forming surface on the outer periphery of the wafer W. The suction hand 27 may be a non-contact type.

The rail 29 is laid along between the positioning portion b and the adhesive tape attaching portion d. The rear end of the support portion of the suction hand 27 is slidably fitted to the rail 26, and the suction hand 27 is slidably fitted to the rail 26 by an appropriate drive source (not shown). It is designed to move between and d. Therefore, the suction hand 27 sucks and holds the wafer W positioned by the positioning portion b, and transfers the wafer W onto the sticking table 8 of the adhesive tape sticking portion d.

The adhesive tape cutting portion f is located on the opposite side of the positioning portion b with the adhesive tape pasting portion d interposed therebetween, and the perforated table 30 and the adhesive tape T are pasted on the perforated table 30. It has a mounting unit 37, a cutter unit 33 provided below the perforated table 30, and the like.

Side plates 36, 36 are erected on both sides of the perforated table 30 from the back of the adhesive tape affixing device 1 to the front of the device 1. The sticking unit 37 is provided between the side plates 36 and 36.

The sticking unit 37 includes a supply reel 38 around which a wide adhesive tape T is wound, a collection reel 39 for winding a used adhesive tape T, and a plurality of guide rollers 40 for guiding the supplied adhesive tape T. The pinch roller 43 that peels the separator S from the adhesive tape T, the separator recovery reel 41 that winds the separator S that is peeled from the adhesive tape T, and the adhesive tape T are pressed against the perforated table 30. It is configured to include a sticking roller 42 for sticking, a peeling roller 44 for peeling off an excess portion of the adhesive tape T stuck to the perforated table 30, and the like.

The supply reel 38 is pivotally supported on the front side of the device between the side plates 36 and 36. An adhesive tape T such as a protective tape that protects the pattern-forming surface of the wafer W is wound around the supply reel 38. In addition to the protective tape, various adhesive tapes such as a die attach film and a double-sided tape for attaching a support substrate to the wafer W can be used. The supply reel 38 is provided with an appropriate drive source and stopper, and the adhesive tape T can be freely fed out.

The adhesive tape T unwound from the supply reel 38 is guided by the guide roller 40, and after the separator S temporarily attached to the adhesive surface side is peeled off by the pinch roller 43, the adhesive surface is turned down. It passes below the sticking roller 42 and is guided onto the perforated table 30. After that, the adhesive tape T is guided by the guide roller 40 via the upper part of the peeling roller 44, and is wound on the recovery reel 39 via the pinch roller 45. Further, the peeled separator S is wound on a separator recovery reel 41. The pinch roller 45 and the recovery reel 39 are provided with an appropriate drive source (not shown).

Rails 47 and 47 are laid on the sides of the side plates 36 and 36 along the perforated table 30. The sticking roller 42 is pivotally supported by the bearing member 46 and is slidably fitted to the rails 47 and 47. The bearing member 46 is provided with a slider 49, and the slider 49 is slidably fitted to the rail 47. Further, the bearing member 46 is horizontally movable along the rail 47 together with the sticking roller 42 by an appropriate drive source (not shown). Further, the sticking roller 42 rolls while pressing the adhesive tape T, and sticks the adhesive tape T on the perforated table 30.

Further, a peeling roller 44 is provided on the side of the perforated table 30. The peeling roller 44 is pivotally supported by the bearing member 48. The bearing member 48 is slidably fitted to the rails 47 and 47. Further, the bearing member 48 is horizontally movable along the rail 47 together with the peeling roller 44 by an appropriate drive source (not shown). The peeling roller 44 rolls between the upper surface of the perforated table 30 and the adhesive surface of the adhesive tape T to peel off the excess portion of the hollowed-out adhesive tape T from the perforated table 30. It has become like. Since the release roller 44 is in contact with the adhesive surface of the adhesive tape T, an appropriate mold release treatment (for example, fluorine treatment) is applied.

The perforated table 30 is formed in a rectangular shape larger than the outer shape of the wafer W, and a circular hole 32 having a diameter substantially equal to or slightly smaller than the outer diameter of the wafer W is formed. Further, the upper surface of the perforated table 30 is substantially the same height as the upper end of the pasting table 8. Further, a retract hole 72 is provided on the upper surface of the perforated table 30 so that the support portion of the suction table 59 does not interfere when the upper chamber 50 is fitted. Further, below the perforated table 30, a cutter unit 33 for cutting the adhesive tape T to be attached to the perforated table 30 in the circumferential direction along the inner circumference of the circular hole 32 is provided.

The cutter unit 33 has a circumferential cutter 34, and the circumferential cutter 34 is freely rotated by being connected to a motor 35 via a belt 36. Further, the circumferential cutter 34 can be moved up and down by an appropriate drive source. Depending on the shape of the positioning portion of the wafer W, an orientation flat cutter or a notch cutter may be provided separately as appropriate.

The adhesive tape T attached to the perforated table 30 is such that the circumferential cutter 34 is pierced from below the circular hole 32. The circumferential cutter 34 pierces the adhesive tape T and then rotates to cut out the adhesive tape T to have a diameter substantially equal to or slightly smaller than the outer shape of the wafer W. The portion of the adhesive tape T corresponding to the notch and the orientation flat of the wafer W may be cut with a cutter (not shown). The circumferential cutter 34 is configured to be movable according to the shape of the notch or the orientation flat of the wafer W, and the circumferential cutter 34 is moved and controlled to the shape of the notch or the orientation flat to cut the notch or the orientation flat. You may do so.

The adhesive tape carrier g is provided so as to face directly above the adhesive tape cutting portion f. The adhesive tape carrier g includes an upper chamber 50, a suction table 51 provided in the upper chamber 50, and a sticking roller 52 provided on the adhesive tape sticking portion d side of the upper chamber 50 side (see FIG. 2). ) Etc.

The side plate 36 is partially cut out to form a cutout portion 36a, and a support frame 53 is provided in a direction perpendicular to the cutout portion 36a. The support frame 53 is suspended from above the adhesive tape cutting portion f to above the adhesive tape attaching portion d, and rails 54 and 54 are laid inside the support walls on both sides. A support frame 55 is hung between the rails 54 and 54, and the support frame 55 is movably supported by the rails 54 and 54 via sliders 58 and 58 provided at both ends. The support frame 55 is movable along the rails 54 and 54 by an appropriate drive source (not shown).

The upper chamber 50 is supported on the support frame 55 so as to be able to move up and down by a plurality of guide members 56 erected on the support frame 55. Further, an elevating cylinder 57 is provided on the support frame 55, and the upper chamber 50 can be moved up and down with respect to the support frame 55 by the elevating cylinder 57.

A vacuum adapter 68 is provided on the upper chamber 50, and the vacuum adapter 68 is connected to a vacuum pump (not shown). By exhausting air from the vacuum adapter 68 through a vacuum pump, the inside of the vacuum chamber formed by the upper chamber 50 and the lower chamber 9 can be depressurized to create a vacuum state.

The upper chamber 50 is provided with a suction table 59 inside, and the suction table 59 sucks and holds the adhesive tape T cut by the adhesive tape cutting portion f from the back surface side. The adsorption table 59 is formed of, for example, a porous body, and is formed to be slightly smaller than the outer shape of the wafer W (for example, formed to be slightly smaller than the outer shape of the wafer by about 1 to 2 mm). The porous body of the adsorption table 59 is surrounded by a non-breathable member, leaving the adsorption surface on the lower surface, so as to generate an adsorption force on the adsorption surface.

Further, the upper surface side of the suction table 59 is supported by a fixed frame 60. A suction hose 61 that can suck the suction table 59 independently of the suction in the vacuum chamber is connected to the suction table 59 so that a differential pressure can be generated between the vacuum chamber and the suction table 59. Therefore, the adhesive tape T can be held on the suction table 59 even when the inside of the vacuum chamber is in a vacuum state.

Further, the tip of the fixed frame 60 is connected to the upper chamber 50 via a spring member 62. At the rear end of the fixed frame 60, a support frame extends downward, and the support frame is pivotally supported by a fixed frame 64 fixed to the upper chamber 50 via a shaft 63.

A rail 66 is laid on the inner upper wall of the upper chamber 50, and a slider is slidably fitted to the rail 66. A swing roller 67 is rotatably supported on the slider via a support frame. A rail 65 is laid on the upper surface of the fixed frame 60, and the swing roller 67 rolls on the rail 65.

Further, the front end side of the fixed frame 60 is urged upward by the spring member 62, and in the initial state, the suction table 59 is tilted forward. Then, as the swing roller 67 travels on the rail 66, the suction table 59 swings around the shaft 63 as a fulcrum, and the suction table 59 is kept horizontal.

Further, the upper chamber 50 sucks and holds the adhesive tape T cut by the adhesive tape cutting portion f on the suction table 59, conveys the adhesive tape T onto the adhesive tape sticking portion d, and of the adhesive tape sticking portion d. Together with the lower chamber 9, it forms a vacuum chamber.

Further, a support plate 70 is extended on the adhesive tape sticking portion d side of the upper chamber 50, and a roller frame 71 is provided on the lower surface of the support plate 70. A presser roller 52 is pivotally supported by the roller frame 71. A cylinder 72 is erected on the support plate 70, and the cylinder shaft of the cylinder 72 is connected to the roller frame 71. In addition, guides 73 are erected on both sides of the cylinder 72, and the pressing roller 52 moves up and down by operating the cylinder 72. The pressing roller 52 acts after the adhesive tape T is attached to the wafer W to prevent the adhesive tape T from floating.

The above is the configuration of the adhesive tape sticking device 1 according to the embodiment of the present invention, and then the operation of the adhesive tape sticking device 1 will be described below with reference to FIGS. 6 to 9.

6 (a) and 6 (b) are explanatory views showing an operation of attaching and peeling the adhesive tape T to the perforated table 30 at the adhesive tape cutting portion f.

FIG. 6A shows an operation of attaching the adhesive tape T to the perforated table 30. First, the adhesive tape T from which the separator S has been peeled off is supplied onto the perforated table 30 with the adhesive surface facing down. Subsequently, the sticking roller 42 sticks the adhesive tape T onto the perforated table 30 while pressing and rolling the back side of the adhesive tape T. After that, the adhesive tape T is cut into the outer shape of the wafer W as described later, and the operation of attaching to the wafer W is performed.

FIG. 6B is an explanatory diagram showing a state in which the adhesive tape T is peeled off from the excess portion of the adhesive tape T after being hollowed out by the perforated table 30. The peeling roller 44 rolls while being in contact with the adhesive surface side of the adhesive tape T. The peeling roller 44 reaches the excess portion of the adhesive tape T attached to the outer portion of the circular hole 32 of the perforated table 30. Subsequently, the peeling roller 44 enters between the excess portion of the adhesive tape T and the perforated table 30, and the adhesive tape T is peeled from the perforated table 30.

Next, the sticking operation of sticking the adhesive tape T to the wafer W will be described with reference to FIGS. 7 to 9.

As shown in FIG. 7A, the upper chamber 50 as the adhesive tape carrier g is located on the perforated table 30 on the adhesive tape cutting portion f. At this time, the adhesive tape T is attached on the perforated table 30 as shown in FIG. 6A. Further, the swing roller 67 in the upper chamber 50 moves horizontally as shown by the arrow in the drawing, and the suction table 59 is flattened.

Next, when the upper chamber 50 descends onto the perforated table 30, the suction table 59 comes into contact with the back surface side of the adhesive tape T, and in this state, a suction force is applied to the suction table 59. The adhesive tape T is sucked and held on the suction table 59. Further, in the adhesive tape sticking portion d, the positioned wafer W is conveyed by the suction hand 27 and placed on the sticking table 8. In the wafer W placed on the sticking table 8, the annular convex portion 80 on the lower surface is suction-held by the suction holes 15. At this time, since the inner peripheral portion of the sticking table 8 is formed in a concave shape, the back surface of the wafer W does not touch the sticking table 8.

As shown in FIG. 7B, the circumferential cutter 34 rises, is pierced into the gap between the perforated table 30 and the suction table 59, and the circumferential cutter 34 swivels to form an outer shape of the suction table 59. The same or slightly larger adhesive tape T is hollowed out.

As shown in FIG. 7C, the upper chamber 50 is raised and the circumferential cutter 34 is lowered. Further, the suction table 59 in the upper chamber 50 is tilted forward as the swing roller 67 moves. On the other hand, in the adhesive tape sticking portion d, the sticking table 8 is lowered and is located at the lowered position.

As shown in FIG. 8D, the upper chamber 50 moves from the adhesive tape cutting portion f onto the adhesive tape attaching portion d, and then the upper chamber 50 moves from the adhesive tape attaching portion f to the adhesive tape attaching portion d. A vacuum chamber is formed by fitting with the lower chamber 9 of d. After the vacuum chamber is formed, the inside of the vacuum chamber is sucked by a vacuum pump (not shown) via the vacuum adapter 68 to reduce the pressure, and the inside of the vacuum chamber is evacuated. When the inside of the vacuum chamber is in a vacuum state, the sticking table 8 rises and is held by the sticking table 8 at the lower end of the adhesive tape T held by the suction table 59 which is inclined forward. The wafer W is brought into contact with the wafer W. At this time, the contact point where the adhesive tape T comes into contact with the wafer W is a portion of the annular convex portion 80 of the wafer W supported by the sticking table 8, so that the wafer W is damaged. There is no.

As shown in FIG. 8 (e), the suction table 59 having an upwardly inclined forward swing is swung by the movement of the swing roller 67 to bring the adhesive tape T into a horizontal state, whereby the adhesive tape T is sequentially pressed against the wafer W and attached. wear. By doing so, it is possible to prevent the adhesive tape T from coming into contact with the wafer W and causing air bubbles or wrinkles.

As shown in FIG. 8 (f), by introducing the atmosphere from the vacuum adapter 68, the vacuum state is released, and by ventilating through the ventilation pump 26, compressed air is introduced through the ventilation holes 24, and the wafer W is introduced. The concave surface is pressed against the adhesive tape T held on the suction table 59. That is, the adhesive tape T is sandwiched between the wafer W and the suction table 59, and the adhesive tape T is brought into close contact with the wafer W. When the compressed air is introduced from the ventilation hole 24, if a part of the air is discharged from the opening 19 formed around the support pin 20, the wafer W and the attachment will be more than necessary. The pressure in the space formed by the concave portion of the table 8 does not become too high. The amount of air discharged from the opening 19 can be adjusted by appropriately closing the opening 19. Further, instead of the air introduced by compressed air, an inert gas such as argon gas or nitrogen gas can be introduced.

As shown in FIG. 9 (g), the upper chamber 50 is raised to open the vacuum chamber.

As shown in FIG. 9H, the upper chamber 50 moves horizontally, and the sticking roller 52 beside the upper chamber 50 is located on the end portion of the wafer W.

As shown in FIG. 9 (i), the sticking roller 52 lowers and presses the sticking start end portion of the wafer W while the upper chamber 50 moves horizontally, so that the sticking roller 52 moves. The wafer W is pressed and rolled, and in particular, the outer peripheral end portion of the adhesive tape T is well adhered to the wafer W. The sticking operation by the sticking roller 52 may be performed as needed depending on the state of adhesion between the adhesive tape T and the wafer W.

The above is an embodiment in which the adhesive tape is attached to the wafer by the adhesive tape attaching device of the present invention, but it can be changed as appropriate within the scope of the invention. For example, in the present embodiment, the concave wafer in which the annular convex portion is formed on the outer periphery has been described, but the slit wafer SW and various wafers described above can be used, and even a flat wafer can be applied. Further, as the adhesive tape, not only the protective tape but also various adhesive tapes such as a die attach film and a double-sided tape can be used.

W substrate (wafer)
Wa Concave wafer SW Slit wafer T Adhesive tape S Separator DT Dicing tape DF Dicing frame a Wafer supply / storage part b Positioning part c Wafer transfer part d Adhesive tape attachment part e Wafer transfer part f Adhesive tape cutting part g Adhesive tape carrier 1 Adhesive tape pasting device 2 Machine stand 3 Storage cassette 4 Conveying robot 5 Rotating table 6 Sensor 7 Rotating motor 8 Pasting table 8a Convex 8b Concave 9 Lower chamber 10 Upper chamber 11 Guide 12 Support plate 13 Support frame 14 Lifting cylinder 14a Cylinder shaft 15 Suction hole 16 Suction hose 17 Switching valve 18 Vacuum pump 19 Open hole 20 Support pin 21 Support frame 22 Ventilation hole 23 Ventilation pipe 24 Ventilation hole 25 Cylinder 26 Ventilation pump 27 Suction hand 28 Support stand 29 Rail 30 Perforated table 31 Support frame 32 Circular hole 33 Cutter unit 34 Circumferential cutter 35 Motor 36 Side plate 37 Sticking unit 38 Supply reel 39 Recovery reel 40 Guide roller 41 Separator recovery reel 42 Sticking roller 43 Pinch roller 44 Peeling roller 45 Pinch roller 46 Bearing member 47 Rail 48 Bearing member 49 Slider 50 Upper chamber 51 Suction table 52 Sticking roller 53 Support frame 54 Rail 55 Support frame 56 Guide member 57 Lifting cylinder 58 Slider 59 Suction table 60 Fixed frame 61 Suction hose 62 Spring member 63 Support frame 64 Fixed frame 65 Rail 66 Rail 67 Swing Roller 68 Vacuum Adapter 70 Support Plate 71 Roller Frame 72 Retract Hole 80 Circular Convex 81 Concave Surface 82 Notch 83 Metal Film 84 Circuit 85 Slit

Claims (6)

A lower chamber with a sticking table that holds the board on its top surface,
An adhesive tape carrier, which sucks and holds an adhesive tape cut to a size suitable for the outer shape of the substrate from the non-adhesive surface side and transfers it onto the lower chamber, and attaches the adhesive tape on the substrate, is provided.
The adhesive tape carrier is
The upper chamber, which forms a vacuum chamber when combined with the lower chamber, and the upper chamber, which is swingably supported in the upper chamber and descends onto the lower chamber in an inclined state, forms a portion of the adhesive tape on the inclined lowering side of the adhesive tape. In a device for attaching an adhesive tape to a substrate, which comprises a suction table for attaching the adhesive tape on the substrate by stacking the layers and swinging from the inclined lowering side as a base point.
The pasting table has a table recess formed so as to face the back surface of the substrate and provided with a gas introduction hole for introducing gas.
An outer peripheral holding portion provided on an outer peripheral surface surrounding the table recess and holding an outer peripheral edge portion of the substrate is provided.
A plurality of substrate holding pins are provided in the table recess so as to be retractable, and a hole is provided at the tip of the substrate holding pin so that the hole can be switched so as to be adsorbed by intake air or gas ejected by exhaust air. A vacuum chamber was formed by the upper chamber and the lower chamber, and after the vacuum chamber was placed in a reduced pressure state and the adhesive tape was attached onto the substrate, the vacuum chamber was introduced through the gas introduction hole when the reduced pressure was released. A device for attaching an adhesive tape to a substrate, wherein the gas presses the substrate from the back surface side onto the suction table so that the substrate and the suction table sandwich the adhesive tape. The substrate according to claim 1, wherein a gas discharge hole is provided in the recess of the table so that a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. Adhesive tape pasting device. The gas discharge hole provided in the table recess is an opening formed in the outer periphery of the substrate holding pin, and is configured to be capable of discharging gas, whichever of claim 1 or 2. The device for attaching an adhesive tape to a substrate according to item 1. The substrate, the annular projection is provided, according to any one of claims 1 or claim 3 inner peripheral surface is surrounded by the annular convex portion, characterized in that a concave wafer is ground Adhesive tape affixing device to the substrate. A lower chamber with a sticking table that holds the board on its top surface,
An upper chamber that combines with the lower chamber to form a vacuum chamber,
A suction table for sucking and holding the adhesive tape cut to a size corresponding to the outer shape of the substrate is provided in the upper chamber, and the adhesive tape held on the suction table is held under reduced pressure in the vacuum chamber. In the method of attaching the adhesive tape to the substrate to be attached to the substrate,
A recess is formed in the pasting table so as to face the back surface of the substrate, a gas introduction hole for introducing gas is provided in the recess, and an outer peripheral edge of the substrate is provided on an outer peripheral surface surrounding the table recess. An outer peripheral holding portion for holding is provided and configured.
A plurality of substrate holding pins are provided in the recesses of the table so as to be retractable, and holes are provided at the tips of the substrate holding pins so that the holes can be switched so as to be adsorbed by intake air or gas ejected by exhaust gas.
The outer peripheral edge portion of the substrate is held by the outer peripheral holding portion, a vacuum chamber is formed by the upper chamber and the lower chamber, the vacuum chamber is decompressed, and the adhesive tape is attached onto the substrate, and then the adhesive tape is attached. substrate when releasing the vacuum, a gas introduced from the gas introduction hole, which presses to the suction table of the substrate from the back side, the substrate and the suction table is characterized in that so as to sandwich the adhesive tape How to attach adhesive tape to. The fifth aspect of claim 5 , wherein a gas discharge hole is provided in the recess of the table so that a part of the gas is discharged from the gas discharge hole when the gas is introduced from the gas introduction hole. How to attach adhesive tape to the substrate.

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