TWI750250B - Method and apparatus for joining adhesive tape - Google Patents

Abstract

An adhesive tape attaching method and an adhesive tape attaching device are provided, which can avoid the damage of the wafer and the circuit, and attach a new adhesive tape with high precision to the other side of the wafer to which the adhesive tape is attached on one side. belt.

In the configuration in which the protective tape PT is attached to the mounting frame MF, the cavity 7 is formed by sandwiching the support tape DT of the mounting frame MF. The holding table 37 holding the protective tape PT is brought close to the support tape DT, and the distance between the protective tape PT and the wafer W is maintained at D2. The inside of the chamber 7 is depressurized while maintaining this distance, and the protective tape PT is attached by the differential pressure. Even if the expansion of air bubbles between the support belt DT and the wafer W pushes the wafer W, the wafer W is quickly blocked by the holding table that maintains the close position. Therefore, damage to the wafer and damage to the circuit due to the deformation of the wafer can be avoided.

Description

Adhesive tape attaching method and adhesive tape attaching device

The present invention relates to a protective tape for protecting circuit patterns formed on a semiconductor wafer, and a dicing tape that covers a ring frame and a back surface of a semiconductor wafer arranged in the center of the ring frame, for example, an adhesive tape. Attachment method and adhesive tape attachment device.

In the case of manufacturing chip parts from a semiconductor wafer (hereinafter referred to as "wafer" as appropriate), after a process of forming a circuit pattern on the surface of the wafer, a protective adhesive tape (protective tape) is attached to the surface of the wafer. ), which is thinned by backside grinding. After the thin-processed wafer is peeled off, a supporting adhesive tape is attached to the range covering the backside of the wafer and the ring frame. The wafer is integrated (mounted; mount) with the ring frame through the dicing tape for the support by attaching the adhesive tape for support.

When attaching various types of adhesive tapes to wafers, in addition to the configuration in which the adhesive tapes are pressed against the wafers by rotating the attachment rollers, a chamber for accommodating the wafers is used in order to reduce the size of the apparatus. The internal decompression is composed of sticking adhesive tape. That is, two spaces are formed by partitioning a chamber consisting of a pair of upper and lower shells with an adhesive tape, and the adhesive tape is attached to the wafer while the air pressure of one space is lower than that of the other space. (For example, refer to Patent Document 1).

[Prior Art Literature] [Patent Literature]

[Patent Document 1]

Japanese Patent Application Laid-Open No. 2014-49626

However, the above-mentioned conventional device has the following problems.

In recent years, depending on the diversification of wafer processing processes, there is a case where a new adhesive tape is attached to the other surface of a wafer with an adhesive tape attached to one side. As an example, the case where the adhesive tape is reattached on the surface of the wafer mounted on the ring frame can be mentioned. At this time, when the operation of affixing the adhesive tape on the wafer surface is performed using the conventional configuration of Patent Document 1, problems such as breakage of the wafer and damage to the circuit occur.

After in-depth review of the occurrence of such problems, the following insights have been obtained. That is, when minute air bubbles are entangled between the dicing tape attached to the backside of the wafer and the wafer, the inside of the chamber for attaching the adhesive tape to the surface of the wafer decreases. When pressed, the bubble expands.

Since the bubbles push the wafer when they expand, it is considered that problems such as circuit damage and wafer breakage occur as a result. Such a problem occurs remarkably when a dicing tape is attached to a wafer under atmospheric pressure. In addition, in recent years, as thinning of wafers has progressed rapidly, breakage of wafers due to air bubble pressing is more likely to occur.

The present invention has been made in view of such a situation, and its main purpose is to provide a new wafer that can avoid breakage of the wafer and damage to the circuit, and can attach a new wafer with an adhesive tape to the other side of the wafer with high precision. An adhesive tape attaching method and an adhesive tape attaching device of the adhesive tape.

In order to achieve such an object, the present invention adopts the following configuration.

That is, the present invention is a method for attaching an adhesive tape, which is a method for attaching a second adhesive tape to the other surface of a semiconductor wafer to which a first adhesive tape is attached on one side, and is characterized by having: : a tape holding process for holding the second adhesive tape with a holding table; a chamber forming process for forming a chamber by sandwiching and bonding the first adhesive tape exposed from the outer edge of the semiconductor wafer with a pair of shells the first approaching process, in which the holding table is brought close to the semiconductor wafer, so that the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value; and in the attaching process, the aforesaid In a state where the first adhesive tape is sandwiched by a pair of shells, the second adhesive tape is attached while the air pressure of the space on the semiconductor wafer side in the chamber is lower than the air pressure of the other space. on semiconductor wafers.

(Function/Effect) According to the present method, in the first approaching process, the holding table approaches the semiconductor wafer, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value. Therefore, during the attaching process, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and push the semiconductor wafer, the pushed semiconductor wafer is maintained in a close position. Keep the table blocked. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding table, the deformation and breakage of the semiconductor wafer due to the warp can be appropriately avoided.

Further, in the above invention, it is preferable that the semiconductor wafer is held successively through the first adhesive tape and the ring frame, and in the process of forming the chamber, the ring frame is held by the frame holding portion, and a frame holding portion is used to hold the ring frame. The pair of shells form a chamber by sandwiching the first adhesive tape between the ring frame and the semiconductor wafer. In this case, the process of attaching the second adhesive tape to the other side of the semiconductor wafer in the mounting frame with the first adhesive tape attached to one side can be performed without deformation and damage of the semiconductor wafer. .

Further, in the above-mentioned invention, it is preferable to include a non-adhesive surface for bringing a suppressing member having a flat surface close to or in contact with the first adhesive tape, so that the distance between the flat surface and the first adhesive tape is maintained at a predetermined distance. The second approach process of the second predetermined value.

(Action/Effect) According to this configuration, in the second approaching process, the suppressing member approaches the first adhesive tape, and the distance between the suppressing member and the first adhesive tape is maintained at the second predetermined value set in advance. Therefore, even if the bubbles caught between the semiconductor wafer and the first adhesive tape expand during the attaching process, the expansion of the bubbles in the direction perpendicular to the surface of the semiconductor wafer is suppressed from flattening the member. face restrained. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, so that damage to the wafer W due to the expansion of the bubbles can be appropriately avoided. In addition, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, the deterioration of the base material and the adhesive material of the first adhesive tape can be avoided.

In order to achieve such an object, the present invention may take the following configurations.

That is, the present invention is an adhesive tape attaching method for attaching a second adhesive tape to the other side of a semiconductor wafer on which a first adhesive tape is attached on one side, and is characterized by comprising: a wafer holding process, The semiconductor wafer is held by a holding table; in a first attaching process, the second adhesive tape is applied to a joint part of a pair of shells constituting a chamber; in a first approaching process, the holding table is brought close to the second The adhesive tape keeps the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a preset first predetermined value; in the second approaching process, the suppressing member with the flat surface is brought close to or contacted with the second adhesive tape. The non-adhesive surface keeps the distance between the flat surface and the second adhesive tape at a second predetermined value; and in the second attaching process, the second adhesive tape is sandwiched and joined by a pair of shells to form the above-mentioned In the state of the chamber, the second adhesive tape is attached to the semiconductor wafer while the air pressure of the space on the side of the semiconductor wafer in the chamber is lower than the air pressure of the other space.

(Function/Effect) According to this configuration, in the first approaching process, the holding table approaches the second adhesive tape, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at the first predetermined value. Therefore, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and push the semiconductor wafer during the attaching process, the pushed semiconductor wafer is maintained in a close position. Blocked by the platform. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding table, the deformation and breakage of the semiconductor wafer due to the warp can be appropriately avoided.

In addition, in the second approaching process, the restraining member approaches the second adhesive tape, and the distance between the restraining member and the second adhesive tape is maintained at the second predetermined value set in advance. Therefore, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand during the attaching process, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer is suppressed by the flat surface of the member. suppressed. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, so that damage to the wafer W due to the expansion of the bubbles can be appropriately avoided. Furthermore, since the elongation of the second adhesive tape due to the expansion of the air bubbles can be suppressed, deterioration of the base material and the adhesive material of the second adhesive tape can be avoided.

Further, in the above-mentioned invention, it is preferable to include a frame holding process for holding the ring frame by the frame holding portion, and in the first attaching process, a joint portion of a pair of casings that cover the chamber and the above-mentioned The second adhesive tape is attached to the ring frame held in the frame holding process.

(Function/Effect) According to this configuration, a process of attaching the second adhesive tape to the semiconductor wafer to which the first adhesive tape is attached on one side using a chamber so as to cover the other side of the semiconductor wafer and the ring frame , which can be performed while avoiding deformation and damage of the semiconductor wafer. Therefore, one side of the semiconductor wafer can be maintained and a more appropriate mounting frame fabrication process can be performed.

In order to achieve such an object, the present invention may adopt the following configurations.

That is, the present invention is a method for attaching an adhesive tape, which is a method for attaching a second adhesive tape to the other surface of a semiconductor wafer to which a first adhesive tape is attached on one side, and is characterized by having: : a tape holding process for holding the second adhesive tape with a holding table; a wafer holding process for holding the semiconductor wafer with a wafer holding part; a chamber forming process for forming a holding table and a cavity by joining a pair of shells the chamber of the wafer holding part; the first approach process of bringing a first suppressing member housed in the chamber and having a flat surface close to the semiconductor wafer, and maintaining a distance between the semiconductor wafer and the first suppressing member In the pre-set first predetermined value; the second approaching process, the second restraining member, which is accommodated in the chamber and has a flat surface, is made to approach or contact the non-adhesive surface of the first adhesive tape, so that the flat surface and the first 1. The distance of the adhesive tape is maintained at a preset second predetermined value; and in the attaching process, after the second approaching process, in a state where the chamber is formed, while reducing the air pressure inside the chamber, the first 2 The adhesive tape is attached to the semiconductor wafer.

(Function/Effect) According to this configuration, in the first approaching process, the first suppressing member approaches the semiconductor wafer, and the distance between the semiconductor wafer and the adhesive surface of the first suppressing member is maintained at the first predetermined value. Therefore, during the attaching process, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and push the semiconductor wafer, the pushed semiconductor wafer is maintained in a close position. blocked by the first restraining member. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding table, the deformation and breakage of the semiconductor wafer due to the warp can be appropriately avoided.

In addition, in the second approaching process, the second restraining member approaches or contacts the first adhesive tape, and the distance between the second restraining member and the first adhesive tape is maintained at a predetermined second predetermined value. Therefore, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand during the attaching process, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer is prevented by the second suppressing member. suppressed by the flat surface. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, so that damage to the wafer W due to the expansion of the bubbles can be appropriately avoided. Furthermore, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, deterioration of the base material and the adhesive material of the first adhesive tape can be avoided. The present configuration is not limited to the configuration in which the second adhesive tape is applied after pressure reduction using the chamber, and the feature of the present invention can be applied to configurations of various chambers.

Moreover, in the above-mentioned invention, it is preferable that a frame holding process for holding the ring frame is provided by the frame holding portion, and the chamber accommodates the frame holding portion. In this case, even in the configuration in which the ring frame and the frame holding portion are accommodated in the chamber, the process of attaching the second adhesive tape to the semiconductor wafer can be performed while avoiding deformation and damage of the semiconductor wafer.

Further, in the above invention, it is preferable that the first restraining member is the holding table, and the second adhesive tape approaches the semiconductor wafer together with the holding table during the first approaching process. In this case, since the holding table also functions as the first restraining member, the complication of the apparatus can be avoided.

Furthermore, since the second adhesive tape approaches the semiconductor wafer during the first approach process, even if air bubbles are caught between the second adhesive tape and the holding table, the air bubbles tend to be perpendicular to the surface of the adhesive tape. The expansion in the direction of the system is rapidly suppressed by the semiconductor wafer. Therefore, it is possible to more reliably prevent the occurrence of unevenness and wrinkles due to the partial elongation of the second adhesive tape. As a result, a situation in which the second adhesive tape is non-uniformly attached to the semiconductor wafer and a situation in which the adhesion between the second adhesive tape and the semiconductor wafer is lowered can be reliably avoided.

Moreover, in the above-mentioned invention, it is preferable that the said 2nd suppressing member is the said wafer holding|maintenance part. In this case, since the wafer holding portion also functions as the second suppressing member, complication of the apparatus can be avoided. Furthermore, since the wafer holding portion is in contact with or closer to the first adhesive tape attached to the semiconductor wafer, damage to the wafer W and elongation of the first adhesive tape due to expansion of air bubbles can be more reliably prevented. .

Moreover, in the above-mentioned invention, it is preferable that the said 1st predetermined value is 0.1 mm or more and 0.5 mm or less. In this case, since the holding table is sufficiently close to each other, the pressing force acting on the semiconductor wafer due to the expansion of the air bubbles caught between the semiconductor wafer and the first adhesive tape can be further reduced. Therefore, deformation and breakage of the semiconductor wafer due to pressing can be avoided more reliably.

Moreover, in the above-mentioned invention, it is preferable that the said 2nd predetermined value is 0.5 mm or less. In this case, since the suppressing members are sufficiently close to each other, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer can be suppressed more reliably. Therefore, damage to the wafer W due to the expansion of the bubbles can be more reliably avoided.

In order to achieve such an object, the present invention may take the following configurations.

That is, the present invention is a method for attaching an adhesive tape, which is used to attach an adhesive tape to a semiconductor wafer, and is characterized by comprising: a tape holding process for holding the aforementioned adhesive tape with a holding table; a wafer holding process for holding the wafer with the wafer The first approach process is to hold the semiconductor wafer in the first approaching process by joining a pair of shells to form a chamber for accommodating the holding table and the wafer holding portion. The first approaching process is to make the suppressing member accommodated in the chamber and having a flat surface approach close Or contact the non-adhesive surface of the adhesive tape, so that the distance between the flat surface and the adhesive tape is maintained at a preset second predetermined value; and in the attaching process, after the second approaching process, in the state where the cavity is formed Next, while reducing the air pressure inside the chamber, the adhesive tape is attached to the semiconductor wafer.

(Function/Effect) According to this configuration, when the adhesive tape is attached to the semiconductor wafer, the wafer holding portion holding the semiconductor wafer is fastened to the adhesive tape during the first approach process, and the semiconductor wafer and the adhesive tape are adhered to each other. The distance between the surfaces is maintained at a preset first predetermined value. In the second approaching process, the restraining member approaches or contacts the non-adhesive surface of the adhesive tape, and the distance between the restraining member and the non-adhesive surface of the adhesive tape is maintained at a predetermined second predetermined value.

Therefore, during the attaching process, even if the adhesive tape is pushed by the expansion of the air bubbles caught between the holding table and the adhesive tape, the pressed adhesive tape will be blocked by the semiconductor wafer that is maintained in the close position. . In addition, the expansion of the air bubbles in the direction perpendicular to the surface of the adhesive tape is suppressed by the flat surface of the suppressing member.

Therefore, it can more reliably prevent that a part of the adhesive tape is pushed in a direction perpendicular to the surface of the adhesive tape and elongated due to the expansion of the air bubbles, thereby causing unevenness and wrinkles to be generated. As a result, the situation in which the adhesive tape is non-uniformly attached to the semiconductor wafer and the situation in which the adhesiveness between the adhesive tape and the semiconductor wafer is lowered can be reliably avoided. Moreover, the deterioration of the base material and the adhesive material of the adhesive tape due to the suppression of the elongation of the adhesive tape can also be avoided. In addition, if the present configuration is a configuration in which the pressure inside the chamber is decompressed and the adhesive tape is attached to the semiconductor wafer, it is not limited to the configuration in which the adhesive tape is previously attached to one side of the semiconductor wafer, and the features of the present invention can be applied. in more diverse compositions.

In order to achieve such an object, the present invention may take the following configurations.

That is, the present invention is an adhesive tape attaching device for attaching a second adhesive tape to the other surface of a semiconductor wafer to which a first adhesive tape is attached on one side, and is characterized by comprising: a tape supply part for supplying a second adhesive tape. the second adhesive tape; a holding table for holding the second adhesive tape; a chamber formed by sandwiching the first adhesive tape exposed from the outer edge of the semiconductor wafer with a pair of shells and accommodating the holding table; A first approaching mechanism for controlling the holding table to approach the semiconductor wafer so as to maintain the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a preset first predetermined value; and an attaching mechanism for controlling When the first approach mechanism is operating, a differential pressure is generated in the two spaces in the chamber partitioned by the first adhesive tape, and the second adhesive tape is attached to the other side of the semiconductor wafer.

(Function/Effect) According to this configuration, the holding stage is brought close to the semiconductor wafer by the first approaching mechanism, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a predetermined first value. Therefore, when the second adhesive tape is affixed to the semiconductor wafer by the affixing mechanism, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and push the semiconductor wafer, the second adhesive tape is pushed. The pressed semiconductor wafer is still blocked by the holding table that is held in close position. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding table, the deformation and breakage of the semiconductor wafer due to the warp can be appropriately avoided.

Further, in the above-mentioned invention, it is preferable that the semiconductor wafer is held next to the ring frame through the first adhesive tape, and includes a frame holding portion for holding the ring frame, and the chamber is provided with a pair of shell clips. The first adhesive tape is formed between the ring frame and the semiconductor wafer held by the frame holding portion. In this case, the process of attaching the second adhesive tape to the other side of the semiconductor wafer in the mounting frame with the first adhesive tape attached to one side can be performed without deformation and damage of the semiconductor wafer. .

Further, in the above-mentioned invention, it is preferable to include: a suppressing member having a flat surface; and a second approaching mechanism for causing the suppressing member to approach or contact the non-adhesive surface of the first adhesive tape, so that the flat surface and the The distance of the 1st adhesive tape is maintained at the preset 2nd predetermined value control.

(Function/Effect) According to this configuration, the suppressing member is brought close to the first adhesive tape by the second approaching mechanism, and the distance between the suppressing member and the first adhesive tape is maintained at the preset second predetermined value. Therefore, when the second adhesive tape is affixed to the semiconductor wafer by the affixing mechanism, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand, the air bubbles tend to be closely related to the semiconductor wafer. The expansion in the direction perpendicular to the plane is restrained by the flat plane of the restraining member. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, so that damage to the wafer W due to the expansion of the bubbles can be appropriately avoided. Furthermore, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, deterioration of the base material and the adhesive material of the first adhesive tape can be avoided.

In order to achieve such an object, the present invention may take the following configurations.

That is, the present invention is an adhesive tape attaching device for attaching a second adhesive tape to the other surface of a semiconductor wafer to which a first adhesive tape is attached on one side, and is characterized by comprising: a tape supply part for supplying a second adhesive tape. the second adhesive tape; a holding table for holding the semiconductor wafer; a restraining member having a flat surface; a chamber formed of a pair of shells for accommodating the holding table and the restraining member; A second adhesive tape is attached to a joint portion of the case; a first approach mechanism is used to move the holding table close to the second adhesive tape to maintain a predetermined distance between the semiconductor wafer and the adhesive surface of the second adhesive tape The control of the set first predetermined value; the second approaching mechanism, which makes the restraining member approach or contact the non-adhesive surface of the second adhesive tape, so that the distance between the flat surface and the second adhesive tape is maintained at a preset second a predetermined value; and a second sticking mechanism, when the first approaching mechanism and the second approaching mechanism are operating, a differential pressure is generated in the two spaces in the chamber partitioned by the second adhesive tape, and the The second adhesive tape is attached to the other side of the semiconductor wafer.

(Function/Effect) According to this configuration, the holding stage is brought close to the second adhesive tape by the first approaching mechanism, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a predetermined first predetermined value. Therefore, when the second adhesive tape is affixed to the semiconductor wafer, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer, the pressed semiconductor wafer The circle system is blocked by the holding table which is maintained in the close position. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding table, the deformation and breakage of the semiconductor wafer due to the warp can be appropriately avoided.

In addition, the suppressing member is brought close to the second adhesive tape by the second approaching mechanism, and the distance between the suppressing member and the second adhesive tape is maintained at a preset second predetermined value. Therefore, when the second adhesive tape is affixed to the semiconductor wafer, even if the air bubbles rolled up between the semiconductor wafer and the first adhesive tape expand, the air bubbles are oriented in the direction perpendicular to the surface of the semiconductor wafer. The expansion system is suppressed by the flat surface of the suppressing member. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, so that damage to the wafer W due to the expansion of the bubbles can be appropriately avoided. Furthermore, since the elongation of the second adhesive tape due to the expansion of the air bubbles can be suppressed, deterioration of the base material and the adhesive material of the second adhesive tape can be avoided.

Further, in the above-mentioned invention, preferably, a frame holding portion for holding the ring frame is provided, and the first attaching mechanism is attached so as to cover a joint portion of the case and the ring frame held by the frame holding portion. The second adhesive tape mentioned above is attached.

(Function/Effect) According to this configuration, in the mounting frame to which the first adhesive tape is attached on one side, the process of attaching the second adhesive tape using the chamber so as to cover the other side of the semiconductor wafer and the ring frame, It can be performed while avoiding deformation and breakage of the semiconductor wafer. Therefore, it is possible to protect one side of the semiconductor wafer, and to perform a more appropriate process of forming the mounting frame.

In order to achieve such an object, the present invention may take the following configurations.

That is, the present invention is an adhesive tape attaching device for attaching a second adhesive tape to the other surface of a semiconductor wafer to which a first adhesive tape is attached on one side, and is characterized by comprising: a tape supply part for supplying a second adhesive tape. the second adhesive tape; a holding table for holding the second adhesive tape; a wafer holding part for holding the semiconductor wafer; a first suppressing member having a flat surface; a second suppressing member having a flat surface; a chamber for accommodating the aforementioned The holding table, the wafer holding portion, the first suppressing member, and the second suppressing member are formed of a pair of shells; The control of maintaining the distance between the semiconductor wafer and the first restraining member at a preset first predetermined value; the second approaching mechanism makes the second restraining member approach or contact the non-adhesive surface of the first adhesive tape, so that the The distance between the flat surface and the first adhesive tape is maintained at a preset second predetermined value; the decompression mechanism decompresses the interior of the chamber when the first approach mechanism and the second approach mechanism are operating ; and an attaching mechanism for attaching the second adhesive tape to the other side of the semiconductor wafer in a state where the inside of the chamber has been decompressed.

(Function/Effect) According to this configuration, the first suppressing member approaches the semiconductor wafer by the first approaching mechanism, and the distance between the semiconductor wafer and the adhesive surface of the first suppressing member is maintained at the first predetermined value. Therefore, even if the air bubbles entangled between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer due to decompression during the sticking by the sticking mechanism, the pressed semiconductor wafer will The circle is still blocked by the first restraining member maintained in the approaching position. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding table, the deformation and breakage of the semiconductor wafer due to the warp can be appropriately avoided.

In addition, the second restraining member approaches or contacts the first adhesive tape by the second approaching mechanism, and the distance between the second restraining member and the first adhesive tape is maintained at a preset second predetermined value. Therefore, even if the air bubbles rolled up between the semiconductor wafer and the first adhesive tape expand due to decompression during the adhesion by the adhesion mechanism, the air bubbles go in the direction perpendicular to the surface of the semiconductor wafer. The expansion is restrained by the flat surface of the second restraining member. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, so that damage to the wafer W due to the expansion of the bubbles can be appropriately avoided. Furthermore, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, deterioration of the base material and the adhesive material of the first adhesive tape can be avoided. This configuration is not limited to the configuration in which the adhesion is performed using a differential pressure, as long as the chamber is used and the second adhesive tape is applied after decompression, and the features of the present invention can be applied to configurations of various chambers .

Furthermore, in the above-mentioned invention, preferably, a frame holding process for holding the ring frame by the frame holding portion is provided, and the chamber accommodates the frame holding portion. In this case, even in the configuration in which the ring frame and the frame holding portion are accommodated in the chamber, the process of attaching the second adhesive tape to the semiconductor wafer can be performed while avoiding deformation and damage of the semiconductor wafer.

Further, in the above invention, it is preferable that the first restraining member is the holding table, and the second adhesive tape is brought close to the semiconductor wafer together with the holding table by the first approaching mechanism. In this case, since the holding table also functions as the first suppressing member, the complication of the apparatus can be avoided.

Furthermore, since the second adhesive tape is brought close to the semiconductor wafer during the first approaching process, even if air bubbles are caught between the second adhesive tape and the holding table, the air bubbles tend to be perpendicular to the surface of the adhesive tape. The expansion in the direction of the system is rapidly suppressed by the semiconductor wafer. Therefore, it is possible to more reliably prevent the occurrence of unevenness and wrinkles due to the elongation of a part of the second adhesive tape. As a result, a situation in which the second adhesive tape is non-uniformly attached to the semiconductor wafer and a situation in which the adhesion between the second adhesive tape and the semiconductor wafer is lowered can be reliably avoided.

Moreover, in the above-mentioned invention, it is preferable that the said 2nd suppressing member is the said wafer holding|maintenance part. In this case, since the wafer holding portion also functions as the second suppressing member, complication of the apparatus can be avoided. Furthermore, since the wafer holding portion is in contact with or closer to the first adhesive tape attached to the semiconductor wafer, damage to the wafer W due to the expansion of air bubbles, and damage to the first adhesive tape can be more reliably prevented. elongation.

Moreover, in the above-mentioned invention, it is preferable that the said 1st predetermined value is 0.1 mm or more and 0.5 mm or less. In this case, since the holding table is sufficiently close to each other, the pressing force acting on the semiconductor wafer due to the expansion of the air bubbles caught between the semiconductor wafer and the first adhesive tape can be further reduced. Therefore, deformation and breakage of the semiconductor wafer due to pressing can be avoided more reliably.

Moreover, in the above-mentioned invention, it is preferable that the said 2nd predetermined value is 0.5 mm or less. In this case, since the suppressing members are sufficiently close to each other, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer can be suppressed more reliably. Therefore, damage to the wafer W due to the expansion of the bubbles can be avoided more reliably.

Moreover, in the above-mentioned invention, it is preferable to include: a cutting mechanism for cutting the second adhesive tape along the outer shape of the semiconductor wafer; a peeling mechanism; and a tape recovery part for recovering the second adhesive tape after peeling.

In this case, since the second adhesive tape attached to the semiconductor wafer is cut along the outer shape of the semiconductor wafer, the second adhesive tape is not exposed from the outer edge of the semiconductor wafer. Therefore, a situation in which the second adhesive tape adheres to other structures can be appropriately avoided.

In order to achieve such an object, the present invention may take the following configurations.

That is, the present invention is an adhesive tape attaching device for attaching an adhesive tape to a semiconductor wafer, and is characterized by comprising: a tape supply part for supplying the adhesive tape; a holding table for holding the adhesive tape; and holding the semiconductor wafer. a round wafer holding part; a suppressing member having a flat surface; a chamber including a pair of casings for accommodating the holding table, the wafer holding part, and the suppressing member; a wafer for holding the semiconductor wafer The holding part is close to the adhesive surface of the adhesive tape, and the distance between the adhesive tape and the semiconductor wafer is maintained at a predetermined first value. Adhesive surface, a second approaching mechanism for maintaining the distance between the flat surface and the adhesive tape at a preset second predetermined value; in the state where the first approaching mechanism and the second approaching mechanism are operating, the chamber is A decompression mechanism for decompressing the inside of the chamber; and an attaching mechanism for attaching the adhesive tape to the semiconductor wafer in a state where the inside of the chamber has been decompressed.

(Function/Effect) According to this configuration, when the adhesive tape is attached to the semiconductor wafer, the wafer holding portion holding the semiconductor wafer is brought close to the adhesive tape by the first approaching mechanism, and the semiconductor wafer and the adhesive tape are adhered to each other. The distance between the surfaces is maintained at a preset first predetermined value. Next, the restraining member approaches or contacts the non-adhesive surface of the adhesive tape by the second approaching mechanism, and the distance between the restraining member and the non-adhesive surface of the adhesive tape is maintained at a preset second predetermined value.

Therefore, even if the air bubbles caught between the holding table and the adhesive tape expand due to decompression and press the adhesive tape during the sticking by the sticking mechanism, the pressed adhesive tape is maintained at Blocked by semiconductor wafers in close proximity. In addition, the expansion of the air bubbles in the direction perpendicular to the surface of the adhesive tape is suppressed by the flat surface of the suppressing member.

Therefore, it can more reliably prevent that a part of the adhesive tape is pushed in a direction perpendicular to the surface of the adhesive tape and elongated due to the expansion of the air bubbles, thereby causing unevenness and wrinkles to be generated. As a result, the situation in which the adhesive tape is non-uniformly attached to the semiconductor wafer and the situation in which the adhesiveness between the adhesive tape and the semiconductor wafer is lowered can be reliably avoided. Moreover, the deterioration of the base material of an adhesive tape and an adhesive material by suppressing the elongation of an adhesive tape can also be avoided. In addition, the present configuration is not limited to the configuration in which the adhesive tape is preliminarily pasted on one side of the semiconductor wafer as long as the pressure in the chamber is decompressed and the adhesive tape is applied to the semiconductor wafer, so the features of the present invention can be applied to more Diverse composition.

According to the adhesive tape attaching method and the adhesive tape attaching device of the present invention, while avoiding damage to the wafer and circuit damage, one side of the wafer to which the adhesive tape is attached can be attached with high precision to the other side of the wafer. New adhesive tape.

4: With supply part

5: Mounting unit

6: With cutting mechanism

7: Chamber

8: Suppression unit

9: Stripping unit

10: With recycling department

20: Peel off components

22: Push Roller

23: Cut off unit

33A: Upper shell

33B, 33C: lower shell

37: Hold Desk

60: Control Department

61: Suppression component

77: Frame Holder

91: Attachment roller

93: Suppression Component

95: Wafer Holder

PT: Protective tape

W: semiconductor wafer

f‧‧‧ring frame

DT‧‧‧Support belt

FIG. 1 is a diagram illustrating the configuration of a mounting frame.

FIG. 1( a ) is a cross-sectional view showing the structure of the mounting frame before and after the attaching process, and FIG. 1( b ) is a perspective view of the mounting frame.

FIG. 2 is an overall front view showing the adhesive tape attaching device of Example 1. FIG.

FIG. 3 is a plan view showing the whole of the adhesive tape attaching device of Example 1. FIG.

4 is a longitudinal cross-sectional view showing the configuration of the rotary drive mechanism of the first embodiment.

FIG. 5 is a longitudinal sectional view showing the structure of the chamber of Example 1. FIG.

FIG. 6 is a longitudinal sectional view showing the configuration of the chamber of Example 1. FIG.

FIG. 7 is a flowchart illustrating the operation of the adhesive tape applying device of each embodiment; FIG. 7(a) is a flowchart illustrating the operation of the first embodiment, and FIG. 7(b) is a flowchart illustrating the operation of the second embodiment. .

FIG. 8 is a longitudinal sectional view showing the operation of step S1 in the first embodiment.

FIG. 9 is a longitudinal sectional view showing the operation of step S1 in the first embodiment.

FIG. 10 is a plan view showing the operation of step S1 in the first embodiment.

FIG. 11 is a longitudinal sectional view showing the operation of step S1 in the first embodiment.

FIG. 12 is a longitudinal sectional view showing the operation of step S1 in the first embodiment.

FIG. 13 is a longitudinal sectional view showing the operation of step S1 in the first embodiment.

FIG. 14 is a longitudinal sectional view showing the operation of step S1 in the first embodiment.

FIG. 15 is a longitudinal sectional view showing the operation of step S2 in the first embodiment.

FIG. 16 is a longitudinal sectional view showing the operation of step S3 in the first embodiment.

FIG. 17 is a longitudinal sectional view showing the operation of step S3 in the first embodiment.

FIG. 18 is a longitudinal sectional view showing the operation of step S4 in the first embodiment.

FIG. 19 is a longitudinal sectional view showing the operation of step S5 in the first embodiment.

FIG. 20 is a longitudinal sectional view showing the operation of step S6 in the first embodiment.

Fig. 21 is a diagram illustrating the effect of the first embodiment; Fig. 21(a) is a diagram showing the configuration of a conventional example, Fig. 21(b) is a diagram showing a problem that occurs in the configuration of the conventional example, and Fig. 21 (c) is a diagram showing the positional relationship between the holding table that maintains the approaching position and the semiconductor wafer in Example 1, and FIG. 21(d) is a diagram illustrating the effect of the holding table that maintains the approaching position in Example 1 , FIG. 21(e) is a diagram showing the positional relationship between the restraining member that maintains the close position and the first adhesive tape in Example 1, and FIG. 21(f) is a diagram illustrating the restraining member that maintains the close position in Example 1. Graph of the effect.

FIG. 22 is a longitudinal sectional view showing the whole of the adhesive tape attaching device of Example 2. FIG.

FIG. 23 is a plan view showing the whole of the adhesive tape attaching device of Example 2. FIG.

FIG. 24 is a longitudinal sectional view showing the configuration of the chamber of Example 2. FIG.

FIG. 25 is a longitudinal sectional view showing the operation of step S1 in the second embodiment.

Fig. 26 is a longitudinal sectional view showing the operation of step S3 of the second embodiment; Fig. 26(a) is a diagram showing the state before the support tape is attached, and Fig. 26(b) is a view showing the state after the support tape is attached .

FIG. 27 is a longitudinal sectional view showing the operation of step S5 in the second embodiment.

FIG. 28 is a longitudinal sectional view showing the operation of step S6 in the second embodiment.

FIG. 29 is a longitudinal sectional view showing the operation of step S7 in the second embodiment.

FIG. 30 is a longitudinal sectional view showing the operation of the attachment process of the modification.

FIG. 31 is a longitudinal sectional view showing the configuration of the chamber of Example 3. FIG.

32 is a longitudinal sectional view showing the operation of step S4 in the third embodiment.

FIG. 33 is a longitudinal sectional view showing the operation of step S5 in the third embodiment.

FIG. 34 is a longitudinal sectional view showing the configuration of the chamber of the modification (5).

FIG. 35 is a longitudinal cross-sectional view showing a configuration in which an adhesive tape is attached by an attaching roller according to the modification (5).

FIG. 36 is a longitudinal cross-sectional view showing the configuration of the chamber of the modification (7).

FIG. 37 is a longitudinal cross-sectional view showing the operation of step S4 in the modification (7).

Fig. 38 is a longitudinal sectional view showing the structure of the chamber of the modification (8); Fig. 38(a) is a view showing the structure of the state in which step S3 is completed, and Fig. 38(b) is a view showing the structure of step S4.

Fig. 39 is a diagram illustrating the effect of the configuration of the modification (8); Fig. 39(a) is a diagram showing the configuration before decompression for a conventional configuration that does not control the wafer holding portion to approach the adhesive tape 39(b) is a diagram showing the state of the air bubbles and the adhesive tape after depressurization in the conventional structure, and FIG. 39(c) is a diagram showing the structure in which the adhesive tape is attached to the wafer in the conventional structure Fig. 39(d) is a diagram showing the state of the air bubbles and the adhesive tape after decompression in the modification (8).

FIG. 40 is a longitudinal sectional view showing the configuration of a chamber according to a modification.

[Form of implementing the invention]

[Example 1]

<Description of the overall configuration>

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. In addition, in this embodiment, the case where the surface protection adhesive tape is applied to the circuit formation surface of the semiconductor wafer (hereinafter, simply referred to as "wafer") mounted on the ring frame is described as an example.

That is, as shown in FIG. 1( a ), in the mounting frame MF in which the adhesive tape DT for support is attached to the back surface of the semiconductor wafer W (hereinafter, simply referred to as “wafer W”), the A protective tape PT for protection is attached to the surface (circuit formation surface) of the wafer W. Hereinafter, the adhesive tape for support is referred to as "support tape DT", and the adhesive tape for protection is referred to as "protective tape PT". As shown in FIG. 1( b ), the mounting frame MF is produced by attaching the support tape DT to the back surface of the wafer W and the ring frame f. In Example 1, the support tape DT corresponds to the first adhesive tape of the present invention, and the protective tape PT corresponds to the second adhesive tape of the present invention.

FIG. 2 is a front view showing the overall structure of the adhesive tape attaching device according to the first embodiment of the present invention, and FIG. 3 is a top view of the adhesive tape attaching device according to the first embodiment.

The adhesive tape sticking apparatus of Example 1 includes: a wafer supply/recovery unit 1; a wafer transfer mechanism 2; an alignment stage 3; a tape supply unit 4; a mounting unit 5; a tape cutting mechanism 6; a chamber 7; Suppression unit 8; peeling unit 9 and tape recovery unit 10, etc. Hereinafter, a specific configuration will be described with respect to each of the above-described structural parts, mechanisms, and the like.

Two cassettes C1 and C2 are mounted in parallel in the wafer supply/recovery unit 1 . In each cassette C, a plurality of mounting frames MF are inserted into multiple layers in a horizontal posture with the circuit formation surface (surface) of the wafer W facing downward, and are accommodated.

The wafer transfer mechanism 2 includes two robot arms 2A and 2B. The two robotic arms 2A, 2B are configured to move horizontally forward and backward, and at the same time, the whole can be rotated and lifted. Furthermore, a horseshoe-shaped vacuum suction type wafer holding portion is provided at the tip of the robot arms 2A and 2B. The wafer holding portion is inserted into the gap between the mounting frames MF accommodated in multiple layers in the cassette C, and suction-holds the upper surface of the mounting frames MF. The mount frame MF held by suction is pulled out from the cassette C and conveyed in the order of the alignment stage 3 , the holding stage 37 , and the wafer supply/recovery unit 1 .

The alignment stage 3 is configured to align the mounting frame MF loaded and mounted by the wafer transfer mechanism 2 based on a notch formed in the outer periphery of the wafer W, a flat portion formed in the outer periphery of the frame f, and the like. .

As shown in FIG. 2 , the tape supply unit 4 , the placement unit 5 , the separator recovery unit 12 , and the cutting unit 23 are mounted on the same vertical plate 14 . The vertical plate 14 is moved horizontally along the upper frame 16 by the movable table 15 .

In the tape supply unit 4, a wide protective tape PT in a roll is loaded on the supply reel 17, and the protective tape PT with the separator S drawn out from the supply reel 17 is wound back and guided to the guide roller 18, The protective tape PT from which the separator S has been peeled off is guided to the placement unit 5 . Moreover, it is comprised so that moderate rotational resistance is given to the supply reel 17, and excess tape extraction cannot be performed.

In the separator recovery unit 12, a recovery reel 19 that winds the separator S peeled off from the protective tape PT is driven to rotate in the winding direction.

The mounting unit 5 mounts the protective tape PT from which the separator S has been peeled off on the holding table 37 with its adhesive surface facing up, and includes a peeling member 20 , a lift roller 21 , and a pressing roller 22 as shown in FIG. 4 . .

The peeling member 20 has a sharp edge at the leading end. The separator S is folded back to peel off the protective tape PT by setting the edge as the peeling member 20 obliquely downward. That is, the protective tape PT is protruded forward from the peeling member 20 . The lift roller 21 cooperates with the peeling member 20 to hold the protective tape PT in a timely manner. The pressing roller 22 is subjected to a non-adhesive treatment, and the front end of the protective tape PT protruding from the front end of the peeling member 20 is pressed and placed on a holding table 37 to be described later.

The cutting unit 23 includes: a movable table 25 that moves along a frame 24 provided on the front side of the peeling member 20; That is, the cutting unit 23 cuts the protective tape PT in the width direction.

As shown in FIGS. 2 and 3 , the tape cutting mechanism 6 is provided with a cutter unit 30 in a spacer support arm 29 which is cantilevered from a movable table 28 along the frame 27 and is supported by a lower diameter of the front end of the arm. to extend. The knife 31 with the knife tip facing downward is attached to the knife unit 30 through a knife holder. In addition, the tool unit 30 has an adjustable rotation radius through the support arm 29 . The tape cutting mechanism 6 cuts the protective tape PT placed on the holding table 37 into substantially the same shape and size as the wafer W. As shown in FIG.

The chamber 7 is constituted by a pair of upper and lower shells having an outer shape smaller than the width of the adhesive tape T. As shown in FIG. In this embodiment, one upper case 33A and two lower cases 33B and 33C are provided.

The lower cases 33B and 33C are connected and fixed to the rotation shaft 35 of the rotation drive mechanism 34 such as a motor, and are provided at both ends of the rotation arm 36 , respectively. That is, for example, when the lower case 33B and the upper case 33A form the chamber 7, the other lower case 33C is positioned at the tape placement position on the placement unit 5 side. Moreover, the upper surface and the lower surface of the lower cases 33B and 33C are subjected to mold release treatment such as fluorine processing.

The holding table 37 which can be raised and lowered is provided in the two lower cases 33B and 33C. The holding table 37 is connected to the ejector pins 38 penetrating the lower casings 33B and 33C. The other end of the ejector rod 38 is connected and driven by an actuator 39 composed of a motor or the like. Therefore, the holding table 37 is raised and lowered in the lower casings 33B and 33C. The position of the holding table 37 is controlled to an arbitrary height by the control unit 60 which will be described later.

The holding table 37 mounts and holds the protective tape PT with the separator S peeled off and the adhesive surface facing upward. As shown in FIG. 5 , a tool running groove 37a is formed on the upper surface of the holding table 37 so that the blade 31 provided in the tool unit 30 can be rotated and moved to cut the protective tape PT. In a plan view of the holding table 37 , the tool running grooves 37 a are formed at positions having substantially the same shape and size as the wafer W. As shown in FIG.

As shown in FIG. 5 , the upper case 33A is provided in the elevating drive mechanism 40 . The elevating drive mechanism 40 includes: a movable table 43 that can be raised and lowered along a rail 42 arranged longitudinally on the back of the vertical wall 41; a movable frame 44 that supports the movable table 43 in a height-adjustable manner; Front extending arm 45. The upper case 33A is attached to the support shaft 46 extending downward from the front end portion of the arm 45 .

The movable table 43 is screwed up and down by forward and reverse rotation of the screw 47 by the motor 48 .

As shown in FIG. 6 , the upper and lower casings 33A to 33C are communicated and connected to a vacuum device 51 via a flow path 50 . In addition, the flow path 50 on the side of the upper casing 33A is provided with a solenoid valve 52. Moreover, the flow path 55 provided with the solenoid valves 53 and 54 for atmospheric release is connected to each case 33A-33C in communication with each other. Moreover, the flow path 57 provided with the solenoid valve 56 which adjusts the internal pressure temporarily decompressed by leakage is connected in communication with the upper case 33A. In addition, the opening and closing operation of these solenoid valves 52 , 53 , 54 , and 56 and the operation of the vacuum device 51 are performed by the control unit 60 .

As shown in FIG. 5 , the suppression unit 8 includes a suppression member 61 in the upper case 33A. The suppressing member 61 is a plate having a flat bottom surface. The air cylinder 62 is connected to the upper part of this suppression member, and it raises and lowers in the upper case 33A. Moreover, the position of the restraining member 61 is controlled by the control part 60 to arbitrary height. In addition, the control part 60 corresponds to the 1st approaching mechanism and the 2nd approaching mechanism of this invention.

As shown in FIGS. 2 , 3 and 17 , the peeling unit 9 includes a movable table 65 that horizontally moves left and right along the guide rail 64 , a fixed support piece 66 that ascends and descends on the movable table 65 , and The movable piece 68 that opens and closes the air cylinder 67 . That is, the peeling unit 9 grasps and peels off one end side of the useless protective tape PT cut into the shape of the wafer W by the tape cutting mechanism 6 by the fixed carrier 66 and the movable piece 68 .

The tape recovery unit 10 is provided with a recovery container 69 which is located on the peeling end end side of the peeling unit 9 and recovers the protective tape PT peeled off by the peeling unit 9 .

The adhesive tape sticking device includes a frame holding table 77 . As shown in FIGS. 3 , 4 , and 15 , etc., the frame holding table 77 is provided on the rotating arm 36 in a ring shape surrounding the outer periphery of the lower casings 33B and 33C. Therefore, it rotates integrally with the lower casings 33B and 33C. When the ring frame f is placed on the frame holding table 77, the height is set so that the upper surface of the joint portion 70 of the lower casings 33B and 33C and the upper surface of the ring frame f are flush. The frame holding stand 77 corresponds to the frame holding portion in the present invention.

<Description of action>

Next, a series of operations for attaching the protective tape PT to the wafer W of the mounting frame MF by the apparatus of the above-described embodiment will be described. FIG. 7( a ) is a flowchart illustrating a process of attaching the protective tape PT to the wafer W of the mounting frame MF according to the first embodiment.

Step S1 (placement of protective tape)

According to the instruction to start the sticking of the protective tape PT, first, the tape supply unit 4 draws out the protective tape PT with the separator S attached to the placement unit 5 . Then, as shown in FIG. 8, the holding table 37 is raised so that the height of the upper surface thereof becomes the same height as the top (joint portion) 70 of the lower case 33B, and moves to the tape receiving position indicated by the solid line.

Furthermore, as shown in FIG. 8 , the placement unit 5 is moved from the start position shown by the broken line to the pressing process start position shown by the solid line. The protective tape PT is protruded by a predetermined length from the peeling member 20 while synchronizing the supply and winding of the protective tape PT. After that, the pressing roller 22 is lowered to press the front end of the protective tape PT against the joint portion 70 of the lower case 33B.

Thereafter, as shown in FIG. 9 , the protective tape PT is placed on the entire surface of the joint portion 70 and the holding table 37 by pressing the protective tape PT downward while moving the placing unit 5 to the left in the drawing. At this time, the placed protective tape PT is sucked and held by the holding table 37 . Then, as shown by the solid line in FIG. 9 , the placing unit 5 stops at a position exceeding a predetermined distance from the pressing of the joint portion 70 on the processing terminal side.

As shown in FIG. 10 , the cutting unit 23 is actuated, and the cutter 26 cuts the rear end side of the protective tape PT in the width direction (the y direction in the drawing). After the protective tape PT is cut into individual pieces, the placing unit 5 and the cutting unit 23 are reset to the starting positions.

After the placement unit 5 and the cutting unit 23 are returned to the home positions, the tape cutting mechanism 6 is actuated. That is, as shown in FIG. 11 , the cutter unit 30 is lowered to a predetermined height, and the cutter 31 is inserted into the protective tape PT in the cutter running groove 37a of the holding table 37 .

When the cutter 31 is inserted into the protective tape PT, the support arm 29 rotates about the vertical axis P as the rotation center. The cutter 31 rotates and moves along the cutter traveling groove 37 a along with the rotation, and the protective tape PT adsorbed and held by the holding table 37 is cut into substantially the same shape and size as the wafer W. At this time, the surface of the protective tape PT is kept horizontal. When the cutting of the protective tape PT is completed, the cutter unit 30 is raised and returned to the standby position.

After the protective tape PT is cut, the peeling unit 9 is moved to the peeling start position. As shown in FIG. 12 , both end sides of the protective tape PT exposed from the lower case 33B are sandwiched by the fixed receiving piece 66 and the movable piece 68 . Next, as shown in FIG. 13 , in this state, the peeling unit 9 moves it diagonally upward by a predetermined distance, and then peels off the useless protective tape PT cut into the same shape as the wafer while moving horizontally.

By peeling off the useless protective tape PT, the protective tape PT cut into the same shape as the wafer W is placed on the holding table 37 in a state where the adhesive surface is exposed upward. When the peeling unit 9 reaches the tape recovery unit 10 , the grip of the protective tape PT is released, and the protective tape PT is dropped into the recovery container 69 .

After the useless protective tape PT is peeled off, as shown in FIG. 14 , the holding table 37 is lowered while the protective tape PT is adsorbed and held, and returned to the starting position. At this time, the surface of the protective tape PT held by the holding table 37 is at a position lower than the joint portion 70 . When the holding table 37 on which the protective tape is placed is reset to the home position, the process of step S1 is completed.

Step S2 (placement of the mounting frame)

After the protective tape PT is placed on the holding table 37, the mounting of the mounting frame is started. That is, the robot arm 2A carries out the mounting frame MF from the cassette body C1 and places it on the alignment stage 3 . After the alignment table 3 is aligned, the mounting frame MF is conveyed above the holding table 37 by the robot arm 2A.

Next, as shown in FIG. 15 , the robot arm 2A lowers the mounting frame MF, and the mounting frame MF is placed on the lower case 33B. At this time, the support tape DT located between the ring frame f and the outer periphery of the wafer W is in contact with the top (joint portion) 70 of the lower case 33B, and the ring frame f is placed on the frame holding table 77 . Therefore, the support tape DT system and the joint portion 70 are in a flat state at the same height.

Also at this time, the distance D1 from the adhesive surface of the protective tape PT held by the holding table 37 to the surface of the wafer W is a sufficient distance to reliably prevent the protective tape PT from contacting the wafer W under atmospheric pressure. As an example, the distance from D1 is about 3 to 5 cm. By placing the mounting frame MF on the lower case 33B, the process of step S2 is completed.

Step S3 (Formation of the Chamber)

After the mounting of the mounting frame is completed, the formation of the chamber is started, that is, as shown in FIG. 16 , the rotary drive machine 34 is actuated to rotate the lower case 33B below the upper case 33A. At this time, the lower case 33C attached to the other end side of the rotating arm 36 is moved to the tape placement position. After the lower case 33B is rotated and moved, as shown in FIG. 17 , the upper case 33A is lowered to sandwich the support tape DT with the lower case 33B to form the chamber 7 .

Step S4 (proximity movement of the stage)

After the chamber is formed, the approach movement of the stage is performed. That is, as shown in FIG. 18 , the holding table 37 is raised from the starting position shown by the dotted line to the attaching position shown by the solid line under the control of the control unit 60 , so that the protective tape PT is brought close to the wafer W. As a result, the distance from the protective tape PT to the surface of the wafer W changes from D1 to D2. The control unit 60 performs various controls such that the position of the holding table 37 is maintained at the sticking position.

The distance D2 is set in advance so that damage to the wafer W can be avoided in the process of attaching the protective tape PT, which will be described later, so as to be equal to or less than the predetermined value Lt1. The predetermined value Lt1 varies depending on various conditions such as the thickness of the wafer W and the material of the protective tape PT. In Example 1, the predetermined value Lt1 is about 0.5 mm to 1 mm.

In addition, at this time, the protective tape PT and the surface of the wafer W are in a non-contact state. That is, the distance D2 is a predetermined positive value Lt2 or more, and is 0.1 mm or more as an example. Since the distance D2 is equal to or greater than the predetermined value Lt2, the situation in which the protective tape PT comes into contact with the surface of the wafer W can be avoided even under atmospheric pressure. The predetermined value Lt1 corresponds to the first predetermined value in the present invention.

Here, it is preferable to perform the approaching movement of the suppressing member 61 in addition to the approaching movement of the holding table 37 . When the restraining member 61 is moved closer, the air cylinder 62 is driven under the control of the control unit 60 . By this driving, the restraining member 61 descends from the initial position indicated by the broken line to the restraining position indicated by the solid line as shown in Fig. 18, and approaches the support belt DT. As a result, the distance from the flat surface 61a of the restraining member 61 to the support tape DT changes from E1 to E2. The control unit 60 performs various controls such that the position of the restraining member 61 is maintained at the restraining position.

The distance E2 is set in advance so that bubble expansion can be avoided in the direction perpendicular to the surface of the wafer (the z direction in the drawing), and the distance E2 is set to be equal to or less than the predetermined value Lt3. The predetermined value Lt3 varies depending on various conditions such as the thickness of the wafer W and the material of the protective tape PT. In Example 1, the predetermined value Lt3 is about 0.5 mm to 1 mm. In addition, from the viewpoint of preventing the expansion of air bubbles, it is more preferable to maintain the contact state between the non-adhesive surface of the tape DT and the flat surface 61a. That is, unlike the distance D2, the distance E2 can also be zero. The predetermined value Lt3 corresponds to the second predetermined value in the present invention.

Step S5 (attachment of protective tape)

After the close movement of the holding table and the restraining member is completed, the attachment of the protective tape is started. That is, the control part 60 operates the vacuum apparatus 51 in the state which closed the solenoid valves 53, 54, and 56, and depressurizes the inside of the upper case 33A and the inside of the lower case 33B. At this time, the opening degree of the solenoid valve 52 is adjusted so that the inside of both casings 33A and 33B is decompressed at the same speed.

When the inside of both casings 33A and 33B is decompressed to a predetermined air pressure, the control unit 60 closes the solenoid valve 52 and stops the operation of the vacuum device 51 .

The control unit 60 gradually increases the air pressure in the lower case 33B to a predetermined air pressure while adjusting the opening degree of the solenoid valve 56 so as to leak. At this time, as shown in Fig. 19, the air pressure in the upper case 33A becomes lower than that in the lower case 33B because the differential pressure thereof causes the protective tape PT to be pulled into the upper case 33A from its center. Therefore, the protective tape PT is gradually attached from the center toward the outer periphery of the wafer W to be placed close to it.

At this time, the non-adhesive surface of the support tape DT and the flat surface 61a of the restraining member 61 are brought close to each other in step S4. Therefore, even when air bubbles are contained between the support tape DT and the back surface of the wafer W, the expansion of the air bubbles in the direction (z direction) perpendicular to the surface of the wafer W is suppressed by the suppressing member 61 . Therefore, damage to the wafer W due to the expansion of the bubbles in the z direction can be appropriately avoided.

In addition, the adhesive surface of the protective tape PT and the surface of the wafer are maintained at a position close to the distance D2. Therefore, even if the bubbles expand in the z direction between the support tape DT and the back surface of the wafer W and the wafer W is pressed downward, the pressed wafer W is quickly held on the holding table 37 via the protective tape PT. blocked. That is, the deformation of the wafer W due to the downward pressing force is suppressed by the holding table 37, so that warpage and damage of the wafer W due to the expansion of air bubbles can be appropriately avoided.

When the air pressure in the upper case 33A reaches a preset air pressure, the control unit 60 adjusts the opening degree of the solenoid valve 54 so that the air pressure in the upper case 33A becomes the same as the air pressure in the lower case 33B. The holding table 37 is raised in accordance with the air pressure adjustment, and the mounting surface (upper surface) of the holding table 37 and the surface of the wafer W are set to the same height.

When the protective tape PT is attached to the entire surface of the wafer W, the control unit 60 raises the upper case 33A to open the upper case 33A to the atmosphere, and at the same time fully opens the solenoid valve 54 so that the lower case 33B side is also exposed to the atmosphere open. By this opening to the atmosphere, the process of attaching the protective tape in step S5 is completed.

In addition, while the protective tape PT is attached to the wafer W in the chamber 7 , the processes of steps S1 to S2 can be performed in the lower case 33C moving toward the tape placement position. That is, the protective tape PT from which the separator S has been peeled off is placed on the holding table 37 in the lower case 33C with the adhesive surface facing up. Then, the protective tape PT is cut into the same shape as the wafer W, and the useless protective tape PT is peeled and removed. Then, the attachment frame MF carried out from the cassette body C2 is mounted on the lower case 33C by the robot arm 2B. In this way, by arranging a plurality of lower casings and performing the processes of steps S1 to S2 alternately, the attachment efficiency of the protective tape PT to the mounting frame MF can be improved.

Step S6 (recovery of the mounting frame)

When the attachment process of the protective tape PT is completed in the chamber 7, the recovery of the mounting frame is started. That is, as shown in FIG. 20 , while the holding table 37 is lowered toward the home position, the rotating arm 36 is reversed. Also at this time, the restraining member 61 is also raised toward the home position.

By the inversion of the rotating arm 36, the lower case 33B is moved to the tape placement position on the placement unit 5 side, and the other lower case 33C is moved to the engagement position below the upper case 33A. The mounting frame MF to which the protective tape PT is attached is conveyed from the lower case 33B by the robot arm 2A, and is recovered to the original position of the case C1.

Further, while the mounting frame MF is collected on the lower case 33B side, the mounting frame MF on the lower case 33C side is subjected to the formation of a cavity, the sticking process of the protective tape PT, and the like. In the above, the sticking operation of the protective tape PT to the mounting frame MF for one turn is completed, and after that, the same process is repeated.

<Effects of using the configuration of Embodiment 1>

According to the configuration of the above-mentioned first embodiment, when a new adhesive tape is attached to the other side of the wafer with the adhesive tape attached to one side by the differential pressure of the chamber, the occurrence of damage to the wafer can be reliably avoided. And the new adhesive tape is attached with good precision.

As shown in FIG. 21( a ), there is a case where air bubbles Ar are mixed between the adhesive tape T1 and the wafer W previously attached to one side of the wafer W. As shown in FIG. In the conventional adhesive tape attaching apparatus, when a new adhesive tape T2 is attached to the wafer W by differential pressure in the chamber, as shown in FIG. 21( b ), the bubbles Ar expand in all directions.

As a result, a large pressing force Ps is applied to the wafer W by the expanded bubbles Ar. In addition, since the structure of the holding table and the like is not close to the wafer W, a wide space is formed on the other surface of the wafer W. As shown in FIG. Therefore, the wafer W is deformed like a warp due to the pressing force Ps, and problems such as breakage of the wafer W and circuit damage occur. Furthermore, when the bubbles Ar expand in the z direction, the expansion makes the length of the adhesive tape T1 extended, so that the base material and the adhesive material of the adhesive tape T1 lose elasticity and deteriorate.

As shown in FIG. 21( c ), in the apparatus of Example 1, before the differential pressure is generated in the chamber 7 , the holding table 37 on which the adhesive tape T2 (protective tape PT) is placed is brought close to facing the wafer W, and maintained This is close to the opposite state. That is, each position is controlled so that the distance between the stage 37 and the wafer W is always kept at a predetermined small value D2 while the adhesive tape T2 is applied by the differential pressure.

In this case, even if the wafer W is pressed due to air bubbles or the like, as shown in FIG. Support quickly. At this time, each configuration is controlled by the control unit 60, and the holding table 37 is held (fixed) at a position close to the semiconductor wafer. Therefore, the holding table 37 does not move downward due to the pressing of the air bubbles. Therefore, the deformation of the wafer W can be suppressed, and the occurrence of problems such as breakage of the wafer W and circuit damage can be avoided more reliably.

In addition, since the distance D2 is set so that the adhesive tape T2 and the wafer W are not in contact with each other, it can be avoided that the adhesive tape T2 contacts the wafer W under atmospheric pressure and air bubbles are mixed in. Even in the case where the wafer W is pressed by the pressing force Ps of the expanded bubble Ar and comes into contact with the adhesive tape T2, since this is after the vacuum suction is started, there will be no contact between the adhesive tape T2 and the adhesive tape T2. A situation where air bubbles are mixed between wafers. Therefore, the new adhesive tape T2 can be adhered to the wafer W with high precision while avoiding damage to the wafer W.

Furthermore, as shown in FIG. 21( e ), in the apparatus of Example 1, the restraining member 61 is brought close to the adhesive tape T1 (support tape DT) and opposed to each other before the differential pressure is generated, and the close and opposed position is maintained. That is, while the protective tape PT is stuck by the differential pressure, the respective positions are controlled so that the distance between the suppressing member 61 and the adhesive tape T1 is always a predetermined small value E2.

In this case, the bubbles Ar are mixed between the support tape DT and the wafer W, and even if the bubbles Ar expand due to the decompression, as shown in FIG. The expansion of the bubble Ar in the direction (z-direction) can still be quickly suppressed by approaching the flat surface 61 a of the opposing suppressing member 61 .

That is, since the air bubbles Ar about to expand in the z direction receive the repulsive force by the flat surface 61a of the restraining member 61 whose position is fixed, the expansion in the z direction is restricted. At this time, each structure is controlled by the control part 60, and the flat surface 61a of the suppression member 61 is held (fixed) at a predetermined position close to the adhesive tape T1. Therefore, the suppressing member 61 does not move upward due to the pressing of the air bubbles.

As a result, since the bubbles Ar expand so as to spread along the surface (xy plane) of the wafer W, the pressing force Ps in the z direction is reduced as compared with the conventional configuration. Therefore, the deformation of the wafer W due to the excessive pressing force Ps can be suppressed, and the occurrence of problems such as breakage of the wafer W and damage to the circuit can be more reliably avoided. In addition, since the expansion of the adhesive tape T1 due to the expansion of the air bubbles in the z direction can be suppressed, the deterioration of the adhesive tape T1 caused by the expansion can be avoided.

In addition, by maintaining the predetermined short distance E2, the suppressing member 61 is configured to maintain a near-opposed state or a contact state with respect to the wafer W. As shown in FIG. Therefore, the suppressing member 61 does not apply an unnecessary pressing force to the wafer W, so that a situation in which the wafer W is damaged or a situation in which the wafer W comes into contact with the adhesive tape T2 under atmospheric pressure can be reliably avoided.

In Example 1, both the suppressing member 61 and the holding table 37 were moved in close proximity, and a differential pressure was generated after maintaining the close and opposing state with the adhesive tape T2. Therefore, when the adhesive tape T2 is attached to the wafer W by the differential pressure, the effects of reducing the pressing force Ps and suppressing the deformation of the wafer W can be obtained, respectively. As a result, when the pressure in the chamber 7 is reduced and the adhesive tape T2 is adhered by a differential pressure, the effects of preventing damage to the wafer W and preventing circuit damage can be multiplied.

[Example 2]

Next, Embodiment 2 of the present invention will be described. In Embodiment 1, the configuration in which the protective tape PT is attached to the wafer W of the mounting frame MF is used as an example for description. In Example 2, the configuration of the mounting process in which the support tape DT is newly attached so as to cover the back surface and the ring frame of the wafer W to which the protective tape PT is previously attached to the surface to form the mounting frame MF will be described as an example. In addition, the same code|symbol is attached|subjected to the same structure as the adhesive tape sticking apparatus of Example 1, and a different structure part is demonstrated in detail. In Example 2, the protective tape PT corresponds to the first adhesive tape in the present invention, and the support tape DT corresponds to the second adhesive tape in the present invention.

As shown in FIGS. 22 and 23 , the adhesive tape applying apparatus of the second embodiment newly includes a frame supply unit 75 , a robot arm 76 , and a cutting unit 78 . In addition, the position of the tape supply part 4 is opposite to the position of the separator collection part 12 . In addition, the tape cutting mechanism 6 can be omitted.

The frame supply part 75 is provided on the side of the box body C1. A transport vehicle 79 of a wagon type that stores the ring frames f in layers is connected to this space. This transport vehicle 78 is equipped with a lift table inside. The structure is such that the ring frames f are stacked on the lift table, and the ring frames f are handed over to the robot arm 76 one by one from an upper opening while being raised and lowered at a predetermined pitch.

The robot arm 76 sucks and holds the upper surface of the ring frame f by a horseshoe-shaped holding portion and conveys it.

The cutting unit 78 cuts the support tape DT attached to cover the wafer W and the ring frame f along the ring frame f. As shown in FIG. 24, the cutting unit 78 is equipped with the raising/lowering drive mechanism 40 which raises and lowers the upper case 33A. The cutting unit 78 includes a boss portion 80 in which the spacer bearing 79 rotates around the support shaft 46 . Here, the hub portion 80 is provided with four support arms 81 to 84 extending radially at the center.

A tool holder supported horizontally by a circular plate-shaped tool 85 is mounted on the front end of a support arm 81 so as to be movable up and down, and at the same time, a push roller 87 is mounted on the upper and lower sides of the rocker arm 88 so as to be movable up and down. The other support arms 82 to 84 have their front ends.

The upper part of the boss|hub part 80 has the connection part 89, and this connection part 89 is connected with the rotating shaft of the motor 90 provided in the arm 45, and is driven.

Next, in the adhesive tape applying device of the second embodiment, a configuration having a different function from that of the device of the first embodiment will be described.

A large number of wafers W are inserted into the cassettes C1 and C2 of the wafer supply/recovery section 1 by inserting them into multiple layers in a horizontal position with the surface facing down. A protective tape PT is attached to the surface of each wafer W in advance.

The wafer holding portion of the wafer transfer mechanism 2 is inserted into the gap between the wafers W stored in multiple layers in the cassette C, and the wafer W is sucked and held from the back surface. The sucked and held wafer W is pulled out from the cassette C and conveyed in the order of the alignment stage 3 , the holding stage 37 , and the wafer supply/recovery unit 1 .

The alignment stage 3 is configured to align the wafer W loaded and loaded by the wafer transfer mechanism 2 based on a notch formed on the outer periphery of the wafer W, an orientation plane, and the like.

In the tape supply unit 4, a roll of wide-width support tape DT is loaded on the supply reel 17, and the support tape DT with the separator S drawn out from the supply reel 17 is wound back and guided to the guide roller 18, The support tape DT from which the separator S has been peeled off is guided to the attaching unit 2A.

The separator recovery unit 12 is a recovery reel 19 that winds the separator S peeled off from the support tape DT and is driven to rotate in the winding direction.

The placement unit 5 is for attaching the support tape DT from which the separator S has been peeled off to the joint portion 70 of the lower casings 33B and 33C with the adhesive surface facing down, and includes a peeling member 20 , a lift roller 21 , and a pressing roller twenty two.

The front end of the peeling member 20 has a sharp edge. The separator S is folded back by the peeling member 20 , which has the edge slanted downward, and the support tape DT is peeled off. That is, the support tape DT is protruded forward from the peeling member 20 . The lift roller 21 cooperates with the peeling member 20 to hold the support tape DT at appropriate time. The pressing roller 22 presses the front end of the protective tape PT protruding from the front end of the peeling member 20 and sticks it to the joint portion 70 of the lower cases 33B and 33C. The cutting unit 23 cuts the support tape DT in the width direction.

The holding table 37 sucks and holds the wafer W to which the protective tape PT is attached with the surface of the wafer W facing downward. As shown in FIG. 22 and FIG. 24 , the holding table 37 has a plurality of support pins 71 built therein. The support pin 71 is configured to be movable up and down, and its front end can be pushed up higher than the holding surface of the holding table 37 .

The peeling unit 9 grasps and peels off one end side of the support tape DT which is useless after being cut by the cutting unit 78 by the fixed carrier sheet 66 and the movable sheet 68 . The tape recovery unit 10 is provided with a recovery container 69 for recovering the useless support tape DT peeled off by the peeling unit 9 .

<Description of action>

Here, the operation of forming one circle of the mounting frame MF by sticking the support tape DT so as to cover the wafer W with the protective tape PT and the ring frame f using the adhesive tape sticking apparatus of the second embodiment will be described. Fig. 7(b) is a flowchart of a process for explaining the operation of the installation process of the second embodiment.

Step S1 (Wafer Mounting)

In response to the instruction to start attaching the support tape DT, first, the robot arm 2A unloads the wafer W from the cassette C1 and places it on the alignment stage 3. After the alignment stage 3 is aligned, the robot arm 2A moves it to the holding belt 37 at the belt attaching position.

As shown in FIG. 25 , the holding table 37 pushes the plurality of support pins 71 higher than the top (joint portion) 70 of the lower case 33B to receive the wafer W. The support pins 71 that have received the wafer W are lowered, and the wafer W is sucked and held by the holding surface of the holding table 37 . At this time, the surface of the wafer W is positioned lower than the bonding portion 70 . The wafer W is sucked and held by the holding table 37 via the protective tape PT, and the process of step S1 is completed.

Step S2 (placement of the ring frame)

After the wafer placement is completed, the ring frame placement is started. That is, the robot arm 76 carries out the ring frame f from the frame supply unit 75 and places it on the frame holding table 77 at the tape attaching position. The engineering of step S2 may be performed before step S1, or may be performed during the execution of step S1.

Step S3 (Attaching the support tape to the ring frame)

When the mounting of the wafer and the mounting of the ring frame are completed, the process of step S3 is started. That is, as shown in FIG. 26( a ), the placement unit 5 is moved from the start position shown by the broken line to the sticking process start position shown by the solid line. While the supply and winding of the support tape DT are synchronized, the support tape DT is protruded from the peeling member 20 by a predetermined length. After that, the pressing roller 22 is lowered to press the front end of the support belt DT against the upper surface of the ring frame f.

As shown in FIG. 26( b ), the placing unit 5 moves from the pressing process start position shown by the broken line to the terminal position shown by the solid line so as to cover the joint portion 70 of the ring frame f and the lower case 33B. Way to attach support tape DT. At this time, the back surface of the wafer W and the adhesive surface of the support tape DT face each other with a predetermined distance D1 therebetween. When the placement unit 5 reaches the end position, the support tape DT is cut in the width direction by the cutting unit 23 . Step S3 of the second embodiment corresponds to the first attaching process in the present invention.

Step S4 (Formation of the Chamber)

When the support tape DT is attached to the ring frame f, the formation of the chamber is performed in the same manner as in Example 1. That is, after the rotary drive machine 34 is actuated to rotate and move the lower case 33B below the upper case 33A, the upper case 33A is lowered. Next, the chamber 7 is formed by sandwiching the support tape DT by the lower case 33B and the upper case 33A. At this time, the distance from the non-adhesion surface of the support tape DT to the flat surface 61a of the restraining member 61 is E1.

Step S5 (proximity movement of the stage)

After the chamber is formed, the proximity movement of the stage is performed. That is, as shown in FIG. 27 , the holding table 37 is raised from the starting position shown by the dotted line to the attaching position shown by the solid line under the control of the control unit 60 , so that the wafer W is brought close to the support belt DT. As a result, the distance from the support tape DT to the surface of the wafer W changes from D1 to D2. The control unit 60 performs various controls such that the position of the holding table 37 is maintained at the sticking position. In addition, at this time, the support tape DT and the surface of the wafer W are in a non-contact state.

The distance D2 is preset to be equal to or smaller than the predetermined value Lt1, so that damage to the wafer W can be avoided in the process of attaching the protective tape PT to be described later. The predetermined value Lt1 varies depending on various conditions such as the thickness of the wafer W and the material of the protective tape PT. In Example 1, the predetermined value Lt1 is about 0.5 mm to 1 mm. The value of the distance D2 is the same as that of the first embodiment.

Here, in addition to the approaching movement of the holding table 37 , it is preferable to further perform the approaching movement of the suppressing member 61 . When the restraining member 61 is moved closer, the air cylinder 62 is driven under the control of the control unit 60. By this driving, as shown in FIG. 27 , the restraining member 61 descends from the starting position indicated by the broken line to the restraining position indicated by the solid line, and approaches the non-adhesion surface of the support tape DT.

As a result, the distance from the flat surface 61a of the suppressing member 61 to the support tape DT changes from E1 to E2. The control unit 60 performs various controls such that the position of the restraining member 61 is maintained at the restraining position. That is, the distance from the flat surface 61a to the support belt DT is always controlled to be E2. In addition, in order to suppress the deformation of the wafer W more quickly, the distance E2 is preferably smaller. In particular, it is preferable to control the height of the restraining member 61 so that the flat surface 61a is kept in contact with the support belt DT.

Step S6 (Attaching the support tape to the wafer)

After the close movement of the holding table and the restraining member is completed, the attachment of the support tape is started. That is, the control unit 60 operates the vacuum device 51 with the solenoid valves 53, 54, and 56 closed, and decompresses the inside of the upper case 33A and the inside of the lower case 33B at the same speed, as in the first embodiment. When the inside of the housings 33A and 33B is decompressed to a predetermined air pressure, the control unit 60 closes the solenoid valve 52 and stops the operation of the vacuum device 51 .

The control unit 60 gradually increases the air pressure in the upper case 33A to a predetermined air pressure while adjusting the opening degree of the solenoid valve 56 so that one of them leaks. At this time, as shown in FIG. 28, the air pressure in the lower case 33B becomes lower than the air pressure in the lower case 33B because the differential pressure thereof causes the support tape DT to be pulled into the lower case 33B from its center. Therefore, the support tape DT is gradually attached from the center toward the outer periphery of the wafer W to be placed close to it.

At this time, since the holding table 37 is sucking and holding the guard tape PT, the distance between the holding table 37 and the guard tape PT is controlled to be zero. Therefore, even when air bubbles are entangled between the protective tape PT and the wafer W, the air bubbles can be prevented from expanding in the z direction at the time of decompression. Therefore, it is possible to avoid a situation in which the wafer W is damaged due to the excessive pressing force acting on the wafer W upward.

In addition, the distance from the wafer W to the suppressing member 61 is maintained at a very small value (D2+E2). Therefore, even if the wafer W is pushed upward due to expansion of the bubbles caught between the protective tape PT and the wafer W, the wafer W can be quickly stopped by the flat surface 61 a of the restraining member 61 . That is, the warpage and deformation of the wafer W are appropriately suppressed by the suppressing member 61 . As a result, it is possible to prevent the occurrence of situations such as deformation and breakage of the wafer W more reliably.

When the air pressure in the upper case 33A reaches a preset air pressure, the control unit 60 adjusts the opening degree of the solenoid valve 54 so that the air pressure in the lower case 33B becomes the same as the air pressure in the upper case 33A. The upper surface of the wafer W (here, the back surface of the wafer) and the upper surface of the ring frame f are set to the same height by raising the holding table 37 in response to this air pressure adjustment.

In addition, the cutting unit 78 is actuated while the sticking process of the support tape DT is being performed in the chamber 7 . At this time, as shown in FIG. 28 , the cutting unit 78 rotates with the vertical axis P as the center of rotation. By this rotation, the cutter 85 cuts the support tape DT attached to the ring frame f into the shape of the ring frame f. Next, the pressing roller 87 is pressed while being rotated on the tape cutting portion on the ring frame f following the cutter 85 .

That is, when the chamber 7 is constituted by the lowered upper case 33A and the lower case 33B, the cutter 85 and the pressing roller 87 of the cutting unit 78 also reach the cutting action position. In this way, the support tape DT is attached to the entire back surface of the wafer W and is cut along the ring frame f.

When the attachment and cutting of the support tape DT are completed, the control unit 60 lifts the upper case 33A to open the upper case 33A to the atmosphere, and fully opens the solenoid valve 54 to also open the lower case 33B to the atmosphere. According to this atmospheric opening, the attachment process of the support tape in step S6 is completed. Step S6 in the second embodiment corresponds to the second attaching process in the present invention.

In addition, while the protective tape PT is attached to the wafer W in the chamber 7 , the wafer W and the ring frame f are placed on the lower case 33C at the tape placement position by the robot arm 2A and the robot arm 76 . With the frame holding table 77, the sticking process of the adhesive tape DT is performed.

Step S7 (recovery of the mounting frame)

When the attachment process of the support tape DT is completed in the chamber 7, the recovery of the mounting frame is started. That is, while the holding table 37 is lowered toward the home position, the rotating arm 36 is reversed. Also at this time, the restraining member 61 is also raised toward the home position (see FIG. 20 ).

By the inversion of the rotating arm 36, the lower case 33B is moved to the tape placement position on the placement unit 5 side, and the other lower case 33C is moved to the engagement position below the upper case 33A.

After the rotating arm 36 is reversed, the peeling unit 9 is moved to the peeling start position. As shown in FIG. 29 , both end sides of the support tape DT exposed from the ring frame f are sandwiched by the fixed receiving piece 66 and the movable piece 68 . After moving it diagonally upward by a predetermined distance in this state, the useless support tape DT cut along the ring frame f is peeled off while moving horizontally.

When the peeling unit 9 reaches the tape collecting section 10, the holding of the support tape DT is released, and the useless support tape DT is dropped into the collecting container 69. The mounting frame MF formed by attaching the support tape DT to the wafer W is transported from the lower case 33B by the robot arm 2A and recovered to the original position of the cassette C1.

In addition, on the lower case 33B side, while the peeling process and the peeling process of the adhesive tape DT are completed and the wafer W and the ring frame f are unloaded from the mounting frame integrally formed, the support tape DT is moved toward the wafer on the lower case 33C side. W sticking processing and cutting processing. In the above, the operation of attaching the support tape DT to the wafer W for one turn is completed, and after that, the same process is repeated.

In this way, also in the adhesive tape attaching apparatus of the second embodiment, the process of attaching the support tape DT by the differential pressure of the chamber to the other surface of the wafer W to which the protective tape PT is attached , deformation and breakage of the wafer W can be more reliably avoided. That is, when the inside of the chamber 7 is depressurized, the holding table 37 is brought close to the adhesive surface of the support tape DT, and the restraining member 61 is brought close to or in contact with the non-adhesive surface of the support tape DT.

Therefore, even when air bubbles are entangled between the protective tape PT and the wafer W attached in advance, the pressing force acting on the wafer W due to the expansion of the air bubbles in the z direction at the time of decompression can be greatly reduced . Also, even if the wafer W is pushed upward, the deformation of the wafer W can be quickly suppressed by the flat surface 61 a of the suppressing member 61 . As a result, deformation and breakage of the wafer W in the attaching process of the support tape DT can be more reliably prevented.

In addition, since the holding table 37 attracts the wafer W, the air bubbles caught between the protective tape PT and the wafer W can be prevented from expanding in the z direction. Therefore, the pressing force acting on the circuit surface of the wafer W can be reduced, and the deterioration of the protective tape PT due to the elongation of the protective tape PT can be appropriately avoided.

[Example 3]

Next, Embodiment 3 of the present invention will be described. In Example 3, as in Example 1, in the mounting frame MF in which the support tape DT is attached to the back surface of the wafer W, the protective tape PT is attached to the surface of the wafer W. However, the internal structure of the chamber 7 is different from that of the first and third embodiments.

As shown in FIG. 17 , in Example 1, a configuration in which the frame holding table 77 is arranged outside the chamber 7 will be described as an example. That is, in Example 1, the chamber 7 is formed by sandwiching the support tape DT between the ring frame f and the wafer W by the pair of shells 33A and 33B. On the other hand, as shown in FIG. 31 , in Example 3, the frame holding portion 77 that holds the ring frame f is arranged inside the chamber 7 . That is, the chamber 7 is formed in a state in which the entire mounting frame MF is accommodated in the chamber 7 .

Moreover, in Example 3, the holding base 37 for holding the protective tape PT is provided in the upper case 33A, and the restraining member 61 is provided in the lower case 33B. The suppressing member 61 having the flat surface 61a is movable up and down, and has a function of placing and holding the wafer W. The holding table 37 is configured to be movable up and down. In addition, similarly to the first embodiment, the holding table 37 may be provided in the lower case 33B, and the suppressing member 61 may be provided in the upper case 33A. In Example 3, the holding table 37 corresponds to the tape holding portion and the first restraining member in the present invention, and the restraining member 61 corresponds to the wafer holding portion and the second restraining member in the present invention.

The operation of attaching the protective tape PT to one turn of the wafer W of the mounting frame MF by the adhesive tape attaching device of the third embodiment will be described. The flow chart of the operations in Embodiment 3 is based on Embodiment 1. Like Example 1, the support tape DT in Example 3 corresponds to the first adhesive tape in the present invention, and the protective tape PT corresponds to the second adhesive tape in the present invention.

Step S1 (holding of the guard tape)

In accordance with the instruction to start attaching the protective tape PT, first, the protective tape PT with the separator S attached thereto is pulled out, and the placing unit 5 peels the separator S from the protective tape PT, and pushes the roller 22 to push the protective tape PT toward the protective tape PT. The holding table 37 is pressed above. The protective tape PT is placed on the holding table 37 by this pressing, and the holding table 37 adsorbs and holds the protective tape PT. In the same manner as in the first embodiment, the protective tape PT is cut into the same shape as the wafer W by the cutting unit 23 and the tape cutting mechanism 6 . The useless protective tape PT after being cut is peeled off by the peeling unit 9 and recovered toward the recovery container 69 .

Step S2 (placement of the mounting frame)

After the protective tape PT is held on the holding table 37 , the mounting frame MF is carried out and aligned on the alignment table 3 in the same manner as in the first embodiment, and then the mounting frame MF is placed on the lower case 33B. At this time, the wafer W is placed on the restraining member 61 , and the ring frame f is placed on the frame holding table 77 .

Step S3 (Formation of the Chamber)

After the mounting of the mounting frame is completed, the lower case 33B is rotated and moved below the upper case 33A. Then, the upper case 33A is lowered, and the upper case 33A and the lower case 33B are brought into close contact to form the chamber 7 . FIG. 31 shows a state in which the cavity 7 has been formed in Example 3. As shown in FIG. At this time, the distance D1 from the adhesive surface of the protective tape PT held by the holding table 37 to the surface of the wafer W is a distance sufficient to reliably prevent the protective tape PT from contacting the wafer W under atmospheric pressure.

Step S4 (proximity movement of the stage)

After the chamber is formed, the proximity movement of the stage is performed. That is, as shown in FIG. 32, the holding table 37 is lowered from the starting position shown by the broken line to the attaching position shown by the solid line under the control of the control unit 60, and the holding table 37 and the protective tape PT are brought close to the crystal. circle W. As a result, the distance from the protective tape PT to the surface of the wafer W changes from D1 to D2. The control unit 60 performs various controls such that the position of the holding table 37 is maintained at the sticking position. In Example 3, the holding base 37 corresponds to the first suppressing member in the present invention, and the suppressing member 61 corresponds to the second suppressing member in the present invention.

The distance D2 is set in advance so that damage to the wafer W can be avoided in the process of attaching the protective tape PT, which will be described later, so as to be equal to or less than the predetermined value Lt1. In Example 3, the predetermined value Lt1 is about 0.5 mm to 1 mm. In addition, the protective tape PT and the surface of the wafer W are in a non-contact state. That is, the distance D2 is a predetermined positive value Lt2 or more, and is 0.1 mm or more as an example.

Step S5 (attachment of protective tape)

After the approaching movement of the holding table is completed, the attachment of the protective tape is started. That is, the control unit 60 operates the vacuum device 51 in a state where the solenoid valves 53 , 54 , and 56 are closed to depressurize the inside of the chamber 7 .

At this time, the non-adhesive surface of the support tape DT is in contact with the flat surface 61 a of the restraining member 61 . Therefore, even when air bubbles are contained between the support tape DT and the back surface of the wafer W, the expansion of the air bubbles in the direction perpendicular to the surface of the wafer W (z direction) is suppressed by the suppressing member 61 at the time of decompression. Therefore, damage to the wafer W due to the expansion of the bubbles in the z direction can be appropriately avoided. In addition, since the distance D2 is equal to or greater than the predetermined value Lt2, a situation in which the protective tape PT comes into contact with the surface of the wafer W can be avoided even under atmospheric pressure.

In addition, the adhesive surface of the protective tape PT and the surface of the wafer are maintained at a position close to the distance D2. Therefore, even if the bubbles expand in the z direction between the support tape DT and the back surface of the wafer W, the wafer W is pushed upward, and the pushed wafer W is quickly held on the holding table 37 via the protective tape PT. block. That is, since the deformation of the wafer W due to the upward pressing force is suppressed by the holding table 37, it is possible to appropriately avoid the occurrence of warpage and breakage of the wafer W due to the expansion of air bubbles during decompression. .

When the air pressure inside the chamber 7 is reduced to a predetermined value, the control unit 60 closes the solenoid valve 52 and stops the operation of the vacuum device 51 . Next, as shown in FIG. 33 , the control unit 60 moves the holding table 37 further downward, and at the same time releases the suction and holding of the protective tape PT by the holding table 37 . At this time, in the decompressed state, the protective tape PT is pressed against the surface of the wafer W by the holding table 37 . Therefore, the protective tape PT can be attached to the wafer W without air bubbles being drawn.

When the protective tape PT is attached to the entire surface of the wafer W, the control unit 60 fully opens the solenoid valves 53 , 54 , and 56 to open the chamber 7 to the atmosphere. Through this atmospheric opening, the process of attaching the protective tape in step S5 is completed.

Step S6 (recovery of the mounting frame)

When the attachment process of the protective tape PT is completed in the chamber 7, the recovery of the mounting frame is started. The engineering system of step S6 is the same as that of Example 1. That is, the rotating arm 36 is reversed to move the lower case 33B to the tape placement position on the placement unit 5 side. The mounting frame MF to which the protective tape PT is attached is transported from the lower case 33B by the robot arm 2A, and is recovered to the original position of the cassette C1.

As shown in Example 3, the present invention can also be applied to a configuration in which the inside of the chamber 7 is depressurized and the protective tape PT is attached to the mounting frame MF in a state where the mounting frame MF is accommodated inside the chamber 7 . constitute. When the mounting frame MF is produced under atmospheric pressure, fine air bubbles Ar may be entangled between the wafer W and the support tape DT. When the pressure around the mounting frame MF is decompressed in this state, the bubbles Ar expand to cause deformation and breakage of the wafer, and deformation and deterioration of the support tape DT.

In the apparatus of the present invention, the holding table 37 having a flat surface and holding the protective tape PT is brought close to the wafer W before the inside of the chamber 7 is depressurized. Therefore, even if the wafer W is pressed due to the expansion of the air bubbles Ar, the wafer W is quickly blocked by the flat surface of the holding table 37 . That is, since the deformation of the wafer W due to the pressing force of the expanded bubbles is suppressed by the holding table 37, the occurrence of warpage of the wafer W due to the expansion of the bubbles Ar at the time of decompression can be appropriately avoided. damaged condition.

In addition, at this time, by bringing the holding table 37 close to the wafer W, the protective tape PT held by the holding table 37 is also brought close to the flat wafer W. That is, even if the air bubbles caught between the holding table 37 and the protective tape PT expand due to decompression and the protective tape PT is pressed in the z direction, the protective tape PT is quickly suppressed by the wafer W. member 61 is suppressed. Therefore, it is possible to more reliably avoid undesired situations such as irregularities and wrinkles occurring in the protective tape PT due to the expansion of the air bubbles, and the protective tape PT being non-uniformly attached to the wafer W.

Furthermore, in the apparatus of the present invention, the suppressing member 61 is brought into contact with the support tape DT before the inside of the chamber 7 is depressurized. Therefore, the elongation of the support tape DT due to the expansion of the air bubbles Ar is quickly suppressed by the suppressing member 61 . Therefore, deformation and deterioration of the support tape DT due to elongation of the support tape DT can be prevented more reliably.

In this way, with the structure in which the pressure is reduced in a state where the member having a flat surface is brought close to or in contact with both surfaces of the protective tape PT or the support tape DT, the pressure of the adhesive tape in the surface direction or deformation is suppressed by the member having a flat surface . As a result, it is possible to prevent the adhesive tape or the wafer W from being adversely affected by the expansion of air bubbles entangled in the adhesive tape under atmospheric pressure.

In addition, the configuration in which the entire ring frame f and the wafer W are accommodated in the chamber 7 as in the third embodiment can also be applied to the configuration in the second embodiment. That is, in order to accommodate the wafer W and the ring frame f with the protective tape PT attached to the surface in advance in the chamber 7, the support tape DT may be replaced so as to cover the back surface of the wafer W and the ring frame f. A mounting frame MF is produced by sticking it.

In addition, the present invention can also be implemented in the following forms.

(1) In each of the above embodiments, the configuration using the ring frame f is used as an example for description, but it is not limited thereto. That is, as shown in FIG. 30 , in the case of a process of attaching the second adhesive tape T2 by the differential pressure of the chamber 7 to the other surface of the wafer W to which the first adhesive tape T1 has been previously attached to one surface , the structure of the present invention can be applied.

(2) In each of the above-described embodiments and modifications, the configuration includes two lower cases 33B and 33C, but one may be used. In this case, the lower case may be rotatably moved by the rotating arm 36 as in the above-mentioned embodiment, or may be configured to be slidably moved along a linear track.

(3) In each of the above-described embodiment and modification, each of the holding table 37 and the restraining member 61 may have a configuration in which a heater is further built in. As an example, FIG. 24 shows a configuration in which the heater 63 is built in the suppressing member 61 . In this case, when the sticking process is performed inside the chamber 7, the adhesive and the base material constituting each of the protective tape PT and the support tape DT are heated and softened by a heater. As a result, each adhesive tape becomes more easily deformed. In addition, a heater may be provided in any one of the holding table 37 and the suppressing member 61 .

(4) In step S1 of the above-mentioned Embodiment 1, the configuration in which the tape-shaped protective tape PT from which the separator S has been peeled off is placed on the holding table 37 and cut into the shape of the wafer W has been described as an example. However, as long as the protective tape PT whose adhesive surface is exposed upward is placed on the holding table 37, the process of step S1 is not limited to this.

As a modification of the first embodiment, a configuration in which the protective tape PT precut in advance according to the shape of the wafer W is placed on the holding table 37, etc. can be mentioned. In addition, step S1 may be completed in a state where the protective tape PT placed on the holding table 37 is cut into individual pieces, and the protective tape PT may be cut along the outer shape of the wafer W after the attaching process of step S5 is performed. .

(5) As shown in FIG. 34 , the structure of the present invention can be widely applied to the process of attaching the second adhesive tape T2 to the other surface of the wafer W to which the first adhesive tape T1 has been previously attached on one surface under reduced pressure. constitute. That is, if a member having a flat surface is brought close to at least one side (preferably both sides) of the wafer W, the circumference of the wafer W is decompressed, and the second adhesive tape T2 is attached in the decompressed state. The structure for reducing the pressure is not limited to the chamber 7 .

In addition, the method of affixing the second adhesive tape T2 to the wafer W is not limited to the configuration using the differential pressure. As another example of this method, as shown in FIG. 33 , a flat member (holding table 37 in Example 3) holding the second adhesive tape T2 (protective tape PT) can be transferred to the wafer W A structure in which sticking is performed by a pressing operation of pressing, a structure in which sticking is performed by the rotation of the sticking roller 91 accommodated in the chamber 7 as shown in FIG. 35 , and the like.

As an operation example of the structure using the sticking roller 91, the following aspects are mentioned. That is, the inside of the chamber 7 is depressurized in a state where the holding table 37 holding the protective tape PT is brought close to the wafer W. The protective tape PT is placed on the wafer W by releasing the suction holding while lowering the holding table 37 after the decompression is completed. Next, by rotating the attaching roller 91 from the position shown by the broken line in FIG. 35 to the position shown by the solid line, the protective tape PT is pressed and attached to the wafer W.

(6) In Example 3, the configuration in which the support tape DT is brought into contact with the suppressing member 61 by placing the mounting frame MF on the suppressing member 61 is exemplified, but the pressure reduction is not limited to the state where the suppressing member 61 is in contact. composition. That is, the pressure reduction may be performed in a state where the suppressing member 61 having the flat surface 61a is brought close to the mounting frame MF. In this case, the decompression is started in a state where the distance from the flat surface 61a to the support belt DT is controlled to be equal to or less than the predetermined value Lt3, that is, E2, and the tape is attached in the decompressed state.

(7) In the third embodiment, the configuration in which the holding table 37 has both the function of the first restraining member and the function of holding the protective tape PT has been described as an example, but as shown in FIG. The member may be provided with a suppressing member 93 having a flat surface. In a further embodiment, the suppressing member 61 has both the function as the second suppressing member and the function as the wafer holding portion for holding the wafer W. However, as an example, the suppressing member 61 is different from the suppressing member 61 having the flat surface. A configuration including a ring-shaped wafer holding portion 95 may be employed. In the modification (7), the suppressing member 93 corresponds to the first suppressing member in the present invention, and the suppressing member 61 corresponds to the second suppressing member in the present invention.

In the case of attaching the second adhesive tape T2 to the other side of the wafer W in the adhesive tape attaching device of the modification (7), the flow chart of the operation is based on the first embodiment. First, the second adhesive tape T2 is held on the holding table 37 (corresponding to step S1). Next, the wafer W to which the first adhesive tape T1 is attached is held in the wafer holding portion 95 (corresponding to step S2 ). Next, the upper case 33A and the lower case are joined to form the chamber 7 (corresponding to step S3). FIG. 36 shows a state in which step S3 in the modification (7) has been completed. At this time, the suppressing member 61 and the suppressing member 93 are separated from the wafer W. As shown in FIG.

Then, in step S4, as shown in FIG. 37, the suppressing member 61 and the suppressing member 93 are brought close to the wafer W. That is, the suppressing member 61 is brought close to (or in contact with) the non-adhesive surface of the first adhesive tape T1 attached to the wafer W, and the suppressing member 93 is brought close to the other surface of the wafer W. As a result, the distance between the suppressing member 93 and the wafer W is changed from D1 to D2 which is a small distance. Further, the distance between the suppressing member 61 and the first adhesive tape T1 is changed from E1 to E2 which is a small distance.

In step S5, the inside of the chamber 7 is depressurized. Even if the air bubbles caught between the first adhesive tape T1 and the wafer W expand due to decompression, and a part of the first adhesive tape T1 is pressed in the z direction, the first adhesive tape T1 is quickly suppressed. member 61 is suppressed. Therefore, it is possible to prevent a situation in which the first adhesive tape T1 is deteriorated due to a part of the first adhesive tape T1 being elongated in the z direction, a situation in which the adhesion between the first adhesive tape T1 and the wafer W is reduced, and the like. Further, even if the wafer W is pressed in the z direction, it is restrained by the restraining member 93, so that the wafer W can be prevented from being damaged, deformed, or the like.

When the decompression is completed, the second adhesive tape T2 is attached to the wafer W by the pressing by the holding table 37, the rotation of the attaching roller, and the like. At this time, after the suppressing member 61 and the first suppressing member 93 are separated and retracted from the wafer W as necessary, the second adhesive tape T2 is applied. After the affixing of the second adhesive tape T2 is completed, the process proceeds to step S6, and the wafer W to which the adhesive tape is affixed on both sides is recovered.

(8) The structure of the present invention in which the pressure is reduced in a state in which a member having a flat surface is brought close to the adhesive tape T is widely applicable to the structure in which the adhesive tape T is adhered to the wafer W under reduced pressure. An example of such a configuration in which the adhesive tape T is attached to one side of the wafer W under reduced pressure is shown in FIG. 38( a ).

In the adhesive tape sticking device of the modification (8), the holding table 37 for holding the adhesive tape T is provided in the lower case 33B, and the wafer holding portion 95 for holding the wafer W by suction or the like is provided in the upper case 33A. In this configuration, the holding table 37 also functions as a restraining member that restrains the adhesive tape T from being pushed in the z direction and extending.

The wafer holding unit 95 is configured to be movable up and down through the control unit 60 . The adhesive tape T is held by the holding table 37 in a state of being attached to the flat support plate G. The sticking of the adhesive tape T to the support plate G is usually performed under atmospheric pressure. However, the support plate G may be omitted, and the adhesive tape T may be directly placed and held on the holding table 37 .

In the modification (8), when the adhesive tape T is affixed to the wafer W, the support plate G to which the adhesive tape T is affixed is held on the holding table 37 , and after the wafer W is held on the wafer holding portion 95 . The chamber 7 is formed (steps S1 to S3). Next, before depressurizing the inside of the chamber 7 , as shown in FIG. 38( b ), the wafer holding portion 95 is lowered to approach the adhesive surface of the adhesive tape T. As shown in FIG. By this proximity control, the distance between the wafer W held by the wafer holding portion 95 and the adhesive tape T is maintained at a small distance D2 (step S4 ).

In this approaching state, the adhesive surface of the adhesive tape T and the wafer W are configured to face each other with a slight distance therebetween. After that, the inside of the chamber 7 is depressurized in a state where the wafer holding portion 95 is brought close to the adhesive tape T, the wafer W is pressed by the holding table 37 and the support plate G under the decompression, and the adhesive tape T is attached. on the wafer W (step S5).

In the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure, when the pressure is reduced without bringing the wafer holding portion 95 close to it, the wide space in the z direction is in a state in contact with the adhesive tape T. was decompressed. Since the adhesion of the adhesive tape T to the support plate G is usually performed in advance under atmospheric pressure, minute air bubbles Ar may be entangled between the adhesive tape T and the support plate G ( FIG. 39( a )).

Therefore, when the inside of the chamber 7 is depressurized, the entangled air bubbles Ar expand to generate a strong pressing force Ps in the z direction. As a result, when the pressure is reduced without bringing the wafer holding portion 95 closer to the adhesive tape T, a part of the adhesive tape T is pressed in the z direction (direction perpendicular to the surface of the adhesive tape T) and greatly elongated, and Concavities and convexities and wrinkles were generated on the adhesive tape T ( FIG. 39( b )). As a result, since the adhesive tape T with unevenness and wrinkles is attached to the wafer W, the adhesiveness between the wafer W and the adhesive tape T is lowered ( FIG. 39( c )).

In the configuration of the modification (8), the non-adhesive surface of the adhesive tape T is in contact with the flat holding table 37, and the flat wafer holding portion 95 (and the wafer W) is maintained in a state close to the adhesive surface of the adhesive tape T . Therefore, even if the air bubbles Ar caught between the support plate G and the adhesive tape T expands due to the decompression treatment, the adhesive tape T to be pressed in the z direction is quickly held by the holding table 37 or the wafer holding portion 95 (and wafer W) (FIG. 39(d)). In addition, the expansion of the bubbles Ar in the z direction is suppressed by the wafer holding portion 95 and the holding table 37 that are close to the adhesive tape T in the z direction.

Therefore, in the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure, it is possible to prevent the adhesive tape T from sticking to the wafer W due to the expansion of the bubbles Ar during the decompression process. When unevenness and wrinkles are formed on the surface. As a result, the deterioration of the adhesive tape T due to the formation of unevenness and wrinkles, the situation where the adhesive tape T is non-uniformly adhered to the wafer W, and the positions of the support plate G and the adhesive tape T can be more reliably avoided. Offset situation, etc.

In addition, the configuration of each embodiment and each modification can also be applied to modification (8). For example, the holding table 37 may be configured to be close to the adhesive tape T instead of contacting the adhesive tape T. As shown in FIG. Also, as shown in FIG. 40 , a restraining member 61 having a flat surface 61 a which is different from the holding table 37 may be provided. In this case, the chamber 7 is decompressed while the suppressing member 61 is brought close to or in contact with the non-adhesive surface of the adhesive tape T, and the flat surface 61a of the suppressing member 61 suppresses the non-adhesive surface of the adhesive tape T while maintaining the state.

7‧‧‧Chamber

8‧‧‧Suppression unit

33A‧‧‧Top shell

33B‧‧‧Lower shell

36‧‧‧Rotary arm

37‧‧‧Keeping Table

61‧‧‧Suppression member

61a‧‧‧Flat surface

62‧‧‧Cylinder

77‧‧‧Frame Holder

D2‧‧‧distance

PT‧‧‧Protective tape

E2‧‧‧distance

f‧‧‧ring frame

DT‧‧‧Support belt

MF‧‧‧Mounting Frame

Claims (25)

An adhesive tape attaching method, wherein a second adhesive tape is attached to the other side of a semiconductor wafer on which a first adhesive tape is attached An adhesive tape; a chamber forming process in which a chamber is formed by sandwiching and bonding the first adhesive tape exposed from the outer edge of the semiconductor wafer with a pair of shells; a first approaching process in which the holding table is brought close to the aforementioned For the semiconductor wafer, the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value; and in the attaching process, the first adhesive tape is sandwiched by a pair of shells In this state, the second adhesive tape is attached to the semiconductor wafer while the air pressure of the space on the side of the semiconductor wafer in the chamber is lower than the air pressure of the other space. The adhesive tape attaching method according to claim 1, wherein the semiconductor wafer is held in succession with the ring frame through the first adhesive tape, and in the process of forming the chamber, the ring frame is held by the frame holding portion while the ring frame is held. A chamber is formed by sandwiching the first adhesive tape between the ring frame and the semiconductor wafer by a pair of shells. The method of attaching an adhesive tape according to claim 1, further comprising: a second approaching process in which a restraining member having a flat surface is brought close to or in contact with the non-adhesive surface of the first adhesive tape, and the flat surface and the first adhesive tape are brought into contact with each other. The distance is maintained at the preset second predetermined value. A method for attaching an adhesive tape, wherein a second adhesive tape is attached to the other side of a semiconductor wafer on which a first adhesive tape is attached on one side. a wafer; a first attaching process in which the second adhesive tape is attached to a joint of a pair of shells constituting a chamber; a first approaching process in which the holding table is brought close to the second adhesive tape to make the semiconductor The distance between the wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value; in the second approaching process, the suppressing member with the flat surface is brought close to or contacts the non-adhesive surface of the second adhesive tape, so that the The distance between the flat surface and the second adhesive tape is maintained at a preset second predetermined value; and in the second attaching process, the cavity is formed by sandwiching and joining the second adhesive tape with a pair of shells. In this state, the second adhesive tape is attached to the semiconductor wafer while the air pressure of the space on the side of the semiconductor wafer in the chamber is lower than the air pressure of the other space. The adhesive tape attaching method according to claim 4, wherein a frame holding process of holding the ring frame with the frame holding part is provided, and in the first attaching process, a joint part of a pair of shells constituting the chamber and a borrowed part are covered in the first attachment process. The second adhesive tape is attached to the ring frame held in the frame holding process. An adhesive tape attaching method, wherein a second adhesive tape is attached to the other side of a semiconductor wafer on which a first adhesive tape is attached Adhesive tape; wafer holding process, holding the semiconductor wafer with a wafer holding part; chamber forming process, forming a chamber for accommodating the holding table and the wafer holding part by joining a pair of shells; the first approach In the process, the first suppressing member accommodated in the chamber and having a flat surface is brought close to the semiconductor wafer, so that the distance between the semiconductor wafer and the first suppressing member is maintained at a preset first predetermined value; In the process, the second restraining member, which is accommodated in the chamber and has a flat surface, is brought close to or in contact with the non-adhesive surface of the first adhesive tape, so that the distance between the flat surface and the first adhesive tape is maintained at a preset second The predetermined value; and the attaching process, after the second approach process, in a state where the chamber is formed, the second adhesive tape is attached to the semiconductor wafer while reducing the air pressure inside the chamber. The method for attaching an adhesive tape according to claim 6, further comprising a frame holding process of holding the ring frame with a frame holding portion, and the chamber accommodates the frame holding portion. The adhesive tape attaching method according to claim 6 or 7, wherein the first restraining member is the holding table, and during the first approaching process, the second adhesive tape and the holding table approach the semiconductor wafer together. The adhesive tape attaching method according to claim 6 or 7, wherein the second suppressing member is the wafer holding portion. The adhesive tape attaching method according to any one of claims 3 to 7, wherein the second predetermined value is 0.5 mm or less. The adhesive tape attaching method according to any one of claims 1 to 7, wherein the first predetermined value is 0.1 mm or more and 0.5 mm or less. A method for attaching an adhesive tape, which is used to attach an adhesive tape to a semiconductor wafer, and is characterized by comprising: a tape holding process for holding the aforementioned adhesive tape with a holding table; and a wafer holding process for holding the aforementioned semiconductor wafer with a wafer holding portion a chamber forming process, by joining a pair of shells to form a chamber for accommodating the holding table and the wafer holding part; the first approaching process, making the wafer holding part holding the semiconductor wafer close to the adhesive tape, The distance between the adhesive surface of the adhesive tape and the semiconductor wafer is maintained at a preset first predetermined value; the second approaching process is to make the restraining member accommodated in the chamber and having a flat surface approach or contact the surface of the adhesive tape. For the non-adhesive surface, the distance between the flat surface and the adhesive tape is maintained at a preset second predetermined value; and in the attaching process, after the second approach process, the cavity is lowered while the cavity is formed in the state The above-mentioned adhesive tape is attached to the semiconductor wafer while the air pressure inside the chamber is controlled. An adhesive tape attaching device for attaching a second adhesive tape to the other surface of a semiconductor wafer to which a first adhesive tape is attached on one side is characterized by comprising: a tape supply part for supplying the second adhesive tape; a holding table holding the second adhesive tape; a chamber formed by sandwiching the first adhesive tape exposed from the outer edge of the semiconductor wafer with a pair of shells and accommodating the holding table; a first approach mechanism, The holding table is brought close to the semiconductor wafer, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value; In the normal operation state, a differential pressure is generated in the two spaces in the chamber partitioned by the first adhesive tape, and the second adhesive tape is attached to the other side of the semiconductor wafer. The adhesive tape attaching device of claim 13, wherein the semiconductor wafer is held next to the ring frame through the first adhesive tape, and includes a frame holding portion for holding the ring frame, and the chamber is formed by a pair of shells It is formed by sandwiching the first adhesive tape between the ring frame and the semiconductor wafer held by the frame holding portion. The adhesive tape sticking device according to claim 13, further comprising: a restraining member having a flat surface; and a second approaching mechanism for causing the restraining member to approach or contact the non-adhesive surface of the first adhesive tape, so that the flat surface is brought into contact with the non-adhesive surface of the first adhesive tape. The control of maintaining the distance of the said 1st adhesive tape at the 2nd predetermined value which is preset. An adhesive tape attaching device for attaching a second adhesive tape to the other surface of a semiconductor wafer on which a first adhesive tape is attached on one side, characterized by comprising: a tape supply part for supplying the second adhesive tape; a wafer holding part holds the semiconductor wafer; a restraining member has a flat surface; a chamber formed of a pair of casings accommodates the holding table and the restraining member; a first attaching mechanism attaches the second adhesive tape A joint part attached to the shell; a first approaching mechanism for making the holding table approach the second adhesive tape to maintain the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a preset first The control of the predetermined value; the second approaching mechanism makes the restraining member approach or contact the non-adhesive surface of the second adhesive tape, so that the distance between the flat surface and the second adhesive tape is maintained at a preset second predetermined value; and The second sticking mechanism generates a differential pressure in the two spaces in the chamber partitioned by the second adhesive tape when the first approaching mechanism and the second approaching mechanism are operating, and the second sticking The tape is attached to the other side of the aforementioned semiconductor wafer. The adhesive tape attaching device according to claim 16, further comprising a frame holding part for holding the ring frame, and the first attaching mechanism is to cover a joint part of the casing and the ring frame held by the frame holding part. The above-mentioned second adhesive tape is attached. An adhesive tape attaching device for attaching a second adhesive tape to the other surface of a semiconductor wafer on which a first adhesive tape is attached on one side, characterized by comprising: a tape supply part for supplying the second adhesive tape; a holding table for holding the second adhesive tape; a wafer holding part for holding the semiconductor wafer; a first suppressing member having a flat surface; a second suppressing member having a flat surface; a chamber for accommodating the holding table and the wafer The holding portion, the first suppressing member, and the second suppressing member are constituted by a pair of shells; The distance between the first restraining member is maintained at a preset first predetermined value; the second approaching mechanism makes the second restraining member approach or contact the non-adhesive surface of the first adhesive tape, so that the flat surface and the first The distance of the adhesive tape is maintained at a preset second predetermined value; the decompression mechanism reduces the pressure inside the chamber when the first proximity mechanism and the second proximity mechanism are in operation; and the sticking mechanism, The second adhesive tape is attached to the other surface of the semiconductor wafer in a state in which the inside of the chamber is depressurized. The adhesive tape attaching device according to claim 18, further comprising a frame holding portion for holding the ring frame, and the chamber accommodates the frame holding portion. The adhesive tape attaching device according to claim 18 or 19, wherein the first restraining member is the holding table, and the first approaching mechanism makes the second adhesive tape approach the semiconductor wafer together with the holding table. The adhesive tape attaching device according to claim 18 or 19, wherein the second restraining member is the wafer holding portion. The adhesive tape attaching device according to any one of claims 16 to 19, wherein the second predetermined value is 0.5 mm or less. The adhesive tape attaching device according to any one of claims 13 to 19, wherein the first predetermined value is 0.1 mm or more and 0.5 mm or less. The adhesive tape sticking device according to any one of claims 13 to 19, further comprising: a cutting mechanism for cutting the second adhesive tape along the outer shape of the semiconductor wafer; and a peeling mechanism for cutting the semiconductor wafer into pieces The said 2nd adhesive tape of the shape is peeled off; and the tape recovery part recovers the said 2nd adhesive tape after peeling. An adhesive tape attaching device for attaching an adhesive tape to a semiconductor wafer, characterized by comprising: a tape supply part for supplying the above-mentioned adhesive tape; a holding table for holding the above-mentioned adhesive tape; and a wafer holding part for holding the above-mentioned semiconductor wafer a restraining member having a flat surface; a chamber for accommodating the holding table, the wafer holding portion and the restraining member and consisting of a pair of casings; a first approach mechanism for holding the wafer holding the semiconductor wafer The control of the part approaching the adhesive surface of the adhesive tape to maintain the distance between the adhesive tape and the semiconductor wafer at a preset first predetermined value; the second approach mechanism makes the restraining member approach or contact the non-adhesive tape of the adhesive tape surface, the distance between the flat surface and the adhesive tape is maintained at a preset second predetermined value; the decompression mechanism is in the state where the first approaching mechanism and the second approaching mechanism are operating, so that the inside of the chamber is decompression; and an attaching mechanism for attaching the adhesive tape to the semiconductor wafer in a state where the inside of the chamber has been decompressed.

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