TWI600073B - Adhesive tape joining method and adhesive tape joining apparatus - Google Patents
Adhesive tape joining method and adhesive tape joining apparatus Download PDFInfo
- Publication number
- TWI600073B TWI600073B TW102130725A TW102130725A TWI600073B TW I600073 B TWI600073 B TW I600073B TW 102130725 A TW102130725 A TW 102130725A TW 102130725 A TW102130725 A TW 102130725A TW I600073 B TWI600073 B TW I600073B
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- Prior art keywords
- adhesive tape
- attaching
- tape
- wafer
- semiconductor wafer
- Prior art date
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- 239000002390 adhesive tape Substances 0.000 title claims description 238
- 238000000034 method Methods 0.000 title claims description 47
- 238000005304 joining Methods 0.000 title description 3
- 230000007246 mechanism Effects 0.000 claims description 60
- 239000004065 semiconductor Substances 0.000 claims description 54
- 238000005520 cutting process Methods 0.000 claims description 40
- 230000008569 process Effects 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 134
- 206010040844 Skin exfoliation Diseases 0.000 description 35
- 230000001681 protective effect Effects 0.000 description 19
- 238000011084 recovery Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004064 recycling Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000006837 decompression Effects 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本發明係關於一種包含保護形成於半導體晶圓上的電路圖案的保護帶、或遍及環狀框架與載置於該環狀框架中央的半導體晶圓背面而貼附的切割帶之黏著帶的貼附方法及黏著帶貼附裝置。 The present invention relates to a protective tape comprising a circuit pattern for protecting a semiconductor wafer, or an adhesive tape for a dicing tape attached to a back surface of a ring frame and a semiconductor wafer placed in the center of the annular frame. Attachment method and adhesive tape attachment device.
一般而言，半導體晶圓(以下適當稱為「晶圓」)在其表面形成有多數個元件的電路圖案。例如，在晶圓表面形成有凸塊或細微電路。於是，為了保護該電路面而貼附有保護帶。 In general, a semiconductor wafer (hereinafter referred to as "wafer" as appropriate) has a circuit pattern of a plurality of elements formed on its surface. For example, bumps or fine circuits are formed on the surface of the wafer. Thus, a protective tape is attached to protect the circuit surface.
由於晶圓表面的凸塊等凹凸的影響，在貼附的保護帶表面也產生了同樣的凹凸。於是，在保護帶的貼附處理後，從該保護帶的表面側按壓，以將構成保護帶的基材表面平坦化(參照日本特開2010-45189號公報)。 Due to the influence of irregularities such as bumps on the surface of the wafer, the same unevenness is generated on the surface of the attached protective tape. Then, after the attachment process of the protective tape, it is pressed from the surface side of the protective tape to planarize the surface of the base material constituting the protective tape (refer to Japanese Laid-Open Patent Publication No. 2010-45189).
然而，在上述先前方法方面，產生了如下的缺點。 However, in the above prior methods, the following disadvantages arise.
近幾年，隨著TSV(Through-Silicon Via；穿透矽通孔)、IGBT(Insulated Gate Bipolar Transistor；絕 緣閘雙極性電晶體)或MEMS(Micro Electro Mechanical System；微機電系統)等的封裝，形成於晶圓面上的電路被要求包含比以往更狹窄間距的凸塊、體積高的凸塊在內的細微化。此外，隨著製造的此等封裝，分別使用不同特性的保護帶。例如，基材的硬度或帶厚度等的特性不同。 In recent years, with TSV (Through-Silicon Via; IGBT (Insulated Gate Bipolar Transistor) In a package such as a rim gate bipolar transistor or a MEMS (Micro Electro Mechanical System), a circuit formed on a wafer surface is required to include a bump having a narrower pitch than a conventional one, and a high-bulk bump. The subtlety. In addition, with the manufacture of such packages, protective tapes of different characteristics are used, respectively. For example, the properties of the substrate such as hardness or tape thickness are different.
日本特開2010-45189號公報中所記載的先前裝置，係在大氣狀態下將保護帶貼附於晶圓表面上。此時，一面將帶狀的保護帶向搬送方向施加張力，一面使貼附輥轉動並按壓於該保護帶的表面，貼附於晶圓表面上。因此，保護帶的長度方向的張力比寬度方向強，而在容易產生皺紋的狀態將保護帶貼附於晶圓表面上。因而，黏著劑跟著不停侵入因晶圓表面上的凸塊之狹窄的間距等而形成的凹凸。換言之，保護帶未密接於晶圓表面。 The prior art device described in Japanese Laid-Open Patent Publication No. 2010-45189 attaches a protective tape to the surface of a wafer in an atmospheric state. At this time, while applying a tension to the belt-shaped protective tape in the conveying direction, the attaching roller is rotated and pressed against the surface of the protective tape to be attached to the surface of the wafer. Therefore, the tension in the longitudinal direction of the protective tape is stronger than the width direction, and the protective tape is attached to the surface of the wafer in a state where wrinkles are likely to occur. Therefore, the adhesive continues to intrude into the irregularities formed by the narrow pitch of the bumps on the surface of the wafer or the like. In other words, the protective tape is not in close contact with the wafer surface.
在該狀態再加壓保護帶表面時，即使可依照保護帶的種類而將其表面平坦化，若不賦予保護帶比保護帶單體平坦化所需的理論負荷大的負荷，則也無法提高保護帶密接於晶圓表面的密合性。然而，若提高負荷，則有使包含凸塊等在內的電路破損之類的問題。 When the surface of the protective tape is repressurized in this state, even if the surface of the protective tape can be flattened according to the type of the protective tape, it is not possible to increase the load of the protective tape which is larger than the theoretical load required for the flattening of the protective tape. The adhesion of the protective tape to the surface of the wafer. However, if the load is increased, there is a problem that the circuit including the bumps or the like is broken.
本發明係有鑑於此種情況而完成者，其目的在於提供一種不管形成於半導體晶圓上的電路狀態如何，都可精度良好地貼附黏著帶之黏著帶貼附方法及黏著帶貼附裝置。 The present invention has been made in view of such circumstances, and an object thereof is to provide an adhesive tape attaching method and an adhesive tape attaching device capable of accurately attaching an adhesive tape regardless of a state of a circuit formed on a semiconductor wafer. .
於是，為了達成此種目的，本發明採取如下的構造。 Thus, in order to achieve such a purpose, the present invention adopts the following configuration.
即，一種黏著帶貼附方法，係將黏著帶貼附於半導體晶圓之電路形成面上，包含以下的過程：第1貼附過程，係在將半導體晶圓載置保持在既收納於構成腔室的一對殼體其中一者之保持平台後，於該殼體的接合部上貼附大於該殼體內徑的前述黏著帶；第2貼附過程，其係於夾住前述黏著帶而接合一對殼體後，一面將與該黏著帶之黏著面接近地對向配置的前述半導體晶圓側的空間的氣壓降得比另一者的空間之氣壓還低，一面將該黏著帶貼附於半導體晶圓上；及加壓過程，係將貼附於前述半導體晶圓之電路形成面上的黏著帶表面利用加壓構件之扁平面加壓而平坦化；於貼附該黏著帶後，在是黏著帶表面會產生凹凸那樣的半導體晶圓的電路狀態及黏著帶的特性之情況，選擇地進行加壓過程的加壓處理。 That is, an adhesive tape attaching method is to attach an adhesive tape to a circuit forming surface of a semiconductor wafer, and includes a process in which the first attaching process holds and holds the semiconductor wafer in the constituent cavity. After the one of the pair of housings of the chamber holds the platform, the adhesive tape larger than the inner diameter of the housing is attached to the joint portion of the housing; and the second attaching process is performed by clamping the adhesive tape After the pair of cases, the air pressure of the space on the semiconductor wafer side that is disposed opposite to the adhesive surface of the adhesive tape is lower than the air pressure of the other space, and the adhesive tape is attached. On the semiconductor wafer; and the pressing process, the surface of the adhesive tape attached to the circuit forming surface of the semiconductor wafer is flattened by the flat surface of the pressing member; after the adhesive tape is attached, In the case where the circuit state of the semiconductor wafer and the characteristics of the adhesive tape are formed on the surface of the adhesive tape, the pressurization process of the pressurization process is selectively performed.
藉由此方法，則藉由在腔室內將收納有半導體晶圓側的空間之氣壓降的比另一方的空間之氣壓還低，可將均勻的按壓作用於為一對殼體所夾住的黏著帶全面。因此，若無使皺紋等產生的情形，則不會因過量的按壓而使表面的凸塊等破損，可將黏著帶貼附於半導體晶圓上。此外，可利用減壓作用使氣泡從半導體晶圓表面的凹部脫氣，並可使黏著劑跟著密接於該半導體晶圓表面的凹凸形狀。 According to this method, by lowering the air pressure of the space in which the semiconductor wafer side is accommodated in the chamber is lower than the air pressure of the other space, uniform pressing can be applied to the pair of housings. Adhesive tape is comprehensive. Therefore, if wrinkles or the like are not caused, the bumps on the surface are not damaged by excessive pressing, and the adhesive tape can be attached to the semiconductor wafer. Further, the decompression action can be utilized to degas the bubbles from the recesses on the surface of the semiconductor wafer, and the adhesive can be adhered to the concavo-convex shape of the surface of the semiconductor wafer.
此外，利用腔室內的差壓在貼附於半導體晶圓的黏著帶表面上因凸塊等的影響而形成有凹凸的情況 時，藉由選擇進行加壓過程的加壓處理，只要賦予可只將黏著帶的表面平坦化程度的加壓即可。因此，不會因該加壓處理而使半導體晶圓的電路破損。 Further, the uneven pressure in the chamber is used to form irregularities on the surface of the adhesive tape attached to the semiconductor wafer due to the influence of bumps or the like. At the time of pressurization which is subjected to the pressurization process, it is sufficient to apply pressure to the extent that the surface of the adhesive tape can be flattened. Therefore, the circuit of the semiconductor wafer is not damaged by the pressurization process.
再者，黏著帶為在背面研磨前貼附於晶圓之電路形成面上的表面保護用的黏著帶的情況，可抑制背面研磨後晶圓厚度的偏差。即，不管黏著帶的特性或晶圓之電路形成面的狀態如何，都可將黏著帶的表面平坦化。 Further, in the case where the adhesive tape is an adhesive tape for surface protection attached to the circuit formation surface of the wafer before the back surface polishing, variation in wafer thickness after back surface polishing can be suppressed. That is, the surface of the adhesive tape can be flattened regardless of the characteristics of the adhesive tape or the state of the circuit formation surface of the wafer.
在上述方法中，最好在第1貼附過程中，從由剝離構件折回並從隔片剝離而推出的黏著帶前端側，一面以貼附構件按壓，一面貼附於殼體之接合部上。 In the above method, it is preferable that the first adhesive tape is attached to the joint portion of the casing while being pressed by the attaching member from the distal end side of the adhesive tape which is folded back by the peeling member and peeled off from the separator. .
此情況，相較於一面對帶狀黏著帶的長度方向賦予張力，一面貼附於晶圓上的先前方法，可在無張力偏倚的狀態將黏著帶貼附於殼體之接合部上。因此，可在腔室內利用差壓一面賦予黏著帶均勻的張力，一面貼附於晶圓之電路形成面上。 In this case, the adhesive tape can be attached to the joint portion of the casing in a state of no tension bias, as compared with a prior art method of applying tension to the longitudinal direction of the tape-like adhesive tape. Therefore, it is possible to apply a uniform tension to the adhesive tape in the chamber while attaching it to the circuit formation surface of the wafer.
在上述方法中，最好在加壓過程中，一面利用加熱器加熱黏著帶，一面加壓。 In the above method, it is preferred that the adhesive tape is heated by a heater while being pressurized.
此情況，由於可使構成黏著帶的黏著劑及基材利用加熱軟化，所以容易使黏著帶變形。 In this case, since the adhesive and the base material constituting the adhesive tape can be softened by heating, the adhesive tape is easily deformed.
再者，在上述方法中，在加壓過程中的加壓處理可如下實施。例如，在將腔室內維持於減壓狀態下，加壓黏著帶。或者，在解除兩殼體接合的大氣狀態下，加壓黏著帶。 Further, in the above method, the pressurization treatment in the pressurization process can be carried out as follows. For example, the adhesive tape is pressurized while maintaining the chamber under reduced pressure. Alternatively, the adhesive tape is pressurized under an atmospheric state in which the two casings are released.
此外，為了達成此種目的，本發明採取如下 的構造。 Moreover, in order to achieve such a purpose, the present invention takes the following Construction.
即，一種黏著帶貼附裝置，係將表面保護用的黏著帶貼附於半導體晶圓之電路形成面上，具備：保持平台，其係保持前述半導體晶圓；腔室，其係由收納前述保持平台的一對殼體構成；帶供應部，其係供應大於前述殼體內徑的前述黏著帶；帶貼附機構，其係在前述殼體之一方的接合部上貼附黏著帶；加壓機構，其係使藉由被一對前述殼體的接合部夾住的黏著帶所分隔的腔室內的兩個空間產生差壓，利用配備於該腔室內的加壓構件之扁平面加壓被貼附於半導體晶圓上的黏著帶表面；切斷機構，其係沿著前述半導體晶圓的外形而切斷黏著帶；剝離機構，其係剝離已切成前述半導體晶圓形狀的黏著帶；及帶回收部，其係回收剝離後的前述黏著帶，前述加壓機構係構成為：在藉由差壓將黏著帶貼附於前述半導體晶圓後，在是黏著帶表面會產生凹凸那樣的半導體晶圓的電路狀態及黏著帶的特性之情況，藉由前述加壓構件加壓黏著帶。 That is, an adhesive tape attaching device attaches an adhesive tape for surface protection to a circuit forming surface of a semiconductor wafer, and includes: a holding platform that holds the semiconductor wafer; and a chamber that houses the aforementioned a pair of housings for holding the platform; a tape supply portion for supplying the adhesive tape larger than the inner diameter of the housing; and a tape attachment mechanism for attaching an adhesive tape to the joint portion of one of the housings; a mechanism for generating a differential pressure in two spaces in a chamber partitioned by an adhesive tape sandwiched by a joint portion of the pair of housings, and pressurizing the flat surface of the pressing member provided in the chamber An adhesive tape surface attached to the semiconductor wafer; a cutting mechanism that cuts the adhesive tape along an outer shape of the semiconductor wafer; and a peeling mechanism that peels off the adhesive tape that has been cut into the shape of the semiconductor wafer; And a tape collecting portion for recovering the peeled adhesive tape, wherein the pressurizing mechanism is configured to adhere the adhesive tape to the semiconductor wafer by differential pressure, thereby causing irregularities on the surface of the adhesive tape half The characteristics of the case body of the wafer and the circuit state of the adhesive tape, by pressing the adhesive tape pressing member.
藉由此裝置，則可將因半導體晶圓表面的電路的凹凸而產生於表面保護用的黏著帶表面的凹凸利用加壓機構平坦化。因此，可抑制在背面研磨處理時容易產生的厚度的偏差。即，可適當地實施上述方法。 According to this device, the unevenness of the surface of the adhesive tape for surface protection due to the unevenness of the circuit on the surface of the semiconductor wafer can be flattened by the pressurizing mechanism. Therefore, variation in thickness which is likely to occur at the time of the back surface grinding treatment can be suppressed. That is, the above method can be suitably carried out.
在上述裝置中，最好帶貼附機構具備：剝離構件，其係從隔片將黏著帶剝離並推出；貼附輥，其係按壓從前述剝離構件推出的黏著帶前端；及 切斷機構，其係在貼附終端位置切斷黏著帶的後端。 In the above apparatus, preferably, the tape attaching mechanism includes: a peeling member that peels off and pushes out the adhesive tape from the spacer; and an attaching roller that presses the front end of the adhesive tape pushed out from the peeling member; The cutting mechanism cuts the rear end of the adhesive tape at the position of the attachment end.
藉由此構造，則可在抑制張力偏倚的狀態將黏著帶貼附於殼體之接合部上。因此，在帶貼附於半導體晶圓上時，可在腔室內利用差壓賦予黏著帶全面均勻的張力。 With this configuration, the adhesive tape can be attached to the joint portion of the casing in a state where the tension is suppressed. Therefore, when the tape is attached to the semiconductor wafer, a uniform uniform tension can be imparted to the adhesive tape by differential pressure in the chamber.
在上述裝置中，最好具備移動機構，其係一面將貼附有黏著帶的半導體晶圓保持於保持平台上，一面和收納有該保持平台的殼體成為一體，在遍及帶貼附位置與帶切斷位置之範圍移動。 In the above device, it is preferable to provide a moving mechanism that holds the semiconductor wafer to which the adhesive tape is attached, on the holding platform, and integrates with the housing in which the holding platform is housed, and is attached to the tape attachment position. The range with the cut position moves.
例如，移動機構具備：旋轉驅動機；及臂，其係連結固定於前述旋轉驅動機之旋轉軸上；構成為在前述臂之至少一端上具有收納前述保持平台的殼體。 For example, the moving mechanism includes: a rotary drive; and an arm coupled to the rotating shaft of the rotary drive; and a housing having the holding platform at least one end of the arm.
藉由此構造，則例如藉由在臂兩端之各端具備收納有保持平台的殼體，可使一方的保持平台移動到帶貼附位置，使另一方的保持平台同時移動到帶切斷位置。即，可同時平行執行黏著帶的貼附處理與切斷處理。 With this configuration, for example, by providing a housing that accommodates the holding platform at each end of both ends of the arm, one of the holding platforms can be moved to the tape attachment position, and the other holding platform can be simultaneously moved to the tape cutting. position. That is, the attaching process and the cutting process of the adhesive tape can be performed in parallel at the same time.
此外，為了達成此種目的，本發明採取如下的構造。 Further, in order to achieve such a purpose, the present invention adopts the following configuration.
即，一種黏著帶貼附裝置，係遍及半導體晶圓與環狀框架而貼附支持用的黏著帶，具備：晶圓保持平台，其係保持前述半導體晶圓；腔室，其係由收納前述晶圓保持平台的一對殼體構成；框架保持平台，其係包圍前述腔室外周並保持前述環狀框架；帶供應部，其係供應前述黏著帶； 帶貼附機構，其係在前述環狀框架與前述殼體之一者的接合部上貼附黏著帶；加壓機構，其係使藉由被一對前述殼體的接合部夾住的前述黏著帶所分隔的腔室內的兩個空間產生差壓，利用配備於該腔室內的加壓構件之扁平面加壓被貼附於半導體晶圓上的黏著帶表面；切斷機構，其係在前述環狀框架上切斷黏著帶；剝離機構，其係剝離切斷後的前述黏著帶；及帶回收部，其係回收剝離後的前述黏著帶，前述加壓機構係構成為：在藉由差壓將黏著帶貼附於前述半導體晶圓後，在是黏著帶表面會產生凹凸那樣的半導體晶圓的電路狀態及黏著帶的特性之情況，藉由前述加壓構件加壓黏著帶。 That is, an adhesive tape attaching device is an adhesive tape for attaching a semiconductor wafer and a ring frame, and includes a wafer holding platform for holding the semiconductor wafer, and a chamber for accommodating the aforementioned a pair of housings of the wafer holding platform; a frame holding platform that surrounds the outer circumference of the cavity and holds the annular frame; and a tape supply portion that supplies the adhesive tape; a tape attaching mechanism that attaches an adhesive tape to a joint portion of one of the annular frame and the casing; and a pressurizing mechanism that is sandwiched by a joint portion of the pair of the casings The two spaces in the chamber separated by the adhesive tape generate a differential pressure, and the flat surface of the pressing member provided in the chamber is pressed to adhere the surface of the adhesive tape on the semiconductor wafer; the cutting mechanism is attached thereto The adhesive tape is cut on the annular frame; the peeling mechanism is for peeling off the adhesive tape after cutting; and the tape collecting portion is for collecting the peeled adhesive tape, and the pressurizing mechanism is configured to be After attaching the adhesive tape to the semiconductor wafer, the adhesive state of the semiconductor wafer and the characteristics of the adhesive tape are formed on the surface of the adhesive tape, and the adhesive member presses the adhesive tape.
藉由此裝置，則於在半導體晶圓之兩面上形成有電路圖案時，有效地起作用。即，可將產生於支持用的黏著帶之基材面上的凹凸利用加壓機構平坦化。因此，可在將晶圓保持於平坦的狀態精度良好地進行切割處理。 According to this device, when a circuit pattern is formed on both surfaces of a semiconductor wafer, it functions effectively. In other words, the unevenness on the surface of the substrate of the adhesive tape for support can be flattened by the pressurizing mechanism. Therefore, the dicing process can be performed accurately while maintaining the wafer in a flat state.
在上述裝置中，最好具備移動機構，其係一面將貼附有黏著帶的半導體晶圓保持於保持平台上，一面和收納有該保持平台的殼體成為一體，在遍及帶貼附位置與帶切斷位置之範圍移動。 In the above device, it is preferable to provide a moving mechanism that holds the semiconductor wafer to which the adhesive tape is attached, on the holding platform, and integrates with the housing in which the holding platform is housed, and is attached to the tape attachment position. The range with the cut position moves.
例如，最好帶貼附機構具備：剝離構件，其係從隔片剝離將黏著帶並推出；貼附輥，其係按壓從前述剝離構件推出的黏著帶前 端；及切斷機構，其係在貼附終端位置切斷黏著帶的後端。 For example, it is preferable that the tape attaching mechanism includes: a peeling member that peels off the adhesive tape from the separator and pushes out; the attaching roller presses the adhesive tape pushed out from the peeling member And a cutting mechanism that cuts the rear end of the adhesive tape at the position of the attachment end.
藉由此構造，則可在抑制張力偏倚的狀態將黏著帶貼附於殼體之接合部上。因此，在帶貼附於半導體晶圓上時，可在腔室內利用差壓賦予黏著帶全面均勻的張力。 With this configuration, the adhesive tape can be attached to the joint portion of the casing in a state where the tension is suppressed. Therefore, when the tape is attached to the semiconductor wafer, a uniform uniform tension can be imparted to the adhesive tape by differential pressure in the chamber.
在上述裝置中，最好具備移動機構，其係一面將貼附有黏著帶的半導體晶圓保持於晶圓保持平台上，一面和收納有該晶圓保持平台的殼體成為一體，在遍及帶貼附位置與帶切斷位置之範圍移動。 In the above device, it is preferable to provide a moving mechanism for holding the semiconductor wafer to which the adhesive tape is attached, on the wafer holding platform, and integrating the housing with the wafer holding platform. The attachment position and the range of the cut position are moved.
例如，移動機構具備：旋轉驅動機；及臂，其係連結固定於前述旋轉驅動機之旋轉軸上；構成為在前述臂之至少一端上具有收納前述晶圓保持平台的殼體與框架保持平台。 For example, the moving mechanism includes: a rotary driving machine; and an arm coupled to the rotating shaft of the rotary driving machine; and configured to have a housing and a frame holding platform for accommodating the wafer holding platform on at least one end of the arm .
藉由此構造，則藉由在臂兩端之各端具備收納晶圓保持平台的殼體與框架保持平台，可使一方的保持平台移動到帶貼附位置，使另一方的保持平台同時移動到帶切斷位置。即，可同時平行執行黏著帶的貼附處理與切斷處理。 With this configuration, by providing the housing holding the wafer holding platform and the frame holding platform at each end of the both ends of the arm, one of the holding platforms can be moved to the tape attaching position, and the other holding platform can be simultaneously moved. To the belt cut position. That is, the attaching process and the cutting process of the adhesive tape can be performed in parallel at the same time.
再者，在上述各裝置中，最好在晶圓保持平台及加壓構件之至少一方具備加熱器。 Further, in each of the above devices, it is preferable that at least one of the wafer holding stage and the pressing member is provided with a heater.
利用加熱器，容易使構成黏著帶的黏著劑及基材利用加熱而軟化變形。 With the heater, it is easy to soften and deform the adhesive and the substrate constituting the adhesive tape by heating.
1‧‧‧晶圓供應/回收部 1‧‧‧ Wafer Supply/Recycling Department
2‧‧‧晶圓搬送機構 2‧‧‧ wafer transfer mechanism
3‧‧‧對準平台 3‧‧‧Alignment platform
4‧‧‧帶供應部 4‧‧‧With the supply department
5‧‧‧貼附單元 5‧‧‧ Attachment unit
6‧‧‧帶切斷機構 6‧‧‧With cutting mechanism
7‧‧‧腔室 7‧‧‧ chamber
8‧‧‧加壓單元 8‧‧‧ Pressurizing unit
9‧‧‧剝離單元 9‧‧‧ peeling unit
10‧‧‧帶回收部 10‧‧‧With recycling department
11A、11B‧‧‧機器手臂 11A, 11B‧‧‧Machine arm
12‧‧‧隔片回收部 12‧‧‧Separator recycling department
14‧‧‧縱板 14‧‧‧ vertical board
15‧‧‧可動台 15‧‧‧ movable platform
16‧‧‧框架 16‧‧‧Frame
17‧‧‧供應筒管 17‧‧‧Supply bobbin
18‧‧‧導輥 18‧‧‧guide roller
19‧‧‧回收筒管 19‧‧‧Recycling bobbin
20‧‧‧剝離構件 20‧‧‧Exfoliation members
21‧‧‧升降輥 21‧‧‧ Lifting roller
22‧‧‧貼附輥 22‧‧‧ Attachment roller
23‧‧‧切斷單元 23‧‧‧cutting unit
24‧‧‧框架 24‧‧‧Frame
25‧‧‧可動台 25‧‧‧ movable platform
26‧‧‧刀具 26‧‧‧Tools
27‧‧‧框架 27‧‧‧Frame
28‧‧‧可動台 28‧‧‧ movable table
29‧‧‧支持臂 29‧‧‧Support arm
30‧‧‧刀具單元 30‧‧‧Tool unit
31‧‧‧刀具 31‧‧‧Tools
33A‧‧‧上殼體 33A‧‧‧Upper casing
33B、33C‧‧‧下殼體 33B, 33C‧‧‧ lower case
34‧‧‧旋轉驅動機 34‧‧‧Rotary drive
35‧‧‧旋轉軸 35‧‧‧Rotary axis
36‧‧‧旋轉臂 36‧‧‧Rotating arm
37‧‧‧保持平台 37‧‧‧Maintaining the platform
38‧‧‧桿 38‧‧‧ rod
39‧‧‧致動器 39‧‧‧Actuator
40‧‧‧升降驅動機構 40‧‧‧ Lifting drive mechanism
41‧‧‧縱壁 41‧‧‧ vertical wall
42‧‧‧導軌 42‧‧‧rails
43‧‧‧可動台 43‧‧‧ movable platform
44‧‧‧可動框 44‧‧‧ movable frame
45‧‧‧臂 45‧‧‧arm
46‧‧‧支軸 46‧‧‧ fulcrum
47‧‧‧螺旋軸 47‧‧‧Spiral axis
48‧‧‧馬達 48‧‧‧Motor
49‧‧‧加熱器 49‧‧‧heater
50‧‧‧流路 50‧‧‧Flow
51‧‧‧真空裝置 51‧‧‧Vacuum device
52‧‧‧電磁閥 52‧‧‧ solenoid valve
53、54‧‧‧電磁閥 53, 54‧‧ ‧ solenoid valve
55‧‧‧流路 55‧‧‧Flow
56‧‧‧電磁閥 56‧‧‧ solenoid valve
57‧‧‧流路 57‧‧‧Flow
60‧‧‧控制部 60‧‧‧Control Department
61‧‧‧加壓構件 61‧‧‧ Pressurized components
62‧‧‧氣缸 62‧‧‧ cylinder
63‧‧‧加熱器 63‧‧‧heater
64‧‧‧導軌 64‧‧‧rails
65‧‧‧可動台 65‧‧‧ movable platform
66‧‧‧固定支承片 66‧‧‧Fixed support piece
67‧‧‧氣缸 67‧‧‧ cylinder
68‧‧‧可動片 68‧‧‧ movable piece
69‧‧‧回收容器 69‧‧‧Recycling container
70‧‧‧接合部 70‧‧‧ joints
71‧‧‧支持銷 71‧‧‧Support pins
75‧‧‧框架供應部 75‧‧‧Frame Supply Department
76‧‧‧機器手臂 76‧‧‧Machine arm
77‧‧‧框架保持平台 77‧‧‧Frame keeping platform
78‧‧‧切斷單元 78‧‧‧Cut unit
79‧‧‧搬送車 79‧‧‧Transportation car
79‧‧‧軸承 79‧‧‧ bearing
80‧‧‧凸起部 80‧‧ ‧ raised parts
81、82、83、84‧‧‧支持臂 81, 82, 83, 84‧‧‧ support arms
85‧‧‧刀具 85‧‧‧Tools
87‧‧‧按壓輥 87‧‧‧Press roller
88‧‧‧搖動臂 88‧‧‧Shake arm
89‧‧‧連結部 89‧‧‧Connecting Department
90‧‧‧馬達 90‧‧‧Motor
f‧‧‧環狀框架 f‧‧‧Ring frame
s‧‧‧隔片 S‧‧‧ spacer
C1、C2‧‧‧片匣 C1, C2‧‧‧ films
DT‧‧‧黏著帶 DT‧‧‧ adhesive tape
PT‧‧‧黏著帶 PT‧‧‧ adhesive tape
W‧‧‧晶圓 W‧‧‧ wafer
請理解雖然為了說明發明而圖示有被認為目前適合的幾個形態，但是發明並不受如圖示的構造及方案限定。 It is to be understood that while the invention has been described in terms of several embodiments, the invention is not limited by the structures and embodiments shown.
第1圖為顯示整個表面保護用的黏著帶貼附裝置的平面圖。 Fig. 1 is a plan view showing an adhesive tape attaching device for protecting the entire surface.
第2圖為顯示整個表面保護用的黏著帶貼附裝置的正面圖。 Fig. 2 is a front elevational view showing the adhesive tape attaching device for the entire surface protection.
第3圖為顯示配備於旋轉驅動機構的構造的正面圖。 Fig. 3 is a front elevational view showing the configuration of the rotary drive mechanism.
第4圖為顯示腔室構造的正面圖。 Figure 4 is a front elevational view showing the construction of the chamber.
第5圖為顯示腔室構造的縱剖面圖。 Fig. 5 is a longitudinal sectional view showing the structure of the chamber.
第6圖-第8圖為顯示實施例裝置動作的正面圖。 Fig. 6 through Fig. 8 are front elevational views showing the operation of the apparatus of the embodiment.
第9圖為顯示實施例裝置動作的平面圖。 Figure 9 is a plan view showing the operation of the apparatus of the embodiment.
第10圖為顯示實施例裝置動作的正面圖。 Figure 10 is a front elevational view showing the operation of the apparatus of the embodiment.
第11圖為顯示實施例裝置動作的平面圖。 Figure 11 is a plan view showing the operation of the apparatus of the embodiment.
第12圖-第17圖為顯示實施例裝置動作的正面圖。 Fig. 12 through Fig. 17 are front elevational views showing the operation of the apparatus of the embodiment.
第18圖為支持用的黏著帶貼附裝置的正面圖。 Figure 18 is a front elevational view of the adhesive tape attachment device for support.
第19圖為支持用的黏著帶貼附裝置的平面圖。 Figure 19 is a plan view of the adhesive tape attaching device for support.
第20圖為顯示腔室構造的正面圖。 Figure 20 is a front elevational view showing the construction of the chamber.
第21圖-第25圖為顯示變形例裝置動作的正面圖。 21 to 25 are front views showing the operation of the device of the modification.
以下，參照圖面說明本發明之一實施例。再者，在本實施例中，係以將表面保護用的黏著帶貼附於半導體晶圓(以下只稱為「晶圓」)之電路形成面上的情況為例而進行說明。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a case where an adhesive tape for surface protection is attached to a circuit forming surface of a semiconductor wafer (hereinafter simply referred to as "wafer") will be described as an example.
第1圖為關於本發明之一實施例，顯示整個黏著帶貼附裝置構造的正面圖，第2圖為黏著帶貼附裝置的平面圖。 Fig. 1 is a front elevational view showing the construction of the entire adhesive tape attaching device, and Fig. 2 is a plan view showing the adhesive tape attaching device.
黏著帶貼附裝置具備晶圓供應/回收部1、晶圓搬送機構2、對準平台3、帶供應部4、貼附單元5、帶切斷機構6、腔室7、加壓單元8、剝離單元9及帶回收部10等。以下，說明關於上述各構造部及機構等的具體構造。 The adhesive tape attaching device includes a wafer supply/recovery unit 1, a wafer transfer mechanism 2, an alignment platform 3, a tape supply unit 4, a attaching unit 5, a tape cutting mechanism 6, a chamber 7, and a pressurizing unit 8, The peeling unit 9 and the belt collecting unit 10 and the like. Hereinafter, specific structures of the above-described respective structural portions, mechanisms, and the like will be described.
在晶圓供應/回收部1上並排載置兩台片匣C1、C2。多數片晶圓W以使電路形成面(表面)向上的水平姿勢多層插入收納於各片匣C內。 Two sheets C1 and C2 are placed side by side on the wafer supply/recovery unit 1. The plurality of wafers W are inserted and housed in the respective sheets C in a horizontal posture in which the circuit forming surface (surface) is upward.
晶圓搬送機構2具備兩台機器手臂11A、11B。兩機器手臂11A、11B構成為可水平進退移動，並且全體可旋轉及升降。而且，在機器手臂11A、11B之前端具備呈馬蹄形的真空吸附式的晶圓保持部。晶圓保持部係插入多層收納於片匣C內的晶圓W彼此的間隙，從背面吸附保持晶圓W。吸附保持的晶圓W係從片匣C1或C2被抽出，依對準平台3、保持平台37及晶圓供應/回收部1的順序被搬送。 The wafer transfer mechanism 2 includes two robot arms 11A and 11B. The two robot arms 11A, 11B are configured to be horizontally advanced and retractable, and are rotatable and movable as a whole. Further, a vacuum suction type wafer holding portion having a horseshoe shape is provided at the front end of the robot arms 11A and 11B. The wafer holding portion is inserted into a gap between the wafers W accommodated in the stack C in a plurality of layers, and the wafer W is adsorbed and held from the back surface. The wafer W adsorbed and held is taken out from the sheet C1 or C2, and is transported in the order of the alignment stage 3, the holding stage 37, and the wafer supply/recovery unit 1.
對準平台3係將由晶圓搬送機構2搬入載置的晶圓W，基於形成於其外周的凹口或定向平面而進行對位。 The alignment stage 3 carries the wafer W placed on the wafer by the wafer transfer mechanism 2, and is aligned based on a notch or an orientation flat formed on the outer circumference thereof.
如第1圖所示，帶供應部4、貼附單元5、隔片回收部12及切斷單元23安裝於同一縱板14上。該縱板14係經由可動台15，沿著上部的框架16而水平移動。 As shown in Fig. 1, the tape supply unit 4, the attaching unit 5, the spacer collecting unit 12, and the cutting unit 23 are attached to the same vertical plate 14. The vertical plate 14 is horizontally moved along the upper frame 16 via the movable table 15.
關於帶供應部4，係成卷狀的寬幅的黏著帶PT裝填於供應筒管17上，構成為將從該供應筒管17放出的附有隔片s的黏著帶PT捲繞引導至導輥18群，並將剝離 隔片s後的黏著帶PT引導至貼附單元5。此外，構成為賦予供應筒管17適度的旋轉阻力，以免進行過量的帶放出。 Regarding the tape supply portion 4, a wide adhesive tape PT which is wound in a roll shape is loaded onto the supply bobbin 17, and is configured to wind and guide the adhesive tape PT with the spacer s discharged from the supply bobbin 17 to the guide. Roll 18 group and will peel off The adhesive tape PT after the spacer s is guided to the attaching unit 5. Further, it is configured to impart a moderate rotational resistance to the supply bobbin 17 to prevent excessive tape discharge.
隔片回收部12係向捲取方向旋轉驅動回收筒管19，該回收筒管19係捲取從黏著帶PT剝離的隔片s。 The separator collecting portion 12 rotationally drives the recovery bobbin 19 in the winding direction, and the recovery bobbin 19 winds up the separator s which is peeled off from the adhesive tape PT.
如第3圖所示，貼附單元5具備剝離構件20、升降輥21及貼附輥22。再者，貼附單元5相當於本發明之帶貼附機構。 As shown in FIG. 3, the attaching unit 5 is provided with the peeling member 20, the elevation roller 21, and the attaching roller 22. Furthermore, the attaching unit 5 corresponds to the tape attaching mechanism of the present invention.
剝離構件20具有前端尖銳的邊緣。利用使該邊緣斜向下的該剝離構件20折回隔片s而剝離黏著帶PT。即，從剝離構件20向前方推出黏著帶PT。 The peeling member 20 has a sharp edge at the front end. The adhesive tape PT is peeled off by folding the peeling member 20 which is inclined downward toward the edge to the spacer s. That is, the adhesive tape PT is pushed out from the peeling member 20 to the front.
升降輥21和剝離構件20協同動作而適時地把持黏著帶PT。 The lift roller 21 and the peeling member 20 cooperate to appropriately hold the adhesive tape PT.
貼附輥22按壓從剝離構件20前端推出的黏著帶PT前端而逐漸貼附於後述的下殼體33B、33C之接合部70上。 The attaching roller 22 presses the distal end of the adhesive tape PT pushed out from the distal end of the peeling member 20, and is gradually attached to the joint portion 70 of the lower casings 33B and 33C to be described later.
切斷單元23具備：沿著設於剝離構件20前側的框架24而移動(紙面的跟前至內部)的可動台25；及於該可動台25之下部，經由刀具夾持器而具備刀具26。即，切斷單元23於寬度方向切斷黏著帶PT。 The cutting unit 23 includes a movable table 25 that moves along the frame 24 provided on the front side of the peeling member 20 (front to back of the paper surface), and a cutter 26 that is provided below the movable table 25 via a tool holder. That is, the cutting unit 23 cuts the adhesive tape PT in the width direction.
如第1圖及第2圖所示，帶切斷機構6在從可沿著框架27升降的可動台28懸臂支持的臂之前端下部，經由延伸於徑向的支持臂29而具備刀具單元30。關於刀具單元30，係經由刀具夾持器而安裝有使刀尖向下的刀具31。再者，刀具單元30可經由支持臂29而調整旋轉半徑。再者，帶切斷機構6相當於本發明之切斷機構。 As shown in FIGS. 1 and 2, the tape cutting mechanism 6 is provided with a cutter unit 30 via a support arm 29 extending in the radial direction at a lower end portion of the arm that is cantilevered from the movable table 28 that can be moved up and down along the frame 27. . Regarding the cutter unit 30, a cutter 31 that causes the cutting edge to be downward is attached via a tool holder. Furthermore, the cutter unit 30 can adjust the radius of rotation via the support arm 29. Further, the tape cutting mechanism 6 corresponds to the cutting mechanism of the present invention.
腔室7係由具有小於黏著帶PT寬度之內徑的上下一對殼體所構成。在本實施例中，具備一個上殼體33A與兩個下殼體33B、33C。 The chamber 7 is composed of a pair of upper and lower housings having an inner diameter smaller than the width of the adhesive tape PT. In the present embodiment, one upper casing 33A and two lower casings 33B, 33C are provided.
如第3圖所示，下殼體33B、33C係連結固定於馬達等旋轉驅動機34之旋轉軸35上，分別配備於旋轉臂36之兩端。即，構成為例如一方的下殼體33B與上殼體33A形成腔室7時，另一方的下殼體33C位於貼附單元5側的帶貼附位置。此外，下殼體33B、33C之上面及下面施有氟加工等脫模處理。 As shown in FIG. 3, the lower casings 33B and 33C are coupled and fixed to the rotating shaft 35 of the rotary drive machine 34 such as a motor, and are respectively provided at both ends of the rotating arm 36. In other words, when the lower casing 33B and the upper casing 33A form the chamber 7, for example, the other lower casing 33C is located at the tape attachment position on the side of the attachment unit 5. Further, mold release treatment such as fluorine processing is applied to the upper and lower surfaces of the lower casings 33B and 33C.
在兩下殼體33B、33C內具備可升降的保持平台37。保持平台37和貫穿下殼體33B、33C的桿38連結。桿38之另一端驅動連結於由馬達等構成的致動器39。因此，保持平台37在下殼體33B、33C內升降。此外，於保持平台37內埋設有加熱器49。 A holding platform 37 that can be raised and lowered is provided in the two lower casings 33B and 33C. The holding platform 37 is coupled to the rod 38 penetrating the lower casings 33B, 33C. The other end of the rod 38 is drivingly coupled to an actuator 39 composed of a motor or the like. Therefore, the holding platform 37 is raised and lowered in the lower casings 33B, 33C. Further, a heater 49 is embedded in the holding platform 37.
如第4圖所示，上殼體33A配備於升降驅動機構40。此升降驅動機構40具備：可動台43，其係可沿著縱向配置於縱壁41背部的導軌42升降；可動框44，其係可調節高度地支持於此可動台43上；及臂45，其係從此可動框44向前方伸出。於從此臂45之前端部向下方伸出的支軸46上安裝有上殼體33A。 As shown in FIG. 4, the upper casing 33A is provided to the elevation drive mechanism 40. The lifting and lowering drive mechanism 40 includes a movable table 43 that is movable up and down along a guide rail 42 disposed longitudinally on the back of the vertical wall 41, and a movable frame 44 that is height-adjustably supported on the movable table 43; and an arm 45, It projects from the movable frame 44 forward. An upper casing 33A is attached to a support shaft 46 projecting downward from the front end of the arm 45.
可動台43係利用馬達48正反轉螺旋軸47而螺旋移動升降。 The movable table 43 is spirally moved up and down by the motor 48 to rotate the screw shaft 47 in the forward and reverse directions.
關於上下殼體33A-33C，如第5圖所示，係經由流路50而和真空裝置51連通連接。再者，關於上殼體33A側的流路50，係具備電磁閥52。此外，關於各殼體 33A-33C，係分別連通連接流路55，該流路55係具備大氣開放用的電磁閥53、54。再者，關於上殼體33A，係連通連接流路57，該流路57係具備利用洩漏來調整暫時減壓之內壓的電磁閥56。再者，此等電磁閥52、53、54、56之開關操作及真空裝置51之動作係由控制部60所進行。 As shown in FIG. 5, the upper and lower casings 33A-33C are connected to the vacuum unit 51 via the flow path 50. Further, the flow path 50 on the side of the upper casing 33A is provided with a solenoid valve 52. In addition, regarding each housing Each of 33A-33C is connected to a connection flow path 55 which is provided with electromagnetic valves 53 and 54 for opening the atmosphere. Further, the upper casing 33A is connected to the connecting flow path 57, and the flow path 57 is provided with a solenoid valve 56 that adjusts the internal pressure of the temporary decompression by leakage. Further, the switching operation of the solenoid valves 52, 53, 54, and 56 and the operation of the vacuum device 51 are performed by the control unit 60.
加壓單元8於上殼體33A內具備加壓構件61。加壓構件61為具有扁平底面的板。於該加壓構件之上部連結有氣缸62，在上殼體33A內升降。此外，於加壓構件61內嵌入有加熱器63。再者，加壓單元8相當於本發明之加壓機構。 The pressurizing unit 8 is provided with a pressurizing member 61 in the upper casing 33A. The pressing member 61 is a plate having a flat bottom surface. An air cylinder 62 is coupled to the upper portion of the pressing member, and is raised and lowered in the upper casing 33A. Further, a heater 63 is embedded in the pressing member 61. Further, the pressurizing unit 8 corresponds to the pressurizing mechanism of the present invention.
如第1圖、第2圖及第16圖所示，剝離單元9具備：可動台65，其係沿著導軌64而左右水平地移動；固定支承片66，其係在該可動台65上升降；及可動片68，其係以該固定支承片66與氣缸67開關。即，剝離單元9係利用固定支承片66和可動片68把持並逐漸剝離由帶切斷機構6切成晶圓W形狀的不要的黏著帶PT之一端側。再者，剝離單元9相當於本發明之剝離機構。 As shown in FIGS. 1 , 2 , and 16 , the peeling unit 9 includes a movable table 65 that moves horizontally left and right along the guide rail 64 , and a fixed support piece 66 that is lifted and lowered on the movable table 65 . And a movable piece 68 which is opened and closed by the fixed support piece 66 and the cylinder 67. In other words, the peeling unit 9 is held by the fixed support piece 66 and the movable piece 68, and gradually peels off one end side of the unnecessary adhesive tape PT which is cut into the shape of the wafer W by the tape cutting mechanism 6. Further, the peeling unit 9 corresponds to the peeling mechanism of the present invention.
關於帶回收部10，係位於剝離單元9之剝離結束端側，配置有回收容器69，該回收容器69係回收由該剝離單元9剝離的黏著帶PT。 The tape collection unit 10 is located on the side of the peeling end of the peeling unit 9, and is provided with a recovery container 69 for recovering the adhesive tape PT peeled off by the peeling unit 9.
其次，說明利用上述的實施例裝置將黏著帶PT貼附於晶圓W上的一輪動作。 Next, a description will be given of a one-round operation of attaching the adhesive tape PT to the wafer W by the apparatus of the above-described embodiment.
首先，利用機器手臂11A從片匣C1搬出晶圓W，載置於對準平台3上。在對準平台3上進行對位後，利用機器手臂11A搬送到在帶貼附位置上的保持平台37。 First, the wafer W is carried out from the sheet cassette C1 by the robot arm 11A, and placed on the alignment stage 3. After the alignment is performed on the alignment stage 3, the robot arm 11A is transported to the holding platform 37 at the tape attachment position.
如第6圖所示，保持平台37係推上高於下殼體33B之頂部(接合部)70的複數根支持銷71而接收晶圓W。接收到晶圓W的支持銷71下降，該晶圓W以保持平台37之保持面吸附保持。此時，晶圓W的表面在低於接合部70的位置。 As shown in Fig. 6, the holding platform 37 pushes up the plurality of support pins 71 higher than the top (joining portion) 70 of the lower casing 33B to receive the wafer W. The support pin 71 that has received the wafer W is lowered, and the wafer W is adsorbed and held by the holding surface of the holding platform 37. At this time, the surface of the wafer W is at a position lower than the joint portion 70.
如第7圖所示，使貼附單元5移動到貼附開始端。一面保持黏著帶PT的供應與捲取的同步，一面從剝離構件20推出黏著帶PT僅預定長度。使貼附輥22下降，將黏著帶PT之前端貼附於下殼體33B之接合部70上。其後，一面使貼附單元5移動，一面將黏著帶PT逐漸貼附於該接合部70之全面上。此時，晶圓W的表面與黏著帶PT的黏著面係以預先決定的間隙接近對向。 As shown in Fig. 7, the attaching unit 5 is moved to the attachment start end. While the supply of the adhesive tape PT is kept in synchronization with the winding, the adhesive tape PT is pushed out from the peeling member 20 only for a predetermined length. The attaching roller 22 is lowered, and the front end of the adhesive tape PT is attached to the joint portion 70 of the lower casing 33B. Thereafter, while the attaching unit 5 is moved, the adhesive tape PT is gradually attached to the entire surface of the joint portion 70. At this time, the adhesion surface of the surface of the wafer W and the adhesive tape PT approaches the opposite direction with a predetermined gap.
貼附單元5在從貼附終端側的接合部70超過預定距離的位置停止。切斷單元23動作，如第8圖及第9圖所示，刀具26於寬度方向切斷黏著帶PT的後端側。再者，第7圖、第8圖及後述的第13圖係使記載於左側的下殼體33B旋轉90度而記載，以便容易理解貼附單元5的帶貼附動作。 The attaching unit 5 is stopped at a position beyond the predetermined distance from the joint portion 70 on the attaching terminal side. The cutting unit 23 operates, and as shown in FIGS. 8 and 9, the cutter 26 cuts the rear end side of the adhesive tape PT in the width direction. In addition, in the seventh drawing, the eighth drawing, and the thirteenth figure which will be described later, the lower case 33B described on the left side is rotated by 90 degrees, so that the tape attaching operation of the attaching unit 5 can be easily understood.
如第10圖及第11圖所示，使旋轉驅動機34動作而使下殼體33B旋轉移動到上殼體33A的下方。此時，安裝於旋轉臂36另一端側的下殼體33C移動到帶貼附位置。 As shown in FIGS. 10 and 11, the rotary driver 34 is operated to rotate the lower casing 33B downward of the upper casing 33A. At this time, the lower casing 33C attached to the other end side of the rotary arm 36 is moved to the tape attachment position.
使上殼體33A下降，和下殼體33B夾住黏著帶PT而形成腔室7。 The upper casing 33A is lowered, and the lower casing 33B sandwiches the adhesive tape PT to form the chamber 7.
控制部60使加熱器49動作，從下殼體33B側 加熱黏著帶PT，並且在關閉電磁閥53、54、56的狀態，使真空裝置51動作，將上殼體33A內與下殼體33B內減壓。此時，調整電磁閥52的開度，以便兩殼體33A、33B內以相同的速度逐漸減壓。 The control unit 60 operates the heater 49 from the lower casing 33B side. The adhesive tape PT is heated, and the vacuum device 51 is operated in a state where the electromagnetic valves 53, 54, 56 are closed, and the inside of the upper casing 33A and the lower casing 33B are decompressed. At this time, the opening degree of the solenoid valve 52 is adjusted so that the pressure is gradually reduced at the same speed in the both casings 33A, 33B.
將兩殼體33A、33B內減壓到預定的氣壓，控制部60就關閉電磁閥52，並且停止真空裝置51的動作。 When the inside of the two casings 33A and 33B is depressurized to a predetermined air pressure, the control unit 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.
控制部60調整電磁閥56的開度，一面使其洩漏，一面將上殼體33A內徐徐地提高到預定的氣壓。此時，下殼體33B內的氣壓低於上殼體33A內的氣壓，利用其差壓，將黏著帶PT從其中心逐漸拉入下殼體33B內，從接近配備的晶圓W中心向外周徐徐地貼附。 The control unit 60 adjusts the opening degree of the electromagnetic valve 56 and gradually raises the inside of the upper casing 33A to a predetermined air pressure while leaking. At this time, the air pressure in the lower casing 33B is lower than the air pressure in the upper casing 33A, and the adhesive tape PT is gradually pulled from the center thereof into the lower casing 33B by the differential pressure thereof, from the center of the wafer W close to the apparatus. The circumference is slowly attached.
上殼體33A內到達預先設定的氣壓，控制部60就調整電磁閥54的開度，使下殼體33B內的氣壓和上殼體33A內的氣壓相同。隨著此氣壓調整，使保持平台37上升而使下殼體33B之接合部70的表面和晶圓W的上面成為相同的高度。 When the inside of the upper casing 33A reaches a predetermined air pressure, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 so that the air pressure in the lower casing 33B and the air pressure in the upper casing 33A are the same. With this air pressure adjustment, the holding platform 37 is raised to bring the surface of the joint portion 70 of the lower casing 33B to the same height as the upper surface of the wafer W.
如第13圖所示，使由加熱器63加熱的加壓構件61下降到預先決定的高度。將黏著帶PT之全面邊加熱預定時間邊加壓。此高度係依照黏著帶PT的厚度、晶圓W上凸塊的高度等，預先設定於包含該凸塊在內的電路不破損的高度。 As shown in Fig. 13, the pressing member 61 heated by the heater 63 is lowered to a predetermined height. The entire side of the adhesive tape PT is heated while being heated for a predetermined period of time. This height is set in advance to a height at which the circuit including the bump is not broken, in accordance with the thickness of the adhesive tape PT, the height of the bump on the wafer W, and the like.
加壓處理完畢，控制部60就使上殼體33A上升而將上殼體33A內進行大氣開放，並且使電磁閥54全開而下殼體33B側也進行大氣開放。 When the pressurization process is completed, the control unit 60 raises the upper casing 33A, opens the atmosphere in the upper casing 33A, and opens the electromagnetic valve 54 and the lower casing 33B side to open the atmosphere.
再者，於在腔室7內將黏著帶PT貼附於晶圓W 上之間，一面以下殼體33C內的保持平台37吸附保持由機器手臂11B從片匣C2搬出的晶圓W，一面將黏著帶PT貼附於該下殼體33C之接合部70上。 Furthermore, the adhesive tape PT is attached to the wafer W in the chamber 7 In the upper side, the holding platform 37 in the lower casing 33C sucks and holds the wafer W carried out from the stack C2 by the robot arm 11B, and attaches the adhesive tape PT to the joint portion 70 of the lower casing 33C.
在腔室7內的黏著帶PT貼附於晶圓W上的處理與加壓處理、及貼附單元5的黏著帶PT貼附於下殼體33C上的處理完畢，就如第14圖所示，使旋轉臂36反轉。即，使一方的下殼體33B移動到貼附單元5側的帶貼附位置，使另一方的下殼體33C移動到上殼體33A下方的接合位置。 The processing of the adhesive tape PT attached to the wafer W in the chamber 7 and the pressure treatment, and the adhesion of the adhesive tape PT of the attaching unit 5 to the lower casing 33C are completed as shown in Fig. 14. It is shown that the rotating arm 36 is reversed. That is, one of the lower casings 33B is moved to the tape attachment position on the side of the attachment unit 5, and the other lower casing 33C is moved to the engagement position below the upper casing 33A.
使帶切斷機構6動作，如第15圖所示，使刀具單元30下降到預定高度，將刀具31刺入晶圓W與下殼體33B之間的黏著帶PT。在該狀態，沿著晶圓W的外周切斷黏著帶PT。此時，黏著帶PT的表面被保持於水平。黏著帶PT的切斷完畢，刀具單元30就上升，回到待命位置。 The belt cutting mechanism 6 is operated, and as shown in Fig. 15, the cutter unit 30 is lowered to a predetermined height, and the cutter 31 is pierced into the adhesive tape PT between the wafer W and the lower casing 33B. In this state, the adhesive tape PT is cut along the outer circumference of the wafer W. At this time, the surface of the adhesive tape PT is kept at the level. When the cutting of the adhesive tape PT is completed, the cutter unit 30 is raised to return to the standby position.
使剝離單元9移動到剝離開始位置。如第16圖所示，利用固定支承片66和可動片68夾住從下殼體33B露出的黏著帶PT之兩端側。如第17圖所示，在該狀態使其向斜上方移動預定距離後，一面使其水平移動，一面逐漸剝離切成晶圓形狀的黏著帶PT。 The peeling unit 9 is moved to the peeling start position. As shown in Fig. 16, the fixed support piece 66 and the movable piece 68 sandwich the both end sides of the adhesive tape PT exposed from the lower case 33B. As shown in Fig. 17, in this state, after moving a predetermined distance obliquely upward, the adhesive tape PT cut into a wafer shape is gradually peeled off while horizontally moving.
剝離單元9到達帶回收部10，就解除黏著帶PT的把持，使黏著帶PT落下到回收容器69內。 When the peeling unit 9 reaches the belt collecting portion 10, the holding of the adhesive tape PT is released, and the adhesive tape PT is dropped into the recovery container 69.
貼附有黏著帶PT的晶圓W利用機器手臂11A，使其收納於片匣C1的原來位置。 The wafer W to which the adhesive tape PT is attached is stored in the original position of the sheet cassette C1 by the robot arm 11A.
再者，在進行下殼體33B側的黏著帶PT切斷及剝離處理之間，進行下殼體33C側的黏著帶PT貼附於 晶圓W上的處理。以上，黏著帶PT貼附於晶圓W上的一輪動作結束，以後，反覆進行相同的處理。 Further, the adhesive tape PT on the lower casing 33C side is attached to the adhesive tape PT cutting and peeling process on the lower casing 33B side. Processing on wafer W. As described above, one round of the operation of attaching the adhesive tape PT to the wafer W is completed, and thereafter, the same processing is repeated.
藉由上述實施例裝置，由於將黏著帶PT之前端側在自由狀態貼附於下殼體33B、33C之接合部70上，所以可在抑制往貼附方向施加張力的狀態貼附黏著帶PT。因此，藉由使差壓作用於無張力偏倚的黏著帶PT，可使放射狀均勻的張力作用於該黏著帶PT。因此，可不使皺紋等產生而將黏著帶PT貼附於晶圓W的表面上。 According to the apparatus of the above-described embodiment, since the front end side of the adhesive tape PT is attached to the joint portion 70 of the lower casings 33B and 33C in a free state, the adhesive tape PT can be attached while suppressing the application of tension to the attaching direction. . Therefore, by applying a differential pressure to the tension-free biasing adhesive tape PT, a radially uniform tension can be applied to the adhesive tape PT. Therefore, the adhesive tape PT can be attached to the surface of the wafer W without causing wrinkles or the like.
此外，由於不像利用貼附輥等貼附構件時那樣過量的按壓作用於晶圓W，所以可不使包含凸塊等在內的電路破損而將黏著帶PT貼附於晶圓W上。 Further, since the excessive pressing acts on the wafer W as in the case of attaching the member by a bonding roller or the like, the adhesive tape PT can be attached to the wafer W without breaking the circuit including the bump or the like.
可以利用減壓作用使氣泡從晶圓W的凹部脫氣，並且也可以使黏著劑跟著密接於該晶圓W表面的凹凸形狀。 The air bubbles can be degassed from the concave portion of the wafer W by the decompression action, and the adhesive can be adhered to the uneven shape of the surface of the wafer W.
利用腔室7的差壓在貼附於晶圓W上的黏著帶PT表面上因凸塊等的影響而形成有凹凸的情況，藉由選擇進行加壓處理，可賦予可只將黏著帶PT的表面平坦化程度的加壓。因此，不會因該加壓處理而使晶圓W的電路破損。 When the differential pressure of the chamber 7 is formed on the surface of the adhesive tape PT attached to the wafer W by the influence of bumps or the like, irregularities can be formed, and by applying pressure treatment, only the adhesive tape PT can be imparted. The surface is flattened to a degree of pressurization. Therefore, the circuit of the wafer W is not damaged by the pressurization process.
由於構成黏著帶PT的基材表面為平坦，所以可抑制背面研磨後晶圓厚度的偏差。即，不管黏著帶PT的特性或晶圓W之電路形成面的狀態如何，都可將黏著帶PT的表面平坦化。 Since the surface of the substrate constituting the adhesive tape PT is flat, variation in wafer thickness after back grinding can be suppressed. That is, the surface of the adhesive tape PT can be flattened regardless of the characteristics of the adhesive tape PT or the state of the circuit formation surface of the wafer W.
再者，於在腔室7內進行黏著帶PT貼附於晶圓W上的處理及加壓處理之間，可平行地同時進行黏著 帶PT貼附於另一方的下殼體的處理或帶切斷及帶剝離處理。因此，可縮短生產節拍時間(tact time)。 Further, in the chamber 7, the adhesive tape PT is attached to the wafer W and the pressure treatment is performed, and the adhesion can be simultaneously performed in parallel. The treatment with the PT attached to the lower casing of the other side or the tape cutting and stripping treatment. Therefore, the tact time can be shortened.
再者，本發明也可以用如下的形態實施： Furthermore, the present invention can also be implemented in the following form:
(1)在上述實施例中，係以貼附表面保護用的黏著帶PT的情況為例而進行了說明，但可以也適用於遍及電路形成於表背面的晶圓W與環狀框架而貼附於支持用的黏著帶(切割帶)上的情況。因此，在和上述實施例裝置相同的構造上只是附上相同的符號，就不同的構造部分進行詳細敘述。 (1) In the above embodiment, the case of attaching the adhesive tape PT for surface protection has been described as an example. However, the present invention can also be applied to the wafer W and the ring frame formed on the front and back surfaces of the circuit. Attached to the support tape (cut tape). Therefore, the same configurations as those of the above-described embodiment are denoted by the same reference numerals, and the different structural portions will be described in detail.
如第18圖及第19圖所示，該黏著帶貼附裝置再具備框架供應部75、機器手臂76、框架保持平台77及切斷單元78。 As shown in Figs. 18 and 19, the adhesive tape attaching device further includes a frame supply portion 75, a robot arm 76, a frame holding platform 77, and a cutting unit 78.
框架供應部75設置於片匣C1的旁邊。於該空間連結層積收納有環狀框架f的台車式搬送車79。該搬送車79於其內部具備升降台。在該升降台上層積有環狀框架f，構成為一面以預定間距升降，一面從上方的開口一片一片地將環狀框架f交接給機器手臂76。 The frame supply portion 75 is disposed beside the sheet cassette C1. A trolley type transport vehicle 79 in which an annular frame f is housed is laminated in this space. The transport vehicle 79 is provided with an elevating platform therein. An annular frame f is stacked on the lifting platform, and is configured to lift and lower the annular frame f one by one from the upper opening to the robot arm 76 while raising and lowering at a predetermined pitch.
機器手臂76以呈馬蹄形的保持部吸附保持環狀框架f的上面而搬送。 The robot arm 76 is held by the upper surface of the annular frame f by a horseshoe-shaped holding portion.
框架保持平台77為包圍下殼體33B、33C外周的環狀，設置於旋轉臂36上。因此，和下殼體33B、33C成為一體而旋轉。於該框架保持平台77上載置有環狀框架f時，將高度設定成下殼體33B、33C之接合面和環狀框架f之面成為齊平面。 The frame holding platform 77 is an annular shape surrounding the outer circumference of the lower casings 33B and 33C, and is provided on the rotating arm 36. Therefore, the lower casings 33B and 33C are integrally rotated. When the annular frame f is placed on the frame holding platform 77, the height is set such that the joint faces of the lower casings 33B and 33C and the surface of the annular frame f are flush.
切斷單元78配備於使上殼體33A升降的升降 驅動機構40。即，具備經由第20圖所示的軸承79而繞支軸46旋轉的凸起部80。在此凸起部80上，於中心具備延伸於徑向的四根支持臂81至84。 The cutting unit 78 is provided for lifting and lowering the upper casing 33A Drive mechanism 40. That is, the boss portion 80 that rotates around the support shaft 46 via the bearing 79 shown in Fig. 20 is provided. On the boss portion 80, four support arms 81 to 84 extending in the radial direction are provided at the center.
水平軸支有圓板形刀具85的刀具托座可上下移動地安裝於一方的支持臂81之前端，並且按壓輥87經由搖動臂88而可上下移動地安裝於其他的支持臂82至84之前端。 The tool holder that supports the disk-shaped cutter 85 on the horizontal axis is attached to the front end of one of the support arms 81 so as to be movable up and down, and the pressing roller 87 is attached to the other support arms 82 to 84 so as to be movable up and down via the swing arm 88. front end.
於凸起部80之上部具有連結部89，於此連結部89和配備於臂45的馬達90之旋轉軸驅動連結。 The upper portion of the boss portion 80 has a coupling portion 89 that is drivingly coupled to a rotating shaft of the motor 90 provided on the arm 45.
茲就利用以下的該實施例裝置將黏著帶DT貼附於環狀框架f與晶圓W上的一輪動作進行說明。 The operation of attaching the adhesive tape DT to the annular frame f and the wafer W by the following apparatus of this embodiment will be described.
在利用機器手臂11A從片匣C1搬出晶圓W並在對準平台3上進行對位之間，利用機器手臂76搬出環狀框架f並載置於在帶貼附位置的框架保持平台77上。 When the wafer W is carried out from the sheet cassette C1 by the robot arm 11A and aligned on the alignment stage 3, the arm frame 76 is carried out by the robot arm 76 and placed on the frame holding platform 77 at the tape attaching position. .
對位完畢的晶圓W利用機器手臂11A交接給保持平台37，就如第21圖所示，利用貼附單元5遍及環狀框架f與下殼體33B之接合部70貼附黏著帶DT。此時，晶圓W的表面與黏著帶DT的黏著面係以預先決定的間隙接近對向。再者，第21圖係使記載於左側的下殼體33B側旋轉90度而記載，以便容易理解貼附單元5的帶貼附動作。 The wafer W that has been aligned is transferred to the holding platform 37 by the robot arm 11A, and as shown in Fig. 21, the adhesive tape DT is attached to the joint portion 70 of the annular frame f and the lower casing 33B by the attaching unit 5. At this time, the adhesion surface of the surface of the wafer W and the adhesive tape DT approaches the opposite direction with a predetermined gap. In addition, the 21st drawing is described by rotating the side of the lower case 33B described on the left side by 90 degrees, and it is easy to understand the tape attaching operation of the attaching unit 5.
貼附單元5到達貼附終端位置，就利用切斷單元23切斷黏著帶DT。此時，切斷後的黏著帶DT之後端從環狀框架f露出預定長度。 When the attaching unit 5 reaches the attaching terminal position, the adhesive tape DT is cut by the cutting unit 23. At this time, the rear end of the cut adhesive tape DT is exposed from the annular frame f by a predetermined length.
使旋轉驅動機34動作而使下殼體33B旋轉移動到上殼體33A的下方。此時，安裝於旋轉臂36另一端側 的下殼體33C移動到帶貼附位置。 The rotation driver 34 is operated to rotationally move the lower casing 33B below the upper casing 33A. At this time, it is attached to the other end side of the rotating arm 36. The lower case 33C is moved to the tape attachment position.
如第22圖所示，使上殼體33A下降，和下殼體33B夾住黏著帶DT而形成腔室7。 As shown in Fig. 22, the upper casing 33A is lowered, and the lower casing 33B is sandwiched by the adhesive tape DT to form the chamber 7.
控制部60調整上殼體33A與下殼體33B之兩空間的氣壓而將黏著帶DT貼附於晶圓W上。其後，使下殼體33B內的氣壓和上殼體33A內的氣壓相同。隨著此氣壓調整，使保持平台37上升而使環狀框架f的表面和晶圓W的上面成為相同的高度。 The control unit 60 adjusts the air pressure in the two spaces of the upper casing 33A and the lower casing 33B to attach the adhesive tape DT to the wafer W. Thereafter, the air pressure in the lower casing 33B is made the same as the air pressure in the upper casing 33A. As the air pressure is adjusted, the holding platform 37 is raised to make the surface of the annular frame f and the upper surface of the wafer W the same height.
如第23圖所示，使由加熱器63加熱的加壓構件61下降到預先決定的高度，將黏著帶PT之全面邊加熱預定時間邊加壓。此高度係依照黏著帶PT的厚度、晶圓W上凸塊的高度等，設定於包含該凸塊在內的電路不破損的高度。 As shown in Fig. 23, the pressing member 61 heated by the heater 63 is lowered to a predetermined height, and the entire surface of the adhesive tape PT is heated while being heated for a predetermined period of time. This height is set to a height at which the circuit including the bump is not damaged in accordance with the thickness of the adhesive tape PT, the height of the bump on the wafer W, and the like.
再者，於在腔室7內進行黏著帶DT的貼附處理及加壓處理之間，切斷單元78動作。此時，刀具85將貼附於環狀框架f上的黏著帶DT切斷成環狀框架f的形狀，並且按壓輥87跟著刀具85，一面在環狀框架f上的帶切斷部位轉動，一面逐漸按壓。即，利用下降的上殼體33A與下殼體33B構成腔室7時，切斷單元78之刀具85與按壓輥87也到達切斷作用位置。 Further, the cutting unit 78 operates between the attaching process and the pressurizing process of the adhesive tape DT in the chamber 7. At this time, the cutter 85 cuts the adhesive tape DT attached to the annular frame f into the shape of the annular frame f, and the pressing roller 87 follows the cutter 85 and rotates on the belt cut portion on the annular frame f. Gradually press on one side. That is, when the chamber 7 is formed by the lowered upper casing 33A and the lower casing 33B, the cutter 85 and the pressing roller 87 of the cutting unit 78 also reach the cutting operation position.
加壓處理完畢，如第24圖所示，控制部60就使上殼體33A上升而將上殼體33A內進行大氣開放，並且使電磁閥54全開而下殼體33B側也進行大氣開放。 When the pressurization process is completed, as shown in Fig. 24, the control unit 60 raises the upper casing 33A, opens the atmosphere in the upper casing 33A, and opens the electromagnetic valve 54 and the lower casing 33B side to open the atmosphere.
再者，於在腔室7內將黏著帶PT貼附於晶圓W上之間，利用機器手臂11A、76將晶圓W與環狀框架f載 置於在帶貼附位置的下殼體33C與框架保持平台77上，進行黏著帶DT的貼附處理。 Further, the adhesive tape PT is attached to the wafer W in the chamber 7, and the wafer W and the ring frame f are carried by the robot arms 11A and 76. The lower casing 33C placed on the tape attaching position and the frame holding platform 77 are attached to the adhesive tape DT.
在腔室7內的黏著帶貼附於晶圓W上的處理與加壓處理、及貼附單元5的黏著帶PT貼附於下殼體33C上的處理完畢，就使旋轉臂36反轉。 The processing of the adhesive tape attached to the wafer W in the chamber 7 and the pressure treatment, and the adhesion of the adhesive tape PT of the attaching unit 5 to the lower casing 33C are completed, and the rotating arm 36 is reversed. .
使剝離單元9移動到剝離開始位置。如第25圖所示，利用固定支承片66和可動片68夾住從環狀框架f露出的黏著帶DT之兩端側。在該狀態向斜上方使其移動預定距離後，一面使其水平移動，一面逐漸剝離切成晶圓形狀的黏著帶PT。 The peeling unit 9 is moved to the peeling start position. As shown in Fig. 25, the both ends of the adhesive tape DT exposed from the annular frame f are sandwiched by the fixed support piece 66 and the movable piece 68. After this state is moved obliquely upward by a predetermined distance, the adhesive tape PT cut into a wafer shape is gradually peeled off while horizontally moving.
剝離單元9到達帶回收部10，就解除黏著帶PT的把持，使黏著帶PT落下到回收容器69內。 When the peeling unit 9 reaches the belt collecting portion 10, the holding of the adhesive tape PT is released, and the adhesive tape PT is dropped into the recovery container 69.
再者，下殼體33B側的黏著帶DT的剝離處理及剝離處理完畢，在進行一體製成有晶圓W與環狀框架f的安裝框架搬出之間，進行下殼體33C側的黏著帶PT貼附於晶圓上的處理、加壓處理及切斷處理。以上，黏著帶T的一輪貼附於晶圓W上的動作結束，以後，反覆進行相同的處理。 Further, the peeling treatment and the peeling treatment of the adhesive tape DT on the lower casing 33B side are completed, and the adhesive tape on the lower casing 33C side is carried out between the mounting frame in which the wafer W and the annular frame f are integrally formed. The PT is attached to the wafer for processing, pressurization, and cutting. As described above, the operation of attaching the adhesive tape T to the wafer W is completed, and thereafter, the same processing is repeated.
藉由該實施例裝置，則即使是在晶圓W的兩面形成有電路的情況，也有效地起作用。即，可將產生於支持用的黏著帶DT之基材面上的凹凸利用加壓機構平坦化。因此，可在將晶圓W保持於平坦的狀態下精度良好地進行切割處理。 According to the apparatus of this embodiment, even when a circuit is formed on both surfaces of the wafer W, it functions effectively. In other words, the unevenness on the surface of the substrate of the adhesive tape DT for support can be flattened by the pressurizing mechanism. Therefore, the dicing process can be performed with high precision while maintaining the wafer W in a flat state.
再者，在該實施例裝置方面，也可以是和主要實施例同樣，將切斷單元78設置於貼附單元5配備的帶 貼附位置側的構造。 Furthermore, in the apparatus of this embodiment, the cutting unit 78 may be provided in the belt provided in the attaching unit 5 as in the main embodiment. Attach the structure on the side of the position.
(2)在上述兩實施例裝置方面，雖然是具備兩台下殼體33B、33C的構造，但也可以是一台。此情況，和上述實施例同樣，下殼體可以利用旋轉臂36使其旋轉移動，也可以構成為沿著直線軌道而使其滑動。 (2) In the apparatus of the above two embodiments, although the two lower casings 33B and 33C are provided, they may be one. In this case, as in the above embodiment, the lower case can be rotationally moved by the rotating arm 36, or it can be configured to slide along the linear track.
(3)在上述實施例中，雖然是在保持平台37與加壓構件61兩方具備加熱器49、63的構造，但也可以是具備於任一方的構造。 (3) In the above embodiment, the heaters 49 and 63 are provided on both the holding platform 37 and the pressing member 61. However, any one of them may be provided.
(4)在上述實施例中，雖然是在片匣C1、C2內收納相同的晶圓W，但也可以將形成有不同電路的晶圓W分開收納於各個片匣C1、C2內。例如，將電路形成面的凹凸小的晶圓W與凹凸大的晶圓W分開收納於片匣內。黏著帶PT及黏著帶DT在兩晶圓W上利用相同的黏著帶。 (4) In the above embodiment, the same wafer W is accommodated in the sheets C1 and C2. However, the wafers W on which the different circuits are formed may be separately housed in the respective sheets C1 and C2. For example, the wafer W having a small unevenness on the circuit formation surface and the wafer W having a large unevenness are separately housed in the wafer cassette. The adhesive tape PT and the adhesive tape DT utilize the same adhesive tape on both wafers W.
此情況，在腔室7內利用差壓將基材堅硬的黏著帶(例如聚對苯二甲酸乙二酯基材)貼附於晶圓W上時，會在貼附於表面凹凸大的晶圓W上的黏著帶表面產生凹凸。在貼附於凹凸小的晶圓上的黏著帶表面則不產生凹凸。 In this case, when the adhesive tape (for example, a polyethylene terephthalate substrate) having a hard substrate is adhered to the wafer W by differential pressure in the chamber 7, the crystal having a large unevenness attached to the surface is attached. The surface of the adhesive tape on the circle W is uneven. No unevenness is formed on the surface of the adhesive tape attached to the wafer having a small unevenness.
因此，對於會在黏著帶表面產生凹凸的晶圓W，可在腔室7內進行加壓處理，對於不會在黏著帶表面產生凹凸的晶圓W，可僅進行利用差壓的帶貼附處理。換言之，可用一台裝置進行黏著帶貼附於不同種類的晶圓W上。 Therefore, the wafer W which has irregularities on the surface of the adhesive tape can be subjected to pressure treatment in the chamber 7, and the wafer W which does not cause irregularities on the surface of the adhesive tape can be attached only to the tape which is subjected to differential pressure. deal with. In other words, the adhesive tape can be attached to different types of wafers W by one device.
此外，也可以在利用差壓的黏著帶貼附處理 後，以感測器測定黏著帶表面的平坦度，依照有無凹凸而進行加壓處理。 In addition, it can also be attached to the adhesive tape using differential pressure. Thereafter, the flatness of the surface of the adhesive tape was measured with a sensor, and pressure treatment was performed in accordance with the presence or absence of unevenness.
本發明可不脫離其思想或本質而用其他的具體形態實施，因此作為顯示發明的範圍者，應參照所附加的申請專利範圍，而非以上的說明。 The present invention may be embodied in other specific forms without departing from the spirit and scope of the invention.
5‧‧‧貼附單元 5‧‧‧ Attachment unit
7‧‧‧腔室 7‧‧‧ chamber
23‧‧‧切斷單元 23‧‧‧cutting unit
33A‧‧‧上殼體 33A‧‧‧Upper casing
33B‧‧‧下殼體 33B‧‧‧ Lower case
33C‧‧‧下殼體 33C‧‧‧ Lower housing
36‧‧‧旋轉臂 36‧‧‧Rotating arm
37‧‧‧保持平台 37‧‧‧Maintaining the platform
61‧‧‧加壓構件 61‧‧‧ Pressurized components
63‧‧‧加熱器 63‧‧‧heater
70‧‧‧接合部 70‧‧‧ joints
s‧‧‧隔片 S‧‧‧ spacer
PT‧‧‧黏著帶 PT‧‧‧ adhesive tape
W‧‧‧晶圓 W‧‧‧ wafer
Claims (15)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012191757A JP5797623B2 (en) | 2012-08-31 | 2012-08-31 | Adhesive tape application method and adhesive tape application device |
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| Publication Number | Publication Date |
|---|---|
| TW201413808A TW201413808A (en) | 2014-04-01 |
| TWI600073B true TWI600073B (en) | 2017-09-21 |
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| TW102130725A TWI600073B (en) | 2012-08-31 | 2013-08-28 | Adhesive tape joining method and adhesive tape joining apparatus |
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| JP (1) | JP5797623B2 (en) |
| KR (1) | KR102146999B1 (en) |
| CN (1) | CN103681228B (en) |
| TW (1) | TWI600073B (en) |
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| JP2017050388A (en) | 2015-09-01 | 2017-03-09 | 日東電工株式会社 | Protective tape sticking method and protective tape sticking device |
| JP6918563B2 (en) * | 2017-02-23 | 2021-08-11 | 日東電工株式会社 | Adhesive tape application method and adhesive tape application device |
| CN108470692B (en) * | 2017-02-23 | 2023-08-18 | 日东电工株式会社 | Adhesive tape joining method and adhesive tape joining apparatus |
| JP6999322B2 (en) * | 2017-07-31 | 2022-01-18 | 株式会社ディスコ | Wafer grinding method |
| KR102541179B1 (en) * | 2018-04-24 | 2023-06-12 | 디스코 하이테크 유럽 게엠베하 | Apparatus and method for attaching protective tape on semiconductor wafers |
| JP7109244B2 (en) * | 2018-04-25 | 2022-07-29 | 日東電工株式会社 | Adhesive Tape Conveying Method and Adhesive Tape Conveying Device |
| CN110610888B (en) * | 2019-09-27 | 2023-06-16 | 江西兆驰半导体有限公司 | Automatic laminating fixing device of wafer |
| CN111489988A (en) * | 2020-03-27 | 2020-08-04 | 南通通富微电子有限公司 | Wafer transfer device |
| CN112687599B (en) * | 2020-12-24 | 2023-08-04 | 宁波凯驰胶带有限公司 | Flat belt for chip cutting and mounting structure thereof |
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| JP4371890B2 (en) * | 2004-04-14 | 2009-11-25 | リンテック株式会社 | Pasting device and pasting method |
| JP2006187862A (en) * | 2006-03-07 | 2006-07-20 | Lintec Corp | Cutting apparatus and cutting method |
| JP2008066684A (en) * | 2006-09-08 | 2008-03-21 | Takatori Corp | Device for mounting substrate to dicing frame |
| JP4773419B2 (en) * | 2007-12-20 | 2011-09-14 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP2009194064A (en) * | 2008-02-13 | 2009-08-27 | Takatori Corp | Apparatus and method for sticking adhesive film to substrate |
| JP5216472B2 (en) | 2008-08-12 | 2013-06-19 | 日東電工株式会社 | Method and apparatus for attaching protective tape to semiconductor wafer |
| JP2010141254A (en) * | 2008-12-15 | 2010-06-24 | Tokyo Electron Ltd | Treatment device for treating object |
| JP5417131B2 (en) * | 2009-11-20 | 2014-02-12 | 日東電工株式会社 | Adhesive tape attaching apparatus and adhesive tape attaching method |
| JP5626782B2 (en) * | 2010-09-13 | 2014-11-19 | リンテック株式会社 | Sheet pasting device |
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2012
- 2012-08-31 JP JP2012191757A patent/JP5797623B2/en active Active
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2013
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- 2013-08-29 CN CN201310385311.XA patent/CN103681228B/en not_active Expired - Fee Related
- 2013-08-30 KR KR1020130103619A patent/KR102146999B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN103681228B (en) | 2017-11-03 |
| CN103681228A (en) | 2014-03-26 |
| JP5797623B2 (en) | 2015-10-21 |
| KR20140029312A (en) | 2014-03-10 |
| TW201413808A (en) | 2014-04-01 |
| KR102146999B1 (en) | 2020-08-21 |
| JP2014049626A (en) | 2014-03-17 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |