JP2010141254A - Treatment device for treating object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment device for treating a treatment object in a treatment vessel while rotating the treatment object. <P>SOLUTION: A substrate treatment device 10 includes: a treatment vessel 100 for treating a substrate G in its inside using a treatment source 155; a plurality of valves V installed on a wall part of the treatment vessel 100 for carrying the substrate G in the inside of the treatment vessel or carrying it out of the inside of the treatment vessel; a plurality of stages 110a, 110b arranged in point symmetry around a center axis O in the vertical direction with respect to the bottom face of the treatment vessel 100 and rotatable around the center axis O in the treatment vessel; and a stage support member 115 for supporting the plurality of stages 110a, 110b and rotating any other stage out of the plurality of stages 110a, 110b to the vicinity of any other valve V out of the plurality of valves V in accordance with timing for rotating any stage out of the plurality of stages 110a, 110b to the vicinity of a transport opening of any valve out of the plurality of valves. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an apparatus for processing an object to be processed in a processing container, and more particularly to an apparatus for processing an object to be processed while moving the object in the processing container.

  2. Description of the Related Art Conventionally, processing apparatuses that perform microfabrication such as film formation and sputtering on an object to be processed inside a processing container are known. The processing apparatus is used for manufacturing a semiconductor or FPD (Flat Panel Display). The processing apparatus normally performs processing such as film formation on the target object on the stage while maintaining the inside of the processing container in a desired vacuum state. Among such processing apparatuses for processing objects, there has been proposed a processing apparatus that performs a desired process on a processing object while moving the processing object inside a vacuum processing container (for example, Patent Document 1). reference).

  In order to realize an apparatus that performs processing while moving an object to be processed as described above, it is necessary to provide, for example, a drive mechanism for moving a stage in a processing container maintained in a vacuum. In addition to this, a guide mechanism for guiding the moving stage and a mechanism for supplying power such as electricity and refrigerant to the stage are also required.

International Opening No. 2008/066103 Pamphlet

  However, if a drive mechanism such as a ball screw is provided in the processing container in a vacuum state, it is necessary to use grease in the vacuum region, which may cause a problem of dust and contamination in the processing container. On the other hand, it is also conceivable to use a non-contact drive source such as a vacuum linear motor that does not require grease. However, in this case, since it is necessary to provide a vacuum partition between the mover and the stator, the space between the mover and the stator must be increased, thereby reducing the thrust for moving the vacuum linear motor forward. Occurs. In addition, when an aluminum vacuum partition made of, for example, aluminum is used between the mover and the stator, eddy current loss occurs, and this also reduces thrust. Thus, when the linear motor is made into a vacuum specification, the factor of reducing the thrust increases, so it is necessary to select an unnecessarily high output linear motor. If a non-contact drive source such as a vacuum linear motor is used, many problems remain, such as heat generation and high cost.

  There is also a problem in providing a guide (guide) mechanism for linearly transporting the stage in a vacuum. For example, when a linear guide is used as the guide mechanism, it is necessary to use grease in the vacuum apparatus, and there is a concern about dust and contamination in the processing container as described above. On the other hand, although a solid lubricating film that does not require grease has been developed, there are problems in that dust is generated in the processing container and the life is short. It is conceivable to use a non-contact guide mechanism such as a magnetic levitation guide.

  There is also a problem in providing a mechanism for supplying a working force (liquid, gas, power) to the stage in a vacuum. For example, when a bellows is used as a power supply mechanism, the vacuum characteristics are not good because the area exposed to vacuum is relatively large and the amount of outgas is large. In the case of a film forming process, the reaction product is deposited on the surface of the bellows. At that time, there is a concern that dust is wound up because of the bellows structure called bellows shape to perform the expansion and contraction operation. Moreover, if a bellows is used, the apparatus will be enlarged. On the other hand, it is conceivable to use a mechanism having a joint such as a duct arm to supply power, but there is a concern about dust problems due to the operation of the duct arm, and the problem of increasing the size of the apparatus cannot be solved. .

  Further, in the case of so-called sink production, the stage places the object to be processed at one end of the processing container and moves to the other end of the processing container. During the movement, a desired process is performed on the object to be processed. However, in this case, after the workpiece is unloaded at the other end, the stage must be returned to the loading position of the workpiece to place the workpiece to be loaded next. Since this return operation is a very useless operation considering the tact time, it is desired to shorten the return time of the stage as much as possible by moving the stage as fast as possible. However, there is a possibility that dust is wound up in the vacuum processing container due to the high-speed movement of the stage. In addition, the maximum output necessary for a driving unit such as a motor for moving the stage is determined by the moving speed required for the stage return operation. Therefore, increasing the maximum output of the drive unit to obtain high speed is disadvantageous in terms of power consumption, drive unit size, and cost, while reducing the maximum output of the drive unit increases the stage return time. As a result, the problem of reduced productivity arises.

  Therefore, in order to solve the above-described problems, the present invention provides a processing apparatus that performs processing while rotating an object to be processed in a processing container.

  That is, in order to solve the above-described problems, according to an aspect of the present invention, a processing container having a processing source and processing an object to be processed inside using the processing source, and a wall portion of the processing container A plurality of transfer ports for carrying in or out the object to be processed into the processing container, and a point-symmetric arrangement with respect to a central axis in a vertical direction with respect to the bottom surface of the processing container. A plurality of stages that can rotate around the central axis in the processing container, and support the plurality of stages, in addition to the timing of rotating any of the stages to the vicinity of any of the conveyance ports, There is provided a processing apparatus for an object to be processed, including a stage support member that rotates any one stage to the vicinity of any other conveyance port.

  According to this configuration, the plurality of stages are arranged symmetrically in a point-and-point manner around the central axis in the vertical direction with respect to the bottom surface of the processing container, and rotate around the central axis. According to this, in accordance with the timing at which one of the stages rotates to the vicinity of one of the conveyance ports, any one of the other stages is rotated to the vicinity of any one of the other conveyance ports.

  For example, when two stages are arranged in a straight line with the central axis as the center, and two transfer ports are provided opposite to the side wall of a cylindrical vacuum processing vessel, the object to be processed carried in from one transfer port While the body is placed on one stage and the stage is half-rotated and moved to the other transport port, the other stage located near the other transport port is half-rotated and Move to the transfer port. According to this, each stage returns to a position where one of the stages carries the next object to be processed. Therefore, even in the case of so-called sink production, there is no need to separately return the stage from the carry-out port to the carry-in port at a high speed. For this reason, the tact time can be greatly shortened, and there is no fear of winding up dust during the stage return operation. Furthermore, since the load fluctuation is small due to the low-speed rotational movement using the rotating mechanism with a simple structure of the simple structure, it becomes easy to control the entire processing apparatus.

  The processing source may process an object to be processed placed on any one of the stages while the stage is rotating.

  A plurality of the processing sources may be provided across each stage, and different objects to be processed placed on different rotating stages may be processed in parallel.

  A plurality of the processing sources may be provided side by side, and the target object placed on the rotating stage may be continuously processed.

  You may have the exhaust apparatus which exhausts the inside of the said processing container, and the sealing member which interrupts | blocks the inside of the said processing container, and the inside of the said stage and the said stage support member.

  Wiring for power supply may be provided inside the stage and the stage support member.

  A pipe for supplying a refrigerant may be provided inside the stage and the stage support member.

  The stage support member includes a rod that supports the plurality of stages, a rotating portion that rotates together with the plurality of stages and the rod, and a fixing portion that rotatably fixes the rotating portion, and the rotating portion and the fixing A rotary vacuum seal may be provided between the parts.

  The processing source may have a processing gas blowing port that opens while expanding from the inside to the outside of the processing container.

  Power is supplied to the rotation mechanism and the rotation mechanism for rotating the direction of the mounting surface of the stage toward the outside or the inside of the processing container, at least on the stage on which the object to be processed is placed among the plurality of stages. An actuator may be provided.

  The processing source may be disposed on the outer wall side of the processing container.

  The processing container may be configured in an annular shape, and the processing source may be disposed on the inner wall side of the processing container.

  The plurality of stages, the plurality of transport ports, and the plurality of processing sources may be arranged point-symmetrically about the central axis.

  The plurality of stages, the plurality of transport ports, and the plurality of processing sources may be arranged in the same number symmetrically with respect to the central axis.

  As described above, according to the present invention, it is not necessary to return the stage at high speed even in the case of so-called sink production, and the tact time can be shortened. Further, it is possible to control the processing apparatus easily and stably by reducing the load fluctuation when the stage is moved.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to the constituent elements having the same configuration and function, and redundant description is omitted.

The following description will be given in the following order.
1. First Embodiment (Vacuum Rotation Transport: Face / Up)
2. Second Embodiment (Vacuum Rotation Transport: Face / Outside)
3. Modified example of the second embodiment (vacuum rotation conveyance: face / inside)

<First Embodiment>
[Substrate processing system]
First, a substrate processing system according to a first embodiment of the present invention will be described with reference to the schematic configuration diagram shown in FIG. The substrate processing system Sys according to the present embodiment performs so-called sink production in which a substrate is loaded from one end of the processing container, the substrate is processed while being moved in the processing container, and the processed substrate is unloaded from the other end. Execute. In the substrate processing system Sys, the process chambers PC1, 2, 3 are arranged on a straight line with the transfer chambers TC1, 2 interposed therebetween. The process chambers PC1, 2, 3 and the transfer chambers TC1, 2 are connected to each other by a valve V so that the inside of the chamber is maintained at a desired degree of vacuum. In the process chambers PC1, 2, and 3, for example, cleaning processing, vapor deposition processing, and sputtering processing are performed. However, the above process is an example of a substrate process that can be executed in each process chamber. For example, an annealing process, a film forming process, or the like can be executed. The transfer chambers TC1 and TC2 carry the substrate processed in the previous process chamber to the next process chamber while being held by an arm (not shown) while maintaining a vacuum state.

[Substrate processing equipment]
Next, the substrate processing apparatus will be described with reference to FIGS. FIG. 2 is a view (2-2 sectional view of FIG. 3) of the substrate processing apparatus 10 cut in the vertical direction with respect to the ground plane. FIG. 3 shows the substrate processing apparatus 10 in the horizontal direction with respect to the ground plane. It is the figure (1-1 sectional drawing of FIG. 2) cut | disconnected.

  As shown in FIG. 3A, the substrate processing apparatus 10 includes a processing container 100 whose outer wall portion in the cross section is an octagonal prism. The processing container 100 is made of aluminum or stainless steel. As shown in FIG. 2, the inside of the processing vessel 100 is a cylindrical space, and an exhaust device 105 such as a turbo molecular pump TMP (Turbo Molecular Pump) or a dry pump (Dry Pump) provided outside. The desired vacuum state is maintained by evacuating at.

  Inside the processing container 100, two stages 110 a and 110 b are provided to face the bottom surface of the processing container 100 with a central axis O in the vertical direction as a center. In the present embodiment, the substrate G is placed only on the stage 110a, but the substrate G may be placed on both the stages 110a and 110b. The stages 110a and 110b are hollow and are made of aluminum or stainless steel.

  The stage support member 115 includes a rod 115a, a rotating portion 115b, and a fixed portion 115c, whereby the stage supporting member 115 is rotated while supporting the stages 110a and 110b. Specifically, the rod 115a is a hollow rod-like member, and supports the stages 110a and 110b at both ends in the longitudinal direction. The internal space of the rod 115a communicates with the internal space of the stages 110a and 110b. This communicating internal space is filled with air, and as will be described in detail later, wiring and piping for supplying utility force to this internal space are arranged.

  The rotating part 115b is fixed to the rod 115a at the center lower part of the rod 115a. The fixing portion 115c is provided around the rotating portion 115b, and rotatably supports the rotating portion 115b and the rod 115a.

  A rotating vacuum seal 120 is interposed on the contact surface between the rotating part 115b and the fixed part 115c. The rotary vacuum seal 120 is interposed between the rotating part 115b and the fixed part 115c in a state where the rotary vacuum seal 120 is suppressed from above by an annular pressing member 125. For the rotary vacuum seal 120, for example, a sliding seal member (O-type seal member, C-type seal member) having high wear resistance such as Rotobari seal (registered trademark) is used to rotate the rotating portion 115b with low friction. be able to.

  A magnetic fluid seal can also be used for the rotary vacuum seal 120. The magnetic fluid in the magnetic fluid seal is a magnetic colloid solution composed of ferromagnetic fine particles, a surfactant covering the surface, and a base solution. The ferromagnetic fine particles in the magnetic fluid are composed of the surfactant and the base. A stable dispersion state can be maintained without agglomeration or settling in the base liquid due to the affinity of the liquid and the repulsive force between the surfactants. Thereby, the rotating part 115b can be rotated with low friction. In this way, the rotating part 115b and the fixed part 115c can function as a magnetic fluid unit.

  Seal members 130 and 135 such as an O-ring and a C-ring are provided on the contact surface between the rod 115a and the rotating portion 115b and the contact surface between the fixed portion 115c and the processing container 100. The seal member 130 blocks the inside of the processing container 100 from the space inside the stage and the rod. The seal member 135 blocks the inside and the outside of the processing container 100. As a result, the inside of the processing container is cut off from the atmosphere inside the stage and the atmosphere outside the processing container, and is maintained in a desired vacuum state. In addition, a bearing 140 is provided on a contact surface between the rotating portion 115b and the fixed portion 115c and on a surface on the atmosphere side. The bearing 140 serves as a bearing for the rotating part 115b and functions to rotate the rotating part 115b accurately and smoothly. The fixing portion 115 c is fixed to the bottom surface of the processing container 100 by a plurality of screws 145. The rod 115a, the rotating part 115b, and the fixed part 115c are made of, for example, aluminum, an aluminum alloy, aluminum spray, or stainless steel (SUS). The surfaces of the stages 110a and 110b and the rod 115a may be blasted. Further, an adhesion plate (not shown) may be provided in the vicinity of the surface and in the vicinity of the inner wall of the processing container 100, and the generation of dust in the processing container may be prevented by replacing the adhesion protection plate as needed.

  The rotating part 115b is driven by a rotating motor 150 provided on the atmosphere side of the processing container. As an example of the rotary motor 150, a commercially available servo motor or stepping motor can be used. Thereby, the rotating part 115b, the rod 115a, and the stages 110a and 110b rotate integrally around the central axis O while being supported by the fixing part 115c in a stubborn manner. Thereby, the stages 110a and 110b can be rotated with a simple mechanism in a balanced manner.

  A mechanism for supplying power to the stages 110a and 110b will be described. A space opened to the atmosphere inside the stages 110a and 110b and the rod 115a is used for supplying the utility force. In the present embodiment, a rotary connector 165a is provided in the rotating portion 115b. The power distribution wiring 165 is a bundle of a plurality of wires, connected to the electrostatic chuck 170 in the atmospheric region in the stages 110a and 110b, and inserted and penetrated through the rotatable flange 165a1 above the rotary connector. . Further, the distribution wiring 165 is connected to the high-voltage DC power supply 160 on the outside. As a result, the DC voltage output from the high-voltage DC power supply 160 is supplied from the distribution wiring 165 to the electrostatic chuck 170. As a result, the substrate G can be electrostatically attracted to the stages 110a and 110b.

  At that time, the rotary connector 165a prevents the wiring from being entangled by the rotation of the rotating portion 115b. In the above description, the electrostatic chuck has been described as an example. However, the present invention is not limited to this. For example, the above mechanism is used for the power of the stages 110a and 110b such as heating a heater (not shown) provided in the stages 110a and 110b. Can be used for supply.

  A rotary joint 175a is also provided inside the rotating part 115b. The rotation axes (center axis O) of the rotating unit 115b, the rotating motor 150, the rotary connector 165a, and the rotary joint 175a are coaxial. The Galden pipe 175 is disposed in the stages 110a and 110b in the atmospheric space inside the stages 110a and 110b, and is inserted into and penetrates through the rotatable flange 175a1 above the rotary joint 175a. The Galden pipe 175 is connected to the refrigerant supply source 180 on the outside. Thus, the refrigerant supplied from the refrigerant supply source 180 is passed through the inner pipe of the Galden pipe 175 and supplied toward the stage. Absorb heat in the stage.

  The rotary joint 175a prevents the tube from being distorted by the rotation of the rotating part 115b. A rotation stopper 185 for stopping the rotation of the rotary connector 165a and the rotary joint 175a is provided under the rotary connector 165a.

[Vacuum rotation conveyance]
Next, the vacuum rotation conveyance according to the present embodiment will be described. As shown in FIG. 3A, valves V <b> 1 and V <b> 2 are provided at positions facing the side wall of the processing container 100. The valves V <b> 1 and V <b> 2 are an example of a transfer port that carries the substrate G into the processing container or carries the substrate G out of the processing container. When processing the substrate G, first, the valve V1 is opened, the substrate G is loaded and placed on the stage 110a, and then the rotation motor 150 is driven to rotate the stages 110a and 110b halfway. The substrate G is processed by the processing gas introduced from the processing source 155 provided on the ceiling surface of the processing container 100 while rotating. After half rotation, the substrate G placed on the stage 110a is unloaded from the valve V2. The next substrate G is placed on the rotary stage 210b, and the above vacuum rotation operation is repeated.

  In this vacuum rotation operation, since the stage 110a and the stage 110b are in a straight line, when the stage 110a is rotated from the valve V1 side to the valve V2 side, the opposite stage 110b is simultaneously moved from the valve V2 side to the valve V1 side. Rotate until. Therefore, the stage 110b may be used for processing the next substrate G, and the returning operation of the stage 110a is not necessary for processing the next substrate G.

  In the case of so-called sink production, in the conventional vacuum linear conveyance shown in FIG. 12, the substrate G carried from the carry-in port V1 is placed on the stage 910 and processed while being vacuum-linearly conveyed to the opposite side of the processing container. Processed by the source 955 and unloaded from the unloading port V2. In this case, after carrying out, the operation | movement which returns the stage 910 to the carrying-in entrance V1 is needed. Therefore, in conventional vacuum linear conveyance, the takt time becomes long, the operation of winding up dust frequently occurs, or the rotation operation with a large output has to be used to shorten the takt time by speeding up the returning operation. Problems arise.

  On the other hand, according to the vacuum rotation conveyance according to the present embodiment, as described above, there is no need to return the stage from the carry-out port to the carry-in port at high speed. However, the tact time can be greatly shortened and the cost is reduced. In addition, there is no fear of winding up dust when the stage is returned at high speed. In addition, the low-speed vacuum rotation conveyance using a rotating mechanism with a simple structure of a simple structure makes it easy to control the entire processing apparatus because the load fluctuation is small.

  However, in the vacuum rotation transfer according to the present embodiment, when the stage 110a passes below the processing source 155, the moving speed increases as the distance from the rotation center of the stage 110a increases. For example, in the case of the film forming process, the outer moving speed is faster than the inner moving speed even if the angular velocity ω is the same, so that a film thinner than the inner film is formed on the outer side. Therefore, in order to eliminate this, in this embodiment, as shown in FIG. 4A, the shape of the blowout port Op provided in the processing source 155 is set to the outside when the processing container 100 is installed. A trapezoidal shape in which the part to be opened is wider than the part to be inside. Thereby, in-plane uniformity of substrate processing can be achieved.

  As shown in FIG. 4B, the outlet may be formed in a trapezoidal shape by a large number of pores Ho. Also in this case, by increasing the number of outer pores Ho having a large moving speed even when the angular velocity ω is the same as the number of inner pores Ho having a small moving speed, the unevenness of film formation is eliminated, and the substrate In-plane uniformity of processing can be achieved.

  In the above, as shown in FIG. 3A, one processing source 155 is provided on the ceiling surface of the processing container 100, and one substrate G is processed by the one processing source 155 while the stage is half-rotated. Explained when to do. However, the substrate processing apparatus 10 according to the present embodiment can perform the parallel processing shown in FIG. 3B, the continuous processing shown in FIG.

  Specifically, in FIG. 3B, two processing sources 155a and 155b are connected to the stage 110a. It arrange | positions in the position which mutually opposed on both sides of 11b. As a result, the substrate G on the stage 110a that rotates and moves below the processing source 155a is processed while each stage rotates halfway, and at the same time, the substrate G on the stage 110b that rotates and moves below the processing source 155b. It is processed. As a result, approximately twice as much processing as in the case of FIG. 3A in which one processing source is provided can be performed.

  As a specific example of such parallel processing, for example, the substrate 110 on the stage 110a is formed by vapor deposition using the processing source 155a by rotating the stage 110a halfway, and the deposit attached to the stage 110b at the same time is treated as the processing source. A cleaning method using 155b may be mentioned. In this case, four exhaust devices 105 may be arranged on both sides of the processing sources 155a and 155b to effectively prevent the occurrence of cross contamination.

  In FIG. 3C, two processing sources 155a and 155b are arranged side by side. Thus, while the stage 110a is rotated halfway, the substrate G is first processed by the processing source 155a and further processed continuously by the processing source 155b. As a result, approximately twice as much processing as in the case of FIG. 3A in which one processing source is provided can be performed.

  As a specific example of such continuous processing, for example, first, a work function layer containing lithium is vapor-deposited on the organic film of the substrate G using the processing source 155a, and silver is further formed thereon using the processing source 155b. It is also preferable to form the cathode layer by sputtering. In this case, three or four exhaust devices 105 may be arranged on both sides of the processing sources 155a and 155b to effectively prevent the occurrence of cross contamination.

  As described above, according to the substrate processing apparatus 10 according to the present embodiment, the two stages 110a and 110b are provided in a straight line in the processing container, and the substrate G is processed while rotating. According to this, the other stage 110b is rotated to the vicinity of the other conveyance port (valve V1) at the timing when the one stage 110a rotates to the vicinity of the one conveyance port (valve V2). Thereby, the board | substrate G can be simultaneously carried in and taken out from the conveyance opening (valve V1, V2) provided in the position which opposes. Therefore, even in the case of so-called sink production, it is not necessary to return the stage at high speed, and the tact time can be greatly shortened. In addition, there is no fear of winding up dust during the stage return operation. Furthermore, since the load fluctuation is small due to the low-speed vacuum rotation transfer using a rotating mechanism with a simple structure of a simple structure, it is easy to control the entire processing apparatus. Furthermore, since the force is supplied to the stages 110a and 110b using the internal space of the stages 110a and 110b and the stage support member 115, it is not necessary to use a joint such as a duct arm, and the entire apparatus can be made compact. it can. In addition, in the case of power supply using a duct arm, it is necessary to use a plurality of rotary vacuum seals such as magnetic fluid seals for each joint, and the rotary vacuum seals must be replaced every time they deteriorate. Since only one rotary vacuum seal is sufficient, the number of parts and the number of replacements can be reduced, and the cost is reduced. Furthermore, in contrast to vacuum linear conveyance in which the rotation motor must be placed in a vacuum, in this embodiment, the rotation motor 150 can be placed in the atmosphere, and a return operation is unnecessary, so that a motor with a large output can be collected. Cost is reduced.

<Second Embodiment>
Next, a substrate processing apparatus 10 according to a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the substrate G is placed in that the substrate G is processed by a processing source provided on the outer wall side of the processing container 100 while the mounting surface of the substrate G faces the outer wall side of the processing container 100. This is different from the first embodiment in which the substrate G is processed by a processing source provided on the ceiling surface of the processing container 100 with the surface facing the ceiling surface of the processing container 100. Therefore, the second embodiment will be described focusing on this difference.

  As shown in FIG. 5, in this embodiment, the rotary stages 210 a and 210 b are supported to be rotatable with respect to the stage support member 115. In other words, the rotary stages 210a and 210b are rotatably supported toward the outer side or the inner side of the processing container by the rotary support members 115d fixed to both ends of the side portions in the longitudinal direction of the stage support member 115.

  The rotation function of the rotary stage 210a will be specifically described with reference to FIG. The rotary stage 210a is rotatably fixed from both sides of the rotary stage 210a by the rotation support members 115d on both sides with bearings 215 and 220 as bearings. The rotation stage 210a is hollow like the first embodiment, and a rotation motor 225 is installed in the internal space. One of the rotation motors 225 is fixed to one rotation support member 115d by a fixed shaft 230a. The other of the rotation motors 225 is rotatably fixed to the other rotation support member 115d2 by a rotation shaft 230b and a receiving shaft 230c. The rotating shaft 230b is fixed to the rotating stage 210a by a fixing member 230b1. When the rotation motor 225 is driven, the rotation shaft 230b rotates, and the rotation stage 210a fixed to the rotation shaft 230b rotates toward the outside or the inside of the processing container 100 by the rotation of the rotation shaft 230b.

  Rotating vacuum seals 235 and 240 are interposed on the contact surface between the rotating stage 210a and the rotating support members 115d on both sides thereof. The rotary vacuum seals 235 and 240 rotate the rotary stage 210a with low friction and block the atmosphere inside the rotary stage 210a and the vacuum outside the rotary stage 210a (that is, inside the processing container).

  Note that the engagement structure between the rotary stage 210b and the rotary support member 115d is the same as that of the rotary stage 210a, and thus the description thereof is omitted. Although not shown, also in the case of the present embodiment, as in the first embodiment, wiring for supplying power to the space opened to the atmosphere inside the rotary stages 210a and 210b and Piping is arranged.

  The rotation function of the rotary stage 210a is not limited to the structure shown above, and may be the structure shown in FIG. For example, the rotation stage 210a is rotatably supported by the rotation support member 115d. An actuator 250 is attached to the rotation support member 115d. The actuator 250 includes a rotary motor 250a, a cylinder 250b, a bellows 250c, and a ball screw mechanism 250d. The bellows 250c is fixed to the bottom surface of the rotation stage 210a and the rotation support member 115d between the bottom surface of the rotation stage 210a and the rotation support member 115d.

  When the rotary motor 250a is driven, a rotor (not shown) of the rotary motor 250a rotates, and the rotary motion is converted into a linear motion in the cylinder 250b by the ball screw mechanism 250d. Thereby, the rotary stage 210a is pushed up or pulled down. As a result, the rotation stage 210a can be rotated toward the outside or the inside of the processing container 100. A motor cylinder or an air cylinder may be used instead of the cylinder 250b and the ball screw mechanism 250d.

  As a method for placing the substrate G, the following several methods are given as examples. For example, the substrate G may be electrostatically attracted to the rotary stages 210a and 210b by an electrostatic chuck, or may be mechanically fixed to the rotary stages 210a and 210b by a clamp. A pedestal (not shown) protruding from the mounting surface of the rotary stages 210a and 210b may be provided, and the lower part of the substrate G may be installed on the pedestal so as to fix the substrate G to the rotary stage 210a.

[Vacuum rotation conveyance]
Next, the vacuum rotation conveyance according to the present embodiment will be described with reference to FIG. 5 (a) to FIG. 5 (c) show the cross section 1-1 in the lower figure, and the lower figures in FIG. 5 (a) to FIG. 5 (c) show the 2-2 cross section in the upper figure. Yes.

  In FIG. 5A, valves V <b> 1 and V <b> 2 are provided at positions facing the side wall of the processing container 100. When processing the substrate G, first, the valve V1 is opened to load the substrate G and place it on the rotary stage 210a. Next, the rotation stage 210 a is rotated 90 ° toward the outer wall side of the processing container 100, so that the placement surface of the substrate G faces the outside of the processing container 100.

  In this state, as shown in FIG. 5B, the rotary stages 210a and 210b are rotated halfway. In the present embodiment, three processing sources 155 a, 155 b, and 155 c are vertically arranged side by side on the outer wall side of the processing container 100. The substrate G is continuously processed with various processing gases introduced from the processing sources 155a, 155b, and 155c while the rotary stage 210a rotates.

  After the half rotation, as shown in FIG. 5C, the rotation stage 210 a is rotated 90 ° to return to the original state so that the mounting surface of the rotation stage 210 a faces the ceiling surface of the processing container 100. At the same time that the processed substrate G is unloaded from the valve V2, the next substrate G is placed on the rotary stage 210b, and the above-described vacuum rotation conveyance is repeated.

  As described above, according to the substrate processing apparatus 10 according to the present embodiment, since the substrate G is processed vertically, the problem of the angular velocity described in the first embodiment is solved, and the shape of the outlet Even if it is not optimized in accordance with the angular velocity, in-plane uniformity of substrate processing can be achieved. In addition, since the substrate G is processed in the vertical direction, particles are hardly mixed on the substrate, so that the yield can be improved and the productivity can be increased. Further, since the processing source is provided on the outer wall of the processing container, maintenance is facilitated. In particular, since the substrate processing apparatus 10 is also increased in size with the recent increase in the size of the substrate G, it is more preferable to arrange the processing source on the side wall than to arrange the processing source on the ceiling surface of the processing container 100 when replacing the material. Good access.

<Modification of Second Embodiment>
An outline of a substrate processing apparatus 10 according to a modification of the second embodiment is shown in FIG. The substrate processing apparatus 10 according to this modification is directed to mounting the substrate G in that the substrate G is processed by a processing source provided on the inner wall side of the processing container 100 with the mounting surface of the substrate G facing the inside of the processing container 100. This is different from the second embodiment in which the substrate is processed by the processing source provided on the outer wall side of the processing container 100 with the mounting surface facing the outside of the processing container 100.

  Specifically, as shown in FIG. 8A, the processing container 100 has a donut shape (annular shape) having a penetrating portion exposed to the atmosphere at the center thereof. Six processing sources 155a to 155f are arranged on the inner wall of the processing container 100, and the outlets of the processing sources 155a to 155f are directed to the outside of the processing container.

  In this modification, first, the valves V1 and V2 are opened, the substrate G is loaded, and placed on the rotary stages 210a and 210b. Thereafter, the rotation stages 210a and 210b are rotated 90 ° toward the inside of the processing container 100, and the mounting surface of the substrate G is directed to the inside of the processing container. In this state, the rotary stages 210a and 210b are rotated halfway. Thereby, the substrate G of the rotary stage 210a is continuously processed by various processing gases introduced from the processing sources 155a, 155b, and 155c during the rotation. Further, the substrate G of the rotary stage 210b is continuously processed with various processing gases introduced from the processing sources 155d, 155e, and 155f.

  In the substrate processing apparatus 10 according to this modification, the processing sources 155a to 155f are arranged on the inner wall side of the processing container 100, and the processing gas is blown out toward the outside of the processing container 100 as shown in FIG. Let As described above, the substrate processing apparatus 10 according to the present modification has an advantage that cross-contamination is unlikely to occur because various processing gases are blown radially toward the outside of the processing container 100. Of course, in the case of this modification as well, since the processing is executed with the substrate G held vertically, the in-plane uniformity of the substrate G can be achieved, and the effect that particles are difficult to mix on the substrate can be achieved. .

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  For example, the processing apparatus according to the present invention is not limited to the above-described substrate processing apparatus, and may be a processing apparatus that processes a wafer having a desired diameter.

  Further, the plurality of stages, the plurality of transfer ports, and the plurality of processing sources of the processing apparatus according to the present invention are not limited to two, and may be three or more. At this time, the plurality of stages, the plurality of transport ports, and the plurality of processing sources are arranged point-symmetrically about the central axis O.

  For example, in the substrate processing apparatus 10 shown in FIG. 9, three stages 110a, 110b, and 110c, three valves V1, V2, and V3, and three processing sources 155a, 155b, and 155c are points about the central axis of the processing container. The same number is arranged symmetrically. According to this, the substrate G on the stage 110a is loaded from the valve V1, and after being processed by the processing source 155a while being rotated by 120 ° and then unloaded from the valve V2, the substrate G on the stages 110b and 110c is simultaneously loaded. It is loaded from the valves V2 and V3, processed by the processing sources 155b and 155c, and then unloaded from the valves V3 and V1. According to this, the tact time can be further shortened.

  Similarly, in the substrate processing apparatus 10 shown in FIG. 10, four stages 110a, 110b, 110c, and 110d, four valves V1, V2, V3, and V4, and four processing sources 155a, 155b, 155c, and 155d are point-symmetric. Are arranged in the same number. According to this, the substrate G on the stage 110a is carried in from the valve V1, and after being processed by the processing source 155a while being rotated by 90 ° and then unloaded from the valve V2, at the same time, the substrate on the stages 110b, 110c and 110d. G is loaded from the valves V2, V3, V4, processed by the processing sources 155b, 155c, 155d, and then unloaded from the valves V3, V4, V1. According to this, the tact time can be further shortened.

  In the processing apparatus according to the present invention, for example, as in the substrate processing apparatus 10 shown in FIG. 11, the internal shape of the processing container may be a cylindrical shape provided with a protrusion in the vicinity of the valve V. In this case, the rotation stages 210a and 210b rotate halfway in the processing container while being rotated by 90 °. Thereby, the volume of the processing container 100 can be reduced, and the downsizing of the apparatus and the exhaust efficiency can be increased.

  In the processing apparatus according to the present invention, the rotation angle of the rotary stage is not limited to 90 °, and may be an angle that tilts the mounting surface of the substrate G, for example, 45 °.

  The plurality of stages, the plurality of transport ports, and the plurality of processing sources may not be the same number. For example, of the stages shown in FIG. 9, two stages 110a and 110b may be provided 120 degrees apart from each other with the central axis as the center, and the stage 110c may not exist.

  The substrate G may be placed so that the placement surface faces the bottom surface (face down).

It is a whole block diagram of the substrate processing system concerning the 1st and 2nd embodiment of this invention. It is a longitudinal cross-sectional view of the substrate processing apparatus concerning 1st Embodiment. It is a figure for demonstrating rotation operation | movement of the substrate processing apparatus concerning the embodiment. It is the figure which showed the blower outlet of the processing source concerning the embodiment. It is a figure for demonstrating the block diagram and rotation operation | movement of the substrate processing apparatus concerning 2nd Embodiment. It is the figure which showed the rotation mechanism of the rotation stage. It is another figure which showed the rotation mechanism of the rotation stage. It is a figure for demonstrating the block diagram and rotation operation | movement of the substrate processing apparatus concerning the modification of 2nd Embodiment. It is another example of a substrate processing apparatus. It is another example of a substrate processing apparatus. It is another example of a substrate processing apparatus. It is an example of the conventional vacuum linear conveyance apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 100 Processing container 105 Exhaust apparatus 110a, 110b, 110c Stage 115 Stage support member 115a Rod 115b Rotating part 115c Fixed part 115d, 115d1, 115d2 Rotating support member 120, 235, 240 Rotating vacuum seal 130, 135 Seal member 140 , 215, 220 Bearing 150, 225, 250a Rotary motor 250b Cylinder 250c Bellows 250d Rack and pinion 155, 155a, 155b, 155c, 155d, 155e, 155f Processing source 160 High voltage DC power supply 165 Wiring 165a Rotary connector 175 Double piping 175a Rotary joint 180 Refrigerant supply source 210a, 210b Rotation stage Sys Substrate processing system Op Outlet Ho Pore V, V1, V2, V3, V4 valve

Claims (14)

A processing container having a processing source and processing an object to be processed inside using the processing source;
A plurality of transport ports arranged on the wall of the processing container and carrying the object to be processed into or out of the processing container;
A plurality of stages that are arranged point-symmetrically about a central axis in a vertical direction with respect to a bottom surface of the processing container, and that are rotatable around the central axis in the processing container;
A stage support member that supports the plurality of stages and rotates any one of the stages to the vicinity of any of the other transport ports in conjunction with the timing of rotating any of the stages to the vicinity of any of the transport ports; A processing apparatus for an object to be processed.   The processing object processing apparatus according to claim 1, wherein the processing source processes a target object placed on any one of the stages while the stage is rotating.   The processing apparatus for a target object according to claim 2, wherein a plurality of the processing sources are provided across each stage, and different target objects placed on different rotating stages are processed in parallel.   4. The processing apparatus for a target object according to claim 2, wherein a plurality of the processing sources are provided side by side, and the target object placed on the rotating stage is continuously processed. 5. An exhaust device for exhausting the inside of the processing vessel;
A seal member that shuts off the inside of the processing container and the inside of the stage and the stage support member;
The processing apparatus of the to-be-processed object described in any one of Claims 1-4 provided with the sealing member which interrupts | blocks the inside of the said processing container, and the exterior of the said processing container.   The substrate processing apparatus according to claim 5, wherein power supply wiring is provided inside the stage and the stage support member.   The processing apparatus of the to-be-processed object described in either of Claim 5 or Claim 6 which provides piping for refrigerant | coolant supply inside the said stage and the said stage support member. The stage support member includes a rod that supports the plurality of stages, a rotation unit that rotates together with the plurality of stages and the rod, and a fixing unit that rotatably fixes the rotation unit.
The processing apparatus of the to-be-processed object described in any one of Claims 5-7 in which a rotation vacuum seal is provided between the said rotation part and the said fixing | fixed part.   The processing object processing apparatus according to claim 1, wherein the processing source has a processing gas blowout opening that opens while spreading from the inside to the outside of the processing container.   Power is supplied to the rotation mechanism and the rotation mechanism for rotating the direction of the mounting surface of the stage toward the outside or the inside of the processing container, at least on the stage on which the object to be processed is placed among the plurality of stages. The processing apparatus of the to-be-processed object described in any one of Claims 1-9 provided with the actuator.   The processing object processing apparatus according to claim 10, wherein the processing source is disposed on an outer wall side of the processing container. The processing container is configured in an annular shape,
The processing object processing apparatus according to claim 10, wherein the processing source is disposed on an inner wall side of the processing container.   The processing apparatus for an object to be processed according to claim 3, wherein the plurality of stages, the plurality of transport ports, and the plurality of processing sources are arranged point-symmetrically with respect to the central axis. The processing apparatus for an object to be processed according to claim 13, wherein the same number of the plurality of stages, the plurality of transport ports, and the plurality of processing sources are arranged point-symmetrically about the central axis.

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