CN111489988A - Wafer transfer device - Google Patents
Wafer transfer device Download PDFInfo
- Publication number
- CN111489988A CN111489988A CN202010228364.0A CN202010228364A CN111489988A CN 111489988 A CN111489988 A CN 111489988A CN 202010228364 A CN202010228364 A CN 202010228364A CN 111489988 A CN111489988 A CN 111489988A
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- Prior art keywords
- wafer
- transfer table
- blue film
- transfer
- disc
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- 238000005520 cutting process Methods 0.000 claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000005096 rolling process Methods 0.000 claims description 9
- 239000002699 waste material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000004064 recycling Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000013072 incoming material Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The application discloses wafer transfer equipment includes: a first transfer table; the roller is arranged above the first transfer table disc in a sliding mode, and the blue film cutting assembly is arranged above the first transfer table disc and can be switched between a position close to the first transfer table disc and a position far away from the first transfer table disc to cut the blue film along the contour of the primary ring and the secondary ring; the carrying unit is used for carrying the wafer on the first transfer table disc to the second transfer table disc and pressing the wafer downwards to enable the blue film to be firmly adhered to the wafer; the wafer transfer device provided by the invention has the advantages of simple structure, convenience in operation, stability in device operation, simplicity in maintenance and low cost, during work, the wafer transfer can be completed only by manual feeding and discharging, pure manual operation is replaced, the risk of manual operation is reduced to a great extent, the wafer transfer quality is ensured, and the production efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer transfer device.
Background
The gallium arsenide wafer operation needs to be transferred and pasted on a designated blue film for a wafer mounting process, the coming materials of the gallium arsenide wafer are fixedly protected by a master-slave ring at present, products are ground, cut and pasted on the scribing film, the products only need to be transferred and pasted on the designated blue film for the wafer mounting process, and due to the fact that the transfer device is not available in the industry, the existing mass production products are manually and purely manually transferred and pasted, the action risk is high, accidents such as wafer falling, chip scratching, dispute and collapse are frequently caused, and the product loss is directly caused.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a wafer transfer apparatus.
In a first aspect, the present application discloses a wafer transfer device, comprising:
the first transfer table disc is used for placing a wafer to be subjected to blue film pasting;
the roller is arranged above the first transfer table disc in a sliding mode and used for rolling the blue film to enable the blue film to be adhered to the wafer;
the blue film cutting assembly is arranged above the first transfer table disc, can be switched between a position close to the first transfer table disc and a position far away from the first transfer table disc and is used for cutting the blue film along the contour of a primary-secondary ring for fixing a wafer;
and the conveying unit is used for conveying the wafer on the first transfer table disc to the second transfer table disc and pressing the wafer downwards to enable the blue film to be firmly adhered to the wafer.
Specifically, the raw materials are placed on a first transfer table disc, a blue film is covered on the upper surface of a wafer, the blue film is rolled through a roller to be adhered to the wafer, then the blue film cutting assembly is close to the first transfer table disc, redundant blue films are cut along the outline of a primary ring and a secondary ring, then the blue film cutting assembly is far away from the transfer table, the wafer adhered with the blue film is conveyed to a second transfer table disc through a conveying unit, the wafer is pressed for 5-10 seconds through the conveying unit, the blue film is firmly pasted on the wafer, then the conveying unit is lifted, and the wafer after transfer is taken out manually.
Further, the wafer transfer device further comprises a blue film fixing unit arranged on one side of the first transfer table disc, and the blue film fixing unit comprises a blue film fixing rolling shaft, a waste film recycling shaft and a film penetrating blocking rod which are all parallel to the roller.
Specifically, during operation, the whole roll of blue film is arranged on the blue film fixing rolling shaft, so that the blue film passes through the blue film blocking rod to bypass the upper surface of the first transfer table disc, and then returns to the waste film recycling wheel from the lower surface of the first transfer table disc, and when the transfer operation is performed, the new blue film can be covered on the upper surface of the wafer only by rotating the waste film recycling wheel.
Further, the carrying unit comprises a first sliding assembly capable of sliding along the horizontal direction, a second sliding group connected with the first sliding assembly and a sucker arranged on the second sliding assembly, wherein the second sliding assembly can slide along the vertical direction.
Specifically, the wafer is adsorbed by the sucker, the second sliding assembly rises after the vacuum degree of the sucker reaches-70 Kpa and stops when the vacuum degree of the sucker rises to a specified height, the first sliding assembly works to slide the sucker towards the direction of the second transfer table plate, the second sliding assembly descends when the vacuum degree of the sucker is right above the second transfer table plate, the wafer is placed on the second transfer table plate, a certain force is applied to press the wafer onto the second transfer table plate for 5-10 seconds, the blue film is firmly adhered to the wafer, then the sucker blows in the reverse direction to separate the sucker from the wafer, the second sliding assembly rises, the wafer after transfer is taken out, and in addition, the damage to the wafer caused by overlarge adsorption force can be avoided by adjusting the suction force of the sucker.
Furthermore, the blue film cutting assembly comprises a cover body, a circumferential cutter rotating shaft vertically penetrating through the cover body, and a circumferential cutter fixedly arranged at one end of the circumferential cutter rotating shaft close to the first transfer table disc, wherein the circumferential cutter rotating shaft is rotatably arranged on the cover body, and when the cover body is in a closed position, the circumferential cutter rotating shaft is positioned at the circle center position of the first transfer table disc.
Furthermore, a cutter shaft is fixedly arranged at one end of the circumferential cutter rotating shaft close to the first transfer table disc, the axis of the cutter shaft is perpendicular to the axis of the circumferential cutter rotating shaft, and the circumferential cutter is arranged at least one end of the cutter shaft.
Specifically, the cutting radius of the circumferential cutter is adjusted by adjusting the length of the cutter shaft, the circumferential cutters are arranged at two ends of the cutter shaft, the cutting radii of the circumferential cutters at the two ends are adjusted to be the same, the blue film can be cut circularly by rotating a half circle, the blue film can be cut circularly by adjusting the cutting radii to be different, and in addition, all blue film pitches are cut to be the same size by the circumferential cutters, so that the use of a subsequent process is facilitated.
Preferably, the first transfer table disc and the second transfer table disc are both provided with a plurality of vacuum adsorption holes.
Preferably, the first transfer table is a ceramic table.
Furthermore, first commentaries on classics pastes the platen and the second commentaries on classics pastes the platen all is provided with heating unit, through setting up heating unit, can effectively prevent because of the lower influence to the commentaries on classics quality of temperature.
Further, the rolling device also comprises a transverse cutter arranged on one side of the roller, and the transverse cutter can slide along the axial direction of the roller in parallel.
Furthermore, an ion fan is arranged on one side of the first rotary pasting table plate.
Advantageous effects
The application discloses wafer transfer equipment includes: a first transfer table; the roller is arranged above the first transfer table disc in a sliding mode and used for rolling the blue film to enable the blue film to be adhered to the wafer; the blue film cutting assembly is arranged above the first transfer table disc, can be switched between a position close to the first transfer table disc and a position far away from the first transfer table disc and is used for cutting the blue film along the contour of a primary-secondary ring for fixing a wafer; and the conveying unit is used for conveying the wafer on the first transfer table disc to the second transfer table disc and pressing the wafer downwards to enable the blue film to be firmly adhered to the wafer. The wafer transfer device provided by the invention has the advantages of simple structure, convenience in operation, stability in device operation, simplicity in maintenance and low cost, during work, the wafer transfer can be completed only by manual feeding and discharging, the pure manual operation is replaced, the risk of manual operation is reduced to a great extent, and the production efficiency is greatly improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic overall structure diagram of an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a blue film fixing component according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a blue magic cutting assembly according to an embodiment of the present invention;
FIG. 4 is a schematic view of a connection structure of a cross-cutter and a roller according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a cross-cutter according to an embodiment of the present invention;
FIG. 6 is a schematic view of a connection structure of a circular cutter and a cutter shaft according to an embodiment of the present invention;
fig. 7 is a schematic view of a blue film penetrating direction according to an embodiment of the invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 and 2, the present application discloses a wafer transfer apparatus, including: a first transfer table 60 for placing a wafer to be bonded with a blue film; the roller 40 is arranged above the first transfer table disc 60 in a sliding mode and used for rolling the blue film to enable the blue film to be adhered to the wafer; a blue film cutting assembly 30, wherein the blue film cutting assembly 30 is rotatably arranged above the first transfer table disc 60 through a connecting piece 33, so that the blue film cutting assembly 30 can be switched between a position close to the first transfer table disc 60 and a position far away from the first transfer table disc 30 for cutting the blue film along the contour of the snap ring for fixing the wafer; and a conveying unit 20, wherein the conveying unit 20 is used for conveying the wafer on the first transfer table disc 60 to the second transfer table disc 10 and pressing the wafer downwards to firmly adhere the blue film and the wafer.
Specifically, referring to fig. 1, the wafer transfer process of the wafer transfer apparatus includes opening the blue film cutting assembly 30 upward, rotating the blue film cutting assembly 30 around the connection member 33 away from the first transfer platform 60, placing the incoming material on the first transfer platform disc 60, covering the blue film on the upper surface of the wafer, rolling the blue film by the roller 40 to adhere the blue film to the wafer, then rotating the blue film cutting assembly 30 downward to be close to the first transfer platform 60, cutting the excess blue film along the contour of the primary-secondary ring by using the blue film cutting assembly 30, then rotating the blue film cutting assembly 30 upward away from the first transfer platform 60, transferring the wafer with the blue film adhered thereto to the second transfer platform disc 10 by the transfer unit 20, pressing the wafer for 5-10 seconds by the transfer unit 20 to firmly transfer the blue film onto the wafer, and then lifting the transfer unit 20, and manually taking out the pasted wafer, and repeating the processes to finish the transfer of the next wafer.
As shown in fig. 1, 2 and 7, the wafer transferring apparatus further includes a blue film fixing unit 50 disposed on one side of the first transferring table 60, and the blue film fixing unit 50 includes a blue film fixing roller 51, a waste film recycling shaft 52 and a film passing stopper 53, all of which are disposed parallel to the roller 40.
Specifically, as shown in fig. 7, during operation, the whole roll of blue film is arranged on the blue film fixing roller 51, the tensioning screw 511 is tightened to pass the blue film through the blue film blocking rod 53 to bypass the upper surface of the first transfer table disc 60 and bypass the rotating shaft 54 to return the lower surface of the first transfer table disc 60 to the waste film recovery wheel 52, and when the transfer operation is performed, the waste film recovery wheel 52 is only required to be rotated to cover a new blue film on the upper surface of the wafer.
As shown in fig. 1, the carrying unit 20 includes a first sliding assembly capable of sliding in a horizontal direction, the first sliding assembly includes a guide rail 22 disposed on the frame, a slider 24 in sliding fit with the first sliding assembly, and a cylinder 21 having one end fixedly connected to the frame and the other end fixedly connected to the slider 24, the cylinder 21 has a telescopic direction parallel to the length direction of the guide rail 22, the slider 24 slides back and forth in the horizontal direction by the telescopic action of the cylinder 21, a second sliding assembly 23 is fixedly disposed on the slider 24, the second sliding assembly is a cylinder 23, an annular suction cup 25 is disposed at the end of the cylinder 23, the suction cup is made of an anti-adhesion material, the vacuum degree of the suction cup during operation is-75 Kpa-65 Kpa, the anti-adhesion material is designed to prevent the substrate from being adhered when the wafer is put down, and inaccurate placement of the substrate due to adhesion of the substrate is prevented, the precision of the equipment is improved, the vacuum degree is-75 Kpa-65 Kpa, the quality of the wafer can be effectively ensured, and the wafer cannot be damaged due to overhigh vacuum degree.
As shown in fig. 1, 3, and 6, the blue film cutting assembly 30 includes a cover 31, the cover 31 is hinged to a connector 33, a circumferential knife rotating shaft 34 vertically penetrates through the cover 31, and a circumferential knife 34 fixedly disposed at one end of the circumferential knife rotating shaft 34 close to the first transfer table disk 60, the circumferential knife rotating shaft 34 is rotatably disposed on the cover 31, when the cover 31 is at a closed position, the circumferential knife rotating shaft 34 is located at a circle center position of the first transfer table disk 60, a knife shaft 35 penetrates through the circumferential knife rotating shaft 34, and the circumferential knife is disposed at two ends of the knife shaft 35.
Specifically, when the wafer transfer device works, the blue film is rotated to the position above the first transfer table disc 60, the cover body 31 is covered above the first transfer table disc 60, the handle 36 is manually rotated to enable the circumferential knife 34 to circularly cut the blue film, then the cover body 31 is opened, the cut blue film is taken out, a circular hollow hole is formed in the blue film, the wafer is aligned to the circular hole, the wafer is placed on the first transfer table disc 60, then the blue film fixing unit 50 is rotated to enable a new blue film to cover the upper portion of the wafer, the blue film is pre-adhered to the wafer through the rolling roller 40, the roller 40 is rolled to one side, the cover body 31 is covered, the handle 36 is rotated to circularly cut the blue film, then the cover body 31 is opened, the wafer after the transfer is taken out through the carrying unit 20 and placed on the second transfer table disc 10, and the processes are repeated, so that the transfer of the next product is completed.
Further, as shown in fig. 3 and 6, an arbor 35 is fixedly disposed at one end of the circumferential knife rotating shaft 34 close to the first transferring platform 60, an axis of the arbor 35 is perpendicular to an axis of the arbor rotating shaft 34, and the circumferential knife 37 is disposed at least at one end of the arbor 35.
Specifically, as shown in fig. 6, the cutter shaft 35 is fixedly disposed on a cutter shaft rotating shaft 34, a circumferential cutter seat 36 is disposed at an end of the cutter shaft rotating shaft, and a circumferential cutter 37 is disposed on the circumferential cutter seat 36; the cutting radius of the circumferential cutter 37 is adjusted by adjusting the length of the cutter shaft 35, the circumferential cutters 37 are arranged at both ends of the cutter shaft 35, and the cutting radii of the circumferential cutters 37 at both ends are adjusted to be the same, so that the ring cutting of the blue film can be completed only by rotating a half circle when the blue film is cut, and the ring cutting of the blue film can be performed by adjusting the cutting radii to be different.
As shown in fig. 2, as a preferred embodiment, the first transfer table plate 60 is provided with a plurality of vacuum suction holes 61, and the second transfer table plate 10 is provided with a plurality of vacuum suction through holes (not shown); the adsorption through holes are arranged to adsorb the wafer, the vacuum adsorption holes are used for fixing the wafer, the wafer cannot be damaged, and the adsorption through holes are simple in structure and reliable in fixation.
As a preferred embodiment, the first transferring table 60 is a ceramic table, which has good flatness and is not easy to deform, so that the wafer can be adsorbed and fixed effectively, and no static electricity is generated in the transferring process of the ceramic table.
Further, the first transfer table tray 60 and the second transfer table tray 10 are both provided with heating units, and by providing the heating units, the influence on the transfer quality due to low temperature can be effectively prevented.
As shown in fig. 2, 4 and 5, the wafer transfer apparatus further includes a cross-cut blade 74 disposed at one side of the roller 40, and the cross-cut blade 74 can slide along a direction parallel to the axial direction of the roller 40.
Specifically, the roller 40 is rotatably arranged on the roller frame 41, the roller frame 41 can slide along the first transfer table disc 60, a guide rail 71 parallel to the roller 40 is further arranged on the roller frame 41, a sliding block 72 is slidably arranged on the guide rail 71, a base 73 and a transverse cutter 74 are fixedly arranged on the sliding block and vertically penetrate through the base 73, the transverse cutter comprises a cutter handle, a blade 743 and a blade fixing lock cap 742, the blade fixing lock cap 742 is in threaded connection with the cutter handle, the blade 743 is fixed onto the cutter handle through the blade fixing lock cap 742, a strip groove 741 is arranged on the cutter handle, the cutter handle is penetratingly arranged on the base 73, the cutter handle is fixed through a positioning bolt 73, and a blue film is transversely cut through the transverse cutter 74.
Further, as a preferred embodiment, an ion fan (not shown) is further disposed on one side of the first transfer table tray 60.
Specifically, static electricity generated by the ion fan eliminating equipment during the transfer operation is prevented from damaging related electronic elements arranged on the wafer, and the quality of products is effectively guaranteed.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A wafer transfer apparatus, comprising:
the first transfer table disc is used for placing a wafer to be subjected to blue film pasting;
the roller is arranged above the first transfer table disc in a sliding mode and used for rolling the blue film to enable the blue film to be adhered to the wafer;
the blue film cutting assembly is rotatably arranged above the first transfer table disc, can be switched between a position close to the first transfer table disc and a position far away from the first transfer table disc and is used for cutting the blue film along the contour of a primary-secondary ring for fixing the wafer;
and the conveying unit is used for conveying the wafer on the first transfer table disc to the second transfer table disc and pressing the wafer downwards to enable the blue film to be firmly adhered to the wafer.
2. The wafer transfer apparatus of claim 1, further comprising a blue film fixing unit disposed at one side of the first transfer table, wherein the blue film fixing unit comprises a blue film fixing roller, a waste film recycling shaft and a film penetrating stopper rod, all of which are disposed parallel to the roller.
3. The wafer transfer apparatus of claim 1, wherein the handling unit comprises a first sliding assembly slidable in a horizontal direction, a second sliding group connected to the first sliding assembly, and a suction cup disposed on the second sliding assembly, wherein the second sliding assembly is slidable in a vertical direction.
4. The wafer transfer apparatus according to claim 1, wherein the blue film cutting assembly includes a cover, a circumferential knife rotating shaft vertically penetrating through the cover, and a circumferential knife fixedly disposed at an end of the circumferential knife rotating shaft close to the first transfer table disk, the circumferential knife rotating shaft is rotatably disposed on the cover, and the circumferential knife rotating shaft is located at a center of the first transfer table disk when the cover is in the closed position.
5. The wafer transfer apparatus of claim 4, wherein a knife shaft is fixedly disposed at one end of the circumferential knife rotating shaft close to the first transfer table disc, an axis of the knife shaft is perpendicular to an axis of the circumferential knife shaft rotating shaft, and the circumferential knife is disposed at least one end of the knife shaft.
6. The wafer transfer apparatus of claim 1, wherein the first transfer platen is a ceramic platen.
7. The arsenized grafted disc transfer apparatus according to claim 1, wherein the first transfer table and the second transfer table are provided with a plurality of vacuum suction holes.
8. The wafer transfer apparatus of claim 1, wherein the first and second transfer table trays are each provided with a heating unit.
9. The wafer transfer apparatus of claim 1, further comprising a cross cutter disposed on one side of the roller, the cross cutter being slidable in a direction parallel to an axial direction of the roller.
10. The wafer transfer apparatus of any of claims 1-9, wherein an ion fan is further disposed on one side of the first transfer platen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010228364.0A CN111489988A (en) | 2020-03-27 | 2020-03-27 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010228364.0A CN111489988A (en) | 2020-03-27 | 2020-03-27 | Wafer transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111489988A true CN111489988A (en) | 2020-08-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010228364.0A Pending CN111489988A (en) | 2020-03-27 | 2020-03-27 | Wafer transfer device |
Country Status (1)
| Country | Link |
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| CN (1) | CN111489988A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113682875A (en) * | 2021-09-02 | 2021-11-23 | 苏州可川电子科技股份有限公司 | Bottom film transfer method for coil product |
| CN117213348A (en) * | 2023-11-09 | 2023-12-12 | 迈为技术(珠海)有限公司 | Method, device, equipment and storage medium for detecting cutting contact position of cutter wheel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101651089A (en) * | 2008-08-12 | 2010-02-17 | 日东电工株式会社 | Method and apparatus for joining protective tape to semiconductor wafer |
| CN103681228A (en) * | 2012-08-31 | 2014-03-26 | 日东电工株式会社 | Adhesive tape joining method and adhesive tape joining apparatus |
| CN205686674U (en) * | 2016-06-17 | 2016-11-16 | 旭丰（天津）电子设备有限公司 | A kind of novel blue film machine |
-
2020
- 2020-03-27 CN CN202010228364.0A patent/CN111489988A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101651089A (en) * | 2008-08-12 | 2010-02-17 | 日东电工株式会社 | Method and apparatus for joining protective tape to semiconductor wafer |
| CN103681228A (en) * | 2012-08-31 | 2014-03-26 | 日东电工株式会社 | Adhesive tape joining method and adhesive tape joining apparatus |
| CN205686674U (en) * | 2016-06-17 | 2016-11-16 | 旭丰（天津）电子设备有限公司 | A kind of novel blue film machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113682875A (en) * | 2021-09-02 | 2021-11-23 | 苏州可川电子科技股份有限公司 | Bottom film transfer method for coil product |
| CN113682875B (en) * | 2021-09-02 | 2022-08-09 | 苏州可川电子科技股份有限公司 | Bottom film transfer method for coil product |
| CN117213348A (en) * | 2023-11-09 | 2023-12-12 | 迈为技术(珠海)有限公司 | Method, device, equipment and storage medium for detecting cutting contact position of cutter wheel |
| CN117213348B (en) * | 2023-11-09 | 2024-02-09 | 迈为技术(珠海)有限公司 | Method, device, equipment and storage medium for detecting cutting contact position of cutter wheel |
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Application publication date: 20200804 |