JPH0697268A - Sticking device for adhesive tape on wafer - Google Patents

Abstract

PURPOSE:To make a wafer loading mechanism and a wafer unloading mechanism simple in structure so as to uniformly stick a wafer on an adhesive film provided onto a ring frame. CONSTITUTION:A ring frame 5 is provided with an adhesive film 4 stuck on its underside. A wafer holding mechanism which places and fixes the ring frame 5 onto a table 3 making its film adhesive surface face upward, a wafer loading mechanism which feeds a wafer W as holding it with a holding member 9 making its pattern surface face upward and loads it onto the adhesive tape 4, a wafer support mechanism which supports the upside of the wafer W placed on the adhesive film 4 by pressing with a wafer presser 15, and an elastic pressing mechanism which slightly presses throughout the underside region of the adhesive film 4 where a wafer is placed through the intermediary of an elastic material 18 with a roller 23 as scanning are provided inside a vacuum chamber which can be exhausted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a thin film such as a semiconductor wafer (hereinafter,
A wafer).

[0002]

2. Description of the Related Art Conventionally, as the above-mentioned apparatus, Japanese Patent Publication No.
As disclosed in Japanese Patent No. 4175, after a ring frame having an adhesive film adhered on a wafer held in a posture with a pattern surface facing downward, the ring frame having the film adhesive surface facing downward is arranged closely. It is known that the decompression chamber containing these is decompressed to lightly adhere the film adhesive surface to the wafer, and then the upper surface of the adhesive film is pressed and scanned by a roller to adhere the wafer as a whole. There is.

[0003]

Since the above-mentioned conventional apparatus performs the wafer bonding process in the decompression chamber, it is possible to perform the bonding process uniformly and well without entraining air bubbles on the wafer bonding surface. Since the wafer undergoes each process with its pattern surface facing upwards, the wafer that has undergone the pretreatment process is turned upside down and set in the bonding machine, and the ring frame after the bonding process is turned upside down for the next process. It is necessary to send the wafer into the process, which complicates the wafer loading / unloading means and the unloading means. Moreover, when the wafer is turned upside down, a suction error or the like may occur and the wafer may fall off.

The present invention has been made paying attention to such a point, and is an apparatus capable of uniformly sticking an adhesive tape onto a wafer without causing the above-mentioned problems in loading and unloading the wafer. The purpose is to provide.

[0005]

In order to achieve the above object, an apparatus for attaching an adhesive tape to a wafer according to the present invention has the following construction. That is, a frame support means for holding a ring frame having an adhesive film attached to the lower surface in a posture in which the film adhesive surface faces upward, and a ring frame in which a wafer in a posture in which the pattern surface faces upward is supported by the frame supporting means. In the decompression chamber which can be evacuated and opened, the wafer loading means that is dropped onto the adhesive film and loaded, and the elastic pressing means that gently presses and scans at least the entire wafer mounting area on the lower surface of the adhesive film through the elastic material. The structure will be interior.

[0006]

According to the present invention, a wafer can be loaded and set in a posture in which the pattern surface is directed upwards, as in the pretreatment process, for example, by mounting the peripheral portion on a locking member or the like without touching the pattern surface. . By supplying and placing the wafer on the adhesive film in a reduced pressure state, the wafer is lightly adhered in a state where no air bubbles are present on the sticking surface. It is evenly attached to the adhesive film.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment is shown in FIGS. This wafer sticking apparatus includes a fixed lower housing 1a and an upper housing 1b which can be opened and closed.
It has a structure in which various means for attaching a wafer are provided in the decompression chamber 2 constituted by.

A ring-shaped table 3 is fixed to the upper part of the lower housing 1a, and a ring frame 5 having an adhesive film 4 attached to the lower surface is placed on the table 3 in a predetermined positioning state and fixed by a clamp 6. To do
A frame support means is configured.

Movable frames 8 which can be moved horizontally and horizontally through slide shafts 7 are mounted on opposing peripheral wall portions of the upper housing 1b, and peripheral diagonal portions of the wafer W are mounted on the lower ends of the movable frames 8. A support member 9 for placing and supporting is provided on the table 3 in close proximity thereto. Further, a connecting member 10 fixed to the outer end of the slide shaft 7 of each movable frame 8 is provided at the center of the upper wall of the upper housing 1b so as to be rotatable about the vertical axis P and rotatable by an air cylinder 11. Rotating arm 12
Are connected to both ends of the wafer via rods 13, and the rotating arm 12 is rotated by the air cylinder 11 to retract both movable frames 8 from each other, so that the wafers mounted on both supporting members 10 are rotated. Wafer loading means for dropping and loading W onto the adhesive film 4 of the ring frame 5 is configured.

At the center of the upper wall of the upper housing 1b, the air cylinder 14 is concentric with the rotation axis P of the rotation arm 12.
Equipped with a piston rod 1 that is thrust into the decompression chamber 2.
A disk 16 having a ring-shaped wafer retainer 15 is connected to the lower end of the wafer 4a, and the wafer retainer 15 lowered by the extension operation of the air cylinder 14 is used for the adhesive film 4
By supporting the peripheral portion of the upper surface of the upper wafer W, the wafer W is prevented from being pushed up by the below-described sticking and pressing action from below.

A thin spring plate 17 having one end fixed and supported in a cantilever manner is provided on the upper part of the lower housing 1a, and a flexible spring 17 having a larger diameter than the wafer W is formed on the upper surface of the spring plate 17. Rubber or sponge-like elastic material 1
8 is attached. A movable bracket 21 is provided below the spring plate 17 so as to be horizontally movable via a guide shaft 19 and reciprocally driven by an air cylinder 20. The movable bracket 21 is rotated around the fulcrum Q. A roller 23 having a length equal to the maximum width of the spring plate is horizontally supported by a pair of movable arms 22. The lower end of the arm 22 is provided with a cam follower 25 acting on a cam rail 24 provided on the bottom surface of the lower housing 1a. As shown in FIG. 1, the roller 23 is retracted to the base end side of the spring plate 17. Cam follower 2
When the roller 23 moves forward from the spring plate 17, the cam follower 25 rides on the high part of the cam rail 24 and the roller 23 pushes up the spring plate 17. The elastic pressing means is configured to press the elastic material 18 against the lower surface of the adhesive film 4.

The pasting device according to the first embodiment of the present invention is constructed as described above, and its operation will be described below.
First, in a state where the upper housing 1b is opened, the ring frame 5 having the adhesive tape 4 attached to the lower surface is positioned and fixed on the table 3 of the frame supporting means. Further, the wafer W having the pattern surface facing upward is positioned and mounted on both the support members 9. At this time, the wafer retainer 15 of the wafer supporting means is on standby at the ascending return position, and the roller 23 of the elastic pressing means is also on standby at the retracting return position.

Next, the upper housing 1b is joined to the lower housing 1a, and the room air is sucked and exhausted from the exhaust port 26 of the lower housing 1a by a vacuum pump (not shown) to depressurize the decompression chamber 2 to a predetermined vacuum pressure.

Next, both support members 9 are retracted to drop the wafer W onto the upper surface of the adhesive tape 4, that is, the adhesive surface, and the wafer retainer 15 is lowered and placed on the adhesive tape 4. The peripheral portion of the upper surface of the wafer W is supported.

After that, by moving the roller 23 forward,
The elastic material 18 is pressed against the lower surface of the adhesive tape 4, and the roller 2
The adhesive tape 4 is evenly adhered to the lower surface (back surface) of the wafer W by the pressure scan accompanying the movement of the wafer W, and as shown in FIG. 6, the work in which the wafer W is mounted on the ring frame 5 via the adhesive tape 4 is processed. The obtained posture can be supplied to the subsequent processing steps in the same posture without requiring any treatment such as posture reversal.

A second embodiment of the invention is shown in FIGS. In this example, the clamp 30 for mounting and fixing the ring frame 5 on the table 3 is the air cylinder 3
The frame supporting means is configured so as to be drivable by means of 1. Further, a ring-shaped wafer retainer 33a is mounted on the lower surface of the peripheral portion of the disk 33 which is lifted and lowered by an air cylinder 32 mounted in the center of the upper housing 1b, and L-shaped arms 34 are provided at a plurality of peripheral portions of the disk 33. A clamp 35 that is vertically swung is attached, and the wafer W is clamped and supported by the wafer retainer 33a and the clamp 35 and lowered to near the adhesive tape 4 of the ring frame 5, and then the clamp 35 is released to attach the wafer W to the adhesive tape. Four
Wafer loading means for dropping and loading is configured.

The L-shaped arm 34 for driving the clamp is used.
As shown in FIG. 5, is connected to a rotary plate 36 concentrically and rotatably supported on a disk 33 via a rod 37, and the rotary plate 36 is rotated forward and backward by an air cylinder 38 to rotate each rod. The clamp 35 is rocked by pushing and pulling 37.

Further, as shown in FIG. 6, the clamp 35 is capable of retracting and swinging above the wafer retainer 33a, and by lowering the wafer retainer 33a in this state,
It is configured so as to also function as a wafer supporting unit that presses the wafer W on the adhesive tape 4.

At the center of the lower housing 1a, there is provided a support shaft 39 which is raised and lowered and rotated by a drive mechanism (not shown), and brush-like elastic members 40 are provided at the upper end of the support shaft 39 in a row longer than the wafer diameter. The elastic pressing means is configured to rotate and scan while elastically pressing the lower surface of the adhesive tape 4.

According to the present embodiment, after the wafer W is dropped onto the adhesive tape 4, the elastic material 40 is lifted to raise the lower surface of the adhesive tape 4 while the peripheral portion of the upper surface of the wafer W is pressed and supported by the wafer retainer 33a. The pressure-sensitive adhesive tape 4 is attached to the lower surface (back surface) of the wafer W by lightly pressing it into contact with and then rotating the elastic member 40.

In each of the above-described embodiments, when the adhesive tape 4 is attached, the peripheral portion of the upper surface of the wafer W is held by the wafer holder 1.
Although the wafer W is pressed and supported by 5, 33a, when the back surface of the wafer W is smooth, it is not always necessary to press and support the wafer W by the wafer retainers 15, 33a.

[0022]

As described above, according to the wafer sticking apparatus of the present invention, the wafer and the adhesive tape are stuck together under reduced pressure, so that air bubbles are prevented from being trapped between the two. Can be applied evenly.
Further, since the wafer is loaded on the adhesive film in a posture with its pattern surface facing upward, it is supplied to the wafer sticking device in the wafer posture in the pretreatment process, and taken out in the posture as it is. Since it is not necessary to perform the posture reversing operation every time the wafer is loaded and unloaded, the wafer loading / unloading means and the unloading means can be simply structured. In addition, it is possible to safely perform processing without fear that the wafer will fall out when the wafer is turned over.

[Brief description of drawings]

FIG. 1 is a vertical sectional side view of an embodiment of a device for attaching an adhesive tape to a wafer according to the present invention.

FIG. 2 is a cross-sectional plan view of an example device.

FIG. 3 is a vertical cross-sectional front view of an elastic pressing unit of the embodiment apparatus.

FIG. 4 is a vertical sectional view of a second embodiment.

FIG. 5 is a plan view of a clamp drive mechanism according to a second embodiment.

FIG. 6 is a vertical cross-sectional view of a main part of a second embodiment in a pasting operation state.

FIG. 7 is a perspective view of a work on which the pasting process has been completed.

[Explanation of symbols]

 2 Decompression chamber 4 Adhesive film 5 Ring frame 18 Elastic material 40 Elastic material W Wafer

Claims (1)

[Claims] 1. A frame supporting means for holding a ring frame having an adhesive film attached to a lower surface in a posture in which the film adhesive surface faces upward, and a wafer in a posture in which a pattern surface faces upward is supported by the frame supporting means. The wafer loading means for dropping and loading the ring frame onto the adhesive film, and the elastic pressing means for lightly pressing and scanning at least the entire wafer mounting area on the lower surface of the adhesive film via the elastic material can be exhausted and openable. A device for attaching an adhesive tape to a wafer, which is characterized by being internally provided in a decompression chamber.