TW201515847A - Protective tape separating method and protective tape separating apparatus - Google Patents
Protective tape separating method and protective tape separating apparatus Download PDFInfo
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- TW201515847A TW201515847A TW103136399A TW103136399A TW201515847A TW 201515847 A TW201515847 A TW 201515847A TW 103136399 A TW103136399 A TW 103136399A TW 103136399 A TW103136399 A TW 103136399A TW 201515847 A TW201515847 A TW 201515847A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/17—Nature of material
- B65H2701/172—Composite material
- B65H2701/1726—Composite material including detachable components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
- B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
本發明係關於保護帶剝離方法及保護帶剝離裝置,其係將剝離用黏著帶黏貼至半導體晶圓(以下適當地稱為「晶圓」)的電路圖案形成面所黏貼的保護帶上,藉由剝離該剝離帶,將保護帶自晶圓一體地剝離。 The present invention relates to a protective tape peeling method and a protective tape peeling device which adheres a peeling adhesive tape to a protective tape adhered to a circuit pattern forming surface of a semiconductor wafer (hereinafter referred to as "wafer" as appropriate). The protective tape is peeled off integrally from the wafer by peeling off the peeling tape.
將保護帶自晶圓的表面剝離的方法係例如以如下的方式實施:於已結束電路圖案之形成處理的晶圓表面黏貼保護帶之後,將背面整體均勻地施以背面研磨處理。黏貼有保護帶的晶圓係於被搬送至切細分離成晶片的切割步驟之前,將保護帶從其表面剝離。 The method of peeling the protective tape from the surface of the wafer is performed, for example, by adhering the protective tape to the surface of the wafer on which the circuit pattern forming process has been completed, and then uniformly applying the back surface to the back surface. The wafer to which the protective tape is attached is peeled off from the surface before being transferred to the cutting step of shredding into wafers.
將保護帶自晶圓的表面剝離的具體方法係例如以如下的方式實施:將帶狀的剝離帶以內建加熱器的黏貼輥按壓並黏貼既定長度至黏貼於晶圓上的保護帶的前端側之後,將剝離帶切斷。之後,於一面使剝離台移動一面拉扯並捲繞窄長方形的剝離帶的過程中,將保護帶從晶圓剝離。接著,於切斷後將處於自由狀態的保護帶前端藉由黏貼輥黏貼既定長度至保護帶的後端側。藉由重複進行剝離帶的黏貼以及保護帶的剝離,將自晶圓 剝離的保護帶的端部彼此以窄長方形的剝離帶接連而捲繞回收(參考專利文獻1)。 A specific method of peeling the protective tape from the surface of the wafer is carried out, for example, by pressing a strip-shaped peeling tape with a bonding roller of a built-in heater and pasting a predetermined length to the front end of the protective tape adhered to the wafer. After the side, the peeling tape was cut. Thereafter, the protective tape was peeled off from the wafer while the peeling stage was being pulled while pulling and winding the narrow rectangular peeling tape. Next, after cutting, the front end of the protective tape in a free state is adhered to a predetermined length to the rear end side of the protective tape by an adhesive roller. Self-wafer by repeating the adhesion of the peeling tape and the peeling of the protective tape The ends of the peeled protective tape are wound up and recovered by a narrow rectangular peeling tape (refer to Patent Document 1).
又,作為其他的方法,將寬度比晶圓小的剝離帶利用前端銳利的邊緣(edge)構件自保護帶的剝離開始端至終止端一面按壓、折回一面將其剝離,藉此將保護帶從晶圓表面剝離(參考專利文獻2)。 Further, as another method, the peeling tape having a smaller width than the wafer is peeled off from the peeling start end to the end of the protective tape by the sharp edge member at the tip end, and is peeled off, thereby peeling off the protective tape. Wafer surface peeling (refer to Patent Document 2).
[專利文獻1]日本特開2011-23612號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-23612
[專利文獻2]日本特願2011-029434號公報 [Patent Document 2] Japanese Patent Application No. 2011-029434
近年來,為了能夠隨著應用程式的急速發展進行高密度安裝,而對晶圓要求要薄型化。又,晶圓的尺寸於該薄型化的同時有增大的傾向。隨著晶圓的大型化,晶圓保持台也需要比晶圓更為大型化。 In recent years, in order to enable high-density mounting with the rapid development of applications, wafer requirements have been reduced. Moreover, the size of the wafer tends to increase as the thickness is reduced. As wafers become larger, wafer holders need to be larger than wafers.
然而,儘管於剝離台上吸附保持著晶圓的整個背面,仍會產生於黏貼剝離帶並將保護帶自晶圓逐漸剝離的過程中,在剝離掉保護帶的晶圓側產生起伏,導致晶圓破損的問題。 However, although the entire back surface of the wafer is adsorbed and held on the stripping stage, it still occurs during the process of adhering the stripping tape and gradually peeling off the protective tape from the wafer, causing undulation on the wafer side of the stripping off the protective tape, resulting in crystal The problem of round damage.
本發明係鑒於上述情事而研創,主要目的在於提供能夠將保護帶高精度地自半導體晶圓剝離的保護帶剝離方法及保護帶剝離裝置。 The present invention has been made in view of the above circumstances, and a main object thereof is to provide a protective tape peeling method and a protective tape peeling device capable of peeling a protective tape from a semiconductor wafer with high precision.
本發明為了達成此目的,係採取如下構成。 In order to achieve the object, the present invention has the following constitution.
即,將剝離帶黏貼至半導體晶圓的表面所黏 貼的保護帶上,藉由剝離該剝離帶,將保護帶自半導體晶圓的表面與剝離帶一體地剝離的保護帶剝離方法,該保護帶剝離方法的特徵在於具備:切斷過程,將寬度比前述半導體晶圓的直徑小且為帶狀的剝離帶藉由刀具切斷成既定長度,第一黏貼過程,藉由第一黏貼構件將切斷成既定長度的前述剝離帶黏貼至保護帶的剝離開始端側,及剝離過程,使越朝向前端越細的剝離板的前端與剝離帶及保護帶交叉並抵接,並於利用該剝離板將剝離帶折回的狀態下,一面將半導體晶圓與剝離板於相對背離的方向上水平移動一面捲繞剝離帶,藉此將保護帶自半導體晶圓剝離。 That is, sticking the peeling tape to the surface of the semiconductor wafer A protective tape peeling method in which a protective tape is integrally peeled off from a surface of a semiconductor wafer and a peeling tape by peeling off the peeling tape, the protective tape peeling method is characterized by: a cutting process, a width a strip having a smaller diameter than the semiconductor wafer and having a strip shape is cut into a predetermined length by a cutter. The first pasting process adheres the strip to a predetermined length by the first adhesive member to the protective tape. The peeling start end side and the peeling process are such that the tip end of the peeling sheet that is thinner toward the front end crosses the peeling tape and the protective tape, and the semiconductor wafer is folded while the peeling tape is folded back by the peeling plate. The release tape is wound while horizontally moving in a direction away from the release sheet, whereby the protective tape is peeled off from the semiconductor wafer.
(作用、效果)根據此方法,將寬度比前述半導體晶圓的直徑小的剝離帶僅黏貼保護帶的剝離開始端側的既定距離。又,於保護帶的剝離帶過程中,在剝離板的前端抵接的狀態下,保護帶一面自保護帶中黏貼有剝離帶的部分移動至僅保護帶的部分,一面被逐漸剝離。即,於剝離帶重疊部分較少的狀態下,僅拉扯保護帶並將其剝離。又,保護帶的剝離部位係由於剝離板而成為直線。由於此兩個現象的相乘效果而作用於保護帶的拉力變得略為平均,並且作用於晶圓的應力也變得略為平均。因此,得以抑制晶圓因習知的保護帶剝離方法而產生起伏,進而避免晶圓的破損。 (Operation and Effect) According to this method, the peeling tape having a width smaller than the diameter of the semiconductor wafer adheres only to a predetermined distance on the peeling start end side of the protective tape. Further, in the peeling belt of the protective tape, in a state in which the front end of the peeling plate is in contact with each other, the protective tape is gradually peeled off while moving from the portion where the peeling tape is adhered to the protective tape to the portion where only the protective tape is applied. That is, in a state where the overlapping portion of the peeling tape is small, only the protective tape is pulled and peeled off. Further, the peeling portion of the protective tape is a straight line due to the peeling plate. Due to the multiplication effect of the two phenomena, the tensile force acting on the protective tape becomes slightly average, and the stress acting on the wafer also becomes slightly average. Therefore, it is possible to suppress the wafer from being undulated by the conventional protective tape peeling method, thereby preventing wafer damage.
此外,於上述方法中,較佳為剝離過程係具備第二黏貼過程,該第二黏貼過程係自靠近半導體晶圓 的剝離終止端處至該剝離終止端,藉由第二黏貼構件將既定長度的剝離帶黏貼至保護帶上,且藉由自前述第一黏貼過程起重複進行第二黏貼過程,將前述保護帶接連捲繞回收。 In addition, in the above method, preferably, the stripping process has a second pasting process, which is from the proximity of the semiconductor wafer. Adhesive tape from the stripping end to the stripping end, a strip of a predetermined length is adhered to the strip by the second adhesive member, and the strip is removed by repeating the second sticking process from the first pasting process Recycled in succession.
自前述第一黏貼過程起具備第二黏貼過程的方法係例如可如下實施。 The method of providing the second pasting process from the first pasting process can be carried out, for example, as follows.
於在剝離方向的前後隔著既定間隔而配備的前述第一黏貼構件及第二黏貼構件、具備於該第一黏貼構件及第二黏貼構件之間夾持著刀具而被分割開的吸附部的黏貼單元上,捲鋪剝離帶並將其吸附保持,前述第一黏貼過程係於將黏貼單元以前低後高的傾斜姿勢下降至既定高度之前,藉由刀具將剝離帶切斷,當達到既定高度時,藉由第一黏貼構件將剝離帶按壓並黏貼在保護帶的剝離開始端上,前述剝離過程係與半導體晶圓的水平移動同步,於一面捲繞剝離帶一面藉由第一黏貼構件將既定長度的剝離帶黏貼於保護帶上後,使黏貼單元上升,前述第二黏貼過程係使黏貼單元搖動並以後低前高的傾斜姿勢下降至既定高度,以使第二黏貼構件抵接於保護帶的剝離終止端,於按壓捲鋪於第二黏貼構件上的剝離帶的狀態下,使黏貼單元以比半導體晶圓的移動速度快的速度前進移動,將既定長度的剝離帶黏貼至保護帶的剝離終止端側上。 The first adhesive member and the second adhesive member provided at a predetermined interval in the peeling direction, and the adsorption portion that is divided by the cutter between the first adhesive member and the second adhesive member On the pasting unit, the peeling tape is rolled and held, and the first pasting process is performed by cutting the peeling tape by the cutter before reaching the predetermined height before lowering the tilting posture of the pasting unit to the predetermined height. When the peeling tape is pressed and adhered to the peeling start end of the protective tape by the first adhesive member, the peeling process is synchronized with the horizontal movement of the semiconductor wafer, and the peeling tape is wound on one side by the first adhesive member. After the peeling tape of a predetermined length is adhered to the protective tape, the adhesive unit is raised, and the second pasting process causes the adhesive unit to rock and then descends to a predetermined height in a low front and high tilting posture, so that the second adhesive member abuts against the protection. The peeling end of the tape is in a state of pressing the peeling tape wound on the second adhesive member, so that the adhesive unit moves faster than the semiconductor wafer Speed forward movement, the release adhesive tape to a predetermined length of the protective tape stripped termination end side.
根據此方法,可連續進行保護帶的剝離處理,並可大幅降低剝離帶的消耗量。 According to this method, the peeling treatment of the protective tape can be continuously performed, and the consumption of the peeling tape can be greatly reduced.
又,本發明係為了達成此目的,採取如下構成。 Further, the present invention has the following constitution in order to achieve the object.
即,一種保護帶剝離裝置,係將剝離帶黏貼至半導體晶圓的表面所黏貼的保護帶上,藉由剝離該剝離帶,將保護帶自半導體晶圓的表面與剝離帶一體地剝離的保護帶剝離裝置,該保護帶剝離裝置的特徵在於具備:剝離台,載置保持具有前述保護帶的半導體晶圓,剝離帶供給機構,供給帶狀的前述剝離帶,第一黏貼構件,於前述剝離台所保持的半導體晶圓上黏貼的保護帶的剝離開始端側黏貼剝離帶,刀具,將要黏貼至剝離開始端側的前述保護帶的剝離帶切斷成既定長度,越朝向前端越細的剝離板,與前述剝離帶及保護帶交叉並使該等抵接,並將剝離帶折回,第一驅動機構,使前述第一黏貼構件及剝離板的組與剝離台於相對背離的方向上水平移動,及帶回收機構,將已與前述保護帶一體化的剝離帶捲繞回收。 That is, a protective tape peeling device is a method in which a peeling tape is adhered to a protective tape adhered to a surface of a semiconductor wafer, and the protective tape is peeled off from the surface of the semiconductor wafer and the peeling tape by peeling off the peeling tape. In the tape peeling device, the tape peeling device includes a peeling station that holds and holds a semiconductor wafer having the protective tape, and a peeling tape supply mechanism that feeds the strip-shaped peeling tape and the first adhesive member. The peeling tape is adhered to the peeling start end side of the protective tape adhered to the semiconductor wafer held by the stage, and the peeling tape of the protective tape which is to be adhered to the peeling start end side is cut into a predetermined length, and the peeling plate is thinner toward the front end. And the peeling tape and the protective tape intersect with the peeling tape and the protective tape, and the peeling tape is folded back, and the first driving mechanism horizontally moves the group of the first adhesive member and the peeling plate in a direction away from the peeling table. And a belt recovery mechanism that winds up the release tape that has been integrated with the aforementioned protective tape.
(作用、效果)根據此構成,可適當地實施自第一黏貼過程實施剝離過程的上述方法。 (Operation, Effect) According to this configuration, the above-described method of performing the peeling process from the first pasting process can be suitably performed.
又,於上述構成中,較佳為構成黏貼單元,其具備在剝離方向的前後隔著既定間隔而配備的前述第一黏貼構件、第二黏貼構件及於前述第一黏貼構件及第二黏貼構件之間夾持著刀具而被分割開的吸附部, 並具備:搖動機構,使前述黏貼單元相對於剝離方向於前後方向上傾斜,升降驅動機構,使前述黏貼單元與剝離台於黏貼位置與待機位置之間相對地升降,及第二驅動機構,使前述黏貼單元水平移動。 Further, in the above configuration, it is preferable that the adhesive unit includes the first adhesive member, the second adhesive member, and the first adhesive member and the second adhesive member which are provided at a predetermined interval in the peeling direction. An adsorption section that is divided by a cutter, And a rocking mechanism for tilting the pasting unit in the front-rear direction with respect to the peeling direction, and lifting and lowering the driving mechanism to relatively raise and lower the adhesive unit and the peeling table between the pasting position and the standby position, and the second driving mechanism The aforementioned pasting unit moves horizontally.
根據此構成,可適當地實施進行自第一黏貼過程至第二黏貼過程的上述方法。 According to this configuration, the above method of performing the first pasting process to the second pasting process can be suitably performed.
根據本發明的保護帶剝離方法以及保護帶剝離裝置,藉由使拉力平均地作用於保護帶的剝離部位上,於抑制了朝剝離掉保護帶的晶圓側產生的起伏的狀態下,將保護帶自晶圓剝離。因此,可一面避免晶圓的破損一面高精度地將保護帶自晶圓剝離。 According to the protective tape peeling method and the protective tape peeling device of the present invention, by applying the tensile force evenly to the peeling portion of the protective tape, the protection is suppressed in a state where the undulation generated on the wafer side of the protective tape is peeled off. Strip stripped from the wafer. Therefore, the protective tape can be peeled off from the wafer with high precision while avoiding breakage of the wafer.
1‧‧‧剝離台 1‧‧‧ peeling station
2‧‧‧帶供給部 2‧‧‧With the supply department
3‧‧‧黏貼單元 3‧‧‧Adhesive unit
4‧‧‧剝離單元 4‧‧‧ peeling unit
5‧‧‧帶回收部 5‧‧‧With recycling department
21‧‧‧第一黏貼輥 21‧‧‧First Adhesive Roller
22‧‧‧第二黏貼輥 22‧‧‧Second adhesive roller
23‧‧‧刀具單元 23‧‧‧Tool unit
24‧‧‧吸附板 24‧‧‧Adsorption plate
51‧‧‧剝離板 51‧‧‧ peeling board
PT‧‧‧保護帶 PT‧‧‧protective tape
Ts‧‧‧剝離帶 Ts‧‧‧ peeling tape
W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer
圖1係顯示保護帶剝離裝置整體的正視圖。 Fig. 1 is a front elevational view showing the entire protective tape peeling device.
圖2係黏貼單元以及剝離單元的主要部分的俯視圖。 2 is a plan view of a main portion of the pasting unit and the peeling unit.
圖3係刀具單元的俯視圖。 Figure 3 is a top plan view of the tool unit.
圖4係刀具單元的左側面圖。 Figure 4 is a left side view of the tool unit.
圖5係顯示保護帶的剝離動作的圖。 Fig. 5 is a view showing a peeling action of the protective tape.
圖6係顯示保護帶的剝離動作的圖。 Fig. 6 is a view showing a peeling action of the protective tape.
圖7係顯示保護帶的剝離動作的圖。 Fig. 7 is a view showing a peeling action of the protective tape.
圖8係顯示保護帶的剝離動作的圖。 Fig. 8 is a view showing a peeling action of the protective tape.
圖9係顯示保護帶的剝離動作的圖。 Fig. 9 is a view showing a peeling action of the protective tape.
圖10係顯示保護帶的剝離動作的圖。 Fig. 10 is a view showing a peeling action of the protective tape.
圖11係顯示保護帶的剝離動作的圖。 Fig. 11 is a view showing a peeling action of the protective tape.
圖12係顯示保護帶的剝離動作的圖。 Fig. 12 is a view showing a peeling action of the protective tape.
圖13係顯示變形例的保護帶剝離裝置整體的正視圖。 Fig. 13 is a front elevational view showing the entire protective tape peeling device of a modification.
圖14係顯示變形例的保護帶的剝離動作的圖。 Fig. 14 is a view showing a peeling operation of a protective tape according to a modification.
圖15係顯示變形例的保護帶的剝離動作的圖。 Fig. 15 is a view showing a peeling operation of a protective tape according to a modification.
以下參考圖式,說明本發明的保護帶剝離裝置的實施例。 Embodiments of the protective tape peeling device of the present invention will be described below with reference to the drawings.
圖1係關於本發明的一實施例,為顯示保護帶剝離裝置的整體構成的正視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front elevational view showing the overall configuration of a protective tape peeling device in accordance with an embodiment of the present invention.
此保護帶剝離裝置係如圖1所示,由剝離台1、帶供給部2、黏貼單元3、剝離單元4以及帶回收部5等所構成。以下具體說明各構成。 This protective tape peeling device is composed of a peeling table 1, a tape supply unit 2, a pasting unit 3, a peeling unit 4, a tape collecting unit 5, and the like, as shown in Fig. 1 . The respective configurations will be specifically described below.
剝離台1係構成為將在形成有電路圖案的表面黏貼有保護帶的半導體晶圓W(以下僅稱為「晶圓W」)從背面側真空吸附。另,剝離台1係安裝在可動台7上,該可動台7係以可沿著前後水平地配置的左右一對的導軌6前後滑動的方式受到支撐。可動台7係藉由以脈衝馬達8正反驅動的螺旋軸9而被螺旋進給驅動。此外,導軌6、可動台7、脈衝馬達8、螺旋軸9等係構成本發明的第一驅動機構。 The peeling station 1 is configured such that a semiconductor wafer W (hereinafter simply referred to as "wafer W") to which a protective tape is adhered on a surface on which a circuit pattern is formed is vacuum-adsorbed from the back side. Further, the peeling table 1 is attached to the movable table 7, and the movable table 7 is supported so as to be slidable back and forth by a pair of right and left guide rails 6 that are horizontally arranged in the front-rear direction. The movable table 7 is driven by screw feed by a screw shaft 9 that is driven forward and reverse by a pulse motor 8. Further, the guide rail 6, the movable table 7, the pulse motor 8, the screw shaft 9, and the like constitute the first drive mechanism of the present invention.
帶供給部2係將自原材輥導出之寬度比晶圓 W的直徑小的剝離帶Ts引導至黏貼單元3的下端部。此外,帶供給部2係相當於本發明的剝離帶供給機構。 The tape supply unit 2 is a width ratio wafer derived from the raw material roll The peeling tape Ts having a small diameter of W is guided to the lower end portion of the pasting unit 3. Further, the tape supply unit 2 corresponds to the peeling tape supply mechanism of the present invention.
圖2顯示黏貼單元3以及剝離單元4的主要部分。黏貼單元3係具備於自可動台13下垂支撐的縱向框架14,該可動台13係可藉由上部的水平框架11所具備的線性導件而移動。即,黏貼單元3係經由左右一對的支撐板18而被升降台17所軸支,該升降台17係經由以縱向框架14的下部固定的基台15所設置的縱向軌道16以可滑動升降的方式被支撐。又,黏貼單元3係藉由未圖示的汽缸等的致動器,以黏貼單元3可繞著軸P前後搖動的方式被升降台17所軸支。升降台17係藉由與馬達連結驅動的滾珠軸來進行升降。 FIG. 2 shows the main parts of the pasting unit 3 and the peeling unit 4. The pasting unit 3 is provided with a longitudinal frame 14 that is suspended from the movable table 13, and the movable table 13 is movable by a linear guide provided in the upper horizontal frame 11. That is, the pasting unit 3 is axially supported by the pair of left and right support plates 18, which are slidably lifted via the longitudinal rails 16 provided by the base 15 fixed to the lower portion of the longitudinal frame 14. The way is supported. Further, the pasting unit 3 is supported by the lifting table 17 so that the bonding unit 3 can swing back and forth around the axis P by an actuator such as a cylinder (not shown). The lifting platform 17 is lifted and lowered by a ball shaft that is coupled to the motor.
黏貼單元3的本體係於支撐板18的內側具備第一黏貼輥21、第二黏貼輥22、刀具單元23以及吸附板24。此外,第一黏貼輥21相當於本發明的第一黏貼部,第二黏貼輥22相當於本發明的第二黏貼部,吸附板24相當於吸附部,線性導件相當於第二驅動機構。 The system of the pasting unit 3 is provided with a first adhesive roller 21, a second adhesive roller 22, a cutter unit 23, and an adsorption plate 24 on the inner side of the support plate 18. Further, the first bonding roller 21 corresponds to the first bonding portion of the present invention, the second bonding roller 22 corresponds to the second bonding portion of the present invention, the adsorption plate 24 corresponds to the adsorption portion, and the linear guide corresponds to the second driving mechanism.
第一黏貼輥21以及第二黏貼輥22係於剝離帶Ts的搬送方向的前後隔著既定的間隔轉動自如地軸支於支撐板18。以刀具單元23的刀具25於第一黏貼輥21與第二黏貼輥22之間的中央在剝離帶Ts的寬度方向上移動的方式,夾持著刀具25於其前後配置吸附板24。此外,於本實施例中,於第二黏貼輥22的後側具備導輥R,但亦可為不具備導輥的構成。 The first bonding roller 21 and the second bonding roller 22 are rotatably supported by the support plate 18 at a predetermined interval before and after the conveyance direction of the release tape Ts. The cutter 25 is placed between the first adhesive roller 21 and the second adhesive roller 22 in the width direction of the peeling tape Ts so that the cutter 25 is placed between the first and second adhesive rollers 22 in the width direction of the peeling tape Ts. Further, in the present embodiment, the guide roller R is provided on the rear side of the second adhesive roller 22, but the guide roller may not be provided.
刀具單元23係如圖3及圖4所示,具備沿著設 置於黏貼單元3的上部的導軌移動的刀具部27。刀具部27係由可動台28、刀具保持器29所構成。將刀刃朝下的刀具25以可裝卸的方式安裝於刀具保持器29上。 The cutter unit 23 is as shown in FIG. 3 and FIG. The cutter portion 27 that is placed on the upper rail of the pasting unit 3 moves. The cutter unit 27 is composed of a movable table 28 and a tool holder 29. The cutter 25 with the blade facing downward is detachably attached to the cutter holder 29.
於導軌26的右端附近,軸支以馬達正反轉驅動的驅動滑輪30,並且於導軌26的左側,軸支自由轉動滑輪31。可動台28的滑動卡合部33連結於捲鋪在此等驅動滑輪30與自由轉動滑輪31之間的轉動帶32,藉由轉動帶32的正反轉動將可動台28左右移動。 Near the right end of the guide rail 26, the shaft is supported by a drive pulley 30 that is driven by the motor in the reverse direction, and on the left side of the guide rail 26, the shaft is free to rotate the pulley 31. The slide engagement portion 33 of the movable table 28 is coupled to the rotation belt 32 that is wound between the drive pulley 30 and the free rotation pulley 31, and the movable table 28 is moved to the left and right by the forward and reverse rotation of the rotation belt 32.
此外,於刀具單元23的底面的左右端設置有蓋34,該蓋34係收納自吸附板24a、24b之間突出的刀具25的刀刃。 Further, a lid 34 is provided at the left and right ends of the bottom surface of the cutter unit 23, and the lid 34 is a blade that accommodates the cutter 25 that protrudes from between the suction plates 24a and 24b.
吸附板24係經由流路與外部的真空裝置連通連接。此外,藉由利用控制部70對設置於流路的電磁閥進行操作,可調整吸引力。 The adsorption plate 24 is connected to the external vacuum device via a flow path. Further, the suction force can be adjusted by operating the solenoid valve provided in the flow path by the control unit 70.
剝離單元4的由鋁拉製材料構成的支撐框架42係橫跨自裝置本體豎立設置的左右一對的縱向框架41而固定。在此支撐框架42的左右方向中央部位聯結有箱形的基台43。又,經由設置於基台43的左右一對的縱向軌道44以可滑動升降的方式被支撐的升降台45,係藉由與馬達46連結驅動的滾珠軸而進行升降。於此升降台45配備有剝離單元4。 The support frame 42 made of an aluminum-drawn material of the peeling unit 4 is fixed across a pair of left and right longitudinal frames 41 that are erected from the apparatus body. A box-shaped base 43 is coupled to a central portion of the support frame 42 in the left-right direction. Further, the elevating table 45 that is slidably supported by the pair of right and left longitudinal rails 44 provided on the base 43 is lifted and lowered by the ball shaft that is driven by the motor 46. The lifting table 45 is equipped with a peeling unit 4.
升降台45係構成為上下貫通的中空框狀。剝離單元4係安裝於升降台45的左右所具備的側板47的內側下部。剝離板51係橫跨兩側板47而被安裝。 The lifting platform 45 is configured in a hollow frame shape that penetrates vertically. The peeling unit 4 is attached to the inner lower portion of the side plate 47 provided on the left and right of the elevating table 45. The peeling plate 51 is attached across the side plates 47.
剝離板51具有晶圓W的直徑以上的長度,且 形成為越朝向前端越細的錐狀。 The peeling plate 51 has a length equal to or larger than the diameter of the wafer W, and It is formed into a tapered shape that is thinner toward the front end.
此外,於剝離單元4的上方配置有複數支回收用的導輥61、軋輥62以及張力輥63。 Further, a plurality of guide rollers 61 for collecting, a roll 62, and a tension roller 63 are disposed above the peeling unit 4.
回收用的導輥61係轉動自如地被軸支。張力輥63係轉動自如地設置於支撐臂64,配置成可經由該支撐臂64搖動。因此,張力輥63係對受到引導而被捲回的剝離帶Ts施加適度的張力。 The guide roller 61 for recovery is rotatably supported by the shaft. The tension roller 63 is rotatably provided to the support arm 64 and is configured to be swingable via the support arm 64. Therefore, the tension roller 63 applies an appropriate tension to the peeling tape Ts that is guided and rolled back.
此等回收用的導輥61以及張力輥63係構成為長度比晶圓W的直徑長的寬幅輥,且其外周面為塗布有氟樹脂的難接著面。 The guide roller 61 and the tension roller 63 for recovery are configured as a wide roll having a length longer than the diameter of the wafer W, and the outer peripheral surface thereof is a difficult-contact surface coated with a fluororesin.
帶回收部5係捲繞回收自剝離單元4送出的剝離帶Ts。此外,帶回收部5係相當於本發明的帶回收機構。 The tape collection unit 5 winds up and collects the peeling tape Ts sent from the peeling unit 4. Further, the tape collecting portion 5 corresponds to the tape collecting mechanism of the present invention.
接著,根據圖式的記載,從圖5開始說明藉由上述的實施例裝置將保護帶PT自晶圓W剝離的一連串動作。 Next, a series of operations in which the protective tape PT is peeled off from the wafer W by the apparatus of the above-described embodiment will be described with reference to the description of the drawings.
當藉由機械臂等的搬送機構將晶圓W載置於剝離台1上時,剝離台1係吸附保持晶圓W,接著如圖5所示自待機位置移動到剝離帶Ts的黏貼開始位置。 When the wafer W is placed on the peeling table 1 by a transfer mechanism such as a robot arm, the peeling stage 1 sucks and holds the wafer W, and then moves from the standby position to the pasting position of the peeling tape Ts as shown in FIG. .
當剝離台1到達黏貼開始位置時,在上方捲鋪有剝離帶Ts的黏貼單元3維持前低後高的傾斜姿勢下降至既定高度。此時,刀具單元23的刀具25係一端一面移動到另一端,一面將吸附板24所吸附的剝離帶Ts切斷。 When the peeling table 1 reaches the pasting start position, the pasting unit 3 on which the peeling tape Ts is wound is held down to a predetermined height while maintaining the front low and high tilt posture. At this time, the cutter 25 of the cutter unit 23 is moved to the other end, and the peeling tape Ts adsorbed by the suction plate 24 is cut.
如圖6所示,當黏貼單元3下降到既定高度時,藉由第一黏貼輥21將剝離帶Ts黏貼於保護帶PT的剝離 開始端。 As shown in FIG. 6, when the pasting unit 3 is lowered to a predetermined height, the peeling tape Ts is adhered to the peeling of the protective tape PT by the first adhesive roller 21. The beginning.
之後如圖7所示,第一黏貼輥21係隨著剝離台1前進移動,將既定長度的剝離帶Ts黏貼於保護帶PT上。即,剝離帶Ts中自第一黏貼輥21處起被前側的吸附板24a所吸附的部分係黏貼於保護帶PT的前側。 Thereafter, as shown in FIG. 7, the first adhesive roller 21 is attached to the protective tape PT by the peeling tape Ts of a predetermined length as the peeling table 1 moves forward. In other words, the portion of the peeling tape Ts that is adsorbed by the suction plate 24a on the front side from the first bonding roller 21 is adhered to the front side of the protective tape PT.
此時,帶回收部5係與剝離台1的移動速度同步,以相同的速度將剝離帶Ts捲繞回收。又,控制部70係為了不讓剝離帶Ts自吸附板25下垂,因應捲繞速度及距離調整吸附板24a的吸引力。 At this time, the tape collection unit 5 winds up and collects the peeling tape Ts at the same speed in synchronization with the moving speed of the peeling table 1. Moreover, the control unit 70 adjusts the suction force of the suction plate 24a in accordance with the winding speed and the distance so as not to allow the peeling tape Ts to hang down from the suction plate 25.
當第一黏貼輥21黏貼至剝離帶Ts的後端時,如圖8所示,在藉由吸附板24b吸附著已經切斷的剝離帶Ts的狀態下,黏貼單元3上升。帶回收部5係與剝離台1的移動同步,將至保護帶PT的前端緣為止的剝離帶Ts予以捲繞。 When the first adhesive roller 21 is adhered to the rear end of the peeling tape Ts, as shown in FIG. 8, the adhesive unit 3 is raised in a state where the peeling tape Ts that has been cut is adsorbed by the suction plate 24b. The belt collecting portion 5 is wound in the peeling belt Ts up to the front end edge of the protective tape PT in synchronization with the movement of the peeling table 1.
當保護帶PT的剝離開始端到達剝離板51的前端時,首先如圖9所示,剝離板51係以既定的荷重按壓剝離帶Ts與保護帶PT。之後,被剝離板51折回的同時,與剝離帶Ts合為一體的保護帶PT係隨著剝離台1的移動,自晶圓W被剝離。 When the peeling start end of the protective tape PT reaches the leading end of the peeling plate 51, first, as shown in FIG. 9, the peeling plate 51 presses the peeling tape Ts and the protective tape PT with a predetermined load. Thereafter, the protective tape PT integrated with the peeling tape Ts is folded back from the wafer W as the peeling table 1 moves.
剝離板51於通過剝離帶Ts的黏貼部位時,一面以其前端僅按壓並折回保護帶PT,一面將其自晶圓W逐漸剝離。 When the peeling plate 51 passes through the adhesive portion of the peeling tape Ts, the peeling plate 51 is gradually peeled off from the wafer W while pressing and folding back the protective tape PT.
配合保護帶PT的剝離開始端到達第二黏貼輥22的下端的時間點,黏貼單元3係如圖10所示,維持前低後高的傾斜姿勢下降至既定高度。 When the peeling start end of the protective tape PT reaches the lower end of the second adhesive roller 22, the pasting unit 3 is lowered to a predetermined height as shown in FIG.
當黏貼單元3下降至既定高度時,利用第二黏貼輥22將剝離帶Ts黏貼至保護帶PT的黏貼終止端。 When the pasting unit 3 is lowered to a predetermined height, the peeling tape Ts is adhered to the pasting end of the protective tape PT by the second adhesive roller 22.
之後如圖11所示,黏貼單元3係隨著剝離台1前進移動,以較剝離台1的移動速度快的速度移動。因此,在剝離板51到達剝離終止端之前,一面調整吸附板24對剝離帶Ts施加的吸附力,一面藉由第二黏貼輥22將剝離帶Ts黏貼至保護帶PT上。 Thereafter, as shown in FIG. 11, the pasting unit 3 moves at a speed faster than the moving speed of the peeling table 1 as the peeling table 1 moves forward. Therefore, before the peeling plate 51 reaches the peeling end, the peeling tape Ts is adhered to the protective tape PT by the second bonding roller 22 while adjusting the suction force applied to the peeling tape Ts by the suction plate 24.
當結束將剝離帶Ts黏貼到後端側的保護帶PT時,黏貼單元3即停止動作。之後,黏貼單元3係如圖12所示,後退並維持與剝離單元4之間的初期設定距離,並且搖動回復到前低後高的傾斜姿勢。 When the peeling tape Ts is pasted to the protective tape PT on the rear end side, the pasting unit 3 stops operating. Thereafter, as shown in FIG. 12, the pasting unit 3 retreats and maintains the initial set distance from the peeling unit 4, and shakes back to the front low and high tilt posture.
接著,黏貼單元3及剝離單元4係返回上方的待機位置。 Next, the pasting unit 3 and the peeling unit 4 are returned to the upper standby position.
以上結束了將保護帶PT自晶圓W剝離的一連串動作,接著重複相同的動作直到達到既定片數為止。 This completes a series of operations of stripping the guard tape PT from the wafer W, and then repeats the same operation until a predetermined number of sheets is reached.
根據上述實施例裝置,將長度短的剝離帶Ts黏貼到保護帶PT的剝離開始端側,並且藉由剝離板51使剝離帶Ts及保護帶PT互相抵接然後將其折回剝離,因此能夠抑制結束剝離之晶圓W的表面所產生的起伏。即,如習知方法般降低剝離帶Ts及保護帶PT彼此重疊的部分,且由於剝離板51的抵接使得保護帶PT的剝離起點與剝離方向正交。因此,藉由此種相互作用,因拉力而往保護帶PT的寬度方向收縮的應力一面受到剝離板51的限制,應力一面自保護帶的外周朝徑向均勻地施加。結果得以抑制晶圓W產生起伏,進而避免晶圓W的破損。 According to the apparatus of the above-described embodiment, the peeling tape Ts having a short length is adhered to the peeling start end side of the protective tape PT, and the peeling tape Ts and the protective tape PT are brought into contact with each other by the peeling plate 51 and then folded back, thereby being able to suppress The undulation generated by the surface of the peeled wafer W is finished. That is, the portion where the peeling tape Ts and the protective tape PT overlap each other is reduced as in the conventional method, and the peeling starting point of the protective tape PT is orthogonal to the peeling direction due to the contact of the peeling plate 51. Therefore, by such an interaction, the stress which is contracted in the width direction of the protective tape PT due to the tensile force is restricted by the peeling plate 51, and the stress is uniformly applied in the radial direction from the outer circumference of the protective tape. As a result, it is possible to suppress the wafer W from undulating, thereby preventing the wafer W from being damaged.
此外,儘管將帶狀的剝離帶Ts切斷成窄長方形,仍橫跨剝離處理後及剝離處理中的保護帶PT的剝離開始端及剝離終止端黏貼剝離帶Ts,因此可以接連捲繞回收複數片的保護帶PT。又,亦可降低剝離帶Ts的消耗量。 In addition, although the strip-shaped peeling tape Ts is cut into a narrow rectangular shape, the peeling tape Ts is adhered across the peeling start end and the peeling end end of the protective tape PT after the peeling treatment and the peeling treatment, so that the winding can be successively wound and recovered. The protection of the film is PT. Moreover, the consumption amount of the peeling tape Ts can also be reduced.
又,本發明亦可以如下的形態來實施。 Further, the present invention can also be implemented in the following aspects.
(1)於上述實施例中,在保護帶PT的剝離開始端及剝離終止端切換黏貼單元3的傾斜姿勢,但並不限定為此形態。例如,亦可使黏貼單元3往一方向搖動然後將剝離帶Ts黏貼到保護帶PT上。於實施此種實施形態的情況下,例如只要以如下方式構成即可。 (1) In the above embodiment, the inclined posture of the pasting unit 3 is switched at the peeling start end and the peeling end end of the protective tape PT, but the configuration is not limited thereto. For example, the adhesive unit 3 can also be shaken in one direction and then the release tape Ts can be attached to the protective tape PT. In the case of carrying out such an embodiment, for example, it may be configured as follows.
如圖13所示,使自第一黏貼輥21至第二黏貼輥22之間所配備的吸附板24A以既定的曲率半徑朝下突出彎曲。 As shown in Fig. 13, the suction plate 24A provided between the first bonding roller 21 and the second bonding roller 22 is bent downward with a predetermined radius of curvature.
接著說明藉由此實施例裝置將保護帶PT自晶圓W剝離的一連串動作。 Next, a series of actions of peeling the protective tape PT from the wafer W by the apparatus of this embodiment will be described.
如圖14所示,使黏貼單元3以前低後高的傾斜姿勢下降至既定高度,並藉由第一黏貼輥21將剝離帶Ts黏貼於保護帶PT的剝離開始端。之後,如兩點鏈線所示,藉由升降台17使黏貼單元3與剝離台1的移動同步地下降,並利用致動器使黏貼單元3搖動,將至吸附板24a所吸附的部分為止的剝離帶Ts黏貼至保護帶PT上。於此時點,黏貼單元3的後端的剝離帶Ts係為了不黏貼到保護帶PT上,其姿勢成為大致水平。 As shown in FIG. 14, the pasting position of the adhesive tape 3 is lowered to a predetermined height, and the peeling tape Ts is adhered to the peeling start end of the protective tape PT by the first adhesive roller 21. Thereafter, as shown by the two-dot chain line, the adhesion unit 3 is lowered in synchronization with the movement of the peeling stage 1 by the elevating table 17, and the sticking unit 3 is shaken by the actuator to the portion sucked by the adsorption plate 24a. The peeling tape Ts is adhered to the protective tape PT. At this point, the peeling tape Ts of the rear end of the pasting unit 3 is substantially horizontal in order not to adhere to the protective tape PT.
於維持水平姿勢的狀態下使黏貼單元3上升 。之後,藉由剝離板51將保護帶PT自晶圓W逐漸剝離。於此剝離過程中,根據預定的距離或是利用編碼器等檢測出的剝離台1的位置資訊,當剝離台1到達既定的位置時,即如圖15所示般將黏貼單元3下降到既定高度。此時,吸附板24b所吸附的剝離帶Ts的前端係被黏貼至保護帶PT上。之後,以較剝離台1的移動速度快的速度或是使剝離台1的移動減速,一面使黏貼單元3下降、搖動,一面將既定長度的剝離帶Ts黏貼到保護帶PT的剝離終止端為止。 Adhesive unit 3 is raised while maintaining a horizontal posture . Thereafter, the protective tape PT is gradually peeled off from the wafer W by the peeling plate 51. In the stripping process, the sticking unit 3 is lowered to a predetermined position as shown in FIG. 15 according to a predetermined distance or position information of the peeling table 1 detected by an encoder or the like. height. At this time, the front end of the peeling tape Ts adsorbed by the suction plate 24b is adhered to the protective tape PT. After that, the peeling tape Ts of a predetermined length is adhered to the peeling end of the protective tape PT while the adhesive unit 3 is lowered and shaken at a speed faster than the moving speed of the peeling table 1 or the movement of the peeling table 1 is decelerated. .
根據此構成,要於保護帶PT的後端側將剝離帶Ts剝離時,不需要使黏貼單元3前進移動。 According to this configuration, when the peeling tape Ts is peeled off on the rear end side of the protective tape PT, it is not necessary to move the pasting unit 3 forward.
(2)於上述實施例中,在將剝離帶Ts黏貼至保護帶PT之後,亦可切斷剝離帶Ts。 (2) In the above embodiment, the peeling tape Ts may be cut after the peeling tape Ts is adhered to the protective tape PT.
(3)於上述實施例中,亦可構成為刀具25進退於刀具保持器29。若根據此構成,可刪除收納蓋34的構成。 (3) In the above embodiment, the cutter 25 may be configured to advance and retreat to the tool holder 29. According to this configuration, the configuration of the storage cover 34 can be deleted.
(4)於上述實施例中,於不需要連續剝離複數片保護帶PT的情況下,亦可將剝離帶Ts黏貼於保護帶PT的後端側,並不將前後的保護帶PT彼此接連捲繞回收。 (4) In the above embodiment, in the case where it is not necessary to continuously peel off the plurality of protective tapes PT, the peeling tape Ts may be adhered to the rear end side of the protective tape PT, and the front and rear protective tapes PT are not connected to each other. Around recycling.
1‧‧‧剝離台 1‧‧‧ peeling station
2‧‧‧帶供給部 2‧‧‧With the supply department
3‧‧‧黏貼單元 3‧‧‧Adhesive unit
4‧‧‧剝離單元 4‧‧‧ peeling unit
5‧‧‧帶回收部 5‧‧‧With recycling department
6‧‧‧導軌 6‧‧‧ rail
7、13‧‧‧可動台 7, 13‧‧‧ movable platform
8‧‧‧脈衝馬達 8‧‧‧pulse motor
9‧‧‧螺旋軸 9‧‧‧Spiral axis
11‧‧‧水平框架 11‧‧‧ horizontal framework
14‧‧‧縱向框架 14‧‧‧ longitudinal frame
15、43‧‧‧基台 15, 43‧‧‧ abutments
16、44‧‧‧縱向軌道 16, 44‧‧‧ longitudinal orbit
17‧‧‧升降台 17‧‧‧ Lifting table
42‧‧‧支撐框架 42‧‧‧Support frame
46‧‧‧馬達 46‧‧‧Motor
47‧‧‧側板 47‧‧‧ side panels
51‧‧‧剝離板 51‧‧‧ peeling board
61‧‧‧導輥 61‧‧‧guide roller
62‧‧‧軋輥 62‧‧‧ Rolls
63‧‧‧張力輥 63‧‧‧ Tension roller
64‧‧‧支撐臂 64‧‧‧Support arm
70‧‧‧控制部 70‧‧‧Control Department
P‧‧‧軸 P‧‧‧ axis
Ts‧‧‧剝離帶 Ts‧‧‧ peeling tape
W‧‧‧晶圓 W‧‧‧ wafer
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2013225511A JP6247075B2 (en) | 2013-10-30 | 2013-10-30 | Protective tape peeling method and protective tape peeling apparatus |
JP2013-225511 | 2013-10-30 |
Publications (2)
Publication Number | Publication Date |
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TW201515847A true TW201515847A (en) | 2015-05-01 |
TWI641492B TWI641492B (en) | 2018-11-21 |
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TW103136399A TWI641492B (en) | 2013-10-30 | 2014-10-22 | Protective tape separating method and protective tape separating apparatus |
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JP (1) | JP6247075B2 (en) |
KR (1) | KR20150050395A (en) |
CN (1) | CN104600017A (en) |
TW (1) | TWI641492B (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI616343B (en) * | 2016-08-10 | 2018-03-01 | Jhen Tou Technology Co Ltd | Automatic wafer protection layer removal equipment |
JP6833541B2 (en) * | 2017-02-08 | 2021-02-24 | 日東電工株式会社 | Adhesive tape joining method and adhesive tape joining device |
KR102440739B1 (en) * | 2020-05-25 | 2022-09-07 | (주) 엔지온 | An apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
KR102440741B1 (en) * | 2020-05-25 | 2022-09-07 | (주) 엔지온 | Method for controlling an apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
CN113664893B (en) * | 2021-07-27 | 2022-11-01 | 中航西安飞机工业集团股份有限公司 | Separating device and separating method for special laying cloth of large airplane |
CN116812623B (en) * | 2023-08-30 | 2023-11-03 | 赛德半导体有限公司 | Packaging roller for flexible ultrathin glass |
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JP4057478B2 (en) * | 2003-06-26 | 2008-03-05 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
JP4326519B2 (en) * | 2005-03-31 | 2009-09-09 | 日東電工株式会社 | Protective tape peeling method and apparatus using the same |
JP4740296B2 (en) * | 2008-08-28 | 2011-08-03 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
JP5317280B2 (en) * | 2009-07-16 | 2013-10-16 | 株式会社タカトリ | Protective tape peeling device |
JP5431053B2 (en) * | 2009-07-27 | 2014-03-05 | 日東電工株式会社 | Adhesive tape application method and adhesive tape application device |
JP5635363B2 (en) * | 2010-10-19 | 2014-12-03 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus |
-
2013
- 2013-10-30 JP JP2013225511A patent/JP6247075B2/en active Active
-
2014
- 2014-10-22 TW TW103136399A patent/TWI641492B/en not_active IP Right Cessation
- 2014-10-27 KR KR1020140145751A patent/KR20150050395A/en not_active Application Discontinuation
- 2014-10-30 CN CN201410597339.4A patent/CN104600017A/en active Pending
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JP6247075B2 (en) | 2017-12-13 |
JP2015088606A (en) | 2015-05-07 |
CN104600017A (en) | 2015-05-06 |
KR20150050395A (en) | 2015-05-08 |
TWI641492B (en) | 2018-11-21 |
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