TW201515847A - Protective tape separating method and protective tape separating apparatus - Google Patents

Abstract

A separating tape is adhered to a protective tape on a surface of a semiconductor wafer and is then separated with high precision. A strip-shaped separating tape Ts of which a width is less than a diameter of a semiconductor wafer W is cut by cutting tools to a predetermined length. The separating tape Ts that is cut to the predetermined length is adhered to a separating start end of the protective tape by a first adhering roll so that a front end of a separating plate 51 that is tapering toward the front end crosses and touches the separating tape Ts and the protective tape. In a situation where the separating tape Ts is bent back by the separating plate 51, the wafer W and the separating plate 51 are moved horizontally in opposite directions while the separating tape Ts is wound up. As such, the protective tape is separated from the semiconductor water W.

Description

Protective tape peeling method and protective tape peeling device

The present invention relates to a protective tape peeling method and a protective tape peeling device which adheres a peeling adhesive tape to a protective tape adhered to a circuit pattern forming surface of a semiconductor wafer (hereinafter referred to as "wafer" as appropriate). The protective tape is peeled off integrally from the wafer by peeling off the peeling tape.

The method of peeling the protective tape from the surface of the wafer is performed, for example, by adhering the protective tape to the surface of the wafer on which the circuit pattern forming process has been completed, and then uniformly applying the back surface to the back surface. The wafer to which the protective tape is attached is peeled off from the surface before being transferred to the cutting step of shredding into wafers.

A specific method of peeling the protective tape from the surface of the wafer is carried out, for example, by pressing a strip-shaped peeling tape with a bonding roller of a built-in heater and pasting a predetermined length to the front end of the protective tape adhered to the wafer. After the side, the peeling tape was cut. Thereafter, the protective tape was peeled off from the wafer while the peeling stage was being pulled while pulling and winding the narrow rectangular peeling tape. Next, after cutting, the front end of the protective tape in a free state is adhered to a predetermined length to the rear end side of the protective tape by an adhesive roller. Self-wafer by repeating the adhesion of the peeling tape and the peeling of the protective tape The ends of the peeled protective tape are wound up and recovered by a narrow rectangular peeling tape (refer to Patent Document 1).

Further, as another method, the peeling tape having a smaller width than the wafer is peeled off from the peeling start end to the end of the protective tape by the sharp edge member at the tip end, and is peeled off, thereby peeling off the protective tape. Wafer surface peeling (refer to Patent Document 2).

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-23612

[Patent Document 2] Japanese Patent Application No. 2011-029434

In recent years, in order to enable high-density mounting with the rapid development of applications, wafer requirements have been reduced. Moreover, the size of the wafer tends to increase as the thickness is reduced. As wafers become larger, wafer holders need to be larger than wafers.

However, although the entire back surface of the wafer is adsorbed and held on the stripping stage, it still occurs during the process of adhering the stripping tape and gradually peeling off the protective tape from the wafer, causing undulation on the wafer side of the stripping off the protective tape, resulting in crystal The problem of round damage.

The present invention has been made in view of the above circumstances, and a main object thereof is to provide a protective tape peeling method and a protective tape peeling device capable of peeling a protective tape from a semiconductor wafer with high precision.

In order to achieve the object, the present invention has the following constitution.

That is, sticking the peeling tape to the surface of the semiconductor wafer A protective tape peeling method in which a protective tape is integrally peeled off from a surface of a semiconductor wafer and a peeling tape by peeling off the peeling tape, the protective tape peeling method is characterized by: a cutting process, a width a strip having a smaller diameter than the semiconductor wafer and having a strip shape is cut into a predetermined length by a cutter. The first pasting process adheres the strip to a predetermined length by the first adhesive member to the protective tape. The peeling start end side and the peeling process are such that the tip end of the peeling sheet that is thinner toward the front end crosses the peeling tape and the protective tape, and the semiconductor wafer is folded while the peeling tape is folded back by the peeling plate. The release tape is wound while horizontally moving in a direction away from the release sheet, whereby the protective tape is peeled off from the semiconductor wafer.

(Operation and Effect) According to this method, the peeling tape having a width smaller than the diameter of the semiconductor wafer adheres only to a predetermined distance on the peeling start end side of the protective tape. Further, in the peeling belt of the protective tape, in a state in which the front end of the peeling plate is in contact with each other, the protective tape is gradually peeled off while moving from the portion where the peeling tape is adhered to the protective tape to the portion where only the protective tape is applied. That is, in a state where the overlapping portion of the peeling tape is small, only the protective tape is pulled and peeled off. Further, the peeling portion of the protective tape is a straight line due to the peeling plate. Due to the multiplication effect of the two phenomena, the tensile force acting on the protective tape becomes slightly average, and the stress acting on the wafer also becomes slightly average. Therefore, it is possible to suppress the wafer from being undulated by the conventional protective tape peeling method, thereby preventing wafer damage.

In addition, in the above method, preferably, the stripping process has a second pasting process, which is from the proximity of the semiconductor wafer. Adhesive tape from the stripping end to the stripping end, a strip of a predetermined length is adhered to the strip by the second adhesive member, and the strip is removed by repeating the second sticking process from the first pasting process Recycled in succession.

The method of providing the second pasting process from the first pasting process can be carried out, for example, as follows.

The first adhesive member and the second adhesive member provided at a predetermined interval in the peeling direction, and the adsorption portion that is divided by the cutter between the first adhesive member and the second adhesive member On the pasting unit, the peeling tape is rolled and held, and the first pasting process is performed by cutting the peeling tape by the cutter before reaching the predetermined height before lowering the tilting posture of the pasting unit to the predetermined height. When the peeling tape is pressed and adhered to the peeling start end of the protective tape by the first adhesive member, the peeling process is synchronized with the horizontal movement of the semiconductor wafer, and the peeling tape is wound on one side by the first adhesive member. After the peeling tape of a predetermined length is adhered to the protective tape, the adhesive unit is raised, and the second pasting process causes the adhesive unit to rock and then descends to a predetermined height in a low front and high tilting posture, so that the second adhesive member abuts against the protection. The peeling end of the tape is in a state of pressing the peeling tape wound on the second adhesive member, so that the adhesive unit moves faster than the semiconductor wafer Speed forward movement, the release adhesive tape to a predetermined length of the protective tape stripped termination end side.

According to this method, the peeling treatment of the protective tape can be continuously performed, and the consumption of the peeling tape can be greatly reduced.

Further, the present invention has the following constitution in order to achieve the object.

That is, a protective tape peeling device is a method in which a peeling tape is adhered to a protective tape adhered to a surface of a semiconductor wafer, and the protective tape is peeled off from the surface of the semiconductor wafer and the peeling tape by peeling off the peeling tape. In the tape peeling device, the tape peeling device includes a peeling station that holds and holds a semiconductor wafer having the protective tape, and a peeling tape supply mechanism that feeds the strip-shaped peeling tape and the first adhesive member. The peeling tape is adhered to the peeling start end side of the protective tape adhered to the semiconductor wafer held by the stage, and the peeling tape of the protective tape which is to be adhered to the peeling start end side is cut into a predetermined length, and the peeling plate is thinner toward the front end. And the peeling tape and the protective tape intersect with the peeling tape and the protective tape, and the peeling tape is folded back, and the first driving mechanism horizontally moves the group of the first adhesive member and the peeling plate in a direction away from the peeling table. And a belt recovery mechanism that winds up the release tape that has been integrated with the aforementioned protective tape.

(Operation, Effect) According to this configuration, the above-described method of performing the peeling process from the first pasting process can be suitably performed.

Further, in the above configuration, it is preferable that the adhesive unit includes the first adhesive member, the second adhesive member, and the first adhesive member and the second adhesive member which are provided at a predetermined interval in the peeling direction. An adsorption section that is divided by a cutter, And a rocking mechanism for tilting the pasting unit in the front-rear direction with respect to the peeling direction, and lifting and lowering the driving mechanism to relatively raise and lower the adhesive unit and the peeling table between the pasting position and the standby position, and the second driving mechanism The aforementioned pasting unit moves horizontally.

According to this configuration, the above method of performing the first pasting process to the second pasting process can be suitably performed.

According to the protective tape peeling method and the protective tape peeling device of the present invention, by applying the tensile force evenly to the peeling portion of the protective tape, the protection is suppressed in a state where the undulation generated on the wafer side of the protective tape is peeled off. Strip stripped from the wafer. Therefore, the protective tape can be peeled off from the wafer with high precision while avoiding breakage of the wafer.

1‧‧‧ peeling station

2‧‧‧With the supply department

3‧‧‧Adhesive unit

4‧‧‧ peeling unit

5‧‧‧With recycling department

21‧‧‧First Adhesive Roller

22‧‧‧Second adhesive roller

23‧‧‧Tool unit

24‧‧‧Adsorption plate

51‧‧‧ peeling board

PT‧‧‧protective tape

Ts‧‧‧ peeling tape

W‧‧‧Semiconductor Wafer

Fig. 1 is a front elevational view showing the entire protective tape peeling device.

2 is a plan view of a main portion of the pasting unit and the peeling unit.

Figure 3 is a top plan view of the tool unit.

Figure 4 is a left side view of the tool unit.

Fig. 5 is a view showing a peeling action of the protective tape.

Fig. 6 is a view showing a peeling action of the protective tape.

Fig. 7 is a view showing a peeling action of the protective tape.

Fig. 8 is a view showing a peeling action of the protective tape.

Fig. 9 is a view showing a peeling action of the protective tape.

Fig. 10 is a view showing a peeling action of the protective tape.

Fig. 11 is a view showing a peeling action of the protective tape.

Fig. 12 is a view showing a peeling action of the protective tape.

Fig. 13 is a front elevational view showing the entire protective tape peeling device of a modification.

Fig. 14 is a view showing a peeling operation of a protective tape according to a modification.

Fig. 15 is a view showing a peeling operation of a protective tape according to a modification.

[Formation of the Invention]

Embodiments of the protective tape peeling device of the present invention will be described below with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front elevational view showing the overall configuration of a protective tape peeling device in accordance with an embodiment of the present invention.

This protective tape peeling device is composed of a peeling table 1, a tape supply unit 2, a pasting unit 3, a peeling unit 4, a tape collecting unit 5, and the like, as shown in Fig. 1 . The respective configurations will be specifically described below.

The peeling station 1 is configured such that a semiconductor wafer W (hereinafter simply referred to as "wafer W") to which a protective tape is adhered on a surface on which a circuit pattern is formed is vacuum-adsorbed from the back side. Further, the peeling table 1 is attached to the movable table 7, and the movable table 7 is supported so as to be slidable back and forth by a pair of right and left guide rails 6 that are horizontally arranged in the front-rear direction. The movable table 7 is driven by screw feed by a screw shaft 9 that is driven forward and reverse by a pulse motor 8. Further, the guide rail 6, the movable table 7, the pulse motor 8, the screw shaft 9, and the like constitute the first drive mechanism of the present invention.

The tape supply unit 2 is a width ratio wafer derived from the raw material roll The peeling tape Ts having a small diameter of W is guided to the lower end portion of the pasting unit 3. Further, the tape supply unit 2 corresponds to the peeling tape supply mechanism of the present invention.

FIG. 2 shows the main parts of the pasting unit 3 and the peeling unit 4. The pasting unit 3 is provided with a longitudinal frame 14 that is suspended from the movable table 13, and the movable table 13 is movable by a linear guide provided in the upper horizontal frame 11. That is, the pasting unit 3 is axially supported by the pair of left and right support plates 18, which are slidably lifted via the longitudinal rails 16 provided by the base 15 fixed to the lower portion of the longitudinal frame 14. The way is supported. Further, the pasting unit 3 is supported by the lifting table 17 so that the bonding unit 3 can swing back and forth around the axis P by an actuator such as a cylinder (not shown). The lifting platform 17 is lifted and lowered by a ball shaft that is coupled to the motor.

The system of the pasting unit 3 is provided with a first adhesive roller 21, a second adhesive roller 22, a cutter unit 23, and an adsorption plate 24 on the inner side of the support plate 18. Further, the first bonding roller 21 corresponds to the first bonding portion of the present invention, the second bonding roller 22 corresponds to the second bonding portion of the present invention, the adsorption plate 24 corresponds to the adsorption portion, and the linear guide corresponds to the second driving mechanism.

The first bonding roller 21 and the second bonding roller 22 are rotatably supported by the support plate 18 at a predetermined interval before and after the conveyance direction of the release tape Ts. The cutter 25 is placed between the first adhesive roller 21 and the second adhesive roller 22 in the width direction of the peeling tape Ts so that the cutter 25 is placed between the first and second adhesive rollers 22 in the width direction of the peeling tape Ts. Further, in the present embodiment, the guide roller R is provided on the rear side of the second adhesive roller 22, but the guide roller may not be provided.

The cutter unit 23 is as shown in FIG. 3 and FIG. The cutter portion 27 that is placed on the upper rail of the pasting unit 3 moves. The cutter unit 27 is composed of a movable table 28 and a tool holder 29. The cutter 25 with the blade facing downward is detachably attached to the cutter holder 29.

Near the right end of the guide rail 26, the shaft is supported by a drive pulley 30 that is driven by the motor in the reverse direction, and on the left side of the guide rail 26, the shaft is free to rotate the pulley 31. The slide engagement portion 33 of the movable table 28 is coupled to the rotation belt 32 that is wound between the drive pulley 30 and the free rotation pulley 31, and the movable table 28 is moved to the left and right by the forward and reverse rotation of the rotation belt 32.

Further, a lid 34 is provided at the left and right ends of the bottom surface of the cutter unit 23, and the lid 34 is a blade that accommodates the cutter 25 that protrudes from between the suction plates 24a and 24b.

The adsorption plate 24 is connected to the external vacuum device via a flow path. Further, the suction force can be adjusted by operating the solenoid valve provided in the flow path by the control unit 70.

The support frame 42 made of an aluminum-drawn material of the peeling unit 4 is fixed across a pair of left and right longitudinal frames 41 that are erected from the apparatus body. A box-shaped base 43 is coupled to a central portion of the support frame 42 in the left-right direction. Further, the elevating table 45 that is slidably supported by the pair of right and left longitudinal rails 44 provided on the base 43 is lifted and lowered by the ball shaft that is driven by the motor 46. The lifting table 45 is equipped with a peeling unit 4.

The lifting platform 45 is configured in a hollow frame shape that penetrates vertically. The peeling unit 4 is attached to the inner lower portion of the side plate 47 provided on the left and right of the elevating table 45. The peeling plate 51 is attached across the side plates 47.

The peeling plate 51 has a length equal to or larger than the diameter of the wafer W, and It is formed into a tapered shape that is thinner toward the front end.

Further, a plurality of guide rollers 61 for collecting, a roll 62, and a tension roller 63 are disposed above the peeling unit 4.

The guide roller 61 for recovery is rotatably supported by the shaft. The tension roller 63 is rotatably provided to the support arm 64 and is configured to be swingable via the support arm 64. Therefore, the tension roller 63 applies an appropriate tension to the peeling tape Ts that is guided and rolled back.

The guide roller 61 and the tension roller 63 for recovery are configured as a wide roll having a length longer than the diameter of the wafer W, and the outer peripheral surface thereof is a difficult-contact surface coated with a fluororesin.

The tape collection unit 5 winds up and collects the peeling tape Ts sent from the peeling unit 4. Further, the tape collecting portion 5 corresponds to the tape collecting mechanism of the present invention.

Next, a series of operations in which the protective tape PT is peeled off from the wafer W by the apparatus of the above-described embodiment will be described with reference to the description of the drawings.

When the wafer W is placed on the peeling table 1 by a transfer mechanism such as a robot arm, the peeling stage 1 sucks and holds the wafer W, and then moves from the standby position to the pasting position of the peeling tape Ts as shown in FIG. .

When the peeling table 1 reaches the pasting start position, the pasting unit 3 on which the peeling tape Ts is wound is held down to a predetermined height while maintaining the front low and high tilt posture. At this time, the cutter 25 of the cutter unit 23 is moved to the other end, and the peeling tape Ts adsorbed by the suction plate 24 is cut.

As shown in FIG. 6, when the pasting unit 3 is lowered to a predetermined height, the peeling tape Ts is adhered to the peeling of the protective tape PT by the first adhesive roller 21. The beginning.

Thereafter, as shown in FIG. 7, the first adhesive roller 21 is attached to the protective tape PT by the peeling tape Ts of a predetermined length as the peeling table 1 moves forward. In other words, the portion of the peeling tape Ts that is adsorbed by the suction plate 24a on the front side from the first bonding roller 21 is adhered to the front side of the protective tape PT.

At this time, the tape collection unit 5 winds up and collects the peeling tape Ts at the same speed in synchronization with the moving speed of the peeling table 1. Moreover, the control unit 70 adjusts the suction force of the suction plate 24a in accordance with the winding speed and the distance so as not to allow the peeling tape Ts to hang down from the suction plate 25.

When the first adhesive roller 21 is adhered to the rear end of the peeling tape Ts, as shown in FIG. 8, the adhesive unit 3 is raised in a state where the peeling tape Ts that has been cut is adsorbed by the suction plate 24b. The belt collecting portion 5 is wound in the peeling belt Ts up to the front end edge of the protective tape PT in synchronization with the movement of the peeling table 1.

When the peeling start end of the protective tape PT reaches the leading end of the peeling plate 51, first, as shown in FIG. 9, the peeling plate 51 presses the peeling tape Ts and the protective tape PT with a predetermined load. Thereafter, the protective tape PT integrated with the peeling tape Ts is folded back from the wafer W as the peeling table 1 moves.

When the peeling plate 51 passes through the adhesive portion of the peeling tape Ts, the peeling plate 51 is gradually peeled off from the wafer W while pressing and folding back the protective tape PT.

When the peeling start end of the protective tape PT reaches the lower end of the second adhesive roller 22, the pasting unit 3 is lowered to a predetermined height as shown in FIG.

When the pasting unit 3 is lowered to a predetermined height, the peeling tape Ts is adhered to the pasting end of the protective tape PT by the second adhesive roller 22.

Thereafter, as shown in FIG. 11, the pasting unit 3 moves at a speed faster than the moving speed of the peeling table 1 as the peeling table 1 moves forward. Therefore, before the peeling plate 51 reaches the peeling end, the peeling tape Ts is adhered to the protective tape PT by the second bonding roller 22 while adjusting the suction force applied to the peeling tape Ts by the suction plate 24.

When the peeling tape Ts is pasted to the protective tape PT on the rear end side, the pasting unit 3 stops operating. Thereafter, as shown in FIG. 12, the pasting unit 3 retreats and maintains the initial set distance from the peeling unit 4, and shakes back to the front low and high tilt posture.

Next, the pasting unit 3 and the peeling unit 4 are returned to the upper standby position.

This completes a series of operations of stripping the guard tape PT from the wafer W, and then repeats the same operation until a predetermined number of sheets is reached.

According to the apparatus of the above-described embodiment, the peeling tape Ts having a short length is adhered to the peeling start end side of the protective tape PT, and the peeling tape Ts and the protective tape PT are brought into contact with each other by the peeling plate 51 and then folded back, thereby being able to suppress The undulation generated by the surface of the peeled wafer W is finished. That is, the portion where the peeling tape Ts and the protective tape PT overlap each other is reduced as in the conventional method, and the peeling starting point of the protective tape PT is orthogonal to the peeling direction due to the contact of the peeling plate 51. Therefore, by such an interaction, the stress which is contracted in the width direction of the protective tape PT due to the tensile force is restricted by the peeling plate 51, and the stress is uniformly applied in the radial direction from the outer circumference of the protective tape. As a result, it is possible to suppress the wafer W from undulating, thereby preventing the wafer W from being damaged.

In addition, although the strip-shaped peeling tape Ts is cut into a narrow rectangular shape, the peeling tape Ts is adhered across the peeling start end and the peeling end end of the protective tape PT after the peeling treatment and the peeling treatment, so that the winding can be successively wound and recovered. The protection of the film is PT. Moreover, the consumption amount of the peeling tape Ts can also be reduced.

Further, the present invention can also be implemented in the following aspects.

(1) In the above embodiment, the inclined posture of the pasting unit 3 is switched at the peeling start end and the peeling end end of the protective tape PT, but the configuration is not limited thereto. For example, the adhesive unit 3 can also be shaken in one direction and then the release tape Ts can be attached to the protective tape PT. In the case of carrying out such an embodiment, for example, it may be configured as follows.

As shown in Fig. 13, the suction plate 24A provided between the first bonding roller 21 and the second bonding roller 22 is bent downward with a predetermined radius of curvature.

Next, a series of actions of peeling the protective tape PT from the wafer W by the apparatus of this embodiment will be described.

As shown in FIG. 14, the pasting position of the adhesive tape 3 is lowered to a predetermined height, and the peeling tape Ts is adhered to the peeling start end of the protective tape PT by the first adhesive roller 21. Thereafter, as shown by the two-dot chain line, the adhesion unit 3 is lowered in synchronization with the movement of the peeling stage 1 by the elevating table 17, and the sticking unit 3 is shaken by the actuator to the portion sucked by the adsorption plate 24a. The peeling tape Ts is adhered to the protective tape PT. At this point, the peeling tape Ts of the rear end of the pasting unit 3 is substantially horizontal in order not to adhere to the protective tape PT.

Adhesive unit 3 is raised while maintaining a horizontal posture . Thereafter, the protective tape PT is gradually peeled off from the wafer W by the peeling plate 51. In the stripping process, the sticking unit 3 is lowered to a predetermined position as shown in FIG. 15 according to a predetermined distance or position information of the peeling table 1 detected by an encoder or the like. height. At this time, the front end of the peeling tape Ts adsorbed by the suction plate 24b is adhered to the protective tape PT. After that, the peeling tape Ts of a predetermined length is adhered to the peeling end of the protective tape PT while the adhesive unit 3 is lowered and shaken at a speed faster than the moving speed of the peeling table 1 or the movement of the peeling table 1 is decelerated. .

According to this configuration, when the peeling tape Ts is peeled off on the rear end side of the protective tape PT, it is not necessary to move the pasting unit 3 forward.

(2) In the above embodiment, the peeling tape Ts may be cut after the peeling tape Ts is adhered to the protective tape PT.

(3) In the above embodiment, the cutter 25 may be configured to advance and retreat to the tool holder 29. According to this configuration, the configuration of the storage cover 34 can be deleted.

(4) In the above embodiment, in the case where it is not necessary to continuously peel off the plurality of protective tapes PT, the peeling tape Ts may be adhered to the rear end side of the protective tape PT, and the front and rear protective tapes PT are not connected to each other. Around recycling.

1‧‧‧ peeling station

2‧‧‧With the supply department

3‧‧‧Adhesive unit

4‧‧‧ peeling unit

5‧‧‧With recycling department

6‧‧‧ rail

7, 13‧‧‧ movable platform

8‧‧‧pulse motor

9‧‧‧Spiral axis

11‧‧‧ horizontal framework

14‧‧‧ longitudinal frame

15, 43‧‧‧ abutments

16, 44‧‧‧ longitudinal orbit

17‧‧‧ Lifting table

42‧‧‧Support frame

46‧‧‧Motor

47‧‧‧ side panels

51‧‧‧ peeling board

61‧‧‧guide roller

62‧‧‧ Rolls

63‧‧‧ Tension roller

64‧‧‧Support arm

70‧‧‧Control Department

P‧‧‧ axis

Ts‧‧‧ peeling tape

W‧‧‧ wafer

Claims (5)

A protective tape peeling method is disclosed in which a peeling tape is adhered to a protective tape adhered to a surface of a semiconductor wafer, and the protective tape is peeled off from the surface of the semiconductor wafer and the peeling tape by peeling off the peeling tape According to the method, the protective tape peeling method is characterized in that: a cutting process is performed, and a peeling tape having a width smaller than a diameter of the semiconductor wafer and having a strip shape is cut into a predetermined length by a cutter, and the first pasting process is performed by the first An adhesive member adheres the peeling tape cut into a predetermined length to the peeling start end side of the protective tape, and the peeling process, so that the front end of the peeling plate which is thinner toward the front end crosses and abuts the peeling tape and the protective tape, and In a state in which the peeling tape is folded back, the peeling tape is wound while horizontally moving the semiconductor wafer and the peeling plate in a direction away from each other, thereby peeling off the protective tape from the semiconductor wafer. The protective tape peeling method of claim 1, wherein the peeling process is provided with a second pasting process from the peeling end end of the semiconductor wafer to the peeling end, by the second adhesive member The strip of the predetermined length is adhered to the protective tape, and the protective tape is repeatedly wound and recovered by repeating the second pasting process from the first pasting process. The protective tape peeling method according to claim 2, wherein the first adhesive member and the second adhesive member which are provided at a predetermined interval before and after the peeling direction are provided between the first adhesive member and the second adhesive member. On the pasting unit of the adsorption portion that is separated by holding the cutter, the peeling tape is rolled and held and held. The first pasting process is performed by cutting the peeling tape by a cutter before the pasting posture of the pasting unit is lowered to a predetermined height, and when the predetermined height is reached, the peeling tape is pressed and pasted by the first adhesive member. At the peeling start end of the protective tape, the peeling process is performed in synchronization with the horizontal movement of the semiconductor wafer, and the peeling tape is wound on one side, and the peeling tape of a predetermined length is adhered to the protective tape by the first adhesive member to be pasted. The unit is raised, and the second pasting process causes the adhesive unit to shake and then descends to a predetermined height in a low front and high tilting posture, so that the second adhesive member abuts against the peeling end end of the protective tape, and presses the roll on the second adhesive. In the state of the peeling tape on the member, the pasting unit is moved forward at a speed faster than the moving speed of the semiconductor wafer, and the peeling tape of a predetermined length is adhered to the peeling end end side of the protective tape. A protective tape peeling device which adheres a peeling tape to a protective tape adhered to a surface of a semiconductor wafer, and peels off the peeling tape to peel off the protective tape from the surface of the semiconductor wafer and the peeling tape integrally peeled off In the apparatus, the protective tape peeling device includes a peeling stage on which a semiconductor wafer having the protective tape is placed, a peeling tape supply mechanism, and a strip-shaped peeling tape are supplied, and the first adhesive member is held by the peeling station. a peeling tape is adhered to the peeling start end side of the protective tape adhered to the semiconductor wafer, and the peeling tape of the protective tape which is to be adhered to the peeling start end side is cut into a predetermined length, and the peeling plate is thinner toward the front end, and The peeling tape and the protective tape are crossed and abutted, and the peeling tape is folded back. The first drive mechanism horizontally moves the group of the first adhesive member and the peeling plate and the peeling table in a direction away from the peeling table, and a tape collecting mechanism that winds and collects the peeling tape that has been integrated with the protective tape. The protective tape peeling device of claim 4, wherein the adhesive tape unit comprises the first adhesive member, the second adhesive member, and the first adhesive member and the second adhesive which are provided at a predetermined interval in the peeling direction. An adsorption unit that is divided by a cutter between the members, and a rocking mechanism that inclines the front and rear direction with respect to the peeling direction, and raises and lowers the driving mechanism to make the pasting unit and the peeling station adhere to each other. The positions are relatively raised and lowered, and the second driving mechanism moves the pasting unit horizontally.