CN104600017A - Protective tape separating method and protective tape separating apparatus - Google Patents
Protective tape separating method and protective tape separating apparatus Download PDFInfo
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- CN104600017A CN104600017A CN201410597339.4A CN201410597339A CN104600017A CN 104600017 A CN104600017 A CN 104600017A CN 201410597339 A CN201410597339 A CN 201410597339A CN 104600017 A CN104600017 A CN 104600017A
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- Prior art keywords
- boundary belt
- release band
- stripping
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- component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/17—Nature of material
- B65H2701/172—Composite material
- B65H2701/1726—Composite material including detachable components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
- B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a protective tape separating method and a protective tape separating apparatus. A tool is used to cut a trip-shaped separating strip, of which the width is less than the diameter of a semiconductor wafer, to be at a stipulated length. A first bonding roller is used to bond the separating strip cut to be at the stipulated length on a stripping starting end side of the protective tape. Then the top end of a separating plate, of which the thickness decreases towards the top end, is abutted against the protective strip in a crossing mode. Furthermore, when the separating plate is used to fold back the separating strip, a wafer and the separating plate are made to move towards a horizontal direction of relatively separating, and simultaneously, the stripping strip is rolled and taken. Thus the protective strip is stripped from the semiconductor wafer.
Description
Technical field
The boundary belt stripping means by peeling off this release band, boundary belt and release band peeled off from wafer integratedly after the present invention relates to the adhesive tape pasted on the boundary belt of the forming surface of the circuit pattern being glued to semiconductor crystal wafer (below, be suitably called " wafer ") and peel off and boundary belt stripping off device.
Background technology
As by the method for boundary belt from the sur-face peeling of wafer, such as, implement as follows.Complete circuit pattern formation processing wafer surface on paste boundary belt.Afterwards, the process of back of the body mill is implemented equably to the whole back side of this wafer.The wafer being pasted with boundary belt is transported to wafer carried out fine cut with the cutting action being separated into chip before, by the sur-face peeling of boundary belt from wafer.
As by the concrete method of boundary belt from the sur-face peeling of wafer, such as, implement as follows.Utilize the Sticking roller being built-in with heater the release band of band shape is pressed on the front of the boundary belt be secured on wafer and this release band is pasted specific length, afterwards this release band is cut off.Afterwards, move the release band pulling and be cut into rectangle (Japanese: short Books shape) making stripping table and in the process of being batched, boundary belt peeled off from wafer.Further, Sticking roller is utilized the front end of the boundary belt of free state after cut-out to be pasted on the rear end side of boundary belt with specific length.By repeatedly carrying out the stickup of release band and the stripping of boundary belt, thus connect between the end of the boundary belt utilizing the release band of rectangle will peel off from wafer and boundary belt batched recovery (with reference to Japanese Laid-Open 2011 ー No. 23612 publications).
In addition, as additive method, the top of certainly peeling away that the release band that width is less than wafer by band edge (Japanese: the エ ッ ジ) component utilizing top sharp presses on boundary belt plays in the scope peeling off and terminate till end.In this pressing process, by utilizing this band edge component to turn back release band while release band peeled off, thus by the sur-face peeling (with reference to Japan Patent 2011-029434 publication) of boundary belt from wafer.
Summary of the invention
the problem that invention will solve
In recent years, in order to the high-density installation of the rapid advances along with application can be realized, the slimming of wafer is required.In addition, while there is wafer slimming, the size of wafer becomes large tendency.Along with the maximization of wafer, the workbench for keeping also needs to maximize to wafer.
But, although the whole back side absorption of wafer is held in stripping table, is pasting release band and boundary belt created from the process that wafer is peeled off the problem making wafer breakage such being stripped the wafer side generation fluctuating of boundary belt.
The present invention considers that such situation is made, its main purpose is, provide the boundary belt stripping means and boundary belt stripping off device that boundary belt can be peeled off accurately from semiconductor crystal wafer.
for the scheme of dealing with problems
The present invention adopts structure as follows, to reach described such object.
Namely, the invention provides a kind of boundary belt stripping means, after the boundary belt on surface being glued to semiconductor crystal wafer pastes release band, by peeling off this release band by boundary belt and release band integratedly from the sur-face peeling of semiconductor crystal wafer, wherein, described boundary belt stripping means comprises following operation: cut off operation, in this cut-out operation, the release band utilizing cutter width to be less than the band shape of described semiconductor die diameter of a circle cuts into specific length; 1st adhering processes, in the 1st adhering processes, utilizing the 1st to paste, the described release band being cut into specific length is pasted on boundary belt by component peels away side, top; And stripping process; in this stripping process; the top of more thinner towards tip thickness peel plate is abutted with release band and boundary belt with intersecting; and; semiconductor crystal wafer and peel plate is made to move horizontally to the direction be relatively separated while release band batched under state after utilizing this peel plate release band to be turned back; thus, boundary belt is peeled off from semiconductor crystal wafer.
Adopt the method, release band width being less than brilliant diameter of a circle is only pasted on the predetermined distance peeling away side, top of boundary belt.In addition, in the stripping process of boundary belt, on the top of peel plate be connected to boundary belt be pasted with release band and the part overlapping with release band under the state of part only having boundary belt, the top of peel plate is moved and is peeled off by boundary belt.That is, under the less state (shorter distance) of the boundary belt part overlapping with release band, boundary belt is only pulled while peeled off by boundary belt.In addition, peel plate is utilized to make the stripping position of boundary belt linearly.Under the synergy of these two phenomenons, the drag force acting on boundary belt becomes roughly evenly and the stress acting on wafer also becomes roughly even.Thus, the fluctuating producing the wafer produced in the stripping means of boundary belt in the past can be suppressed, and then the breakage of wafer can be avoided.
In addition; in described boundary belt stripping means; preferably; stripping process comprises the 2nd adhering processes; in the 2nd adhering processes; utilize the 2nd stickup component the release band of specific length to be pasted on being positioned at of boundary belt and terminate the front portion of the front side of the direction of delaminate held to peeling off the part terminating end from the stripping of semiconductor crystal wafer, by repeatedly carrying out the operation playing the 2nd adhering processes from the 1st adhering processes, thus boundary belt is linked up and batches recovery.
As having the method playing the 2nd adhering processes from the 1st adhering processes, such as, can implement as follows.
Utilize this application unit to adsorb maintenance release band in application unit on stripping roll coil of strip frame, this application unit have configure in the mode separating predetermined distance before and after on direction of delaminate the described 1st paste component and the described 2nd and paste component, and paste divided adsorption section of opening between component across cutter at the 1st stickup component and the 2nd, in described 1st adhering processes, make application unit drop to specified altitude with the posture that forward downward tilts before utilize cutter release band to be cut off, utilize after application unit reaches specified altitude the 1st paste component release band is pressed and be pasted on boundary belt peel away top, in described stripping process, with semiconductor crystal wafer move horizontally synchronously while release band is batched while utilize the 1st to paste component the release band of specific length is pasted on boundary belt, application unit is made to increase afterwards, in described 2nd adhering processes, swing making application unit and drop to specified altitude with the posture of inclined downward backward and make the 2nd to paste stripping that component is connected to boundary belt terminates end, and the 2nd stickup component pressing is rolled up frame under the 2nd state of pasting the release band of component, the stripping making application unit with the speed faster than the translational speed of semiconductor crystal wafer advance movement, the release band of specific length is pasted on boundary belt terminates side.
Adopt the method, the lift-off processing can carrying out boundary belt continuously also significantly can cut down the consumption of release band.
In addition, the present invention adopts following structure to reach described object.
Namely, the invention provides a kind of boundary belt stripping off device, after the boundary belt on surface being glued to semiconductor crystal wafer pastes release band, by peeling off this release band by boundary belt and release band integratedly from the sur-face peeling of semiconductor crystal wafer, wherein, described boundary belt stripping off device comprises: stripping table, and it is for loading the semiconductor crystal wafer with described boundary belt and keeping; Release band feed mechanism, it is for supplying banded described release band; 1st pastes component, it peels away side, top for what release band is pasted on the boundary belt that is secured at the semiconductor crystal wafer that remain by described stripping table: cutter, it is for cutting into specific length by the release band being pasted on the described boundary belt peeling away side, top: peel plate, it is more thinner towards tip thickness, for to abut with intersecting with described release band and described boundary belt and release band to be turned back: the 1st driving mechanism, it is pasted component for making stripping table move horizontally to the described 1st with the direction that this group of described peel plate is relatively separated; And band recovering mechanism, it will be for batching recovery with described boundary belt shape all-in-one-piece release band.
Adopt this structure, the said method till preferably can implementing to play stripping process from the 1st adhering processes.
In addition, in described structure, this boundary belt stripping off device comprises: application unit, its have configure in the mode separating predetermined distance before and after on direction of delaminate the described 1st paste component and the described 2nd and paste component and paste component and the described 2nd across cutter the described 1st and paste divided adsorption section of opening between component; Swing mechanism, it tilts along the fore-and-aft direction for direction of delaminate for making described application unit; Lift drive mechanism, it is relatively elevated for making described application unit and stripping table between paste position and position of readiness; And the 2nd driving mechanism, it moves horizontally for making described application unit.
Adopt this structure, can preferably implement to play said method till the 2nd adhering processes from the 1st adhering processes.
the effect of invention
Adopt boundary belt stripping means of the present invention and boundary belt stripping off device, by the stripping position making uniform drag force act on boundary belt, under the state suppressing the boundary belt after peeling off, to wafer side, fluctuating occurs, boundary belt can be peeled off from wafer.Thus, avoiding wafer breakage, boundary belt can be peeled off accurately from wafer.
Accompanying drawing explanation
Fig. 1 is the front view representing whole boundary belt stripping off device.
Fig. 2 is the vertical view of application unit and the major part peeling off unit.
Fig. 3 is the vertical view of knife unit.
Fig. 4 is the left view of knife unit.
Fig. 5 is the figure of the peeling action representing boundary belt.
Fig. 6 is the figure of the peeling action representing boundary belt.
Fig. 7 is the figure of the peeling action representing boundary belt.
Fig. 8 is the figure of the peeling action representing boundary belt.
Fig. 9 is the figure of the peeling action representing boundary belt.
Figure 10 is the figure of the peeling action representing boundary belt.
Figure 11 is the figure of the peeling action representing boundary belt.
Figure 12 is the figure of the peeling action representing boundary belt.
Figure 13 is the front view of the whole boundary belt stripping off device representing variation.
Figure 14 is the figure of the peeling action of the boundary belt representing variation.
Figure 15 is the figure of the peeling action of the boundary belt representing variation.
Embodiment
Below, the embodiment of boundary belt stripping off device of the present invention is described with reference to accompanying drawing.
Fig. 1 relates to one embodiment of the present invention, and it is the integrally-built front view representing boundary belt stripping off device.
As shown in Figure 1, this boundary belt stripping off device comprises stripping table 1, band supply unit 2, application unit 3, peels off unit 4 and band recoverer 5 etc.Below, each structure is specifically described.
Stripping table 1 is configured to the semiconductor crystal wafer W (hereinafter simply referred to as " wafer W ") being pasted with boundary belt from rear side vacuum suction on the surface being formed with circuit pattern.In addition, stripping table 1 is installed on movable table 7, and this movable table 7 is can be supported along the mode of pair of right and left guide rail 6 slide anteroposterior, and this pair of right and left guide rail 6 anterior-posterior horizontal ground configures.Movable table 7 is passed through by the leading screw 9 of the positive and negative driving of pulse motor 8 by screw thread Feed servo system.In addition, guide rail 6, movable table 7, pulse motor 8, leading screw 9 etc. form the 1st driving mechanism of the present invention.
The release band Ts with supply unit 2, the width of deriving from material webs being less than the diameter of wafer W guides to the bottom of application unit 3.In addition, supply unit 2 is with to be equivalent to release band feed mechanism of the present invention.
Figure 2 illustrates the major part of application unit 3 and stripping unit 4.Application unit 3 is located at vertical frame 14, and this vertical frame 14 pendency is supported on the movable table 13 can being carried out movement by the line slideway of the frame 11 being located at the level on the top shown in Fig. 1.That is, application unit 3 is supported on can carry out the mode of slip lifting by the lifting platform 17 supported via long rails 16 by pair of right and left support plate 18 axle, and this long rails 16 is located at the base station 15 of the bottom being fixed on vertical frame 14.In addition, application unit 3 is can be supported on lifting platform 17 by driver drives such as not shown working cylinders around the mode axle that axle P swings in the longitudinal direction.Lifting platform 17 is by linking with motor and being elevated by the leading screw of motor driven.
The main body of application unit 3 has the 1st Sticking roller 21, the 2nd Sticking roller 22, knife unit 23 and adsorption plate 24 in the inner side of support plate 18.In addition, the 1st Sticking roller 21 is equivalent to the of the present invention 1st and pastes component, and the 2nd Sticking roller 22 is equivalent to the 2nd and pastes component, and adsorption plate 24 is equivalent to adsorption section, and line slideway is equivalent to the 2nd driving mechanism.
1st Sticking roller 21 and the 2nd Sticking roller 22 with the mode separating predetermined distance before and after on the throughput direction of release band Ts idling freely axle be supported on support plate 18.Central authorities between the 1st Sticking roller 21 and the 2nd Sticking roller 22, can be configured with adsorption plate 24 along the mode of the Width movement of release band Ts across this cutter 25 in the longitudinal direction to make the cutter 25 of knife unit 23.In addition, in the present embodiment, be provided with guide reel R at the rear side of the 2nd Sticking roller 22, but also can be the structure without guide reel R.
As shown in Figure 3 and Figure 4, knife unit 23 comprises the cutter part 27 carrying out movement along the guide rail on the top being located at application unit 3.Cutter part 27 is made up of movable table 28, tool holder 29.Tool holder 29 is provided with point of a knife down, the cutter 25 that can load and unload.
Be supported near the right-hand member of guide rail 26 by drive pulley 30 axle that motor positive and negative rotation drives, and loose pulley 31 axle is supported on the left side of guide rail 26.The band 32 of volume frame on described drive pulley 30 and loose pulley 31 is connected with the sliding engagement portion 33 of movable table 28, thus can by making movable table 28 move in the lateral direction with the positive and negative rotation of 32.
In addition, be provided with storage cover 34 at the left and right end of the bottom surface of knife unit 23, storage cover 34 for receive cutter 25 from point of a knife outstanding between adsorption plate 24a, 24b.
Adsorption plate 24 is communicated with via stream with outside vacuum plant and is connected.In addition, by utilizing control part 70 to operate to be located at the electromagnetically operated valve on stream, attraction can be adjusted.
As shown in Figure 2, in stripping unit 4, the supporting frame 42 being fixed with between frame 41 and being made up of aluminum drawable material is indulged in the pair of right and left being vertically arranged at apparatus main body.Central part on the left and right directions of this supporting frame 42 is connected with the base station 43 of box-shaped.In addition, lifting platform 45 is by linking with motor 46 and being elevated by the leading screw that motor 46 drives, and this lifting platform 45 is supported in the mode can carrying out slip lifting via the pair of right and left long rails 44 being located at base station 43.This lifting platform 45 is equipped with and peels off unit 4.
Lifting platform 45 is configured to the hollow rack-like run through in the vertical direction.Peel off the lower inside that unit 4 is configured at the side plate 47 arranged in the left and right of lifting platform 45.Peel plate 51 is installed between biside plate 47.
Peel plate 51 has the length of more than the diameter of wafer W, and peel plate 51 is formed as more thinner towards tip thickness taper.
In addition, the guide reel 61, niproll 62 and the jockey pulleys 63 that are configured with many recovery above unit 4 are being peeled off.
The guide reel 61 reclaimed is supported by axle in idle running mode freely.Jockey pulley 63 is arranged at supporting arm 64 idling freely and can swings by this supporting arm 64.Therefore, jockey pulley 63 can apply appropriate tension force to guiding the release band Ts after winding.
The wider roller that the guide reel 61 of described recovery and jockey pulley 63 are greater than the diameter of wafer W by length is formed, and the outer peripheral face of the guide reel 61 of described recovery and jockey pulley 63 forms the difficult adhesive surface being coated with fluororesin.
With recoverer 5, recovery is batched to the release band Ts sent from stripping unit 4.In addition, recoverer 5 is with to be equivalent to band recovering mechanism of the present invention.
Next, a series of action of being peeled off from wafer W by boundary belt PT is described according to the record of Fig. 5 ~ Figure 12.
Utilizing after wafer W is positioned on stripping table 1 by the conveying mechanisms such as mechanical arm, as shown in Figure 5, stripping table 1 absorption remains the stickup starting position of wafer W from position of readiness to release band Ts and moves.
After stripping table 1 arrives stickup starting position, the posture that the volume frame of top has the application unit 3 of release band Ts to tilt with forward downward drops to specified altitude.Now, the cutter 25 of knife unit 23 moves while cut off by the release band Ts adsorbed by adsorption plate 24 to the other end from one end.
As shown in Figure 6, after application unit 3 drops to specified altitude, what utilize the 1st Sticking roller 21 release band Ts to be pasted on boundary belt PT peels away top.
Afterwards, as shown in Figure 7, along with the advance of stripping table 1 is moved, the release band Ts of specific length is pasted on boundary belt PT by the 1st Sticking roller 21.That is, the 1st Sticking roller 21 by the bonding partially adsorbed by the adsorption plate 24a of front side of release band Ts in the front side of boundary belt PT.
Now, recoverer 5 is with to batch recovery with the speed sync identical with the translational speed of stripping table 1 to release band Ts.In addition, control part 70 correspondingly adjusts the attraction of adsorption plate 24a according to coiling speed and distance, not make release band Ts hang down from adsorption plate 25.
After the 1st Sticking roller 21 pastes the rear end of release band Ts, as shown in Figure 8, utilize adsorption plate 24b to adsorb cut off after release band Ts state under make application unit 3 increase.Movement with recoverer 5 and stripping table 1 synchronously by release band Ts's until the part of the front-end edge of boundary belt PT is batched.
Boundary belt PT peel away top arrive peel plate 51 top after, first, as shown in Figure 9, make peel plate 51 with regulation load pressing release band Ts and boundary belt PT.Afterwards, along with the movement of stripping table 1, be stripped plate 51 with release band Ts shape all-in-one-piece boundary belt PT and turn back and to be peeled off by from wafer W.
Peel plate 51 utilizes its top only press boundary belt PT on one side and turned back by boundary belt PT while peeled off from wafer W by boundary belt PT after the stickup position by release band Ts.
To arrive moment of the lower end of the 2nd Sticking roller 22 corresponding with the top of peeling away of boundary belt PT, and as shown in Figure 10, application unit 3 drops to specified altitude with the posture of inclined downward backward.
After application unit 3 drops to specified altitude, the stripping utilizing the 2nd Sticking roller 22 release band Ts to be pasted on boundary belt PT terminates end.
Afterwards, as shown in figure 11, along with the advance of stripping table 1 is moved, application unit 3 moves with the speed faster than the translational speed of stripping table 1.Thus, before peel plate 51 arrives stripping end end, the absorption affinity of adsorption plate 24b to release band Ts can be adjusted and utilize the 2nd Sticking roller 22 that release band Ts is pasted on boundary belt PT.
After the end of job of boundary belt PT release band Ts being pasted on rear end side, application unit 3 stops mobile.Afterwards, as shown in figure 12, application unit 3 retreat and and peel off the distance keeping initial setting between unit 4, and returned to the posture that forward downward tilts by swinging.
Further, application unit 3 and stripping unit 4 turn back to the position of readiness of top.
Above, complete a series of action of being peeled off from wafer W by boundary belt PT, afterwards, repeatedly carry out same action, till arrival regulation number.
Adopt described embodiment device; what release band Ts shorter for length is pasted on boundary belt PT peels away side, top; and utilize peel plate 51 that release band Ts and boundary belt PT is turned back and peeled off while making peel plate 51 be connected to release band Ts and boundary belt PT, therefore, it is possible to suppress the fluctuating that the surface of the wafer W after having peeled off produces.That is, make the part be superimposed together of release band Ts and boundary belt PT as previous methods reduce and utilize the abutting of peel plate 51 to make the stripping starting point of boundary belt PT orthogonal with direction of delaminate.Thus, by this interaction, the stress that boundary belt PT broad ways is shunk that peel plate 51 can be utilized to limit produce because of drag force, while make the periphery of stress self-insurance protecting band rise act on boundary belt equably towards radial direction.Its result, can suppress the fluctuating producing wafer W, and then can avoid the breakage of wafer W.
In addition; due to the release band Ts of band shape is cut into rectangle; and the stripping of crossing over the boundary belt PT after lift-off processing terminate boundary belt PT in side and lift-off processing paste release band Ts with peeling away side, top, therefore, it is possible to linked up and batch recovery by multiple boundary belts PT.In addition, the consumption of release band Ts can also be reduced.
In addition, the present invention can also implement with following such form.
(1) in the described embodiment, peeling away top and peeling off the inclination attitude that application unit 3 is changed in end end-grain cutting at boundary belt PT, but be not limited to this form.Such as, application unit 3 also can be made to swing to a direction and release band Ts is pasted on boundary belt PT.When implementing this execution mode, such as, as long as form as follows.
As shown in figure 13, the adsorption plate 24a be configured between the 1st Sticking roller 21 and the 2nd Sticking roller 22 is bent highlightedly down with the radius of curvature specified.
Next, utilize this embodiment device that a series of action of being peeled off from wafer W by boundary belt PT is described.
As shown in figure 14, the posture that application unit 3 is tilted with forward downward drops to specified altitude, and what utilize the 1st Sticking roller 21 release band Ts to be pasted on boundary belt PT peels away top.Afterwards; with the movement of stripping table 1 synchronously, as shown in double dot dash line, utilize lifting platform 17 that application unit 3 is declined and utilize driver that application unit 3 is swung and by the bonding partially before the part of being adsorbed by adsorption plate 24a of release band Ts in boundary belt PT.In this moment, the generally horizontal posture of application unit 3, not make the release band Ts of rear end be pasted onto on boundary belt PT.
Application unit 3 is made to increase under the state keeping flat-hand position.Afterwards, peel plate 51 is utilized to be peeled off from wafer W by boundary belt PT.In this stripping process, if arrive the position of regulation according to the positional information of the distance predetermined or the stripping table 1 that utilizes encoder etc. to detect, stripping table 1, stripping application unit 3 is made to drop to specified altitude as shown in Figure 15.Now, the front end of the release band Ts adsorbed by adsorption plate 24b is glued to boundary belt PT.Afterwards; while to make the translational speed of application unit 3 faster than the translational speed of stripping table 1 or to make the mobile mode of slowing down of stripping table 1 make application unit 3 decline and swing while the release band Ts of specific length is pasted on boundary belt PT, till the stripping pasting boundary belt PT terminates end.
Adopt this structure, when the rear end side of boundary belt PT peels off release band Ts, application unit 3 need not be made to advance mobile.
(2) in described each embodiment, also can be, after release band Ts is pasted on boundary belt PT, release band Ts is cut off.
(3) in described each embodiment, cutter 25 also can be made to retreat on tool holder 29.Adopt this structure, the structure of storage cover 34 can be omitted.
(4) in described each embodiment, when not will multiple boundary belts PT peel off continuously, also release band Ts can not be pasted on the rear end side of boundary belt PT and the boundary belt PT of front and back is linked up each other and batches recovery.
Claims (5)
1. a boundary belt stripping means; after the boundary belt on surface being glued to semiconductor crystal wafer pastes release band; by peeling off this release band by boundary belt and release band integratedly from the sur-face peeling of semiconductor crystal wafer; wherein, described boundary belt stripping means comprises following operation:
Cut off operation, in this cut-out operation, the release band utilizing cutter width to be less than the band shape of described semiconductor die diameter of a circle cuts into specific length;
1st adhering processes, in the 1st adhering processes, utilizing the 1st to paste, the described release band being cut into specific length is pasted on boundary belt by component peels away side, top; And
Stripping process; in this stripping process; the top of more thinner towards tip thickness peel plate is abutted with release band and boundary belt with intersecting; and; semiconductor crystal wafer and peel plate is made to move horizontally to the direction be relatively separated while release band batched under state after utilizing this peel plate release band to be turned back; thus, boundary belt is peeled off from semiconductor crystal wafer.
2. boundary belt stripping means according to claim 1, wherein,
Described stripping process comprises the 2nd adhering processes; in the 2nd adhering processes; utilize the 2nd stickup component the release band of specific length to be pasted on being positioned at of boundary belt and terminate the front portion of the front side of the direction of delaminate held to peeling off the part terminating end from the stripping semiconductor crystal wafer
By repeatedly carrying out the operation from described 1st adhering processes to described 2nd adhering processes, thus described boundary belt is linked up and batches recovery.
3. boundary belt stripping means according to claim 2, wherein,
Utilize this application unit to adsorb maintenance release band in application unit on stripping roll coil of strip frame, this application unit have configure in the mode separating predetermined distance before and after on direction of delaminate the described 1st paste component and the described 2nd and paste component and paste component and the 2nd across cutter the 1st and paste divided adsorption section of opening between component
In described 1st adhering processes; make application unit drop to specified altitude with the posture that forward downward tilts before utilize cutter release band to be cut off; utilize when application unit reaches specified altitude the 1st paste component release band is pressed and be pasted on boundary belt peel away top
In described stripping process, synchronously release band is batched while utilize the 1st to paste component the release band of specific length is pasted on boundary belt with moving horizontally of semiconductor crystal wafer, makes application unit increase afterwards,
In described 2nd adhering processes; swing making application unit and drop to specified altitude with the posture of inclined downward backward and make the 2nd to paste stripping that component is connected to boundary belt terminates to hold and the 2nd paste component pressing by volume frame under the 2nd state of pasting the release band of component, making that application unit advances mobile with the speed faster than the translational speed of semiconductor crystal wafer and stripping that is that the release band of specific length is pasted on boundary belt terminates side.
4. a boundary belt stripping off device; after the boundary belt on surface being glued to semiconductor crystal wafer pastes release band; by peeling off this release band by boundary belt and release band integratedly from the sur-face peeling of semiconductor crystal wafer, wherein, described boundary belt stripping off device comprises:
Stripping table, it is for loading the semiconductor crystal wafer with described boundary belt and keeping;
Release band feed mechanism, it is for supplying banded described release band;
1st pastes component, and it peels away side, top for what release band is pasted on the boundary belt that is secured at the semiconductor crystal wafer that remain by described stripping table:
Cutter, it is for cutting into specific length by the release band being pasted on the described boundary belt peeling away side, top:
Peel plate, it is more thinner towards tip thickness, for abutting with intersecting with described release band and boundary belt and release band being turned back:
1st driving mechanism, it is pasted component for making stripping table move horizontally to the described 1st with the direction that this group of described peel plate is relatively separated; And
Band recovering mechanism, it will be for batching recovery with described boundary belt shape all-in-one-piece release band.
5. boundary belt stripping off device according to claim 4, wherein,
This boundary belt stripping off device comprises:
Application unit, its have configure in the mode separating predetermined distance before and after on direction of delaminate the described 1st paste component and the described 2nd and paste component and paste component and the described 2nd across cutter the described 1st and paste divided adsorption section of opening between component;
Swing mechanism, it tilts along the fore-and-aft direction for direction of delaminate for making described application unit;
Lift drive mechanism, it is relatively elevated for making described application unit and stripping table between paste position and position of readiness; And
2nd driving mechanism, it moves horizontally for making described application unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-225511 | 2013-10-30 | ||
| JP2013225511A JP6247075B2 (en) | 2013-10-30 | 2013-10-30 | Protective tape peeling method and protective tape peeling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104600017A true CN104600017A (en) | 2015-05-06 |
Family
ID=53051090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410597339.4A Pending CN104600017A (en) | 2013-10-30 | 2014-10-30 | Protective tape separating method and protective tape separating apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6247075B2 (en) |
| KR (1) | KR20150050395A (en) |
| CN (1) | CN104600017A (en) |
| TW (1) | TWI641492B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI616343B (en) * | 2016-08-10 | 2018-03-01 | Jhen Tou Technology Co Ltd | Automatic wafer protection layer removal equipment |
| CN113664893A (en) * | 2021-07-27 | 2021-11-19 | 中航西安飞机工业集团股份有限公司 | Separating device and separating method for special laying cloth of large airplane |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6833541B2 (en) * | 2017-02-08 | 2021-02-24 | 日東電工株式会社 | Adhesive tape joining method and adhesive tape joining device |
| KR102440741B1 (en) * | 2020-05-25 | 2022-09-07 | (주) 엔지온 | Method for controlling an apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
| KR102440739B1 (en) * | 2020-05-25 | 2022-09-07 | (주) 엔지온 | An apparatus for manufacturing semiconductor with a chip-level delamination of protection film |
| CN116812623B (en) * | 2023-08-30 | 2023-11-03 | 赛德半导体有限公司 | Packaging roller for flexible ultrathin glass |
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|---|---|---|---|---|
| JP2005015160A (en) * | 2003-06-26 | 2005-01-20 | Lintec Corp | Sheet peeling device and method |
| CN1841657A (en) * | 2005-03-31 | 2006-10-04 | 日东电工株式会社 | Protective tape separating method and apparatus using the same |
| CN101969018A (en) * | 2009-07-16 | 2011-02-09 | 株式会社高鸟 | Striping apparatus of protection adhesive tape |
| CN102138208A (en) * | 2008-08-28 | 2011-07-27 | 琳得科株式会社 | Sheet peeling apparatus and sheet peeling method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5431053B2 (en) * | 2009-07-27 | 2014-03-05 | 日東電工株式会社 | Adhesive tape application method and adhesive tape application device |
| JP5635363B2 (en) * | 2010-10-19 | 2014-12-03 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus |
-
2013
- 2013-10-30 JP JP2013225511A patent/JP6247075B2/en active Active
-
2014
- 2014-10-22 TW TW103136399A patent/TWI641492B/en not_active IP Right Cessation
- 2014-10-27 KR KR1020140145751A patent/KR20150050395A/en not_active Application Discontinuation
- 2014-10-30 CN CN201410597339.4A patent/CN104600017A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005015160A (en) * | 2003-06-26 | 2005-01-20 | Lintec Corp | Sheet peeling device and method |
| CN1841657A (en) * | 2005-03-31 | 2006-10-04 | 日东电工株式会社 | Protective tape separating method and apparatus using the same |
| CN102138208A (en) * | 2008-08-28 | 2011-07-27 | 琳得科株式会社 | Sheet peeling apparatus and sheet peeling method |
| CN101969018A (en) * | 2009-07-16 | 2011-02-09 | 株式会社高鸟 | Striping apparatus of protection adhesive tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI616343B (en) * | 2016-08-10 | 2018-03-01 | Jhen Tou Technology Co Ltd | Automatic wafer protection layer removal equipment |
| CN113664893A (en) * | 2021-07-27 | 2021-11-19 | 中航西安飞机工业集团股份有限公司 | Separating device and separating method for special laying cloth of large airplane |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI641492B (en) | 2018-11-21 |
| KR20150050395A (en) | 2015-05-08 |
| JP2015088606A (en) | 2015-05-07 |
| TW201515847A (en) | 2015-05-01 |
| JP6247075B2 (en) | 2017-12-13 |
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