TW201832280A - Method and apparatus for attaching adhesive tape to avoid the damage to the wafer or circuit due to deformation of wafer - Google Patents

Abstract

The present invention provides a method and apparatus for attaching adhesive tape, which can avoid the damage to the wafer or damage to the circuit, and accurately attach a new adhesive tape to the other surface of a wafer having an adhesive tape attached on one side. In a configuration in which a protective tape PT is attached to a mount frame MF, a support tape DT of the mount frame MF is clamped to form a chamber 7. The holding table 37 holding the protective tape PT is brought close to the support tape DT so that the distance between the protective tape PT and the wafer W is maintained at D2. The chamber 7 is depressurized while maintaining the distance D2 to perform the attachment of the protective tape PT based on the pressure difference. Even if the bubbles expand between the support tape DT and the wafer W and the wafer W is pressed accordingly, the wafer W is still blocked quickly by the holding table that maintains the position D2. Therefore, damage to the wafer or circuit due to the deformation of wafer can be avoided.

Description

 Adhesive tape attachment method and adhesive tape attachment device  

The present invention relates to a protective tape for protecting a circuit pattern formed on a semiconductor wafer, and an adhesive tape attached to a dicing tape which covers a ring frame and a back surface of a semiconductor wafer disposed at a center of the ring frame. Attachment method and adhesive tape attachment device.

In the case of manufacturing a wafer component from a semiconductor wafer (hereinafter referred to as "wafer" as appropriate), after the circuit pattern is formed on the surface of the wafer, an adhesive tape for protection is attached to the surface of the wafer (protective tape) ), it is thinned by the back grinding process. After the thin-processed wafer is peeled off, the adhesive tape for support is attached to the back surface of the wafer and the ring frame. Through the support of the adhesive tape, that is, the attachment of the dicing tape, the wafer is separated from the ring frame by mounting the dicing tape.

In the case where the various adhesive tapes are attached to the wafer, in addition to the configuration in which the attaching roller is rotated to press the adhesive tape against the wafer, a chamber for accommodating the wafer is used in order to reduce the size of the device. The internal pressure is reduced to attach the adhesive tape. That is, the chamber formed by the upper and lower pair of shells is separated by an adhesive tape to form two spaces, and the adhesive tape is attached to the wafer while the air pressure of one space is set lower than the air pressure of the other space. (For example, refer to Patent Document 1).

 [Previous Technical Literature]    [Patent Literature]  

[Patent Document 1]

Japanese Special Open 2014-49626

However, the above conventional device has the following problems.

In recent years, depending on the variety of wafer processing engineering, there is a case where a new adhesive tape is attached to the other surface of a wafer to which an adhesive tape is attached. As an example, there is a case where an adhesive tape is attached to the surface of the wafer attached to the ring frame. At this time, when the operation of attaching the adhesive tape on the surface of the wafer is performed using the conventional configuration of Patent Document 1, there is a problem that the wafer is damaged or the circuit is damaged.

After profoundly reviewing the results of such problems, the following findings were obtained. That is, in the case where tiny bubbles are caught between the dicing tape attached to the back surface of the wafer and the wafer, the inside of the chamber for attaching the adhesive tape to the surface of the wafer is reduced. At the time of the pressure, the bubble will swell.

Since the bubble presses the wafer at the time of expansion, it is considered that there is a problem that the circuit is damaged or the wafer is broken. Such a problem occurs in the case where a dicing tape is attached to a wafer under atmospheric pressure. Moreover, in recent years, as the thickness of the wafer has progressed rapidly, damage of the wafer due to bubble pressing is more likely to occur.

The present invention has been made in view of such circumstances, and its main object is to provide a wafer which can be prevented from being damaged or damaged by a circuit, and which can be attached to the other surface of the wafer to which an adhesive tape is attached on one side with high precision. Adhesive tape attachment method and adhesive tape attachment device.

In order to achieve such an object, the present invention has the following constitution.

That is, the present invention is an adhesive tape attaching method, which is an adhesive tape attaching method in which a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and is characterized in that a tape holding process for holding the second adhesive tape in the holding stage; the chamber forming process is formed by sandwiching and joining the first adhesive tape exposed from the outer edge of the semiconductor wafer by a pair of shells to form a chamber a first approaching process of maintaining the holding stage close to the semiconductor wafer, maintaining a distance between the semiconductor wafer and the adhesion surface of the second adhesive tape at a predetermined first predetermined value; and attaching the When the first adhesive tape is sandwiched by the pair of shells, the second adhesive tape is attached while the air pressure in the space on the semiconductor wafer side in the chamber is lower than the air pressure in the other space. For semiconductor wafers.

(Operation/Effect) According to the method, in the first approaching process, the holding stage approaches the semiconductor wafer, and the distance between the semiconductor wafer and the adhesion surface of the second adhesive tape is maintained at a predetermined first predetermined value. Therefore, in the attaching process, even if the bubble that is caught between the semiconductor wafer and the first adhesive tape expands and pushes the semiconductor wafer, the pressed semiconductor wafer is maintained at a close position. Keep the table blocked. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding stage, deformation and breakage of the semiconductor wafer due to the warpage can be appropriately avoided.

Further, in the above invention, preferably, the semiconductor wafer is sandwiched between the first adhesive tape and the ring frame, and the frame is held by the frame holding portion while the chamber is being formed. The pair of shells sandwich the first adhesive tape between the ring frame and the semiconductor wafer to form a chamber. In this case, in the mounting frame to which the first adhesive tape is attached, the second adhesive tape is attached to the other surface of the semiconductor wafer, and the semiconductor wafer can be prevented from being deformed or damaged. .

Moreover, in the above invention, it is preferable that the non-adhesive surface that closes or contacts the first adhesive tape with the flat member is provided, and the distance between the flat surface and the first adhesive tape is maintained at a predetermined value. The second approaching process of the second predetermined value.

(Operation/Effect) According to this configuration, in the second approaching process, the restraining member approaches the first adhesive tape, and the distance between the restraining member and the first adhesive tape is maintained at a predetermined second predetermined value. Therefore, in the attaching process, even if the bubble entrapped between the semiconductor wafer and the first adhesive tape is expanded, the expansion of the bubble in a direction perpendicular to the surface of the semiconductor wafer is suppressed by the flattening of the member. The surface is suppressed. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubble can be greatly reduced, so that damage of the wafer W due to bubble expansion can be appropriately avoided. Further, since the elongation of the first adhesive tape due to the expansion of the bubble can be suppressed, the base material and the adhesive material of the first adhesive tape can be prevented from being deteriorated.

In order to achieve such an object, the present invention may have the following constitution.

That is, the present invention is an adhesive tape attaching method in which a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a wafer holding process is provided. Holding the semiconductor wafer in a holding stage; in the first attaching process, the second adhesive tape is attached to a joint portion of a pair of shells constituting the chamber; and the first approaching process brings the holding table closer to the second The adhesive tape maintains a distance between the semiconductor wafer and the adhesion surface of the second adhesive tape at a predetermined first predetermined value, and in the second proximity process, the suppression member having a flat surface approaches or contacts the second adhesive tape. a non-adhesive surface, the distance between the flat surface and the second adhesive tape is maintained at a second predetermined value; and in the second attachment process, the second adhesive tape is sandwiched and joined by a pair of shells to form the aforementioned In the state of the chamber, the second adhesive tape is attached to the semiconductor wafer while the air pressure in the space on the semiconductor wafer side in the chamber is lower than the air pressure in the other space.

(Operation/Effect) According to this configuration, in the first approaching process, the holding stage approaches the second adhesive tape, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a predetermined first predetermined value. Therefore, in the attaching process, even if the bubble which is caught between the semiconductor wafer and the first adhesive tape expands and presses the semiconductor wafer, the pressed semiconductor wafer is maintained at the close position. Blocked by the station. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding stage, deformation and breakage of the semiconductor wafer due to the warpage can be appropriately avoided.

Further, in the second approaching process, the restraining member approaches the second adhesive tape, and the distance between the restraining member and the second adhesive tape is maintained at a predetermined second predetermined value. Therefore, even in the case where the bubble which is caught between the semiconductor wafer and the first adhesive tape is swollen during the attaching process, the expansion of the bubble in a direction perpendicular to the surface of the semiconductor wafer is suppressed by the flat surface of the member. Suppressed. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubble can be greatly reduced, so that damage of the wafer W due to bubble expansion can be appropriately avoided. Further, since the elongation of the second adhesive tape due to the expansion of the air bubbles can be suppressed, the base material and the adhesive material of the second adhesive tape can be prevented from being deteriorated.

Moreover, in the above invention, it is preferable to provide a frame holding process for holding the ring frame by the frame holding portion, and to cover a joint portion of the pair of shells constituting the chamber in the first attaching process The second adhesive tape is attached to the frame in such a manner that the frame retains the ring frame.

(Operation/Effect) According to this configuration, in the semiconductor wafer to which the first adhesive tape is attached, the second adhesive tape is attached to the other side of the semiconductor wafer and the ring frame using the chamber. It can be performed while avoiding deformation or breakage of the semiconductor wafer. Therefore, it is possible to maintain one side of the semiconductor wafer and perform a construction work of a more appropriate mounting frame.

The present invention can also be constructed as follows for achieving such an object.

That is, the present invention is an adhesive tape attaching method, which is an adhesive tape attaching method in which a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and is characterized in that a holding process for holding the second adhesive tape in the holding stage; a wafer holding process for holding the semiconductor wafer by the wafer holding portion; and a chamber forming process for joining the holding table by joining a pair of shells and a chamber of the wafer holding portion; a first approaching process: a first suppressing member having a flat surface accommodated in the chamber is brought close to the semiconductor wafer, and a distance between the semiconductor wafer and the first suppressing member is maintained In the second approaching process, the second restraining member that is housed in the chamber and has a flat surface approaches or contacts the non-adhesive surface of the first adhesive tape, and the flat surface and the first surface are The distance between the adhesive tape is maintained at a predetermined second predetermined value; and the attaching process is performed after the second approaching process, while the air chamber inside the chamber is lowered while the chamber is formed. The second adhesive tape is attached to the semiconductor wafer.

(Operation/Effect) According to this configuration, in the first approaching process, the first suppressing member approaches the semiconductor wafer, and the distance between the semiconductor wafer and the adhesion surface of the first suppressing member is maintained at a predetermined first predetermined value. Therefore, in the attaching process, even if the bubble that is caught between the semiconductor wafer and the first adhesive tape expands and pushes the semiconductor wafer, the pressed semiconductor wafer is maintained at a close position. The first suppressing member is blocked. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding stage, deformation and breakage of the semiconductor wafer due to the warpage can be appropriately avoided.

Further, in the second approaching process, the second suppressing member approaches or contacts the first adhesive tape, and the distance between the second suppressing member and the first adhesive tape is maintained at a predetermined second predetermined value. Therefore, even in the case where the bubble which is caught between the semiconductor wafer and the first adhesive tape is expanded during the attaching process, the expansion of the bubble in the direction perpendicular to the surface of the semiconductor wafer is still caused by the second suppressing member. The flat surface is suppressed. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubble can be greatly reduced, so that damage of the wafer W due to bubble expansion can be appropriately avoided. Further, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, the base material and the adhesive material of the first adhesive tape can be prevented from being deteriorated. In the present configuration, the configuration in which the second adhesive tape is attached after the chamber is decompressed is not limited to the configuration in which the pressure is applied by the differential pressure. Therefore, the features of the present invention can be applied to a configuration of a plurality of chambers.

Moreover, in the above invention, it is preferable to provide a frame holding process in which the frame holding portion holds the ring frame, and the chamber houses the frame holding portion. In this case, in the configuration in which the ring frame and the frame holding portion are housed in the chamber, the attachment of the second adhesive tape to the semiconductor wafer can be performed while avoiding deformation or breakage of the semiconductor wafer.

Further, in the above invention, preferably, the first suppressing member is the holding stage, and in the first approaching process, the second adhesive tape is brought close to the semiconductor wafer together with the holding stage. In this case, since the holding table functions as the first suppressing member, the complication of the apparatus can be avoided.

Furthermore, since the second adhesive tape approaches the semiconductor wafer during the first approach, even if bubbles are caught between the second adhesive tape and the holding table, the bubbles are perpendicular to the surface of the adhesive tape. The expansion of the direction is quickly suppressed by the semiconductor wafer. Therefore, it is possible to more reliably prevent the occurrence of irregularities and wrinkles due to elongation of a part of the second adhesive tape. As a result, it is possible to surely avoid a situation in which the second adhesive tape is unevenly attached to the semiconductor wafer, and the adhesion between the second adhesive tape and the semiconductor wafer is lowered.

Further, in the above invention, preferably, the second suppressing member is the wafer holding portion. In this case, since the wafer holding portion functions as the second suppressing member, the complication of the device can be avoided. Further, since the wafer holding portion is in contact with or closer to the first adhesive tape attached to the semiconductor wafer, damage of the wafer W due to bubble expansion and elongation of the first adhesive tape can be more reliably prevented. .

Moreover, in the above invention, it is preferable that the first predetermined value is 0.1 mm or more and 0.5 mm or less. In this case, since the holding stage is sufficiently close, the pressing force acting on the semiconductor wafer due to the expansion of the air bubbles wound between the semiconductor wafer and the first adhesive tape can be further reduced. Therefore, deformation and breakage of the semiconductor wafer due to pressing can be more reliably avoided.

Moreover, in the above invention, it is preferable that the second predetermined value is 0.5 mm or less. In this case, since the suppressing member is sufficiently close to each other, it is possible to more reliably suppress the expansion of the bubble in the direction perpendicular to the surface of the semiconductor wafer. Therefore, it is possible to more reliably avoid damage of the wafer W caused by the expansion of the bubble.

In order to achieve such an object, the present invention may have the following constitution.

That is, the present invention is an adhesive tape attaching method for attaching an adhesive tape to a semiconductor wafer, which is characterized in that: a tape holding process is performed to keep the adhesive tape held by the holding table; the wafer holding process is maintained by the wafer Holding the semiconductor wafer; the chamber forming process is performed by joining a pair of shells to form a chamber for accommodating the holding stage and the wafer holding portion; and the first approaching process is to maintain the wafer holding the semiconductor wafer The portion is close to the adhesive tape, and the distance between the adhesive surface of the adhesive tape and the semiconductor wafer is maintained at a predetermined first predetermined value; and in the second proximity, the suppressing member having the flat surface accommodated in the chamber is approached Or contacting the non-adhesive surface of the adhesive tape to maintain the distance between the flat surface and the adhesive tape at a predetermined second predetermined value; and the attaching process, after the second approaching process, the state in which the chamber is formed Next, the adhesive tape is attached to the semiconductor wafer while reducing the air pressure inside the chamber.

(Operation/Effect) According to this configuration, when the adhesive tape is attached to the semiconductor wafer, the wafer holding portion holding the semiconductor wafer is adhered to the adhesive tape in the first approaching process, and the semiconductor wafer and the adhesive tape are adhered. The surface distance is maintained at a predetermined first predetermined value. Further, in the second approaching process, the restraining member approaches or contacts the non-adhesive surface of the adhesive tape, and the distance between the restraining member and the non-adhesive surface of the adhesive tape is maintained at a predetermined second predetermined value.

Therefore, in the attaching process, even if the air bubble which is caught between the holding table and the adhesive tape expands and pushes the adhesive tape, the pressed adhesive tape is blocked by the semiconductor wafer which is maintained close to the position. . Further, the expansion of the bubble in the direction perpendicular to the surface of the adhesive tape is suppressed by the flat surface of the restraining member.

Therefore, it is possible to more reliably prevent a part of the adhesive tape from being pressed in a direction perpendicular to the surface of the adhesive tape due to the expansion of the air bubbles, and to cause unevenness and wrinkles. As a result, it is possible to surely avoid a situation in which the adhesive tape is unevenly attached to the semiconductor wafer, and the adhesion between the adhesive tape and the semiconductor wafer is lowered. Moreover, deterioration of the base material and the adhesive material due to the suppression of the elongation of the adhesive tape can be avoided. Further, in the configuration in which the adhesive tape is attached to the semiconductor wafer by depressurizing the chamber, the configuration is not limited to the configuration in which the adhesive tape is attached to one surface of the semiconductor wafer. Therefore, the features of the present invention can be applied. For a more diverse composition.

In order to achieve such an object, the present invention may have the following constitution.

That is, the present invention provides an adhesive tape attaching device in which a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a tape supply portion is provided. The second adhesive tape; the holding table holds the second adhesive tape; and the chamber is formed by sandwiching the first adhesive tape exposed from the outer edge of the semiconductor wafer with a pair of shells, and accommodating the holding table; The first approaching mechanism performs control for maintaining the distance between the semiconductor wafer and the adhesion surface of the second adhesive tape at a predetermined first value by bringing the holding stage close to the semiconductor wafer; and attaching the mechanism In a state in which the first approaching mechanism is being actuated, a differential pressure is generated in two spaces in the chamber by the first adhesive tape, and the second adhesive tape is attached to the other surface of the semiconductor wafer.

(Operation/Effect) According to this configuration, the holding stage approaches the semiconductor wafer by the first approaching means, and the distance between the semiconductor wafer and the adhesion surface of the second adhesive tape is maintained at a predetermined first predetermined value. Therefore, when the second adhesive tape is attached to the semiconductor wafer by the attaching mechanism, even if the bubble that is caught between the semiconductor wafer and the first adhesive tape is expanded to push the semiconductor wafer, the semiconductor wafer is pushed. The pressed semiconductor wafer is still blocked by the holding station that is maintained in close proximity. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding stage, deformation and breakage of the semiconductor wafer due to the warpage can be appropriately avoided.

Further, in the above invention, it is preferable that the semiconductor wafer is held by the first adhesive tape and the ring frame, and the frame holding portion for holding the ring frame is provided, and the chamber is a pair of shell clips. The first adhesive tape between the ring frame held by the frame holding portion and the semiconductor wafer is formed. In this case, in the mounting frame to which the first adhesive tape is attached, the second adhesive tape is attached to the other surface of the semiconductor wafer, and the semiconductor wafer can be prevented from being deformed or damaged. .

Further, in the above invention, preferably, the suppressing member includes a flat surface, and the second approaching mechanism performs a non-adhesive surface in which the suppressing member approaches or contacts the first adhesive tape, and the flat surface and the flat surface are The distance of the first adhesive tape is maintained at a predetermined second predetermined value.

(Operation/Effect) According to this configuration, the restraining member approaches the first adhesive tape by the second approaching mechanism, and the distance between the restraining member and the first adhesive tape is maintained at a predetermined second predetermined value. Therefore, when the second adhesive tape is attached to the semiconductor wafer by the attaching mechanism, even if the bubble which is caught between the semiconductor wafer and the first adhesive tape is expanded, the bubble is transferred to the semiconductor wafer. The expansion of the surface in the vertical direction is suppressed by the flat surface of the restraining member. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubble can be greatly reduced, so that damage of the wafer W due to bubble expansion can be appropriately avoided. Further, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, the base material and the adhesive material of the first adhesive tape can be prevented from being deteriorated.

In order to achieve such an object, the present invention may have the following constitution.

That is, the present invention provides an adhesive tape attaching device in which a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a tape supply portion is provided. a second adhesive tape; a holding stage for holding the semiconductor wafer; a suppressing member having a flat surface; and a chamber formed of a pair of shells for accommodating the holding stage and the suppressing member; and the first attaching means The second adhesive tape is attached to a joint portion of the casing; the first proximity mechanism is configured to maintain the holding table close to the second adhesive tape, and maintain a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape in advance. Controlling the first predetermined value; the second approaching means bringing the restraining member close to or in contact with the non-adhesive surface of the second adhesive tape, and maintaining the distance between the flat surface and the second adhesive tape at a predetermined second a predetermined value; and the second attaching mechanism, in a state in which the first approaching mechanism and the second approaching mechanism are in a state of being operated, a differential pressure is generated in two spaces in the chamber that are separated by the second adhesive tape, and The second mentioned above The tape stuck to the other surface of the semiconductor wafer.

(Operation/Effect) According to this configuration, the holding unit approaches the second adhesive tape by the first approaching mechanism, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a predetermined first predetermined value. Therefore, when the second adhesive tape is attached to the semiconductor wafer, even if the bubble is swollen between the semiconductor wafer and the first adhesive tape to press the semiconductor wafer, the pressed semiconductor crystal is pressed. The circle is held in a position close to the holding table. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding stage, deformation and breakage of the semiconductor wafer due to the warpage can be appropriately avoided.

Further, the restraining member approaches the second adhesive tape by the second approaching means, and the distance between the restraining member and the second adhesive tape is maintained at a predetermined second predetermined value. Therefore, when the second adhesive tape is attached to the semiconductor wafer, even if the bubble that is caught between the semiconductor wafer and the first adhesive tape is expanded, the bubble is directed in a direction perpendicular to the surface of the semiconductor wafer. The expansion system is suppressed by the flat surface of the restraining member. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubble can be greatly reduced, so that damage of the wafer W due to bubble expansion can be appropriately avoided. Further, since the elongation of the second adhesive tape due to the expansion of the air bubbles can be suppressed, the base material and the adhesive material of the second adhesive tape can be prevented from being deteriorated.

Further, in the above invention, it is preferable that the first attaching mechanism includes a joint portion that covers the shell and a ring frame that is held by the frame holding portion. Attached to the aforementioned second adhesive tape.

(Operation/Effect) According to this configuration, in the mounting frame to which the first adhesive tape is attached, the second adhesive tape is attached to the other surface of the semiconductor wafer and the ring frame using the chamber. It can be performed while avoiding deformation or breakage of the semiconductor wafer. Therefore, it is possible to protect one side of the semiconductor wafer and to perform a construction work of a more appropriate mounting frame.

In order to achieve such an object, the present invention may have the following constitution.

That is, the present invention provides an adhesive tape attaching device in which a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a tape supply portion is provided. The second adhesive tape; the holding holder holds the second adhesive tape; the wafer holding portion holds the semiconductor wafer; the first suppressing member having a flat surface; the second suppressing member having a flat surface; and the chamber The holding stage, the wafer holding unit, the first suppressing member, and the second suppressing member are each formed of a pair of shells; and the first approaching mechanism brings the first suppressing member closer to the other surface of the semiconductor wafer The distance between the semiconductor wafer and the first suppressing member is maintained at a predetermined first predetermined value; and the second approaching mechanism brings the second suppressing member into contact with or in contact with the non-adhesive surface of the first adhesive tape. The distance between the flat surface and the first adhesive tape is maintained at a predetermined second predetermined value, and the pressure reducing mechanism is configured to open the inside of the chamber while the first approaching mechanism and the second approaching mechanism are operating Under reduced pressure; and attaching mechanism, in a state where the inside of the chamber was depressurized to the second adhesive tape adhered to the other surface of the semiconductor wafer.

(Operation/Effect) According to this configuration, the first suppression member approaches the semiconductor wafer by the first proximity mechanism, and the distance between the adhesion surface of the semiconductor wafer and the first suppression member is maintained at a predetermined first predetermined value. Therefore, when the attachment by the attaching mechanism is performed, even if the bubble which is caught between the semiconductor wafer and the first adhesive tape is pressed by the decompression expansion, the semiconductor wafer is pressed, and the semiconductor crystal is pressed. The circle is still blocked by the first restraining member that is maintained in the close position. That is, since the warpage of the semiconductor wafer due to the pressing is quickly suppressed by the holding stage, deformation and breakage of the semiconductor wafer due to the warpage can be appropriately avoided.

Further, the second restraining member approaches or contacts the first adhesive tape by the second approaching mechanism, and the distance between the second restraining member and the first adhesive tape is maintained at a predetermined second predetermined value. Therefore, even when the bubble which is wound between the semiconductor wafer and the first adhesive tape is expanded by the pressure reduction when the attachment by the attaching means is performed, the bubble is directed in a direction perpendicular to the surface of the semiconductor wafer. The expansion is suppressed by the flat surface of the second suppressing member. Therefore, the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubble can be greatly reduced, so that damage of the wafer W due to bubble expansion can be appropriately avoided. Further, since the elongation of the first adhesive tape due to the expansion of the air bubbles can be suppressed, the base material and the adhesive material of the first adhesive tape can be prevented from being deteriorated. In the present configuration, the configuration in which the second adhesive tape is attached after the pressure reduction and the pressure is applied is not limited to the configuration in which the pressure is applied by the differential pressure. Therefore, the features of the present invention can be applied to the configuration of a plurality of chambers. .

Moreover, in the above invention, it is preferable that the frame holding portion holds the ring frame by the frame holding portion, and the frame holds the frame holding portion. In this case, in the configuration in which the ring frame and the frame holding portion are housed in the chamber, the process of attaching the second adhesive tape to the semiconductor wafer can be performed while avoiding deformation or breakage of the semiconductor wafer.

Further, in the above invention, preferably, the first suppressing member is the holding stage, and the first proximity means brings the second adhesive tape to the semiconductor wafer together with the holding stage. In this case, since the holding stage functions as the first suppressing member, the complication of the apparatus can be avoided.

Furthermore, since the second adhesive tape is close to the semiconductor wafer during the first approach, even if bubbles are caught between the second adhesive tape and the holding table, the bubbles are perpendicular to the surface of the adhesive tape. The expansion of the direction is quickly suppressed by the semiconductor wafer. Therefore, it is possible to more reliably prevent the occurrence of irregularities and wrinkles due to elongation of a part of the second adhesive tape. As a result, it is possible to surely avoid a situation in which the second adhesive tape is unevenly attached to the semiconductor wafer, and the adhesion between the second adhesive tape and the semiconductor wafer is lowered.

Further, in the above invention, preferably, the second suppressing member is the wafer holding portion. In this case, since the wafer holding portion functions as the second suppressing member, the complication of the device can be avoided. Furthermore, since the wafer holding portion is in contact with or closer to the first adhesive tape attached to the semiconductor wafer, damage of the wafer W due to bubble expansion and the first adhesive tape can be more reliably prevented. elongation.

Moreover, in the above invention, it is preferable that the first predetermined value is 0.1 mm or more and 0.5 mm or less. In this case, since the holding stage is sufficiently close, the pressing force acting on the semiconductor wafer due to the expansion of the air bubbles wound between the semiconductor wafer and the first adhesive tape can be further reduced. Therefore, deformation and breakage of the semiconductor wafer due to pressing can be more reliably avoided.

Moreover, in the above invention, it is preferable that the second predetermined value is 0.5 mm or less. In this case, since the suppressing member is sufficiently close to each other, it is possible to more reliably suppress the expansion of the bubble in the direction perpendicular to the surface of the semiconductor wafer. Therefore, damage to the wafer W due to bubble expansion can be more reliably avoided.

Moreover, in the above invention, preferably, the cutting mechanism that cuts the second adhesive tape along the outer shape of the semiconductor wafer is provided, and the second adhesive tape that is cut into the shape of the semiconductor wafer is peeled off. a peeling mechanism; and a tape collecting portion of the second adhesive tape after the peeling is recovered.

In this case, since the second adhesive tape attached to the semiconductor wafer is cut along the outer shape of the semiconductor wafer, the second adhesive tape is not exposed from the outer edge of the semiconductor wafer. Therefore, it is possible to appropriately avoid the situation in which the second adhesive tape is followed by other constitutions.

In order to achieve such an object, the present invention may have the following constitution.

That is, the present invention provides an adhesive tape attaching device for attaching an adhesive tape to a semiconductor wafer, comprising: a tape supply portion for supplying the adhesive tape; and a holding table for holding the adhesive tape; and holding the semiconductor crystal a wafer holding portion; a suppressing member having a flat surface; a chamber including a pair of shells of the holding stage, the wafer holding portion, and the suppressing member; and a wafer for holding the semiconductor wafer a holding portion that is close to the adhesive surface of the adhesive tape, and maintains a distance between the adhesive tape and the semiconductor wafer at a predetermined first predetermined value; and the suppression member approaches or contacts the adhesive tape a second proximity mechanism that maintains a distance between the flat surface and the adhesive tape at a predetermined second predetermined value; and the chamber is in a state in which the first proximity mechanism and the second proximity mechanism are operating And a pressure reducing mechanism for internal pressure reduction; and attaching the adhesive tape to the attaching mechanism of the semiconductor wafer in a state where the inside of the chamber is decompressed.

(Operation/Effect) According to this configuration, when the adhesive tape is attached to the semiconductor wafer, the wafer holding portion holding the semiconductor wafer is brought close to the adhesive tape by the first proximity mechanism, and the semiconductor wafer and the adhesive tape are adhered. The surface distance is maintained at a predetermined first predetermined value. Then, the restraining member approaches or contacts the non-adhesive surface of the adhesive tape by the second approaching mechanism, and the distance between the restraining member and the non-adhesive surface of the adhesive tape is maintained at a predetermined second predetermined value.

Therefore, when the attachment by the attaching mechanism is performed, even if the air bubble which is caught between the holding table and the adhesive tape is inflated by the decompression, the adhesive tape is pressed, and the pressed adhesive tape is maintained. The semiconductor wafer near the location is blocked. Further, the expansion of the bubble in the direction perpendicular to the surface of the adhesive tape is suppressed by the flat surface of the restraining member.

Therefore, it is possible to more reliably prevent a part of the adhesive tape from being pressed in a direction perpendicular to the surface of the adhesive tape due to the expansion of the air bubbles, and to cause unevenness and wrinkles. As a result, it is possible to surely avoid a situation in which the adhesive tape is unevenly attached to the semiconductor wafer, and the adhesion between the adhesive tape and the semiconductor wafer is lowered. Moreover, deterioration of the base material and the adhesive material due to the suppression of the elongation of the adhesive tape can be avoided. Further, in the configuration, in order to decompress the chamber and attach the adhesive tape to the semiconductor wafer, the configuration is not limited to the case where the tape is attached to one surface of the semiconductor wafer. Therefore, the features of the present invention can be applied to more. Diverse composition.

According to the adhesive tape attaching method and the adhesive tape attaching device of the present invention, the wafer can be attached to the other side of the wafer to which the adhesive tape is attached with excellent precision while avoiding damage of the wafer and damage of the circuit. New adhesive tape.

4‧‧‧With the supply department

5‧‧‧Loading unit

6‧‧‧With cutting mechanism

7‧‧‧ chamber

8‧‧‧Suppression unit

9‧‧‧ peeling unit

10‧‧‧With recycling department

20‧‧‧Exfoliation members

22‧‧‧ Attachment roller

23‧‧‧cutting unit

33A‧‧‧Upper shell

33B, 33C‧‧‧ lower case

37‧‧‧ Keeping the table

60‧‧‧Control Department

61‧‧‧Suppressing components

77‧‧‧Frame keeping platform

91‧‧‧ Attachment roller

93‧‧‧Suppressing components

95‧‧‧ Wafer Holder

PT‧‧‧protective tape

W‧‧‧Semiconductor Wafer

F‧‧‧ ring frame

DT‧‧‧Support belt

Fig. 1 is a view showing the configuration of a mounting frame.

Fig. 1(a) is a cross-sectional view showing the configuration of a mounting frame before and after the attaching work, and Fig. 1(b) is a perspective view showing the mounting frame.

Fig. 2 is a front elevational view showing the entire embodiment of the adhesive tape attaching device of the first embodiment.

Fig. 3 is a plan view showing the entirety of the adhesive tape attaching device of the first embodiment.

Fig. 4 is a longitudinal sectional view showing a configuration of a rotary drive mechanism of the first embodiment.

Fig. 5 is a longitudinal sectional view showing the configuration of the chamber of the first embodiment.

Fig. 6 is a longitudinal sectional view showing the configuration of the chamber of the first embodiment.

Fig. 7 is a flow chart for explaining the operation of the adhesive tape attaching device of each embodiment; Fig. 7(a) is a flow chart for explaining the operation of the first embodiment, and Fig. 7(b) is a flow chart for explaining the operation of the second embodiment; .

Fig. 8 is a longitudinal sectional view showing the operation of step S1 of the first embodiment.

Fig. 9 is a longitudinal sectional view showing the operation of step S1 of the first embodiment.

Fig. 10 is a plan view showing the operation of step S1 of the first embodiment.

Fig. 11 is a longitudinal sectional view showing the operation of step S1 of the first embodiment.

Fig. 12 is a longitudinal sectional view showing the operation of step S1 of the first embodiment.

Fig. 13 is a longitudinal sectional view showing the operation of step S1 of the first embodiment.

Fig. 14 is a longitudinal sectional view showing the operation of step S1 of the first embodiment.

Fig. 15 is a longitudinal sectional view showing the operation of step S2 of the first embodiment.

Fig. 16 is a longitudinal sectional view showing the operation of step S3 of the first embodiment.

Fig. 17 is a longitudinal sectional view showing the operation of step S3 of the first embodiment.

Fig. 18 is a longitudinal sectional view showing the operation of step S4 of the first embodiment.

Fig. 19 is a longitudinal sectional view showing the operation of step S5 of the first embodiment.

Fig. 20 is a longitudinal sectional view showing the operation of step S6 of the first embodiment.

Fig. 21 is a view for explaining the effect of the first embodiment; Fig. 21 (a) is a view showing the configuration of a conventional example, and Fig. 21 (b) is a view showing a problem occurring in the constitution of the conventional example, Fig. 21 (c) is a view showing the positional relationship between the holding stage and the semiconductor wafer in the vicinity of the first embodiment, and FIG. 21(d) is a view for explaining the effect of maintaining the holding position in the approach position in the first embodiment. Fig. 21 (e) is a view showing a positional relationship between the restraining member that maintains the approach position and the first adhesive tape in the first embodiment, and Fig. 21 (f) is a view showing a suppressing member that maintains the approach position in the first embodiment. The picture of the effect.

Fig. 22 is a longitudinal sectional view showing the entirety of the adhesive tape attaching device of the second embodiment.

Fig. 23 is a plan view showing the entirety of the adhesive tape attaching device of the second embodiment.

Fig. 24 is a longitudinal sectional view showing the configuration of the chamber of the second embodiment.

Fig. 25 is a longitudinal sectional view showing the operation of step S1 of the second embodiment.

Fig. 26 is a longitudinal sectional view showing the operation of step S3 of the second embodiment; Fig. 26(a) is a view showing a state before the support tape is attached, and Fig. 26(b) is a view showing a state after the support tape is attached. .

Fig. 27 is a longitudinal sectional view showing the operation of step S5 of the second embodiment.

Fig. 28 is a longitudinal sectional view showing the operation of step S6 of the second embodiment.

Fig. 29 is a longitudinal sectional view showing the operation of step S7 of the second embodiment.

Fig. 30 is a longitudinal sectional view showing the operation of the attachment work of the modification.

Figure 31 is a longitudinal sectional view showing the configuration of a chamber of the third embodiment.

Fig. 32 is a longitudinal sectional view showing the operation of step S4 of the third embodiment.

Fig. 33 is a longitudinal sectional view showing the operation of step S5 of the third embodiment.

Fig. 34 is a longitudinal sectional view showing the configuration of a chamber of a modification (5).

Fig. 35 is a longitudinal sectional view showing a configuration in which an adhesive tape is attached by a attaching roller in a modification (5).

Fig. 36 is a longitudinal sectional view showing the configuration of a chamber of a modification (7).

Fig. 37 is a longitudinal sectional view showing the operation of step S4 of the modification (7).

38 is a longitudinal cross-sectional view showing a configuration of a chamber of a modification (8); FIG. 38(a) is a view showing a configuration of a state in which step S3 is completed, and FIG. 38(b) is a view showing a configuration of step S4.

39 is a view for explaining the effect of the configuration of the modification (8), and FIG. 39(a) is a view showing a configuration before the decompression is performed on a conventional configuration in which the wafer holding portion is controlled to be close to the adhesive tape. 39(b) is a view showing a state of the bubble and the adhesive tape after decompression in the conventional configuration, and FIG. 39(c) is a view showing the structure in which the adhesive tape is attached to the wafer in the conventional configuration. FIG. 39(d) is a view showing a state of the bubble and the adhesive tape after the pressure reduction in the modification (8).

Fig. 40 is a longitudinal sectional view showing the configuration of a chamber of a modification.

 [Formation of the Invention]  

[Example 1]

<Description of the overall composition>

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Further, in the present embodiment, a case where an adhesive tape for surface protection is attached to a circuit forming surface of a semiconductor wafer (hereinafter simply referred to as "wafer") mounted on a ring frame will be described as an example.

That is, as shown in FIG. 1(a), in the mounting frame MF to which the adhesive tape DT for support is attached to the back surface of the semiconductor wafer W (hereinafter simply referred to as "wafer W"), A protective tape PT for protection is attached to the surface (circuit forming surface) of the wafer W. In the following, the adhesive tape for support is referred to as "support tape DT", and the adhesive tape for protection is referred to as "protective tape PT". As shown in FIG. 1(b), the mounting frame MF is produced by attaching a support tape DT to the back surface of the wafer W and the ring frame f. In the first embodiment, the support tape DT corresponds to the first adhesive tape of the present invention, and the protective tape PT corresponds to the second adhesive tape of the present invention.

Fig. 2 is a front view showing the entire configuration of an adhesive tape attaching device according to a first embodiment of the present invention, and Fig. 3 is a plan view showing the adhesive tape attaching device of the first embodiment.

The adhesive tape attaching device of the first embodiment includes a wafer supply/recovery unit 1, a wafer transfer mechanism 2, an alignment table 3, a tape supply unit 4, a mounting unit 5, a tape cutting mechanism 6, and a chamber 7; The suppressing unit 8; the peeling unit 9, the belt collecting unit 10, and the like. Hereinafter, a specific configuration will be described with respect to each of the above-described structural portions, mechanisms, and the like.

Two wafer bodies C1 and C2 are placed in parallel in the wafer supply/recovery unit 1. In each of the cartridges C, the mounting frame MF of the plurality of sheets is inserted into a plurality of layers in a horizontal posture in which the circuit forming surface (surface) of the wafer W faces downward and is accommodated.

The wafer transfer mechanism 2 includes two robot arms 2A and 2B. The two robot arms 2A, 2B are configured to be horizontally advanced and retractable, and are rotatable and movable as a whole. Further, a vacuum suction type wafer holding portion having a horseshoe shape is provided at the tip end of the robot arms 2A and 2B. The wafer holding portion is inserted into a gap between the mounting frames MF that are housed in a plurality of layers in the body C to adsorb and hold the upper surface of the mounting frame MF. The mounting frame MF that is adsorbed and held is pulled out from the cartridge C and transported in the order of the alignment table 3, the holding table 37, and the wafer supply/recovery unit 1.

The alignment stage 3 is configured such that the mounting frame MF placed in the mounting by the wafer transfer mechanism 2 is aligned in accordance with a notch formed on the outer circumference of the wafer W, a flat portion formed on the outer periphery of the frame f, or the like. .

As shown in FIG. 2, the tape supply unit 4, the mounting unit 5, the separator collecting portion 12, and the cutting unit 23 are mounted on the same vertical plate 14. The vertical plate 14 is horizontally moved along the upper frame 16 by the movable table 15.

In the tape supply unit 4, a wide protective tape PT that is wound up is loaded on the supply reel 17, and the protective tape PT with the separation piece S taken out from the supply reel 17 is rolled back to the guide roller 18. The protective tape PT of the peeled separation sheet S is guided to the mounting unit 5. Further, it is configured such that an appropriate rotational resistance is applied to the supply reel 17, and excessive tape extraction cannot be performed.

In the separator recovery unit 12, the recovery spool 19 that winds the separator S that has been peeled off from the protective tape PT is rotationally driven in the winding direction.

In the mounting unit 5, the protective tape PT of the peeled separation sheet S is placed on the holding table 37 with the adhesive surface facing upward, and the peeling member 20, the lifting roller 21, and the pressing roller 22 are provided as shown in FIG. .

The peeling member 20 has a sharp edge at the front end. By separating the edge into the peeling member 20 which is obliquely downward, the separator S is folded back to peel off the protective tape PT. That is, the protective tape PT protrudes forward from the peeling member 20. The lift roller 21 cooperates with the peeling member 20 to hold the protective tape PT in a timely manner. The pressing roller 22 is subjected to a non-adhesive treatment, and the front end of the protective tape PT protruding from the front end of the peeling member 20 is pressed and placed on the holding table 37 to be described later.

The cutting unit 23 includes a movable table 25 that moves along a frame 24 provided on the front side of the peeling member 20, and a cutter 26 that is interposed between the movable table 25 and a tool holder. That is, the cutting unit 23 cuts the protective tape PT in the width direction.

As shown in FIGS. 2 and 3, the tape cutting mechanism 6 is a spacer support arm 29 including a cutter unit 30 which is a lower end of the arm front end of the arm supported by the movable table 28 which is movable up and down along the frame 27. Extend. The cutter 31 with the blade tip facing downward is attached to the cutter unit 30. Further, the cutter unit 30 is configured to be capable of adjusting the radius of rotation through the support arm 29. The tape cutting mechanism 6 cuts the protective tape PT placed on the holding table 37 into substantially the same shape and size as the wafer W.

The chamber 7 is constituted by a pair of upper and lower outer shells having a smaller outer shape than the width of the adhesive tape T. In the present embodiment, one upper case 33A and two lower cases 33B and 33C are provided.

The lower casings 33B and 33C are coupled and fixed to the rotation shaft 35 of the rotation drive mechanism 34 such as a motor, and are provided at both ends of the rotation arm 36, respectively. That is, for example, when the lower casing 33B and the upper casing 33A form the chamber 7, the other lower casing 33C is positioned at the belt loading position on the side of the placing unit 5. Further, the upper surface and the lower surface of the lower casings 33B and 33C are subjected to a release treatment such as fluorine processing.

A holding table 37 that can be raised and lowered is provided in the two lower casings 33B and 33C. The holding table 37 is coupled to the ejector pins 38 that penetrate the lower casings 33B and 33C. The other end of the jack 38 is driven by being coupled by an actuator 39 composed of a motor or the like. Therefore, the holding table 37 is raised and lowered in the lower casings 33B and 33C. The position of the holding table 37 is controlled to an arbitrary height by the control unit 60 to be described later.

The holding table 37 is placed and held by the protective tape PT in which the separation sheet S is peeled off and the adhesive surface faces upward. As shown in FIG. 5, the upper surface of the holding table 37 is formed with a tool travel groove 37a, and the blade 31 provided in the cutter unit 30 is rotationally moved to cut the protective tape PT. In the plan view of the holding table 37, the tool traveling groove 37a is formed at a position substantially the same shape and size as the wafer W.

As shown in FIG. 5, the upper case 33A is provided in the elevation drive mechanism 40. The elevation drive mechanism 40 includes a movable table 43 that can be raised and lowered along a rail 42 disposed longitudinally of the back of the vertical wall 41, and a movable frame 44 supported by the movable table 43 in an adjustable height; and from the movable frame 44 An arm 45 extending forward. An upper casing 33A is attached to the support shaft 46 that extends downward from the front end portion of the arm 45.

The movable table 43 is configured such that the screw 47 is reversely rotated by the motor 48 to perform the screw feed lifting.

As shown in FIG. 6, the upper and lower casings 33A-33C are connected to the vacuum apparatus 51 via the flow path 50. Further, the flow path 50 on the side of the upper casing 33A is provided with a solenoid valve 52. Further, a flow path 55 including electromagnetic valves 53 and 54 for opening the atmosphere is connected and connected to each of the casings 33A to 33C. Further, a flow path 57 including a solenoid valve 56 that is leaked to adjust the internal pressure of the temporary pressure reduction is connected to the upper case 33A. Further, the opening and closing operations of the electromagnetic valves 52, 53, 54, and 56 and the operation of the vacuum device 51 are performed by the control unit 60.

As shown in FIG. 5, the suppression unit 8 is provided with the suppression member 61 in the upper case 33A. The restraining member 61 is a plate having a flat bottom surface. The upper portion of the suppressing member is coupled to the cylinder 62, and is lifted and lowered in the upper casing 33A. Further, the position of the restraining member 61 is controlled to an arbitrary height by the control unit 60. Further, the control unit 60 corresponds to the first approaching mechanism and the second approaching mechanism of the present invention.

As shown in FIGS. 2, 3, and 17, the peeling unit 9 includes a movable table 65 that horizontally moves left and right along the guide rail 64, a fixed piece 66 that moves up and down the movable table 65, and the fixed piece 66 and the fixed piece 66 The movable piece 68 of the cylinder 67 is opened and closed. In other words, the peeling unit 9 grips and peels off one end side of the unnecessary protective tape PT in which the fixed tape piece 66 and the movable piece 68 cut the borrowing tape cutting mechanism 6 into the shape of the wafer W.

In the belt collecting portion 10, a recovery container 69 positioned on the side of the peeling end of the peeling unit 9 and having the protective tape PT peeled off by the peeling unit 9 is disposed.

The adhesive tape attaching device is provided with a frame holding base 77. As shown in FIGS. 3, 4, and 15 and the like, the frame holding base 77 surrounds the outer circumference of the lower casings 33B and 33C and is provided on the rotating arm 36. Therefore, it rotates integrally with the lower casings 33B and 33C. When the frame frame f is placed on the frame holding base 77, the height is set such that the upper surface of the joint portion 70 of the lower casings 33B and 33C and the upper surface of the ring frame f are flush with each other. The frame holding base 77 corresponds to the frame holding portion in the present invention.

<Description of action>

Next, a series of operations in which the protective tape PT is attached to the wafer W of the mounting frame MF by the above-described embodiment will be described. Fig. 7 (a) is a flow chart for explaining the process of attaching the protective tape PT to the wafer W of the mounting frame MF of the first embodiment.

Step S1 (loading of the guard band)

In response to the instruction to start the attachment of the protective tape PT, first, the tape supply unit 4 draws the protective tape PT with the separator S attached thereto toward the mounting unit 5. Then, as shown in FIG. 8, the holding table 37 is raised such that the height of the upper surface thereof becomes the same height as the top (joining portion) 70 of the lower case 33B and moves toward the tape take-up position indicated by the solid line.

Further, as shown in FIG. 8, the placing unit 5 is moved from the starting position indicated by the broken line to the pressing processing start position indicated by the solid line. The protective tape PT is protruded from the peeling member 20 by a predetermined length while synchronizing the supply of the protective tape PT with the winding. Thereafter, the pressing roller 22 is lowered to press the front end of the protective tape PT toward the joint portion 70 of the lower casing 33B.

Thereafter, as shown in FIG. 9, the protective tape PT is pressed downward while moving the mounting unit 5 to the left in the drawing, and the protective tape PT is placed on the entire joint portion 70 and the holding table 37. At this time, the placed protective tape PT is held by the holding table 37. Then, as shown by the solid line in FIG. 9, the placing unit 5 is stopped at a position exceeding a predetermined distance from the joint portion 70 on the pressing processing terminal side.

As shown in Fig. 10, the cutting unit 23 is actuated, and the cutter 26 cuts the rear end side of the protective tape PT in the width direction (y direction in the drawing). After the protective tape PT is cut into a single piece, the placing unit 5 and the cutting unit 23 are reset toward the home position.

After the placing unit 5 and the cutting unit 23 are returned to the home position, the tape cutting mechanism 6 is actuated. That is, as shown in Fig. 11, the cutter unit 30 is lowered to a predetermined height, and the cutter 31 is pierced into the guard belt PT at the cutter travel groove 37a of the holding table 37.

When the cutter 31 is stuck into the guard band PT, the support arm 29 rotates with the longitudinal axis P as the center of rotation. The cutter 31 is rotationally moved along the tool travel groove 37a in accordance with the rotation, and the protective tape PT sucked and held by the holding table 37 is cut into substantially the same shape and size as the wafer W. At this time, the surface of the protective tape PT is kept horizontal. When the cutting of the protective tape PT is completed, the cutter unit 30 is raised and returned to the standby position.

After the protective tape PT is cut, the peeling unit 9 is moved to the peeling start position. As shown in FIG. 12, both ends of the protective tape PT exposed from the lower case 33B are sandwiched by the fixing piece 66 and the movable piece 68. Next, as shown in FIG. 13, the peeling unit 9 is moved to a predetermined distance obliquely upward in this state, and then the unnecessary protective tape PT cut into the same shape as the wafer is horizontally moved and peeled off.

When the unnecessary protective tape PT is peeled off, the protective tape PT cut into the same shape as the wafer W is placed on the holding table 37 in a state where the adhesive surface is exposed upward. When the peeling unit 9 reaches the belt collecting portion 10, the holding of the protective tape PT is released, and the protective tape PT is dropped on the recovery container 69.

After the unnecessary protective tape PT is peeled off, as shown in FIG. 14, the holding table 37 is lowered while being held toward the home position while sucking and holding the protective tape PT. At this time, the surface of the protective tape PT held by the holding table 37 is at a position lower than the joint portion 70. The holding table 37 on which the protective tape is placed is reset toward the home position, and the engineering of step S1 is completed.

Step S2 (mounting of the mounting frame)

After the protective tape PT is placed on the holding table 37, the mounting of the mounting frame is started. That is, the robot arm 2A carries out the mounting frame MF from the body C1 and mounts it on the alignment table 3. After the alignment table 3 is aligned, the mounting frame MF is conveyed toward the upper side of the holding table 37 by the robot arm 2A.

Next, as shown in FIG. 15, the robot arm 2A lowers the mounting frame MF, and the mounting frame MF is placed on the lower case 33B. At this time, the support tape DT between the ring frame f and the outer periphery of the wafer W is in contact with the top (joining portion) 70 of the lower case 33B, and the ring frame f is placed on the frame holding table 77. Therefore, the support belt DT system and the joint portion 70 are in a flat state at the same height.

At this time, the distance D1 from the adhesion surface of the protective tape PT held by the holding table 37 to the surface of the wafer W is a sufficient distance to surely prevent the protective tape PT from coming into contact with the wafer W under atmospheric pressure. As an example, the distance D1 is about 3 to 5 cm. By placing the mounting frame MF on the lower case 33B, the engineering of step S2 is completed.

Step S3 (formation of the chamber)

After the mounting of the mounting frame is completed, the formation of the chamber is started, that is, as shown in Fig. 16, the rotary driving machine 34 is actuated and the lower casing 33B is rotationally moved below the upper casing 33A. At this time, the lower end case 33C attached to the other end side of the rotary arm 36 is moved to the tape placement position. After the lower case 33B is rotationally moved, as shown in FIG. 17, the upper case 33A is lowered, and the lower case 33B sandwiches the support tape DT to form the chamber 7.

Step S4 (the close movement of the station)

After the chamber is formed, the proximity movement of the stage is performed. That is, as shown in FIG. 18, the holding stage 37 is raised from the starting position indicated by the broken line toward the attaching position indicated by the solid line in accordance with the control of the control unit 60, so that the protective tape PT is brought close to the wafer W. As a result, the distance from the protective tape PT to the surface of the wafer W is changed from D1 to D2. The control unit 60 performs various controls such that the position of the holding table 37 is maintained at the attaching position.

The distance D2 is set in advance so as to avoid damage of the wafer W in the attaching process of the protective tape PT to be described later, and to be equal to or less than the predetermined value Lt1. The predetermined value Lt1 varies depending on conditions such as the thickness of the wafer W and the material of the guard tape PT. In the first embodiment, the predetermined value Lt1 is about 0.5 mm to 1 mm.

Further, at this time, the surfaces of the protective tape PT and the wafer W are in a non-contact state. In other words, the distance D2 is a predetermined positive value Lt2 or more, and is, for example, 0.1 mm or more. By the distance D2 being a predetermined value Lt2 or more, it is possible to avoid the situation in which the protective tape PT contacts the surface of the wafer W even under atmospheric pressure. The predetermined value Lt1 corresponds to the first predetermined value in the present invention.

Here, it is preferable to perform the approach movement of the restraining member 61 in addition to the approach movement of the holding table 37. When the approaching movement of the restraining member 61 is performed, the cylinder 62 is driven in accordance with the control of the control unit 60. By this driving, the suppressing member 61 is lowered toward the support belt DT from the starting position indicated by the broken line toward the restraining position indicated by the solid line as shown in Fig. 18 . As a result, the distance from the flat surface 61a of the restraining member 61 to the support belt DT is changed from E1 to E2. The control unit 60 performs various controls such that the position of the suppressing member 61 is maintained at the suppressed position.

The distance E2 is set in advance so as to prevent bubble expansion in a direction perpendicular to the surface of the wafer (z direction in the drawing) and to be equal to or less than a predetermined value Lt3. The predetermined value Lt3 varies depending on conditions such as the thickness of the wafer W and the material of the protective tape PT. In the first embodiment, the predetermined value Lt3 is about 0.5 mm to 1 mm. Further, from the viewpoint of preventing the expansion of the bubble, it is more preferable that the non-adhesive surface supporting the belt DT is maintained in contact with the flat surface 61a. That is, unlike the distance D2, the distance E2 may also be zero. The predetermined value Lt3 corresponds to the second predetermined value in the present invention.

Step S5 (attachment of the protective tape)

After the proximity movement of the holding table and the restraining member is completed, the attachment of the protective tape is started. In other words, the control unit 60 operates the vacuum device 51 while the solenoid valves 53, 54, 56 are closed, and decompresses the inside of the upper casing 33A and the lower casing 33B. At this time, the opening degree of the electromagnetic valve 52 is adjusted to decompress the inside of the two shells 33A, 33B at the same speed.

When the inside of the two shells 33A, 33B is decompressed to a predetermined air pressure, the control unit 60 closes the solenoid valve 52 and stops the operation of the vacuum device 51.

The control unit 60 adjusts the opening degree of the electromagnetic valve 56 to leak it, and gradually raises the inside of the lower casing 33B to a predetermined air pressure. At this time, as shown in Fig. 19, the air pressure in the upper casing 33A becomes lower than the air pressure in the lower casing 33B because the differential pressure causes the protective tape PT to be pulled into the upper casing 33A from the center thereof. Therefore, the protective tape PT is slowly attached from the center of the wafer W that is close to being equipped toward the outer periphery.

At this time, the non-adhesive surface of the support belt DT and the flat surface 61a of the restraining member 61 are brought close to each other in step S4. Therefore, even when air bubbles are contained between the support tape DT and the back surface of the wafer W, the expansion of the air bubbles in the direction (z direction) perpendicular to the surface of the wafer W is suppressed by the suppressing member 61. Therefore, damage to the wafer W due to expansion of the bubble in the z direction can be appropriately avoided.

Further, the adhesive surface of the protective tape PT and the surface of the wafer are maintained at a position close to the distance D2. Therefore, even between the support tape DT and the back surface of the wafer W, the bubble is expanded in the z direction so that the wafer W is pushed downward, and the pressed wafer W is quickly held by the protective tape PT. Blocked. In other words, the deformation of the wafer W due to the pressing force directed downward is suppressed by the holding stage 37, so that the warpage or breakage of the wafer W due to the expansion of the air bubbles can be appropriately prevented.

When the inside of the upper casing 33A reaches a predetermined air pressure, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 to set the air pressure in the upper casing 33A to be the same as the air pressure in the lower casing 33B. The holding table 37 is raised in response to the air pressure adjustment, and the mounting surface (upper surface) of the holding table 37 and the surface of the wafer W are set to the same height.

When the protective tape PT is attached to the entire surface of the wafer W, the control portion 60 raises the upper casing 33A to open the atmosphere in the upper casing 33A, and simultaneously opens the electromagnetic valve 54 so that the lower casing 33B side is also atmospheric. open. By the opening of the atmosphere, the attachment engineering of the protective tape of step S5 is completed.

Further, during the period in which the protective tape PT is attached to the wafer W in the chamber 7, the steps S1 to S2 can be performed in the lower case 33C that moves toward the tape placement position. In other words, the protective tape PT of the peeled separation sheet S is placed on the holding table 37 in the lower casing 33C with the adhesive surface facing upward. Further, the protective tape PT is cut into the same shape as the wafer W, and the useless protective tape PT is peeled off. Thereafter, the mounting frame MF carried out from the body C2 is placed on the lower case 33C by the robot arm 2B. Thus, by setting a plurality of lower casings and performing the steps S1 to S2 interactively, the attachment efficiency of the protective tape PT to the mounting frame MF can be improved.

Step S6 (recycling of the mounting frame)

When the attachment of the protective tape PT is completed in the chamber 7, the recovery of the mounting frame is started. That is, as shown in Fig. 20, the holding table 37 is lowered toward the starting position while the rotating arm 36 is reversed. At this time, the suppressing member 61 is also raised toward the starting position.

By the reverse rotation of the rotary arm 36, the lower case 33B is moved to the tape placement position on the side of the mounting unit 5, and the other lower case 33C is moved to the engagement position below the upper case 33A. The mounting frame MF to which the protective tape PT is attached is transported from the lower case 33B by the robot arm 2A, and is collected to the original position of the body C1.

In addition, during the collection of the mounting frame MF on the side of the lower casing 33B, the mounting frame MF on the lower casing 33C side is subjected to the formation of a chamber and the attachment treatment of the protective tape PT. As described above, the attaching operation of one turn of the protective tape PT to the mounting frame MF is completed, and thereafter, the same processing is repeated.

<Effect of Using the Configuration of Embodiment 1>

According to the configuration of the first embodiment, in the case where the other adhesive tape is attached to the other surface of the wafer to which the adhesive tape is attached, the damage of the wafer can be reliably prevented. And attach a new adhesive tape with precision.

As shown in FIG. 21(a), the bubble Ar is mixed between the adhesive tape T1 and the wafer W which are previously attached to one surface of the wafer W. In the conventional adhesive tape attaching device, when a new adhesive tape T2 is attached to the wafer W by differential pressure in the chamber, as shown in Fig. 21 (b), the bubble Ar is expanded in all directions.

As a result, a large pressing force Ps is applied to the wafer W due to the expanded bubble Ar. Further, since the configuration of the holding stage or the like is not close to the wafer W, a wide space is formed on the other surface of the wafer W. Therefore, the wafer W is warped and deformed by the pressing force Ps, and even the wafer W is damaged or the circuit is damaged. In addition, when the bubble Ar expands in the z direction, the length of the adhesive tape T1 is increased by the expansion, and the elastic properties of the base material and the adhesive material of the adhesive tape T1 are lost and deteriorated.

As shown in Fig. 21 (c), in the apparatus of the first embodiment, the holding stage 37 on which the adhesive tape T2 (protective tape PT) is placed is brought close to the wafer W before the differential pressure is generated in the chamber 7, and is maintained. This is close to the opposite state. In other words, during the period in which the adhesive tape T2 is attached by the differential pressure, the respective positions are controlled such that the distance between the holding stage 37 and the wafer W always becomes a predetermined small value D2.

In this case, even if the wafer W is pressed by bubbles or the like, as shown in FIG. 21(d), the wafer W is transferred through the holding table 37 whose distance from the wafer W is maintained at D2. Support quickly. At this time, the configuration is controlled by the transmission control unit 60, and the holding stage 37 is held (fixed) at a position close to the semiconductor wafer. Therefore, there is no possibility that the holding table 37 moves downward due to the pressing of the air bubbles. Therefore, deformation of the wafer W can be suppressed, and problems such as breakage of the wafer W and damage of the circuit can be more reliably prevented.

Further, since the distance D2 is set so that the adhesive tape T2 is not in contact with the wafer W, it is possible to prevent the adhesive tape T2 from coming into contact with the wafer W under atmospheric pressure and mixing air bubbles. Even if the pressing force Ps due to the expanded bubble Ar causes the wafer W to be pressed to come into contact with the adhesive tape T2, since this is the case after the vacuum suction starts, there is no adhesive tape T2 and A situation in which bubbles are mixed between wafers. Therefore, it is possible to attach the new adhesive tape T2 to the wafer W with high precision while avoiding breakage of the wafer W.

Further, as shown in Fig. 21(e), in the apparatus of the first embodiment, the restraining member 61 is brought close to the opposing direction of the adhesive tape T1 (supporting belt DT) before the differential pressure is generated, and the approaching direction is maintained. In other words, during the period in which the protective tape PT is attached by the differential pressure, the respective positions are controlled so that the distance between the member 61 and the adhesive tape T1 is always a predetermined small value E2.

In this case, the bubble Ar is mixed between the support tape DT and the wafer W, and even if the bubble Ar expands due to the pressure reduction, as shown in FIG. 21(f), it is perpendicular to the surface of the wafer W. The expansion of the bubble Ar in the direction (z direction) can be quickly suppressed by the flat face 61a of the restraining member 61 close to the opposite direction.

In other words, since the bubble Ar which is to be expanded toward the z direction is subjected to the buckling force by the flat surface 61a of the restraining member 61 whose position is fixed, the expansion in the z direction is restricted. At this time, the transmission control unit 60 controls the respective configurations, and the flat surface 61a of the suppression member 61 is held (fixed) at a predetermined position close to the adhesive tape T1. Therefore, there is no possibility that the restraining member 61 moves upward due to the pressing of the air bubbles.

As a result, since the bubble Ar expands so as to extend along the surface (xy plane) of the wafer W, the pressing force Ps in the z direction is reduced as compared with the conventional configuration. Therefore, deformation of the wafer W due to the excessive pressing force Ps can be suppressed, and problems such as breakage of the wafer W and damage of the circuit can be more reliably prevented. Further, it is possible to suppress the occurrence of the expansion of the adhesive tape T1 due to the expansion of the bubble in the z direction, so that the deterioration of the adhesive tape T1 due to the elongation can be avoided.

Further, by maintaining the predetermined short distance E2, the suppressing member 61 is configured to maintain the wafer W in an approaching or contact state. Therefore, since the suppressing member 61 does not apply unnecessary pressing force to the wafer W, it is possible to surely avoid a situation in which the wafer W is damaged and a state in which the wafer W comes into contact with the adhesive tape T2 under atmospheric pressure.

In the first embodiment, both the restraining member 61 and the holding table 37 are moved close to each other, and a differential pressure is generated after maintaining the close contact state with the adhesive tape T2. Therefore, when the adhesive tape T2 is attached to the wafer W by the differential pressure, the effect of reducing the pressing force Ps and suppressing the deformation of the wafer W can be obtained. As a result, when the pressure in the chamber 7 is reduced and the adhesive tape T2 is attached by differential pressure, the effect of preventing damage of the wafer W and preventing damage of the circuit can be increased.

[Embodiment 2]

Next, a second embodiment of the present invention will be described. In the first embodiment, the configuration in which the wafer W of the mounting frame MF is attached with the protective tape PT will be described as an example. In the second embodiment, a configuration in which the support tape DT is newly attached so as to cover the rear surface of the wafer W with the protective tape PT and the ring frame is attached, and the mounting process of the mounting frame MF is performed will be described as an example. In addition, the same components as those of the adhesive tape attaching device of the first embodiment are denoted by the same reference numerals, and the different components will be described in detail. In the second embodiment, the protective tape PT corresponds to the first adhesive tape in the present invention, and the support tape DT corresponds to the second adhesive tape in the present invention.

As shown in FIGS. 22 and 23, the adhesive tape attaching device of the second embodiment includes a frame supply portion 75, a robot arm 76, and a cutting unit 78. Further, the position of the belt collecting portion 4 is opposite to the position of the separator collecting portion 12. Further, the configuration of the tape cutting mechanism 6 can be omitted.

The frame supply portion 75 is provided on the side of the body C1. A wagon-type transport vehicle 79 in which the ring frame f is stacked is connected to the space. The transport vehicle 78 is provided with an elevating platform inside. The ring frame f is lifted at a predetermined pitch on the lifting platform, and the ring frame f is delivered to the robot arm 76 one by one from the upper opening.

The robot arm 76 sucks and holds the upper surface of the ring frame f by a horseshoe-shaped holding portion.

The cutting unit 78 cuts off the support tape DT attached to the wafer W and the ring frame f along the ring frame f. As shown in FIG. 24, the cutting unit 78 is provided in the elevation drive mechanism 40 which raises and lowers the upper case 33A. The cutting unit 78 is provided with a hub portion 80 that rotates around the support shaft 46 by the spacer bearing 79. The hub portion 80 is provided with four support arms 81 to 84 extending in the center in the radial direction.

The tool holder that supports the horizontal axis of the disk-shaped cutter 85 is mounted on the front end of a support arm 81 so as to be movable up and down, and the pressing roller 87 is movably mounted on the rocker arm 88 so as to be movable up and down. The other support arms 82 to 84 have a front end.

The upper portion of the hub portion 80 has a coupling portion 89 that is coupled to and driven by a rotation shaft of the motor 90 provided on the arm 45.

Next, in the adhesive tape attaching device of the second embodiment, a configuration having a different function from the device of the first embodiment will be described.

The plurality of wafers W are inserted into a plurality of layers in a horizontal posture with the surface facing downward, and are accommodated in the bodies C1 and C2 of the wafer supply/recovery unit 1. A protective tape PT is attached to the surface of each wafer W in advance.

The wafer holding portion of the wafer transfer mechanism 2 is inserted into a gap between the wafers W accommodated in the multilayer body C, and the wafer W is sucked and held from the back surface. The wafer W that is adsorbed and held is pulled out from the body C and transported in the order of the alignment stage 3, the holding stage 37, and the wafer supply/recovery unit 1.

The alignment stage 3 is configured such that the wafer W placed on the wafer transfer mechanism 2 is placed in alignment with a notch formed on the outer circumference of the wafer W, an orientation flat surface, or the like.

In the belt supply unit 4, a wide support belt DT that is wound up is loaded on the supply reel 17, and the support belt DT with the separation piece S taken out from the supply reel 17 is rolled back to the guide roller 18. The support tape DT of the peeled separation sheet S is guided to the attaching unit 2A.

The separator recovery unit 12 is configured to rotationally drive the recovery spool 19 wound by the separator S separated from the support belt DT in the winding direction.

In the mounting unit 5, the support tape DT of the peeled separation sheet S is attached to the joint portion 70 of the lower casings 33B and 33C with the adhesive surface facing downward, and the peeling member 20, the lift roller 21, and the urging roller are provided. twenty two.

The front end of the peeling member 20 has a sharp edge. The separator S is folded back by the peeling member 20 having the edge set obliquely downward to peel off the support belt DT. That is, the support belt DT is protruded forward from the peeling member 20. The lift roller 21 and the peeling member 20 cooperate to hold the support belt DT in a timely manner. The pressing roller 22 presses the front end of the protective tape PT protruding from the front end of the peeling member 20 and adheres to the joint portion 70 of the lower casings 33B and 33C. The cutting unit 23 cuts the support belt DT in the width direction.

The holding table 37 sucks and holds the wafer W to which the protective tape PT is attached with the surface of the wafer W facing downward. As shown in FIGS. 22 and 24, the holding table 37 has a plurality of support pins 71 built therein. The support pin 71 is configured to be movable up and down, and the front end thereof can be raised upwards higher than the holding surface of the holding table 37.

The peeling unit 9 holds and peels off one end side of the unnecessary support belt DT which is cut by the cutting unit 78 by the fixing piece 66 and the movable piece 68. In the belt collecting unit 10, a recovery container 69 for collecting the unnecessary support belt DT from which the stripping unit 9 is detached is disposed.

<Description of action>

Here, an operation of attaching the support tape DT to cover one of the mounting frames MF by the adhesive tape attaching device of the second embodiment to cover the wafer W with the protective tape PT and the ring frame f will be described. Fig. 7 (b) is a flowchart showing the procedure of the operation of the mounting process of the second embodiment.

Step S1 (displacement of the wafer)

With the instruction to support the start of attachment of the tape DT, first, the robot arm 2A carries out the wafer W from the body C1 and mounts it on the alignment table 3. After the alignment table 3 is aligned, the robot arm 2A moves it to the holding belt 37 at the attached position.

As shown in FIG. 25, the holding table 37 pushes the plurality of support pins 71 higher than the top (joining portion) 70 of the lower case 33B to pick up the wafer W. The support pin 71 that has been taken up to the wafer W is lowered, and the wafer W is adsorbed and held by the holding surface of the holding stage 37. At this time, the surface of the wafer W is at a position lower than the joint portion 70. The wafer W is adsorbed and held by the holding stage 37 via the protective tape PT, and the engineering of the step S1 is completed.

Step S2 (mounting of the ring frame)

After the placement of the wafer is completed, the mounting of the ring frame is started. That is, the robot arm 76 carries out the ring frame f from the frame supply portion 75 and mounts it on the frame holding table 77 at the tape attaching position. The engineering of step S2 may be performed before step S1, or may be performed during the execution of step S1.

Step S3 (attach the support tape to the ring frame)

When the mounting of the wafer and the mounting of the ring frame are completed, the process of step S3 is started. That is, as shown in Fig. 26 (a), the placing unit 5 is moved from the starting position indicated by the broken line toward the attaching processing start position indicated by the solid line. The support belt DT is protruded from the peeling member 20 by a predetermined length while the supply of the support belt DT is synchronized with the winding. Thereafter, the pressing roller 22 is lowered to push the front end of the support belt DT toward the upper surface of the ring frame f.

As shown in Fig. 26 (b), the mounting unit 5 moves from the end position of the pressing process indicated by a broken line toward the end position indicated by the solid line, and covers the joint portion 70 of the ring frame f and the lower case 33B. The way is attached with support DT. At this time, the back surface of the wafer W and the adhesive surface of the support tape DT are opposed to each other by a predetermined distance D1. When the placing unit 5 reaches the end position, the support belt DT is cut in the width direction by the cutting unit 23. Step S3 of the second embodiment corresponds to the first attaching process in the present invention.

Step S4 (formation of the chamber)

When the support belt DT is attached to the ring frame f, the chamber is formed in the same manner as in the first embodiment. That is, after the rotary driving machine 34 is actuated and the lower casing 33B is rotationally moved below the upper casing 33A, the upper casing 33A is lowered. Next, the support belt DT is sandwiched by the lower case 33B and the upper case 33A to form the chamber 7. At this time, the distance from the non-adhesive surface of the support belt DT to the flat surface 61a of the restraining member 61 is E1.

Step S5 (the close movement of the station)

After the chamber is formed, the proximity movement of the stage is performed. That is, as shown in Fig. 27, the holding table 37 is raised from the initial position indicated by the broken line toward the attached position shown by the solid line in accordance with the control of the control unit 60, so that the wafer W is brought close to the support belt DT. As a result, the distance from the support tape DT to the surface of the wafer W is from D1 to D2. The control unit 60 performs various controls such that the position of the holding table 37 is maintained at the attaching position. Further, at this time, the support tape DT and the surface of the wafer W are in a non-contact state.

The distance D2 is set to a predetermined value Lt1 or less in advance, and is prevented from damaging the wafer W in the attaching process of the protective tape PT to be described later. The predetermined value Lt1 varies depending on conditions such as the thickness of the wafer W and the material of the guard tape PT. In the first embodiment, the predetermined value Lt1 is about 0.5 mm to 1 mm. The value of the distance D2 is the same as that of the first embodiment.

Here, it is preferable to further control the approach movement of the member 61 in addition to the approach movement of the holding table 37. When the approaching movement of the restraining member 61 is performed, the cylinder 62 is driven in accordance with the control of the control unit 60. By this driving, as shown in FIG. 27, the suppressing member 61 is lowered from the initial position indicated by the broken line toward the restraining position indicated by the solid line, and is close to the non-adhesive surface of the support belt DT.

As a result, the distance from the flat surface 61a of the restraining member 61 to the support belt DT is E1 from E1. The control unit 60 performs various controls such that the position of the suppressing member 61 is maintained at the suppressed position. That is, the distance controlled from the flat surface 61a to the support belt DT is always E2. Further, in order to suppress the deformation of the wafer W more quickly, it is preferable to have a smaller distance E2. In particular, it is preferable to control the height of the restraining member 61 such that the flat surface 61a is held in contact with the support belt DT.

Step S6 (attach the support tape to the wafer)

After the proximity movement of the holding table and the restraining member is completed, the attachment of the support tape is started. That is, the control unit 60 is the same as the first embodiment, and the vacuum device 51 is operated in a state where the electromagnetic valves 53, 54, 56 are closed, and the inside of the upper casing 33A and the lower casing 33B are depressurized at the same speed. When the inside of the two cases 33A, 33B is depressurized to a predetermined air pressure, the control unit 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.

The control unit 60 adjusts the opening degree of the electromagnetic valve 56 to leak one of the sides, and gradually raises the inside of the upper casing 33A to a predetermined air pressure. At this time, as shown in Fig. 28, the air pressure in the lower case 33B becomes lower than the air pressure in the lower case 33B because the differential pressure causes the support band DT to be pulled into the lower case 33B from the center thereof. Therefore, the support tape DT is slowly attached from the center of the wafer W to be closely equipped toward the outer periphery.

At this time, since the holding table 37 is holding and holding the protective tape PT, the distance between the holding table 37 and the protective tape PT is controlled to be zero. Therefore, even when air bubbles are caught between the protective tape PT and the wafer W, it is possible to prevent the air bubbles from expanding in the z direction during decompression. Therefore, it is possible to prevent the wafer W from being damaged by the excessive pressing force acting on the wafer W.

Further, the distance from the wafer W to the suppressing member 61 is maintained at a very small value (D2+E2). Therefore, even if the wafer W is pushed upward by the bubble expansion between the protective tape PT and the wafer W, the wafer W can be quickly blocked by the flat surface 61a of the suppressing member 61. In other words, the warpage and deformation of the wafer W are appropriately suppressed by the suppressing member 61. As a result, it is possible to more reliably prevent the occurrence of deformation or breakage of the wafer W.

When the inside of the upper casing 33A reaches the preset air pressure, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 to set the air pressure in the lower casing 33B to be the same as the air pressure in the upper casing 33A. In response to this air pressure adjustment, the holding stage 37 is raised to set the upper surface of the wafer W (here, the back surface of the wafer) to the same height as the upper surface of the ring frame f.

Further, during the period in which the attachment process of the support tape DT is performed in the chamber 7, the cutting unit 78 is actuated. At this time, as shown in FIG. 28, the cutting unit 78 rotates with the longitudinal axis P as the center of rotation. By this rotation, the cutter 85 cuts the support belt DT attached to the ring frame f into the shape of the ring frame f. Next, the pressing roller 87 is pressed while following the belt cutting portion of the ring frame f while the cutter 85 is being rotated.

That is, when the chamber 7 is constituted by the lowered upper casing 33A and the lower casing 33B, the cutter 85 of the cutting unit 78 and the pressing roller 87 also reach the cutting operation position. In this manner, the support tape DT is attached to the entire back surface of the wafer W and is cut along the ring frame f.

When the attachment and the cutting of the support belt DT are completed, the control unit 60 raises the upper casing 33A to open the atmosphere in the upper casing 33A, and simultaneously opens the electromagnetic valve 54 so that the lower casing 33B side is also open to the atmosphere. According to the opening of the atmosphere, the attachment engineering of the support belt of step S6 is completed. Step S6 of the second embodiment corresponds to the second attaching process in the present invention.

Further, while the protective tape PT is attached to the wafer W in the chamber 7, the wafer W and the ring frame f are placed on the lower case 33C at the tape loading position by the robot arm 2A and the robot arm 76. Attachment processing to the frame holding stage 77 is performed by the adhesive tape DT.

Step S7 (recycling of the mounting frame)

When the attachment of the support tape DT is completed in the chamber 7, the recovery of the mounting frame is started. That is, the holding table 37 is lowered toward the home position while the rotating arm 36 is reversed. At this time, the restraining member 61 also rises toward the starting position (see FIG. 20).

By the reverse rotation of the rotary arm 36, the lower case 33B is moved to the tape placement position on the side of the mounting unit 5, and the other lower case 33C is moved to the engagement position below the upper case 33A.

After the rotation arm 36 is reversed, the peeling unit 9 is moved to the peeling start position. As shown in FIG. 29, both end sides of the support belt DT exposed from the ring frame f are sandwiched by the fixed piece 66 and the movable piece 68. After moving a predetermined distance obliquely upward in the state, the unnecessary support belt DT cut along the ring frame f is peeled off while moving horizontally.

When the peeling unit 9 reaches the tape collecting portion 10, the holding of the support tape DT is released, and the useless support tape DT is dropped on the recovery container 69. The mounting frame MF which is attached to the wafer W by the DT is transported from the lower case 33B by the robot arm 2A and recovered to the original position of the body C1.

Further, on the side of the lower case 33B, while the peeling process and the peeling process of the adhesive tape DT are completed and the mounting frame in which the wafer W and the ring frame f are integrally formed are carried out, the support tape DT is directed toward the wafer on the lower case 33C side. W attach processing and cutting processing. As described above, the operation of attaching one side of the tape DT to the wafer W is completed, and thereafter, the same processing is repeated.

As described above, in the adhesive tape attaching apparatus of the second embodiment, the support tape DT is attached to the other surface of the wafer W to which the protective tape PT is attached on one surface by the differential pressure of the chamber. It is possible to more reliably avoid deformation and breakage of the wafer W. That is, when the inside of the chamber 7 is decompressed, the holding table 37 is brought close to the adhesive surface of the support belt DT, and the restraining member 61 is brought close to or in contact with the non-adhesive surface of the support belt DT.

Therefore, even when air bubbles are caught between the protective tape PT and the wafer W which are attached in advance, the pressing force which acts on the wafer W due to the expansion of the bubble in the z direction during decompression can be greatly reduced. . Further, even if the wafer W is pressed upward, the deformation of the wafer W can be quickly suppressed by the flat surface 61a of the suppressing member 61. As a result, it is possible to more reliably prevent deformation or breakage of the wafer W in the attaching process of the support tape DT.

Further, since the holding table 37 adsorbs the wafer W, it is possible to prevent the air bubbles caught between the protective tape PT and the wafer W from expanding in the z direction. Therefore, the pressing force acting on the circuit surface of the wafer W can be reduced, and deterioration of the protective tape PT due to the elongation of the protective tape PT can be appropriately avoided.

[Example 3]

Next, a third embodiment of the present invention will be described. In the third embodiment, in the same manner as in the first embodiment, the protective tape PT is attached to the surface of the wafer W in the mounting frame MF to which the support tape DT is attached on the back surface of the wafer W. The configuration of the inside of the chamber 7 is different from that of the first embodiment and the third embodiment.

As shown in Fig. 17, the configuration in which the frame holding table 77 is disposed outside the chamber 7 in the first embodiment will be described as an example. In other words, in the first embodiment, the support belt DT between the ring frame f and the wafer W is sandwiched between the pair of shells 33A and 33B to form the chamber 7. On the other hand, as shown in FIG. 31, the frame holding portion 77 holding the ring frame f in the third embodiment is disposed inside the chamber 7. That is, the chamber 7 is formed in a state in which the entire mounting frame MF is housed inside the chamber 7.

Further, in the third embodiment, the holding table 37 holding the protective tape PT is provided in the upper case 33A, and the suppressing member 61 is provided in the lower case 33B. The suppressing member 61 having the flat surface 61a is capable of moving up and down, and has a function of placing and holding the wafer W. The holding table 37 is configured to be movable up and down. Further, similarly to the first embodiment, the holding base 37 may be provided in the lower casing 33B, and the restraining member 61 may be provided in the upper casing 33A. In the third embodiment, the holding table 37 corresponds to the tape holding portion and the first suppressing member in the present invention, and the suppressing member 61 corresponds to the wafer holding portion and the second suppressing member in the present invention.

The operation of attaching the protective tape PT to one of the wafers W of the mounting frame MF by the adhesive tape attaching device of the third embodiment will be described. The flow chart of the operation in the third embodiment is based on the first embodiment. In the same manner as in the first embodiment, the support tape DT in the third embodiment corresponds to the first adhesive tape in the present invention, and the protective tape PT corresponds to the second adhesive tape in the present invention.

Step S1 (holding of the guard band)

According to the instruction to start the attachment of the protective tape PT, first, the protective tape PT with the separation piece S is taken out, and the mounting unit 5 peels off the separation piece S from the protective tape PT, and pushes the protective tape PT toward the pressing roller 22 Pushing above the holding table 37. By this pressing, the protective tape PT is placed on the holding table 37, and the holding table 37 sucks and holds the protective tape PT. Further, similarly to the first embodiment, the protective tape PT is cut by the cutting unit 23 and the tape cutting mechanism 6 into the same shape as the wafer W. The useless protective tape PT that has been cut is peeled off by the peeling unit 9 and recovered in the recovery container 69.

Step S2 (mounting of the mounting frame)

After the protective tape PT is held by the holding table 37, the mounting frame MF is carried out in the same manner as in the first embodiment, and after the alignment table 3 is aligned, the mounting frame MF is placed on the lower case 33B. At this time, the wafer W is placed on the suppressing member 61, and the ring frame f is placed on the frame holding base 77.

Step S3 (formation of the chamber)

After the mounting of the mounting frame is completed, the lower case 33B is rotationally moved below the upper case 33A. Then, the upper case 33A is lowered, and the upper case 33A and the lower case 33B are brought into close contact to form the chamber 7. Figure 31 is a view showing a state in which the chamber 7 has been formed in Embodiment 3. At this time, the distance D1 from the adhesion surface of the protective tape PT held by the holding table 37 to the surface of the wafer W is sufficient to reliably avoid the distance between the protective tape PT and the wafer W at atmospheric pressure.

Step S4 (the close movement of the station)

After the chamber is formed, the proximity movement of the stage is performed. In other words, as shown in Fig. 32, the holding table 37 is lowered from the initial position indicated by the broken line toward the attached position indicated by the solid line, so that the holding stage 37 and the protective tape PT are close to the crystal. Round W. As a result, the distance from the protective tape PT to the surface of the wafer W is from D1 to D2. The control unit 60 performs various controls such that the position of the holding table 37 is maintained at the attaching position. In the third embodiment, the holding table 37 corresponds to the first suppressing member in the present invention, and the suppressing member 61 corresponds to the second suppressing member in the present invention.

The distance D2 is set in advance so as to avoid damage of the wafer W in the attaching process of the protective tape PT to be described later, and to be equal to or less than the predetermined value Lt1. In the third embodiment, the predetermined value Lt1 is set to about 0.5 mm to 1 mm. Further, the surface of the protective tape PT and the wafer W is in a non-contact state. In other words, the distance D2 is a predetermined positive value Lt2 or more, and is, for example, 0.1 mm or more.

Step S5 (attachment of the protective tape)

After the proximity movement of the holding table is completed, the attachment of the protective tape is started. In other words, the control unit 60 activates the vacuum device 51 in a state where the electromagnetic valves 53, 54, and 56 are closed, and decompresses the inside of the chamber 7.

At this time, the non-adhesive surface of the support belt DT is in contact with the flat surface 61a of the restraining member 61. Therefore, even if the support tape DT and the back surface of the wafer W contain air bubbles, the expansion of the air bubbles in the direction (z direction) perpendicular to the surface of the wafer W during the decompression is suppressed by the suppressing member 61. Therefore, the damage of the wafer W due to the expansion of the bubble in the z direction can be appropriately avoided. Further, by the distance D2 being equal to or greater than the predetermined value Lt2, it is possible to avoid the situation in which the protective tape PT contacts the surface of the wafer W even under atmospheric pressure.

Further, the adhesive surface of the protective tape PT and the surface of the wafer are maintained at a position close to the distance D2. Therefore, even between the support tape DT and the back surface of the wafer W, the bubble is expanded in the z direction and the wafer W is pressed upward, and the pressed wafer W is quickly held by the protective tape PT through the holding table 37. Blocked. In other words, since the deformation of the wafer W due to the upward pressing force is suppressed by the holding stage 37, it is possible to appropriately avoid the occurrence of warpage or breakage of the wafer W due to bubble expansion during decompression. .

When the air pressure inside the chamber 7 is depressurized to a predetermined value, the control unit 60 closes the electromagnetic valve 52 while stopping the operation of the vacuum device 51. Next, as shown in FIG. 33, the control unit 60 moves the holding table 37 further downward, and at the same time, the suction holding of the protective tape PT by the holding table 37 is released. At this time, in the decompressed state, the protective tape PT is pressed by the holding stage 37 toward the surface of the wafer W. Therefore, the protective tape PT can be attached to the wafer W without the bubbles being entangled.

When the protective tape PT is attached to the entire surface of the wafer W, the control unit 60 fully opens the electromagnetic valves 53, 54, 56 to open the chamber 7 to the atmosphere. Through the opening of the atmosphere, the attachment of the protective tape of step S5 is completed.

Step S6 (recycling of the mounting frame)

When the attachment of the protective tape PT is completed in the chamber 7, the recovery of the mounting frame is started. The engineering of step S6 is the same as that of the first embodiment. In other words, the rotating arm 36 is reversed to move the lower casing 33B toward the tape mounting position on the side of the mounting unit 5. The mounting frame MF to which the protective tape PT is attached is transported from the lower case 33B by the robot arm 2A, and is collected to the original position of the body C1.

As shown in the third embodiment, the present invention can also be applied to a configuration in which the inside of the chamber 7 is housed in the chamber 7 and the inside of the chamber 7 is decompressed to attach the protective tape PT to the mounting frame MF. Composition. In the case where the mounting frame MF is formed under atmospheric pressure, there is a case where fine bubbles Ar are interposed between the wafer W and the support belt DT. When the periphery of the mounting frame MF is decompressed in this state, the bubble Ar expands, and deformation or breakage of the wafer or deformation and deterioration of the support belt DT may occur.

In the apparatus of the present invention, the holding stage 37 having the flat surface and holding the protective tape PT is brought close to the wafer W before the inside of the chamber 7 is depressurized. Therefore, even if the wafer W is pressed by the expansion of the bubble Ar, the wafer W is quickly blocked by the flat surface of the holding table 37. In other words, the deformation of the wafer W due to the pressing force of the expanded bubble is suppressed by the holding stage 37, so that warpage of the wafer W due to expansion of the bubble Ar during decompression can be appropriately prevented. Damaged situation.

Further, at this time, by bringing the holding stage 37 close to the wafer W, the protective tape PT held by the holding stage 37 is also close to the flat wafer W. In other words, even if the bubble which is caught between the holding table 37 and the protective tape PT is expanded by decompression and the protective tape PT is pressed in the z direction, the protective tape PT is quickly pressed and suppressed. The member 61 is suppressed. Therefore, it is possible to more reliably avoid an unfavorable situation in which the protective tape PT is uneven, wrinkles, and the protective tape PT is unevenly attached to the wafer W due to bubble expansion.

Further, in the apparatus of the present invention, the restraining member 61 is brought into contact with the support belt DT before the inside of the chamber 7 is decompressed. Therefore, the elongation of the support belt DT due to the expansion of the bubble Ar is quickly suppressed by the restraining member 61. Therefore, deformation and deterioration of the support belt DT due to the elongation of the support belt DT can be more reliably prevented.

In this manner, when the member having the flat surface is brought into contact with or in contact with both sides of the protective tape PT or the support tape DT, the adhesive tape is pressed or deformed in the surface direction by the member having the flat surface. . As a result, it is possible to prevent the adverse effect on the adhesive tape or the wafer W due to the expansion of the bubbles which are caught in the adhesive tape under atmospheric pressure.

Further, the configuration in which the entire ring frame f and the wafer W are housed inside the chamber 7 as in the third embodiment can be applied to the configuration of the second embodiment. In other words, the wafer W and the ring frame f on which the protective tape PT is attached in advance may be housed inside the chamber 7, and the support tape DT may be re-covered to cover the back surface of the wafer W and the ring frame f. Attached to form the installation framework MF.

Further, the present invention can also be implemented in the following aspects.

(1) The configuration using the ring frame f is exemplified in each of the above embodiments, but is not limited thereto. In other words, as shown in FIG. 30, the second adhesive tape T2 is attached to the other surface of the wafer W on which the first adhesive tape T1 is attached to one surface, and the second adhesive tape T2 is attached by the differential pressure of the chamber 7. The constitution of the present invention can be applied.

(2) Although each of the above-described embodiments and modifications has a configuration in which two lower casings 33B and 33C are provided, one may be provided. In this case, the lower case may be rotated in the same manner as in the above embodiment by the rotating arm 36, or may be configured to be slidably moved along the linear track.

(3) In each of the above-described embodiments and modifications, each of the holding table 37 and the suppressing member 61 may have a configuration in which a heater is further built. As an example, a configuration in which the heater 63 is built in the suppressing member 61 is shown in FIG. In this case, when the attachment process is performed inside the chamber 7, the adhesive and the substrate constituting each of the protective tape PT and the support tape DT are softened by heating by a heater. As a result, the adhesive tapes are more easily deformed. Further, a configuration may be adopted in which the heater 37 and the suppressing member 61 are provided with a heater.

(4) In the step S1 of the above-described first embodiment, the configuration in which the strip-shaped protective tape PT of the peeled separation sheet S is placed on the holding table 37 and cut into the shape of the wafer W will be described as an example. However, if the protective tape PT having the adhesive surface exposed upward is placed on the holding table 37, the construction of the step S1 is not limited thereto.

As a modification of the first embodiment, a configuration in which the protective tape PT pre-cut in accordance with the shape of the wafer W is placed on the holding table 37 is exemplified. Further, the step S1 may be completed in a state where the protective tape PT placed on the holding table 37 is cut into a single piece, and the protective tape PT may be cut along the outer shape of the wafer W after the attaching process of the step S5. .

(5) As shown in Fig. 34, the configuration of the present invention can be widely applied to attaching the second adhesive tape T2 to the other surface of the wafer W to which the first adhesive tape T1 is attached in advance on one surface under reduced pressure. Composition. In other words, when the member having the flat surface is brought close to at least one surface (preferably two surfaces) of the wafer W, the periphery of the wafer W is decompressed, and the second adhesive tape T2 is attached to the reduced pressure state. In the configuration, the configuration for decompressing is not limited to the chamber 7.

Further, the method of attaching the second adhesive tape T2 to the wafer W is not limited to the configuration using the differential pressure. As another example of the method, a flat member (the holding stage 37 in the embodiment 3) holding the second adhesive tape T2 (protective tape PT) as shown in FIG. 33 can be cited as the wafer W. The push-pressing operation is performed by attaching a pressing operation, and the configuration is such that the attaching roller 91 accommodated in the inside of the chamber 7 is attached as shown in FIG.

The following examples of the operation of the configuration using the attaching roller 91 include the following. That is, the pressure reduction inside the chamber 7 is performed in a state where the holding table 37 holding the protective tape PT is brought close to the wafer W. After the completion of the pressure reduction, the holding layer 37 is lowered while the adsorption holding is released, and the protective tape PT is placed on the wafer W. Then, the attaching roller 91 is rotated from the position indicated by the broken line in FIG. 35 toward the position indicated by the solid line, so that the protective tape PT is pressed and attached to the wafer W.

(6) In the third embodiment, the support frame MF is placed on the restraining member 61 to bring the support belt DT into contact with the restraining member 61. However, the pressure is reduced in a state where the restraining member 61 is brought into contact with each other. Composition. That is, the pressure reduction can be performed in a state where the restraining member 61 having the flat surface 61a is brought close to the mounting frame MF. In this case, the pressure is reduced in a state where the distance from the flat surface 61a to the support belt DT is equal to or lower than the predetermined value Lt3, that is, E2, and the tape is attached in a reduced pressure state.

(7) In the third embodiment, the configuration in which the holding stage 37 has both the function as the first suppressing member and the function of holding the protective tape PT has been described as an example. However, as shown in FIG. 36, the holding table 37 is different from the holding table 37. The member may also be provided with a suppressing member 93 having a flat surface. In the embodiment, the suppressing member 61 has a function as the second suppressing member and a function as the wafer holding portion for holding the wafer W. However, as an example of the member different from the suppressing member 61 having the flat surface, It may be configured to have a ring-shaped wafer holding portion 95. In the modification (7), the suppression member 93 corresponds to the first suppression member in the present invention, and the suppression member 61 corresponds to the second suppression member in the present invention.

In the adhesive tape attaching device of the modification (7), the second adhesive tape T2 is attached to the other surface of the wafer W, and the operation flow chart is based on the first embodiment. First, the second adhesive tape T2 is held by the holding table 37 (corresponding to step S1). Next, the wafer W to which the first adhesive tape T1 is attached is held in the wafer holding portion 95 (corresponding to step S2). Next, the upper case 33A is joined to the lower case to form the chamber 7 (corresponding to step S3). Fig. 36 is a view showing a state in which the step S3 in the modification (7) has been completed. At this time, the suppressing member 61 and the suppressing member 93 are separated from the wafer W.

Then, in step S4, as shown in FIG. 37, the suppressing member 61 and the suppressing member 93 are brought close to the wafer W. That is, the suppressing member 61 is brought close to (or in contact with) the non-adhesive surface of the first adhesive tape T1 attached to the wafer W, and the suppressing member 93 is brought close to the other surface of the wafer W. As a result, the distance between the suppressing member 93 and the wafer W becomes D2 which is a minute distance from D1. Further, the distance between the restraining member 61 and the first adhesive tape T1 is E2 which is a minute distance from E1.

In step S5, the inside of the chamber 7 is decompressed. Even if the air bubbles that are caught between the first adhesive tape T1 and the wafer W are expanded by the pressure reduction, and a part of the first adhesive tape T1 is pressed in the z direction, the first adhesive tape T1 is quickly suppressed. The member 61 is suppressed. Therefore, it is possible to prevent a situation in which the first adhesive tape T1 is deteriorated due to a part of the first adhesive tape T1 being elongated in the z direction, and the adhesion between the first adhesive tape T1 and the wafer W is lowered. Further, since the wafer W is pressed by the suppressing member 93 even if it is pressed in the z direction, damage, deformation, and the like of the wafer W can be prevented.

When the pressure reduction is completed, the second adhesive tape T2 is attached to the wafer W by the pressurization by the holding table 37, the rotation of the attaching roller, or the like. At this time, the second adhesive tape T2 is attached after the suppression member 61 and the first suppression member 93 are separated/retracted from the wafer W as necessary. After the attachment of the second adhesive tape T2 is completed, the process proceeds to step S6, and the wafer W to which the adhesive tape is attached is collected on both sides.

(8) The configuration in which the member having the flat surface is decompressed in a state in which the member having the flat surface is brought close to the adhesive tape T, and the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure can be widely applied. An example of such a configuration in which the adhesive tape T is attached to one surface of the wafer W under reduced pressure is shown in Fig. 38(a).

In the adhesive tape attaching device of the modification (8), the holding table 37 holding the adhesive tape T is attached to the lower case 33B, and the wafer holding portion 95 holding the wafer W by suction or the like is attached to the upper case 33A. In the present configuration, the holding table 37 functions as a suppressing member that suppresses the elongation of the adhesive tape T by being pressed in the z direction.

The wafer holding unit 95 is configured to be movable up and down by the transmission control unit 60. The adhesive tape T is held by the holding table 37 in a state of being attached to the flat support plate G. Attaching the adhesive tape T to the support plate G is usually carried out under atmospheric pressure. However, the support plate G may be omitted and the adhesive tape T may be directly placed and held on the holding table 37.

In the modification (8), when the adhesive tape T is attached to the wafer W, the support plate G to which the adhesive tape T is attached is held by the holding table 37, and after the wafer W is held by the wafer holding portion 95, The chamber 7 is formed (steps S1 to S3). Next, before depressurizing the inside of the chamber 7, as shown in Fig. 38 (b), the wafer holding portion 95 is lowered to approach the adhesive surface of the adhesive tape T. By the proximity control, the distance between the wafer W held by the wafer holding portion 95 and the adhesive tape T is maintained at a minute distance D2 (step S4).

In the approaching state, the adhesive surface of the adhesive tape T is opposed to the wafer W by a slight distance. Thereafter, the inside of the chamber 7 is decompressed while the wafer holding portion 95 is approaching the adhesive tape T, and the holding table 37 and the support plate G are pressed against the wafer W under reduced pressure to attach the adhesive tape T. On the wafer W (step S5).

In the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure, and the wafer holding portion 95 is not decompressed, the space in the z direction is in a state of being adjacent to the adhesive tape T. It is decompressed underneath. Since the adhesive tape T attached to the support plate G is usually preliminarily performed under atmospheric pressure, a minute air bubble Ar is caught between the adhesive tape T and the support plate G (Fig. 39 (a)).

Therefore, when the inside of the chamber 7 is decompressed, the entrapped bubble Ar expands to generate a strong pressing force Ps toward the z direction. As a result, when the wafer holding portion 95 is not decompressed toward the adhesive tape T, a part of the adhesive tape T is pressed in the z direction (direction perpendicular to the surface of the adhesive tape T) and is greatly elongated. Concavities and wrinkles are formed on the adhesive tape T (Fig. 39(b)). As a result, since the adhesive tape T which generates irregularities and wrinkles is attached to the wafer W, the adhesion between the wafer W and the adhesive tape T is lowered (FIG. 39(c)).

In the configuration of the modification (8), the non-adhesive surface of the adhesive tape T is in contact with the flat holding table 37, and the flat wafer holding portion 95 (and the wafer W) is maintained close to the adhesive surface of the adhesive tape T. . Therefore, even if the bubble Ar caught between the support plate G and the adhesive tape T is expanded by the pressure reduction treatment, the adhesive tape T to be pressed in the z direction is quickly held by the holding stage 37 or the wafer holding portion. 95 (and wafer W) is suppressed (Fig. 39(d)). Further, by the wafer holding portion 95 and the holding table 37 which are close to the adhesive tape T in the z direction, the expansion of the bubble Ar in the z direction is suppressed.

Therefore, in the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure, it is possible to avoid the adhesive tape T which is caused by the expansion of the bubble Ar during the pressure reduction treatment before being attached to the wafer W. The case where irregularities and wrinkles are formed. As a result, it is possible to more reliably avoid the deterioration of the adhesive tape T due to the formation of irregularities and wrinkles, the fact that the adhesive tape T is unevenly attached to the wafer W, and the position of the support plate G and the adhesive tape T. The state of the offset, etc.

Further, the configurations of the respective embodiments and the modifications are also applicable to the modification (8). For example, the holding table 37 may be configured to be close to the adhesive tape T instead of contacting the adhesive tape T. Further, as shown in Fig. 40, a restraining member 61 having a flat surface 61a different from the holding table 37 may be provided. In this case, the restraining member 61 is brought into contact with or in contact with the non-adhesive surface of the adhesive tape T, and the pressure reduction of the chamber 7 is performed while maintaining the flat surface 61a of the restraining member 61 against the non-adhesive surface of the adhesive tape T.

Claims (25)

 An adhesive tape attaching method is characterized in that a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and has a tape holding process for holding the second Adhesive tape; a cavity forming process, wherein a cavity is formed by sandwiching and joining the first adhesive tape exposed from an outer edge of the semiconductor wafer by a pair of shells; and the first approaching process brings the holding table closer to the foregoing a semiconductor wafer that maintains a distance between the semiconductor wafer and an adhesion surface of the second adhesive tape at a predetermined first predetermined value; and a bonding process of sandwiching the first adhesive tape with a pair of shells In the state, the second adhesive tape is attached to the semiconductor wafer while the air pressure in the space on the semiconductor wafer side in the chamber is lower than the air pressure in the other space.    The adhesive tape attaching method according to claim 1, wherein the semiconductor wafer is held by the first adhesive tape and held by the ring frame, and the ring frame is held by the frame holding portion while the chamber is being formed. A chamber is formed by sandwiching the first adhesive tape between the ring frame and the semiconductor wafer by a pair of shells.    The adhesive tape attaching method according to claim 1, further comprising: a second approaching process of bringing the flat member having a flat surface into contact with or contacting the non-adhesive surface of the first adhesive tape, and the flat surface and the first adhesive tape The distance is maintained at a predetermined second predetermined value.    An adhesive tape attaching method is characterized in that a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a wafer holding process is provided to hold the semiconductor a wafer; a first attaching process, wherein the second adhesive tape is attached to a joint portion of a pair of shells constituting the chamber; and the first approaching process causes the holding table to approach the second adhesive tape to cause the semiconductor The distance between the wafer and the adhesion surface of the second adhesive tape is maintained at a predetermined first predetermined value; and in the second proximity process, the suppression member having the flat surface approaches or contacts the non-adhesive surface of the second adhesive tape, and the aforementioned The distance between the flat surface and the second adhesive tape is maintained at a predetermined second predetermined value; and the second attachment process is formed by sandwiching and joining the second adhesive tape with a pair of shells to form the chamber. In the state, the second adhesive tape is attached to the semiconductor wafer while the air pressure in the space on the semiconductor wafer side in the chamber is lower than the air pressure in the other space.    The adhesive tape attaching method according to claim 4, wherein a frame holding process for holding the ring frame by the frame holding portion is provided, and in the first attaching process, a joint portion and a case covering a pair of shells constituting the chamber are covered The second adhesive tape is attached to the frame frame held by the frame holding process.    An adhesive tape attaching method is characterized in that a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and has a tape holding process for holding the second Adhesive tape; a wafer holding process for holding the semiconductor wafer by a wafer holding portion; and a chamber forming process for forming a chamber for accommodating the holding stage and the wafer holding portion by joining a pair of shells; a process of bringing a first suppressing member having a flat surface and being accommodated in the chamber close to the semiconductor wafer, and maintaining a distance between the semiconductor wafer and the first suppressing member at a predetermined first predetermined value; a process of bringing the second suppressing member accommodated in the chamber and having a flat surface close to or in contact with the non-adhesive surface of the first adhesive tape, and maintaining the distance between the flat surface and the first adhesive tape at a predetermined second The predetermined value and the attaching process are performed by attaching the second adhesive tape to the semiconductor wafer while reducing the air pressure inside the chamber in the state in which the chamber is formed after the second approaching process.    The adhesive tape attaching method according to claim 6, further comprising a frame holding process of holding the ring frame by the frame holding portion, wherein the chamber houses the frame holding portion.    The adhesive tape attaching method according to claim 6 or 7, wherein the first suppressing member is the holding stage, and in the first approaching process, the second adhesive tape is brought close to the semiconductor wafer together with the holding stage.    The adhesive tape attaching method according to claim 6 or 7, wherein the second suppressing member is the wafer holding portion.    The adhesive tape attaching method according to any one of claims 3 to 7, wherein the second predetermined value is 0.5 mm or less.    The adhesive tape attaching method according to any one of claims 1 to 7, wherein the first predetermined value is 0.1 mm or more and 0.5 mm or less.    An adhesive tape attaching method for attaching an adhesive tape to a semiconductor wafer, characterized by: a tape holding process for holding the adhesive tape to hold the substrate; and a wafer holding process for holding the semiconductor wafer by the wafer holding portion a chamber forming process for forming a chamber for accommodating the holding stage and the wafer holding portion by joining a pair of shells; and a first approaching process of bringing the wafer holding portion holding the semiconductor wafer close to the adhesive tape Maintaining a distance between the adhesive surface of the adhesive tape and the semiconductor wafer at a predetermined first predetermined value; and in a second approaching process, the suppressing member having the flat surface accommodated in the chamber approaches or contacts the adhesive tape The non-adhesive surface maintains the distance between the flat surface and the adhesive tape at a predetermined second predetermined value; and the attaching process, after the second approaching process, the cavity is lowered while the chamber is formed The air pressure inside the room is attached to the semiconductor wafer while the adhesive tape is attached.    An adhesive tape attaching device is characterized in that a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a tape supply portion is provided to supply the second adhesive tape; a holding stage for holding the second adhesive tape; the chamber is formed by sandwiching the first adhesive tape exposed from an outer edge of the semiconductor wafer with a pair of shells, and accommodating the holding stage; the first approaching mechanism Controlling that the holding stage is close to the semiconductor wafer, maintaining a distance between the semiconductor wafer and the adhesion surface of the second adhesive tape at a predetermined first predetermined value; and attaching the mechanism to the first proximity mechanism In the state of being activated, a differential pressure is generated in two spaces in the chamber by the first adhesive tape, and the second adhesive tape is attached to the other surface of the semiconductor wafer.    The adhesive tape attaching device of claim 13, wherein the semiconductor wafer is held by the first adhesive tape and held by the ring frame, and has a frame holding portion for holding the ring frame, wherein the chamber is a pair of shells. The first adhesive tape between the ring frame held by the frame holding portion and the semiconductor wafer is sandwiched.    The adhesive tape attaching device according to claim 13, comprising: a suppressing member having a flat surface; and a second approaching mechanism that causes the suppressing member to approach or contact the non-adhesive surface of the first adhesive tape, and the flat surface and the flat surface are The distance of the first adhesive tape is maintained at a predetermined second predetermined value.    An adhesive tape attaching device is characterized in that a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a tape supply portion is provided to supply the second adhesive tape; The wafer holding portion holds the semiconductor wafer; the suppressing member has a flat surface; the chamber formed by the pair of shells houses the holding stage and the suppressing member; and the first attaching means connects the second adhesive tape Attached to a joint portion of the casing; the first proximity mechanism is configured to maintain the holding table close to the second adhesive tape, and maintain a distance between the semiconductor wafer and the adhesion surface of the second adhesive tape at a predetermined first Controlling the predetermined value; the second approaching means bringing the restraining member into contact with or contacting the non-adhesive surface of the second adhesive tape, and maintaining the distance between the flat surface and the second adhesive tape at a predetermined second predetermined value; In the second attaching mechanism, when the first approaching mechanism and the second approaching mechanism are operating, a differential pressure is generated in the two spaces in the chamber separated by the second adhesive tape, and the second adhesive is applied. With attachment The other surface of the semiconductor wafer.    The adhesive tape attaching device of claim 16, comprising: a frame holding portion for holding a ring frame, wherein the first attaching mechanism covers a joint portion of the shell and the ring frame held by the frame holding portion The second adhesive tape is attached to the method.    An adhesive tape attaching device is characterized in that a second adhesive tape is attached to the other surface of a semiconductor wafer to which a first adhesive tape is attached, and a tape supply portion is provided to supply the second adhesive tape; a holding holder that holds the second adhesive tape, a wafer holding portion that holds the semiconductor wafer, a first suppressing member having a flat surface, a second suppressing member having a flat surface, and a chamber that houses the holding stage and the wafer The holding portion, the first suppressing member, and the second suppressing member are each formed of a pair of shells; and the first approaching mechanism is configured to bring the first suppressing member closer to the other surface of the semiconductor wafer, and to form the semiconductor wafer and the semiconductor wafer The distance between the first suppressing members is maintained at a predetermined first predetermined value; and the second approaching mechanism brings the second suppressing member into contact with or in contact with the non-adhesive surface of the first adhesive tape to make the flat surface and the first surface The distance of the adhesive tape is maintained at a predetermined second predetermined value; and the pressure reducing mechanism decompresses the inside of the chamber while the first approaching mechanism and the second approaching mechanism are operating; and attaching Configuration, in a state where the inside of the chamber was depressurized to the second adhesive tape adhered to the other surface of the semiconductor wafer.    The adhesive tape attaching device of claim 18, further comprising a frame holding portion for holding the ring frame, wherein the chamber houses the frame holding portion.    The adhesive tape attaching device according to claim 18 or 19, wherein the first suppressing member is the holding table, and the first proximity mechanism brings the second adhesive tape together with the holding table to the semiconductor wafer.    The adhesive tape attaching device of claim 18 or 19, wherein the second suppressing member is the wafer holding portion.    The adhesive tape attaching device according to any one of claims 16 to 19, wherein the second predetermined value is 0.5 mm or less.    The adhesive tape attaching device according to any one of claims 13 to 19, wherein the first predetermined value is 0.1 mm or more and 0.5 mm or less.    The adhesive tape attaching device according to any one of claims 13 to 19, further comprising: a cutting mechanism that cuts the second adhesive tape along an outer shape of the semiconductor wafer; and a peeling mechanism that cuts the semiconductor wafer The second adhesive tape of the shape is peeled off; and the tape collecting portion is used to collect the second adhesive tape after peeling.    An adhesive tape attaching device for attaching an adhesive tape to a semiconductor wafer, comprising: a tape supply portion for supplying the adhesive tape; a holding table for holding the adhesive tape; and a wafer holding portion for holding the semiconductor wafer The suppressing member has a flat surface; the chamber houses the holding stage, the wafer holding portion, and the suppressing member, and is composed of a pair of shells; and the first approaching mechanism holds the wafer holding the semiconductor wafer The portion is close to the adhesive surface of the adhesive tape, and the distance between the adhesive tape and the semiconductor wafer is maintained at a predetermined first predetermined value; and the second proximity mechanism causes the suppression member to approach or contact the non-adhesive of the adhesive tape. a surface that maintains a distance between the flat surface and the adhesive tape at a predetermined second predetermined value, and a pressure reducing mechanism that opens the inside of the chamber while the first approaching mechanism and the second proximity mechanism are operating The pressure-reducing mechanism and the attaching mechanism attach the adhesive tape to the semiconductor wafer in a state where the inside of the chamber is depressurized.