TW202209421A - Apparatus and method for joining film material - Google Patents

Abstract

The present invention provides an apparatus and a method for joining film material, which may join the film material onto the workpiece with excellent efficiency and precision in a configuration for pushing and pressing the entire surface of workpiece to join with film material. In a state while a holding table 39 holds the substrate W and the dry film DF, the present invention enables a first pressing mechanism 35 having the holding table 39 and a second pressing mechanism 36 arranged opposite to the first pressing mechanism approaching to each other and pushing and pressing each other, so as to join the dry film DF onto the substrate W. The second pressing mechanism 36 includes: an elastic member 47 arranged to make the pressing force acting on the entire surface of the substrate W and the entire surface of the dry film DF while the first pressing mechanism 35 and the second pressing mechanism 36 press against each other; and a protection sheet 49 for at least protecting the surface of the elastic member 47 opposite to the holding table 39.

Description

Film material attaching device and film material attaching method

The present invention relates to a film attaching device and a film attaching method for attaching a film such as a film or a tape to a workpiece such as a substrate.

When manufacturing a semiconductor wafer, in the process of forming a circuit pattern on the surface of the wafer, a dry film resist (hereinafter referred to as a "dry film"), which is a film-like photosensitive resin, is attached to the surface of the wafer, and then The dried film is subjected to exposure treatment and development treatment corresponding to the circuit pattern.

In the prior art, when attaching a drying film to a wafer, a method of attaching the drying film while pressing the drying film on the wafer by rotating a roller on the wafer has been proposed (refer to Patent Document 1). ). Furthermore, in another example of the conventional sticking method, a method has been proposed in which the dry film is pressed against the wafer by pressing a pressing member having a flat surface against the wafer and the dry film placed on the holding table. (refer to Patent Document 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-288255 [Patent Document 2] Japanese Patent Laid-Open No. 2011-133499

[The problem to be solved by the invention]

However, the above-mentioned conventional device has the following problems. That is, in the conventional technology, a small and circular wafer is used for the workpiece to which the dry film is attached. In recent years, wafer level packages (WLP, Wafer Level Package) or panel level packages (PLP, Panel Level Package) have been known for the purpose of reducing chip manufacturing costs. Wafer-level packaging is a chip-level package (CSP, Chip Size Package) completed by performing processing up to the final process of packaging in the state of a wafer. Panel level packaging is not applied to wafers, but to CSPs of panel-like glass substrates or printed substrates. In order to implement such wafer-level packaging and panel-level packaging, in recent years, workpieces tend to increase in size. Therefore, attempts have been made to attach a dry film using a large and rectangular substrate as a workpiece.

In the method of attaching the dry film to the workpiece using a rotating roller, a particularly large pressing force acts on the rotating portion of the roller. Therefore, in the attaching process, the pressing force acting on the substrate W may be biased. Therefore, a defect such as cracking or breakage may occur in the workpiece due to the deviation of the pressing force. In particular, when the size of the workpiece is increased, in the roll method, the frequency of occurrence of this problem becomes particularly high, and it is difficult to put it into practical use.

On the other hand, in the method of attaching the dry film to the workpiece using a flat pressing member, since a relatively uniform pressing force can be applied to the entire workpiece, the frequency of occurrence of cracks and the like in the workpiece can be reduced. However, when the entire surface of the drying film is pressed by the pressing member and attached to the workpiece, there is a new problem that the workpiece to which the drying film is attached is attached to the pressing member and cannot be separated.

When the workpiece is attached to the pressing member, the workpiece and the dry film are released from the holding table when the pressing member is separated from the holding table. As a result, since the device must be stopped and the workpiece with the dry film attached to the pressing member must be recovered, the operation efficiency of the sticking device is greatly reduced.

The present invention has been developed in view of such a situation, and its main purpose is to provide a film that can adhere a film material to the workpiece with excellent efficiency and accuracy, in a configuration in which the entire surface of the workpiece is pressed and attached to the film. A material attaching device and a film material attaching method. [means to solve the problem]

In order to achieve such an object, the present invention adopts the following configuration. That is, the film material sticking device of the present invention is equipped with: The first pressing mechanism has a workpiece holding portion for holding the workpiece; The second pressing mechanism is arranged opposite to the aforementioned first pressing mechanism; a film supply mechanism for holding the film material in the workpiece holding portion by laminating the film material on the workpiece held in the workpiece holding portion; and The attaching mechanism attaches the film material to the film material by bringing the first pressing mechanism and the second pressing mechanism relatively close to each other and pressing each other while the workpiece holding portion holds the workpiece and the film material. workpiece; The aforementioned second pressing mechanism has: an elastic member arranged so as to bring the first pressing mechanism and the second pressing mechanism relatively close to each other through the attaching mechanism, so that a pressing force acts on the entire surface of the film material; and The protective sheet protects at least a surface of the elastic member facing the workpiece holding portion.

(action-efficacy) According to this configuration, the second pressing mechanism includes the protective sheet. The protective sheet protects at least a surface of the elastic member facing the workpiece holding portion. In other words, the protective sheet protects at least the surface of the second pressing mechanism that is in contact with the first pressing mechanism. Therefore, since the use of the film sticking device can avoid the occurrence of scars, deformations, foreign matter adhesion, etc. on the elastic member, the durability and operation efficiency of the film sticking device can be improved.

That is, when the structure in which the elastic member directly presses the film material is used, the elastic member may be scratched, and the elastic member needs to be replaced. Replacing the larger elastic member is troublesome and reduces the working efficiency of the film sticking device. On the other hand, the replacement work of the sheet-like protective sheet is easy. Therefore, by protecting the elastic member with the protective sheet, the operation efficiency of the film attaching device can be improved, and the film attaching device can be used continuously.

Moreover, the elastic member presses the film material through the protective sheet. Therefore, even when the entire surface of the workpiece and the film is pressed by the elastic member, the film can be attached to the workpiece, thereby preventing the film from adhering to the elastic member and detaching from the workpiece holding portion.

In addition, since the second pressing mechanism is relatively close to the first pressing mechanism holding the workpiece and the film, and presses each other, the pressing force can be simultaneously and uniformly applied to the entire surface of the film and the workpiece. Therefore, it is possible to prevent the workpiece from being defective due to the bias of the pressing force acting on the workpiece. Furthermore, even if the workpiece has irregularities, the elastic member pushes the film material while elastically deforming, so that the film material fills the gaps between the irregularities with good precision to obtain a sticking effect. Therefore, the flatness of the surface of the film material attached to the workpiece can be improved.

Moreover, in the above-mentioned invention, it is preferable to provide a tension|tensile_strength applying mechanism which applies tension|tensile_strength to the said protection sheet, and prevents the said protection sheet from coming into contact with the said film material in a slack state.

(action-efficacy) According to this configuration, the tension applying mechanism applies tension to the protective sheet. By applying this tension, it is possible to prevent the protective sheet from contacting the film material in a state where a gap is formed between the protective sheet and the elastic member due to the slack of the protective sheet. When there is a gap between the protective sheet and the elastic member due to slack, when the elastic member pushes the film through the protective sheet and attaches it to the workpiece, the shape of the slack protective sheet can be adapted to allow the dry film to be affected. When the workpiece is pressed, the adhesion between the film and the workpiece decreases. The tension imparting mechanism can prevent the slack of the protective sheet, so that the adhesion accuracy of the film and the workpiece can be further improved.

Furthermore, in the above-mentioned invention, it is preferable to include: a chamber having an upper case and a lower case, and accommodating the first pressing mechanism and the second pressing mechanism; and a decompression mechanism for reducing the pressure inside the chamber. Space decompression; in a state where the sticking mechanism decompresses the internal space of the chamber by the decompression mechanism, the first pressing mechanism and the second pressing mechanism are relatively close to each other and press each other, so that the The film material is attached to the aforementioned workpiece.

(action-efficacy) According to this structure, it is equipped with a chamber which accommodates a 1st pressing mechanism and a 2nd pressing mechanism, and a decompression mechanism which depressurizes the internal space of a chamber. Next, the film material is attached to the workpiece by bringing the first pressing mechanism and the second pressing mechanism relatively close to each other and pressing each other in a state where the inner space of the chamber is depressurized. Since the film material is attached to the workpiece in a state where the air inside the chamber is evacuated by decompression, air can be reliably prevented from being entangled between the film material and the workpiece when the film material is attached to the workpiece. Therefore, the adhesion between the film and the workpiece can be further improved.

Further, in the above invention, preferably, at least one of the first pressing mechanism and the second pressing mechanism includes a heating mechanism for heating the film material when the film is attached by the attaching mechanism.

(action-efficacy) According to this structure, the heating means for heating a thin film material is provided. By heating the film, the film can be made softer and more easily deformed. Therefore, the thin film can be attached with good precision according to the shape of the workpiece surface. Also, even when a workpiece having irregularities on the surface is used, the adhesion between the workpiece and the film material can be improved.

In order to achieve such an object, the present invention can also adopt the following configurations. That is, the film material attaching method of the present invention has: The workpiece holding program holds the workpiece in the workpiece holding part of the first pressing mechanism; The film supply process is to hold the film material on the workpiece holding portion by laminating the film material on the workpiece held by the workpiece holding portion; an approach procedure, in which the workpiece holding portion holds the workpiece and the film material, and relatively approaches the first pressing mechanism and the second pressing mechanism disposed opposite to the first pressing mechanism; and In the attaching process, the film material is attached to the workpiece by pressing the first pressing mechanism and the second pressing mechanism that are relatively close to each other, The aforementioned second pressing mechanism includes: an elastic member disposed on a surface facing the first pressing mechanism; and a protective sheet protecting at least a surface of the elastic member facing the workpiece holding portion; In the attaching procedure, a pressing force acts on the entire surface of the film material through the protective sheet through the elastic member, and the film material is attached to the workpiece.

(action-efficacy) According to this configuration, the second pressing mechanism is relatively close to the first pressing mechanism holding the workpiece and the thin film, and is pressed against each other. The second pressing mechanism includes an elastic member. During the attaching process, the elastic member makes the pushing force act on the entire surface of the workpiece and the entire surface of the film material, so the pushing force can be simultaneously and uniformly applied to the entire surface of the film material and the workpiece. Therefore, even when the workpiece is enlarged, when the film is attached to the workpiece, it is possible to avoid defects such as cracks and missing corners in the workpiece due to the bias of the pressing force acting on the workpiece.

Furthermore, even if the workpiece has irregularities, since the elastic member presses the film material while elastically deforming, the film material is adhered and closely adhered to the irregularities with high precision. In addition, by pressing the entire thin film material by the second pressing mechanism, the thin film material can be attached so as to fill the gaps of the unevenness with high precision. Therefore, the surface flatness of the film attached to the workpiece can be improved.

Next, the second pressing mechanism includes a protective sheet. The protective sheet protects at least a surface of the elastic member facing the workpiece holding portion. In other words, the protective sheet protects at least the surface of the second pressing mechanism that is in contact with the first pressing mechanism. Therefore, the use of the film sticking device can prevent the elastic member from being scratched, deformed, and adhered to foreign matter, so that the durability and operation efficiency of the film sticking device can be improved.

In addition, the elastic member presses the film material through the protective sheet. Therefore, even when the entire surface of the film is pressed against the workpiece by the elastic member, by attaching the film to the workpiece, it is possible to prevent the film from attaching to the elastic member and detaching from the workpiece holding portion.

In addition, in the above-mentioned invention, a tensioning procedure is provided for applying tension to the protective sheet so as to prevent the protective sheet from contacting the film in a relaxed state; the attaching procedure is preferably performed through a In the protection sheet provided with tension by the tension application process, the elastic member attaches the film material to the workpiece by applying a pressing force to the entire surface of the film material.

(action-efficacy) According to this configuration, tension is applied to the protective sheet in the tension applying process. By applying this tension, it is possible to prevent the protective sheet from contacting the film material in a state where a gap is generated between the protective sheet and the elastic member due to slack of the protective sheet. When the protective sheet is slack and a gap is formed between the elastic member and the elastic member, in the attaching process, when the elastic member presses the film material through the protective sheet and attaches to the workpiece, deviation occurs due to the pressing force acting on the film material. , so that the adhesion between the film and the workpiece is reduced. Through the tension imparting process to prevent the protection sheet from loosening, in the attaching process, the attaching accuracy of the film and the workpiece can be further improved.

Furthermore, in the above-mentioned invention, it is preferable to include: a chamber forming process having an upper case and a lower case to form a chamber for accommodating the first pressing mechanism and the second pressing mechanism; and a decompression process, The internal space of the chamber is decompressed; the attaching process is in a state in which the internal space of the chamber is decompressed by the decompression process, and the first pressing mechanism and the second pressing mechanism are relatively close to each other. and press each other to attach the film material to the workpiece.

(action-efficacy) According to this configuration, it includes: a chamber formation process for forming a chamber for accommodating the first pressing mechanism and the second pressing mechanism; and a decompression process for depressurizing the inner space of the chamber. Next, in a state where the internal space of the chamber is depressurized, the first pressing mechanism and the second pressing mechanism are relatively close to each other and pressed against each other, so that the film material is attached to the workpiece. Since the workpiece is attached to the film material in a state where the inside of the chamber is exhausted by decompression, air can be reliably prevented from being drawn between the film material and the workpiece. Therefore, the adhesion between the film and the workpiece can be further improved.

Moreover, in the said invention, the heating process which heats the said thin film material by the heating means provided in at least one of the said 1st pressing means and the said 2nd pressing means is provided. In the above-mentioned attaching process, the film material in the state heated by the above-mentioned heating process is preferably attached to the above-mentioned workpiece.

(action-efficacy) According to this configuration, a heating program for heating the thin film material is provided. By heating the film, the film becomes softer and more easily deformed. Therefore, the thin film material can be attached with good precision according to the shape of the workpiece surface. Furthermore, even when a workpiece with uneven surfaces is used, the adhesion between the workpiece and the film material can be improved. [Effect of invention]

According to the film sticking device and the film sticking method of the present invention, the second pressing mechanism is relatively close to the first pressing mechanism holding the workpiece and the thin film and presses each other. The second pressing mechanism includes an elastic member, and since the elastic member causes a pressing force to act on the entire surface of the workpiece and the entire surface of the film material, the pressing force can be uniformly applied to the entire surface of the film material and the workpiece at the same time. Therefore, even when the workpiece is enlarged, when the film is attached to the workpiece, it is possible to prevent the workpiece from being cracked or damaged due to the bias of the pressing force acting on the workpiece.

Furthermore, even when the workpiece has irregularities, since the elastic member pushes the thin film material while elastically deforming, the thin film material is adhered and closely adhered to the irregularities with good precision. In addition, by pressing the entirety of the film material by the second pressing mechanism, the film material can be attached so that the gap between the unevenness and the convexity can be filled with high precision. Therefore, the flatness of the surface of the film material attached to the workpiece can be improved.

Furthermore, the second pressing mechanism is provided with a protective sheet. The protective sheet is used to protect at least a surface of the elastic member facing the workpiece holding portion. In other words, the protective sheet is used to protect at least the surface of the second pressing mechanism that is in contact with the first pressing mechanism. Therefore, through the use of the film sticking device, the elastic member can be prevented from being scratched, deformed, and foreign matter adhered, so that the durability and operation efficiency of the film sticking device can be improved.

In addition, the elastic member presses the film material through the protective sheet. Therefore, even in the case of pressing the entire surface of the film material to adhere to the workpiece, by attaching the film material to the workpiece, the erroneous action of the film material adhering to the elastic member and being detached from the workpiece holding portion can be avoided. Improve the operation efficiency of the film sticking device. Therefore, even when the workpiece is increased in size, the thin film material can be attached to the workpiece with excellent efficiency and good accuracy.

[Form for carrying out the invention]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the film material sticking apparatus 1 of the Example, the dry film DF was used as the film material, and the rectangular substrate W was used as the workpiece to which the film material was stuck. That is, in the film material sticking apparatus 1 of the embodiment, the film-attached substrate FW is produced by sticking the dry film DF on the surface of the substrate W. As shown in FIG. In addition, in this embodiment, the size of about 500 mm×500 mm to about 700 mm×700 mm is given as a preferable example of the size of the substrate W, but the specifications of the substrate W are not limited to these ranges.

<Description of the overall structure> As shown in FIG. 1 , the film sticking apparatus 1 includes a substrate supply unit 2 , a substrate transfer mechanism 3 , an alignment unit 4 , a sticking unit 5 , a substrate transfer mechanism 6 , a peeling unit 7 , an alignment unit 8 , and an electrostatic The inspection unit 9 and the substrate recovery unit 11 and the like. In addition, in the following description, the longitudinal direction of the film sticking apparatus 1 shown in FIG. 1 is called the left-right direction (x direction), and the horizontal direction (y direction) orthogonal to it is called the front-back direction.

Next, the structure of the dry thin film DF will be described with reference to FIG. 2 . The dry thin film DF used in this example has an elongated structure in which the first spacer layer S1, the resist layer Re, and the second spacer layer S2 are laminated. That is, the resist layer Re is exposed by peeling the first separator S1 from the dry film DF.

In addition, in this embodiment, the resist layer Re has thermal adhesiveness. The resist layer Re does not exhibit adhesive force at room temperature, but on the other hand, it can exhibit adhesive force by being heated. Therefore, the dry thin film DF can be attached to the substrate W by being heated. Furthermore, although the dry film DF of the present embodiment has a single-layer structure in which the resist layer Re has thermal adhesiveness, the resist layer Re may also have a multi-layer structure. In the case of the multi-layer structure, the resist layer Re is formed so that at least the lower surface side is an adhesive surface having adhesiveness, and the first isolation layer S1 may be added to the lower surface side.

Returning to FIG. 1 , the specific configuration of each structural part and mechanism of the film sticking device 1 will be described. The storage cassette C1 is mounted in the board|substrate supply part 2. As shown in FIG. In the storage box C1, a plurality of substrates W are inserted and stored in a horizontal posture with the surface (surface) on which the circuit pattern is formed facing upward.

The substrate transfer mechanism 3 is a device for transferring the substrate W from the substrate supply unit 2, and in one example, is constituted by a robot arm 3a. The substrate transfer mechanism 3 is configured to be able to move forward and backward horizontally, and at the same time, the entirety can be rotated and raised and lowered. Moreover, the front-end|tip of the robot arm 3a is equipped with the vacuum suction-type board|substrate holding part 3b which has a horseshoe shape. The board|substrate holding part 3b can be inserted in the clearance gap between the board|substrates W accommodated in the storage cassette C1 in several layers, and the lower surface of the board|substrate W is adsorbed and held. The sucked and held substrate W is pulled out from the storage cassette C1 and transferred to the alignment unit 4 and the attaching unit 5 in this order.

The alignment unit 4 is configured to be able to transfer the substrate W placed on the substrate W by the substrate transfer mechanism 3 , and to perform alignment based on a notch or a flat portion formed on the outer periphery of the substrate W, or the like.

The sticking unit 5 includes a film supply unit 13 and a chamber 15 . The film supply unit 13 supplies the dry film DF to the chamber 15 while peeling off the first separator S1 from the dry film DF. The substrate W transferred to the attaching unit 5 is housed in the chamber 15 , and the dry film DF is attached to the substrate W in the chamber 15 .

The substrate transfer mechanism 6 is a portion that transfers the substrate W (film-attached substrate FW) to which the dry film DF is attached from the chamber 15 , and is constituted by a robot arm 6 a in one example. The substrate transfer mechanism 6 is configured to be able to move forward and backward horizontally, and to be able to rotate and lift as a whole. Moreover, the front-end|tip of the robot arm 6a is equipped with the vacuum suction-type board|substrate holding part 6b which has a horseshoe shape. The substrate holding portion 6b adsorbs and holds the lower surface of the film-attached substrate FW. The film-attached substrate FW held by suction is pulled out from the chamber 15 and transferred to the peeling unit 7 , the alignment unit 8 , and the electrostatic inspection unit 9 in this order.

The peeling unit 7 is provided with the peeling stage 17 and the peeling mechanism 19 for peeling the 2nd separator S2 from the dry film DF attached to the board|substrate W. The alignment portion 8 is configured to align the thin-film-attached substrate FW from which the second spacer layer S2 has been peeled off again based on a notch, a flat portion, or the like formed on the outer periphery of the thin-film-attached substrate FW.

The electrostatic inspection unit 9 includes an inspection table 9a and an electrostatic sensor 9b. The inspection table 9 a holds the thin-film-attached substrate FW aligned in the alignment section 8 . The electrostatic sensor 9b measures the amount of static electricity carried by the film-attached substrate FW placed and held on the inspection table 9a. When the static electricity is equal to or less than the reference value, the film-attached substrate FW is transferred to the substrate recovery unit 11 .

The substrate recovery unit 11 has a storage cassette C2 placed thereon. The storage cassette C2 is comprised so that many sheets of the film-attached board|substrate FW can be inserted in multiple stages in a horizontal position, and can be accommodated.

As shown in FIG. 3 , the film supply unit 13 includes a film supply unit 21 , a guide roller 23 , a separator peeling member 25 , and a separator recovery unit 27 . The film supply unit 13 is configured to be able to reciprocate in the x direction along the pair of rails 29 shown in FIG. 1 as a whole. In addition, the separator peeling member 25 is comprised so that it can further reciprocate in the x direction independently of the film supply unit 13 .

In the film supply part 21, the strip|belt-shaped dry film DF wound in a roll shape is loaded in the supply shaft tube B1. The guide roller 23 is configured to be able to wind and guide the dry film DF fed out from the supply shaft tube B1 , and to guide it toward the separator peeling member 25 .

The separator peeling member 25 has a sharp-edged blade. By setting the blade to the rightward separation layer peeling member 25, the first separation layer S1 can be folded back and peeled off from the dry film Df. The dry film DF from which the first spacer layer S1 has been peeled off is guided to the inside of the chamber 15 . The separator recovery part 27 is rotationally driven in the winding direction of the recovery shaft tube B2 wound up by the first separator S1 peeled off from the dry film DF.

As shown in FIG. 4 , the chamber 15 is formed by the lower casing 15A and the upper casing 15B. The upper casing 15B is configured to be able to be lifted and lowered by the cylinder 16 , and is lowered through the upper casing 15B and abuts against the lower casing 15A to form a chamber 15 with a closed internal space.

In addition, each of the cylindrical top portion 28 of the lower case 15A and the cylindrical bottom portion 30 of the upper case 15B is preferably constituted by an elastic body as an example. In the case where the cylinder top 28 and the cylinder bottom 30 are formed of an elastic body, the lower case 15A and the upper case 15B can be brought into close contact with better precision when the chamber 15 is formed.

As shown in FIG. 4 , the lower case 15A and the upper case 15B are communicated and connected to the vacuum device 32 via the flow path 31 . The inner space of the chamber 15 can be decompressed by the operation of the vacuum device 32 . In addition, the flow path 31 is provided with a solenoid valve 33 for reducing the pressure in the internal space of the chamber 15 . In addition, the flow path 83 provided with the electromagnetic valve 81 for atmospheric release is connected to the chamber 15 in communication. The opening and closing operations of the solenoid valve 33 and the solenoid valve 81 and the operation of the vacuum device 32 are performed by the control unit 34 . In addition to the solenoid valve 33 and the like, the control unit 34 also controls the operation of each unit in the film sticking device 1 .

Inside the chamber 15 , a first pressing mechanism 35 , a second pressing mechanism 36 , a film cutting mechanism 37 , and a film holding plate 38 are provided. In the embodiment, the first pressing mechanism 35 and the film cutting mechanism 37 are housed in the lower case 15A, and the second pressing mechanism 36 is housed in the upper case 15B.

The first pressing mechanism 35 includes a holding table 39 for holding the substrate W. An example of the holding table 39 is a metal chuck table having the same shape or size as the substrate W or more. In the preferred configuration of the holding table 39, the substrate W is sucked and held by a suction device provided inside.

The holding table 39 is connected to the rod 40 penetrating the lower case 15A. The other end of the rod 40 is connected to and driven by an actuator 41 constituted by a motor or the like. Therefore, the holding table 39 is raised and lowered inside the lower case 15A. The position of the holding table 39 is controlled at an arbitrary height by the control unit 34 . Furthermore, the holding table 39 holds the dry thin film DF with the substrate W interposed therebetween.

The holding table 39 includes a plurality of support pins 43 . The support pin 43 is configured to be advanced and retracted by a cylinder (not shown). That is, by ascending by the air cylinder, as shown in FIG. 4 , each of the support pins 43 can protrude from the substrate holding surface (upper surface) of the holding table 39 . Also, each of the support pins 43 is built into the holding table 39 by being lowered by the cylinder.

Furthermore, the heater 44 is built in the holding table 39 . The heater 44 can heat the substrate and the dry film DF held by the holding table 39 by heating the holding table 39 .

The second pressing mechanism 36 is arranged to face the first pressing mechanism 35 . As shown in FIG. 5( a ), the second pressing mechanism 36 includes a pressing plate 45 , an elastic member 47 , a protection sheet 49 , and a cylinder 51 .

The pressing plate 45 is a rigid plate-like member, and the lower surface thereof is arranged so as to face the substrate holding surface of the holding table 39 . In the present embodiment, the lower surface peripheral edge portion 45a of the pressing plate 45 has an arc shape of the lace when viewed from the side. The elastic member 47 is disposed on the lower surface of the pressing plate 45 and is formed of an elastic body. Further, the lower surface peripheral edge portion 47a of the elastic member 47 has the same arc shape as the lower surface peripheral edge portion 45a. The protective sheet 49 is arranged so as to cover the lower surface of the elastic member 47 and the side surface of the pressing plate 45 .

That is, when the holding table 39 is raised, the first pressing mechanism 35 and the second pressing mechanism 36 are brought into contact with each other, and the substrate W and the drying film DF held on the holding table 39 are pressed against the elastic member 47 via the protective sheet 49 . . The lower surface of the elastic member 47 is a flat surface, and the flat surface faces the substrate W and the drying film DF. When the first pressing mechanism 35 and the second pressing mechanism 36 are pressed against each other, the elastic member 47 can apply a pressing force to the entire surface of the drying film DF through the flat lower surface. In addition, the width of the lower surface of the elastic member 47 is preferably equal to or larger than the size of the dry film DF.

The air cylinder 51 is arranged on the pressing plate 45 , and the end portion of the protective sheet 49 is connected to the air cylinder 51 . The tension of the protective sheet 49 can be appropriately adjusted by the expansion and contraction of the air cylinder 51 . Also, the tension of the protective sheet 49 can be detected by the tension sensor 52 at any time.

As shown in FIG. 5( b ), the protective sheet 49 is slack due to aging, temperature change, or the like, and a gap K is generated between the elastic member 47 and the protective sheet 49 . In this case, since the tension of the protective sheet 49 is lowered, the tension sensor 52 can detect the slack of the protective sheet 49 . When it is detected that the protection sheet 49 is slack, the control unit 34 actuates the air cylinder 51 . That is, as shown in FIG.5(c), the tension|tensile_strength is given to the protection sheet 49 again by the expansion-contraction operation of the cylinder 51. As a result, since the slack of the protective sheet 49 is released and the gap K disappears, the protective sheet 49 is again brought into a close contact state on the entire lower surface of the elastic body 47 .

In addition, the protective sheet 49 may be subjected to mold release treatment such as fluorine treatment, silicone treatment, wax treatment, or the like. Therefore, after the dry film DF is attached to the substrate W by pressing the substrate W and the dry film DF by the elastic member 47 , the dry film DF can be properly separated from the protective sheet 49 . That is, by the operation of attaching the dry film DF to the substrate W, the film-attached substrate FW can be attached to the second pressing mechanism 36 via the protective sheet 49, so that the film-attached substrate FW can be prevented from being released from the first pressing mechanism 35. The situation in which the holding table 39 is separated occurs. Then, even when the releasability of the protective sheet 49 is lowered due to aging or the like, the deteriorated protective sheet 49 can be easily removed from the cylinder 51 and replaced with a new protective sheet 49 . In addition, as an example of the wax treatment, there is a treatment for imparting mold releasability with fatty acid esters.

Examples of the protective sheet 49 include glass fiber sheets, rubber sheets, films, and the like. In particular, the protective sheet 49 is more preferably constituted by an elastic body. When the protective sheet 49 has elasticity, in the process of attaching the dry film DF to the substrate W, the protective sheet 49 contacts the dry film DF and elastically deforms. Therefore, the applied pressing force can be made more uniform over the entire surface of the dry film DF.

In FIG. 5 , the cylinders 51 are arranged on the left and right sides of the upper surface of the pressing plate 45 , but the cylinders 51 may be arranged on the front side and the deep side of the upper surface of the pressing plate 45 . That is, in the present embodiment, the protective sheet 49 can be stretched in four directions of the left-right direction and the front-rear direction in a plan view according to each operation of the air cylinder 51 . In the present embodiment, the cylinder 51 corresponds to the tension imparting mechanism of the present invention.

The film cutting mechanism 37 includes a lift table 37a which can be lifted and lowered, a tool holder 37b arranged on the upper portion of the lift table 37a, and a cutter 37c provided at the front end of the tool holder 37b. The film cutting mechanism 37 is configured to be able to reciprocate in the y direction. That is, the cutter 37c can cut the dry film DF guided to the inside of the chamber 15 in the width direction (y direction).

The film holding plate 38 has a flat lower surface, and can hold the dry film DF in a flat state. On the lower surface of the film holding plate 38, a tool running groove 38a extending in the y direction is formed. By running the cutter 37c along the cutter running groove 38a, the dry film DF held by the flat surface of the film holding plate 38 can be cut into individual pieces.

The film holding plate 38 is configured to be able to move up and down in the chamber 15, and is configured to be horizontally movable in the x-direction. Therefore, the film holding plate 38 can move to the upper side of the holding table 39 while holding the dry film DF cut into individual pieces.

The peeling table 17 is a structure for holding the film-attached substrate FW, and an example thereof is a metal chuck table. The peeling stage 17 is preferably configured so that the film-attached substrate FW can be adsorbed and held by a suction device or the like. The peeling table 17 has built-in support pins (not shown) configured to be capable of advancing and retracting. The support pins can be raised and protruded from the upper surface through the support pins, and the support pins can receive the film-attached substrate FW.

The peeling mechanism 19 is arranged above the peeling table 17 and is configured to be able to reciprocate in the x direction along the rail 52 shown in FIG. 1 . In this embodiment, the peeling mechanism 19 can peel the second isolation layer S2 from the resist layer Re of the dry film DF together with the peeling tape Ts after attaching the peeling tape Ts to the surface of the second isolation layer S2.

As shown in FIG. 6 , the peeling mechanism 19 includes a tape supply portion 53 , a support frame 55 , a peeling member 57 , and a tape recovery portion 59 . The tape supply unit 53 feeds out the peeling tape Ts loaded on the material reel. The support frame 55 is configured to be movable up and down by a lift table (not shown), and includes guide rollers 58 and guide rollers 60 .

The peeling member 57 is arranged on the right side of the center of the support frame 55 in plan view. The peeling member 57 has a plate shape shorter than the size of the substrate W, and is formed in a tapered shape tapered toward the front end. The peeling member 57 is fixed in a posture inclined obliquely downward. That is, the peeling tape Ts fed from the tape supply unit 53 is guided to the peeling member 57 by the guide roller 58 , is folded back at the front end of the peeling member 57 , and is guided to the tape recovery unit 59 via the guide roller 60 . The tape recovery unit 59 winds up and recovers the peeling tape Ts sent out from the peeling member 57 .

＜Outline of Action＞ Hereinafter, the basic operation of the film sticking device 1 of the embodiment will be described. FIG. 7 is a flowchart illustrating a series of processes for attaching the dry film DF to the substrate W using the film material attaching apparatus 1 .

Step S1 (Supply of Substrate) When the attach command is sent, the supply of the substrate W to be the workpiece starts. That is, the front ends of the support pins 43 protrude from the substrate placement surface of the holding table 39, and the robot arm 3a of the substrate transfer mechanism 3 inserts the substrate holding portion 3b into the storage cassette C1, and adsorbs and holds the back side of the substrate W . The board|substrate transfer mechanism 3 carries out the board|substrate W from the storage cassette C1 in the state which suction-held the board|substrate W, and mounts it on the alignment part 4. As shown in FIG. After the alignment unit 4 performs the alignment of the substrates W, the substrate transfer mechanism 3 transfers the substrates W above the holding table 39 accommodated in the lower case 15A, as shown in FIG. 8( a ).

Next, as shown in FIG.8(b), the board|substrate holding part 3b of the board|substrate transfer mechanism 3 lowers the board|substrate W. At this time, the substrate W on the back surface is sucked and held by the substrate holding portion 3b, that is, placed on the support pins 15 protruding from the holding table 39 . Then, as shown in FIG. 8( c ), the support pins 43 descend, and the substrate W is placed on the substrate holding surface of the holding table 39 . When the substrate W is held on the holding table 39, the suction device is actuated, and the holding table 39 sucks and holds the substrate W through the suction holes formed on the substrate holding surface.

Step S2 (supply of dry film) In this step, the supply of the substrate W is performed, and on the other hand, the supply of the dry film DF by the film supply unit 13 is started. That is, while moving the film supply unit 13 to the right, a predetermined amount of the dry film DF is fed from the film supply unit 21 . Next, the guide roller 23 and the separator peeling member 25 are moved to the inside of the chamber 15 as shown in FIG. 9( a ) while guiding the fed dry film DF.

By this movement, the leading end portion of the drying film DF is guided toward the inside of the chamber 15 . At this time, the leading end portion of the dry film DF is positioned below the film holding plate 38, and the amount of movement of the guide roller 23 and the separator peeling member 25 is controlled.

After the leading end of the dried film DF is guided below the film holding plate 38 by the film supply unit 13 , the control unit 34 performs control to lower the film holding plate 38 while stopping the feeding operation of the film supply unit 21 . As shown in FIG.9(b), the front-end|tip part of the dry film DF is adsorbed and held while the film holding plate 38 which descend|falls is contact|abutted to the front-end|tip part of the dry film DF.

After the dry film DF is held from above by the film holding plate 38, the operation of cutting the front end of the dry film DF into individual pieces is performed. First, as shown in FIG. 10( a ), the guide roller 23 and the spacer peeling member 25 are retreated to the left while the spacer recovery unit 27 winds up a predetermined amount of the first spacer S1 .

By this operation, the first separator S1 is peeled off from the resist layer Re in the front end portion of the dry film DF. The adhesive surface of the resist layer Re is exposed by being peeled off through the first spacer layer S1. At this time, the leading end of the dry film DF can be kept flat by the film holding plate 38, and the flatness and tension of the dry film DF are not lowered even if the guide roller 23 and the separator peeling member 25 are retracted.

After peeling off the 1st separator S1 from the front-end|tip part of the dry film DF, as shown in FIG.10(b), the film cutting mechanism 37 is raised to a predetermined height. By the upward movement of the film cutting mechanism 37, the knife 37c is inserted into the dry film DF in the knife running groove 38a of the film holding plate 38.

When the knife 37c penetrates the dry film DF, the knife 37c cuts the dry film DF in the width direction while moving in the y direction along the knife travel groove 38a. As a result, the leading end portion of the dry film DF is cut into individual pieces and separated from the material roll of the dry film DF loaded in the film supply unit 21 .

After cutting the front end of the dry film DF into a single sheet, the film supply unit 13 is returned to the initial position. By this return movement, the guide roller 23 and the separator peeling member 25 can be retracted to the outside of the chamber 15 together with the drying film DF. Then, the single-piece dried film DF remaining on the film holding plate 38 remains inside the chamber 15 . Through a series of operations in step S2 , the single-piece dry film DF can be supplied to the inside of the chamber 15 .

Step S3 (Formation of the Chamber) After the substrate W and the dry film DF are supplied into the chamber 15 , the control unit 34 lowers the upper case 15B by controlling the operation of the air cylinder 16 . As shown in FIG. 11 , the cylindrical top portion 28 of the lower case 15A and the cylindrical bottom portion 30 of the upper case 15B are brought into contact with each other by the descending, thereby forming the chamber 15 in which the internal space is sealed.

Step S4 (layering procedure) When the sealed chamber 15 is formed, the dry thin film DF can be laminated on the substrate W. First, the control unit 34 opens the solenoid valve 33 and operates the vacuum device 32 with the solenoid valve 81 closed, thereby reducing the pressure in the internal space of the chamber 15 . Preferably, the inner space of the chamber 15 is decompressed to a vacuum state or close to a vacuum state. When the pressure inside the chamber 15 is reduced to a predetermined air pressure, the control unit 34 stops the operation of the vacuum device 32 . An example of the internal air pressure of the depressurized chamber 15 can be, for example, 10 Pa to 100 Pa.

Next, as shown in FIG. 12( a ), the control unit 34 moves the film holding plate 38 holding the dry film DF toward the upper side of the holding table 39 . At this time, the up-and-down movement and the horizontal movement of the film holding plate 38 are controlled so that the dry film DF is positioned above the substrate W.

After the dry film DF is transferred over the substrate W by the film holding plate 38 , as shown in FIG. By laminating the dry thin film DF on the substrate W, the dry thin film DF is held together with the substrate W on the holding table 39 . And by this lamination operation, the dry film DF and the substrate W are brought into a state of being aligned in plan view.

In addition, since the dry film DF is preliminarily laminated on the substrate W in a state where the inside of the chamber 15 is decompressed under vacuum, air can be reliably prevented from being entrapped between the dry film DF and the substrate W in this laminated state. Therefore, in the subsequent attaching process, the adhesion between the dry film DF and the substrate W can be further improved.

In addition, the adhesive surface of the dry film DF is made of a heat-adhesive material capable of exerting adhesive force by heating. Therefore, by performing the lamination process at room temperature, when the dry thin film DF is laminated on the substrate W, the situation where the dry thin film DF is attached to the substrate W can be avoided. Therefore, it is possible to prevent the dry film DF from being prematurely attached to the substrate W when the dry film DF is not sufficiently pressed against the dry film DF, thereby preventing the adhesiveness between the dry film DF and the substrate W from decreasing.

Step S5 (Attaching Procedure) The dry film DF and the substrate W in the temporarily aligned state are brought into a held state by the holding table 39 of the first pressing mechanism 35, and the process of attaching the dry film DF to the substrate W starts.

First, while maintaining the state in which the inside of the chamber 15 is depressurized, the controller 34 operates the heater 44 to heat the dry film DF held on the holding table 39 . By heating the dry film DF, the heatable adhesive contained in the resist layer Re of the dry film DF exhibits an adhesive force. Therefore, the dry film DF and the substrate W can be adhered to each other through the adhesion surface of the resist layer Re. The temperature heated by the heater 44 is 40° C. to 80° C. in one example, but the temperature heated by the heater 44 can be appropriately changed as long as it is a temperature at which the thermally adhesive dry film DF can exhibit adhesiveness.

Next, as shown in FIG. 13( a ), the control unit 34 can control the actuator 41 to raise the holding table 39 , and by the raising operation, the first pressing mechanism 35 and the second pressing mechanism 36 can be relatively approached.

Then, by bringing the first pressing mechanism 35 and the second pressing mechanism 36 closer together, as shown in FIG. 13( b ), the first pressing mechanism 35 and the second pressing mechanism 36 can be brought into contact and pressed against each other. That is, the elastic member 47 facing the holding table 39 comes into contact with the drying film DF with the protective sheet 49 interposed therebetween, and pushes the drying film DF downward. As a result, the pressing force acts on the entire surfaces of the dry thin film DF and the substrate W, and the dry thin film DF is attached to the substrate W. That is, by pressing the first pressing mechanism 35 and the second pressing mechanism 36 against each other, the film-attached substrate FW can be produced.

The elastic member 47 is in contact with the entire surface of the dry film DF and the substrate W because the elastic member 47 has elastic force. Therefore, the pressing force can be uniformly applied to the entire surface of the dry thin film DF and the substrate W. In addition, since the drying film DF and the substrate W are attached by applying a pressing force in a state where the inside of the chamber 15 is depressurized, it is possible to more reliably prevent air from being drawn into the space between the drying film DF and the substrate W. between.

Furthermore, even when the surface of the substrate W is formed with irregularities, the elastic member 47 can be elastically deformed in accordance with the irregularities, while pressing the dry film DF. Therefore, the resist layer Re of the dry thin film DF having adhesive force fills the uneven gaps on the substrate W with high precision. Therefore, in the prepared thin film-attached substrate FW, the substrate W and the dry thin film DF can be closely adhered with high precision.

After the dry film DF is attached to the substrate W, the first pressing mechanism 35 and the second pressing mechanism 36 can be separated by lowering the holding table 39 . At this time, the surface of the protective sheet 49 is subjected to mold release treatment. Therefore, the situation where the film-attached substrate FW as shown in FIG. 18( b ) is attached to the protective sheet 49 and then separated from the holding table 39 can be reliably avoided.

When the first pressing mechanism 35 and the second pressing mechanism 3 are separated, the control unit 34 adjusts the opening degree of the solenoid valve 81 so that the air pressure inside the chamber 15 is close to atmospheric pressure. Next, when the interior of the chamber 15 rises to a predetermined air pressure, the control unit 34 fully opens the solenoid valve 81 to open the chamber 15 to the atmosphere, and then operates the cylinder 16 to lift the upper case 15B. The airtight state of the permeable chamber 15 is released, and the sticking process is ended.

Step S6 (peeling procedure) After the attaching process is completed, the operation of peeling the second separator S2 from the dry film DF is started. First, the substrate transfer mechanism 6 is used to transfer the film-attached substrate FW to the separation stage 17 . That is, as shown in FIG. 14( a ), the support pins 43 are protruded from the substrate holding surface of the holding table 39 , the film-attached substrate FW is lifted up, and the substrate holding portion 6 b of the substrate transfer mechanism 6 is inserted into the holding table 39 . and the film-attached substrate FW.

Then, as shown in FIG. 14( b ), the lower surface of the film-attached substrate FW is sucked and held by the substrate holding portion 6 b and raised, and the film-attached substrate FW can be separated from the holding table 39 . The substrate transfer mechanism 6 removes the film-attached substrate FW from the chamber 15 and transfers the film-attached substrate FW to the web peeling unit 7 .

After the film-attached substrate FW is transferred to the peeling unit 7 , the substrate transfer mechanism 6 places the film-attached substrate FW on the peeling table 17 . At this time, as shown in FIG. 15 , the peeling mechanism 19 is appropriately moved so that the peeling member 57 is positioned above the right end portion of the film-attached substrate FW. After that, as shown in FIG. 16 , the support frame 55 is lowered, and the peeling tape Ts is attached to the surface of the second isolation layer S2 by the peeling member 57 .

After the release tape Ts is attached to the surface of the second separator S2, as shown in FIG. 17 , the release tape Ts is wound while moving the release mechanism 19 to the left. That is, while the peeling tape Ts is folded back by the peeling member 57, the second separator S2 and the peeling tape Ts are integrated and peeled from the film-attached substrate FW. The peeling tape Ts to which the second separator S2 peeled off from the film-attached substrate FW is attached is wound up and recovered by the tape recovery unit 59 .

Step S7 (recovery of the substrate with thin film) After peeling off the 2nd spacer layer S2 from the board|substrate FW with a film, the board|substrate transfer mechanism 6 removes the board|substrate FW with a film|membrane from the peeling stage 17, and transfers it toward the alignment part 8. In the alignment part 8, after aligning the film-attached substrate FW, the substrate transfer mechanism 6 transfers the film-attached substrate FW to the electrostatic inspection part 9, and mounts it on the inspection table 9a.

The static electricity inspection part 9 measures the static electricity amount with respect to the thin-film board|substrate FW using the static electricity sensor 9b. When the amount of static electricity exceeds the reference value, it is determined that the film-attached substrate FW is a defective product, and the film-attached substrate FW is removed by performing a static elimination operation on the film-attached substrate FW or by an operator. When the amount of static electricity is less than or equal to the reference value, it is determined that the film-attached substrate FW is a good product, and is transferred to the substrate recovery unit 11 by the substrate transfer mechanism 3 . The film-attached substrate FW transferred to the substrate recovery unit 11 is stacked and stored in the storage cassette C2.

In the above-described manner, the operation of attaching the dry film DF to the substrate W in one pass is completed. After that, the above-mentioned process is repeated until the number of the thin-film-attached substrates FW reaches a predetermined number.

In addition, in a series of processes, the tension of the protective sheet 49 can be detected at any time by the tension sensor 52 . Then, when the tension of the protection sheet 49 is below a predetermined reference value, the tension sensor 52 determines that the protection sheet 49 is in a relaxed state as shown in FIG. 5(b), and determines that the tension of the protection sheet 49 has been The lowering intention signal is sent to the control unit 34 . By receiving this signal, the control unit 34 operates the air cylinder 51 to apply tension to the protective sheet 49 . As a result, as shown in FIG. 5( c ), the slack state of the protective sheet 49 is eliminated, and the protective sheet 49 is brought into a state of being in close contact with the entire lower surface of the elastic body 47 again.

<Effects achieved by the configuration of the embodiment> The apparatus according to the above-mentioned embodiment is provided with: a first pressing mechanism 35 for holding both the substrate W and the dry film DF in a laminated state; and a second pressing mechanism 36 arranged to face the first pressing mechanism 35 and having The flat surface facing the substrate W and the dry film DF. Therefore, the dry film DF can be attached to the substrate W by bringing the first pressing mechanism 35 and the first pressing mechanism 36 relatively close to each other and pressing each other.

In the apparatus of the embodiment, the pressing force can be simultaneously and uniformly applied to the entire surface of the drying film DF by the flat surface of the second pressing mechanism 36 . Therefore, even when the size of the substrate W is increased, when the dry film DF is attached to the substrate W, it is possible to avoid the occurrence of defects such as cracks and missing corners in the substrate W due to the bias of the pressing force acting on the substrate W. situation. In addition, even when the substrate W has irregularities, the dry film DF can be adhered to the irregularities with good adhesion. Furthermore, by pressing the entire dry film DF with the second pressing mechanism 36, the resist layer R of the dry film DF can be attached so as to fill the gap between the concavities and convexities with high precision. Therefore, the flatness of the surface of the thin-film-attached substrate FW is improved.

Next, the second pressing mechanism 36 includes a protective sheet 49 having mold releasability. The protective sheet 49 is arranged so as to protect at least the surface of the second pressing mechanism 36 that is in contact with the first pressing mechanism 35 . Since the protective sheet 49 has releasability, the first pressing mechanism 35 and the second pressing mechanism 36 holding the substrate W and the drying film DF press each other to perform the attaching process, and then the drying film DF is attached. The substrate W can be appropriately detached from the protective sheet 49 .

In the comparative example which does not have the protective sheet 49, the problem shown to FIG.18(a) and (b) arises. That is, for the larger-sized substrate W and the dry film DF, as shown in FIG. 18( a ), the pressing plate 45 and the elastic member 47 which are large-sized members are brought close to each other and pressed against each other. At this time, the entire surface of the drying film DF can be pressed by the elastic member 47 .

As a result, when the first pressing mechanism 35 and the second pressing mechanism 36 are separated after the attaching process, as shown in (b) of FIG. 18 , the film-attached substrate FW is completely attached to the second pressing mechanism by the attaching process. The mechanism 36 is used, and there is a concern that the thin-film-attached substrate FW will be detached from the holding table 39 . When such an error occurs, it is necessary to stop the apparatus and to recover the thin-film-attached substrate FW from the second pressing mechanism 36 , so that the operation efficiency of the apparatus decreases.

In the structure of this Example, the releasability is given to the 2nd pressing mechanism 36 using the protective sheet 49. FIG. Therefore, the film-attached substrate FW can be attached to the second pressing mechanism 36 by the attaching process to prevent the occurrence of an error in which the film-attached substrate FW is detached from the holding table 39 . Therefore, the operation efficiency of the film sticking device 1 can be improved.

As a comparative example of a configuration in which the second pressing mechanism 36 is provided with releasability, it can be considered that the lower surface of the elastic member 47 is subjected to mold release treatment, and the lower surface is brought into contact with the dry film DF to press the dry film. Composition of DF. However, in the configuration of this comparative example, when the releasability of the elastic member 47 decreases due to long-term use, the elastic member 47 must be removed from the pressing plate 45 and replaced with a new elastic member 47, or the elastic member 47 must be replaced with a new one. 47 and the pressing plate 45 are replaced together. Since these operations are labor-intensive, the operation efficiency of the device is lowered. Furthermore, since the elastic member 47 and the pressing plate 45 are large-sized members, the cost required for replacement increases.

On the other hand, in the related structure of an Example, the releasability is given to the 2nd pressing mechanism 36 using the protective sheet 49. As shown in FIG. The protective sheet 49 is a sheet-like member that covers at least a part of the outer surface of the second pressing mechanism 36 . Therefore, even when the releasability of the protective sheet 49 decreases due to long-term use, the sheet-like protective sheet 49 can be replaced by removing the protective sheet 49 from the cylinder 51, so that the releasability of the second pressing mechanism 36 can be easily recovered. . Therefore, the cost and time required for replacement can be suppressed, and the operation efficiency of the film sticking device 1 can be further improved.

The protective sheet 49 can prevent inconveniences such as scratches, deformation, or adhesion of foreign matter from occurring on the elastic member 47 . Therefore, the replacement frequency of the elastic member 47 due to the protective sheet 49 can be further reduced.

Furthermore, the apparatus according to the embodiment includes the air cylinder 51 for adjusting the tension of the protective sheet 49 . When the protective sheet 49 is loosened as shown in FIG. 19( a ) due to long-term use, etc., tension can be applied by operating the air cylinder 51 to eliminate the slack of the protective sheet 49 .

When the operation of attaching the dry film DF to the substrate W is performed in a state where the protective sheet 49 is relaxed, the following problems may occur. That is, in the state where the gap K is generated between the protective sheet 49 and the elastic member 47, the elastic member 47 is pressed against the drying film DF, and as shown in FIG. On the lower surface, wrinkles P are generated in the protective sheet 49 .

When wrinkles P are generated in the protective sheet 49, when the elastic member 47 presses the dry film DF through the protective sheet 49, the dry film DF cannot be properly pressed at the portion where the wrinkles P are generated. Therefore, as shown in FIG. 19( c ), depending on the shape of the wrinkle P, a gap Q is generated between the dry thin film DF and the substrate W on the thin film-attached substrate FW. In addition, on the film-attached substrate FW, the dry film DF also produces wrinkles with high frequency. Therefore, it is difficult to closely adhere between the dry thin film DF and the substrate W with good precision.

Therefore, in the apparatus of the embodiment, the protective sheet 49 is constantly provided with a certain degree of tension or more by using the air cylinder 51, so as to prevent the protective sheet 49 from contacting the dry film in a relaxed state. Therefore, in the attaching process, the dry film DF can be brought into close contact with the substrate W with good precision.

In this embodiment, the lower surface peripheral edge portion 45a of the pressing plate 45 and the lower surface peripheral edge portion 47a of the elastic member 47 are both formed in the shape of an arc. As shown in Fig. 20(a), when the lower surface peripheral edge portion 45a or the lower surface peripheral edge portion 47a has a ribbed shape, in the operation of eliminating the slack of the protective sheet 49, the following problems may occur. That is, as shown in FIG.20(b), the protective sheet 49 is clamped to the lower surface peripheral edge part 45a or the lower surface peripheral edge part 47a which has a rib shape.

Since the protective sheet 49 is stuck, a large frictional force is generated on the protective sheet 49 . Therefore, when the frictional force is generated, the tension applied by the cylinder 51 is hardly transmitted to the protective sheet 49 at the portion facing the lower surface of the elastic member 47 . As a result, even if the air cylinder 51 is actuated, the slack of the protective sheet 49 is not eliminated, and the gap K remains.

On the other hand, in the present embodiment, the surface treatment with a circular arc shape is applied to the lower surface peripheral edge portion 45a and the lower surface peripheral edge portion 47a. Since the lower surface peripheral edge portion 45a and the lower surface peripheral edge portion 47a have a chamfered shape, that is, a shape with an arc, it is possible to greatly reduce the occurrence of damage between the protective sheet 49 and the lower surface peripheral edge portion 45a or the lower surface peripheral edge portion 47a. friction. Therefore, the tension can be adjusted by the air cylinder 51, and the operation of eliminating the slack of the protective sheet 49 can be performed with good precision.

In addition, in the embodiment disclosed in this specification, it is an illustration in all viewpoints, and does not have a restrictive effect. The scope of the patent of the present invention is not based on the description of the above-mentioned embodiments, but is indicated on the basis of the scope of claims, and all changes (modifications) within the meaning and scope equivalent to the scope of claims are included in the present invention. For example, the present invention can be implemented according to the following variations.

(1) In the embodiment, the procedures of step S1 and step S2 for supplying the substrate W and the dry film DF to the chamber 15 respectively are performed, but step S4 is not limited to laminating the two inside the chamber 15 . That is, the process of laminating the dry thin film DF on the substrate W may be performed in advance, and then the substrate W on which the dry thin film DF is laminated may be supplied to the chamber 15 .

As an example of such a modified example, the following aspects are mentioned. The substrate W on which the dry thin film DF is laminated in advance is accommodated in the substrate supply unit 2 in a multi-layered manner. Then, the substrate W on which the dry film DF is laminated is transferred by the substrate transfer mechanism 3 to the chamber 15 via the alignment unit 4 , and placed on the holding table 39 . Next, after the upper case 15B is lowered to form a sealed chamber 15, the process after step S5 is performed by operating the vacuum device 32, and the second pressing mechanism 36 presses the substrate W on which the dry film DF is laminated. , the substrate W with the thin film can be made.

In this modification, the dry thin film DF is laminated on the substrate W in advance. Therefore, for example, the configuration of the film supply unit 13 and the film holding plate 38 can be appropriately omitted. Therefore, the miniaturization and cost reduction of the film sticking device 1 can be easily realized.

(2) In the embodiment and each modification, a series of procedures for attaching the film material to the workpiece may be repeated a plurality of times. That is, after the dry film DF is attached to the substrate W, the metal wiring of the first layer can be formed on the substrate W by performing exposure treatment, development treatment, and the like. Then, the substrate W on which the metal wiring is formed is accommodated in the substrate supply unit 2, and a series of processes for attaching the dry film DF are performed.

The dry film DF can be adhered with high adhesion and filling property to the substrate W having the unevenness|corrugation formed by the metal wiring by the sticking process again. Then, by performing the exposure treatment and the development treatment again, the second-layer metal wiring can be formed. Hereinafter, the multilayer metal wiring can be formed on the substrate W with good precision by repeatedly performing the film attaching process, the exposure process, and the developing process by the film attaching device.

(3). In the embodiment and each modification, the workpiece to which the thin film material is attached is a rectangular substrate W, but the present invention is not limited to this. In addition to substrates, various semiconductor elements such as panels and wafers can be used as workpieces. Furthermore, the shape of the workpiece may be circular, polygonal, roughly circular, or the like, in addition to a rectangle.

(4) In the embodiment and each modification, the dry film DF was used as the film material attached to the workpiece, but it is not limited to this. That is, as other examples of the film material, a film, a tape, a sheet, or the like can be used. Specific examples include an adhesive tape for circuit protection (back grinding tape) attached to a wafer or a substrate before back grinding treatment (back grinding treatment), and a wafer formed on a wafer or a substrate. Encapsulation adhesive sheets, etc.

The film attaching device 1 of this embodiment, especially in the case of attaching the film to a workpiece with unevenness, can improve the adhesion and filling of the film to the unevenness. Therefore, in the thin-film-attached substrate FW, it is possible to avoid the occurrence of wrinkles on the surface or the occurrence of air bubbles between the substrate W and the thin film. In the case of using a back grinding tape, since the surface of the film material is flat, it is possible to prevent the occurrence of cracks in the workpiece due to uneven back grinding. In the case of using the sheet for encapsulation, it is possible to prevent poor mounting of the wafer and occurrence of cracks.

(5) In the embodiment and each modification, the example of the configuration of the thermal adhesive film in which the dry film DF exerts the adhesive force by heating is used for description, but it is not limited thereto. As another example, a pressure-sensitive adhesive-type film that exhibits adhesive force by pressing can also be used. In addition, the film material is not limited to the structure provided with an adhesive material, and an adhesive film material provided with an adhesive material can also be used.

(6) In the embodiment and each modification, the cylinder 51 adjusts the tension by stretching the protective sheet 49 in four directions, but the direction in which the tension is applied is not limited to the four directions. In one example, as shown in FIG. 21 , the protective sheet 49 may be stretched in only one direction to give tension, or the protective sheet 49 may be stretched in multiple directions in four or more directions. The protective sheet 49 may be stretched in two directions or three directions to give tension.

In addition, the structure which adjusts the tension|tensile_strength of the protective sheet 49 is not limited to the structure which provides arbitrary magnitude|tensile tension|tensile_strength at arbitrary timing by the expansion-contraction operation of the air cylinder 51. FIG. In one example, as shown in FIG. 22 , a constant tension spring 54 may be used to continuously apply a constant tension to the protective sheet 49 . Moreover, in addition to the structure which provides tension|tensile_strength arbitrarily by the air cylinder 51, tension|tensile_strength may be arbitrarily imparted to the protective sheet 49 by a motor etc..

(7) In the embodiment and each modification, the cylinder 51 stretches the protective sheet 49 in the direction perpendicular to the pressing surface (the lower surface of the elastic member 47 ) that is the surface on which the dry film DF is pressed, so as to Tension is imparted to the protective sheet 49 . In plan view, the stretching direction of the protective sheet 49 is not limited to this. That is, as shown in FIG. 23( a ), the protective sheet 49 may be stretched in a direction forming an obtuse angle with respect to the pressing surface. Moreover, as shown in FIG.23(b), the protection sheet 49 may be stretched in the direction which forms an acute angle with respect to a pressing surface. When the protective sheet 49 is stretched in a direction forming an acute angle with respect to the pressing surface, the pressing plate 45 preferably has an arcuate shape not only on the lower peripheral edge portion 45a but also in the upper peripheral edge portion. In addition, for the convenience of description, the cylinder 51 is abbreviate|omitted in each figure of FIG. 23. FIG.

(8) In each embodiment and each modification, the second pressing mechanism 36 is not limited to the configuration including the elastic member 47 . That is, as shown in FIG. 24 , the second pressing mechanism 36 may be configured to include the pressing plate 45 and the protective sheet 49 that protects at least the lower surface of the pressing plate 45 . In this case, the pressing plate 45 serves as a pressing surface on which the lower surface presses the drying film DF. Moreover, the lower surface of the pressing plate 45 presses the dry film DF with the protective sheet 49 interposed therebetween. In addition, in the second pressing mechanism 36, the pressing plate 45 and the elastic member 47 are not limited to the single-layer structure composed of a single member as in the embodiment, and may be a multi-layer structure composed of a combination of a plurality of members.

(9) In each embodiment and each modification, the holding table 39 or the peeling table 17 is not limited to being made of metal, and a structure formed of a ceramic-type porous material or the like may be appropriately used instead. In addition, the holding table 39 or the separation table 17 may not be configured to suck the substrate W as long as the configuration can stably hold the wafer W.

(10) In step S5 according to each embodiment and each modification, the first pressing mechanism 35 and the second pressing mechanism 36 are pressed against each other by raising the first pressing mechanism 35 , but the present invention is not limited thereto. That is, as long as the first pressing mechanism 35 and the second pressing mechanism can be relatively brought closer together, the second pressing mechanism 36 may be moved, or both the first pressing mechanism 35 and the second pressing mechanism 36 may be moved. composition.

(11) In each embodiment and each modification, the first pressing mechanism 35 is not limited to the configuration in which the first pressing mechanism 35 is arranged below the second pressing mechanism 36 . That is, as long as the first pressing mechanism 35 and the second pressing mechanism are arranged to face each other, the positions where the first pressing mechanism 35 and the second pressing mechanism are arranged can be appropriately changed.

(12) In the embodiment and each modification, the procedure of step S4 or step S5 is not limited to the configuration performed under reduced pressure inside the chamber 15 . That is, the routine of step S4 or step S5 may be executed under the condition of atmospheric pressure. However, it is preferable to perform step S4 or step S5 under a reduced pressure condition from the viewpoint of preventing air from being caught between the substrate W and the dry film DF.

(13) In the embodiment and each modification, the heater 44 is provided on the holding table 39 included in the first pressing mechanism 35 as an example, but the heater 44 is not limited to the configuration included only in the first pressing mechanism 35 . . The heater 44 for heating and drying the film DF may be provided in the second pressing mechanism 36 , or may be provided in both the first pressing mechanism 35 and the second pressing mechanism 36 . The configuration in which the heater 44 is provided in the pressing plate 45 or the elastic member 47 can be regarded as an example of the configuration in which the heater 44 is provided in the second pressing mechanism 36 .

(14) In the embodiment and each modification, the protective sheet 49 is arranged so as to cover the second pressing mechanism 36 , but it is not limited to this. In the second pressing mechanism 36, as another example of the configuration to protect at least the surface facing the protection table 39, as shown in FIG. 25, the protection sheet 49 is arranged on the lower case 15A and the upper case. configuration between the bodies 15B.

The film sticking device 1 of this modified example includes a protective sheet supply unit 71 that supplies the tape-shaped protective sheet 49 between the lower case 15A and the upper case 15B. The protective sheet supply unit 71 includes a sheet supply portion 73 , a guide roll 74 , a sheet recovery portion 75 , and a tension roller 77 . In addition, for the convenience of explaining this modification, a part of the structure, such as the vacuum apparatus 32, the thin film cutting mechanism 37, is abbreviate|omitted in drawing.

The sheet feeding unit 73 has a material roll for the protection sheet 49, and supplies the belt-shaped protection sheet 49 from the material roll. The guide roller 74 and the tension roller 77 guide the protection sheet 49 that has been sent out and supplied to the sheet recovery unit 75 through the space between the lower casing 15A and the upper casing 15B. The sheet recovery unit 75 includes a recovery shaft tube that winds the protective sheet 49 . The recovery shaft tube is rotationally driven in the winding direction.

The tension roller 77 is rotatably provided on the support arm 78 , and is arranged so as to be swingable via the support arm 78 . Therefore, the tension roller 77 can give an appropriate tension to the protective sheet 49 that is guided and wound. The swing amount of the tension roller 77 is appropriately controlled by the control unit 34 . Therefore, the tension applied to the protective sheet 49 can be appropriately adjusted according to the swing amount of the tension roller 77 . In this modification, the tension roller 77 corresponds to the tension applying mechanism.

Next, a series of operations related to a modification of the protective sheet supply unit 71 will be described. First, the substrate W and the dry film DF are supplied to the holding table 39 through the processes of steps S1 and S2 and the like. Next, the dry thin film DF is laminated on the substrate W on the holding table 39 . The substrate W on which the dry thin film DF is laminated is held on the holding table 39 as shown in FIG. 26 . In addition, in FIG. 26 , the portion of the protective sheet 49 facing the holding table 39 , that is, the portion that is in contact with the elastic member 47 and presses the drying film DF is indicated by the symbol F.

When the holding table 39 holds the substrate W and the dry film DF in a stacked state, the cylinder 16 is actuated to lower the upper case 15B. Due to the lowering of the upper casing 15B, as shown in FIG. 27 , the protective sheet 49 can be sandwiched by the lower casing 15A and the upper casing 15B, and the inner space is divided into upper and lower spaces by the protective sheet 49 to form a cavity 15.

To form the chamber 15 by sandwiching the protective sheet 49, the vacuum device 32 is actuated to depressurize the inner space of the chamber 15, and at the same time, the heater 44 starts heating the drying film DF. Next, the first pressing mechanism 35 and the second pressing mechanism 36 are brought close to each other and pressed against each other. As a result, as shown in FIG. 28 , the elastic member 47 of the second pressing mechanism 36 comes into contact with the protective sheet 49 and presses the drying film DF through the protective sheet 49 . The entire surface of the dry film DF is pressed through the elastic member 47 , and the dry film DF that has been heated and exerted an adhesive force is attached to the substrate W.

After the dry film DF is attached to the substrate W, as shown in FIG. 29 , the first pressing mechanism 35 and the second pressing mechanism 36 are separated. Next, the solenoid valve 33 is opened to raise the internal pressure of the chamber 15 to atmospheric pressure, and then the upper case 15B is raised to open the chamber 15 . Then, the film-attached substrate FW is removed from the holding table 39 to the peeling unit 7 by the substrate transfer mechanism 6, and the operations after step S6 are performed in the same manner as in the embodiment.

In addition, by repeatedly performing the sticking operation, in the part of the protective sheet 49 indicated by the symbol F, if a defect such as a decrease in the mold releasability or the adhesion of foreign matter occurs, the protective sheet 49 can be protected by re-feeding the protective sheet 49. replacement. That is, the protective sheet 49 corresponding to the length indicated by the symbol F is re-fed out through the sheet feeding portion 73, and the part of the protective sheet 49 indicated by the symbol F as shown in FIG. position and move downstream. The replacement of the protective sheet 49 is completed when the protective sheet 49 corresponding to the unused portion upstream of the portion indicated by the symbol F is moved again to the position facing the holding table 39 . After that, a sticking operation is performed using the newly acquired portion of the protective sheet 49 .

In this way, in the modification provided with the protective sheet supply unit 71, the belt-shaped protective sheet 49 is fed and supplied to the space between the lower case 15A and the upper case 15B. Then, the drying film DF can be attached to the substrate by bringing the first pressing mechanism 35 and the second pressing mechanism 36, which are opposed to each other with the protective sheet 49 in between, relatively close to each other and pressing each other with the protective sheet 49 therebetween. W.

The elastic member 47 presses the drying film DF through the protective sheet 49 . That is, since the elastic member 47 pushes the dry film DF in a state protected by the protective sheet 49, the elastic member 47 can be prevented from deteriorating due to the occurrence of scratches or the adhesion of foreign matter. Furthermore, because of the releasability of the protective sheet 49 , it is possible to avoid a situation where the substrate W to which the drying film DF is attached adheres to the second pressing mechanism 36 . In addition, since the tension of the protective sheet 49 can be appropriately adjusted by the tension roller 77, the elastic member 47 can avoid pressing the drying film DF in a state where the protective sheet 49 is relaxed.

Furthermore, in the case where the protective sheet 49 at the contact portion of the elastic member 47 is deteriorated due to long-term use, the protective sheet 49 can be replaced with a new one by a simple operation of feeding out the new protective sheet 49 from the sheet feeder 73 . . Therefore, in this comparative example, the time required to replace the protective sheet 49 can be further shortened. Furthermore, in this comparative example, there is no need for the protective sheet 49 to cover the side surface of the second pressing mechanism 36 . That is, the situation where the protective sheet 49 is wasted can be prevented. The entire portion of the protective sheet 49 can be utilized as a portion where the elastic member 47 abuts and pushes the drying film DF. Therefore, the utilization efficiency of the protective sheet 49 can be greatly improved.

(15). In each embodiment and each modification, the order of step S3 and step S4 may be reversed. That is, in the embodiment, after the chamber 15 in the closed state is formed, the dry film DF is laminated on the workpiece W, but after the dry film DF is laminated on the workpiece W, the upper case 15B may be lowered to form the block. State of the chamber 15.

(16) In each embodiment and each modification, the cylinder 51 may be configured to always apply a predetermined tension to the protective sheet 49 . In this case, the protective sheet 49 is always in a state of being tensioned to release the gap K, so the tension sensor 52 can be omitted. Furthermore, when the tension sensor 52 detects the slack of the protective sheet 49, the slack may be notified by the generation of a warning sound, the lighting of a warning lamp, or the like. In addition, a configuration in which the tension sensor 52 is omitted, and the operator checks whether there is slack in the protective sheet 49 visually or the like, and manually adjusts the tension of the protective sheet can also be applied.

1: Film attachment device 2: Substrate supply section 3: Substrate transfer mechanism 4: Alignment part 5: Attachment unit 6: Substrate transfer mechanism 7: Stripping unit 8: Alignment part 9: Electrostatic Inspection Department 11: Substrate recycling department 13: Film supply unit 15: Chamber 15A: Lower case 15B: Upper shell 17: Stripping table 19: Stripping Mechanism 21: Film supply section 23: Guide reel 25: Isolation layer peeling member 27: Isolation layer recycling department 28: Cylinder top 30: Bottom of cylinder 32: Vacuum device (decompression mechanism) 34: Control Department 35: 1st pressing mechanism 36: 2nd pressing mechanism 37: Film cutting mechanism 38: Film retaining plate 39: Holding table (workpiece holding part) 43: Support pin 44: Heater 45: Press the plate 45a: Lower surface peripheral portion 47: Elastic member 47a: Lower surface peripheral portion 49: Protective sheet 51: Cylinder (tension imparting mechanism) 53: With supply part 55: Support Frames 57: Peel off components 59: With recycling department 71: Protective sheet feeding unit 73: Sheet feeding section 75: Sheet Recycling Department 77: Tension roller (tension imparting mechanism) 78: Support Arm W: substrate (workpiece) DF: dry film (film material) FW: with thin film substrate Re: Resist layer S1: 1st isolation layer S2: 2nd isolation layer

FIG. 1 is a top view of the film attaching device of the embodiment. FIG. 2 is a longitudinal sectional view of the structure of the dry film of the embodiment. FIG. 3 is a front view of the film supply unit of the embodiment. Figure 4 is a front view of the chamber of the embodiment. FIG. 5 is a longitudinal sectional view showing the structure of the second pressing mechanism of the embodiment. Among them, (a) is a longitudinal sectional view showing the basic state where the protective sheet has sufficient tension; (b) is a longitudinal sectional view showing a relaxed state of the protective sheet; (c) is a cylinder actuated to adjust the tension of the protective sheet The longitudinal cross-sectional view of the state. FIG. 6 is a front view of the peeling unit of the embodiment. FIG. 7 is a flow chart of the operation of the film sticking device of the embodiment. FIG. 8 is an explanatory diagram of step S1 of the embodiment. Among them, (a) is a state diagram of transferring the substrate to the top of the holding table; (b) is a state diagram of transferring the substrate to the support pins; (c) is a state diagram of storing the support pins inside the holding table and placing the substrate on the holding table State diagram of the station. FIG. 9 is an explanatory diagram of step S2 of the embodiment. Among them, (a) is a state diagram in which the front end of the dry film is guided into the chamber; (b) is a state diagram in which the front end of the dry film is held by a film holding plate. FIG. 10 is an explanatory diagram of step S2 of the embodiment. Among them, (a) is a state diagram of peeling off the first separator from the front end of the dried film to expose the adhesive surface of the resist layer; (b) is a diagram of a cut state of the front end of the dried film. FIG. 11 is an explanatory diagram of step S3 of the embodiment. FIG. 12 is an explanatory diagram of step S4 of the embodiment. Among them, (a) is a state diagram in which the dry thin film is transferred above the substrate held on the holding table; (b) is a state diagram in which the dry thin film is laminated on the substrate. FIG. 13 is an explanatory diagram of step S5 of the embodiment. Among them, (a) is a state diagram in which the first pressing mechanism and the second pressing mechanism are relatively close to each other; (b) is a state diagram in which the first pressing mechanism and the second pressing mechanism are brought into contact and pressed against each other. FIG. 14 is an explanatory diagram of step S6 of the embodiment. Among them, (a) is a state diagram in which the substrate transfer mechanism is inserted between the film-attached substrate and the holding table; (b) is a state diagram in which the film-attached substrate is held by the substrate transfer mechanism and separated from the holding table. FIG. 15 is an explanatory diagram of step S6 of the embodiment. FIG. 16 is an explanatory diagram of step S6 of the embodiment. FIG. 17 is an explanatory diagram of step S6 of the embodiment. FIG. 18 is a diagram showing the function of the film attaching device of the embodiment. Among them, (a) is a state diagram in which the first pressing mechanism and the second pressing mechanism are relatively close to each other in the comparative example in which the second pressing mechanism does not have a protective sheet; (b) is a state diagram where the second pressing mechanism does not have a protective sheet In the comparative example of , it is a state diagram in which the film-attached substrate is attached to the second pressing mechanism due to the completion of step S5. FIG. 19 is a diagram showing the function of the film attaching device of the embodiment. Among them, (a) is a state diagram showing that the protective sheet is being loosened, and the first pressing mechanism and the second pressing mechanism are relatively close to each other; (b) is a state that shows that the protective sheet is being loosened. The first pressing mechanism and the second pressing mechanism are pressed against each other, and the protective sheet is wrinkled; (c) shows that the protective sheet is in a relaxed state, by making the first pressing mechanism and the second pressing mechanism. A state diagram in which a gap is formed between the dry film and the substrate when they are pressed against each other. FIG. 20 is a diagram showing the function of the film attaching device of the embodiment. Among them, (a) is a state diagram showing that the protective sheet is being loosened in the comparative example in which the lower surface peripheral portion of the pressing plate and the elastic member has an angular shape; (b) is a state diagram of applying tension to the protective sheet in the comparative example State diagram. Fig. 21 is a diagram showing a configuration of a film sticking device according to a modified example. Fig. 22 is a diagram showing the configuration of a film sticking device according to a modified example. Fig. 23 is a diagram showing a configuration of a film sticking device according to a modified example. Among them, (a) is a structural diagram showing that the protective sheet is stretched in a direction forming an obtuse angle on the lower surface of the elastic member; (b) is a structural diagram showing stretching the protective sheet in a direction forming an acute angle on the lower surface of the elastic member. FIG. 24 is a diagram showing the configuration of a film sticking device according to a modified example. Fig. 25 is a diagram showing a configuration of a film sticking device according to a modification. Fig. 26 is a diagram showing a configuration of a film sticking device according to a modified example. FIG. 27 is a view showing a process of forming a chamber by sandwiching a protective sheet in the film sticking device according to a modification example. 28 is an explanatory diagram showing a process of pressing a first pressing mechanism and a second pressing mechanism against each other with a protective sheet interposed therebetween in the film sticking device according to the modified example. FIG. 29 is a process diagram showing the separation of the first pressing mechanism and the second pressing mechanism after the formation of the film-attached substrate in the thin-film material sticking apparatus according to the modified example. FIG. 30 is an explanatory diagram showing a process of replacing the deteriorated protective sheet 2 with a new protective sheet in the film sticking device of the modified example.

15: Chamber

15A: Lower case

15B: Upper shell

35: 1st pressing mechanism

36: 2nd pressing mechanism

39: Hold Desk

44: Heater

45: Press the plate

47: Elastic member

49: Protective sheet

W: substrate (workpiece)

DF: dry film

Claims (8)

A film material attaching device is provided with: The first pressing mechanism has a workpiece holding portion for holding the workpiece; The second pressing mechanism is arranged opposite to the aforementioned first pressing mechanism; a film supply mechanism for holding the film material on the workpiece holding portion by laminating the film material on the workpiece held by the workpiece holding portion; and An attaching mechanism for attaching the film material to the film material by bringing the first pressing mechanism and the second pressing mechanism relatively close to each other and pressing each other while the workpiece holding portion holds the workpiece and the film material. workpiece; The aforementioned second pressing mechanism includes: an elastic member arranged so as to bring the first pressing mechanism and the second pressing mechanism relatively close to each other through the attaching mechanism, so that a pressing force acts on the entire surface of the film material; and The protective sheet protects at least a surface of the elastic member facing the workpiece holding portion. The film sticking device according to claim 1, which is provided with a tension imparting mechanism for preventing the protective sheet from contacting the thin film in a relaxed state by imparting tension to the protective sheet. As claimed in claim 1 or 2, the film material attaching device, which has: a chamber, having an upper casing and a lower casing, and accommodating the first pressing mechanism and the second pressing mechanism; a decompression mechanism to decompress the inner space of the aforementioned chamber; The sticking mechanism attaches the film material by bringing the first pressing mechanism and the second pressing mechanism relatively close to each other and pressing each other in a state in which the pressure reducing mechanism depressurizes the internal space of the chamber. attached to the aforementioned workpiece. The film material sticking device according to claim 1 or 2, wherein at least one of the first pressing mechanism and the second pressing mechanism is provided with a heating mechanism that heats the film material when sticking by the sticking mechanism . A method for attaching a film material, comprising: The workpiece holding program keeps the workpiece in the workpiece holding part of the first pressing mechanism; The film supply process is to hold the film material on the workpiece holding portion by laminating the film material on the workpiece held by the workpiece holding portion; an approach procedure, in which the second pressing mechanism arranged opposite to the first pressing mechanism is relatively approached to the first pressing mechanism in a state in which the workpiece holding portion holds the workpiece and the film material; and In the attaching process, the film material is attached to the workpiece by pressing the first pressing mechanism and the second pressing mechanism that are relatively close to each other, The aforementioned second pressing mechanism includes: an elastic member disposed on a surface facing the first pressing mechanism; and a protective sheet protecting at least a surface of the elastic member facing the workpiece holding portion; In the above-mentioned attaching procedure, the above-mentioned film material is attached to the above-mentioned workpiece by causing the above-mentioned elastic member to act on the entire surface of the above-mentioned film material through a pressing force through the above-mentioned protective sheet. The method for attaching a film material according to claim 5, comprising a tension imparting procedure, which is to prevent the protection sheet from contacting the film material in a relaxed state by imparting tension to the protection sheet; In the attaching process, the elastic member applies a pressing force to the entire surface of the film material through the protective sheet provided with tension by the tension application process, thereby attaching the film material to the workpiece. As claimed in claim 5 or 6, the film material attaching method has: a chamber forming process, forming a chamber having an upper casing and a lower casing for accommodating the first pressing mechanism and the second pressing mechanism; and a decompression procedure to decompress the interior space of the aforementioned chamber; The above-mentioned sticking process is in the state where the inner space of the said chamber is decompressed by the above-mentioned decompression process, and the above-mentioned film material is compressed by making the above-mentioned first pressing mechanism and the said second pressing mechanism relatively close to each other and pressing each other. Attached to the aforementioned workpiece. As claimed in claim 5 or 6, the film material attaching method has: a heating procedure, heating the film material by a heating mechanism provided at least in one of the first pressing mechanism and the second pressing mechanism; In the above-mentioned attaching process, the above-mentioned film material in a state of being heated by the above-mentioned heating process is attached to the above-mentioned workpiece.

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