WO2013058094A1 - Workpiece holding device - Google Patents

Workpiece holding device Download PDF

Info

Publication number
WO2013058094A1
WO2013058094A1 PCT/JP2012/075428 JP2012075428W WO2013058094A1 WO 2013058094 A1 WO2013058094 A1 WO 2013058094A1 JP 2012075428 W JP2012075428 W JP 2012075428W WO 2013058094 A1 WO2013058094 A1 WO 2013058094A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
workpiece
pin
work
holding device
Prior art date
Application number
PCT/JP2012/075428
Other languages
French (fr)
Japanese (ja)
Inventor
利文 菅原
良昭 辰己
Original Assignee
株式会社クリエイティブ テクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社クリエイティブ テクノロジー filed Critical 株式会社クリエイティブ テクノロジー
Publication of WO2013058094A1 publication Critical patent/WO2013058094A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Definitions

  • the present invention relates to a work holding device that can hold and hold a work.
  • a workpiece laminating apparatus when manufacturing a flat panel display such as a liquid crystal display or a plasma display, a workpiece laminating apparatus is used in which a glass substrate or the like is arranged on top and bottom to bond.
  • a substrate attaching device is used in order to place the substrate on the correct position on the mount plate of a polishing machine that polishes the surface of the semiconductor substrate.
  • work holding devices for suspending and holding glass substrates, semiconductor substrates, etc. are widely used.
  • films In the process of depositing a predetermined film on a resin base material, a work holding device that holds and suspends the opposite side of the processing surface is required to keep the processing surface side non-contact.
  • workpiece holding devices that suspend workpieces are also used in cases where workpieces are suspended and transferred between processes. It is to hold securely.
  • Patent Document 1 a workpiece pasting apparatus that holds the workpiece reliably by sucking the inside of the elastic suction pad by a vacuum action. Also, there has been proposed a workpiece laminating apparatus in which a plurality of adhesive pins standing on an adhesive pin plate are provided with an adhesive pad at the tip thereof so that the workpiece can be securely held (see Patent Document 2).
  • Patent Document 2 when mounting a plurality of adhesive pins on an adhesive pin plate, the accuracy of attaching the adhesive pins becomes extremely important. In other words, if the tip of the adhesive pin does not form a uniform workpiece holding surface as a whole, the workpiece will be missed, or if some of the adhesive pins cannot form the correct workpiece holding surface, the workpiece will be suspended. There is a risk of dropping the workpiece after a while. For this reason, it is necessary to determine the number of adhesive pins in anticipation of the safety factor. In practice, adhesive pins that exhibit an adhesive force of several tens of times the work load are provided on the adhesive plate. However, when the number of adhesive pins increases, another problem arises that an extra force is required when removing the workpiece.
  • an IC handling device that reduces the number of suction mistakes by providing a bellows-like tube between the suction nozzle and the rubber pad.
  • an elastic suction pad is formed in an accordion shape (see FIG. 2 of Patent Document 1).
  • a metal bellows-like tube or suction pad may not be able to contact the workpiece at a correct position because the restoring force is difficult to work. This problem is particularly noticeable when the workpiece is suspended and held by a large number of pins, and it follows well if the workpiece is a film or foil that has surface irregularities or is flexible and flexible. As a result, it is necessary to increase the number of pins by a further safety factor.
  • JP 2001-189293 A Japanese Patent Laying-Open No. 2007-310041 (FIG. 5) JP-A-5-337866 (FIG. 1)
  • the present inventors have determined that a plurality of adhesive pins standing on the adhesive pin plate are pinned via a rubber member having a rubber hardness smaller than that of the adhesive pad. It has been found that by attaching an adhesive pad to the tip of the main body, the number of extra adhesive pins can be reduced as much as possible so that the workpiece can be securely adhered and held, and the present invention has been completed.
  • the object of the present invention is to solve the problem of the mounting accuracy of the adhesive pins, to reduce the number of adhesive pins as much as possible, and to hold and suspend the workpiece, and also to have a workpiece with surface irregularities. It is another object of the present invention to provide a work holding device that can securely stick and hold even a work that is easily bent.
  • the present invention is a work holding device that can suspend and hold a work, and includes an adhesive pin plate that is relatively raised and lowered relative to the work, and in which a plurality of adhesive pins are erected,
  • the adhesive pin has an adhesive pad that holds and holds a workpiece and a pin body, and the adhesive pad is provided at the tip of the pin body via a rubber member, and the rubber hardness of the rubber member is the rubber hardness of the adhesive pad.
  • the work holding device includes an adhesive pin plate in which a plurality of adhesive pins are erected, and the adhesive pin plate moves up and down relatively with respect to the workpiece, and the adhesive pad at the tip of the adhesive pin is the workpiece. Adheres to and adheres to the workpiece, allowing the workpiece to be suspended.
  • the adhesive pin has an adhesive pad and a pin main body for adhering and holding the work, and the adhesive pad is provided at the tip of the pin main body via a rubber member.
  • the adhesive pad expresses adhesive force to a plate-like or sheet-like workpiece such as a glass substrate, a plastic substrate, a semiconductor substrate, a sapphire substrate, a resin film, a resin base material, a metal foil, etc.
  • the workpiece suspended by the plurality of adhesive pins can be adhered and held so that it does not fall at least due to its own weight, and the workpiece can be repeatedly attached and detached.
  • Such adhesive pads are preferably silicone resin, styrene butadiene rubber, chlorosulfonated polyethylene rubber, acrylonitrile butadiene rubber, ethylene propylene rubber, chloroprene rubber, butadiene rubber, fluoro rubber, isobutylene isoprene rubber, urethane rubber, etc. It is made of a resin material and has fine protrusions on the surface that have a fiber structure with a high aspect ratio on the order of submicron, and expresses adhesive force by intermolecular force (van der Waals force). If a commercial item is mentioned, the brand name Sirius etc. by the Fuso rubber rubber industry company etc. can be illustrated, for example.
  • the thickness of the adhesive pad should be 50 ⁇ m or more, and it is desirable to provide a thicker thickness, but the effect is saturated and cost performance In consideration of the above, about 1000 ⁇ m is sufficient.
  • the rubber member interposed between the adhesive pad and the pin body should be one having a rubber hardness smaller than that of the adhesive pad.
  • the rubber hardness of the silicone resin is generally about 30 ° to 80 °, and therefore a rubber member having a rubber hardness at least smaller than this may be selected.
  • the rubber hardness is generally about 50 ° to 90 °, and therefore, a rubber member having a rubber hardness smaller than this may be selected.
  • the rubber hardness means a durometer measurement value measured based on JIS-K6253.
  • the thickness of the rubber member should be larger than that of the adhesive pad, and preferably 0.5 mm or more in consideration of the elastic pin length direction and horizontal elastic deformation with respect to the workpiece described below. It is good that it is 5.0 mm.
  • the rubber member By providing an adhesive pad at the tip of the pin body via a rubber member whose rubber hardness is smaller than that of the adhesive pad, the rubber member can contract when the adhesive pin comes into contact with the workpiece.
  • an attachment error in the length direction of the adhesive pin can be absorbed.
  • the adhesive pad can be reliably adhered to the surface of the workpiece by following the elastic deformation of the rubber member. For this reason, all the adhesive pins installed on the adhesive pin plate can function for the intended purpose, eliminating the need to increase the number of adhesive pins in anticipation of an excessive safety factor in advance. On the other hand, the number of adhesive pins and the installation location can be determined within a more appropriate safety factor range.
  • the rubber member has a restoring force, the alignment accuracy of the adhesive pin with respect to the workpiece can be increased.
  • the rubber member and the adhesive pad provided at the tip of the adhesive pin have at least the same outer diameter as that of the pin body.
  • the area where the adhesive pad abuts against the workpiece may be increased by expanding the outer periphery of the adhesive pad or pushing the outer peripheral portion of the adhesive pad closer than the rubber member.
  • the rubber member may be formed in a bellows shape.
  • the swing function of the adhesive pin can be used more effectively. That is, since the adhesive pad can be brought into contact with the work in a wide range by utilizing the elastic deformation of the rubber member in the horizontal direction with respect to the work, the followability to the work warpage and surface unevenness can be further improved.
  • a ventilation through hole penetrating from the front end side of the adhesive pin to the back surface side of the adhesive pin plate may be provided so that the adhesive pin can suck the work by a vacuum action.
  • the pin body has a cylindrical shape, and the rubber member and the adhesive pad on the tip side of the pin body have holes through which the hollow portions pass, and holes are also provided in the adhesive pin plate corresponding to the base side of the pin body.
  • vacuum suction may be performed from the back side of the adhesive pin plate (the side opposite to the surface on which the adhesive pins are erected) so that the adhesive pad has an auxiliary suction force that attracts the workpiece.
  • this auxiliary suction function is effective for a work that is flexible and flexible, such as a resin film or a metal foil.
  • the adhesive pin plate is not particularly limited as long as it has a plate shape that is rigid enough to move up and down relative to the workpiece by interlocking a plurality of standing adhesive pins.
  • An arbitrary shape such as a circle or a rectangle can be selected in correspondence with the shape.
  • the drive mechanism that moves the adhesive pin plate up and down relative to the workpiece may be provided on the adhesive pin plate side, may be provided on the side of the robot hand or pedestal that supports the workpiece, or You may make it provide in both independently.
  • the work holding device in the present invention can reliably hold and hold the work in a suspended state, and also acts reliably on a work with surface irregularities and a work that is easily bent, its use form is There is no particular limitation.
  • a flat panel display such as a liquid crystal display or a plasma display
  • the bonding apparatus it can be used to suspend and hold a work placed on the upper stage side by an adhesive pin penetrating the upper stage.
  • it can be used for a workpiece pasting device that places the substrate on the mounting plate of a polishing machine that polishes the surface of a semiconductor substrate, or in the manufacture of solar cell devices, organic EL devices, etc.
  • a workpiece holding device that holds and suspends the opposite side of the processing surface.
  • it can be used to hold a mask, etc., when a mask is overlaid on a workpiece for exposure, and it can also be used as a transfer device for transferring workpieces between manufacturing processes during the manufacture of various devices.
  • it can be used for various in-line manufacturing because it is not restricted by the use environment such as working under vacuum.
  • the problem of adhesive pin mounting accuracy is solved, and the workpiece can be held and suspended without the need to increase the number of adhesive pins in anticipation of an excessive safety factor.
  • it can be securely attached to and suspended from workpieces with surface irregularities and flexible workpieces.
  • the usage environment is not limited. .
  • FIG. 1 is a perspective explanatory view showing a work holding device of the present invention.
  • FIG. 2 is a schematic side view showing the relationship between the workpiece holding device of the present invention and the workpiece.
  • FIG. 3 is a schematic cross-sectional view showing an example of an adhesive pin.
  • FIG. 4 is a schematic cross-sectional view showing a state in which the work holding device of the present invention is used in a work bonding apparatus.
  • FIG. 5 is a schematic cross-sectional view showing how the work holding device of the present invention is used in a work bonding apparatus.
  • FIG. 6 is a schematic cross-sectional view showing a state in which the work holding device of the present invention is used in a work bonding apparatus.
  • FIG. 7 is a schematic cross-sectional view showing a state in which the work holding device of the present invention is used in a work bonding apparatus.
  • the work holding device X includes a plate-like adhesive pin plate 1 made of aluminum, stainless steel, or the like, and a plurality of adhesive pins 2 erected on the plate, and the adhesive pin plate 1 side or the workpiece W side.
  • the adhesive pin plate 1 moves up and down relatively with respect to the workpiece W by the vertical drive devices (not shown) provided independently of each other, and the tip of the adhesive pin 2 contacts to hold the workpiece W in an adhesive state. This can be lifted.
  • Each adhesive pin 2 in the work holding device X has an adhesive pad 5 and a pin main body 3 that are brought into contact with and adhere to the work W, and the adhesive pad 5 is attached to the tip of the pin main body 3 via the rubber member 4. It is provided.
  • the pin body 3 may be formed of, for example, aluminum, stainless steel, PEEK, or the like, and have a length necessary for holding the workpiece W in a suspended manner.
  • the rubber member 4 must have a rubber hardness smaller than that of the adhesive pad 5.
  • the adhesive pad 5 made of silicone resin having a rubber hardness of about 60 ° is used, the rubber member 4 is made of rubber. Silicone resin (rubber hardness 20 °) having low hardness, urethane rubber (rubber hardness 30 °), or the like may be used.
  • the rubber member 4 and the adhesive pad 5 provided on the distal end side of the pin main body 3 should have at least the same outer diameter as the pin main body 2.
  • the rubber member 4 is reverse-tapered so that the adhesive pad 5 side is widened, or as shown in FIG. 3 (C), the outer peripheral portion of the adhesive pad 5 protrudes from the rubber member 4. It can also be done.
  • the pin body 2 is formed in a cylindrical shape so that the rubber member 4 and the adhesive pad 5 have holes that communicate with the hollow portions, and the adhesive pin plate 1 corresponding to the base side of the pin body 3 has holes. It is also possible to provide a ventilation through hole 6 that is provided and penetrates from the front end side of the adhesive pin 2 to the back surface side of the adhesive pin plate 1. Thus, the work can be sucked and brought into contact with the suction pad 5 by evacuating from the back surface side (opposite side of the work) of the adhesive pin plate 1 with a vacuum device (not shown).
  • FIG. 4 to 7 show a state in which the workpiece holding device X of the present invention is used in a workpiece laminating apparatus used for manufacturing a liquid crystal display or the like.
  • This workpiece laminating apparatus is configured such that two workpieces W 1 and W 2 are opposed to each other between an upper stage 8 and a lower stage 9, liquid crystal is sealed, and then bonded under a vacuum with an adhesive layer or the like interposed therebetween. It is to match.
  • the weight has a size of longitudinal 400 mm ⁇ horizontal 400 mm ⁇ thickness 1.1mm is a glass substrate W 1 of about 450g to hold on the stage 10 side, FIG.
  • a workpiece holding device X as shown in 1 to 3 is used.
  • the work holding device X includes a total of 12 adhesive pins 2 on an adhesive pin plate 1 made of aluminum having a length of 500 mm, a width of 500 mm, and a thickness of 15 mm.
  • a vertical driving device 7 is connected to the adhesive pin plate 1. It has to be relatively vertical with respect to the glass substrates W 1 Te.
  • Each adhesive pin 2 is made of a silicone resin through a fluorine rubber member 4 having a rubber hardness of 20 ° at the tip of a cylindrical stainless steel pin body 3 having an outer diameter of 16 mm, an inner diameter of 8 mm, and a length of 100 mm.
  • Adhesive pad 5 (trade name Sirius manufactured by Fuso Rubber Co., Ltd., rubber hardness 50 °), rubber member 4 has an outer diameter of 16 mm and a thickness of 3 mm, and adhesive pad 5 has an outer diameter of 16 mm, The thickness was 0.1 mm.
  • the adhesive pin 2 to evenly adhere the surface of the glass substrate W 1, was placed the whole against adhesive pin plate 1. Further, the adhesive force generated by the whole of the adhesive pin 2 has to be able to develop adhesive force of about 3 times the minimum required work load holding hanging glass substrate W 1.
  • this work bonding apparatus for disposing a glass substrate W 1 in the upper stage 8 side, first, as shown in FIG. 4, the rear surface of the glass substrate W 1 by a vacuum action a suction surface of the fork-shaped ( using the robot hand 10 which can be held by sucking the back side) of the opposing surface of the glass substrate W 2, transports the glass substrate W 1 directly below the upper stage 8.
  • the suction surface of the robot hand 10 is of a fork shape, a portion of the back surface of the glass substrate W 1 is exposed.
  • the adhesive pin plate 1 of the work holding device X that has kept the adhesive pin 2 in the through hole 8 a of the upper stage 8 is lowered, and the adhesive pin is attached to the back surface of the glass substrate W 1.
  • the tip of 2 is brought into contact, and the adhesive pad 5 is adhered.
  • a ventilation through hole 6 is provided that penetrates from the front end side of the adhesive pin 2 to the back surface side of the adhesive pin plate 1 and is connected to a vacuum pump or the like (not shown).
  • the glass substrate W 1 may allow supplementary sucked by vacuum action.
  • the adhesive pin plate 1 is raised by the vertical drive device 7 as shown in FIG. 7,
  • the glass substrate W 1 can be placed on the upper stage 8.
  • an appropriate adhesive force can be obtained without increasing the number of adhesive pins in anticipation of an excessive safety factor. in can be hung by holding the glass substrate W 1.
  • the glass substrate W 1 disposed on the upper stage 8 may be bonded to the glass substrate W 2 on the lower stage 9 side while being suspended and held by the work holding device X of the present invention. 8 is provided with an electrostatic chuck, an adhesive pad, etc. (all not shown), and after holding the glass substrate W 1 with these, the adhesive pin 2 is further raised to bring the glass substrate W 1 to the upper stage 8. You may make it hand over.
  • Adhesive pin plate Adhesive pin
  • 3 Pin body
  • 4 Rubber member
  • 5 Adhesive pad
  • 6 Venting through hole
  • 7 Vertical drive device
  • 8 Upper stage
  • 9 Lower stage
  • 10 Robot hand
  • X work holding device
  • W work.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Abstract

Provided is a workpiece holding device, whereby: the issue of attachment precision of adhesive pins is eliminated; the number of adhesive pins is reduced as much as possible, and a workpiece is held and suspended; and even a workpiece having surface unevenness or an easily bent workpiece can be securely adhered to and held suspended. The workpiece holding device (X) can suspend and hold the workpiece (W), and comprises an adhesive pin plate (1) that moves up and down relative to the workpiece (W) and has a plurality of adhesive pins (2) provided therein. The workpiece holding device (X) is characterized by: the adhesive pins (2) having an adhesive pad (5) that adheres to and holds the workpiece (W), and a pin main body (3); the adhesive pad (5) being attached to the tip of the pin main body (3) via a rubber member (4); and the rubber hardness of the rubber member (4) being less than the rubber hardness of the adhesive pad (5).

Description

ワーク保持装置Work holding device
　この発明は、ワークを吊り下げて保持することができるワーク保持装置に関する。 The present invention relates to a work holding device that can hold and hold a work.
　例えば、液晶ディスプレイやプラズマディスプレイのようなフラットパネルディスプレイを製造する上で、ガラス基板等を上下に配して貼り合わせるワーク貼り合わせ装置が使用されている。また、半導体基板の表面を研磨する研磨機のマウント板に基板を正しい位置に載置するために、基板貼り付け装置が使用される。これらの装置に代表されるように、ガラス基板や半導体基板等を吊り下げて保持するためのワーク保持装置が広く利用されており、更には、太陽電池装置や有機ＥＬ装置等の製造において、フィルムや樹脂基材に所定の膜を蒸着するような処理では処理面側を非接触に保つために、処理面の反対側を保持して吊り下げるワーク保持装置が必要になる。 For example, when manufacturing a flat panel display such as a liquid crystal display or a plasma display, a workpiece laminating apparatus is used in which a glass substrate or the like is arranged on top and bottom to bond. In addition, in order to place the substrate on the correct position on the mount plate of a polishing machine that polishes the surface of the semiconductor substrate, a substrate attaching device is used. As represented by these devices, work holding devices for suspending and holding glass substrates, semiconductor substrates, etc. are widely used. Furthermore, in the manufacture of solar cell devices, organic EL devices, etc., films In the process of depositing a predetermined film on a resin base material, a work holding device that holds and suspends the opposite side of the processing surface is required to keep the processing surface side non-contact.
　また、上記のような例をはじめ、工程間でワークを宙吊りにして搬送するような場合にもワークを吊り下げるワーク保持装置が利用されているが、これらに共通して求められることはワークを確実に保持することである。 In addition to the above examples, workpiece holding devices that suspend workpieces are also used in cases where workpieces are suspended and transferred between processes. It is to hold securely.
　そこで、有弾性の吸着パッド内を真空作用により吸引することで、ワークを確実に保持するようにしたワーク貼り付け装置が提案されている（特許文献１参照）。また、粘着ピンプレートに立設された複数の粘着ピンがその先端に粘着パッドを備えることで、ワークを確実に保持できるようにしたワーク貼り合わせ装置が提案されている（特許文献２参照）。 Therefore, there has been proposed a workpiece pasting apparatus that holds the workpiece reliably by sucking the inside of the elastic suction pad by a vacuum action (see Patent Document 1). Also, there has been proposed a workpiece laminating apparatus in which a plurality of adhesive pins standing on an adhesive pin plate are provided with an adhesive pad at the tip thereof so that the workpiece can be securely held (see Patent Document 2).
　しかしながら、液晶ディスプレイ等の製造に使われるワーク貼り合わせ装置では、ガラス基板等の貼り合わせの際に真空下で処理することから、特許文献１のように真空作用を利用した吸着パッドではワークを保持することができず、その利用は制限される。 However, in a workpiece bonding apparatus used for manufacturing liquid crystal displays and the like, processing is performed under vacuum when a glass substrate or the like is bonded. Therefore, a suction pad using a vacuum action holds a workpiece as in Patent Document 1. Cannot be used and its use is limited.
　一方で、特許文献２のように、複数の粘着ピンを粘着ピンプレートに立設させる場合には、粘着ピンの取り付け精度が極めて重要になる。つまり、粘着ピンの先端が全体で均一なワーク保持面を形成していないとワークを取り損ねてしまい、或いは、一部の粘着ピンが正しいワーク保持面を形成できていないと、ワークを吊り下げた後にワークを落下させてしまうおそれがある。そのため、安全率を見越して粘着ピンの本数を決める必要があり、実際には、ワーク荷重に対して数十倍程度の粘着力を発現するような粘着ピンを粘着プレートに設けるようにしている。ところが、粘着ピンの数が増えることで、逆にワークを取り外す際に余計な力が必要になるといった別の問題が生じてしまう。 On the other hand, as in Patent Document 2, when mounting a plurality of adhesive pins on an adhesive pin plate, the accuracy of attaching the adhesive pins becomes extremely important. In other words, if the tip of the adhesive pin does not form a uniform workpiece holding surface as a whole, the workpiece will be missed, or if some of the adhesive pins cannot form the correct workpiece holding surface, the workpiece will be suspended. There is a risk of dropping the workpiece after a while. For this reason, it is necessary to determine the number of adhesive pins in anticipation of the safety factor. In practice, adhesive pins that exhibit an adhesive force of several tens of times the work load are provided on the adhesive plate. However, when the number of adhesive pins increases, another problem arises that an extra force is required when removing the workpiece.
　ワークを取り損ねてしまうような問題に対して、例えば、吸引ノズルとゴム製パッドとの間に蛇腹状の管を設けることで、吸着ミスの回数を低減させるようにしたＩＣハンドリング装置や（特許文献３参照）、有弾性の吸着パッドを蛇腹状に形成することが知られている（上記特許文献１の図２参照）。しかしながら、金属製の蛇腹状の管や吸着パッドでは復元力が働き難いことから、ワークに対して正しい位置で当接できないことがある。特に多数のピンでワークを吊り下げ保持するような場合にはこの問題が顕著に現れてしまい、また、ワークが表面凹凸を有していたり、腰がなく撓みやすいフィルムや箔であるとうまく追従することができず、結果として更なる安全率の分だけピン数を増やすことが必要になる。 For example, an IC handling device that reduces the number of suction mistakes by providing a bellows-like tube between the suction nozzle and the rubber pad. It is known that an elastic suction pad is formed in an accordion shape (see FIG. 2 of Patent Document 1). However, a metal bellows-like tube or suction pad may not be able to contact the workpiece at a correct position because the restoring force is difficult to work. This problem is particularly noticeable when the workpiece is suspended and held by a large number of pins, and it follows well if the workpiece is a film or foil that has surface irregularities or is flexible and flexible. As a result, it is necessary to increase the number of pins by a further safety factor.
特開２００１－１８９２９３号公報（図２）JP 2001-189293 A (FIG. 2) 特開２００７－３１００４１号公報（図５）Japanese Patent Laying-Open No. 2007-310041 (FIG. 5) 特開平５－３３７８６６号公報（図１）JP-A-5-337866 (FIG. 1)
　そこで、本発明者等は上記のような問題を解決するために鋭意検討した結果、粘着ピンプレートに立設された複数の粘着ピンについて、粘着パッドよりもゴム硬度が小さいゴム部材を介してピン本体の先端に粘着パッドを備え付けるようにすることで、余分な粘着ピンの数をできるだけ減らしてワークを確実に粘着・保持することができるようになることを見出し、本発明を完成した。 Accordingly, as a result of intensive studies to solve the above problems, the present inventors have determined that a plurality of adhesive pins standing on the adhesive pin plate are pinned via a rubber member having a rubber hardness smaller than that of the adhesive pad. It has been found that by attaching an adhesive pad to the tip of the main body, the number of extra adhesive pins can be reduced as much as possible so that the workpiece can be securely adhered and held, and the present invention has been completed.
　したがって、本発明の目的は、粘着ピンの取り付け精度の問題が解消されて、粘着ピンの数を可及的に減らしてワークを保持して吊り下げることができ、しかも、表面凹凸を有したワークや撓みやすいワークに対しても確実に粘着して吊り下げ保持することが可能なワーク保持装置を提供することにある。 Therefore, the object of the present invention is to solve the problem of the mounting accuracy of the adhesive pins, to reduce the number of adhesive pins as much as possible, and to hold and suspend the workpiece, and also to have a workpiece with surface irregularities. It is another object of the present invention to provide a work holding device that can securely stick and hold even a work that is easily bent.
　すなわち、本発明は、ワークを吊り下げて保持することができるワーク保持装置であって、ワークに対して相対的に上下し、かつ、複数の粘着ピンが立設された粘着ピンプレートを備え、前記粘着ピンは、ワークを粘着保持する粘着パッドとピン本体とを有して、粘着パッドがゴム部材を介してピン本体の先端に備え付けられており、ゴム部材のゴム硬度が粘着パッドのゴム硬度よりも小さいことを特徴とするワーク保持装置である。 That is, the present invention is a work holding device that can suspend and hold a work, and includes an adhesive pin plate that is relatively raised and lowered relative to the work, and in which a plurality of adhesive pins are erected, The adhesive pin has an adhesive pad that holds and holds a workpiece and a pin body, and the adhesive pad is provided at the tip of the pin body via a rubber member, and the rubber hardness of the rubber member is the rubber hardness of the adhesive pad. It is a workpiece holding device characterized by being smaller than the above.
　本発明におけるワーク保持装置は、複数の粘着ピンが立設された粘着ピンプレートを備えており、この粘着ピンプレートがワークに対して相対的に上下して、粘着ピンの先端の粘着パッドがワークに当接して粘着し、ワークの吊り下げ保持を可能にする。 The work holding device according to the present invention includes an adhesive pin plate in which a plurality of adhesive pins are erected, and the adhesive pin plate moves up and down relatively with respect to the workpiece, and the adhesive pad at the tip of the adhesive pin is the workpiece. Adheres to and adheres to the workpiece, allowing the workpiece to be suspended.
　このうち、粘着ピンについては、それぞれワークを粘着保持する粘着パッドとピン本体とを有して、粘着パッドがゴム部材を介してピン本体の先端に備え付けられるようにする。ここで、粘着パッドは、例えば、ガラス基板、プラスチック基板、半導体基板、サファイア基板、樹脂フィルム、樹脂基材、金属箔等のような板状又はシート状のワークに対して粘着力を発現するものであって、複数の粘着ピンによって吊り下げたワークが少なくともその自重で落下しないように粘着保持することができ、しかも、ワークの着脱を繰り返し可能にするものであるのがよい。 Among these, the adhesive pin has an adhesive pad and a pin main body for adhering and holding the work, and the adhesive pad is provided at the tip of the pin main body via a rubber member. Here, the adhesive pad expresses adhesive force to a plate-like or sheet-like workpiece such as a glass substrate, a plastic substrate, a semiconductor substrate, a sapphire substrate, a resin film, a resin base material, a metal foil, etc. In addition, it is preferable that the workpiece suspended by the plurality of adhesive pins can be adhered and held so that it does not fall at least due to its own weight, and the workpiece can be repeatedly attached and detached.
　このような粘着パッドとして、好ましくは、シリコーン樹脂、スチレンブタジエンゴム、クロロスルホン化ポリエチレンゴム、アクリロニトリルブタジエンゴム、エチレンプロピレンゴム、クロロプレンゴム、ブタジエンゴム、フッ素ゴム、イソブチレンイソプレンゴム、ウレタンゴム等のような樹脂材料からなり、かつ、表面にサブミクロンオーダーの高アスペクト比の繊維構造を有するような微細な突起が形成されて、分子間力（ファンデルワールス力）により粘着力を発現するものであるのがよく、市販品を挙げると、例えば扶桑ゴム産業社製商品名シリウス等を例示することができる。 Such adhesive pads are preferably silicone resin, styrene butadiene rubber, chlorosulfonated polyethylene rubber, acrylonitrile butadiene rubber, ethylene propylene rubber, chloroprene rubber, butadiene rubber, fluoro rubber, isobutylene isoprene rubber, urethane rubber, etc. It is made of a resin material and has fine protrusions on the surface that have a fiber structure with a high aspect ratio on the order of submicron, and expresses adhesive force by intermolecular force (van der Waals force). If a commercial item is mentioned, the brand name Sirius etc. by the Fuso rubber rubber industry company etc. can be illustrated, for example.
　保持したワークを吊り下げた状態で落下させないような粘着力を発現させるために、粘着パッドの厚みは５０μｍ以上であるのがよく、より厚く設けるのが望ましいが、効果が飽和することやコスト性等を考慮すれば、１０００μｍ程度あれば十分である。 In order to develop an adhesive force that prevents the held work from being dropped in a suspended state, the thickness of the adhesive pad should be 50 μm or more, and it is desirable to provide a thicker thickness, but the effect is saturated and cost performance In consideration of the above, about 1000 μm is sufficient.
　一方、粘着パッドとピン本体との間に介在させるゴム部材は、粘着パッドよりもゴム硬度が小さいものを使用する。例えば、粘着パッドがシリコーン樹脂からなる場合、シリコーン樹脂のゴム硬度は一般に３０°～８０°程度であることから、少なくともこれよりもゴム硬度が小さいゴム部材を選択すればよい。また、粘着パッドがウレタンゴムからなる場合、そのゴム硬度は一般に５０°～９０°程度であることから、少なくともこれよりもゴム硬度が小さいゴム部材を選択すればよい。具体的には、シリコーンゴム、フッ素ゴム、ウレタンゴム等からなるゴム部材であって、５°～５０°のゴム硬度を有したものを使用するのが好適である。なお、ゴム硬度とは、ＪＩＳ－Ｋ６２５３に基づいて測定したデュロメータ測定値を意味する。 On the other hand, the rubber member interposed between the adhesive pad and the pin body should be one having a rubber hardness smaller than that of the adhesive pad. For example, when the adhesive pad is made of a silicone resin, the rubber hardness of the silicone resin is generally about 30 ° to 80 °, and therefore a rubber member having a rubber hardness at least smaller than this may be selected. Further, when the adhesive pad is made of urethane rubber, the rubber hardness is generally about 50 ° to 90 °, and therefore, a rubber member having a rubber hardness smaller than this may be selected. Specifically, it is preferable to use a rubber member made of silicone rubber, fluorine rubber, urethane rubber or the like and having a rubber hardness of 5 ° to 50 °. The rubber hardness means a durometer measurement value measured based on JIS-K6253.
　また、ゴム部材の厚みについては、粘着パッドよりも厚くするのがよく、好ましくは、以下で説明する粘着ピンの長さ方向やワークに対する水平方向の弾性変形等を考慮して、０．５ｍｍ～５．０ｍｍであるのがよい。 The thickness of the rubber member should be larger than that of the adhesive pad, and preferably 0.5 mm or more in consideration of the elastic pin length direction and horizontal elastic deformation with respect to the workpiece described below. It is good that it is 5.0 mm.
　粘着パッドよりもゴム硬度が小さいゴム部材を介して粘着パッドをピン本体の先端に設けることで、ワークに粘着ピンを当接した際にゴム部材が収縮可能であり、仮に複数の粘着ピンの先端が全体で均一なワーク保持面を形成できていなくても、粘着ピンの長さ方向の取り付け誤差を吸収することができる。また、ワークが反っていたり表面凹凸を有していても、ゴム部材の弾性変形によってそれらに追従して粘着バッドをワークの表面に確実に粘着させることができる。そのため、粘着ピンプレートに立設した全ての粘着ピンを所期の目的で機能させることができ、予め過剰な安全率を見越して粘着ピンの数を増大させる必要性がなくなることから、ワーク荷重に対してより適切な安全率の範囲で粘着ピンの本数や設置場所を決定することができる。しかも、ゴム部材が復元力を有していることから、ワークに対する粘着ピンの位置合わせ精度を高めることもできる。 By providing an adhesive pad at the tip of the pin body via a rubber member whose rubber hardness is smaller than that of the adhesive pad, the rubber member can contract when the adhesive pin comes into contact with the workpiece. However, even if a uniform work holding surface cannot be formed as a whole, an attachment error in the length direction of the adhesive pin can be absorbed. Moreover, even if the workpiece is warped or has surface irregularities, the adhesive pad can be reliably adhered to the surface of the workpiece by following the elastic deformation of the rubber member. For this reason, all the adhesive pins installed on the adhesive pin plate can function for the intended purpose, eliminating the need to increase the number of adhesive pins in anticipation of an excessive safety factor in advance. On the other hand, the number of adhesive pins and the installation location can be determined within a more appropriate safety factor range. Moreover, since the rubber member has a restoring force, the alignment accuracy of the adhesive pin with respect to the workpiece can be increased.
　本発明においては、粘着ピンの先端に備え付けられるゴム部材と粘着パッドは少なくともピン本体と同じ外径を有するようにするのが好ましいが、例えば、ゴム部材を逆テーパー状にして粘着パッド側を裾広がりにしたり、粘着パッドの外周部をゴム部材よりも迫り出すようにして、ワークに対して粘着バッドが当接する面積を増やすようにしてもよい。或いは、ゴム部材を蛇腹状に形成するようにしてもよい。なかでも、粘着ピンの先端に備え付けられた粘着パッドの外周部をゴム部材よりも迫り出すようにすることで、粘着ピンの首振り機能をより有効活用することができる。すなわち、ワークに対して水平方向のゴム部材の弾性変形を利用して広範囲で粘着パッドをワークに当接させることができるため、ワークの反りや表面凹凸に対する追従性をより高めることができる。 In the present invention, it is preferable that the rubber member and the adhesive pad provided at the tip of the adhesive pin have at least the same outer diameter as that of the pin body. The area where the adhesive pad abuts against the workpiece may be increased by expanding the outer periphery of the adhesive pad or pushing the outer peripheral portion of the adhesive pad closer than the rubber member. Alternatively, the rubber member may be formed in a bellows shape. In particular, by swinging the outer peripheral portion of the adhesive pad provided at the tip of the adhesive pin beyond the rubber member, the swing function of the adhesive pin can be used more effectively. That is, since the adhesive pad can be brought into contact with the work in a wide range by utilizing the elastic deformation of the rubber member in the horizontal direction with respect to the work, the followability to the work warpage and surface unevenness can be further improved.
　また、本発明においては、粘着ピンの先端側から粘着ピンプレートの裏面側まで貫通する通気貫通孔を備えるようにして、粘着ピンが真空作用によりワークを吸引できるようにしてもよい。すなわち、ピン本体を円筒形にして、ピン本体の先端側のゴム部材と粘着パッドがその中空部に通ずる孔を有するようにして、ピン本体の基部側に相当する粘着ピンプレートにも孔を設けることで、粘着ピンプレートの裏面側（粘着ピンが立設される面と反対側）から真空引きして、粘着パッドがワークを引き付ける補助的な吸着力を備えるようにしてもよい。特に、樹脂フィルムや金属箔等のように腰がなく撓みやすいワークに対して、この補助的な吸引機能は効果的である。 In the present invention, a ventilation through hole penetrating from the front end side of the adhesive pin to the back surface side of the adhesive pin plate may be provided so that the adhesive pin can suck the work by a vacuum action. That is, the pin body has a cylindrical shape, and the rubber member and the adhesive pad on the tip side of the pin body have holes through which the hollow portions pass, and holes are also provided in the adhesive pin plate corresponding to the base side of the pin body. Thus, vacuum suction may be performed from the back side of the adhesive pin plate (the side opposite to the surface on which the adhesive pins are erected) so that the adhesive pad has an auxiliary suction force that attracts the workpiece. In particular, this auxiliary suction function is effective for a work that is flexible and flexible, such as a resin film or a metal foil.
　粘着ピンプレートについては、立設された複数の粘着ピンを連動させてワークに対して相対的に上下させることができる程度に剛性を有した板状のものであれば特に制限はなく、ワークの形状に対応させて円形や矩形等の任意の形状を選択することができる。ワークに対して粘着ピンプレートを相対的に上下させる駆動機構は粘着ピンプレート側に設けるようにしてもよく、ワークを支持するロボットハンドや台座等の側に設けるようにしてもよく、或いは、それぞれ独立して両者に設けるようにしてもよい。 The adhesive pin plate is not particularly limited as long as it has a plate shape that is rigid enough to move up and down relative to the workpiece by interlocking a plurality of standing adhesive pins. An arbitrary shape such as a circle or a rectangle can be selected in correspondence with the shape. The drive mechanism that moves the adhesive pin plate up and down relative to the workpiece may be provided on the adhesive pin plate side, may be provided on the side of the robot hand or pedestal that supports the workpiece, or You may make it provide in both independently.
　本発明におけるワーク保持装置は、ワークを確実に粘着して吊り下げ保持することができ、しかも、表面凹凸を有したワークや撓みやすいワークに対しても確実に作用することから、その利用形態は特に制限されない。一例を挙げるとすれば、例えば、液晶ディスプレイやプラズマディスプレイのようなフラットパネルディスプレイを製造する際に、上ステージと下ステージとの間でガラス基板等の２枚のワークを対向させて貼り合わせるワーク貼り合わせ装置において、上ステージを貫通する粘着ピンによって上ステージ側に配されるワークを吊り下げて保持するのに利用することができる。 Since the work holding device in the present invention can reliably hold and hold the work in a suspended state, and also acts reliably on a work with surface irregularities and a work that is easily bent, its use form is There is no particular limitation. For example, when manufacturing a flat panel display such as a liquid crystal display or a plasma display, for example, a workpiece in which two workpieces such as a glass substrate are bonded to each other between an upper stage and a lower stage. In the bonding apparatus, it can be used to suspend and hold a work placed on the upper stage side by an adhesive pin penetrating the upper stage.
　また、半導体基板の表面を研磨する研磨機のマウント板に基板を正しい位置に載置させるようなワーク貼り付け装置等に利用したり、太陽電池装置や有機ＥＬ装置等の製造でフィルムや樹脂基材等に所定の膜を蒸着するにあたり、処理面の反対側を保持して吊り下げるようなワーク保持装置としても利用することができる。更には、ワークにマスクを重ねて露光する際にマスク等を保持するのに利用することができるほか、各種デバイスの製造途中でワークを製造工程間で受け渡す際の搬送装置としても利用可能であり、特に真空下でも作用するなどその使用環境に制限を受けないことから、種々のインライン製造に供することができる。 In addition, it can be used for a workpiece pasting device that places the substrate on the mounting plate of a polishing machine that polishes the surface of a semiconductor substrate, or in the manufacture of solar cell devices, organic EL devices, etc. When depositing a predetermined film on a material or the like, it can also be used as a workpiece holding device that holds and suspends the opposite side of the processing surface. Furthermore, it can be used to hold a mask, etc., when a mask is overlaid on a workpiece for exposure, and it can also be used as a transfer device for transferring workpieces between manufacturing processes during the manufacture of various devices. In particular, it can be used for various in-line manufacturing because it is not restricted by the use environment such as working under vacuum.
　本発明によれば、粘着ピンの取り付け精度の問題が解消されて、過剰な安全率を見越していたずらに粘着ピンの本数を増やす必要性もなくワークを保持して吊り下げることができる。しかも、表面凹凸を有したワークや撓みやすいワークに対しても確実に粘着して吊り下げ保持することができ、更には、真空下でも保持可能であることから使用環境が制限されることもない。 According to the present invention, the problem of adhesive pin mounting accuracy is solved, and the workpiece can be held and suspended without the need to increase the number of adhesive pins in anticipation of an excessive safety factor. In addition, it can be securely attached to and suspended from workpieces with surface irregularities and flexible workpieces. Furthermore, since it can be held under vacuum, the usage environment is not limited. .
図１は、本発明のワーク保持装置を示す斜視説明図である。FIG. 1 is a perspective explanatory view showing a work holding device of the present invention. 図２は、本発明のワーク保持装置とワークとの関係を示す側面模式図である。FIG. 2 is a schematic side view showing the relationship between the workpiece holding device of the present invention and the workpiece. 図３は、粘着ピンの例を示す断面模式図である。FIG. 3 is a schematic cross-sectional view showing an example of an adhesive pin. 図４は、本発明のワーク保持装置をワーク貼り合わせ装置で使用する様子を示す断面模式図である。FIG. 4 is a schematic cross-sectional view showing a state in which the work holding device of the present invention is used in a work bonding apparatus. 図５は、本発明のワーク保持装置をワーク貼り合わせ装置で使用する様子を示す断面模式図である。FIG. 5 is a schematic cross-sectional view showing how the work holding device of the present invention is used in a work bonding apparatus. 図６は、本発明のワーク保持装置をワーク貼り合わせ装置で使用する様子を示す断面模式図である。FIG. 6 is a schematic cross-sectional view showing a state in which the work holding device of the present invention is used in a work bonding apparatus. 図７は、本発明のワーク保持装置をワーク貼り合わせ装置で使用する様子を示す断面模式図である。FIG. 7 is a schematic cross-sectional view showing a state in which the work holding device of the present invention is used in a work bonding apparatus.
　以下、図面を用いて本発明の実施形態について具体的に説明する。なお、下記内容は本発明の好適な実施形態の一例に過ぎず、本発明はこれらに制限されるものではない。 Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. The following content is merely an example of a preferred embodiment of the present invention, and the present invention is not limited to these.
　図１及び図２において、本発明に係るワーク保持装置Ｘが示されている。このワーク保持装置Ｘは、アルミニウム、ステンレス等からなる板状をした粘着ピンプレート１と、これに立設される複数の粘着ピン２とを備えており、粘着ピンプレート１側か、ワークＷ側か、或いはそれぞれに独立して設けられた上下駆動装置（図示外）によって、粘着ピンプレート１がワークＷに対して相対的に上下し、粘着ピン２の先端が当接してワークＷを粘着保持し、これを吊り上げることができる。 1 and 2 show a workpiece holding device X according to the present invention. The work holding device X includes a plate-like adhesive pin plate 1 made of aluminum, stainless steel, or the like, and a plurality of adhesive pins 2 erected on the plate, and the adhesive pin plate 1 side or the workpiece W side. Alternatively, the adhesive pin plate 1 moves up and down relatively with respect to the workpiece W by the vertical drive devices (not shown) provided independently of each other, and the tip of the adhesive pin 2 contacts to hold the workpiece W in an adhesive state. This can be lifted.
　このワーク保持装置Ｘにおける各粘着ピン２は、ワークＷに当接して粘着させる粘着パッド５とピン本体３とを有しており、粘着パッド５はゴム部材４を介してピン本体３の先端に備え付けられている。ピン本体３は、例えばアルミニウム、ステンレス、ＰＥＥＫ等によって形成され、ワークＷの吊り下げ保持に必要な分の長さを備えるようにすればよい。また、ゴム部材４については、粘着パッド５よりもゴム硬度が小さいものを用いる必要があり、例えば、ゴム硬度が６０°程度であるシリコーン樹脂製の粘着パッド５を用いる場合には、それよりゴム硬度が小さいシリコーン樹脂（ゴム硬度２０°）、ウレタンゴム（ゴム硬度３０°）、等を用いるようにすればよい。 Each adhesive pin 2 in the work holding device X has an adhesive pad 5 and a pin main body 3 that are brought into contact with and adhere to the work W, and the adhesive pad 5 is attached to the tip of the pin main body 3 via the rubber member 4. It is provided. The pin body 3 may be formed of, for example, aluminum, stainless steel, PEEK, or the like, and have a length necessary for holding the workpiece W in a suspended manner. The rubber member 4 must have a rubber hardness smaller than that of the adhesive pad 5. For example, when the adhesive pad 5 made of silicone resin having a rubber hardness of about 60 ° is used, the rubber member 4 is made of rubber. Silicone resin (rubber hardness 20 °) having low hardness, urethane rubber (rubber hardness 30 °), or the like may be used.
　また、ピン本体３の先端側に設けられるゴム部材４と粘着パッド５は、図３（Ａ）に示したように、少なくともピン本体２と同じ外径を有するようにするのがよいが、図３（Ｂ）のように、ゴム部材４を逆テーパー状にして粘着パッド５側を裾広がりにしたり、図３（Ｃ）のように、粘着パッド５の外周部がゴム部材４よりも迫り出すようにすることもできる。 Further, as shown in FIG. 3A, the rubber member 4 and the adhesive pad 5 provided on the distal end side of the pin main body 3 should have at least the same outer diameter as the pin main body 2. As shown in FIG. 3 (B), the rubber member 4 is reverse-tapered so that the adhesive pad 5 side is widened, or as shown in FIG. 3 (C), the outer peripheral portion of the adhesive pad 5 protrudes from the rubber member 4. It can also be done.
　更には、ピン本体２を円筒形にして、ゴム部材４と粘着パッド５がその中空部に通ずる孔を有するようにし、また、ピン本体３の基部側に相当する粘着ピンプレート１にも孔を設けて、粘着ピン２の先端側から粘着ピンプレート１の裏面側まで貫通する通気貫通孔６を備えるようにしてもよい。これにより、粘着ピンプレート１の裏面側（ワークと反対側）から図示外の真空装置等で真空引きすることで、ワークを吸引して吸着パッド５に当接させることができる。 Further, the pin body 2 is formed in a cylindrical shape so that the rubber member 4 and the adhesive pad 5 have holes that communicate with the hollow portions, and the adhesive pin plate 1 corresponding to the base side of the pin body 3 has holes. It is also possible to provide a ventilation through hole 6 that is provided and penetrates from the front end side of the adhesive pin 2 to the back surface side of the adhesive pin plate 1. Thus, the work can be sucked and brought into contact with the suction pad 5 by evacuating from the back surface side (opposite side of the work) of the adhesive pin plate 1 with a vacuum device (not shown).
　次に、本発明のワーク保持装置を使用した実施例について説明する。
　図４～７において、本発明のワーク保持装置Ｘを液晶ディスプレイ等の製造に使用されるワーク貼り合わせ装置で使用した様子が示されている。このワーク貼り合わせ装置は、上ステージ８と下ステージ９との間で２枚のワークＷ１、Ｗ２を対向させて、液晶封入等を行った後に接着層等を介在させて真空下で貼り合わせるものである。 Next, an embodiment using the workpiece holding device of the present invention will be described.
4 to 7 show a state in which the workpiece holding device X of the present invention is used in a workpiece laminating apparatus used for manufacturing a liquid crystal display or the like. This workpiece laminating apparatus is configured such that two workpieces W 1 and W 2 are opposed to each other between an upper stage 8 and a lower stage 9, liquid crystal is sealed, and then bonded under a vacuum with an adhesive layer or the like interposed therebetween. It is to match.
　本実施例に係るワーク貼り合わせ装置では、縦４００ｍｍ×横４００ｍｍ×厚さ１．１ｍｍのサイズを有して重さが約４５０ｇのガラス基板Ｗ１を上ステージ１０側に保持するために、図１～３に示したようなワーク保持装置Ｘを使用する。このワーク保持装置Ｘは、縦５００ｍｍ×横５００ｍｍ×厚さ１５ｍｍのアルミニウム製の粘着ピンプレート１に合計１２本の粘着ピン２を備えており、粘着ピンプレート１には上下駆動装置７が接続されてガラス基板Ｗ１に対して相対的に上下できるようになっている。また、各粘着ピン２は、外径１６ｍｍ、内径８ｍｍ、長さ１００ｍｍの円筒形をしたステンレス製のピン本体３の先端に、ゴム硬度が２０°のフッ素系ゴム部材４を介してシリコーン樹脂製の粘着パッド５（扶桑ゴム社製商品名シリウス、ゴム硬度５０°）が備え付けられており、ゴム部材４は、外径１６ｍｍ、厚さが３ｍｍとし、また、粘着パッド５は、外径１６ｍｍ、厚さが０．１ｍｍとした。なお、粘着ピン２はガラス基板Ｗ１の表面を均等に粘着するように、粘着ピンプレート１に対して全体を配置した。また、粘着ピン２の全体によって生じる粘着力は、ガラス基板Ｗ１の吊り下げ保持に最低限必要なワーク荷重に対して３倍程度の粘着力を発現できるようにした。 In the work bonding apparatus according to the present embodiment, the weight has a size of longitudinal 400 mm × horizontal 400 mm × thickness 1.1mm is a glass substrate W 1 of about 450g to hold on the stage 10 side, FIG. A workpiece holding device X as shown in 1 to 3 is used. The work holding device X includes a total of 12 adhesive pins 2 on an adhesive pin plate 1 made of aluminum having a length of 500 mm, a width of 500 mm, and a thickness of 15 mm. A vertical driving device 7 is connected to the adhesive pin plate 1. It has to be relatively vertical with respect to the glass substrates W 1 Te. Each adhesive pin 2 is made of a silicone resin through a fluorine rubber member 4 having a rubber hardness of 20 ° at the tip of a cylindrical stainless steel pin body 3 having an outer diameter of 16 mm, an inner diameter of 8 mm, and a length of 100 mm. Adhesive pad 5 (trade name Sirius manufactured by Fuso Rubber Co., Ltd., rubber hardness 50 °), rubber member 4 has an outer diameter of 16 mm and a thickness of 3 mm, and adhesive pad 5 has an outer diameter of 16 mm, The thickness was 0.1 mm. The adhesive pin 2 to evenly adhere the surface of the glass substrate W 1, was placed the whole against adhesive pin plate 1. Further, the adhesive force generated by the whole of the adhesive pin 2 has to be able to develop adhesive force of about 3 times the minimum required work load holding hanging glass substrate W 1.
　このワーク貼り合わせ装置においてガラス基板Ｗ１を上ステージ８側に配するために、先ず、図４に示したように、フォーク形状の吸着面を有して真空作用によりガラス基板Ｗ１の裏面（ガラス基板Ｗ２との対向面の裏側）を吸引して保持することができるロボットハンド１０を用いて、上ステージ８の直下にガラス基板Ｗ１を搬送する。ここで、ロボットハンド１０の吸着面はフォーク形状をしており、ガラス基板Ｗ１の裏面の一部は露出した状態である。 In this work bonding apparatus for disposing a glass substrate W 1 in the upper stage 8 side, first, as shown in FIG. 4, the rear surface of the glass substrate W 1 by a vacuum action a suction surface of the fork-shaped ( using the robot hand 10 which can be held by sucking the back side) of the opposing surface of the glass substrate W 2, transports the glass substrate W 1 directly below the upper stage 8. Here, the suction surface of the robot hand 10 is of a fork shape, a portion of the back surface of the glass substrate W 1 is exposed.
　次いで、図５に示したように、粘着ピン２を上ステージ８の貫通孔8a内に待機させておいたワーク保持装置Ｘの粘着ピンプレート１を下降させ、ガラス基板Ｗ１の裏面に粘着ピン２の先端を当接させて、粘着パッド５を粘着させる。ここでは大気下での処理であるため、粘着ピン２の先端側から粘着ピンプレート１の裏面側まで貫通する通気貫通孔６を設けて、図示外の真空ポンプ等に接続して粘着ピン２が真空作用によりガラス基板Ｗ１を補助的に吸引できるようにしてもよい。 Next, as shown in FIG. 5, the adhesive pin plate 1 of the work holding device X that has kept the adhesive pin 2 in the through hole 8 a of the upper stage 8 is lowered, and the adhesive pin is attached to the back surface of the glass substrate W 1. The tip of 2 is brought into contact, and the adhesive pad 5 is adhered. Here, since the treatment is performed in the atmosphere, a ventilation through hole 6 is provided that penetrates from the front end side of the adhesive pin 2 to the back surface side of the adhesive pin plate 1 and is connected to a vacuum pump or the like (not shown). the glass substrate W 1 may allow supplementary sucked by vacuum action.
　そして、図６に示したように、ロボットハンド１０による吸引を解除してこれを退避させた上で、図７に示したように、上下駆動装置７により粘着ピンプレート１を上昇させることで、ガラス基板Ｗ１を上ステージ８に配置させることができる。本発明のワーク保持装置Ｘによれば、ロボットハンド１０からの受け渡しから上ステージ８への配置に至るまで、過剰な安全率を見越していたずらに粘着ピンの本数を増やすことなく、適切な粘着力でガラス基板Ｗ１を保持して吊り下げることが可能である。 Then, as shown in FIG. 6, after the suction by the robot hand 10 is released and retracted, the adhesive pin plate 1 is raised by the vertical drive device 7 as shown in FIG. 7, The glass substrate W 1 can be placed on the upper stage 8. According to the workpiece holding device X of the present invention, from the delivery from the robot hand 10 to the placement on the upper stage 8, an appropriate adhesive force can be obtained without increasing the number of adhesive pins in anticipation of an excessive safety factor. in can be hung by holding the glass substrate W 1.
　なお、上ステージ８に配されたガラス基板Ｗ１を本発明のワーク保持装置Ｘによって終始吊り下げ保持した状態で下ステージ９側のガラス基板Ｗ２と貼り合わせるようにしてもよいが、上ステージ８には静電チャックや粘着パッド等（いずれも図示外）を設けておき、これらによってガラス基板Ｗ１を保持させた後、粘着ピン２を更に上昇させてガラス基板Ｗ１を上ステージ８に受け渡すようにしてもよい。 The glass substrate W 1 disposed on the upper stage 8 may be bonded to the glass substrate W 2 on the lower stage 9 side while being suspended and held by the work holding device X of the present invention. 8 is provided with an electrostatic chuck, an adhesive pad, etc. (all not shown), and after holding the glass substrate W 1 with these, the adhesive pin 2 is further raised to bring the glass substrate W 1 to the upper stage 8. You may make it hand over.
１：粘着ピンプレート、２：粘着ピン、３：ピン本体、４：ゴム部材、５：粘着パッド、６：通気貫通孔、７：上下駆動装置、８：上ステージ、９：下ステージ、１０：ロボットハンド、Ｘ：ワーク保持装置、Ｗ：ワーク。 1: Adhesive pin plate, 2: Adhesive pin, 3: Pin body, 4: Rubber member, 5: Adhesive pad, 6: Venting through hole, 7: Vertical drive device, 8: Upper stage, 9: Lower stage, 10: Robot hand, X: work holding device, W: work.

Claims (4)

  1. 　ワークを吊り下げて保持することができるワーク保持装置であって、ワークに対して相対的に上下し、かつ、複数の粘着ピンが立設された粘着ピンプレートを備え、前記粘着ピンは、ワークを粘着保持する粘着パッドとピン本体とを有して、粘着パッドがゴム部材を介してピン本体の先端に備え付けられており、ゴム部材のゴム硬度が粘着パッドのゴム硬度よりも小さいことを特徴とするワーク保持装置。 A workpiece holding device capable of suspending and holding a workpiece, the workpiece holding device including an adhesive pin plate which is moved up and down relative to the workpiece and has a plurality of adhesive pins standing upright. The adhesive pad is attached to the tip of the pin body via a rubber member, and the rubber hardness of the rubber member is smaller than the rubber hardness of the adhesive pad. Work holding device.
  2. 　粘着ピンの先端側から粘着ピンプレートの裏面側まで貫通する通気貫通孔を備えて、粘着ピンが真空作用によりワークを吸引することができる請求項１に記載のワーク保持装置。 The work holding apparatus according to claim 1, further comprising a ventilation through hole penetrating from the front end side of the adhesive pin to the back surface side of the adhesive pin plate, and the adhesive pin can suck the work by a vacuum action.
  3. 　粘着ピンの先端に備え付けられた粘着パッドの外周部がゴム部材よりも迫り出している請求項１又は２に記載のワーク保持装置。 The work holding device according to claim 1 or 2, wherein the outer peripheral portion of the adhesive pad provided at the tip of the adhesive pin protrudes from the rubber member.
  4. 　上ステージと下ステージとの間で２枚のワークを対向させて貼り合わせるワーク貼り合わせ装置において、上ステージを貫通する粘着ピンによって上ステージ側に配されるワークを吊り下げて保持するのに使用されることを特徴とする請求項１～３のいずれかに記載のワーク保持装置。 Used to suspend and hold a work placed on the upper stage side by an adhesive pin that penetrates the upper stage in a work laminating device that attaches two works facing each other between the upper stage and the lower stage. The work holding apparatus according to any one of claims 1 to 3, wherein the work holding apparatus is provided.
PCT/JP2012/075428 2011-10-21 2012-10-01 Workpiece holding device WO2013058094A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-232126 2011-10-21
JP2011232126 2011-10-21

Publications (1)

Publication Number Publication Date
WO2013058094A1 true WO2013058094A1 (en) 2013-04-25

Family

ID=48140746

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/075428 WO2013058094A1 (en) 2011-10-21 2012-10-01 Workpiece holding device

Country Status (2)

Country Link
TW (1) TW201331670A (en)
WO (1) WO2013058094A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175016A (en) * 2010-02-23 2011-09-08 Hitachi Plant Technologies Ltd Liquid crystal substrate laminate system
JP2013257594A (en) * 2013-08-30 2013-12-26 Hitachi Ltd Liquid crystal substrate lamination system
JP2016039185A (en) * 2014-08-05 2016-03-22 株式会社アルバック Substrate holder and substrate attachment and detachment method
JP2018195670A (en) * 2017-05-16 2018-12-06 株式会社アルバック Adhesion retainer and holding method of held body
WO2019096426A1 (en) * 2017-11-20 2019-05-23 Applied Materials, Inc. Substrate process arrangement and method for holding a substrate

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01242345A (en) * 1988-03-23 1989-09-27 Katsuo Nishijima Vacuum suction device
JP2001179672A (en) * 1999-12-21 2001-07-03 Mitsubishi Electric Corp Robot hand
JP2003191191A (en) * 2001-12-20 2003-07-08 Shinko Electric Co Ltd Vacuum suction device
WO2003075343A1 (en) * 2002-03-05 2003-09-12 Sharp Kabushiki Kaisha Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate
JP2007199384A (en) * 2006-01-26 2007-08-09 Ulvac Japan Ltd Substrate-sticking device
JP2010212298A (en) * 2009-03-06 2010-09-24 Tomoegawa Paper Co Ltd Adhesive chuck device
JP2011175016A (en) * 2010-02-23 2011-09-08 Hitachi Plant Technologies Ltd Liquid crystal substrate laminate system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01242345A (en) * 1988-03-23 1989-09-27 Katsuo Nishijima Vacuum suction device
JP2001179672A (en) * 1999-12-21 2001-07-03 Mitsubishi Electric Corp Robot hand
JP2003191191A (en) * 2001-12-20 2003-07-08 Shinko Electric Co Ltd Vacuum suction device
WO2003075343A1 (en) * 2002-03-05 2003-09-12 Sharp Kabushiki Kaisha Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate
JP2007199384A (en) * 2006-01-26 2007-08-09 Ulvac Japan Ltd Substrate-sticking device
JP2010212298A (en) * 2009-03-06 2010-09-24 Tomoegawa Paper Co Ltd Adhesive chuck device
JP2011175016A (en) * 2010-02-23 2011-09-08 Hitachi Plant Technologies Ltd Liquid crystal substrate laminate system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175016A (en) * 2010-02-23 2011-09-08 Hitachi Plant Technologies Ltd Liquid crystal substrate laminate system
JP2013257594A (en) * 2013-08-30 2013-12-26 Hitachi Ltd Liquid crystal substrate lamination system
JP2016039185A (en) * 2014-08-05 2016-03-22 株式会社アルバック Substrate holder and substrate attachment and detachment method
JP2018195670A (en) * 2017-05-16 2018-12-06 株式会社アルバック Adhesion retainer and holding method of held body
WO2019096426A1 (en) * 2017-11-20 2019-05-23 Applied Materials, Inc. Substrate process arrangement and method for holding a substrate

Also Published As

Publication number Publication date
TW201331670A (en) 2013-08-01

Similar Documents

Publication Publication Date Title
WO2013058094A1 (en) Workpiece holding device
KR102005610B1 (en) Conveying hand and lithography apparatus
JP5273791B2 (en) Equipment for applying adhesive tape to substrates
TW201200447A (en) Workpiece transport method and workpiece transport device
JP2013055093A (en) Adhesive chuck device and adhesion holding method of work-piece
KR20120107360A (en) Sticking device of film for display panel and sticking method of film using the same
JP2013095006A (en) Pasting device and pasting method
KR102010247B1 (en) Protective film peeling device and system for attaching film to panel having the same
KR20140018694A (en) Robot for transporting weight and substrate
KR20190122281A (en) Method of attaching substrate and apparatus for attaching substatr
JP2007212572A (en) Method and device for manufacturing laminated substrate
KR20190079024A (en) System for attaching functional film
JP7222535B2 (en) Work transfer hand and ball mounting device
JP2008305951A (en) Component fixing jig
KR100797572B1 (en) Vertical type apparatus for transferring a substrate
KR20160046732A (en) Method and apparatus for joining adhesive tape
JP2016011210A (en) Device and method for peeling laminate, and method of manufacturing electronic device
KR101404057B1 (en) Laminating Device and Method for Apparatus of Bonding Substrates, and Apparatus and Method of Bonding Substrates Having the same
JP2015187648A (en) Bonding method and bonding device
JP6471606B2 (en) Laminate peeling apparatus, peeling method, and electronic device manufacturing method
JP3711802B2 (en) Pallet for conveyance, conveyance apparatus provided with this pallet for conveyance, and work fixing method
KR101873048B1 (en) Polarized Film Attaching Apparatus for Display Panel
JP2006039238A (en) Sticking device for functional film such as polarizing plate and ar film
KR101403850B1 (en) System for holding large scale substrate
JP6468462B2 (en) Laminate peeling apparatus, peeling method, and electronic device manufacturing method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12842052

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12842052

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP