JP2016011210A - Device and method for peeling laminate, and method of manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for peeling a laminate, which facilitate replacement of a suction attachment part for attaching a base plate of the laminate by a suction force and holding it, and a method of manufacturing an electronic device.SOLUTION: A suction attachment part 54 of a peeling unit 42 of a peeling device 40 is provided in such a manner as to be capable of being freely attached to/detached from a flexible plate 52 via a double-sided adhesive tape 56. Thus, when the suction attachment part 54 is replaced, the suction attachment part 54 is detached from the flexible plate 52, and a new suction attachment part 54 is attached to the flexible plate 52. This facilitates the replacement of the suction attachment part 54. Additionally, non-operation time for replacing the suction attachment part 54 can be shortened.

Description

  The present invention relates to a peeling apparatus and a peeling method for a laminate, and a method for manufacturing an electronic device.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are made thinner. Is desired.

However, as the thickness of the substrate decreases, the handling of the substrate deteriorates. Therefore, a functional layer for an electronic device (thin film transistor (TFT: Thin Film Transistor) is formed on the surface of the substrate.
), It is difficult to form a color filter (CF: Color Filter).

  Therefore, an electronic device in which a glass reinforcing plate (second substrate) is attached to the back surface of the substrate to form a laminate in which the substrate is reinforced by the reinforcing plate, and a functional layer is formed on the surface of the substrate in the state of the laminate. A device manufacturing method has been proposed. In this manufacturing method, since the handling property of the substrate is improved, the functional layer can be favorably formed on the surface of the substrate. And a reinforcement board is peeled from a board | substrate after formation of a functional layer.

  The method of peeling a reinforcing plate disclosed in Patent Document 1 is a direction in which the reinforcing plate and / or the substrate are separated from each other from one of the two corners located on the diagonal line of the rectangular laminate. This is done by bending and deforming. At this time, in order to perform peeling smoothly, a peeling start part is created at one corner of the laminate. The peeling start portion is created by inserting a predetermined amount of a peeling blade from the end face of the laminate to the interface between the substrate and the reinforcing plate.

  The peeling device of Patent Document 1 includes a stage, a flexible member, a pad, and the like. The substrate is sucked and held by the stage, the reinforcing plate is sucked and held by the flexible member, and the pad is flexible. The reinforcing plate is peeled from the substrate by bending and deforming the member from one to the other.

  The flexible member is composed of a rubber mounting portion (suction portion) and a defining portion that defines the bending rigidity of the flexible member, and the groove portion of the mounting portion and the through hole of the defining portion are communicated with each other. The reinforcing plate is sucked and held on the mounting portion by the suction force of the vacuum pump connected to the hole.

International Publication No. 2011/024689

  In the peeling device of Patent Document 1, when the rubber attachment portion deteriorates or the attachment portion is damaged due to use, the specified portion must be replaced, which is not economical. In the case where the prescribed portion is not exchanged, the attachment portion must be scraped from the prescribed portion, and a new attachment portion must be provided on the prescribed portion, resulting in a problem that the replacement work takes time.

  The present invention has been made in view of such problems, and provides a laminate peeling apparatus and peeling method, and an electronic device manufacturing method, in which an adsorption portion that holds the substrate of the laminate by suction is easily exchanged. With the goal.

  In one aspect of the laminate peeling apparatus of the present invention, in order to achieve the above object, the first substrate and the second substrate are attached to the first substrate so as to be peelable. And a stacking apparatus for sequentially stripping the interface between the first substrate and the second substrate along the stripping progress direction from one end side to the other end side, and a support unit for supporting the first substrate of the stacked body; A peeling unit including a plate-like first flexible member, and a detachable unit that is detachably attached to the first flexible member and that adsorbs the second substrate of the laminate. And a drive unit that deforms the peeling unit so that the second substrate of the body is sequentially bent and deformed from one end side to the other end side.

  In one aspect of the method for peeling a laminate of the present invention, in order to achieve the above object, the first substrate and the second substrate are attached to the first substrate so as to be peelable. In the peeling method of a laminate in which the interface between the first substrate and the second substrate is sequentially peeled along the peeling progress direction from one end side to the other end side, the first substrate of the laminate is supported by a support portion. A peeling unit including a supporting step, a plate-like first flexible member, and an adsorption portion that is detachably attached to the first flexible member and adsorbs the second substrate of the laminate. And an adsorption step of adsorbing the second substrate of the laminate by the adsorption unit, and the peeling unit so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side. A peeling step in which the interface is peeled off by deforming the drive unit, Characterized by comprising.

  In one aspect of the method for producing an electronic device of the present invention, in order to achieve the above object, the first substrate and the second substrate made of glass are attached to the laminate so that the first substrate and the second substrate can be peeled. A method of manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on an exposed surface of one substrate; and a separating step of separating the second substrate from the first substrate on which the functional layer is formed. The separation step is detachable from the support step of supporting the first substrate of the laminate by a support portion, the plate-like first flexible member, and the first flexible member. Using a peeling unit including an adsorption unit that adsorbs the second substrate of the laminate, and adsorbing the second substrate of the laminate by the adsorption unit; and the first of the laminate 2 substrates are deformed sequentially from one end to the other end Characterized in that and a peeling step of peeling the second substrate from the first substrate is deformed by the drive unit to the separation unit to so that.

  According to one aspect of the present invention, since the suction portion is detachably attached to the first flexible member, the suction portion is removed from the first flexible member when the suction portion is replaced. A new suction part is attached to the first flexible member. Therefore, the suction part can be easily replaced. Moreover, the non-operation time for replacing | exchanging an adsorption | suction part can be shortened.

  In one aspect of the present invention, it is preferable that the support portion has the same configuration as the peeling unit. In other words, according to one embodiment of the present invention, in the supporting step, it is preferable to support the first substrate using the supporting portion having the same configuration as the peeling unit in the adsorption step.

  According to one aspect of the present invention, the first substrate is sucked and held by the support portion having the same configuration as that of the peeling unit, and the first substrate and the second substrate are sequentially bent and deformed from one end side to the other end side. In this manner, the first substrate and the second substrate are peeled by deforming the peeling unit and the support portion. According to this aspect, since the first substrate and the second substrate are bent at the same time, it is possible to reduce the peeling force as compared with a mode in which only one substrate is bent.

  According to one aspect of the present invention, the adsorbing portion includes a plate-like second flexible member having one surface detachably attached to the first flexible member, and the second flexible member. Provided on the other surface of the permeable member, and provided on the other surface of the second flexible member so as to surround the permeable sheet, and a breathable sheet that vacuum-sucks the inner surface of the second substrate. It is preferable to have a seal frame member that contacts the outer peripheral surface excluding the inner surface of the second substrate.

  According to one aspect of the present invention, when the inner surface of the second substrate is vacuum-sucked by the breathable sheet, the outer peripheral surface of the second substrate is in close contact with the seal frame member. The sheet can be reliably vacuum-adsorbed. In addition, since the breathable sheet and the seal frame member are configured to be supported on the other surface of the second flexible member, the breathable sheet and the seal frame member are separated from the second flexible member. Can be assembled accurately outside. Furthermore, since the soft breathable sheet and the seal frame member are supported by the second flexible member having higher rigidity than those, the respective functions can be stably exhibited. It should be noted that electrostatic adsorption or adhesion may be used instead of vacuum adsorption, but vacuum adsorption is preferred because a strong adsorption force can be obtained.

  According to an aspect of the present invention, the suction portion is detachably attached to the first flexible member via a double-sided adhesive tape, and the adhesive force of the double-sided adhesive tape to the suction portion is: It is preferable that the adhesive strength to the first flexible member is higher.

  According to one aspect of the present invention, when the suction part is replaced, the double-sided adhesive tape is taken out together with the suction part. Therefore, when the adhesive force of the double-sided adhesive tape decreases, it can be easily replaced with a new one. . The double-sided adhesive tape uses a single-sided re-peeling type with a strong-bonding surface on one side and a re-peeling surface on the other side. It is preferable to adhere to the part.

  According to an aspect of the present invention, the adsorption unit includes a plurality of sizes according to the size of the stacked body, and one adsorption unit selected based on the size of the stacked body is the first adsorption unit. It is preferable that the flexible member is detachably mounted.

  According to one aspect of the present invention, when a plurality of sizes of adsorbing portions corresponding to the size of the laminated body are arranged, and when the size of the laminated body is changed, one adsorbing portion corresponding to the size of the laminated body Select and replace. Also when exchanging the adsorbing part due to such a size change, exchanging the adsorbing part becomes easy, and the non-operation time for exchanging the adsorbing part can be shortened.

  According to the peeling apparatus and peeling method for a laminate and the method for manufacturing an electronic device according to the present invention, it is easy to replace the suction unit that holds the substrate of the laminate by suction.

The principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device The principal part enlarged side view which shows an example of the laminated body produced in the middle of the manufacturing process of LCD Explanatory drawing which showed the peeling start part creation method by the peeling start part creation apparatus Plan view of a laminate in which a peeling start part is created by the peeling start part creation method The longitudinal cross-sectional view which showed the structure of the peeling apparatus of embodiment The top view of the flexible board which showed typically the arrangement position of a plurality of movable bodies to a peeling unit Explanatory drawing showing the configuration of the peeling unit Longitudinal sectional view of the peeling device that peels the interface of the laminate Explanatory drawing which showed the peeling method which peels the reinforcement board of the laminated body by which the peeling start part was created by the peeling start part creation method in time series Explanatory drawing which showed the peeling method which peels the reinforcement board of a laminated body in time series following FIG. Explanatory drawing which showed another form of the adsorption part of a peeling unit

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  Below, the case where the peeling apparatus and peeling method of the laminated body concerning this invention are used in the manufacturing process of an electronic device is demonstrated.

  An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As a display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be illustrated.

[Manufacturing process of electronic devices]
An electronic device is manufactured by forming a functional layer for an electronic device (in the case of LCD, a thin film transistor (TFT) and a color filter (CF)) on the surface of a substrate made of glass, resin, metal, or the like.

  Prior to the formation of the functional layer, the back surface of the substrate is bonded to a reinforcing plate to form a laminate. Thereafter, a functional layer is formed on the surface of the substrate in the state of the laminate. Then, after the functional layer is formed, the reinforcing plate is peeled from the substrate.

  That is, the electronic device manufacturing process includes a functional layer forming process for forming a functional layer on the surface of the substrate in the state of a laminate, and a separation process for separating the reinforcing plate from the substrate on which the functional layer is formed. In this separation step, the laminate peeling apparatus and peeling method according to the present invention are applied.

[Laminate 1]
FIG. 1 is an enlarged side view of an essential part showing an example of a laminated body 1.

  The laminate 1 includes a substrate (first substrate) 2 on which a functional layer is formed, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. The reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the front surface 3 a, and the back surface 2 b of the substrate 2 is attached to the resin layer 4. That is, the substrate 2 is detachably attached to the reinforcing plate 3 through the resin layer 4 by van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]
The substrate 2 has a functional layer formed on its surface 2a. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, a glass substrate is suitable as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. Further, as the linear expansion coefficient becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be displaced during cooling.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, it is preferable to select and use glass suitable for the type of electronic device to be produced and glass suitable for the production process. For example, it is preferable to employ glass (non-alkali glass) that does not substantially contain an alkali metal component for the glass substrate for a liquid crystal panel.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, and even more preferably 0.1 mm or less, in order to reduce the weight and thickness of the electronic device. Set to When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll. However, from the viewpoint of manufacturing the glass substrate and handling the glass substrate, the thickness is 0.03 mm or more. Preferably there is.

  In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the board | substrate 2 can also be comprised with the laminated body which laminated | stacked the several board | substrate.

[Reinforcement plate 3]
Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

  The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type and thickness of the substrate 2 to be reinforced. The reinforcing plate 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

  In this example, the reinforcing plate 3 is constituted by a single substrate, but the reinforcing plate 3 can also be constituted by a laminated body in which a plurality of substrates are laminated.

[Resin layer 4]
In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling process, the interface between the resin layer 4 and the substrate 2 is peeled off.

  Although resin which comprises the resin layer 4 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, when the thickness of the resin layer 4 is 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is economical.

  The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2.

  Moreover, although the resin layer 4 is comprised by 1 layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. In this case, the type of resin constituting each layer may be different.

  Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  Furthermore, although the laminated body 1 of FIG. 1 includes the resin layer 4 as an adsorption layer, the resin layer 4 may be eliminated and the substrate 2 and the reinforcing plate 3 may be configured. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. In this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 so that the substrate 2 which is a glass substrate and the reinforcing plate 3 which is a glass plate do not adhere at a high temperature.

[Laminated body 6 of embodiment in which functional layer is formed]
A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 through the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed in a predetermined pattern by photolithography or etching.

  FIG. 2 is an enlarged side view of an essential part showing an example of a rectangular laminate 6 produced during the manufacturing process of the LCD.

  The laminate 6 is configured by laminating a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B in this order. That is, the laminate 6 in FIG. 2 corresponds to a laminate in which the laminate 1 shown in FIG. 1 is arranged symmetrically with the functional layer 7 in between. Hereinafter, a laminate composed of the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminate 1A, and a laminate composed of the substrate 2B, the resin layer 4B, and the reinforcement plate 3B is referred to as a second laminate 1B. Called.

  A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the surface 2Ba of the substrate 2B of the second laminated body 1B. (CF) is formed.

  The first laminate 1A and the second laminate 1B are integrated by superimposing the surfaces 2Aa and 2Ba of the substrates 2A and 2B. Thereby, the laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically with the functional layer 7 interposed therebetween is manufactured.

  In the laminate 6, after the peeling start part is formed with a knife in the peeling start part process of the separation process, the reinforcing plates 3 </ b> A and 3 </ b> B are sequentially peeled off in the peeling process of the separation process. Is attached to produce a product LCD.

[Peeling start part creation device 10]
FIG. 3 is an explanatory view showing the configuration of the peeling start part creation device 10 used in the peeling start part creation step, and FIG. 3 (A) shows the positional relationship between the laminate 6 and the knife N. 3B is an explanatory diagram for creating the peeling start portion 26 at the interface 24 by the knife N, and FIG. 3C is an explanatory diagram showing a state immediately before creating the peeling start portion 30 at the interface 28. 3D is an explanatory diagram for creating the peeling start portion 30 on the interface 28 by the knife N, and FIG. 3E is an explanatory diagram of the laminate 6 in which the peeling start portions 26 and 30 are created. FIG. 4 is a plan view of the laminate 6 in which the peeling start portions 26 and 30 are created.

  At the time of creating the peeling start portions 26 and 30, the laminated body 6 is supported horizontally (X-axis direction in the drawing) with the back surface 3Bb of the reinforcing plate 3B being sucked and held by the table 12, as shown in FIG.

  The knife N is supported horizontally by the holder 14 so that the cutting edge faces the end face of the corner 6A of the laminate 6. In addition, the position of the knife N is adjusted by the height adjusting device 16 in the height direction (Z-axis direction in the drawing). Furthermore, the knife N and the laminated body 6 are relatively moved in the horizontal direction by a feeding device 18 such as a ball screw device. The feeding device 18 may move at least one of the knife N and the table 12 in the horizontal direction. In the embodiment, the knife N is moved. Furthermore, a liquid supply device 22 for supplying the liquid 20 is disposed above the knife N on the upper surface of the knife N before or during insertion.

[Peeling start part creation method]
The peeling start part creation method by the peeling start part creation apparatus 10 sets the insertion position of the knife N to the corner 6A of the laminated body 6 at a position overlapping in the thickness direction of the laminated body 6, and the knife N The amount of insertion is set to be different for each of the interfaces 24 and 28.

  The creation procedure will be described.

  In the initial state, the cutting edge of the knife N exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B, which is the first insertion position. Therefore, first, as shown in FIG. 3A, the knife N is moved in the height direction, and the height of the blade edge of the knife N is set to the height of the interface 24.

  Thereafter, as shown in FIG. 3B, the knife N is moved horizontally toward the corner 6 </ b> A of the stacked body 6, and a predetermined amount of the knife N is inserted into the interface 24. In addition, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N at the time of or before the insertion of the knife N. As a result, the substrate 2B at the corner 6A is peeled off from the resin layer 4B, so that a triangular peeling start portion 26 is created at the interface 24 in plan view as shown in FIG. Although supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 even after the knife N is removed, and thus the peeling start portion 26 that cannot be reattached can be created.

  Next, the knife N is pulled out from the corner 6A in the horizontal direction, and as shown in FIG. 3C, the cutting edge of the knife N is moved to the height of the interface 28 between the substrate 2A and the resin layer 4A which is the second insertion position. Set to

  Thereafter, as shown in FIG. 3D, the knife N is moved horizontally toward the laminated body 6 and a predetermined amount of the knife N is inserted into the interface 28. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. As a result, as shown in FIG. 3D, a peeling start portion 30 is created at the interface 28. Here, the amount of insertion of the knife N into the interface 28 is smaller than the amount of insertion into the interface 24. The above is the peeling start part creation method. Note that the amount of insertion of the knife N into the interface 24 may be smaller than the amount of insertion into the interface 28.

  The laminate 6 in which the peeling start portions 26 and 30 are created is taken out from the peeling start portion creating apparatus 10 and is transported to a peeling apparatus described later, and the interfaces 24 and 28 are sequentially peeled by the peeling apparatus.

  Although details of the peeling method will be described later, as shown by an arrow A in FIG. 4, the area of the peeling start portion 26 is increased by bending the laminated body 6 from the corner portion 6A toward the corner portion 6B facing the corner portion 6A. The interface 24 is first peeled off starting from the peeling start portion 26. Thereby, the reinforcing plate 3B is peeled off. Thereafter, the laminated body 6 is bent again from the corner 6 </ b> A toward the corner 6 </ b> B, whereby the interface 28 having a small area of the peeling start portion 30 is peeled off from the peeling start portion 30. Thereby, the reinforcing plate 3A is peeled off.

  The insertion amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm, depending on the size of the laminate 6.

[Peeling device 40]
FIG. 5 is a longitudinal sectional view showing the configuration of the peeling device 40 of the embodiment, and FIG. 6 is a peeling unit 42 schematically showing the arrangement positions of the plurality of movable bodies 44 with respect to the peeling unit 42 of the peeling device 40. FIG. 5 corresponds to a cross-sectional view taken along line B-B in FIG. 6, and in FIG. 6, the stacked body 6 is indicated by a solid line.

  As shown in FIG. 5, the peeling device 40 includes a pair of movable devices 46 and 46 that are disposed above and below the laminated body 6. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of FIG. 5 will be described here, and the description of the movable device 46 disposed on the upper side will be omitted by attaching the same reference numerals. .

  The movable device 46 includes a plurality of movable bodies 44, a plurality of drive devices (drive units) 48 that move the movable body 44 up and down for each movable body 44, and a controller 50 (drive unit) that controls the drive device 48 for each drive device 48. ) Etc.

  The peeling unit 42 holds the reinforcing plate 3B by vacuum suction in order to bend and deform the reinforcing plate 3B. Instead of vacuum suction, electrostatic suction or magnetic suction may be used.

[Peeling unit 42]
FIG. 7A is a plan view of the peeling unit 42, and FIG. 7B is an enlarged longitudinal sectional view of the peeling unit 42 taken along the line CC in FIG. 7A. Further, FIG. 7C shows that the adsorbing portion 54 constituting the peeling unit 42 is bonded on both sides to a rectangular plate-like flexible plate (first flexible member) 52 constituting the peeling unit 42. FIG. 6 is an enlarged longitudinal sectional view of the peeling unit 42 showing that it is detachably provided via a tape 56.

  As described above, the peeling unit 42 is configured such that the suction portion 54 is detachably attached to the flexible plate 52 via the double-sided adhesive tape 56.

  The adsorption portion 54 includes a flexible plate (second flexible member) 58 that is thinner than the flexible plate 52. The lower surface (one surface) of the flexible plate 58 is detachably attached to the upper surface of the flexible plate 52 via a double-sided adhesive tape 56.

  Further, the adsorbing portion 54 is provided with a rectangular breathable sheet 60 that adsorbs and holds the inner surface of the reinforcing plate 3B of the laminate 6. The thickness of the breathable sheet 60 is 2 mm or less, preferably 1 mm or less for the purpose of reducing the tensile stress generated in the reinforcing plate 3B at the time of peeling, and in the embodiment, the thickness of 0.5 mm is used.

  Further, the adsorbing portion 54 is provided with a seal frame member 62 that surrounds the air-permeable sheet 60 and is in contact with the outer peripheral surface of the reinforcing plate 3B. The seal frame member 62 and the breathable sheet 60 are bonded to the upper surface (the other surface) of the flexible plate 58 via a double-sided adhesive tape 64. Further, the seal frame member 62 is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is configured to be 0.3 mm to 0.5 mm thicker than the thickness of the breathable sheet 60. Has been.

  A frame-shaped groove 66 is provided between the breathable sheet 60 and the seal frame member 62. In addition, a plurality of through holes 68 are opened in the flexible plate 52, and one end of each of these through holes 68 is communicated with the groove 66, and the other end is connected to an intake source via a suction pipe (not shown). (For example, a vacuum pump).

  Therefore, when the intake source is driven, air in the suction pipe, the through hole 68, and the groove 66 is sucked, so that the inner surface of the reinforcing plate 3B of the laminate 6 is vacuum-adsorbed and held on the air-permeable sheet 60. In addition, since the outer peripheral surface of the reinforcing plate 3B is pressed against the seal frame member 62, the sealing performance of the suction space surrounded by the seal frame member 62 is improved.

The flexible plate 52 has higher bending rigidity than the flexible plate 58, the air permeable sheet 60, and the seal frame member 62, and the bending rigidity of the flexible plate 52 dominates the bending rigidity of the peeling unit 42. The bending rigidity per unit width (1 mm) of the peeling unit 42 is preferably 1000 to 40000 N · mm ² / mm. For example, in a portion where the width of the peeling unit 42 is 100 mm, the bending rigidity is 100000 to 4000000 N · mm ² . By setting the bending rigidity of the peeling unit 42 to 1000 N · mm ² / mm or more, it is possible to prevent the reinforcing plate 3B from being bent and held by the peeling unit 42 from being bent. In addition, by setting the bending rigidity of the peeling unit 42 to 40000 N · mm ² / mm or less, the reinforcing plate 3B sucked and held by the peeling unit 42 can be appropriately bent and deformed.

  The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, for example, resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM) resin.

[Movable device 46]
A plurality of disk-shaped movable bodies 44 shown in FIG. 5 are fixed to the lower surface of the flexible plate 52 in a grid pattern as shown in FIG. These movable bodies 44 are fixed to the flexible plate 52 by fastening members such as bolts, but may be bonded and fixed instead of the bolts. These movable bodies 44 are moved up and down independently by a drive device 48 that is driven and controlled by the controller 50.

  That is, the controller 50 controls the driving device 48 to move the movable body 44 located on the corner 6B side in the peeling progress direction indicated by the arrow A from the movable body 44 located on the corner 6A side of the stacked body 6 in FIG. Are sequentially moved downward. By this operation, as shown in the longitudinal sectional view of FIG. 8, the interface 24 of the laminate 6 is peeled off from the peeling start portion 26 (see FIG. 4). In addition, the laminated body 6 shown in FIG. 5, FIG. 8 is the laminated body 6 by which the peeling start parts 26 and 30 were created by the peeling start part preparation method demonstrated in FIG.

  The drive device 48 is composed of, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism. A movable body 44 is provided at the tip of the rod 70 via a ball joint 72. Thereby, the movable body 44 can be tilted following the bending deformation of the peeling unit 42 as shown in FIG. Therefore, the peeling unit 42 can be bent and deformed from the corner 6A toward the corner 6B without applying an excessive force to the peeling unit 42. The drive device 48 is not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

  The plurality of driving devices 48 are preferably attached to a frame 74 that can be raised and lowered via cushion members 76. The cushion member 76 is elastically deformed so as to follow the bending deformation of the peeling unit 42. As a result, the rod 70 tilts with respect to the frame 74.

  The frame 74 is moved downward by a drive unit (not shown) when the peeled reinforcing plate 3B is removed from the peeling unit 42.

  The controller 50 is configured as a computer including a recording medium such as a CPU, a ROM, and a RAM. The controller 50 controls the plurality of driving devices 48 for each of the driving devices 48 by causing the CPU to execute the program recorded on the recording medium, thereby controlling the vertical movement of the plurality of movable bodies 44.

[Peeling method of reinforcing plates 3A and 3B by peeling device 40]
9 (A) to 9 (C) to 10 (A) to 10 (C) show the laminate 6 in which the peeling start portions 26 and 30 are created at the corner 6A by the peeling start portion creating method described in FIG. The peeling method is shown. That is, in the drawing, a peeling method for peeling the reinforcing plates 3A and 3B of the laminate 6 is shown in time series.

  Moreover, the carrying-in work of the laminated body 6 to the peeling apparatus 40 and the carrying-out work of the peeled reinforcing plates 3A and 3B and the panel P are performed by the transport apparatus 80 provided with the suction pad 78 shown in FIG. In FIGS. 9 and 10, the movable device 46 is not shown in order to avoid complexity of the drawings. The panel P is a product panel in which the substrate 2A excluding the reinforcing plates 3A and 3B and the substrate 2B are attached via the functional layer 7.

  FIG. 9A is a side view of the peeling device 40 in which the laminate 6 is placed on the lower peeling unit 42 by the operations indicated by arrows E and F of the conveying device 80. In this case, the position where the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the transfer device 80 is inserted between the lower peeling unit and the upper peeling unit 42. Moved in advance. When the laminated body 6 is placed on the lower peeling unit 42, the lower peeling unit 42 holds the reinforcing plate 3 </ b> B of the laminated body 6 by vacuum suction. That is, FIG. 9A shows an adsorption process in which the reinforcing plate 3B as the second substrate is adsorbed and held by the lower peeling unit 42.

  In FIG. 9B, the lower peeling unit 42 and the upper peeling unit 42 are moved in a relatively approaching direction, and the reinforcing plate 3 </ b> A of the laminated body 6 is vacuum-sucked and held by the upper peeling unit 42. It is a side view of the peeling apparatus 40 in a state. That is, FIG. 9B shows an adsorption process in which the reinforcing plate 3A as the second substrate is adsorbed and held by the upper peeling unit 42.

  When the substrate 2 of the laminate 1 shown in FIG. 1 is peeled from the reinforcing plate 3 by the peeling device 40, the substrate 2 as the first substrate is supported by the upper peeling unit 42 (supporting step). Then, the reinforcing plate 3 as the second substrate is sucked and held by the lower peeling unit 42 (sucking step). In this case, the support part that supports the substrate 2 is not limited to the peeling unit 42, and may be any member that can detachably support the substrate 2. However, since the substrate 2 and the reinforcing plate 3 can be simultaneously bent and peeled by using the peeling unit 42 as the support portion, the peeling force can be increased as compared with a mode in which only the substrate 2 or the reinforcing plate 3 is bent. There is an advantage that can be reduced.

  Returning to FIG. 9, FIG. 9C illustrates that the interface 24 of the laminate 6 starts to be peeled while the lower peeling unit 42 is bent downward and deformed from the corner 6 </ b> A to the corner 6 </ b> B of the laminate 6. It is the side view which showed the state which peels from the part 26 (refer FIG. 4) as the starting point. That is, in the plurality of movable bodies 44 of the lower peeling unit 42 shown in FIG. 8, the movable body 44 positioned on the corner 6B side is sequentially moved downward from the movable body 44 positioned on the corner 6A side of the stacked body 6. The interface 24 is peeled off (peeling step). In conjunction with this operation, in the plurality of movable bodies 44 of the upper peeling unit 42, the movable bodies 44 located on the corner 6B side are sequentially raised from the movable bodies 44 located on the corner 6A side of the stacked body 6. The interface 24 may be peeled off by moving. Thereby, a peeling force can be made small compared with the form which curves only the reinforcement board 3B.

  FIG. 10A is a side view of the peeling apparatus 40 in a state where the interface 24 is completely peeled. According to the figure, the peeled reinforcing plate 3B is vacuum-sucked and held by the lower peeling unit 42, and the laminate 6 (laminate comprising the reinforcing plate 3A and the panel P) excluding the reinforcing plate 3B is the upper peeling unit 42. Is held by vacuum suction.

  Further, the lower peeling unit 42 and the upper peeling unit 42 are relatively sufficiently retracted so that the conveying device 80 shown in FIG. 9A is inserted between the upper and lower peeling units 42. Moved to position.

  After this, first, vacuum suction of the lower peeling unit 42 is released. Next, the reinforcing plate 3B is sucked and held by the suction pad 78 of the transport device 80 via the resin layer 4B. Next, the reinforcing plate 3B is unloaded from the peeling device 40 by the operation of the conveying device 80 indicated by arrows G and H in FIG.

  FIG. 10B is a side view in which the stacked body 6 excluding the reinforcing plate 3B is vacuum-sucked and held by the lower peeling unit 42 and the upper peeling unit 42. That is, the lower peeling unit 42 and the upper peeling unit 42 are moved relatively closer to each other, and the substrate 2B is held by vacuum suction on the lower peeling unit 42 (supporting step).

  FIG. 10C shows the peeling start part 30 (see FIG. 4) while the upper peeling unit 42 is bent upward and deformed upward from the corner 6 </ b> A to the corner 6 </ b> B of the laminated body 6. It is the side view which showed the state which peels from the origin. That is, in the plurality of movable bodies 44 of the upper peeling unit 42 shown in FIG. 8, the movable body 44 located on the corner 6B side is sequentially moved upward from the movable body 44 located on the corner 6A side of the laminate 6. Then, the interface 28 is peeled off (peeling step). In conjunction with this operation, in the plurality of movable bodies 44 of the lower peeling unit 42, the movable bodies 44 positioned on the corner 6B side are sequentially moved from the movable bodies 44 positioned on the corner 6A side of the stacked body 6. The interface 28 may be peeled off by moving downward. Thereby, a peeling force can be made small compared with the form which curves only reinforcement board 3A.

  Thereafter, the reinforcing plate 3A completely peeled from the panel P is taken out from the upper peeling unit 42, and the panel P is taken out from the lower peeling unit 42. The above is the peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were created in the corner 6A.

[Features of peeling device 40]
First, as shown in FIG. 7C, the suction portion 54 is detachably provided on the flexible plate 52 via a double-sided adhesive tape 56.

  Thereby, when exchanging the suction part 54 with respect to the flexible plate 52, it is only necessary to remove the suction part 54 from the flexible plate 52 and attach a new suction part 54 to the flexible member 52. Therefore, the suction part 54 can be easily replaced. Moreover, the non-operation time for replacing | exchanging the adsorption | suction part 54 can be shortened. The suction portion 54 is adhered or fixed to the flexible plate 52 in a removable state. By preparing various adsorbing portions in which the shape of the seal frame member 62 is changed, it is possible to deal with laminated bodies having various sizes and shapes. In particular, it is preferable that the upper suction part 54 can be replaced because the assembly accuracy of the suction part 54 can be increased and the laminates of various sizes and shapes can be peeled in a short time.

  The adhesive force of the double-sided adhesive tape 56 to the suction portion 54 is preferably higher than the adhesive force to the flexible plate 52.

Thereby, when the suction part 54 is replaced, the double-sided adhesive tape 56 is taken out together with the suction part 54. Therefore, when the adhesive force of the double-sided adhesive tape 56 is reduced, it can be easily replaced with a new one. As the double-sided adhesive tape 56, a single-sided re-peeling type having a strongly-bonding surface on one side and a re-peeling surface on the other side is used. It is preferable to adhere to 54 and use. Examples of the double-sided adhesive tape 56 include a double-sided tape (product name # 7686UR) manufactured by Ebisu Kasei Co., Ltd. The means for detachably attaching the suction portion 54 to the flexible plate 52 is not limited to the double-sided adhesive tape 56, and may be detachable by a vacuum suction means.

  Next, as shown in FIGS. 7A and 7B, the adsorbing portion 54 is constituted by the flexible plate 58, the air-permeable sheet 60, and the seal frame member 62.

  That is, when the inner surface of the reinforcing plate 3B is vacuum-sucked by the breathable sheet 60, the outer peripheral surface of the reinforcing plate 3B is brought into close contact with the seal frame member 62, so that air leakage can be prevented, and thus the reinforcing plate 3B is made breathable. The sheet 60 can be reliably vacuum-adsorbed.

  Further, since the air permeable sheet 60 and the seal frame member 62 are configured to be supported by the flexible plate 58, the air permeable sheet 60 and the seal frame member 62 are attached to the flexible plate 58 outside the peeling device 40. Can be assembled accurately.

  Further, since the soft breathable sheet 60 and the seal frame member 62 are supported by the flexible plate 58 having higher rigidity than these, the respective functions can be stably exhibited.

  Next, paying attention to the fact that the suction part 54 can be replaced, the suction part 54 having a size corresponding to the size of the stacked body 6 can be replaced.

  That is, the suction part 54 is prepared in advance in a plurality of sizes according to the size of the stacked body 6, and one suction part selected based on the size of the stacked body 6 is detachable from the flexible plate 52. Installed.

  FIG. 11A is a plan view of the peeling unit 42, and FIG. 11B is an enlarged longitudinal sectional view of the peeling unit 42 along the line DD in FIG. 11A.

  A rectangular reinforcing plate 8 having a smaller size than the reinforcing plate 3B shown in FIG. 7 is adsorbed and held on the adsorbing portion 82 of the peeling unit 42 in FIG. Therefore, the breathable sheet 84 having a size smaller than the breathable sheet 60 shown in FIG. 7 and corresponding to the size of the reinforcing plate 8 is used for the adsorbing portion 82. Further, the adsorbing portion 82 uses a seal frame member 86 having a size larger than that of the seal frame member 62 shown in FIG.

  The breathable sheet 84 and the seal frame member 86 are affixed to the upper surface of the flexible plate 58 via the double-sided adhesive tape 64. When exchanging the suction part, the double-sided adhesive tape 56 is peeled from the flexible plate 52. A frame-shaped groove 88 is provided between the air-permeable sheet 84 and the seal frame member 86, and the groove 88 communicates with the through hole 68. Therefore, the inner surface of the reinforcing plate 8 is vacuum-sucked and held on the air permeable sheet 84, and the outer peripheral surface of the reinforcing plate 8 is pressed against the seal frame member 86.

  As described above, when the suction part is replaced when the size of the reinforcing plate is changed, the replacement of the suction part becomes easy, and the non-operation time for replacing the suction part can be shortened.

  N ... knife, P ... panel, 1 ... laminated body, 1A ... first laminated body, 1B ... second laminated body, 2 ... substrate, 2a ... surface of substrate, 2b ... back surface of substrate, 2A ... substrate, 2Aa ... surface of substrate, 2Ab ... back surface of substrate, 2B ... substrate, 2Ba ... surface of substrate, 2Bb ... back surface of substrate, 3 ... reinforcing plate, 3a ... surface of reinforcing plate, 3b ... back surface of reinforcing plate, 3A ... reinforcing plate 3Aa ... the surface of the reinforcing plate, 3Ab ... the back surface of the reinforcing plate, 3B ... the reinforcing plate, 3Ba ... the surface of the reinforcing plate, 3Bb ... the back surface of the reinforcing plate, 4 ... the resin layer, 4A ... the resin layer, 4B ... the resin layer, 6 ... Laminate, 6A, 6B ... Corner, 7 ... Functional layer, 8 ... Reinforcement plate, 10 ... Peeling start creation device, 12 ... Table, 14 ... Holder, 16 ... Height adjustment device, 18 ... Feeding device, 20 ... liquid, 22 ... liquid supply device, 24 ... interface, 26 ... peeling start part, 28 ... interface, 30 ... peeling open Part, 32, 34 ... peeling start part, 40 ... peeling apparatus, 42 ... peeling unit, 44 ... movable body, 46 ... movable apparatus, 48 ... drive device, 50 ... controller, 52 ... flexible plate, 54 ... adsorption part 56 ... Double-sided adhesive tape, 58 ... Flexible plate, 60 ... Breathable sheet, 62 ... Seal frame member, 64 ... Double-sided adhesive sheet, 66 ... Groove, 68 ... Through-hole, 70 ... Rod, 72 ... Ball joint, 74 ... Frame, 76 ... Cushion member, 78 ... Adsorption pad, 80 ... Conveying device, 82 ... Adsorption part, 84 ... Breathable sheet, 86 ... Seal frame member, 88 ... Groove

Claims (11)

Separation progress with the interface between the first substrate and the second substrate directed from one end to the other end with respect to the laminate in which the first substrate and the second substrate are detachably attached. In the peeling device of the laminate that peels sequentially along the direction,
A support part for supporting the first substrate of the laminate;
A plate-like first flexible member, and a peeling unit that is detachably attached to the first flexible member and includes an adsorption portion that adsorbs the second substrate of the laminate;
A drive unit that deforms the peeling unit so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side;
A laminate peeling apparatus comprising:   The peeling device for a laminate according to claim 1, wherein the support portion has the same configuration as the peeling unit. The adsorption part is
A plate-like second flexible member having one surface detachably provided on the first flexible member;
A breathable sheet provided on the other surface of the second flexible member and vacuum-adsorbing the inner surface of the second substrate;
A seal frame member provided on the other surface of the second flexible member so as to surround the breathable sheet, and contacting an outer peripheral surface excluding an inner surface of the second substrate;
The peeling apparatus of the laminated body of Claim 1 or 2 which has these. The suction portion is detachably provided to the first flexible member via a double-sided adhesive tape,
The peeling apparatus of the laminated body of Claim 1, 2, or 3 with which the adhesive force with respect to the said adsorption | suction part of the said double-sided adhesive tape is higher than the adhesive force with respect to a said 1st flexible member.   A plurality of sizes of the adsorbing portion according to the size of the laminated body are arranged, and one adsorbing portion selected based on the size of the laminated body is detachable from the first flexible member. The peeling apparatus of the laminated body of any one of Claim 1 to 4 with which it mounts | wears. Separation progress with the interface between the first substrate and the second substrate directed from one end to the other end with respect to the laminate in which the first substrate and the second substrate are detachably attached. In the peeling method of the laminate that peels sequentially along the direction,
A supporting step of supporting the first substrate of the laminate by a support portion;
Using the plate-shaped first flexible member, and a peeling unit that is detachably attached to the first flexible member and includes a suction portion that sucks the second substrate of the laminate, the suction unit An adsorption step of adsorbing the second substrate of the laminate by a portion;
A peeling step of peeling the interface by deforming the peeling unit by a driving unit so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side;
A method for peeling a laminate, comprising:   The laminate peeling method according to claim 6, wherein, in the supporting step, the first substrate is supported using the support portion having the same configuration as the peeling unit in the adsorption step.   A plurality of sizes of the adsorbing portion according to the size of the laminated body are arranged, and one adsorbing portion selected based on the size of the laminated body is detachable from the first flexible member. The peeling method of the laminated body of Claim 6 or 7 with which it mounts | wears. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate with respect to a laminate in which the first substrate and the second substrate made of glass are detachably attached; and the functional layer Separating the second substrate from the first substrate on which is formed, and a method for manufacturing an electronic device comprising:
The separation step includes
A supporting step of supporting the first substrate of the laminate by a support portion;
Using the plate-shaped first flexible member, and a peeling unit that is detachably attached to the first flexible member and includes a suction portion that sucks the second substrate of the laminate, the suction unit An adsorption step of adsorbing the second substrate of the laminate by a portion;
Peeling that peels off the second substrate from the first substrate by deforming the peeling unit with a driving unit so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side. Process,
An electronic device manufacturing method comprising:   10. The method of manufacturing an electronic device according to claim 9, wherein in the supporting step, the first substrate is supported using the supporting portion having the same configuration as that of the peeling unit in the adsorption step.   A plurality of sizes of the adsorbing portion according to the size of the laminated body are arranged, and one adsorbing portion selected based on the size of the laminated body is detachable from the first flexible member. The manufacturing method of the electronic device of Claim 9 or 10 with which it mounts | wears.

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