CN105270909B - The stripping off device and stripping means of laminated body and the manufacturing method of electronic device - Google Patents
The stripping off device and stripping means of laminated body and the manufacturing method of electronic device Download PDFInfo
- Publication number
- CN105270909B CN105270909B CN201510303612.2A CN201510303612A CN105270909B CN 105270909 B CN105270909 B CN 105270909B CN 201510303612 A CN201510303612 A CN 201510303612A CN 105270909 B CN105270909 B CN 105270909B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- substrate
- laminated body
- stripping
- adsorption section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The present invention provides a kind of manufacturing method of the stripping off device and stripping means and electronic device of laminated body.The stripping off device of above-mentioned laminated body in a manner of it can remove for pasting laminated body made of the 1st substrate and the 2nd substrate, interface between above-mentioned 1st substrate and above-mentioned 2nd substrate is removed successively along the stripping direction of travel from one end towards another side, including：Supporting part supports above-mentioned 1st substrate of above-mentioned laminated body；Stripping unit, it includes the 1st flexure member of adsorption section and plate, which is set to above-mentioned 1st flexure member by loading and unloading freely, above-mentioned 2nd substrate for adsorbing above-mentioned laminated body；And driving portion, so that above-mentioned stripping unit is deformed, so that above-mentioned 2nd substrate of above-mentioned laminated body is from one end towards another side successively deflection deformation.
Description
Technical field
The present invention relates to the manufacturing methods of the stripping off device of laminated body and stripping means and electronic device.
Background technology
With the slimming of the electronic devices such as display panel, solar cell, thin-film secondary battery, lightness, it is expected that answering
The thin plate of the substrates such as glass plate, resin plate, metallic plate for these electronic devices (the 1st substrate).
However, if the thickness of substrate is thinning, the treatability of substrate deteriorates, accordingly, it is difficult to form electricity on the surface of the substrate
Functional layer (thin film transistor (TFT) (the TFT of sub- device：Thin Film Transistor) and colour filter (CF：Color
Filter))。
Therefore, motion has a kind of following manufacturing method of electronic device：The reinforcement of glass system is pasted on the back of the substrate
Plate (the 2nd substrate) reinforces the laminated body of substrate to constitute using reinforcing plate, and in the state of laminated body on the surface of the substrate
Form functional layer.In this manufacturing method, the treatability of substrate improves, therefore can form function well on the surface of the substrate
Layer.Moreover, reinforcing plate self-reference substrate can be removed after forming functional layer.
The stripping means of reinforcing plate disclosed in patent document 1, by from the diagonal line of rectangular-shaped laminated body
Two corners in a corner towards another corner make reinforcing plate or substrate or their twocoueses separated from each other
Direction flexible deformation carries out.At this point, in order to make stripping be smoothed out, stripping beginning portion is made in a corner of laminated body.
It is by hoe scaler is inserted into predetermined amount into the interface between substrate and reinforcing plate from the end face of laminated body to remove beginning portion
It makes.
The stripping off device of patent document 1 includes objective table, flexure member and sucker etc., is adsorbed and is protected using objective table
Substrate is held, reinforcing plate is adsorbed and kept using flexure member, so that flexure member is become from side towards other side flexibility using sucker
Shape, thus by reinforcing plate from strippable substrate.
Flexure member includes the mounting portion (adsorption section) of rubber system and the limit of the flexural rigidity for limiting flexure member
Determine portion, the groove portion of mounting portion is connected to the through hole of limited section, under the action of being connected to the attraction of vacuum pump of through hole,
So that reinforcing plate is adsorbed and is held in mounting portion.
Patent document 1：International Publication No. 2011/024689
Invention content
Problems to be solved by the invention
In the stripping off device of patent document 1, in the mounting portion deterioration or mounting portion damage for making rubber system because using
In the case of, it need to be replaced as unit of limited section, thus and uneconomical.In the case where being changed without limited section, need to will install
Portion is removed from limited section, and new mounting portion is arranged on limited section, thus there is also the replacement operations to spend asking for effort
Topic.
The present invention is to be made in view of this problem, and its purpose is to provide readily replaceable for adsorbing and keeping
The manufacturing method of stripping off device and stripping means and electronic device of the adsorption section of the substrate of laminated body, laminated body.
The solution to the problem
In order to achieve the above objectives, the stripping off device of laminated body of the invention is, for being pasted in a manner of it can remove
Laminated body made of 1st substrate and the 2nd substrate, interface between above-mentioned 1st substrate and above-mentioned 2nd substrate is along from one end
It is removed successively towards the stripping direction of travel of another side, which is characterized in that the stripping off device of the laminated body includes：Bearing
Portion supports above-mentioned 1st substrate of above-mentioned laminated body；Stripping unit, it includes the 1st flexure members of adsorption section and plate, should
Adsorption section is set to above-mentioned 1st flexure member by loading and unloading freely, above-mentioned 2nd substrate for adsorbing above-mentioned laminated body；
And driving portion, so that above-mentioned stripping unit is deformed, so that above-mentioned 2nd substrate of above-mentioned laminated body is from one end towards the other end
Side deflection deformation successively.
In order to achieve the above objectives, the stripping means of laminated body of the invention is, for being pasted in a manner of it can remove
Laminated body made of 1st substrate and the 2nd substrate, interface between above-mentioned 1st substrate and above-mentioned 2nd substrate is along from one end
It is removed successively towards the stripping direction of travel of another side, which is characterized in that the stripping means of the laminated body includes：Bearing
Process supports above-mentioned 1st substrate of above-mentioned laminated body using supporting part；Absorption process uses stripping unit, the stripping unit packet
The 1st flexure member containing adsorption section and plate, the adsorption section are set to above-mentioned 1st flexure member by loading and unloading freely, use
In above-mentioned 2nd substrate for adsorbing above-mentioned laminated body, above-mentioned 2nd substrate of above-mentioned laminated body is adsorbed using above-mentioned adsorption section；And
Stripping process makes above-mentioned stripping unit deform using driving portion, so that above-mentioned 2nd substrate of above-mentioned laminated body is from one end direction
The mode of another side deflection deformation successively is at above-mentioned interface make above-mentioned 2nd strippable substrate of above-mentioned laminated body.
In order to achieve the above objectives, the manufacturing method of electronic device of the invention includes：Functional layer formation process, for
The mode that can be removed pastes laminated body made of the 1st substrate and the 2nd substrate, and work(is formed in the exposure of above-mentioned 1st substrate
Ergosphere；And separation process, detach above-mentioned 2nd substrate from above-mentioned 1st substrate for being formed with above-mentioned functional layer, which is characterized in that
Above-mentioned separation process includes：Process is supported, above-mentioned 1st substrate of above-mentioned laminated body is supported using supporting part；Absorption process uses
Stripping unit, the stripping unit include the 1st flexure member of adsorption section and plate, which is arranged by loading and unloading freely
In above-mentioned 1st flexure member, above-mentioned 2nd substrate for adsorbing above-mentioned laminated body adsorbs above-mentioned stacking using above-mentioned adsorption section
Above-mentioned 2nd substrate of body；And stripping process, so that above-mentioned stripping unit is deformed using driving portion, so that above-mentioned laminated body is upper
The 2nd substrate is stated from one end towards another side successively deflection deformation, to make above-mentioned 2nd substrate from above-mentioned 1st strippable substrate.
According to the present invention, adsorption section is set to the 1st flexure member by loading and unloading freely, therefore, is replacing adsorption section
When, adsorption section is taken out from the 1st flexure member, and new adsorption section is mounted on the 1st flexure member.Thus, adsorption section
Exchange becomes easy.In addition, the non-duration of runs for replacing adsorption section can be shortened.
Preferably, above-mentioned supporting part of the invention is identical structure with above-mentioned stripping unit.Namely it is preferred that this hair
It is bright to be propped up using with the mutually isostructural above-mentioned supporting part of above-mentioned stripping unit in above-mentioned absorption process in above-mentioned bearing process
Hold above-mentioned 1st substrate.
According to this structure, make that the 1st substrate is adsorbed and kept with the mutually isostructural supporting part of stripping unit, make stripping list
Member and supporting part deformation, so that the 1st substrate and the 2nd substrate be from one end towards another side successively deflection deformation, to by the 1st
It is removed between substrate and the 2nd substrate.In this case, make the 1st substrate and the 2nd substrate while being bent, therefore, compared to only making one
The mode of substrate bending, can reduce peeling force.
Preferably, above-mentioned adsorption section of the invention includes：2nd flexure member of plate, one side is with detachable
Mode be set to above-mentioned 1st flexure member；Gas permeability thin slice is set to the another side of above-mentioned 2nd flexure member, vacuum
Adsorb the inner surface of above-mentioned 2nd substrate；And sealing frame component, it is set in a manner of surrounding above-mentioned gas permeability thin slice above-mentioned
The above-mentioned another side of 2nd flexure member is in contact with the peripheral surface in addition to above-mentioned inner surface of above-mentioned 2nd substrate.
According to this structure, when the inner surface of the 2nd substrate is by gas permeability thin slice vacuum suction, the periphery of the 2nd substrate
Face is sealed at sealing frame component, thus can make the 2nd substrate reliably vacuum suction in gas permeability thin slice.In addition, due to make
Gas permeability thin slice and sealing frame member supporting are in the structure of the another side of the 2nd flexure member, therefore, it is possible to outside stripping off device
Gas permeability thin slice and sealing frame component are accurately assembled in the 2nd flexure member by portion.Moreover, soft gas permeability thin slice and close
Envelope frame component is supported in the 2nd flexure member that rigidity is higher than gas permeability thin slice and sealing frame component, therefore, it is possible to steadily send out
Wave respective function.Furthermore it is also possible to instead of vacuum suction, and Electrostatic Absorption or bonding are utilized, but it is relatively strong in order to obtain
Adsorption capacity, preferred vacuum suction.
Preferably, above-mentioned adsorption section of the invention is arranged across double-sided adhesive tape above-mentioned the by loading and unloading freely
On 1 flexure member, the bonding force to above-mentioned adsorption section of above-mentioned double-sided adhesive tape is higher than above-mentioned double-sided adhesive tape to the above-mentioned 1st
The bonding force of flexure member.
According to above-mentioned such structure, when replacing adsorption section, since double-sided adhesive tape is removed together with adsorption section, because
This, is in the case where the bonding force of double-sided adhesive tape reduces, the adsorption section that easily can more renew.It is preferable to use sides to have
Strong bonding plane, the other side have again the single side of release surface exfoliated double-sided adhesive tape again, so that release surface and the 1st flexure member again
It is bonded and the strong bonding plane mode Nian Jie with adsorption section uses.
Preferably, above-mentioned adsorption section of the invention has the suction of multiple sizes corresponding with the size of above-mentioned laminated body
Attached portion, it is flexible that the adsorption section selected according to the size of above-mentioned laminated body is installed on the above-mentioned 1st by loading and unloading freely
Component.
According to above-mentioned feature, prepare the adsorption section of multiple sizes corresponding with the size of laminated body, in laminated body
When dimension modifying, an adsorption section corresponding with the size of the laminated body is selected to be replaced.Become with such size
When more replacing adsorption section, also become easy the replacement of adsorption section, in addition, the non-operating for replacing adsorption section can be shortened
Time.
The effect of invention
The stripping off device and stripping means of laminated body using the present invention and the manufacturing method of electronic device, readily replaceable use
In absorption and the adsorption section of the substrate of retaining layer stack.
Description of the drawings
Fig. 1 is to indicate that the main portions Zoom Side of an example of the laminated body supplied to the manufacturing process of electronic device regards
Figure.
Fig. 2 is the main portions Zoom Side for the example for indicating the laminated body made by the midway of the manufacturing process of LCD
View.
(E) of (A)~Fig. 3 of Fig. 3 is the making side of stripping beginning portion for indicating to carry out using stripping beginning portion producing device
The definition graph of method.
Fig. 4 is the vertical view for the laminated body that stripping beginning portion has been made using stripping beginning portion production method.
Fig. 5 is the longitudinal section view of the structure for the stripping off device for indicating embodiment.
Fig. 6 is the vertical view for schematically showing multiple movable bodys relative to the flex plate of the allocation position of stripping unit.
(C) of (A)~Fig. 7 of Fig. 7 is the definition graph for the structure for indicating stripping unit.
Fig. 8 is the longitudinal section view in the stripping off device of the interface peel reinforcing plate of laminated body.
(C) of (A)~Fig. 9 of Fig. 9 is to indicate that stripping beginning portion production method will be utilized to have made stripping in chronological order
The definition graph of the stripping means of the reinforcing plate of the stripping laminated body in beginning portion.
(C) of (A)~Figure 10 of Figure 10 is that then Fig. 9 indicates the stripping for removing the reinforcing plate of laminated body in chronological order
The definition graph of method.
(A) of Figure 11 and (B) of Figure 11 are the definition graphs of the other modes for the adsorption section for indicating stripping unit.
Specific implementation mode
Hereinafter, illustrating embodiments of the present invention with reference to the accompanying drawings.
Hereinafter, explanation uses the stripping off device and stripping means of the laminated body of the present invention in the manufacturing process of electronic device
The case where.
Electronic device refers to the electronic components such as display panel, solar cell, thin-film secondary battery.As display panel,
Liquid crystal display (LCD can have been illustrated：Liquid Crystal Display) panel, plasma display device (PDP：
Plasma Display Panel) and organic el display (OELD：Organic Electro Luminescence
Display) panel.
The manufacturing process of electronic device
Electronic device forms the function of electronic device by the surface of the substrate in glass system, resin system, made of metal etc.
Layer (being then thin film transistor (TFT) (TFT), colour filter (CF) if LCD) manufactures.
Before forming functional layer, the back side of aforesaid substrate is made to be pasted on reinforcing plate and be configured to laminated body.Later, in layer
In the state of stack, functional layer is formed on the surface of the substrate.Then, after forming functional layer, reinforcing plate self-reference substrate is made to remove.
That is, in the manufacturing process of electronic device, including：Functional layer is formed on the surface of the substrate in the state of laminated body
Functional layer formation process and the active ergosphere of self-forming substrate separation reinforcing plate separation process.The separation process can answer
With the stripping off device and stripping means of the laminated body of the present invention.
Laminated body 1
Fig. 1 is the main portions enlarged side view for the example for indicating laminated body 1.
Laminated body 1 includes the substrate (the 1st substrate) 2 for being formed with functional layer and the reinforcing plate the (the 2nd for reinforcing the substrate 2
Substrate) 3.In addition, reinforcing plate 3 includes the resin layer 4 as adsorption layer on the 3a of surface, substrate 2 is pasted on resin layer 4
Back side 2b.That is, substrate 2 utilizes the bonding force in its Van der Waals force or resin layer 4 that are acted between resin layer 4 across resin
Layer 4 is pasted on reinforcing plate 3 in a manner of it can remove.
Substrate 2
It is formed with functional layer in the surface 2a of substrate 2.As substrate 2, glass substrate, ceramic substrate, resin can be illustrated
Substrate, metal substrate, semiconductor substrate.Among these substrates, due to the chemical resistance of glass substrate, resistance to excellent moisture permeability and
Linear expansion coefficient is smaller, therefore, is suitable as the substrate 2 of electronic device.In addition, since linear expansion coefficient becomes smaller, also
Have the advantages that the pattern of the functional layer formed at high temperature is difficult to deviate while cooling.
As the glass of glass substrate, can illustrate alkali-free glass, pyrex, soda-lime glass, high silica glass, its
He with silica oxide system glass as main component.The content of silica of the oxide system glass preferably in terms of oxide
For the glass of 40 mass of mass %~90 %.
Glass as glass substrate, it is preferred that select and apply the type for being suitable for manufactured electronic device
Glass or the glass for being suitable for its manufacturing process.For example, the glass substrate of liquid crystal board is preferably, using being substantially free of
The glass (alkali-free glass) of alkali metal component.
The thickness of substrate 2 is set according to the type of substrate 2.For example, in the case where substrate 2 is using glass substrate,
Lightness, thin plate for electronic device, the thickness of substrate 2 are preferably set to 0.7mm hereinafter, being more preferably set in 0.3mm
Hereinafter, being further preferably set in 0.1mm or less.Thickness in substrate 2 is below in 0.3mm, can assign glass
Substrate good flexibility.Moreover, the thickness in substrate 2 is below in 0.1mm, it is web-like that can roll up glass substrate,
From the viewpoint of the processing of the viewpoint of the manufacture of glass substrate and glass substrate, the thickness of preferable substrate 2 0.03mm with
On.
In addition, in Fig. 1, substrate 2 is made of a substrate, but substrate 2 can also be made of multiple substrates.That is, substrate 2
It can also be by laminated body made of the stacking of multiple substrates be constituted.In this case, constituting the aggregate thickness of all substrates of substrate 2
As the thickness of substrate 2.
Reinforcing plate 3
As reinforcing plate 3, glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate can have been illustrated.
The thickness of reinforcing plate 3 is set in 0.7mm hereinafter, being set according to the type for the substrate 2 reinforced, thickness etc..
In addition, the thickness of reinforcing plate 3 can both might be less that the thickness of substrate 2 more than the thickness of substrate 2, but in order to reinforce substrate 2,
The thickness of reinforcing plate 3 is preferably in 0.4mm or more.
In addition, in the present embodiment, reinforcing plate 3 is made of a substrate, but reinforcing plate 3 can also be by by multiple substrate layers
Laminated body made of folded is constituted.In this case, the aggregate thickness for constituting all substrates of reinforcing plate 3 becomes the thickness of reinforcing plate 3.
Resin layer 4
It is peeling-off between resin layer 4 and reinforcing plate 3 in order to prevent, and by the combination between resin layer 4 and reinforcing plate 3
Power is set to higher than the binding force between resin layer 4 and substrate 2.As a result, in stripping process, make substrate 2 in resin layer 4 and base
Interface peel between plate 2.
The resin for constituting resin layer 4 is not particularly limited, and can there are acrylic resin, vistanex, polyurethane
Resin, polyimide resin, organic siliconresin and polyimides organic siliconresin.Several resins can also be used in mixed way.Its
In, from the viewpoint of heat resistance, fissility, preferably organic siliconresin and polyimides organic siliconresin.
The thickness of resin layer 4 is not particularly limited, and is preferably set to 1 μm~50 μm, is more preferably set as 4 μm~20 μm.
The thickness of resin layer 4 is set in 1 μm or more, thus when being mixed into bubble, foreign matter between resin layer 4 and substrate 2, Neng Gouli
The thickness of bubble, foreign matter is absorbed with the deformation of resin layer 4.On the other hand, by the thickness of resin layer 4 be located at 50 μm hereinafter, to
The formation time of resin layer 4 can be shortened, and need not excessively use the resin of resin layer 4, therefore is more economical.
In addition, in order to enable reinforcing plate 3 to support entire resin layer 4, the shape of resin layer 4 is preferably and reinforcing plate 3
Shape of the shape identical or less than reinforcing plate 3.In addition, in order to keep resin layer 4 and entire substrate 2 closely sealed, the shape of resin layer 4 is excellent
It is selected as shape identical as the shape of substrate 2 or more than substrate 2.
In addition, in Fig. 1, resin layer 4 is constituted by one layer, but resin layer 4 can also be constituted by two layers or more.The situation
Under, constituting all layers of total thickness of resin layer 4 becomes the thickness of resin layer.In addition, in this case, constituting the tree of each layer
The type of fat can also be different.
Moreover, in the present embodiment, having used organic film i.e. resin layer 4 to be used as adsorption layer, inorganic layer can also be used
To replace resin layer 4.The inoranic membrane of inorganic layer is constituted for example containing from including metal silicide, nitride, carbide and carbon
At least one selected in the group of nitride.
Moreover, the laminated body 1 of Fig. 1 includes the resin layer 4 as adsorption layer, but laminated body 1 can not also include resin layer 4
And it is made of substrate 2 and reinforcing plate 3.In this case, made using the Van der Waals force etc. acted between substrate 2 and reinforcing plate 3
Substrate 2 and reinforcing plate 3 are pasted in a manner of it can remove.In addition, in the case where substrate 2 and reinforcing plate 3 are glass substrate, it is
So that substrate 2 and reinforcing plate 3 is not bonded at high temperature, preferably forms inorganic thin film in the surface 3a of reinforcing plate 3.
It is formed with the laminated body 6 of the embodiment of functional layer
Via functional layer formation process to which the surface 2a of the substrate 2 in laminated body 1 is formed with functional layer.As functional layer
Forming method, CVD (Chemical Vapor Deposition can be used：Chemical vapor deposition) method and PVD
(Physical Vapor Deposition：Physical vapour deposition (PVD)) method etc. vapour deposition method, sputtering method.Functional layer using photoetching process,
Etching method is formed as scheduled pattern.
Fig. 2 is illustrated in the main portion of an example of the rectangular-shaped laminated body 6 of the midway of the manufacturing process of LCD making
Position enlarged side view.
Laminated body 6 includes reinforcing plate 3A, resin layer 4A, substrate 2A, functional layer 7, substrate 2B, resin layer 4B and reinforcing plate
3B is simultaneously formed so that above-mentioned sequential layer is folded.That is, the laminated body 6 of Fig. 2 is equivalent to laminated body 1 shown in FIG. 1 to clip the side of functional layer 7
Laminated body made of formula balanced configuration.Hereinafter, the laminated body including substrate 2A, resin layer 4A and reinforcing plate 3A is known as the 1st
Laminated body including substrate 2B, resin layer 4B and reinforcing plate 3B is known as the 2nd laminated body 1B by laminated body 1A.
It is formed with the thin film transistor (TFT) (TFT) as functional layer 7 in the surface 2Aa of the substrate 2A of the 1st laminated body 1A,
The surface 2Ba of the substrate 2B of 2 laminated body 1B is formed with the colour filter (CF) as functional layer 7.
1st laminated body 1A and the 2nd laminated body 1B is by making the surface 2Aa of substrate 2A, the surface 2Ba of substrate 2B mutually coincide
And it is integrated.The 1st laminated body 1A and the 2nd laminated body the 1B construction of balanced configuration in a manner of clipping functional layer 7 are manufactured as a result,
Laminated body 6.
After laminated body 6 forms stripping beginning portion in the stripping beginning portion production process of separation process using knife, detaching
Reinforcing plate 3A, 3B is removed in the stripping process of process successively, later, installation polarizing film, backlight etc., to be manufactured as product
LCD.
Remove beginning portion producing device 10
(E) of (A)~Fig. 3 of Fig. 3 is to indicate that the stripping beginning portion carried out using stripping beginning portion producing device 10 is made
(A) of the definition graph of method, Fig. 3 is the definition graph for indicating the position relationship between laminated body 6 and knife N, and (B) of Fig. 3 is to utilize
Knife N makes the definition graph in stripping beginning portion 26 at interface 24, and (C) of Fig. 3 is to indicate that stripping beginning portion will be made at interface 28
The definition graph of 30 state, (D) of Fig. 3 are to make the definition graph in stripping beginning portion 30 at interface 28 using knife N, and (E) of Fig. 3 is
The definition graph of the laminated body 6 in stripping beginning portion 26,30 is made.In addition, Fig. 4 is the stacking for having made stripping beginning portion 26,30
The vertical view of body 6.
When making stripping beginning portion 26,30, as shown in (A) of Fig. 3, the back side 3Bb of the reinforcing plate 3B of laminated body 6 is adsorbed
And it is held in workbench 12 and is supported to horizontal (X-direction in figure).
Knife N is supported in such a way that point of a knife is opposite with the end face of corner 6A of laminated body 6 as level by holder 14.In addition,
Positions of the knife N in short transverse (Z-direction in attached drawing) is adjusted using height adjuster 16.In addition, utilizing ball-screw
The conveying devices such as device 18 make knife N and laminated body 6 relatively move in the horizontal direction.Conveying device 18 makes knife N and workbench 12
At least one of in the horizontal direction move, in embodiments, make knife N move.In addition, being configured in the top of knife N
Upper surface for the knife N to before being inserted into or in being inserted into supplies the fluid Supplying apparatus 22 of liquid 20.
Remove beginning portion production method
In the stripping beginning portion production method carried out using stripping beginning portion producing device 10, by the insertion position of knife N
It is set in the position being overlapped on the thickness direction of laminated body 6 in the corner 6A of laminated body 6, and the insertion of knife N is set
It is set to according to each interface 24,28 and different.
Illustrate the making step of the stripping beginning portion production method.
In the initial state, the point of a knife of knife N is located relative between the 1st insertion position, i.e. substrate 2B and resin layer 4B
The position that interface 24 deviates in short transverse (Z-direction).Therefore, first, as shown in (A) of Fig. 3, make knife N in height side
It moves up, the height of the point of a knife of knife N is set in the height at interface 24.
Then, as shown in (B) of Fig. 3, knife N is made to be moved horizontally towards the corner 6A of laminated body 6, knife N is inserted to interface 24
Enter predetermined amount.In addition, when being inserted into knife N or before being inserted into knife N, liquid 20 is supplied from fluid Supplying apparatus 22 to the upper surface of knife N.
The substrate 2B of corner 6A is removed from resin layer 4B as a result, therefore, as shown in figure 4, producing vertical view triangular shape at interface 24
Stripping beginning portion 26.In addition, liquid 20 must be not necessarily supplied, but if if using liquid 20, even if knife N is extracted it
Liquid 20 can remain in stripping beginning portion 26 afterwards, therefore, it is possible to make the stripping beginning portion 26 that can not adhere to again.
Then, knife N is extracted in the horizontal direction from corner 6A, as shown in (C) of Fig. 3, the point of a knife of knife N is set in the 2nd and inserts
Enter the height at the interface 28 between position, i.e. substrate 2A and resin layer 4A.
Then, as shown in (D) of Fig. 3, knife N is made to be moved horizontally towards laminated body 6, knife N is inserted into predetermined amount to interface 28.
Similarly, liquid 20 is supplied from fluid Supplying apparatus 22 to the upper surface of knife N.As a result, as shown in (E) of Fig. 3, made at interface 28
Make stripping beginning portion 30.Here, knife N is set as being less than insertions of the knife N relative to interface 24 relative to the insertion at interface 28.With
Upper is stripping beginning portion production method.Alternatively, it is also possible to by knife N relative to the insertion at interface 24 be set as be less than knife N relative to
The insertion at interface 28.
The laminated body 6 for having made stripping beginning portion 26,30 is taken out since portion's producing device 10 stripping, after being delivered to
The stripping off device stated removes reinforcing plate 3B, 3A at interface 24,28 successively using stripping off device.
The detailed content of aftermentioned stripping means makes laminated body 6 from corner 6A directions and corner 6A as shown in the arrow A of Fig. 4
Opposite corner 6B is bent, and is with the stripping beginning portion 26 for removing the larger interface 24 of the area in beginning portion 26 at first as a result,
Point is removed.Stripping reinforcing plate 3B as a result,.Then, laminated body 6 is made to be bent again from corner 6A towards corner 6B, thus with
The stripping beginning portion 30 at the smaller interface 28 of area in stripping beginning portion 30 is that starting point is removed.Stripping reinforcing plate 3A as a result,.
In addition, the insertion of knife N is preferably set to 7mm or more according to the size of laminated body 6, be more preferably set in 15mm~
20mm or so.
Stripping off device 40
Fig. 5 is the longitudinal section view of the structure for the stripping off device 40 for indicating embodiment, Fig. 6 be schematically show it is multiple can
Vertical view of the kinetoplast 44 relative to the stripping unit 42 of the allocation position of the stripping unit 42 of stripping off device 40.In addition, Fig. 5 is suitable
In the sectional view of the line B-B along Fig. 6, in addition, indicating laminated body 6 in figure 6 with solid line.
Stripping off device 40 shown in fig. 5 includes being configured in a manner of laminated body 6 is clamped above and below laminated body 6
A pair of of movable device 46,46.Movable device 46,46 is therefore identical structure illustrates to configure in the movable of the downside of Fig. 5 herein
Device 46, the movable device 46 to configuration in upside mark identical reference numeral and omit the description.
Movable device 46 makes the multiple of 44 lifting moving of movable body including multiple movable bodys 44, according to each movable body 44
Driving device (driving portion) 48 and controlled the driving device according to each driving device 48 48 controller 50 (driving portion)
Deng.
In order to make reinforcing plate 3B flexible deformations, 42 vacuum suction of stripping unit simultaneously keep reinforcing plate 3B.In addition, instead of vacuum
Absorption, can also use Electrostatic Absorption or magnetic suck.
Stripping unit 42
(A) of Fig. 7 is the vertical view of stripping unit 42, and (B) of Fig. 7 is the stripping unit 42 along the line C-C of Fig. 7 (A)
Amplification longitudinal section view.In addition, (C) of Fig. 7 be indicate constitute stripping unit 42 adsorption section 54 across double-sided adhesive tape 56 with
Detachable mode is set to the flex plate (the 1st flexure member) 52 of the plate for the rectangle for constituting stripping unit 42, stripping
The amplification longitudinal section view of unit 42.
It is installed by loading and unloading freely across double-sided adhesive tape 56 as it appears from the above, stripping unit 42 is configured to adsorption section 54
In flex plate 52.
Adsorption section 54 includes the flex plate (the 2nd flexure member) 58 that thickness is less than the thickness of flex plate 52.The flex plate 58
Lower surface (one side) be installed on the upper surface of flex plate 52 by loading and unloading freely across double-sided adhesive tape 56.
In addition, adsorption section 54 have for adsorb and retaining layer stack 6 reinforcing plate 3B inner surface rectangle breathe freely
Property thin slice 60.In order to reduce the tensile stress that is generated on reinforcing plate 3B in stripping, the thickness of gas permeability thin slice 60 2mm with
Under, preferably in 1mm hereinafter, using the gas permeability thin slice 60 of 0.5mm in embodiments.
Moreover, adsorption section 54 has, to surround gas permeability thin slice 60 and the sealing frame structure that is abutted against with the peripheral surface of reinforcing plate 3B
Part 62.Sealing frame component 62 and gas permeability thin slice 60 are adhered to the upper surface (other side of flex plate 58 across double-sided adhesive tape 64
Face).In addition, sealing frame component 62 be Shore E hardness (シ ョ ア E hardness) at 20 degree or more and in the sea of 50 degree of closed pores below
Continuous body, thickness are set as thickness thickness 0.3mm~0.5mm relative to gas permeability thin slice 60.
The slot 66 with frame-shaped between gas permeability thin slice 60 and sealing frame component 62.In addition, being open on flex plate 52
There are multiple through holes 68, one end of these through holes 68 is connected to slot 66, and the other end is through not shown suction pipeline and air-breathing
Source (such as vacuum pump) connects.
Thus, when driving above-mentioned source of suction, the air of above-mentioned suction pipeline, through hole 68 and slot 66 is attracted, from
And make the inner surface vacuum suction of the reinforcing plate 3B of laminated body 6 and be held in gas permeability thin slice 60, in addition, due to reinforcing plate 3B's
Peripheral surface is pressed and is connected to sealing frame component 62, therefore, it is possible to improve the adsorption space surrounded by sealing frame component 62
Seal.
The flexural rigidity of flex plate 52 is rigid higher than the bending of flex plate 58, gas permeability thin slice 60 and sealing frame component 62
Property, the flexural rigidity of flex plate 52 determines the flexural rigidity of stripping unit 42.The per unit width (1mm) of stripping unit 42 it is curved
Qu Gang property is preferably 1000Nmm2/ mm~40000Nmm2/mm.For example, stripping unit 42 width be 100mm portion
Point, flexural rigidity 100000Nmm2/ mm~4000000Nmm2.By the way that the flexural rigidity of stripping unit 42 is located at
1000N·mm2/ mm or more can prevent the bending for the reinforcing plate 3B for adsorbing and being held in stripping unit 42.In addition, pass through by
The flexural rigidity of stripping unit 42 is located at 40000Nmm2/ mm is hereinafter, can make absorption and be held in the reinforcement of stripping unit 42
Plate 3B suitably deflection deformations.
Flex plate 52,58 is Young's modulus in 10GPa resinous members below, for example, polycarbonate resin, polychlorostyrene
The resinous members such as ethylene (PVC) resin, acrylic resin, polyacetals (POM) resin.
Movable device 46
Discoid multiple movable bodys 44 shown in fig. 5 are with gridiron pattern (Acer Disk mesh shown in fig. 6) shape is fixed on flex plate
52 lower surface.These movable bodys 44 are fixed on flex plate 52 using fastening members such as bolts, can also be used instead of bolt
It is adhesively fixed.These movable bodys 44 utilize the driving device 48 for being driven and being controlled by controller 50 independently lifting moving.
That is, controller 50 controls the driving device 48, make from the position of the corner sides 6A for the laminated body 6 being located in Fig. 6 can
The movable body 44 that the position positioned at the corner sides 6B of direction of travel is removed shown in kinetoplast 44 to arrow A declines movement successively.Root
According to the action, as shown in the longitudinal section view of Fig. 8, stacking is peeled away for starting point at interface 24 to remove beginning portion 26 (with reference to Fig. 4)
The reinforcing plate 3B of body 6.In addition, Fig. 5, laminated body shown in Fig. 86 are to utilize stripping beginning portion illustrated in fig. 3 production method system
The laminated body 6 in stripping beginning portion 26,30 is made.
Driving device 48 includes such as revolving servo motor and ball screw framework.The rotary motion of servo motor
Linear motion is converted under the action of ball screw framework, is transferred to the bar 70 of ball screw framework.In the top end part of bar 70
It is equipped with movable body 44 across spherojoint 72.Thereby, it is possible to so that movable body 44 is followed the flexible deformation of stripping unit 42 as shown in Figure 8
And it fascinates.Thus, stripping unit 42 can be made to be scratched from corner 6A towards corner 6B not applying excessive power to stripping unit 42
Property deformation.In addition, as driving device 48, it is not limited to revolving servo motor and ball screw framework, can also be
Linear servo motor or fluid-pressure cylinder (such as pneumatic cylinder).
Multiple driving devices 48 are preferably installed on the frame 74 that can be lifted across buffer component 76.Buffer component 76 is to chase after
With the mode flexible deformation of the flexible deformation of stripping unit 42.Bar 70 fascinates relative to frame 74 as a result,.
When the reinforcing plate 3B that will have been removed takes out from stripping unit 42, frame 74 is set to decline using driving portion (not shown)
It is mobile.
Controller 50 be configured to include the recording mediums such as ROM and RAM, CPU etc. computer.Controller 50 makes CPU execute
The program of record in the recording medium, controls multiple driving devices 48 according to each driving device 48 as a result, more to control
The lifting moving of a movable body 44.
Utilize the stripping means of reinforcing plate 3A, 3B of stripping off device 40
(C) of (A)~Fig. 9 of Fig. 9, (A)~Figure 10 of Figure 10 (C) in, show using illustrated in figure 3
Stripping beginning portion's production method has made the stripping means of the laminated body 6 in stripping beginning portion 26,30 in corner 6A.That is, above-mentioned
In figure, the stripping means of reinforcing plate 3A, 3B of stripping laminated body 6 is indicated in chronological order.
In addition, being sent into the feeding operation of laminated body 6 to stripping off device 40 and sending out reinforcing plate 3A, the 3B knead dough after stripping
Conveying device 80 with sucker 78 shown in (A) of the submitting operation of plate P using Fig. 9 carries out.In addition, in order to avoid attached drawing
Complication, the diagram of movable device 46 is omitted in Fig. 9, Figure 10.In addition, panel P refers to being pasted with to remove across functional layer 7
Remove products panel made of the substrate 2A and substrate 2B of reinforcing plate 3A, 3B.
(A) of Fig. 9 be using the action of conveying device 80 shown in arrow E, F make laminated body 6 be placed in downside stripping
Unit 42, stripping off device 40 side view.In this case, in order in the stripping unit 42 of the stripping unit of downside and upside
Between be inserted into conveying device 80, the stripping unit 42 of the stripping unit 42 and upside that make downside in advance is moved to and fully keeps out of the way relatively
Position.Then, when laminated body 6 is placed in the stripping unit 42 of downside, the reinforcing plate 3B of laminated body 6 is by the stripping list of downside
First 42 vacuum suctions are simultaneously kept.That is, in (A) of Fig. 9, show the reinforcing plate 3B as the 2nd substrate by the stripping list of downside
The absorption process that member 42 is adsorbed and kept.
(B) of Fig. 9 be the stripping unit 42 and upside for making downside stripping unit 42 to relatively close direction mobile, layer
The reinforcing plate 3A of stack 6 is by the side view of the stripping off device 40 of 42 vacuum suction of stripping unit of upside and the state of holding.That is,
In (B) of Fig. 9, the absorption work that the reinforcing plate 3A as the 2nd substrate is adsorbed and kept by the stripping unit 42 of upside is shown
Sequence.
In addition, in the case where making the substrate 2 of laminated body 1 shown in FIG. 1 remove from reinforcing plate 3 using stripping off device 40,
It supports to adsorb as the substrate 2 (bearing process) of the 1st substrate, using the stripping unit 42 of downside using the stripping unit 42 of upside
And keep reinforcing plate 3 (absorption process) as the 2nd substrate.In this case, it is not limited for the supporting part of supporting substrates 2
In stripping unit 42, as long as the component of supporting substrates 2 by loading and unloading freely.However, by using stripping unit
42 be used as supporting part, substrate 2 and reinforcing plate 3 can be made while being bent and being removed, therefore, compared to only make substrate 2 or plus
The mode that strong plate 3 is bent, has the advantages that peeling force can be reduced.
Fig. 9 is returned to, (C) of Fig. 9 is the stripping unit for indicating to make from the corner 6A of laminated body 6 towards corner 6B on one side downside
42 downwards flexible deformation, with the stripping beginning portion 26 at interface 24 (with reference to Fig. 4) be on one side reinforcing plate 3B of the starting point to laminated body 6
The side view for the state removed.That is, multiple movable bodys 44 of the stripping unit 42 for downside shown in Fig. 8, make self-alignment
Movable body 44 in movable body 44 to the position positioned at the corner sides 6B of the position of the corner sides 6A of laminated body 6 declines movement successively
To remove reinforcing plate 3B (stripping process) at interface 24.Alternatively, it is also possible to the action linkedly, for the stripping list of upside
Multiple movable bodys 44 of member 42 make the movable body 44 from the position for the corner sides 6A for being located at laminated body 6 to positioned at the corner sides 6B
The movable body 44 of position rises mobile to remove reinforcing plate 3B successively.As a result, compared to only make reinforcing plate 3B be bent mode,
Peeling force can be reduced.
(A) of Figure 10 is the side view of the stripping off device 40 for the state after reinforcing plate 3B that has been completely exfoliated.According to Figure 10's
(A), the reinforcing plate 3B after stripping by 42 vacuum suction of stripping unit of downside and is kept, the laminated body 6 in addition to reinforcing plate 3B
(laminated body for including reinforcing plate 3A and panel P) is by 42 vacuum suction of stripping unit of upside and keeps.
In addition, defeated shown in (A) of Fig. 9 in order to be inserted between the stripping unit 42 of upside and the stripping unit 42 of downside
Device 80 is sent, the stripping unit 42 of the stripping unit 42 and upside that make downside is moved to the position fully kept out of the way relatively.
Then, first, the vacuum suction to the stripping unit 42 of downside is released.Then, the sucker of conveying device 80 is utilized
78 adsorb across resin layer 4B and keep reinforcing plate 3B.Then, conveying device shown in arrow G, H such as (A) of Figure 10 is utilized
80 action sends out reinforcing plate 3B from stripping off device 40.
(B) of Figure 10 is the stripping list of the stripping unit 42 and upside on the downside of the laminated body 6 in addition to reinforcing plate 3B utilizes
First 42 vacuum suctions and the side view of holding.That is, make downside stripping unit 42 and upside stripping unit 42 to relatively close
Direction movement, substrate 2B is by 42 vacuum suction of stripping unit of downside and keeps (bearing process).
(C) of Figure 10 is to indicate to keep the stripping unit 42 of upside upward from the corner 6A of laminated body 6 towards corner 6B on one side
Square flexible deformation at interface 28 to remove beginning portion 30 (with reference to Fig. 4) is on one side the reinforcing plate 3A that starting point peels away laminated body 6
The side view of state.That is, multiple movable bodys 44 of the stripping unit 42 for upside shown in Fig. 8, make from positioned at laminated body 6
The movable body 44 of the movable body 44 of the position of the corner sides 6A to the position positioned at the corner sides 6B rises movement successively, at interface
28 stripping reinforcing plate 3A (stripping process).Alternatively, it is also possible to the action linkedly, for downside stripping unit 42 it is multiple
Movable body 44 keeps the movable body 44 from the position for the corner sides 6A for being located at laminated body 6 movable to the position positioned at the corner sides 6B
Body 44 declines movement successively, to remove reinforcing plate 3A at interface 28.As a result, compared to the mode for only making strong plate 3A bendings, energy
Enough reduce peeling force.
Then, the reinforcing plate 3A being completely exfoliated from panel P is taken out from the stripping unit 42 of upside, and certainly by panel P
The stripping unit 42 of downside is taken out.It is the stripping means that the laminated body 6 in stripping beginning portion 26,30 has been made in corner 6A above.
The feature of stripping off device 40
First, it as shown in (C) of Fig. 7, is characterized in that, adsorption section 54 is by loading and unloading freely across double-sided adhesive tape 56
It is arranged on flex plate 52.
As a result, in the case where replacing adsorption section 54 to flex plate 52, adsorption section 54 is dismantled from flex plate 52, and will be new
Adsorption section 54 be mounted on flex plate 52 on.Thus, the replacement of adsorption section 54 becomes easy.It is used in addition, can shorten
Replace the non-duration of runs of adsorption section 54.Adsorption section 54 is bonded or is fixed on the state that can be dismantled relative to flex plate 52 and scratched
Property plate 52.By prepare change sealing frame component 62 shape various adsorption sections, can correspond to all size, shape layer
Stack.In particular, in order to improve the assembly precision of adsorption section 54 and all size, shape can be removed in a short time
Laminated body, preferably upside adsorption section 54 can replace.
Double-sided adhesive tape 56 is preferably higher than double-sided adhesive tape 56 relative to flex plate 52 relative to the bonding force of adsorption section 54
Bonding force.
As a result, when replacing adsorption section 54, double-sided adhesive tape 56 takes out together with adsorption section 54, therefore, in double-sided adhesive
In the case of being reduced with 56 bonding force, the double-sided adhesive tape 56 that easily can more renew.As double-sided adhesive tape 56, preferably
Using side with the single side of strong bonding plane, the other side with release surface again exfoliated double-sided adhesive tape again, so that release surface again
The mode that flex plate 52 and strong bonding plane are adhered to adsorption section 54 is adhered to use.As double-sided adhesive tape 56, such as being capable of example
Show that favour is melted into the double-sided adhesive tape (name of an article #7686UR) of Co. Ltd. system than the longevity.In addition, by adsorption section 54 with detachable side
The component that formula is installed on flex plate 52 is not limited to double-sided adhesive tape 56, can also be by vacuum adsorption part detachably
Installation.
Then, as (A) of Fig. 7, Fig. 7 (B) shown in, adsorption section 54 includes flex plate 58, gas permeability thin slice 60 and close
Seal frame component 62.
That is, when the inner surface of reinforcing plate 3B is by gas permeability 60 vacuum suction of thin slice, the peripheral surface of reinforcing plate 3B is sealed at
Sealing frame component 62, therefore can prevent air from leaking, thus, it is possible to make reinforcing plate 3B, reliably vacuum suction is thin in gas permeability
Piece 60.
In addition, due to make gas permeability thin slice 60 and sealing frame component 62 be supported on the structure of flex plate 58, therefore, it is possible to
Gas permeability thin slice 60 and sealing frame component 62 are accurately assembled into flex plate 58 in the outside of stripping off device 40.
Moreover, because soft gas permeability thin slice 60 and sealing frame component 62, which is supported in rigidity, is higher than gas permeability thin slice 60
With sealing frame component 62 rigidity flex plate 58, therefore, it is possible to play consistently respective function.
Then, it is characterized in that, adsorption section 54 can be replaced by being conceived to, and can be replaced corresponding with the size of laminated body 6
Size adsorption section 54.
That is, the adsorption section 54 of multiple sizes corresponding with the size of laminated body 6 is prepared in advance, according to the ruler of laminated body 6
An adsorption section that is very little and selecting is installed on flex plate 52 by loading and unloading freely.
(A) of Figure 11 is the vertical view of stripping unit 42, and (B) of Figure 11 is the stripping list along the line D-D of Figure 11 (A)
The amplification longitudinal section view of member 42.
The ruler that size is less than reinforcing plate 3B shown in Fig. 7 is adsorbed and maintains in the adsorption section 82 of the stripping unit 42 of Figure 11
Very little, rectangle reinforcing plate 8.Therefore, adsorption section 82 can use size be less than gas permeability thin slice 60 shown in Fig. 7 size,
And the gas permeability thin slice 84 of size corresponding with the size of reinforcing plate 8.In addition, adsorption section 82 can use size to be more than Fig. 7
Shown in sealing frame component 62 size sealing frame component 86.
Gas permeability thin slice 84 and sealing frame component 86 are pasted on the upper surface of flex plate 58 across double-sided adhesive tape 64.
When replacing adsorption section, double-sided adhesive tape 56 is set to remove from flex plate 52.In addition, gas permeability thin slice 84 and sealing frame component 86 it
Between the slot 88 with frame-shaped, slot 88 is connected to through hole 68.Thus, the inner surface of reinforcing plate 8 is inhaled by 84 vacuum of gas permeability thin slice
It is attached and keep, and the peripheral surface of reinforcing plate 8 is pressed and is connected to sealing frame component 86.
In this way, when the dimension modifying with reinforcing plate replaces adsorption section, also become easy the replacement of adsorption section, separately
Outside, the non-duration of runs for replacing adsorption section can be shortened.
Be described in detail by the present invention with reference to specific embodiment, but those skilled in the art it is clear that, Neng Gou
Apply various changes, amendment under the premise of without departing from the spirit and scope of the invention.
The application goes out to be willing to 2014-116464 based on Japanese Patent filed in 5 days June in 2014, and content is by referring to volume
Enter into this specification.
Reference sign
N, knife；P, panel；1, laminated body；1A, the 1st laminated body；1B, the 2nd laminated body；2, substrate；The surface of 2a, substrate；
The back side of 2b, substrate；2A, substrate；The surface of 2Aa, substrate；2B, substrate；The surface of 2Ba, substrate；3, reinforcing plate；3a, reinforcement
The surface of plate；3A, reinforcing plate；3B, reinforcing plate；The back side of 3Bb, reinforcing plate；4, resin layer；4A, resin layer；4B, resin layer；6、
Laminated body；6A, 6B, corner；7, functional layer；8, reinforcing plate；10, stripping beginning portion producing device；12, workbench；14, it keeps
Part；16, height adjuster；18, conveying device；20, liquid；22, fluid Supplying apparatus；24, interface；26, stripping beginning portion；
28, interface；30, stripping beginning portion；40, stripping off device；42, stripping unit；44, movable body；46, movable device；48, driving dress
It sets；50, controller；52, flex plate；54, adsorption section；56, double-sided adhesive tape；58, flex plate；60, gas permeability thin slice；62, close
Seal frame component；64, double-sided adhesive tape；66, slot；68, through hole；70, bar；72, spherojoint；74, frame；76, buffer component；
78, sucker；80, conveying device；82, adsorption section；84, gas permeability thin slice；86, sealing frame component；88, slot.
Claims (10)
1. a kind of stripping off device of laminated body is laminated for being pasted in a manner of it can remove made of the 1st substrate and the 2nd substrate
Body, the interface between above-mentioned 1st substrate and above-mentioned 2nd substrate is along the stripping direction of travel from one end towards another side
It is removed successively, which is characterized in that
The stripping off device of the laminated body includes：
Supporting part supports above-mentioned 1st substrate of above-mentioned laminated body；
Stripping unit, it includes the 1st flexure members of adsorption section and plate, and the adsorption section is by loading and unloading freely across two-sided
Splicing tape is set to above-mentioned 1st flexure member, above-mentioned 2nd substrate for adsorbing above-mentioned laminated body；And
Driving portion makes above-mentioned stripping unit deform, so that above-mentioned 2nd substrate of above-mentioned laminated body is from one end towards the other end
Side deflection deformation successively,
The bonding force to above-mentioned adsorption section of above-mentioned double-sided adhesive tape is higher than above-mentioned double-sided adhesive tape to above-mentioned 1st flexure member
Bonding force.
2. stripping off device layered product according to the claim 1, wherein
Above-mentioned supporting part is identical structure with above-mentioned stripping unit.
3. the stripping off device of laminated body according to claim 1 or 2, wherein
Above-mentioned adsorption section includes：
2nd flexure member of plate, one side are set to above-mentioned 1st flexure member by loading and unloading freely；
Gas permeability thin slice is set to the another side of above-mentioned 2nd flexure member, the inner surface of above-mentioned 2nd substrate of vacuum suction；
And
Sealing frame component is set to the above-mentioned other side of above-mentioned 2nd flexure member in a manner of surrounding above-mentioned gas permeability thin slice
Face is in contact with the peripheral surface in addition to above-mentioned inner surface of above-mentioned 2nd substrate.
4. the stripping off device of laminated body according to claim 1 or 2, wherein
Above-mentioned adsorption section has the adsorption section of multiple sizes corresponding with the size of above-mentioned laminated body, according to above-mentioned laminated body
Size and an adsorption section selecting is installed on above-mentioned 1st flexure member by loading and unloading freely.
5. a kind of stripping means of laminated body is laminated for being pasted in a manner of it can remove made of the 1st substrate and the 2nd substrate
Body, the interface between above-mentioned 1st substrate and above-mentioned 2nd substrate is along the stripping direction of travel from one end towards another side
It is removed successively, which is characterized in that
The stripping means of the laminated body includes：
Process is supported, above-mentioned 1st substrate of above-mentioned laminated body is supported using supporting part；
Absorption process, using stripping unit, which includes the 1st flexure member of adsorption section and plate, the adsorption section with
Detachable mode is set to above-mentioned 1st flexure member across double-sided adhesive tape, and for adsorbing above-mentioned laminated body the above-mentioned 2nd
Substrate adsorbs above-mentioned 2nd substrate of above-mentioned laminated body using above-mentioned adsorption section；And
Stripping process, using driving portion so that above-mentioned 2nd substrate of above-mentioned laminated body is scratched successively from one end towards another side
The mode of song deformation makes above-mentioned stripping unit deformation to make above-mentioned 2nd strippable substrate of above-mentioned laminated body at above-mentioned interface,
The bonding force to above-mentioned adsorption section of above-mentioned double-sided adhesive tape is higher than above-mentioned double-sided adhesive tape to above-mentioned 1st flexure member
Bonding force.
6. the stripping means of laminated body according to claim 5, wherein
In above-mentioned bearing process, the above-mentioned supporting part of structure identical with the above-mentioned stripping unit in above-mentioned absorption process is used
To support above-mentioned 1st substrate.
7. the stripping means of laminated body according to claim 5 or 6, wherein
Above-mentioned adsorption section has the adsorption section of multiple sizes corresponding with the size of above-mentioned laminated body, according to above-mentioned laminated body
Size and an adsorption section selecting is installed on above-mentioned 1st flexure member by loading and unloading freely.
8. a kind of manufacturing method of electronic device, including：Functional layer formation process, for pasting the 1st in a manner of it can remove
Laminated body made of substrate and the 2nd substrate forms functional layer in the exposure of above-mentioned 1st substrate；And separation process, from shape
Above-mentioned 2nd substrate is detached at above-mentioned 1st substrate for having above-mentioned functional layer, which is characterized in that
Above-mentioned separation process includes：
Process is supported, above-mentioned 1st substrate of above-mentioned laminated body is supported using supporting part；
Absorption process, using stripping unit, which includes the 1st flexure member of adsorption section and plate, the adsorption section with
Detachable mode is set to above-mentioned 1st flexure member across double-sided adhesive tape, and for adsorbing above-mentioned laminated body the above-mentioned 2nd
Substrate adsorbs above-mentioned 2nd substrate of above-mentioned laminated body using above-mentioned adsorption section；And
Stripping process makes above-mentioned stripping unit deform using driving portion, so that above-mentioned 2nd substrate of above-mentioned laminated body is from one end
Towards another side successively deflection deformation, to make above-mentioned 2nd substrate from above-mentioned 1st strippable substrate,
The bonding force to above-mentioned adsorption section of above-mentioned double-sided adhesive tape is higher than above-mentioned double-sided adhesive tape to above-mentioned 1st flexure member
Bonding force.
9. the manufacturing method of electronic device according to claim 8, wherein
In above-mentioned bearing process, come using with the mutually isostructural above-mentioned supporting part of above-mentioned stripping unit in above-mentioned absorption process
Support above-mentioned 1st substrate.
10. the manufacturing method of electronic device according to claim 8 or claim 9, wherein
Above-mentioned adsorption section has the adsorption section of multiple sizes corresponding with the size of above-mentioned laminated body, according to above-mentioned laminated body
Size and an adsorption section selecting is installed on above-mentioned 1st flexure member by loading and unloading freely.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014116464 | 2014-06-05 | ||
| JP2014-116464 | 2014-06-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105270909A CN105270909A (en) | 2016-01-27 |
| CN105270909B true CN105270909B (en) | 2018-07-31 |
Family
ID=55021254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510303612.2A Active CN105270909B (en) | 2014-06-05 | 2015-06-05 | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6547403B2 (en) |
| KR (1) | KR102406292B1 (en) |
| CN (1) | CN105270909B (en) |
| TW (1) | TWI652731B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6430439B2 (en) * | 2016-06-07 | 2018-11-28 | 株式会社岩崎製作所 | Film peeling and winding device |
| JP7234109B2 (en) | 2016-11-15 | 2023-03-07 | コーニング インコーポレイテッド | How to process the substrate |
| CN110690158B (en) * | 2019-09-25 | 2022-03-22 | 云谷（固安）科技有限公司 | Stripping device and stripping method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1742526A (en) * | 2003-01-23 | 2006-03-01 | 东丽株式会社 | The manufacture method of member for circuit board, circuit substrate and the manufacturing installation of circuit substrate |
| CN102202994A (en) * | 2009-08-31 | 2011-09-28 | 旭硝子株式会社 | Peeling device |
| JP2013052998A (en) * | 2011-09-06 | 2013-03-21 | Asahi Glass Co Ltd | Peeling device, and method of manufacturing electronic device |
| CN103871945A (en) * | 2012-12-18 | 2014-06-18 | 旭硝子株式会社 | Device for peeling substrate, method for peeling substrate and method for producing electronic device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3910485B2 (en) | 2002-05-15 | 2007-04-25 | シャープ株式会社 | Film peeling apparatus and film peeling method |
| JP2009078902A (en) | 2007-09-26 | 2009-04-16 | Sharp Corp | Peeling device and peeling method |
-
2015
- 2015-05-15 JP JP2015099738A patent/JP6547403B2/en active Active
- 2015-06-02 KR KR1020150077706A patent/KR102406292B1/en active IP Right Grant
- 2015-06-05 TW TW104118391A patent/TWI652731B/en active
- 2015-06-05 CN CN201510303612.2A patent/CN105270909B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1742526A (en) * | 2003-01-23 | 2006-03-01 | 东丽株式会社 | The manufacture method of member for circuit board, circuit substrate and the manufacturing installation of circuit substrate |
| CN102202994A (en) * | 2009-08-31 | 2011-09-28 | 旭硝子株式会社 | Peeling device |
| JP2013052998A (en) * | 2011-09-06 | 2013-03-21 | Asahi Glass Co Ltd | Peeling device, and method of manufacturing electronic device |
| CN103871945A (en) * | 2012-12-18 | 2014-06-18 | 旭硝子株式会社 | Device for peeling substrate, method for peeling substrate and method for producing electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102406292B1 (en) | 2022-06-10 |
| TWI652731B (en) | 2019-03-01 |
| JP2016011210A (en) | 2016-01-21 |
| JP6547403B2 (en) | 2019-07-24 |
| KR20150140222A (en) | 2015-12-15 |
| CN105270909A (en) | 2016-01-27 |
| TW201608628A (en) | 2016-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105252881B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
| TW201434649A (en) | Stripping device and stripping method for substrate and manufacturing method for electronic device | |
| CN105270909B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
| TW201725166A (en) | Device for delaminating laminate, delamination method, and method for manufacturing electronic device | |
| JP6558646B2 (en) | Substrate adsorption device, substrate bonding apparatus and method, and electronic device manufacturing method | |
| KR102535656B1 (en) | Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device | |
| JP2016147758A (en) | Peeling device and peeling method for laminate, and manufacturing method of electronic device | |
| CN105291545A (en) | Stripping device and stripping method of multilayer body and manufacture method of electronic device | |
| CN105084085B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
| TW201429854A (en) | Substrate peeling device and peeling method, and method for manufacturing electronic device | |
| TWI686307B (en) | Lamination body peeling device, peeling method and electronic device manufacturing method | |
| CN105261578B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
| TWI671253B (en) | Stripping device and peeling method of laminated body and manufacturing method of electronic device | |
| CN105856798B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
| CN105904830B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
| CN105904831B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: AGC Corporation Address before: Tokyo, Japan, Japan Patentee before: Asahi Glass Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |