CN105904831B - The stripping off device and stripping means of laminated body and the manufacturing method of electronic device - Google Patents
The stripping off device and stripping means of laminated body and the manufacturing method of electronic device Download PDFInfo
- Publication number
- CN105904831B CN105904831B CN201610099092.2A CN201610099092A CN105904831B CN 105904831 B CN105904831 B CN 105904831B CN 201610099092 A CN201610099092 A CN 201610099092A CN 105904831 B CN105904831 B CN 105904831B
- Authority
- CN
- China
- Prior art keywords
- substrate
- laminated body
- flex plate
- plate
- stripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to the manufacturing methods of the stripping off device of laminated body and stripping means and electronic device.A kind of stripping off device of laminated body, make that there is the 1st substrate and the 2nd substrate and bond interface of the laminated body between the 1st substrate and the 2nd substrate made of the 1st substrate and the 2nd substrate in a manner of it can remove successively to remove from one end towards another side, it include: supporting part, the 1st substrate of supporting stack;Flex plate utilizes the 2nd substrate of its adsorption plane vacuum suction laminated body;Movable body, the face of the side opposite with adsorption plane of flex plate is fixed on by coupling member, and make flex plate flexible deformation by making movable body be independently relative to supporting part movement, remove laminated body successively at interface, coupling member is configured in a manner of the through hole having through flex plate, it is being formed in by through hole between the spatial portion of flex plate and the 2nd substrate for being adsorbed in flex plate configured with shading member, flex plate is to the shielded members interrupt of the pull of vacuum of spatial portion.
Description
Technical field
The present invention relates to the manufacturing methods of the stripping off device of laminated body and stripping means and electronic device.
Background technique
With the slimming of the electronic devices such as display panel, solar battery, thin-film secondary battery, lightness, it is expected that answering
The thin plate of the substrates such as glass plate, resin plate, metal plate for these electronic devices (the 1st substrate).
However, if the thickness of substrate is thinning, the treatability of substrate deteriorates, accordingly, it is difficult to form electricity on the surface of the substrate
Functional layer (thin film transistor (TFT) (TFT:Thin Film Transistor), colour filter (CF:Color of sub- device
Filter))。
Therefore, motion has a kind of following manufacturing method of electronic device: pasting the stiffening plate of glass system at the back side of substrate
(the 2nd substrate) reinforces laminated body made of substrate using stiffening plate to constitute, and in the sudden and violent of substrate in the state of laminated body
Show up to form functional layer.In this manufacturing method, the treatability of substrate improves, therefore can be in the good landform of exposure of substrate
At functional layer.Moreover, stiffening plate self-reference substrate after forming functional layer is removed.
The stripping means of stiffening plate disclosed in patent document 1 passes through from two on the diagonal line of laminated body for being located at rectangle
A corner in a corner towards another corner makes stiffening plate or substrate or their twocoueses direction separated from each other
Successively flexible deformation carries out.At this point, in order to go on smoothly removing, in a corner of laminated body production removing beginning portion.
Removing beginning portion is and hoe scaler is inserted into predetermined amount into the interface between substrate and stiffening plate from the end face of laminated body
Production.
The stripping off device of patent document 1 includes objective table, flex plate, multiple suckers (coupling member), multiple driving devices
(movable body) and control device etc..It using the stripping off device of patent document 1, is adsorbed using objective table and keeps substrate, using scratching
Property plate absorption keep stiffening plate.The bar of multiple driving devices is linked to flex plate by multiple suckers.Also, control device is to more
The bar of a driving device is controlled as unit of each bar relative to the position of objective table.Specifically, utilizing objective table
Flatly in the state of supporting substrates, the position of the bar of multiple driving devices is controlled, make stiffening plate since removing portion
Successively flexible deformation.Thereby, it is possible to self-reference substrates to remove stiffening plate.
Patent document 1: No. 5155454 bulletins of Japanese Patent Publication No.
Summary of the invention
Problems to be solved by the invention
In the stripping off device of patent document 1, by the sucker (coupling member) be fixed on flex plate with by laminated body
The opposite side in side face, and the top end part of the bar of driving device is installed on the sucker by connector.In such peace
It filling in form, there are the following problems, that is, when to flex plate fixing sucking disk, the bar and connector of driving device become obstacle, thus
Sucker cannot be easily fixed to flex plate.
Therefore, in order to improve fixed operation of the sucker relative to flex plate, research has scheme below.
Figure 16 is to indicate that the main portions amplification of the 1st previous form for sucker 100 to be fixed on to flex plate 102 is cutd open
View.
Flex plate 102 shown in Figure 16 specifically includes that flexed plate 104, determines the flexibility of flex plate 102;And rubber
Plate 108 is adhered to the surface of flexed plate 104 and vacuum suction laminated body 106.It is equipped on rubber slab 108 and flexed plate 104
The through hole 110,112 configured to run through for sucker 100.In the 1st form, by sucker 100 from the stacking of flex plate 102
Side (A) is chimeric and is fixed on through hole 110,112.Thereby, it is possible to be easy to sucker 100 being fixed on flex plate 102.Namely
It says, since sucker 100 is fixed on flex plate 102 from the stacking side (A) of flex plate 102, solid to flex plate 102
When determining sucker 100, the bar and connector of driving device will not become obstacle.
However, in the 1st form, by 106 vacuum suction of laminated body when the rubber slab 108 of flex plate 102, in rubber
Under the sucking action of plate 108, the spatial portion 114 of through hole 110,112 is occluded by sucker 100 and laminated body 106 and becomes vacuum.
Therefore, as shown in figure 17, there are following situations, that is, a part of 106A positioned at spatial portion 114 of laminated body 106 is inhaled into
In spatial portion 114, thus local deformation and crack.
Figure 18 is to indicate that the main portions amplification of the 2nd previous form for sucker 100 to be fixed on to flex plate 102 is cutd open
View.
In the 2nd form shown in Figure 18, in order not to make a part of 106A of laminated body 106 be inhaled into spatial portion 114
It is interior, the rubber block 116 of horizontal aligument is configured at spatial portion 114.
However, rubber block 116 will not follow the flexible deformation of flex plate 102 and deform in the 2nd form.Therefore, it is shelling
From when, the local 106A of laminated body 106 being in contact with rubber block 116 will not deform relative to other parts, that is, from change
The other parts of shape see that laminated body 106 is locally deformed with, therefore is cracked sometimes.
Figure 19 is to indicate that the main portions amplification of the 3rd previous form for sucker 100 to be fixed on to flex plate 102 is cutd open
View.
In the 3rd form shown in Figure 19, spatial portion 114 becomes vacuum in order to prevent, is equipped with and space in flexed plate 104
The venthole 118 that portion 114 is connected makes spatial portion 114 via venthole 118 to atmosphere opening.
When flexed plate 104 is equipped with the venthole 118 being connected with spatial portion 114, due to spatial portion 114 and big gas phase
The problem of being connected to, therefore being able to solve 1 form.However, since the vacuum between rubber slab 108 and laminated body 106 is destroyed,
Therefore presence cannot adsorb 106 such problems of laminated body.
As shown above, in previous the 1st form~the 3rd form, although sucker 100 can be improved relative to flex plate
102 fixed operation, but there is a problem of the local 106A of laminated body 106 it is damaged and the problem of laminated body 106 cannot be adsorbed.
In addition, appended drawing reference 120 is the flexure between flexed plate 104 and rubber slab 108 in Figure 16~Figure 19
Plate, the flexed plate 120 are adhered to flexed plate 104 via double-sided adhesive tape 122.In addition, rubber slab 108 is via double-sided adhesive tape
124 are adhered to flexed plate 120.Also, appended drawing reference 126 is provided at the through hole of the attraction of flex plate 102, the through hole
126 are connected with the attraction slot 128 of the frame-shaped of the periphery formation along rubber slab 108.That is, by being inhaled via through hole 126
Draw the air in attraction slot 128, thus by 106 vacuum suction of laminated body in rubber slab 108.
The present invention is made in view of such problems, it is intended that providing stripping off device and the removing of laminated body
The manufacturing method of method and electronic device can prevent while improving fixed operation of the coupling member relative to flex plate
The breakage of laminated body, and it is able to maintain that flex plate keeps the absorption of substrate.
The solution to the problem
In order to reach the purpose, the present invention provides a kind of stripping off device of laminated body, makes have the 1st substrate and the 2nd base
Plate and laminated body made of the 1st substrate and the 2nd substrate is bonded in a manner of it can remove in the 1st substrate and institute
It is successively removed from one end towards another side at the interface stated between the 2nd substrate, which is characterized in that the stripping off device of the laminated body
Include: supporting part, is used to support the 1st substrate of the laminated body;Flex plate utilizes its adsorption plane vacuum suction institute
State the 2nd substrate of laminated body;And movable body, it is being fixed on the flex plate with the adsorption plane by coupling member
The face of opposite side, also, keep the flex plate flexible by making movable body be independently relative to the supporting part movement
Deformation, so that the laminated body be made successively to remove at the interface, the coupling member through the flex plate to be had
Through hole in mode configure, in the spatial portion that is formed in the flex plate by the through hole and be adsorbed in the flex plate
The 2nd substrate between be configured with shading member, the flex plate is to the shielded component of the pull of vacuum of the spatial portion
It blocks.
In order to reach the purpose, the present invention provides a kind of stripping means of laminated body, makes have the 1st substrate and the 2nd base
Plate and laminated body made of the 1st substrate and the 2nd substrate is bonded in a manner of it can remove in the 1st substrate and institute
It is successively removed from one end towards another side at the interface stated between the 2nd substrate, which is characterized in that the stripping means of the laminated body
Include: bearing process, the 1st substrate of the laminated body is supported using supporting part;Absorption process utilizes the absorption of flex plate
Adsorb the 2nd substrate of the laminated body in face;And stripping process, make using multiple movable bodys and by coupling member described
Flex plate flexible deformation and make the 2nd substrate of the laminated body from one end towards another side successively flexible deformation, from
And remove the laminated body successively at the interface.The coupling member is with through through hole possessed by the flex plate
In mode configure, spatial portion that the flex plate is formed in by the through hole be adsorbed in described the of the flex plate
Shading member, in the stripping process, pull of vacuum quilt of the flex plate to the spatial portion are configured between 2 substrates
Shading member blocks.
In order to reach the purpose, the present invention provides a kind of manufacturing method of electronic device, the manufacturer of the electronic device
Method includes functional layer formation process, for laminated body made of pasting the 1st substrate and the 2nd substrate in a manner of it can remove,
Functional layer is formed in the exposure of the 1st substrate;And separation process, self-forming have the 1st substrate of the functional layer
Separate the 2nd substrate, which is characterized in that the separation process includes bearing process, supports the laminated body using supporting part
The 1st substrate;Absorption process adsorbs the 2nd substrate of the laminated body using the adsorption plane of flex plate;And removing
Process using multiple movable bodys and makes the flex plate flexible deformation by coupling member and makes the described 2nd of the laminated body
Substrate is from one end towards another side successively flexible deformation, so that the 2nd substrate is successively removed from the 1st substrate,
The coupling member is formed in configuring through the mode in through hole possessed by the flex plate by the through hole
Shading member is configured between the spatial portion of the flex plate and the 2nd substrate for being adsorbed in the flex plate, in the stripping
From in process, the flex plate is to the shielded members interrupt of the pull of vacuum of the spatial portion.
Using the present invention, due to being provided with through hole in flex plate, by the way that coupling member is passed through so that side is laminated certainly
The mode being through in through hole configures, and can improve fixed operation of the coupling member relative to flex plate.In addition, by penetrating through
Hole is formed between the spatial portion of flex plate and the 2nd substrate for being adsorbed in flex plate and is configured with shading member, utilizes shading member
It blocks flex plate to the pull of vacuum of spatial portion, therefore, the laminated body because caused by spatial portion becomes vacuum can be prevented
The breakage of (the 2nd substrate), and it is able to maintain that flex plate keeps the absorption of substrate.
In a technical solution of the invention, it is preferred that the sheet material that the shading member is made of resin fits in institute
State flex plate.
Using the technical program, flexibility can be blocked using the sheet material for fitting in the resins such as flex plate, plastic tape
Plate can prevent the vacuum leak of flex plate, therefore be able to maintain that flex plate to substrate to the pull of vacuum of spatial portion
Absorption is kept.
In another technical solution of the invention, it is preferred that the spatial portion is via being set to the flex plate and described
The venthole of at least one of coupling member is connected with atmosphere.
The technical program is used, even if in the case where having minimum pull of vacuum to spatial portion effect from flex plate,
Since spatial portion is to atmosphere opening, also the part of laminated body can be prevented to be attracted in spatial portion.In addition, even if making to make
Minimum pull of vacuum for spatial portion will not be directed to the vacuum suction of laminated body effect to atmosphere opening to flex plate
It is had an impact with holding.
The effect of invention
Using the stripping off device and stripping means of laminated body of the invention and the manufacturing method of electronic device, can improve
The breakage of laminated body is prevented while fixed operation of the coupling member relative to flex plate, and is able to maintain that flex plate to base
The absorption of plate is kept.
Detailed description of the invention
Fig. 1 is to indicate that the main portions of an example of the laminated body supplied to the manufacturing process of electronic device amplify side view
Figure.
Fig. 2 is to indicate that the main portions of an example of the laminated body made in the midway of the manufacturing process of LCD amplify side view
Figure.
(E) of (A)~Fig. 3 of Fig. 3 is the production side, removing beginning portion for indicating to carry out using removing beginning portion producing device
The explanatory diagram of method.
Fig. 4 is the top view that the laminated body in removing beginning portion has been made using removing beginning portion production method.
Fig. 5 is the longitudinal section view for indicating the structure of stripping off device of embodiment.
Fig. 6 is the allocation position for indicating more connecting rods relative to flex plate, flex plate top view.
(C) of (A)~Fig. 7 of Fig. 7 is the explanatory diagram for indicating the structure of flex plate.
Fig. 8 is the longitudinal section view for the stripping off device removed to the interface of laminated body.
Fig. 9 is the longitudinal section view for indicating sucker relative to the mounting structure of connecting rod.
(A) of Figure 10 and (B) of Figure 10 are the longitudinal section views for indicating the sucker of movement of sucker.
Figure 11 is the main portions sectional view for indicating bolt relative to the flex plate of the installation form of flex plate.
(C) of (A)~Figure 12 of Figure 12 is to indicate that stripping will have been made by removing beginning portion production method in chronological order
Leave the explanatory diagram of the stripping means of the stiffening plate removing of the laminated body in beginning portion.
(C) of (A)~Figure 13 of Figure 13 is that then Figure 12 (A)~Figure 12 (C) is indicated in chronological order by laminated body
Stiffening plate removing stripping means explanatory diagram.
(A) of Figure 14 and (B) of Figure 14 are the main portions amplification stereogram of (C) of Figure 12 (B) and Figure 12.
Figure 15 is the main portions sectional view for indicating the flex plate of another form of the venthole set on flex plate.
Figure 16 is the main portions for indicating the 1st previous form for improving fixed operation of the sucker relative to flex plate
Enlarged cross-sectional view.
Figure 17 is the main portions enlarged cross-sectional view for indicating the part of laminated body and being attracted in the spatial portion of flex plate.
Figure 18 is the main portions for indicating the 2nd previous form for improving fixed operation of the sucker relative to flex plate
Enlarged cross-sectional view.
Figure 19 is the main portions for indicating the 3rd previous form for improving fixed operation of the sucker relative to flex plate
Enlarged cross-sectional view.
Specific embodiment
Hereinafter, illustrating embodiments of the present invention with reference to the accompanying drawings.
Hereinafter, explanation uses the stripping off device of laminated body of the invention in manufacturing process's (manufacturing method) of electronic device
And the case where stripping means.
Electronic device refers to the electronic components such as display panel, solar battery, thin-film secondary battery.As display panel,
Can illustrate liquid crystal display (LCD:Liquid Crystal Display) panel, plasma display device (PDP:
Plasma Display Panel) and organic el display (OELD:Organic Electro Luminescence
Display) panel.
The manufacturing process of electronic device
Electronic device forms the function of electronic device by the surface of the substrate in glass system, resin system, made of metal etc.
Layer (being then thin film transistor (TFT) (TFT), colour filter (CF) if LCD) and manufacture.
Before forming functional layer, the back side of the substrate is made to be pasted on stiffening plate and be configured to laminated body.Later, in layer
In the state of stack, functional layer is formed on the surface of the substrate.Then, after forming functional layer, remove stiffening plate self-reference substrate.
That is, in the manufacturing process of electronic device, comprising: form functional layer on the surface of the substrate in the state of laminated body
Functional layer formation process and the active ergosphere of self-forming substrate separation stiffening plate separation process.Separation process application is originally
The stripping off device and stripping means of the laminated body of invention.
Laminated body 1
Fig. 1 is the main portions enlarged side view for indicating an example of laminated body 1.
Laminated body 1 includes the substrate (the 1st substrate) 2 formed for functional layer and the stiffening plate the (the 2nd for reinforcing the substrate 2
Substrate) 3.In addition, stiffening plate 3 has the resin layer 4 as adsorption layer, the back side of adhesive base plate 2 on resin layer 4 in surface 3a
2b.That is, substrate 2 using its Van der Waals force or resin layer 4 that are acted between resin layer 4 bonding force across resin layer 4 with
The mode that can be removed is pasted on stiffening plate 3.
Substrate 2
Functional layer is formed in surface (exposure) 2a of substrate 2.As substrate 2, glass substrate, ceramic base can be illustrated
Plate, resin substrate, metal substrate, semiconductor substrate.Among these substrates, due to the chemical resistance of glass substrate, resistance to moisture-inhibiting
The excellent and linear expansion coefficient of property is smaller, therefore, is suitable as the substrate 2 of electronic device.In addition, since linear expansion coefficient becomes
It is small, therefore also have the advantages that the pattern of the functional layer formed at high temperature is difficult to deviate while cooling.
As the glass of glass substrate, can illustrate alkali-free glass, pyrex, soda-lime glass, high silica glass, its
He with silica oxide system glass as main component.The content of silica of the oxide system glass preferably in terms of oxide
For the glass of 40 mass of mass %~90 %.
Glass as glass substrate, it is preferred that select and apply the type for being suitable for manufactured electronic device
Glass or the glass for being suitable for its manufacturing process.For example, the glass substrate of liquid crystal board is preferably, using being substantially free of
The glass (alkali-free glass) of alkali metal component.
The thickness of substrate 2 is set according to the type of substrate 2.For example, in the case where substrate 2 is using glass substrate,
Lightness, thin plate for electronic device, the thickness of substrate 2 are preferably set to 0.7mm hereinafter, being more preferably set in 0.3mm
Hereinafter, being further preferably set in 0.1mm or less.Substrate 2 thickness in 0.3mm situation below, glass can be assigned
Substrate good flexibility.Moreover, substrate 2 thickness in 0.1mm situation below, glass substrate can be rolled up as web-like,
From the viewpoint of the processing of the viewpoint of the manufacture of glass substrate and glass substrate, the thickness of preferable substrate 2 0.03mm with
On.
In addition, substrate 2 is made of a substrate in Fig. 1, but substrate 2 can also be made of multiple substrates.That is, substrate 2
It can also be by laminated body made of the stacking of multiple substrates be constituted.In this case, constituting the aggregate thickness of all substrates of substrate 2
Thickness as substrate 2.
Stiffening plate 3
As stiffening plate 3, glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate can have been illustrated.
The thickness of stiffening plate 3 is set in 0.7mm hereinafter, being set according to the type for the substrate 2 reinforced, thickness etc..
In addition, the thickness that the thickness of stiffening plate 3 can both be greater than substrate 2 might be less that the thickness of substrate 2, but in order to reinforce substrate 2,
The thickness of stiffening plate 3 is preferably in 0.4mm or more.
In addition, in the present embodiment, stiffening plate 3 is made of a substrate, but stiffening plate 3 can also be by by multiple substrate layers
Laminated body made of folded is constituted.In this case, the aggregate thickness for constituting all substrates of stiffening plate 3 becomes the thickness of stiffening plate 3.
Resin layer 4
Laminated body is removed between resin layer 4 and stiffening plate 3 in order to prevent, and by the knot between resin layer 4 and stiffening plate 3
Resultant force is set to higher than the binding force between resin layer 4 and substrate 2.As a result, in stripping process, resin layer 4 and substrate 2 it
Between interface peel.
The resin for constituting resin layer 4 is not particularly limited, and can there are acrylic resin, polyolefin resin, polyurethane
Resin, polyimide resin, organic siliconresin and polyimides organic siliconresin.Several resins can also be used in mixed way.Its
In, from the viewpoint of heat resistance, fissility, preferably organic siliconresin, polyimides organic siliconresin.
The thickness of resin layer 4 is not particularly limited, and is preferably set to 1 μm~50 μm, is more preferably set as 4 μm~20 μm.
The thickness of resin layer 4 is set in 1 μm or more, thus when being mixed into bubble, foreign matter between resin layer 4 and substrate 2, Neng Gouli
The thickness of bubble, foreign matter is absorbed with the deformation of resin layer 4.On the other hand, by the thickness of resin layer 4 be located at 50 μm hereinafter, to
The formation time of resin layer 4 can be shortened, and need not excessively use the resin of resin layer 4, therefore more economical.
In addition, in order to enable stiffening plate 3 to support entire resin layer 4, the shape of resin layer 4 is preferably and stiffening plate 3
Shape of the shape identical or less than stiffening plate 3.In addition, the shape of resin layer 4 is excellent in order to keep resin layer 4 and entire substrate 2 closely sealed
It is selected as shape identical as the shape of substrate 2 or greater than substrate 2.
In addition, resin layer 4 is constituted by one layer in Fig. 1, but resin layer 4 can also be constituted by two layers or more.The situation
Under, all layers of total thickness for constituting resin layer 4 becomes the thickness of resin layer.In addition, in this case, constituting the tree of each layer
The type of rouge can also be different.
Moreover, in the present embodiment, having used organic film i.e. resin layer 4 as adsorption layer, but also can be used inorganic
Layer replaces resin layer 4.The inoranic membrane of inorganic layer is constituted for example containing from by metal silicide, nitride, carbide and carbon
At least one selected in the group that nitride is constituted.
Moreover, there is the laminated body 1 of Fig. 1 resin layer 4 to be used as adsorption layer, but laminated body 1 can not also include resin layer 4 and
Including substrate 2 and stiffening plate 3.In this case, make substrate 2 using the Van der Waals force etc. acted between substrate 2 and stiffening plate 3
It is pasted in a manner of it can remove with stiffening plate 3.In addition, in the case where substrate 2 and stiffening plate 3 are glass substrate, in order to make
Substrate 2 and stiffening plate 3 are not bonded at high temperature, preferably form inorganic thin film in the surface 3a of stiffening plate 3.
It is formed with the laminated body 6 of the embodiment of functional layer
Via functional layer formation process to form functional layer in the surface 2a of the substrate 2 of laminated body 1.As functional layer
Forming method is able to use CVD (Chemical Vapor Deposition: chemical vapor deposition) method and PVD (Physical
Vapor Deposition: physical vapour deposition (PVD)) method etc. vapour deposition method, sputtering method.Functional layer is formed using photoetching process, etching method
For scheduled pattern.
Fig. 2 is the main portions for indicating an example of laminated body 6 for the rectangle made by the midway of the manufacturing process of LCD
Enlarged side view.
Laminated body 6 includes stiffening plate 3A, resin layer 4A, substrate 2A, functional layer 7, substrate 2B, resin layer 4B and stiffening plate
3B is simultaneously laminated with the sequence.That is, the laminated body 6 of Fig. 2 is equivalent to laminated body 1 shown in FIG. 1 to clip the side of functional layer 7
Laminated body made of formula balanced configuration.Hereinafter, the laminated body including substrate 2A, resin layer 4A and stiffening plate 3A is known as the 1st
Laminated body including substrate 2B, resin layer 4B and stiffening plate 3B is known as the 2nd laminated body 1B by laminated body 1A.
The thin film transistor (TFT) (TFT) as functional layer 7 is formed in the surface 2Aa of the substrate 2A of the 1st laminated body 1A, the 2nd
The surface 2Ba of the substrate 2B of laminated body 1B forms the colour filter (CF) as functional layer 7.
1st laminated body 1A and the 2nd laminated body 1B is by making the surface 2Ba of the surface 2Aa of substrate 2A, substrate 2B mutually coincide
And it is integrated.The 1st laminated body 1A and the 2nd laminated body the 1B construction of balanced configuration in a manner of clipping functional layer 7 are manufactured as a result,
Laminated body 6.
In the removing beginning portion production process of separation process using knife after laminated body 6 forms removing beginning portion, dividing
From stiffening plate 3A, 3B is successively removed in the stripping process of process, later, installation polarizing film, backlight etc., to be manufactured as production
The LCD of product.
Remove beginning portion producing device 10
(E) of (A)~Fig. 3 of Fig. 3 is to indicate the removing beginning portion production dress used in removing beginning portion production process
The explanatory diagram of 10 structure is set, (A) of Fig. 3 is the explanatory diagram for indicating the positional relationship between laminated body 6 and knife N, (B) of Fig. 3
It is to make the explanatory diagram in removing beginning portion 26 at interface 24 using knife N, (C) of Fig. 3 is to indicate to make at interface 28 to remove
The explanatory diagram of the state in beginning portion 30, (D) of Fig. 3 are to make the explanatory diagram in removing beginning portion 30, Fig. 3 at interface 28 using knife N
(E) be made removing beginning portion 26,30 laminated body 6 explanatory diagram.In addition, Fig. 4 is that production has removing beginning portion 26,30
Laminated body 6 top view.
When beginning portion 26,30 are removed in production, as shown in (A) of Fig. 3, laminated body 6 is adsorbed with the back side 3Bb of stiffening plate 3B
The mode of workbench 12 is held in along horizontal (X-direction in figure) bearing.
Knife N is kept the mode horizontal twelve Earthly Branches opposite with the end face of corner (one end) 6A of laminated body 6 with point of a knife of part 14
It holds.In addition, adjusting position of the knife N in short transverse (Z-direction in attached drawing) using height adjuster 16.In addition, utilizing
The conveying devices such as ball-screw apparatus 18 relatively move knife N and laminated body 6 in the horizontal direction.As long as conveying device 18 makes knife
At least one of N and workbench 12 are moved in the horizontal direction, in embodiments, keep knife N mobile.In addition, knife N's
Top is configured with the fluid Supplying apparatus 22 of the upper surface supply liquid 20 for the knife N to before being inserted into or in insertion.
Remove beginning portion production method
The characteristics of removing beginning portion's production method carried out using removing beginning portion producing device 10, is: by inserting for knife N
Enter the position being overlapped on the thickness direction of laminated body 6 that position is set in the corner 6A of laminated body 6, and inserting knife N
Enter amount and is set as different according to each interface 24,28.
Illustrate the making step in the removing beginning portion.
In the initial state, the point of a knife of knife N is located relative between the 1st insertion position, i.e. substrate 2B and resin layer 4B
The position that interface 24 is offset by short transverse (Z-direction).Therefore, firstly, as shown in (A) of Fig. 3, make knife N in height
It is moved on direction, the height of the point of a knife of knife N is set in the height at interface 24.
Then, it as shown in (B) of Fig. 3, moves horizontally knife N towards the corner 6A of laminated body 6, knife N is inserted to interface 24
Enter predetermined amount.In addition, supplying liquid 20 from fluid Supplying apparatus 22 to the upper surface of knife N when being inserted into knife N or before insertion knife N.
The substrate 2B of corner 6A is removed from resin layer 4B as a result, therefore, as shown in figure 4, producing vertical view triangular shape at interface 24
Removing beginning portion 26.In addition, liquid 20 must be not necessarily supplied, but if if using liquid 20, even if knife N is extracted it
Liquid 20 can also remain in removing beginning portion 26 afterwards, therefore can make the removing beginning portion 26 that can not adhere to again.
Then, knife N is extracted in the horizontal direction from corner 6A, as shown in (C) of Fig. 3, the point of a knife of knife N is set in the 2nd and inserts
Enter the height at the interface 28 between position, i.e. substrate 2A and resin layer 4A.
Then, it as shown in (D) of Fig. 3, moves horizontally knife N towards laminated body 6, knife N is inserted into predetermined amount to interface 28.
Similarly, liquid 20 is supplied from fluid Supplying apparatus 22 to the upper surface of knife N.As a result, as shown in (D) of Fig. 3, made at interface 28
Make removing beginning portion 30.Here, knife N is set as being less than insertion of the knife N relative to interface 24 relative to the insertion at interface 28.With
Upper is removing beginning portion production method.Alternatively, it is also possible to by knife N relative to the insertion at interface 24 be set as be less than knife N relative to
The insertion at interface 28.
Since the laminated body 6 for having made removing beginning portion 26,30 is removed in portion's producing device 10 removing, after being delivered to
The stripping off device stated successively is removed at interface 24,28 using stripping off device.
The detailed content of aftermentioned stripping means makes laminated body 6 from corner 6A direction and corner 6A as shown in the arrow A of Fig. 4
Opposite corner (another side) 6B flexure, to be started at first at the biggish interface 24 of area in removing beginning portion 26 with removing
Portion 26 is that starting point is removed.Stiffening plate 3B is removed as a result,.Then, laminated body 6 is scratched again from corner 6A towards corner 6B
Song, to be removed at the lesser interface 28 of area in removing beginning portion 30 with removing beginning portion 30 as starting point.It removes as a result,
Stiffening plate 3A.
In addition, the insertion of knife N is preferably set to 7mm or more according to the size of laminated body 6, be more preferably set in 15mm~
20mm or so.
Stripping off device 40
Fig. 5 is the longitudinal section view for indicating the structure of stripping off device 40 of embodiment, and Fig. 6 is to schematically show more
(in Fig. 6 be 19) connecting rod 44A, 44B, 44C, 44D, 44E, 44F, 44G, 44H, 44I, 44J, 44K, 44L, 44M, 44N,
44O, 44P, 44Q, 44R, 44S and Duo Tai driving device (movable body) 48A, 48B, 48C, 48D, 48E, 48F, 48G, 48H, 48I,
The allocation position of 48J, 48K, 48L, 48M, 48N, 48O, 48P, 48Q, 48R, 48S relative to the flex plate 42 of stripping off device 40
, the top view of flex plate 42.In addition, Fig. 5 is equivalent to the cross-sectional view of the line B-B along Fig. 6, in addition, with solid line table in Fig. 6
Show laminated body 6.
Stripping off device 40 shown in fig. 5 includes the upper side and lower side that laminated body 6 is configured in a manner of clamping laminated body 6
A pair of of movable device 46,46.Movable device 46,46 structures are identical, therefore, illustrate to configure the movable dress in the downside of Fig. 5 herein
46 are set, the movable device 46 to configuration in upside marks identical appended drawing reference and omits the description.
Connecting rod 44A~44S of movable device 46 including the more lengthwise shapes, according to every connecting rod 44A~44S and
Make connecting rod 44A~44S lifting moving the more driving device 48A~48S and according to every driving device 48A~
48S controls driving device 48A~driving device 48S controller 50 etc..In addition, be described below connecting rod 44A~44S and
Driving device 48A~48S.
In order to make stiffening plate 3B flexible deformation, flex plate 42 is by stiffening plate 3B vacuum suction and keeps.
Flex plate 42
(A) of Fig. 7 is the top view of flex plate 42, (B) of Fig. 7 be along Fig. 7 (A) line C-C, flex plate 42
Amplification longitudinal section view.In addition, (C) of Fig. 7 be indicate constitute flex plate 42 adsorption section 54 by double-sided adhesive tape 56 with fill
It unloads mode freely and is set to amplification longitudinal section view that constitute the flexed plate 52 of the rectangle of flex plate 42, flex plate 42.
Flex plate 42 is configured to as described, and adsorption section 54 is installed by loading and unloading freely by double-sided adhesive tape 56
In flexed plate 52.
The flexed plate 58 that adsorption section 54 has thickness thinner than flexed plate 52.The lower surface of the flexed plate 58 is by double-sided adhesive
The upper surface for being installed on flexed plate 52 by loading and unloading freely with 56.
In addition, being equipped with the ventilation for adsorbing the rectangle of the inner surface of the stiffening plate 3B of retaining layer stack 6 in adsorption section 54
Property sheet material (adsorption plane) 60.In order to reduce the tensile stress for resulting from stiffening plate 3B in removing, the thickness of aeration sheet material 60
For 2mm hereinafter, preferably 1mm hereinafter, use the aeration sheet material 60 with a thickness of 0.5mm in embodiments.
In addition, being additionally provided with the sealing frame surrounding aeration sheet material 60 and abutting with the outer peripheral surface of stiffening plate 3B in adsorption section 54
Component 62.Sealing frame component 62 and aeration sheet material 60 are adhered to the upper surface of flexed plate 58 by double-sided adhesive tape 64.In addition,
Sealing frame component 62 is the cavernous body that Shore E hardness is 20 degree or more and 50 degree closed pores below, the thickness of sealing frame component 62
It is configured to 0.3mm~0.5mm thicker than the thickness of aeration sheet material 60.
The slot 66 of frame-shaped is equipped between aeration sheet material 60 and sealing frame component 62.In addition, having in the opening of flexed plate 52
One end of multiple through holes 68, these through holes 68 is connected to slot 66, and the other end is through not shown suction pipeline and source of suction
(such as vacuum pump) connection.
Thus, when driving the source of suction, the air in the suction pipeline, through hole 68 and slot 66 is attracted,
To which the inner surface of the stiffening plate 3B of laminated body 6 by vacuum suction and is held in aeration sheet material 60, also, stiffening plate 3B's is outer
Circumferential surface is pushed and is connected to sealing frame component 62.The airtightness of the adsorption space surrounded as a result, by sealing frame component 62 improves.
Compared with flexed plate 58, aeration sheet material 60 and sealing frame component 62, the flexural rigidity of flexed plate 52 is higher, because
This, the flexural rigidity of flexed plate 52 determines the flexural rigidity of flex plate 42.It is preferred that the per unit width (1mm) of flex plate 42 is curved
Qu Gang property is 1000Nmm2/ mm~40000Nmm2/mm.For example, the width in flex plate 42 is the part of 100mm, it is bent
Rigidity is 100000Nmm2~4000000Nmm2.By the way that the flexural rigidity of flex plate 42 is set as 1000Nmm2/ mm with
On, absorption can be prevented to be held in the stiffening plate 3B bending of flex plate 42.Also, by the way that the flexural rigidity of flex plate 42 is set as
40000N·mm2/ mm is hereinafter, can make to adsorb the stiffening plate 3B for being held in flex plate 42 suitably flexible deformation.
Flexed plate 52,58 is that Young's modulus is 10GPa resinous member below, for example, polycarbonate resin, polychlorostyrene
The resinous member of ethylene (PVC) resin, acrylic resin, polyacetals (POM) resin etc..
Movable device 46
More connecting rod 44A~44S for constituting the movable device 46 of Fig. 5 are fixed on flexure by sucker (coupling member) 82
The lower surface (face of the side opposite with adsorption plane) of plate 52.
Connecting rod 44A~44S
As shown in fig. 6, connecting rod 44A~44S is such as aluminum with a higher rigidity, the long axis of connecting rod 44A~44S along
Removing front as the boundary line between the released part and unstripped part at the interface 24,28 (referring to Fig. 5) of laminated body 6
L (referring to Fig. 6, Fig. 8) configuration.
On the other hand, the corner 52A corresponding with the corner 6A of laminated body 6 of flexed plate 52 is relative to removing front L's
Removing direction of travel A extends round about.In corner 52A, along removing direction of travel A configured with two connecting rod 44A,
44B and two driving device 48A, 48B.That is, passing through two driving devices 48A, the 48B decline movement for making to be configured at corner 52A
To remove corner 6A.
In addition, connecting rod 44A~44S along interface 24,28 (referring to Fig. 5) removing direction of travel (the arrow A of Fig. 6) every
Open compartment of terrain configuration.It is consistent as a result, due to the long axis of connecting rod 44A~44S with the removing front L of traveling, it can be from base
Plate 2B successfully removes stiffening plate 3B.
Also, connecting rod 44C~connecting rod 44Q length is respectively structured as corresponding with the removing length of front L.
In addition, the driving device 48A~48S configuration being connected with connecting rod 44A~44S exists by connecting rod 44A~44S
The position of equal segmentations on length direction.That is, since removing front is without the connecting rod in the outside for being configured at removing starting end
The lower section of 44A, 44B and be configured at removing end outside connecting rod 44R, 44S lower section, therefore, driving device 48A,
The central portion of 48B, 48R, 48S on the length direction of connecting rod 44A, 44B, 44R, 44S is each configured with one.It is being configured at
It removes the lower section of connecting rod 44C, 44D of starting end and is configured at the lower section process of connecting rod 44P, 44Q of removing end
Remove front L the length being shorter in length than in other parts, therefore driving device 48C, 48D, 48P, 48Q connecting rod 44C,
Central portion on the length direction of 44D, 44P, 44Q is each configured with one.In connecting rod 44E~connecting rod in addition to this
The length for the removing front L that the lower section of 44O is passed through is longer than the length in other parts, and therefore, driving device 48E~48O is to incite somebody to action
The mode of connecting rod 44E~44O 3 equal parts in the longitudinal direction is each configured with two.Thereby, it is possible in connecting rod 44A~44S
Length direction on Transmit evenly carry out the power of automatic drive device 48A~48S, therefore can self-reference substrate 2B further successfully
Remove stiffening plate 3B.In addition, the segmentation number on the length direction be not limited to 2 segmentations, 3 segmentation, or 4 segmentation with
On.
These driving devices 48A~48S passes through the independently lifting moving of controller 50.
That is, controller 50 controls driving device 48A~48S to make from the corner side 6A for the laminated body 6 being located in Fig. 6
The connecting rod 44A of position to be located at shown in arrow A remove direction of travel the corner side 6B position connecting rod 44S successively under
Drop movement.According to the movement, as shown in the longitudinal section view of Fig. 8, by laminated body 6 at interface 24 to remove beginning portion 26 (referring to figure
4) it is removed for starting point.In addition, Fig. 5, laminated body shown in Fig. 86 are to illustrate using in (E) of (A)~Fig. 3 of Fig. 3
Removing beginning portion production method has made the laminated body 6 in removing beginning portion 26,30.
Driving device 48A~48S is for example including revolving servo motor and ball screw framework etc..The rotation of servo motor
Transhipment is moved is converted to linear motion in ball screw framework, is transferred to the bar 70 of ball screw framework.In the top end part of bar 70
Connecting rod 44A~44S is connected with by spherojoint (not shown) and side-slipping mechanism.Thereby, it is possible to make connecting rod 44A~44S with
It fascinates with the flexible deformation of flex plate 42.Thus, flex plate 42 can be made from angle not applying excessive power to flex plate 42
Portion 6A is towards corner 6B successively flexible deformation.In addition, being not limited to revolving servo horse as driving device 48A~48S
It reaches and ball screw framework, can also be linear servo motor or fluid-pressure cylinder (such as pneumatic cylinder).
When the stiffening plate 3B that will have been removed is removed from flex plate 42, carry out down frame 74 using driving portion (not shown)
Drop movement.
Controller 50 be configured to include the recording mediums such as ROM and RAM, CPU etc. computer.Controller 50 holds CPU
Row record program on the recording medium, controlled as a result, according to every driving device 48A~48S more driving device 48A~
48S, to control the lifting moving of more connecting rod 44A~44S.
Sucker 82
Fig. 9 is the longitudinal section view for indicating sucker 82 relative to the mounting structure of connecting rod 44D.In addition, (A) right and wrong of Figure 10
The longitudinal section view of sucker 82 when compression, the longitudinal section view of the sucker 82 when (B) of Figure 10 is compression.In addition, in Fig. 9 and Figure 10
(A) and Figure 10 (B) in, instantiate the sucker 82 for being installed on connecting rod 44D, but be installed on other connecting rods 44A~
44C, the sucker 82 of connecting rod 44E~44S and same structure.Sucker 82 include bolt 84, spring 86, stop part 88, with
And nut 90.
Figure 11 is the main portions sectional view for indicating bolt 84 relative to the installation form of flex plate 42.
Bolt 84 is configured in the mode in from the side stiffening plate 3B through through hole 43 possessed by flex plate 42.Also,
After being inserted into die nut (not shown) in the hexagon ring 85A of base portion 84A of bolt 84, spiral shell is threadingly engaged in by making
The nut 92 and bolt 84 of bolt 84 relatively rotate, so that bolt 84 is anchored on flex plate 42.
Back to (A) of Figure 10, (B) of Figure 10, the through hole 45 of threaded portion 84B from the connecting rod 44D of bolt 84 are prominent
To outside.Threaded portion 84B is inserted into spring 86, and spring 86 is between base portion 84A and connecting rod 44D.In addition, connecting rod
The section constitution of 44D is U-shaped.
The diameter stop part 88 bigger than through hole 45 is fixed on from the threaded portion outstanding of through hole 45 using nut 90
84B.As shown in (A) of Figure 10, under the form on the surface that the stop part 88 is connected to connecting rod 44D, spring 86 is maintained as
Precommpression length.Sucker 82 becomes uncompressed form as a result,.In addition, in Fig. 9, when driving device 48D to be utilized makes connecting rod
When 44D declines, since the surface of connecting rod 44D is connected to stop part 88, it can make to scratch by stop part 88 and bolt 84
Property plate 42 decline.
In addition, making to be configured at the pairs of of the upper side and lower side because of the deviation of the flatness of the flexed plate 52 of flex plate 42
In the case that interval (interval between supporting part and flex plate) between flex plate 42,42 produces deviation, spring 86 is as schemed
It shrinks like that shown in 10 (B) and absorbs the deviation.In addition, leading in the case where the straightness of connecting rod 44D produces deviation
The contraction of spring 86 is crossed, the deviation can be also absorbed.Even if the interval and the straightness produce deviation as a result, can also incite somebody to action
Connecting rod 44D is reliably mounted on flexed plate 52.
The stripping means of stiffening plate 3A, 3B is removed using stripping off device 40
In (C) of (the A)~Figure 13 of (C) and Figure 13 of (A)~Figure 12 of Figure 12, (A)~Fig. 3 in Fig. 3 is shown
(E) illustrated in, by removing beginning portion production method corner 6A made removing beginning portion 26,30 laminated body 6
Stripping means.That is, indicating stripping in chronological order in (C) of (the A)~Figure 13 of (C) and Figure 13 of (A)~Figure 12 of Figure 12
The stripping means of stiffening plate 3A, 3B of absciss layer stack 6.
In addition, inputting the input operation of laminated body 6 to stripping off device 40, exporting the stiffening plate removed from stripping off device 40
Conveying device 80 of the output operation of 3A, 3B and panel P as shown in (A) of Figure 12 with sucker 78 carries out.Wherein, in Figure 12
(C) of (A)~Figure 12, Figure 13 (A)~Figure 13 (C) in, it is multifarious in order to avoid attached drawing, movable device 46 is omitted
Diagram.In addition, panel P, which refers to, is pasted with production made of the substrate 2A and substrate 2B for removing stiffening plate 3A, 3B across functional layer 7
Product panel.
(A) of Figure 12 is the flexibility that laminated body 6 is placed in downside by movement shown in arrow E, F by conveying device 80
Plate 42, stripping off device 40 side view.In this case, in order between the flex plate 42 of downside and the flex plate 42 of upside
It is inserted into conveying device 80, and the flex plate 42 of downside and the flex plate 42 of upside is made to relatively move to the position sufficiently kept out of the way in advance
It sets.Later, by laminated body 6 be placed in downside flex plate 42 when, by downside 42 vacuum suction of flex plate and keep being laminated
The stiffening plate 3B of body 6.It is kept as the stiffening plate 3B of the 2nd substrate by the absorption of flex plate 42 of downside that is, (A) of Figure 12 is shown
Absorption process.
(B) of Figure 12 is that the flex plate 42 for the flex plate 42 and upside for making downside makes layer to relatively close direction movement
The stiffening plate 3A of stack 6 by upside 42 vacuum suction of flex plate and keep state stripping off device 40 side view.That is, figure
12 (B) shows the bearing process supported as the stiffening plate 3A of the 1st substrate by the flex plate (supporting part) 42 of upside.Separately
Outside, (A) of Figure 14 is perspective view corresponding with Figure 12 (B), is the perspective view for indicating the corner 6A amplification of laminated body 6.
In addition, the case where stripping off device 40 to be utilized removes the substrate 2 of laminated body 1 shown in FIG. 1 from stiffening plate 3
Under, the substrate 2 (bearing process) as the 1st substrate is supported using the flex plate 42 (supporting part) of upside, and utilize downside
Flex plate 42 keeps stiffening plate 3 (absorption process) as the 2nd substrate to adsorb.In this case, the supporting part of supporting substrates 2
It is not limited to flex plate 42, as long as can be with the component of the detachable mode supporting substrates 2 of substrate 2.But it is logical
Cross by flex plate 42 be used as supporting part, substrate 2 can be made to be bent simultaneously with stiffening plate 3 and removed, thus with only make substrate 2 or plus
The strong curved form of plate 3 is compared, and has the advantages that peeling force can be reduced.
Back to (C) of (A)~Figure 12 of Figure 12, (C) of Figure 12 is indicated on one side from the corner 6A of laminated body 6 towards angle
Portion 6B make the flex plate 42 of downside downwards flexible deformation on one side at interface 24 to remove beginning portion 26 (referring to Fig. 4) as starting point pair
The side view for the state that laminated body 6 is removed.That is, more connecting rod 44A of the flex plate 42 of downside shown in Fig. 8~
The connecting rod 44A to the connecting rod 44S for being located at the corner side 6B from the corner side 6A for being located at laminated body 6 is set successively to decline shifting in 44S
It is dynamic, to be removed (stripping process) at interface 24.In addition, (B) of Figure 14 is perspective view corresponding with Figure 12 (C),
It is the perspective view for indicating the corner 6A amplification of laminated body 6.By (B) of Figure 14 it is found that passing through connecting rod 44A~connecting rod
The decline of 44E is mobile and makes 42 flexible deformation of flex plate, so that self-reference substrate 2B removes stiffening plate 3B.
Alternatively, it is also possible to be, acted in linkage in more connecting rod 44A~44S of the flex plate 42 of upside with described
The connecting rod 44A to the connecting rod 44S for being located at the corner side 6B from the corner side 6A for being located at laminated body 6 is set successively to rise movement, from
And it is removed at interface 24.As a result, compared with only making the curved form of stiffening plate 3B, peeling force can be reduced.
The state that (A) of Figure 13, which is stiffening plate 3B, to be completely exfoliated at interface 24, stripping off device 40 side view.According to
(A) of Figure 13, the stiffening plate 3B vacuum suction stripped down and the flex plate 42 for being held in downside remove the stacking of stiffening plate 3B
(laminated body including the stiffening plate 3A and panel P) vacuum suction of body 6 and the flex plate 42 for being held in upside.
In addition, in order to be inserted into conveying device 80 shown in (A) of Figure 12 between upper and lower flex plate 42, and make downside
Flex plate 42 and the flex plate 42 of upside relatively move to the position sufficiently kept out of the way.
Later, firstly, releasing the vacuum suction of the flex plate 42 of downside.Then, using the sucker 78 of conveying device 80 every
Resin layer 4B adsorb keep stiffening plate 3B.Then, conveying device 80 shown in arrow G, H by (A) of Figure 13 is dynamic
Make, stiffening plate 3B is exported from stripping off device 40.
(B) of Figure 13 is to remove the laminated body 6 of stiffening plate 3B by the flex plate 42 of downside and 42 vacuum of flex plate of upside
The side view for adsorbing and keeping.That is, the flex plate 42 of flex plate 42 and upside on the downside of making is mobile to relatively close direction, and
By downside 42 vacuum suction of flex plate and keep substrate 2B (bearing process).
(C) of Figure 13 is to indicate to make the flex plate 42 of upside upwards from the corner 6A of laminated body 6 towards corner 6B on one side
Flexible deformation is on one side at interface 28 to remove the side that beginning portion 30 (referring to Fig. 4) is the state that starting point removes laminated body 6
View.That is, making in more connecting rod 44A~44S of the flex plate 42 of upside shown in Fig. 8 from the corner for being located at laminated body 6
The connecting rod 44A of the side 6A to the connecting rod 44S for being located at the corner side 6B successively rises movement, to be removed (stripping at interface 28
From process).Alternatively, it is also possible to make self-alignment in more connecting rod 44A~44S of the flex plate 42 of downside in linkage with the movement
Connecting rod 44A to the connecting rod 44S for being located at the corner side 6B in the corner side 6A of laminated body 6 successively declines movement, thus on boundary
It is removed in face 28.As a result, compared with only making the curved form of stiffening plate 3A, peeling force can be reduced.
Later, the stiffening plate 3A stripped down completely from panel P is taken out from the flex plate 42 of upside, by panel P under
The flex plate 42 of side takes out.It is the stripping means for the laminated body 6 for having removing beginning portion 26,30 in corner 6A production above.
The feature of stripping off device 40
As shown in figure 11, stripping off device 40, which has the feature that, is equipped with through hole 43 in the flexed plate 52 of flex plate 42, will
The bolt 84 of sucker 82 is constituted to configure in the mode in from the side laminated body (stiffening plate 3B) through through hole 43.Thereby, it is possible to
Improve fixed operation of the bolt 84 relative to flex plate 42.In addition, after bolt 84 is installed on through hole 43, by double
Adsorption section 54 is pasted on flexed plate 52 by face splicing tape 56.
Stripping off device 40 has the feature that in the spatial portion 94 for being formed in flex plate 42 by through hole 43 and inhales as a result,
Invest between the stiffening plate 3B of flex plate 42 configured with double-sided adhesive tape 56 as shading member, using double-sided adhesive tape 56 come
Block flex plate 42 to the pull of vacuum of spatial portion 94.Thereby, it is possible to prevent from adding because caused by spatial portion 94 becomes vacuum
The breakage of strong plate 3B, and it is able to maintain that flex plate 42 keeps the absorption of stiffening plate 3B.
As double-sided adhesive tape 56, plastic tape can be illustrated.
Also, stripping off device 40 has the feature that the spatial portion 94 by flex plate 42 via venthole 96 and big gas phase
Connection.Venthole 96 shown in Figure 11 is set to the flexed plate 52 of flex plate 42, and but not limited to this.For example, as shown in figure 15
Another form flex plate 42 main portions sectional view shown in, be also possible to bolt 84 base portion 84A be arranged venthole
84C, is arranged air channel 53A along the bolt embedded hole 53 of flexed plate 52, and air channel 92A is arranged in nut 92, makes venthole
84C, air channel 53A and air channel 92A are interconnected and spatial portion 94 are made to be connected with atmosphere.Alternatively, it is also possible to only in spiral shell
The venthole for making spatial portion 94 be connected with atmosphere is arranged in bolt 84.As long as that is, in flexed plate 52 and sucker 82
At least one setting venthole.
Even if as a result, in the case where having minimum pull of vacuum to the effect of spatial portion 94 from flex plate 42, due to sky
Between portion 94 always to atmosphere opening, therefore the part of stiffening plate 3B can be prevented to be attracted in spatial portion 94.In addition, even if making
The minimum pull of vacuum of spatial portion 94 is acted on to atmosphere opening, flex plate 4 will not be acted on for stiffening plate 3B
Vacuum suction and holding have an impact.
Illustrate the present invention referring to detailed or specific embodiment, but those skilled in the art it is clear that, Neng Gou
Apply various changes, amendment under the premise of without departing from the spirit and scope of the invention.
The application went out to be willing on May 15th, 2015-032743 and 2015 based on 2 months 2015 Japanese Patents filed in 23 days
The Japanese Patent of application goes out to be willing to 2015-099741, and content is by referring to being programmed into this specification.
Description of symbols
N, knife;P, panel;1, laminated body;1A, the 1st laminated body;1B, the 2nd laminated body;2, substrate;The surface of 2a, substrate;
The back side of 2b, substrate;2A, substrate;The surface of 2Aa, substrate;2B, substrate;The surface of 2Ba, substrate;3, stiffening plate;3a, reinforcement
The surface of plate;3A, stiffening plate;3B, stiffening plate;The back side of 3Bb, stiffening plate;4, resin layer;4A, resin layer;4B, resin layer;6,
Laminated body;6A, 6B, corner;7, functional layer;10, beginning portion producing device is removed;12, workbench;14, holder;16, height
Adjust device;18, conveying device;20, liquid;22, fluid Supplying apparatus;24, interface;26, beginning portion is removed;28, interface;
30, beginning portion is removed;40, stripping off device;42, flex plate;43, through hole;44A~44S, connecting rod;46, movable device;48A
~48S, driving device;50, controller;52, flexed plate;53, bolt embedded hole;53A, air channel;54, adsorption section;56, two-sided
Splicing tape;58, flexed plate;60, aeration sheet material;62, sealing frame component;64, double-sided adhesive tape;66, slot;68, through hole;
70, bar;74, frame;78, sucker;80, conveying device;82, sucker;84, bolt;84A, base portion;84C, venthole;85A, six
Corner apertures;86, spring;88, stop part;90, nut;92, nut;92A, air channel;94, spatial portion;96, venthole.
Claims (5)
1. a kind of stripping off device of laminated body, makes to have the 1st substrate and the 2nd substrate and bond described the in a manner of it can remove
Interface of the laminated body between the 1st substrate and the 2nd substrate made of 1 substrate and the 2nd substrate is from one end court
It is successively removed to another side, wherein
The stripping off device of the laminated body includes:
Supporting part is used to support the 1st substrate of the laminated body;
Flex plate utilizes the 2nd substrate of laminated body described in its adsorption plane vacuum suction;And
Movable body is fixed on the face of the side opposite with the adsorption plane of the flex plate by coupling member, also, logical
Crossing makes movable body be independently relative to the supporting part movement to make the flex plate flexible deformation, so that the laminated body be made to exist
The interface is successively removed,
The coupling member to be configured through the mode in through hole possessed by the flex plate,
It is being formed in by the through hole between the spatial portion of the flex plate and the 2nd substrate for being adsorbed in the flex plate
Configured with shading member,
The flex plate is to the shielded members interrupt of the pull of vacuum of the spatial portion.
2. the stripping off device of layered product according to the claim 1, wherein
The sheet material that the shading member is made of resin fits in the flex plate.
3. the stripping off device of laminated body according to claim 1 or 2, wherein
The spatial portion is connected via the venthole for being set at least one of the flex plate and described coupling member with atmosphere
It is logical.
4. a kind of stripping means of laminated body, makes to have the 1st substrate and the 2nd substrate and bond described the in a manner of it can remove
Interface of the laminated body between the 1st substrate and the 2nd substrate made of 1 substrate and the 2nd substrate is from one end court
It is successively removed to another side, wherein
The stripping means of the laminated body includes:
Process is supported, the 1st substrate of the laminated body is supported using supporting part;
Absorption process adsorbs the 2nd substrate of the laminated body using the adsorption plane of flex plate;And
Stripping process using multiple movable bodys and makes the flex plate flexible deformation by coupling member and makes the laminated body
2nd substrate is from one end towards another side successively flexible deformation, so that the laminated body be made successively to shell at the interface
From,
The coupling member to be configured through the mode in through hole possessed by the flex plate,
It is being formed in by the through hole between the spatial portion of the flex plate and the 2nd substrate for being adsorbed in the flex plate
Configured with shading member,
In the stripping process, the flex plate is to the shielded members interrupt of the pull of vacuum of the spatial portion.
5. a kind of manufacturing method of electronic device, the manufacturing method of the electronic device include functional layer formation process, for by
Laminated body made of 1 substrate and the 2nd substrate are pasted in a manner of it can remove forms function in the exposure of the 1st substrate
Layer;And separation process, self-forming have the 1st substrate of the functional layer to separate the 2nd substrate, wherein
The separation process includes
Process is supported, the 1st substrate of the laminated body is supported using supporting part;
Absorption process adsorbs the 2nd substrate of the laminated body using the adsorption plane of flex plate;And
Stripping process using multiple movable bodys and makes the flex plate flexible deformation by coupling member and makes the laminated body
2nd substrate from one end towards another side successively flexible deformation, thus by the 2nd substrate from the 1st substrate according to
Secondary removing,
The coupling member to be configured through the mode in through hole possessed by the flex plate,
It is being formed in by the through hole between the spatial portion of the flex plate and the 2nd substrate for being adsorbed in the flex plate
Configured with shading member,
In the stripping process, the flex plate is to the shielded members interrupt of the pull of vacuum of the spatial portion.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015032743 | 2015-02-23 | ||
JP2015-032743 | 2015-02-23 | ||
JP2015-099741 | 2015-05-15 | ||
JP2015099741A JP6471606B2 (en) | 2015-02-23 | 2015-05-15 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105904831A CN105904831A (en) | 2016-08-31 |
CN105904831B true CN105904831B (en) | 2019-07-26 |
Family
ID=56744450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610099092.2A Active CN105904831B (en) | 2015-02-23 | 2016-02-23 | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105904831B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1532900A (en) * | 2003-03-26 | 2004-09-29 | ��ʽ���綫֥ | Semiconductor producing device and method for producing semiconductor device |
CN1768422A (en) * | 2003-04-10 | 2006-05-03 | 松下电器产业株式会社 | Apparatus and method for picking up semiconductor chip |
CN102202994A (en) * | 2009-08-31 | 2011-09-28 | 旭硝子株式会社 | Peeling device |
CN102655109A (en) * | 2011-03-01 | 2012-09-05 | 富士机械制造株式会社 | Bare chip pickup device |
CN104143499A (en) * | 2013-05-09 | 2014-11-12 | 信越工程株式会社 | Bonding separation method and separation device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8888085B2 (en) * | 2010-10-05 | 2014-11-18 | Skyworks Solutions, Inc. | Devices and methodologies for handling wafers |
KR101382601B1 (en) * | 2012-07-02 | 2014-04-17 | 삼성디스플레이 주식회사 | Manufacturing apparatus and method of organic light emitting diode display |
-
2016
- 2016-02-23 CN CN201610099092.2A patent/CN105904831B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1532900A (en) * | 2003-03-26 | 2004-09-29 | ��ʽ���綫֥ | Semiconductor producing device and method for producing semiconductor device |
CN1768422A (en) * | 2003-04-10 | 2006-05-03 | 松下电器产业株式会社 | Apparatus and method for picking up semiconductor chip |
CN100392842C (en) * | 2003-04-10 | 2008-06-04 | 松下电器产业株式会社 | Apparatus and method for picking up semiconductor chip |
CN102202994A (en) * | 2009-08-31 | 2011-09-28 | 旭硝子株式会社 | Peeling device |
CN102655109A (en) * | 2011-03-01 | 2012-09-05 | 富士机械制造株式会社 | Bare chip pickup device |
CN104143499A (en) * | 2013-05-09 | 2014-11-12 | 信越工程株式会社 | Bonding separation method and separation device |
JP2014220436A (en) * | 2013-05-09 | 2014-11-20 | 信越エンジニアリング株式会社 | Sticking and separating method and separating device |
Also Published As
Publication number | Publication date |
---|---|
CN105904831A (en) | 2016-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI602703B (en) | Substrate stripping apparatus and stripping method, and electronic device manufacturing method | |
CN105252881B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
JP6558646B2 (en) | Substrate adsorption device, substrate bonding apparatus and method, and electronic device manufacturing method | |
KR102535656B1 (en) | Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device | |
WO2017065155A1 (en) | Device for delaminating laminate, delamination method, and method for manufacturing electronic device | |
CN105291545A (en) | Stripping device and stripping method of multilayer body and manufacture method of electronic device | |
JP2016147758A (en) | Peeling device and peeling method for laminate, and manufacturing method of electronic device | |
CN105270909B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
TWI601682B (en) | Substrate stripping apparatus and stripping method, and electronic device manufacturing method | |
CN105904831B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
KR102471642B1 (en) | Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device | |
CN105904830B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
CN105084085B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
CN105261578B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device | |
TWI671253B (en) | Stripping device and peeling method of laminated body and manufacturing method of electronic device | |
CN105856798B (en) | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: AGC Corporation Address before: Tokyo, Japan, Japan Applicant before: Asahi Glass Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |