CN105904830B - The stripping off device and stripping means of laminated body and the manufacturing method of electronic device - Google Patents
The stripping off device and stripping means of laminated body and the manufacturing method of electronic device Download PDFInfo
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- CN105904830B CN105904830B CN201610098916.4A CN201610098916A CN105904830B CN 105904830 B CN105904830 B CN 105904830B CN 201610098916 A CN201610098916 A CN 201610098916A CN 105904830 B CN105904830 B CN 105904830B
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- substrate
- laminated body
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- coupling member
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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Abstract
The present invention relates to the manufacturing methods of the stripping off device of laminated body and stripping means and electronic device.The stripping off device of laminated body makes to have the 1st substrate and the 2nd substrate and bond interface of the laminated body between the 1st substrate and the 2nd substrate made of the 1st substrate and the 2nd substrate in a manner of it can remove successively to remove from one end towards another side, it include: supporting part, for supporting the 1st substrate of the laminated body；Flex plate adsorbs the 2nd substrate of the laminated body using its adsorption plane；And multiple movable bodys, multiple movable body is installed on the face of the side opposite with the adsorption plane of the flex plate, and the supporting part is mobile to make the flex plate from one end towards another side flexible deformation by being independently relative to multiple movable bodys, to make the laminated body successively remove at the interface, the multiple movable body is installed on the flex plate by more coupling members as unit of single and as unit of multiple.
Description
Technical field
The present invention relates to the manufacturing methods of the stripping off device of laminated body and stripping means and electronic device.
Background technique
With the slimming of the electronic devices such as display panel, solar battery, thin-film secondary battery, lightness, it is expected that answering
The thin plate of the substrates such as glass plate, resin plate, metal plate for these electronic devices (the 1st substrate).
However, if the thickness of substrate is thinning, the treatability of substrate deteriorates, accordingly, it is difficult to form electricity on the surface of the substrate
Functional layer (thin film transistor (TFT) (TFT:Thin Film Transistor) and the colour filter (CF:Color of sub- device
Filter))。
Therefore, motion has a kind of following manufacturing method of electronic device: pasting the stiffening plate of glass system at the back side of substrate
(the 2nd substrate) reinforces laminated body made of substrate using stiffening plate to constitute, and in the sudden and violent of substrate in the state of laminated body
Show up to form functional layer.In this manufacturing method, the treatability of substrate improves, therefore can be in the good landform of exposure of substrate
At functional layer.Moreover, stiffening plate self-reference substrate after forming functional layer is removed.
The stripping means of stiffening plate disclosed in patent document 1 passes through from two on the diagonal line of laminated body for being located at rectangle
A corner in a corner towards another corner makes stiffening plate or substrate or their twocoueses direction separated from each other
Successively flexible deformation carries out.At this point, in order to go on smoothly removing, in a corner of laminated body production removing beginning portion.
Removing beginning portion is and hoe scaler is inserted into predetermined amount into the interface between substrate and stiffening plate from the end face of laminated body
Production.
The stripping off device of patent document 1 include objective table, flex plate, multiple suckers, multiple driving devices (movable body), with
And control device etc..It using the stripping off device of patent document 1, is adsorbed using objective table and keeps substrate, adsorbed and protected using flex plate
Hold stiffening plate.The bar of multiple driving devices is linked to flex plate by multiple suckers.Also, control device is to multiple driving devices
Bar controlled as unit of each bar relative to the position of objective table.Specifically, flatly being supported using objective table
In the state of substrate, the position of the bar of multiple driving devices is controlled, keeps stiffening plate portion since the removing successively flexible
Deformation.Thereby, it is possible to self-reference substrates to remove stiffening plate.
Patent document 1: No. 5155454 bulletins of Japanese Patent Publication No.
Summary of the invention
Problems to be solved by the invention
In the stripping off device of patent document 1, multiple driving devices are equally spaced set to flex plate with chessboard trellis.That is,
The stripping off device of patent document 1 is the structure that the power of each bar of multiple driving devices is transferred directly to flex plate via sucker
It makes, therefore there are the increase of the number of units of driving device, apparatus structure complicates such problems.
The present invention is made in view of such problems, it is intended that with providing the number of units that can cut down movable body
The manufacturer of stripping off device and stripping means and electronic device to the laminated body removed between the 1st substrate and the 2nd substrate
Method.
The solution to the problem
In order to reach the purpose, the present invention provides a kind of stripping off device of laminated body, makes have the 1st substrate and the 2nd base
Plate and laminated body made of the 1st substrate and the 2nd substrate is bonded in a manner of it can remove in the 1st substrate and institute
It is successively removed from one end towards another side at the interface stated between the 2nd substrate, which is characterized in that the stripping off device of the laminated body
Include: supporting part, is used to support the 1st substrate of the laminated body；Flex plate adsorbs the layer using its adsorption plane
The 2nd substrate of stack；And multiple movable bodys, multiple movable body are being installed on the flex plate with the adsorption plane phase
The face of anti-side, and make the flex plate from one by making multiple movable bodys be independently relative to the supporting part movement
End side is towards another side flexible deformation, so that the laminated body be made successively to remove at the interface, the multiple movable body with
Individually unit and to be installed on the flex plate by more coupling members as unit of multiple.
In order to reach the purpose, the present invention provides a kind of stripping means of laminated body, makes have the 1st substrate and the 2nd base
Plate and laminated body made of the 1st substrate and the 2nd substrate is bonded in a manner of it can remove in the 1st substrate and institute
It is successively removed from one end towards another side at the interface stated between the 2nd substrate, which is characterized in that the stripping means of the laminated body
Include: bearing process, the 1st substrate of the laminated body is supported using supporting part；Absorption process utilizes the absorption of flex plate
Adsorb the 2nd substrate of the laminated body in face；And stripping process, make using multiple movable bodys and by more coupling members
The flex plate flexible deformation and become the 2nd substrate of the laminated body from one end towards another side is successively flexible
Shape, so that the laminated body be made successively to remove at the interface.
In order to reach the purpose, the present invention provides a kind of manufacturing method of electronic device, the manufacturer of the electronic device
Method includes functional layer formation process, for laminated body made of pasting the 1st substrate and the 2nd substrate in a manner of it can remove,
Functional layer is formed in the exposure of the 1st substrate；And separation process, self-forming have the 1st substrate of the functional layer
Separate the 2nd substrate, which is characterized in that the separation process includes bearing process, supports the laminated body using supporting part
The 1st substrate；Absorption process adsorbs the 2nd substrate of the laminated body using the adsorption plane of flex plate；And removing
Process using multiple movable bodys and makes the flex plate flexible deformation by more coupling members and makes described in the laminated body
2nd substrate is from one end towards another side successively flexible deformation, so that the 2nd substrate successively be shelled from the 1st substrate
From.
Using the present invention, in stripping process, the power of movable body is transferred to flex plate via coupling member and makes flexibility
Plate flexible deformation.That is, previous movable body makes flex plate flexible deformation and transmitting power to flex plate on one point, but at this
In invention, due to making coupling member between movable body and flex plate, the power of movable body can be made to pass with line or face
It is handed to flex plate.Thereby, it is possible to the 1st substrate and the 2nd substrate are removed using the stripping off device after the number of units for reducing movable body.
In a technical solution of the invention, it is preferred that the coupling member is configured to lengthwise shape, the coupling member
Long axis configured along the removing front of the boundary line between the released part and unstripped part as the interface, and institute
It states coupling member and is configured with more at spaced intervals along the removing direction of travel at the interface.
It can since the long axis of coupling member is consistent with removing front using a technical solution of the invention
Successfully removed between the 1st substrate and the 2nd substrate.
In another technical solution of the invention, it is preferred that the length of the coupling member be respectively structured as with it is described
The length for removing front is corresponding, and the movable body configuration is in the position that the coupling member is waited to segmentations in the longitudinal direction.
Using another technical solution of the invention, due to can on the length direction of coupling member Transmit evenly
The power of movable body, therefore can further successfully be removed between the 1st substrate and the 2nd substrate.
In another technical solution of the invention, it is preferred that the coupling member is installed on described by buffer component
Flex plate.
Using the another technical solution of the invention, even if making to prop up because of the deviation of the flatness of supporting part and flex plate
Interval between bearing portion and flex plate produces deviation, and buffer component can also absorb the deviation, therefore can by coupling member
Flex plate is installed on by ground.In addition, can will link since buffer component also absorbs the deviation of the straightness of coupling member
Component is reliably mounted on flex plate.
The effect of invention
Using the stripping off device and stripping means of laminated body of the invention and the manufacturing method of electronic device, can cut down can
Removed between the 1st substrate and the 2nd substrate to the number of units of kinetoplast.
Detailed description of the invention
Fig. 1 is to indicate that the main portions of an example of the laminated body supplied to the manufacturing process of electronic device amplify side view
Figure.
Fig. 2 is to indicate that the main portions of an example of the laminated body made in the midway of the manufacturing process of LCD amplify side view
Figure.
(E) of (A)~Fig. 3 of Fig. 3 is the production side, removing beginning portion for indicating to carry out using removing beginning portion producing device
The explanatory diagram of method.
Fig. 4 is the top view that the laminated body in removing beginning portion has been made using removing beginning portion production method.
Fig. 5 is the longitudinal section view for indicating the structure of stripping off device of embodiment.
Fig. 6 is the allocation position for indicating more coupling members relative to stripping unit, flex plate top view.
(C) of (A)~Fig. 7 of Fig. 7 is the explanatory diagram for indicating the structure of stripping unit.
Fig. 8 is the longitudinal section view in the stripping off device of interface peel laminated body.
Fig. 9 is the longitudinal section view for indicating buffer component relative to the mounting structure of coupling member.
(A) of Figure 10 and (B) of Figure 10 are the longitudinal section views for indicating the buffer component of movement of buffer component 82.
(C) of (A)~Figure 11 of Figure 11 is to indicate that stripping will have been made by removing beginning portion production method in chronological order
Leave the explanatory diagram of the stripping means of the stiffening plate removing of the laminated body in beginning portion.
(C) of (A)~Figure 12 of Figure 12 is that then Figure 11 (A)~Figure 11 (C) is indicated in chronological order by laminated body
Stiffening plate removing stripping means explanatory diagram.
(A) of Figure 13 and (B) of Figure 13 are the main portions amplification stereogram of (C) of Figure 11 (B) and Figure 11.
Specific embodiment
Hereinafter, illustrating embodiments of the present invention with reference to the accompanying drawings.
Hereinafter, explanation uses the stripping off device of laminated body of the invention in manufacturing process's (manufacturing method) of electronic device
And the case where stripping means.
Electronic device refers to the electronic components such as display panel, solar battery, thin-film secondary battery.As display panel,
Can illustrate liquid crystal display (LCD:Liquid Crystal Display) panel, plasma display device (PDP:
Plasma Display Panel) and organic el display (OELD:Organic Electro Luminescence
Display) panel.
The manufacturing process of electronic device
Electronic device forms the function of electronic device by the surface of the substrate in glass system, resin system, made of metal etc.
Layer (being then thin film transistor (TFT) (TFT), colour filter (CF) if LCD) and manufacture.
Before forming functional layer, the back side of the substrate is made to be pasted on stiffening plate and be configured to laminated body.Later, in layer
In the state of stack, functional layer is formed on the surface of the substrate.Then, after forming functional layer, remove stiffening plate self-reference substrate.
That is, in the manufacturing process of electronic device, comprising: form functional layer on the surface of the substrate in the state of laminated body
Functional layer formation process and the active ergosphere of self-forming substrate separation stiffening plate separation process.Separation process application is originally
The stripping off device and stripping means of the laminated body of invention.
Laminated body 1
Fig. 1 is the main portions enlarged side view for indicating an example of laminated body 1.
Laminated body 1 includes the substrate (the 1st substrate) 2 formed for functional layer and the stiffening plate the (the 2nd for reinforcing the substrate 2
Substrate) 3.In addition, stiffening plate 3 has the resin layer 4 as adsorption layer in surface 3a, the back of substrate 2 is bonded on resin layer 4
Face 2b.That is, substrate 2 is using the bonding force in its Van der Waals force or resin layer 4 that act between resin layer 4 across resin layer 4
Stiffening plate 3 is pasted in a manner of it can remove.
Substrate 2
Functional layer is formed in surface (exposure) 2a of substrate 2.As substrate 2, glass substrate, ceramic base can be illustrated
Plate, resin substrate, metal substrate, semiconductor substrate.Among these substrates, due to the chemical resistance of glass substrate, resistance to moisture-inhibiting
The excellent and linear expansion coefficient of property is smaller, therefore, is suitable as the substrate 2 of electronic device.In addition, since linear expansion coefficient becomes
It is small, therefore also have the advantages that the pattern of the functional layer formed at high temperature is difficult to deviate while cooling.
As the glass of glass substrate, can illustrate alkali-free glass, pyrex, soda-lime glass, high silica glass, its
He with silica oxide system glass as main component.The content of silica of the oxide system glass preferably in terms of oxide
For the glass of 40 mass of mass %~90 %.
Glass as glass substrate, it is preferred that select and apply the type for being suitable for manufactured electronic device
Glass or the glass for being suitable for its manufacturing process.For example, the glass substrate of liquid crystal board is preferably, using being substantially free of
The glass (alkali-free glass) of alkali metal component.
The thickness of substrate 2 is set according to the type of substrate 2.For example, in the case where substrate 2 is using glass substrate,
Lightness, thin plate for electronic device, the thickness of substrate 2 are preferably set to 0.7mm hereinafter, being more preferably set in 0.3mm
Hereinafter, being further preferably set in 0.1mm or less.Substrate 2 thickness in 0.3mm situation below, glass can be assigned
Substrate good flexibility.Moreover, substrate 2 thickness in 0.1mm situation below, glass substrate can be rolled up as web-like,
From the viewpoint of the processing of the viewpoint of the manufacture of glass substrate and glass substrate, the thickness of preferable substrate 2 0.03mm with
On
In addition, substrate 2 is made of a substrate in Fig. 1, but substrate 2 can also be made of multiple substrates.That is, substrate 2
It can also be by laminated body made of the stacking of multiple substrates be constituted.In this case, constituting the aggregate thickness of all substrates of substrate 2
Thickness as substrate 2.
Stiffening plate 3
As stiffening plate 3, glass substrate, ceramic substrate, resin substrate, metal substrate, semiconductor substrate can have been illustrated.
The thickness of stiffening plate 3 is set in 0.7mm hereinafter, being set according to the type for the substrate 2 reinforced, thickness etc..
In addition, the thickness that the thickness of stiffening plate 3 can both be greater than substrate 2 might be less that the thickness of substrate 2, but in order to reinforce substrate 2,
The thickness of stiffening plate 3 is preferably in 0.4mm or more.
In addition, in the present embodiment, stiffening plate 3 is made of a substrate, but stiffening plate 3 can also be by by multiple substrate layers
Laminated body made of folded is constituted.In this case, the aggregate thickness for constituting all substrates of stiffening plate 3 becomes the thickness of stiffening plate 3.
Resin layer 4
Laminated body is removed between resin layer 4 and stiffening plate 3 in order to prevent, and by the knot between resin layer 4 and stiffening plate 3
Resultant force is set to higher than the binding force between resin layer 4 and substrate 2.As a result, in stripping process, resin layer 4 and substrate 2 it
Between interface peel.
The resin for constituting resin layer 4 is not particularly limited, and can there are acrylic resin, polyolefin resin, polyurethane
Resin, polyimide resin, organic siliconresin and polyimides organic siliconresin.Several resins can also be used in mixed way.Its
In, from the viewpoint of heat resistance, fissility, preferably organic siliconresin, polyimides organic siliconresin.
The thickness of resin layer 4 is not particularly limited, and is preferably set to 1 μm~50 μm, is more preferably set as 4 μm~20 μm.
The thickness of resin layer 4 is set in 1 μm or more, thus when being mixed into bubble, foreign matter between resin layer 4 and substrate 2, Neng Gouli
The thickness of bubble, foreign matter is absorbed with the deformation of resin layer 4.On the other hand, by the thickness of resin layer 4 be located at 50 μm hereinafter, to
The formation time of resin layer 4 can be shortened, and need not excessively use the resin of resin layer 4, therefore more economical.
In addition, in order to enable stiffening plate 3 to support entire resin layer 4, the shape of resin layer 4 is preferably and stiffening plate 3
Shape of the shape identical or less than stiffening plate 3.In addition, the shape of resin layer 4 is excellent in order to keep resin layer 4 and entire substrate 2 closely sealed
It is selected as shape identical as the shape of substrate 2 or greater than substrate 2.
In addition, resin layer 4 is constituted by one layer in Fig. 1, but resin layer 4 can also be constituted by two layers or more.The situation
Under, all layers of total thickness for constituting resin layer 4 becomes the thickness of resin layer 4.In addition, in this case, constituting each layer
The type of resin can also be different.
Moreover, in embodiments, having used organic film i.e. resin layer 4 as adsorption layer, but inorganic layer also can be used
To replace resin layer 4.The inoranic membrane of inorganic layer is constituted for example containing from by metal silicide, nitride, carbide and carbon nitrogen
At least one selected in the group that compound is constituted.
Moreover, there is the laminated body 1 of Fig. 1 resin layer 4 to be used as adsorption layer, but laminated body 1 can not also include resin layer 4 and
Including substrate 2 and stiffening plate 3.In this case, make substrate 2 using the Van der Waals force etc. acted between substrate 2 and stiffening plate 3
It is pasted in a manner of it can remove with stiffening plate 3.In addition, in the case where substrate 2 and stiffening plate 3 are glass substrate, in order to make
Substrate 2 and stiffening plate 3 are not bonded at high temperature, preferably form inorganic thin film in the surface 3a of stiffening plate 3.
It is formed with the laminated body 6 of the embodiment of functional layer
Via functional layer formation process to form functional layer in the surface 2a of the substrate 2 of laminated body 1.As functional layer
Forming method is able to use CVD (Chemical Vapor Deposition: chemical vapor deposition) method and PVD (Physical
Vapor Deposition: physical vapour deposition (PVD)) method etc. vapour deposition method, sputtering method.Functional layer is formed using photoetching process, etching method
For scheduled pattern.
Fig. 2 is the main portions for indicating an example of laminated body 6 for the rectangle made by the midway of the manufacturing process of LCD
Enlarged side view.
Laminated body 6 includes stiffening plate 3A, resin layer 4A, substrate 2A, functional layer 7, substrate 2B, resin layer 4B and stiffening plate
3B is simultaneously laminated with the sequence.That is, the laminated body 6 of Fig. 2 is equivalent to laminated body 1 shown in FIG. 1 to clip the side of functional layer 7
Laminated body made of formula balanced configuration.Hereinafter, the laminated body including substrate 2A, resin layer 4A and stiffening plate 3A is known as the 1st
Laminated body including substrate 2B, resin layer 4B and stiffening plate 3B is known as the 2nd laminated body 1B by laminated body 1A.
The thin film transistor (TFT) (TFT) as functional layer 7 is formed in the surface 2Aa of the substrate 2A of the 1st laminated body 1A, the 2nd
The surface 2Ba of the substrate 2B of laminated body 1B forms the colour filter (CF) as functional layer 7.
1st laminated body 1A and the 2nd laminated body 1B is by making the surface 2Ba of the surface 2Aa of substrate 2A, substrate 2B mutually coincide
And it is integrated.The 1st laminated body 1A and the 2nd laminated body the 1B construction of balanced configuration in a manner of clipping functional layer 7 are manufactured as a result,
Laminated body 6.
In the removing beginning portion production process of separation process using knife after laminated body 6 forms removing beginning portion, dividing
From stiffening plate 3A, 3B is successively removed in the stripping process of process, later, installation polarizing film, backlight etc., to be manufactured as production
The LCD of product.
Remove beginning portion producing device 10
(E) of (A)~Fig. 3 of Fig. 3 is to indicate the removing beginning portion production dress used in removing beginning portion production process
The explanatory diagram of 10 structure is set, (A) of Fig. 3 is the explanatory diagram for indicating the positional relationship between laminated body 6 and knife N, (B) of Fig. 3
It is to make the explanatory diagram in removing beginning portion 26 at interface 24 using knife N, (C) of Fig. 3 is to indicate to make at interface 28 to remove
The explanatory diagram of the state in beginning portion 30, (D) of Fig. 3 are to make the explanatory diagram in removing beginning portion 30, Fig. 3 at interface 28 using knife N
(E) be made removing beginning portion 26,30 laminated body 6 explanatory diagram.In addition, Fig. 4 is that production has removing beginning portion 26,30
Laminated body 6 top view.
When beginning portion 26,30 are removed in production, as shown in (A) of Fig. 3, laminated body 6 is adsorbed with the back side 3Bb of stiffening plate 3B
The mode of workbench 12 is held in by along horizontal (X-direction in figure) bearing.
Knife N is kept the mode horizontal twelve Earthly Branches opposite with the end face of corner (one end) 6A of laminated body 6 with point of a knife of part 14
It holds.In addition, adjusting position of the knife N in short transverse (Z-direction in attached drawing) using height adjuster 16.In addition, utilizing
The conveying devices such as ball-screw apparatus 18 relatively move knife N and laminated body 6 in the horizontal direction.As long as conveying device 18 makes knife
At least one of N and workbench 12 are moved in the horizontal direction, in embodiments, keep knife N mobile.In addition, knife N's
Top is configured with the fluid Supplying apparatus 22 of the upper surface supply liquid 20 for the knife N to before being inserted into or in insertion.
Remove beginning portion production method
The characteristics of removing beginning portion's production method carried out using removing beginning portion producing device 10, is: by inserting for knife N
Enter the position being overlapped on the thickness direction of laminated body 6 that position is set in the corner 6A of laminated body 6, and inserting knife N
Enter amount and is set as different according to each interface 24,28.
Illustrate the making step in the removing beginning portion.
In the initial state, the point of a knife of knife N is located relative between the 1st insertion position, i.e. substrate 2B and resin layer 4B
The position that interface 24 is offset by short transverse (Z-direction).Therefore, firstly, as shown in (A) of Fig. 3, make knife N in height
It is moved on direction, the height of the point of a knife of knife N is set in the height at interface 24.
Then, it as shown in (B) of Fig. 3, moves horizontally knife N towards the corner 6A of laminated body 6, knife N is inserted to interface 24
Enter predetermined amount.In addition, supplying liquid 20 from fluid Supplying apparatus 22 to the upper surface of knife N when being inserted into knife N or before insertion knife N.
The substrate 2B of corner 6A is removed from resin layer 4B as a result, therefore, as shown in figure 4, producing vertical view triangular shape at interface 24
Removing beginning portion 26.In addition, liquid 20 must be not necessarily supplied, but if if using liquid 20, even if knife N is extracted it
Therefore liquid 20, which can also remain in removing beginning portion 26, afterwards can make the removing beginning portion 26 that can not adhere to again.
Then, knife N is extracted in the horizontal direction from corner 6A, as shown in (C) of Fig. 3, the point of a knife of knife N is set in the 2nd and inserts
Enter the height at the interface 28 between position, i.e. substrate 2A and resin layer 4A.
Then, it as shown in (D) of Fig. 3, moves horizontally knife N towards laminated body 6, knife N is inserted into predetermined amount to interface 28.
Similarly, liquid 20 is supplied from fluid Supplying apparatus 22 to the upper surface of knife N.As a result, as shown in (D) of Fig. 3, made at interface 28
Make removing beginning portion 30.Here, knife N is set as being less than insertion of the knife N relative to interface 24 relative to the insertion at interface 28.With
Upper is removing beginning portion production method.Alternatively, it is also possible to by knife N relative to the insertion at interface 24 be set as be less than knife N relative to
The insertion at interface 28.
Since the laminated body 6 for having made removing beginning portion 26,30 is removed in portion's producing device 10 removing, after being delivered to
The stripping off device stated successively is removed at interface 24,28 using stripping off device.
The detailed content of aftermentioned stripping means makes laminated body 6 from corner 6A direction and corner 6A as shown in the arrow A of Fig. 4
Opposite corner (another side) 6B flexure, to be started at first at the biggish interface 24 of area in removing beginning portion 26 with removing
Portion 26 is that starting point is removed.Stiffening plate 3B is removed as a result,.Then, laminated body 6 is scratched again from corner 6A towards corner 6B
Song, to be removed at the lesser interface 28 of area in removing beginning portion 30 with removing beginning portion 30 as starting point.It removes as a result,
Stiffening plate 3A.
In addition, the insertion of knife N is preferably set to 7mm or more according to the size of laminated body 6, be more preferably set in 15mm~
20mm or so.
Stripping off device 40
Fig. 5 is the longitudinal section view for indicating the structure of stripping off device 40 of embodiment, and Fig. 6 is to schematically show more
(in Fig. 6 be 19) coupling member 44A, 44B, 44C, 44D, 44E, 44F, 44G, 44H, 44I, 44J, 44K, 44L, 44M,
44N, 44O, 44P, 44Q, 44R, 44S and Duo Tai driving device (movable body) 48A, 48B, 48C, 48D, 48E, 48F, 48G, 48H,
The configuration of 48I, 48J, 48K, 48L, 48M, 48N, 48O, 48P, 48Q, 48R, 48S relative to the stripping unit 42 of stripping off device 40
Position, stripping unit 42 top view.In addition, Fig. 5 is equivalent to the cross-sectional view of the line B-B along Fig. 6, in addition, in Fig. 6 with
Solid line indicates laminated body 6.
Stripping off device 40 shown in fig. 5 includes the upper side and lower side that laminated body 6 is configured in a manner of clamping laminated body 6
A pair of of movable device 46,46.Movable device 46,46 structures are identical, therefore, illustrate to configure the movable dress in the downside of Fig. 5 herein
46 are set, the movable device 46 to configuration in upside marks identical appended drawing reference and omits the description.
Movable device 46 makes to connect including the more coupling member 44A~44S, according to every coupling member 44A~44S
More driving device 48A~48S of structural member 44A~44S lifting moving and according to every driving device 48A~48S
Come the controller 50 etc. for controlling driving device 48A~48S.In addition, coupling member 44A~44S and driving device is described below
48A~48S.In addition, coupling member 44A, 44B, 44C, 44D, 44P, 44Q, 44R, 44S utilize 1 (single) driving device
48A, 48B, 48C, 48D, 48P, 48Q, 48R, 48S carry out lifting moving.Other coupling members 44E, 44F, 44G, 44H, 44I,
44J, 44K, 44L, 44M, 44N, 44O using two (multiple) 48E, 48F, 48G, 48H, 48I, 48J, 48K, 48L, 48M, 48N,
48O carries out lifting moving.
In order to make stiffening plate 3B flexible deformation, stripping unit 42 is by stiffening plate 3B vacuum suction and keeps.In addition, replacing true
Suction is attached, can also use Electrostatic Absorption or magnetic suck.
Stripping unit 42
(A) of Fig. 7 is the top view of stripping unit 42, (B) of Fig. 7 be along Fig. 7 (A) line C-C, removing it is single
The amplification longitudinal section view of member 42.In addition, (C) of Fig. 7 is to indicate the adsorption section 54 for constituting stripping unit 42 by double-sided adhesive tape
56 are set to the flex plate 52 for the plate of rectangle for constituting stripping unit 42, stripping unit 42 amplification by loading and unloading freely
Longitudinal section view.
Stripping unit 42 is configured to as described, and adsorption section 54 is pacified by loading and unloading freely by double-sided adhesive tape 56
Loaded on flex plate 52.
The flex plate 58 that adsorption section 54 has thickness thinner than flex plate 52.The lower surface of the flex plate 58 is by double-sided adhesive
The upper surface for being installed on flex plate 52 by loading and unloading freely with 56.
In addition, being equipped with the ventilation for adsorbing the rectangle of the inner surface of the stiffening plate 3B of retaining layer stack 6 in adsorption section 54
Property sheet material (adsorption plane) 60.In order to reduce the tensile stress for resulting from stiffening plate 3B in removing, the thickness of aeration sheet material 60
For 2mm hereinafter, preferably 1mm hereinafter, use the aeration sheet material 60 with a thickness of 0.5mm in embodiments.
In addition, being additionally provided with the sealing frame surrounding aeration sheet material 60 and abutting with the outer peripheral surface of stiffening plate 3B in adsorption section 54
Component 62.Sealing frame component 62 and aeration sheet material 60 are adhered to the upper surface of flex plate 58 by double-sided adhesive tape 64.In addition,
Sealing frame component 62 is the cavernous body that Shore E hardness is 20 degree or more and 50 degree closed pores below, the thickness of sealing frame component 62
It is configured to 0.3mm~0.5mm thicker than the thickness of aeration sheet material 60.
The slot 66 of frame-shaped is equipped between aeration sheet material 60 and sealing frame component 62.In addition, having in the opening of flex plate 52
One end of multiple through holes 68, these through holes 68 is connected to slot 66, and the other end is through not shown suction pipeline and source of suction
(such as vacuum pump) connection.
Thus, when driving the source of suction, the air in the suction pipeline, through hole 68 and slot 66 is attracted,
To which the inner surface of the stiffening plate 3B of laminated body 6 by vacuum suction and is held in aeration sheet material 60, also, stiffening plate 3B's is outer
Circumferential surface is pushed and is connected to sealing frame component 62.The airtightness of the adsorption space surrounded as a result, by sealing frame component 62 improves.
Compared with flex plate 58, aeration sheet material 60 and sealing frame component 62, the flexural rigidity of flex plate 52 is higher, because
This, the flexural rigidity of flex plate 52 determines the flexural rigidity of stripping unit 42.It is preferred that the per unit width (1mm) of stripping unit 42
Flexural rigidity be 1000Nmm2/ mm~40000Nmm2/mm.For example, stripping unit 42 width be 100mm portion
Point, flexural rigidity 100000Nmm2~4000000Nmm2.By the way that the flexural rigidity of stripping unit 42 is set as 1000N
mm2/ mm or more can prevent absorption to be held in the stiffening plate 3B bending of stripping unit 42.Also, by by stripping unit 42
Flexural rigidity is set as 40000Nmm2/ mm is hereinafter, the stiffening plate 3B that absorption can be made to be held in stripping unit 42 is suitably flexible
Deformation.
Flex plate 52,58 is that Young's modulus is 10GPa resinous member below, for example, polycarbonate resin, polychlorostyrene
The resinous member of ethylene (PVC) resin, acrylic resin, polyacetals (POM) resin etc..
Movable device 46
More coupling member 44A~44S for constituting the movable device 46 of Fig. 5 are fixed on flex plate 52 by buffer component 82
Lower surface (face of the side opposite with adsorption plane).
Coupling member 44A~44S
As shown in fig. 6, coupling member 44A~44S is such as aluminum with a higher rigidity, the long axis of coupling member 44A~44S
Along the removing of the boundary line between the released part and unstripped part at the interface 24,28 (referring to Fig. 5) as laminated body 6
Front L (referring to Fig. 6, Fig. 8) configuration.
On the other hand, the corner 52A corresponding with the corner 6A of laminated body 6 of flex plate 52 is relative to removing front L's
Removing direction of travel A extends round about.In corner 52A, two coupling members are configured with along removing direction of travel A
44A, 44B and two driving devices 48A, 48B.That is, passing through two driving devices 48A, the 48B decline for making to be configured at corner 52A
Movement is to remove corner 6A.
In addition, removing direction of travel (the arrow A of Fig. 6) of the coupling member 44A~44S along interface 24,28 (referring to Fig. 5)
It configures at spaced intervals.It is consistent as a result, due to the long axis of coupling member 44A~44S with the removing front L of traveling, it can
Self-reference substrate 2B successfully removes stiffening plate 3B.
Also, the length of coupling member 44C~44Q is respectively structured as corresponding with the removing length of front L.
In addition, be connected with coupling member 44A~44S driving device 48A~48S configuration by coupling member 44A~
The position of 44S segmentations equal in the longitudinal direction.That is, since removing front is without the connection in the outside for being configured at removing starting end
The lower section of component 44A, 44B and be configured at removing end outside coupling member 44R, 44S lower section, therefore, driving dress
It sets the central portion of 48A, 48B, 48R, 48S on the length direction of coupling member 44A, 44B, 44R, 44S and is each configured with one.
It is being configured at the lower section of coupling member 44C, 44D of removing starting end and is being configured at coupling member 44P, 44Q of removing end
The length being shorter in length than in other parts of removing front L passed through of lower section, therefore driving device 48C, 48D, 48P, 48Q exist
Central portion on the length direction of coupling member 44C, 44D, 44P, 44Q is each configured with one.In connection structure in addition to this
The length for the removing front L that the lower section of part 44E~44O is passed through is longer than the length in other parts, therefore, driving device 48E~
48O is each configured with two in a manner of by coupling member 44E~44O in the longitudinal direction 3 equal parts.Thereby, it is possible to link
Transmit evenly carrys out the power of automatic drive device 48A~48S on the length direction of component 44A~44S, therefore being capable of self-reference substrate 2B
Further successfully remove stiffening plate 3B.In addition, the segmentation number on the length direction is not limited to 2 segmentations, 3 segmentations,
More than can be for 4 segmentations, but on condition that not depart from the number of units of the such purpose of the present invention for the number of units for cutting down driving device.
These driving devices 48A~48S passes through the independently lifting moving of controller 50.
That is, controller 50 controls driving device 48A~48S to make from the corner side 6A for the laminated body 6 being located in Fig. 6
The coupling member 44A of position to be located at shown in arrow A remove direction of travel the corner side 6B position coupling member 44S according to
Secondary decline movement.According to the movement, as shown in the longitudinal section view of Fig. 8, by laminated body 6 at interface 24 to remove (the ginseng of beginning portion 26
According to Fig. 4) it is that starting point is removed.In addition, Fig. 5, laminated body shown in Fig. 86 are to say using in (E) of (A)~Fig. 3 of Fig. 3
Bright removing beginning portion production method has made the laminated body 6 in removing beginning portion 26,30.
Driving device 48A~48S is for example including revolving servo motor and ball screw framework etc..The rotation of servo motor
Transhipment is moved is converted to linear motion in ball screw framework, is transferred to the bar 70 of ball screw framework.In the top end part of bar 70
Coupling member 44A~44S is connected with by spherojoint (not shown) and side-slipping mechanism.Thereby, it is possible to make coupling member 44A~
44S follows the flexible deformation of stripping unit 42 and fascinates.Thus, it can make to remove not applying excessive power to stripping unit 42
Unit 42 is from corner 6A towards corner 6B successively flexible deformation.In addition, being not limited to rotate as driving device 48A~48S
The servo motor and ball screw framework of formula can also be linear servo motor or fluid-pressure cylinder (such as pneumatic cylinder).
When the stiffening plate 3B that will have been removed is removed from stripping unit 42, carry out frame 74 using driving portion (not shown)
Decline movement.
Controller 50 be configured to include the recording mediums such as ROM and RAM, CPU etc. computer.Controller 50 holds CPU
Row record program on the recording medium, controlled as a result, according to every driving device 48A~48S more driving device 48A~
48S, to control the lifting moving of more coupling member 44A~44S.
Buffer component 82
Fig. 9 is the longitudinal section view for indicating buffer component 82 relative to the mounting structure of coupling member 44D.In addition, Figure 10
(A) longitudinal section view of the buffer component 82 when being uncompressed, the longitudinal section view of the buffer component 82 when (B) of Figure 10 is compression.
In addition, instantiating the buffer component 82 for being installed on coupling member 44D, but pacify in (A) of Fig. 9 and Figure 10 and (B) of Figure 10
Buffer component 82 loaded on other coupling members 44A~44C, coupling member 44E~44S is also same structure.Buffer component
82 include bolt 84, spring 86, stop part 88 and nut 90.
The base portion 84A of bolt 84 is fixed on to the flex plate 52 of stripping unit 42, the screw thread of bolt 84 using screw element 92
Portion 84B is projected into outside from the through hole 45 of coupling member 44D.Threaded portion 84B is inserted into spring 86, and spring 86 is between base portion
Between 84A and coupling member 44D.In addition, the section constitution of coupling member 44D is U-shaped.
The diameter stop part 88 bigger than through hole 45 is fixed on from the threaded portion outstanding of through hole 45 using nut 90
84B.As shown in (A) of Figure 10, under the form on the surface that the stop part 88 is connected to coupling member 44D, spring 86 is kept
For precommpression length.Buffer component 82 becomes uncompressed form as a result,.In addition, in Fig. 9, when driving device 48D to be utilized makes
It, can be by 88 He of stop part since the surface of coupling member 44D is connected to stop part 88 when coupling member 44D rises
Bolt 84 rises stripping unit 42.
In addition, making to be configured at the pairs of of the upper side and lower side because of the deviation of the flatness of the flex plate 52 of stripping unit 42
Stripping unit 42,42 between interval (interval between supporting part and flex plate) produce deviation in the case where, spring 86
It is shunk as shown in (B) of Figure 10 and absorbs the deviation.In addition, the straightness in coupling member 44D produces the feelings of deviation
It under condition, is shunk by spring 86, can also absorb the deviation.Even if the interval and the straightness produce deviation as a result,
Coupling member 44D can be reliably mounted on to flex plate 52.
The stripping means of stiffening plate 3A, 3B is removed using stripping off device 40
In (C) of (the A)~Figure 12 of (C) and Figure 12 of (A)~Figure 11 of Figure 11, (A)~Fig. 3 in Fig. 3 is shown
(E) illustrated in, by removing beginning portion production method corner 6A made removing beginning portion 26,30 laminated body 6
Stripping means.That is, indicating stripping in chronological order in (C) of (the A)~Figure 12 of (C) and Figure 12 of (A)~Figure 11 of Figure 11
The stripping means of stiffening plate 3A, 3B of absciss layer stack 6.
In addition, inputting the input operation of laminated body 6 to stripping off device 40, exporting the stiffening plate removed from stripping off device 40
Conveying device 80 of the output operation of 3A, 3B and panel P as shown in (A) of Figure 11 with sucker 78 carries out.Wherein, in Figure 11
(C) of (A)~Figure 11, Figure 12 (A)~Figure 12 (C) in, it is multifarious in order to avoid attached drawing, movable device 46 is omitted
Diagram.In addition, panel P, which refers to, is pasted with production made of the substrate 2A and substrate 2B for removing stiffening plate 3A, 3B across functional layer 7
Product panel.
(A) of Figure 11 is the removing that laminated body 6 is placed in downside by movement shown in arrow E, F by conveying device 80
Unit 42, stripping off device 40 side view.In this case, in order in the stripping unit of the stripping unit 42 of downside and upside
It is inserted into conveying device 80 between 42, and relatively moves to the stripping unit 42 of downside and the stripping unit 42 of upside in advance sufficiently
The position kept out of the way.Later, it when laminated body 6 to be placed in the stripping unit 42 of downside, is inhaled by 42 vacuum of stripping unit of downside
Attached and retaining layer stack 6 stiffening plate 3B.That is, (A) of Figure 11 shows the stiffening plate 3B as the 2nd substrate by the removing of downside
The absorption process that the absorption of unit 42 is kept.
(B) of Figure 11 be the stripping unit 42 for the stripping unit 42 and upside for making downside it is mobile to relatively close direction and
Make the stiffening plate 3A of laminated body 6 by the side view of the stripping off device 40 of 42 vacuum suction of stripping unit of upside and the state of holding
Figure.That is, (B) of Figure 11 shows the branch supported as the stiffening plate 3A of the 1st substrate by the stripping unit (supporting part) 42 of upside
Hold process.In addition, (A) of Figure 13 is perspective view corresponding with Figure 11 (B), it is to indicate the corner 6A amplification of laminated body 6
Perspective view.
In addition, the case where stripping off device 40 to be utilized removes the substrate 2 of laminated body 1 shown in FIG. 1 from stiffening plate 3
Under, the substrate 2 (bearing process) as the 1st substrate is supported using the stripping unit 42 (supporting part) of upside, and utilize downside
Stripping unit 42 keep stiffening plate 3 (absorption process) as the 2nd substrate to adsorb.In this case, the branch of supporting substrates 2
Bearing portion is not limited to stripping unit 42, as long as can be with the component of the detachable mode supporting substrates 2 of substrate 2.
But by by stripping unit 42 be used as supporting part, substrate 2 can be made to be bent simultaneously with stiffening plate 3 and removed, thus with only make
Substrate 2 or the curved form of stiffening plate 3 are compared, and have the advantages that peeling force can be reduced.
Back to (C) of (A)~Figure 11 of Figure 11, (C) of Figure 11 is indicated on one side from the corner 6A of laminated body 6 towards angle
Portion 6B make the stripping unit 42 of downside downwards flexible deformation on one side at interface 24 to remove beginning portion 26 (referring to Fig. 4) as starting point
Remove the side view of the state of laminated body 6.That is, more coupling member 44A of the stripping unit 42 of downside shown in Fig. 8~
Make the coupling member 44A from the corner side 6A for being located at laminated body 6 under being located at the coupling member 44S of the corner side 6B successively in 44S
Drop movement, to be removed (stripping process) at interface 24.In addition, (B) of Figure 13 is solid corresponding with Figure 11 (C)
Figure is the perspective view for indicating the corner 6A amplification of laminated body 6.By (B) of Figure 13 it is found that passing through coupling member 44A~company
The decline of structural member 44E is mobile and makes 42 flexible deformation of stripping unit, so that self-reference substrate 2B removes stiffening plate 3B.
Alternatively, it is also possible to be, with it is described movement in linkage upside stripping unit 42 more coupling member 44A~
Make in 44S from the coupling member 44A for the corner side 6A for being located at laminated body 6 to be located at the coupling member 44S of the corner side 6B successively on
Movement is risen, to be removed at interface 24.As a result, compared with only making the curved form of stiffening plate 3B, peeling force can be reduced.
The state that (A) of Figure 12, which is stiffening plate 3B, to be completely exfoliated at interface 24, stripping off device 40 side view.According to
(A) of Figure 12, the stiffening plate 3B vacuum suction stripped down and the stripping unit 42 for being held in downside remove the layer of stiffening plate 3B
(laminated body including the stiffening plate 3A and panel P) vacuum suction of stack 6 and the stripping unit 42 for being held in upside.
In addition, in order to be inserted into conveying device 80 shown in (A) of Figure 11 between upper and lower stripping unit 42, and make downside
Stripping unit 42 and the stripping unit 42 of upside relatively move to the position sufficiently kept out of the way.
Later, firstly, releasing the vacuum suction of the stripping unit 42 of downside.Then, the sucker 78 of conveying device 80 is utilized
It is adsorbed across resin layer 4B and keeps stiffening plate 3B.Then, conveying device 80 shown in arrow G, H by (A) of Figure 12
Movement, stiffening plate 3B is exported from stripping off device 40.
(B) of Figure 12 is to remove the laminated body 6 of stiffening plate 3B by the stripping unit 42 of downside and the stripping unit 42 of upside
Vacuum suction and the side view kept.That is, make downside stripping unit 42 and upside stripping unit 42 to relatively close side
To movement, and by 42 vacuum suction of the stripping unit of downside and keep substrate 2B (bearing process).
(C) of Figure 12 is to indicate to keep the stripping unit 42 of upside upward from the corner 6A of laminated body 6 towards corner 6B on one side
Square flexible deformation is on one side the state that starting point removes laminated body 6 to remove beginning portion 30 (referring to Fig. 4) at interface 28
Side view.That is, making in more coupling member 44A~44S of the stripping unit 42 of upside shown in Fig. 8 from positioned at laminated body 6
The coupling member 44A to the coupling member 44S for being located at the corner side 6B of the corner side 6A successively rise movement, thus interface 28 into
Row removing (stripping process).Alternatively, it is also possible to the movement in linkage downside stripping unit 42 more coupling member 44A
Make the coupling member 44A from the corner side 6A for being located at laminated body 6 to being located at the coupling member 44S of the corner side 6B successively in~44S
Decline movement, to be removed at interface 28.As a result, compared with only making the curved form of stiffening plate 3A, removing can be reduced
Power.
Later, the stiffening plate 3A stripped down completely from panel P is taken out from the stripping unit 42 of upside, certainly by panel P
The stripping unit 42 of downside is taken out.It is the stripping means for the laminated body 6 for having removing beginning portion 26,30 in corner 6A production above.
The feature of stripping off device 40
1st feature
Stripping off device 40 is characterized in that: in stripping process, by the power of driving device 48A~48S via lengthwise shape
Coupling member 44A~44S be transferred to flex plate 52 and make 52 flexible deformation of flex plate.
That is, previous driving device makes flex plate flexible deformation and transmitting power to flex plate on one point, but in reality
It applies in mode, due to making coupling member 44A~44S of lengthwise shape between driving device 48A~48S and flex plate 52, because
This can make the power of driving device 48A~48S be transferred to flex plate 52 with line or face.Thereby, it is possible to utilize to reduce driving
It 40 pairs of removing substrates 2 (2A, 2B) of stripping off device after the number of units of device 48A~48S and is shelled between stiffening plate 3 (3A, 3B)
From.
2nd feature
Stripping off device 40 is characterized in that: by coupling member 44A~44S with its long axis along removing front L shown in fig. 6
Mode configure, and by coupling member 44A~44S along shown in arrow A removing direction of travel be configured at spaced intervals it is more
Root.
The long axis of coupling member 44A~44S is set to be consistent with removing front L as a result, therefore can be successfully to removing substrate
It is removed between 2 (2A, 2B) and stiffening plate 3 (3A, 3B).
3rd feature
Stripping off device 40 is characterized in that: being respectively structured as the length of coupling member 44A~44S with removing front L's
Length is corresponding, and driving device 48A~48S is arranged respectively at coupling member 44A~44S segmentations equal in the longitudinal direction
Position.
Thereby, it is possible on the length direction of coupling member 44A~44S Transmit evenly driving device 48A~48S it is dynamic
Power, therefore can further successfully be removed between removing substrate 2 (2A, 2B) and stiffening plate 3 (3A, 3B).
4th feature
Stripping off device 40 is characterized in that: coupling member 44A~44S is installed on flex plate 52 by buffer component 82.
Even if producing deviation at the interval of pairs of stripping unit 42,42 as a result, the spring 86 of buffer component 82 also can
It is shunk and absorbs the deviation.In addition, the deviation of the straightness for coupling member 44B, can also be shunk by spring 86 come
Absorb the deviation.Even if the interval and the straightness produce deviation as a result, also can be by coupling member 44B reliably
It is installed on flex plate 52.
Illustrate the present invention referring to detailed or specific embodiment, but those skilled in the art it is clear that, Neng Gou
Apply various changes, amendment under the premise of without departing from the spirit and scope of the invention.
The application went out to be willing on May 15th, 2015-032742 and 2015 based on 2 months 2015 Japanese Patents filed in 23 days
The Japanese Patent of application goes out to be willing to 2015-099740, and content is by referring to being programmed into this specification.
Description of symbols
N, knife；P, panel；1, laminated body；1A, the 1st laminated body；1B, the 2nd laminated body；2, substrate；The surface of 2a, substrate；
The back side of 2b, substrate；2A, substrate；The surface of 2Aa, substrate；2B, substrate；The surface of 2Ba, substrate；3, stiffening plate；3a, reinforcement
The surface of plate；3A, stiffening plate；3B, stiffening plate；The back side of 3Bb, stiffening plate；4, resin layer；4A, resin layer；4B, resin layer；6,
Laminated body；6A, 6B, corner；7, functional layer；10, beginning portion producing device is removed；12, workbench；14, holder；16, height
Adjust device；18, conveying device；20, liquid；22, fluid Supplying apparatus；24, interface；26, beginning portion is removed；28, interface；
30, beginning portion is removed；40, stripping off device；42, stripping unit；44A~44S, coupling member；46, movable device；48A~48S,
Driving device；50, controller；52, flex plate；54, adsorption section；56, double-sided adhesive tape；58, flex plate；60, aeration sheet material；
62, sealing frame component；64, double-sided adhesive tape；66, slot；68, through hole；70, bar；74, frame；78, sucker；80, conveying dress
It sets；82, buffer component；84, bolt；86, spring；88, stop part；90, nut；92, screw element.
Claims (5)
1. a kind of stripping off device of laminated body, makes to have the 1st substrate and the 2nd substrate and bond described the in a manner of it can remove
Interface of the laminated body between the 1st substrate and the 2nd substrate made of 1 substrate and the 2nd substrate is from one end court
It is successively removed to another side, wherein
The stripping off device of the laminated body includes:
Supporting part is used to support the 1st substrate of the laminated body；
Flex plate adsorbs the 2nd substrate of the laminated body using its adsorption plane；And
Multiple movable bodys, multiple movable body are installed on the face of the side opposite with the adsorption plane of the flex plate, and
By being independently relative to multiple movable bodys, the supporting part is mobile to make the flex plate from one end towards another side
Flexible deformation, thus remove the laminated body successively at the interface,
The multiple movable body is installed on the flexibility by more coupling members as unit of single and as unit of multiple
Plate,
The coupling member is configured to lengthwise shape, the long axis of the coupling member along as the interface released part with
The removing front of boundary line between unstripped part configures, and the coupling member is along the removing direction of travel at the interface
It is configured with more at spaced intervals.
2. the stripping off device of layered product according to the claim 1, wherein
The length of the coupling member is respectively structured as corresponding with the removing length in front, and movable body configuration will be will
The position of coupling member segmentations equal in the longitudinal direction.
3. the stripping off device of laminated body according to claim 1 or 2, wherein
The coupling member is installed on the flex plate by buffer component.
4. a kind of stripping means of laminated body, makes to have the 1st substrate and the 2nd substrate and bond described the in a manner of it can remove
Interface of the laminated body between the 1st substrate and the 2nd substrate made of 1 substrate and the 2nd substrate is from one end court
It is successively removed to another side, wherein
The stripping means of the laminated body includes:
Process is supported, the 1st substrate of the laminated body is supported using supporting part；
Absorption process adsorbs the 2nd substrate of the laminated body using the adsorption plane of flex plate；And
Stripping process using multiple movable bodys and makes the flex plate flexible deformation by more coupling members and makes the stacking
The 2nd substrate of body from one end towards another side successively flexible deformation, thus make the laminated body the interface according to
Secondary removing,
The coupling member is configured to lengthwise shape, the long axis of the coupling member along as the interface released part with
The removing front of boundary line between unstripped part configures, and the coupling member is along the removing direction of travel at the interface
It is configured with more at spaced intervals.
5. a kind of manufacturing method of electronic device, the manufacturing method of the electronic device include functional layer formation process, for by
Laminated body made of 1 substrate and the 2nd substrate are pasted in a manner of it can remove forms function in the exposure of the 1st substrate
Layer；And separation process, self-forming have the 1st substrate of the functional layer to separate the 2nd substrate, wherein
The separation process includes
Process is supported, the 1st substrate of the laminated body is supported using supporting part；
Absorption process adsorbs the 2nd substrate of the laminated body using the adsorption plane of flex plate；And
Stripping process using multiple movable bodys and makes the flex plate flexible deformation by more coupling members and makes the stacking
The 2nd substrate of body is from one end towards another side successively flexible deformation, thus in the 1st substrate and the 2nd base
Interface between plate successively removes the 2nd substrate from the 1st substrate,
The coupling member is configured to lengthwise shape, the long axis of the coupling member along as the interface released part with
The removing front of boundary line between unstripped part configures, and the coupling member is along the removing direction of travel at the interface
It is configured with more at spaced intervals.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-032742 | 2015-02-23 | ||
| JP2015032742 | 2015-02-23 | ||
| JP2015-099740 | 2015-05-15 | ||
| JP2015099740A JP6468462B2 (en) | 2015-02-23 | 2015-05-15 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105904830A CN105904830A (en) | 2016-08-31 |
| CN105904830B true CN105904830B (en) | 2019-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610098916.4A Active CN105904830B (en) | 2015-02-23 | 2016-02-23 | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device |
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| CN (1) | CN105904830B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000030868A1 (en) * | 1998-11-20 | 2000-06-02 | Tito Trevisan | Method and apparatus for producing a silicone film for industrial decoration of objects |
| CN102171745B (en) * | 2009-02-06 | 2014-10-08 | 旭硝子株式会社 | Method for manufacturing electronic device and separation apparatus used therefor |
| JP6003675B2 (en) * | 2013-01-25 | 2016-10-05 | 旭硝子株式会社 | Substrate peeling device and peeling method and manufacturing method of electronic device |
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