CN102171745B - Method for manufacturing electronic device and separation apparatus used therefor - Google Patents
Method for manufacturing electronic device and separation apparatus used therefor Download PDFInfo
- Publication number
- CN102171745B CN102171745B CN201080002805.XA CN201080002805A CN102171745B CN 102171745 B CN102171745 B CN 102171745B CN 201080002805 A CN201080002805 A CN 201080002805A CN 102171745 B CN102171745 B CN 102171745B
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- supporting mass
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Provided are a method for manufacturing an electronic device and a separation apparatus used therefore, wherein a substrate and a resin layer closely connected thereto can be easily separated and removed within a short space of time without damage. When a support (17b) comprised of a support substrate (19b) and a resin layer (18b) is separated from a support-provided electronic device (10) which has a substrate (12b) having an electronic device member (14) and a resin layer (18b) which is secured to a support substrate (19b) and which is closely connected to the substrate (12b), a main surface on which a substrate (17b) to be separated later is not mounted is closely connected to a securing surface (20a) of a stage (20) to secure the support-provided electronic device (10), and a knife (30) is inserted between interfaces of the resin layer (18b) and the substrate (12b) of the support (17b) to be separated, at an end surface of the support-provided electronic device (10) secured to the stage (20) to thereby separate the support (17b) and an electronic device (16), thus to solve the aforementioned problem.
Description
Technical field
The present invention relates to the stripping off device using in the manufacture method of electron device and the method.
Background technology
In recent years, liquid crystal indicator (LCD), organic EL display (OLED) are widely used as display device.Particularly, in pocket field of display devices such as mobile or mobile phones, seek lightweight, the slimming of display device.
Equally, the electron devices such as semiconductor wafer that solar cell, thin-film secondary battery, surface are formed with circuit are also sought lightweight, slimming.
For correspondingly, for substrates such as the glass of the electron devices such as display device, resin, metals, carrying out thin plate.
The in the situation that of glass substrate, method as attenuate thickness of slab, conventionally carry out following method, before formation display device in the surface of glass substrate is with parts or after forming, use chemical etching to carry out etch processes to the outside surface of glass substrate, and further carry out as required physical grinding and carry out attenuate.
But, form the used for electronic device parts such as display device on the surface of glass substrate before, carry out etch processes etc. and during attenuate glass substrate, the strength decreased of glass substrate, it is large that amount of bow also becomes.Therefore the problem that, generation can not be processed at existing manufacturing line.
In addition, after formation display device in the surface of glass substrate is with parts, carry out etch processes etc. and during attenuate glass substrate, on the surface of glass substrate, form display device with in the process of parts, produce fine the manifesting of damage that is formed at glass baseplate surface problem, be called as the problem of edge pit.
Therefore, in order to solve such problem, motion has following method etc., by the thin glass substrate of thickness of slab (below also referred to as " glass sheet substrate ".) make duplexer with other supporting glass baseplate-laminating, under this state, implement the processing for the manufacture of the regulation of display device, afterwards, glass sheet substrate is separated with supporting glass substrate.
For example, in patent documentation 1, record following method: the glass substrate that goods are used and enhancing utilize Electrostatic Absorption power or the vacuum adsorption force laminating between glass substrate and form one with glass substrate, the display device of the glass substrate that manufacture use goods are used.
In patent documentation 2, record following method: use the bonding agent of glass dust system bonding the end of the substrate of liquid crystal indicator and supporting mass, afterwards, the manufacture of the liquid crystal indicator of formation electrode pattern etc.
In patent documentation 3, record the manufacture method with the base board for display device that makes the operation that above-mentioned two glass substrates merge near the irradiating laser end face of at least circumference of two glass substrates.
In patent documentation 4, record a kind of manufacture method of liquid crystal indicator, on supporting mass, be provided with on the substrate transporting clamp of layer of adhesive material adhesive substrate and by manufacturing process's conveying substrate transporting clamp of liquid crystal display cells, for the substrate that fits in substrate transporting clamp, carry out successively liquid crystal display cells formation processing thus, after finishing the operation of regulation, substrate is peeled off from substrate transporting clamp.
In patent documentation 5, record a kind of manufacture method of liquid crystal display cells, it is characterized in that, the fixture that uses supporting mass to be provided with ultraviolet hardening bonding agent used for liquid crystal display element electrode base board has been implemented after the processing of regulation to used for liquid crystal display element electrode base board, to ultraviolet hardening bonding agent irradiation ultraviolet radiation, make thus the bonding force of above-mentioned ultraviolet hardening bonding agent reduce, above-mentioned used for liquid crystal display element electrode base board is peeled off from above-mentioned fixture.
In patent documentation 6, record and a kind ofly by adhesives, thin plate is temporarily fixed on support plate, by encapsulant, the circumference of above-mentioned adhesives is sealed, carry the temporary fixed carrying method that has the support plate of thin plate.
In patent documentation 7, record the stacked body of a kind of sheet glass, laminated thin plate glass substrate, supporting glass substrate and form, is characterized in that, above-mentioned sheet glass and above-mentioned supporting glass are via having the silicone resin layer of easy fissility and non-cementability and stacked.And, glass sheet substrate is separated with supporting glass substrate, as long as give and glass sheet substrate pulled to the power of vertical direction from supporting glass substrate, by the sword by razor etc., give the opportunity of peeling off end or inject air to stacked interface, can more easily peel off.
In patent documentation 8, record the stripping off device of peeling off from suction sheet for absorption being held in to the tabular bodys such as glass substrate of suction sheet.
Patent documentation 1: the JP 2000-241804 of Japan communique
Patent documentation 2: the JP 58-54316 of Japan communique
Patent documentation 3: the JP 2003-216068 of Japan communique
Patent documentation 4: the Unexamined Patent 8-86993 of Japan communique
Patent documentation 5: the Unexamined Patent 9-105896 of Japan communique
Patent documentation 6: the JP 2000-252342 of Japan communique
Patent documentation 7: No. 2007/018028 pamphlet of International Publication
Patent documentation 8: the JP 2007-185725 of Japan communique
But, the making in the method for two glass substrates fusions near the irradiating laser end face of circumference by record in the fixing method of glass dust or patent documentation 3 by the two ends of glass substrate of recording in the fixing method of Electrostatic Absorption power or vacuum adsorption force, patent documentation 2 utilizing between glass substrate of recording in patent documentation 1, owing to making to have not to be situated between between glass substrate, the mode in any middle layer is stacked connects airtight, so because of the foreign matters such as the bubble to sneaking between glass substrate or the dust defect that deforms on glass substrate.Therefore, be difficult to obtain the glass substrate laminate of surface smoothing.
In addition, in the method that configures adhesive linkage etc. between glass substrate of recording in patent documentation 4～6, although can avoid the generation to sneaking into the deformation defect that bubble etc. causes between glass substrate as described above, be difficult to two glass substrates separatedly, when separated, glass sheet substrate may be damaged.Also exist in addition bonding agent to residue in the problem of the glass sheet substrate after separation.
In contrast, according to the stacked body of sheet glass of recording in patent documentation 7, be difficult to produce the above-mentioned that deformation defect to sneaking into bubble etc. between glass substrate and causing.In addition, also can be by glass sheet substrate and supporting glass strippable substrate.In addition, solved the problem that bonding agent residues in glass sheet substrate after separation.But the separation of expectation two glass substrates more easily and carry out in shorter time.At glass substrate, be large-scale in the situation that, aspect industrial utilization, be particularly important point.
In addition, the stripping off device of recording in patent documentation 8 is that absorption is held in to the device that the glass substrate etc. of suction sheet is peeled off from suction sheet, is difficult to the supporting glass substrate connecting airtight via resin bed and glass sheet substrate to be peeled off in the mode of not damaging above-mentioned glass sheet substrate and do not make above-mentioned resin bed residue on above-mentioned glass sheet substrate.
Summary of the invention
The present invention puts in view of the above problems and makes.; its object is; a kind of manufacture method of electron device is provided; inhibition causes the generation of base board defect to foreign matters such as the bubble of sneaking between substrate and dust; can not produce edge pit and utilize existing manufacturing line to process, can not damage the substrate that connects airtight and resin bed they easily and are at short notice peeled off and separated.In addition, its object is, a kind of stripping off device that can implement the manufacture method of this electron device is provided.
Present inventor concentrates on studies for solving above-mentioned problem, has completed the present invention.
The present invention relates to following (1)～(18).
(1) a kind of manufacture method of electron device, comprise from peel off the operation of supporting mass with the electron device of supporting mass, the described electron device with supporting mass connects airtight resin bed and forms having the first interarea and the second interarea and have on the second interarea on first interarea of substrate of used for electronic device parts, described resin bed is fixed on the first interarea of the supporting substrates with the first interarea and the second interarea and has easy fissility, described supporting mass consists of described supporting substrates and described resin bed, described electron device consists of described used for electronic device parts and described substrate, wherein, possess: fixing operation, in two interareas that the described electron device with supporting mass has one the plane stationary plane not possessing to worktable with the interarea of the supporting mass being stripped from the stripping process as rear operation is connected airtight, the described electron device with supporting mass is fixed on the stationary plane of described worktable, and stripping process, to described resin bed and the interface between described substrate of being fixed on the described supporting mass being stripped from the end face of the described electron device with supporting mass on the stationary plane of described worktable, insert blade, described supporting mass and described electron device are peeled off.
(2) manufacture method of the electron device as described in (1), wherein, in described stripping process, be inserted into the described blade at the interface between described resin bed and described substrate because being out of shape from the effect of described resin bed and/or described substrate, thereby described blade is further moved to the direction of inserting, in this case, described blade moves along the surface of described resin bed, and described supporting mass and described electron device are peeled off.
(3) manufacture method of the electron device as described in (1) or (2), wherein, in described stripping process, to the interface between described resin bed and described substrate, inserted after described blade, described blade rotates centered by its leading section, rearward end moves along the direction of the normal parallel of the described stationary plane with described worktable, and then described blade integral body also moves at least one party in the direction of identical parallel direction and insertion, thereby described blade moves along the surface of described resin bed, described supporting mass and described electron device are peeled off.
(4) manufacture method of the electron device as described in any one in (1)～(3), wherein, also possesses absorption process, described absorption process is after described fixedly operation and before described stripping process, make a plurality of absorption layers be adsorbed in the second interarea of the described supporting substrates of the described supporting mass being stripped from, described stripping process and then be operation as described below: insert after described blade to the interface between described resin bed and described substrate, making described absorption layer is that direction of delaminate moves to the direction of peeling off described resin bed and described substrate, described supporting mass and described electron device are peeled off.
(5) manufacture method of the electron device as described in (4), wherein, described stripping process and then be operation as described below: make to be adsorbed in and be positioned at the absorption layer that has inserted portion's bit position of described blade on the end face that approaches the described electron device with supporting mass most in a plurality of absorption layers of the second interarea of described supporting substrates and first move to described direction of delaminate, then make the absorption layer adjacent with this absorption layer move to described direction of delaminate, make similarly afterwards the absorption layer adjacent with the absorption layer having moved to described direction of delaminate then to described direction of delaminate, move, sequentially carry out aforesaid operations, by described supporting mass along peeling off towards central direction from having inserted the end of described blade, and then peel off on its extended line.
(6) manufacture method of the electron device as described in any one in (1)～(5), wherein, described stripping process and then be operation as described below: comprise by image and process the operation of inserting the position of described blade on the interface of determining described resin bed and described substrate.
(7) manufacture method of the electron device as described in any one in (1)～(6), wherein, described stripping process and then be operation as described below: form ground connection at any part bonding conductor of described supporting substrates and/or described substrate and suppress charged, and described supporting mass and described electron device are peeled off.
(8) manufacture method of the electron device as described in any one in (1)～(7), wherein, described stripping process and then be operation as described below: winding-up is with electric control with material except electricity between described supporting mass and described electron device, and described supporting mass and described electron device are peeled off.
(9) manufacture method of the electron device as described in any one in (1)～(8), wherein, described stripping process is operation as described below: the load of detection effect on described blade, and insert described blade to the interface between described resin bed and described substrate.
(10) manufacture method of the electron device as described in any one in (1)～(9), wherein, described electron device is display device panel.
(11) a kind of stripping off device, from the electron device with supporting mass, peel off supporting mass, the described electron device with supporting mass connects airtight resin bed and forms with the first interarea of the substrate of parts having the first interarea and the second interarea and have display device on the second interarea, described resin bed is fixed on the first interarea of the supporting substrates with the first interarea and the second interarea and has easy fissility, described supporting mass consists of described supporting substrates and described resin bed, wherein, possess: worktable, connect airtight with the interarea of the described electron device with supporting mass, possesses the plane stationary plane that can fix the described electron device with supporting mass, blade, for peeling off described supporting mass from the described electron device with supporting mass, normal direction mobile unit, making described blade is that normal direction moves along the direction of the normal parallel of the described stationary plane with described worktable, so that described blade inserts the described resin bed of the described supporting mass being stripped from the end face of the described electron device with supporting mass that is fixed on described worktable and the interface between described substrate, stationary plane direction mobile unit, described blade is moved between described resin bed and described substrate, and then, described blade possesses character as described below: when being inserted between described resin bed and described substrate, because the effect from described resin bed and/or described substrate deforms, thereby move on the surface along described resin bed, and/or possess: insert angle regulating unit, the insertion angle initialization mechanism with the bound of the rotating mechanism that the rearward end that described blade is rotated centered by leading section and makes described blade moves along normal direction and the insertion angle of setting described blade, and normal direction travel mechanism, described blade integral body is moved along described normal direction.
(12) stripping off device as described in (11), wherein, also possessing being fixed on a plurality of absorption layers that second interarea of described supporting substrates of the described supporting mass being stripped from of the described electron device with supporting mass on the stationary plane of described worktable adsorbs and making described absorption layer is the pad mobile unit that direction of delaminate moves to the direction of peeling off described resin bed and described substrate.
(13) stripping off device as described in (12), wherein, described pad mobile unit possesses time control function, making to be positioned in described a plurality of absorption layer the absorption layer that has inserted portion's bit position of described blade on the end face that approaches the described electron device with supporting mass most first moves to described direction of delaminate, then make the absorption layer adjacent with this absorption layer move to described direction of delaminate, similarly make afterwards the absorption layer adjacent with the absorption layer having moved to described direction of delaminate then to described direction of delaminate, move, sequentially carry out aforesaid operations, by described supporting mass along peeling off towards central direction from having inserted the end of described blade, and then peel off on its extended line.
(14) stripping off device as described in any one in (11)～(13), wherein, also possesses image processing apparatus, for determining the position of inserting described blade on the interface between described resin bed and described substrate.
(15) stripping off device as described in any one in (11)～(14), wherein, also possesses at any part bonding conductor of described supporting substrates and/or described substrate and suppresses charged grounding construction.
(16) stripping off device as described in any one in (11)～(15), wherein, also possesses to winding-up between described supporting mass and described electron device except electricity with material with the band controller for electric consumption of electric control.
(17) stripping off device as described in any one in (11)～(16), wherein, also possesses the load detecting device of the load of detection effect on described blade.
(18) stripping off device as described in any one in (11)～(17), wherein, described electron device is display device panel.
According to the present invention, a kind of manufacture method of electron device can be provided, can suppress to sneak into the generation of the base board defect that the foreign matters such as bubble between substrate and dust cause, can not produce edge pit and process with existing manufacturing line, can not damage the substrate that connects airtight and resin bed they easily and are at short notice peeled off and separated.In addition, can provide a kind of stripping off device that can implement the manufacture method of this electron device.
Accompanying drawing explanation
Fig. 1 (a)～1 (d) means the summary section of the preferred implementation of stripping off device of the present invention;
Fig. 2 (a)～2 (d) means the summary section of other preferred implementation of stripping off device of the present invention;
Fig. 3 means the summary section of a part of the preferred implementation of stripping off device of the present invention;
Fig. 4 (a) and 4 (b) mean figure and summary end view drawing above the summary of preferred implementation of blade;
Fig. 5 (a) is for the approximate three-dimensional map of the support of blade is described, Fig. 5 (b) and Fig. 5 (c) scheme above summary;
Fig. 6 (a)～6 (c) is the approximate three-dimensional map that the distortion for the blade when peeling off describes;
Fig. 7 means the summary section of the preferred implementation of rotating mechanism;
Fig. 8 means the approximate three-dimensional map of the preferred implementation of absorption layer;
Fig. 9 is the figure that schematically shows the situation of absorption layer absorption;
Figure 10 means the block diagram of the control system of absorption layer;
Figure 11 means the summary section by a mode of panel with supporting mass display device;
Figure 12 means the general view with the alternate manner of panel with supporting mass display device;
Figure 13 means the summary section with the alternate manner of panel with supporting mass display device;
Figure 14 means the summary section with another alternate manner of panel with supporting mass display device;
Figure 15 (a)～15 (c) is the summary section describing for the stripping means in the situation that is curved surface to a part for the stationary plane of worktable;
Figure 16 (a)～16 (c) is for being the summary section that the stripping means in the situation of pliability parts describes to worktable;
The process flow diagram of one of the flow process of the manufacture method of panel example for the display device that Figure 17 means one of the manufacture method of electron device of the present invention embodiment.
Label declaration
1,11 stripping off devices
2 base station parts
3 first moving-member main bodys
4 the 3rd moving-member main bodys
5 second moving-member main bodys
10 band supporting mass display device panels
10x is the end face with panel with supporting mass display device
12a, 12b glass sheet substrate
16,116,126,136 display device panels
17a, 17b, 117,127,137a, 137b supporting mass
18a, 18b resin bed
19a, 19b supporting glass substrate
20 worktable
22 Porous vacuum suction sheets
24 pumps
26 table frames
30 blades
The leading section of 30a blade
The center section part of 30b blade
The rearward end of 30c blade
40 above-below direction mobile units
40a second moves side component
40b the second fixation side parts
42 stationary plane direction mobile units
42a first moves side component
42b first moves side component
44Shang direction travel mechanism
44a the 3rd moves side component
44b the 3rd fixation side parts
44c retainer
46 3 component sensors
50 rotating mechanisms
51 retainers
52 overlayers
54 turning axles
56 axle bushes
58 overlayers
59 insert angle regulating unit
60 absorption layers
61 supports
611 arms
70 cameras
73 nozzles
75 charged restraining devices
θ inserts angle
77 vacuum pumps
78 electric pressure regulator valves
79 valves
82 absorption layers
83 air pumps
84 frameworks
85 electric pressure regulator valves
86 guides
87 solenoid valves
88 cylinders
89 pistons
90 control parts
The 110 display device panels with supporting mass
112 glass sheet substrates
114 display device parts
118 resin beds
119 supporting glass substrates
The 120 display device panels with supporting mass
122 glass sheet substrates
124 display device parts
125 clearance portion
128 resin beds
129 supporting glass substrates
132a, 132b glass sheet substrate
134 display device parts
138a, 138b resin bed
139a, 139b supporting glass substrate
Embodiment
The present invention is comprised of manufacture method of the present invention and stripping off device.
Manufacture method of the present invention can be used stripping off device of the present invention to implement best.
First, enumerating two preferred embodiments describes stripping off device of the present invention.
In addition, be described in detail later, the electron device with supporting mass using in the present invention connects airtight resin bed and forms having the first interarea and the second interarea and have on the second interarea on first interarea of substrate of used for electronic device parts, and described resin bed is fixed on the first interarea of the supporting substrates with the first interarea and the second interarea and has easy fissility.
That is, with the electron device of supporting mass, have used for electronic device parts, substrate, resin bed and supporting substrates, it is stacked that they press said sequence.In addition, electron device has used for electronic device parts and substrate, and used for electronic device parts are formed on the second interarea of substrate.
In addition, with the electron device of supporting mass also can for by the duplexer that stacks gradually substrate, resin bed and supporting substrates via two layers of device forming of used for electronic device stacking part, stack gradually the device that supporting substrates, resin bed, substrate, used for electronic device parts, substrate, resin bed and supporting substrates form.
At this, electron device refers to that panel for display device, solar cell, thin-film secondary battery, surface are formed with the electronic components such as semiconductor wafer of circuit.Display device refers to and comprises liquid crystal panel, organic EL panel, plasma display, field emission panel etc. with panel.
Preferred embodiment to stripping off device of the present invention describes.
Fig. 1 is the summary section of stripping off device 1 of the preferred embodiment of stripping off device of the present invention.
Fig. 1 (a)～1 (d) is for the sequential chart of action at each position of the stripping off device 1 while peeling off being described, using Fig. 1 (a) to describe the formation of stripping off device 1.The action aftermentioned at each position when peeling off.
In Fig. 1 (a), stripping off device 1 possesses worktable 20, blade 30, normal direction mobile unit 40 and stationary plane direction mobile unit 42, and then possesses three component sensors 46.
That is, stripping off device 1 possesses: worktable 20, and connect airtight with the interarea of panel 10 with supporting mass display device, possess can fixed band supporting mass display device with the plane stationary plane of panel 10; Blade 30, for peeling off supporting mass from band supporting mass display device with panel 10; Normal direction mobile unit 40, making blade 30 is that normal direction (being above-below direction in Fig. 1) is mobile along the direction of the normal parallel of the stationary plane with worktable 20, so that blade 30 inserts the resin bed of the supporting mass being stripped from the end face with panel 10 with supporting mass display device that is fixed on worktable 20 and the interface between glass sheet substrate; Stationary plane direction mobile unit 42 moves blade 30 between resin bed and glass sheet substrate, and then, possess three component sensors 46 as load detecting unit that can the load of detection effect on blade 30.
In addition, as described later, the blade 30 of stripping off device 1 possesses when being inserted between resin bed and glass sheet substrate, because the effect from resin bed and/or glass sheet substrate deforms, thus the character moving along the surface of resin bed.
In addition, the base station parts 2 of the stripping off device 1 of preferred embodiment and worktable 20 are fixed on the floor in the room that is provided with stripping off device 1 and do not move.In addition, the stationary plane 20a (with reference to Fig. 3) of worktable 20 is surface level (parallel with the floor in room).In addition, the first fixation side parts 42b of base station parts 2 and stationary plane direction mobile unit 42 is fixed, equally, first of stationary plane direction mobile unit 42 moves the first moving-member main body 3 of side component 42a and stationary plane direction, the second fixation side parts 40b of the first moving-member main body 3 and normal direction mobile unit 40, second of normal direction mobile unit 40 moves the second moving-member main body 5 of side component 40a and normal direction, the 3rd moving-member main body 4 of the second moving-member main body 5 and three component sensors 46 and normal direction, the 3rd moving-member main body 4 and blade 30 are fixed.
In addition, not shown in Fig. 1, as after use Fig. 3 to illustrate, stripping off device 1 possesses: at the absorption layer 60 with the second interarea absorption of the supporting glass substrate 19b of panel 10 with supporting mass display device; In order to insert the camera 70 using with the blade 30 of the end face of panel with supporting mass display device; Resin bed 18b and the winding-up of the interface between glass sheet substrate 12b as the supporting mass to being stripped from remove the nozzle 73 of the blowing device of material (water etc.) for electricity; And by conductor connecting band supporting mass display device the charged charged restraining device 75 of panel 10 with panel 10 and ground and for inhibition zone supporting mass display device.
Other preferred embodiment to stripping off device of the present invention describes.
Fig. 2 is the summary section of stripping off device 11 of other preferred embodiment of stripping off device of the present invention.
Fig. 2 (a)～2 (d) is for the sequential chart of action at each position of the stripping off device 11 while peeling off being described, using Fig. 2 (a) to describe the formation of stripping off device 11.The action aftermentioned at each position when peeling off.
In addition, stripping off device 11 has the position common with above-mentioned stripping off device 1.The explanation at this position is simply carried out.In addition, in Fig. 2, for position mark with Fig. 1 identical label (sequence number) common with stripping off device 1.
In Fig. 2 (a), stripping off device 11 possesses worktable 20, blade 300, normal direction mobile unit 40, stationary plane direction mobile unit 42, the insertion angle regulating unit 59 with rotating mechanism 50 and retainer 51, normal direction travel mechanism 44, also possesses in addition three component sensors 46.
That is, stripping off device 11 possesses the worktable 20 identical with stripping off device 1, normal direction mobile unit 40, stationary plane direction mobile unit 42 and three component sensors 46.And, also possess on this basis: blade 300, for peeling off supporting mass from band supporting mass display device with panel 10; Insert angle regulating unit 59, have and make blade 300 using rotation centered by leading section to rotate predetermined angular (being less than 180 degree) and make rotating mechanism 50 that the rearward end of blade 300 can move along normal direction and as the retainer 51 of the insertion angle initialization mechanism of the bound of the insertion angle of setting blade 300; And normal direction travel mechanism 44, blade 300 integral body can be moved along above-mentioned normal direction.
At this, the blade 300 of stripping off device 11 possesses the character different from the blade 30 of above-mentioned stripping off device 1, can not deform.That is, blade 300 does not possess the character as blade 30, thus the character that deforms and move along the surface of resin bed because of the effect from resin bed and/or glass sheet substrate when being inserted between resin bed and glass sheet substrate.
In addition, base station parts 2 and the worktable 20 of the stripping off device 11 of preferred embodiment are fixed on the floor in the room that is provided with stripping off device 11, do not move.In addition, the stationary plane of worktable 20 is surface level (parallel with the floor in room).In addition, the first fixation side parts 42b of base station parts 2 and stationary plane direction mobile unit 42 is fixed, equally, first of stationary plane direction mobile unit 42 moves the first moving-member main body 3 of side component 42a and stationary plane direction, the second fixation side parts 40b of the first moving-member main body 3 and normal direction mobile unit 40, second of normal direction mobile unit 40 moves the 3rd fixation side parts 44b of side component 40aHe normal direction travel mechanism 44, the 3rd of normal direction travel mechanism 44 moves the second moving-member main body 5 of side component 44a and normal direction, the 3rd moving-member main body 4 of the second moving-member main body 5 and three component sensors 46 and normal direction is fixed.In addition, rotatable the 3rd moving-member main body 4 that is supported on of blade 30 (rotation).
In addition, though not shown in Fig. 2, as after use Fig. 3 illustrated, stripping off device 11 is identical with stripping off device 1, possesses absorption layer 60, camera 70, nozzle 73 and charged restraining device 75.
< worktable >
Stripping off device 1 and stripping off device 11 (are also recited as " stripping off device 1,11 " below.) possess worktable 20.Use Fig. 3 to describe the worktable 20 of stripping off device 1,11.
Fig. 3 means and on the stationary plane 20a of the worktable 20 of stripping off device 1,11, is fixed with the summary section with panel 10 with supporting mass display device.At this, band supporting mass display device use panel 10 is the structure by the state of two interareas of the duplexer clamping display device use parts 14 of glass sheet substrate (12a, 12b), resin bed (18a, 18b) and supporting glass substrate (19a, 19b).
At this, by being called sense stricto panel 16 for display device by glass sheet substrate 12a and 12b clamping display device by the structure of two interareas of parts 14, each duplexer of resin bed 18a and 18b and supporting glass substrate 19a and 19b is called to supporting mass 17a and 17b.In addition, the supporting mass 17b being stripped from consists of supporting glass substrate 19b and resin bed 18b.Therefore, broadly also sense stricto display device can be called to display device panel by panel 16 and supporting mass 17a one.
Stripping off device 1,11 possesses: worktable 20, comprises the Porous vacuum suction sheet 22 that possesses plane stationary plane; Band supporting mass panel 10 for display device, is fixed on the stationary plane of worktable 20; And blade 30 or blade 300, insert the resin bed 18b of the supporting mass 17b being stripped from the end face 10x with panel 10 with supporting mass display device and the interface between glass sheet substrate 12b.
In addition, possess: be adsorbed in the absorption layer 60 on the second interarea of the supporting glass substrate 19b of panel 10 for supporting mass display device; The camera 70 that possesses the image processing apparatus using in order to insert the blade 30 of end face 10x or blade 300; Resin bed 18b and the winding-up of the interface between glass sheet substrate 12b to the supporting mass being stripped from remove the nozzle 73 of material for electricity; And will with panel 10, be connected with ground and the inhibition zone supporting mass display device charged charged restraining device 75 of panel 10 with supporting mass display device by conductor.
In addition, Porous vacuum suction sheet 22 is connected with pump 24, use pump 24 to vacuumize, in the upper vacuum suction band supporting mass display device of stationary plane (being upper surface on the worktable 20 shown in Fig. 3) of Porous vacuum suction sheet 22, use the second interarea of the supporting glass substrate 19a of panel 10, will be with supporting mass display device fixing with panel 10.In stripping off device of the present invention, the stationary plane of worktable refers to and connects airtight and can will with supporting mass display device, use the fixing plane of panel 10 with the interarea of panel 10 with supporting mass display device.
In the present invention, as long as worktable can just be not particularly limited remaining secured to panel with supporting mass display device on the stationary plane of worktable, but as shown in Figure 3, preferably by vacuum suction, adsorb fixing.This is because make to be difficult to damage with supporting mass display device with the surface of panel, in addition, and desorb at short notice.
In addition, worktable loads band supporting mass display device panel on its stationary plane, can retainer belt supporting mass display device panel, preferably the width (area) on stationary plane for and the fixing major-surface-area equal extent with the glass sheet substrate of panel with supporting mass display device.
In addition, in the present invention, for the stationary plane of worktable, being made as shown in Figures 1 to 3 surface level, but being not limited to surface level, can be also curved surface.Figure 15 is the summary section describing for the stripping means in the situation that is curved surface to a part for the stationary plane of worktable 20.First, on the worktable 20 that is curved surface by a part that is fixed on stationary plane 20a with supporting mass display device with panel 10, blade 30 is being inserted into the resin bed 18b (with reference to Fig. 3) of supporting mass 17b and the initial stage (Figure 15 (a)) between the glass sheet substrate 12b (with reference to Fig. 3) of panel 16 for display device, blade 30 moves in the surperficial mode along resin bed 18b, gives the opportunity (Figure 15 (b)) that supporting mass 17b and display device are peeled off with panel 16.(Figure 15 (c)) afterwards, is used absorption layer 82 absorption supporting mass 17b, and supporting mass 17b and display device are peeled off with panel 16.Because the stationary plane 20a of worktable 20 is curved surface, so the worktable 20 that is surface level with stationary plane is compared, the distortion of supporting mass 17b can be suppressed for less, there is not the worry of supporting mass 17b destruction when peeling off.
In addition, also can make worktable 20 for pliability parts, peel off on deflection deformation limit successively comprehensively on limit.Figure 16 is the summary section for the stripping means during for pliability parts describes to worktable 20.First, to with panel 10, be fixed on the pliability worktable 20 that stationary plane is level with supporting mass display device, blade 30 is being inserted into the resin bed 18b (with reference to Fig. 3) of supporting mass 17b and the initial stage (Figure 16 (a)) between the glass sheet substrate 12b (with reference to Fig. 3) of panel 16 for display device, blade 30 moves in the surperficial mode along resin bed 18b, gives the opportunity (Figure 16 (b)) that supporting mass 17b and display device are peeled off with panel 16.(Fig. 6 (c)) afterwards, use absorption layer 82 absorption supporting mass 17b, further, by other absorption layer 82 absorption workbench 20 that are arranged at worktable 20 belows, limit makes supporting mass 17b and worktable 20 deflection deformation successively, and peel off supporting mass 17b and display device on limit with panel 16.Owing to making worktable 20 for pliability parts, peel off on deflection deformation limit successively on limit, so be surface level with stationary plane and do not have the worktable of distortion to compare, the distortion of supporting mass 17b can be suppressed for less, there is not the possibility of supporting mass 17b destruction while peeling off.
In addition, the angle being represented by θ in Fig. 3 represents the insertion angle of blade.That is, insert that angle (θ) refers to the upper surface (if blade is the situation of two sections of swords shown in Fig. 4 described later, being the upper surface of the center section part of blade and rearward end) of blade and the surperficial angulation of the resin bed 18b of the supporting mass 17b that is stripped from.
< blade >
Blade 30 and blade 300 for by supporting mass 17b from peel off the member using with panel 10 with supporting mass display device, be inserted into the supporting mass 17b that formed by supporting glass substrate 19b and resin bed 18b and the interface between glass sheet substrate 12b and peel off.
Use Fig. 4 to describe the shape of the blade 30 of stripping off device 1.In addition, this only blade 30 describe, the shape of the blade 300 of stripping off device 11 also can be identical with the blade 30 of stripping off device 1.
Fig. 4 (a) schemes above the summary of blade 30, and Fig. 4 (b) is summary end view drawing.
The size of the blade using in the present invention, shape etc. are not particularly limited, but the blade 30 of preferred embodiment is the size shown in Fig. 4 and shape.That is,, as shown in Fig. 4 (a), while observing from above, blade 30 is rectangle, is the size of width 10mm, length 100mm.In addition, as shown in Fig. 4 (b), thickness is 0.1mm, is two sections of swords.Leading section 30a shown in Fig. 4 (b) of two sections of swords of formation is most advanced and sophisticated, and the angle of observing into 25 degree from end face, and center section part 30b becomes the angles of 15 degree, and rearward end 30c forms smooth.
As described above, the size of blade 30 is width 10mm, length 100mm, but the size of the blade using in the present invention is preferably width 5～50mm, length 30～200mm.In addition, preferred thickness is 0.05～1.0mm.
In addition, as blade 30, be preferably two sections of swords.The front end of blade can prevent that the surface that gives glass sheet substrate and resin bed from bringing damage.
In addition, as above-mentioned, the leading section 30a angulation of blade 30 is the degree of 25 degree, but the blade using is in the present invention in the situation of two sections of swords, and the angle that preferably leading section forms is 20～30 degree.In addition, same, the angle that preferably center section part forms is 10～20 degree.In addition, though the curvature of front end is not particularly limited, preferred curvature radius is more than 0.001mm.In addition, the blade using in the present invention is preferably illustrated in figure 4 twolip, but also can be single-blade.
Secondly, the material of blade and deformation energy etc. describe.
The material of blade 30 and blade 300 is not particularly limited.Can enumerate such as the metals such as stainless steel, pottery, plastics, vulcanie.
In addition, be preferably following material: inserting between resin bed and glass sheet substrate, in the situation that resin bed and/or glass sheet substrate bear any effect (power), deform, in the situation that having removed effect, also reversibly remove distortion, return to original shape.For example can the such elastic body of preferred exemplary rubber, but because metal in the little scope of the effect applying in blade (power) etc. is also as elastic body action, therefore can preferably use.
In addition, preferably following material, consist of, yang type modulus is 1,000～400,000N/mm
2, be preferably 200,000N/mm
2the material of degree.Stainless yang type modulus is 206,000N/mm
2, be the material that can preferably use.
In addition, the blade 30 of stripping off device 1 possesses specific flexural rigidity [Nmm
2].
Particularly, in the situation that the shape of blade 30 be for example above-mentioned as shown in Figure 4, the flexural rigidity of the load (load of thickness direction) applying with respect to the upper surface of blade 30 is (hereinafter referred to as " flexural rigidity A ".) be 5,000Nmm
2below, be preferably 200Nmm
2below.
In addition, in the situation that the shape of blade 30 is for example as shown in Figure 4 above-mentioned, with respect to the flexural rigidity of the load of blade width direction (flexural rigidity while having applied load to the limit (face) of length direction), (following is " flexural rigidity B ".) be 200,000Nmm
2above, be preferably 1,000,000Nmm
2above.
In addition, more preferably, flexural rigidity A is 5,000Nmm
2below, and flexural rigidity B be 200,000Nmm
2above.
In addition, the yang type modulus [N/mm determining according to the material of blade in this said flexural rigidity (flexural rigidity A and flexural rigidity B) conduct
2] and according to the section second moment [mm of the determining positions of section shape and neutral axis
4] long-pending obtaining.
Like this, for the blade 30 of stripping off device 1, owing to possessing flexural rigidity A, the B of above-mentioned particular range, therefore, in the situation that being inserted between resin bed and glass sheet substrate, because the effect from resin bed and/or glass sheet substrate deforms, thereby move along the surface of resin bed.As described later, the blade 300 of stripping off device 11 does not need to possess the flexural rigidity that blade 30 possesses, but can possess yet.
Secondly, the support of the blade 30 of supporting stripping off device 1 is described.
Blade 30 is preferably by support 61 supportings that possess the structure shown in Fig. 5.Fig. 5 (a) is for the blade 30 of stripping off device 1 and support the approximate three-dimensional map of the support 61 of described blade 30.In addition, Fig. 5 (b), (c) scheme above meaning the summary of action of arm 611 of a side of Fig. 5 (a).In Fig. 5 (b), (c), omit diagram blade 30.
The support 61 of Fig. 5 has two tabular arms 611, and they and blade 30 are linked.For arm 611, when applying any power to blade 30, can be can not hinder the mode of blade 30 self-deformations to deform.
For example, shown in Fig. 5 (b), two arms 611 can be out of shape in mode close to each other.In addition, for example, shown in Fig. 5 (c), while observing from above, can deform to become the mode of S word shape.
Blade 30 possesses flexural rigidity A, the B of above-mentioned particular range, in addition also by above-mentioned support part supports, therefore, when being inserted between resin bed and glass sheet substrate, because the effect from resin bed and/or glass sheet substrate is more easily out of shape, thereby move along the surface of resin bed.
More specifically, (Fig. 6 (a)～(c) middle omission represents support 61 to example as shown in Figure 6.), blade is inserted into the initial stage (Fig. 6 (b)) between resin bed and glass sheet substrate, blade 30 moves in the surperficial mode along resin bed because of the distortion of the normal direction of himself, (Fig. 6 (c)) afterwards, by take the distortion of the sense of rotation that part that the blade 30 of direction of insertion and the part contacting with panel 10 with supporting mass display device and blade 30 and support link is fulcrum and so-called self the torsion phenomenon compound with sense of rotation, can move along the surface of resin bed.
In contrast, the blade 300 of stripping off device 11 does not possess the flexural rigidity that blade 30 possesses, and does not possess the such supporting construction of support 61 yet.Therefore, can be because not being out of shape from the effect of resin bed and glass sheet substrate.Therefore, stripping off device 11 need to possess the angle regulating unit of insertion and normal direction travel mechanism, and described insertion angle regulating unit has rotating mechanism and the insertion angle initialization mechanism that stripping off device 1 does not possess.
In addition, stripping off device of the present invention also comprises having possess the blade of the such deformation energy of blade 30 and possess the situation of inserting angle regulating unit and normal direction travel mechanism as stripping off device 11.Certainly, also sometimes according to deformation energy (degree of distortion), blade is better moved.
< normal direction mobile unit >
Use Fig. 1 (a) to describe the normal direction mobile unit 40 of stripping off device 1.Stripping off device 11 also has same normal direction mobile unit 40.
In stripping off device 1, normal direction mobile unit 40 has second and moves side component 40a and the second fixation side parts 40b.Second moves side component 40a is connected via not shown crossed roller guide with the second fixation side parts 40b, by driving not shown servomotor can make second to move side component 40a and move to normal direction with respect to the second fixation side parts 40b, can make to move the blade 30 that side component 40a is connected and move to normal direction with second.
As mentioned above, normal direction refers to the direction with the normal parallel of the stationary plane 20a (with reference to Fig. 3) of worktable 20.Because the stationary plane 20a of the worktable 20 of stripping off device 1 is surface level, so (stripping off device 11 too) normal direction is above-below direction (vertical direction) in stripping off device 1.
Can regulate its position blade 30 can be inserted to the resin bed 18b of the supporting mass 17b being stripped from the end face with panel 10 with supporting mass display device on the stationary plane 20a that be fixed on worktable 20 and the mode (with reference to Fig. 3) at the interface of glass sheet substrate 12b.
In the present invention, normal direction mobile unit so long as the unit that can make blade move to the desirable position of normal direction be just not particularly limited.
< inserts angle regulating unit >
Stripping off device 11 possesses and inserts angle regulating unit 59, and described insertion angle regulating unit 59 has rotation (or rotation) mechanism 50 and as the retainer 51 of bound set mechanism.Stripping off device 1 does not have insertion angle regulating unit.
Use Fig. 2 (a) and Fig. 7 to describe the rotating mechanism 50 of stripping off device 11.
In stripping off device 11, rotating mechanism 50 links turning axle 54 and blade 300 via bracket 52, for making blade 300 also rotate the mechanism of (or rotation) predetermined angular by making rotation (or rotation) axle 54 rotate (or rotation) predetermined angular.
Fig. 7 is for the summary section of such rotating mechanism 50 is described, the figure of the section cutting for the central horizontal at turning axle 54 seen from above.
In Fig. 7, three limits of the blade 300 of rectangle are fixed on bracket 52 regularly, and then bracket 52 is fixed on turning axle 54, therefore, by turning axle 54, rotate, and blade 300 rotates similarly.Turning axle 54 is supported by bracket 58 via resinous slide bushings 56.Bracket 58 is fixed in the 3rd moving-member main body 4 shown in Fig. 2 (a).In addition, as shown in Fig. 2 (a) and Fig. 7, the front end of blade 300 is roughly consistent with turning axle 54 center.Therefore, blade 300 can rotate centered by its front end.
In addition, as shown in Fig. 2 (a), stripping off device 11 has retainer 51.Retainer 51 and the 3rd moving-member main body 4 link, relatively mobile in normal direction (above-below direction) with respect to the 3rd moving-member main body 4, can fix in desirable position.Therefore, if fixing, retainer 51 follow the 3rd moving-member main body 4 normal direction movement and move.
The upper limit or the lower limit of insertion angle (θ) that can adjustable blade 300 by such retainer 51.In the mode of the lower surface of frame support bracket 52, determine the position of retainer 51, thereby blade 300 can not be further rotated to inserting the direction that angle (θ) increases, therefore can capping.In this situation, can be to (direction that θ reduces) rotation in the other direction.
Insert angle (θ) and be not particularly limited, but be preferably 2～5 degree.
< stationary plane direction mobile unit >
Use Fig. 1 (a) to describe the stationary plane direction mobile unit 42 of stripping off device 1.
Stripping off device 11 also has same stationary plane direction mobile unit.
In stripping off device 1, stationary plane direction mobile unit 42 has first and moves side component 42a and the first fixation side parts 42b.First moves side component 42a is connected via not shown crossed roller guide with the first fixation side parts 42b, by driving not shown servomotor, making first, to move side component 42a be that stationary plane direction (in Fig. 1 (a) for left and right directions) is mobile with respect to the first fixation side parts 42b to the parallel direction of the stationary plane with worktable 20, thereby can make connected blade 30 move to stationary plane direction.And, can make blade 30 move between resin bed and glass sheet substrate.
In the present invention, stationary plane direction mobile unit so long as the unit that can make blade move to the desirable position of stationary plane direction be just not particularly limited.
The < normal direction > of travel mechanism
Use Fig. 2 (a) to describe the normal direction travel mechanism 44 of stripping off device 11.
In stripping off device 11, normal direction travel mechanism 44 has the 3rd and moves side component 44a, the 3rd fixation side parts 44b and retainer 44c.The 3rd moves side component 44a is connected via not shown crossed roller guide with the 3rd fixation side parts 44b, and the 3rd moves side component 44a can move freely along normal direction (upper direction) with respect to the 3rd fixation side parts 44b.
In addition, second of retainer 44c and normal direction mobile unit 40 moves side component 40a and links, and can move side component 40a with respect to second and relatively along normal direction (above-below direction), moves and fix in desirable position.Therefore, if fixing, retainer 44c follow second move side component 40a normal direction (above-below direction) movement and move.
By such retainer 44c, can determine the upper/lower positions of the normal direction (above-below direction) of blade 30.To support the mode of the lower surface of the second moving-member main body 5, determine the position of retainer 44c, thereby blade 30 can be to more below is mobile.Can upward direction move.
In the present invention, normal direction travel mechanism so long as the mechanism that blade integral body can upward direction moves be just not particularly limited.
< load detecting unit >
Use Fig. 1 (a) to describe the load detecting unit of stripping off device 1.Stripping off device 11 also has same load detecting unit.
The mode that stripping off device 1 is usingd by the 3rd moving-member main body 4 and the clamping of the second moving-member main body 5 possesses three component sensors 46 as the load detecting unit acting on blade 30.
Stripping off device of the present invention preferably possesses the load detecting unit acting on such blade.In addition, be preferably equipped on as far as possible blade near.If stripping off device of the present invention possesses the load detecting device acting on blade, when using blade to peel off supporting mass, can not apply useless power and peel off, so preferably.
< absorption layer >
Stripping off device 1,11 possesses and is adsorbed in a plurality of absorption layers 60 with the second interarea of the supporting glass substrate 19b of panel 10 with supporting mass display device.
In the present invention, possess this absorption layer, preferably use this absorption layer with panel 10, to peel off supporting mass from band supporting mass display device.
The absorption layer that uses accompanying drawing to possess stripping off device 1,11 describes.
Fig. 8 means the local approximate three-dimensional map of stripping off device 1,11.In Fig. 8, stripping off device 1,11 is fixed with to approximate horizontal band supporting mass panel 10 for display device, the second interarea of the supporting glass substrate 19b (with reference to Fig. 3) of the supporting mass 17b being stripped from of panel 10 for a plurality of absorption layer 82 adsorption band supporting mass display device on the stationary plane of worktable 20.
As shown in Figure 8, dispose a plurality of absorption layers 82 above with the worktable 20 of panel 10 being fixed with supporting mass display device.In stripping off device 1,11, be disposed at framework 84, but in the present invention, it is equally spaced that configuration can need not to be these absorption layer 82 chessboard trellis.This framework 84 declines mobile along guide 86 when peeling off supporting mass, absorption layer 82 with tight with upper surface (the second interarea of the supporting glass substrate) butt of panel 10 with supporting mass display device before the moment, it declines to moving and stops because of not shown jacking gear.
About the size of absorption layer 82, if size is little,, to not enough with the confining force of panel 10 with supporting mass display device, the number of absorption layer 82 increases, and is uneconomic.In addition, when absorption layer 82 oversize, because vacuumizing, make to adsorb increasing with the distortion of panel 10 with supporting mass display device of central portion, therefore, according to circumstances become the reason with the damage of panel 10 with supporting mass display device.According to this situation, the suitable size of absorption layer 82 (such as φ 25～80mm, be preferably φ 25～65mm, φ 40mm degree more preferably) and number are according to selected with the size of panel 10 and thickness etc. with supporting mass display device.
Absorption layer 82 with respectively independently the piston 89 of cylinder 88 link, the expanding-contracting action by this piston 89 makes absorption layer 82 carry out lifting moving.By the down maneuver of absorption layer 82, absorption layer 82 is pressed and is connected to band supporting mass display device with on panel 10, on absorption layer 82, the upper surface of panel 10 for adsorption band supporting mass display device, will peel off (with reference to Fig. 3) from display device with panel 16 with the supporting mass 17b (supporting glass substrate 19b and resin bed 18b) of panel 10 with supporting mass display device by the vertical motion of absorption layer 82.
Described in being preferably as follows, the vertical motion of such absorption layer 82 controls,, not to make with the absorption layer 82 in panel 10 whole regions, to carry out together vertical motion with supporting mass display device, but from carrying out successively vertical motion with supporting mass display device by the progress of peeling off that the end of panel 10 is accompanied by supporting mass towards central authorities.In addition, the climb of absorption layer is preferably allowed according to supporting mass bending stress and size regulate.
In addition, the linking portion of absorption layer 82 and piston 89 is used spin axis structure etc., preferably in the deflective mode of absorption layer 82, supports.Even if this is because of the part of the supporting glass substrate 19b (with reference to Fig. 3) of the adsorption plane absorption by absorption layer 82, also can peel off gradually from one end, make to peel off stabilization.
In addition, can make absorption layer rise and peel off supporting mass to normal direction, but also can make absorption layer to rising with respect to the angled direction of normal direction tool.For example following detailed description, from with supporting mass display device with the end of panel 10 when central authorities follow the progress of peeling off of supporting mass and carry out vertical motion successively, if so that the mode that absorption layer tilts to this center direction rises, can more easily peel off supporting mass, so preferably.
Fig. 9 means that be the figure above of the position of absorption layer 82 absorption shown in Fig. 8 with supporting mass display device with the upper surface (the second interarea of supporting glass substrate 19b) of panel 10, and Figure 10 means the block diagram of the control system of absorption layer 82.In addition, in Fig. 9, in bight, bottom right, insert blade, the absorption layer that approaches this bight most of a plurality of if (in Fig. 8,9 being 42) absorption layer 82 for pad 82a, establish its adjacent (upper left) two absorption layers for pad 82b, establish and then adjacent (upper left) three absorption layers 82 are pad 82c, mark label for pad 82d～82l after by this way.
Make these pads 82a～82l action (pad of same numeral similarly moves) independently respectively, in each of cylinder 88a～88l of pad 82a～82l, solenoid valve 87a～87l is set as shown in figure 10, and by control part (pad mobile unit) 90, the opening/closing time of these solenoid valves 87a～87l is carried out to time management.That is, control, so that pad 82a～82l rises mobile with specific time interval from eliminate the position (bight) of absorption affinity because inserting blade 30 or blade 300 successively.That is, possesses time control function.Thus, can prevent from making the unreasonable rising in the remaining position of absorption affinity and the supporting mass that causes is damaged.And, can be from following the progress peeled off of supporting mass successively carry out vertical motion and peel off with the end of panel 10 towards central authorities with supporting mass display device.
In addition, cylinder 88a～88l of pad 82a～82l is connected with air pump 83 with electric pressure regulator valve 85a～85l via solenoid valve 87a～87l, by control part 90, these electric pressure regulator valve 85a～85l is controlled respectively.That is, by control part 90, control respectively electric pressure regulator valve 85a～85l, by the air capacity of supplying with to cylinder 88a～88l is increased gradually, can improve gradually the power that absorption layer 82 rises.By carrying out such power, control, can avoid starting at first improving unreasonably the damage problem of the glass substrate 10 with supporting mass that the power of rising causes, and can shorten to minimum by peeling off required necessary time.
On the other hand, absorption layer 82 is connected with vacuum pump 77 with electric pressure regulator valve 78 via the valve 79 that is carried out open and close controlling by control part 90.The control of the air pressure of absorption layer 82 is undertaken by regulator 78.The times that absorption layer 82 rises and the power of rising can be located at the switch (not shown) of touch panel on the operation board of control part 90 etc. and be set as being worth arbitrarily by operator by operation.
< camera >
For stripping off device 1,11, in order to confirm to insert with supporting mass display device, with the blade 30 of the end face 10x of panel 10 or the position of blade 300, possess camera 70, described camera 70 has image processing apparatus.In camera 70, the positional information of blade 30 or blade 300 is taken into image processing apparatus as view data, this view data is processed, by image processing apparatus, determine whether desirable position, to normal direction mobile unit 40, can make thus blade 30 or blade 300 move to desirable position its result feedback.
In the present invention, possess such camera with image processing apparatus, preferably by image, process to determine with supporting mass display device the position with the insertion blade of the end face of panel.
The kind of camera and image processing apparatus etc. is not particularly limited, and can use existing known type.
< blowing device >
Stripping off device 1,11 possesses and can with the interface winding-up between the glass sheet substrate 12b of panel 16, remove resin bed 18b from the nozzle 73 (with reference to Fig. 3) of material (water etc.) for electricity to the supporting mass 17b being stripped from and display device.
When using stripping off device of the present invention to peel off, the display device sometimes obtaining can be charged with panel.For example also sometimes present+10kV's is with voltage.Therefore,, if winding-up is except electricity material when peeling off, can suppress above-mentioned charged.
As except electricity material, can enumerate water or steam plasma liquid and/or gas.In addition, air and other gas that can enumerate by Pulased power supply unit plasma.
In addition, in blowing device, also can jet except electric with the material material (air etc.).In this situation, realize the effect that promotion is peeled off.Even having jetted except electricity is use material in the situation that, also can realize same effect.For example, by the fluid-mixing of winding-up water or water and air, realize except electro ultrafiltration and peel off facilitation, so preferably.
In the present invention, owing to possessing this blowing device, thereby can use it that supporting mass is peeled off with panel 10 from band supporting mass display device.
< band controller for electric consumption >
Stripping off device 1,11 possesses charged restraining device 75 (with reference to Fig. 3), described charged restraining device 75 by conductor connecting band supporting mass display device with panel 10 and ground with inhibition zone supporting mass display device charged for obtaining ground connection with panel 10.
Preferably the periphery on the surface of the glass sheet substrate contacting with parts with display device (interarea) is formed with guard ring, described guard ring is by for example consisting of the film formed non-drive electrode film that does not apply driving voltage of transparency electrode, and this guard ring is connected with conductor and obtains ground connection.
When using stripping off device of the present invention to peel off, resulting display device can be charged with panel sometimes.For example also sometimes present+10kV's is with voltage.Therefore,, if possess charged restraining device as described above, can suppress above-mentioned charged.
In the present invention, if possess this charged restraining device, can aptly supporting mass be peeled off with panel 10 from band supporting mass display device.
In the stripping off device 1,11 of above-mentioned explanation, the stationary plane 20a of worktable 20 is surface level, but in stripping off device of the present invention, and stationary plane can not be also surface level, can not be the parallel faces such as floor with room.Can be also for example the face parallel with vertical direction, can be also the face of skewed crossing with it.In addition, worktable not only, and also do not limit completely for the direction that stripping off device of the present invention self is set.Also can arrange with the configuration of left and right in stripping off device 1 as shown in Figures 1 and 2 of example and stripping off device 11 and transposing up and down.
< stripping means (its 1) >
Secondly, use Fig. 1 (a)～(d) stripping means of stripping off device 1 has been used in explanation.
First, by with supporting mass display device with panel 10 not with after a side the interarea of the supporting mass peeled off connect airtight and be fixed on the plane stationary plane that worktable 20 possesses (Fig. 1 (a)).That is, by with supporting mass display device with panel 10 so that the interarea of the supporting mass that is stripped from of band be upper, take its contrary interarea as under mode vacuum suction be fixed on worktable 20.
Secondly, as shown in Fig. 1 (b), the position of the normal direction (above-below direction) by normal direction mobile unit 40 adjustable blades 30.Particularly, by driving servomotor, make second to move side component 40a normal direction (above-below direction) movement to the stationary plane of worktable 20 with respect to the second fixation side parts 40b, regulate its position inserting blade 30 to the surface of resin bed 18b and the interface between the first interarea of glass sheet substrate 12b of the supporting mass being stripped from.
Secondly, as Fig. 1 (c) and (d), by stationary plane direction mobile unit 42, insert and be pressed into blade 30.If blade 30 is inserted and be pressed in the interface between resin bed 18b and glass sheet substrate 12b along the direction of insertion of stationary plane direction like this, as illustrated in use Fig. 5, Fig. 6, blade 30 and support 61 deform.The stripping off device 1 of the preferred implementation of stripping off device of the present invention can make blade 30 carry out such action, therefore, can aptly supporting mass and above-mentioned display device be peeled off with panel.
< stripping means (its 2) >
Secondly, use Fig. 2 (a)～(d) stripping means of stripping off device 11 has been used in explanation.
First, by with supporting mass display device with panel 10 not with after the interarea of the supporting mass that is stripped from connect airtight the plane stationary plane (Fig. 2 (a)) that is fixed on worktable 20 and possesses.That is, by with supporting mass display device with panel 10 take the supporting mass that is stripped from of band interarea as the interarea upper, it is contrary as under mode vacuum suction be fixed on worktable 20.
Secondly, as shown in Fig. 2 (a), the insertion angle (θ) of adjustable blade 300.Particularly, by rotation (rotation) predetermined angular centered by turning axle, the insertion angle (θ) of blade 300 is adjusted to desirable angle, and the mode contacting by the lower surface with overlayer 52 loads retainer 51, can fix thus and insert angle (θ).
Secondly, as shown in Fig. 2 (b), the position of the normal direction (above-below direction) by normal direction mobile unit 40 adjustable blades 300.Particularly, by driving servomotor, can make second to move side component 40a and move along normal direction with respect to the second fixation side parts 40b, regulate its position inserting blade 30 to the surface of resin bed 18b and the interface between the first interarea of glass sheet substrate 12b of the supporting mass being stripped from.
Secondly, as Fig. 2 (c) and (d), by stationary plane direction mobile unit 42, insert and be pressed into blade 300.If insert and be pressed into blade 300 to the interface between resin bed 18b and glass sheet substrate 12b like this, blade 300 rotates (rotation) predetermined angular centered by its leading section 30a, rearward end 30c upward direction is moved, and then the direction of insertion of the whole upward direction of blade 300 and/or stationary plane direction is moved, and make blade 300 move and then be pressed into (Fig. 2 (d)) in the surperficial mode along resin bed.The stripping off device 11 of the preferred implementation of stripping off device of the present invention can make blade 300 carry out such action, therefore, supporting mass and above-mentioned display device can be peeled off aptly with panel.
In addition, in stripping off device 1,11, peel off example as shown in Figure 3 with supporting mass display device during with two supporting mass 17a of panel 10 and 17b, first a supporting mass 17b is peeled off, make to be again fixed on the stationary plane of same worktable or on the stationary plane of the worktable of other stripping off device of the present invention after its reversion, another supporting mass 17a is peeled off, thereby can obtain display device panel.
Secondly, use Fig. 8～10 explanation to use the preferred stripping means of the stripping off device 1,11 that possesses absorption layer.
On the stationary plane of worktable 20, fixed band supporting mass display device with after panel 10, framework 84 declined mobile, make absorption layer 82 with tight with the surperficial butt of panel 10 with supporting mass display device before time stop described decline and move.Then, the piston 89 of cylinder 88 is extended, make absorption layer 82 movement that declines, and with the surface of panel 10, press butt with supporting mass display device.And by the air pressure of electric pressure regulator valve 78 control absorption layers 82, the time of expending certain degree is increased to above-mentioned set pressure by the air pressure of absorption layer 82.Thus, all absorption layers 82 are adsorbed in band supporting mass display device with on panel 10.
Secondly, as shown in Figure 9, by blade 30 (or blade 300) to inserting blade 30 (or blade 300) with supporting mass display device with the bight of panel 10.At this, preferred blade 30 (or blade 300) is inserted under the absorption layer 82a shown in Fig. 9 tight.This is because can be more easily and carry out aptly peeling off based on absorption layer.And, afterwards, solenoid valve 87a shown in control part 90 control Figure 10, makes absorption keep rising and moving along direction of delaminate (can be also normal direction) with the pad 82a in the bight of panel 10 with supporting mass display device shown in Fig. 9, and the bight of supporting mass 17b is peeled off with panel from display device.
Secondly, the solenoid valve 87b of 90 couples of Figure 10 of control part carries out Open control, makes absorption keep the pad 82b of the edge of the supporting mass 17b shown in Fig. 9 to rise along direction of delaminate mobile, makes the edge of supporting mass 17b from panel 16 (with reference to Fig. 3) separation for display device.
Secondly, the solenoid valve 87c of 87 couples of Figure 10 of control part carries out Open control, makes the pad 82c shown in Fig. 9 increase along direction of delaminate mobile, and the part that is positioned at the inner side, edge of supporting mass 17b is peeled off with panel 16 from display device.
Afterwards, can carry out equally supporting mass fully to peel off with panel from display device.
< band supporting mass display device panel >
Secondly, to describing with panel with supporting mass panel for display device, the display device with supporting mass and glass sheet substrate of using in the present invention.
The band supporting mass display device of using in manufacture method of the present invention is with in panel, on first interarea of display device with the glass sheet substrate of parts, connect airtight resin bed and form having the first interarea and the second interarea and have on the second interarea, described resin bed is fixed on the first interarea of the supporting glass substrate with the first interarea and the second interarea and has easy fissility.
In embodiments of the present invention, electron device is display device panel, but the invention is not restricted to this.As other electron device, can enumerate the electronic components such as semiconductor wafer that solar cell, thin-film secondary battery, surface are formed with circuit.Display device comprises liquid crystal panel, organic EL panel, plasma display, field emission panel etc. with panel.Be particularly suitable for the manufacture of panel for thin-type display device.The advantage of its manufacturing process is directly to utilize the manufacturing installation of one chip.
Band supporting mass display device is with in panel, the thickness of glass sheet substrate, shape, size, physical property (percent thermal shrinkage, surface configuration, chemical resistance etc.), composition etc. are not particularly limited, such as also can be identical with the glass substrate that the display device such as existing LCD, OLED are used.
The thickness of glass sheet substrate is preferably and is less than 0.7mm, more preferably below 0.5mm, more preferably below 0.4mm.In addition, more than being preferably 0.05mm, more preferably more than 0.07mm, more preferably more than 0.1mm.
The shape of sheet glass does not limit, but is preferably rectangle.
The size of sheet glass does not limit, for example, be in the situation of rectangle can be 100～2000mm * 100～2000mm, more preferably 500～1000mm * 500～1000mm.
Even if be such thickness and size, in the stripping process of manufacture method of the present invention, also can easily supporting glass substrate be peeled off and separation from glass sheet substrate.
The characteristics such as the percent thermal shrinkage of glass sheet substrate, surface configuration, chemical resistance are also not particularly limited, according to the kind of the display device of manufacturing and difference.
Preferably percent thermal shrinkage is little.Particularly, preferably the index of percent thermal shrinkage is that linear expansion coefficient is 500 * 10
-7/ ℃ below, more preferably 300 * 10
-7/ ℃ below, be particularly preferably 200 * 10
-7/ ℃ below, and more preferably 100 * 10
-7/ ℃ below, more preferably 45 * 10
-7/ ℃ below.
In addition, in the present invention, linear expansion coefficient refers to the content by JIS R3102 (nineteen ninety-five) regulation.
In embodiments of the present invention, substrate is glass sheet substrate, but the invention is not restricted to this.From the viewpoint that obtains easiness of industry, consider, take glass plate, silicon wafer, sheet metal, plastic plate etc. to represent as preference.
In the situation that adopt the thin glass plate (glass sheet substrate) of thickness of slab as substrate, the composition of glass sheet substrate for example can be identical with alkali glass or alkali-free glass.Wherein, from the little viewpoint of percent thermal shrinkage, preferred alkali-free glass.
In the situation that adopting plastic plate as substrate, its kind is not particularly limited, be for example in the situation of transparent substrate, example pet resin, polycarbonate resin, polyethersulfone resin, PEN resin, polyacrylic resin, polyorganosiloxane resin, transparent fluorine resin etc.In situation for opaque substrate, example polyimide resin, fluorine resin, polyamide, aromatic polyamide resin, polyether ketone resin, polyether-ether-ketone resin, various liquid crystal polymer resins etc.
In the situation that adopting sheet metal as substrate, its kind is not particularly limited, such as example corrosion resistant plate, copper coin etc.
The thermotolerance of substrate is not particularly limited, but uses the preferred thermotolerances such as tft array of parts high in the situation that form display device.Particularly, preferably above-mentioned 5% loss in weight on heating temperature is more than 300 ℃.More preferably more than 350 ℃.
In this situation, aspect thermotolerance, above-mentioned glass plate is all applicable to.
As considering preferred plastic plate from stable on heating viewpoint, example polyimide resin, fluorine resin, polyamide, aromatic polyamide resin, polyethersulfone resin, polyether ketone resin, polyether-ether-ketone resin, PEN resin, various liquid crystal polymer resins etc.
In addition, substrate can be the duplexer that is laminated with the unlike materials such as glass plate, silicon wafer, sheet metal, plastic plate.Such as being the duplexer of glass plate and plastic plate, with the duplexer of the sequential cascade of plastic plate, glass, plastic plate and plural glass plate each other or plural plastic plate duplexer each other etc.
With supporting mass display device, with panel, on the second interarea of above-mentioned glass sheet substrate, there are display device parts.
Display device refers to that with parts the luminescent layer on its surface with the glass substrate of being used by display device such as existing LCD, OLED, protective seam, tft array are (hereinafter referred to as array.), the transparency electrode that forms of colored filter, liquid crystal, ITO etc., various circuit patterns etc.Display device on the second interarea of above-mentioned glass sheet substrate is not particularly limited by the kind of parts.
Display device has parts and above-mentioned glass sheet substrate for such display device with panel.
For band supporting mass display device panel, on the first interarea of above-mentioned glass sheet substrate, as supporting mass, connect airtight the supporting glass substrate that is fixed with resin bed.Supporting glass substrate connects airtight via resin bed and glass sheet substrate, and the intensity of glass sheet substrate is strengthened.
In embodiments of the present invention, supporting substrates is supporting glass substrate, but the invention is not restricted to this.The viewpoint of the easiness obtaining from industry, take glass plate, silicon wafer, sheet metal, plastic plate etc. to represent as preference.
In the situation that adopting glass plate as supporting substrates, the thickness of supporting glass substrate, shape, size, physical property (percent thermal shrinkage, surface configuration, chemical resistance etc.), composition etc. are not particularly limited.
The thickness of supporting glass substrate is not particularly limited, but need to make with supporting mass display device, with panel, is the thickness that can process in existing manufacturing line.
For example be preferably the thickness of 0.1～1.1mm, more preferably 0.3～0.8mm, more preferably 0.4～0.7mm.
For example existing manufacturing line designs can process the mode of the substrate of thickness 0.5mm, in the situation that the thickness of glass sheet substrate is 0.1mm, the thickness of supporting glass substrate and the thickness of resin bed are 0.4mm altogether.In addition, existing manufacturing line is the most common is to design can process the mode of the glass substrate of thickness 0.7mm, if but the thickness 0.4mm of glass sheet substrate is for example 0.3mm with the thickness of resin bed altogether.
The thickness of supporting glass substrate is preferably thick than above-mentioned glass sheet substrate.
The shape of supporting glass substrate does not limit, and is preferably rectangle.
The size of supporting glass substrate does not limit, but preferred and the same degree of above-mentioned glass sheet substrate are more preferably slightly large than above-mentioned glass sheet substrate.For example, particularly, preferred longitudinal direction or transverse direction difference be 0.05～10mm degree roughly.This is because can more easily carry out from glass sheet substrate separation support glass substrate.
The linear expansion coefficient of supporting glass substrate can be identical in fact with above-mentioned glass sheet substrate, also can be different.When identical in fact, when for manufacture method of the present invention, on glass sheet substrate or supporting glass substrate, be difficult to produce deflection, preferred in this.
The difference of the linear expansion coefficient of glass sheet substrate and supporting glass substrate is preferably 300 * 10
-7/ ℃ below, more preferably 100 * 10
-7/ ℃ below, more preferably 50 * 10
-7/ ℃ below.
The composition of supporting glass substrate for example can be identical with alkali glass, alkali-free glass.Wherein, from the little viewpoint of percent thermal shrinkage, be preferably alkali-free glass.
In the situation that adopting plastic plate as supporting substrates, its kind is not particularly limited, such as example pet resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide, aromatic polyamide resin, polyethersulfone resin, polyether ketone resin, polyether-ether-ketone resin, PEN resin, polyacrylic resin, various liquid crystal polymer resin, polyorganosiloxane resin etc.
In the situation that adopting sheet metal as supporting substrates, its kind is not particularly limited, such as example corrosion resistant plate, copper coin etc.
The thermotolerance of supporting substrates is not particularly limited, but in the situation that form display device with the tft array of parts etc., preferably thermotolerance is high.Particularly, preferably above-mentioned 5% loss in weight on heating temperature is more than 300 ℃.And then more preferably more than 350 ℃.
In this situation, glass plate above-mentioned in thermotolerance this point is all applicable to.
As considering preferred plastic material from stable on heating viewpoint, example polyimide resin, fluorine resin, polyamide, aromatic polyamide resin, polyethersulfone resin, polyether ketone resin, polyether-ether-ketone resin, PEN resin, various liquid crystal polymer resins etc.
On the first interarea of such supporting glass substrate, fixing resin bed and the first interarea of above-mentioned glass sheet substrate adhere to and connect airtight, and can easily peel off.That is, resin bed has easy fissility with respect to above-mentioned glass sheet substrate.
Band supporting mass display device used in the present invention is with in panel, thinks that resin bed and glass sheet substrate are not to adhere to because of bonding force that bonding agent has, the power of thinking to cause by the intermolecular van der waals force of solid, because connecting airtight power, adheres to.
The thickness of resin bed is not particularly limited.Be preferably 1～100 μ m, more preferably 5～30 μ m, more preferably 7～20 μ m.This is because if the thickness of resin bed is such scope, and glass sheet substrate and resin bed connects airtight fully.
In addition, even if this is because entrained air bubbles or foreign matter also can suppress the generation of the deformation defect of glass sheet substrate.In addition, if the thickness of resin bed is blocked up, forms and expend time in and material, is uneconomic.
In addition, resin bed can form above by 2 layers.In this situation, " thickness of resin bed " refers to the aggregate thickness of all layers.
In addition, resin bed is by 2 layers of situation about forming above, and the kind that forms the resin of each layer also can be different.
Resin bed is preferably below 30mN/m with respect to the surface tension of the resin layer surface of the first interarea of above-mentioned glass sheet substrate, more preferably below 25mN/m, more preferably below 22mN/m.This is because such surface tension, can more easily peel off with glass sheet substrate if, also becomes abundant with connecting airtight of glass sheet substrate simultaneously.
In addition, resin bed preferably consists of than the low material of room temperature (25 ℃ of degree) or the material without glass temperature vitrification point.This is because be the resin bed of non-cementability, has easier fissility, can more easily peel off with glass sheet substrate, also becomes abundant with connecting airtight of glass sheet substrate simultaneously.
In addition, preferred resin layer has thermotolerance.This be because, in the present invention, for example, in the situation that form parts for display device on the second interarea of above-mentioned glass sheet substrate, sometimes by the glass laminate of glass sheet substrate and resin bed and supporting glass substrate for thermal treatment.
In addition, when the spring rate of resin bed is too high, reduce with the adhesion of glass sheet substrate, so will not be preferably.In addition, if spring rate is too low, easy fissility step-down, so will not be preferably.
The kind that forms the resin of resin bed is not particularly limited.Can enumerate for example acryl resin, polyolefin-based resins, urethane resin and silicone resin.Also the mixed with resin of several kinds can be used.Preferred silicone resin in above-mentioned resin group.This is because silicone resin excellent heat resistance and suitable with respect to the degree of the easy fissility of glass sheet substrate.In addition, this is because the condensation reaction of the silanol by the first interarea with supporting glass substrate is easily fixed on supporting glass substrate.Even if silicone resin layer is for example processed 1 hour degree under 300～400 ℃ of degree, easily fissility also hardly can be deteriorated, also preferred in this.
In addition, resin bed preferably also consists of silicone for release paper in silicone resin, more preferably its solidfied material.It is host that silicone for release paper be take the silicone that molecule contains the dimethyl polysiloxane of straight chain shape.The resin bed that uses catalyzer, Photoepolymerizationinitiater initiater etc. that the constituent that contains this host and crosslinking chemical is solidify to form to the surface (the first interarea) in above-mentioned supporting glass substrate has excellent easy fissility, so preferably.In addition, because flexibility is high, so even if the foreign matters such as bubble or dust are sneaked between glass sheet substrate and resin bed, also can suppress the generation of the deformation defect of glass sheet substrate.
This silicone for release paper is categorized into condensation reaction type silicone, addition reaction-type silicone, ultraviolet hardening silicone and electronic beam solidified silicone according to its curing mechanism, all can use.Preferred addition reaction-type silicone wherein.This is that thermotolerance is also high because the easness of curing reaction, the degree of easy fissility is good while forming resin bed.
In addition, silicone for release paper has solvent-borne type, emulsion-type and no-solvent type in form, and any type all can be used.Preferred no-solvent type wherein.Productivity, security, environmental characteristics aspect excellence.In addition, owing to not containing curing when forming resin bed, be heating and curing, produce the solvent of foaming when ultraviolet curing or electronic beam curing, so be difficult to residual bubble in resin bed.
In addition, as silicone for release paper, particularly as commodity or the model of conventionally selling, enumerate KNS-320A, KS-847 (being silicone company of SHIN-ETSU HANTOTAI system), TPR6700 (silicone company of GE Toshiba system), the combination of vinyl silicone " 8500 " (Arakawa Chemical Industries, Ltd.'s system) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd.'s system), the combination of vinyl silicone " 11364 " (Arakawa Chemical Industries, Ltd.'s system) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd.'s system), the combination of vinyl silicone " 11365 " (Arakawa Chemical Industries, Ltd.'s system) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd.'s system) etc.In addition, KNS-320A, KS-847 and the TPR6700 silicone for containing host and crosslinking chemical in advance.
In addition, the silicone resin that forms resin bed preferably has character that composition in silicone resin is difficult to shift to glass sheet substrate, i.e. low silicone metastatic.
Use silicone resin layer as resin bed like this in the situation that, can recycle aptly the supporting mass being formed by the above-mentioned supporting glass substrate of having peeled off and above-mentioned silicone resin layer.The silicone resin of the supporting mass after such peeling off has in the metastatic situation of low silicone, and this silicone resin layer has the trend of high residual bonding rate.Therefore, can recycle no problemly.
Secondly, use accompanying drawing to describe with panel band supporting mass display device.
Figure 11 means the summary section of using a mode of panel with supporting mass display device of the present invention.
In Figure 11, band supporting mass display device consists of parts 114, glass sheet substrate 112, resin bed 118 and supporting glass substrate 119 for display device with panel 110, and they are stacked.In addition, with panel 116, the display device by stratiform forms with parts 114 and glass sheet substrate 112 display device, and supporting mass 117 consists of resin bed 118 and supporting glass substrate 119.In addition, display device is formed on the second interarea of glass sheet substrate 112 with parts 114.
And the first interarea of glass sheet substrate 112 connects airtight and adheres to the surface of fixing resin bed 118 on the first interarea of supporting glass substrate 119, formation band supporting mass panel 110 for display device.
The band supporting mass display device of the mode shown in Figure 11 is with in panel 110, and glass sheet substrate 112 and resin bed 118 and supporting glass substrate 119 are identical size.
Figure 12 means the general positive map with the alternate manner of panel with supporting mass display device, and Figure 13 is its A-A ' sectional view (summary section).
In Figure 12 and Figure 13, band supporting mass display device consists of parts 124, glass sheet substrate 122, resin bed 128 and supporting glass substrate 129 for display device with panel 120, and they are stacked.In addition, with panel 126, the display device by stratiform forms with parts 124 and glass sheet substrate 122 display device, and supporting mass 127 consists of resin bed 128 and supporting glass substrate 129.In addition, display device is formed on the second interarea of glass sheet substrate 122 with parts 124.
And the first interarea of glass sheet substrate 122 connects airtight and adheres to fixing resin bed 128 on the first interarea of supporting glass substrate 129, form band supporting mass panel 120 for display device.
The band supporting mass display device of the mode shown in Figure 12 and Figure 13 is with in panel 120, and the major-surface-area of supporting glass substrate 129 is larger than glass sheet substrate 122.
In addition, the band supporting mass display device of the mode shown in Figure 12 and Figure 13 is used in panel 120, the area of the surface of the Area Ratio resin bed 128 of the first interarea of glass sheet substrate 122 (face contacting with glass sheet substrate 122) (following " surface area " also referred to as resin bed.) large.The surface area of resin bed 128 is than the little amount that is formed with clearance portion 125 of the area of the first interarea of glass sheet substrate 122.And a part of β of the part α not contacting with the resin bed 128 of the first interarea of glass sheet substrate 122 and the supporting glass substrate 129 relative with described α forms and the clearance portion 125 being connected with the end face (γ 1, γ 2) of panel 120 with supporting mass display device of the present invention.
When forming this clearance portion 125, in the stripping process of manufacture method of the present invention, can more easily peel off glass sheet substrate 122 and resin bed 128, so preferably.
α shown in Figure 12, Figure 13 is preferably 0.1～5.0mm, more preferably 2.5mm degree.
In addition, band supporting mass display device uses panel as shown in summary section in Figure 14, also can be for display device being used two interareas of parts 134 by the mode of the duplexer clamping of glass sheet substrate (132a, 132b), resin bed (138a, 138b) and supporting glass substrate (139a, 139b).Now, with panel 136, the display device by stratiform forms with glass sheet substrate 132a, the 132b of parts 134 and both sides display device, and supporting mass 137a and 137b consist of resin bed 138a, 138b and supporting glass substrate 139a, 139b respectively.Even if be such mode, it is also the band supporting mass display device panel that can use in the present invention.
Secondly, to describing by the manufacture method of panel with supporting mass display device of can using in the present invention.
The manufacture method of glass sheet substrate and supporting glass substrate is not particularly limited.For example can manufacture by existing known method.For example can dissolve after glass existing known frit is dissolved make, by float glass process, fusion method, descent method, under draw method, daraf(reciprocal of farad) etc. is configured as tabular obtaining again.
On the surface (the first interarea) of the supporting glass substrate of manufacturing like this, the upper method that forms resin bed is also not particularly limited.
For example can enumerate the lip-deep method that film is adhered to supporting glass substrate.Particularly, can enumerate for the surface of film is given high bonding force and carried out the processing of surface modification, and be adhered to the method on the first interarea of supporting glass substrate.As the disposal route of surface modification, on the chemistry of example silane coupling agent and so on, improve connect airtight power chemical method, as flame treatment, make physical method that surfactivity base increases, as blasting treatment by making surperficial rugosity increase the mechanical means etc. of stretching.
In addition, for example can enumerate by known method the resin combination as resin bed is coated on to the method on the first interarea of supporting glass substrate.As known method, can enumerate spraying process, mould painting method, spin-coating method, dip coated method, rolling method, excellent painting method, stencil printing, intaglio plate rubbing method.Can be according to the suitable selection of the kind of resin combination from these methods.
For example, in the situation that use the silicone for release paper of no-solvent type as resin combination, preferably mould is coated with method, spin-coating method or stencil printing.
In addition, in the situation that manufacture as use Figure 12,13 explanations have clearance portion with supporting mass panel display device for, preferably in advance the position of formation clearance portion is sheltered, thereon application of resin constituent.Shelter the method as described below that refers to, at the position that forms clearance portion, paste in advance the film of removable etc. during application of resin constituent, not at this position application of resin constituent, afterwards this film is peeled off.
In addition, in the situation that resin combination is coated on the first interarea of supporting glass substrate, its coating amount is preferably 1～100g/m
2, 5～20g/m more preferably
2.
In addition, as other method, for example, when forming resin bed by addition reaction-type silicone, to comprise that the resin combination that molecule contains the silicone of the dimethyl polysiloxane of straight chain shape (host), crosslinking chemical and catalyzer is coated on supporting glass substrate by the above-mentioned known methods such as spraying process, is heating and curing afterwards.The condition that is heating and curing is according to the use level of catalyzer and difference, but for example when total amount 100 mass parts with respect to host and crosslinking chemical coordinate the platinum group catalyst of 2 weight portions, make its in atmosphere at 50 ℃～250 ℃, be preferably at 100 ℃～200 ℃ and react.In addition, the reaction time in this situation is 5～60 minutes, is preferably 10～30 minutes.In order to form, there is the metastatic silicone resin layer of low silicone, preferably be cured as much as possible reaction so that the silicone composition of remained unreacted not in silicone resin layer, such temperature of reaction and reaction time if, can be in silicone resin layer the silicone composition of remained unreacted not, so preferably.In the situation that more too high than long situation of above-mentioned reaction time or temperature of reaction, the oxygenolysis of silicone resin produces simultaneously, generates low-molecular-weight silicone composition, and therefore, silicone metastatic may improve.With in silicone resin layer not the mode of the silicone composition of remained unreacted be cured as much as possible reaction, can make the fissility after heat treated good, so preferably.
By such method, on the first interarea of supporting glass substrate, form after resin bed, at the superficial layer stacked plate glass substrate of resin bed.
When using silicone for release paper to manufacture resin bed, the silicone for release paper being coated on supporting glass substrate is heating and curing and forms silicone resin layer, afterwards laminated thin plate glass substrate on the silicone resin formation face of supporting glass substrate.By silicone for release paper is heating and curing, silicone resin solidfied material and supporting glass chemical bond.In addition, by anchoring effect, silicone resin layer is combined with supporting glass.By these effects, silicone resin layer is firmly fixed on supporting glass substrate.
The power that glass sheet substrate and resin bed cause by the intermolecular van der waals force of relative solid approaching very much, by connecting airtight power and resin bed connects airtight.In this situation, can remain on the state after stacked by supporting glass substrate and glass sheet substrate.
In the method for superficial layer stacked plate glass substrate that is fixed on the resin bed of supporting glass substrate, be not particularly limited.For example can use known method to implement.For example can be set forth under atmospheric pressure environment surface at resin bed overlapping after glass sheet substrate, use roll squeezer or extruder by the method for resin bed and glass sheet substrate crimping.By carrying out crimping by roll squeezer or extruder, resin bed and glass sheet substrate more connect airtight, so preferably.In addition, by carrying out crimping by roll squeezer or extruder, can easily remove the bubble of sneaking between resin bed and glass sheet substrate, so preferably.
While carrying out crimping by vacuum layer platen press or vacuum press method, can more appropriately carry out the inhibition that bubble sneaks into and guarantee good connecting airtight, so preferably.By carry out crimping under vacuum, there is following advantage: even in the situation that the bubble of residual pettiness, bubble can not grown up because of heating yet, is difficult to cause the deformation defect of glass sheet substrate yet.
When the superficial layer stacked plate glass substrate of the resin bed of supporting glass substrate, preferably the surface of glass sheet substrate is fully cleaned, under the high environment of cleanliness, carry out stacked.Even if this is because there is foreign matter, due to resin bed distortion, thereby can not bring impact to the flatness on glass sheet substrate surface yet, cleanliness are higher, and its flatness is better, more preferred.
Obtaining like this glass laminate that glass sheet substrate and resin bed and supporting glass substrate be laminated (below also referred to as " the stacked body of sheet glass ".) after, on the second interarea of the glass sheet substrate of the stacked body of this sheet glass, form display device parts.
When formation display device is used parts, also preferably as required the second interarea of glass sheet substrate is ground, make thus its flatness improve.
Display device is not particularly limited with parts.For example can enumerate array and colored filter that LCD has.In addition, for example can enumerate transparency electrode, hole injection layer, hole transporting layer, luminescent layer, the electron supplying layer that OLED has.
The method of this formation display device parts is also not particularly limited, can be identical with existing known method.
For example, while manufacturing LCD as display device, also can with on existing known glass substrate, form the operation of array, form the operation, identical by being formed with the glass substrate of array and being formed with the bonding various operations such as operation (array/colored filter bonding process) of the glass substrate of colored filter of colored filter.More specifically, as the processing of implementing by these operations, for example, can enumerate that pure water cleans, dry, film forming, resist coating, exposure, development, etching and resist remove.In addition, as the operation having implemented to carry out after the bonding process of array side substrate/colored filter side group plate, there is Liquid crystal pour operation and at the sealing process of the inlet of having implemented to carry out after this processing, can be set forth in the processing of implementing in these operations.
In addition, the situation of manufacturing OLED of take is example, as for form the operation of organic EL tectosome on the first interarea of glass sheet substrate, the various operations such as the operation that comprises the operation, evaporation hole injection layer/hole transporting layer/luminescent layer/electron supplying layer etc. that form transparency electrode, sealing process, as the processing of implementing by these operations, particularly such as can enumerate film forming processing, vapor deposition treatment, seal pad bonding processing etc.
Can manufacture so spendable band supporting mass display device panel in the present invention.
Secondly, manufacture method of the present invention is described.
Manufacture method of the present invention is to manufacture the manufacture method of panel for display device, comprise from peel off the operation of the supporting mass being formed by described supporting glass substrate and described resin bed with panel with supporting mass display device, describedly with supporting mass display device, with panel, on first interarea of display device with the glass sheet substrate of parts, connect airtight resin bed and form thering is the first interarea and the second interarea and have on the second interarea, described resin bed is fixed on the first interarea of the supporting glass substrate with the first interarea and the second interarea and has easy fissility wherein, possess: fixing operation, in above-mentioned two interareas that have with panel with supporting mass display device one the plane stationary plane not possessing to worktable with the interarea of the supporting mass being stripped from the stripping process as rear operation is connected airtight, by above-mentioned, with supporting mass display device, with panel, be fixed on the stationary plane of above-mentioned worktable, and stripping process, to above-mentioned resin bed and the interface between above-mentioned glass sheet substrate of being fixed on the above-mentioned above-mentioned supporting mass being stripped from the end face with panel with supporting mass display device on the stationary plane of above-mentioned worktable, insert blade, above-mentioned supporting mass and above-mentioned display device are peeled off with panel.
Like this, manufacture method of the present invention possesses above-mentioned fixedly operation and above-mentioned stripping process, and fixedly operation and stripping process can be by the above-mentioned suitable enforcements of stripping off device of the present invention for this.By above-mentioned stripping means, can implement above-mentioned fixedly operation and above-mentioned stripping process.
In manufacture method of the present invention, the above-mentioned fixedly operation of panel application and above-mentioned stripping process for the band supporting mass display device that the method by above-mentioned is obtained, can obtain display device panel thus.
The process flow diagram of one of the flow process of the manufacture method of panel example for the display device that Figure 17 means one of the manufacture method of electron device of the present invention embodiment.
Situation based on using the stripping off device of the present invention shown in Fig. 1 and Fig. 2 illustrates the manufacture method of panel for the display device of the present invention shown in Figure 17.
As shown in figure 17, in display device of the present invention, with in the manufacture method of panel, first, in step S100, preparation band supporting mass panel 10 for display device, for example, manufacture as mentioned above.
Secondly, transfer to the fixedly operation with panel with supporting mass display device of step 110.
At this, fixedly in operation S110, in step S112, make to connect airtight on the stationary plane of worktable 20 with panel 10 with supporting mass display device.Secondly, in step S114 the step of connecting airtight is fixed on to the stationary plane of worktable 20 by panel 10 vacuum suction with supporting mass display device.
Secondly, transfer to the stripping process with panel with supporting mass display device of step 120.
In this stripping process S120, apply above-mentioned stripping means (its 1) and these two first and second stripping meanss of stripping means (its 2).Can certainly only implement a stripping means.
In the first stripping means (with reference to Fig. 1) of stripping process S120, first, the insertion position (highly) that adjustable blade 30 is used the interface between the glass sheet substrate of panel to resin bed and the display device of the supporting mass with supporting mass display device use panel 10 in step S122.Secondly, in step S124, to the interface between resin bed and glass sheet substrate, insert and be pressed into blade 30.
Then, in step S126, make blade 30 move and supporting mass is peeled off to direction of insertion.
On the other hand, in the second stripping means (with reference to Fig. 2) of stripping process S120, first, in step S132, adjustable blade 300 is with respect to insertion angle and insertion position (highly) of using the interface between the glass sheet substrate of panel by resin bed and the display device of the supporting mass of panel 10 with supporting mass display device.Secondly, in step S134, to the interface of resin bed and glass sheet substrate, insert and be pressed into blade 300.Then,, in step S136, make blade 300 centered by its front end, rotate (rotation) predetermined angular, and make described blade upward direction and/or direction of insertion move and supporting mass is peeled off.
Like this, in stripping process S120, from band supporting mass display device, with panel 10, peel off supporting mass, thus, in step S140, manufacture display device panel.
The above-mentioned stripping process that manufacturing method according to the invention possesses, in the situation that supporting glass substrate is larger, even if be for example 730 * 920mm, also separated above-mentioned supporting glass substrate easily.
In addition, after for above-mentioned stripping process, can be further for desirable operation.Desirable operation refers to, the situation of LCD for example if, can enumerate the unit that is divided into desired size operation, inject and seal the operation of inlet after liquid crystal, the operation of pasting polaroid, module form operation.In addition, the situation of OLED for example if,, on the basis of the operation of the situation applicable to LCD, also can enumerate and will be formed with the operation of glass sheet substrate with the relative substrate mounting of organic EL tectosome.In addition, be divided in the operation of unit of desired size, from the intensity of glass sheet substrate, because cutting off to process, do not reduce, the viewpoint that does not also produce in addition cullet is set out, and is preferably based on cut and cuts off.
In the manufacture method of the present invention by such, obtain display device with after panel, further, for existing known operation, can obtain display device thus.
The manufacture of the small-sized display device that the mobile terminal of the applicable mobile phone of manufacture method of such display device or PDA and so on is used.Display device is mainly LCD or OLED, as LCD, comprises TN type, STN type, FE type, TFT type, mim type, IPS type, VA type etc.Substantially in the situation that in passive drive type, active-drive any display device all can apply.
Preference to manufacture method of the present invention describes.
First, to spendable in the present invention, with supporting mass display device, by the manufacture method of panel, describe.
First, prepare glass sheet substrate and supporting glass substrate, and their surface is cleaned.As cleaning, for example, can enumerate pure water cleaning, UV cleaning.
Secondly, on the first interarea of supporting glass substrate, form resin bed.For example on the first interarea of supporting glass substrate, use screen printer coating silicone resin.Be heating and curing, on the first interarea of supporting glass substrate, form resin bed, be fixed the supporting glass substrate of resin bed.
Secondly, by the first interarea adhesive bonding of resin bed and sheet glass.For example can by resin bed and glass sheet substrate, at room temperature vacuum press be bonding.Then, the duplexer of supported glass substrate and resin bed and glass sheet substrate is glass laminate.
At this, the second interarea of glass sheet substrate that as required also can abrading glass duplexer, and also can clean.As cleaning, for example, can enumerate pure water cleaning, UV cleaning.
After having manufactured by this method two glass laminate, on the second interarea of the glass sheet substrate of each glass laminate, form display device parts.A glass laminate forms operation for known colored filter, and the second interarea at this glass sheet substrate forms colorful optical filter array thus.And another glass laminate forms operation for known array, the second interarea at this glass sheet substrate forms tft array thus.
By such method, can manufacture two band supporting mass display device panels.
In addition, below, the band supporting mass display device with the colorful optical filter array obtaining at this is called to " band supporting mass panel x ", the band supporting mass panel with tft array is called to " band supporting mass panel y " with panel.
In manufacture method of the present invention, by further processing with the method for situation 1～situation 4 for example as follows with supporting mass panel x and with supporting mass panel y of manufacturing like this, manufacture display device panel.
(situation 1)
In situation 1, make as mentioned above with supporting mass panel x and relative with tft array with supporting mass panel y colorful optical filter array separately, use unit to form and carry out bonding with sealants such as ultraviolet hardening sealants.Below, the band supporting mass display device obtaining at this is used panel also referred to as " band supporting mass panel z1 ".With supporting mass panel z1, be not yet to enclose the state of liquid crystal.
Secondly, by the Liquid crystal pour hole sealing with supporting mass panel z1.Such as also using the water-soluble sealant of ultraviolet hardening etc. by the further sealing of its outside.
And, by the stripping process for manufacture method of the present invention with supporting mass panel z1 after sealing.Particularly, at stripping off device of the present invention, be on the worktable 20 of stripping off device 1 or stripping off device 11, take the supporting mass that band peels off interarea as on, its contrary interarea as under mode be fixed, any part to the first interarea of glass sheet substrate and the end of connecting airtight interface of resin bed inserts blade, forms gap.And absorption keeps a plurality of absorption layers on the second interarea of the supporting glass substrate of supporting mass, make described absorption layer upward direction (direction of delaminate) mobile, thus by supporting mass and glass sheet substrate peel separation.
Secondly, by the transposing up and down to supporting mass panel z1, similarly process, two supporting masses can be peeled off.
Below, also the display device obtaining is like this called to " panel w1 " with panel.Peel off two also separated supporting masses and can recycle manufacture with supporting mass panel in other.
Secondly, panel w1 is cut into independent unit.
Secondly, the independent unit after Liquid crystal pour is cut off, seals afterwards and forms liquid crystal cells.
Then, further additional polaroid, forms backlight etc., thereby can obtain LCD1.
(situation 2)
In situation 2, make as mentioned above with supporting mass panel x and relative with tft array with supporting mass panel y colorful optical filter array separately, enclose liquid crystal, afterwards, use unit to form and carry out bonding with sealants such as ultraviolet hardening sealants.Below, by the band supporting mass panel of the present invention obtaining at this also referred to as " band supporting mass panel z2 ".
Secondly, by the stripping process for manufacture method of the present invention with supporting mass panel z2.Particularly, at stripping off device of the present invention, be on the worktable 20 of stripping off device 1 or stripping off device 11, take the supporting mass that band is stripped from interarea as on, its contrary interarea as under mode be fixed, any part in the first interarea of glass sheet substrate and the end of connecting airtight interface of resin bed inserts blade, forms gap.And absorption keeps a plurality of absorption layers on the second interarea of the supporting glass substrate of supporting mass, by making described absorption layer upward direction (direction of delaminate) mobile, supporting mass and glass sheet substrate can be peeled off and separated.
Secondly, the transposing up and down with supporting mass panel z2 is similarly processed, two supporting masses can be peeled off thus.
Below, use panel also referred to as " panel w2 " display device obtaining like this.Peel off two also separated supporting masses and can recycle the manufacture with supporting mass panel in other.
Secondly, panel w2 is cut into independent unit.
Then, and then additional polaroid, form backlight etc., thereby can obtain LCD2.
(situation 3)
In situation 3, make as mentioned above with supporting mass panel x and relative with tft array with supporting mass panel y colorful optical filter array separately, enclose liquid crystal, use afterwards unit to form and carry out bonding with sealants such as ultraviolet hardening sealants.Then, together cut into independent unit with supporting mass.Below, also the band supporting mass display device obtaining in this cut-out is called to " band supporting mass panel z3 " with panel.
Secondly, will be with supporting mass panel z3 for stripping process.Particularly, it at stripping off device of the present invention, is the worktable 20 of stripping off device 1 or stripping off device 11, take the supporting mass that is stripped from of band interarea as the interarea upper, it is contrary as under mode be fixed, any part in the first interarea of glass sheet substrate and the end of connecting airtight interface of resin bed inserts blade, forms gap.Then, on the second interarea of the supporting glass substrate of supporting mass, absorption keeps a plurality of absorption layers, by making described absorption layer upward direction (direction of delaminate) mobile, supporting mass and glass sheet substrate can be peeled off and separated.
Secondly, by the transposing up and down to supporting mass panel z3, similarly process, two supporting masses can be peeled off.
Below, also the display device obtaining is like this called to " panel w3 " with panel.
Then, and then additional polaroid, form backlight etc., thereby can obtain LCD3.
(situation 4)
In situation 4, as mentioned above, make with supporting mass panel x and relative with tft array with the colorful optical filter array separately of supporting mass panel y, use unit to form and carry out bonding with sealants such as ultraviolet hardening sealants.Then, be together cut to independent unit with supporting mass.Below, also the band supporting mass panel of the present invention obtaining in this cut-out is called to " band supporting mass panel z4 ".With supporting mass panel z4, be not yet to enclose the state of liquid crystal.
Secondly, also can be by the Liquid crystal pour hole sealing with supporting mass panel z4.Also can be such as using the water-soluble sealant of ultraviolet hardening etc. by the further sealing of its outside.
Then, by sealing after band supporting mass panel z4 for stripping process.Particularly, at stripping off device of the present invention, be on the worktable 20 of stripping off device 1 or stripping off device 11, take the supporting mass that is stripped from of band interarea as the interarea upper, it is contrary as under mode be fixed, any part in the first interarea of glass sheet substrate and the end of connecting airtight interface of resin bed inserts blade, forms gap.Then, on the second interarea of the supporting glass substrate of supporting mass, absorption keeps a plurality of absorption layers, makes described absorption layer upward direction (direction of delaminate) mobile, supporting mass and glass sheet substrate can be peeled off thus and separated.
Secondly, the transposing up and down with supporting mass panel z4 is similarly processed, two supporting masses can be peeled off thus.
Below, also the panel obtaining at these separated two supporting masses is called to " panel w4 ".
Secondly, the unit to panel w4 injects liquid crystal, sealing afterwards.
Then, and then additional polaroid, form backlight etc., thereby can obtain LCD4.
Above, as electron device of the present invention, take and on the surface of substrate (the second interarea), there is display device and be illustrated as typical example with the display device panel of parts, but as mentioned above, the invention is not restricted to this, can certainly be to replace display device with parts, on the surface of substrate (the second interarea), to have respectively the electron devices such as solar cell, thin-film secondary battery and electronic component of the used for electronic device parts such as circuit for parts for solar cell, thin-film secondary battery use parts and electronic component.
For example, as solar cell parts, in silicon type, the transparency electrodes such as anodal tin oxide, the silicon layer representing with p layer/i layer/n layer and the metal of negative pole etc. can be enumerated, in addition, the various parts corresponding with compound type, coloring matter sensitization type, quantum point type etc. etc. can be enumerated.
In addition, as thin-film secondary battery parts, in type lithium ion, can enumerate the transparency electrodes such as the metal of positive pole and negative pole or metal oxide, the lithium compound of dielectric substrate, the metal of current collection layer, as resin of sealant etc., in addition, can enumerate the various parts corresponding with ni-mh type, polymer-type, ceramic electrolyte type etc. etc.
In addition, as electronic component circuit, in CCD and CMOS, can enumerate the metal of conductive part, the monox of insulation division and silicon nitride etc., in addition, can enumerate various parts corresponding with the various sensors such as pressure transducer/acceleration transducer and rigidity printed board, flexible printed board, rigid and flexibility printed board etc. etc.
Embodiment 1
Embodiments of the invention are described.
First, to vertical 720mm, horizontal 600mm, thickness of slab 0.4mm, linear expansion coefficient 38 * 10
-7/ ℃ supporting glass substrate (Asahi Glass Co., Ltd's system, AN100, alkali-free glass substrate) carry out pure water cleaning, UV and clean and make it to clean.
Secondly, on supporting glass substrate to indulge screen printer coating (the coating amount 30g/m for size of 705mm, horizontal 595mm
2) the solvent-free addition reaction-type silicone for release paper (potpourri of silicone company of SHIN-ETSU HANTOTAI system, KNS-320A, viscosity: 0.40Pas, 100 mass parts and platinum group catalyst (silicone company of SHIN-ETSU HANTOTAI system, CAT-PL-56) 2 mass parts.
Secondly, it is heating and curing 30 minutes at 180 ℃ in atmosphere, on the surface of supporting glass substrate, obtains the silicone resin layer of thickness 20 μ m.
Secondly, to vertical 715mm, horizontal 595mm, thickness of slab 0.3mm, linear expansion coefficient 38 * 10
-7/ ℃ the face of a side of silicone resin layer contact of glass sheet substrate (Asahi Glass Co., Ltd's system, AN100, alkali-free glass substrate) carry out pure water cleaning, UV cleans and after making it to clean, by silicone resin layer and glass sheet substrate, at room temperature vacuum press is bonding, obtains glass laminate (glass laminate A1).
In addition, the mode of the stacked clearance portion with the end formation degree of depth 15mm in glass laminate of the formation of resin bed and glass sheet substrate is carried out.
In the glass laminate A1 obtaining, two glass substrates connect airtight not produce mode and the silicone resin layer of bubble, thereby both there is no crooked shape defect and flatness.
Secondly, different from the glass laminate A1 as above obtaining, further glass substrate A1 is obtained in atmosphere to glass laminate A2 with 300 ℃ of heat treated 1 hour.The resin bed that can confirm glass laminate A2 can be not deteriorated because of heat, and thermotolerance is good.
Secondly, by glass laminate A1 and A2 for following disbonded test 1～6.
< disbonded test 1>
The second interarea side of utilizing the glass sheet substrate of the stripping off device 1 fixing glass duplexer A1 on Porous vacuum suction sheet that uses above-mentioned Fig. 1 explanation is the attached maintenance vacuum suction of the second interarea side draught pad (40mm φ) of supporting glass substrate at opposing face.
Then, by blade (thickness: 0.10mm, length: 100mm, width: 10mm, stainless steel, flexural rigidity A:170Nmm
2, flexural rigidity B:1,720,000Nmm
2) load on bight in glass laminate A1 (in four bights) and end face, by stationary plane direction mobile unit, make the blade surface of contact pressure resin layer a little, and limit sliding edge is inserted into and the first interarea of glass sheet substrate between interface, insert about 20mm, form space.
Secondly, make vacuum suction pad from using the end of panel towards central authorities with supporting mass display device, follow the progress that supporting mass is peeled off to rise successively.At this moment absorption layer range of lift be 10mm.
In such disbonded test 1, blade self-deformation, moves along the surface of resin bed.And, can not damage supporting mass and glass sheet substrate and peel off.
< disbonded test 2>
Utilize the second interarea side of the glass sheet substrate of the stripping off device 11 fixing glass duplexer A1 on Porous vacuum suction sheet that uses above-mentioned Fig. 2 explanation, and at opposing face, be the attached maintenance vacuum suction of the second interarea side draught pad (40mm φ) of supporting glass substrate.
Secondly, by blade (thickness: 0.40mm, length: 100mm, width: 10mm, stainless steel, flexural rigidity A:11000Nmm
2, flexural rigidity B:6,870,000Nmm
2) load on bight in glass laminate A1 (in four bights) and end face, by stationary plane direction mobile unit, make the blade surface of contact pressure resin layer a little, interface between limit sliding edge insertion simultaneously and the first interarea of glass sheet substrate, inserts about 20mm, forms space.
Secondly, make vacuum suction pad from using the end of panel towards central authorities with supporting mass display device, follow the progress that supporting mass is peeled off to rise successively.The range of lift of absorption layer is at this moment 10mm.
In such disbonded test 2, blade is rotated centered by leading section, and rearward end upwards moves freely, and then the whole upward direction of blade is moved, and blade moves in the surperficial mode along resin bed thus.And, can not damage supporting mass and glass sheet substrate and peel off.
< disbonded test 3>
Using the second interarea side of the glass sheet substrate of stripping off device 11 fixing glass duplexer A1 on Porous vacuum suction sheet, is that the second interarea side draught of supporting glass substrate is attached and keep vacuum suction pad (40mm φ) at opposition side.
Secondly, blade (thickness: 0.10mm, length: 100mm, width: 10mm, stainless steel) is loaded to bight in glass laminate A1 (in four bights) and end face, by stationary plane direction mobile unit, make the blade surface of contact pressure resin layer a little, simultaneously limit sliding edge be inserted into and the first interarea of glass sheet substrate between interface, insert about 20mm and form space.At this, be inserted in from static remover (キYiエン ス company system) and will when jet in this interface, carry out except electrical fluid.
When secondly, then winding-up is except electrical fluid towards the space forming from static remover, vacuum suction pad is promoted.Its result can not damaged glass laminate A1 supporting mass and sheet glass are peeled off.The with voltage of glass sheet substrate after peeling off is+0.2kV.
< disbonded test 4>
The second interarea side of using the glass sheet substrate of stripping off device 11 fixing glass duplexer A1 on Porous vacuum suction sheet is the attached maintenance vacuum suction of the second interarea side draught pad (40mm φ) of supporting glass substrate at opposing face.
Secondly, by blade (thickness: 0.10mm, length: 100mm, width: 10mm, stainless steel.) load bight in glass laminate A1 (in four bights) and end face, by stationary plane direction mobile unit, make the blade surface of contact pressure resin layer a little, simultaneously limit sliding edge insert and the first interarea of glass sheet substrate between interface, insert about 20mm and form space.
Secondly, from finishing nozzle (いけうち company system, 1mm φ) to the space winding-up water under high pressure (2MPa) forming.Its result can not damaged glass laminate A1 and peel off supporting mass and sheet glass.The with voltage of glass sheet substrate after peeling off is+0.2kV.
< disbonded test 5>
Except using glass laminate A2, with the method that the disbonded test 1 with above-mentioned is identical, carry out disbonded test 4.Do not damage glass laminate A2 by supporting glass substrate and glass sheet substrate peel separation.
< disbonded test 6>
Use two glass laminate A2, the first ultra-violet solidified sealant for interarea side of each glass sheet substrate (ponding chemistry society system) is bonding after the region wire apart from glass end 5mm inner side and tetragonal coating, obtain glass laminate, except using, this is glass laminated external, with the method identical with disbonded test 1, implements disbonded test 5.
Can will be bonded with duplexer that two glass sheet substrates form, from panel, not damage separated two supporting masses in panel ground.
< disbonded test 7>
Stripping off device 1 and stripping off device 11 do not make land used peel off.
For above-mentioned glass laminate A1, blade (length 650mm, the 1mm of blade are thick) is manually loaded to bight and end in glass laminate A1, described blade is contacted be a little formed on the surface of resin bed of the first interarea of supporting glass substrate, interface between limit sliding edge insertion simultaneously and the first interarea of glass sheet substrate, make described blade then directly mobile, do not damage glass laminate A1 supporting glass is separated from sheet glass.The with voltage of sheet glass after separation is+10kV.
Embodiment 2
In embodiment 2, except substrate being changed to the pet resin substrate of thickness 0.1mm, make similarly to Example 1 duplexer B, carry out the test identical with disbonded test 3.Its result can not damaged duplexer B by supporting mass and pet resin strippable substrate.The with voltage of pet resin substrate after peeling off is+0.3kV.
Embodiment 3
In embodiment 3, except substrate is changed to thickness 0.1mm enforcement the stainless steel of mirror process (SUS304) substrate, make similarly to Example 1 duplexer C, carry out the test identical with disbonded test 3.Its result can not damaged duplexer C supporting mass and stainless steel substrate are peeled off.The with voltage of stainless steel substrate after peeling off is+0.02kV.
Embodiment 4
In embodiment 4, except supporting substrates is changed to thickness 1mm pet resin substrate, substrate is changed to the pet resin substrate of thickness 0.1mm, make similarly to Example 1 duplexer D, implemented to carry out the simulation test of the test identical with disbonded test 3.Its result can not damaged duplexer D by supporting mass and pet resin strippable substrate.The with voltage of pet resin substrate after peeling off is+0.5kV.
Embodiment 5
In embodiment 5, except supporting substrates is changed to 6 inches of thickness 1mm, diameter silicon wafer substrate, substrate is changed to the silicon wafer substrate of 6 inches of thickness 0.1mm, diameter, make similarly to Example 1 duplexer E, implemented to carry out the simulation test of the test identical with disbonded test 3.Its result can not damaged duplexer E supporting mass and silicon wafer substrate are peeled off.The with voltage of silicon wafer substrate after peeling off is+0.05kV.
Embodiment 6
In embodiment 6, except supporting substrates is changed to thickness 1mm pet resin substrate, substrate is changed to the glass sheet substrate of thickness 0.1mm, make similarly to Example 1 duplexer F, implemented to carry out the simulation test of the test identical with disbonded test 3.Its result can not damaged duplexer F supporting mass and glass sheet substrate are peeled off.The with voltage of sheet glass resin substrate after peeling off is+0.2kV.
Embodiment 7
In embodiment 7, except substrate being changed to the polyimide resin substrate (eastern レデユポ Application company system, カ プ ト Application 200HV) of thickness 0.05mm, make similarly to Example 1 duplexer G, carry out the test identical with disbonded test 3.Its result can not damaged duplexer G supporting mass and polyimide resin substrate are peeled off.The with voltage of polyimide resin substrate after peeling off is+0.2kV.
Embodiment 8
First, will indulge 350mm, horizontal 300mm, thickness of slab 0.08mm, linear expansion coefficient 38 * 10
-7/ ℃ glass substrate (Asahi Glass Co., Ltd's system, AN100, alkali-free glass substrate) use the cleaning device of sheet glass special use to utilize alkali cleaning agent to clean, make Surface cleaning, and then 0.1% methanol solution of effects on surface spraying γ mercaptopropyitrimethoxy silane, then at 80 ℃, be dried 3 minutes, the material obtaining is thus prepared with glass film as stacked.On the other hand, prepare the surface of the polyimide substrate of vertical 350mm, horizontal 300mm, thickness of slab 0.05mm (eastern レデユポ Application company system, カ プ ト Application 200HV) to carry out the material of Cement Composite Treated by Plasma.And, overlap with glass substrate before, use that to be heated to be the pressurizing unit of 320 ℃ stacked by both, make glass/laminated resin substrate.
In embodiment 8, glass sheet substrate is changed to above-mentioned glass/laminated resin substrate, the face of the opposition side of the lamination surface of the glass substrate with this resin substrate is made as to the lamination surface with supporting mass, in addition, make similarly to Example 1 duplexer H, carry out the test identical with disbonded test 3.Its result, can not damage duplexer H supporting mass and glass/laminated resin film substrate are peeled off.The with voltage of glass/laminated resin film substrate after peeling off is+0.2kV.
With reference to specific embodiment, the present invention is illustrated in detail, but known to those skilled in the art, can not depart from the spirit and scope of the present invention and carry out various changes or correction.
The Japanese patent application 2009-026196 of the application based on application on February 6th, 2009 and the Japanese patent application 2009-198992 of application on August 28th, 2009, its content is introduced in this as reference.
Industrial applicability
According to the present invention, a kind of manufacture method of electron device can be provided, can suppress to sneak into the generation of the base board defect that the foreign matters such as bubble between substrate and dust cause, can not produce edge pit and process with existing manufacturing line, can not damage the substrate connecting airtight and they easily and in short time be peeled off also separated with resin bed.In addition, can provide a kind of stripping off device that can implement the manufacture method of this electron device.
Claims (18)
1. the manufacture method of an electron device, comprise from peel off the operation of supporting mass with the electron device of supporting mass, the described electron device with supporting mass connects airtight resin bed and forms having the first interarea and the second interarea and have on the second interarea on first interarea of substrate of used for electronic device parts, described resin bed is fixed on the first interarea of the supporting substrates with the first interarea and the second interarea and has easy fissility, described supporting mass consists of described supporting substrates and described resin bed, described electron device consists of described used for electronic device parts and described substrate, wherein, possess:
Fixing operation, in two interareas that the described electron device with supporting mass has one the plane stationary plane not possessing to worktable with the interarea of the supporting mass being stripped from the stripping process as rear operation is connected airtight, the described electron device with supporting mass is fixed on the stationary plane of described worktable; And
Stripping process, inserts blade to described resin bed and the interface between described substrate of being fixed on the described supporting mass being stripped from the end face of the described electron device with supporting mass on the stationary plane of described worktable, described supporting mass and described electron device peeled off,
Described blade is by the support part supports with two tabular arms that link with this blade,
The flexural rigidity of the load with respect to thickness direction of this blade is 5,000Nmm
2below, the flexural rigidity with respect to the load of Width is 200,000Nmm
2above,
Described in when described blade is applied to power, two arms can be out of shape in mode close to each other,
In described stripping process, described blade by being inserted into the interface between described resin bed and described substrate is because being out of shape to normal direction from the effect of described resin bed and/or described substrate, and by means of take the distortion to sense of rotation that part that described blade and described support link is fulcrum, when described blade is further moved to the direction of inserting, described blade moves along the surface of described resin bed, and described supporting mass and described electron device are peeled off.
2. the manufacture method of electron device as claimed in claim 1, wherein,
In described stripping process, to the interface between described resin bed and described substrate, inserted after described blade, described blade rotates centered by its leading section, rearward end moves along the direction of the normal parallel of the described stationary plane with described worktable, and then described blade integral body also moves at least one party in the direction of identical parallel direction and insertion, thereby described blade moves along the surface of described resin bed, described supporting mass and described electron device are peeled off.
3. the manufacture method of electron device as claimed in claim 1 or 2, wherein,
Also possess absorption process, described absorption process is after described fixedly operation and before described stripping process, makes a plurality of absorption layers be adsorbed in the second interarea of the described supporting substrates of the described supporting mass being stripped from,
In described stripping process: insert after described blade to the interface between described resin bed and described substrate, making described absorption layer is that direction of delaminate moves to the direction of peeling off described resin bed and described substrate, and described supporting mass and described electron device are peeled off.
4. the manufacture method of electron device as claimed in claim 3, wherein,
In described stripping process: make to be adsorbed in and be positioned at the absorption layer that has inserted portion's bit position of described blade on the end face that approaches the described electron device with supporting mass most in a plurality of absorption layers of the second interarea of described supporting substrates and first move to described direction of delaminate, then make the absorption layer adjacent with this absorption layer move to described direction of delaminate, make similarly afterwards the absorption layer adjacent with the absorption layer having moved to described direction of delaminate then to described direction of delaminate, move, sequentially carry out aforesaid operations, by described supporting mass along peeling off towards central direction from having inserted the end of described blade, and then peel off on its extended line.
5. the manufacture method of electron device as claimed in claim 1 or 2, wherein,
In described stripping process: comprise by image and process the operation of inserting the position of described blade on the interface of determining between described resin bed and described substrate.
6. the manufacture method of electron device as claimed in claim 1 or 2, wherein,
In described stripping process: any part bonding conductor formation ground connection at described supporting substrates and/or described substrate suppresses charged, and described supporting mass and described electron device are peeled off.
7. the manufacture method of electron device as claimed in claim 1 or 2, wherein,
In described stripping process: between described supporting mass and described electron device, winding-up is with electric control except electric with material, and described supporting mass and described electron device are peeled off.
8. the manufacture method of electron device as claimed in claim 1 or 2, wherein,
In described stripping process: the load of detection effect on described blade, and insert described blade to the interface between described resin bed and described substrate.
9. the manufacture method of electron device as claimed in claim 1 or 2, wherein,
Described electron device is display device panel.
10. a stripping off device, from the electron device with supporting mass, peel off supporting mass, the described electron device with supporting mass connects airtight resin bed and forms with the first interarea of the substrate of parts having the first interarea and the second interarea and have display device on the second interarea, described resin bed is fixed on the first interarea of the supporting substrates with the first interarea and the second interarea and has easy fissility, described supporting mass consists of described supporting substrates and described resin bed, wherein, possess:
Worktable, connects airtight with the interarea of the described electron device with supporting mass, possesses the plane stationary plane that can fix the described electron device with supporting mass;
Blade, for peeling off described supporting mass from the described electron device with supporting mass;
Normal direction mobile unit, making described blade is that normal direction moves along the direction of the normal parallel of the described stationary plane with described worktable, so that described blade inserts the described resin bed of the described supporting mass being stripped from the end face of the described electron device with supporting mass that is fixed on described worktable and the interface between described substrate;
Stationary plane direction mobile unit moves described blade between described resin bed and described substrate, and then,
Described blade is by the support part supports with two tabular arms that link with this blade,
The flexural rigidity of the load with respect to thickness direction of this blade is 5,000Nmm
2below, the flexural rigidity with respect to the load of Width is 200,000Nmm
2above, described blade possesses character as described below: when being inserted between described resin bed and described substrate, because the effect from described resin bed and/or described substrate deforms to normal direction, thereby move along the surface of described resin bed,
Described two arms have the character that can be out of shape in mode close to each other when described blade is applied to power.
11. stripping off devices as claimed in claim 10, wherein,
Also possess:
Insert angle regulating unit, there is the insertion angle initialization mechanism of the bound of the rotating mechanism that the rearward end that described blade is rotated centered by leading section and makes described blade moves along normal direction and the insertion angle of setting described blade; And
Normal direction travel mechanism, makes described blade integral body move along described normal direction.
12. stripping off devices as described in claim 10 or 11, wherein,
Also possessing being fixed on a plurality of absorption layers that second interarea of described supporting substrates of the described supporting mass being stripped from of the described electron device with supporting mass on the stationary plane of described worktable adsorbs and making described absorption layer is the pad mobile unit that direction of delaminate moves to the direction of peeling off described resin bed and described substrate.
13. stripping off devices as claimed in claim 12, wherein,
Described pad mobile unit possesses time control function, making to be positioned in described a plurality of absorption layer the absorption layer that has inserted portion's bit position of described blade on the end face that approaches the described electron device with supporting mass most first moves to described direction of delaminate, then make the absorption layer adjacent with this absorption layer move to described direction of delaminate, similarly make afterwards the absorption layer adjacent with the absorption layer having moved to described direction of delaminate then to described direction of delaminate, move, sequentially carry out aforesaid operations, by described supporting mass along peeling off towards central direction from having inserted the end of described blade, and then peel off on its extended line.
14. stripping off devices as described in claim 10 or 11, wherein,
Also possesses image processing apparatus, for determining the position of inserting described blade on the interface between described resin bed and described substrate.
15. stripping off devices as described in claim 10 or 11, wherein,
Also possess at any part bonding conductor of described supporting substrates and/or described substrate and suppress charged grounding construction.
16. stripping off devices as described in claim 10 or 11, wherein,
Also possess between described supporting mass and described electron device winding-up except electricity with material with the band controller for electric consumption of electric control.
17. stripping off devices as described in claim 10 or 11, wherein,
The load detecting device that also possesses the load of detection effect on described blade.
18. stripping off devices as described in claim 10 or 11, wherein,
Described electron device is display device panel.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009026196 | 2009-02-06 | ||
| JP2009-026196 | 2009-02-06 | ||
| JP2009-198992 | 2009-08-28 | ||
| JP2009198992 | 2009-08-28 | ||
| PCT/JP2010/051281 WO2010090147A1 (en) | 2009-02-06 | 2010-01-29 | Method for manufacturing electronic device and separation apparatus used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102171745A CN102171745A (en) | 2011-08-31 |
| CN102171745B true CN102171745B (en) | 2014-10-08 |
Family
ID=42542043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080002805.XA Expired - Fee Related CN102171745B (en) | 2009-02-06 | 2010-01-29 | Method for manufacturing electronic device and separation apparatus used therefor |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5360073B2 (en) |
| KR (1) | KR101311652B1 (en) |
| CN (1) | CN102171745B (en) |
| TW (1) | TWI417939B (en) |
| WO (1) | WO2010090147A1 (en) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120044445A1 (en) * | 2010-08-17 | 2012-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Liquid Crystal Device and Manufacturing Method Thereof |
| CN102097591A (en) * | 2010-11-16 | 2011-06-15 | 福建钧石能源有限公司 | Flexible thin film solar cell |
| JP2014506008A (en) * | 2010-12-29 | 2014-03-06 | ジーティーエイティー・コーポレーション | Method and apparatus for forming thin films |
| JP2012146448A (en) * | 2011-01-11 | 2012-08-02 | Nitto Denko Corp | Method of manufacturing organic el device and substrate for manufacturing organic el device |
| JP2014157167A (en) * | 2011-05-18 | 2014-08-28 | Asahi Glass Co Ltd | Peeling method of laminated substrate |
| JP2013055307A (en) * | 2011-09-06 | 2013-03-21 | Asahi Glass Co Ltd | Peeling device, and manufacturing method of electronic device |
| JP5807554B2 (en) | 2012-01-19 | 2015-11-10 | 旭硝子株式会社 | Peeling apparatus and electronic device manufacturing method |
| KR101941448B1 (en) * | 2012-02-29 | 2019-01-23 | 엘지디스플레이 주식회사 | Method of fabricating lightweight and thin liquid crystal display device |
| KR101935780B1 (en) * | 2012-06-01 | 2019-01-07 | 엘지디스플레이 주식회사 | Processing line for fabricating liquid crystal display device |
| KR101970553B1 (en) * | 2012-05-23 | 2019-08-13 | 엘지디스플레이 주식회사 | Method of fabricating lightweight and thin liquid crystal display device |
| KR101992907B1 (en) * | 2012-12-26 | 2019-09-30 | 엘지전자 주식회사 | Desorption apparatus having gap forming unit and method of fabricating lightweight and thin liquid crystal display device using thereof |
| WO2014133007A1 (en) * | 2013-02-26 | 2014-09-04 | 日本電気硝子株式会社 | Method for manufacturing electronic device |
| KR102082271B1 (en) * | 2013-05-24 | 2020-04-16 | 엘지디스플레이 주식회사 | System for Separating Carrier Substrate and Method of Separating the Same |
| CN103280423A (en) * | 2013-05-29 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | Technology and system for mechanical bonding disassembling |
| KR102028913B1 (en) * | 2013-05-31 | 2019-11-08 | 엘지디스플레이 주식회사 | Desorption apparatus and method for manufacturing flat panal display device using threrof |
| CN105359253B (en) * | 2013-07-01 | 2017-08-25 | 旭硝子株式会社 | Stripping starting point producing device and stripping starting point preparation method |
| KR102285804B1 (en) * | 2013-08-30 | 2021-08-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Processing apparatus and processing method of stack |
| JP6410209B2 (en) * | 2013-09-17 | 2018-10-24 | 日本電気硝子株式会社 | Glass film peeling device |
| KR102135913B1 (en) * | 2013-10-28 | 2020-07-20 | 엘지디스플레이 주식회사 | Clamp and Manufacturing Appratus of Organic Light Emitting Display Device Include the Clamp |
| KR20150056316A (en) | 2013-11-15 | 2015-05-26 | 삼성디스플레이 주식회사 | Manufacturing method of device substrate and display device manufatured by using the method |
| KR20150058610A (en) | 2013-11-18 | 2015-05-29 | 삼성디스플레이 주식회사 | Method for manuacturing liquid crystal display pannel and manufacturing device thereor |
| JP6223795B2 (en) * | 2013-11-28 | 2017-11-01 | 日東電工株式会社 | Board peeling method |
| JP6176591B2 (en) | 2013-12-25 | 2017-08-09 | 旭硝子株式会社 | Packing method and packing body for substrate with adsorption layer and packing apparatus for substrate with adsorption layer |
| JP6122790B2 (en) * | 2014-01-24 | 2017-04-26 | 東京エレクトロン株式会社 | Peeling device and peeling system |
| KR102064405B1 (en) | 2014-02-04 | 2020-01-10 | 삼성디스플레이 주식회사 | Substrate peeling apparatus and substrate peeling method using the same |
| JP6234391B2 (en) * | 2014-02-28 | 2017-11-22 | 新日鉄住金化学株式会社 | Manufacturing method of display device and resin solution for display device |
| KR102165162B1 (en) * | 2014-03-12 | 2020-10-14 | 삼성디스플레이 주식회사 | Substrate peeling apparatus and method of manufacturing device using the same |
| JP6548871B2 (en) * | 2014-05-03 | 2019-07-24 | 株式会社半導体エネルギー研究所 | Laminated substrate peeling apparatus |
| WO2015170210A1 (en) * | 2014-05-03 | 2015-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Separation apparatus for thin film stacked body |
| JP6268483B2 (en) * | 2014-06-03 | 2018-01-31 | 旭硝子株式会社 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
| JP6269954B2 (en) * | 2014-07-11 | 2018-01-31 | 旭硝子株式会社 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
| JP6354945B2 (en) * | 2014-07-11 | 2018-07-11 | 旭硝子株式会社 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
| JP6398622B2 (en) * | 2014-11-06 | 2018-10-03 | オムロン株式会社 | Peeling apparatus and peeling method |
| WO2016104122A1 (en) * | 2014-12-26 | 2016-06-30 | 旭硝子株式会社 | Method for creating separation start portion for layered bodies, device for creating separation start portion, and electronic device manufacturing method |
| KR102336572B1 (en) * | 2015-01-23 | 2021-12-08 | 삼성디스플레이 주식회사 | Substrate desorption apparatus and method for manufacturing display device using threrof |
| JP6436389B2 (en) | 2015-02-18 | 2018-12-12 | Ａｇｃ株式会社 | Peel start part creating apparatus, peel start part creating method, and electronic device manufacturing method |
| CN105904830B (en) * | 2015-02-23 | 2019-07-16 | Ａｇｃ株式会社 | The stripping off device and stripping means of laminated body and the manufacturing method of electronic device |
| JP6450620B2 (en) * | 2015-03-26 | 2019-01-09 | 東京応化工業株式会社 | Substrate peeling apparatus and substrate peeling method |
| CN104808362B (en) * | 2015-05-14 | 2018-05-11 | 苏州市邦成电子科技有限公司 | A kind of polarizer stripping device for removing electrostatic |
| JP6488912B2 (en) | 2015-06-25 | 2019-03-27 | Ａｇｃ株式会社 | Packing method for substrate with adsorption layer and packing apparatus for substrate with adsorption layer |
| CN105047589B (en) * | 2015-07-08 | 2018-05-29 | 浙江中纳晶微电子科技有限公司 | Wafer solution bonding apparatus |
| JP6519951B2 (en) * | 2015-07-24 | 2019-05-29 | 日本電気硝子株式会社 | METHOD FOR MANUFACTURING GLASS FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE INCLUDING GLASS FILM |
| JP6064015B2 (en) * | 2015-10-14 | 2017-01-18 | 東京エレクトロン株式会社 | Peeling device, peeling system and peeling method |
| US10279576B2 (en) * | 2016-04-26 | 2019-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Peeling method and manufacturing method of flexible device |
| TWI629770B (en) * | 2016-08-09 | 2018-07-11 | 陽程科技股份有限公司 | Method for separating flexible display from carrier substrate |
| US10374161B2 (en) | 2017-08-16 | 2019-08-06 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Glass substrate separation method and glass substrate separation device |
| CN107686007B (en) * | 2017-08-16 | 2019-08-20 | 武汉华星光电半导体显示技术有限公司 | Glass substrate separation method and glass substrate separator |
| US20190312201A1 (en) * | 2017-09-13 | 2019-10-10 | Sharp Kabushiki Kaisha | Display device manufacturing method |
| CN110890306A (en) * | 2018-09-10 | 2020-03-17 | 山东浪潮华光光电子股份有限公司 | Simple and convenient substrate thinning and unloading method for semiconductor device |
| CN109926914A (en) * | 2019-04-24 | 2019-06-25 | 蚌埠中光电科技有限公司 | A kind of float glass process TFT-LCD glass surface grinding stripping device |
| CN112520418B (en) * | 2020-12-15 | 2022-06-24 | 深圳南玻应用技术有限公司 | Glass sheet taking device and method |
| KR20230012922A (en) * | 2021-07-16 | 2023-01-26 | 주식회사 엘지에너지솔루션 | Support plate and pick and place apparatus having the same |
| CN117246621B (en) * | 2023-11-10 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Device and method for efficiently stripping gold-plated layer surface protection adhesive tape of circuit board |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3199964B2 (en) * | 1994-10-07 | 2001-08-20 | シャープ株式会社 | Substrate peeling device |
| JP3333681B2 (en) * | 1996-03-25 | 2002-10-15 | オークマ株式会社 | Cutting edge position measuring device |
| JP3958815B2 (en) * | 1996-11-11 | 2007-08-15 | 株式会社森精機製作所 | Tool position measuring method in NC machine tools |
| JPH10244545A (en) * | 1997-03-04 | 1998-09-14 | Canon Inc | Mold release method and apparatus |
| JP4096695B2 (en) * | 2002-10-24 | 2008-06-04 | 東レ株式会社 | Flexible film peeling method, peeling device, and circuit board |
| JP2004191576A (en) * | 2002-12-10 | 2004-07-08 | Seiko Epson Corp | Device and method for peeling film, and method for manufacturing optoelectronic device |
| CN100579333C (en) * | 2003-01-23 | 2010-01-06 | 东丽株式会社 | The manufacture method of member for circuit board, circuit substrate and the manufacturing installation of circuit substrate |
| JP2004247721A (en) * | 2003-01-23 | 2004-09-02 | Toray Ind Inc | Method and apparatus for manufacturing electronic circuit board |
| TWI356658B (en) * | 2003-01-23 | 2012-01-11 | Toray Industries | Members for circuit board, method and device for m |
| JP4543688B2 (en) * | 2003-02-04 | 2010-09-15 | 東レ株式会社 | Circuit board manufacturing method and manufacturing apparatus |
| JP2006113124A (en) * | 2004-10-12 | 2006-04-27 | Sharp Corp | Device for releasing polarizer and its management method |
| JP4241697B2 (en) * | 2005-09-06 | 2009-03-18 | ユーテック株式会社 | Film peeling device |
| JP5307970B2 (en) * | 2006-01-11 | 2013-10-02 | 旭硝子株式会社 | Method and apparatus for peeling large glass substrate |
| JP4666514B2 (en) * | 2006-07-20 | 2011-04-06 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
-
2010
- 2010-01-29 KR KR1020117007425A patent/KR101311652B1/en active IP Right Grant
- 2010-01-29 CN CN201080002805.XA patent/CN102171745B/en not_active Expired - Fee Related
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Non-Patent Citations (2)
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| JP特开2004-142878A 2004.05.20 |
| JP特开2004-247721A 2004.09.02 |
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| TW201039375A (en) | 2010-11-01 |
| TWI417939B (en) | 2013-12-01 |
| KR20110063800A (en) | 2011-06-14 |
| WO2010090147A1 (en) | 2010-08-12 |
| JPWO2010090147A1 (en) | 2012-08-09 |
| CN102171745A (en) | 2011-08-31 |
| KR101311652B1 (en) | 2013-09-25 |
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