TW201039375A - Method for manufacturing electronic device and separation apparatus used therefor - Google Patents

Method for manufacturing electronic device and separation apparatus used therefor Download PDF

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Publication number
TW201039375A
TW201039375A TW099103237A TW99103237A TW201039375A TW 201039375 A TW201039375 A TW 201039375A TW 099103237 A TW099103237 A TW 099103237A TW 99103237 A TW99103237 A TW 99103237A TW 201039375 A TW201039375 A TW 201039375A
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Taiwan
Prior art keywords
support
substrate
peeling
resin layer
electronic device
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TW099103237A
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Chinese (zh)
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TWI417939B (en
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Kenichi Ebata
Satoshi Kondo
Yasunori Ito
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Asahi Glass Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Provided are a method for manufacturing an electronic device and a separation apparatus used therefore, wherein a substrate and a resin layer closely connected thereto can be easily separated and removed within a short space of time without damage. When a support (17b) comprised of a support substrate (19b) and a resin layer (18b) is separated from a support-provided electronic device (10) which has a substrate (12b) having an electronic device member (14) and a resin layer (18b) which is secured to a support substrate (19b) and which is closely connected to the substrate (12b), a main surface on which a substrate (17b) to be separated later is not mounted is closely connected to a securing surface (20a) of a stage (20) to secure the support-provided electronic device (10), and a knife (30) is inserted between interfaces of the resin layer (18b) and the substrate (12b); of the support (17b) to be separated, at an end surface of the support-provided electronic device (10) secured to the stage (20) to thereby separate the support (17b) and an electronic device (16).

Description

201039375 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子裝置之製造方法及用於其之剝離 裝置。 【先前技術】 近年來’液晶顯示裝置（LCD，Liquid Crystal Display)、 有機 EL顯示裝置（〇LED，〇rganic Light Emitting Diode， 有機發光二極體）作為顯示裴置而被廣泛地利用。尤其於 行動電話或移動電話等之移動型顯示裝置之領域中，要求 顯示裝置之輕量化、薄型化。 同樣地，太陽電池、薄膜二次電池、表面形成有電路之 半導體晶圓等之電子裝置亦需要輕量化、薄型化。 為了解決上述問題，用於顯示裝置等電子裝置之玻璃、 樹脂、金屬等之基板之薄板化正在發展。 於玻璃基板之情形時，作為使板厚變薄之方法，一般實 Q 施如下方法’即，於將顯示裝置用構件形成於玻璃基板之 表面之前或形.成之後，利用化學蝕刻對玻璃基板之外表面 進行#刻處理’並視需要，更進而進行物理研磨而使其變 % 薄。 ' 然而’若於將顯示裝置等電子裝置用構件形成於玻璃基 板之表面之前進行餘刻處理等而使玻璃基板變薄，則玻璃 基板之強度會降低’撓曲量亦會變大。因此會產生無法藉 由既存之生產線進行處理之問題。 又’若於將顯示裝置用構件形成於玻璃基板之表面之後 146274.doc 201039375 則於將顯示裝置用構 會產生形成於破璃基 ’即稱為韻刻斑之問 進行蝕刻處理等而使玻璃基板變薄， 件形成於玻璃基板之表面之過程中， 板之表面之細微之傷痕明顯化之問題 題。 對此，為了解決上述問題，接 釭出有如下方法等，即，將 板厚較薄之玻璃基板（以下亦稱為「篇^ ^ 稱马溥板玻璃基板」）與苴 他之支持玻璃基板貼合而形成籍 八 „ 办成積層體，於該狀態下實施用 於製造顯不裝置之特定之處理，並 八後’將溥板玻璃基板盘 支持玻璃基板分離。 … 例如，專利文獻丨中揭示有如τ方法，其制玻璃基板 彼此之靜電吸附力或真Μ附力使製品用之玻璃基板與加 強用玻璃基板點合而一體化，而制、a 髖化，而製造使用有製品用之玻璃 基板之顯示裴置。 專利文獻2中揭示有如下该s as - 句如下液晶顯不裝置之製造方法，其 利用玻璃漿料系之接著劑將液a 有劑將/夜日日顯不裝置之基板與支持體 之端部接著，並於其後形成電極圖案等。 專利文獻3中揭示有如下顯示裂置用基板之製造方法， 其包括對兩片玻璃基板之至少 ， 土双 &lt; 主V周緣部之端面附近照射雷射 光而使上述兩片玻璃基板熔合之步驟。 專利文獻4中揭示有如下液晶顯示裝置之製造方法，其 將基板貼附於支持體上設有黏著材料層之基板搬送用爽 | 顯示元件之製造步驟而搬送基板搬送用爽 具：藉此，對貼附於基板搬送用失具之基板依序進行液晶 ·’、貝T元件七成處理’於結束特定之步驟之後，將基板自基 146274.doc 201039375 板搬送用夾具剝離。 專利文獻5中揭示有如一 特徵在於：使用支持體顯示元件之製造方法，其 具，對洛曰顏- 有紫外線硬化型黏著劑之夾 • Li 件用電極基板實施特定之加工之後，對 .硬化型黏著劑之黏著力^ 述紫外線 基板自上述夾具剝離。 &lt; 而將上述液晶顯示元件用電極 〇 :=獻6中揭示有如下搬送方法，其藉由黏著材料將 板暫時^於支持板’並藉由密封材密封上述料材料 之周緣部’從而搬送暫時固定有薄板之支持板。 專利文獻7中揭示有薄板玻璃積層體，其係將薄板玻璃 土板、支持玻璃基板積層而成者，其特徵在於經由具有易 剝離性及非黏著性之石夕氧樹脂層而將上述薄板玻璃與上述 支持玻璃積層。並且記載有：為了將薄板玻璃基板與支持 玻璃基板分離，只要施加將薄板玻璃基板自支持玻璃基板 〇於垂直方向上分離之力即可’利用刺刀之刀刀等給予端部 剝離之機會，或者朝積層界面注入空氣，從而可更容易地 進行剝離。 專利文獻8中揭示有用於使吸附保持於吸附片之玻璃基 板等板狀體自吸附片剝離之剝離裝置。 先行技術文獻 專利文獻 專利文獻1:日本專利特開2000-241804號公報 專利文獻2.日本專利特開昭58_54316號公報 146274.doc 201039375 專利文獻3 :日本專利特開2003-216068號公報 專利文獻4:日本專利特開平8-86993號公報 專利文獻5:日本專利特開平9-105896號公報 專利文獻6:曰本專利特開2000-252342號公報 專利文獻7 :國際公開第2007/018028號小冊子 專利文獻8 :曰本專利特開2007-1 85725號公報 【發明内容】 發明所欲解決之問題 然而，專利文獻1中揭示之利用靜電吸附力或真空吸附 力將玻璃基板彼此固定之方法、專利文獻2中揭示之藉由 玻璃漿料將玻璃基板之兩端固定之方法、或者專利文獻3 中揭示之對周緣部之端面附近照射雷射光而使兩片玻璃基 板熔合之方法中，未經由任何中間層而使玻璃基板彼此積 層密接，因此會由於混入至玻璃基板間之氣泡或灰塵等異 物而於玻璃基板產生應變缺陷。因此，難以獲得表面平滑 之玻璃基板積層體。 又，專利文獻4〜6中揭示之於玻璃基板間配置黏著層等 之方法中’雖然可避免由於氣泡等混入至上述玻璃基板間 而產生應變缺陷，但有難以分離兩玻璃基板、分離時薄板 玻璃基板損壞之虞。又，分離後之薄板玻璃基板上之黏著 劑之殘存亦成為問題。 針對於此’根據專利文獻7中揭示之薄板玻璃積層體， 則難以產生上述由力氣泡等混入至玻璃基板Μ而引起之應 變缺陷。又’亦可剥離薄板玻璃基板與支持玻璃基板。進 146274.doc 201039375 而，分離後之薄板玻璃基板上之黏著劑之殘存之問題得以 解決。然而，業界期望更容易且以更短之時間進行兩玻璃 基板之分離。尤其是於玻璃基板為大型之情形時，於工業 利用上成為重要之方面。 又，專利文獻8中揭示之剝離裝置係使吸附保持於吸附 片之玻璃基板等自吸附片剝離之裝置，其難以將經樹脂層 密接之支持玻璃基板與薄板玻璃基板以不損傷上述薄板玻 璃基板、且不使上述樹脂層殘存於上述薄板玻璃基板之方 式剝離。 本發明係鑒於上述問題點而完成者。即，其目的在於提 供一種電子裝置之製造方法，其可抑制由於混入至基板間 之氣泡或灰塵等異物而產生基板缺陷，可於既存之生產線 上進行處理而不會產生蝕刻斑，且可不損傷密接之基板與 樹脂層而容易地且短時間地將該等剝離並分離。又，本發 明之目的在於提供一種可實施上述電子裝置之製造方法之 剝離裝置。 解決問題之技術手段 本發明者為了解決上述問題進行積極研究而完成本發 明。 本發明與以下之（1)〜（18)相關。 ⑴種電子裝置之製造方法，該電子裝置係包含電子裝置 用構件及基板；其製造方法係包括將包含支持基板及樹脂 層之支持體自附支持體之電子裝置剝離之操作，該附支持 體之電子裝置係於包含第1±面及第2主面並於第2主面上 146274.doc 201039375 具有上述電子裝置用構件之上述基板的第丨主面上，密接 有固定於包含第1主面及第2主面之支持基板之第i主面且 具有易剝離性之樹脂層，其製造方法係包括：固定步驟， 使上述附支持體之電子裝置所包含之兩個主面中之一主 面即未附有於作為後步驟之剝離步驟中被剥離之支持體 之一主面，朝平台所包含之平面狀之固定面密接，而將上. 述附支持體之電子裝置固定於上述平台之固定面上；以及 剝離步.驟，將刀插入至固定於上述平台之固定面上之上述 附支持體之電子裝置之端面、即被剝離之上述支持體之上 〇 述樹脂層與上述基板之界面，從而將上述支持體與上述電 子裝置剝離。 (2)如上述（1)所揭示之電子裝置之製造方法，其中於上述 剝離步驟中’插入至上述樹脂層與上述基板之界面之上述 刀會藉由來自i述樹脂層及/或上述基板之作用而變形， 藉此，於使上述刀更進而朝插入方向移動之情形時，上述 刀以沿上述樹脂層之表面之方式移動，從而將上述支持體 與上述電子裝置剝離。 ◎201039375 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing an electronic device and a peeling device therefor. [Prior Art] In recent years, liquid crystal display devices (LCDs) and organic EL display devices (〇, 〇rganic Light Emitting Diodes, organic light-emitting diodes) have been widely used as display devices. In particular, in the field of mobile display devices such as mobile phones and mobile phones, it is required to reduce the weight and thickness of the display device. Similarly, an electronic device such as a solar cell, a thin film secondary battery, or a semiconductor wafer on which a circuit is formed needs to be lighter and thinner. In order to solve the above problems, thinning of substrates such as glass, resin, metal, and the like for electronic devices such as display devices is progressing. In the case of a glass substrate, as a method of thinning the thickness of the sheet, the following method is generally employed. That is, the glass substrate is chemically etched before or after forming the member for the display device on the surface of the glass substrate. The outer surface is subjected to 'etching treatment' and, if necessary, physically polished to make it thinner. In the case where the glass substrate is thinned by forming a member for an electronic device such as a display device on the surface of the glass substrate, the strength of the glass substrate is lowered, and the amount of deflection is also increased. This creates problems that cannot be handled by existing production lines. Further, if the member for the display device is formed on the surface of the glass substrate, 146274.doc 201039375, the glass is formed on the glass substrate by the structure of the display device, that is, the etching is performed, and the glass is etched. The problem that the substrate is thinned and the pieces are formed on the surface of the glass substrate, and the slight flaws on the surface of the plate are conspicuous. In order to solve the above problems, there is a method of thinning a glass substrate having a small thickness (hereinafter also referred to as "a sheet of glass plate") and a supporting glass substrate of the other. In the state where the specific processing for manufacturing the display device is carried out, the glass substrate of the seesaw glass substrate is supported to separate the glass substrate. For example, in the patent document, It is disclosed that, as in the τ method, the electrostatic adsorption force or the true adhesion force of the glass substrates is integrated so that the glass substrate for the product is integrated with the glass substrate for reinforcement, and the a glass is formed, and the product is used for manufacturing. A display device for a glass substrate is disclosed in Patent Document 2, which discloses a method for producing a liquid crystal display device as follows, which uses a glass paste-based adhesive to cause a liquid to have a device The substrate and the end of the support are next, and an electrode pattern or the like is formed thereafter. Patent Document 3 discloses a method of manufacturing a substrate for dicing, which includes at least two glass substrates, a step of illuminating the two glass substrates in the vicinity of the end surface of the peripheral portion of the main V. Patent Document 4 discloses a method of manufacturing a liquid crystal display device in which a substrate is attached to a support and an adhesive material is provided. In the substrate transfer process, the substrate transfer processing is performed, and the substrate transfer processing is performed on the substrate attached to the substrate transfer device. After the specific step, the substrate is peeled off from the substrate 146274.doc 201039375 plate transport jig. Patent Document 5 discloses a method for manufacturing a display device using a support, which has a UV-curing type. Adhesive clips • After the specific processing is performed on the electrode substrate for Li, the adhesion of the curable adhesive is removed from the jig. <The electrode for the liquid crystal display element 〇:=6 There is disclosed a transfer method in which a sheet is temporarily attached to a support sheet by an adhesive material and sealed by sealing a peripheral portion of the material material. A support plate having a thin plate is fixed. Patent Document 7 discloses a thin plate glass laminate which is formed by laminating a thin glass plate and a supporting glass substrate, and is characterized by being easily peeled off and non-adhesive. In the oxygen resin layer, the thin plate glass and the supporting glass are laminated. It is described that in order to separate the thin glass substrate from the supporting glass substrate, a force for separating the thin glass substrate from the supporting glass substrate in the vertical direction may be applied. The edge peeling is given by a knife or the like of a bayonet or the like, or air is injected into the laminate interface, whereby peeling can be performed more easily. Patent Document 8 discloses that a plate-like body such as a glass substrate for holding and holding the adsorption sheet is self-adsorbed. The peeling device of the sheet peeling. The prior art document patent document patent document 1: Japanese Patent Laid-Open No. 2000-241804. Patent Document 2. Japanese Patent Laid-Open Publication No. SHO 58-54316 No. 146274.doc 201039375 Patent Document 3: Japanese Patent Laid-Open 2003- Patent Document No. 216068, Japanese Patent Laid-Open No. Hei 8-86993, Patent Document 5: Japanese Patent Japanese Laid-Open Patent Publication No. 2000-252342 (Patent Document No. 2000-252342) Patent Document 7: International Publication No. 2007/018028 Patent Document 8: Japanese Patent Laid-Open Publication No. 2007-1 85725 [Problem to be Solved by the Invention] However, a method of fixing glass substrates to each other by electrostatic adsorption force or vacuum adsorption force disclosed in Patent Document 1, and fixing both ends of a glass substrate by a glass paste disclosed in Patent Document 2 In the method or the method disclosed in Patent Document 3, in which the laser light is irradiated to the vicinity of the end surface of the peripheral portion to fuse the two glass substrates, the glass substrates are not adhered to each other without any intermediate layer, and therefore, they are mixed between the glass substrates. A foreign matter such as bubbles or dust generates strain defects on the glass substrate. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface. Further, in the method of disposing an adhesive layer or the like between glass substrates as disclosed in Patent Documents 4 to 6, 'the occurrence of strain defects due to mixing of bubbles or the like between the glass substrates is avoided, but it is difficult to separate the two glass substrates and the thin plates at the time of separation. Damage to the glass substrate. Further, the residual of the adhesive on the separated thin glass substrate is also a problem. According to the thin-plate glass laminate disclosed in Patent Document 7, it is difficult to cause the above-described strain defects caused by the incorporation of force bubbles or the like into the glass substrate. Further, the thin glass substrate and the supporting glass substrate can also be peeled off. In 146274.doc 201039375, the problem of the residual adhesive on the separated thin glass substrate is solved. However, the industry desires to separate the two glass substrates more easily and in a shorter time. Especially in the case where the glass substrate is large, it is an important aspect in industrial use. Further, the peeling device disclosed in Patent Document 8 is a device for peeling off a self-adsorbing sheet such as a glass substrate which is adsorbed and held on an adsorption sheet, and it is difficult to prevent the glass substrate and the thin glass substrate which are adhered via the resin layer from damaging the thin glass substrate. The resin layer is peeled off without leaving the resin layer on the thin glass substrate. The present invention has been made in view of the above problems. That is, an object of the present invention is to provide a method for manufacturing an electronic device which can prevent substrate defects from being generated by foreign matter such as bubbles or dust mixed between substrates, and can be processed on an existing production line without causing etching spots, and can be prevented from being damaged. The substrate and the resin layer are in close contact with each other, and are easily peeled off and separated in a short time. Further, it is an object of the present invention to provide a peeling apparatus which can carry out the above-described manufacturing method of an electronic device. Means for Solving the Problems The inventors of the present invention have conducted active research to solve the above problems and have completed the present invention. The present invention is related to the following (1) to (18). (1) A method of manufacturing an electronic device comprising: a member for an electronic device and a substrate; and a method of manufacturing the method comprising: peeling off an electronic device including a support substrate and a resin layer from a support, the support The electronic device is attached to the second main surface of the substrate including the first electronic surface and the second main surface 146274.doc 201039375 having the electronic device member, and is fixedly attached to the first main surface. a resin layer having an easy-peelability of the i-th main surface of the support substrate of the second main surface and the second main surface, the manufacturing method comprising: a fixing step of one of the two main faces included in the electronic device with the support The main surface is not attached to one of the main faces of the support which is peeled off in the peeling step of the subsequent step, and is adhered to the planar fixing surface included in the platform, and the electronic device with the support is fixed to the above a fixing surface of the platform; and a peeling step, the knife is inserted into the end surface of the electronic device with the support attached to the fixing surface of the platform, that is, the above-mentioned support body which is peeled off The resin layer and the substrate interface, thereby the supporting member and the electronic release means. (2) The method of manufacturing an electronic device according to the above (1), wherein the knives inserted into the interface between the resin layer and the substrate in the peeling step are performed by the resin layer and/or the substrate When the knife is further moved in the insertion direction, the blade moves along the surface of the resin layer to peel the support from the electronic device. ◎

少一個方向上移動，藉此 之方式移動，從而將上述支持體與上述電子裝置剝離 面之法線平行之方向上移動， 之平行方向及插入方向中的至 上述刀以沿上述樹脂層之表面 146274.doc 201039375 (4) 如上述（1)〜(3)中任一項所揭示之電子裝置之製造方法， 其中於上述固定步驟之後且上述剝離步驟之前，更包括使 複數個吸盤吸附於被剝離之上述支持體之上述支持基板之 第2主面的吸附步驟；於上述剝離步驟中更進而於將上述 刀插入至上述樹脂層與上述基板之界面之後，使上述吸盤 朝將上述樹脂層與上述基板剝離之方向即剝離方向移動， 從而將上述支持體與上述電子裝置剝離。 (5) 如上述（4)所揭示之電子裝置之製造方法，其中於上述 剝離中更進而依序進行操作，以使吸附於上述支持基板之 第2主面之複數個吸盤中之' 位於離上述附支持體之電子 裝置之端面中插入有上述刀之部位最近之處的吸盤首先朝 上述制離方向移動，其次使其相鄰之吸盤朝上述剝離方向 移動，然後亦同樣地使已朝上述剝離方向移動之吸盤之相 鄰之吸盤接著朝上述剝離方向移動，從而將上述支持體於 自插入上述刀之端部朝向中央之方向上剝離，並進而朝其 延長線上剝離。 (6) 如上述（1)〜（5)中任一項所揭示之電子裝置之製造方法， 其中上述剝離步驟更進而包括藉由圖像處理確定上述樹脂 層與上述基板之界面中插入上述刀之部位的操作。 (7) 如上述（1)〜(6)中任一項所揭示之電子裝置之製造方法， 其中於上述剝離步驟中更進而一面將導體連接於上述支持 基板及/或上述基板之任意部位以接地而抑制帶電，—面 將上述支持體與上述電子裝置剝離。 (8) 如上述（1)~(7)中任一項所揭示之電子裝置之製造方法， 146274.doc 201039375 其中於上述剝離步驟令更進而一面向上述支持體與上述電 子裝置之間嘴附除電用物質而進行帶電控制，-面將上述 支持體與上述電子裝置剝離。 ⑼如上述⑴〜⑻中任_項所揭示之電子裝置之製造方法， 其中於上述剝離步财更進而_面檢測對上述刀之負載重 量’-面將上述刀插入至上述樹脂層與上述基板之界面。 (10)如上述（1)〜(9)中任一項所揭示之電子裝置之製造方 法’其中上述電子裝置為顯示裝置用面板。 ⑴）-種剝離裝置，其係將包含支持基板及樹脂層之支持 體自附支持體之電子裝置剝離者，該附支持體之電子裝置 係於包含第!主面及第2主面並於第2主面上具有顯示褒置 用構件之基板的第i主面上，密接有固定於包含第1主面及 第2主面之支持基板之第1主面且具有易剝離性之樹脂層， 上述剝離裝置係包括：平台’其與上述附支持體之電子裝 置之主面雄、接，且包含可固定上述附支持體之電子裝置之 平面狀之固定面；刀，其用於將上述支持體自上述附支持 體之電子裝置剝離；法線方向移動單元，其以將上述刀插 入至固定於上述平台之上述附支持體之電子裝置之端面中 的、被剝離之上述支持體中之上述樹脂層與上述基板之界 面的方式’使上述刀朝與上述平台之上述固定面之法線平 行之方向即法線方向移動；以及固定面方向移動單元，其 使上述刀於上述樹脂層與上述基板之間移動；進而上述刀 有如下性質’即’於插入至上述樹脂層與上述基板之間 之情形時’可藉由來自上述樹脂層及/或上述基板之作用 146274.doc 201039375 而變形，以沿上述樹脂層之表面移動；且及/或包括：插 入角度調整單元，其包含使上述刀以前端部為中心旋轉而 使上述刀之後端部於法線方向上移動之旋轉機構、及設定 上述刀之插入角度之上下限之插入角度設定機構；以及法 線方向移動機構，其使上述刀之整體於上述法線方向上移 動。 (12) 如上述（11)所揭示之剝離裝置，其中更包括：複數個 吸盤，其吸附被固定於上述平台之固定面上之上述附支持 體之電子裝置中的被剝離之上述支持體之上述支持基板之 第2主面，以及吸盤移動單元，其使上述吸盤於將上述樹 脂層與上述基板剝離之方向即剝離方向上移動。 (13) 如上述（12)所揭示之剝離裝置’其中上述吸盤移動單 元具有時間控制功能，即，依序進行操作’以使上述複數 個吸盤中之、位於離上述附支持體之電子裝置之端面中插 入有上述刀之部位最近之處的吸盤首先朝上述剝離方向移 動，其次使其相鄰之吸盤朝上述剝離方向移動，然而亦同 樣地使已朝上述剝離方向移動之吸盤之相鄰之吸盤接著朝 上述剝離方向移動，從而將上述支持體於自插入上述刀之 端部朝向中央之方向上剝離，並進而朝其延長線上剝離。 (14) 如上述（11)〜（13)中任一項所揭示之剝離裝置，其中更 包括圖像處理裝置，其用於確定上述樹脂層與上述基板之 界面中插入上述刀之部位。 (15) 如上述（11)〜（14)中任一項所揭示之剝離裝置，其中更 包括地線，其將導體連接於上述支持基板及/或上述基板 146274.doc 201039375 之任意部位而抑制帶電。 ⑽如上述上述⑴)〜(15)中任_項所揭示之剝離裝置，发 t更包括帶電控制裝置，其向上述支持體與上述電i 之間噴附除電用物質而進行帶電控制。 直 ()如上述(11)〜(16)中任一項所揭示之剝離裝置，其中 包括負載重量檢測裝置’其檢測對上述刀之負載重量。 (18)如上述⑴)〜〇7)中任一項所揭示之剝離裝置，其 述電子裝置為顯示裝置用面板。 、 發明之效果 根據本發明，提供-種電子裝置之製造方法，其可抑制 :於混入至基板間之氣泡或灰塵等異物而產生之基板缺 陷’可於既存之生產線上進行處理而不會產生蝕刻斑，可 不損傷密接之基板與樹脂層而容易地且短時間地將該等剝 離並分離。又’可提供—種可實施上述電子裝置之製造方 法之剥離裝置。 【實施方式】 本發明包括本發明之製造方法及剝離裝置。 本發明之製造方法可使用本發明之剝離裝置而較佳地實 百先’關於本發明之剝離裝置’列舉兩個較佳實施例進 行說明。 再者，以下敍述詳細情況，本發明中所使用之附支持體 之電子裝置係於包含第!主面及第2主面並於第2主面上具 有電子裝置用構件之基板的第！主面上，密接有固定於包 146274.doc -12- 201039375 含第1主面及第2主面之支持基板之第〗主面且具有易剝離 性之樹脂層。 即，附支持體之電子裝置包括電子裝置用構件、基板、 樹脂層及支持基板，該等以該順序積層。又，電子裝置包 &amp;電子裝置用構件及基板’電子裝置用構件形成於基板之 第2主面上。 又，附支持體之電子#置亦可為經由電子裝置用構件而 ❹制兩個將基板、樹脂層及支持基板以該順序積層之積層 體者即，亦可為將支持基板、樹脂層、基板、電子裝置 用構件、基板、樹脂層及支持基板以該順序積層者。 ，此處’所謂電子裝置’係指顯示裝置用面板、太陽電 池、薄膜二次電池、表面形成有電路之半導體晶圓等電子 零件。所谓顯不裝置用面板，包括液晶面板、有機el面 板、電漿顯示面板、場發射面板等。 5兄明本發明之剝離裝置之較佳實施例。 ◎ 圖1係作為本發明之剝離裝置之較佳實施例之剝離裝置1 之概略剖面圖。 圖1(a)〜圖1(d)係用於說明進行剝離時之剝離裝置丨中之 各邛位之動作之連續圖，利用圖i(a)說明剝離裝置1之構 成剝離時之各部位之動作如下所述。 抑圖1(&amp;)中，剝離裝置1包括平台20、刀30、法線方向移動 單兀4〇、以及固定面方向移動單元42’並更包括三成分力 感測器46。 P东】離名置1包括：平台2〇，其與附支持體之顯示裝 146274.doc -13- 201039375 置用面板ίο之主面密接，並包括可固定附支持體之顯示裝 置用面板10之平面狀之固定面；刀30,其用於將支持體自 附支持體之顯示裝置用面板10剝離；法線方向移動單元 40,其以可將刀30插入至固定於平台2〇之附支持體之顯示 裝置用面板10之端面中的、被剝離之支持體中之樹脂層與 薄板玻璃基板之界面的方式，使刀3〇朝與平台2〇之固定面 之法線平行之方向即法線方向（圖丨中為上下方向）移動；以 及固定面方向移動單元42,其使刀3〇於樹脂層與薄板玻璃 基板之間移動；並更包括三成分力感測器46，作為可檢測 對刀30之負載負重的負載重量檢測單元。 又，如下所述，剝離裝置i中之刀3〇具有如下性質， 即，於插入至樹脂層與薄板玻璃基板之間之情形時，可藉 由來自樹脂層及/或薄板玻璃基板之作用而變形，以便沿 樹脂層之表面移動。 又，作為較佳實施例之剝離裝置丨中之基台構件2及平台 20係被固定於設置有剝離裝置i之房間之地板，且不^ 動。又，平台20之固定面2〇a(參照圖3)為水平面（即與房間 之地板平打）。又，將基台構件2與固定面方向移動單元竹 之第1固定側構件42b固定，同樣地，將固定面方向移動單 元42之第1移動侧構件42a與固定面方向之第丨移動構件本 體3、第1移動構件本體3與法線方向移動單元4〇之第2固定 侧構件40b、法線方向移動單㈣之第2移動側構件他食 法線方向之第2移動構件本體5、第2移動構件本體5與三^ 分力感測器46及法線方向之第3移動構件本體4、第3移動 146274.doc •14· 201039375 構件本體4與刀30固定。 ΟMoving in less than one direction, thereby moving, thereby moving the support body in a direction parallel to the normal line of the peeling surface of the electronic device, and the parallel direction and the insertion direction of the blade to the surface of the resin layer The method for manufacturing an electronic device according to any one of the above (1) to (3), wherein after the fixing step and before the stripping step, further comprising adsorbing a plurality of suction cups a step of adsorbing the second main surface of the support substrate on the support; and in the peeling step, after inserting the blade into the interface between the resin layer and the substrate, the suction cup is oriented toward the resin layer The direction in which the substrate is peeled off, that is, the peeling direction is moved, and the support is peeled off from the electronic device. (5) The method of manufacturing an electronic device according to the above (4), wherein the detachment is further performed in order to cause the plurality of suction cups adsorbed on the second main surface of the support substrate to be located The suction cup in which the end portion of the above-mentioned knife is inserted into the end surface of the electronic device with the support is first moved toward the separation direction, and then the adjacent suction cup is moved toward the peeling direction, and then the same is made toward the above-mentioned peeling direction. The suction cup adjacent to the suction cup that has moved in the peeling direction is then moved in the peeling direction, and the support is peeled off in the direction from the end portion of the insert into the center, and further peeled off toward the extension line. (6) The method of manufacturing an electronic device according to any one of (1) to (5) above, wherein the peeling step further comprises determining, by image processing, inserting the knife into an interface between the resin layer and the substrate The operation of the part. (7) The method of manufacturing an electronic device according to any one of (1) to (6), wherein, in the peeling step, a conductor is further connected to the support substrate and/or an arbitrary portion of the substrate. The grounding is suppressed to electrify, and the support is peeled off from the electronic device. (8) The method for manufacturing an electronic device according to any one of the above (1) to (7), wherein the peeling step further causes a mouth to be attached between the support body and the electronic device The charge control is performed in addition to the electric substance, and the support is peeled off from the electronic device. (9) The method for manufacturing an electronic device according to any one of the above-mentioned items, wherein the peeling step further detects a load on the load side of the blade and inserts the blade into the resin layer and the substrate. The interface. (10) The method of manufacturing an electronic device disclosed in any one of the above (1) to (9) wherein the electronic device is a panel for a display device. (1) A peeling device for separating an electronic device including a support substrate and a resin layer from a support, wherein the electronic device with the support includes a first main surface and a second main surface The i-th main surface of the substrate having the member for displaying the second surface on the second main surface is closely adhered to the resin layer which is fixed to the first main surface of the support substrate including the first main surface and the second main surface and which is easily peelable. The peeling device includes: a platform 'which is connected to the main surface of the electronic device with the support, and includes a planar fixing surface of the electronic device capable of fixing the support; the knife is used for the above The support body is peeled off from the electronic device with the support; the normal direction moving unit is inserted into the peeled support body by inserting the knife into an end surface of the electronic device fixed to the support body of the platform The manner of the interface between the resin layer and the substrate is such that the blade moves in a direction parallel to the normal to the fixed surface of the platform, that is, in a normal direction; and the fixed surface direction moving unit causes the blade to The resin layer moves between the resin layer and the substrate; and the knife has the following property 'that is, when inserted between the resin layer and the substrate', by the action of the resin layer and/or the substrate 146274. Doc 201039375 is deformed to move along the surface of the resin layer; and/or includes: an insertion angle adjusting unit that rotates the knife about a front end portion to move the rear end portion of the knife in a normal direction a rotation mechanism and an insertion angle setting mechanism that sets a lower limit of the insertion angle of the knife; and a normal direction movement mechanism that moves the entire blade in the normal direction. (12) The peeling device according to (11) above, further comprising: a plurality of suction cups that adsorb the peeled support body of the electronic device with the support attached to the fixing surface of the platform The second main surface of the support substrate and the chuck moving unit move the chuck in a direction in which the resin layer and the substrate are peeled off, that is, in a peeling direction. (13) The peeling device of the above (12), wherein the suction cup moving unit has a time control function, that is, sequentially operates to cause the plurality of the plurality of suction cups to be located from the electronic device of the attached support The suction cup in which the portion of the end surface in which the blade is inserted is moved first in the peeling direction, and then the adjacent suction cup is moved in the peeling direction. However, the suction of the suction cup which has moved in the peeling direction is similarly applied. The suction cup is then moved in the peeling direction, and the support is peeled off in the direction from the end portion of the insert into the center, and further peeled off toward the extension line. (14) The peeling apparatus disclosed in any one of the above (11) to (13), further comprising an image processing apparatus for determining a portion in which the blade is inserted into an interface between the resin layer and the substrate. (15) The peeling device disclosed in any one of the above (11) to (14), further comprising a ground wire that connects the conductor to the support substrate and/or any portion of the substrate 146274.doc 201039375 to suppress charged. (10) The peeling device disclosed in any one of the above-mentioned items (1) to (15), further comprising a charging control device that performs a charging control by spraying a substance for removing electricity between the support and the electric device i. The peeling device disclosed in any one of the above (11) to (16), which includes a load weight detecting device' which detects a load weight to the above knife. (18) The peeling device disclosed in any one of the above (1) to (7), wherein the electronic device is a panel for a display device. Advantageous Effects of Invention According to the present invention, there is provided a method of manufacturing an electronic device capable of suppressing substrate defects generated by foreign matter such as bubbles or dust mixed between substrates, which can be processed on an existing production line without generating The etched spots can be peeled off and separated easily and in a short time without damaging the closely bonded substrate and the resin layer. Further, a peeling device capable of implementing the above-described method of manufacturing an electronic device can be provided. [Embodiment] The present invention includes the production method and the peeling device of the present invention. The manufacturing method of the present invention can be illustrated by using the stripping apparatus of the present invention, and preferably two preferred embodiments of the stripping apparatus of the present invention. Further, as will be described in detail below, the electronic device with a support used in the present invention is a substrate including a first main surface and a second main surface and having a substrate for an electronic device on the second main surface! On the main surface, a resin layer which is fixed to the first main surface of the support substrate including the first main surface and the second main surface of the package 146274.doc -12- 201039375 and which has easy peelability is closely adhered. That is, the electronic device with the support includes a member for an electronic device, a substrate, a resin layer, and a support substrate, which are laminated in this order. Further, the electronic device package &amp; electronic device member and substrate 'electronic device member are formed on the second main surface of the substrate. In addition, the electronic component with the support may be a laminated body in which the substrate, the resin layer, and the support substrate are laminated in this order via the member for the electronic device, or the support substrate, the resin layer, or the support substrate or the resin layer may be used. The substrate, the member for an electronic device, the substrate, the resin layer, and the support substrate are laminated in this order. Here, the term "electronic device" refers to an electronic component such as a panel for a display device, a solar cell, a thin film secondary battery, or a semiconductor wafer having a circuit formed thereon. The panel for the display device includes a liquid crystal panel, an organic el panel, a plasma display panel, a field emission panel, and the like. 5 Brothers Preferred embodiments of the stripping device of the present invention. Fig. 1 is a schematic cross-sectional view showing a peeling device 1 as a preferred embodiment of the peeling device of the present invention. Fig. 1 (a) to Fig. 1 (d) are continuous views for explaining the operation of each of the positions in the peeling device 剥离 at the time of peeling, and each part of the peeling device 1 is peeled off by the use of Fig. i (a) The actions are as follows. In Fig. 1 (&amp;), the peeling device 1 includes a stage 20, a blade 30, a normal direction moving unit 4〇, and a fixed surface direction moving unit 42' and further includes a three-component force sensor 46. P East] The name 1 includes: the platform 2〇, which is in close contact with the main surface of the display panel 146274.doc -13- 201039375 with the support, and includes a display panel 10 for fixing the support. a planar fixing surface; a blade 30 for peeling off the display device panel 10 for supporting the support from the support; and a normal direction moving unit 40 for inserting the blade 30 to the attachment fixed to the platform 2 The interface between the resin layer in the peeled support and the thin glass substrate in the end surface of the panel 10 for the display device of the support device is such that the blade 3 is parallel to the normal line of the fixed surface of the platform 2 The normal direction (the upper and lower directions in the figure) is moved; and the fixed surface direction moving unit 42 moves the knife 3 between the resin layer and the thin glass substrate; and further includes a three-component force sensor 46 as A load weight detecting unit that measures the load on the blade 30 is detected. Further, as described below, the blade 3 in the peeling device i has such a property that it can be inserted from the resin layer and the thin glass substrate by the action of the resin layer and/or the thin glass substrate. Deformed to move along the surface of the resin layer. Further, the base member 2 and the stage 20 in the peeling device of the preferred embodiment are fixed to the floor of the room in which the peeling device i is provided, and are not moved. Further, the fixed surface 2〇a (refer to Fig. 3) of the platform 20 is a horizontal plane (i.e., flush with the floor of the room). Further, the base member 2 is fixed to the first fixed side member 42b of the fixed surface direction moving unit bamboo, and similarly, the first moving side member 42a of the fixed surface direction moving unit 42 and the second moving member body in the fixed surface direction are fixed. 3. The second moving member body 5 of the first moving member main body 3 and the normal direction moving unit 4〇, and the second moving member body 5 of the second moving side member of the normal moving member in the normal direction 2 Moving member body 5 and three-way force sensor 46 and third moving member body 4 in the normal direction, third movement 146274.doc • 14· 201039375 The component body 4 is fixed to the blade 30. Ο

又，圖1中雖未表示，但如以下利用圖3所說明般，剝離 裝置1包括：吸盤60，其吸附於附支持體之顯示裝置用面 板中之支持玻璃基板19b之第2主面；相機70，其係為了 將刀30插入至附支持體之顯示裝置用面板之端面而使用， 嘴嘴73，其作為對被剝離之支持體之樹脂層18b與薄板玻 璃基板12b之界面喷附除電用物質（水等）之噴附裝置；帶電 抑制裝置75，其藉由導體連接附支持體之顯示裝置用面板 1〇與地面而抑制附支持體之顯示裝置用面板1〇之帶電。 說明本發明之剝離裝置之另一較佳實施例。 圖2係作為本發明之剝離裝置之另—較佳實施例之剝離 裝置Π之概略刮面圖。 圖2(a)〜圖2(d)係用於說明進行剝離時之剝離裝置丨〗十之 各部位之動作之連續圖，利用圖2(a)說明剝離裝置u之構 成°制離時之各部位之動作如下所述。 再者，剝離裝置U包括與上述剥離裝置【共用之部位。 簡略地進行該部位之說明。又，圖2中，對與剝離裝置# 用之部位附上與圖1相同之符號（編號）。 圖2(a)中’剝離裝置U包括平台2〇、刀3〇〇、法線方向移 動單元40、固定面方向移動單元42、包括旋轉機構5〇及止 動部”之插入角度調整單元59、以及法線方向移動機構 44 ’並更包括三成分力感測器46。 即，剝離裝置 方向移動單元40 11包括與剝離裝置1相同之平台20、法線 、固定面方向移動單元42、以及三成分力 146274.doc 15 201039375 感測器46。並且’除此之外亦包括··刀3〇〇，其用於將支 持體自附支持體之顯示裝置用面板1〇剝離；插入角度調整 單元59,其包括旋轉機構5〇與止動部51 ’該旋轉機^5〇可 使刀300以前端部為中心旋轉特定角度（未達度），即進 行旋動而使刀300之後端部於法線方向上移動，該止動部 5 1'係作為設定刀3 〇 〇之插入角度之上下限之插入角度設定 機構；以及法線方向移動機構44,其可使刀3〇〇之=體於 上述法線方向上移動。 此處，剝離裝置U中之刀3〇〇具有與上述剝離裝置i中之 刀30不同之性質’且不變形。即’刀鳩不具有如錢般 於插入至樹脂層與薄板玻璃基板之間時藉由來自樹脂層及/ 或薄板玻璃基板之作用變形而沿樹脂層之表面移動之性 質。 又，作為較佳實施例之剝離裝置u中之基台構件2及平 台20被固定於設置有剝離裝置u之房間之地板，且不移 動又’平台20之固定面為水平面（即與房間之地板平 行）。又’將基台構件2與固定面方向移動單元仏之第^ 定側構件42bi]定，同樣地，將固定面方向移動單元之 第1移動侧構件仏與固定面方向之第i移動構件本體3、第 !移動構件本體3與法線方向移動單元4〇之第2固定側構件 桃、法線方向移動單元40之第2移動側構件他與法線方 向移動機構44之第3固定側構件44b、法線方向移動機構料 之第3移動側構件44a與法線方向之第2移動構件本體$ 2移動構件本體5與三成分力感測器46及法線方向之第3移 146274.doc •16- 201039375 動構件本體4固定。又，刀30以可相對於第3移動構件本體 4旋轉（旋動）之方式受到支持。 又’圖2中雖未表示，但如以下利用圖3所說明般，剝離 裝置11與剝離裝置1同樣地包括吸盤60、相機70、喷嘴 73、及帶電抑制裝置75。 &lt;平台&gt; 剝離裝置1及剝離裝置丨丨（以下亦記作「剝離裝置1、 11」）包括平台20。利用圖3說明剝離裝置1、11中之平台 20 〇 圖3係表示於剝離裝置1、丨丨中之平台2〇之固定面之以上 固疋有附支持體之顯示裝置用面板丨〇之概略剖面圖。此 處’附支持體之顯示裝置用面板10係藉由薄板玻璃基板 (12a、12b)、樹脂層（18a、18b)及支持玻璃基板（19a、19b) 之積層體炎持顯示裝置用構件丨4之兩主面之態樣者。 此處’將藉由薄板玻璃基板123及丨2t)夾持顯示裝置用構 〇 件14之兩主面者稱為狹義之顯示裝置用面板16,將樹脂層 18a及18b與支持玻璃基板19a及19b之各積層體稱為支持體 17a及17b。再者’被剝離之支持體17b包括支持玻璃基板 ’ 19b與樹脂層18b。因此，廣義上，亦可將狹義之顯示裝置 - 用面板16與支持體i7a作為一體而稱為顯示裝置用面板。 剝離裝置1、11包括：平台2〇，其包括具有平面狀之固 定面之多孔質真空吸附板22 ;附支持體之顯示裝置用面板 1〇，其固定於平台20之固定面上；以及刀3〇或刀3〇〇,其 插入至附支持體之顯示裝置用面板1〇之端面1〇χ、即被剝 146274.doc 17 201039375 離之支持體17b之樹脂層18b與薄板玻璃基板12b之界面。 又，剝離裝置1、11包括：吸盤60，其吸附於附支持體 之顯示裝置用面板10中之支持玻璃基板19b之第2主面；相 機70，其包括為了將刀30或刀300插入至端面1〇χ而使用之 圖像處理裝置；喷嘴73，其對被剝離之支持體之樹脂層 18b與薄板玻璃基板12b之界面噴附除電用物質；以及帶電 抑制裝置75’其藉由導體連接附支持體之顯示裝置用面板 10與地面而抑制附支持體之顯示裝置用面板丨〇之帶電。 又，多孔質真空吸附板22與泵24連接，利用泵24抽成真 空’將支持體之顯示裝置用面板1〇中之支持玻璃基板19a 之第2主面真空吸附附於多孔質真空吸附板22之固定面（圖 3中所不之平台20中為上面），從而固定附支持體之顯示裝 置用面板10。本發明之剝離裝置中，所謂平台之固定面， 係指可與附支持體之顯示裝置用面板丨〇之主面密接並將其 固定之平面。 本發明中，只要為可將附支持體之顯示裝置用面板保持 並固疋於其固定面上者，則無特別限定如圖3所示，較 好的是藉由真空吸附進行吸附並固定者。其原因在於對附 支持體之顯示裝置用面板之表面不易造成傷痕，又可以短 時間裝卸。 又’平台係可於其固定面上載置附支持體之顯示裝置用 面板並保持附支持體之顯示裝置用面板m面上之幅 度（面積m好的疋與固定之附支持體之顯示裝置用面板中 之薄板破璃基板之主面面積為同程度。 146274.doc 201039375 再者，本發明中，關於平台之固定面，如圖1〜3所示設 為水平面，但並不限定為水平面，亦可為曲面。圖1 $係用 於說明平台20之固定面之__部分為曲面之情形時之剝離方 ’去之概略剖面圖。首先，於將附支持體之顯示裝置用面板 10固定於固定面20a之一部分為曲面之平台2〇並將刀3〇插 入至支持體17b之樹脂層18b(參照圖3)與顯示裝置用面板16 之薄板玻璃基板12b(參照圖3)之間之初始階段（圖15(a)) 0 中，刀3〇以沿樹脂層18b之表面之方式移動，開始支持體 17b與顯示裝置用面板16之剝離（圖15化)）。其後（圖 15(c))，利用吸盤82吸附支持體17b，將支持體nb與顯示 裝置用面板16剝離。由於平台2〇之固定面2〇a為曲面，故 而與固定面為水平面之平台2〇相比，可將支持體l7b之變 形抑制為較小，從而無剝離時損壞支持體17b之虞。 又，亦可將平台20設為可撓性構件，一邊使其依序彎曲 變形一邊全面剝離。圖16係用於說明平台2〇為可撓性構件 〇 之情形時之剝離方法之概略剖面圖。首先，於將附支持體 之顯不裝置用面板10固定於固定面為水平之可撓性平台20 並將刀30插入至支持體17b之樹脂層18b(參照圖3)與顯示裝 置用面板16之薄板玻璃基板12b(參照圖3)之間之初始階段 (圓16(a))中，刀3〇以沿樹脂層18b之表面之方式移動開 始支持體17b與顯示裝置用面板16之剝離（圖16(b))。其後 (圖16(c))，利用吸盤82吸附支持體nb，進而藉由設於平 台2〇下方之另一吸盤82吸附平台20, 一邊使支持體17b及 平台20依序彎曲變形，一邊將支持體nb與顯示裝置用面 146274.doc •19- 201039375 板16剝離。由於將平台20設為可撓性構件並一面使其依序 彎曲變形一面進行剝離，故而與固定面保持為水平面而不 變形之平台相比，可將支持體17b之變形抑制為較小，從 而無剝離時損壞支持體l7b之虞。 又，圖3中，Θ所表示之角度表示刀之插入角度。即，所 謂插入角度（Θ)，係指刀之上面（若為刀為下述之圖4所示之 二段刀之情形，則為刀之中段部及後端部之上面）、與被 剝離之支持體17b之樹脂層18b之表面所成之角度。 &lt;刀&gt; 刀30及刀300係用於將支持體丨7b自附支持體之顯示裝置 用面板ίο剝離者，其插入至包括支持玻璃基板19b與樹脂 層18b之支持體17b、與薄板玻璃基板12b之界面並進行剝 離。 利用圖4說明剝離裝置i中之刀3〇之形狀。再者，此處雖 僅說明刀30，但剝離裝置丨丨中之刀3〇〇之形狀可與剝離裝 置1中之刀30相同。 圖4(a)為刀30之概略俯視圖，圖4(b)為概略端面圖。 本發明中所用之刀之大小、形狀等並無㈣限定，作為 較佳實施例之刀30具有如圖4所示之大小及形狀。即，如 圖4⑷所示’自上方觀察，刀3G為矩形，大小為寬度1〇 _，長度100 _。又，如圖4(b)所示，厚度為〇1 _， 為二段刀。構成二段刀之圖4(b)t所示之前端部3〇a為尖 頭，自端面觀察，形成25度之角度，，段部_形成“度 之角度，後端部3〇c平坦。 146274.doc -20· 201039375 ι，本 長度 如上所述，刀30之大小為寬度10 mm、長度100 nu 發月中所用之刀之大小較好的是寬度咖、 3〇 2〇〇mm。又，厚度較好的是0.05〜M) mm。 又較好的疋如刀3〇般為二段刀。其原因在於可防止刀 之前端對薄板玻璃基板或樹脂層之表面造成損傷。 又’如上所述’刀30中之前端部30a所成之角度為25度 左右，於本發明中所使用之刀為二段刀之情形時，前端部1 is not shown, but as described below with reference to FIG. 3, the peeling device 1 includes a suction cup 60 that is attracted to the second main surface of the supporting glass substrate 19b in the display device panel with the support; The camera 70 is used to insert the blade 30 into the end surface of the panel for a display device with a support, and the nozzle 73 is used as a connection to the interface between the resin layer 18b and the thin glass substrate 12b of the peeled support. A spraying device for a substance (water or the like); a charging suppressing device 75 that is connected to the display panel for the display device with the conductor and the ground, thereby suppressing charging of the panel 1 for the display device with the support. Another preferred embodiment of the stripping device of the present invention is illustrated. Fig. 2 is a schematic plan view showing a peeling device of another preferred embodiment of the peeling device of the present invention. 2(a) to 2(d) are a continuous view for explaining the operation of each part of the peeling device 剥离 十 10 when the peeling is performed, and the configuration of the peeling device u is described with reference to Fig. 2 (a) The operation of each part is as follows. Further, the peeling device U includes a portion that is shared with the above-described peeling device. The description of the part is briefly performed. In addition, in Fig. 2, the same reference numerals (numbers) as those in Fig. 1 are attached to the parts used for the peeling device #. In Fig. 2(a), the "peeling device U includes a table 2", a knife 3", a normal direction moving unit 40, a fixed surface direction moving unit 42, an insertion angle adjusting unit 59 including a rotating mechanism 5" and a stopper" And the normal direction moving mechanism 44' and further includes a three-component force sensor 46. That is, the peeling device direction moving unit 4011 includes the same platform 20 as the peeling device 1, the normal line, the fixed surface direction moving unit 42, and Three-component force 146274.doc 15 201039375 Sensor 46. And 'in addition to this, it also includes a knife 3〇〇 for peeling off the display panel for the display device with the support from the support; insertion angle adjustment The unit 59 includes a rotating mechanism 5〇 and a stopping portion 51'. The rotating machine can rotate the knife 300 by a specific angle (not reaching) centering on the front end portion, that is, rotating to make the rear end of the knife 300 Moving in the normal direction, the stopper portion 5 1' serves as an insertion angle setting mechanism for setting the upper limit of the insertion angle of the blade 3 ;; and a normal direction moving mechanism 44, which can make the knife 3 = The body moves in the normal direction above. Here, The blade 3 in the peeling device U has a different property from the blade 30 in the above-described peeling device i' and is not deformed. That is, the blade does not have the money to be inserted between the resin layer and the thin glass substrate by money. The property of the resin layer and/or the thin glass substrate is deformed to move along the surface of the resin layer. Further, the abutment member 2 and the stage 20 in the peeling device u of the preferred embodiment are fixed to the peeling device u. The floor of the room is not moved and the fixed surface of the platform 20 is a horizontal plane (ie parallel to the floor of the room). Further, 'the abutment member 2 and the fixed side member 42bi of the fixed surface direction moving unit ] are fixed, Similarly, the first moving side member 固定 of the fixed surface direction moving unit and the i-th moving member main body 3 of the fixed surface direction, the second moving member body 3 and the second fixed side member of the normal direction moving unit 4, The second moving side member of the normal direction moving unit 40 and the third fixed side member 44b of the normal direction moving mechanism 44, the third moving side member 44a of the normal direction moving mechanism, and the second moving member of the normal direction Ontology $ 2 shift The movable member body 5 is fixed to the three-component force sensor 46 and the third direction of the normal direction 146274.doc •16- 201039375. The knife 30 is rotatable relative to the third moving member body 4 (rotating) In addition, although not shown in FIG. 2, as described below with reference to FIG. 3, the peeling device 11 includes the suction cup 60, the camera 70, the nozzle 73, and the charging suppression device 75 similarly to the peeling device 1. &lt;Platform&gt; The peeling device 1 and the peeling device (hereinafter also referred to as "peeling devices 1, 11") include a stage 20. The platform 20 in the peeling devices 1 and 11 will be described with reference to Fig. 3, and Fig. 3 is a schematic view of the panel for the display device with the support attached to the fixed surface of the platform 2 in the peeling device 1. Sectional view. Here, the display panel 10 for a display device with a support is a member for a display device for a laminate of a thin glass substrate (12a, 12b), a resin layer (18a, 18b), and a supporting glass substrate (19a, 19b). 4 of the two main aspects of the situation. Here, the two main faces of the display device structure 14 are sandwiched between the thin glass substrate 123 and the crucible 2t, and the display panel 16 is narrowly defined, and the resin layers 18a and 18b and the supporting glass substrate 19a are Each of the laminates of 19b is referred to as a support 17a and 17b. Further, the peeled support 17b includes a supporting glass substrate '19b and a resin layer 18b. Therefore, in a broad sense, the narrow display device - the panel 16 and the support i7a can be collectively referred to as a display device panel. The peeling device 1, 11 includes a platform 2A including a porous vacuum adsorption plate 22 having a planar fixing surface, a display panel for the display device with a support, which is fixed to the fixing surface of the platform 20, and a knife 3〇 or a knife 3〇〇, which is inserted into the end face 1 of the panel 1B of the display device with the support, that is, the resin layer 18b and the thin glass substrate 12b of the support 17b which are peeled off by 146274.doc 17 201039375 interface. Further, the peeling device 1 and 11 include a suction cup 60 that is attracted to the second main surface of the supporting glass substrate 19b in the display device panel 10 with the support, and a camera 70 that includes a knife 30 or a knife 300 inserted thereinto. An image processing apparatus used for the end surface; a nozzle 73 for ejecting a substance for removing electricity from an interface between the resin layer 18b of the peeled support and the thin glass substrate 12b; and a charging suppression device 75' connected by a conductor The display device panel 10 with the support and the ground surface suppress the charging of the panel for the display device with the support. Further, the porous vacuum adsorption plate 22 is connected to the pump 24, and is evacuated by the pump 24. The second main surface of the supporting glass substrate 19a in the panel 1 of the display device for the support is vacuum-adsorbed to the porous vacuum adsorption plate. The fixing surface of 22 (the upper surface of the platform 20 in Fig. 3 is the upper surface) is used to fix the display device panel 10 with the support. In the peeling device of the present invention, the fixing surface of the platform means a plane which can be adhered to and fixed to the main surface of the panel 显示 of the display device with the support. In the present invention, as long as the panel for a display device with a support can be held and fixed to the fixing surface thereof, it is not particularly limited as shown in FIG. 3, and is preferably adsorbed and fixed by vacuum suction. . The reason for this is that the surface of the panel for a display device with a support is less likely to cause scratches and can be loaded and unloaded for a short period of time. In addition, the platform can mount the panel for the display device on which the support is placed on the fixed surface and maintain the width of the panel on the m surface of the display device with the support (the area m is good and the fixed display device for the support is used) The main surface area of the thin glass substrate in the panel is the same. 146274.doc 201039375 In the present invention, the fixed surface of the platform is set as a horizontal plane as shown in FIGS. 1 to 3, but is not limited to a horizontal plane. It can also be a curved surface. Fig. 1 is a schematic sectional view of the peeling side when the __ portion of the fixed surface of the platform 20 is a curved surface. First, the display device with the support is fixed with the panel 10 A portion of the fixed surface 20a is a curved surface plate 2, and the blade 3A is inserted between the resin layer 18b (see FIG. 3) of the support 17b and the thin glass substrate 12b (see FIG. 3) of the display device panel 16. In the initial stage (Fig. 15 (a)) 0, the blade 3 is moved along the surface of the resin layer 18b, and the peeling of the support body 17b and the display device panel 16 is started (Fig. 15). Thereafter (Fig. 15 (c)), the support body 17b is sucked by the suction cup 82, and the support nb is peeled off from the display device panel 16. Since the fixed surface 2〇a of the platform 2 is a curved surface, the deformation of the support l7b can be suppressed to be smaller than that of the platform 2A whose fixed surface is a horizontal surface, so that the support 17b is not damaged when peeling. Further, the stage 20 may be a flexible member, and may be completely peeled off while being sequentially bent and deformed. Fig. 16 is a schematic cross-sectional view showing a peeling method when the stage 2 is a flexible member 〇. First, the display panel 10 for attaching the support is fixed to the flexible flexible platform 20 having the fixed surface, and the blade 30 is inserted into the resin layer 18b (see FIG. 3) of the support 17b and the panel 16 for the display device. In the initial stage (circle 16 (a)) between the thin glass substrates 12b (see FIG. 3), the knives 3 移动 move along the surface of the resin layer 18b to start peeling of the support 17b and the display device panel 16 ( Figure 16 (b)). Thereafter (Fig. 16 (c)), the support body nb is sucked by the suction cup 82, and the platform 20 is sucked by the other suction cup 82 provided under the platform 2, and the support body 17b and the stage 20 are sequentially bent and deformed. The support nb is peeled off from the display device surface 146274.doc • 19-201039375. Since the stage 20 is made into a flexible member and is peeled and deformed while being sequentially deformed, the deformation of the support 17b can be suppressed to be smaller than that of the stage in which the fixed surface is maintained in a horizontal plane without being deformed. The support l7b is damaged when there is no peeling. Further, in Fig. 3, the angle indicated by Θ indicates the insertion angle of the blade. In other words, the insertion angle (Θ) refers to the upper surface of the knife (if the knife is the two-stage knife shown in Fig. 4 below, the upper portion of the middle portion and the rear end portion of the blade) is peeled off. The angle formed by the surface of the resin layer 18b of the support 17b. &lt;Knife&gt; The blade 30 and the blade 300 are used for peeling off the display device panel for supporting the support body 7b from the support, and are inserted into the support body 17b including the support glass substrate 19b and the resin layer 18b, and the thin plate The interface of the glass substrate 12b is peeled off. The shape of the blade 3 in the peeling device i will be described using FIG. Further, although only the blade 30 will be described here, the shape of the blade 3 in the peeling device can be the same as that of the blade 30 in the peeling device 1. 4(a) is a schematic plan view of the blade 30, and FIG. 4(b) is a schematic end view. The size, shape, and the like of the blade used in the present invention are not limited to (4), and the blade 30 as a preferred embodiment has a size and shape as shown in FIG. That is, as shown in Fig. 4 (4), the knife 3G is rectangular as viewed from above, and has a size of 1 〇 _ and a length of 100 _. Further, as shown in Fig. 4(b), the thickness is 〇1_, which is a two-stage knife. The front end portion 3〇a shown in Fig. 4(b)t which constitutes the two-stage knife is a pointed end, and is formed at an angle of 25 degrees from the end surface, and the segment portion _ forms an angle of degree, and the rear end portion 3〇c is flat. 146274.doc -20· 201039375 ι, the length is as described above, the size of the knife 30 is 10 mm in width and 100 nu in length. The size of the knife used in the month is preferably width coffee, 3 〇 2 〇〇 mm. Further, the thickness is preferably 0.05 to M) mm. The preferred one is a two-stage knife such as a knife. The reason is that the front end of the blade can be prevented from causing damage to the surface of the thin glass substrate or the resin layer. As described above, the angle formed by the front end portion 30a of the blade 30 is about 25 degrees, and when the blade used in the present invention is a two-stage knife, the front end portion

所成之角度較好的是2〇〜3〇度。又，同樣地，中段部所成 之角度較好的是10〜20 # „ 1 0度°又，前端之曲率並無特別限 疋較好的疋曲率半控為〇 〇〇 1 mm以上。進而，如圖4所 示，本發明中所用之刀較好料雙刃，但亦可為單刃。 其次，說明刀之材質及變形能等。 刀30及刀;3〇{)之材f並無特別限^。可列舉例如不鐵剛 專之金屬、陶瓷、塑勝、硬質橡膠。 又，較好的是如下材料，，插入至樹脂層與薄板玻璃 基板之間而自樹脂層及/或薄板玻璃基板受到某些作用（力） 時變形，作用解除時變形亦可逆地解除並恢復為原來之形 狀。可較佳地例示如橡膠之彈性體，於對刀施加之作用 (力）不大之範圍内，金屬等亦作為彈性體動作，因此可較 佳地使用。 又，較好的疋包括揚式模量為1〇〇〇〜4〇〇 〇〇〇 N/mm2、 較好為200,000 N/mm2左右之材料者。不鏽剛係揚式模量 為206,000 N/mm2、可較好地使用之材料。 又，剝離裝置1之刀30係具有指定之抗撓剛度[NMnm2] 146274.doc -21- 201039375 者。 具體而言，於刀30之形狀為例如上述圖4中所示者之情 形時，對於施加於其上面之負重（厚度方向之負重）之抗撓 剛度（以下設為「抗撓剛度A」）為5,000 N.mm2以下，較好 的是200 N，min2以下。 又，於刀30之形狀為例如上述圖4中所示者之情形時， 對於其寬度方向之負重之抗撓剛度（對於長度方向之邊（面） 施加負重之情形時之抗撓剛度）（以下設為「抗撓剛度B」） 為200,000 N.mm2以上，較好的是}，嶋嶋〜晒2以上。 進而更好的疋抗撓剛度A為5,000 N，mm2以下且抗撓剛 度 B 為 200,0〇〇Ν·ππη2 以上。 再者，此處所謂之抗撓剛度（抗撓剛度Α及抗撓剛度⑴係 作為取決於刀之材質之揚式模量[N/mm2]、與取決於剖面 形狀及中立軸之位置之剖面二次矩[mm4]之積而求出。 如上所述，剝離裝置丨之刀3〇具有上述指定範圍之抗撓 剛度A、B，因此於插入至樹脂層與薄板玻璃基板之間之 隋开V時彳藉由來自樹脂層及/或薄板玻璃基板之作用而 隻形，以沿樹脂層之表面移動。如下所述，剝離裝置11之 刀300雖無需具有如刀3G所具有之抗撓剛度但亦可具 有。 其次，說明支持剝離裝置1之刀30之支持部。 較好的是刀30文到包括圖5所示之構造之支持部61支 持。圖5(a)係剝離裝置1中之刀30及支持其之支持部61之概 略立體圖°又’圖5(b)、® 5(e)係表示圖5(a)中之其中-個 146274.doc •22- 201039375 臂之動作之概略俯視圖。圖5(b)、圖5⑷中省略刀则 未圖示。 圖5中之支持部61包括兩個板狀之臂川，該等與刀贿 •、结。於刀3〇受到某些力之情形時，臂川可為了不妨礙刀 30自身之變形而變形。 例如圖5(b)所示，兩個臂611可變形為相互接近。又，如 圖5(c)所示’可變形為自上方觀察時為§字狀。 0 由於刀3G除具有上述指定範®之抗撓剛度A、B，亦進 而受到上述支持部支持，故而於插入至樹脂層與薄板玻璃 基板之間之情形時，可藉由來自樹脂層及/或薄板玻璃基 板之作用而更容易變形，以沿樹脂層之表面移動。 更具體而言，如圖6所示（圖6⑷〜圖6⑷中省略支持㈣ 而表示），於將刀插人至樹脂層與薄板玻璃基板之間之初 始階段(圖6(b))中’刀30可藉由其自身之法線方向之變形 而以沿樹脂層之表面之方式移動，其後（圖6⑷），藉由以 Ο 插入方向上之刀30與附支持體之顯示裝置用面板10接觸之 4刀及刀3G與支持部連結之部分為支點之旋轉方向之變 形且與旋轉方向複合之稱為自身之扭轉現象，沿樹脂層之 '表面移動。 • &gt;相對於此，剝離裝置U之刀3〇〇不具有如刀3〇所具有之 抗撓剛度，亦不包括如支持部61之支持構造。因此，不會 藉由來自樹脂層或薄板玻璃基板之作用而變形。因此，剝 離裝置U必需包括剝離裝置i所不包括之具有旋轉機構及 插入角度設定機構之插入角度調整單元、及法線方向移動 146274.doc -23. 201039375 機構。 再者’本發明之剝離裝置並不排除包括具有如刀30之變 形能之刀、且、如剝離裝置11般包括插入角度調整單元及法 線方向移動機構者。更確切地說，根據變形能（變形之程 度）’亦存在刀更好地動作之情形。 &lt;法線方向移動單元&gt; 利用圖1 (a)說明剝離裝置1中之法線方向移動單元40。剝 離裝置11亦包括相同之法線方向移動單元40。 剝離裝置1中’法線方向移動單元40包括第2移動側構件 40a及第2固定側構件4〇b。第2移動側構件4〇a與第2固定側 構件40b經由未圖示之交叉式轉輪導轨而連接藉由使未 圖示之伺服馬達驅動，可使第2移動側構件4〇a相對於第2 固定側構件40b而朝法線方向移動’並使連接於其之刀3〇 朝法線方向移動。 如上所述，所谓法線方向，係指與平台2〇之固定面 20a(參照圖3)之法線平行之方向。剝離裝置1中之平台2〇之 固定面20a為水平面，因此剝離裝置】中（剝離裝置丨丨中亦 同樣）所謂法線方向，係指上下方向（垂直方向）。 能以如上所述般將刀30插入至固定於平台2〇之固定面 2〇a上之附支持體之顯示裝置用面板1〇之端面、即被剥離 之支持體17b之樹脂層18b與薄板玻璃基板12b之界面的方 式（參照圖3 )，調整其位置。 本發明中，法線方向移動單元只要為可使刀朝法線方向 之所需之位置移動之單元，則無特別限定。 146274.doc -24· 201039375 &lt;插入角度調整單元&gt; 剝離裝置11包括插入角度調整單元59，其包括旋轉（或 旋動）機構50與作為上下限設定機構之止動部5 1。剝離裝 置1不包括插入角度調整單元。 利用圖2(a)及圖7，說明剝離裝置11中之旋轉機構50。 剝離裝置11中，旋轉機構50係如下機構，即，旋轉軸54 與刀300經由托架52而連結，可藉由使旋轉（或旋動）軸54進 ❹ 行特定角度旋轉（或旋動）而亦使刀300進行特定角度旋轉 (或旋動）。 圖7係用於說明上述旋轉機構5〇之概略剖面圖，其係自 上方觀察於旋轉軸54之中心水平地切開之剖面之圖。 圖7中’矩形之刀3 〇〇之三邊被固定地固定於托架52，進 而托架52被固定於旋轉軸54，因此藉由旋轉軸54旋轉而刀 3〇〇亦同樣地旋轉。旋轉軸54經由樹脂製之滑動套56而受 到托架58支持。托架58固定於圖2(a)所示之第3移動構件本 〇 體4 °又’如圖2(a)及圖7所示，刀300之前端與旋轉軸54之 中心大致一致。因此，刀3〇〇能以其前端為中心進行旋 轉。 又’如圖2(a)所示’剝離裝置11包括止動部5 1。止動部 51與第3移動構件本體4連結，可相對於第3移動構件本體4 而相對地於法線方向（上下方向）移動並於所需之位置進行 固疋。因此，若進行固定，則止動部51追隨第3移動構件 本體4之法線方向之移動而移動。 可藉由上述止動部5丨調整刀300之插入角度（Θ)之上限或 146274.doc -25· 201039375 下限。以支純架52之下面之方式蚊止動部此位置， 藉此力300不再朝插入角度⑼變大之方向旋轉，因此可 没疋上限。此時，可朝逆方向（θ變小之方向）旋轉。 插入角度（Θ)雖然並無特別限定，但較好的是2〜5度。 &lt;固定面方向移動單元&gt; 利用圖1(a)說明剝離裝置i中之固定面方向移動單元42。 剝離裝置11亦包括相同之固定面方向移動單元。 剝離裝置1中，固定面方向移動單元42包括第旧動側構 件42a及第1固定側構件421^第【移動側構件42a與第上固定 側構件42b經由未圖示之交叉式轉輪導軌而連接，藉由使 未圖示之伺服馬達驅動，可使第！移動側構件42a相對於第 1固定侧構件421^朝與平台2〇之固定面平行之方向即固定面 方向（圖1(a)中為左右方向）移動，並使連接於其之刀朝 固定面方向移動。接著，可使刀3〇於樹脂層與薄板玻璃基 板之間移動。 本發明中，固定面方向移動單元只要為可使刀朝固定面 方向之所需之位置移動之單元’則無特別限定。 &lt;法線方向移動機構&gt; 利用圖2(a)說明剝離裝置丨丨中之法線方向移動機構44。 剝離裝置11中，法線方向移動機構44包括第3移動侧構 件44a、第3固定側構件4仆及止動部44ce第3移動側構件 44a與第3固定側構件44b經由未圖示之交又式轉輪導軌而 連接，第3移動側構件44a可相對於第3固定側構件44b於法 線方向（上方向）上自由地移動。 146274.doc -26- 201039375 止動。卩44c與法線方向移動單元4〇之第2移動側構件 _連結’可相對於第2移動側構件40a而相對地於法線方 向（上下方向）移動並於所需之位置進行固定。因此，若進 打固定，則止動部44c追隨第2移動側構件4〇a之法線方向 (上下方向）之移動而移動。 可糟由上述止動部44c決定刀30之法線方向（上下方向）之 最下位置。藉由以支持第2移動構件本體5之下面之方式決 〇 定止動。卩44e之位置’刀30不再朝下方移動。可朝上方向 移動。 本I明中，法線方向移動機構只要為刀之整體可於上方 向移動之機構，則無特別限定。 &lt;負載重量檢測單元&gt; 利用圖1(a)說明剝離裝置丨中之負載重量檢測單元。剝離 裝置11亦包括相同之負載重量檢測單元。 剝離裝置1包括對刀30之負載重量檢測單元，其藉由第3 〇 移動構件本體4與第2移動構件本體5夾持三成分力感測器 46 〇 本發明之剝離裝置較好的是包括上述對刀之負載重量檢 測單元。又，較好的是儘可能位於刀之附近。若本發明之 卿裝置包括對刀之負載重量檢測裝置，則於利用刀剝離 支持體時可進行剝離而不會施加過度之力，因而較佳。 &lt;吸盤&gt; 剝離裝置1、11包括複數個吸盤60，其吸附於附支持體 之顯示裝置用面板10中之支持玻璃基板19b之第2主面。 146274.doc -27- 201039375 本發明中’較好的是包括上述吸盤，並利用其將支持體 自附支持體之顯示装置用面板10剝離。 利用圖式說明剝離裝置1、i丨所包括之吸盤。 圖8係表示剝離裝置丨、丨丨之一部分之概略立體圖。圖8 中，剝離裝置1、11於平台2〇之固定面上大致水平地固定 有附支持體之顯示裝置用面板1〇，多數個吸盤82吸附於附 支持體之顯示裝置用面板1〇中被剝離之支持體17b之支持 玻璃基板19b(參照圖3)之第2主面。 如圖8所示，複數個吸盤82配置於固定有附支持體之顯 示裝置用面板10之平台2〇之上方。剝離裴置i、丨丨中，該 等吸盤82柵格狀地配置於框架84，但本發明中未必為等間 距地配置。該框架84於支持體之剝離時沿導板86下降移 動，於吸盤82即將抵接於附支持體之顯示裝置用面板⑺之 上面（支持玻璃基板之第2主面）之前之時序時，其下降移動 藉由未圖示之升降裝置停止。 關於吸盤82之尺寸，若尺寸較小，則對於附支持體之顯 示裝置用面板10之保持力不充分，吸盤82之個數變多而浪 費。又，若吸盤82之尺寸過大，則藉由抽成真空而吸附中 央硭之附支持體之顯示裝置用面板丨〇之變形變大，因此視 情況而成為附支持體之顯示裝置用面板10之損傷之原因。 自上述事情來看，吸盤82之適當之尺寸（例如0為25〜80 mm，較好的是^為25〜65 mm，更好的是卢為4〇爪⑺左右）及 個數係根據附支持體之顯示裝置用面板1〇之大小及厚度等 而選定。 146274.doc •28- 201039375 吸盤82連結於各個獨立之氣缸88之活塞89，藉由該活塞 89之伸縮動作而使吸盤82升降移動。藉由吸盤82之下降動 作，吸盤82按壓抵接於附支持體之顯示裝置用丨〇，附支持 體之顯示裝置用面板之上面受到吸盤82之吸附，並藉由 吸盤82之上升動作將附支持體之顯示裝置用面板1〇中之支 持體17b(支持玻璃基板19b及樹脂層18b)自顯示裝置用面板 16剝離（參照圖3)。 0 較好的是以如下方式控制上述吸盤82之上升動作，即， 不使附支持體之顯示裝置用面板丨〇全域之吸盤82 一併進行 上升動作，而是隨著自附支持體之顯示裝置用面板1〇之端 邛朝中央剝離支持體之進展而依次進行上升動作。又，較 好的是根據支持體所容許之彎曲應力或尺寸而調整吸盤之 上升距離。 又，較好的是對於吸盤82與活塞89之連結部分使用活節 構造等，可傾斜地支持吸盤82。其原因在於可使由吸盤82 ◎ 之吸附面吸附之支持玻璃基板19b(參照圖3)之部分亦自一 端逐漸剝離，使剝離穩定化。 再者，可使吸盤朝法線方向上升而剝離支持體，亦可使 吸盤朝相對於法線方向具有角度之方向上升。例如，如下 詳細說明般，若於隨著自附支持體之顯示裝置用面板1〇之 端部朝中央剝離支持體之進展而依次進行上升動作之情形 時，使吸盤以朝該中央方向傾斜之方式上升，則可更容易 地剝離支持體，故而較佳。 圖9係表示附支持體之顯示裝置用面板1〇之上面（支持玻 146274.doc -29- 201039375 璃基板19b之第2主面）且圖8中所示之吸盤82所吸附之位置 之俯視圖，圖10係表示吸盤82之控制系統之方塊圖。再 者，圖9為右下角部插入有刀者，如將複數個（圖8、9中為 42個）吸盤82中之距該角部最近之吸盤稱為吸盤82&amp;、其鄰 近（左上）之兩個吸盤稱為吸盤82b、進而將其鄰近（左上）之 二個吸盤82稱為吸盤82c般，其後亦附上82d〜821之符號。 如圖10所示，以該等吸盤82a〜821分別獨立動作之方式 (相同符號之吸盤以相同之方式動作），針對每個吸盤 82a〜821之氣缸88a〜881設有電磁閥87a〜871，並且該等電磁 閥87a〜871之開啟及關閉時序藉由控制部（吸盤移動單元）9〇 進行時間管理。即’以藉由插入刀30或刀3〇〇自無吸附力 之部位（角部）起依序使吸盤82a〜821以特定時間間隔上升移 動之方式進行控制。即’具有時間控制功能。藉此，可防 止使吸附力殘存之部位強制上升所引起之支持體之損壞。 接著’可隨著將支持體自附支持體之顯示裝置用面板1〇之 端部朝中央剝離之進展而依序進行上升動作並剝離。 又’吸盤82a〜821之氣缸88a〜881經由電磁閥87a〜871與電 控調卽器85 a〜8 51而連接於空氣泉83，該等電控調節器 85a〜851分別受到控制部90控制。即，藉由控制部9〇分別 控制電控調節器85a~85卜逐漸增加供給至氣缸88a〜881之 空氣量之間’藉此，可逐漸增加吸盤82之上升之力。藉由 執行上述力控制’可自最初回避由於強制提高上升之力所 引起之附支持體之玻璃基板10之損傷問題，且可將剝離所 需之必要時間縮短為最低限度。 146274.doc •30· 201039375 另-方面’吸盤82經由藉由控制部9〇進行開啟及關閉控 制之閥79與電動氣動調節器78而連接於真空㈣。吸㈣ 之氣壓之控制係藉由調節器78進行。關於吸盤以之上升之 日f序與上升之力，藉由操作設置於控制部％之操作盤之觸 控面板等之開關(未圖示”操作員可設定為任意值。 &lt;相機&gt; 為了確疋附支持體之顯示裝置用面板1〇之端面上之 0 插入刀30或刀300之部位’剥離裝置1、11包括具有圖像處 理裝置之相機70。藉由相機70將刀30或刀300之位置資訊 作為圖像資料取入至圖像處理褒置，並處理該圖像資料， 藉由圖像處理裝置判斷是否為所需之位置，並將其結果反 饋至法線方向移動單元4〇 ’藉此可使刀3〇或刀3〇〇朝所需 之位置移動。 本發明中，較好的是如上所述般包括具有上述圖像處理 裝置之相機，並藉由圖像處理確定將附支持體之顯示裝置 ❹用面 板之端面上之插入刀之部位。 相機及圖像處理裝置之種類等並無特別限定，可使用先 刖眾所周知者。 ' &lt;噴附裝置：&gt; -剝離裝置1、1 1包括噴嘴73，其可對被剝離之支持體i7b 中之樹脂層18b與顯示裝置用面板16之薄板玻璃基板12b之 界面喷附除電用物質（水等）（參照圖3)。 若使用本發明之剝離裝置進行剝離，則存在所獲得之顯 不裝置用面板帶電之情形。亦存在呈現例如+1〇 kV之帶電 146274.doc •31 - 201039375 壓之if开〉。因此’若於剝離時㈣^ ^ ^ 上述帶電。 t賴除Μ物貝，則可抑制 作為除電用物質，可列臬&gt; + # 列舉水或水蒸汽等之經離子化之液 體及/或氣體。又，可列與雜 列舉藉由脈衝電源裝置等離子化之 空氣或其他氣體。 ^，就喷附裝置而言，亦可噴附除電用物質以外者（空 時’發揮促進剝離之效果。即便於喷附除電用 物質之情形時，亦發揎^日ρη + β 同之放果。較好的是藉由喷附例 h水及空氣之混合流體而發揮除電作用及剝離促進作 用。 本發明中，藉由包括上 ^賀附裝置，可利用其將支持體 自附支持體之顯示裝置用面板1〇剝離。 &lt;帶電控制裝置&gt; 剝離裝置-U包括帶電抑制裝置75,其用於藉由導體 連接附支持體之顯示裝置用面板1G與地面而抑制附支持體 之顯示裝置用面板10之帶電，即用於接地（參照圖3)。 較好的是’於與顯示裝置用構件接觸之薄板玻璃基板之 又面(主面)之周緣’形成有包括由例如透明電極膜形成之 未施加驅動電壓之非聰叙垂· |·ς时 非驅動電極膜之保護圈，將該保護圈與 導體連接而接地。 右使用本發明之剝離_宰；隹左丨站 _ 離裝置進仃剝離，則存在所獲得之顯 示裝置用面板帶電之，陪丑彡 匱形亦存在呈現例如+10 kV之帶電 壓之情形。因此，若句扛μ、+.蛛而. 右匕括上述帶電抑制裝置，則可抑制上 述帶電。 146274.doc •32- 201039375 若本發明中包括上述帶電抑制裝置 體自附支持體之顯示裝置用面板1〇剝離。較好地將支持 =所=之剝離裝置……，平台2。之固 水千面，但本發明之剝離裝置中，固定面亦可 面、即不為與房間之地板等平行之面。例如可為鱼垂直方 向平行之面’亦可為與其斜交之面。進而，不僅是平上， 設置本發明之剝離裝置自身之方向亦全無限定。亦可：由The angle formed is preferably 2〇~3〇. Further, similarly, the angle formed by the middle portion is preferably 10 to 20 # „1 0 degrees °, and the curvature of the front end is not particularly limited. The half curvature of the curvature is preferably 〇〇〇1 mm or more. As shown in Fig. 4, the knife used in the present invention is preferably double-edged, but can also be a single-blade. Next, the material and deformation energy of the knife, etc. The knife 30 and the knife; There is no particular limitation. For example, a metal, a ceramic, a plastic, or a hard rubber which is not a steel is used. Further, it is preferably a material which is inserted between the resin layer and the thin glass substrate from the resin layer and/or When the thin glass substrate is deformed by some action (force), the deformation can be reversely released and restored to the original shape when the action is released. The elastic body such as rubber can be preferably exemplified, and the effect (force) applied to the knife is not large. In the range, the metal or the like also functions as an elastic body, so that it can be preferably used. Further, the preferred enthalpy includes a male modulus of 1 〇〇〇 to 4 〇〇〇〇〇 N/mm 2 , preferably 200,000. N/mm2 or so material. Stainless steel spring modulus is 206,000 N/mm2, which can be used well. Further, the blade 30 of the peeling device 1 has a specified flexural rigidity [NMnm2] 146274.doc -21 - 201039375. Specifically, when the shape of the blade 30 is, for example, the case shown in FIG. 4 described above. The flexural rigidity (hereinafter referred to as "flexural rigidity A") of the load (weight-bearing load in the thickness direction) applied thereto is 5,000 N.mm 2 or less, preferably 200 N, min 2 or less. Further, in the case where the shape of the blade 30 is, for example, the case shown in Fig. 4 described above, the bending rigidity of the load in the width direction (the bending rigidity in the case where the load is applied to the side (face) in the longitudinal direction) ( The following is set to "flexural rigidity B"), which is 200,000 N.mm2 or more, preferably }~2 or more. Further, the flexural rigidity A is preferably 5,000 N, mm 2 or less and the flexural rigidity B is 200, 0 〇〇Ν · π π η 2 or more. Furthermore, the flexural rigidity (flexural rigidity 抗 and flexural rigidity (1) referred to herein is a type of tensile modulus [N/mm2] depending on the material of the blade, and a profile depending on the shape of the cross section and the position of the neutral axis. The product of the second moment [mm4] is obtained. As described above, the blade 3 of the peeling device has the flexural rigidity A and B of the above-specified range, and thus is inserted between the resin layer and the thin glass substrate. The V is only shaped by the action of the resin layer and/or the thin glass substrate to move along the surface of the resin layer. As described below, the blade 300 of the peeling device 11 does not need to have the flexural rigidity as the blade 3G. Next, the support portion of the blade 30 supporting the peeling device 1 will be described. It is preferable that the blade 30 is supported by the support portion 61 including the configuration shown in Fig. 5. Fig. 5(a) is the peeling device 1 A schematic perspective view of the blade 30 and the supporting portion 61 supporting the same, and 'Fig. 5(b), ® 5(e) are the ones of the 146274.doc • 22- 201039375 arm of Fig. 5(a) Fig. 5(b) and Fig. 5(4) are omitted, and the support portion 61 in Fig. 5 includes two plate-shaped arms. In the case of a certain force, the arm can be deformed so as not to interfere with the deformation of the knife 30 itself. For example, as shown in Fig. 5(b), the two arms 611 It can be deformed to be close to each other. Further, as shown in Fig. 5(c), it can be deformed to be §-shaped when viewed from above. 0 Since the knife 3G has the flexural rigidity A and B of the above specified specification, it is further affected. The support portion supports, so that when inserted between the resin layer and the thin glass substrate, it can be more easily deformed by the action of the resin layer and/or the thin glass substrate to move along the surface of the resin layer. As shown in FIG. 6 (shown in FIG. 6 (4) to FIG. 6 (4), the support (4) is omitted), in the initial stage (FIG. 6 (b)) in which the blade is inserted between the resin layer and the thin glass substrate (the blade 30) It can be moved along the surface of the resin layer by deformation of its own normal direction, and thereafter (Fig. 6 (4)), by contact with the panel 10 for display device with the support by the blade 30 in the 插入 insertion direction The portion of the 4th knife and the knife 3G that is coupled to the support portion is a deformation of the rotation direction of the fulcrum and The direction of rotation is called the twisting phenomenon of itself, and moves along the surface of the resin layer. • In contrast, the blade 3 of the peeling device U does not have the flexural rigidity as the blade 3〇, and does not include The support structure of the support portion 61. Therefore, it is not deformed by the action of the resin layer or the thin glass substrate. Therefore, the peeling device U must include the insertion mechanism having the rotation mechanism and the insertion angle setting mechanism not included in the peeling device i. Angle adjustment unit, and normal direction movement 146274.doc -23. 201039375 mechanism. Further, the peeling device of the present invention does not exclude a knife including a deformation energy such as a knife 30, and includes an insertion angle as the peeling device 11 Adjust the unit and the normal direction moving mechanism. More specifically, depending on the deformation energy (degree of deformation), there is also a case where the knife operates better. &lt;Normal direction moving unit&gt; The normal direction moving unit 40 in the peeling device 1 will be described with reference to Fig. 1 (a). The stripping device 11 also includes the same normal direction moving unit 40. In the peeling device 1, the normal direction moving unit 40 includes a second moving side member 40a and a second fixed side member 4b. When the second moving-side member 4A and the second fixed-side member 40b are connected via a cross-type turning guide (not shown), the second moving-side member 4A can be driven by driving a servo motor (not shown). The second fixed side member 40b is moved in the normal direction to move the knife 3〇 connected thereto in the normal direction. As described above, the normal direction means a direction parallel to the normal line of the fixed surface 20a (see Fig. 3) of the stage 2A. Since the fixing surface 20a of the stage 2〇 in the peeling device 1 is a horizontal plane, the so-called normal direction in the peeling device (the same in the peeling device) means the vertical direction (vertical direction). The resin sheet 18b and the sheet of the support member 17b which is peeled off can be inserted into the end surface of the panel 1 of the display device with the support attached to the fixing surface 2A of the stage 2A as described above. The position of the interface of the glass substrate 12b (refer to FIG. 3) is adjusted. In the present invention, the normal direction moving unit is not particularly limited as long as it is a unit that can move the blade to a desired position in the normal direction. 146274.doc -24· 201039375 &lt;Insert Angle Adjustment Unit&gt; The peeling device 11 includes an insertion angle adjustment unit 59 including a rotation (or rotation) mechanism 50 and a stopper portion 51 as an upper and lower limit setting mechanism. The peeling device 1 does not include an insertion angle adjusting unit. The rotation mechanism 50 in the peeling device 11 will be described with reference to Figs. 2(a) and 7 . In the peeling device 11, the rotating mechanism 50 is a mechanism in which the rotating shaft 54 and the blade 300 are coupled via the bracket 52, and the rotating (or rotating) shaft 54 can be rotated at a specific angle (or rotated). The knife 300 is also rotated (or rotated) at a specific angle. Fig. 7 is a schematic cross-sectional view for explaining the above-described rotating mechanism 5'', which is a cross-sectional view of the center of the rotating shaft 54 horizontally cut from above. In Fig. 7, the three sides of the 'rectangular blade 3' are fixedly fixed to the bracket 52, and the bracket 52 is fixed to the rotating shaft 54, so that the knife 3 is rotated in the same manner by the rotation of the rotating shaft 54. The rotary shaft 54 is supported by the bracket 58 via a sliding sleeve 56 made of resin. The bracket 58 is fixed to the third moving member body 4 shown in Fig. 2(a). As shown in Fig. 2(a) and Fig. 7, the front end of the blade 300 substantially coincides with the center of the rotating shaft 54. Therefore, the knife 3 can be rotated around its front end. Further, as shown in Fig. 2(a), the peeling device 11 includes a stopper portion 51. The stopper portion 51 is coupled to the third moving member main body 4, and is movable relative to the third moving member main body 4 in the normal direction (up-and-down direction) to be fixed at a desired position. Therefore, when the fixing is performed, the stopper portion 51 moves in accordance with the movement of the third moving member main body 4 in the normal direction. The upper limit of the insertion angle (Θ) of the blade 300 or the lower limit of 146274.doc -25· 201039375 can be adjusted by the above-described stopper portion 5丨. The position of the mosquito stopper is in the lower side of the pure frame 52, whereby the force 300 is no longer rotated in the direction in which the insertion angle (9) becomes larger, so that the upper limit is not available. At this time, it is possible to rotate in the reverse direction (the direction in which θ becomes smaller). The insertion angle (Θ) is not particularly limited, but is preferably 2 to 5 degrees. &lt;fixed surface direction moving unit&gt; The fixed surface direction moving unit 42 in the peeling device i will be described with reference to Fig. 1(a). The peeling device 11 also includes the same fixed surface direction moving unit. In the peeling device 1, the fixed surface direction moving unit 42 includes the old moving side member 42a and the first fixed side member 421. [The moving side member 42a and the upper fixed side member 42b are via an intersecting turning guide rail (not shown). The connection can be made by driving a servo motor (not shown)! The moving-side member 42a moves in a direction parallel to the fixing surface of the platform 2A, that is, a direction in which the fixing surface is parallel to the fixing surface (the horizontal direction in FIG. 1(a)), and the blade attached thereto is fixed toward the fixed surface. Move in the direction of the face. Next, the blade 3 can be moved between the resin layer and the thin glass substrate. In the present invention, the fixed surface direction moving unit is not particularly limited as long as it is a unit that can move the blade to a desired position in the direction of the fixing surface. &lt;Normal direction moving mechanism&gt; The normal direction moving mechanism 44 in the peeling device 说明 will be described with reference to Fig. 2(a). In the peeling device 11, the normal direction moving mechanism 44 includes the third moving side member 44a, the third fixed side member 4, and the stopper portion 44ce. The third moving side member 44a and the third fixed side member 44b are not shown. Further, the third moving side member 44a is freely movable in the normal direction (upward direction) with respect to the third fixed side member 44b. 146274.doc -26- 201039375 Stop. The second moving-side member _connecting portion 卩 44c and the normal-direction moving unit 4〇 are relatively movable in the normal direction (up-and-down direction) with respect to the second moving-side member 40a, and are fixed at a desired position. Therefore, when the engagement is fixed, the stopper portion 44c moves in accordance with the movement in the normal direction (vertical direction) of the second moving-side member 4a. The lowermost position of the normal direction (up-and-down direction) of the blade 30 can be determined by the stopper portion 44c. The movement is determined by supporting the lower surface of the second moving member body 5. Position of 卩44e The knife 30 is no longer moving downward. Move up. In the present invention, the normal direction moving mechanism is not particularly limited as long as it is a mechanism that can move upward in the entire blade. &lt;Load weight detecting unit&gt; The load weight detecting unit in the peeling device 说明 will be described with reference to Fig. 1(a). The peeling device 11 also includes the same load weight detecting unit. The peeling device 1 includes a load weight detecting unit of the pair of blades 30, and the third component force sensor 46 is sandwiched by the third moving member body 4 and the second moving member body 5. The peeling device of the present invention preferably includes The load weight detecting unit of the above knife. Also, it is preferred to be located as close as possible to the knife. If the apparatus of the present invention includes a load weight detecting device for the blade, it is preferable to peel off the support without peeling off the support when the blade is peeled off by the blade. &lt;Sucker&gt; The peeling device 1 and 11 include a plurality of suction cups 60 that are attracted to the second main surface of the supporting glass substrate 19b in the display device panel 10 with the support. 146274.doc -27- 201039375 In the present invention, it is preferable to include the above-mentioned suction cup, and to peel off the panel 10 for a display device using the support-attached support. The suction cups included in the peeling device 1, i丨 are illustrated by the drawings. Fig. 8 is a schematic perspective view showing a part of the peeling device 丨 and 丨丨. In Fig. 8, the peeling devices 1 and 11 are substantially horizontally fixed to the fixing surface of the platform 2A with the panel 1 for the display device with the support attached thereto, and the plurality of suction cups 82 are attracted to the panel 1 for the display device with the support. The second main surface of the support glass substrate 19b (see FIG. 3) of the peeled support 17b. As shown in Fig. 8, a plurality of suction cups 82 are disposed above the platform 2A of the display device panel 10 to which the support body is attached. In the peeling devices i and 丨丨, the suction cups 82 are arranged in a grid shape on the frame 84, but in the present invention, they are not necessarily arranged at equal intervals. The frame 84 is moved downward along the guide 86 when the support is peeled off, and when the chuck 82 is in contact with the upper surface of the display device panel (7) (supporting the second main surface of the glass substrate), The descending movement is stopped by a lifting device not shown. When the size of the suction cup 82 is small, the holding force of the display device panel 10 with the support is insufficient, and the number of the suction cups 82 is increased and is wasted. In addition, when the size of the suction cup 82 is too large, the deformation of the panel 显示 for the display device which is attached to the support by the vacuum is increased, and the panel 10 for the display device with the support is provided as the case may be. The cause of the injury. From the above, the appropriate size of the suction cup 82 (for example, 0 is 25 to 80 mm, preferably 25 to 65 mm, and more preferably 4 is about 4 claws (7)) and the number is attached. The display device for the support is selected by the size and thickness of the panel 1 . 146274.doc • 28- 201039375 The suction cup 82 is coupled to the piston 89 of each of the independent cylinders 88, and the suction cup 82 is moved up and down by the expansion and contraction of the piston 89. By the lowering operation of the suction cup 82, the suction cup 82 is pressed against the display device for attaching the support, and the upper surface of the display device panel with the support is sucked by the suction cup 82, and is attached by the upward movement of the suction cup 82. The support 17b (support glass substrate 19b and resin layer 18b) in the panel 1 for display device of the support is peeled off from the display device panel 16 (refer FIG. 3). Preferably, the raising operation of the suction cup 82 is controlled in such a manner that the display panel with the support member is not lifted up by the suction cup 82 of the panel, but is displayed along with the self-supporting support. The end of the panel 1装置 of the apparatus is sequentially raised toward the center of the peeling support. Further, it is preferable to adjust the rising distance of the suction cup in accordance with the bending stress or the size allowed by the support. Further, it is preferable to use a joint structure or the like for the connection portion between the suction cup 82 and the piston 89 to support the suction cup 82 obliquely. This is because the portion of the supporting glass substrate 19b (see Fig. 3) adsorbed by the adsorption surface of the chuck 82 is gradually peeled off from one end to stabilize the peeling. Further, the suction cup may be raised in the normal direction to peel off the support, or the suction cup may be raised in an angle with respect to the normal direction. For example, as described in detail below, when the ascending operation is sequentially performed as the end portion of the display panel panel 1 of the display device is attached to the center toward the center, the chuck is tilted toward the center. When the mode is increased, the support can be peeled off more easily, which is preferable. Fig. 9 is a plan view showing the position of the upper surface of the panel 1 for supporting the display device (supporting the second main surface of the glass substrate 19b of the glass substrate 146274.doc -29-201039375) and the suction tray 82 shown in Fig. 8. Figure 10 is a block diagram showing the control system of the suction cup 82. In addition, FIG. 9 is a knife inserted in the lower right corner portion, and the suction cups closest to the corners of the plurality of suction cups 82 (42 in FIGS. 8 and 9) are referred to as suction cups 82 & adjacent thereto (top left). The two suction cups are referred to as suction cups 82b, and the two suction cups 82 adjacent thereto (upper left) are referred to as suction cups 82c, and the symbols 82d to 821 are attached thereto. As shown in Fig. 10, the suction cups 82a to 821 are independently operated (the suction cups of the same symbol operate in the same manner), and the electromagnetic valves 87a to 871 are provided for the cylinders 88a to 881 of each of the suction cups 82a to 821. Further, the opening and closing timings of the solenoid valves 87a to 87 are time-managed by the control unit (suction cup moving unit). In other words, the suction cups 82a to 821 are sequentially moved up and down at specific time intervals by the insertion of the blade 30 or the blade 3 from the portion (corner portion) having no suction force. That is, it has a time control function. Thereby, it is possible to prevent the damage of the support caused by the forced rise of the portion where the adsorption force remains. Then, it is possible to sequentially perform the ascending operation and peel off as the end portion of the panel 1B of the display device with the support from the support is peeled toward the center. Further, the cylinders 88a to 881 of the suction cups 82a to 821 are connected to the air springs 83 via the electromagnetic valves 87a to 87 and the electronically controlled regulators 85a to 85, and the electronically controlled regulators 85a to 851 are controlled by the control unit 90, respectively. . That is, by the control unit 9 〇 controlling the electronically controlled regulators 85a to 85 to gradually increase the amount of air supplied to the cylinders 88a to 881, the force of the rise of the suction cup 82 can be gradually increased. By performing the above-described force control, the damage of the glass substrate 10 with the support due to the force forcibly increasing the rise can be avoided, and the time required for the peeling can be minimized. 146274.doc • 30· 201039375 Another aspect is that the suction cup 82 is connected to the vacuum (four) via a valve 79 that is opened and closed by the control unit 9 and an electropneumatic regulator 78. The control of the air pressure of the suction (four) is performed by the regulator 78. The switch (not shown) of the touch panel or the like provided on the operation panel of the control unit % can be set to an arbitrary value by the operation of the suction plate on the rising date and the rising force. &lt;Camera&gt; In order to confirm the position of the 0 insertion knife 30 or the knife 300 on the end surface of the panel 1' of the display device with the support, the peeling device 1, 11 includes a camera 70 having an image processing device. The camera 70 or the knife 30 The position information of the knife 300 is taken as image data into the image processing device, and the image data is processed, and the image processing device determines whether it is the desired position, and feeds the result back to the normal direction moving unit. 4〇' thereby moving the knife 3〇 or the knife 3〇〇 to a desired position. In the present invention, it is preferable to include the camera having the above image processing apparatus as described above, and by image processing The position of the insertion knife on the end surface of the panel to which the support is attached is determined. The type of the camera and the image processing apparatus are not particularly limited, and those skilled in the art can be used. ' &lt; Spraying apparatus: &gt; - peeling device 1, 1 1 including spray The nozzle 73 is capable of ejecting a substance for removing electricity (water or the like) to the interface between the resin layer 18b in the peeled support i7b and the thin glass substrate 12b of the display device panel 16 (see FIG. 3). When the peeling device is peeled off, there is a case where the obtained device panel is charged with electricity. There is also a charge of 146274.doc • 31 - 201039375 which is, for example, +1 〇 kV. Therefore, if it is peeled off (four) ^ ^ ^ The above-mentioned electrification. t 赖 Μ , , , , , , 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 臬 臬 臬 臬 臬The air or other gas that is ionized by the pulse power supply device is listed. ^ As for the spraying device, it is also possible to spray the substance for removing electricity (the effect of promoting the peeling when it is empty). Even if the substance for removing electricity is sprayed In the case of the case, it is also possible to release the fruit by the same time. It is preferable to perform the charge removing action and the peeling promoting action by spraying the mixed fluid of the water and the air of the example h. In the present invention, by including the upper ^ He attached device, which can be used The display device for holding the support is peeled off by the panel 1 &. &lt;Charge control device&gt; The peeling device-U includes a charging suppression device 75 for connecting the display device panel 1G and the ground with a support by a conductor The charging of the panel 10 for the display device with the support is suppressed, that is, for grounding (refer to Fig. 3). It is preferable to 'the periphery of the opposite side (main surface) of the thin glass substrate in contact with the member for the display device'. A protective ring including a non-driven electrode film formed of a transparent electrode film and having a non-applied driving voltage is formed, and the protective ring is connected to the conductor and grounded. The right side is used for the peeling of the present invention.隹 隹 丨 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Therefore, if the sentence 扛μ, +. spider and the right side include the above-described charging suppression device, the above charging can be suppressed. 146274.doc • 32- 201039375 In the present invention, the display device for a display device including the above-described charging suppression device body is attached and detached. It is better to support the stripping device of ==, platform 2. The solid water surface is not limited to the surface of the room. For example, it may be a face parallel to the vertical direction of the fish ' or a face oblique to it. Further, not only the upper side but also the direction in which the peeling device itself of the present invention is provided is not limited. Also: by

G 將如圖1及圖2所示之剝離裝置丨及剝離裝置u中之左右與 上下調換配置而設置。 、 &lt;剝離方法（其1)&gt; 其次’利關丨⑷〜圖⑷說明使用剝離裝置以剝離方 法。 首先，錢支持體之顯示裝置用面板10中之未附有其後 被剝離之支持體之一主面密接於平台20所具有之平面狀之 固定面而進行固定（圖i⑷）。即，將附支持體之顯示裝置 〇 用面板10以附有被剝離之支持體之主面為上、與其相反的 主面為下之方式真空吸附於平台20上而進行固定。 其次，如圖1(b)所示，藉由法線方向移動單元4〇調整刀 ' 30之法線方向（上下方向）之位置。具體而言，以如下方式 調整其位置，即，藉由使伺服馬達驅動，使第2移動側構 件40a相對於第2固定側構件40b而於平台2〇之固定面之法 線方向（上下方向）上移動，可將刀30插入至被剝離之支持 體上之樹脂層18b之表面與薄板玻璃基板i2b之第1主面之 界面。 146274.doc -33- 201039375 其次，如圖⑽及® 1⑷所示，藉由固定面方向移動單 元42將刀30插入並擠入。若如上所述般將刀3〇沿固定面方 向之插入方向插入至樹脂層18b與薄板玻璃基板i2b之界 面、並將其擠入，則如圖5、圖6所說明，刀3〇及支持部Μ 會變形。作為本發明之剝離裝置之較佳實施態樣的剝離襄 置1可使刀30進行上述動作，因此可較好地將支持體與上 述顯示裝置用面板剝離。 &lt;剝離方法（其2)&gt; 其次，利用圖2(a)〜圖2(d)說明使用有剝離裝置u之剝離 方法。 首先，使附支持體之顯示裝置用面板1〇中未附有其後被 剝離之支持體之一主面密接於平台2〇所具有之平面狀之固 定面而進行固定（圖2(a))。即，將附支持體之顯示裝置用 面板10以附有剝離之支持體之主面為上、與其相反之主面 為下之方式真空吸附於平台2〇上而進行固定。 其次，如圖2(a)所示，調整刀3〇〇之插入角度。具體 而言，藉由以旋轉軸為中心進行特定角度旋轉（旋動）而將 刀300之插入角度（Θ)調整為所需之角度，並以接觸於托架 52之下面之方式載置止動部51，藉此可固定插入角度（❷）。 其次，如圖2(b)所示，藉由法線方向移動單元4〇調整刀 300之法線方向（上下方向）之位置。具體而言，以如下方式 調整位置，即，藉由使伺服馬達驅動，可使第2移動側構 件40a相對於第2固定側構件4〇b而於法線方向移動，並將 刀30插入至被剝離之支持體上之樹脂層}8b之表面與薄板 146274.doc •34· 201039375 玻璃基板12b之第1主面之界面。 其次，如圖2(c)及圖2(d)所示，藉由固定面方向移動單 兀42插入刀300並將其擠入。若如上所述般，將刀插入 至樹如層18b與薄板玻璃基板12b之界面並擠入，則刀3〇〇 以其前端部30a為中心進行特定角度旋轉（旋動），後端部 3〇c朝上方向移動，進而刀3〇〇之整體朝上方向及/或固定 面方向之插入方向移動，刀3〇〇以沿樹脂層之表面之方式 ❹ 移動並進一步被擠入（圖2(d))。作為本發明之剝離裝置之 較佳實施態樣之剝離裝置丨丨可使刀3〇〇進行上述動作，因 此可較佳地將支持體與上述顯示裝置用面板剝離。 再者，剝離裝置i、llt，於將如圖3所示之附支持體之 顯示裝置用面板10中之兩個支持體m及m剝離之情形 時，首先，例如剝離其中之一支持體丨7b，使其反轉之 後，再次固定於同一平台之固定面上或其他之本發明之剝 離裝置之平台之固定面上，剝離另一個支持體⑺，藉此 ◎可獲得顯示裝置用面板。 其次，利用圖8〜圖10說明使用有包括吸盤之剝離裝置 1、11之較佳之剝離方法。 將附支持體之顯示裳置用面板1G固定於固定平台20之固 定面上之後：使框架84下降移動，於吸盤82即將抵接於附 支持體之顯不裝置用面板10之表面之前之時序時停止其下 降移動。其次，拉伸氣缸88之活塞89，使吸盤82下降移動 而按壓抵接於附支持體之顯示裝置用面板10之表面。接 著’藉由電動氣動調節器78控制吸盤82之氣壓，花費—定 146274.doc -35· 201039375 程度之時間將吸盤82之氣壓提高至上述設定壓。藉此，全 部吸盤82吸附於附支持體之顯示裝置用面板i〇。 其次’如圖9所示，藉由刀3〇(或刀3〇〇)，將刀3〇(或刀 3〇〇)插入至附支持體之顯示裝置用面板i()n此處， 較好的是刀3〇(或刀300)插入至圖9所示之吸盤…之正下方 為止。其原因在於可更容易且較佳地進行藉由吸盤之剝 離。接著，其後，控制部9G對圖1G所示之電磁閥…進行 控制，使吸附保持圖9所示之附支持體之顯示裝置用面板 1〇之角部之吸盤82a於剝離方向（可為法線方向）上升移動， 從而將支持體17b之角部自顯示裝置用面板剝離。 其次’控制部崎㈣之電磁閱m進行打開控制，使 吸附保持圖9所示之支持體17b之緣部之吸盤㈣於剝離方 向上升移動’從而將支持體17b之緣部自顯示裝置用面板 16(參照圖3)剝離。 接著，控制部87對圖10之電磁閥87c進行打開控制，使 圖9所示之吸盤82c於剝離方向上升移動，從而使位於較支 持體m之緣部更内側之部分自顯示裝置用面板16剝離。 其後’可進行才目同之處理而將支持體㈣示裝置用面板 完全剝離。 &lt;附支持體之顯示裝置用面板&gt; 其次，說明本發明中所使用之包括附支持體之顯示裳置 用面板、支持體及薄板玻璃基板之顯示裝置用面板。 本&amp;明之製造方法中所使用之附支持體之顯示襄置用面 板，係於包含第丨主面及第2主面並於第2主面上具有顯示 146274.doc •36- 201039375 裝置用構件之薄板玻璃基板的第1主面上，密接有固定於 包含第1主面及第2主面之支持玻璃基板之第丨主面且具有 易剝離性之樹脂層。 於本發明之實施形態中，電子裝置為顯示裝置用面板， 但本發明並不限定於此。作為其他之電子裝置，可列舉太 陽电池、薄膜二次電池、表面形成有電路之半導體晶圓等 電子零件。所謂顯示裝置用面板，係包括液晶面板、有機 ❹ EL面板、電漿顯示面板、場發射面板等。尤其適用於薄型 顯不裝置用面板之製造。其優點在於在該製造步驟中可直 接利用單片式之製造裝置。 於附支持體之顯示裝置用面板中，薄板玻璃基板之厚 度、形狀、大小、物性（熱縮率、表面形狀、耐化學品性 等）、組成等並無特別限定’可與例如先前之LCD、0LED 等顯示裝置用之玻璃基板相同。 ^ w μ疋木逹υ.7 mm，更好的是 〇·4 mm以下。又，較好的是〇.〇5 mm以上，進而好的是〇.〗mm以 薄板玻璃基板之厚度較好的是未達0.7 mm， Q 〇.5 mm以下，進而好的是0.4 mm以上’更好的是〇 〇7 mm 薄板玻璃之形狀並無限定，. 薄板玻璃之大小並無限定， 100〜2000 mmxlOO〜2000 mm 1000 mm。 較好的是矩形。 ，但如矩形之情形時，可為 更好的是50〇~1〇〇〇 mmxSOO、 即使為上述厚度及大小， 亦可於本發明之製造方法中之G. The left and right sides of the peeling device 丨 and the peeling device u shown in Figs. 1 and 2 are arranged alternately. &lt;Peeling method (1)&gt; Next, the method of peeling using a peeling device will be described. First, the main surface of one of the support members for the display device panel 10, which is not attached with the substrate, is fixed to the flat fixed surface of the stage 20 (Fig. i(4)). In other words, the display device 10 with the support is vacuum-adsorbed to the stage 20 with the main surface of the support to be peeled off and the main surface opposite thereto as the lower surface. Next, as shown in Fig. 1(b), the position of the normal direction (up and down direction) of the blade '30 is adjusted by the normal direction moving unit 4'. Specifically, the position of the second moving-side member 40a is fixed to the normal direction of the fixed surface of the stage 2〇 with respect to the second fixed-side member 40b by driving the servo motor (up and down direction) When moving up, the blade 30 can be inserted into the interface between the surface of the resin layer 18b on the peeled support and the first main surface of the thin glass substrate i2b. 146274.doc -33- 201039375 Next, as shown in Figs. (10) and ® 1 (4), the blade 30 is inserted and pushed in by the fixed surface direction moving unit 42. When the blade 3 is inserted into the interface between the resin layer 18b and the thin glass substrate i2b in the insertion direction of the fixing surface as described above, and is squeezed in, as shown in FIGS. 5 and 6, the blade 3 and the support are provided. The department will be deformed. The peeling device 1 which is a preferred embodiment of the peeling device of the present invention allows the blade 30 to perform the above-described operation. Therefore, the support can be preferably peeled off from the panel for the display device. &lt;Peeling method (Part 2)&gt; Next, a peeling method using the peeling device u will be described with reference to Figs. 2(a) to 2(d). First, the main surface of one of the support members for the display device with the support member is not attached to the planar fixing surface of the platform 2, and is fixed (Fig. 2(a) ). In other words, the panel 10 for display device with the support is vacuum-adsorbed to the stage 2A with the main surface of the support having the peeling off as the upper surface and the opposite main surface thereof. Next, as shown in Fig. 2(a), the insertion angle of the blade 3 is adjusted. Specifically, the insertion angle (Θ) of the blade 300 is adjusted to a desired angle by a specific angular rotation (rotation) around the rotation axis, and is placed in contact with the lower surface of the bracket 52. The moving portion 51, whereby the insertion angle (❷) can be fixed. Next, as shown in Fig. 2(b), the position of the normal direction (up-and-down direction) of the blade 300 is adjusted by the normal direction moving unit 4'. Specifically, the position is adjusted such that the second moving-side member 40a is moved in the normal direction with respect to the second fixed-side member 4〇b by driving the servo motor, and the blade 30 is inserted. The surface of the resin layer on the peeled support}8b and the interface of the first main surface of the thin plate 146274.doc •34·201039375 glass substrate 12b. Next, as shown in Fig. 2 (c) and Fig. 2 (d), the blade 300 is inserted and pushed in by moving the single bore 42 in the direction of the fixed surface. When the knives are inserted into the interface between the tree 18b and the thin glass substrate 12b and pushed in as described above, the knives 3 are rotated at a specific angle around the front end portion 30a (rotation), and the rear end portion 3 The 〇c moves upward, and the knives 3〇〇 move in the upward direction of the upper direction and/or the direction of the fixed surface, and the knives 3 ❹ move along the surface of the resin layer and are further pushed in (Fig. 2 (d)). The peeling device which is a preferred embodiment of the peeling device of the present invention allows the blade 3 to perform the above operation, so that the support can be preferably peeled off from the panel for the display device. Further, when the peeling devices i and 11t are used to peel off the two supports m and m in the panel 10 for a display device with a support as shown in FIG. 3, first, for example, one of the supports is peeled off. 7b, after reversing it, it is fixed again on the fixing surface of the same platform or the fixing surface of the other platform of the peeling device of the present invention, and the other supporting body (7) is peeled off, whereby the panel for the display device can be obtained. Next, a preferred peeling method using the peeling devices 1, 11 including the suction cup will be described with reference to Figs. After the display panel 1G with the support is fixed to the fixing surface of the fixed platform 20, the frame 84 is moved downward, and the timing before the suction cup 82 is abutted on the surface of the display device panel 10 with the support is attached. When it stops its falling movement. Next, the piston 89 of the air cylinder 88 is stretched, and the suction cup 82 is moved downward to be pressed against the surface of the display device panel 10 with the support. Next, the air pressure of the suction cup 82 is controlled by the electro-pneumatic regulator 78, and the air pressure of the suction cup 82 is raised to the above-mentioned set pressure for a period of time of 146274.doc - 35 · 201039375. Thereby, all of the suction cups 82 are attracted to the panel for display device with the support. Next, as shown in Fig. 9, by means of a knife 3 (or a knife 3), a knife 3 (or a knife 3) is inserted into the display device panel i () n of the support, here Preferably, the knife 3 (or the knife 300) is inserted just below the suction cup shown in FIG. The reason for this is that peeling by the suction cup can be performed more easily and preferably. Then, the control unit 9G controls the electromagnetic valve (...) shown in FIG. 1G so as to adsorb and hold the suction cup 82a of the corner portion of the display panel panel 1 with the support shown in FIG. 9 in the peeling direction (may be The normal direction is moved upward, and the corner portion of the support 17b is peeled off from the display device panel. Next, the electromagnetic control m of the control unit (4) is opened, and the suction cup (4) that sucks and holds the edge of the support 17b shown in FIG. 9 is moved up and moved in the peeling direction, and the edge of the support 17b is self-display panel. 16 (refer to Fig. 3) peeling off. Next, the control unit 87 opens and controls the electromagnetic valve 87c of FIG. 10 so that the suction cup 82c shown in FIG. 9 is moved upward in the peeling direction, and the portion located further inside the edge of the support body m is self-display panel 16 Stripped. Thereafter, the processing of the support (4) device panel is completely peeled off. &lt;Panel for display device with support&gt; Next, a panel for a display device including a display panel for mounting a support, a support, and a thin glass substrate, which are used in the present invention, will be described. The display panel for a support used in the manufacturing method of the present invention includes a second main surface and a second main surface, and has a display on the second main surface. 146274.doc • 36- 201039375 On the first main surface of the thin plate glass substrate of the member, a resin layer which is fixed to the second main surface of the supporting glass substrate including the first main surface and the second main surface and which has easy peelability is adhered. In the embodiment of the present invention, the electronic device is a panel for a display device, but the present invention is not limited thereto. Examples of other electronic devices include electronic components such as solar cells, thin film secondary batteries, and semiconductor wafers on which circuits are formed. The panel for a display device includes a liquid crystal panel, an organic ❹EL panel, a plasma display panel, a field emission panel, and the like. It is especially suitable for the manufacture of panels for thin display devices. This has the advantage that a monolithic manufacturing apparatus can be utilized directly in this manufacturing step. In the panel for a display device with a support, the thickness, shape, size, physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like of the thin glass substrate are not particularly limited to, for example, the previous LCD. The glass substrate used for the display device such as 0LED is the same. ^ w μ疋木逹υ.7 mm, more preferably 〇·4 mm or less. Further, it is preferably 〇.〇5 mm or more, and further preferably 〇. 〗 〖 mm The thickness of the thin glass substrate is preferably less than 0.7 mm, Q 〇.5 mm or less, and further preferably 0.4 mm or more. 'Better, the shape of the 〇〇7 mm thin plate glass is not limited. The size of the thin plate glass is not limited, 100~2000 mmxlOO~2000 mm 1000 mm. It is preferably a rectangle. However, in the case of a rectangular shape, it may be more preferably 50 〇 to 1 〇〇〇 mm x SOO, even in the above thickness and size, in the manufacturing method of the present invention.

146274.doc -37- 201039375 分離。 薄板破璃基板之熱縮率、表㈣狀、耐化學品性等特性 亦無特別限定’根據製造之顯示裝置之種類而異。 較好的是熱縮率較小。具體而言，作為熱縮率之指標之 ^ £.^^3〇〇x10-Vc 以下，更好的是200x10-vc以下，更好的是100xm 下，進而好的是45χ1〇·7/1以下。 再者，本發明中，線膨脹係數係指Jis们1〇2(1995 規定者。 於本發明之實施形態巾’基板為薄板玻璃基板，但本發 明並不限定於此。根據工業上獲得之容易性之觀點，例示 玻璃板、㊉氧晶圓、金屬板、塑膠板等作為較佳之例。 於採用板厚較薄之玻璃板（薄板玻璃基板）作為基板之情 形時，薄板玻璃基板之組成可與例如驗性玻璃或無驗玻璃 相同。其中，自熱縮率較小之方面來看，較好的是無驗玻 璃。 於採用塑膠板作為基板之情形時，其種類並無特別限 制，例如，於透明之基板之情形時，可例示聚對苯二曱酸 乙二酯樹脂、聚碳酸酯樹脂、聚醚砜樹脂、聚萘二曱酸乙 二酯樹脂、聚丙烯酸樹脂、聚矽氧樹脂、透明氟樹脂等。 於不透明之基板之情形時，可例示聚醯亞胺樹脂、氟樹 脂、聚醯胺樹脂、芳族聚醯胺樹脂、聚醚酮樹脂、聚醚醚 酮樹脂、各種液晶聚合物樹脂等。 於採用金屬板作為基板之情形時，其種類並無特比限 146274.doc •38· 201039375 制，例如可例示不鏽剛鋼板、銅板等。 基板之耐熱性雖無特別限制，但於形成顯示裝置用構 =FT陣列（Thin Film Transist〇r _，薄膜電晶體陣列） 等之情形時’較好的是耐熱性較高。具體而言，較好的是 上述5%熱重損失溫度為剔。c以上。進而更好的是= 以上。 此時，於耐熱性之方面，上述玻璃板均適合。 根據耐熱性之觀點，作為較好之塑膠板，例示聚酿亞胺 •樹脂、氟樹脂、聚醯胺樹脂、芳族聚酿胺樹脂、聚醚· 脂、聚醚酮樹脂、聚醚醚酮樹脂、聚萘二甲酸乙二酯樹 脂、各種液晶聚合物樹脂等。 又，基板亦可為玻璃板、矽氧晶圓、金屬板、塑膠板等 不同之材質積層而成之積層體L亦可為玻璃板與塑 膠板之積層體，按塑膠板、玻璃、塑膠板之順序積層而成 之積層體，將兩片以上之玻璃板彼此積層、或兩片以上之 塑膠板彼此積層之積層體等。 附支持體之顯示裝置用面板於上述薄板玻璃基板之第2 主面上具有顯示裝置用構件。 所謂顯示裝置用構件，係指先前之LCD、〇LED等顯示 裝置用之玻璃基板於其表面上所具有之發光層、保護層、 TFT陣列（以下成為陣列）、彩色濾光片、液晶、包含ιτ〇 (Indium Tin Oxide，氧化銦錫）之透明電極等、各種電路圖 案等。上述薄板玻璃基板之第2主面上之顯示裝置用構件 之種類並無特別限定。 146274.doc -39· 201039375 顯示裝置用面板包括上述顯示裝置用構件與上述薄板玻 璃基板。 附支持體之顯示裝置用面板係於上述薄板玻璃基板之第 1主面上密接有固定有樹脂層之支持玻璃基板，作為支持 體。支持玻璃基板經由樹脂層而與薄板玻璃基板密接，以 加強薄板玻璃基板之強度。 於本發明之實施形態中，支持基板為支持玻璃基板，但 本發明並不限定於此。根據工業上獲得之容易性之觀點， 例不玻璃板、矽氧晶圓、金屬板、塑膠板等作為較佳之 例0 於採用玻璃板作為支持基板之情形時，支持玻璃基板之 厚度'形狀、大小、物性（熱縮率、表面形狀、耐化學品 性等）、組成等並無特別限定。 支持玻璃基板之厚度雖無特別限定，但必需為附支持體 之顯不裝置用面板可於現行之生產線上進行處理之厚度。 例如較好的是0.1〜1.1 mm之厚度，更好的是〇3〜〇8 mm，進而好的是〇.4〜〇.7 mm。 例如，於現行之生產線設計為處理厚度為〇5 mm之基 板’且薄板玻璃基板之厚度為0.1 mm之情形時，支持玻璃 基板之厚度與樹脂層之厚度合為0 4 mm。又，最普通的是 現行之生產線设§·)·為處理厚度為〇·7 mm之玻璃基板，例如 薄板玻璃基板之厚度為0.4 mm，則與樹脂層之厚度合計為 0.3 mm。 較好的是支持玻璃基板之厚度厚於上述薄板玻璃基板。 146274.doc •40- 201039375 支持玻璃基板之形狀雖無限定但較好的是矩形。 支持玻璃基板之大小雖無限^，但較好的是與上述薄板 玻璃基板為同程度’較好的是稍稍大於上述薄板玻璃基 .板。例如具體而言，較好的是縱方向或橫方向之各個大 0.05〜10 mm左右。其原因在於可更容易地將支持玻璃基板 自薄板玻璃基板分離。 支持玻璃基板之線膨脹係數可與上述薄板玻璃基板實質 〇 上相同，亦可不同。若實質上相同，則於提供於本發明之 製造方法時薄板玻璃基板或支持玻璃基板上不易產生翹曲 之方面較佳。 較好的是薄板玻璃基板與支持玻璃基板之線膨脹係數之 差為30〇xl〇-VC.以下，更好的是1〇〇xl〇_7rc以下進而好 的是5〇xl(T7/°c以下。 支持玻璃基板之組成可與例如鹼性玻璃或無鹼玻璃相 同。其中，自熱縮率較小之方面來看，較好的是無鹼玻 〇 璃。 於採用塑膠板作為支持基板之情形時’其種類並無特別 限制，例如例示有聚對苯二曱酸乙二酯樹脂、聚碳酸酯樹 _ 脂、聚醯亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹 ' 脂 '聚醚硬樹脂、聚醚酮樹脂、聚醚醚酮樹脂、聚萘二甲 酸乙二酯樹脂、聚丙烯酸樹脂、各種液晶聚合物樹脂、聚 矽氧樹脂等。 於採用金屬板作為支持基板之情形時，其種類並無特別 限制’例如可例示不鏽剛鋼板、銅板等。 146274.doc • 41 - 201039375 支持基板之耐熱性並無特別限制，但於形成顯示裝置用 構件之Tm車料之情料，較好的是耐熱性較高。具體 而言，較好的是上述5。/。熱重損失溫度為300t以上。進而 更好的是350。(：以上。 此時，於耐熱性之方面，上述玻璃板均適合。 作為自耐熱性之觀點來看較好之塑膠材料，例示有聚醯 亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹脂、聚醚 .颯樹脂、聚醚酮樹脂、聚醚醚酮樹脂、聚萘二甲酸乙二酯 樹脂、各種液晶聚合物樹脂等。 固定於上述支持玻璃基板之第丨主面之樹脂層雖與上述 薄板玻璃基板之第丨主面附著、密接，但可容易地剝離。 即，樹脂層相對於上述薄板玻璃基板具有易剝離性。 於本發明中所使用之附支持體之顯示裝置用面板中，認 為樹脂層與薄板玻璃基板並非藉由類似具有黏著劑之黏著 力而附著，而認為是藉由固體分子間之凡得瓦力所引起之 力、即密接力而附著。 樹脂層之厚度並無特別限定。較好的是丨〜丨⑽pm，更好 的是5〜30μϊη，進而好的是7〜2〇μιη。其原因在於若樹脂層 之厚度為此範圍，則薄板玻璃基板與樹脂層之密接變得充 分。 又其原因在於即使夾雜有氣泡或異物，亦可抑制薄板 玻璃基板之應變缺陷之產生。又，若樹脂層之厚度過厚， 則形成需要時間及材料，因此不經濟。 再者’樹脂層亦可包括兩層以上。此時，「樹脂層之厚 146274.doc -42- 201039375 度」係指全部之層之合計之厚度。 又’於樹脂層包括兩層以上之情形時，形成各層之樹脂 之種類亦可不同。 . 較好的疋，樹脂層之表面對於上述薄板玻璃基板之第1 主面的表面張力為30 mN/m以下，更好的是25 mN/m以 下，進而好的是22 mN/nmT。其眉、因在於，若為上述表 面張力，則可更容易地與薄板玻璃基板剥離，同時與薄板 玻璃基板之密接亦變得充分。 〇 又，較好的是樹脂層包括玻璃轉移點低於室溫（25。〇左 右）之材料或不具有玻璃轉移點之材料。原因在於其成為 非黏著性之樹脂層，則具有更易剝離性，可更容易地與薄 板玻璃基板剝離，同時與薄板玻璃基板之密接亦變得充 分。 又，較好的是樹脂層具有耐熱性。其原因在於，本發明 中，例如將顯示裝置用構件形成於上述薄板玻璃基板之第 Ο 2主面上之情形時，有時會將薄板玻璃基板、樹脂層及支 持玻璃基板之玻璃積層體提供至熱處理。 又，由於若樹脂層之彈性率過高，則與薄板玻璃基板之 岔接性降低，故而不佳。X，由於若彈性率過低，則易剝 離性降低，故而不佳。 形成樹脂層之樹脂之種類並無特限定。例如可列舉丙烯 酸樹脂、聚烯烴系樹脂、聚胺基甲酸酯樹脂及矽氧樹脂。 亦可混合幾種樹脂使用。上述樹脂之候群之中，較好的是 矽氧樹脂。其原因在於，矽氧樹脂之耐熱性優異且對於薄 146274.doc •43- 201039375 板玻璃基板之易剝離性之程度較佳。又，其原因在於，藉 由與支持玻璃基板之第1主面之矽烷醇基之縮合反應 易固定於支持玻璃基板。矽氧樹脂層於即使於例2 300〜400°C左右進行丨小時左右處理而易剝離性亦無絲毫劣 化之方面較佳。 又，矽氧樹脂之中，較好的是樹脂層包括剝離紙用矽 氧，較好的是其硬化物。剝離紙用矽氧係以分子内包含直 鏈狀之二甲基聚矽氧烷之矽氧為主劑者。利用觸媒、光聚 合起始劑等使包含上述主劑與交聯劑之組成物於上述支持 玻璃基板之表面（第1主面）硬化而形成之樹脂層具有優異之 易剝離性，因而較佳。又，由於柔軟性較高，故而即使氣 泡或灰塵等異物混入至薄板玻璃基板與樹脂層之間，亦可 抑制薄板玻璃基板之應變缺陷之產生。 上述剝離紙用矽氧根據其硬化機構而分類為縮合反應型 矽氧、加成反應型矽氧、紫外線硬化型矽氧及電子線硬化 型石夕氧’且均可使用。該等中較好的是加成反應型石夕氧。 其原因在於硬化反應之容易度、形成樹脂層時易剝離性之 程度良好、且耐熱性亦較高。 又，剝離紙用矽氧根據形態分為溶劑型'乳膠型及無溶 劑型’均可使用。料中較好的是無溶劑型。纟房、因在於 生產性、安全性'環境特性之方面優異。又其原因在 於’由於在形成樹脂層時之硬化時，即加熱硬化、紫外線 硬化或電子線硬化時，+包含產生發泡之溶劑，故而樹脂 層中不易殘留氣泡。 146274.doc 201039375 又，作為剝離紙用矽氧，具體而言，作為一般市場出售 之商品或型號，可列舉KNS_320A、KS_847(均為阳❿叩 Silicone公司製造）、tpr67〇〇(ge T〇shiba Silic〇ne公司製 造）、乙烯基矽氧（vinyl Silic〇ne) r 85〇〇」（荒川化學工業 股份有限公司製造）與甲基氫化聚矽氧烷「12〇31」（荒川化 學工業股份有限公司製造）之組合、乙烯基矽氧「11364」 (荒川化學工業股份有限公司製造）與曱基氫化聚矽氧烷 ❹ 1203 1」（爪川化學工業股份有限公司製造）之組合、乙晞 基矽氧「11365」（荒川化學工業股份有限公司製造）與甲基 氫化聚矽氧烷「12031」（荒川化學工業股份有限公司製造） 之組合等。再者，KNS_32〇A、〖8_847及TpR67〇〇係預先 含有主劑與交聯劑之矽氧。 又，較好的是形成樹脂層之矽氧樹脂具有矽氧樹脂中之 成分難以移行至薄板玻璃基板之性質，即低矽氧移行性。 如上所述’於使用矽氧樹脂層作為樹脂層之情形時，可 〇 較好地對被剝離之包含上述支持玻璃基板及上述矽氧樹脂 層之支持體進行再利用。於上述剝離後之支持體中之矽氧 樹脂具有低矽氧移行性之情形時，該矽氧樹脂層有具有較 鬲之殘留接著率之傾向。因此’可無問題地進行再利用。 其次’利用圖式說明附支持體之顯示裝置用面板。 圖11係表示本發明之附支持體之顯示裝置用面板之一態 樣之概略剖面圖。 圖11中’附支持體之顯示裝置用面板110包含顯示裝置 用構件114、薄板玻璃基板112、樹脂層118及支持玻璃基 146274.doc •45- 201039375 板119’並積層該等。又，顯示裝置用面板116包含層狀之 顯示裝置用構件114及薄板玻璃基板112，支持體Η?包含 樹脂層118及支持玻璃基板119。又，顯示裝置用構件U4 形成於薄板玻璃基板112之第2主面上。 接著，薄板玻璃基板112之第1主面、與固定於支持玻璃 基板119之第1主面之樹脂層118之表面密接並附著，形成 附支持體之顯示裝置用面板11 〇。 圊11中所示之態樣之附支持體之顯示裝置用面板u〇 中，薄板玻璃基板112、樹脂層118、及支持玻璃基板119 為相同之大小。 圖1 2係表示附支持體之顯示裝置用面板之另一態樣之概 略正視圖’圖13為其A-A'剖面圖（概略剖面圖）。 圖12及圖13中’附支持體之顯示裝置用面板12〇包含顯 示裝置用構件124、薄板玻璃基板122、樹脂層128及支持 玻璃基板129’並積層該等。又，顯示裝置用面板丨26包含 層狀之顯示裝置用構件124及薄板玻璃基板122，支持體 127包含樹脂層128及支持玻璃基板129。又，顯示裝置用 構件124形成於薄板玻璃基板122之第2主面上。 接著，薄板玻璃基板122之第1主面、與固定於支持玻璃 基板129之第1主面之樹脂層128密接並附著，從而形成附 支持體之顯示裝置用面板120。 圖12及圖13所示之態樣之附支持體之顯示裝置用面板 120中’與薄板玻璃基板122相比，支持玻璃基板129之主 面面積較大。 146274.doc •46- 201039375 又，圖12及圖13所示之態樣之附支持體之顯示裴置用面 板120中，與樹脂層128之表面（與薄板玻璃基板122相接之 面）之面積（以下亦稱為樹脂層中之「表面面積」）相比，薄 板玻璃基板122之第1主面之面積較大。樹脂層128之表面 面積比薄板玻璃基板122之第1主面之面積小相當於形成間 隙部125之部分。接著，薄板玻璃基板122之第丨主面中未 與樹脂層128相接之部分α、及與其對向之支持玻璃基板 129之一部分β形成與本發明之附支持體之顯示裝置用面板 120之端面（γι、連接之間隙部125。 若形成有上述間隙部125，則於本發明之製造方法中之 剝離步驟中，可更容易地將薄板玻璃基板丨22與樹脂層i 28 剝離，因而較佳。 圖12、圖13中所示之α較好的是〇丨〜5 〇 mm，更好的是 2.5 mm左右。 又，如圖14中所示之概略剖面圖，附支持體之顯示裝置 用面板亦可為藉由薄板玻璃基板〇 32a、132b)、樹脂層 (138a、138b)與支持玻璃基板（139a、139b)之積層體夹持 顯示裝置用構件13 4之兩主面之態樣。此時，顯示裝置用 面板136包含層狀之顯示裝置用構件134及兩側之薄板玻璃 基板132a、132b，支持體137a及137b分別包含樹脂層 138a、138b及支持玻璃基板139a、139b。上述態樣之附支 持體之顯示裝置用面板亦可用於本發明。 其次’說明可用於本發明之附支持體之顯示裝置用面板 之製造方法。 146274.doc •47· 201039375 薄板玻璃基板及支持玻璃基板之製造方法並無特別限 定。例如可藉由先前公知之方法製造。例如可將先前公知 之玻璃原料熔解而成為熔融玻璃之後，藉由浮式法、溶合 法、下拉法、流孔下引法、再拉法等成形為板狀而獲得。 於如上所述般製造之支持玻璃基板之表面（第1主面）上 形成樹脂層之方法亦無特別限定。 可列舉例如將薄膜接著於支持玻璃基板之表面之方法。 具體而言’可列舉為了對薄膜之表面賦予較高之接著力而 進行表面改質之處理並接著於支持玻璃基板之第1主面之 方法。作為表面改質之處理方法，可例示如石夕燒偶合劑之 化學性地提高密接力之化學性方法、如火焰（flame)處理般 增加表面活性基之物理性方法、如噴砂處理般藉由增加表 面之粗糙度而增加勾掛性之機械性之方法等。 又，可列舉藉由例如公知之方法將作為樹脂層之樹脂組 成物塗佈於支持玻璃基板之第丨主面上之方法。作為公知 之方法，可列舉喷塗法、模塗法、旋塗法、浸塗法、輥塗 法、棒塗法、絲網印刷法、凹版塗佈法。可根據樹脂組成 物之種類自上述方法中適當選擇。 例如，於使用無溶劑型之剝離紙用矽氧作為樹脂組成物 之情形時，較好的是模塗法、旋塗法或絲網印刷法。 再者，於製造圖12、13所說明之包括間隙部之附支持體 之顯不裝置用面板之情形時，較好的是預先對形成間隙部 之部位進行遮蔽，再於其上塗佈樹脂組成物。所謂遮蔽， 係指如下方法，即，於塗佈樹脂組成物時，預先於形成間 146274.doc -48- 201039375 隙部之部位貼附可再剝離之薄膜等而防止樹脂組成物塗佈 於该部位’之後剝離該薄膜。 又’於將樹脂組成物塗佈於支持玻璃基板之第！主面上 月形夺其塗佈里較好的是卜⑽§/瓜2，更好的是$〜 g/m。 又，作為其他方法，於例如由加成反應型梦氧形成樹脂 曰之情形時，藉由上述喷塗法等公知之方法，將包括於分 〇 +内含有直鏈狀之二甲基聚砂氧烧之⑦氧（主劑）、交聯劑 及觸媒之樹脂組成物塗佈於支持玻璃基板上，其後使盆加 熱硬化。加熱硬化條件根據觸媒之調配量而異，例如於相 對於主劑及交聯劑之合計量1GGf量份而調配2質量份之白 金系觸媒之情形時，於大氣中以5(rc〜25(rc '較好的是以 c 200 C進仃反應。又，此時之反應時間為5〜分 鐘，較好的是1〇〜30分鐘。為了形成具有低石夕氧移行性之 矽氧樹脂層’較好的是以於石夕氧樹脂層中不殘留未反應之 〇 #氧成分之方式，儘可能地進行硬化反應，若為上述反應 溫度及反應時間，則可使石夕氧樹脂層中不會殘留未反應之 氧成刀®而較佳。於與上述反應時間相比反應時間過 長之情形或反應溫度過高之情形時，同時引起石夕氧樹脂之 $化分解而生成低分子量之♦氧成分，因此梦氧移行性可 月b會變南。以石夕氧樹脂層中不殘留未反應之石夕氧成分之方 、儘可月b地進行硬化反應，於用於使加熱處理後之剝離性 良好方面亦較佳。 於藉由上述方法將樹脂層形成於支持玻璃基板之第1主 146274.doc -49- 201039375 面上之後，將薄板玻璃基板層積於樹脂層之表面。 於使用剝離紙时氧製造樹脂層之情形時，將塗佈於支 持玻璃基板上之騎紙时氧加熱魏㈣❹氧樹脂層 之後’使薄板玻璃基板積層於支持玻璃基板之矽氧樹脂形 成面。藉由使剝離紙用石夕氧加熱硬化，石夕氧樹脂硬化物與 支持玻璃化學性地結合。又，藉^㈣效應，錢樹脂層 與支持玻璃結合。藉由該等作用，錢樹脂層牢固地固定 於支持玻璃基板。 薄板玻璃基板與樹脂層係藉由非常接近之相對之固體分 子間之凡得瓦力所引起之力、即密接力而與樹脂層密接。 此時，可保持為使支持玻璃基板與薄板玻璃基板積層之狀 態。 使薄板玻璃基板積層於固定於支持玻璃基板之樹脂層之 表面之方法並無特別限定。可使用例如公知之方法實施。 例如，可列舉於常壓環境下將薄板玻璃基板疊合於樹脂層 之表面之後，利用輥或壓機使樹脂層與薄板玻璃基板壓接 之方法。藉由利用輥或壓機進行壓接，樹脂層與薄板玻璃 基板進一步密接，因而較佳。又，藉由利用輥或壓機之壓 接，樹脂層與薄板玻璃基板之間所混入之氣泡得以容易地 除去’因而較佳。 务藉由真空層壓法或真空加壓法進行壓接，則可更好地 抑制氣泡之混入或確保良好之密接，因而較佳。其亦存在 下優點’即，藉由於真空下進行壓接，即使於殘存微少 之氣泡之情形時亦不會由於加熱而使氣泡成長，不易與薄 146274.d〇c -50- 201039375 板玻璃基板之應變缺陷相聯繫。 較好的是，於使薄板玻璃基板積層於支持玻璃基板之樹 脂層之表面時，充分地清洗薄板玻璃基板之表面，於潔淨 度較咼之環境下進行積層。其原因在於，雖然即使存在異 物，亦不會因樹脂層變形而對薄板玻璃基板之表面之平坦 I&quot;生產生影響，而潔淨度越高，其平坦性越好。146274.doc -37- 201039375 Separation. The heat shrinkage ratio, the surface (four) shape, and the chemical resistance of the thin glass substrate are also not particularly limited, and vary depending on the type of display device to be manufactured. It is preferred that the heat shrinkage rate is small. Specifically, as an index of heat shrinkage rate, ^ £.^^3〇〇x10-Vc or less, more preferably 200x10-vc or less, more preferably 100xm, and further preferably 45χ1〇·7/1 the following. Further, in the present invention, the coefficient of linear expansion refers to Jiss 1〇2 (1995). In the embodiment of the present invention, the substrate is a thin glass substrate, but the present invention is not limited thereto. From the viewpoint of easiness, a glass plate, a ten oxygen wafer, a metal plate, a plastic plate, or the like is exemplified as a preferred example. When a thin glass plate (thin plate glass substrate) is used as a substrate, the composition of the thin glass substrate For example, in the case of a small heat-shrinkage ratio, it is preferred that there is no glass. In the case of using a plastic plate as a substrate, the kind thereof is not particularly limited. For example, in the case of a transparent substrate, polyethylene terephthalate resin, polycarbonate resin, polyether sulfone resin, polyethylene naphthalate resin, polyacrylic resin, polyfluorene oxide can be exemplified. Resin, transparent fluororesin, etc. In the case of an opaque substrate, a polyimide resin, a fluororesin, a polyamide resin, an aromatic polyamide resin, a polyether ketone resin, a polyether ether ketone resin, and various liquid Crystalline polymer resin, etc. When a metal plate is used as the substrate, the type of the substrate is not limited to 146274.doc •38·201039375. For example, stainless steel plates, copper plates, etc. can be exemplified. However, when forming a display device structure = FT array (Thin Film Transist _, thin film transistor array) or the like, it is preferable that heat resistance is high. Specifically, the above 5% is preferable. The thermogravimetric loss temperature is more than or equal to c. More preferably, it is more than or equal to. In this case, the above-mentioned glass sheets are suitable in terms of heat resistance. From the viewpoint of heat resistance, as a better plastic sheet, an example of a polystyrene is shown. Amine resin, fluororesin, polyamide resin, aromatic polyamine resin, polyether grease, polyether ketone resin, polyether ether ketone resin, polyethylene naphthalate resin, various liquid crystal polymer resins, etc. Further, the substrate may be a laminate of different materials such as a glass plate, a silicon oxide wafer, a metal plate or a plastic plate, or a laminate of a glass plate and a plastic plate, and may be a plastic plate, glass or plastic. The order of the boards is laminated The laminated body is a laminated body in which two or more glass sheets are laminated to each other or two or more plastic sheets are laminated on each other. The display device panel with a support has a display device on the second main surface of the thin glass substrate. The member for a display device refers to a light-emitting layer, a protective layer, a TFT array (hereinafter referred to as an array), a color filter, and a liquid crystal which are provided on a surface of a glass substrate for a display device such as an LCD or a 〇LED. The transparent electrode including ITO (Indium Tin Oxide), various circuit patterns, etc. The type of the member for the display device on the second main surface of the thin glass substrate is not particularly limited. 146274.doc -39 The 201039375 display device panel includes the above-described display device member and the above-described thin glass substrate. The panel for a display device with a support is a support glass substrate to which a resin layer is fixed to the first main surface of the thin glass substrate as a support. The glass substrate is supported to adhere to the thin glass substrate via the resin layer to enhance the strength of the thin glass substrate. In the embodiment of the present invention, the support substrate is a supporting glass substrate, but the present invention is not limited thereto. From the viewpoint of the ease of industrial availability, for example, glass plates, silicon oxide wafers, metal plates, plastic plates, and the like are preferable. When the glass plate is used as the support substrate, the thickness of the glass substrate is supported. The size, physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like are not particularly limited. The thickness of the supporting glass substrate is not particularly limited, but it is necessary to use a thickness of the panel for the display device with the support which can be processed on the current production line. For example, it is preferably a thickness of 0.1 to 1.1 mm, more preferably 〇3 to 〇8 mm, and further preferably 〇.4 to 〇.7 mm. For example, when the current production line is designed to handle a substrate having a thickness of 〇5 mm and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the thickness of the resin layer are combined to be 0.4 mm. Further, the most common one is the current production line §·)· For processing a glass substrate having a thickness of 〇·7 mm, for example, the thickness of the thin glass substrate is 0.4 mm, and the total thickness of the resin layer is 0.3 mm. It is preferred that the thickness of the supporting glass substrate is thicker than the above-mentioned thin glass substrate. 146274.doc •40- 201039375 The shape of the supporting glass substrate is not limited, but is preferably rectangular. Although the size of the supporting glass substrate is infinite, it is preferably the same level as the above-mentioned thin glass substrate. It is preferably slightly larger than the above-mentioned thin glass substrate. For example, it is preferable that each of the longitudinal direction or the lateral direction is about 0.05 to 10 mm. The reason for this is that the support glass substrate can be more easily separated from the thin glass substrate. The linear expansion coefficient of the supporting glass substrate may be the same as or different from that of the above-mentioned thin glass substrate. If they are substantially the same, it is preferable in that it is less likely to cause warpage on the thin glass substrate or the supporting glass substrate when provided in the production method of the present invention. Preferably, the difference between the linear expansion coefficients of the thin glass substrate and the supporting glass substrate is 30 〇 xl 〇 -VC. or less, more preferably 1 〇〇 x 〇 _ 7 rc or less and further preferably 5 〇 x 1 (T7 / ° The composition of the supporting glass substrate may be the same as, for example, alkaline glass or alkali-free glass. Among them, from the viewpoint of a small heat shrinkage ratio, an alkali-free glass glaze is preferred. In the case of the case, the type thereof is not particularly limited, and examples thereof include polyethylene terephthalate resin, polycarbonate resin, polyimine resin, fluororesin, polyamide resin, and aromatic polyfluorene. Amine tree 'fat' polyether hard resin, polyether ketone resin, polyether ether ketone resin, polyethylene naphthalate resin, polyacrylic resin, various liquid crystal polymer resins, polyoxyn resin, etc. In the case of the support substrate, the type thereof is not particularly limited. For example, a stainless steel plate or a copper plate can be exemplified. 146274.doc • 41 - 201039375 The heat resistance of the support substrate is not particularly limited, but is formed into a member for a display device. Tm car material situation, it is better The heat resistance is high. Specifically, the above-mentioned weight loss temperature is 300 t or more, and more preferably 350. (: above. At this time, in terms of heat resistance, the above glass plates are all Suitable as a plastic material which is preferable from the viewpoint of heat resistance, examples thereof include a polyimide resin, a fluororesin, a polyamide resin, an aromatic polyamide resin, a polyether resin, a polyether ketone resin, a polyetheretherketone resin, a polyethylene naphthalate resin, various liquid crystal polymer resins, etc. The resin layer fixed to the first major surface of the supporting glass substrate is adhered to and adhered to the first major surface of the thin glass substrate. That is, the resin layer is easily peelable with respect to the above-mentioned thin glass substrate. In the panel for a display device with a support used in the present invention, it is considered that the resin layer and the thin glass substrate are not similar. It adheres to the adhesive force of the adhesive, and is considered to be adhered by the force caused by the van der Waals force between the solid molecules, that is, the adhesion. The thickness of the resin layer is not particularly limited. Preferably, 丨~丨The reason of pm is more preferably 5 to 30 μm, and further preferably 7 to 2 μm. The reason is that if the thickness of the resin layer is in this range, the adhesion between the thin glass substrate and the resin layer becomes sufficient. It is also possible to suppress the occurrence of strain defects in the thin glass substrate by inclusion of air bubbles or foreign matter. Further, if the thickness of the resin layer is too thick, it takes time and material to form, which is uneconomical. Further, the resin layer may include two or more layers. At this time, the "thickness of the resin layer 146274.doc -42 - 201039375 degree" means the total thickness of all the layers. Further, when the resin layer includes two or more layers, the types of the resins forming the respective layers may be different. Preferably, the surface of the resin layer has a surface tension of 30 mN/m or less, more preferably 25 mN/m or less, and more preferably 22 mN/nmT with respect to the first main surface of the thin glass substrate. The eyebrows are such that the surface tension is more easily peeled off from the thin glass substrate, and the adhesion to the thin glass substrate is also sufficient. Further, it is preferred that the resin layer include a material having a glass transition point lower than room temperature (25 〇 left) or a material having no glass transition point. The reason is that it becomes a non-adhesive resin layer, which is more easily peelable, can be more easily peeled off from the thin glass substrate, and is also sufficiently adhered to the thin glass substrate. Further, it is preferred that the resin layer has heat resistance. The reason for this is that, in the case where the member for a display device is formed on the second main surface of the thin glass substrate, for example, a thin glass substrate, a resin layer, and a glass laminate supporting the glass substrate may be provided. To heat treatment. Further, if the elastic modulus of the resin layer is too high, the adhesion to the thin glass substrate is lowered, which is not preferable. X, since the peeling property is lowered if the modulus of elasticity is too low, it is not preferable. The kind of the resin forming the resin layer is not particularly limited. For example, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin can be mentioned. It can also be mixed with several resins. Among the above resin groups, a silicone resin is preferred. The reason for this is that the heat resistance of the silicone resin is excellent and the degree of easy peelability of the glass substrate of the thin 146274.doc • 43-201039375 is preferable. Further, this is because the condensation reaction with the sterol group on the first main surface of the supporting glass substrate is easily fixed to the supporting glass substrate. The epoxy resin layer is preferably not deteriorated even if it is treated at about 300 to 400 ° C for about 2,000 hours. Further, among the silicone resins, it is preferred that the resin layer comprises helium oxygen for the release paper, preferably a cured product. The deuterated paper is mainly composed of a ruthenium oxygen containing a linear dimethyl polyoxyalkylene in the molecule. The resin layer formed by curing the composition containing the main component and the crosslinking agent on the surface (first main surface) of the supporting glass substrate by using a catalyst, a photopolymerization initiator or the like has excellent peelability, and thus good. Further, since the flexibility is high, even if foreign matter such as bubbles or dust is mixed between the thin glass substrate and the resin layer, the occurrence of strain defects in the thin glass substrate can be suppressed. The above-mentioned release paper is classified into a condensation reaction type oxime, an addition reaction type oxime, an ultraviolet ray type oxime, and an electron beam curing type shihedo according to the curing mechanism. Preferred among these are the addition reaction type Shihe oxygen. The reason for this is that the ease of the curing reaction is good, the degree of easy peelability when forming the resin layer is good, and the heat resistance is also high. Further, the release paper is classified into a solvent type 'latex type and no solvent type' depending on the form. Preferred in the material is a solventless type. The mortuary is excellent in terms of productivity and safety. Further, the reason is that when the resin layer is cured, i.e., heat hardening, ultraviolet curing, or electron beam hardening, + contains a solvent which causes foaming, so that bubbles are less likely to remain in the resin layer. 146274.doc 201039375 In addition, as a product or model sold in the general market, KNS_320A and KS_847 (both manufactured by Yangshuo Silicone Co., Ltd.) and tpr67〇〇 (ge T〇shiba) Made by Silic〇ne, vinyl silic 〇ne r 85〇〇” (made by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene “12〇31” (Arakawa Chemical Industry Co., Ltd.) Combination of the company's manufacture, a combination of vinyl oxime "11364" (manufactured by Arakawa Chemical Industries Co., Ltd.) and sulfhydryl hydrogenated polyoxaxane 1203 1" (manufactured by Kugawa Chemical Industry Co., Ltd.) A combination of "11365" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.). Further, KNS_32〇A, -8_847 and TpR67 预先 previously contained ruthenium oxygen of the main component and the crosslinking agent. Further, it is preferred that the epoxy resin forming the resin layer has a property that the components in the epoxy resin are difficult to migrate to the thin glass substrate, i.e., low oxygen permeability. As described above, when the epoxy resin layer is used as the resin layer, the support containing the above-mentioned supporting glass substrate and the above-mentioned silicone resin layer can be preferably reused. In the case where the oxime resin in the support after the above peeling has a low oxymethylene transition property, the oxime resin layer tends to have a residual residual adhesion ratio. Therefore, it can be reused without problems. Next, the panel for the display device with the support will be described with reference to the drawings. Fig. 11 is a schematic cross-sectional view showing a state of a panel for a display device with a support according to the present invention. The display device panel 110 with the support shown in Fig. 11 includes a display device member 114, a thin plate glass substrate 112, a resin layer 118, and a supporting glass substrate 146274.doc • 45 - 201039375 plate 119' and laminated. Further, the display device panel 116 includes a layered display device member 114 and a thin glass substrate 112, and the support member includes a resin layer 118 and a supporting glass substrate 119. Further, the display device member U4 is formed on the second main surface of the thin glass substrate 112. Then, the first main surface of the thin glass substrate 112 is adhered to and adhered to the surface of the resin layer 118 fixed to the first main surface of the supporting glass substrate 119, and the panel 11 for display device with the support is formed. In the panel for display device with a support as shown in Fig. 11, the thin glass substrate 112, the resin layer 118, and the supporting glass substrate 119 are the same size. Fig. 1 is a schematic front view showing another aspect of the panel for a display device with a support. Fig. 13 is a cross-sectional view (a schematic cross-sectional view) thereof taken along line A-A'. In the display device panel 12A with the support shown in Fig. 12 and Fig. 13, the display device member 124, the thin glass substrate 122, the resin layer 128, and the supporting glass substrate 129' are laminated. Further, the display panel panel 26 includes a layered display device member 124 and a thin glass substrate 122, and the support 127 includes a resin layer 128 and a supporting glass substrate 129. Further, the display device member 124 is formed on the second main surface of the thin glass substrate 122. Then, the first main surface of the thin glass substrate 122 is adhered to and adhered to the resin layer 128 fixed to the first main surface of the supporting glass substrate 129, thereby forming the display device panel 120 with the support. In the panel 120 for a display device with a support shown in Fig. 12 and Fig. 13, the main surface area of the support glass substrate 129 is larger than that of the thin glass substrate 122. 146274.doc •46- 201039375 Further, in the display panel 120 with the support shown in FIGS. 12 and 13, the surface of the resin layer 128 (the surface in contact with the thin glass substrate 122) is The area of the first main surface of the thin glass substrate 122 is larger than the area (hereinafter also referred to as "surface area" in the resin layer). The surface area of the resin layer 128 is smaller than the area of the first main surface of the thin glass substrate 122, which corresponds to the portion where the gap portion 125 is formed. Then, a portion α of the second main surface of the thin glass substrate 122 that is not in contact with the resin layer 128 and a portion β of the supporting glass substrate 129 that is opposite thereto are formed with the panel 120 for the display device with the support of the present invention. The end surface (γ1, the gap portion 125 to be joined. When the gap portion 125 is formed, in the peeling step in the manufacturing method of the present invention, the thin glass substrate 22 and the resin layer i 28 can be more easily peeled off, thereby Preferably, the α shown in Fig. 12 and Fig. 13 is preferably 〇丨~5 〇mm, more preferably about 2.5 mm. Further, a schematic sectional view as shown in Fig. 14, a display device with a support The panel may be such that the two main faces of the display device member 13 4 are sandwiched by the laminated body of the thin glass substrate 〇 32a, 132b), the resin layer (138a, 138b), and the supporting glass substrate (139a, 139b). . At this time, the display device panel 136 includes the layered display device member 134 and the thin plate glass substrates 132a and 132b on both sides, and the support members 137a and 137b include the resin layers 138a and 138b and the supporting glass substrates 139a and 139b, respectively. The panel for a display device with the above-mentioned support can also be used in the present invention. Next, a method of manufacturing a panel for a display device which can be used in the support of the present invention will be described. 146274.doc •47· 201039375 The manufacturing method of the thin glass substrate and the supporting glass substrate is not particularly limited. For example, it can be produced by a previously known method. For example, a previously known glass raw material can be melted into molten glass, and then obtained by forming into a plate shape by a float method, a fusion method, a down-draw method, a flow-down method, a re-drawing method, or the like. The method of forming the resin layer on the surface (first main surface) of the supporting glass substrate produced as described above is also not particularly limited. For example, a method of adhering a film to a surface of a supporting glass substrate can be mentioned. Specifically, a method of performing surface modification for imparting a high adhesion to the surface of the film and then adhering to the first main surface of the supporting glass substrate can be cited. As a treatment method for the surface modification, a chemical method such as chemically improving the adhesion of the sulphur coupling agent, a physical method of increasing the surface active group such as a flame treatment, and the like by sandblasting can be exemplified. A method of increasing the roughness of the surface and increasing the mechanical properties of the hooking property. Further, a method of applying a resin composition as a resin layer to the first major surface of the supporting glass substrate by a known method can be mentioned. As a known method, a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, and a gravure coating method can be mentioned. It can be appropriately selected from the above methods depending on the kind of the resin composition. For example, when a solventless type release paper is used as the resin composition, it is preferably a die coating method, a spin coating method or a screen printing method. Further, in the case of manufacturing the panel for the display device including the support member having the gap portion described in Figs. 12 and 13, it is preferable to mask the portion where the gap portion is formed in advance, and then apply the resin thereon. Composition. The term "shading" refers to a method of applying a re-peelable film or the like to a portion where a gap portion is formed between 146274.doc -48 - 201039375 in advance when the resin composition is applied, thereby preventing application of the resin composition to the resin composition. The film is peeled off after the portion. In addition, the resin composition is applied to the support glass substrate! On the main surface, it is better to use the moon (10) §/ melon 2, and more preferably $~g/m. Further, as another method, when a resin ruthenium is formed by, for example, an addition reaction type dream oxygen, a linear dimethyl condensate is included in the bifurcation + by a known method such as the above-described spraying method. The resin composition of the oxygen-burning 7-oxygen (main agent), the crosslinking agent, and the catalyst is applied onto the supporting glass substrate, and then the pot is heat-hardened. The heat-hardening condition varies depending on the amount of the catalyst to be mixed. For example, when 2 parts by mass of the platinum-based catalyst is blended with respect to the total amount of the main agent and the crosslinking agent, the amount of the platinum-based catalyst is 5 (rc~) in the atmosphere. 25 (rc ' is preferably a reaction of c 200 C. Further, the reaction time at this time is 5 to minutes, preferably 1 to 30 minutes. In order to form a helium oxygen having a low Oxygen oxygen migration property. The resin layer is preferably a hardening reaction as much as possible in such a manner that no unreacted 〇# oxygen component remains in the oleoresin layer, and if it is the above reaction temperature and reaction time, the cerium oxide resin can be used. It is preferred that no unreacted oxygen is formed in the layer, and when the reaction time is too long or the reaction temperature is too high compared with the above reaction time, the decomposition of the cerium oxide resin is simultaneously generated. Low-molecular-weight ♦ oxygen component, so the dream oxygen migration property can be changed to the south of the month b. The unreacted shihe oxygen component does not remain in the shixi oxygen resin layer, and the hardening reaction can be performed as long as possible. It is also preferable in terms of good peelability after heat treatment. After the resin layer is formed on the surface of the first main 146274.doc -49 - 201039375 supporting the glass substrate, the thin glass substrate is laminated on the surface of the resin layer. When the resin layer is formed by oxygen when the release paper is used, After heating the Wei (tetra) oxime resin layer by oxygen coating on the supporting glass substrate, 'the thin glass substrate is laminated on the surface of the support resin glass substrate. The steel is heat-hardened by the heat of the stone. The oxy-resin hardened material is chemically bonded to the supporting glass. Further, by the effect of the (four) effect, the money resin layer is combined with the supporting glass. By these actions, the money resin layer is firmly fixed to the supporting glass substrate. The thin glass substrate and the resin The layer is in close contact with the resin layer by a force close to the relative van der Waals force, that is, the adhesion force. In this case, the state in which the supporting glass substrate and the thin glass substrate are laminated can be maintained. The method of laminating the thin glass substrate on the surface of the resin layer fixed to the supporting glass substrate is not particularly limited, and can be carried out, for example, by a known method. A method of laminating a resin layer and a thin glass substrate by a roll or a press after laminating a thin glass substrate on a surface of a resin layer in a normal pressure environment. The resin layer is bonded by a roll or a press. It is preferable that the thin glass substrate is further adhered to each other. Further, by the pressure bonding by the roll or the press, the air bubbles mixed between the resin layer and the thin glass substrate can be easily removed, and thus it is preferable to perform vacuum lamination. By crimping by vacuum or pressure, it is better to suppress the incorporation of air bubbles or to ensure good adhesion. It also has the advantage that it is even if there is little residual by vacuum bonding. In the case of bubbles, the bubbles do not grow due to heating, and are not easily associated with the strain defects of the thin 146274.d〇c -50- 201039375 plate glass substrate. Preferably, when the thin glass substrate is laminated on the surface of the resin layer supporting the glass substrate, the surface of the thin glass substrate is sufficiently cleaned, and the layer is laminated in a clean environment. The reason for this is that even if foreign matter is present, the flatness of the surface of the thin glass substrate is not affected by the deformation of the resin layer, and the higher the cleanliness, the better the flatness.

如上所述般獲得將薄板玻璃基板、樹脂層與支持玻璃基 板積層而成之玻璃積層體（以下亦稱為「薄板玻璃積層 體」）之後，於該薄板玻璃積層體之薄板玻璃基板之第2主 面上形成顯示裝置用構件。 較好的是，於正在形成顯示裝置用構件之過程中，視需 要而研磨薄板玻璃基板之第2主面，藉此提高其平坦度。 顯示裝置用構件並無特別限定。可列舉例如包括lcd之 陣列或彩色渡光片。又，可列舉例如包括〇led之透明電 極、電洞注入層、電洞輸送層、發光層、及電子輸送層。 形成上述顯示襄置構件之方法亦無特別限^，可與先前 公知之方法相同。 例如裝造LCD作為顯示裝置之情形時，可與先前公知之 於玻璃基板上形成陣列之步驟、形成彩色滤光片之步驟、 使形成有陣列之玻璃基板與形成有彩色濾光片之玻璃基板 占口之乂驟（陣列.彩色遽光片貼合步驟）等各種步驟相 5更-體1¾。’作為藉由該等步驟實施之處理，可列舉 例如純水清洗、乾燥、成膜、光阻塗佈、曝光、顯影、触 J及光阻除去。進而’作為於實施陣列側基板•彩色據光 146274.doc -51 - 201039375 晶注入步驟及 ’可列舉藉由 片侧基板之貼合步驟之後進行之步驟，有液 該處理之實施後所進行之注入口之密封步驟 該等步驟實施之處理。 又’若將製造OLED之情形作為示例， 例作為用於將有機 EL構造體形成於薄板玻璃基板之第 田 &lt; 步驟，包括形 成透明電極之步驟、對電洞注入層·電洞輸送層.發光 層·電子輸送層等進行蒸鍍之步驟、密封步驟等各種步 驟，作為藉由該等步驟所實施之處王里，具料列舉成料 理、蒸鍍處理、密封板之接著處理等。 可如上所述般製造可用於本發明之附支持體之顯示裝置 用面板。 其次，說明本發明之製造方法。 本發明之製造方法係顯示裝置用面板之製造方法，其係 包括將包含支持玻璃基板及樹脂層之支持體自附支持體之 顯不裝置用面板剝離之操作，該附支持體之顯示裝置用面 板係於包含第1主面及第2主面並於第2主面上具有顯示裝 置用構件之薄板玻璃基板之第1主面上，密接有固定於包 含第1主面及第2主面之支持玻璃基板之第1主面且具有易 剝離性之樹脂層，本發明之製造方法係包括：固定步驟， 使上述附支持體之顯示裝置用面板所包含之兩個主面中之 —主面、即未附有於作為後步驟之剝離步驟中被剝離之支 持體之一主面，朝平台所包含之平面狀之固定面密接，而 將上述附支持體之顯示裝置用面板固定於上述平台之固定 面上；以及剝離步驟’將刀插入至固定於上述平台之固定 146274.di 201039375 面上之上述附支持體之顯示裝置用面板之端面、即被剝離 之上述支持體之上述樹脂層與上述薄板玻璃基板之界面， 從而將上述支持體與上述顯示裝置用面板剝離。 如上所述’本發明之製造方法包括i述固$步驟及上述 剝離步驟，6亥固定步驟及剝離步驟可藉由上述本發明之剝 離裝置較好地實施。可藉由上述剝離方法，實施上述固定 步驟及上述剝離步驟。 0 本發明之製造方法中，可藉由對於藉由上述方法所獲得 之附支持體之顯示裝置用面板適用上述固定步驟及上述剝 離步驟’而獲得顯示裝置用面板。 圖17係表示作為本發明之電子裝置之製造方法之一實施 形態之顯示裝置用面板之製造方法之一例的流程圖。 基於使用圖1及圖2所示之本發明之剝離裝置之情形，說 明圖17所示之本發明之顯示裝置用面板之製造方法。 如圖17所示，於本發明之顯示裝置用面板之製造方法 〇 中’首先，於步驟810〇中，準備附支持體之顯示裝置用面 板1 〇，例如，如上所述般進行製造。 其次，過渡至步驟110之附支持體之顯示裝置用面板之 ’固定步驟。 於該固定步驟S110中，於步驟S112中使步進附支持體之 顯示裝置用面板10密接於平台2〇之固定面。其次’於步驟 S114中將雄、接之步進附支持體之顯示裝置用面板1〇真空吸 附於平台20之固定面並進行固定。 其次，過渡至步驟120之附支持體之顯示裝置用面板之 146274.doc -53- 201039375 剝離步驟。 於該剝離步驟S120中，使用上述剝離方法（其1}及剝離 方法（其2)之兩個之第1及第2之剝離方法。當然，亦可僅實 施其中一個剝離方法。 剝離步驟S120之第1剝離方法（參照圖丨）中，首先，於步 驟S122中，將刀30之插入位置（高度）調整至步進附支持體 之顯示裝置用面板10之支持體之樹脂層與顯示裝置用面板 之薄板玻璃基板之界面。其次，於步驟8124中將刀川插 入至樹脂層與薄板玻璃基板之界面並擠入。 接著，於步驟8126中，使刀30於插入方向上移動並剝離 支持體。 另一方面，於剝離步驟S120之第2剝離方法（參照圖2) 中，首先，於步·132中’相對於步進附支持體之顯示裝 置用面㈣之支持體之樹脂層與顯示裝置用面板之薄板玻 璃基板之界面，調整刀3〇〇之插入角度及插入位置（高度）。 其次’於步驟S134中，將刀300插入至樹脂層與薄板玻璃 2板之界面並擠入。接著’於步驟以36中，使刀3〇〇以其 前端為中心進行特定角度旋轉（旋動），且於上方向及/或插 入方向移動而剝離支持體。 如上所述’藉由於㈣步驟S12G巾將支持體自步進附支 ，體之顯示裝置用面板10剝離，於步驟SU0中製造出顯示 裝置用面板。 藉由本發明之製造方法所包括之上述剝離步驟，即使於 支持破璃基板較大之情形時，例如73〇χ92()顏，亦可容 146274.doc •54- 201039375 易地將上述支持玻璃基板分離。 又，可提供至上述剝離步驟之後，進而提供至所需之步 驟。所謂所需之步驟，可列舉例如於LCD之情形時，分割 為所需大小之單元之步驟、注入液晶並於其後密封其注入 口之步驟、貼附偏光板之步驟、模組形成步驟。又，若為 例如OLED之情形，則除可適用於LCD之情形之步驟之 外，亦可列舉組裝形成有有機EL構造體之薄板玻璃基板與 對向基板之步驟。再者，就分割為所需大小之單元之步驟 〇 而言，藉由切斷處理不會降低薄板玻璃基板之強度，亦不 會產生玻璃屑，因此藉由雷射切割之切斷較佳。 藉由上述本發明之製造方法獲得顯示裝置用面板之後， 進而提供至先前公知之步驟，藉此可獲得顯示裝置。 就移動電話或PDA(Personal Digital Assistant，個人數位 助理）之行動電話端末所使用之小型之顯示裝置之製造而 言，上述顯示裝置之製造方法較佳。顯示裝置主要為LCD ^ 或 OLED，作為 LCD，包括 TN(Twisted Nematic，扭轉向 列）型、STN(Super Twisted Nematic，超扭轉向列）型、FE (Field-Emission，場發射）型、TFT(Thin Film Transistor， ' 薄膜電晶體）型、MIM(Metal-Insulator-Metal，金屬-絕緣 體-金屬）型、IPS (In Plane Switching，橫向電場切換）型、 VA(Vertical Alignment，垂直配向）型等。基本上，於被動 驅動型、主動驅動型之任何顯示裝置之情形時均可適用。 說明本發明之製造方法之較佳例。 首先，說明可用於本發明之附支持體之顯示裝置用面板 146274.doc -55- 201039375 之製造方法。 首先’準備薄板玻璃基板及支持玻璃基板，並清洗該等 表面。關於清洗，可列舉例如純水清洗、uv(ult〜 Violet，紫外線）清洗。 其次，於支持玻璃基板之第1主面上形成樹脂層。例如 利用絲網印刷機於支持玻璃基板之第1主面上塗佈石夕氧樹 脂。接著，進行加熱硬化，於支持玻璃基板之第丨主面上 形成樹脂層，獲得固定有樹脂層之支持玻璃基板。 其次，使樹脂層與薄板玻璃之第丨主面附著並貼合。例 如，可於室溫下將樹脂層與薄板玻璃基板真空加壓而貼 合。接著，可獲得支持玻璃基板、樹脂層與薄板玻璃基板 之積層體即玻璃積層體。 此處，視需要，可研磨玻璃積層體中之薄板玻璃基板之 第2主面，亦可進行清洗。關於清洗，可列舉例如純水清 洗、UV清洗。 1 於藉由上述方法製造兩個玻璃積層體之後，於各個玻璃 積層體之薄板玻璃基板之第2主面上形成顯示裝置用構 件。藉由將一個玻璃積層體提供至公知之彩色濾光片形成 步驟，於其薄板玻璃基板之第2主面形成彩色濾光片陣 列。接著，藉由將另一個玻璃積層體提供至公知之陣列形 成步驟，於其薄板玻璃基板之第2主面形成TFT陣列。 藉由上述方法’可製造兩個附支持體之顯示裝置用面 板。 再者，以下，亦將此處所獲得之具有彩色濾光片陣列之 146274.doc -56- 201039375 附支持體之顯示裝置用面板稱為「附支持體之面板χ」，將 具有TFT陣列之附支持體之面板稱為「附支持體之面板 y」。 本發明之製造方法中’進而藉由如下所示之實例丨〜實例 4之方法對如上所述製造之附支持體之面板χ及附支持體之 面板y進行處理，製造顯示裝置用面板。 (實例1) ❹ 實例1中，如上所述，使附支持體之面板X及附支持體之 面板y之各個中之彩色濾光片陣列與tft陣列對向，並利用 單元形成用紫外線硬化型密封劑等密封劑進行貼合。以下 亦將此處所獲得之附支持體之顯示裝置用面板稱為「附支 持體之面板zi」。附支持體之面板21係尚未封入有液晶之 狀態者。 其次，將附支持體之面板zl之液晶注入孔密封。亦可利 用例如紫外線硬化型水溶性密封劑等進一步密封其外側。 〇 接著，將密封之後之附支持體之面板zl提供至本發明之 製造方法中之剝離步驟。具體而言，以附有被剝離之支持 體之主面為上、與其相反之主面為下之方式固定於作為本 •發明之剝離裝置之剝離裝置1或剝離裝置u中之平台2〇， - 將刀插入至薄板玻璃基板之主面與樹脂層之密接界面 之端部之任意部位，而形成間隙。接著，將複數個吸盤吸 附於支持體中之支持玻璃基板之第2主面而進行保持，並 使其於上方向（剝離方向）移動，藉此可將支持體與薄板玻 璃基板剝離並分離。 146274.doc -57- 201039375 其次，藉由調換附支持體之面板zl之上下而進行相同之 處理，可將兩個支持體剝離。 以下，亦將如上所述般獲得之顯示裝置用面板稱為「面 板wl」。剝離並分離之兩個支持體可於其他之附支持體之 面板之製造中進行再利用。 其次，將面板wl切斷為個別單元。 其次，將液晶注入至切斷而成之個別單元，其後進行密 封而形成液晶胞。 接著’可進而附上偏光板，另外形成背光，獲得 ❹ LCD1。 (實例2) 實例2中’如上所述，使附支持體之面板X及附支持體之 面板y之各個中之彩色濾光片陣列與TFT陣列對向，並封入 液晶，其後’利用單元形成用紫外線硬化型密封劑等密封 劑進行貼合。以下，亦將此處所獲得之本發明之附支持體 之面板稱為「附支持體之面板z2」。 其次，將附支持體之面板z2提供至本發明之製造方法中 ❹ 之剝離步驟。具體而言，以附有被剝離之支持體之主面為 上、與其相反之主面為下之方式固定於作為本發明之剝離 裝置之剝離裝置1或剝離裝置11中之平台20，將刀插入至 溥板玻璃基板之第丨主面與樹脂層之密接界面之端部之任 %、IM立而形成間隙。接著，將複數個吸盤吸附於支持體 中之支持玻璃基板之第2主面而進行保持，並使其於上方 向（剝離方向）移動，藉此可將支持體與薄板玻璃基板剝離 146274.doc -58- 201039375 並分離。 八人，藉由調換附支持體之面板Z2之上下而進行相同之 處理，可將兩個支持體剝離。 以下，亦將如上所述般獲得之顯示裝置用面板稱為「面 板w2」。剝離並分離之兩個支持體可於其他之附支持體之 面板之製造中進行再利用。 其次’將面板w2切斷為個別單元。 接著，可進而附上偏光板，另外形成背光，獲得 LCD2。 (實例3) 實例3中，如上所述，使附支持體之面板χ及附支持體之 面板y之各個中之彩色濾光片陣列與TFT陣列對向，並封入 液曰曰其後，利用单元形成用紫外線硬化型密封劑等密封 劑進行貼合。接著，與支持體一併切斷為個別單元。以 下’亦將此處切斷所獲得之附支持體之顯示裝置用面板稱 為「附支持體之面板Z3」》 其-欠’將附支持體之面板Z3提供至剝離步驟。具體而 ° 以附有被剝離之支持體之主面為上、與其相反之主面 為下之方式固定於作為本發明之剝離裝置之剝離裝置1或 剝離裝置11中之平台20,將刀插入至薄板玻璃基板之第1 主面與樹脂層之密接界面之端部之任意部位，而形成間 隙。接著’將複數個吸盤吸附於支持體中之支持玻璃基板 之第2主面而進行保持，並使其於上方向（剝離方向）移動， 藉此可使支持體與薄板玻璃基板剝離並分離。 146274.doc -59· 201039375 其次’藉由調換附支持體之面板Z3之上下而進行相同之 處理’可將兩個支持體剝離。 以下’亦將如上所述般獲得之顯示裴置用面板稱為「面 板w3」。 接著，可進而附上偏光板，另外形成背光，獲得 LCD3。 (實例4) 實例4中，如上所述，使附支持體之面板χ及附支持體之After obtaining a glass laminate (hereinafter also referred to as a "thin-glass laminate") in which a thin glass substrate, a resin layer, and a supporting glass substrate are laminated as described above, the second sheet of the thin glass substrate of the thin glass laminate is obtained. A member for a display device is formed on the main surface. Preferably, in the process of forming the member for the display device, the second main surface of the thin glass substrate is polished as necessary, thereby improving the flatness thereof. The member for the display device is not particularly limited. For example, an array including lcd or a color light-emitting sheet can be cited. Further, for example, a transparent electrode including a ruthenium, a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer may be mentioned. The method of forming the above display member is also not particularly limited and may be the same as the previously known method. For example, when an LCD is mounted as a display device, a step of forming an array on a glass substrate, a step of forming a color filter, a glass substrate on which an array is formed, and a glass substrate on which a color filter is formed may be used. The steps of the mouth (array, color grading sheet bonding step) and the like are more in the form of a body-body 13⁄4. The treatment carried out by these steps may, for example, be pure water washing, drying, film formation, photoresist coating, exposure, development, contact, and photoresist removal. Further, as the implementation of the array side substrate, the color light 146274.doc -51 - 201039375, the crystal implantation step and the step of performing the bonding step by the sheet side substrate, the liquid is performed after the implementation of the treatment The sealing step of the injection inlet is carried out in the steps. Further, if the case of manufacturing an OLED is taken as an example, the example is as a field for forming an organic EL structure on a thin glass substrate, including a step of forming a transparent electrode, a hole injection layer, and a hole transport layer. Various steps such as a step of performing vapor deposition on the light-emitting layer and the electron transport layer, and a sealing step, etc., are carried out in the steps of the steps, and the materials are listed as cooking, vapor deposition treatment, and subsequent treatment of the sealing plate. A panel for a display device which can be used in the attached support of the present invention can be manufactured as described above. Next, the manufacturing method of the present invention will be described. The manufacturing method of the present invention is a method for producing a panel for a display device, which comprises an operation of peeling a panel for a display device including a support for supporting a glass substrate and a resin layer, and a display device for supporting the support. The panel is attached to the first main surface of the thin glass substrate including the first main surface and the second main surface and having the display device member on the second main surface, and is fixed to the first main surface and the second main surface in close contact with each other. The resin layer supporting the first main surface of the glass substrate and having easy peelability, and the manufacturing method of the present invention includes a fixing step of making the main surface included in the panel for the display device with the support a surface, that is, a main surface of the support which is not peeled off in the peeling step as a subsequent step, is adhered to the planar fixing surface included in the platform, and the display device panel for the above-mentioned support is fixed to the above a fixing surface of the platform; and a peeling step of inserting the blade into the end surface of the panel for the display device with the support attached to the fixed surface of the above-mentioned platform 146274.di 201039375 An interface between the resin layer of the support and the thin glass substrate is used to peel the support from the panel for a display device. As described above, the manufacturing method of the present invention includes the step of solidifying and the step of peeling off, and the step of peeling and peeling off can be preferably carried out by the above-described peeling device of the present invention. The above-described fixing step and the above-described peeling step can be carried out by the above-described peeling method. In the manufacturing method of the present invention, the panel for a display device can be obtained by applying the above-described fixing step and the peeling step to the panel for a display device with a support obtained by the above method. Fig. 17 is a flow chart showing an example of a method of manufacturing a panel for a display device according to an embodiment of the method for manufacturing an electronic device of the present invention. The method of manufacturing the panel for a display device of the present invention shown in Fig. 17 will be described based on the case of using the peeling device of the present invention shown in Figs. 1 and 2 . As shown in Fig. 17, in the method of manufacturing a panel for a display device of the present invention, first, in step 810, a panel for a display device with a support is prepared, for example, as described above. Next, the transition to the 'fixing step of the panel for the display device with the support of step 110 is made. In the fixing step S110, in step S112, the display device panel 10 for stepping the support is adhered to the fixed surface of the stage 2A. Next, in step S114, the display panel for the display device with the male and the step-attached support is vacuum-adsorbed to the fixed surface of the stage 20 and fixed. Next, the process proceeds to the 146274.doc -53-201039375 stripping step of the panel for the display device with the support of step 120. In the peeling step S120, the first and second peeling methods of the two peeling methods (the 1} and the peeling method (the 2) are used. Of course, only one of the peeling methods may be performed. In the first peeling method (see FIG. 丨), first, in step S122, the insertion position (height) of the blade 30 is adjusted to the resin layer of the support body of the display device panel 10 for stepping the support, and the display device. The interface of the thin glass substrate of the panel. Next, the knife is inserted into the interface between the resin layer and the thin glass substrate in step 8124 and pushed in. Next, in step 8126, the knife 30 is moved in the insertion direction and the support is peeled off. On the other hand, in the second peeling method (see FIG. 2) of the peeling step S120, first, in step 132, the resin layer and the display of the support for the surface (4) of the display device with respect to the stepping support are used. The interface of the thin plate glass substrate of the panel for the device adjusts the insertion angle and the insertion position (height) of the blade 3. Next, in step S134, the blade 300 is inserted into the interface between the resin layer and the thin plate glass 2 Then, in step 36, the knife 3 is rotated at a specific angle around its front end (rotation), and moved in the upper direction and/or the insertion direction to peel off the support. As described above, (4) The step S12G towel supports the body from the stepping attachment, and the display panel for the display device 10 is peeled off, and the panel for the display device is manufactured in the step SU0. The peeling step included in the manufacturing method of the present invention, even if the support is broken When the glass substrate is large, for example, 73〇χ92(), or 146274.doc •54-201039375, the above supporting glass substrate can be easily separated. Further, it can be provided to the above peeling step, and then provided to the desired The steps required are as follows, for example, in the case of an LCD, a step of dividing into a unit of a desired size, a step of injecting a liquid crystal and sealing the injection port thereafter, a step of attaching the polarizing plate, and a module Further, in the case of, for example, an OLED, in addition to the steps applicable to the case of the LCD, a thin-plate glass substrate and an opposite substrate on which the organic EL structure is formed may be cited. Further, in the step of dividing into units of a desired size, the cutting process does not reduce the strength of the thin glass substrate, and does not generate glass swarf, so the cutting by laser cutting is more Preferably, after the panel for a display device is obtained by the above-described manufacturing method of the present invention, it is further provided to a previously known step, whereby a display device can be obtained. A mobile phone or a PDA (Personal Digital Assistant) For the manufacture of a small display device to be used, the above display device is preferably manufactured. The display device is mainly LCD ^ or OLED, and as LCD, including TN (Twisted Nematic) type, STN (Super Twisted Nematic) , super twisted nematic), FE (Field-Emission), TFT (Thin Film Transistor), MIM (Metal-Insulator-Metal), IPS ( In Plane Switching, VA (Vertical Alignment) type, etc. Basically, it can be applied to any of the passive drive type and active drive type display devices. A preferred embodiment of the production method of the present invention will be described. First, a manufacturing method of a panel for a display device 146274.doc-55-201039375 which can be used for the support of the present invention will be described. First, the thin glass substrate and the supporting glass substrate are prepared and the surfaces are cleaned. Examples of the washing include pure water washing and uv (ult~ Violet) cleaning. Next, a resin layer is formed on the first main surface of the supporting glass substrate. For example, a sulphuric acid resin is applied to the first main surface of the supporting glass substrate by a screen printer. Then, heat curing is performed to form a resin layer on the second main surface of the supporting glass substrate, thereby obtaining a supporting glass substrate to which the resin layer is fixed. Next, the resin layer is adhered to and bonded to the first major surface of the thin plate glass. For example, the resin layer and the thin glass substrate can be vacuum-pressed and bonded at room temperature. Next, a glass laminate which is a laminate which supports the glass substrate, the resin layer and the thin glass substrate can be obtained. Here, if necessary, the second main surface of the thin glass substrate in the glass laminate can be polished and cleaned. Examples of the washing include pure water washing and UV washing. After the two glass laminates are produced by the above method, the members for the display device are formed on the second main surface of the thin glass substrate of each of the glass laminates. By providing a glass laminate to the known color filter forming step, a color filter array is formed on the second main surface of the thin glass substrate. Next, a TFT array is formed on the second main surface of the thin glass substrate by supplying another glass laminate to the known array forming step. By the above method, two panels for a display device with a support can be manufactured. In addition, hereinafter, the panel for a display device with a color filter array 146274.doc-56-201039375 with a support is also referred to as a "support panel", which will have a TFT array attached. The panel of the support is called "the panel y with the support". In the manufacturing method of the present invention, the panel 附 with the support and the panel y with the support manufactured as described above are processed by the method of Example ～ to Example 4 as follows to manufacture a panel for a display device. (Example 1) 实例 In Example 1, as described above, the color filter array in each of the panel X of the support and the panel y with the support was opposed to the tft array, and the ultraviolet curing type was used for the cell formation. A sealant such as a sealant is applied. The panel for a display device with a support obtained here is also referred to as a "panel zi with a support". The panel 21 with the support is not in a state in which the liquid crystal is sealed. Next, the liquid crystal injection hole of the panel z1 with the support is sealed. Further, the outer side can be further sealed by, for example, an ultraviolet curable water-soluble sealant. 〇 Next, the panel z1 with the support after sealing is supplied to the peeling step in the manufacturing method of the present invention. Specifically, the platform 2 is fixed to the peeling device 1 or the peeling device u as the peeling device of the present invention, with the main surface of the peeled support as the upper surface and the opposite main surface as the lower surface. - Insert a knife into any part of the end of the interface between the main surface of the thin glass substrate and the resin layer to form a gap. Then, a plurality of suction cups are adhered to the second main surface of the supporting glass substrate in the support, and are held in the upper direction (peeling direction), whereby the support and the thin glass substrate can be peeled off and separated. 146274.doc -57- 201039375 Secondly, the two supports can be peeled off by performing the same treatment by replacing the upper surface of the support panel zl. Hereinafter, the panel for a display device obtained as described above is also referred to as "panel w1". The two supports that are peeled off and separated can be reused in the manufacture of other panels with attached supports. Next, the panel w1 is cut into individual units. Next, liquid crystal is injected into the individual cells which are cut, and then sealed to form liquid crystal cells. Then, a polarizing plate can be attached, and a backlight is additionally formed to obtain a ❹ LCD1. (Example 2) In Example 2, as described above, the color filter array in each of the panel X with the support and the panel y with the support was opposed to the TFT array, and the liquid crystal was sealed, and then the 'utilization unit' The bonding is performed by a sealing agent such as an ultraviolet curable sealant. Hereinafter, the panel of the support of the present invention obtained herein is also referred to as "the panel z2 with a support". Next, the panel z2 with the support is supplied to the peeling step of the manufacturing method of the present invention. Specifically, the platform 20 is fixed to the peeling device 1 or the peeling device 11 as the peeling device of the present invention with the main surface of the peeled support as the upper surface and the opposite main surface as the lower surface. Any one of the ends of the interface between the second main surface of the enamel glass substrate and the resin layer is inserted into the gap to form a gap. Next, a plurality of suction cups are held by the second main surface of the supporting glass substrate in the support and held in the upper direction (peeling direction), whereby the support and the thin glass substrate can be peeled off 146,274.doc -58- 201039375 and separated. For eight people, the two supports can be peeled off by replacing the upper surface of the support panel Z2 and performing the same treatment. Hereinafter, the panel for a display device obtained as described above is also referred to as "panel w2". The two supports that are peeled off and separated can be reused in the manufacture of other panels with attached supports. Next, the panel w2 is cut into individual units. Next, a polarizing plate can be attached, and a backlight is additionally formed to obtain the LCD 2. (Example 3) In Example 3, as described above, the color filter array in each of the panel 附 of the support and the panel y of the support was opposed to the TFT array, and sealed in a liquid layer, and then utilized. The unit is formed by bonding with a sealant such as an ultraviolet curable sealant. Then, it is cut into individual units together with the support. The panel for a display device with the support attached thereto is also referred to as "the panel Z3 with a support". The panel Z3 with the support is supplied to the peeling step. Specifically, the table 20 is fixed to the peeling device 1 or the peeling device 11 as the peeling device of the present invention with the main surface of the peeled support as the upper surface and the opposite main surface as the lower surface, and the cutter is inserted. A gap is formed at any portion of the end portion of the interface between the first main surface of the thin glass substrate and the resin layer. Then, a plurality of suction cups are held by the second main surface of the supporting glass substrate in the support and held in the upper direction (peeling direction), whereby the support and the thin glass substrate are peeled off and separated. 146274.doc -59· 201039375 Secondly, the two supports can be peeled off by replacing the upper surface of the support panel Z3 and performing the same treatment. The panel for displaying the display as described above is also referred to as "panel w3". Next, a polarizing plate can be attached, and a backlight is additionally formed to obtain the LCD 3. (Example 4) In Example 4, as described above, the panel of the support was attached and the support was attached.

面板y之各個中之彩色濾光片陣列與TFT陣列對向並利用 單元形成用紫外線硬化型密封劑等密封劑進行貼合。接 著’與支持體—併切斷為個別單元。以下，亦將此處切斷 所獲得之本發明之附支持體之面板稱為「附支持體之面板 z4j。附支持體之面板z4係尚未封入有液晶之狀態者。 八-人，將附支持體之面板z4之液晶注入孔密封。可$ 例如紫外線硬化型水溶性密封劑等進一步密封其外側。The color filter array in each of the panels y is opposed to the TFT array and bonded by a sealing agent such as an ultraviolet curable sealant for cell formation. Then 'with the support body' and cut off to individual units. In the following, the panel to which the support of the present invention obtained is cut off is also referred to as "the panel z4j with the support. The panel z4 with the support is not sealed with the liquid crystal. The eight-person will be attached. The liquid crystal injection hole of the panel z4 of the support is sealed, and the outer side can be further sealed by, for example, an ultraviolet curing type water-soluble sealant.

接著，將密封之後之附支持體之面板z4提供至剝凑 驟。具體而言’以附有被剝離之支持體之主面為上、$ 相反之主面為下之方式固定於作為本發明之剝離裝置^ 離裝置1或剝離裝置u中之平台2〇，將刀插入至薄板为 基板之第1主面與樹脂層之密接界面之端部之任意部七 而形成間隙。接著，將複數個吸盤吸附於支持體中之j 玻璃基板之第2主面而進行保持，並使其於上方向㈣ 向）移動’藉此可將支持體與薄板玻璃基板剝離並分離 其次’藉由調換附支持體之面板z4之上下而進行相同 146274.doc -60 - 201039375 處理，可將兩個支持體剝離。 以下，將分離兩個支持體所得之面板稱為「面板 w4」〇 其次，將結晶注入至面板w4之單元，其後進行密封。 接著，可進而附上偏光板，另外形成背光，猂 LCD4。 &amp; f Ο Ο 以上，作為本發明之電子裝置，以於基板之表面（第2主 面1具有顯示裝置用構件之顯示裝置用面板為代表例進行 了說明，但如上所述，本發明並不限定於此，當然亦可為 代替顯示裝置用構件而於基板之表面（第2主面）分別具有太 陽電池用構件、薄膜_ t % 存膜一-人电池用構件及電子零件用電路 電子襄置用構件之太陽電池、薄膜二次電池及電子零件等 電子裝置。 ' 例如，作為太陽電池用構件，就石夕氧型而言，可列舉正 極之氧化錫等透明電極、由P層/i層/η層所代表之石夕氧層、 及負極之金屬算，足从 ，可列舉與化合物型、染料敏化 型、置子點型等相對應之各種構件等。 兴^ ’作為薄膜二次電池用構件，就鐘離子型而言，可列 i鐘=7^4或金屬氧化物等透明電極、電解質層 ==集電層之金屬、作為密封層之樹脂等，另 應之各種構=化錦型、聚合物型、陶究電解質型等相對 又’作為電子裳生Next, the panel z4 with the support after sealing is supplied to the stripping step. Specifically, it is fixed to the platform 2 as the peeling device 1 or the peeling device u of the present invention, with the main surface of the support to be peeled off as the upper surface and the opposite main surface as the lower surface. The blade is inserted into the thin plate to form a gap between any one of the end portions of the first main surface of the substrate and the resin layer. Next, a plurality of suction cups are adsorbed on the second main surface of the j glass substrate in the support, and are held in the upper direction (four) direction. Thereby, the support and the thin glass substrate can be peeled off and separated secondly. The two supports can be peeled off by performing the same 146274.doc -60 - 201039375 treatment by swapping the upper surface of the support panel z4. Hereinafter, the panel obtained by separating the two supports is referred to as "panel w4". Next, the crystal is injected into the unit of the panel w4, and then sealed. Next, a polarizing plate can be attached, and a backlight is further formed, 猂 LCD4. In the electronic device of the present invention, the display device panel having the member for the display device on the second main surface 1 has been described as a representative example. However, as described above, the present invention It is needless to say that the solar cell member, the thin film, the thin film, the human battery member, and the electronic component circuit electronic device may be provided on the surface (second main surface) of the substrate instead of the member for the display device. For example, as a member for a solar cell, a transparent electrode such as a tin oxide of a positive electrode may be used as a member for a solar cell, and a P layer/ The metal oxide layer represented by the i layer/n layer and the metal of the negative electrode are various, and various members corresponding to the compound type, the dye sensitization type, the set point type, and the like are exemplified. The member for a secondary battery, in terms of the bell ion type, may be a transparent electrode such as a metal oxide such as 7^4 or a metal oxide, an electrolyte layer = a metal of a collector layer, a resin as a sealing layer, or the like. Structure = chemical type, poly TYPE, ceramic and other relatively study oxide 'as an electronic student Sang

Device，電荷耦合 _ 電路，就 CCD(Charge Coupled '&quot;元件）或 CM〇S(Complementary Metal 146274.doc -61 201039375Device, charge coupled _ circuit, either CCD (Charge Coupled '&quot; component) or CM〇S (Complementary Metal 146274.doc -61 201039375

Oxide Semiconductor，互補金屬氧半導體）而言，可列舉 導電部之金屬、絕緣部之氧化石夕或氮化矽等，另外，可列 舉壓力感測器.加速度感測器等各種感測器、或與剛性印 刷基板、可撓性印刷基板、剛撓性印刷基板等相對應之各 種構件等。 實施例1 說明本發明之實施例。 首先’對縱720 mm、橫600 mm、板厚0.4 mm、線膨脹 係數3 8 X 1 (T7/°c之支持玻璃基板（旭硝子股份有限公司製 造’ AN100 ’無鹼玻璃基板）進行純水清洗、uv清洗而將 其淨化。 其次，藉由絲網印刷機，以縱705 mm、橫595 mm之大 小’於支持玻璃基板上塗佈1 〇〇質量份之無溶劑加成反應 型剝離紙用石夕氧（Shin-Etsu Silicone公司製造，KNS_ 320A ’黏度0.40 Pa· s)與2質量份之白金系觸媒（shin-EtsuExamples of the Oxide semiconductor and the complementary metal oxide semiconductor include a metal of a conductive portion, an oxidized stone of an insulating portion, or a tantalum nitride, and various sensors such as a pressure sensor and an acceleration sensor, or Various members corresponding to rigid printed boards, flexible printed boards, rigid flexible printed boards, and the like. Example 1 illustrates an embodiment of the invention. First, pure water cleaning is carried out for a vertical glass of 720 mm, a width of 600 mm, a thickness of 0.4 mm, and a linear expansion coefficient of 3 8 X 1 (T7/°c supporting glass substrate (AN100 'alkali-free glass substrate manufactured by Asahi Glass Co., Ltd.) And uv cleaning and purifying it. Secondly, by using a screen printing machine, it is coated with 1 〇〇 by mass of solvent-free addition reaction type release paper on a supporting glass substrate by a length of 705 mm and a width of 595 mm. Shiki Oxygen (manufactured by Shin-Etsu Silicone, KNS_320A 'viscosity 0.40 Pa·s) and 2 parts by mass of platinum-based catalyst (shin-Etsu)

Silicone公司製造，CAT-PL-56)之混合物（塗佈量30 g/m2)。 其次’於180°C下，於大氣中對其進行30分鐘之加熱硬 化’於支持玻璃基板之表面獲得厚度為20 μηι之矽氧樹脂 層。 其次，對縱715 mm、橫595 mm '板厚0.3 mm、線膨脹 係數38xl(T7/°C之薄板玻璃基板（旭硝子股份有限公司製 造’ AN 100，無鹼玻璃基板）之與矽氧樹脂層接觸之側之面 進行純水清洗、UV清洗而將其淨化之後，藉由室溫下真 146274.doc •62- 201039375 空加壓而使對矽氧樹脂層與薄板玻璃基板貼合，從而獲得 玻璃積層體（玻璃積層體A1)。 再者’樹脂層之形成及薄板玻璃基板之積層係以於玻璃 積層體之端部形成深度為15 mm之間隙部之方式進行。 所獲得之玻璃積層體A1中’兩玻璃基板以不產生氣泡之 方式與矽氧樹脂層密接，從而既無應變缺陷，平滑性亦良 好。 其次’除如上所述般獲得之玻璃積層體A1，另外進而將 玻璃基板A1於大氣中以3〇〇。(：進行1小時之加熱處理而獲得 玻璃積層體A2。可以確定的是，玻璃積層體A2之樹脂層 並無因熱而引起之劣化’耐熱性良好。 其次’將玻璃積層體A1及A2提供至以下之剝離試驗 1〜6 〇 &lt;剝離試驗1&gt; 使用利用上述圖1所說明之剝離裝置i，將玻璃積層體A1 Q 之薄板玻璃基板之第2主面側固定於多孔質真空吸附板 上’將真空吸盤（40 mm 吸附於相反面即支持玻璃基板之 第2主面側而進行保持。 其次，將刀（厚度為0.10 mm，長度為1〇〇 mm，寬度為10 . mm ’不鏽剛製’抗撓剛度a為170 N.mm2，抗撓剛度B為 1’720,〇〇〇 N*mm2)載置於玻璃積層體A1之角部（四個角部中 之一個）及端面，藉由固定面方向移動單元，一面使刀稍 稍接觸於樹脂層之表面並滑動，一面插入至與薄板玻璃基 板之第1主面之界面，插入大致2〇 mm而形成空隙。 146274.doc -63- 201039375 其次’使真空吸盤隨著支持體之剝離而自附支持體之顯 示裝置用面板之端部朝中央進展，而依序上升。此時之吸 盤之上升距離為10 mm。 於上述剝離試驗1中，刀自身變形，並以沿樹脂層之表 面之方式移動。接著，可不損傷支持體與薄板玻璃基板而 進行剝離。 &lt;剝離試驗2&gt; 使用刊用上述圖2所說明之剝離裝置21，將玻璃積層體 A1之薄板玻璃基板之第2主面側固定於多孔質真空吸附板 亡’將真空吸盤(40 吸附於相反面即支持玻璃基板之 第2主面側並進行保持。 其次，將刀（厚度為0.40mm，長度為1〇〇_，寬度為W 不鏽剛製，抗撓剛度八為11〇〇〇 NW，抗㈣度0 = M7M〇〇N.mm2)載置於玻璃積層體^之角部（四個角部 中之一個）及端面，藉由lil中 精由固疋面方向移動單元，一 稍稍接觸於樹脂層之表面# 某板之心“ 面插入至與薄板玻璃 第主面之界面，插入大致20麵而形成空隙。 次’使真空吸盤隨著支持體之剝離自附支持體 裝置用面板之端部朝中央 ， 之上升距離為10mm。 此時之吸盤 :上述剝離試驗2中…前端部為中心進 端部於上方向自由移動， 疋轉後 π 進而刀之整體於上方向## 此，刀以沿樹脂層之表面 G移動’猎 持體與f#板玻璃基板而進行_。 # ’可不損傷支 146274.doc -64 - 201039375 &lt;剝離試驗3&gt; 利用剝離裝置11 ’將玻璃積層體A1之薄板玻璃基板之第 2主面側固疋於多孔質真空吸附板上，將真空吸盤（4〇 mm #)吸附於相反面即支持玻璃基板之第2主面侧並進行保 持。 ΟA mixture made by Silicone, CAT-PL-56) (coating amount 30 g/m2). Next, it was subjected to heat hardening at 180 ° C for 30 minutes in the atmosphere. On the surface of the supporting glass substrate, an epoxy resin layer having a thickness of 20 μm was obtained. Next, a 715-mm vertical, 595 mm-thickness 0.3 mm, and a linear expansion coefficient of 38xl (T7/°C thin glass substrate (AN 100, non-alkali glass substrate manufactured by Asahi Glass Co., Ltd.) and a silicone resin layer After the surface of the contact side is cleaned by pure water and cleaned by UV cleaning, the epoxy resin layer is bonded to the thin glass substrate by air pressurization at room temperature 146274.doc • 62-201039375. The glass laminate (glass laminate A1). The formation of the resin layer and the laminate of the thin glass substrate are performed so as to form a gap portion having a depth of 15 mm at the end portion of the glass laminate. In A1, the two glass substrates are in close contact with the epoxy resin layer so as not to generate bubbles, so that there is no strain defect and the smoothness is good. Next, the glass laminate A1 obtained in addition to the above is additionally provided with the glass substrate A1. In the atmosphere, the glass laminate A2 was obtained by heat treatment for 1 hour. It was confirmed that the resin layer of the glass laminate A2 was not deteriorated by heat, and the heat resistance was good. Next, the glass laminates A1 and A2 were supplied to the following peeling test 1 to 6 〇 &lt; peeling test 1&gt; Using the peeling apparatus i described above with reference to Fig. 1, the second layer of the glass substrate of the glass laminate A1 Q was used. The main surface side is fixed to the porous vacuum adsorption plate. 'The vacuum chuck (40 mm is adhered to the opposite surface, that is, the second main surface side of the supporting glass substrate is held. Next, the knife (thickness is 0.10 mm, length is 1〇) 〇mm, width is 10. mm 'rust-made' flexural rigidity a is 170 N.mm2, flexural rigidity B is 1'720, 〇〇〇N*mm2) is placed at the corner of the glass laminate A1 (the one of the four corners) and the end surface are inserted into the interface with the first main surface of the thin glass substrate while being slightly moved in contact with the surface of the resin layer by moving the unit in the direction of the fixing surface, and inserted into the surface.空隙 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 146 The suction cup has a rising distance of 10 mm. In the test 1, the blade itself was deformed and moved along the surface of the resin layer. Then, the support and the thin glass substrate were peeled off and peeled off. <Peel test 2> Using the peeling device described in Fig. 2 21, the second main surface side of the thin glass substrate of the glass laminate A1 is fixed to the porous vacuum adsorption plate. The vacuum chuck (40 is adsorbed on the opposite surface, that is, the second main surface side of the supporting glass substrate is held. , the knife (thickness is 0.40mm, length is 1〇〇_, width is W, stainless steel, flexural rigidity is 11〇〇〇NW, anti-(four) degree 0 = M7M〇〇N.mm2) is placed The corner portion of the glass laminate (one of the four corners) and the end surface, by the movement of the solid layer in the direction of the solid surface, a slight contact with the surface of the resin layer # The interface of the main surface of the thin glass is inserted into approximately 20 faces to form a void. In the second step, the vacuum chuck was peeled off from the support body, and the end portion of the panel for supporting the device was directed toward the center, and the rising distance was 10 mm. The suction cup at this time: in the peeling test 2, the front end portion is freely moved in the upper direction from the center end portion, and the π is further rotated in the upper direction. ##, the knife moves along the surface G of the resin layer. Hold the body with the f# plate glass substrate. # '可不伤支146274.doc -64 - 201039375 &lt;peeling test 3&gt; The second main surface side of the thin glass substrate of the glass laminate A1 is fixed to the porous vacuum adsorption plate by the peeling device 11', and the vacuum is applied. The suction cup (4 〇 mm #) is attached to the opposite surface, that is, the second main surface side of the glass substrate is supported and held. Ο

其次’將刀（厚度為〇.1〇 mm，長度為10〇 mm，寬度為10 mm’不鏽剛製）載置於玻璃積層體A1之角部（四個角部中 之一個）及端面，藉由固定面方向移動單元，一面使刀稍 稍接觸於樹脂層之表面並滑動，一面插入至與薄板玻璃基 板之第1主面之界面’插入大致2〇 mm而形成空隙。此處， 插入係與自離子化器（Keyence公司製造）對該界面喷附除電 性流體同時進行。 其次，一面繼續自離子化器朝所形成之空隙喷附除電性 流體，一面提拉真空吸盤。其結果，可不損傷玻璃積層體 A1而將支持體與薄板玻璃剝離。剝離之後之薄板玻璃基板 之帶電壓為+0.2 kV。 &lt;剝離試驗4&gt; 利用剝離裝置U，將玻璃積層體A1之薄板玻璃基板之第 2主面侧固定於多孔質真空吸附板上，將真空吸盤（4〇 mm幻吸附於相反面即支持玻璃基板之第2主面側而進行保 持。 其次’將刀（厚度為0.10 mm，長度為1〇〇 mm，寬度為10 mm ’不鏽剛製）載置於玻璃積層體A1之角部（四個角部中 之一個）及端面，藉由固定面方向移動單元，一面使刀稍 146274.doc -65· 201039375 稍接觸於樹脂層之表面並滑動，一面插入至與薄板玻璃基 板之第1主面之界面’插入大致2〇 mm而形成空隙。 其次，自微調噴嘴（池内公司製造，i mm幻朝形成之空 隙噴附高壓水（2 MPa)。其結果，可不損傷破璃積層體^ 而將支持體與薄板玻璃剝離。剝離之後之薄板破璃基板之 帶電壓為+0.2 kV。 〈剝離試驗5 &gt; 除使用破璃積層體A2之外，藉由與上述剝離試驗丨相同 之方法進仃剝離試驗4。可不損傷玻璃積層體八2而將支持 玻璃基板與薄板玻璃基板剝離並分離。 &lt;剝離試驗6&gt; ’、吏用如下者，即，其係使用兩個玻璃積層體A〗，藉由 紫外線硬化性密封劑（積水化學公司製造）將各個薄板^璃 基板之第1主面側自玻璃端部起5 _内側之區域内塗佈為 線狀且四角形之後貼合而成’而除此以外藉由與剝離試驗 1相同之方法實施剝離試驗5。 可將兩片支持體以不損傷面板之方式自兩片薄板玻璃基 板貼合而成之積層體即面板分離。 &lt;剝離試驗7&gt; 離 不使用剝離裝^及剝離裝置llt之任何—個地進行剝 關於上述破璃積層體A1，以手動將刀（刀刀長度為 咖’厚度為1 _)載置於玻璃積層體A1之角部及端部， 面將刀稍稍接觸於形成於支持玻璃基板之第!主面之核 146274.doc •66· 201039375 層之表面上亚使其滑動，一面插入至與薄板玻璃基板之第 主面之界面，並保持該狀態移動，可不損傷玻璃積層體 A1而將支持玻璃自薄板玻璃分離。分離之後之薄板玻璃之 帶電壓為+10 kV。 實施例2 於實施例2中，除將基板變更為厚度〇1 mm之聚對苯二 甲酸乙二酯樹脂基板之外，與實施例丨同樣地作成積層體 ^ B，進行與剝離試驗3相同之試驗。其結果，可不損傷積層 體B而將支持體與聚對苯二曱酸乙二酯樹脂基板剝離。剝 離之後之聚對笨二曱酸乙二酯樹脂基板之帶電壓為+〇.3 kV。 實施例3 於實施例3中’除將基板變更為厚度〇. 1 mm之施以鏡面 處理之不鏽剛（SUS304)基板之外，與實施例1同樣地作成 積層體C，進行與剥離試驗3相同之試驗。其結果，可不損 Q 傷積層體C而將支持體與不鏽剛基板剝離。剝離之後之不 鏽剛基板之帶電壓為+0.02 kV。 實施例4 •於實施例4中，進行模擬實驗，其除將支持基板變更為 厚度1 mm之聚對笨二曱酸乙二酯樹脂基板、將基板變更為 厚度0.1 mm之聚對苯二曱酸乙二酯樹脂基板之外，與實施 例1同樣地作成積層體D，進行與剝離試驗3相同之試驗。 其結果’可不損傷積層體D而將支持體與聚對苯二曱，酸乙 二酯樹脂基板剝離。剝離之後之聚對苯二甲酸乙二酯樹脂 146274.doc •67· 201039375 基板之帶電壓為+0.5 kV。 實施例5 於實施例5中’進行模擬實驗，其除將支持基板變更為 子又為 mm直住為6英对之石夕氧晶圓基板，將基板變更 為厚度為0.1 mm、直徑為6英吋之矽氧晶圓基板之外，與 實施例1同樣地作成積層體E，進行與剝離試驗3相同之試 驗。其結果，可不損傷積層體E而將支持體與矽氧晶圓基 板剝離。剝離之後之矽氧晶圓基板之帶電壓為+〇 〇5 kv。 實施例6 於實施例6中，進行模擬實驗，其除將支持基板變更為 厚度為1 mm之聚對苯二曱酸乙二酯樹脂基板、將基板變更 為厚度為0.1 mm之薄板玻璃基板之外，與實施例1同樣地 作成積層體F ’進行與剝離試驗3相同之試驗。其結果，可 不損傷積層體F而將支持體與薄板玻璃基板剝離。剝離之 後之薄板玻璃樹脂基板之帶電壓為+0.2 kV。 實施例7 於實施例7中，除將基板變更為厚度為〇〇5 mm之聚醯亞 胺樹脂基板（Dupont-Toray公司製造，Kapton200HV)之 外’與實施例1同樣地作成積層體G，進行與剝離試驗3相 同之試驗。其結果，可不損傷積層體G而將支持體與聚醯 亞胺樹脂基板剝離。剝離之後之聚醯亞胺樹脂基板之帶電 壓為+0.2 kV。 實施例8 準備如下所述者作為積層用玻璃薄臈，即，首先，使用 146274.doc -68 201039375 薄板玻璃專用之清洗裝置，藉由鹼性洗劑，對縱350 mm、 橫300 mm、板厚0.08 mm、線膨脹係數38χ10·7厂C之玻璃 基板（旭硝子股份有限公司製造，AN100，無鹼玻璃基板） 進行清洗而將表面淨化，進而對表面霧化喷射γ-疏基丙基 三甲氧基矽烷之0.1%曱醇溶液，接著以80°C乾燥3分鐘。 另一方面’準備對縱350 mm、橫300 mm、板厚〇.〇5 mm之 聚醯亞胺基板（Dupont-Toray公司製造，Kapton200HV)之 表面進行了電漿處理者。接著，與之前之玻璃基板疊合， 使用已於320°C下加熱之加壓裝置將兩者積層，作為玻璃/ 樹脂積層基板。 於實施例8中，除將薄板玻璃基板變更為上述玻璃/樹脂 積層基板，將該樹脂基板之與玻璃基板之積層面為相反側 之面作為與支持體之積層面之外，與實施例1同樣地作成 積層體Η ’進行與剝離試驗3相同之試驗。其結果，可不損 傷積層體Η而將支持體與玻璃/樹脂積層薄膜基板剝離。剝 離之後之玻璃/樹脂積層薄膜基板之帶電壓為+〇2 kv。 已詳細並參照指定之實施態樣說明本發明，但作為本領 域技術人員明確的是，可不脫離本發明之精神與範圍而添 加各種變更或修正。 本申凊案係基於2009年2月6日申請之日本專利申請案 2009-隱96及2_年8月28日中請之日本專财請案細9-198992者’其内容併入本文以作參照。 產業上之可利用性 根據本發明，可提供一種電子裝置之製造方法，其可抑 146274.doc •69· 201039375 制混入至基板間之氣、泡或灰塵等異物所弓丨起之基板缺陷之 產生’可不產生蚀刻斑而於既存之生產線上進行處理，可 不損傷密接之基板與樹脂層而容易地且短時間地將該等剝 離並分離。又，可提供一種可實施上述電子裝置之製造方 法之剝離裝置。 【圖式簡單說明】 圖1(a)〜圖1(d)係表不本發明之剝離裝置之較佳實施態樣 之概略剖面圖。 圖2(a)〜圖2(d)係表示本發明之剝離裝置之另一較佳實施 態樣之概略剖面圖。 圖3係表示本發明之剝離裝置之較佳實施態樣之一部分 之概略剖面圖。 圖4(a)及圖4(b)係表示刀之較佳實施態樣之概略俯視圖 及概略端面圖。 圖5(a)係用於說明刀之支持部之概略立體圖，圖5(b)及 圖50)係概略俯視圖。 圖6(a)〜6(c)係用於說明剝離時之刀之變形之概略立體 圖。 圖7係表示旋轉機構之較佳實施態樣之概略剖面圖。 圖8係表示吸盤之較佳實施態樣之概略立體圖。 圖9係模式性地表示吸盤進行吸附之圖。 圖1〇係表示吸盤之控制系統之方塊圖。 圖U係表示附支持體之顯示裝置用面板之一態樣之概略 剖面圖。 146274.doc •70· 201039375 圖u係表示附支持體之顯示裝置用面板之另—熊樣之概 略平面圖。 &quot; 圖13係表不附支持體之顯示裝置用面板之另一態樣之概 略剖面圖。 圖14係表不附支持體之顯示裝置用面板之又—態樣之概 略剖面圖。 圖1 5(a)圖15(c)係用於說明平台之固定面之—部分為曲 面之匱形時之剝離方法的概略剖面圖。 圖16⑷〜圖10⑷係用於說明平台為可撓性構件之情形時 之剝離方法的概略剖面圖。 圖17係表示作為本發明之電子裝置之製造方法之-實施 形態之顯示裝置用面板之製造方法之流程之—例的流程 【主要元件符號說明】 1 ' 11 剝離裝置 2 基台構件 3 第1移動構件本體 4 第3移動構件本體 5 第2移動構件本體 10 附支持體之顯示裝置用面板 10x 附支持體之顯示裝置用面板之端面 12a、12b 薄板破璃基板 16 ' 116 ' 126 ' 136 顯示裝置用面板 146274.doc -71- 201039375 17a、17b、117、 127、137a、137b 支持體 18a' 18b 樹脂層 19a ' 19b 支持玻璃基板 20 平台 22 多孔質真空吸附板 24 泵 26 平台框 30 刀 30a 刀之前端部 30b 刀之中段部 30c 刀之後端部 40 上下方向移動單元 40a 第2移動側構件 40b 第2固定側構件 42 固定面方向移動單元 42a 第1移動側構件 42b 第1移動側構件 44 上方向移動機構 44a 第3移動側構件 44b 第3固定側構件 44c 止動部 46 三成分力感測器 50 旋轉機構 146274.doc -72- 201039375 Ο ❹ 51 止動部 52 托架 54 旋轉軸 56 套 58 托架 59 插入角度調整單元 60 吸盤 61 支持部 70 相機 73 喷嘴 75 帶電抑制裝置 77 真空泵 78 電控調節器 79 閥 82 吸盤 83 空氣泵 84 框架 85 電控調節器 86 導板 87 電磁閱 88 氣缸 89 活塞 90 控制部 110 附支持體之顯示裝置用面板 146274.doc -73 · 201039375 112 薄板玻璃基板 114 顯示裝置用構件 118 樹脂層 119 支持玻璃基板 120 附支持體之顯示裝置用面板 122 薄板玻璃基板 124 顯示裝置用構件 125 間隙部 128 樹脂層 129 支持玻璃基板 132a、 132b 薄板玻璃基板 134 顯示裝置用構件 138a &gt; 138b 樹脂層 139a、 139b 支持玻璃基板 611 臂 Θ 插入角度 146274.doc 74-Next, 'the knife (thickness: 〇.1〇mm, length 10〇mm, width 10mm' stainless steel) is placed on the corner of the glass laminate A1 (one of the four corners) and the end face By moving the unit in the direction of the fixing surface, the blade is inserted into the interface with the first main surface of the thin glass substrate while inserting the blade slightly into contact with the surface of the resin layer to form a gap. Here, the insertion system and the self-ionizer (manufactured by Keyence Corporation) are simultaneously sprayed with the static eliminating fluid to the interface. Next, the vacuum chuck is pulled while the ionizer is continuously ejected toward the formed gap. As a result, the support and the thin plate glass can be peeled off without damaging the glass laminate A1. The strip voltage of the thin glass substrate after peeling was +0.2 kV. &lt;Peel Test 4&gt; The second main surface side of the thin glass substrate of the glass laminate A1 was fixed to the porous vacuum adsorption plate by the peeling device U, and the vacuum chuck (4 〇 mm phantom adsorption on the opposite side, that is, the support glass) The second main surface side of the substrate is held. Next, a knife (thickness: 0.10 mm, length: 1 mm, width: 10 mm, stainless steel) is placed on the corner of the glass laminate A1. One of the corners and the end face, by moving the unit in the direction of the fixed surface, the blade 146274.doc -65· 201039375 is slightly contacted with the surface of the resin layer and slid, and inserted into the first main body of the thin glass substrate. The interface of the surface is inserted into a gap of approximately 2 mm to form a gap. Secondly, the self-tuning nozzle (manufactured by the company, the gap formed by the i mm phantom is sprayed with high-pressure water (2 MPa). As a result, the glass laminate body can be prevented from being damaged. The support and the thin glass were peeled off. The strip voltage of the thin glass substrate after peeling was +0.2 kV. <Peel Test 5 &gt; In addition to the use of the glass laminate A2, the same method as the above peel test was carried out.仃 peeling test 4 The support glass substrate and the thin glass substrate can be peeled off and separated without damaging the glass laminate body 8. [Peel test 6 &gt; ', using the following two, that is, using two glass laminates A, by ultraviolet curing The sealant (manufactured by Sekisui Chemical Co., Ltd.) is formed by coating the first main surface side of each of the thin-plate substrates from the glass end portion in the inner side of the glass end portion in a linear shape and a quadrangular shape. The peeling test 5 was carried out in the same manner as in the peeling test 1. The two sheets of the support can be separated from the laminate which is a laminate obtained by bonding the two thin glass substrates without damaging the panel. &lt; peeling test 7&gt; Stripping the glass laminated body A1 using any one of the peeling device and the peeling device 11t, and manually placing the blade (the blade length is 1 _) into the corner of the glass laminate A1 and At the end, the surface is slightly in contact with the core formed on the first main surface of the supporting glass substrate. The surface of the layer 146274.doc •66·201039375 is slid and inserted into the interface with the main surface of the thin glass substrate. , and By moving in this state, the support glass can be separated from the thin plate glass without damaging the glass laminate A1. The strip voltage of the thin plate glass after the separation is +10 kV. Embodiment 2 In the second embodiment, the substrate is changed to the thickness 〇1. In the same manner as in Example 丨, a layered body B was produced in the same manner as in Example 丨, and the same test as in the peeling test 3 was carried out. As a result, the support and the aggregate can be formed without damaging the layered body B. The ethylene terephthalate resin substrate was peeled off. The strip voltage of the polyethylene terephthalate resin substrate after peeling was +〇3 kV. Example 3 In Example 3, except that the substrate was changed to A laminate C was produced in the same manner as in Example 1 except that a mirror-treated stainless steel (SUS304) substrate having a thickness of 11 was applied, and the same test as in the peeling test 3 was carried out. As a result, the support can be peeled off from the stainless steel substrate without damaging the Q-injured layer C. The strip voltage of the stainless steel substrate after peeling is +0.02 kV. Example 4 In Example 4, a simulation experiment was carried out in which a support substrate was changed to a polyethylene terephthalate resin substrate having a thickness of 1 mm, and the substrate was changed to a polyparaphenylene ruthenium having a thickness of 0.1 mm. A laminate D was produced in the same manner as in Example 1 except for the acid ethyl ester resin substrate, and the same test as in the peeling test 3 was carried out. As a result, the support can be peeled off from the polyethylene terephthalate or acid ethylene glycol resin substrate without damaging the laminate D. Polyethylene terephthalate resin after peeling 146274.doc •67· 201039375 The substrate voltage is +0.5 kV. [Example 5] In Example 5, a simulation experiment was carried out in which the substrate was changed to a 6-inch yttrium-oxygen wafer substrate, and the substrate was changed to a thickness of 0.1 mm and a diameter of 6 A layered product E was produced in the same manner as in Example 1 except for the enamel wafer substrate of the inch, and the same test as in the peeling test 3 was carried out. As a result, the support can be peeled off from the silicon oxide wafer substrate without damaging the laminate E. The strip voltage of the tantalum wafer substrate after stripping is +〇 〇5 kv. Example 6 In Example 6, a simulation experiment was carried out in which a support substrate was changed to a polyethylene terephthalate resin substrate having a thickness of 1 mm, and the substrate was changed to a thin glass substrate having a thickness of 0.1 mm. In the same manner as in Example 1, a laminate F' was produced in the same manner as in the peel test 3. As a result, the support can be peeled off from the thin glass substrate without damaging the laminate F. The strip voltage of the thin glass resin substrate after stripping was +0.2 kV. [Example 7] In the same manner as in Example 1, except that the substrate was changed to a polyimide substrate having a thickness of 〇〇5 mm (Kapton 200HV manufactured by Dupont-Toray Co., Ltd.), a layered product G was produced in the same manner as in Example 1. The same test as the peel test 3 was carried out. As a result, the support and the polyimide film substrate can be peeled off without damaging the laminate G. The strip voltage of the polyimide substrate after peeling was +0.2 kV. Example 8 A glass crucible for lamination was prepared as follows, that is, first, a cleaning device for sheet glass of 146274.doc-68 201039375 was used, and an alkaline lotion was used for 350 mm in length, 300 mm in width, and plate. Glass substrate with a thickness of 0.08 mm and a coefficient of linear expansion of 38χ10·7 Factory C (manufactured by Asahi Glass Co., Ltd., AN100, an alkali-free glass substrate) is cleaned to purify the surface, and then atomized and sprayed with γ-succinylpropyltrimethoxy A 0.1% decyl alcohol solution of decane was then dried at 80 ° C for 3 minutes. On the other hand, the surface of a polyimide substrate (manufactured by Dupont-Toray Co., Ltd., Kapton 200HV) having a thickness of 350 mm, a width of 300 mm, and a thickness of 〇5 mm was prepared for plasma treatment. Next, the same was laminated with the previous glass substrate, and the both were laminated as a glass/resin laminated substrate using a pressurizing device which was heated at 320 °C. In the eighth embodiment, except that the thin glass substrate is changed to the glass/resin laminated substrate, the surface on the opposite side of the laminated surface of the resin substrate and the glass substrate is used as the layer of the support, and Example 1 The same test was carried out as in the case of the peeling test 3. As a result, the support and the glass/resin laminated film substrate can be peeled off without damaging the laminated body. The strip voltage of the glass/resin laminate film substrate after peeling is +〇2 kv. The present invention has been described in detail with reference to the preferred embodiments thereof. This application is based on the Japanese Patent Application No. 2009-Hidden 96, filed on February 6, 2009, and the Japanese Special Account for the August 28th, 2008. For reference. INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a method of manufacturing an electronic device which can suppress substrate defects caused by foreign matter such as gas, bubbles or dust mixed in between substrates 146274.doc •69· 201039375 It is possible to perform processing on an existing production line without generating etching spots, and it is possible to easily and quickly separate and separate the substrates and the resin layer without damaging them. Further, a peeling device which can carry out the above-described manufacturing method of the electronic device can be provided. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) to Fig. 1 (d) are schematic cross-sectional views showing a preferred embodiment of the peeling device of the present invention. Fig. 2 (a) to Fig. 2 (d) are schematic cross-sectional views showing another preferred embodiment of the peeling device of the present invention. Fig. 3 is a schematic cross-sectional view showing a part of a preferred embodiment of the peeling device of the present invention. 4(a) and 4(b) are a schematic plan view and a schematic end view showing a preferred embodiment of the blade. Fig. 5 (a) is a schematic perspective view for explaining a support portion of a blade, and Figs. 5 (b) and 50) are schematic plan views. Figs. 6(a) to 6(c) are schematic perspective views for explaining deformation of the blade at the time of peeling. Fig. 7 is a schematic cross-sectional view showing a preferred embodiment of the rotating mechanism. Fig. 8 is a schematic perspective view showing a preferred embodiment of the suction cup. Fig. 9 is a view schematically showing the suction of the suction cup. Figure 1 is a block diagram showing the control system of the suction cup. Fig. U is a schematic cross-sectional view showing one of the panels for a display device with a support. 146274.doc •70· 201039375 Figure u is a schematic plan view showing another bear-like type of the panel for a display device with a support. &quot; Fig. 13 is a schematic cross-sectional view showing another aspect of the panel for a display device without a support. Fig. 14 is a schematic cross-sectional view showing a state in which a panel for a display device without a support is attached. Fig. 15 (a) Fig. 15 (c) is a schematic cross-sectional view for explaining a peeling method when a portion of the fixing surface of the platform is a meandering shape. Figs. 16(4) to 10(4) are schematic cross-sectional views for explaining a peeling method when the stage is a flexible member. Fig. 17 is a flow chart showing an example of a flow of a method for manufacturing a panel for a display device according to a method of manufacturing an electronic device according to the present invention. [Description of main components] 1 '11 Peeling device 2 Abutment member 3 First Moving member body 4 Third moving member body 5 Second moving member body 10 Display panel for display device 10x End face 12a, 12b for display device panel with support for thin plate Glass substrate 16 ' 116 ' 126 ' 136 Display Device panel 146274.doc -71- 201039375 17a, 17b, 117, 127, 137a, 137b Support 18a' 18b Resin layer 19a ' 19b Support glass substrate 20 Platform 22 Porous vacuum adsorption plate 24 Pump 26 Platform frame 30 Knife 30a Knife front end portion 30b Knife intermediate portion 30c Knife rear end portion 40 Up and down direction moving unit 40a Second moving side member 40b Second fixed side member 42 Fixed surface direction moving unit 42a First moving side member 42b First moving side member 44 Upward direction moving mechanism 44a Third moving side member 44b Third fixed side member 44c Stopping portion 46 Three-component force sensor 50 rotation 146274.doc -72- 201039375 Ο ❹ 51 Stopper 52 Bracket 54 Rotary shaft 56 Set 58 Bracket 59 Insertion angle adjustment unit 60 Suction cup 61 Support 70 Camera 73 Nozzle 75 Charging suppression device 77 Vacuum pump 78 Electronically controlled regulator 79 Valve 82 Suction cup 83 Air pump 84 Frame 85 Electronically controlled regulator 86 Guide 87 Electromagnetic reading 88 Cylinder 89 Piston 90 Control unit 110 Display panel with support 146274.doc -73 · 201039375 112 Thin glass substrate 114 Display unit Member 118 Resin layer 119 Supporting glass substrate 120 Display panel for display device 122 Thin plate glass substrate 124 Display device member 125 Gap portion 128 Resin layer 129 Support glass substrate 132a, 132b Thin glass substrate 134 Display device member 138a &gt 138b resin layer 139a, 139b support glass substrate 611 arm Θ insertion angle 146274.doc 74-

Claims (1)

201039375 七、申請專利範圍： 1. -種電子裝置之製造方法，該電子裝置係包含電子裝置 用構件及基板；其製造方法係包括將包含支持基板及樹 脂層之支持體自附支持體之電子裝置剝離之操作，該附 支持體之電子裝置係於包含第！主面及第2主面並於第2 主面上具有上述電子裝置用構件之上述基板的第丨主面 上，密接有固定於包含第丨主面及第2主面之支持基板之 第1主面且具有易剝離性之樹脂層， 其製造方法係包括： 固定步驟，使上述附支持體之電子裝置所包含之兩 個主面中之一主面、即未附有於作為後步驟之剝離步驟 中被剝離之支持體之一主面，朝平台所包含之平面狀之 固定面密接，而將上述附支持體之電子裝置固定於上述 平台之固定面上；以及 剝離步驟，將刀插入至固定於上述平台之固定面上 之上述附支持體之電子裝置之端面、即被剝離之上述支 持體之上述樹脂層與上述基板之界面，從而將上述支持 體與上述電子裝置剝離。 2. 如請求項1之電子裝置之製造方法，其中 於上述剝離步驟中，插入至上述樹脂層與上述基板之 界面之上述刀會藉由來自上述樹脂層及/或上述基板之作 用而變形，藉此，於使上述刀更進而朝插入方向移動之 情形時’上述刀以沿上述樹脂層之表面之方式移動，從 而將上述支持體與上述電子裝置剝離。 146274.doc 201039375 3. 如請求項1或2之電子裝置之製造方法，莓中 於上述剝離步驟中， 上述基板之界面之後， 轉，後端部於與上述平 向上移動 在將上述刀插入至上述樹脂層與 上述刀以其前端部為中心進行旋 台之上述固定面之法線平行之方 進而上述刀之整體亦於相同之平行方向及插 入方向中的至少_個方向上移動，藉此，上述刀以沿上 述樹脂層之表面之方式移動，從而將上述支持體與上述 電子裝置剝離。 4. 如請求項！至3中任一項之電子裝置之製造方法，其中 於上述固定步驟之後且上述剝離步驟之前，更包括使 複數個吸盤吸附於被剝離之上述支持體之上述支持基板 之第2主面的吸附步驟； 於上述剝離步驟中更進而於將上述刀插入至上述樹脂 層與上述基板之界面之後，使上述吸盤朝將上述樹脂層 與上述基板剝離之方向即剝離方向移動，從而將上述支 持體與上述電子裝置剝離。 5. 如請求項4之電子裝置之製造方法，其中 於上述剝離步驟中更進而依序進行操作，以使吸附於 上述支持基板之第2主面之複數個吸盤中之、位於離上 述附支持體之電子裝置之端面中插入有上述刀之部位最 近之處的吸盤首先朝上述剝離方向移動，其次使其相鄰 之吸盤朝上述剝離方向移動，然後亦同樣地使已朝上述 剝離方向移動之吸盤之相鄰之吸盤接著朝上述剝離方向 移動，從而將上述支持體於自插入上述刀之端部朝向中 146274.doc 201039375 央之方向上剝離，並進而朝其延長線上剝離。 6. 如請求項1至5中任一項之電子裝置之製造方法，1中 上述剝離步驟更包括藉由圖像處理確定上述樹月旨層與 上述基板之界面中插入上述刀之部位的操作。 ❹ 如請求項1至6中任一項之電子裝置之製造方法其中 於上述剝離步驟中更進而一面將導體連接於上述支持 基板及/或上述基板之任意部位以接地而抑制帶電，一面 將上述支持體與上述電子裝置剝離。 8. 如請求項1至7中任一項之電子裝置之製造方法，其中 於上述剝離步驟中更進而一面向上述支持體與上述電 子裝置之間噴附除電用物質而進行帶電控制，一面將上 述支持體與上述電子裝置剝離。 9.如請求項1至8中任一項之電子裝置之製造方法，其中 於上述剝離步驟中更進而一面檢測對上述刀之負載重 量，一面將上述刀插入至上述樹脂層與上述基板之界 面。 10_如請求項1至9中任一項之電子裝置之製造方法，其中 上述電子裝置為顯不裝置用面板。 11. 一種剝離裝置，其係將包含支持基板及樹脂層之支持體 自附支持體之電子裝置剝離者，該附支持體之電子裝置 係於包含第1主面及第2主面並於第2主面上具有顯示裝 置用構件之基板的第1主面上’密接有固定於包含第1主 面及第2主面之支持基板之第1主面且具有易剝離性之樹 脂層， 146274.doc 201039375 上述剥離裴置係包括： 平台，其與上ϋ附支持體之電子裝置之主面密接， 且包含可固^上述附支持體之電子裝置之平面狀之固定 面； 八用於將上述支持體自上述附支持體之電子裝 置剝離； 、，法線方向移動單元，其以將上述刀插人至固定於上 述平台之上述附支持體之電子裝置之端面中的、被剝離 述支持體中之上述樹脂層與上述基板之界面的方 式’使上述刀朝與上述平台之上述固定面之法線平行之 方向即法線方向移動；以及 口定面方向移動單元，其使上述刀於上述樹脂層與 上述基板之間移動；進而 上述刀具有如下性質，即，於插入至上述樹脂層與上 述基板之間之情形時，可藉由來自上述樹脂層及/或上述 基板之作用而變形，以便沿上述樹脂層之表面移動；且 及/或包括： 插入角度調整單元，其包含使上述刀以前端部為中 心旋轉而使上述刀之後端部於法線方向上移動之旋轉機 構、及設定上述刀之插入角度之上下限之插入角度設定 機構；以及法線方向移動機構，其使上述刀之整體於上 述法線方向上移動。 12 _如請求項11之剝離裝置，其中 更包括：複數個吸盤，其吸附被固定於上述平台之固 146274.doc 201039375 疋面上之上述附支持體之電子裝置中的被剝離之上述支 持體之上述支持基板之第2主面；以及吸盤移動單元， 其使上述吸盤於將上述樹脂層與上述基板剝離之方向即 剝離方向上移動。 13.如凊求項12之剥離裝置，其中 上述吸盤移動單元具有時間控制功能，#，依序進 订核作，錢上述複數個吸盤中之、位於離上述附支持 〇 體之電子裝置之端面中插入有上述刀之部位最近之處的 吸盤首先朝上述剝離方向移動，其次使其相鄰之吸盤朝 上述剝離方向移動，然後亦同樣地使已朝上述剝離方向 移動之吸盤之相鄰之吸盤接著朝上述剝離方向移動，從 而將上述支持體於自插入上述刀之端部朝向中央之方向 上剝離，並進而朝其延長線上剝離。 14·如請求項^至^中任一項之剝離裝置，其中 更包括圖像處理裝置，其用於確定上述樹脂層與上述 0 基板之界面中插入上述刀之部位。 15. 如請求項丨丨至“中任一項之剝離裝置，其中 更包括地線，其將導體連接於上述支持基板及/或上述 基板之任意部位而抑制帶電。 16. 如請求項丨丨至^中任一項之剝離裝置，其中 更包括帶電控制裝置，其向上述支持體與上述電 置之間噴附除電用物質而進行帶電控制。 、 17. 如請求項11至16甲任—項之剝離裝置，其中 更包括負載重量檢測裝置，其檢測對上述刀之負載重 146274.doc 201039375 量。 1 8.如請求項11至17中任一項之剝離裝置，其中 上述電子裝置為顯示裝置用面板。 146274.doc201039375 VII. Patent application scope: 1. A method for manufacturing an electronic device, comprising: a member for an electronic device and a substrate; and a manufacturing method thereof, comprising: an electron supporting the support body including the support substrate and the resin layer; The operation of the device peeling off, the electronic device with the support is included in the first! The first main surface of the substrate having the electronic device member on the second main surface and the second main surface is in contact with the first support surface of the support substrate including the second main surface and the second main surface The main surface and the resin layer having easy peelability, the manufacturing method thereof comprises: a fixing step of causing one of the two main faces included in the electronic device with the support to be attached, that is, not attached as a subsequent step One of the main faces of the peeled support in the peeling step is adhered to the planar fixing surface included in the platform, and the electronic device with the support is fixed to the fixing surface of the platform; and the peeling step is performed to insert the knife An end surface of the electronic device with the support attached to the fixing surface of the platform, that is, an interface between the resin layer of the peeled support and the substrate, thereby peeling the support from the electronic device. 2. The method of manufacturing an electronic device according to claim 1, wherein in the peeling step, the blade inserted into an interface between the resin layer and the substrate is deformed by an action from the resin layer and/or the substrate. Thereby, when the blade is further moved in the insertion direction, the blade moves along the surface of the resin layer to peel the support from the electronic device. 146274.doc 201039375 3. The method of manufacturing the electronic device of claim 1 or 2, wherein in the peeling step, the interface of the substrate is rotated, and the rear end portion is moved in the horizontal direction to insert the knife into the The resin layer and the knives are parallel to the normal line of the fixing surface of the turret around the tip end portion, and the entire knives are moved in at least one of the same parallel direction and the insertion direction. The blade is moved along the surface of the resin layer to peel the support from the electronic device. 4. As requested! The method of manufacturing an electronic device according to any one of the preceding claims, wherein after the fixing step and before the stripping step, further comprising adsorbing a plurality of suction cups on the second main surface of the support substrate of the peeled support. In the peeling step, after the knife is inserted into the interface between the resin layer and the substrate, the chuck is moved in a direction in which the resin layer and the substrate are peeled off, that is, in a peeling direction, thereby supporting the support body and the support body. The above electronic device is peeled off. 5. The method of manufacturing an electronic device according to claim 4, wherein the stripping step is further performed in sequence so that the plurality of chucks adsorbed on the second main surface of the support substrate are located away from the support The chuck having the closest portion of the end surface of the electronic device to which the blade is inserted is first moved in the peeling direction, and then the adjacent chuck is moved in the peeling direction, and then the peeling direction is similarly moved. The suction cup adjacent to the suction cup is then moved in the above-mentioned peeling direction, thereby peeling the support body from the end portion of the knives toward the center of the middle 146274.doc 201039375, and further peeling off toward the extension line. 6. The method of manufacturing an electronic device according to any one of claims 1 to 5, wherein the stripping step of 1 further comprises: determining, by image processing, an operation of inserting a portion of the knife in an interface between the tree layer and the substrate . The method of manufacturing an electronic device according to any one of claims 1 to 6, wherein in the peeling step, the conductor is connected to the support substrate and/or any portion of the substrate is grounded to suppress charging, and the above-mentioned The support is peeled off from the above electronic device. 8. The method of manufacturing an electronic device according to any one of claims 1 to 7, wherein in the peeling step, a charge-removing substance is sprayed between the support and the electronic device to perform charge control. The support is peeled off from the electronic device. 9. The method of manufacturing an electronic device according to any one of claims 1 to 8, wherein in the peeling step, the load on the blade is further detected, and the blade is inserted into an interface between the resin layer and the substrate. . The method of manufacturing an electronic device according to any one of claims 1 to 9, wherein the electronic device is a panel for a display device. A peeling device for separating an electronic device including a support substrate and a resin layer from a support, wherein the electronic device with the support includes a first main surface and a second main surface 2, the first main surface of the substrate having the member for display device on the main surface is in close contact with a resin layer which is fixed to the first main surface of the support substrate including the first main surface and the second main surface and has easy peelability, 146274 .doc 201039375 The above peeling device comprises: a platform which is in close contact with the main surface of the electronic device with the upper support, and includes a planar fixing surface of the electronic device capable of fixing the above support; The support body is peeled off from the electronic device with the support; the normal direction moving unit is detached from the end surface of the electronic device fixed to the support body of the platform by the cutter. The manner of the interface between the resin layer and the substrate in the body is such that the blade moves in a direction parallel to the normal to the fixed surface of the platform, that is, in the normal direction; And the knives move between the resin layer and the substrate; and the knives have the property that, when inserted between the resin layer and the substrate, the resin layer and/or Or deformed by the action of the substrate to move along the surface of the resin layer; and/or include: an insertion angle adjusting unit that rotates the knife about a front end portion such that the end portion of the knife is in a normal direction a rotation mechanism that moves upward, and an insertion angle setting mechanism that sets a lower limit of the insertion angle of the knife; and a normal direction movement mechanism that moves the entire blade in the normal direction. The peeling device of claim 11, further comprising: a plurality of suction cups for adsorbing the peeled support in the electronic device with the support attached to the top surface of the platform 146274.doc 201039375 The second main surface of the support substrate; and a chuck moving unit that moves the chuck in a direction in which the resin layer and the substrate are peeled off, that is, in a peeling direction. 13. The stripping device of claim 12, wherein the suction cup moving unit has a time control function, #, sequentially sorting the core, and the plurality of the plurality of suction cups are located at an end face of the electronic device attached to the supporting body The suction cup in which the portion of the knife is inserted is first moved toward the peeling direction, and then the adjacent suction cup is moved toward the peeling direction, and then the adjacent suction cup of the suction cup that has moved toward the peeling direction is similarly Then, the support is moved in the peeling direction, and the support is peeled off in the direction from the end portion of the blade inserted toward the center, and further peeled off toward the extension line. The stripping device according to any one of claims 1 to 4, further comprising an image processing device for determining a portion in which the blade is inserted into an interface between the resin layer and the 0 substrate. 15. The method of claim 1, wherein the stripping device further comprises a ground wire that connects the conductor to the support substrate and/or any portion of the substrate to suppress charging. A stripping device according to any one of the preceding claims, further comprising a charging control device for performing electrification control by spraying a substance for removing electricity between the support body and the electric device. 17., as claimed in claims 11 to 16 The stripping device of the present invention, further comprising a load weight detecting device for detecting the load of the knives 146274.doc 201039375. The stripping device of any one of claims 11 to 17, wherein the electronic device is a display Panel for the unit. 146274.doc
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