TW201332768A - Method for producing electronic device - Google Patents

Abstract

A manufacturing method of an electronic device capable of including a fissility glass substrate and a member for the electronic device is provided to provide the manufacturing method of the electronic device in which the productivity is excellent, and uses a carrier substrate including a resin layer with excellent flatness. A manufacturing method of an electronic device prepares a surface treatment process(S102) obtaining a fissility glass substrate having a surface showing an easy fissility by treating a first main surface of the glass substrate having the first main surface and a second main surface with a fissility material. By covering a curing resin composition layer on a surface showing an easy fissility of the fissility glass substrate, the curing resin composition layer formation process(S104) forming a hardening property resin composition layer is prepared. A lamination process (S106) is prepared to obtain the former hardening laminate layer by laminating a carrier substrate, having a smaller outer size than the outer size of the hardening property resin composition layer of the uncured, on the hardening property resin composition layer of the uncured in order to leave a fringe area which does not contact with the carrier substrate on the hardening property resin composition layer of the uncured. A hardening process(S108) obtaining the laminated layer after the hardening and having the resin layer is prepared by hardening the hardening property resin composition layer of the uncured in the former hardening laminated layer. A sawing process(S110) cutting the resin layer and the fissility glass substrate is prepared along the outer periphery of the carrier substrate within the post-cure laminate. A member formation process(S112) obtaining the laminate layer equipped with the member for the electronic device is prepared by forming the member for the electronic device on the second major surface of the fissility glass substrate. A singulation process(S114) obtaining the electronic device having the fissility glass substrate and the member for the electronic device is prepared as the laminate layer including the member for the electronic device.

Description

Electronic device manufacturing method

The present invention relates to a method of fabricating an electronic device.

In recent years, solar cells (PV, Photovoltaic, liquid crystal displays), organic EL (Electro Luminescence) panels (OLED, Organic Light Emitting Diode, organic light-emitting diodes) The thinning and weight reduction of devices (electronic devices) such as the polar body are progressing, and the thinning of the glass substrate used in these devices is progressing. If the strength of the glass substrate is insufficient due to the thinning, the handleability of the glass substrate is lowered in the manufacturing process of the device.

Therefore, a method of thinning a glass substrate by chemical etching treatment after forming a device member (for example, a thin film transistor) on a glass substrate having a thicker final thickness has been widely used. However, in this method, for example, when the thickness of one glass substrate is reduced from 0.7 mm to 0.2 mm or 0.1 mm, most of the original glass substrate is scraped off by an etching solution, so that productivity or The use efficiency of raw materials is not good.

Further, in the thinning method of the glass substrate produced by the above chemical etching, when there is a slight damage on the surface of the glass substrate, minute pits (corrosion pits) are formed from the damage by the etching process. It becomes a case of optical defects.

Recently, in order to cope with the above problems, it is proposed to have a laminated glass substrate and In the laminated body of the reinforcing plate, a method of separating the reinforcing plate from the glass substrate after forming a member for an electronic device such as a display device on the glass substrate of the laminated body (for example, refer to Patent Document 1). The reinforcing plate has a support and a resin layer fixed to the support, and the resin layer and the glass substrate are detachably adhered to each other. The interface between the resin layer of the laminate and the glass substrate is peeled off, and the reinforcing plate separated from the glass substrate can be laminated with the new glass substrate to be reused as a laminate.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 07/018028

On the other hand, in recent years, with the demand for higher performance of electronic devices, the miniaturization of components for electronic devices has progressed, and the steps performed have become more complicated. That is, in this case, it is also required to manufacture an electronic device excellent in performance with good productivity.

When the inventors of the present invention used the laminate described in Patent Document 1 to manufacture an electronic device, it was found that the performance of the obtained electronic device was inferior. For example, as a result of the fabrication of the OLED panel, there is a case where display unevenness occurs in the driving region of the panel.

The inventors of the present invention have studied the above-mentioned causes and found that the thickness of the resin layer in the laminate described in Patent Document 1 is uneven (particularly, the peripheral portion has a convex portion), which may impair the flatness of the glass substrate. As a result, the manufacturing yield of the electronic device is lowered.

In the case of producing the laminate described in Patent Document 1, it is shown in Fig. 8(A). A cross-sectional view of a carrier substrate 28 having a carrier layer of a carrier substrate 14 and a resin layer 18 is used. A glass substrate is laminated on the exposed surface of the resin layer 18 in the carrier substrate 28 with the resin layer to form a laminate. As shown in FIG. 8(A), the resin layer 18 formed by the method described in Patent Document 1 has thickness unevenness. In particular, the thickness is not uniform in the vicinity of the outer periphery of the resin layer 18, and the convex portion 80 is formed. When the glass substrate 82 is laminated on the resin layer 18 having such a thickness unevenness, the central portion of the glass substrate 82 is bent in a concave manner to impair the flatness of the glass substrate 82 (see FIG. 8(B)). Since the flatness of the glass substrate 82 is impaired, the positional displacement of the member for an electronic device disposed on the glass substrate 82 is caused, and as a result, the performance of the electronic device is lowered.

Further, as shown in FIG. 8(B), when the glass substrate 82 is laminated on the carrier substrate 28 of the resin-attached layer, a void 84 is formed between the glass substrate 82 and the resin layer 18. The laminated body is supplied to a manufacturing step of the member for an electronic device, and a functional layer such as a conductive layer is formed on the exposed surface of the glass substrate 82. At this time, various solutions such as a resist liquid are used.

If voids 84 are present in the laminate, various solutions enter by capillary action. The material that has entered the void 84 is difficult to remove even by washing, and is easily left as a foreign matter after drying. Since the foreign matter becomes a source of contamination of the member for contaminating the electronic device by heat treatment or the like, the performance of the electronic device is lowered, and as a result, the yield is lowered.

The present invention has been made in view of the above problems, and an object of the invention is to provide a method for producing an electronic device which is excellent in productivity of a carrier substrate having a resin layer excellent in flatness.

The present inventors conducted intensive studies in order to solve the above problems, and as a result, completed the present invention.

That is, the first aspect of the present invention is a method of manufacturing an electronic device, which is an electronic device including a member for a release glass substrate and an electronic device, and includes a surface treatment step of using a release agent pair The first main surface of the glass substrate of the main surface and the second main surface is treated to obtain a peelable glass substrate having a surface that is easily peelable; and the curable resin composition layer forming step is performed by the peeling property The curable resin composition is coated on the surface of the glass substrate which is easily peelable, and the uncured curable resin composition layer is formed; and the laminating step is performed to have a shape other than the uncured curable resin composition layer. The carrier substrate having a small size and a small size is laminated on the uncured curable resin composition layer so that the peripheral portion of the uncured curable resin composition layer does not remain in contact with the carrier substrate. Obtaining a pre-hardened laminate; a hardening step of hardening the uncured hardenable resin composition layer in the pre-hardened laminate Obtaining a cured laminated body having a resin layer; and a cutting step of cutting the resin layer and the peelable glass substrate along a periphery of the carrier substrate in the cured laminated body; and forming a member a laminate for forming an electronic device on the second main surface of the peelable glass substrate to obtain a laminate for a member for an electronic device, and a separation step for attaching the laminate to the member for the electronic device The glass substrate is separated from the electronic device of the above-described electronic device member.

In the first aspect, it is preferable to further include a defoaming step of performing the defoaming treatment of the uncured curable resin composition layer after the laminating step and before the curing step.

In the first aspect, it is preferred that the release agent comprises a compound having a methyl fluorenyl group or a fluoroalkyl group.

In the first aspect, it is preferred that the release agent contains an oxime oil or a fluorine compound.

In the first aspect, it is preferred that the resin layer contains a silicone resin.

In the first aspect, preferably, the resin layer is an addition reaction comprising a combination of an alkenyl group-containing organic alkenyl polyoxyalkylene and an organic hydrogen polyoxyalkylene having a hydrogen atom bonded to a halogen atom. Type of hardened oxygen.

Preferably, the organic hydrogen polyoxyalkylene has a molar ratio of a hydrogen atom bonded to a halogen atom to an alkenyl group of the above organic alkenyl polyoxyalkylene of 0.5 to 2.

In the first aspect, the resin layer preferably contains 5% by mass or less of non-hardenable organic siloxane.

In the first aspect, preferably, in the cutting step, the main surface of the carrier substrate in the cured laminated body is supported by the stage, and the outer periphery of the carrier substrate is brought into contact with the carrier. Positioning block on the stage.

In the first aspect, preferably, in the cutting step, after the dicing line is formed on the surface of the peelable glass substrate in the cured laminated body, the peeling property in the cured laminated body is along the dicing line. The outer periphery of each of the glass substrate and the resin layer was cut at one time.

According to the present invention, it is possible to provide a resin layer which is excellent in flatness. A method of manufacturing an electronic device excellent in productivity of a carrier substrate.

In the following, the embodiments of the present invention are described with reference to the drawings, but the present invention is not limited to the following embodiments, and various modifications and substitutions may be made in the following embodiments without departing from the scope of the invention.

The inventors of the present invention have studied the problems of the invention of Patent Document 1, and have found that the surface of the resin layer is unevenly affected by the influence of the application of the curable resin composition or the surface tension of the air interface. .

Therefore, it has been found that when the resin layer is brought into contact with a glass substrate exhibiting specific releasability in an uncured state, flatness is imparted, and then cured, whereby a laminate including a resin layer having specific flatness can be obtained. As a result, the performance degradation of the electronic device can be suppressed.

Hereinafter, a method of manufacturing an electronic device will be described in the order of the respective steps.

Further, in the present invention, the peeling strength at the interface between the resin layer and the layer of the carrier substrate in the cured laminated body described below is higher than the peeling strength at the interface between the layer of the glass substrate and the resin layer, which is also referred to as a resin. The layer is fixed to the carrier substrate, and the resin layer is detachably adhered to the glass substrate.

[First embodiment]

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the manufacturing steps of an embodiment of a method of manufacturing an electronic device according to the present invention. As shown in FIG. 1, the manufacturing method of the electronic device includes a surface treatment step S102, a curable resin composition layer forming step S104, a lamination step S106, a hardening step S108, a cutting step S110, and a structure. The forming step S112 and the separating step S114.

2(A) to 2(G) are schematic cross-sectional views showing respective manufacturing steps of the method of manufacturing the electronic device of the present invention.

Hereinafter, the materials used in the respective steps and the order thereof will be described in detail with reference to FIGS. 2(A) to 2(G). First, the surface treatment step S102 will be described in detail.

[Surface treatment steps]

The surface treatment step S102 is a step of treating the first main surface of the glass substrate having the first main surface and the second main surface with a release agent to obtain a peelable glass substrate having a surface which is easily peelable. By performing this step S102, the peelable glass substrate 10 which is peelably adhered to the resin layer described below can be obtained (see FIG. 2(A)). The peelable glass substrate 10 herein refers to a glass substrate having a surface 10a which is easily peelable to the resin layer described below. In addition, the surface of the peelable glass substrate has an easy-peelability, and is a case where a force for peeling off the peelable glass substrate from the laminated body after hardening is applied, and the carrier substrate and the resin layer are not used. The interface and the inside of the resin layer are peeled off to peel off the interface between the peelable glass substrate and the resin layer.

First, the glass substrate and the release agent used in this step will be described in detail, and the procedure of step S102 will be described in detail later.

(glass substrate)

The glass substrate is a plate-shaped substrate having a first main surface and a second main surface, and the first main surface thereof is surface-treated by a release agent. The first main surface which is subjected to surface treatment to exhibit easy peelability is detachably adhered to the resin layer described below, A member for an electronic device is provided on the second main surface on the side opposite to the side in contact with the resin layer.

The type of the glass substrate may be a normal one, and examples thereof include a glass substrate for a display device such as an LCD or an OLED. The glass substrate is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage rate. As an index of the heat shrinkage rate, the linear expansion coefficient prescribed in JIS (Japanese Industrial Standards) R3102 (1995 correction) is used.

When the linear expansion coefficient of the glass substrate is large, the member forming step S112 is often accompanied by heat treatment, so that various problems are likely to occur. For example, when a TFT (Thin Film Transistor) is formed on a glass substrate, if the glass substrate on which the TFT is formed under heating is cooled, the positional shift of the TFT is caused by thermal contraction of the glass substrate. Too big.

The glass substrate is obtained by melting a glass raw material and forming the molten glass into a plate shape. Such a molding method may be a normal one, and for example, a floating method, a melting method, a flow hole down method, a rich method, a Luber method, or the like may be used. Further, in particular, a glass substrate having a small thickness is obtained by heating a glass which has been temporarily formed into a plate shape to a temperature at which it can be formed, and forming it by a method of stretching and thinning by means of stretching or the like (re-drawing method).

The glass of the glass substrate is not particularly limited, but is preferably an alkali-free borosilicate glass, a borosilicate glass, a soda lime glass, a high cerium oxide glass, or another oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide of 40 to 90% by mass in terms of oxide.

As the glass of the glass substrate, a type suitable for a member for an electronic device is used. Or the glass of its manufacturing steps. For example, the glass substrate for a liquid crystal panel easily affects the liquid crystal by elution of an alkali metal component, and therefore contains glass (alkali-free glass) which does not substantially contain an alkali metal component (however, it usually contains an alkaline earth metal component). As such, the glass of the glass substrate is appropriately selected depending on the type of the apparatus to be applied and the manufacturing steps thereof.

The thickness of the glass substrate is not particularly limited, but is preferably 0.8 mm or less, more preferably 0.3 mm or less, and still more preferably 0.15 mm or less from the viewpoint of thickness reduction and/or weight reduction of the glass substrate. When it exceeds 0.8 mm, the requirements for thinning and/or weight reduction of the glass substrate cannot be satisfied. When it is 0.3 mm or less, the glass substrate can be imparted with good softness. When the thickness is 0.15 mm or less, the glass substrate can be wound into a roll shape. Moreover, the thickness of the glass substrate is preferably 0.03 mm or more for the reason that the glass substrate is easily produced and the glass substrate is easily handled.

Further, the glass substrate may include two or more layers. In this case, the materials forming the layers may be the same material or different materials. In this case, the "thickness of the glass substrate" means the total thickness of all the layers.

Further, other layered materials may be layered on one surface area of the glass substrate. For example, in order to enhance the strength of the glass substrate, a resin layer or the like may be laminated, and an inorganic thin film layer such as indium tin oxide or cerium oxide may be laminated.

(release agent)

As the release agent, a known release agent can be used, and examples thereof include a ruthenium-based compound (for example, a sulfonium-oxygen oil), a decylating agent (for example, hexamethyldiazepine or the like), and a fluorine-based compound (for example, Fluorine resin, etc.). The release agent can be used as an emulsion type, a solvent type, or a solventless type. In terms of peeling force, safety, cost, and the like, as a preferred example, any one containing a methyl fluorenyl group (≡SiCH ₃ , =Si(CH ₃ ) ₂ , or -Si(CH ₃ ) ₃ ) may be mentioned. Or a fluoroalkyl group (-C _m F _2m+1 ) (m is preferably an integer of 1 to 6), and other preferred examples include a fluorene-based compound or a fluorine-based compound, and particularly preferably ruthenium. Oxygen oil.

The type of the oxime oil is not particularly limited, and examples thereof include pure oxime oil such as dimethyl sulfonium oil, methyl phenyl sulfonium oil, and methylhydroquinone oxy-oil, and the side chain or end of the pure bismuth oil. A modified oxygenated oil having an alkyl group, a hydrogen group, an epoxy group, an amine group, a carboxyl group, a polyether group, a halogen group or the like is introduced. Specific examples of the pure helium oxide oil include methylhydrogenpolysiloxane, dimethylpolysiloxane, methylphenylpolysiloxane, diphenylpolysiloxane, and the like, and heat resistance is The order of enumeration is increased, and the highest heat resistance is diphenyl polysiloxane. The helium oxide oil is usually used for water repellent treatment on the surface of a substrate such as a glass substrate or a metal substrate subjected to an underlayer treatment.

The silicone oil preferably has an kinetic viscosity at 25 ° C of 5000 mm ² /s or less, more preferably 500 mm ² /s or less, from the viewpoint of the efficiency of the treatment in combination with the treated surface of the glass substrate. The lower limit of the dynamic viscosity is not particularly limited, but is preferably 0.5 mm ² /s or more in view of handling or cost.

The above-mentioned helium oxide oil is preferably a pure helium oxide oil, and the above-mentioned helium oxide oil is preferably dimethylpolyoxyl in terms of imparting particularly high releasability in terms of good releasability from the resin layer. alkyl. Further, in the case where it is necessary to have releasability and particularly heat resistance, methylphenyl polysiloxane or diphenyl polysiloxane is preferred.

The type of the fluorine-based compound is not particularly limited, and examples thereof include a perfluoroalkylammonium salt, a perfluoroalkylsulfonium decylamine, a perfluoroalkylsulfonate (for example, sodium perfluoroalkylsulfonate), and perfluoro Alkyl potassium salt, perfluoroalkyl carboxylate, perfluoroalkyl ethylene oxide adduct, perfluoroalkyl trimethyl ammonium salt, perfluoroalkyl amine sulfonate, perfluoroalkyl phosphate Esters, perfluoroalkyl compounds, perfluoroalkyl betaines, perfluoroalkyl halides, and the like. In addition, examples of the compound containing a fluoroalkyl group (C _m F _2m+1 ) include a compound having a fluoroalkyl group among the above-exemplified compounds of the above fluorine-based compound. The upper limit of m is not particularly limited in terms of peeling performance, but m is preferably an integer of 1 to 6 in terms of safety in terms of handling.

(order of steps)

The method of treating the surface of the glass substrate is appropriately selected depending on the release agent to be used. Usually, the treatment is carried out by applying (for example, coating) a release agent to the surface of the first main surface of the glass substrate.

For example, in the case of using a helium oxide oil, a method of applying a helium oxide oil to the surface of a glass substrate is mentioned. Among them, it is preferred to carry out a treatment of bonding the helium oxide oil to the treated surface of the glass substrate after applying the oxime oil. The treatment for binding the helium oxide oil to the surface to be treated is a treatment in which the molecular chain of the helium oxide oil is cut, and the cut piece is bonded to the surface to be treated (hereinafter, the treatment is referred to as low molecular weight of the helium oxide oil). ).

The coating method of the helium oxide oil can be a usual method. For example, it can be used in a spray coating method, a squeeze coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, a gravure coating method, or the like according to the type of the silicone oil. The coating amount or the like is appropriately selected.

The coating liquid is preferably dissolved in a solvent such as hexane, heptane, xylene or isoparaffin, and is dissolved in an amount of 5 mass% or less of the oxime oil. liquid. If it exceeds 5% by mass, the treatment time for the low molecular weight is too long.

The solvent contained in the coating liquid is removed by heating or/or drying under reduced pressure as needed. It can also be removed by heating in the low molecularization step.

The coating amount of the helium oxide oil is preferably from 0.1 to 10 μg/cm ² . When it is 0.1 μg/cm ² or more, the peeling property is more excellent, and in this respect, it is preferable, and when it is 10 μg/cm ² or less, the coating property and the low molecular weight treatment property of the coating liquid are more excellent. It is better.

In the method of lowering the molecular weight of the helium oxide oil, a usual method such as a method of cutting off the oxygen bond of the helium oxide oil by photolysis or thermal decomposition is used. In the photolysis, ultraviolet rays irradiated from a low-pressure mercury lamp or a xenon arc lamp or the like may be used, and ozone generated by ultraviolet rays in the atmosphere may be used in combination. The thermal decomposition can be carried out by using a batch furnace, a conveying furnace, or the like, or by using plasma or arc discharge.

When the helium oxygen bond of the helium oxide oil or the bond of the helium atom and the carbon atom is cleaved, the active site generated reacts with an active group such as a hydroxyl group of the surface to be treated. As a result, the density of the hydrophobic functional group such as a methyl group on the surface to be treated becomes high, and the density of the hydrophilic polar group is lowered, and as a result, the surface to be treated is easily peelable.

Further, the surface of the surface-treated glass substrate is preferably a sufficiently clean surface, preferably a surface just after cleaning. As the cleaning method, a usual method used for cleaning the glass surface or the resin surface is used.

Preferably, the surface which has not been surface-treated is previously protected by a protective film such as a mask.

Further, in the case of using a decylating agent such as hexamethyldiazepine, it is preferred to bring the vapor of the decylating agent into contact with the surface of the glass substrate. Furthermore, it can also The glass substrate is heated to be in contact with the vapor of the alkylating agent.

It is preferred that the higher the vapor concentration of the alkylating agent, that is, the near-saturated concentration, can shorten the processing time.

The contact time between the decylating agent and the glass substrate can be shortened as long as the function of the peelable glass substrate is not impaired.

The surface roughness Ra of the surface of the peelable glass substrate which is produced by the above-described order is further suppressed in terms of the thickness unevenness of the resin layer obtained in the hardening step S108 described below, and is preferably 2.0. Below nm, it is more preferably 1.0 nm or less, and further preferably 0.5 nm or less. The lower limit is not particularly limited, but is preferably 0 nm.

Further, the surface roughness Ra can be measured by an atomic force microscope (manufactured by Pacific Nanotechnology, Nano Scope IIIa; Scan Rate 1.0 Hz, Sample Lines 256, Off-line Modify Flatten order-2, Planefit order-2, etc.) and in accordance with JIS B. 0601 (2001).

The water contact angle of the surface of the peelable glass substrate which is easily peelable is preferably 90° or more, more preferably 90 to 120°, in terms of facilitating further peeling of the interface between the peelable glass substrate and the resin layer. Further preferably, it is 90 to 110°.

Further, the measurement of the water contact angle can be carried out using a contact angle meter (manufactured by Kurusu Co., Ltd., DROP SHAPE ANALYSIS SYSTEM DSA 10Mk2, etc.).

[Sclerosing resin composition layer forming step]

The curable resin composition layer forming step S104 is a step of: The surface of the peelable glass substrate obtained in the surface treatment step S102 is coated with a curable resin composition on the surface of the peelable glass substrate to form an uncured curable resin composition layer. More specifically, as shown in FIG. 2(B), the uncured curable resin composition layer 12 is formed on the peelable surface 10a of the peelable glass substrate 10.

The uncured curable resin composition layer is in contact with the peelable surface of the peelable glass substrate without leaving a gap. Therefore, when the curable resin composition layer is cured in the curing step S108 described below, the resin layer on which the flat surface of the peelable glass substrate is transferred can be obtained, and deformation of the peelable glass substrate can be suppressed.

First, the curable resin composition used in this step will be described in detail, and the procedure of the step S104 will be described in detail later.

(curable resin composition)

The curable resin composition used in the step S104 can form a composition of a resin layer (adhesive resin layer) in the curing step S108 described below.

The curable resin to be contained in the curable resin composition may have a tackifying property in which the cured film is adhered to the object, and a known curable resin (for example, a thermosetting composition, photohardening) may be used. Sex composition, etc.). For example, a curable acrylic resin, a curable urethane resin, a curable oxime, etc. are mentioned. Several kinds of curable resins may also be used in combination. Among them, curable oxime is preferred. This is because the heat-sensitive resin or the peeling property obtained by curing the curable oxime is excellent. Further, the reason is that when curable oxime is used, it is easily fixed to the glass substrate by a condensation reaction with a stanol group on the surface of the glass substrate described below.

The curable resin composition is preferably a curable epoxy resin composition (particularly preferably used as a curable silicone resin composition for release paper). The resin layer formed using the curable epoxy resin composition is intimately bonded to the surface of the glass substrate, and its free surface has excellent peelability, which is preferable.

The curable oxime which is used as the oxime resin for the release paper is classified into a condensation reaction type 矽 oxygen, an addition reaction type 矽 oxygen, an ultraviolet curing type 矽 oxygen, and an electron beam curing type 矽 oxygen according to the curing mechanism thereof, and any of them can be used. One. Among these, an addition reaction type helium oxygen is preferred. This is because the hardening reaction proceeds easily, and the degree of peeling property is good when the resin layer is formed, and the heat resistance is also high.

The addition reaction type oxime resin composition contains a main component and a crosslinking agent and is hardened by the presence of a catalyst such as a platinum-based catalyst. The hardening of the addition reaction type epoxy resin composition is promoted by heat treatment. The main component in the addition reaction type oxirane resin composition is preferably an organic polyoxyalkylene having an alkenyl group (vinyl group or the like) bonded to a ruthenium atom (i.e., an organic alkenyl polyoxane, further, It is preferably a linear chain), and an alkenyl group or the like becomes a crosslinking point. The crosslinking agent in the addition reaction type oxirane resin composition is preferably an organic oxirane having a hydrogen atom (hydroalkylene group) bonded to a ruthenium atom (i.e., an organic hydrogen polyoxy siloxane, and further, Preferably, it is a linear chain), and a hydroquinone group or the like becomes a crosslinking point.

The addition reaction type epoxy resin composition is hardened by an addition reaction of a crosslinking point of a main agent and a crosslinking agent.

Further, in terms of the more excellent heat resistance of the crosslinked structure, it is preferred that the organic hydrogen polyoxyalkylene is bonded to the hydrogen atom of the halogen atom relative to the organic The alkenyl group of the alkenyl polyoxyalkylene has a molar ratio of 0.5 to 2.

Further, the curable silicone resin composition for forming a release layer such as release paper may be of a solvent type, an emulsion type or a solventless type, and any type may be used. Among these, a solventless type is preferred. The reason is that it is excellent in productivity, safety, and environmental characteristics. In addition, the solvent is not contained in the resin layer which is formed when the resin layer is formed, that is, when it is cured by heat, ultraviolet curing, or electron beam curing, so that bubbles do not easily remain in the resin layer.

In addition, as a curable silicone resin composition for forming a release layer such as a release paper, specifically, KNS-320A and KS-847 (both Shin-Etsu Silicones) are commercially available as trade names or models. Manufactured, TPR6700 (manufactured by Momentive Performance Materials JaPan Co., Ltd.), vinyl oxime "8500" (manufactured by Arakawa Chemical Industries, Ltd.), and methyl hydrogen polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries, Ltd.), ethylene A combination of a group of "11364" (manufactured by Arakawa Chemical Industries Co., Ltd.) and a methyl hydrogen polyoxyalkylene "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.), vinyl oxime "11365" (manufactured by Arakawa Chemical Industries Co., Ltd.) and A A combination of a base hydrogen polyoxane "12031" (manufactured by Arakawa Chemical Industries, Ltd.).

Further, KNS-320A, KS-847, and TPR6700 are hardenable oxime resin compositions containing a main component and a crosslinking agent in advance.

(order of steps)

The method of applying the curable resin composition on the surface of the peelable glass substrate which is easily peelable is not particularly limited, and a known method can be employed. For example, as a coating method, a spraying method, a squeeze coating method, and a spinning method are mentioned. A spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, a gravure coating method, or the like. From the above methods, it can be appropriately selected depending on the kind of the curable resin composition.

Further, the coating amount of the curable resin composition is not particularly limited, and from the viewpoint of obtaining a preferable thickness of the resin layer, it is preferably from 1 to 100 g/m ² , more preferably from 5 to 20 g/m. ² .

In the case where the curable resin composition contains a solvent, the solvent may be volatilized by heat treatment to the extent that the curable resin is not cured.

The thickness of the uncured curable resin composition layer obtained by applying the curable resin composition to the release glass substrate is not particularly limited, and is appropriately adjusted in order to obtain a resin layer having a preferable thickness as described below.

The outer shape of the formed uncured curable resin composition layer is the same as or smaller than the outer shape of the peelable glass substrate.

[Lamination step]

The lamination step S106 is a step of: a carrier substrate having a shape smaller than that of the uncured curable resin composition layer, and an uncured hardening obtained in the above-described curable resin composition layer forming step S104. The resin composition layer is laminated on the uncured curable resin composition layer so as to remain in the peripheral layer region which is not in contact with the carrier substrate, and the pre-cured laminate (the laminate before the hardening treatment) is obtained. In other words, the carrier substrate is laminated on the uncured curable resin composition layer so that the uncured curable resin composition layer is exposed on the periphery of the carrier substrate.

More specifically, as shown in FIG. 2(C), according to this step S106, The carrier substrate 14 having a small size outside the hardened curable resin composition layer 12 is laminated on the unhardened curable resin composition layer 12 to form a peripheral region 12a which is not in contact with the carrier substrate 14, and is laminated in an unhardened manner. On the curable resin composition layer 12, a laminated body 16 before hardening is obtained. 3(A) is a plan view of the laminated body 16 before hardening, and as shown in the figure, the peripheral region 12a of the uncured curable resin composition layer 12 is not in contact with the carrier substrate 14.

In general, the exposed surface of the uncured curable resin composition layer 12 is likely to have a convex portion in the vicinity of the peripheral portion due to the influence of the surface tension (see FIG. 3(B)). When the carrier substrate 14 is laminated, when the contact portion is in contact with the convex portion, a void 32 or the like is formed between the carrier substrate 14 and the uncured curable resin composition layer 12, and as a result, the carrier substrate 14 is unhardened. The case where the region of the curable resin composition layer 12 is not in contact (Fig. 3(C)). If such a region is present, there is a case where the adhesion of the resin layer obtained in the hardening step S108 to the carrier substrate 14 is lowered. Further, there is a case where the thickness of the resin layer is uneven, and the surface unevenness may be formed on the exposed surface of the carrier substrate with the resin layer. Further, foreign matter enters the gap 32 and becomes a source of contamination of the member for contaminating the electronic device, which may also cause a decrease in the yield of the electronic device.

Therefore, by using the carrier substrate 14 having a shape smaller than that of the uncured curable resin composition layer 12, the carrier substrate 14 can be hardened without being hardened by contact with the convex portion. The resin composition layer 12 is in contact. As a result, the region where the carrier substrate 14 and the uncured curable resin composition layer 12 are not contacted is further suppressed, and the adhesion of the resin layer to the carrier substrate 14 is further improved, and the generation of the tree is further suppressed. The thickness of the lipid layer is uneven.

First, the carrier substrate used in this step will be described in detail, and the sequence of step S106 will be described in detail later.

(carrier substrate)

The carrier substrate is a substrate that prevents deformation, damage, breakage, or the like of the peelable glass substrate during manufacture of the electronic device member in the member forming step S112 (step of manufacturing the electronic device) described below.

As the carrier substrate, for example, a glass plate, a plastic plate, a metal plate such as a SUS (Steel Use Stainless) plate, or the like can be used. When the carrier substrate is subjected to heat treatment in the member forming step S112, it is preferably formed of a material having a small difference in linear expansion coefficient from the peelable glass substrate, and more preferably formed of the same material as the peelable glass substrate. The substrate is preferably a glass plate. In particular, the carrier substrate is preferably a glass plate containing the same glass material as the release glass substrate.

The thickness of the carrier substrate may be thicker than that of the peelable glass substrate, or may be thinner. It is preferable to select the thickness of the carrier substrate in accordance with the thickness of the peelable glass substrate, the thickness of the resin layer, and the thickness of the laminated body after the cutting. For example, the current member forming step is a member forming process (for example, cleaning, film formation, or the like) for a member for forming a member having a thickness of 0.5 mm (the current operation as a substrate of a carrier substrate without a laminate of a carrier substrate). In the case where the thickness of the peelable glass substrate and the thickness of the resin layer are 0.1 mm, the thickness of the carrier substrate is set to 0.4 mm. The thickness of the carrier substrate is preferably 0.2 to 5.0 mm in the usual case.

When the carrier substrate is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for reasons of easy handling and difficulty in cracking. In addition, it is desirable that the thickness of the glass plate is 1.0 mm or less for the reason that the member for the electronic device is formed to be rigid and not bent at the time of peeling and is appropriately bent.

The difference between the average linear expansion coefficient (hereinafter simply referred to as "average linear expansion coefficient") of the peelable glass substrate and the carrier substrate at 25 to 300 ° C is preferably 500 × 10 ^-7 / ° C or less, more preferably 300. ×10 ^-7 /°C or less, further preferably 200×10 ^-7 /°C or less. If the difference is too large, there is a possibility that the laminated body is severely warped during heating and cooling in the member forming step S112. When the material of the peelable glass substrate is the same as the material of the carrier substrate, the occurrence of such a problem can be suppressed.

(order of steps)

The method of laminating the carrier substrate on the uncured curable resin composition layer is not particularly limited, and a known method can be employed.

For example, a method of stacking a carrier substrate on the surface of an uncured curable resin composition layer under a normal pressure environment can be exemplified. Further, if necessary, the carrier substrate may be stacked on the surface of the uncured curable resin composition layer, and then the carrier substrate may be pressure-bonded to the uncured curable resin composition layer using a roll or a press. It is preferable to use a pressure contact by a roll or a press to relatively easily remove bubbles which are mixed between the layer of the uncured curable resin composition and the layer of the carrier substrate.

When the pressure is bonded by a vacuum lamination method or a vacuum press method, it is more preferable to suppress the incorporation of air bubbles or to ensure good adhesion. By vacuum When the pressure is applied, even if minute bubbles are left, the bubbles are not grown by heating, and it is difficult to cause deformation defects of the carrier substrate.

In the case of laminating a carrier substrate, it is preferred to sufficiently clean the surface of the carrier substrate which is in contact with the uncured curable resin composition layer, and to laminate the layer in an environment having a high degree of cleanliness. The higher the cleanliness, the better the flatness of the carrier substrate, which is preferable.

The layer before the hardening obtained by the above steps sequentially includes a layer of a peelable glass substrate, an uncured curable resin composition layer, and a layer of a carrier substrate.

In this aspect, the shape of the uncured curable resin composition layer is larger than that of the carrier substrate. The ratio (area A / total area B) of the area A of the region of the uncured curable resin composition layer in contact with the carrier substrate to the total area B of the uncured curable resin composition layer is preferably 0.98 or less. Good is below 0.95. When it is in the above range, the occurrence of thickness unevenness of the resin layer is further suppressed. The lower limit is not particularly limited, but is preferably 0.75 or more, and more preferably 0.80 or more in terms of productivity and the like.

Moreover, the length from the outer periphery of the carrier substrate to the outer periphery of the uncured curable resin composition layer is preferably 10 mm or more, and more preferably 15 mm or more. When it is in the above range, the occurrence of thickness unevenness of the resin layer is further suppressed. The upper limit is not particularly limited, but is preferably 100 mm or less in terms of productivity and the like.

[hardening step]

The hardening step S108 is a step of obtaining the above-mentioned lamination step S106 The hardened pre-hardened laminate is subjected to a hardening treatment to harden the uncured curable resin composition layer in the laminate before curing, thereby obtaining a post-hardened laminate having a resin layer (a laminate subjected to hardening treatment). More specifically, as shown in FIG. 2(D), by performing this step, the uncured curable resin composition layer 12 is cured to obtain the resin layer 18, and the peelable glass substrate 10 is obtained in order. The laminated layer 20 of the layer, the resin layer 18, and the layer of the carrier substrate 14 is cured.

Hereinafter, the procedure of the steps carried out in this step will be described in detail, and then the configuration of the obtained laminate will be described in detail.

(order of steps)

The hardening treatment carried out in this step is appropriately selected depending on the type of the curable resin to be used, but usually, heat treatment or exposure treatment is performed.

When the curable resin contained in the curable resin composition layer is thermosetting, the layer can be cured by heat-treating the uncured curable resin composition layer. The conditions of the heat treatment are appropriately selected depending on the type of the thermosetting resin to be used. Among them, in terms of the curing speed of the curable resin and the heat resistance of the formed resin layer, it is preferably heated at 150 to 300 ° C (preferably 180 to 250 ° C) for 10 to 120 minutes (compared to Good for 30~60 minutes).

When the curable resin contained in the curable resin composition layer is a photocurable resin, the layer can be cured by subjecting the uncured curable resin composition layer to an exposure treatment. The type of light to be irradiated during the exposure treatment is appropriately selected depending on the type of the photocurable resin, and examples thereof include ultraviolet light. Light, visible light, infrared light, etc. Further, the irradiation time during the exposure treatment is preferably from 0.1 to 10 minutes (preferably from 0.5 to 5 minutes) in terms of the curing speed of the curable resin and the light resistance of the formed resin layer.

(resin layer)

Next, the resin layer in the laminated body after hardening will be described in detail.

The thickness of the resin layer is not particularly limited, but is preferably 1 to 100 μm, more preferably 5 to 30 μm, still more preferably 7 to 20 μm. This is because if the thickness of the resin layer is in this range, the adhesion between the resin layer and the carrier substrate becomes sufficient. Moreover, this is because the occurrence of deformation defects of the peelable glass substrate can be suppressed even when air bubbles or foreign matter are interposed between the resin layer and the carrier substrate. Further, if the thickness of the resin layer is too thick, time and material are required at the time of formation, which is uneconomical.

Further, the resin layer may contain two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all the layers.

Further, when the resin layer contains two or more layers, the types of the resins forming the respective layers may be different.

The resin layer preferably contains a material having a glass transition point lower than room temperature (about 25 ° C) or having no glass transition point. This is because the peeling glass substrate can be more easily peeled off and the adhesion to the peelable glass substrate is also sufficient.

The type of the resin forming the resin layer is not particularly limited, and varies depending on the type of the resin contained in the curable resin composition. For example, an acrylic resin, a polyolefin resin, a polyurethane resin, or a oxime resin can be mentioned. Among them, as described above, a silicone resin is preferred.

In addition, the resin layer may contain a non-hardening organic siloxane, and the content thereof is specifically 5% by mass or less (0 to 5% by mass), preferably 0.01 to 1% by mass. When the non-hardenable organic siloxane is contained in the resin layer, the separation of the interface between the detachable glass substrate and the resin layer in the separation step S114 described below is further efficiently performed.

The method of containing the non-curable organic decane in the resin layer is not particularly limited, and a method of adding the composition to the curable resin composition is exemplified.

Further, examples of the non-curable organic siloxane include an oxime oil which does not contain a Si—H bond, and specific examples thereof include a polydimethyl siloxane or a polymethyl phenyl siloxane. Oxygen oil, etc.

(Laminated body after hardening)

The cured laminated body obtained by the above-described hardening step sequentially has a layer of a peelable glass substrate, a resin layer, and a layer of a carrier substrate.

In the obtained post-hardened laminate, the resin layer was fixed (and subsequently) on the carrier substrate, and was peelably adhered to the peelable glass substrate. The resin layer prevents the positional shift of the peelable glass substrate until the separation of the peelable glass substrate and the carrier substrate with the resin layer is performed in the separation step S114 described below.

The surface of the peelable glass substrate that is in contact with the resin layer is peelably adhered to the surface of the resin layer. In the present invention, the property of the peelable glass substrate which can be easily peeled off is referred to as easy peelability.

In the present invention, the above-mentioned fixation differs from the (peelable) in the peel strength (that is, the stress required for peeling), and the fixing means that the peel strength is large with respect to the adhesion. Specifically, the tree in the laminated body after hardening The peeling strength of the interface between the layer of the lipid layer and the carrier substrate is larger than the peeling strength of the interface between the layer of the peelable glass substrate and the resin layer.

Further, the peelable adhesive means peelable, and also refers to peeling off in the case where peeling of the fixed surface is not caused. Specifically, in the case where the peeling glass substrate and the carrier substrate are separated from each other in the laminated body after curing, the surface is adhered to the surface to be adhered, and the surface to be fixed is not peeled off. Therefore, when the laminated body after hardening is separated into the peelable glass substrate and the carrier substrate, the laminated body after the hardening is separated into two of the peelable glass substrate and the carrier substrate with the resin layer.

As described above, the uncured curable resin composition layer is reactively cured in a state of being in contact with the surface of the carrier substrate, so that the formed resin layer is strongly adhered to the surface of the carrier substrate. On the other hand, the uncured curable resin composition layer is reactively cured in a state of being in contact with the peelable glass substrate, but the resin formed by the surface of the peelable glass substrate is easily peelable (non-adhesive). The layer is intimately bonded to the peeling glass substrate by a weak bonding force such as a bonding force between solid molecules and a Van Der Waals force.

[cutting step]

The cutting step S110 is a step of cutting the resin layer and the peelable glass substrate along the outer periphery of the carrier substrate in the cured laminated body obtained in the curing step S108. In other words, the outer peripheral portion of each of the resin layer and the peelable glass substrate in the laminated body after curing is cut so that the periphery of each of the carrier substrate, the resin layer, and the peelable glass substrate is completed. The step of aligning. More specifically, as shown in FIG. 2(E), according to this step, along the carrier The resin layer 18 and the peelable glass substrate 10 are cut off from the outer periphery of the substrate 14, and the laminated body 22 after cutting (the laminated body subjected to the cutting process) is obtained.

Hereinafter, the sequence of this step S110 will be described in detail.

The method of cutting the resin layer and the peelable glass substrate is not particularly limited, and a known method can be employed. For example, the cutting method described based on FIGS. 4 to 6 is preferable in terms of operability and the like.

Figure 4 is a plan view showing a portion of the hardened laminated body placed on the stage, and Figure 5 is a view showing a part of the hardened laminated body and the working head placed on the stage. FIG. 6 is a cross-sectional view showing the hardened laminated body and the holding jig placed on the other stage.

As shown in FIG. 4, the laminated body 20 after curing is supported by the stage 50 to support the main surface of the carrier substrate 14, and the outer periphery of the carrier substrate is brought into contact with the positioning blocks 51 to 53 provided on the stage 50.

In FIG. 4, the exposed surface of the carrier substrate 14 is supported by the upper surface of the stage 50, and the mutually perpendicular sides 14a and 14b of the rectangular carrier substrate 14 are brought into contact with the positioning blocks 51-53. Thereafter, the moving blocks 54, 55 are brought close to and abut against the remaining sides 14c, 14d of the carrier substrate 14.

As shown in FIG. 4, when the outer peripheral edge of the carrier substrate 14 is brought into contact with the positioning blocks 51 to 53, the alignment accuracy of the outer peripheral edge of the carrier substrate 14 and the stage 50 is improved. Therefore, the outer periphery of the carrier substrate 14 and the outer periphery of the resin layer 18 and the peelable glass substrate 10 are accurately aligned.

Further, the plurality of adsorption holes provided on the upper surface of the stage 50 are decompressed by a vacuum pump or the like, and the carrier substrate 14 is adsorbed on the upper surface of the stage 50. in order to The carrier substrate 14 may be protected, and a resin film or the like may be provided on the upper surface of the stage 50.

Next, the imaging device images the hardened laminated body 20 on the stage 50. The captured image is transferred to a computer. The computer performs image processing on the received image to detect the positional relationship between the outer periphery of the carrier substrate 14 and the stage 50.

Next, the computer relatively moves the processing head 60 of the laminated body 20 after work hardening with respect to the stage 50 based on the result of the image processing. The movement locus of the processing head 60 is controlled so as to overlap the outer periphery of the carrier substrate 14 in plan view (see FIG. 5).

Further, in the present embodiment, the computer uses the result of image processing in order to control the movement trajectory of the processing head, but may alternatively use information on the shape and size of the carrier substrate previously recorded on a recording medium such as a hard disk. In this case, an imaging device is not required.

The processing head 60 shown in FIG. 5 is configured according to the type, thickness, and the like of the peelable glass substrate 10. For example, the processing head 60 is formed of a cutter 62 or the like by forming a cutting line 66 on the surface of the peelable glass substrate 10.

The cutter 62 is, for example, a disk shape, and the outer peripheral portion is formed of diamond or superalloy, and the holder 64 is rotatably supported. When the retainer 64 is relatively moved in the in-plane direction of the peelable glass substrate 10 while the outer peripheral portion of the cutter 62 is pressed against the surface of the peelable glass substrate 10, the cutter 62 is rotated on the peeling glass. The surface of the substrate 10 forms a cutting line 66.

The cutting line 66 is provided in four rows corresponding to the four sides 14a, 14b, 14c, and 14d of the rectangular carrier substrate 14, and each of them is arranged in a plan view and a carrier substrate. The corresponding sides of 14 are formed in an overlapping manner. Each of the dicing lines 66 extends from one side of the detachable glass substrate 10 to the other side so as to break the surface of the detachable glass substrate 10.

Further, the processing head 60 of the present embodiment shown in FIG. 5 is constituted by a cutter 62 or the like, but the front end may also be a point-shaped scriber which is formed in a conical shape and formed by diamond and cut into a cutting line by sliding. It can be composed of a laser light source or the like. The laser light source irradiates the surface of the peelable glass substrate 10 with a light spot. The light spot is scanned on the surface of the peelable glass substrate 10, and the cut line 66 is formed by thermal stress.

After the cutting line 66 is formed by the processing head 60, the vacuum pump is stopped, the inside of the suction hole is opened to the atmosphere, and the suction is released. Next, the moving blocks 54, 55 are separated from the carrier substrate 14, and the carrier substrate 14 is separated from the positioning blocks 51-53. Thereafter, the hardened laminated body 20 is lifted above the stage 50 and then transferred to the upper side of the other stage 70. Then, the hardened laminated body 20 is lowered to the lower side and then placed on the stage 70 (refer to FIG. 6).

Next, as shown in FIG. 6, the plurality of suction holes provided on the upper surface of the stage 70 are decompressed by a vacuum pump or the like, and the carrier substrate 14 is adsorbed on the upper surface of the stage 70. In this state, a cutting line 66 protrudes from the outer side of the stage 70.

Next, the portion outside the one cutting line 66 is sandwiched by the holding jig 72 in the thickness direction. In this state, when the clamp jig 72 is rotated in the downward direction, bending stress is applied to the peelable glass substrate 10 and the resin layer 18, so that the crack 68 is extended in the thickness direction from the one cutting line 66 as a starting point. The peelable glass substrate 10 and the resin layer 18 are once cut (see FIG. 6).

Next, the adsorption of the carrier substrate 14 on the stage 50 is released, and after the hardening, the layered body 20 is again adsorbed by being moved in parallel or rotated by 90°. Thereafter, the peelable glass substrate 10 and the resin layer 18 are cut along the other cutting line 66. The above operation is repeated, and the peelable glass substrate 10 and the resin layer 18 are cut along the four cutting lines 66.

Further, in the present embodiment, in order to perform the cutting, the laminated body after curing is transferred from the stage 50 to the other stage 70, but may be moved or rotated 90° in parallel on the same stage 50. Then cut it. Further, the cut portion may be chamfered as needed.

[Component forming step]

The member forming step S112 is a step of forming a member for an electronic device on the second main surface of the peelable glass substrate in the laminated body obtained in the cutting step S110, and obtaining a laminate of the member for an electronic device. .

More specifically, as shown in FIG. 2(F), the electronic device member 24 is formed on the second main surface 10b of the peelable glass substrate 10, and the laminated body 26 for the electronic device is obtained.

First, the components for electronic devices used in this step will be described in detail, and the order of the steps will be described in detail later.

(Mechanical components (functional components))

The member for an electronic device is formed on the second main surface of the peelable glass substrate in the laminated body after the cutting, and constitutes at least a part of the electronic device. More specifically, examples of the member for an electronic device include a panel for a display device, a solar cell, a thin film secondary battery, or a surface formed with electricity. A component used in electronic parts such as semiconductor wafers. The panel for a display device includes an organic EL panel, a plasma display panel, a field emission panel, and the like.

For example, as a member for a solar cell, a transparent electrode such as tin oxide of a positive electrode, a tantalum layer represented by a p layer/i layer/n layer, and a negative electrode metal may be mentioned. Various members corresponding to compound type, dye-sensitized type, quantum dot type, and the like.

In addition, examples of the lithium ion type include a transparent electrode such as a positive electrode, a negative electrode metal or a metal oxide, a lithium compound of an electrolyte layer, a metal of a collector layer, a resin as a sealing layer, and the like. In addition, various members corresponding to a nickel hydrogen type, a polymer type, a ceramic electrolyte type, etc. are mentioned.

In addition, as a member for an electronic component, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) may be exemplified by a metal of a conductive portion or a ruthenium oxide of an insulating portion. Other than the above, various components such as a pressure sensor and an acceleration sensor, or a rigid printed circuit board, a flexible printed circuit board, a rigid flexible printed circuit board, or the like can be used.

(order of steps)

The method for producing the laminated body of the member for an electronic device is not particularly limited, and the second main surface of the peelable glass substrate of the laminated body after the cutting is used according to the type of the constituent member of the electronic device member by a conventionally known method. A member for an electronic device is formed.

In addition, the member for the electronic device may not be the entire member (hereinafter referred to as "all members") which is finally formed on the second main surface of the peelable glass substrate, and is a part of all members (hereinafter referred to as "partial member" "). In the subsequent step, the peelable glass substrate to which the member is peeled off from the resin layer may be a peelable glass substrate (corresponding to an electronic device described below).

Moreover, the laminated body with all the members may be assembled, and the carrier substrate with the resin layer may be peeled off from the laminated body of all the members thereafter to manufacture an electronic device. Further, the electronic device can be assembled by using two laminated bodies with all the members, and the carrier substrate of the two resin-attached layers can be peeled off from the laminated body of all the members thereafter to manufacture an electronic device.

For example, in the case of manufacturing an OLED, an organic EL is formed on the surface on the side opposite to the resin layer side of the peelable glass substrate of the laminated body (corresponding to the second main surface of the peelable glass substrate). In the structure, a transparent electrode is formed, and a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like are deposited on the surface on which the transparent electrode is formed, and a back electrode is formed, and various layers such as a sealing plate are used for sealing. Or deal with. Specific examples of the formation or treatment of such a layer include a film formation treatment, a vapor deposition treatment, and a subsequent treatment of a sealing plate.

Further, for example, the TFT-LCD manufacturing method has the steps of forming a TFT on the second main surface of the peelable glass substrate after the cut laminated body, and forming the film by CVD (using CVD) Thin film transistor formed by metal film and metal oxide film formed by a usual film formation method such as Chemical Vapor Deposition, Chemical Vapor Deposition, and sputtering (TFT); CF (Color Filter) forming step of the second main surface 1 of the glass substrate of the laminated body after the cutting, and the resist liquid is used for pattern formation to form a color filter (CF); and a bonding step of interposing the laminated body of the TFT obtained in the TFT forming step and the laminated body of the CF obtained in the CF forming step so as to face the sheet by the TFT and the CF.

In the TFT forming step or the CF forming step, TFT or CF is formed on the second main surface of the peelable glass substrate using a well-known photolithography technique or etching technique. At this time, a resist liquid was used as the coating liquid for pattern formation.

Further, the second main surface of the peelable glass substrate may be cleaned as needed before forming the TFT or CF. As the cleaning method, a well-known dry cleaning or wet cleaning can be used.

In the bonding step, for example, a liquid crystal material is injected between the laminated body with the TFT and the laminated body with the CF to laminate. As a method of injecting a liquid crystal material, for example, a pressure reduction injection method or a dropping injection method is available.

[Separation step]

The separation step S114 is a step of forming a laminate of the member for an electronic device obtained in the step S112 from the member, and removing the resin layer having the resin layer and the carrier substrate with the peeling surface at the interface between the peelable glass substrate and the resin layer. The carrier substrate is used to obtain an electronic device having a peelable glass substrate and a member for an electronic device. More specifically, as shown in FIG. 2(G), the carrier substrate 28 with the resin layer is separated and removed by the laminated body 26 of the member for electronic device according to the step S114, and the peelable glass substrate 10 is obtained. The electronic device 30 is connected to the member 24 for electronic devices.

In the case where the member for an electronic device on the peelable glass substrate at the time of peeling is a part of all the constituent members required, the remaining constituent members may be formed on the peelable glass substrate after the separation.

The method of peeling off the peelable glass substrate and the resin layer is not specifically limited. Specifically, for example, a sharp cutter can be inserted into the interface between the peelable glass substrate and the resin layer to provide a starting point for peeling, and then a mixed fluid of water and compressed air can be discharged and peeled off. Preferably, the carrier substrate in the laminate of the member for electronic device is placed on the upper side of the carrier, and the member for electronic device is placed on the pressure plate, and the member side of the electronic device is vacuum-applied to the pressure plate. Next, the cutter is first introduced into the interface between the peelable glass substrate and the resin layer. Then, the side of the carrier substrate was adsorbed by a plurality of vacuum suction pads, and the vacuum suction pad was sequentially raised from the vicinity of the portion where the cutter was inserted. As a result, an air layer is formed at the interface between the peelable glass substrate and the resin layer, and the air layer spreads over the entire surface of the interface, and the carrier substrate with the resin layer can be easily peeled off.

Further, when the carrier substrate with the resin layer is removed from the laminate of the member for electronic device, by controlling the discharge or humidity of the ionizer, it is possible to suppress static electricity which may affect the electronic device. Alternatively, the electronic device may be incorporated into a circuit that consumes static electricity, or a sacrificial circuit may be incorporated to obtain conduction from the terminal portion to the outside of the laminate.

The electronic device obtained by the above steps is preferably used for the manufacture of a small display device used in a mobile terminal such as a mobile phone or a PDA (Personal Digital Assistant). Display device is mainly LCD or OLED, as LCD, including TN (Twisted Nematic), STN (Super Twisted Nematic), FE (Field Effect), TFT, MIM (Metal Insulator Metal) , metal-insulator-metal type, IPS (In-Plane Switching) type, VA (Vertical Alignment) type, etc. It can be applied basically in the case of any of the passive driving type and the active driving type.

[Second embodiment]

Fig. 7 is a flow chart showing the manufacturing steps in another embodiment of the method of manufacturing the electronic device of the present invention. As shown in FIG. 7, the manufacturing method of the electronic device includes a surface treatment step S102, a curable resin composition layer forming step S104, a lamination step S106, a defoaming step S116, a hardening step S108, a cutting step S110, and a member forming step S112. And separating step S114.

The steps shown in FIG. 7 are the same as the steps shown in FIG. 1 except for the point of the defoaming step S116, and the same reference numerals are attached to the same steps, and the description thereof is omitted, and the following main cancellations are omitted. The bubble step S116 will be described.

[Defoaming step]

The defoaming step S116 is a step of performing a defoaming treatment of the uncured curable resin composition layer after the laminating step S106 and before the curing step S108. By providing this step S116, bubbles or volatile components are removed from the uncured curable resin composition layer, and the adhesion between the obtained resin layer and the carrier substrate is further enhanced.

The treatment method of the defoaming step is appropriately selected depending on the material of the uncured curable resin composition layer to be used, and examples thereof include vacuum defoaming using a vacuum pump or centrifugal defoaming using centrifugal force. Ultrasonic defoaming of the ultrasonic defoaming device. In terms of productivity, etc., it is preferred to carry out defoaming and defoaming under decompression under reduced pressure, and as a condition, it is preferable to carry out defoaming treatment at 1000 Pa or less (preferably 100 Pa or less). 30 minutes or so.

[Examples]

Hereinafter, the invention will be specifically described by way of examples, but the invention is not limited by the examples.

In the following Examples 1 and 4 to 6 and Comparative Examples 1 and 2, a glass plate containing an alkali-free borosilicate glass (length 760 mm, width 640 mm, thickness) was used as the glass substrate for the peelable glass substrate. 0.3 mm, linear expansion coefficient 38 × 10 ^-7 / ° C, manufactured by Asahi Glass Co., Ltd., trade name "AN100"). Further, as the carrier substrate, a glass plate containing an alkali-free borosilicate glass (720 mm in length, 600 mm in width, 0.7 mm in plate thickness, and a coefficient of linear expansion of 38 × 10 ^-7 /° C., manufactured by Asahi Glass Co., Ltd., trade name) was used in the same manner. "AN100").

(Example 1)

The glass substrate used as the peelable glass substrate is subjected to pure water washing and UV (ultraviolet) cleaning to clean the surface. Thereafter, a mask was applied to the second main surface of one side of the glass substrate, and then a heptane solution having a parafoaming oil content of 1% by mass was sprayed on the first main surface on the opposite side and dried. The oxime oil was dimethylpolysiloxane (manufactured by Dow Corning Toray, SH200, dynamic viscosity: 190 to 210 mm ² /s). Then, in order to achieve low molecular weight of the oxime oil, heat treatment at 350 ° C was performed for 5 minutes to obtain a peelable glass substrate.

Then, the water contact angle of the first main surface of the peelable glass substrate was measured using a contact angle meter (DROP SHAPE ANALYSIS SYSTEM DSA 10Mk2, manufactured by Kurusu Co., Ltd.), and it was 100°.

Further, the average surface of the first main surface of the peelable glass substrate was measured using an atomic force microscope (manufactured by Pacific Nanotechnology, Nano Scope IIIa; Scan Rate 1.0 Hz, Sample Lines 256, Off-line Modify Flatten order-2, Planefit order-2). Roughness Ra, the result is 0.5 nm. The average surface roughness Ra is calculated based on the measurement value of the measurement range of 10 μm square.

Next, on the first main surface of the peelable glass substrate, a linear organic alkenyl polyoxyalkylene (vinyl anthracene, manufactured by Arakawa Chemical Industries, Ltd., 8500) having a vinyl group at both ends is used in the molecule. A mixture of methylhydroquinone (hydrocarbon alkyl) (available from Arakawa Chemical Industries, Inc., 12031) and a platinum-based catalyst (manufactured by Arakawa Chemical Industries, Inc., CAT12070) was applied by a screen printer to a length of 750 mm. A rectangular shape having a size of 630 mm and a layer containing uncured hardenable oxygen was placed on the peelable glass substrate (coating amount: 35 g/m ² ). Here, the mixing ratio of the linear organic alkenyl polyoxyalkylene to the methylhydrogenpolysiloxane is adjusted so that the molar ratio of the vinyl group to the hydrofluorenyl group is 1:1. In addition, the platinum-based catalyst is used in an amount of 5 parts by mass based on 100 parts by mass of the total of the linear organoalkenyl polysiloxane and the methylhydrogenpolyoxyalkylene.

Secondly, the side of the carrier substrate with a thickness of 0.4 mm in contact with the epoxy resin The surface (the first main surface) was cleaned with pure water, and then cleaned by UV cleaning. Thereafter, the first main surface of the carrier substrate and the layer containing the uncured curable cerium oxide were bonded together at room temperature by a vacuum press, and allowed to stand at 30 Pa for 5 minutes to carry out uncured hardening. The defoaming treatment of the layer of the bismuth oxygen is carried out to obtain the layered body A0 before hardening. At this time, the carrier substrate is laminated on the layer containing the uncured curable cerium oxide so that the peripheral region which is not in contact with the carrier substrate remains in the layer containing the uncured curable cerium oxide. Further, the length from the outer periphery of the carrier substrate to the outer periphery of the uncured curable resin composition layer is about 15 mm or more. Moreover, the ratio (area A / total area B) of the area A of the region of the uncured curable resin composition layer in contact with the carrier substrate and the total area B of the uncured curable resin composition layer (area A / total area B) was 0.91.

Next, this was heat-hardened in the atmosphere at 250 ° C for 30 minutes to obtain a post-hardened layered product A1 containing a hardened epoxy resin layer having a thickness of 10 μm.

Then, the carrier substrate of the laminated body A1 is fixed to the platen on which the positioning jig is attached, and the upper surface of the platen is overlapped with one of the outer edges of the carrier substrate to form the second main body of the peelable glass substrate. After the cutting line was scored on the surface by a diamond wheel cutter, the outer side of the cutting line of the peelable glass substrate was sandwiched and cut by a clamp jig. Similarly, the outer side of the peeling glass which overlaps with the remaining three sides of the outer periphery of the carrier substrate is also cut, and then the cut surface of the peelable glass substrate is ground and chamfered by a grindstone having a curved surface to obtain a cut. After the break, the layered body A2.

Then, the peeling glass substrate of the laminated body A2 is cut off and the oxygen tree is After the surface of the opposite side of the contact surface of the grease (the second main surface) is vacuum-adsorbed to the platen, the peelable glass substrate and the epoxy resin layer are formed at the corners of one of the corner portions of the four portions of the peelable glass substrate. A stainless steel cutter having a thickness of 0.1 mm was inserted into the interface to provide a starting point for peeling off the interface between the peelable glass substrate and the silicone resin layer. Further, after the surface of the carrier substrate was adsorbed by the 24 vacuum adsorption pads, the adsorption pads from the corners of the insertion tool were sequentially raised. Here, the inserting of the cutter is performed while ejecting the static eliminating fluid to the interface from the ionizer (manufactured by KEYENCE Corporation). Next, the vacuum adsorption pad is pulled while the ionizer continues to eject the neutralizing fluid into the formed void. As a result, the carrier substrate (the carrier substrate with the resin layer) on which the epoxy resin layer is formed on the first main surface can be peeled off from the platen. At this time, adhesion of the epoxy resin was not visually observed on the surface (first main surface) of the peelable glass substrate which was in contact with the silicone resin layer. Further, from the results, it was confirmed that the peel strength at the interface between the resin layer and the layer of the carrier substrate was larger than the peel strength at the interface between the layer of the peelable glass substrate and the resin layer.

(Example 2)

The cut laminated body B2 was obtained in the same manner as in Example 1 except that a glass plate containing soda lime glass was used as the carrier substrate and the glass substrate. Further, the size of the carrier substrate and the glass substrate used was the same as that of the carrier substrate and the glass substrate used in Example 1.

Then, the carrier substrate with the resin layer was peeled off from the laminated body B2 after the cutting in the same manner as in Example 1 to obtain a soda lime glass substrate B3 (peelable glass substrate). At this time, adhesion of the epoxy resin was not visually observed on the surface (first main surface) of the soda lime glass substrate B3 which was in contact with the silicone resin layer.

(Example 3)

The cut laminated body C2 was obtained in the same manner as in Example 1 except that a glass plate including a chemically strengthened glass plate was used as the carrier substrate and the glass substrate. Further, the size of the carrier substrate and the glass substrate used was the same as that of the carrier substrate and the glass substrate used in Example 1.

Then, the carrier substrate with the resin layer was peeled off from the laminated body C2 after the cutting in the same manner as in Example 1 to obtain a chemically strengthened glass substrate C3 (peelable glass substrate). At this time, adhesion of the epoxy resin was not visually observed on the surface (first main surface) of the glass substrate C3 which was in close contact with the epoxy resin layer.

(Example 4)

The surface of the first main surface of the glass substrate, that is, the side in contact with the epoxy resin, is cleaned with pure water, then cleaned by UV cleaning, and further cleaned by magnetron sputtering (heating) Temperature 300 ° C, film formation pressure 5 mTorr, power density 0.5 W / cm ² ) film of indium tin oxide having a thickness of 10 nm (sheet resistance 300 Ω / □), and then sprayed on the film of indium tin oxide The cut laminated body D2 was obtained by the same method as in Example 1 except that the oil content was 1% by mass of heptane solution and dried.

Then, in the same manner as in the first embodiment, the carrier substrate with the resin layer is peeled off from the laminated body D2 after the cutting, and the glass substrate D3 in which the thin film layer of indium tin oxide is formed on the first main surface is obtained (peelable glass) Substrate). At this time, adhesion of the epoxy resin was not visually observed on the surface (first main surface) of the glass substrate D3 which was in close contact with the epoxy resin layer.

(Example 5)

In this example, an OLED was produced using the cut-back laminated body A2 obtained in Example 1.

More specifically, on the second main surface of the peelable glass substrate of the laminated body A2 after the cutting, molybdenum is formed by sputtering, and the gate electrode is formed by etching using photolithography. Next, by the plasma CVD method, the tantalum nitride, the intrinsic amorphous germanium, and the n-type amorphous germanium are sequentially formed on the second main surface side of the peelable glass substrate provided with the gate electrode, and then by the plasma CVD method. The sputtering method forms a film of molybdenum, and forms a gate insulating film, a semiconductor element portion, and a source/drain electrode by etching using photolithography. Next, a passivation layer is formed by forming a passivation layer on the second main surface side of the peelable glass substrate by a plasma CVD method, and then indium tin oxide is formed by sputtering, and light micron is used. The etching of the shadow method forms a pixel electrode.

Then, on the second main surface side of the peelable glass substrate, 4,4',4"-tris(3-methylphenylphenylamino)triphenyl which is a positive hole injection layer is further deposited by a vapor deposition method. The base amine, bis[(N-naphthyl)-N-phenyl]benzidine as a positive hole transport layer, and 40% by volume mixed in the 8-hydroxyquinoline aluminum complex (Alq ₃ ) as a light-emitting layer 2,6-bis[4-[N-(4-methoxyphenyl)-N-phenyl]aminostyryl]naphthalene-1,5-dicarbonitrile (BSN-BCN), and The Alq ₃ as the electron transport layer was sequentially formed into a film. Next, aluminum was formed on the second main surface side of the peelable glass substrate by sputtering, and the counter electrode was formed by etching using photolithography. Next, on the second main surface of the peelable glass substrate on which the counter electrode is formed, another glass substrate is bonded and sealed by an ultraviolet curing type adhesive layer. The peeling glass substrate obtained by the above procedure is obtained. The post-cut laminated body A2 having the organic EL structure is equivalent to the display device panel (panel A2) (the laminated body of the member for electronic devices) having the carrier substrate.

Then, the sealing body side of the panel A2 is vacuum-adsorbed to the pressure plate, and a stainless steel cutter having a thickness of 0.1 mm is inserted into the interface between the peelable glass substrate and the silicone resin layer at the corner of the panel A2, and the resin layer is attached from the panel A2. The carrier substrate is separated to obtain an OLED panel (corresponding to an electronic device, hereinafter referred to as panel A).

When an IC (Integrated Circuit) driver was connected to the panel A to be fabricated and driven, no display unevenness was confirmed in the drive region.

(Example 6)

In this example, an LCD was produced using the cut laminated body A2 obtained in Example 1.

Two sheets of the laminated body A2 after cutting are prepared. First, on the second main surface of the peelable glass substrate of the laminated body A2 after the cutting, the molybdenum is formed by sputtering, and etching by photolithography is performed. A gate electrode is formed. Next, by the plasma CVD method, the tantalum nitride, the intrinsic amorphous germanium, and the n-type amorphous germanium are sequentially formed on the second main surface side of the peelable glass substrate provided with the gate electrode, and then by the plasma CVD method. The sputtering method forms a film of molybdenum, and forms a gate insulating film, a semiconductor element portion, and a source/drain electrode by etching using photolithography. Next, a passivation layer is formed by forming a passivation layer on the second main surface side of the peelable glass substrate by a plasma CVD method, and then indium tin oxide is formed by sputtering, and light micron is used. The etching of the shadow method forms a pixel electrode. Next, on the second main surface of the peelable glass substrate on which the pixel electrode is formed, The polyimine resin liquid is applied by a roll coating method to form an alignment layer by heat hardening, and rubbing is performed. The obtained laminated body A2 after cutting is referred to as a cut laminated body A2-1.

Next, on the second main surface of the peelable glass substrate of the laminated body A2 after another cut, chromium is formed by sputtering, and a light shielding layer is formed by etching using photolithography. Next, a color filter is applied by a die coating method on the second main surface side of the peelable glass substrate provided with the light shielding layer, and a color filter layer is formed by photolithography and thermal curing. Next, on the second main surface side of the peelable glass substrate, indium tin oxide was further formed into a film by sputtering to form a counter electrode. Next, on the second main surface of the peelable glass substrate provided with the counter electrode, the ultraviolet curable resin liquid was applied by a squeeze coating method, and a columnar spacer was formed by photolithography and thermal hardening. Next, on the second main surface of the peelable glass substrate on which the columnar spacers are formed, the polyimide film solution is applied by a roll coating method to form an alignment layer by thermal curing, and rubbing is performed. Next, on the second main surface side of the peelable glass substrate, the resin liquid for sheet is drawn into a frame shape by a dispensing method, and the liquid crystal is dropped by a dispensing method in the frame, and then the laminated body A2-1 after the cutting is used. The second main surface sides of the peelable glass substrate of the laminated body A2 after the two cuts are bonded to each other, and a laminate having an LCD panel is obtained by ultraviolet curing and thermal curing. Here, the laminated body having the LCD panel is hereinafter referred to as a laminated body B2.

Then, in the same manner as in the first embodiment, the laminated body B2 of the self-attached panel peels off the carrier substrate with the resin layers on both sides, thereby obtaining an LCD panel including the glass substrate on which the TFT array is formed and the glass substrate on which the color filter is formed. B (comparable to electronic devices).

When the IC panel of the manufactured LCD panel B was connected and driven, the display unevenness was not confirmed in the drive area.

(Comparative Example 1)

In the same manner as in Example 1, the first main surface of the carrier substrate was subjected to pure water washing and UV cleaning to be cleaned.

Next, a mixture of a linear organoalkenyl polyoxyalkylene having a vinyl group at the terminal, a methylhydrogenpolysiloxane having a hydrofluorenyl group in the molecule, and a platinum-based catalyst in Example 1 was used. A mixture of 0.5 parts by mass of a part by mass and a buffer of a fluorinated oil (manufactured by Dow Corning Toray Co., Ltd., SH200) was applied to the first main surface of the carrier substrate by screen printing. Next, it was heat-hardened in the atmosphere at 250 ° C for 30 minutes to form a hardened epoxy resin layer having a thickness of 10 μm.

Then, the first main surface of the glass substrate is subjected to pure water washing, UV cleaning, and cleaned, and then subjected to a vacuum press at room temperature to form a silicone resin formed on the first main surface of the carrier substrate. The layers are closely bonded to obtain a layered body P1.

Further, on the glass substrate of the laminate P1, an OLED was produced in the same manner as in Example 5, and then the carrier substrate with the resin layer was peeled off to obtain an OLED panel (hereinafter referred to as a panel P).

When the IC driver is connected to the panel P to be produced and driven, unevenness of display is confirmed in the driving region, and the defective portion exists in a portion corresponding to the vicinity of the end portion of the laminated body P1.

(Comparative Example 2)

Two laminated bodies P1 were obtained in the same manner as in Comparative Example 1.

Next, in the same order as in the embodiment 6, a laminate having an LCD panel was obtained using two laminated bodies P1. Further, the obtained laminated body was peeled off from the carrier substrate with the resin layers on both sides to obtain an LCD panel (hereinafter referred to as panel Q).

When the panel driver Q is connected to the IC driver and driven, the display unevenness is confirmed in the driving region, and the defective portion exists in a portion corresponding to the vicinity of the end portion of the laminated body P1.

As shown in the above-described fifth and sixth embodiments, according to the method of manufacturing an electronic device of the present invention, an electronic device having excellent performance can be manufactured with good yield.

On the other hand, in the prior method described in Patent Document 1, as shown in the above Comparative Examples 1 and 2, there is a case where the performance of the obtained electronic device is lowered. In Comparative Examples 1 and 2, display unevenness was observed in the vicinity of the end portion (peripheral portion) of the electronic device. It is considered that the resin layer obtained by the hardening treatment (especially in the vicinity of the periphery of the resin layer) has thickness unevenness as described above, and a void is generated between the glass substrate and the resin layer, and foreign matter enters the void. The performance of the resulting electronic device is reduced.

The present application is based on Japanese Patent Application No. 2011-225239, filed on Jan.

10‧‧‧Release glass substrate

12‧‧‧Unhardened curable resin composition layer

14‧‧‧ Carrier substrate

16‧‧‧Pre-hardening laminate

18‧‧‧ resin layer

20‧‧‧ hardened laminated body

22‧‧‧After cutting the laminated body

24‧‧‧Members for electronic devices

26‧‧‧Laminated body of components for electronic devices

28‧‧‧ Carrier substrate with resin layer

30‧‧‧Electronic devices

32‧‧‧ gap

50‧‧‧stage

51~53‧‧‧ positioning block

54‧‧‧moving block

55‧‧‧moving block

60‧‧‧Processing head

62‧‧‧Cut cutter

64‧‧‧Retainer

66‧‧‧ cutting line

68‧‧‧ crack

70‧‧‧stage

72‧‧‧Clamping fixture

80‧‧‧ convex

82‧‧‧ glass substrate

84‧‧‧ gap

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the manufacturing steps of an embodiment of a method of manufacturing an electronic device according to the present invention.

2(A) to 2(G) are schematic cross-sectional views showing an embodiment of a method of manufacturing an electronic device according to the present invention in order of steps.

Fig. 3(A) is a plan view of the laminated body before hardening obtained in the lamination step. Fig. 3(B) is a partial cross-sectional view showing a state before lamination of the carrier substrate. Fig. 3(C) is a partial cross-sectional view showing a state in which a carrier substrate is laminated.

Figure 4 is a plan view showing a portion of the hardened laminated body placed on the stage in perspective.

Fig. 5 is a cross-sectional view showing a portion of the hardened laminated body and the processing head placed on the stage.

Fig. 6 is a cross-sectional view showing the hardened laminated body and the holding jig placed on the other stage.

Fig. 7 is a flow chart showing the manufacturing steps of another embodiment of the method of manufacturing the electronic device of the present invention.

Fig. 8(A) is a cross-sectional view of a carrier substrate with a resin layer according to the prior art. Fig. 8(B) is a partial cross-sectional view showing the end portion of the laminated body based on the prior art.

10‧‧‧Release glass substrate

14‧‧‧ Carrier substrate

18‧‧‧ resin layer

20‧‧‧ hardened laminated body

50‧‧‧stage

52‧‧‧ Positioning block

60‧‧‧Processing head

62‧‧‧Cut cutter

64‧‧‧Retainer

66‧‧‧ cutting line

Claims (10)

A method of manufacturing an electronic device for manufacturing an electronic device including a member for a release glass substrate and an electronic device, and comprising: a surface treatment step of using a release agent for the glass having the first main surface and the second main surface The first main surface of the substrate is treated to obtain a peelable glass substrate having a surface that is easily peelable; and a curable resin composition layer forming step is formed on the surface of the peelable glass substrate that is easily peelable Coating a curable resin composition to form an uncured curable resin composition layer; and a laminating step of disposing a carrier substrate having a size smaller than that of the uncured curable resin composition layer a layer of the unhardened curable resin composition layer is laminated on the uncured curable resin composition layer so as to remain in the uncured curable resin composition layer, and a hardening step is obtained. And hardening the uncured curable resin composition layer in the pre-hardened laminate to obtain hardening with a resin layer a layered body; the cutting step of cutting the resin layer and the peelable glass substrate along a periphery of the carrier substrate in the cured laminated body; and a member forming step of the peelable glass substrate a layered body for forming an electronic device member on the second main surface to obtain a member for an electronic device; and a separating step for attaching the laminated body of the member for the electronic device The peelable glass substrate is separated from the electronic device of the electronic device member. The method of manufacturing an electronic device according to claim 1, further comprising a defoaming step of performing a defoaming treatment of the uncured curable resin composition layer after the stacking step and before the hardening step. The method of producing an electronic device according to claim 1 or 2, wherein the release agent comprises a compound containing a methyl fluorenyl group or a fluoroalkyl group. The method of producing an electronic device according to claim 1 or 2, wherein the release agent contains a fluorinated oil or a fluorine-based compound. The method of manufacturing an electronic device according to any one of claims 1 to 4, wherein the resin layer contains a silicone resin. The method of producing an electronic device according to any one of claims 1 to 5, wherein the resin layer is an organic alkenyl group having an alkenyl group and an organic hydrogen group having a hydrogen atom bonded to a ruthenium atom. An addition reaction type oxygenated product of a combination of oxynes. The method of producing an electronic device according to claim 6, wherein the organic hydrogenated polyoxyalkylene has a molar ratio of a hydrogen atom bonded to a halogen atom to an alkenyl group of the above organic alkenyl polyoxyalkylene of 0.5 to 2. The method of producing an electronic device according to any one of claims 1 to 7, wherein the resin layer contains 5% by mass or less of non-hardenable organic polyoxane. The method of manufacturing an electronic device according to any one of claims 1 to 8, wherein in the cutting step, the main surface of the carrier substrate in the hardened laminated body is supported by the stage, and the outer periphery of the carrier substrate is made Abutting on the positioning block disposed on the above stage. The method of manufacturing an electronic device according to any one of claims 1 to 9, wherein in the cutting step, after the cutting line is formed on the surface of the peelable glass substrate in the hardened laminated body, along the cutting line The outer peripheral portion of each of the peelable glass substrate and the resin layer in the cured laminated body is once cut.