CN102725143B - The manufacture method of duplexer and duplexer - Google Patents

The manufacture method of duplexer and duplexer Download PDF

Info

Publication number
CN102725143B
CN102725143B CN201180007092.0A CN201180007092A CN102725143B CN 102725143 B CN102725143 B CN 102725143B CN 201180007092 A CN201180007092 A CN 201180007092A CN 102725143 B CN102725143 B CN 102725143B
Authority
CN
China
Prior art keywords
duplexer
device substrate
resin bed
gripper shoe
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180007092.0A
Other languages
Chinese (zh)
Other versions
CN102725143A (en
Inventor
近藤聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN102725143A publication Critical patent/CN102725143A/en
Application granted granted Critical
Publication of CN102725143B publication Critical patent/CN102725143B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10743—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing acrylate (co)polymers or salts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10128—Treatment of at least one glass sheet
    • B32B17/10155—Edge treatment or chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10293—Edge features, e.g. inserts or holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/1077—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10798—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing silicone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Abstract

The present invention relates to a kind of manufacture method of duplexer, it comprises and duplexer block is cut into given size and by the operation of carrying out complanation at least partially of the circumference of the outer peripheral face of described duplexer block, described duplexer block is folded with resin bed between device substrate and gripper shoe, and this resin bed to fit tightly on the 1st interarea of described device substrate in the mode that can peel off and is fixed in described gripper shoe.

Description

The manufacture method of duplexer and duplexer
Technical field
The present invention relates to manufacture method and the duplexer of duplexer.
Background technology
In recent years, device (electronic equipment) progressively slimming, the lightweights such as solar cell (PV), liquid crystal panel (LCD), organic EL panel (OLED), for the substrate (hereinafter referred to as " device substrate ") of these devices also just at thin plate.Due to thin plate, the intensity of device substrate is insufficient, then, in the manufacturing process of device, the operability of device substrate reduces.
Therefore, extensively adopt following methods: forming apparatus parts on the device substrate thicker than final thickness, then make device substrate thin plate by chemical etching process all the time.But, in the method, such as, by the thickness of 1 sheet devices substrate by 0.7mm thin plate to 0.2mm, 0.1mm time, material more than half, therefore not preferred from the viewpoint of productivity ratio, raw-material service efficiency of original device substrate of having pruned with etching solution.
In addition, carrying out in the method for thin plate above by chemical etching process to device substrate, when device substrate exists fine wound on the surface, is that starting point forms fine pit (etch pit with wound because of etch processes sometimes, etch pit), become optical defect.
Recently, in order to tackle the problems referred to above, propose following method: prepare the duplexer that fixing resin bed is on the supporting plate fitted tightly on the 1st interarea of device substrate in the mode that can peel off, on the 2nd interarea of the device substrate of duplexer after forming apparatus parts, the gripper shoe (for example, referring to patent document 1) with resin bed is peeled off from device substrate.
prior art document
patent document
Patent document 1: International Publication No. 07/018028 pamphlet
Summary of the invention
the problem that invention will solve
But, in above-mentioned duplexer in the past, sometimes can form groove at the outer peripheral face of duplexer.Such as, when device substrate, gripper shoe have carried out chamfer machining, resin bed be by the coating of the resin combination of liquid state on the supporting plate and be heating and curing the resin bed obtained time, the outer peripheral face of device substrate, gripper shoe, the outer peripheral face of resin bed, with fillet, therefore form groove at the outer peripheral face of duplexer.
In the manufacturing process of device, have and the process such as sandblasting, etching is carried out to the conducting film on the surface being formed in device substrate and connects up or operation that the pattern of element formation etc. is formed.Before this pattern formation process, in order to protect the part surface of conducting film, there is the painting process at coating fluids such as the surface of conducting film coating anti-corrosion liquids.
In the painting process of the manufacturing process of device, coating fluid easily immerses groove due to capillarity and accumulates.The coating fluid accumulated in groove is difficult to remove by washing, and easily leaves residue after drying.This residue becomes dust and produces source in the heating treatment step of device manufacturing process, and the generation of dust pollutes in heating treatment step, and the yield rate as the device of product is reduced.
The present invention carries out in view of the above problems, its main purpose is, provide a kind of manufacture method and duplexer of the duplexer that can dust be suppressed to produce in the manufacturing process of device.
for the scheme of dealing with problems
In order to solve above-mentioned purpose, the manufacture method of duplexer of the present invention is comprise duplexer block being cut into given size and by the method for carrying out the operation of complanation at least partially of the circumference of the outer peripheral face of aforementioned duplexer block, described duplexer block is folded with resin bed between device substrate and gripper shoe, and this resin bed to fit tightly on the 1st interarea of aforementioned means substrate in the mode that can peel off and is fixed in aforementioned gripper shoe.
And then the manufacture method of duplexer of the present invention preferably includes the operation of the bight implementing the part of complanation of the outer peripheral face of aforementioned duplexer block being carried out chamfering.
In addition, preferably, the part implementing complanation of the outer peripheral face of aforementioned resin layer is almost parallel with the thickness direction of aforementioned resin layer.
In addition, preferably, aforementioned means substrate is the glass substrate manufactured by float glass process, comprises after aforementioned corner is carried out chamfering, the operation of the 2nd interarea of grinding aforementioned means substrate.
Aforementioned means substrate is preferably more than thickness 0.03mm and less than the glass substrate of 0.8mm.
Aforementioned resin layer preferably comprises at least one in the group being selected from and being made up of acrylic resin, polyolefin resin layer, urethane resin layer and silicone resin layer.
The thickness of aforementioned resin layer is preferably 5 ~ 50 μm.
In addition, duplexer of the present invention is duplexer block is cut into given size and the circumference of the outer peripheral face of aforementioned duplexer block carried out the duplexer of complanation at least partially, described duplexer block is folded with resin bed between device substrate and gripper shoe, and this resin bed to fit tightly on the 1st interarea of aforementioned means substrate in the mode that can peel off and is fixed in aforementioned gripper shoe.
the effect of invention
According to the present invention, may be provided in the manufacturing process of device manufacture method and the duplexer of the duplexer that dust can be suppressed to produce.
Accompanying drawing explanation
Fig. 1 is the process chart of the manufacture method of duplexer in the 1st embodiment of the present invention.
Fig. 2 be the 1st embodiment of the present invention planarizing before the local side figure of duplexer block.
Fig. 3 be the 1st embodiment of the present invention planarizing after the local side figure of duplexer block.
Fig. 4 is the key diagram (1) of chamfering method in the 1st embodiment of the present invention.
Fig. 5 is the key diagram (2) of chamfering method in the 1st embodiment of the present invention.
Fig. 6 is the key diagram (3) of chamfering method in the 1st embodiment of the present invention.
Fig. 7 is the local side figure of the duplexer block in the 1st embodiment of the present invention after chamfering.
Fig. 8 is the local side figure of the duplexer block in the 1st embodiment of the present invention after grinding.
Fig. 9 is the process chart of the manufacture method of device in the 1st embodiment of the present invention.
Figure 10 is the process chart of the manufacture method of LCD in the 1st embodiment of the present invention.
Figure 11 is the process chart of the manufacture method of OLED in the 1st embodiment of the present invention.
Figure 12 be the 2nd embodiment of the present invention planarizing before the local side figure of duplexer block.
Figure 13 be the 3rd embodiment of the present invention planarizing before the local side figure of duplexer block.
Detailed description of the invention
Below, be described for implementing embodiments of the present invention with reference to accompanying drawing.In each figure, identical structure gives same-sign, and the description thereof will be omitted.
(the 1st embodiment)
Fig. 1 is the process chart of the manufacture method of duplexer in the 1st embodiment of the present invention.As shown in Figure 1, the manufacture method of duplexer has and duplexer block is cut into given size and by the operation (step S11) of carrying out complanation at least partially of the circumference of the outer peripheral face of duplexer block, described duplexer block is folded with resin bed between device substrate and gripper shoe, this resin bed to fit tightly on the 1st interarea of device substrate in the mode that can peel off and fixing on the supporting plate.
Duplexer after complanation is used for the manufacture of device, will describe in detail below.Use the gripper shoe with resin bed of the duplexer after complanation until device manufacturing process way in (until by strip operation stripping off device substrate and resin bed).After device substrate and resin bed are stripped, the gripper shoe with resin bed removes from the manufacturing process of device, is no longer the parts of constituent apparatus.The manufacturing process of duplexer again can be used in from the gripper shoe with resin bed of device substrate stripping.That is, can on the resin bed of the gripper shoe with resin bed stacked new device substrate, obtain new duplexer block.
First, the duplexer block before complanation is described, then, the duplexer block after complanation is described, finally, the manufacturing process of device is described.
Fig. 2 be the 1st embodiment of the present invention planarizing before the local side figure of duplexer block.As shown in Figure 2, the duplexer block 10 before complanation is folded with resin bed 13 between device substrate 11 and gripper shoe 12.Resin bed 13 to fit tightly on the 1st interarea 111 of device substrate 11 in the mode that can peel off and is fixed in gripper shoe 12.
(device substrate)
Device substrate 11 forming apparatus parts and constituent apparatus on the 2nd interarea 112.Herein, device parts refer to the parts at least partially of constituent apparatus (electronic equipment).As concrete example, thin film transistor (TFT) (TFT), colour filter (CF) can be listed.As device, solar cell (PV), liquid crystal panel (LCD), organic EL panel (OLED) etc. can be illustrated.Device parts after by the outer peripheral face complanation of duplexer block 10, are formed on the 2nd interarea 112 of device substrate 11.
The kind of device substrate 11 can be common substrate, such as, can be glass substrate or the metal substrate such as resin substrate or SUS substrate.Preferred glass substrate among these.Because glass substrate chemical proofing, resistance to excellent moisture permeability, and percent thermal shrinkage is low.The linear expansion coefficient adopting JIS R 3102-1995 to specify is as the index of percent thermal shrinkage.
When the linear expansion coefficient of device substrate 11 is large, the most heat tracing process of manufacturing process of device, therefore easily produces various inconvenience.Such as, device substrate 11 forms TFT, when cooling is formed with the device substrate 11 of TFT under heating, due to the thermal contraction of device substrate 11, the position of TFT is had to offset excessive worry.
Glass substrate makes frit melting and melten glass is configured as tabular and obtains.This manufacturing process can be usual way, such as, can use float glass process, fusion method, slot draw method, Fourcault process (fourcault process), mechanical cylinder process (Labbers method) etc.In addition, the glass substrate that particularly thickness is thin obtains by also making the method for its tension-thining (horizontal sheet process) be shaped by means such as stretchings to the temperature that can be shaped the glass heats being temporarily configured as tabular.
The glass of glass substrate has no particular limits, and is preferably alkali-free glass, Pyrex, calcium soda-lime glass, vagcor, other take silica as the oxide based glass of main component.As oxide based glass, the silica content preferably converted with oxide is the glass of 40 ~ 90 quality %.
As the glass of glass substrate, preferably adopt and be applicable to the kind of device and the glass of manufacturing process thereof.Such as, the glass substrate of liquid crystal panel easily impacts liquid crystal due to the stripping of alkali metal component, and therefore the preferred glass (alkali-free glass) by fact alkali-free metal ingredient is formed.Like this, the glass of glass substrate can suitablely based on the kind of the device of application and manufacturing process thereof be selected.
The thickness of device substrate has no particular limits, and is generally less than 0.8mm, is preferably below 0.3mm, more preferably below 0.15mm.In addition, more than 0.03mm is preferably.When particularly device substrate is glass substrate, from slimming and/or the light-weighted viewpoint of glass substrate, be generally less than 0.8mm, be preferably below 0.3mm, more preferably below 0.15mm.During for more than 0.8mm, do not meet the slimming of glass substrate and/or light-weighted requirement.During for below 0.3mm, the flexibility that glass substrate is good can be given.During for below 0.15mm, glass substrate can be wound into tubular.In addition, the thickness of glass substrate, from reasons such as the processing eases of easy to manufacture, the glass substrate of glass substrate, is preferably more than 0.03mm.
The kind of the resin of resin substrate has no particular limits.As transparent resin, pet resin, polycarbonate resin, transparent fluororesin, clear polyimides resin, polyethersulfone resin, PEN resin, polyacrylics, cyclic olefin resins, organic siliconresin, silicon-type organic-inorganic hybrid resin, organic polymer/biological nano fibers mixture resin etc. can be illustrated.In addition, as opaque resin, polyimide resin, fluororesin, polyamide, poly-aramid fiber resin, polyether-ether-ketone resin, polyether ketone resin, various liquid crystal polymer resins etc. can be illustrated.In addition, resin substrate also can be formed with the functional layers such as protective layer on surface.
(gripper shoe)
Gripper shoe 12 supports intensifying device substrate 11, and the distortion, scuffing, breakage etc. of device substrate 11 in the manufacturing process of anti-locking apparatus.In addition, when using the device substrate 11 thinner than thickness in the past, by becoming the duplexer block 10 identical with device substrate thickness in the past, can use manufacturing technology, the manufacturing equipment of the device substrate of the thickness be applicable in the past in the manufacturing process of device, this is also one of object using gripper shoe 12.
The thickness of gripper shoe 12 can be thicker than device substrate 11, also can be thinner than device substrate.Preferably, the thickness of gripper shoe 12 is selected based on the thickness of the thickness of device substrate 11, the thickness of resin bed 13 and duplexer block 10.Such as, the manufacturing process of existing device is that the mode of the substrate processing thickness 0.5mm designs, and when the thickness of device substrate 11 and the thickness sum of resin bed 13 are 0.1mm, makes the thickness of gripper shoe 12 be 0.4mm.When gripper shoe 12 is glass plate, the thickness of glass plate calmly easy to operate, not easily the reason such as to break, be preferably more than 0.08mm.
The kind of gripper shoe 12 can be common gripper shoe, such as, can be glass plate, resin plate, metallic plate etc.When the manufacturing process of device is with heat treatment, gripper shoe 12 is preferably formed with the material that the difference of the linear expansion coefficient with device substrate 11 is less, is more preferably formed with the material identical with device substrate 11.
Device substrate 11 is preferably 700 × 10 with the difference of the average coefficient of linear expansion (hereinafter referred to as " average coefficient of linear expansion ") at 25 ~ 300 DEG C of gripper shoe 12 -7/ DEG C below, be more preferably 500 × 10 -7/ DEG C below, more preferably 300 × 10 -7/ DEG C below.When difference is excessive, when the heating in the manufacturing process of device cools, duplexer block 10 is violent warpage likely, or device substrate 11 may be peeled off with gripper shoe 12.When the material of device substrate 11 is identical with the material of gripper shoe 12, then there is not the worry of this problem.
(resin bed)
Resin bed 13 is fixed in gripper shoe 12, in addition, fits tightly on the 1st interarea 111 of device substrate 11 in the mode that can peel off.Resin bed 13 prevents the position of device substrate 11 before carrying out strip operation from offseting, and is easily peeled off from device substrate 11 by strip operation, prevents device substrate 11 grade damaged because of strip operation.
The surface of preferred resin layer 13 by the Van der Waals bonding that results between molecular solids on the 1st interarea 111 of device substrate 11, instead of by bonding force that common adhesive has.This is because can easily peel off.In the present invention, the character that can easily peel off of this resin layer surface is called fissility.
On the other hand, the adhesion on the surface of resin bed 13 pairs of gripper shoes 12 is relatively higher than the adhesion of the 1st interarea 111 of resin bed 13 pairs of device substrates 11.In the present invention, the combination of resin bed 13 surface to device substrate 11 surface is called and fits tightly, will be called fixing to the combination on gripper shoe 32 surface.
The thickness of resin bed 13 has no particular limits, and is preferably 5 ~ 50 μm, is more preferably 5 ~ 30 μm, more preferably 7 ~ 20 μm.This is because when the thickness of resin bed 13 is this scope, resin bed 13 and fitting tightly of device substrate 11 become abundant.In addition, even if accompany bubble, foreign matter between resin bed 13 and device substrate 11, also can to deform defect by restraining device substrate 11.In addition, when the thickness of resin bed 13 is blocked up, needing time and material owing to being formed, is therefore uneconomic.
In addition, resin bed 13 also can be formed more than two-layer.Now " thickness of resin bed " refers to the gross thickness of all resin beds.
In addition, resin bed 13 by two-layer above formed time, the kind forming the resin of each layer can be different.
The surface tension of resin bed 13 is preferably below 30mN/m, is more preferably below 25mN/m, more preferably below 22mN/m.In addition, more than 15mN/m is preferably.This is because when surface tension is this scope, more easily can peel off with device substrate 11, also become abundant with fitting tightly of device substrate 11 simultaneously.
Surface tension measures as follows.First, to resin bed 13, use the plurality of liquid of known surface tension force, the contact angle of each liquid at measuring 20 DEG C.Then, map with the surface tension of each liquid and contact angle (cos θ), carry out fitting a straight line, surface tension value during extrapolated cos θ=1, obtain the critical surface tension of resin bed 13.Surface tension using this critical surface tension as resin bed 13.
Resin bed 13 is preferably lower than room temperature (about 25 DEG C) by glass transition point or do not have the material of glass transition point to be formed.This is because, become the resin bed of non-adhesive, can more easily peel off with device substrate 11, also become abundant with fitting tightly of device substrate 11 simultaneously.
In addition, because resin bed 13 mostly heats in the manufacturing process of device, therefore preferably there is heat resistance.
In addition, when the elastic modelling quantity of resin bed 13 is too high, there is the tendency with the close fitting step-down of device substrate 11.On the other hand, when the elastic modelling quantity of resin bed 13 is too low, there is the tendency of fissility step-down.
The kind forming the resin of resin bed 13 has no particular limits.Include, for example out acrylic resin, vistanex, polyurethane polyester and organic siliconresin.These resins can be used alone, also can various kinds of resin used in combination.Wherein preferred organic siliconresin.This is because the heat resistance of organic siliconresin, fissility are excellent.In addition, this is because, when gripper shoe 12 is glass plate, by the condensation reaction of the silanol base with surface, be easily fixed in gripper shoe 12.Even if silicone resin layer is process 1 hours under such as about 300 ~ 400 DEG C, fissility is deterioration hardly also, is also preferred from this point of view.
Resin bed 13 is preferably formed by the organic siliconresin (solidfied material) for peeling paper in organic siliconresin.The resin bed 13 that the hardening resin composition of formation peeling paper organic siliconresin is solidified to form on the surface of gripper shoe 12 has excellent fissility, therefore preferably.In addition, because flexibility is high, even if be therefore mixed into the foreign matter such as bubble, dust and weed-trifles between resin bed 13 and device substrate 11, also can to deform defect by restraining device substrate 11.
The curable silicone forming this peeling paper organic siliconresin can be divided into condensation reaction type organosilicon, addition reaction-type organosilicon, ultraviolet hardening organosilicon and electron ray curing type organosilicon according to its curing mechanism, all can use.Preferred addition reaction-type organosilicon among these.This is because the degree of the easy degree of curing reaction, fissility when forming resin bed 13 is good, heat resistance is also high.
Addition reaction-type organosilicon be have the unsaturated groups such as vinyl olefinic organic based polysiloxane, with the organic hydrogen polysiloxanes with bonding hydrogen atom on the silicon atoms, the hardening resin composition that obtains with the catalyst combination such as platinum group catalyst, be solidified into the organic siliconresin that have cured at normal temperatures or by heating.
In addition, the curable silicone forming peeling paper organic siliconresin has the form of solvent-borne type, emulsion-type and no-solvent type, can use any type.Preferred no-solvent type among these.This is because productivity ratio, security, environmental characteristics in excellent.In addition, this is because, when not being included in solidification when forming resin bed 13, be heating and curing, ultraviolet curing or electron ray curing time produce the solvent of foaming, therefore not easily residual bubble in resin bed 13.
In addition, for the curable silicone forming peeling paper organic siliconresin, specifically, as commercially available trade name or model, KNS-320A can be listed, KS-847(is Shinetsu Silicone Co., Ltd manufactures), TPR6700(GE ToshibaSilicone Co., Ltd manufactures), the combination of vinyl organosilicon " 8500 " (Arakawa Chemical Industries, Ltd.'s manufacture) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd. manufactures), the combination of vinyl organosilicon " 11364 " (Arakawa Chemical Industries, Ltd.'s manufacture) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd. manufactures), the combination etc. of vinyl organosilicon " 11365 " (Arakawa Chemical Industries, Ltd.'s manufacture) and methylhydrogenpolysi,oxane " 12031 " (Arakawa Chemical Industries, Ltd. manufactures).
Wherein, KNS-320A, KS-847 and TPR6700 are the curable silicone in advance containing host and crosslinking agent.
In addition, the organic siliconresin composition preferably had in silicone resin layer forming resin bed 13 is difficult to character, the i.e. low organosilicon animal migration of moving to device substrate 11.
(fixing means)
In gripper shoe 12, the method for fixing resin layer 13 has no particular limits, and include, for example out the method for the resin of the surperficial fixed film shape in gripper shoe 12.Specifically, the bed knife (high-peeling strength) that the surface of the surface in order to give gripper shoe 12 to film is high can be listed, surface modification treatment (prime treatment, priming prosess) is carried out to the surface of gripper shoe 12, is fixed on the method in gripper shoe 12.Such as can exemplify the chemical method (prime treatment) chemically making bed knife improve as silane coupler, the physical method that surface active groups is increased as processed in flame (flame), as blasting treatment make surface roughness increase thus the mechanical processing method etc. that attachment is increased.
In addition, include, for example out and be coated on method in gripper shoe 12 by forming the hardening resin composition of resin bed 13.As coating process, spraying process can be listed, mould is coated with method, spin-coating method, dip coating, rolling method, stick coating method, silk screen print method, gravure coating process etc.Can select according to the kind of resin combination is suitable from these methods.
In addition, when being coated in gripper shoe 12 by the hardening resin composition forming resin bed 13, its coating weight is preferably 1 ~ 100g/m 2, be more preferably 5 ~ 20g/m 2.
Such as, when forming resin bed 13 by the organosilyl hardening resin composition of addition reaction-type, by the hardening resin composition that the known method coating such as above-mentioned spraying process is formed with the mixture of organic hydrogen polysiloxanes and catalyst by thiazolinyl polysiloxanes in gripper shoe 12, then heat and make it solidify.The condition that is heating and curing is different according to the compounding amount of catalyst, such as, relative to total amount 100 mass parts of thiazolinyl polysiloxanes and organic hydrogen polysiloxanes, during compounding 2 mass parts platinum group catalyst, at 50 DEG C in an atmosphere ~ 250 DEG C, at being preferably 100 DEG C ~ 200 DEG C, it is made to react.In addition, the reaction time of this situation is set to 5 ~ 60 minutes, is preferably set to 10 ~ 30 minutes.In order to become the silicone resin layer with low organosilicon animal migration, preferably with in silicone resin layer not the mode of the silicone ingredients of remained unreacted make curing reaction carry out as much as possible.If above-mentioned reaction temperature and reaction time, then can make the silicone ingredients of remained unreacted hardly in silicone resin layer, be therefore preferred.When reaction time long, reaction temperature is too high compared with above-mentioned, there is the oxidation Decomposition simultaneously causing organic siliconresin, generate low-molecular-weight silicone ingredients, the possibility that organosilicon animal migration uprises.Also be preferred so that in silicone resin layer, the mode of the silicone ingredients of remained unreacted does not make curing reaction carry out in good in order to the fissility after making heating as much as possible.
In addition, such as, when using the hardening resin composition forming peeling paper organic siliconresin to manufacture resin bed 13, the hardening resin composition be coated in gripper shoe 12 is heating and curing and forms silicone resin layer.By making hardening resin composition be heating and curing, organic siliconresin and gripper shoe 12 chemical bonding during curing reaction.In addition, by anchoring effect, silicone resin layer combines with gripper shoe 12.By these effects, silicone resin layer is securely fixed in gripper shoe 12.
(fitting tightly method)
The resin bed 13 be formed on supporter is made to can be known method with the mode that can the peel off method fitted tightly on device substrate 11.Include, for example out under atmospheric pressure environment after the fissility of resin bed 13 on the surface overlapping device substrate 11, method resin bed 13 being crimped with roller, press with device substrate 11.By crimping with roller, press, resin bed 13 and device substrate 11 fit tightly more, therefore preferably.In addition, by crimping with roller or press, remove than being easier to the bubble be mixed between resin bed 13 and device substrate 11, therefore preferably.
When the resin bed 13 be formed on supporter being crimped with device substrate 11 by vacuum layer platen press, Vacuum Pressure method for making, owing to suppressing being mixed into of bubble, guaranteeing that good fitting tightly can more preferably be carried out, be therefore preferred.By crimping under vacuo, also have the following advantages: even when remaining micro-bubble, bubble also can not be grown up because of heating, not easily causes the deformation defect of device substrate 11.
When resin bed 13 is fitted tightly on device substrate 11 in the mode that can peel off, the preferably surface of the side that contacts with each other of abundant washing resin layer 13 and device substrate 11, and carry out stacked in the environment that cleanliness factor is high.Even if be mixed into foreign matter between resin bed 13 and device substrate 11, because resin bed 13 is out of shape, therefore also can not impact the flatness on the surface of device substrate 11, but cleanliness factor its flatness higher is better, therefore preferably.
It should be noted that, in gripper shoe 12, the operation of fixing resin layer 13 does not limit with the order of the operation making resin bed 13 fit tightly on device substrate 11 in the mode that can peel off, such as, can almost carry out simultaneously.
(cutting of duplexer block)
The outer peripheral face 14 of the duplexer block 10 of operation gained like this is formed with groove 15 sometimes.Such as, as shown in Figure 2, when device substrate 11, gripper shoe 12 have carried out chamfer machining, resin bed 13 has been be coated on by the resin combination of liquid state when gripper shoe 12 also heating the layer making it solidify, the outer peripheral face of device substrate 11, gripper shoe 12, resin bed 13, with fillet, therefore forms groove 15 on the outer peripheral face 14 of duplexer block 10.
In present embodiment, as shown in Figure 1, the manufacture method of duplexer has and duplexer block is cut into given size, by the operation (step S11) of the complanation at least partially of the circumference of the outer peripheral face of duplexer block.More specifically, duplexer block is cut into given size, (be preferably all-round to) at least partially of the circumference of the peripheral part of duplexer block is removed, by (be preferably all-round to) at least partially complanation of the circumference of the outer peripheral face of duplexer block.
The method of cutting duplexer block 10 can be usual way.Include, for example out: by the method for cutlery cutting; The method of cutting is melted by high-energy rays such as laser; By the method etc. that cutlery, laser etc. form score line, cut off along score line on the interarea of at least one plate object of device substrate and gripper shoe.These cutting methods can be used alone or in combination.Like this, cutting comprises and molten to cut, cut off.
Cutting method can according to the suitable selection such as kind, thickness of device substrate 11, gripper shoe 12, resin bed 13.Such as, when device substrate 11 or gripper shoe 12 are formed by glass, the interarea of glass forms score line, then by duplexer block 10 flexural deformation, the method for cutting off along score line is suitable.In addition, when device substrate 11 and gripper shoe 12 are formed by glass, the interarea of both glass forming score line, is then suitable by duplexer block 10 flexural deformation, the method for cutting off along both score line.When carrying out cutting off, the thickness of resin bed 13 is preferably less than 50 μm.When resin bed 13 is blocked up, cuts off and become difficulty.
Cut direction can be the direction from device substrate 11 to gripper shoe 12, also can be the direction from gripper shoe 12 to device substrate 11.In addition, cut direction can be unidirectional, also can be two-way.And then cut direction is preferably almost parallel with the thickness direction (i.e. the thickness direction of resin bed) of duplexer block.This is because, can make resin bed 13 to expose area less, can by the deterioration of heating the resin bed 13 caused in restraining device manufacturing process.
Fig. 3 is the local side figure of the duplexer block in the 1st embodiment of the present invention after outer peripheral face complanation.The duplexer block 10A of Fig. 3 cuts duplexer block 10 along the A-A' line of Fig. 2 and obtains.Device substrate 11A, gripper shoe 12A after complanation, resin bed 13A correspond respectively to the device substrate 11 before complanation, gripper shoe 12, resin bed 13.
Duplexer block 10A after complanation is folded with resin bed 13A between device substrate 11A and gripper shoe 12A.Resin bed 13A to fit tightly on the 1st interarea 111A of device substrate 11A in the mode that can peel off and is fixed on gripper shoe 12A.Wherein, forming apparatus parts on the 2nd interarea 112A of device substrate 11A, will describe in detail below.
The outer peripheral face 14A of the duplexer block 10A after complanation becomes plane as shown in Figure 3, and groove 15(is with reference to Fig. 2) be removed.
When there is this groove 15, in the manufacturing process of device, the coating fluids such as anti-corrosion liquid easily immerse because of capillarity and accumulate.In groove 15, the coating fluid of accumulation is difficult to be removed by washing, easy remaining residue after dry.This residue becomes dust and produces source in the heating treatment step of device manufacturing process, and therefore the generation of dust pollutes in heating treatment step, and the yield rate as the device of product is reduced.
Because groove 15 is removed in present embodiment, therefore in the manufacturing process of device, the residue of coating fluid not easily accumulates.Therefore, the dust in heating treatment step can be suppressed to produce, the reduction of the yield rate of the device as product can be suppressed.
(chamfering of duplexer block)
As shown in Figure 1, the manufacture method of duplexer can have the operation (step S12) of the bight implementing the part of complanation of the outer peripheral face of duplexer block being carried out chamfering further.By chamfering, resistance to impact, security can be improved.
Before the outer peripheral face of duplexer block is carried out complanation, when chamfering is carried out in the bight of duplexer block, if the outer peripheral face of duplexer block is fluted, then the end of device substrate, the end failure in bending sometimes of gripper shoe.
In present embodiment, after the outer peripheral face of duplexer block is carried out complanation, chamfering is carried out in the bight of duplexer block, and therefore groove is removed in advance.Therefore, the bend at end breakage of the end of chamfering timer substrate, gripper shoe can be suppressed.
Chamfering method can be usual way.Include, for example out the method with bevelers such as grinders.The kind of chamfering can for the chamfering bight 110,120 after complanation being processed into plane as shown in Figure 4, also can be the R chamfering in arc-shaped face that the bight 110,120 after complanation is processed into as shown in Figure 5, also for the chamfering bight 110,120 after complanation being processed into the combination in plane and arc-shaped face as shown in Figure 6, can have no particular limits.In addition, can be the chamfering of resin bed of pruning, also can be the chamfering of resin bed of not pruning.
Chamfer dimesion is according to the suitable selection such as kind, thickness of device substrate, gripper shoe, resin bed.When R chamfering, the radius of curvature R 1 of device substrate side can be the same or different with the radius of curvature R 2 of gripper shoe side.When plane is processed in bight, the chamfer angle θ 1 of device substrate side can be the same or different with the chamfer angle θ 2 of gripper shoe side.
After chamfering, it is preferred that the thickness direction of the part and resin bed that implement complanation of the outer peripheral face of resin bed becomes almost parallel.Thus, what can reduce resin bed exposes area.
Resin bed expose area large time, due to the heating in the manufacturing process of device, resin bed becomes easy deterioration.
In present embodiment, what can reduce resin bed exposes area, therefore can the deterioration of resin bed in the manufacturing process of restraining device.
Fig. 7 is the local side figure of the duplexer block in the 1st embodiment of the present invention after chamfering.In Fig. 7, the shape of the duplexer block before chamfering shown in broken lines.The duplexer block 10B of Fig. 7 is the duplexer block two bights of the cut surface of the duplexer block 10A of Fig. 3 having been carried out R chamfering.Device substrate 11B, gripper shoe 12B after chamfering, resin bed 13B correspond respectively to device substrate 11A, gripper shoe 12A before chamfering, resin bed 13A.
Duplexer block 10B after chamfering is folded with resin bed 13B between device substrate 11B and gripper shoe 12B.Resin bed 13B fits tightly the 1st interarea 111B at device substrate 11B in the mode that can peel off and is fixed on gripper shoe 12B.
Duplexer block 10B after chamfering as shown in Figure 7, outer peripheral face 14B with fillet, therefore resistance to impact, excellent in safety.
As shown in Figure 7, the outer peripheral face 134B of resin bed 13B and the thickness direction (in Fig. 7, arrow A direction) of resin bed 13B become almost parallel to duplexer block 10B after chamfering, and therefore the area that exposes of resin bed 13B diminishes.Therefore, can suppress resin bed 13B, due to the heating in the manufacturing process of device, deterioration occurs.
(grinding of duplexer block)
As shown in Figure 1, the manufacture method of duplexer, when device substrate is the glass substrate with float glass process manufacture, after chamfering (namely after complanation), can have the grinding step (step S13) of the 2nd interarea of lapping device substrate further.Herein, comprise with the glass substrate of float glass process manufacture and being stretched with the glass substrate of float glass process manufacture by horizontal sheet process, make the glass substrate that thickness is thinner.
Float glass process is that the molten tin in float bath flows out melten glass, makes its downstream flow and be configured as the method for the glass of band plate-like.The glass of cutting belt tabular manufactures glass substrate, but glass baseplate surface has small concavo-convex, ripple produce.
By the grinding in aforementioned grinding step, the minute asperities of glass baseplate surface, ripple can be removed, the flatness on the surface of forming apparatus parts can be improved.Therefore the reliability of the device as product can be improved.This effect is significant when the thickness of glass substrate is 0.03 ~ 0.3mm.This is because the glass substrate of thickness 0.03 ~ 0.3mm is difficult to independent grinding, it is difficult for grinding in advance before forming duplexer block.
Before complanation when the 2nd interarea of lapping device substrate, if the outer peripheral face of duplexer block is fluted, then sometimes grinding agent can enter groove and cannot take out, device substrate failure in bending.In addition, even after planarization, before chamfering when the 2nd interarea of lapping device substrate, the sharp keen bight of device substrate is easily damaged.
In present embodiment, owing to being the 2nd interarea of (namely after complanation) lapping device substrate after chamfering, therefore chamfering has been carried out in advance in the bight of device substrate, and eliminates groove in advance.Therefore, when can suppress to grind, grinding agent is damaged to the attachment of groove, device substrate.
Ginding process can be usual way.Include, for example out the Ginding process of the abrasive grains such as use cerium oxide.
Grind according to the suitable setting of the device of the thickness of device substrate, use, such as, can be 0.05 ~ 10 μm.
Fig. 8 is the local side figure of the duplexer block in the 1st embodiment of the present invention after grinding.In fig. 8, the shape of the duplexer block before grinding shown in broken lines.The duplexer block 10C of Fig. 8 is the duplexer block of the 2nd interarea 112B of the device substrate 11B of the duplexer block 10B having ground Fig. 7.Device substrate 11C after grinding corresponds to the device substrate 11B before grinding.
Duplexer block 10C after grinding is folded with resin bed 13B between device substrate 11C and gripper shoe 12B.Resin bed 13B to fit tightly on the 1st interarea 111C of device substrate 11C in the mode that can peel off and is fixed on gripper shoe 12B.
Duplexer block 10C after grinding is compared with the duplexer block 10B before grinding, and the flatness, the cleannes that are formed with the 2nd interarea 112C of device parts uprise.
(manufacture method of device)
Fig. 9 is the process chart of the manufacture method representing device in the 1st embodiment of the present invention.
The 2nd interarea that the manufacture method of device has a device substrate of the duplexer block (duplexer) after complanation uses the operation (step S61) of coating fluid forming apparatus parts and the operation (step S62) of stripping off device substrate and resin bed.Herein, the duplexer block (duplexer) after complanation comprises the duplexer block (duplexer) after the duplexer block (duplexer) after chamfering, grinding certainly.
Device parts are be formed in parts at least partially on the 2nd interarea of device substrate, constituent apparatus.Device parts may not be whole (hereinafter referred to as " whole parts ") of the parts be finally formed on the 2nd interarea of device substrate, and can be a part (hereinafter referred to as " section components ") for whole parts.This is because, can make the device substrate with section components peeled off from resin bed in operation thereafter, become device substrate with whole parts.And then thereafter, the device substrate with whole parts can be used to carry out manufacturing installation.In addition, the device substrate with whole parts peeled off from resin bed can form other device parts in its release surface (the 1st interarea).In addition, the duplexer with whole parts can be used to carry out assembling device, and the gripper shoe then peeled off with resin bed from the duplexer with whole parts carrys out manufacturing installation.And then, two duplexers with whole parts can be used to carry out assembling device, then peel off two gripper shoes with resin bed from the duplexer with whole parts and carry out manufacturing installation.
The method of stripping off device substrate and resin bed can be known method.Such as, between device substrate and resin bed, thrust hoe scaler, thrust then to hoe scaler the fluid that position compressed-air blows and water mixes.In this condition, keep an interarea of duplexer smooth, make the flexural deformation successively from thrusting near position of another interarea.Such operation, peelable device substrate and resin bed.
Figure 10 is the process chart of the manufacture method of LCD in the 1st embodiment of the present invention.In present embodiment, the manufacture method of TFT-LCD is described, but the present invention also can be applicable to the manufacture method of STN-LCD, be not limited to kind and even the mode of liquid crystal panel.
The manufacture method of TFT-LCD has following operation: on the 2nd interarea of the device substrate of the duplexer block (duplexer) after complanation, carries out the operation (step S71) that patterning forms thin film transistor (TFT) (TFT) with anti-corrosion liquid to the metal film formed by the common membrane formation process such as CVD and sputtering method and metal oxide film etc.; With on the 2nd interarea of the device substrate of the duplexer block (duplexer) after other complanation, anti-corrosion liquid is used for pattern and is formed and form the operation (step S72) of colour filter (CF); With by the device substrate with TFT and the stacked operation (step S73) of the device substrate with CF; With the device substrate of both strippings and the operation (step S74) of resin bed.Wherein, TFT formation process (step S71) does not limit with the order of CF formation process (step S72), also can be almost simultaneously.In addition, stripping process (step S74) can before lamination process (step S73), also can in the way of TFT formation process, CF formation process.
In TFT formation process, CF formation process, use known photoetching technique, etching technique etc., the 2nd interarea of device substrate forms TFT, CF.Now, the coating fluid using anti-corrosion liquid to be formed as pattern.
In addition, formed before TFT, CF, can the 2nd interarea of wash mill substrate as required.As washing methods, known dry washing, wet scrubbing can be used.
In lamination process, between the duplexer with TFT and the duplexer with CF, inject liquid crystal material and stacked.As the method injecting liquid crystal material, such as, there is decompression injection method, drip injection method.
In decompression injection method, such as, the face first using encapsulant and isolated material to exist with the TFT mode relative with the face that CF exists is fitted two duplexers.Then two gripper shoes with resin bed are peeled off from two duplexers.Then, be multiple unit by the stream oriented device substrate cut of laminating.Make the inside of each unit of cutting be after reduced atmosphere, inject liquid crystal material from hand-hole to the inside of each unit and hand-hole is sealed.Then, each unit attaches Polarizer, assembling backlight etc., manufacture liquid crystal panel.
It should be noted that, in present embodiment, peel off two gripper shoes with resin bed from two duplexers, then the stream oriented device substrate cut of laminating is become multiple unit, but the present invention is not by its restriction.Such as, also before make two stacked considerations conjunctions with encapsulant and isolated material, the gripper shoe with resin bed can be peeled off from each duplexer.
Dripping in injection method, such as, first two duplexers any one on drip liquid crystal material, stacked two duplexers of mode that the face existed with TFT with encapsulant and isolated material is relative with the face that CF exists.Then, two gripper shoes with resin bed are peeled off from two duplexers.Then stacked stream oriented device substrate cut is become multiple unit.Then on each unit, attach Polarizer, assembling backlight etc., manufacture liquid crystal panel.
The manufacture method of liquid crystal panel, except above-mentioned operation, can also be had from after gripper shoe with resin bed peeled off by the glass substrate as device substrate, by chemical etching process, glass substrate be carried out to the operation (step S75) of thin plate.1st interarea of glass substrate due to protect by gripper shoe, even if therefore carry out etch processes, also not easily produce etch pit.
It should be noted that, in the example shown in Figure 10, difference each use duplexer when manufacturing the device substrate with TFT, the device substrate with CF, but the present invention is by its restriction.Such as, also can manufacture the device substrate with TFT, the device substrate with CF time only one of them substrate use duplexer.
Figure 11 is the process chart of the manufacture method of the organic EL panel (OLED) of the 1st embodiment of the present invention.
The manufacture method of organic EL panel has following operation: the anti-corrosion liquid using pattern to be formed, the 2nd interarea of the device substrate of the duplexer after complanation is formed the operation (step S81) of organic EL element; With in the operation (step S82) of organic EL element upper strata overlay to substrate; With the operation (step S83) of stripping off device substrate and resin bed.Wherein, stripping process (step S83) can before lamination process (step S82), also can in the way of organic EL element formation process (step S81).
In organic EL element formation process, known optical lithography, evaporation coating technique etc. is used to form organic EL element on the 2nd interarea of device substrate.Now, the 2nd interarea of device substrate is coated with the coating fluid that anti-corrosion liquid is formed as pattern.Organic EL element is such as formed by transparent electrode layer, hole transmission layer, luminescent layer, electron transfer layer etc.
In addition, formed before organic EL element, can the 2nd interarea of wash mill substrate as required.As washing methods, such as, can use dry washing, wet scrubbing.
In lamination process, such as, first the gripper shoe with resin bed is peeled off from the device substrate with organic EL element.Then the device substrate with organic EL element is cut into multiple unit.Then, to make the mode of organic EL element and subtend substrate contacts fit each unit and subtend substrate.Like this, organic el display is made.
As above operate the display floaters such as LCD, OLED of manufacture, its purposes is not particularly limited to, such as, can be suitably used for the portable electric appts such as mobile phone, PDA, digital camera, game machine.
(the 2nd embodiment)
2nd embodiment relates to the duplexer block before complanation.
Figure 12 be the 2nd embodiment of the present invention planarizing before the local side figure of duplexer block.As shown in figure 12, the duplexer block 20 before complanation is folded with resin bed 23 between device substrate 21 and gripper shoe 22.Resin bed 23 to fit tightly on the 1st interarea 211 of device substrate 21 in the mode that can peel off and is fixed in gripper shoe 22.
Gripper shoe 22 is larger than resin bed 23, and resin bed 23 is larger than device substrate 21.In this case as shown in figure 12, when device substrate 21 has carried out chamfer machining, because the outer peripheral face of device substrate 21 is with fillet, therefore on the outer peripheral face 24 of duplexer block 20, groove 25 is formed.
In this case, by the A-A' Linear cut duplexer block 20 along Figure 12, the outer peripheral face 24 of duplexer block 20 can be carried out complanation, groove 25 can be removed.
But during along B-B' line, the C-C' Linear cut duplexer block 20 of Figure 12, the outer peripheral face 24 of duplexer block 20 cannot be carried out complanation, therefore groove 25 remains.
In this case, the groove 25 that results from remains, and in the manufacturing process of device, the residue of coating fluid easily remains.This residue becomes dust and produces source in the heating treatment step of device manufacturing process, and therefore the generation of dust pollutes in heating treatment step, and the yield rate as the device of product is reduced.
Groove 25 can be removed in present embodiment, therefore can the generation of dust in the manufacturing process of restraining device, the reduction of the yield rate of the device as product can be suppressed.
(the 3rd embodiment)
Figure 13 be the 3rd embodiment of the present invention planarizing before the local side figure of duplexer block.As shown in figure 13, the sandwiched resin bed 33 between device substrate 31 and gripper shoe 32 of the duplexer block 30 before complanation.Resin bed 33 to fit tightly on the 1st interarea 311 of device substrate 31 in the mode that can peel off and is fixed in gripper shoe 32.
Resin bed 33 is less than device substrate 31, gripper shoe 32.Therefore, as shown in figure 13, the outer peripheral face 34 of duplexer block 30 forms groove 35.
In this case, by the A-A' Linear cut duplexer block 30 along Figure 13, the outer peripheral face 34 of duplexer block 30 can be carried out complanation, groove 35 can be removed.
But, during along B-B' line, the C-C' Linear cut duplexer block 30 of Figure 13, the outer peripheral face 34 of duplexer block 30 cannot be carried out complanation, therefore groove 35 part or all remain.
In this case, result from groove 35 part or all remain, in the manufacturing process of device, the residue of coating fluid easily remains.This residue becomes dust and produces source in the heating treatment step of device manufacturing process, and therefore the generation of dust pollutes in heating treatment step, and the yield rate as the device of product is reduced.
Groove 35 can be removed in present embodiment, therefore can produce by the dust in the manufacturing process of restraining device, the reduction of the yield rate of the device as product can be suppressed.
Embodiment
By the following examples etc. illustrate the present invention, but the present invention is by any restriction of these embodiment.
(embodiment 1)
Gripper shoe uses by the glass plate of the long 370mm × wide 320mm × thick 0.6mm of float glass process gained (Asahi Glass company manufactures, AN100, alkali-free glass).The average coefficient of linear expansion of this glass plate is 38 × 10 -7/ DEG C.
This glass plate is carried out pure water, UV washing, by the Surface cleaning of glass plate.Then, the solvent-free addition reaction-type organosilicon of 100 mass parts (Shinetsu Silicone Co. is applied at the surface spinner of glass plate, Ltd. manufacture, KNS-320A) and 5 mass parts platinum group catalysts (Shinetsu Silicone Co., Ltd. manufacture, CAT-PL-56) mixture (coated weight 20g/m 2).
Above-mentioned solvent-free addition reaction-type organosilicon comprises and has and the straight-chain olefinic organic based polysiloxane (host) of the vinyl of silicon atom bonding and methyl and the straight-chain organic hydrogen polysiloxanes (crosslinking agent) that has with the hydrogen atom of bonded silica atom and methyl.
Within 10 minutes, make it solidify heating at the mixture applied on a glass in an atmosphere 180 DEG C, form the resin bed of long 366mm × wide 316mm on a glass and fix.
On the other hand, device substrate uses the resin substrate (Sumitomo Bakelite Co., Ltd manufacture, Sumilite FS-5300) of the long 370mm × wide 320mm × thick 0.1mm formed by polyether sulfone.The average coefficient of linear expansion of this resin substrate is 540 × 10 -7/ DEG C.
This resin substrate is carried out pure water, UV washing, by the Surface cleaning of resin substrate.Then, after resin substrate and glass plate are carried out position alignment, at room temperature make fixing resin bed on a glass fit tightly on the 1st interarea of resin substrate with vacuum pressurizing device.
Operate as described above, obtain the duplexer block roughly the same with the duplexer block shown in Fig. 2.Through-thickness cutting gained duplexer block, at the all-round peripheral part to removing duplexer block with width 10mm.Specifically, with cutter through-thickness cutting resin substrate and resin bed, and after forming score line with glass cutter on the interarea of glass plate, make the flexural deformation of duplexer block and cut off along score line, at the all-round peripheral part to removing duplexer block.
Under this state, the outer peripheral face of resin substrate, glass plate and resin bed all-round to unanimously, the outer peripheral face of duplexer block all-round to having carried out complanation.In addition, the outer peripheral face of duplexer block has no groove.
Then, after the duplexer block after the black matrix" of CF floods complanation with anti-corrosion liquid (Asahi Glass company manufactures, PMA-ST) is middle, wash by propylene glycol monomethyl ether acetate (main solvent of anti-corrosion liquid).Then in hot-air oven at 120 DEG C dry 30 minutes, during outer peripheral face with microscopic examination duplexer, the residue of anti-corrosion liquid is had no.
(embodiment 2)
In example 2, except gripper shoe uses by beyond the glass plate of the long 370mm × wide 320mm × thickness 0.4mm of float glass process gained (Asahi Glass company manufactures, AN100, alkali-free glass), form resin bed on a glass similarly to Example 1 and fix.
In addition, in example 2, except device substrate uses by the glass substrate of the long 370mm × wide 320mm × thickness 0.3mm of float glass process gained, (Asahi Glass company manufactures, AN100, alkali-free glass) beyond, make fixing resin bed on a glass fit tightly on the 1st interarea of glass substrate similarly to Example 1.
Operate as described above, obtain the duplexer block roughly the same with the duplexer block shown in Fig. 2.Through-thickness cutting gained duplexer block, at the all-round peripheral part to removing duplexer block with width 10mm.Specifically, on the 2nd interarea of glass substrate, score line is formed with glass cutter, and with glass cutter after the interarea of glass plate forms score line, make the flexural deformation of duplexer block and cut off along score line, at the all-round peripheral part to removing duplexer block.
Under this state, the outer peripheral face of glass substrate, glass plate and resin bed all-round to unanimously, the outer peripheral face of duplexer block all-round to having carried out complanation.In addition, the outer peripheral face of duplexer block has no groove.
With grinding stone by the bight of the outer peripheral face of this duplexer block all-round to carrying out chamfering.Chamfer dimesion is set to radius of curvature R=0.4(unit: mm).
Then flood in anti-corrosion liquid similarly to Example 1 the duplexer block after chamfering, washing and drying after, with the outer peripheral face of microscopic examination duplexer.Its result, has no the residue of anti-corrosion liquid.
(comparative example 1)
In comparative example 1, the duplexer block before the cutting obtained similarly to Example 2 to be immersed in similarly to Example 1 in anti-corrosion liquid, washing after drying, with the outer peripheral face of microscopic examination duplexer.Its result, the residue of visible anti-corrosion liquid.
In detail and describe the present invention with reference to specific embodiment, but it will be apparent to those skilled in the art that and various correction, change are carried out to the present invention with can not departing from the spirit and scope of the invention.
The Japanese patent application 2010-012785 that the application applied for based on January 25th, 2010, its content is incorporated in this as reference.
description of reference numerals
10 duplexer blocks
11 device substrates
111 the 1st interareas
11 the 2nd interareas
12 gripper shoes
13 resin beds
14 outer peripheral faces
15 grooves

Claims (8)

1. the manufacture method of a duplexer, the method comprises and duplexer block is cut into given size and by the operation of carrying out complanation at least partially of the circumference of the outer peripheral face of described duplexer block, described duplexer block for be folded with resin bed between device substrate and gripper shoe, this resin bed to fit tightly on the 1st interarea of described device substrate in the mode that can peel off and is fixed in described gripper shoe, described device substrate and gripper shoe are glass, the groove that the outer peripheral face of described duplexer block is formed is removed by described planarization process, described groove is by device substrate, the groove that the outer peripheral face of gripper shoe and resin bed is formed with fillet.
2. the manufacture method of duplexer according to claim 1, wherein, also comprises the operation of the bight implementing the part of complanation of the outer peripheral face of described duplexer block being carried out chamfering.
3. the manufacture method of duplexer according to claim 1 and 2, wherein, the part implementing complanation of the outer peripheral face of described resin bed is almost parallel with the thickness direction of described resin bed.
4. the manufacture method of duplexer according to claim 2, wherein, described device substrate is the glass substrate manufactured by float glass process,
After the method comprises chamfering is carried out in described bight, grind the operation of the 2nd interarea of described device substrate.
5. the manufacture method of duplexer according to claim 1 and 2, wherein, described device substrate is more than thickness 0.03mm and less than the glass substrate of 0.8mm.
6. the manufacture method of duplexer according to claim 1 and 2, wherein, described resin bed comprises at least one in the group being selected from and being made up of acrylic resin, vistanex, polyurethane resin and organic siliconresin.
7. the manufacture method of duplexer according to claim 1 and 2, wherein, the thickness of described resin bed is 5 ~ 50 μm.
8. a duplexer, it is for being cut into given size by duplexer block and the circumference of the outer peripheral face of described duplexer block having been carried out the duplexer of complanation at least partially, described duplexer block for be folded with resin bed between device substrate and gripper shoe, this resin bed to fit tightly on the 1st interarea of described device substrate in the mode that can peel off and is fixed in described gripper shoe, described device substrate and gripper shoe are glass, the groove that the outer peripheral face of described duplexer block is formed is removed by described planarization process, described groove is by device substrate, the groove that the outer peripheral face of gripper shoe and resin bed is formed with fillet.
CN201180007092.0A 2010-01-25 2011-01-17 The manufacture method of duplexer and duplexer Active CN102725143B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-012785 2010-01-25
JP2010012785 2010-01-25
PCT/JP2011/050680 WO2011090004A1 (en) 2010-01-25 2011-01-17 Method for manufacturing laminate, and laminate

Publications (2)

Publication Number Publication Date
CN102725143A CN102725143A (en) 2012-10-10
CN102725143B true CN102725143B (en) 2015-09-30

Family

ID=44306807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180007092.0A Active CN102725143B (en) 2010-01-25 2011-01-17 The manufacture method of duplexer and duplexer

Country Status (5)

Country Link
JP (1) JP5716678B2 (en)
KR (1) KR101538835B1 (en)
CN (1) CN102725143B (en)
TW (1) TWI508863B (en)
WO (1) WO2011090004A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101900971B1 (en) * 2010-12-28 2018-09-20 에이지씨 가부시키가이샤 Process for production of laminate
JP5904457B2 (en) * 2011-05-13 2016-04-13 日本電気硝子株式会社 Laminated body
US9446566B2 (en) 2011-05-13 2016-09-20 Nippon Electric Glass Co., Ltd. Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
JP5790392B2 (en) * 2011-10-12 2015-10-07 旭硝子株式会社 Manufacturing method of electronic device
JP5887946B2 (en) * 2012-01-18 2016-03-16 旭硝子株式会社 Method for manufacturing electronic device and method for manufacturing glass laminate
CN107275763B (en) 2012-03-23 2020-07-28 Lg 伊诺特有限公司 Antenna assembly
TWI604480B (en) 2012-03-23 2017-11-01 Ｌｇ伊諾特股份有限公司 Wireless power receiver and portable terminal comprising the same
US20140014260A1 (en) 2012-07-12 2014-01-16 Dipakbin Qasem Chowdhury Laminated structures and methods of manufacturing laminated structures
JP6003604B2 (en) * 2012-12-10 2016-10-05 旭硝子株式会社 Laminate processing method, processed laminate
WO2014092015A1 (en) * 2012-12-13 2014-06-19 旭硝子株式会社 Electronic device manufacturing method, and glass laminate manufacturing method
JP6375595B2 (en) * 2013-06-21 2018-08-22 凸版印刷株式会社 Coreless wiring board manufacturing method and peeling apparatus
JP2015096313A (en) * 2013-11-15 2015-05-21 日本電気硝子株式会社 Glass film laminate and method of producing liquid crystal panel
CN107406294A (en) * 2015-01-06 2017-11-28 康宁股份有限公司 For processing the glass carrier component and method of flexible glass plate
JP6541987B2 (en) * 2015-02-18 2019-07-10 コニカミノルタ株式会社 Optical element and method of manufacturing imaging element
JP6593676B2 (en) * 2015-03-02 2019-10-23 日本電気硝子株式会社 Laminated body and semiconductor package manufacturing method
JP2016210023A (en) * 2015-04-30 2016-12-15 日本電気硝子株式会社 Method for manufacturing flexible laminate
WO2017099167A1 (en) * 2015-12-09 2017-06-15 旭硝子株式会社 Laminated glass
JP6834983B2 (en) 2015-12-21 2021-02-24 Ａｇｃ株式会社 Laminated board
JP2018032661A (en) * 2016-08-22 2018-03-01 イビデン株式会社 Printed wiring board and method for manufacturing the same
WO2018092688A1 (en) * 2016-11-15 2018-05-24 旭硝子株式会社 Laminated substrate and method for manufacturing electronic device
CN106624628B (en) * 2016-11-22 2019-07-23 江西昌河航空工业有限公司 A kind of honeycomb core NC processing method of no chamfering defect
KR102200159B1 (en) * 2017-12-18 2021-01-08 주식회사 포스코 Method of manufacturing ultra thin and wide width steel sheet
EP3878647A4 (en) * 2018-11-08 2022-06-15 Nitto Denko Corporation Thin glass laminated body
CN111918489B (en) * 2020-08-26 2022-07-05 鸿安（福建）机械有限公司 Multilayer PCB board closing device
KR102443795B1 (en) * 2020-11-03 2022-09-16 주식회사 도우인시스 Manufacturing Method of Ultra-Thin Type Glass Plate
JP2022078516A (en) * 2020-11-13 2022-05-25 日東電工株式会社 Multilayer structure and method for manufacturing the same
TWI770818B (en) * 2021-02-10 2022-07-11 彩碁科技股份有限公司 A substrate and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001097733A (en) * 1999-09-29 2001-04-10 Mitsubishi Plastics Ind Ltd Method for handling glass film and glass laminate
JP2007281067A (en) * 2006-04-04 2007-10-25 Nitto Denko Corp Semiconductor device manufacturing method and semiconductor wafer processing adhesive sheet used for it
US20080135175A1 (en) * 2005-08-09 2008-06-12 Asahi Glass Company, Limited Thin plate glass laminate and process for producing display device using thin plate glass laminate
CN101334546A (en) * 2007-06-29 2008-12-31 株式会社日立显示器 Liquid crystal display device
JP2009120439A (en) * 2007-11-14 2009-06-04 Agc Glass Kenzai Engineering Co Ltd Tempered laminated glass, glass screen structure and glass-made handrail
CN100532017C (en) * 2005-05-27 2009-08-26 日本电气硝子株式会社 End surface processing device of glass substrate and end surface processing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545277A (en) * 1994-10-03 1996-08-13 Ford Motor Company Plate glass edge strength
EP1048628A1 (en) * 1999-04-30 2000-11-02 Schott Glas Polymer coated glassfoil substrate
JP4250276B2 (en) * 1999-10-20 2009-04-08 三菱樹脂株式会社 Plastic film / glass film laminate and method for producing the same
JP2002011826A (en) * 2000-06-29 2002-01-15 Mitsubishi Plastics Ind Ltd Metal laminated injection molding and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001097733A (en) * 1999-09-29 2001-04-10 Mitsubishi Plastics Ind Ltd Method for handling glass film and glass laminate
CN100532017C (en) * 2005-05-27 2009-08-26 日本电气硝子株式会社 End surface processing device of glass substrate and end surface processing method
US20080135175A1 (en) * 2005-08-09 2008-06-12 Asahi Glass Company, Limited Thin plate glass laminate and process for producing display device using thin plate glass laminate
JP2007281067A (en) * 2006-04-04 2007-10-25 Nitto Denko Corp Semiconductor device manufacturing method and semiconductor wafer processing adhesive sheet used for it
CN101334546A (en) * 2007-06-29 2008-12-31 株式会社日立显示器 Liquid crystal display device
JP2009120439A (en) * 2007-11-14 2009-06-04 Agc Glass Kenzai Engineering Co Ltd Tempered laminated glass, glass screen structure and glass-made handrail

Also Published As

Publication number Publication date
JPWO2011090004A1 (en) 2013-05-23
JP5716678B2 (en) 2015-05-13
CN102725143A (en) 2012-10-10
TW201132503A (en) 2011-10-01
KR101538835B1 (en) 2015-07-22
KR20120123375A (en) 2012-11-08
TWI508863B (en) 2015-11-21
WO2011090004A1 (en) 2011-07-28

Similar Documents

Publication Publication Date Title
CN102725143B (en) The manufacture method of duplexer and duplexer
CN102596565B (en) Multilayer structure with flexible base material and support, panel for use in electronic device provided with support and production method for panel for use in electronic device
CN102883879B (en) Process for producing laminate, and laminate
CN102362305B (en) Manufacturing method for electronic device
WO2011024775A1 (en) Support, glass substrate laminate, support-equipped display device panel, and method for manufacturing a display device panel
CN103213371A (en) Method for manufacturing electronic device and method for manufacturing glass laminate
WO2008007622A1 (en) Glass substrate with protective glass, process for producing display using glass substrate with protective glass, and silicone for release paper
CN103889712A (en) Laminate, method for producing laminate, and method for producing glass substrate having member for electronic devices attached thereto
KR20160119080A (en) Glass laminate
CN103201104A (en) Laminate body, panel for use in display device with support board, panel for use in display device, and display device
KR20170102239A (en) Glass laminate, method for producing electronic device, method for producing glass laminate, and glass plate package
JP6194893B2 (en) GLASS LAMINATE, PROCESS FOR PRODUCING THE SAME, AND SUPPORT SUBSTRATE WITH SILICONE RESIN LAYER
CN102791647B (en) Method for eliminating resin film and method for producing laminate
KR102296538B1 (en) Method of removing the resin layer
JP6361440B2 (en) Glass laminate, method for producing the same, and method for producing electronic device
JP5770890B2 (en) SUPPORT, GLASS SUBSTRATE LAMINATE, DISPLAY DEVICE PANEL WITH SUPPORT AND METHOD FOR PRODUCING DISPLAY DEVICE PANEL
JP6063522B2 (en) SUPPORT, GLASS SUBSTRATE LAMINATE, DISPLAY DEVICE PANEL WITH SUPPORT AND METHOD FOR PRODUCING DISPLAY DEVICE PANEL

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan, Japan

Patentee after: AGC Corporation

Address before: Tokyo, Japan, Japan

Patentee before: Asahi Glass Co., Ltd.