KR20130039701A - Method for producing electronic device - Google Patents

Abstract

PURPOSE: A manufacturing method of an electronic device capable of including a fissility glass substrate and a member for the electronic device is provided to provide the manufacturing method of the electronic device in which the productivity is excellent, and uses a carrier substrate including a resin layer with excellent flatness. CONSTITUTION: A manufacturing method of an electronic device prepares a surface treatment process(S102) obtaining a fissility glass substrate having a surface showing an easy fissility by treating a first main surface of the glass substrate having the first main surface and a second main surface with a fissility material. By covering a curing resin composition layer on a surface showing an easy fissility of the fissility glass substrate, the curing resin composition layer formation process(S104) forming a hardening property resin composition layer is prepared. A lamination process (S106) is prepared to obtain the former hardening laminate layer by laminating a carrier substrate, having a smaller outer size than the outer size of the hardening property resin composition layer of the uncured, on the hardening property resin composition layer of the uncured in order to leave a fringe area which does not contact with the carrier substrate on the hardening property resin composition layer of the uncured. A hardening process(S108) obtaining the laminated layer after the hardening and having the resin layer is prepared by hardening the hardening property resin composition layer of the uncured in the former hardening laminated layer. A sawing process(S110) cutting the resin layer and the fissility glass substrate is prepared along the outer periphery of the carrier substrate within the post-cure laminate. A member formation process(S112) obtaining the laminate layer equipped with the member for the electronic device is prepared by forming the member for the electronic device on the second major surface of the fissility glass substrate. A singulation process(S114) obtaining the electronic device having the fissility glass substrate and the member for the electronic device is prepared as the laminate layer including the member for the electronic device. [Reference numerals] (AA) Start; (BB) End; (S102) Surface treatment process; (S104) Curing resin composition layer formation process; (S106) Lamination process; (S108) Hardening process; (S110) Sawing process; (S112) Member formation process; (S114) Singulation process;

Description

Manufacturing method of electronic device {METHOD FOR PRODUCING ELECTRONIC DEVICE}

TECHNICAL FIELD This invention relates to the manufacturing method of an electronic device.

In recent years, thinning and weight reduction of devices (electronic devices), such as a solar cell (PV), a liquid crystal panel (LCD), and an organic electroluminescent panel (OLED), are progressing, and the thinning of the glass substrate used for these devices is progressing. If the strength of the glass substrate is insufficient due to thinning, the handling property of the glass substrate decreases in the device manufacturing process.

Therefore, conventionally, after forming a device member (for example, a thin film transistor) on the glass substrate thicker than a final thickness, the method of thinly thinning a glass substrate by a chemical etching process is employ | adopted widely. However, in this method, when the thickness of one glass substrate is thinned from 0.7 mm to 0.2 mm or 0.1 mm, for example, most of the original glass substrate material is scraped off with an etchant, thus increasing productivity and use efficiency of raw materials. It is not preferable from the viewpoint.

In addition, in the thinning method of the glass substrate by said chemical etching, when a fine flaw exists on the surface of a glass substrate, a fine recessed part (etch pit) is formed by an etching process as a starting point, and an optical defect There was a case.

In recent years, in order to respond to the above problem, a laminate in which a glass substrate and a reinforcement plate are laminated is prepared, and after forming a member for an electronic device such as a display device on the glass substrate of the laminate, the reinforcement plate is removed from the glass substrate. A separation method has been proposed (see, for example, Patent Document 1). A reinforcement board has a support body and the resin layer fixed on the said support body, and a resin layer and a glass substrate adhere | attach so that peeling is possible. The interface of the resin layer of a laminated body and a glass substrate is peeled off, and the reinforcement board separated from the glass substrate is laminated | stacked with a new glass substrate, and can be reused as a laminated body.

International Publication No. 07/018028

On the other hand, in recent years, with the request for the high performance of an electronic device, further refinement | miniaturization of the member for electronic devices advances, and the process performed is becoming more complicated. Even in the above situation, it is required to manufacture an electronic device having excellent performance with high productivity.

MEANS TO SOLVE THE PROBLEM When this inventor manufactured the electronic device using the laminated body of patent document 1, it discovered that the performance of the obtained electronic device may be inferior. For example, when an OLED panel is manufactured, display irregularity may occur in a driving region of the panel.

MEANS TO SOLVE THE PROBLEM The present inventors examined the said cause, and there exists a thickness nonuniformity (especially a convex part in a periphery part) of the resin layer in the laminated body of patent document 1, and this causes the flatness of a glass substrate, and consequently an electron It was found that the manufacturing yield of the device was lowered.

FIG. 8A is a cross-sectional view of the carrier substrate 28 including the resin substrate having the carrier substrate 14 and the resin layer 18, which are used when producing the laminate described in Patent Document 1. FIG. A glass substrate is laminated | stacked on the exposed surface of the resin layer 18 in the carrier substrate 28 provided with the resin layer, and a laminated body is formed. As shown to FIG. 8A, the resin layer 18 formed by the method of patent document 1 has thickness nonuniformity. In particular, this thickness nonuniformity is remarkable in the vicinity of the outer periphery of the resin layer 18, and the convex part 80 is formed. When the glass substrate 82 is laminated on the resin layer 18 having such a thickness nonuniformity, the center part of the glass substrate 82 is curved so as to be concave, and the flatness of the glass substrate 82 is impaired (FIG. 8B). ) Reference). When the flatness of the glass substrate 82 is impaired, the position shift of the member for electronic devices arrange | positioned on the glass substrate 82, etc. generate | occur | produce, and as a result, there exists a possibility of causing the performance fall of an electronic device.

In addition, as shown in FIG. 8B, when the glass substrate 82 is laminated on the carrier substrate 28 having such a resin layer, a gap (between the glass substrate 82 and the resin layer 18) is formed. 84) is formed. The laminated body is provided in the manufacturing process of the member for electronic devices, and functional layers, such as a conductive layer, are formed on the exposed surface of the glass substrate 82. At this time, various solutions such as a resist solution are used.

If the voids 84 are present in the laminate, various solutions are drawn in by capillary action. The material which entered the space | gap 84 is difficult to remove also by washing | cleaning, and it is easy to remain as a foreign material after drying. Since this foreign matter becomes a pollution source that contaminates the electronic device member by heat treatment or the like, it causes performance degradation of the electronic device and consequently lowers the yield.

This invention is made | formed in view of the said subject, and an object of this invention is to provide the manufacturing method of the electronic device excellent in productivity using the carrier substrate provided with the resin layer excellent in flatness.

MEANS TO SOLVE THE PROBLEM The present inventors completed this invention, as a result of earnestly examining in order to solve the said subject.

That is, the 1st aspect of this invention is a manufacturing method of the electronic device containing a peelable glass substrate and a member for electronic devices, Comprising: The said 1st main surface of the glass substrate which has a 1st main surface and a 2nd main surface is treated with a release agent, Curable which apply | coats curable resin composition on the surface treatment process of obtaining the peelable glass substrate which has a surface which shows peelability, and the surface which shows peelability of the said peelable glass substrate, and forms an uncured curable resin composition layer. The carrier substrate having a resin composition layer forming step and an outer dimension smaller than the outer dimension of the uncured curable resin composition layer is left in the uncured curable resin composition layer so that a peripheral region does not contact the carrier substrate. The lamination | stacking process of laminating | stacking on the unhardened curable resin composition layer, and obtaining a laminated body before hardening, and the said laminated body before hardening The said resin layer and said peelable glass along the hardening process of hardening | curing the said uncured curable resin composition layer of the above, and obtaining a laminated body after hardening which has a resin layer, and the outer periphery of the said carrier substrate in the said laminated body after hardening. And a cutting step of cutting the substrate, a member forming step of forming a member for an electronic device on the second main surface of the peelable glass substrate, obtaining a laminate including the member for an electronic device, and the member for the electronic device. It is a manufacturing method of the electronic device provided with the separation process obtained by isolate | separating the said peelable glass substrate and the electronic device which has the said electronic device member from one laminated body.

In a 1st aspect, it is preferable to further provide the defoaming process of performing the defoaming process of the said uncured curable resin composition layer after the said lamination process and before the said hardening process.

In a 1st aspect, it is preferable that the said peeling agent contains the compound which has a methylsilyl group or a fluoroalkyl group.

In a 1st aspect, it is preferable that the said peeling agent contains a silicone oil or a fluorine-type compound.

In a 1st aspect, it is preferable that the said resin layer contains a silicone resin.

In 1st aspect, it is preferable that the said resin layer is hardened | cured material of addition reaction type silicone which consists of a combination of the organo alkenyl polysiloxane which has an alkenyl group, and the organohydrogen polysiloxane which has a hydrogen atom couple | bonded with the silicon atom.

It is preferable that the molar ratio of the hydrogen atom couple | bonded with the silicon atom of the said organohydrogenpolysiloxane with respect to the alkenyl group of the said organo alkenyl polysiloxane is 0.5-2.

In 1st aspect, it is preferable that the said resin layer contains 5 mass% or less of non-hardening organopolysiloxane.

1st aspect WHEREIN: It is preferable in the said cutting process that the main surface of the carrier substrate in the said laminated body after hardening is supported by a stage, and the outer periphery of the said carrier substrate is made to contact the positioning block formed on the said stage. Do.

In a 1st aspect, in the said cutting process, after forming a cut line on the surface of the peelable glass substrate in the said laminated body after hardening, each of the peelable glass substrate and resin layer in the said laminated body after hardening along a broken line It is preferable to cut the outer periphery at once.

According to this invention, the manufacturing method of the electronic device excellent in productivity using the carrier substrate provided with the resin layer excellent in flatness can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS The flowchart which shows the manufacturing process of one Embodiment of the manufacturing method of the electronic device of this invention.
2 (A) to 2 (G) are schematic cross-sectional views showing one embodiment of a method for manufacturing an electronic device of the present invention in the order of steps.
3A is a top view of the laminate before curing obtained in the lamination step.
3B is a partial cross-sectional view showing a state before lamination of a carrier substrate.
3C is a partial cross-sectional view showing a state after laminating a carrier substrate.
4 is a plan view partially showing the laminated body after curing loaded on a stage;
FIG. 5 is a cross-sectional view showing a part of the laminate and the processing head after curing, which are stacked on the stage. FIG.
FIG. 6 is a cross-sectional view showing the laminate and the fitting support jig after curing loaded on another stage. FIG.
7 is a flowchart showing a manufacturing process of another embodiment of the manufacturing method of the electronic device of the present invention.
Fig. 8A is a sectional view of a carrier substrate with a resin layer based on the prior art.
Fig. 8B is a partial cross sectional view of the end of the laminate, based on the prior art;

EMBODIMENT OF THE INVENTION Hereinafter, although the form for implementing this invention is demonstrated with reference to drawings, this invention is not limited to the following embodiment, A various deformation | transformation and substitution are given to the following embodiment, without deviating from the range of this invention. Can be added.

MEANS TO SOLVE THE PROBLEM The present inventors examined the problem of invention of patent document 1, and discovered that the unevenness | corrugation arises on the surface of a resin layer under the influence of application | coating of curable resin composition, or the surface tension in an air interface. did.

Therefore, by contacting with a glass substrate showing predetermined peelability in a state where the resin layer is uncured, giving flatness, and curing, a laminate having a resin layer having predetermined flatness can be obtained, resulting in an electronic device. It has been found that the degradation in performance can be suppressed.

Below, the manufacturing method of an electronic device is demonstrated in order of each process.

In addition, in this invention, that the peeling strength of the interface of the resin layer in the laminated body after hardening mentioned later, and the layer of a carrier substrate is higher than the peeling strength of the interface of the layer of a glass substrate and a resin layer is called a carrier below. It is said that it is fixed to a board | substrate and the resin layer is closely_contact | adhering to a glass substrate so that exfoliation is possible.

[First Embodiment]

1 is a flowchart showing a manufacturing process in one embodiment of a method for manufacturing an electronic device of the present invention. As shown in FIG. 1, the manufacturing method of an electronic device is provided with surface treatment process S102, curable resin composition layer formation process S104, lamination process S106, curing process S108, cutting process S110, member formation process S112, and separation process S114. do.

2 is typical sectional drawing which shows each manufacturing process in the manufacturing method of the electronic device of this invention in order.

Hereinafter, with reference to Fig. 2, the materials used in each step and the procedure thereof will be described in detail. First, surface treatment process S102 is demonstrated in detail.

[Surface Treatment Process]

Surface treatment process S102 is a process of processing the 1st main surface of the glass substrate which has a 1st main surface and a 2nd main surface with a peeling agent, and obtaining a peelable glass substrate which has a surface which shows peelability. By performing the said process S102, the peelable glass substrate 10 which contact | connects so that exfoliation and the resin layer mentioned later can be obtained (refer FIG. 2 (A)). The peelable glass substrate 10 means the glass substrate which has the surface 10a which shows easy peelability with respect to the resin layer mentioned later here. In addition, with the peelability which the surface of a peelable glass substrate has, when the external force for peeling a peelable glass substrate is applied from the laminated body after hardening mentioned later, it does not peel in the interface of a carrier substrate and a resin layer, and inside a resin layer, It means the property which peels at the interface of a peelable glass substrate and a resin layer.

First, the glass substrate and peeling agent used at this process are demonstrated in detail, and the procedure of the said process S102 is explained in full detail after that.

(Glass substrate)

A glass substrate is a plate-shaped board | substrate which has a 1st main surface and a 2nd main surface, and the 1st main surface is surface-treated with a peeling agent. An electronic device member is formed on the 2nd main surface which is surface-treated and the 1st main surface which shows easy peelability is peelably contact | connected with the resin layer mentioned later and peelable, and is the opposite side to the side in close contact with a resin layer.

Although the kind of glass substrate may be general, the glass substrate for display apparatuses, such as LCD and OLED, etc. are mentioned, for example. The glass substrate is excellent in chemical resistance, moisture permeability, and low in heat shrinkage. As an index of thermal contraction rate, the linear expansion coefficient prescribed | regulated to JISR3102 (Rev. 1995) is used.

When the coefficient of linear expansion of a glass substrate is large, since the member formation process S112 often involves heat processing, various problems are easy to produce. For example, when forming a TFT on a glass substrate, when cooling the glass substrate in which TFT was formed under heating, there exists a possibility that the position shift of TFT may become excessive by heat shrink of a glass substrate.

The glass substrate is obtained by melting a glass raw material and molding the molten glass into a plate. Such a molding method may be a general one. For example, a float method, a fusion method, a slot down draw method, a furcol method, a rubber method and the like are used. Moreover, especially a thin glass substrate is obtained by shape | molding the glass once shape | molded at plate shape by the method (stretch method) which stretches and thins by means of extending | stretching temperature, etc. by means of extending | stretching temperature.

The glass of the glass substrate is not particularly limited, but is preferably an alkali-free borosilicate glass, borosilicate glass, soda lime glass, high silica glass, or other oxide-based glass containing silicon oxide as a main component. As the oxide-based glass, a glass having a silicon oxide content of 40 to 90 mass% in terms of an oxide is preferable.

As the glass of the glass substrate, glass suitable for the kind of the electronic device member and the manufacturing process thereof is employed. For example, the glass substrate for liquid crystal panels consists of glass (alkali free glass) which does not substantially contain an alkali metal component, since elution of an alkali metal component tends to affect a liquid crystal (however, normally alkaline earth metals) Ingredients are included). Thus, the glass of the glass substrate is appropriately selected based on the kind of the applied device and the manufacturing process thereof.

Although the thickness of a glass substrate is not specifically limited, From a viewpoint of thickness reduction and / or light weight of a glass substrate, it is preferable that it is normally 0.8 mm or less, More preferably, it is 0.3 mm or less, More preferably, it is 0.15 mm or less. In the case of more than 0.8 mm, the demand for thinning and / or lightening the glass substrate cannot be satisfied. In the case of 0.3 mm or less, it is possible to give favorable flexibility to a glass substrate. In the case of 0.15 mm or less, it is possible to wind up a glass substrate in roll shape. In addition, it is preferable that the thickness of a glass substrate is 0.03 mm or more for the reason that manufacture of a glass substrate is easy, handling of a glass substrate is easy, etc.

In addition, a glass substrate may consist of two or more layers, In this case, the material which forms each layer may be a homogeneous material, or a heterogeneous material may be sufficient as it. In addition, in this case, "thickness of a glass substrate" shall mean the total thickness of all the layers.

In addition, another layer material may be laminated | stacked on one surface of a glass substrate. For example, in order to reinforce the strength of the glass substrate, a resin layer or the like may be laminated, or an inorganic thin film layer such as indium tin oxide or silicon oxide may be laminated.

(remover)

As a releasing agent, a known releasing agent can be used, for example, a silicone-based compound (for example, silicone oil, etc.), a silylating agent (for example, hexamethyldisilazane, etc.), a fluorine-based compound (for example, a fluorine resin, etc.). ), And the like. The releasing agent can be used as an emulsion type, a solvent type or a solventless form. As a suitable example, in terms of peeling force, safety, cost, and the like, a methylsilyl group (≡SiCH ₃ , = Si (CH ₃ ) ₂ , -Si (CH ₃ ) ₃ ) or a fluoroalkyl group (-C _m F _{2 m + 1} ) (m is preferably an integer of 1 to 6). Examples of other suitable examples include silicone-based compounds or fluorine-based compounds, with silicone oil being particularly preferred.

Although the type of silicone oil is not particularly limited, straight silicone oils such as dimethylsilicone oil, methylphenylsilicone oil and methylhydrogensilicone oil, alkyl groups, hydrogen groups, epoxy groups, amino groups, carboxyl groups and polyethers on the side chains or ends of the straightsilicone oils A modified silicone oil which introduce | transduced the group, a halogen group, etc. is illustrated. Specific examples of the straight silicone oil include methylhydrogenpolysiloxane, dimethylpolysiloxane, methylphenylpolysiloxane, diphenylpolysiloxane, and the like. The heat resistance increases in the order of hot air, and the highest heat resistance is diphenyl polysiloxane. These silicone oils are generally used for the water-repellent treatment of the surface of board | substrates, such as a glass substrate and a metal substrate which carried out the primer process.

From a viewpoint of the efficiency of the process which bonds a silicone oil to the to-be-processed surface of a glass substrate, a kinematic viscosity in 25 degreeC is preferable 5000 mm <2> / s or less, and its 500 mm <2> / s or less is more preferable. The lower limit of the kinematic viscosity is not particularly limited, but is preferably 0.5 mm 2 / s or more in consideration of the handling surface and cost.

Of the silicone oils, a straight silicone oil is preferable in terms of good peelability with the resin layer, and dimethyl polysiloxane is particularly preferable in terms of providing high peelability. In addition, methylphenyl polysiloxane or diphenyl polysiloxane is preferable when heat resistance is particularly required.

The kind of the fluorine-based compound is not particularly limited, but perfluoroalkylammonium salt, perfluoroalkylsulfonate amide, perfluoroalkylsulfonate salt (for example, sodium perfluoroalkylsulfonate), perfluoroalkyl potassium salt, purple Luoroalkylcarboxylates, perfluoroalkylethylene oxide adducts, perfluoroalkyltrimethylammonium salts, perfluoroalkylamino sulfonates, perfluoroalkyl phosphate esters, perfluoroalkyl compounds, perfluoroalkylbeta Phosphorus, a perfluoroalkyl halogen compound, etc. are mentioned. Examples of the compounds containing an alkyl group (C _m F _{2m +1)} fluoroalkyl, for example, there may be mentioned a compound having a fluoroalkyl group of exemplary compounds of the fluorine-based compound. The upper limit of m is not particularly limited on the peeling performance, but m is preferably an integer of 1 to 6 from the viewpoint of better safety in handling.

(Process procedure)

As for the processing method of the surface of a glass substrate, the optimal method is selected suitably according to the peeling agent used. Usually, a process is performed by providing a peeling agent to the surface of the 1st main surface of a glass substrate (for example, apply | coating).

For example, when using a silicone oil, the method of apply | coating a silicone oil to the glass substrate surface is mentioned. Especially, after apply | coating silicone oil, it is preferable to perform the process which bonds a silicone oil to the to-be-processed surface of a glass substrate. The process of bonding the silicone oil to the surface to be treated is a process of breaking the molecular chain of the silicone oil, and the cut fragments are bonded to the surface to be treated (hereinafter, this treatment is referred to as low molecular weight of the silicone oil).

The coating method of silicone oil may be a general method. For example, it selects suitably according to the kind, application | coating amount, etc. of silicone oil from the spray coating method, the die coating method, the spin coating method, the dip coating method, the roll coating method, the bar coating method, the screen printing method, the gravure coating method, etc., for example.

As a coating liquid, it is preferable to use the solution which diluted 5 mass% or less of silicone oil with solvents, such as hexane, heptane, xylene, and isoparaffin. If it is more than 5% by mass, the processing time for the lower molecular weight is too long.

The solvent contained in a coating liquid is removed by methods, such as a heating and / or vacuum drying, as needed. You may remove by heating in a low molecular weight process.

The application amount of the silicone oil is preferably 0.1 to 10 µg / cm 2. If it is 0.1 microgram / cm <2> or more, peelability is preferable at the point which is more excellent, and if it is 10 micrograms / cm <2> or less, it is preferable at the point which is more excellent in the coating property of a coating liquid and low molecular-ized treatment processability.

As a method for lowering the molecular weight of silicone oil, a general method is used, for example, there is a method of cleaving the siloxane bond of the silicone oil by photolysis or pyrolysis. Ultraviolet light irradiated from a low pressure mercury lamp, a xenon arc lamp, etc. may be used for photolysis, and ozone generated by ultraviolet irradiation in the atmosphere may be used in combination. Pyrolysis may be performed by a batch, a conveyor furnace, etc., and a plasma, an arc discharge, etc. may be used.

When the siloxane bond of the silicone oil or the bond between the silicon atom and the carbon atom is cleaved, the generated active point reacts with an active group such as a hydroxyl group on the surface to be treated. As a result, the density of hydrophobic functional groups, such as a methyl group, on a to-be-processed surface becomes high, the density of a hydrophilic polar group is reduced, and as a result, peelability is provided to a to-be-processed surface.

Moreover, it is preferable that the surface of the glass substrate which surface-treats is a surface fully clean, and it is preferable that it is a surface immediately after washing | cleaning. As a cleaning method, a general method used for cleaning a glass surface or a resin surface is used.

It is preferable to protect the surface which does not surface-treat previously with protective films, such as a mask.

In addition, when using silylating agents, such as hexamethyldisilazane, it is preferable to make vapor of a silylating agent contact with the glass substrate surface. Moreover, you may make it contact with the vapor of a silylating agent in the state which heated the glass substrate.

The higher the vapor concentration of the silylating agent, that is, the closer to the saturation concentration, is preferable because the treatment time can be shortened.

The contact time of a silylating agent and a glass substrate can be shortened in the range which does not impair the function of a peelable glass substrate.

As surface roughness Ra of the surface which shows the peelability of the peelable glass substrate manufactured by the said procedure, 2.0 nm or less is preferable at the point by which the thickness nonuniformity of the resin layer obtained by the hardening process S108 mentioned later is suppressed more, 1.0 nm The following is more preferable, and 0.5 nm or less is further more preferable. Although a minimum in particular is not restrict | limited, 0 nm is especially preferable.

In addition, measurement of surface roughness Ra is atomic force microscope (made by Pacific Nanotechnology, Nano Scope IIIa; Scan Rate 1.0Hz, Sample Lines256, 0ff-line Modify Flatten order-2, Planefit order-2, etc.). Can be performed based on JI SB O601 (2001).

It is preferable that it is 90 degrees or more, and, as for the water contact angle of the surface which shows the peelability of a peelable glass substrate more easily in the peeling at the interface of a peelable glass substrate and a resin layer, it is more preferable that it is 90-120 degrees. And it is more preferable that it is 90-110 degrees.

In addition, the water contact angle can be measured using a contact angle meter (manufactured by Cross Corporation, DROP SHAPE ANALYSIS SYSTEM DSA 10Mk2, etc.).

[Curable resin composition layer forming step]

Curable resin composition layer formation process S104 is a process of apply | coating curable resin composition on the surface which shows the peelability of the peelable glass substrate obtained by the said surface treatment process S102, and forming an uncured curable resin composition layer. More specifically, as shown in FIG.2 (B), the uncurable curable resin composition layer 12 is formed on the surface 10a which shows the peelability of the peelable glass substrate 10. FIG.

The uncured curable resin composition layer is in contact with the surface exhibiting the peelability of the peelable glass substrate without gaps. Therefore, in hardening process S108 mentioned later, when hardening the said curable resin composition layer, the resin layer to which the flat surface of the peelable glass substrate was transferred can be obtained, and distortion of a peelable glass substrate, etc. are suppressed.

First, the curable resin composition used at this process is explained in full detail, and the procedure of the said process S104 is explained in full detail after that.

(Curable resin composition)

Curable resin composition used by this process S104 is a composition which can form a resin layer (adhesive resin layer) in the hardening process S108 mentioned later.

As curable resin contained in curable resin composition, the cured film should just have adhesiveness which can adhere to an object so that peeling is possible, and well-known curable resin (for example, thermosetting composition, photocurable composition, etc.) can be used. . For example, a curable acrylic resin, a curable urethane resin, a curable silicone and the like can be given. Several types of curable resins can also be mixed and used. Among them, curable silicone is preferable. This is because the silicone resin obtained by curing the curable silicone has excellent heat resistance and peelability. Moreover, when curable silicone is used, it is easy to fix to a glass substrate by condensation reaction with the silanol group of the glass substrate surface mentioned later.

As curable resin composition, curable silicone resin composition (The curable silicone resin composition especially used for release papers is preferable) is preferable. Since the resin layer formed using this curable silicone resin composition adheres to the glass substrate surface, and the free surface has the outstanding peelability, it is preferable.

Although curable silicone which becomes such a release paper silicone resin is classified into condensation reaction type | mold silicone, addition reaction type | mold silicone, ultraviolet curable silicone, and electron beam curable silicone by the hardening mechanism, all can be used. Of these, addition reaction type silicon is preferable. This is because the curing reaction is easy, the degree of peelability is good when the resin layer is formed, and the heat resistance is also high.

An addition reaction type silicone resin composition is a curable composition containing a main body and a crosslinking agent and curing in the presence of a catalyst such as a platinum catalyst. Curing of the addition reaction type silicone resin composition is promoted by heat treatment. The main ingredient in the addition-reaction type silicone resin composition is an organopolysiloxane having an alkenyl group (vinyl group or the like) bonded to a silicon atom (that is, organoalkenylpolysiloxane, preferably linear), and an alkenyl group Etc. become a crosslinking point. It is preferable that the crosslinking agent in an addition reaction type | mold silicone resin composition is organopolysiloxane (that is, organohydrogenpolysiloxane. Furthermore, linear form is preferable) which has a hydrogen atom (hydrosilyl group) couple | bonded with the silicon atom, and a hydrosilyl group Etc. become a crosslinking point.

The addition reaction type silicone resin composition cures when the crosslinking point of the main material and the crosslinking agent undergoes an addition reaction.

Moreover, since the heat resistance derived from a crosslinked structure is more excellent, it is preferable that the molar ratio of the hydrogen atom couple | bonded with the silicon atom of organohydrogenpolysiloxane with respect to the alkenyl group of organoalkenylpolysiloxane is 0.5-2.

Moreover, curable silicone resin composition used in order to form peeling layers, such as a release paper, has a solvent type, an emulsion type, and a non-solvent type in form, and can use any form. Of these, no-solvent formulations are preferred. This is because it is excellent in productivity, safety, and environmental characteristics. Moreover, since it does not contain the solvent which generate | occur | produces foaming at the time of hardening at the time of forming the resin layer mentioned later, ie, heating hardening, ultraviolet curing, or electron beam hardening, it is because a bubble is hard to remain in a resin layer.

Moreover, as curable silicone resin composition used in order to form peeling layers, such as a release paper, KNS-320A, KS-847 (all are Shin-Etsu Silicone Co., Ltd.), TPR6700 (all are commercially available as a brand name or model number). Product made in creative performance materials Japan Kodo Kaisha), vinyl silicone "8500" (product made by Arakawa Chemical Industries) and methylhydrogenpolysiloxane "12031" (product made by Arakawa Chemical Industries, Ltd.), vinyl silicone "11364" Combination of Arakawa Chemical Co., Ltd.) and methylhydrogen polysiloxane "12031" (product of Arakawa Chemical Co., Ltd.), vinyl silicone "11365" (product of Arakawa Chemical Co., Ltd.) and methyl hydrogen polysiloxane "12031" (Arakawa Kagaku Kogyo Co., Ltd.) etc. can be mentioned.

In addition, KNS-320A, KS-847, and TPR6700 are curable silicone resin compositions containing the main body and a crosslinking agent beforehand.

(Process procedure)

The method of apply | coating curable resin composition on the surface which shows the peelability of a peelable glass substrate is not specifically limited, A well-known method can be employ | adopted. For example, as a coating method, the spray coating method, the die coating method, the spin coating method, the dip coating method, the roll coating method, the bar coating method, the screen printing method, the gravure coating method, etc. are mentioned. Among these methods, it can be appropriately selected depending on the kind of the curable resin composition.

Moreover, although the application amount of curable resin composition is not restrict | limited, It is preferable that it is 1-100 g / m <2>, and, as for the suitable thickness of a resin layer, it is more preferable that it is 5-20 g / m <2>.

In addition, when a solvent is contained in curable resin composition, you may volatilize a solvent by heat-processing about the grade which curable resin does not harden as needed.

The thickness of the uncured curable resin composition layer obtained by apply | coating curable resin composition on a peelable glass substrate is not restrict | limited, It adjusts suitably so that the resin layer which has a suitable thickness mentioned later is obtained.

The external dimension of the uncured curable resin composition layer formed is about the same as the external dimension of a peelable glass substrate, or it is smaller than it.

[Lamination process]

Lamination process S106 does not contact a carrier substrate which has an external dimension smaller than the external dimension of an uncurable curable resin composition layer to the uncurable curable resin composition layer obtained by said curable resin composition layer formation process S104 with a carrier substrate. It is a process of laminating | stacking on the unhardened curable resin composition layer so that a peripheral region may remain, and obtaining a laminated body before hardening (laminated body before hardening process is performed). In other words, the carrier substrate is laminated on the uncured curable resin composition layer so that the uncured curable resin composition layer is exposed to the outer circumference of the carrier substrate.

More specifically, as shown to Fig.2 (C), by this process S106, the carrier substrate 14 smaller than the external dimension of the uncurable curable resin composition layer 12 is made into the uncurable curable resin. The laminated body 16 is obtained by laminating on the uncured curable resin composition layer 12 so that the peripheral region 12a which is not in contact with the carrier substrate 14 is formed in the composition layer 12. 3A is a top view of the laminate 16 before curing, and as shown in the figure, the peripheral region 12a of the uncured curable resin composition layer 12 is the carrier substrate 14. Not in contact with

Usually, a convex part tends to generate | occur | produce on the exposed surface of the uncured curable resin composition layer 12 near a peripheral part by influence of the surface tension (refer FIG. 3 (B)). When the carrier substrate 14 is in contact with such a convex portion when the carrier substrate 14 is laminated, voids 32 and the like may occur between the carrier substrate 14 and the uncured curable resin composition layer 12, and as a result, the carrier substrate ( The area | region which 14) and the uncured curable resin composition layer 12 do not contact may arise (FIG. 3C). If there exists such an area, the adhesiveness with respect to the carrier substrate 14 of the resin layer obtained by hardening process S108 may fall. Moreover, the thickness nonuniformity of a resin layer may generate | occur | produce, and it may become a cause which surface unevenness generate | occur | produces on the exposed surface of the carrier substrate provided with the resin layer. In addition, foreign matter may enter the void 32 to become a pollution source that contaminates the electronic device member, which may cause a decrease in the yield of the electronic device.

Therefore, by using the carrier substrate 14 which has an external dimension smaller than the external dimension of the uncurable curable resin composition layer 12, the carrier substrate 14 is not hardened without contacting the said convex part, and the uncurable curable resin composition Contact with layer 12. As a result, generation | occurrence | production of the area | region which the carrier substrate 14 and the uncured curable resin composition layer 12 do not contact is suppressed more, adhesiveness with respect to the carrier substrate 14 of a resin layer is more excellent, and a resin layer The occurrence of thickness nonuniformity of is further suppressed.

First, the carrier substrate used at this process is explained in full detail, and the procedure of the said process S106 is explained in full detail after that.

(Carrier board)

A carrier substrate is a board | substrate which prevents deformation | transformation, a flaw generation, damage, etc. of a peelable glass substrate at the time of manufacture of an electronic device member in member formation process S112 (process of manufacturing a member for electronic device) mentioned later.

As a carrier substrate, metal plates, such as a glass plate, a plastic plate, and an SUS board, etc. are used, for example. When member formation process S112 carries out heat processing, it is preferable that a carrier substrate is formed with the material with a small difference of the linear expansion coefficient with a peelable glass substrate, It is more preferable that it is formed with the same material as a peelable glass substrate, It is preferable that a board | substrate is a glass plate. It is preferable that especially a carrier substrate is a glass plate which consists of the same glass material as a peelable glass substrate.

The thickness of a carrier substrate may be thicker than a peelable glass substrate, and may be thin. Preferably, the thickness of a carrier substrate is selected based on the thickness of a peelable glass substrate, the thickness of a resin layer, and the thickness of the laminated body after cutting mentioned later. For example, the current member forming process is a member forming process (for example, the current case of operating as a carrier substrate single plate without laminating a carrier substrate) having a thickness of 0.5 mm. Development, inspection, etc.), and when the sum of the thickness of the peelable glass substrate and the thickness of the resin layer is 0.1 mm, the thickness of the carrier substrate is 0.4 mm. In general, the thickness of the carrier substrate is preferably 0.2 to 5.0 mm.

In the case where the carrier substrate is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for reasons such as being easy to handle and difficult to break. Moreover, when peeling after formation of an electronic device member, the thickness of a glass plate is 1.0 mm or less, for the reason that the rigidity which bends suitably without breaking is desired.

The difference between the average linear expansion coefficient (hereinafter referred to simply as the "average linear expansion coefficient") at 25 to 300 ° C of the peelable glass substrate and the carrier substrate is preferably 500 × 10 ^-7 / ° C or less, and more preferably It is 300x10 <^-7> / degrees C or less, More preferably, it is 200x10 <^-7> / degrees C or less. If the difference is too large, there is a fear that the laminate violently during heating and cooling in the member forming step S112. When the material of a peelable glass substrate and the material of a carrier substrate are the same, generation of such a problem can be suppressed.

(Process procedure)

The method of laminating | stacking a carrier substrate on an uncured curable resin composition layer is not specifically limited, A well-known method can be employ | adopted.

For example, the method of laminating | stacking a carrier substrate on the surface of an unhardened curable resin composition layer in an atmospheric pressure environment is mentioned. In addition, if necessary, the carrier substrate may be pressed onto the uncured curable resin composition layer using a roll or a press after the carrier substrate is laminated on the surface of the uncured curable resin composition layer. Since the bubble mixed in between the uncured curable resin composition layer and the layer of a carrier substrate is removed comparatively easily by the crimping | rolling by a roll or a press, it is preferable.

The vacuum lamination method or the vacuum press method is preferable because it suppresses mixing of bubbles and secures good adhesion. By pressing under vacuum, even when a minute bubble remains, the bubble does not grow by heating, and there is also an advantage that it is difficult to be connected to distortion defects of the carrier substrate.

When laminating | stacking a carrier substrate, it is preferable to fully wash | clean the surface of the carrier substrate which contact | connects an uncured curable resin composition layer, and to laminate | stack in an environment with high cleanness. The higher the cleanliness, the better the flatness of the carrier substrate is.

The layer of a peelable glass substrate, the uncured curable resin composition layer, and the layer of a carrier substrate are contained in this order in the laminated body before hardening obtained by the said process.

In the said aspect, the external dimension of an uncured curable resin composition layer is larger than the external dimension of a carrier substrate. It is preferable that ratio (area A / total area B) of the area A of the area | region A in contact with the carrier substrate of an uncured curable resin composition layer, and the total area B of an uncured curable resin composition layer is 0.98 or less, and it is 0.95 or less More preferred. If it is in the said range, generation | occurrence | production of the thickness nonuniformity of a resin layer will be suppressed more. Although a minimum in particular is not restrict | limited, From a viewpoint of productivity etc., it is preferable that it is 0.75 or more, and it is more preferable that it is 0.80 or more.

Moreover, 10 mm or more is preferable and, as for the length from the outer periphery of a carrier substrate to the outer periphery of an uncured curable resin composition layer, 15 mm or more is more preferable. If it is in the said range, generation | occurrence | production of the thickness nonuniformity of a resin layer will be suppressed more. Although an upper limit in particular is not restrict | limited, 100 mm or less is preferable from a viewpoint of productivity.

[Curing Process]

The hardening process S108 hardens the uncured resin composition layer in the laminated body before hardening by hardening | curing the pre-cured laminated body obtained by the said lamination process S106, and the hardened | cured laminated body (hardening process) which has a resin layer To a laminated body). More specifically, as shown in FIG. 2 (D), by performing the above process, the uncured curable resin composition layer 12 is cured to obtain a resin layer 18, and a peelable glass substrate ( The laminated body 20 after hardening which has the layer of 10), the resin layer 18, and the layer of the carrier substrate 14 in this order is obtained.

Below, the procedure of the process performed by this process is explained in full detail, and the structure of the laminated body obtained after that is demonstrated in detail.

(Process procedure)

Although the optimal method is selected suitably according to the kind of curable resin used for the hardening process performed by this process, heat processing or an exposure process is normally performed.

When curable resin contained in curable resin composition layer is thermosetting, the said layer can be hardened by heat-processing about the uncured curable resin composition layer. The conditions of heat processing are suitably selected suitably according to the kind of thermosetting resin used. Especially, heat processing is performed for 10 to 120 minutes (preferably 30 to 60 minutes) at 150-300 degreeC (preferably 180-250 degreeC) from a viewpoint of the hardening rate of curable resin, the heat resistance of the resin layer formed, etc. It is preferable to carry out.

When curable resin contained in curable resin composition layer is photocurable resin, the said layer can be hardened by performing exposure process with respect to the uncured curable resin composition layer. The kind of light irradiated in the exposure process is appropriately selected depending on the type of the photocurable resin, and examples thereof include ultraviolet light, visible light, and infrared light. Moreover, as for irradiation time at the time of an exposure process, 0.1-10 minutes (preferably 0.5 to 5 minutes) are preferable from a viewpoint of the hardening speed of curable resin, the light resistance of the resin layer formed, etc.

(Resin layer)

Next, the resin layer in the laminated body after hardening is demonstrated in detail.

Although the thickness of a resin layer is not specifically limited, It is preferable that it is 1-100 micrometers, It is more preferable that it is 5-30 micrometers, It is further more preferable that it is 7-20 micrometers. It is because the adhesiveness of a resin layer and a carrier substrate becomes enough that the thickness of a resin layer is such a range. Moreover, even if foam | bubble and a foreign material may interpose between a resin layer and a carrier substrate, it is because generation | occurrence | production of the distortion defect of a peelable glass substrate can be suppressed. In addition, when the thickness of the resin layer is too thick, it is not economical because it requires time and materials to form.

In addition, the resin layer may consist of two or more layers. In this case, "thickness of the resin layer" shall mean the thickness of the sum total of all layers.

In addition, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

It is preferable that a resin layer consists of a material in which a glass transition point is lower than room temperature (about 25 degreeC), or does not have a glass transition point. It is because peeling with a peelable glass substrate can be carried out more easily, and also adhesiveness with a peelable glass substrate becomes sufficient at the same time.

The kind of resin which forms a resin layer is not specifically limited, It changes with kinds of resin contained in curable resin composition mentioned above. For example, acrylic resin, polyolefin resin, polyurethane resin or silicone resin can be mentioned. Among them, a silicone resin is preferable as described above.

In addition, the resin layer may contain the non-curable organopolysiloxane as needed, and its content is specifically 5 mass% or less (0-5 mass%), Preferably 0.01-1 mass% is mentioned. Can be. When a nonhardening organopolysiloxane is contained in a resin layer, peeling at the interface of the peelable glass substrate and resin layer in separation process S114 mentioned later advances more efficiently.

The method of including the said non-curable organopolysiloxane in a resin layer is not specifically limited, The method of adding in curable resin composition mentioned above is mentioned.

Examples of the noncurable organopolysiloxane include a silicone oil not containing a Si-H bond, specifically, a polydimethylsiloxane-based or polymethylphenylsiloxane-based silicone oil.

(Cured laminate)

The laminated body after hardening obtained by the said hardening process has the layer of a peelable glass substrate, the resin layer, and the layer of a carrier substrate in this order.

In the obtained laminated body after hardening, the resin layer is fixed (adhesive) on the carrier substrate and is in close contact with the peelable glass substrate so that peeling is possible. In the separation process S114 mentioned later, a resin layer prevents position shift of a peelable glass substrate until the operation which isolate | separates a peelable glass substrate and a carrier substrate provided with a resin layer is performed.

The surface which contacts the resin layer of a peelable glass substrate is closely_contact | adhered to the surface of a resin layer so that exfoliation is possible. In this invention, the property which can peel easily of this peelable glass substrate is called peelability.

In the present invention, the fixation (peelable) adhesion has a difference in peel strength (i.e., the stress required for peeling), and the fixation means that the peel strength is higher than that of adhesion. Specifically, the peeling strength of the interface between the resin layer in the laminate after curing and the layer of the carrier substrate is greater than the peeling strength of the interface between the layer of the peelable glass substrate and the resin layer.

In addition, peelable adhesiveness also means that peelable and peelable are possible without generating peeling of the fixed surface. Specifically, in the laminated body after curing, when an operation of separating the peelable glass substrate and the carrier substrate is performed, it means that the adhesive is peeled off from the adhered surface and not peeled off from the fixed surface. Therefore, when the operation | movement which isolate | separates a laminated body after hardening into a peelable glass substrate and a carrier substrate is carried out, the laminated body after hardening will be isolate | separated into two of a carrier substrate provided with a peelable glass substrate and a resin layer.

As mentioned above, in the state which react-hardens in the state which contacted the uncurable curable resin composition layer to the carrier substrate surface, the formed resin layer adhere | attaches strongly to the carrier substrate surface. On the other hand, although the uncured curable resin composition layer is reacted and cured in contact with the peelable glass substrate, the formed resin layer is formed on the peelable glass substrate for ease of peeling (non-adhesion) on the surface of the peelable glass substrate. And a weak bonding force such as a bonding force due to van de Waals force between solid molecules.

[Cutting step]

Cutting process S110 is a process of cut | disconnecting a resin layer and a peelable glass substrate along the outer periphery of the carrier substrate in the laminated body after hardening obtained in the said hardening process S108. In other words, it is a process of cutting the outer periphery of each of the resin layer and peelable glass substrate in a laminated body after hardening, and aligning the perimeter of the outer periphery of each of a carrier substrate, a resin layer, and a peelable glass substrate. More specifically, as shown to FIG. 2E, the resin layer 18 and the peelable glass substrate 10 are cut | disconnected along the outer periphery of the carrier substrate 14 by this process, After cutting, the laminate 22 (the laminate subjected to the cutting treatment) is obtained.

Hereinafter, the procedure of this process S110 is explained in full detail.

The method of cutting a resin layer and a peelable glass substrate is not specifically limited, A well-known method can be employ | adopted. For example, the cutting method explained based on FIGS. 4-6 is preferable from a viewpoint of handleability.

FIG. 4 is a plan view partially showing a laminated body after curing stacked on a stage, and FIG. 5 is a cross-sectional view showing a partial fracture of the laminated body and a processing head after curing stacked on a stage, and FIG. 6 is stacked on another stage. It is sectional drawing which shows a laminated body and a fitting support jig after one hardening.

As shown in FIG. 4, in the laminated body 20 after curing, the main surface of the carrier substrate 14 is supported by the stage 50, and the outer periphery of the carrier substrate is formed on the stage 50. Contact blocks 51-53.

In FIG. 4, while the exposed surface of the carrier substrate 14 is supported by the top surface of the stage 50, the two sides 14a and 14b perpendicular to each other of the rectangular carrier substrate 14 are positioned in the positioning block ( 51 to 53). Thereafter, the moving blocks 54 and 55 approach and contact the remaining sides 14c and 14d of the carrier substrate 14.

As shown in FIG. 4, when the outer periphery of the carrier substrate 14 contacts the positioning blocks 51 to 53, the outer periphery of the carrier substrate 14 and the alignment accuracy of the stage 50 are improved. Therefore, the outer periphery of the carrier substrate 14 and the outer periphery of the resin layer 18 and the peelable glass substrate 10 are aligned with high precision.

Moreover, the inside of the suction hole formed in multiple numbers on the upper surface of the stage 50 is decompressed by a vacuum pump, etc., and the carrier substrate 14 is adsorbed on the upper surface of the stage 50. A resin film or the like may be formed on the upper surface of the stage 50 to protect the carrier substrate 14.

Next, the imaging device picks up the laminated body 20 after hardening on the stage 50. The captured image is transmitted to a computer. The computer image-processes the received image, and detects the positional relationship of the outer periphery of the carrier substrate 14 and the stage 50.

Subsequently, the computer moves the processing head 60 which processes the laminated body 20 after hardening with respect to the stage 50 based on the result of image processing. The movement trajectory of the processing head 60 is controlled to overlap the outer periphery of the carrier substrate 14 in plan view (see FIG. 5).

In the present embodiment, the computer uses the result of the image processing to control the movement trajectory of the processing head, but instead the information on the shape dimensions of the carrier substrate which is recorded in advance in a recording medium such as a hard disk or the like is used. You may use it. In that case, the imaging device becomes unnecessary.

The processing head 60 shown in FIG. 5 is comprised according to the kind, thickness, etc. of the peelable glass substrate 10. FIG. For example, the processing head 60 forms the cutting line 66 on the surface of the peelable glass substrate 10, and is comprised by the cutter 62 etc.

The cutter 62 is, for example, in the shape of a disk, and its outer circumference is formed of diamond, superalloy, or the like, and the holder 64 is rotatably supported. When the holder 64 is relatively moved in the in-plane direction of the peelable glass substrate 10 while the outer circumferential portion of the cutter 62 is pressed against the surface of the peelable glass substrate 10, the cutter 62 rotates. Cut lines 66 are formed on the surface of the peelable glass substrate 10.

Four cutting lines 66 are formed corresponding to four sides 14a, 14b, 14c, and 14d of the rectangular carrier substrate 14, and the carrier substrate 14 overlaps with the corresponding sides in plan view, respectively. Is formed. Each cutting line 66 extends from one side to the other side of the peelable glass substrate 10 so as to segment the surface of the peelable glass substrate 10.

In addition, although the processing head 60 of this embodiment shown in FIG. 5 is comprised by the cutter 62 etc., the tip scriber may be a point scriber in which the tip is formed in the shape of diamond, and cuts off by sliding, It may be comprised with a laser light source. The laser light source irradiates the spot light to the surface of the peelable glass substrate 10. Spot light is scanned on the surface of the peelable glass substrate 10, and forms the cutting line 66 by thermal stress.

After the cutting line 66 is formed by the processing head 60, the vacuum pump is stopped, the suction hole is opened to the atmosphere, and suction is released. Subsequently, while the moving blocks 54 and 55 are spaced apart from the carrier substrate 14, the carrier substrate 14 is spaced apart from the positioning blocks 51 to 53. Thereafter, the laminated body 20 after curing is lifted above the stage 50 and transferred above the other stage 70. Subsequently, the laminated body 20 after hardening goes down and is mounted in the stage 70 (refer FIG. 6).

Next, as shown in FIG. 6, the inside of the suction hole formed in multiple numbers on the upper surface of the stage 70 is decompressed by a vacuum pump, etc., and the carrier substrate 14 is adsorb | sucked on the upper surface of the stage 70. FIG. In this state, one cutting line 66 is pushed out of the stage 70.

Subsequently, the part outside the one cutting line 66 is clamped by the fitting support jig 72 in the plate | board thickness direction. In this state, when the clamping jig 72 is rotated in the downward direction, bending stress is applied to the peelable glass substrate 10 and the resin layer 18, so that the sheet thickness is set based on one cut line 66. The crack 68 is extended in the direction, and the peelable glass substrate 10 and the resin layer 18 are cut | disconnected at once (refer FIG. 6).

Subsequently, the adsorption | suction of the carrier substrate 14 on the stage 50 is canceled | released, and the laminated body 20 after hardening is adsorb | sucked again after parallel movement or 90 degree rotational movement. Then, the peelable glass substrate 10 and the resin layer 18 are cut along another cut line 66. This is repeated, and the peelable glass substrate 10 and the resin layer 18 are cut along the four cutting lines 66.

In addition, in this embodiment, in order to perform cutting, although the laminated body after hardening was made to be conveyed from the stage 50 to another stage 70, after cutting in parallel or 90 degree rotation on the same stage 50, This may be done. In addition, you may perform a chamfering process to a cut part as needed.

[Member forming process]

Member formation process S112 is a process of forming the member for electronic devices on the 2nd main surface of the peelable glass substrate in the after-cut | disconnection laminated body obtained by the said cutting process S110, and obtaining the laminated body provided with the member for electronic devices.

More specifically, as shown to FIG. 2F, the electronic device member 24 is formed on the 2nd main surface 10b of the peelable glass substrate 10, and is equipped with the electronic device member. The laminated body 26 is obtained.

First, the electronic device member used in this step will be described in detail and the procedure of the subsequent step will be described in detail.

(Member for electronic device (functional element))

The member for electronic devices is a member formed on the 2nd main surface of the peelable glass substrate in a laminated body after cutting | disconnection, and comprises at least one part of an electronic device. More specifically, as an electronic device member, the member used for electronic components, such as a display panel, a solar cell, a thin film secondary battery, or a semiconductor wafer with a circuit formed in the surface, is mentioned. The panel for a display device includes an organic EL panel, a plasma display panel, a field emission panel and the like.

For example, as a solar cell member, in a silicon type | mold, a transparent electrode, such as a tin oxide of a positive electrode, the silicon layer represented by p layer / i layer / n layer, the metal of a negative electrode, etc. are mentioned, In addition, a compound type and a pigment | dye Various members corresponding to a sensitization type, a quantum dot type, etc. are mentioned.

Moreover, as a member for thin-film secondary batteries, in lithium ion type, transparent electrodes, such as a metal or metal oxide of a positive electrode and a negative electrode, the lithium compound of an electrolyte layer, the metal of a current collector layer, resin as a sealing layer, etc. are mentioned. And various members corresponding to nickel hydrogen type, polymer type, ceramic electrolyte type and the like.

As the electronic component member, in the CCD or CMOS, a metal of a conductive portion, silicon oxide or silicon nitride of an insulating portion, and the like, and various sensors such as a pressure sensor and an acceleration sensor, a rigid printed substrate, a flexible printed substrate, Various members corresponding to a printed board and the like.

(Process procedure)

The manufacturing method of the laminated body provided with the member for electronic devices mentioned above is not specifically limited, The 2nd main surface of the peelable glass substrate of a laminated body after cutting | disconnection by a conventionally well-known method according to the kind of structural member of an electronic device member. On the surface, a member for an electronic device is formed.

In addition, the member for electronic devices is not part of the member finally formed in the 2nd main surface of a peelable glass substrate (henceforth a "whole member"), but a part of all members (henceforth a "part member"). ) May be used. The peelable glass substrate provided with the partial member peeled from the resin layer can also be made into the peelable glass substrate (corresponding to the electronic device mentioned later) provided with the whole member in a subsequent process.

Moreover, the laminated body provided with the whole member is assembled, and after that, the carrier substrate provided with the resin layer is peeled from the laminated body provided with the whole member, and an electronic device can also be manufactured. In addition, the electronic device is assembled using two laminates with all members, and then the carrier substrate with two resin layers is peeled from the laminate with all members to manufacture the electronic devices. It may be.

For example, in the case of manufacturing OLED, for example, an organic EL structure is formed on the surface on the side opposite to the resin layer side of the peelable glass substrate of the laminate after cutting (corresponding to the second main surface of the peelable glass substrate). To this end, a transparent electrode is formed, and a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like are deposited on the surface on which the transparent electrode is formed, and a back electrode is formed and sealed using a sealing plate. Layer formation and processing are performed. Specific examples of such layer formation and treatment include film forming treatment, vapor deposition treatment, adhesion treatment of a sealing plate, and the like.

In addition, for example, in the manufacturing method of TFT-LCD, the metal film formed by general film-forming methods, such as CVD method and sputtering method, using a resist liquid on the 2nd main surface of the peelable glass substrate of a laminated body after cutting | disconnection. And a TFT forming step of forming a thin film transistor (TFT) by patterning a metal oxide film or the like, and using the resist liquid on the second main surface 1 of the glass substrate of the laminated body after other cutting for pattern formation using the color filter CF. Various processes such as a CF forming step to be formed, a lamination step including a TFT obtained in the TFT forming step, and a laminate including a CF obtained in the CF forming step, and a lamination step for laminating the TFT and CF so as to face each other through a seal. Have

In a TFT formation process and a CF formation process, TFT and CF are formed in the 2nd main surface of a peelable glass substrate using well-known photolithography technique, an etching technique, etc. At this time, a resist liquid is used as the coating liquid for pattern formation.

In addition, before forming TFT and CF, you may wash the 2nd main surface of a peelable glass substrate as needed. As a washing | cleaning method, well-known dry washing and wet washing can be used.

In the bonding step, for example, a liquid crystal material is injected and laminated between the laminate with TFT and the laminate with CF. As a method of inject | pouring a liquid crystal material, there exists a vacuum injection method and the dropping injection method, for example.

Separation Process

Separation process S114 is provided with the resin layer which has a resin layer and a carrier substrate from the laminated body provided with the member for electronic devices obtained by the said member formation process S112, using the interface of a peelable glass substrate and a resin layer as a peeling surface. It is a process of removing a carrier substrate and obtaining the electronic device which has a peelable glass substrate and a member for electronic devices. More specifically, as shown in FIG. 2G, the carrier substrate 28 having the resin layer is separated and separated from the laminate 26 provided with the electronic device member by the step S114. It removes and the electronic device 30 containing the peelable glass substrate 10 and the electronic device member 24 is obtained.

When it is a part of formation of the whole structural member which requires the member for electronic devices on the peelable glass substrate at the time of peeling, you may form the remaining structural member on a peelable glass substrate after separation.

The method of peeling a peelable glass substrate and a resin layer is not specifically limited. Specifically, for example, a sharp blade-like thing is inserted into the interface between the peelable glass substrate and the resin layer, and after giving an opportunity for peeling, the mixed fluid of water and compressed air can be sprayed or peeled off. Preferably, the carrier substrate in the laminate including the electronic device member is placed on the surface plate so that the upper side and the electronic device member are on the lower side, and the electronic device member side is vacuum-adsorbed on the surface plate. A blade penetrates into the interface of a peelable glass substrate and a resin layer. Then, the carrier substrate side is adsorbed by a plurality of vacuum adsorption pads, and the vacuum adsorption pads are raised in order from the vicinity of the point where the blade is inserted. Then, an air layer is formed in the interface of a peelable glass substrate and a resin layer, the air layer spreads over the whole surface of an interface, and a carrier substrate provided with a resin layer can be peeled easily.

Moreover, when removing the carrier substrate with a resin layer from the laminated body provided with the member for electronic devices, the static electricity which may affect an electronic device can be suppressed by controlling spraying and humidity by an ionizer. have. Alternatively, a circuit for consuming static electricity in the electronic device may be incorporated, or a conductive circuit may be incorporated to the outside of the laminate from the terminal portion.

The electronic device obtained by the said process is suitable for manufacture of the small display apparatus used for mobile terminals, such as a mobile telephone and a PDA. The display device is mainly an LCD or an OLED, and the LCD includes TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type and the like. Basically, it can be applied to any display device of passive driving type and active driving type.

[Second Embodiment]

7 is a flowchart showing a manufacturing process in another embodiment of the manufacturing method of the electronic device of the present invention. As shown in FIG. 7, the manufacturing method of an electronic device is surface treatment process S102, curable resin composition layer formation process S104, lamination process S106, defoaming process S116, hardening process S108, cutting process S110, member formation process S112, and separation | separation. Step S114 is provided.

Each step shown in FIG. 7 is the same procedure as the step shown in FIG. 1 except that the defoaming step S116 is provided. The same steps are denoted by the same reference numerals, and the description thereof is omitted. The defoaming step S116 will be described.

[Degreasing Process]

Defoaming process S116 is a process of degassing the uncured curable resin composition layer after lamination process S106 and before hardening process S108. By providing the said process S116, the bubble and the easily volatile component are removed from the uncured curable resin composition layer, and the adhesiveness of the resin layer obtained and a carrier substrate is strengthened more.

Although the optimal method is appropriately selected according to the material of the uncured curable resin composition layer used for the degassing process, for example, vacuum degassing using a vacuum pump, centrifugal defoaming using centrifugal force, and ultrasonic degassing apparatus are used. Ultrasonic defoaming etc. are mentioned. From the viewpoint of productivity and the like, vacuum degassing is preferably carried out under reduced pressure, and as the condition, it is preferable to perform the defoaming treatment at about 1000 Pa or less (preferably 100 Pa or less) for about 1 to 30 minutes.

<Examples>

Hereinafter, the present invention will be described in detail by way of examples and the like, but the present invention is not limited by these examples.

In the following Examples 1 and 4 to 6 and Comparative Examples 1 to 2, glass plates made of alkali-free borosilicate glass (length 760 mm, width 640 mm, sheet thickness 0.3 mm, linear expansion coefficient 38 ×) as glass substrates for peelable glass substrates. ^10-7 / ° C, brand name "AN100" manufactured by Asahi Glass Co., Ltd.) was used. In addition, as a carrier board | substrate, the glass plate (length 720mm, width 600mm, plate thickness 0.7mm, linear expansion coefficient 38x10 <^-7> / degreeC), brand name "AN100" by Asahi Glass Co., Ltd. made of alkali-free borosilicate glass was used similarly.

(Example 1)

The glass substrate used as a peelable glass substrate was wash | cleaned pure water, UV wash, and the surface was cleaned. Then, after masking on the 2nd main surface which is the single side | surface of a glass substrate, the heptane solution of 1 mass% of silicone oil content was spray-coated and dried on the 1st main surface on the opposite side. Dimethyl polysiloxane (made by Toray Dow Corning, SH200, kinematic viscosity 190-210 mm <2> / s) was used for silicone oil. Subsequently, for the low molecular weight of silicone oil, the heat processing at 350 degreeC was performed for 5 minutes, and the peelable glass substrate was obtained.

Then, it was 100 degrees when the water contact angle of the 1st main surface of a peelable glass substrate was measured using the contact angle meter (Drop SHAPE ANALYSIS SYSTEM DSA 10Mk2 by the cross company).

In addition, the first of the peelable glass substrates using an atomic force microscope (manufactured by Pacific Nanotechnology, Nano Scope IIIa; Scan Rate 1.0 Hz, Sample Lines 256, 0ff-line Modify Flatten order-2, Planefit order-2) It was 0.5 nm when the average surface roughness Ra of the principal surface was measured. Average surface roughness Ra was computed from the measured value of the rectangle whose length of one side of a measuring range is 10 micrometers.

Subsequently, on the 1st main surface of a peelable glass substrate, the linear organo alkenyl polysiloxane (vinyl silicone, Arakawa Chemical Co., Ltd., 8500) which has a vinyl group at both ends, and methylhydrogen which has a hydrosilyl group in a molecule | numerator A mixture of polysiloxane (Arakawa Chemical Co., Ltd., 12031) and platinum catalyst (Arakawa Chemical Co., Ltd., CAT12070) is applied by a screen printing machine in a rectangular shape of 750 mm long and 630 mm wide. A layer containing uncured curable silicone was formed on a peelable glass substrate (coating amount of 35 g / m 2). Here, the mixing ratio of linear organoalkenylpolysiloxane and methylhydrogenpolysiloxane was adjusted so that the molar ratio of vinyl group and hydrosilyl group might be 1: 1. In addition, the platinum catalyst was 5 mass parts with respect to a total of 100 mass parts of linear organo alkenyl polysiloxane and methylhydrogen polysiloxane.

Subsequently, the surface (1st main surface) of the side which contacts the silicone resin of the carrier substrate of 0.4 mm of plate | board thicknesses was wash | cleaned purely, and it cleaned by UV washing after that. Thereafter, the first main surface of the carrier substrate and the layer containing uncured curable silicone are bonded to each other by vacuum press at room temperature, and left to stand at 30 Pa for 5 minutes, and a defoaming treatment of the layer containing uncured curable silicone is performed. Was performed to obtain laminate A0 before curing. At that time, the carrier substrate was laminated on the layer containing the uncured curable silicone so that the peripheral region not contacting the carrier substrate remained in the layer containing the uncured curable silicone. In addition, the length from the outer periphery of the carrier substrate to the outer periphery of the uncured curable resin composition layer was about 15 mm or more. In addition, the ratio (area A / total area B) of the area A of the area | region A in contact with the carrier substrate of the uncured curable resin composition layer and the total area B of the uncured curable resin composition layer was 0.91.

Subsequently, this was heat-cured at 250 degreeC for 30 minutes in air | atmosphere, and the post-curing laminated body A1 containing the hardened silicone resin layer of thickness 10micrometer was obtained.

Subsequently, the carrier substrate of the laminated body A1 after hardening is fixed on the surface plate in which the positioning jig was provided, and the diamond on the 2nd main surface of a peelable glass substrate so that it may overlap with one side of the outer periphery of a carrier substrate from the upper surface of a surface plate. After carving a cut line with a wheel cutter, the outer side of the cut line of a peelable glass substrate was inserted and cut | disconnected by the fitting support jig. Similarly, after cutting also about the outer side of the peelable glass which overlaps with the remaining three sides of the outer periphery of a carrier substrate, the cut edge of a peelable glass substrate is polished and chamfered by the grindstone which has a curved surface, and laminated body A2 after cutting Got.

Subsequently, after making the surface (2nd main surface) opposite to the contact surface with the silicone resin of the peelable glass substrate in laminated body A2 after cutting to vacuum in a surface plate, 1 of the four corner parts of a peelable glass substrate A stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the peelable glass substrate and the silicone resin layer at the corner portion, and an occasion for peeling was applied to the interface between the peelable glass substrate and the silicone resin layer. Then, the surface of the carrier substrate was adsorbed by 24 vacuum adsorption pads, and then raised from the adsorption pad close to the corner portion where the blade was inserted. Here, the blade was inserted while spraying the antistatic fluid on the interface from the ionizer (manufactured by Giens). Subsequently, the vacuum adsorption pad was pulled toward the formed void while continuously spraying the antistatic fluid from the ionizer. As a result, the carrier substrate (carrier substrate with resin layer) in which the silicone resin layer was formed in the 1st main surface on the surface plate could be peeled. At this time, adhesion | attachment of a silicone resin was not visually seen on the surface (1st main surface) which was in close contact with the silicone resin layer of a peelable glass substrate. Moreover, it was confirmed from the said result that peeling strength of the interface of a layer of a resin layer and a carrier substrate is larger than peeling strength of the interface of a layer of a peelable glass substrate, and a resin layer.

(Example 2)

As a carrier substrate and a glass substrate, the laminated body B2 after cutting was obtained by the method similar to Example 1 except having used the glass plate which consists of soda-lime glass. In addition, the magnitude | size of the carrier substrate and glass substrate which were used were the same as the magnitude | size of the carrier substrate and glass substrate which were used in Example 1.

Next, by the method similar to Example 1, the carrier substrate provided with the resin layer was peeled from the laminated body B2 after cutting, and the soda-lime glass substrate B3 (peelable glass substrate) was obtained. At this time, adhesion | attachment of a silicone resin was not visually seen on the surface (first main surface) which was in close contact with the silicone resin layer of soda-lime glass substrate B3.

(Example 3)

As a carrier substrate and a glass substrate, the laminated body C2 after cutting was obtained by the method similar to Example 1 except having used the glass plate which consists of chemically strengthened glass plate. In addition, the magnitude | size of the carrier substrate and glass substrate which were used were the same as the magnitude | size of the carrier substrate and glass substrate which were used in Example 1.

Subsequently, by the method similar to Example 1, the carrier substrate provided with the resin layer was peeled from the laminated body C2 after cutting | disconnection, and chemically strengthened glass substrate C3 (peelable glass substrate) was obtained. At this time, adhesion of silicone resin was not visually seen on the surface (first main surface) which was in close contact with the silicone resin layer of glass substrate C3.

(Example 4)

The magnetron sputtering method (heating temperature of 300 ° C., film forming pressure of 5 mTorr, power) is cleaned on the first main surface of the glass substrate, that is, on the side of the side in contact with the silicone resin, followed by pure cleaning by UV cleaning, followed by cleaning. A density of 0.5 W / cm 2) to form a thin film of indium tin oxide having a thickness of 10 nm (sheet resistance 300 Ω / square), and then spray coating a heptane solution having a silicon oil content of 1 mass% on the thin film of indium tin oxide. The laminated body D2 was cut after cutting by the method similar to Example 1 except having dried.

Next, by the method similar to Example 1, the carrier substrate provided with the resin layer was peeled from the laminated body D2 after cutting | disconnection, and the glass substrate D3 (peelable glass substrate) in which the thin film layer of indium tin oxide was formed in the 1st main surface was removed. Got it. At this time, adhesion of silicone resin was not visually seen on the surface (first main surface) which was in close contact with the silicone resin layer of glass substrate D3.

(Example 5)

In this example, OLED was produced using the laminated body A2 after cutting obtained in Example 1.

More specifically, molybdenum was formed into a film by sputtering method on the 2nd main surface of the peelable glass substrate in laminated body A2 after cutting, and the gate electrode was formed by the etching using the photolithographic method. Subsequently, a film is formed on the second main surface side of the peelable glass substrate on which the gate electrode is formed by the plasma CVD method, in the order of silicon nitride, intrinsic amorphous silicon, and n-type amorphous silicon, and then molybdenum is formed by sputtering. It formed into a film and the gate insulating film, the semiconductor element part, and the source / drain electrode were formed by the etching using the photolithographic method. Subsequently, after forming a passivation layer by forming a silicon nitride film further on the 2nd main surface side of a peelable glass substrate by plasma CVD method, indium tin oxide is formed into a film by sputtering method, and it is used for the etching using the photolithographic method. Thus, pixel electrodes were formed.

Subsequently, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine as a hole injection layer and a bis [(N-) as a hole transport layer by the vapor deposition method further on the 2nd main surface side of a peelable glass substrate. Naphthyl) -N-phenyl] benzidine, 2,6-bis [4- [N- (4-methoxyphenyl) -N-phenyl] aminostyryl to 8-quinolinol aluminum complex (Alq ₃ ) as light emitting layer ] naphthalene-1,5-dicarbonyl nitrile (BSN-BCN) to 40% by volume to the mixture, and depositing the Alq ₃ as the electron transporting layer in this order. then, the second sputtering on the main surface side of the glass substrate, releasability Aluminum was formed into a film, and the counter electrode was formed by the etching using the photolithographic method Next, one more glass substrate was carried out on the 2nd main surface of the peelable glass substrate on which the counter electrode was formed via the ultraviolet curable adhesive layer. It bonded and sealed.The organic EL structure was provided on the peelable glass substrate obtained by the said procedure. After cutting the layered product A2 corresponds to (a laminate comprising a member for an electronic device), a display panel (Panel A2) provided for the carrier substrate.

Subsequently, after vacuum-adsorbing the sealing body side of panel A2 to a surface plate, a 0.1 mm-thick stainless steel blade is inserted in the interface of the peelable glass substrate of the corner part of panel A2, and a silicone resin layer, and a resin layer is removed from panel A2. The equipped carrier substrate was isolate | separated and the OLED panel (it corresponds to an electronic device. Hereinafter, it is called panel A).

When an IC driver was connected and driven to the produced panel A, display unevenness was not recognized in the drive area.

(Example 6)

In this example, the LCD was produced using the laminated body A2 after cutting obtained in Example 1.

Two sheets of laminated body A2 are prepared after cutting, and molybdenum is formed into a film by sputtering method on the 2nd main surface of the peelable glass substrate in one after cutting, and by etching using the photolithographic method A gate electrode was formed. Subsequently, a film is formed on the second main surface side of the peelable glass substrate on which the gate electrode is formed by the plasma CVD method, in the order of silicon nitride, intrinsic amorphous silicon, and n-type amorphous silicon, and then molybdenum is formed by sputtering. It formed into a film and the gate insulating film, the semiconductor element part, and the source / drain electrode were formed by the etching using the photolithographic method. Subsequently, after forming a passivation layer by forming a silicon nitride film further on the 2nd main surface side of a peelable glass substrate by plasma CVD method, indium tin oxide is formed into a film by sputtering method, and it is used for the etching using the photolithographic method. Thus, pixel electrodes were formed. Next, the polyimide resin liquid was apply | coated by the roll coat method on the 2nd main surface of the peelable glass substrate in which the pixel electrode was formed, the orientation layer was formed by thermosetting, and rubbing was performed. The obtained laminated body A2 after cutting is called laminated body A2-1 after cutting.

Next, chromium was formed into a film by the sputtering method on the 2nd main surface of the peelable glass substrate in the laminated body A2 after the other cutting, and the light shielding layer was formed by the etching using the photolithographic method. Subsequently, on the 2nd main surface side of the peelable glass substrate in which the light shielding layer was formed, the color resist was further apply | coated by the die-coat method, and the color filter layer was formed by the photolithographic method and thermosetting. Next, indium tin oxide was formed into a film by the sputtering method on the 2nd main surface side of a peelable glass substrate, and the counter electrode was formed. Subsequently, the ultraviolet curable resin liquid was apply | coated by the die-coat method on the 2nd main surface of the peelable glass substrate in which the counter electrode was formed, and the columnar spacer was formed by the photolithographic method and thermosetting. Next, the polyimide resin liquid is apply | coated by the roll coat method on the 2nd main surface of the peelable glass substrate in which the columnar spacer was formed, an orientation layer is formed by thermosetting, and rubbing is performed. Next, after drawing the resin liquid for sealing to a frame shape by the dispenser method to the 2nd main surface side of a peelable glass substrate, and dropping a liquid crystal by the dispenser method in a frame, the laminated body A2-1 after cutting mentioned above is The 2nd main surface side of the peelable glass substrate of laminated body A2 after two sheets of cutting | disconnection was bonded together, and the laminated body which has an LCD panel by ultraviolet curing and thermosetting was obtained. Here, the laminated body which has an LCD panel is called laminated body B2 provided with a panel.

Next, the LCD panel B which consists of a glass substrate in which the TFT substrate was formed, and the glass substrate in which the TFT substrate was formed, and the glass substrate in which the color filter was formed was peeled from the laminated body B2 with a panel similarly to Example 1. Corresponding to the device).

When an IC driver was connected and driven to the produced LCD panel B, display unevenness was not recognized in the drive area.

(Comparative Example 1)

In the same manner as in Example 1, the first main surface of the carrier substrate was cleaned by pure water, washed with UV, and cleaned.

Subsequently, in Example 1, 99.5 parts by mass of a mixed liquid of a linear organoalkenylpolysiloxane having a vinyl group at its terminal, a methylhydrogenpolysiloxane having a hydrosilyl group in a molecule, a platinum-based catalyst, and a silicone oil (Toray Dow Corning Corporation). The SH200) 0.5 mass part mixture was apply | coated by screen printing on the 1st main surface of a carrier substrate. This was then heat cured at 250 ° C. for 30 minutes in air to form a cured silicone resin layer having a thickness of 10 μm.

Subsequently, after pure water washing | cleaning, UV washing, and purifying the 1st main surface of a glass substrate, it contact | adhered by the silicone resin layer formed on the 1st main surface of a carrier substrate by vacuum press at room temperature, and laminated body P1 was obtained.

And after producing OLED on the glass substrate of laminated body P1 by the procedure similar to Example 5, the carrier substrate provided with the resin layer was peeled off, and the OLED panel (henceforth panel P) was obtained.

When the IC driver was connected and driven to the produced panel P, display unevenness was confirmed in the driving region, and the defective portion was present at a portion corresponding to the end portion of the laminate P1.

(Comparative Example 2)

In the same manner as in Comparative Example 1, two laminates P1 were obtained.

Next, according to the same procedure as in Example 6, two laminates P1 were used to obtain a laminate having an LCD panel. Moreover, the carrier substrate provided with the resin layer of both surfaces was peeled from the obtained laminated body, and the LCD panel (henceforth panel Q) was obtained.

When the IC Q was connected to the manufactured panel Q for driving, the display unevenness was confirmed in the driving region, and the defective portion was present in the portion corresponding to the end portion of the laminate P1.

As described in the above Examples 5 and 6, according to the manufacturing method of the electronic device of the present invention, an electronic device excellent in performance can be manufactured with high yield.

On the other hand, in the conventional method of patent document 1, as described in the said Comparative Examples 1 and 2, the performance fall of the obtained electronic device may occur. In Comparative Examples 1 and 2, display unevenness was observed near the edge (periphery) of the electronic device. As described above, voids are formed between the glass substrate and the resin layer due to thickness irregularity in the resin layer (particularly near the outer circumferential edge of the resin layer) obtained by the curing treatment, and foreign matter enters the voids and the electronic device. It is thought that caused the degradation of the performance.

This application is based on the JP Patent application 2011-225239 of an application on October 12, 2011, The content is taken in here with reference.

10: peelable glass substrate
12: uncured curable resin composition layer
14: carrier substrate
16: laminate before curing
18: resin layer
20: laminate after curing
22: laminate after cutting
24: member for an electronic device
26: laminated body with members for electronic devices
28: carrier substrate with resin layer
30: electronic device
32: void
50, 70: stage
51 to 53: positioning block
54, 55: moving block
60: machining head
62: cutter
64: holder
66: cutting
68: crack
72: fitting support jig
80: convex
82: glass substrate
84: void

Claims (10)

It is a manufacturing method of the electronic device containing a peelable glass substrate and the member for electronic devices,
The surface treatment process of processing the said 1st main surface of the glass substrate which has a 1st main surface and a 2nd main surface with a peeling agent, and obtaining the peelable glass substrate which has a surface which shows peelability,
Curable resin composition layer formation process of apply | coating curable resin composition on the surface which shows the peelability of the said peelable glass substrate, and forming an unhardened curable resin composition layer,
The uncured curable resin composition layer such that a carrier substrate having an outer dimension smaller than the outer dimension of the uncured curable resin composition layer is left in the uncured curable resin composition layer so that a peripheral region does not contact the carrier substrate. A lamination step of laminating on to obtain a laminate before curing,
A curing step of curing the uncured curable resin composition layer in the laminate before curing and obtaining a laminate after curing having a resin layer,
A cutting step of cutting the resin layer and the peelable glass substrate along the outer periphery of the carrier substrate in the laminate after the curing;
A member formation step of forming a member for an electronic device on the second main surface of the peelable glass substrate to obtain a laminate including the member for an electronic device;
The manufacturing method of an electronic device provided with the separation process obtained by isolate | separating the said peelable glass substrate and the electronic device which has the said electronic device member from the laminated body provided with the said electronic device member. The manufacturing method of the electronic device of Claim 1 which further includes the degassing process of degassing the said uncured curable resin composition layer after the said lamination process and before the said hardening process. The manufacturing method of the electronic device of Claim 1 or 2 in which the said release agent contains the compound containing a methylsilyl group or a fluoroalkyl group. The manufacturing method of the electronic device of Claim 1 or 2 in which the said peeling agent contains a silicone oil or a fluorine-type compound. The manufacturing method of the electronic device of any one of Claims 1-4 in which the said resin layer contains a silicone resin. The addition reaction type according to any one of claims 1 to 5, wherein the resin layer is a combination of an organoalkenylpolysiloxane having an alkenyl group and an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom. The manufacturing method of an electronic device which is a hardened | cured material of silicone. The manufacturing method of the electronic device of Claim 6 whose molar ratio of the hydrogen atom couple | bonded with the silicon atom of the said organohydrogenpolysiloxane with respect to the alkenyl group of the said organo alkenyl polysiloxane is 0.5-2. The manufacturing method of the electronic device of any one of Claims 1-7 in which the said resin layer contains 5 mass% or less of non-curable organopolysiloxane. The cutting step WHEREIN: The cutting process WHEREIN: The main surface of the carrier substrate in a laminated body after the said hardening is supported by a stage, and the outer periphery of the said carrier substrate is formed on the said stage. A method of manufacturing an electronic device, contacting the positioning block. The cutting process according to any one of claims 1 to 9, wherein in the cutting step, after forming a cut line on the surface of the peelable glass substrate in the laminate after the curing, the cut line is formed in the laminated body after the curing. The manufacturing method of an electronic device which cuts the outer peripheral part of each of a peelable glass substrate and a resin layer at once.

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