TWI584957B - Laminated processing methods, the processing of the laminated board - Google Patents

Description

Processing method of laminated board, processed laminated board

The invention relates to a method for processing a laminated board and a processed laminated board.

Requires LCD panel (Liquid Crystal Display) or PDP (Plasma Display Panel), Organic EL (Electroluminescence) panel (OLED (Organic Light Emitting Diode) LEDs such as light-emitting diodes) and other electronic devices such as solar cells and thin-film secondary batteries are thinner and lighter, and substrates for these electronic devices are being thinned. If the rigidity of the substrate is lowered due to thinning, the rationality of the substrate is deteriorated. Further, if the thickness of the substrate is changed by thinning, it is difficult to manufacture an electronic device using the conventional device.

Therefore, a method of peeling a substrate and a reinforcing plate after forming a specific functional film (for example, a conductive layer) on a substrate to which the reinforcing plate is bonded and peeling is proposed (for example, refer to Patent Document 1). According to this method, it is possible to ensure the rationality of the substrate, and it is possible to manufacture a thin electronic device using the existing equipment.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-326358

An end portion of a laminate having a substrate and a reinforcing plate releasably bonded to the substrate For the purpose of impact resistance, grinding with a grindstone and chamfering.

The polishing surface polished by the grindstone on the substrate generates minute cracks, and minute cracks are generated to reach the interface between the substrate and the reinforcing plate, so that the substrate is notched.

Further, the substrate is cracked by the operation of peeling off the substrate and the reinforcing plate.

The present invention has been made in view of the above problems, and an object thereof is to provide a method for processing a laminated board which can suppress cracks during polishing and cracks during peeling.

In order to solve the above problems, according to an aspect of the present invention, a method for processing a laminated board is provided, which is a method of processing a laminated board having a substrate and a reinforcing sheet that is releasably bonded to the substrate, and has the above-described method of grinding the above by using a grindstone In the chamfering step of the end portion of the laminate, the angle between the interface between the substrate and the reinforcing plate and the polished surface of the substrate polished by the grindstone is greater than 26° and not more than 30°.

According to the present invention, there is provided a method for processing a laminate which can suppress cracks during polishing and cracks during peeling.

10‧‧‧Laminated boards

12‧‧‧Substrate

14‧‧‧ reinforcing plate

15‧‧‧Release film

16‧‧‧Support board

30‧‧‧Martstone

32‧‧‧ Grinding trough

A‧‧‧thickness of the substrate

B‧‧‧ Thickness of reinforcing plate

C‧‧‧ Thickness of support plate

D‧‧‧ peel film thickness

Outstanding dimensions of E‧‧‧ reinforcing plates

F‧‧‧ Dimensions of the vertical part of the polished surface of the laminated board to the thickness direction of the laminated board

G‧‧‧力

G1‧‧‧

R‧‧‧ radius of curvature

Θ‧‧‧ corner

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing a method of processing a laminated board according to an embodiment of the present invention.

Fig. 2 is a plan view showing a method of processing a laminated board according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing the force of the self-grinding stone acting on the laminated plate in the chamfering step in an embodiment of the present invention.

Embodiments will be described below with reference to the drawings. In the drawings, the same or corresponding reference numerals are attached to the same or corresponding components, and the description is omitted.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing a method of processing a laminated board according to an embodiment of the present invention. Figure 2 is a plan view showing a method of processing a laminated board according to an embodiment of the present invention.

First, the laminated board 10 will be described with reference to Fig. 1 . For example, as shown in FIG. 1, the laminate 10 includes a substrate 12 and a reinforcing plate 14 that is releasably bonded to the substrate 12. The laminate 10 can be used for the manufacture of articles after being processed by the following processing method. A plurality of laminated sheets 10 can also be used in the manufacture of a product. Examples of the product include electronic devices such as display panels, solar cells, and film secondary batteries.

The substrate 12 is a part of the product, and in the manufacturing step of the product, a functional film corresponding to the type of the product is formed on the substrate 12. It can also be composed of a plurality of functional films.

The substrate 12 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these substrates, a glass substrate is preferred. The reason for this is that the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. When the linear expansion coefficient of the substrate 12 is large, various defects are likely to occur during heat treatment. For example, when the functional film formed at a high temperature is cooled to room temperature, the functional film may be deformed.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, sorghum glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of 40 to 90% by mass based on the oxide. The glass of the glass substrate is selected according to the type of the product. For example, in the case of a liquid crystal panel, glass (alkali-free glass) which does not substantially contain an alkali metal component is used.

When the substrate 12 is a glass substrate, the thickness A of the substrate 12 is, for example, 0.3 mm or less, more preferably 0.1 mm or less, still more preferably 0.05 mm or less. Moreover, when the substrate 12 is a glass substrate, the thickness A of the substrate 12 is preferably 0.001 mm or more from the viewpoint of moldability.

Before the operation of peeling the reinforcing plate 14 from the substrate 12, the reinforcing plate 14 is bonded to the substrate 12 to reinforce the substrate 12. The thickness B of the reinforcing plate 14 may be greater than the thickness A of the substrate 12. In the middle of the manufacturing process of the product, the reinforcing plate 14 is peeled off from the substrate 12 and does not become a part of the product.

In order to prevent warping or peeling due to heat treatment, it is preferable that the reinforcing plate 14 has a small difference in thermal expansion from the substrate 12. In the case where the substrate 12 is a glass substrate, it is preferable that the reinforcing plate 14 is a glass plate, and the glass of the substrate 12 and the glass of the reinforcing plate 14 are the same kind of glass.

The reinforcing plate 14 includes, for example, a release film 15 that is detachably bonded to the substrate 12 and a support plate 16 that supports the substrate 12 via the release film 15 . The release film 15 and the substrate 12 are releasably bonded by a van der Waals force or the like acting between the two. The release film 15 may be either a resin film or an inorganic film. The inorganic film may be, for example, a metal oxide film.

Further, although the reinforcing plate 14 of the present embodiment is composed of the release film 15 and the support plate 16, it may be constituted only by the support plate 16 and the support plate 16 (for example, a glass plate) and the substrate 12 (for example, a glass substrate) may be directly Combine. The surface of the support plate 16 that is in contact with the substrate 12 and the surface of the substrate 12 that is in contact with the support plate 16 may each have a surface roughness of a specific value or less so that the two faces are easily bonded to each other. Further, by providing at least one contact surface with a region having a different surface roughness, an interface having a different bonding force may be provided at the interface between the support plate 16 and the substrate 12. Thereby the peeling operation becomes easy. Each of the surface of the support plate 16 that is in contact with the substrate 12 and the surface of the substrate 12 that is in contact with the support plate 16 may be a process (for example, a cleaning process) in which the activity of the surface is increased.

Further, the reinforcing plate 14 may be formed by alternately laminating a glass plate and a resin film, and may have a plurality of support plates 16 and a plurality of resin films. In this case, the outermost resin film becomes a release film.

The support plate 16 supports the substrate 12 via the release film 15 . The support plate 16 is, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, a metal plate, or the like. In the case where the substrate 12 is a glass substrate, the support plate 16 is preferably a glass plate. On the other hand, when the support plate 16 is a resin plate or a metal plate, the reinforcing plate 14 is easily bent and deformed, so that the reinforcing plate 14 and the substrate 12 are easily peeled off.

The difference (absolute value) of the average linear expansion coefficient between the support plate 16 and the substrate 12 is appropriately set depending on the size and shape of the substrate 12, and is preferably, for example, 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient (JIS R 3102) in a temperature range of 50 ° C to 300 ° C.

In the case where the support plate 16 is a glass plate, the thickness C of the support plate 16 is, for example, 0.7 mm or less. Further, in the case where the support plate 16 is a glass plate, in order to reinforce the substrate 12, it is preferable that the thickness C of the support plate 16 is 0.4 mm or more.

As shown in FIG. 1, the outer shape of the support plate 16 is the same as or smaller than the outer shape of the release film 15, so that the support plate 16 can support the entirety of the release film 15.

The release film 15 prevents misalignment of the substrate 12 before the operation of peeling the release film 15 from the substrate 12 is performed. The release film 15 is easily peeled off from the substrate 12 by a peeling operation. Thereby, damage of the substrate 12 due to the peeling operation can be prevented.

The release film 15 is formed such that its bonding force with the support plate 16 is relatively higher than that of the bonding force with the substrate 12. The peeling operation can prevent the laminated board 10 from being peeled off at an unexpected position (between the release film 15 and the support sheet 16).

The resin of the release film 15 is not particularly limited. For example, examples of the resin of the release film 15 include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, a polyimide, a polyoxymethylene resin, and the like. Several resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polydecene oxide resin or a polyamidene polyimide resin is preferable.

The thickness D of the release film 15 is not particularly limited. However, when the release film 15 is a resin film, the thickness thereof is preferably from 1 μm to 50 μm, more preferably from 4 μm to 20 μm. By setting the thickness D of the release film 15 to 1 μm or more, the release film 15 can be deformed to absorb the thickness of bubbles or foreign matter when bubbles or foreign matter are mixed between the release film 15 and the substrate 12. On the other hand, when the thickness D of the release film 15 is 50 μm or less, the formation time of the release film 15 can be shortened, and the resin of the release film 15 can be used without exceeding the necessity, which is economical.

Preferably, as shown in FIG. 1, the outer shape of the release film 15 is the same as or larger than the outer shape of the substrate 12, so that the release film 15 can support the entirety of the substrate 12. If the shape of the release film 15 is larger than that of the substrate 12, the portion of the release film 15 exposed from the substrate 12 is exposed. The bending deformation and the peeling of the reinforcing plate 14 and the substrate 12 are gradually performed, and the peeling is smoothly performed.

Further, the release film 15 may also include a plurality of resin films. In this case, the "thickness of the release film" means the total thickness of all the resin films.

Next, a method of manufacturing the laminated board 10 will be described. As a method of manufacturing the laminated board 10, for example, there are the following methods (1) to (3).

(1) A resin composition having fluidity is applied onto the support sheet 16 to be cured to form the release film 15, and then the substrate 12 is pressure-bonded to the release film 15. When the resin composition is cured, since the resin composition interacts with the support sheet 16, the bonding force between the support sheet 16 and the release film 15 is more likely to be higher than the bonding force between the release film 15 and the substrate 12.

(2) After applying a fluid resin composition to a specific substrate and curing it to form a release film 15, the release film 15 is peeled off from a specific substrate, and pressure-bonding is performed to make the release film The form of the film is sandwiched between the substrate 12 and the support plate 16. After the release film 15 is pressure-bonded, the bonding strength to the substrate 12 is low, and the bonding strength of the support plate 16 is high. The surface of the substrate 12 or the support plate 16 may be surface-treated before contact with the release film 15, so that the bonding force after the pressure-bonding with the release film 15 is different.

(3) A resin composition is interposed between the substrate 12 and the support plate 16, and the resin composition is cured to form the release film 15. After the resin composition is hardened, the bonding strength to the substrate 12 is low, and it is effective in the case where the bonding strength of the support sheet 16 is high. The surface of the substrate 12 or the support plate 16 may be surface-treated before being contacted with the resin composition, so that the bonding strength of the resin composition after hardening is different.

The crimping in the methods (1) and (2) above can be carried out in a highly clean environment. Although the air pressure around the pressure contact may be atmospheric pressure, in order to suppress the intrusion of air, it is preferable that the peripheral pressure is a negative pressure lower than atmospheric pressure. As a method of crimping, there are a roll type, a push type, and the like. Although the pressure bonding temperature may be a temperature higher than room temperature, in order to prevent deterioration of the resin film as the release film 15, room temperature is preferred.

The resin composition to be the release film 15 may be cured by any of a condensation reaction type, an addition reaction type, an ultraviolet curing type, and an electron beam curing type. The addition reaction type resin composition is easily cured, and is excellent in peelability and high in heat resistance.

In addition, the resin composition to be the release film 15 may be one of a solvent type, an emulsion type, and a solventless type, but it is preferably a solvent-free type from the viewpoint of productivity and environmental characteristics. . Further, the solvent-free resin composition does not contain a solvent which may foam during curing, so that the release film 15 having less defects can be obtained.

The hardening method is an addition reaction type and uses a solvent-free polyoxyxylene resin composition, and has a linear polyorganosiloxane having a vinyl group and a methylhydrogenpolyoxy group having a hydroquinone group. Alkane. The polyoxyxylene resin composition is cured by heating in the presence of a platinum catalyst to form a polyoxynoxide resin film.

Examples of the coating method of the resin composition to be the release film 15 include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, and a gravure coating method. Bufa and so on. These coating methods are appropriately selected depending on the kind of the resin composition.

The coating amount of the resin composition to be the release film 15 is appropriately selected depending on the type of the resin composition or the like. For example, in the case where the type of the resin composition is the above polyoxyxylene resin composition, the coating amount is preferably from 1 g/m ² to 100 g/m ² , more preferably from 5 g/m ² to 20 g/m ² .

The curing conditions of the resin composition to be the release film 15 are appropriately selected depending on the type of the resin composition and the like. For example, when the amount of the platinum-based catalyst is 2 parts by mass based on 100 parts by mass of the linear polyorganosiloxane and the methylhydropolysiloxane. The temperature for heating in the atmosphere is 50 ° C to 250 ° C, preferably 100 ° C to 200 ° C. Further, the reaction time in this case is set to 5 minutes to 60 minutes, preferably 10 minutes to 30 minutes. As long as the curing conditions of the resin composition are within the range of the above reaction time and the reaction temperature, the oxidative decomposition of the polyoxynoxy resin will not occur simultaneously. When the reinforcing plate and the substrate are peeled off, the resin does not easily remain on the substrate side.

Next, a method of processing the produced laminated board will be described with reference to FIGS. 1 and 2 again. As shown in FIGS. 1 and 2, the method of processing a laminated board has a chamfering processing step of polishing the end portion of the laminated board 10 by the grindstone 30.

The grindstone 30 has a disk shape, and an annular grinding groove 32 is formed on the outer peripheral surface of the grindstone 30. The cross-sectional shape of the polishing groove 32 may be, for example, a substantially trapezoidal shape or a substantially isosceles trapezoid. The groove width of the grinding groove 32 gradually narrows toward the radially inner portion of the grindstone 30. The boundary between the bottom surface of the polishing groove 32 and each side surface of the polishing groove 32 faces the radially inner portion of the grindstone 30 to form a convex curved surface.

In the chamfering processing step, first, as shown in FIG. 1, the laminated plate 10 is placed in such a manner that the thickness direction of the laminated plate 10 is parallel to the center line of the grindstone 30. In this state, the grinding stone 30 is rotated around the center line of the grindstone 30, and the wall surface of the grinding groove 32 is pressed against the end portion of the laminated plate 10, and the end portion of the laminated plate 10 is polished by the grindstone 30. . At this time, the end portions of the laminated plate 10 are ground on the both side faces of the polishing groove 32, and the bottom surface of the laminated plate 10 is ground by the bottom surface of the polishing groove 32. The misalignment of the laminated plate 10 and the grindstone 30 can be prevented by sandwiching the ends of the laminated plate 10 on both side faces of the grinding groove 32. In the chamfering processing step, as shown in FIG. 2, the grindstone 30 and the laminated plate 10 are moved relative to each other, and at least a part of the outer periphery of the laminated plate 10 is polished.

Fig. 3 is a cross-sectional view showing the force of the self-grinding stone acting on the substrate in the chamfering step in the embodiment of the present invention. As shown in FIG. 3, in the chamfering step, the force G acts on the substrate 12 from the grindstone 30. This force G acts in a direction perpendicular to the center line of the grindstone 30 (that is, the plate thickness direction of the laminated plate 10). Among the forces G, microscopic cracks may occur on the polished surface of the substrate 12 due to the component force G1 perpendicular to the wall surface of the polishing groove 32. The smaller the angle θ between the interface between the substrate 12 and the reinforcing plate 14 and the polished surface of the substrate 12, the smaller the component force G1 at which minute cracks may occur.

In the present embodiment, the angle θ between the interface between the substrate 12 and the reinforcing plate 14 and the polished surface of the substrate 12 is 30° or less, so that the component G1 which may cause micro cracks on the polished surface of the substrate 12 is sufficiently small, so that the substrate 12 is not easy to create a gap.

The interface between the substrate 12 and the reinforcing plate 14 may be polished by one side of the polishing groove 32 as shown in FIG. 1 without using the bottom surface of the polishing groove 32 so as to be inclined with respect to the polishing surface of the substrate 12. In this case, the polished surface of the substrate 12 is composed only of a flat portion.

Furthermore, in the present embodiment, although the interface between the substrate 12 and the reinforcing plate 14 is polished by one side of the polishing groove 32, a curved surface portion of one side of the polishing groove 32 and the bottom surface of the polishing groove 32 may be used. Grinding. In this case, the abrasive surface of the substrate 12 includes a flat portion and a curved portion. The angle formed by the tangent to the curved portion and the interface between the substrate 12 and the reinforcing plate 14 may be 30 or less.

Further, the angle θ between the interface between the substrate 12 and the reinforcing plate 14 and the polished surface of the substrate 12 is greater than 26°. Since the interface between the substrate 12 and the reinforcing plate 14 and the polishing surface of the substrate 12 is not too sharp, when the thin blade is inserted between the substrate 12 and the reinforcing plate 14 in order to peel the substrate 12 from the reinforcing plate 14, the substrate 12 is inserted. Not easy to create gaps.

The polished surface of the laminated plate 10 polished by the grindstone 30 (hereinafter simply referred to as "the polished surface of the laminated board 10") has, for example, an inclined portion of the laminated board 10 which is inclined obliquely from the front surface and the back surface thereof, and the laminated board 10 is opposed thereto. a vertical portion perpendicular to the front surface and the back surface, and a curved surface portion formed between each of the inclined portion and the vertical portion.

As long as the inclined portion of the processed laminated plate 10 extending obliquely from the front surface thereof and the inclined portion of the processed laminated plate 10 extending obliquely from the back surface thereof are symmetrical with respect to the center plane between the front surface and the back surface of the processed laminated plate 10 Just fine.

The cross-sectional shape of the curved surface portion of the polished surface of the processed laminated plate 10 is a shape that is convex toward the radially inner portion of the grindstone 30, and is, for example, an arc shape. The curvature radius R of the curved surface portion of the polished surface of the processed laminated plate 10 is, for example, 0.05 mm to 0.20 mm.

The vertical portion of the polished surface of the processed laminate 10 is on the plate of the processed laminate 10 The dimension F in the thick direction is, for example, 0.05 mm to 0.30 mm.

Further, regarding the processed laminated board 10, the reinforcing plate 14 may be placed on the platform with the reinforcing plate 14 facing downward, and may be in contact with the positioning block provided on the platform.

In the present embodiment, the reinforcing plate 14 protrudes more outward than the substrate 12 in the direction of the thickness of the processed laminated plate 10. The substrate 12 is not in contact with the positioning block, so that the substrate 12 is not easily damaged. The protruding dimension E of the reinforcing plate 14 is, for example, 0.05 mm to 0.30 mm.

Next, a method of manufacturing an electronic device using the processed laminate 10 will be described. The manufacturing method of the electronic device may have a step of forming a functional film on the substrate 12 of the processed laminated board 10 and a step of peeling off the substrate 12 on which the functional film is formed and the reinforcing plate 14.

When a functional film is formed, a lithography technique or an etching technique is sometimes used and a resist liquid is used. Sometimes the resist liquid spreads to the polished surface of the processed laminate 10.

The polished surface of the processed laminated board 10 of the present embodiment has no gap near the interface between the substrate 12 and the reinforcing plate 14, so that the residue of the resist is easily removed. The residue becomes the origin of dust during the heat treatment process, so the yield of the electronic device is improved by reducing the residue.

The peeling of the substrate 12 and the reinforcing plate 14 is performed by, for example, inserting a thin blade between the substrate 12 and the reinforcing plate 14, and after forming the gap which is the starting point of the peeling, the substrate 12 is held flat while the reinforcing plate is held. 14 is bent and deformed in order from the starting point side of the peeling toward the opposite side.

Next, a method of manufacturing a liquid crystal panel as an electronic device will be described. The method of manufacturing a liquid crystal panel includes, for example, a TFT (Thin Film Transistor) substrate fabrication step, a CF (Color Filter) substrate fabrication step, an assembly step, and a peeling step.

In the TFT substrate fabrication step, a thin film transistor (TFT) or the like is formed on the substrate 12 of the processed laminate 10 to form a TFT substrate. The TFT substrate is fabricated using a lithography technique or an etching technique and a resist liquid is used.

In the CT substrate fabrication step, on the substrate 12 of another processed laminate 10 A CF substrate is produced by forming a transparent conductive film or a color filter (CF). In the production of a CF substrate, a lithography technique is used and a resist liquid is used.

The assembly step has a step of sealing the liquid crystal material between the TFT substrate and the CF substrate. As a method of injecting a liquid crystal material between a TFT substrate and a CF substrate, there are a pressure reduction injection method or a dropping injection method.

In the vacuum injection method, for example, a large panel is produced by first bonding a TFT substrate and a CF substrate with a sealing material and a spacer. The large panel produced is cut into a plurality of units. Then, the inside of each unit was evacuated, and the injection hole was sealed by injecting a liquid crystal material into the inside of each unit from the injection holes provided on the side faces of the respective units. Then, a liquid crystal panel was manufactured by attaching a polarizing plate to each unit.

In the dropping method, for example, first, a liquid crystal material is dropped onto any of the TFT substrate and the CF substrate, and then the TFT substrate and the CF substrate are bonded together via a sealing material and a spacer material to form a large panel. . The large panel produced is cut into a plurality of units. Then, a liquid crystal panel was manufactured by attaching a polarizing plate to each unit.

In the peeling step, the substrate 12 and the reinforcing plate 14 are peeled off. The stripping step can be performed after the TFT substrate fabrication step and the CF substrate fabrication step, before the assembly step, or during the assembly step or after the assembly step.

For example, in the case where the peeling step is performed in the middle of the assembly step by the reduced pressure injection method, the peeling step may be performed after the production of the large panel, before the cutting of the large panel, or after the sealing of the liquid crystal material or before the attachment of the polarizing plate. get on.

Further, in the case where the peeling step is performed in the middle of the assembly step by the dropping injection method, the peeling step may be performed after the production of the large panel, before the cutting of the large panel, or after the cutting of the large panel or before the attachment of the polarizing plate. get on.

Next, a method of manufacturing an organic EL panel (OLED) as an electronic device will be described. The manufacturing method of the organic EL panel has, for example, an organic EL element forming step, a bonding step, and a peeling step.

In the organic EL element forming step, an organic EL element is formed on the substrate 12 of the processed laminated board 10. The organic EL element includes, for example, a transparent electrode layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like. In the formation of an organic EL element, a photolithography technique is used and a resist liquid is used.

In the bonding step, the substrate on which the organic EL element is formed is bonded to the counter substrate. The substrate on which the organic EL element is formed can be diced into a plurality of cells, and each cell can be bonded to the counter substrate.

In the peeling step, the substrate 12 and the reinforcing plate 14 are peeled off. The peeling step can be performed, for example, after the organic EL element forming step, before the bonding step, or in the middle of the bonding step, or after the bonding step.

Next, a method of manufacturing a solar cell as an electronic device will be described. The solar cell manufacturing method has a solar cell element forming step and a peeling step.

In the solar cell element forming step, solar cell elements are formed on the substrate 12 of the processed laminate 10. The solar cell element includes, for example, a transparent electrode layer, a semiconductor layer, and the like. Photolithography is used in the formation of solar cell elements and a resist solution is used.

In the peeling step, the substrate 12 and the reinforcing plate 14 are peeled off. The peeling step can be performed, for example, after the solar cell element forming step.

[Examples] [Test Examples 1 to 4]

In Test Examples 1 to 4, a laminate was prepared as follows: a resin composition having fluidity was applied to a support plate to be cured to form a release film, and the glass substrate was pressure-bonded to the formed release film. Made up. The laminated plates of Test Examples 1 to 4 have the same configuration.

An alkali-free glass plate (920 mm × 730 mm × thickness 0.5 mm) manufactured by Asahi Glass Co., Ltd. was used as the glass plate of the support plate.

Using 100 parts by mass of solvent-free addition reaction type polyoxane (Shin-e-oxygen (Shin- A mixture of 2 parts by mass of a platinum-based catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-56) was produced as a resin composition by Etsu Silicone Co., Ltd., KNS-320A. The release film (920 mm × 730 mm × thickness 8 μm) was formed by applying the mixture to a glass plate by a die coater and heat-treating at 220 ° C for 30 minutes.

As the glass substrate, an alkali-free glass plate (920 mm × 730 mm × thickness 0.1 mm) manufactured by Asahi Glass Co., Ltd. was used.

In Test Examples 1 to 4, each of the four sides of the substantially rectangular laminated plate was polished to the size shown in Table 1 by a grindstone, and it was examined by a microscope whether or not a notch was formed in the glass substrate. Diamond abrasive grains having an average particle diameter of 30 μm were used as the abrasive grains of the grindstone. Further, the cross-sectional shape of the grinding groove of the grindstone is substantially an isosceles trapezoid. A case where a notch having a length of 0.03 mm or more is not formed on the polished surface of the glass substrate is referred to as "○", and a case where the length of the polished surface of the glass substrate is 0.03 mm or more and not less than 0.05 mm is referred to as "Δ". A case where a notch having a length of 0.05 mm or more was formed on the polished surface of the glass substrate was referred to as "x".

Then, in Test Examples 1 to 4, the laminated plate was placed on the platform with the reinforcing plate facing downward, and the laminated plate was collided with the positioning block provided on the platform at a speed of 100 mm/s, and the microscope was used. Check whether the corners of the upper surface of the glass substrate and the polished surface are notched. The face of the positioning block that collides with the laminate is perpendicular to the upper surface of the platform. A case where a notch having a length of 0.03 mm or more is not formed at a corner portion of the upper surface of the glass substrate and the polished surface is referred to as "○", and a length of the upper surface of the glass substrate and the polished surface is 0.03 mm or more and is not reached. The case of a notch of 0.05 mm is referred to as "△", and a case where a notch having a length of 0.05 mm or more is formed on the upper surface of the glass substrate and the corner of the polishing surface is referred to as "x".

Then, in Test Examples 1 to 4, the glass substrate and the reinforcing plate were peeled off, and the glass substrate was inspected for cracking during the peeling process. In the peeling test, a thin blade is inserted between a glass substrate and a reinforcing plate which are not in contact with the positioning block among the four corners of the laminated plate which is ground by the grindstone, thereby forming a gap which is a starting point of peeling, and is flat on one side. While holding the glass substrate, the reinforcing plate is sequentially bent and deformed from the peeling start side toward the opposite side. Stripping In the process, the case where the substrate was not cracked was referred to as "○", and the case where the substrate was cracked was referred to as "x".

The results of the test are shown in Table 1. In Table 1, A indicates the thickness of the glass substrate, B indicates the thickness of the reinforcing plate, C indicates the thickness of the glass plate as the support plate, D indicates the thickness of the polyfluorene oxide film as the release film, and θ indicates the glass substrate and the reinforcing plate. The interface is at an angle to the polished surface of the glass substrate. Further, in Table 1, R represents the radius of curvature of the curved surface portion of the polished surface of the laminated board, E represents the size of the reinforcing plate from the glass substrate in the thickness direction of the processed laminated plate, and F represents the laminated plate. The vertical portion of the polished surface is dimensioned in the thickness direction of the laminate.

As shown in Table 1, as long as the angle θ between the interface between the glass substrate and the reinforcing plate and the polished surface of the glass substrate is 30 or less, the notch at the time of polishing hardly occurs. Further, as long as the dimension E of the reinforcing plate protruding from the glass substrate in the thickness direction of the processed laminated plate is 0.05 mm or more, the notch at the time of positioning is hardly generated. Further, as long as the angle θ between the interface between the glass substrate and the reinforcing plate and the polished surface of the glass substrate is larger than 26°, cracks at the time of peeling hardly occur.

[Test Examples 5 to 8]

In the test examples 5 to 8, the same test as in Test Examples 1 to 4 was carried out except that an alkali-free glass plate (920 mm × 730 mm × thickness: 0.2 mm) manufactured by Asahi Glass Co., Ltd. was used as the glass substrate. The results of the test are shown in Table 2.

As shown in Table 2, as long as the angle θ between the interface between the glass substrate and the reinforcing plate and the polished surface of the glass substrate is 30 or less, the gap at the time of polishing hardly occurs. Further, as long as the dimension E of the reinforcing plate protruding from the glass substrate in the thickness direction of the processed laminated plate is 0.05 mm or more, the notch at the time of positioning is hardly generated. Further, as long as the angle θ between the interface between the glass substrate and the reinforcing plate and the polished surface of the glass substrate is larger than 26°, cracks at the time of peeling hardly occur.

In the above, the method of processing the laminated board, the embodiment of the processed laminated board, and the like have been described. However, the present invention is not limited to the above-described embodiment and the like, and various modifications can be made within the scope of the gist of the invention described in the claims. And improvement.

For example, in the above-described embodiment and the like, the polishing surface of the laminated plate 10 includes inclined portions extending from the front surface and the back surface of the laminated plate 10, and vertical portions perpendicular to the front surface and the back surface of the laminated plate 10, and are formed on The curved surface portion between each inclined portion and the vertical portion may have various configurations of the polishing surface. For example, the polished surface of the laminated board may further include inclined portions extending from the front surface and the back surface of the laminated board 10 and formed on the two inclined sides. The curved surface between the slopes. The curved surface portion has, for example, a circular arc shape, and protrudes more outward than the inclined portion in the thickness direction of the laminated plate 10.

Further, in the above-described embodiment and the like, the inclined portion extending from the front surface of the processed laminated plate 10 and the inclined portion extending obliquely from the back surface of the processed laminated plate 10 with respect to the processed laminated plate 10 The center plane between the front and back is symmetrical, but it can also be asymmetrical.

The present application is based on Japanese Patent Application No. 2012-269500, filed on Dec.

10‧‧‧Laminated boards

12‧‧‧Substrate

14‧‧‧ reinforcing plate

15‧‧‧Release film

16‧‧‧Support board

30‧‧‧Martstone

32‧‧‧ Grinding trough

A‧‧‧thickness of the substrate

B‧‧‧ Thickness of reinforcing plate

C‧‧‧ Thickness of support plate

D‧‧‧ peel film thickness

Outstanding dimensions of E‧‧‧ reinforcing plates

F‧‧‧ Dimensions of the vertical part of the polished surface of the laminated board to the thickness direction of the laminated board

R‧‧‧ radius of curvature

Θ‧‧‧ corner

Claims (8)

A method for processing a laminated board, which is a method for processing a laminated board having a substrate and a reinforcing sheet removably bonded to the substrate, and having a chamfering processing step of grinding the end portion of the laminated board with a grindstone, the substrate and the substrate The angle between the interface of the reinforcing plate and the polished surface of the substrate polished by the grindstone is greater than 26° and 30° or less. The method of processing a laminate according to claim 1, wherein the substrate is a glass substrate, and the reinforcing plate includes a resin film that is detachably bonded to the glass substrate, and a glass plate that supports the glass substrate via the resin film. The method of processing a laminate according to claim 1, wherein the substrate is a glass substrate, and the reinforcing plate comprises a glass plate detachably bonded to the glass substrate. The method of processing a laminate according to claim 1, wherein the substrate is a glass substrate, and the reinforcing plate includes an inorganic film that is detachably bonded to the glass substrate, and a glass plate that supports the glass substrate via the inorganic film. A processed laminated board having a substrate and a reinforcing plate detachably bonded to the substrate, and having an abrasive surface polished by a grindstone at an end portion, and an interface between the substrate and the reinforcing plate and the above The angle formed by the polished surface of the substrate polished by the grindstone is greater than 26° and 30° or less. The processed laminate according to claim 5, wherein the substrate is a glass substrate, and the reinforcing plate includes a resin film that is detachably bonded to the glass substrate, and a glass plate that supports the glass substrate via the resin film. A processed laminate according to claim 5, wherein said substrate is a glass substrate, and said reinforcing plate comprises a glass plate releasably bonded to said glass substrate. The processed laminate according to claim 5, wherein the substrate is a glass substrate, and the reinforcing plate includes an inorganic film that is detachably bonded to the glass substrate, and a glass plate that supports the glass substrate via the inorganic film.