JP2014114183A - Method for working laminated sheet, and worked laminated sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for working a laminated sheet capable of suppressing chipping upon grinding and cracking upon peeling.SOLUTION: Provided is a method for working a laminated sheet 10 having a substrate 12 and a reinforcing sheet 14 coupled with the substrate 12 so as to be peelable. The method for working a laminated sheet comprises a chamfer step of grinding the edge part of the laminated sheet 10 with a grinder 30. The angle θ made by the boundary between the substrate 12 and the reinforcing sheet 14 and the ground face obtained by being ground with the grinder 30 in the substrate 12 is wider than 26° and less than 30°.

Description

  The present invention relates to a method for processing a laminated plate and a processed laminated plate.

  Electronic devices such as liquid crystal panels (LCD), plasma panels (PDP), organic EL panels (OLED) and other display panels, solar cells, and thin film secondary batteries are required to be thinner and lighter. Thinning of substrates used in devices is progressing. If the rigidity of the substrate is reduced by thinning, the handling property of the substrate is deteriorated. In addition, if the thickness of the substrate changes due to the thin plate, it becomes difficult to manufacture an electronic device using existing equipment.

  Accordingly, a method has been proposed in which a predetermined functional film (for example, a conductive layer) is formed on a substrate that is detachably coupled to the reinforcing plate, and then the substrate and the reinforcing plate are separated (for example, see Patent Document 1). . According to this method, the handling property of the substrate can be ensured, and a thin electronic device using existing equipment can be manufactured.

JP 2007-326358 A

  An end portion of a laminate having a substrate and a reinforcing plate releasably coupled to the substrate may be ground and chamfered with a grindstone for the purpose of improving impact resistance.

  A microcrack may occur on the ground surface of the substrate ground with the grindstone, and the generated microcrack may reach the interface between the substrate and the reinforcing plate, and the substrate may be chipped.

  Further, the substrate may be broken by the peeling operation between the substrate and the reinforcing plate.

  This invention is made | formed in view of the said subject, Comprising: It aims at provision of the processing method of the laminated board which can suppress the chipping at the time of grinding, and the crack at the time of peeling.

In order to solve the above problems, according to one aspect of the present invention,
A method of processing a laminated plate having a substrate and a reinforcing plate releasably coupled to the substrate,
Having a chamfering step of grinding the end of the laminate with a grindstone;
There is provided a method for processing a laminated board, wherein an angle formed between an interface between the substrate and the reinforcing plate and a ground surface of the substrate ground by the grindstone is larger than 26 ° and not larger than 30 °.

  ADVANTAGE OF THE INVENTION According to this invention, the processing method of the laminated board which can suppress the chipping at the time of grinding and the crack at the time of peeling is provided.

It is a side view which shows the processing method of the laminated sheet by one Example of this invention. It is a top view which shows the processing method of the laminated board by one Example of this invention. It is sectional drawing which shows the force which acts on a laminated board from a grindstone in the chamfering process by one Example of this invention.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted.

  FIG. 1 is a side view showing a method of processing a laminated board according to an embodiment of the present invention. FIG. 2 is a plan view showing a method of processing a laminated board according to an embodiment of the present invention.

  First, the laminated board 10 is demonstrated with reference to FIG. For example, as shown in FIG. 1, the laminated plate 10 includes a substrate 12 and a reinforcing plate 14 detachably coupled to the substrate 12. The laminated plate 10 is used for manufacturing a product after being processed by a processing method described later. A plurality of laminated boards 10 may be used for manufacture of one product. Examples of the product include electronic devices such as a display panel, a solar battery, and a thin film secondary battery.

  The substrate 12 is a part of the product, and a functional film corresponding to the type of product is formed on the substrate 12 in the manufacturing process of the product. The functional film may be composed of a plurality of layers.

  The substrate 12 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, or a semiconductor substrate. Among these, a glass substrate is preferable. This is because the glass substrate is excellent in chemical resistance and moisture permeability resistance and has a small linear expansion coefficient. When the linear expansion coefficient of the substrate 12 is large, various inconveniences are likely to occur during the heat treatment, and for example, when the functional film formed at a high temperature is cooled to room temperature, the pattern of the functional film may be distorted.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. The oxide glass is preferably a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide. The glass of the glass substrate is selected according to the type of product. For example, in the case of a liquid crystal panel, glass (non-alkali glass) that does not substantially contain an alkali metal component is used.

  When the substrate 12 is a glass substrate, the thickness A of the substrate 12 is, for example, 0.3 mm or less, more preferably 0.1 mm or less, and further preferably 0.05 mm or less. Further, when the substrate 12 is a glass substrate, the thickness A of the substrate 12 is preferably 0.001 mm or more from the viewpoint of formability.

  The reinforcing plate 14 is bonded to the substrate 12 and reinforces the substrate 12 until the peeling operation between the reinforcing plate 14 and the substrate 12 is performed. The thickness B of the reinforcing plate 14 may be thicker than the thickness A of the substrate 12. The reinforcing plate 14 is peeled off from the substrate 12 during the manufacturing process of the product and does not become a part of the product.

  The reinforcing plate 14 preferably has a small difference in thermal expansion with respect to the substrate 12 in order to prevent warpage or peeling due to heat treatment. When the substrate 12 is a glass substrate, the reinforcing plate 14 preferably includes a glass plate, and the glass of the substrate 12 and the glass of the reinforcing plate 14 are preferably the same type of glass.

  The reinforcing plate 14 includes, for example, a peeling film 15 that is detachably coupled to the substrate 12 and a support plate 16 that supports the substrate 12 via the peeling film 15. The release film 15 and the substrate 12 are detachably coupled by van der Waals force acting between them. The release film 15 may be a resin film or an inorganic film. The inorganic film may be a metal oxide film, for example.

  In addition, although the reinforcement board 14 of a present Example is comprised with the peeling film 15 and the support plate 16, it is comprised only with the support plate 16, and the support plate 16 (for example, glass plate) and the board | substrate 12 (for example, glass substrate) are comprised. You may combine directly. The contact surface of the support plate 16 with the substrate 12 and the contact surface of the substrate 12 with the support plate 16 may each have a surface roughness of a predetermined value or less so that they can be easily coupled to each other. In addition, by providing a region having a different surface roughness on at least one contact surface, a region having a different bonding force may be provided at the interface between the support plate 16 and the substrate 12. The peeling operation becomes easy. The contact surface of the support plate 16 with the substrate 12 and the contact surface of the substrate 12 with the support plate 16 may each be subjected to a treatment for increasing the surface activity (for example, a cleaning treatment).

  The reinforcing plate 14 may be a laminate of glass plates and resin films alternately, and may include a plurality of support plates 16 and a plurality of resin films. In this case, the outermost resin film becomes the release film.

  The support plate 16 supports the substrate 12 through the release film 15. The support plate 16 is, for example, a glass plate, a ceramic plate, a resin plate, a semiconductor plate, or a metal plate. When the substrate 12 is a glass substrate, the support plate 16 is preferably a glass plate. On the other hand, when the support plate 16 is a resin plate or a metal plate, the reinforcement plate 14 can be easily bent and deformed, so that the reinforcement plate 14 and the substrate 12 can be easily separated.

The average linear expansion coefficient difference (absolute value) between the support plate 16 and the substrate 12 is appropriately set according to the dimensional shape and the like of the substrate 12, and is preferably, for example, 35 × 10 ⁻⁷ / ° C. or less. Here, the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R 3102) in a temperature range of 50 ° C. to 300 ° C.

  When the support plate 16 is a glass plate, the thickness C of the support plate 16 is, for example, 0.7 mm or less. Further, when the support plate 16 is a glass plate, the thickness C of the support plate 16 is preferably 0.4 mm or more in order to reinforce the substrate 12.

  The outer shape of the support plate 16 is preferably the same as or larger than the outer shape of the release film 15 as shown in FIG. 1 so that the support plate 16 can support the entire release film 15. .

  The release film 15 prevents the displacement of the substrate 12 until the release operation between the release film 15 and the substrate 12 is performed. The release film 15 is easily peeled from the substrate 12 by a peeling operation. Damage to the substrate 12 due to the peeling operation can be prevented.

  The release film 15 is formed so that the bonding force with the support plate 16 is relatively higher than the bonding force with the substrate 12. It is possible to prevent the laminate 10 from being peeled at an unintended position (between the release film 15 and the support plate 16) by the peeling operation.

  The resin of the release film 15 is not particularly limited. For example, examples of the resin of the release film 15 include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, and polyimide silicone resin. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  The thickness D of the release film 15 is not particularly limited, but when the release film 15 is a resin film, it is preferably 1 μm to 50 μm, more preferably 4 μm to 20 μm. By setting the thickness D of the release film 15 to 1 μm or more, the release film 15 is deformed so as to absorb the thickness of the bubbles and foreign objects when bubbles or foreign objects are mixed between the release film 15 and the substrate 12. it can. On the other hand, when the thickness D of the release film 15 is 50 μm or less, it is economical because the formation time of the release film 15 can be shortened and the resin of the release film 15 is not used more than necessary.

  The outer shape of the release film 15 is preferably the same as or larger than the outer shape of the substrate 12 as shown in FIG. 1 so that the release film 15 can support the entire substrate 12. When the outer shape of the release film 15 is larger than the outer shape of the substrate 12, the portion of the release film 15 that protrudes from the substrate 12 is bent and deformed, whereby the reinforcing plate 14 and the substrate 12 are gradually peeled off, and the peeling is performed smoothly. Is called.

  Note that the release film 15 may be composed of a plurality of types of resin films. In this case, the “thickness of the release film” means the total thickness of all the resin films.

  Next, the manufacturing method of the laminated board 10 is demonstrated. As a manufacturing method of the laminated board 10, there exist the following method (1)-(3), for example.

  (1) A fluid resin composition is applied on the support plate 16 and cured to form the release film 15, and then the substrate 12 is pressure-bonded onto the release film 15. Since the resin composition interacts with the support plate 16 when the resin composition is cured, the bonding force between the support plate 16 and the release film 15 tends to be higher than the bond strength between the release film 15 and the substrate 12.

  (2) A flowable resin composition is applied on a predetermined base material and cured to form a release film 15, and then the release film 15 is released from the predetermined base material to form a substrate in the form of a film. 12 and the support plate 16 are clamped. This is effective when the bonding force of the release film 15 after pressure bonding is low with respect to the substrate 12 and high with respect to the support plate 16. Before the contact with the release film 15, the surface of the substrate 12 or the support plate 16 may be surface-treated to make a difference in the bonding force after the press-bonding with the release film 15.

  (3) The resin composition is sandwiched between the substrate 12 and the support plate 16 and cured to form the release film 15. This is effective when the bonding strength of the resin composition after curing is low with respect to the substrate 12 and high with respect to the support plate 16. Before the contact with the resin composition, the surface of the substrate 12 or the support plate 16 may be surface-treated to make a difference in the bonding strength after curing of the resin composition.

  The pressure bonding in the methods (1) and (2) may be performed in an environment with a high degree of cleanliness. The atmospheric pressure at the time of pressure bonding may be atmospheric pressure, but is preferably a negative pressure lower than atmospheric pressure in order to suppress air entrainment. There are a roll type, a press type, and the like as a method of pressure bonding. The pressure bonding temperature may be higher than room temperature, but may be room temperature in order to prevent deterioration of the resin film as the release film 15.

  The resin composition to be the release film 15 may be cured by any mechanism of a condensation reaction type, an addition reaction type, an ultraviolet curable type, and an electron beam curable type. The addition reaction type resin composition is particularly preferable because it easily cures, has excellent peelability, and has high heat resistance.

  Further, the resin composition to be the release film 15 may be used in any form of a solvent type, an emulsion type, and a solventless type, but a solventless type is preferable from the viewpoint of productivity and environmental characteristics. Further, since the solventless resin composition does not contain a solvent that can foam during curing, the release film 15 with few defects can be obtained.

  As a silicone resin composition having a curing mechanism of addition reaction type and a usage form of solvent-free type, linear polyorganosiloxane having a vinyl group and methylhydrogen polysiloxane having a hydrosilyl group are used. There is something to include. This silicone resin composition is heated and cured in the presence of a platinum catalyst to form a silicone resin film.

  Examples of the method for applying the resin composition to be the release film 15 include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. These coating methods are appropriately selected according to the type of the resin composition.

The coating amount of the resin composition that becomes the release film 15 is appropriately selected according to the type of the resin composition. For example, in the case of the silicone resin composition, preferably from ^{1g / m 2 ~100g / m 2} , more preferably ^{5g / m 2 ~20g / m 2} .

  The curing conditions for the resin composition to be the release film 15 are appropriately selected according to the type of the resin composition. For example, as the silicone resin composition, when 2 parts by mass of a platinum-based catalyst is blended with respect to 100 parts by mass of the total amount of linear polyorganosiloxane and methylhydrogenpolysiloxane, the temperature heated in the atmosphere is It is 50 ° C to 250 ° C, preferably 100 ° C to 200 ° C. In this case, the reaction time is 5 minutes to 60 minutes, preferably 10 minutes to 30 minutes. If the curing conditions of the resin composition are the above reaction time range and reaction temperature range, the oxidative decomposition of the silicone resin does not occur at the same time, a low molecular weight silicone component is not generated, and the reinforcing plate and the substrate are peeled off. Resin hardly remains on the substrate side.

  Next, a method for processing the manufactured laminate will be described with reference to FIGS. 1 and 2 again. The processing method of a laminated board has a chamfering process which grinds the edge part of the laminated board 10 with the grindstone 30, as shown in FIG. 1 and FIG.

  The grindstone 30 is disc-shaped, and an annular grinding groove 32 is formed on the outer peripheral surface of the grindstone 30. The cross-sectional shape of the grinding groove 32 is, for example, a substantially trapezoidal shape, and may be a substantially isosceles trapezoidal shape. The groove width of the grinding groove 32 is gradually reduced toward the inside in the radial direction of the grindstone 30. A boundary portion between the bottom surface of the grinding groove 32 and each side surface of the grinding groove 32 has a curved surface shape that protrudes inward in the radial direction of the grindstone 30.

  In the chamfering step, first, as shown in FIG. 1, the laminated plate 10 is set so that the thickness direction of the laminated plate 10 is parallel to the center line of the grindstone 30. In this state, while rotating the grindstone 30 around the center line of the grindstone 30, the wall surface of the grinding groove 32 is pressed against the end of the laminated plate 10, and the end of the laminated plate 10 is ground with the grindstone 30. At this time, both side surfaces of the grinding groove 32 are scraped across the end portion of the laminated plate 10, and the bottom surface of the grinding groove 32 scrapes the end portion of the laminated plate 10. Since both side surfaces of the grinding groove 32 sandwich the end portion of the laminated plate 10, it is possible to prevent the positional deviation between the laminated plate 10 and the grindstone 30. In the chamfering step, as shown in FIG. 2, the grindstone 30 and the laminated plate 10 are relatively moved to grind at least a part of the outer periphery of the laminated plate 10.

  FIG. 3 is a cross-sectional view showing a force acting on a substrate from a grindstone in a chamfering process according to an embodiment of the present invention. As shown in FIG. 3, in the chamfering process, a force G acts on the substrate 12 from the grindstone 30. This force G acts in a direction perpendicular to the center line of the grindstone 30 (that is, the thickness direction of the laminated plate 10). Of this force G, a micro-crack can occur on the ground surface of the substrate 12 due to the component force G1 perpendicular to the wall surface of the grinding groove 32. The smaller the angle θ formed by the interface between the substrate 12 and the reinforcing plate 14 and the ground surface of the substrate 12, the smaller the component force G1 that can cause microcracks.

  In this embodiment, the angle θ formed by the interface between the substrate 12 and the reinforcing plate 14 and the grinding surface of the substrate 12 is 30 ° or less, and the component force G1 that can cause microcracks on the grinding surface of the substrate 12. Is sufficiently small and the substrate 12 is not easily chipped.

  The interface between the substrate 12 and the reinforcing plate 14 is ground not on the bottom surface of the grinding groove 32 but on one side surface of the grinding groove 32 as shown in FIG. 1 so as to be inclined with respect to the grinding surface of the substrate 12. Good. In this case, the ground surface of the substrate 12 is composed of only a flat portion.

  In the present embodiment, the interface between the substrate 12 and the reinforcing plate 14 is ground on one side surface of the grinding groove 32, but a curved boundary portion between one side surface of the grinding groove 32 and the bottom surface of the grinding groove 32. It may be ground with. In this case, the ground surface of the substrate 12 includes a flat portion and a curved portion. The angle formed by the tangent line of the curved portion and the interface between the substrate 12 and the reinforcing plate 14 may be 30 ° or less.

  Further, the angle θ formed by the interface between the substrate 12 and the reinforcing plate 14 and the ground surface of the substrate 12 is larger than 26 °. Since the portion where the interface between the substrate 12 and the reinforcing plate 14 intersects with the ground surface of the substrate 12 is not too sharp, the substrate 12 and the reinforcing plate 14 are peeled off, so that the substrate 12 and the reinforcing plate 14 are thin. When the blade is inserted, the substrate 12 is not easily chipped.

  The grinding surface (hereinafter, simply referred to as “grinding surface of the laminated plate 10”) of the laminated plate 10 ground with the grindstone 30 includes, for example, inclined portions extending obliquely from the front and back surfaces of the laminated plate 10 and the surface of the laminated plate 10, respectively. And a vertical portion perpendicular to the back surface, and a curved surface portion formed between each inclined portion and the vertical portion.

  The inclined portion extending obliquely from the front surface of the processed laminated plate 10 and the inclined portion extending obliquely from the rear surface of the processed laminated plate 10 are located on the center plane between the front surface and the rear surface of the processed laminated plate 10. It may be symmetrical.

  The cross-sectional shape of the curved surface portion of the grinding surface of the laminated plate 10 is a convex shape toward the inside in the radial direction of the grindstone 30, for example, an arc shape. The curvature radius R of the curved surface portion of the ground surface of the laminate 10 is, for example, 0.05 mm to 0.20 mm.

  The vertical part of the grinding surface of the laminated plate 10 has a dimension F in the thickness direction of the laminated plate 10 of, for example, 0.05 mm to 0.30 mm.

  By the way, the processed laminated plate 10 may be placed on the stage with the reinforcing plate 14 facing downward and may come into contact with a positioning block provided on the stage.

  In the present embodiment, the reinforcing plate 14 protrudes outward from the substrate 12 in the thickness direction view of the processed laminated plate 10, and the substrate 12 does not come into contact with the positioning block, so that the substrate 12 is not easily damaged. The protruding dimension E of the reinforcing plate 14 is, for example, 0.05 mm to 0.30 mm.

  Next, a method for manufacturing an electronic device using the processed laminated plate 10 will be described. The electronic device manufacturing method may include a step of forming a functional film on the processed substrate 12 of the laminated plate 10 and a step of peeling the substrate 12 and the reinforcing plate 14 on which the functional film is formed.

  In forming the functional film, a lithography technique or an etching technique is used, and a resist solution may be used. The resist solution may spread to the ground surface of the processed laminated plate 10.

  Since the ground surface of the laminated board 10 of the present embodiment is not chipped near the interface between the substrate 12 and the reinforcing plate 14, it is easy to remove the resist residue. Since the residue becomes a source of dust generation by heat treatment, the yield of the electronic device is improved by reducing the residue.

  The substrate 12 and the reinforcing plate 14 are peeled off by, for example, inserting a thin blade between the substrate 12 and the reinforcing plate 14 to form a gap serving as a starting point of peeling, and then holding the substrate 12 flat, This is performed by sequentially bending and deforming 14 from the peeling starting point side to the opposite side.

  Next, a method for manufacturing a liquid crystal panel as an electronic device will be described. The liquid crystal panel manufacturing method includes, for example, a TFT substrate manufacturing process, a CF substrate manufacturing process, an assembling process, and a peeling process.

  In the TFT substrate manufacturing step, a thin film transistor (TFT) or the like is formed on the processed substrate 12 of the laminated plate 10 to manufacture a TFT substrate. For manufacturing the TFT substrate, a lithography technique or an etching technique is used, and a resist solution is used.

  In the CT substrate manufacturing step, a CF substrate is manufactured by forming a transparent conductive film, a color filter (CF), or the like on the substrate 12 of another processed laminated plate 10. For the production of the CF substrate, a lithography technique is used, and a resist solution is used.

  The assembly process includes a process of sealing a liquid crystal material between the TFT substrate and the CF substrate. As a method for injecting a liquid crystal material between the TFT substrate and the CF substrate, there is a reduced pressure injection method or a drop injection method.

  In the reduced pressure injection method, for example, first, a large panel is manufactured by bonding a TFT substrate and a CF substrate through a sealing material and a spacer material. The produced large panel is cut into a plurality of cells. Next, the inside of each cell is evacuated, and a liquid crystal material is injected into each cell from the injection hole provided on the side surface of each cell, and then the injection hole is sealed. Subsequently, a liquid crystal panel is manufactured by attaching a polarizing plate to each cell.

  In the dropping injection method, for example, first, a liquid crystal material is dropped on one of the TFT substrate and the CF substrate, and then the TFT substrate and the CF substrate are bonded to each other through a sealing material and a spacer material, thereby forming a large panel. Make it. The produced large panel is cut into a plurality of cells. Subsequently, a liquid crystal panel is manufactured by attaching a polarizing plate to each cell.

  In the peeling step, the substrate 12 and the reinforcing plate 14 are peeled off. The peeling process may be performed after the TFT substrate manufacturing process and the CF substrate manufacturing process, before the assembly process, or during or after the assembly process.

  For example, when the peeling process is performed in the middle of the assembly process by the vacuum injection method, the peeling process is performed after the large panel is manufactured and before the large panel is cut, or after the liquid crystal material is sealed and the polarizing plate is applied. May be done before application.

  In addition, when the peeling process is performed in the middle of the assembly process by the appropriate injection method, the peeling process is performed after the large panel is manufactured and before the large panel is cut, or after the large panel is cut and the polarizing plate It may be performed before pasting.

  Next, a method for manufacturing an organic EL panel (OLED) as an electronic device will be described. The manufacturing method of an organic EL panel includes, for example, an organic EL element forming process, a bonding process, and a peeling process.

  In the organic EL element forming step, an organic EL element is formed on the processed substrate 12 of the laminated plate 10. An organic EL element consists of a transparent electrode layer, a positive hole transport layer, a light emitting layer, an electron carrying layer etc., for example. For the formation of the organic EL element, a photolithography technique is used, and a resist solution is used.

  In the bonding step, the substrate on which the organic EL element is formed and the counter substrate are bonded together. The substrate on which the organic EL element is formed may be cut into a plurality of cells, and each cell and the counter substrate may be bonded together.

  In the peeling step, the substrate 12 and the reinforcing plate 14 are peeled off. The peeling step may be performed, for example, after the organic EL element forming step and before the bonding step, or during or after the bonding step.

  Next, the manufacturing method of the solar cell as an electronic device is demonstrated. The manufacturing method of a solar cell has a solar cell element formation process and a peeling process.

  In the solar cell element forming step, a solar cell element is formed on the processed substrate 12 of the laminated plate 10. A solar cell element consists of a transparent electrode layer, a semiconductor layer, etc., for example. For the formation of the solar cell element, a photolithography technique is used, and a resist solution is used.

  In the peeling step, the substrate 12 and the reinforcing plate 14 are peeled off. A peeling process may be performed after a solar cell element formation process, for example.

[Test Examples 1 to 4]
In Test Examples 1 to 4, a laminate is prepared by applying a resin composition having fluidity on a support plate and curing it to form a release film, and pressing a glass substrate on the formed release film. did. The laminates of Test Examples 1 to 4 have the same configuration.

  As the glass plate of the support plate, an alkali-free glass plate (920 mm × 730 mm × 0.5 mm thickness) manufactured by Asahi Glass Co., Ltd. was used.

  As the resin composition, a mixture of 100 parts by mass of a solvent-free addition reaction type silicone (manufactured by Shin-Etsu Silicone, KNS-320A) and 2 parts by mass of a platinum-based catalyst (manufactured by Shin-Etsu Silicone, CAT-PL-56) was used. . This mixture was applied onto a glass plate with a die coater and heat-treated at 220 ° C. for 30 minutes to form a release film (920 mm × 730 mm × thickness 8 μm).

  As the glass substrate, an alkali-free glass plate (920 mm × 730 mm × thickness 0.1 mm) manufactured by Asahi Glass Co., Ltd. was used.

  In Test Examples 1 to 4, each of the four sides of the substantially rectangular laminated plate was ground to a size shown in Table 1 with a grindstone, and whether or not chipping occurred in the glass substrate was examined with a microscope. As the abrasive grains of the grindstone, diamond abrasive grains having an average particle diameter of 30 μm were used. The cross-sectional shape of the grinding groove of the grindstone was a substantially isosceles trapezoid. A case where a chip having a length of 0.03 mm or more does not occur on the ground surface of the glass substrate is “◯”, and a case where a chip having a length of 0.03 mm or more and less than 0.05 mm is generated on the ground surface of the glass substrate. “Δ”, and “x” when a chip having a length of 0.05 mm or more occurred on the ground surface of the glass substrate.

  Next, in Test Examples 1 to 4, with the reinforcing plate facing downward, the laminated plate was placed on the stage, and the laminated plate was made to collide with the positioning block provided on the stage at a speed of 100 mm / s. It was examined with a microscope whether chipping occurred at the corner between the upper surface and the ground surface. The collision surface with the laminated plate in the positioning block was perpendicular to the upper surface of the stage. “○” indicates that no chipping with a length of 0.03 mm or more occurred in the corner between the upper surface of the glass substrate and the ground surface, and the length of 0.03 mm at the corner between the upper surface of the glass substrate and the ground surface. The case where a chip having a length of less than 0.05 mm occurs is “Δ”, and the case where a chip having a length of 0.05 mm or more is generated at the corner between the upper surface and the ground surface of the glass substrate is “X”.

  Next, in Test Examples 1 to 4, the glass substrate and the reinforcing plate were peeled off, and it was examined whether or not the glass substrate was broken during peeling. In the peel test, a thin blade is inserted between the glass substrate and the reinforcing plate in the four corners of the laminated plate ground with the grindstone so as not to collide with the positioning block, thereby forming a gap as a separation starting point. The reinforcing plate was sequentially bent and deformed from the peeling starting side to the opposite side while holding the glass substrate flat. The case where the substrate was not cracked during peeling was indicated as “◯”, and the case where the substrate was cracked was indicated as “x”.

  The test results are shown in Table 1. In Table 1, A is the thickness of the glass substrate, B is the thickness of the reinforcing plate, C is the thickness of the glass plate as the support plate, D is the thickness of the silicone film as the release film, and θ is the glass substrate and reinforcement. The angle between the interface with the plate and the ground surface of the glass substrate is shown. In Table 1, R is the radius of curvature of the curved portion of the grinding surface of the laminated plate, E is the protruding dimension of the reinforcing plate from the glass substrate in the thickness direction of the processed laminated plate, and F is the grinding of the laminated plate. The dimension in the plate | board thickness direction of a laminated board of the vertical part of a surface is each represented.

表１に示すように、ガラス基板と補強板との界面と、ガラス基板の研削面とのなす角θが３０°以下であれば、研削時の欠けがほとんど発生しない。また、加工された積層板の板厚方向視での補強板のガラス基板からの突出寸法Ｅが０．０５ｍｍ以上であれば、位置決め時の欠けがほとんど発生しない。また、ガラス基板と補強板との界面と、ガラス基板の研削面とのなす角θが２６°よりも大きければ、剥離時の割れがほとんど発生しない。

As shown in Table 1, if the angle θ formed by the interface between the glass substrate and the reinforcing plate and the ground surface of the glass substrate is 30 ° or less, chipping during grinding hardly occurs. Moreover, if the protrusion dimension E from the glass substrate of the reinforcing plate in the thickness direction view of the processed laminated plate is 0.05 mm or more, chipping at the time of positioning hardly occurs. Further, if the angle θ formed by the interface between the glass substrate and the reinforcing plate and the ground surface of the glass substrate is larger than 26 °, almost no cracking occurs during peeling.

[Test Examples 5 to 8]
In Test Examples 5 to 8, tests similar to Test Examples 1 to 4 were performed except that an alkali-free glass plate (920 mm x 730 mm x thickness 0.2 mm) manufactured by Asahi Glass Co., Ltd. was used as the glass substrate. The test results are shown in Table 2.

表２に示すように、ガラス基板と補強板との界面と、ガラス基板の研削面とのなす角θが３０°以下であれば、研削時の欠けがほとんど発生しない。また、加工された積層板の板厚方向視での補強板のガラス基板からの突出寸法Ｅが０．０５ｍｍ以上であれば、位置決め時の欠けがほとんど発生しない。また、ガラス基板と補強板との界面と、ガラス基板の研削面とのなす角θが２６°よりも大きければ、剥離時の割れがほとんど発生しない。

As shown in Table 2, if the angle θ formed by the interface between the glass substrate and the reinforcing plate and the ground surface of the glass substrate is 30 ° or less, chipping during grinding hardly occurs. Moreover, if the protrusion dimension E from the glass substrate of the reinforcing plate in the thickness direction view of the processed laminated plate is 0.05 mm or more, chipping at the time of positioning hardly occurs. Further, if the angle θ formed by the interface between the glass substrate and the reinforcing plate and the ground surface of the glass substrate is larger than 26 °, almost no cracking occurs during peeling.

  As mentioned above, although the processing method of a laminated board, the Example of the processed laminated board, etc. were demonstrated, this invention is not limited to the said Example etc., In the range of the summary of this invention described in the claim Various modifications and improvements are possible.

  For example, in the above-described embodiment, the grinding surface of the laminated plate 10 includes an inclined portion extending obliquely from the front surface and the back surface of the laminated plate 10, a vertical portion perpendicular to the front surface and the back surface of the laminated plate 10, and each inclined surface. The curved surface portion is formed between the portion and the vertical portion, but the configuration may be various. For example, the grinding surface of the laminated plate may be constituted by an inclined portion that extends obliquely from the front surface and the back surface of the laminated plate 10 and a curved surface portion formed between the two inclined portions. The curved surface portion is, for example, an arc surface shape, and protrudes outward from the inclined portion in the thickness direction of the laminated plate 10.

  Moreover, in the said Example etc., the inclination part extended diagonally from the surface of the processed laminated board 10 and the inclination part extended diagonally from the back surface of the processed laminated board 10 are the surface of the processed laminated board 10 and Although it is symmetrical with respect to the center plane between the back surface, it may not be symmetrical.

DESCRIPTION OF SYMBOLS 10 Laminated board 12 Board | substrate 14 Reinforcement board 15 Release film 16 Support board 30 Grinding stone 32 Grinding groove

Claims (8)

A method of processing a laminated plate having a substrate and a reinforcing plate releasably coupled to the substrate,
Having a chamfering step of grinding the end of the laminate with a grindstone;
A method for processing a laminated board, wherein an angle formed by an interface between the substrate and the reinforcing plate and a ground surface of the substrate ground by the grindstone is larger than 26 ° and not larger than 30 °. The substrate is a glass substrate;
The said reinforcement board is a processing method of the laminated board of Claim 1 containing the resin film couple | bonded with the said glass substrate so that peeling is possible, and the glass plate which supports the said glass substrate through this resin film. The substrate is a glass substrate;
The said reinforcement board is a processing method of the laminated board of Claim 1 containing the glass plate couple | bonded with the said glass substrate so that peeling is possible. The substrate is a glass substrate;
The said reinforcement board is a processing method of the laminated board of Claim 1 containing the inorganic film couple | bonded with the said glass substrate so that peeling is possible, and the glass plate which supports the said glass substrate through this inorganic film. A processed laminate having a substrate and a reinforcing plate releasably coupled to the substrate, and having a grinding surface ground with a grindstone at an end,
A processed laminated plate, wherein an angle formed by an interface between the substrate and the reinforcing plate and a ground surface of the substrate ground by the grindstone is larger than 26 ° and not larger than 30 °. The substrate is a glass substrate;
The laminated plate according to claim 5, wherein the reinforcing plate includes a resin film that is detachably coupled to the glass substrate, and a glass plate that supports the glass substrate via the resin film. The substrate is a glass substrate;
The laminated plate according to claim 5, wherein the reinforcing plate includes a glass plate that is detachably coupled to the glass substrate. The substrate is a glass substrate;
The laminated plate according to claim 5, wherein the reinforcing plate includes an inorganic film that is detachably bonded to the glass substrate, and a glass plate that supports the glass substrate via the inorganic film.

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