JP3202718B2 - Display device manufacturing jig and display device manufacturing method using the same - Google Patents
Display device manufacturing jig and display device manufacturing method using the sameInfo
- Publication number
- JP3202718B2 JP3202718B2 JP4484899A JP4484899A JP3202718B2 JP 3202718 B2 JP3202718 B2 JP 3202718B2 JP 4484899 A JP4484899 A JP 4484899A JP 4484899 A JP4484899 A JP 4484899A JP 3202718 B2 JP3202718 B2 JP 3202718B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- product
- display device
- manufacturing
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表示装置製造用治
具及びそれを用いた表示装置の製造方法に関し、特にガ
ラス基板を用いた液晶表示体（以下、ＬＣＤという、Ｌ
ｉｑｕｉｄ Ｃｒｙｓｔａｌ Ｄｉｓｐｌａｙ）又はＰ
ＤＰ（Ｐｌａｓｍａ Ｄｉｓｐｌａｙ Ｐａｎｅｌ）の
製品用のガラス基板の強度を補強する表示装置製造用治
具及びそれを用いた表示装置の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for manufacturing a display device and a method for manufacturing a display device using the same, and more particularly to a liquid crystal display (hereinafter referred to as an LCD) using a glass substrate.
liquid Crystal Display) or P
The present invention relates to a display device manufacturing jig for reinforcing the strength of a glass substrate for a DP (Plasma Display Panel) product, and a display device manufacturing method using the same.
【０００２】[0002]
【従来の技術】本発明を適用する、ＬＣＤ又はＰＤＰは
パソコンのモニターあるいはテレビの画面として使用さ
れている。2. Description of the Related Art An LCD or PDP to which the present invention is applied is used as a monitor of a personal computer or a screen of a television.
【０００３】一般に、このＬＣＤ又はＰＤＰの製造方法
は、ＬＣＤを例にすると、図７の工程図に示すように、
ＴＦＴ（Ｔｈｉｎ Ｆｉｌｍ Ｔｒａｎｓｉｓｔｏｒ）
用ガラス基板１上にＴＦＴ駆動トランジスタ７を形成し
（実際のＴＦＴ駆動トランジスタの数量は例えば３００
万個程度である）、ＴＦＴ駆動トランジスタ７が形成さ
れているＴＦＴガラス基板１と光に色を付けるためのカ
ラーフィルター４をＡｇペースト５にて張り合わせ、こ
の間にＴＦＴ用ガラス基板１上のデバイス電界で光の透
過をコントロールできる液晶剤６を注入し挟み込みＡｇ
ペースト５にて封止する。そして、更にＴＦＴ駆動トラ
ンジスタ７を駆動する駆動ドライバー８及び光を発生す
る蛍光灯９を組み込み、カラー液晶ディスプレイ１０が
完成する。In general, this LCD or PDP manufacturing method is, as shown in the process chart of FIG.
TFT (Thin Film Transistor)
TFT driving transistors 7 are formed on the glass substrate 1 for use (the actual number of TFT driving transistors is, for example, 300
A TFT glass substrate 1 on which a TFT drive transistor 7 is formed and a color filter 4 for coloring light with an Ag paste 5, and a device electric field on the TFT glass substrate 1. Inject and sandwich liquid crystal agent 6 that can control light transmission with Ag
Seal with paste 5. Further, a driving driver 8 for driving the TFT driving transistor 7 and a fluorescent lamp 9 for generating light are incorporated, and a color liquid crystal display 10 is completed.
【０００４】本発明は、このＬＣＤ又はＰＤＰの、ＴＦ
Ｔ用ガラス基板，カラーフィルター用ガラス基板又はＰ
ＤＰ用ガラス基板の強度を補強する製造用治具及びそれ
を用いたＬＣＤ又はＰＤＰの製造方法についてのもので
ある。According to the present invention, the TF of the LCD or PDP is
Glass substrate for T, glass substrate for color filter or P
The present invention relates to a manufacturing jig for reinforcing the strength of a DP glass substrate and a method for manufacturing an LCD or PDP using the same.
【０００５】従来のＬＣＤ又はＰＤＰの製造方法では、
ガラス基板は１枚の基板から製造されていた。しかし、
ガラス基板を取り巻く環境は次第に変化し、ＬＣＤを例
にすると、まず第１に、１枚のガラス基板から１つのＬ
ＣＤを製造していたのではコストが高くついていたの
で、価格競争の中で次第に１枚の基板から複数のＬＣＤ
を１度に製造するようになり、ガラス基板の大型化が進
んだ。また、ＬＣＤ自体の大きさも大型化して更に大型
化が進んだ。そして第２に、ノートパソコン等のＬＣＤ
はガラス基板の軽量化のニーズが要求されるようになっ
た。この２つの結果として、ガラス基板は大型且つ薄型
への要求を満足する必要に迫られてきた。In a conventional method of manufacturing an LCD or PDP,
Glass substrates were manufactured from a single substrate. But,
The environment surrounding a glass substrate changes gradually, and taking an LCD as an example, first of all, one glass substrate is replaced by one L
Since manufacturing CDs was expensive, multiple LCDs were gradually replaced from one substrate in a price competition.
Was manufactured at one time, and the size of the glass substrate was increased. In addition, the size of the LCD itself has increased, and the size of the LCD has further increased. Second, LCDs for notebook computers
In recent years, the need to reduce the weight of glass substrates has been required. As a result of these two factors, it has been necessary to satisfy the requirements for a large and thin glass substrate.
【０００６】このことを従来のガラス基板について具体
的に説明すると、図８の説明図に示すように、従来のガ
ラス基板ではガラス基板サイズは３００ｘ３５０ｘ１．
１ｔｍｍが標準であり、ガラス基板割れ不良率（以下、
基板割れ不良率という）は０．０２％であった。これ以
上ガラス基板を薄型化（軽量化）したり、大型化したり
すると、ガラス基板の撓みが大きくなり、製造歩留まり
を落としたり、最悪の場合ガラス基板が割れたりした。
ガラス基板サイズを３６０ｘ４６５ｘ０．７ｔｍｍに移
行した際は、基板割れ不良率は０．７％に増加し、更
に、ガラス基板サイズを３６０ｘ４６５ｘ０．６５ｔｍ
ｍに移行した際には、工程内製造装置の改造を施し対応
したが、基板割れ不良率は２．０％に増加した。そして
ついに、ガラス基板サイズが７００ｘ８００ｘ０．５ｔ
ｍｍでは、ガラス基板の撓み量が２０ｍｍ以上になり、
自重で割れてしまい現状での生産は無理であった。[0008] This will be described in detail with respect to a conventional glass substrate. As shown in an explanatory view of FIG. 8, the size of the conventional glass substrate is 300 × 350 × 1.
1 tmm is standard, and the glass substrate cracking defect rate (hereinafter, referred to as
The substrate cracking defect rate) was 0.02%. If the glass substrate is made thinner (lighter) or larger in size, the glass substrate will bend more, lowering the manufacturing yield or, in the worst case, breaking the glass substrate.
When the glass substrate size is shifted to 360 × 465 × 0.7 tmm, the substrate cracking defect rate increases to 0.7%, and further, the glass substrate size is changed to 360 × 465 × 0.65 tm.
At the time of shifting to m, the in-process manufacturing equipment was remodeled to cope with it, but the substrate cracking defect rate increased to 2.0%. And finally, the glass substrate size is 700x800x0.5t
mm, the amount of deflection of the glass substrate becomes 20 mm or more,
It was broken by its own weight and production was impossible at present.
【０００７】つまり、ガラス基板の強度は一定であるの
に、ＬＣＤやＰＤＰ製品の軽量化や、コスト低減で多面
取り（複数取り）する為に、ガラス基板は薄型化し、且
つ大型化してきている。その為、ガラス基板本来の強度
を越えてしまうと、ガラス基板は撓んだり、割れてしま
い、ガラス基板の基板割れ不良率が高くなり、場合によ
っては生産が出来ないという問題が有る。In other words, although the strength of the glass substrate is constant, the glass substrate is becoming thinner and larger in order to reduce the weight of LCD and PDP products and to obtain multiple (multiple) products at a reduced cost. . Therefore, if the strength exceeds the intrinsic strength of the glass substrate, the glass substrate bends or breaks, and the defect rate of the glass substrate becomes high.
【０００８】[0008]
【発明が解決しようとする課題】そこでこの問題を解決
するために、例えば特開平９−１０５８９６号公報（従
来例１）、特開平８−８６９９３号公報（従来例２）及
び特開昭５８−５４３１６号公報（従来例３）には、図
９の模式図に示す、液晶表示素子製造用治具及びそれを
用いた液晶表示素子の製造方法（従来例１）、基板搬送
用治具及びそれを用いた液晶表示素子の製造方法（従来
例２）及び液晶表示装置の製造方法（従来例３）があ
る。これら各従来例は、製品用のガラス基板１１をガラ
ス基板やプラスチック基板である支持体（補強用基板）
１２に粘着剤１３で貼り付けして補強し、この貼り付け
補強した状態で液晶表示素子又は液晶表示装置の製造工
程を流す製造用治具，搬送用治具及びそれを用いた製造
方法が示されている。In order to solve this problem, for example, JP-A-9-105896 (conventional example 1), JP-A-8-86993 (conventional example 2), and No. 54316 (conventional example 3) discloses a jig for manufacturing a liquid crystal display element and a method for manufacturing a liquid crystal display element using the same (conventional example 1), a jig for transporting a substrate, and a jig shown in the schematic diagram of FIG. And a method of manufacturing a liquid crystal display device (Conventional Example 3). In each of these conventional examples, a glass substrate 11 for a product is replaced with a support (a reinforcing substrate) which is a glass substrate or a plastic substrate.
12 shows a production jig, a transportation jig, and a production method using the same, which are adhered and reinforced with an adhesive 13 and flow through the production process of a liquid crystal display element or a liquid crystal display device in a state where the adhesive 13 is reinforced. Have been.
【０００９】この各従来例は、製品用のガラス基板１１
をガラス基板やプラスチック基板である支持体（補強用
基板）１２に粘着剤１３で貼り付けして、ガラス基板１
１の強度を補強することにより、ガラス基板１１が薄型
化し、且つ大型化しても、液晶表示素子又は液晶表示装
置の製造工程でガラス基板１１が撓んだり、割れてしま
うことを防止する点において効果を奏している。In each of the conventional examples, a glass substrate 11 for a product is used.
Is adhered to a support (reinforcing substrate) 12, which is a glass substrate or a plastic substrate, with an adhesive 13, and the glass substrate 1
In order to prevent the glass substrate 11 from being bent or broken in the manufacturing process of the liquid crystal display element or the liquid crystal display device even when the glass substrate 11 is thinned and increased in size by reinforcing the strength of (1). It has an effect.
【００１０】しかしながら、この各従来例では２項目の
問題が生ずる。まず第１に、ガラス基板１１と支持体
（補強用基板）１２の貼り付けに粘着剤１３を使用する
ため、粘着剤１３は製造工程内でのパーティクル、放出
ガス、液中溶解による製造工程内汚染により液晶表示素
子又は液晶表示装置の製造歩留を落してしまう。また、
製造工程中の熱処理、真空処理、エッチング処理で粘着
剤１３が剥がれてしまうという問題が生ずる。そしてま
た第２に、支持体（補強用基板）１２としてプラスチッ
ク基板を使用した場合には、支持体（補強用基板）１２
が製造工程内で熱変形を起こしてしまうという問題が生
ずる。However, in each of these conventional examples, two problems occur. First, since the adhesive 13 is used for attaching the glass substrate 11 and the support (reinforcing substrate) 12, the adhesive 13 is used in the manufacturing process due to particles, released gas, and dissolution in liquid during the manufacturing process. The contamination lowers the production yield of the liquid crystal display element or the liquid crystal display device due to the contamination. Also,
There is a problem that the adhesive 13 is peeled off by heat treatment, vacuum treatment, and etching treatment during the manufacturing process. Secondly, when a plastic substrate is used as the support (reinforcement substrate) 12, the support (reinforcement substrate) 12
However, there is a problem that thermal deformation occurs in the manufacturing process.
【００１１】従って、本発明の目的は、ガラス基板が薄
型化し、且つ大型化しても、ガラス基板の強度を補強で
き、製造工程でガラス基板が撓んだり、割れてしまうこ
とを防止し、かつ各従来例のような粘着剤及び補強基板
としてプラスチック基板を使用した場合の問題を生じな
い表示装置製造用治具及びそれを用いた表示装置の製造
方法を提供することにある。Accordingly, an object of the present invention is to provide a glass substrate which can be reinforced even if the glass substrate is thinned and enlarged, preventing the glass substrate from being bent or broken in a manufacturing process, and An object of the present invention is to provide a display device manufacturing jig which does not cause a problem when a plastic substrate is used as an adhesive and a reinforcing substrate as in each conventional example, and a method for manufacturing a display device using the same.
【００１２】[0012]
【課題を解決するための手段】本発明の表示装置製造用
治具は、ガラス基板を用いた表示装置の製造における、
前記製品用のガラス基板を張り合わせて一体化し、前記
製品用のガラス基板の強度を補強して、前記表示装置を
製造する治具において、前記製造用治具が前記製品と同
材質のガラス基板を使用した補強用基板と、前記製品用
のガラス基板と前記補強用基板の張り合わせに用いるＯ
リングとで構成され、製造後に表示装置から取り除かれ
ることを特徴とする。According to the present invention, there is provided a display device manufacturing jig for manufacturing a display device using a glass substrate.
The glass substrate for the product is bonded and integrated, and the strength of the glass substrate for the product is reinforced, and in a jig for manufacturing the display device, the manufacturing jig includes a glass substrate of the same material as the product. The reinforcing substrate used, and O used for bonding the glass substrate for the product and the reinforcing substrate
Ring and is removed from the display device after manufacture
Characterized in that that.
【００１３】また、前記表示装置が、液晶表示体又はＰ
ＤＰである。The display device may be a liquid crystal display or a P display.
DP.
【００１４】また、前記Ｏリングが、前記補強用ガラス
基板に印刷あるいはパターンニングされたフッ素系高温
硬化樹脂である。Further, the O-ring is a fluorine-based high-temperature curing resin printed or patterned on the reinforcing glass substrate.
【００１５】本発明の表示装置の製造方法は、ガラス基
板を用いた表示装置の製造方法において、前記製品と同
材質のガラス基板を使用した補強用基板と、前記製品用
のガラス基板と前記補強用ガラス基板の張り合わせに用
いるＯリングとを用い、ガラス基板同士の静電吸着力及
び真空吸着力を利用して、前記製品用のガラス基板を前
記補強用ガラス基板に張り合わせて一体化し、前記製品
用のガラス基板の強度を補強して、前記製品用のガラス
基板を用いた表示装置を製造することを特徴とする。According to a method of manufacturing a display device of the present invention, there is provided a method of manufacturing a display device using a glass substrate, comprising: a reinforcing substrate using a glass substrate of the same material as the product; a glass substrate for the product; Using an O-ring used for bonding the glass substrates for use, the glass substrate for the product is bonded to the reinforcing glass substrate and integrated using the electrostatic attraction force and vacuum suction force between the glass substrates, A display device using the glass substrate for the product is manufactured by reinforcing the strength of the glass substrate for the product.
【００１６】また、前記表示装置が、液晶表示体又はＰ
ＤＰである。The display device may be a liquid crystal display or a P display.
DP.
【００１７】また、前記補強用ガラス基板として前記製
品用のガラス基板を使用し、前記製品用のガラス基板同
士を張り合わせ、張り合わせた前記製品用のガラス基板
の両表面で、製品を両面に製造する。Further, a glass substrate for the product is used as the reinforcing glass substrate, and the glass substrates for the product are bonded to each other, and the product is manufactured on both surfaces on both surfaces of the bonded glass substrate for the product. .
【００１８】また、複数枚の前記製品用のガラス基板を
前記補強用ガラス基板の片面または両面に配置し、前記
製品用のガラス基板を前記補強用ガラス基板に各々張り
合わせて、複数の製品を製造する。Further, a plurality of products glass substrates are arranged on one or both sides of the reinforcing glass substrate, and the product glass substrates are bonded to the reinforcing glass substrate, respectively, to produce a plurality of products. I do.
【００１９】このような本発明によれば、補強用ガラス
基板を用いることにより、製品用のガラス基板が薄型化
し、且つ大型化しても、製品用のガラス基板の強度を補
強でき、液晶表示体またはＰＤＰの製造工程で製品用の
ガラス基板が撓んだり、割れてしまうことを防止でき
る。According to the present invention, by using the reinforcing glass substrate, the strength of the product glass substrate can be reinforced even if the product glass substrate is made thinner and larger, and the liquid crystal display is provided. Alternatively, it is possible to prevent a glass substrate for a product from being bent or broken in a PDP manufacturing process.
【００２０】[0020]
【発明の実施の形態】次に、本発明の表示装置製造用治
具及びそれを用いた表示装置の製造方法の第１の実施の
形態について図面を参照して詳細に説明する。ここでは
ＬＣＤの製造について説明する。図１は本発明の第１の
実施形態を製造工程順に説明する工程図、図２は図１の
第１の実施形態の一部製造工程を工程順に説明する概略
図である。図１に於ける（ａ）〜（ｉ）および図２に於
ける（ａ）〜（ｄ）は各製造工程を示し、図１に於ける
（ａ）〜（ｄ）と図２に於ける（ａ）〜（ｄ）は同じ製
造工程を示し、以下説明における（ａ）等はその各製造
工程を示している。Next, a first embodiment of a display device manufacturing jig and a display device manufacturing method using the same according to the present invention will be described in detail with reference to the drawings. Here, the manufacture of the LCD will be described. FIG. 1 is a process diagram for explaining a first embodiment of the present invention in the order of manufacturing steps, and FIG. 2 is a schematic diagram for explaining a partial manufacturing process of the first embodiment of FIG. 1 in the order of steps. (A) to (i) in FIG. 1 and (a) to (d) in FIG. 2 show respective manufacturing steps, and (a) to (d) in FIG. 1 and FIG. (A) to (d) show the same manufacturing steps, and (a) and the like in the following description show the respective manufacturing steps.
【００２１】図１及び従来技術を示す図７に示すよう
に、本実施形態のＬＣＤであるカラー液晶ディスプレイ
１０は、製品用のＴＦＴ用ガラス基板１、ＴＦＴ用ガラ
ス基板１に張り合わせて強度を補強する補強用ガラス基
板２、ＴＦＴ用ガラス基板１と補強用ガラス基板２を張
り合わせるために用いるＯリング３、ＴＦＴ用ガラス基
板１上に形成されるＴＦＴ駆動トランジスタ７、光に色
を付ける為のカラーフィルター４、ＴＦＴ用ガラス基板
１とカラーフィルター４を張り合わせて封止するＡｇペ
ースト５、張り合わせたＴＦＴ用ガラス基板１とカラー
フィルター４の間に注入し挟み込みＴＦＴ用ガラス基板
１上のデバイス電界で光の透過をコントロールできる液
晶剤６、ＴＦＴ駆動トランジスタ７を駆動する駆動ドラ
イバー８及び光を発生する蛍光灯９から構成されてい
る。As shown in FIG. 1 and FIG. 7 showing the prior art, a color liquid crystal display 10 which is an LCD according to the present embodiment is reinforced by bonding to a glass substrate 1 for a product TFT and a glass substrate 1 for a TFT. A glass substrate for reinforcement 2, an O-ring 3 for bonding the glass substrate for TFT 1 to the glass substrate 2 for reinforcement, a TFT driving transistor 7 formed on the glass substrate 1 for TFT, for coloring light. Ag paste 5 for sealing the color filter 4, the glass substrate 1 for TFT and the color filter 4 and sealing them, and injecting and sandwiching between the glass substrate 1 for TFT and the color filter 4 for bonding by the device electric field on the glass substrate 1 for TFT. A liquid crystal agent 6 that can control the transmission of light, a driving driver 8 that drives a TFT driving transistor 7, and a light emitting device. And a fluorescent lamp 9.
【００２２】そして、本実施形態の構成の一部を成し、
表示装置製造用治具を構成し、従来例の構成とは相違す
る、補強用ガラス基板２及びＯリング３について、更に
説明する。Then, it constitutes a part of the configuration of the present embodiment,
The reinforcing glass substrate 2 and the O-ring 3, which constitute a display device manufacturing jig and are different from those of the conventional example, will be further described.
【００２３】補強用ガラス基板２は、製品用のＴＦＴ用
ガラス基板１に張り合わせて１枚の基板にするため、２
つの条件を満足する様にした。１つ目は補強用ガラス基
板２の材質をＴＦＴ用ガラス基板１と同一材質にし、膨
張係数、誘電率、透磁率等を合わせ、製造工程での熱ス
トレス、成膜装置内でのプラズマの影響をガラス基板１
枚の時とより条件を同じにし、且つガラス基板同士が製
造工程内で擦った時に傷が着かないようにした。２つ目
は補強用ガラス基板２の長さと幅をＴＦＴ用ガラス基板
１に揃え、張り合わせた後のガラス基板端部の欠け等を
防止するようにした。尚、各従来例では補強用ガラス基
板の材質は製品用のガラス基板と同一ではなく、従来例
１では研磨ガラスでなく安価なものを、従来例２ではソ
ーダガラスを、そして従来例３ではガラス基板を充分支
持し得る形状でかつ平坦な板材例えばフロートガラスが
用いられている。The reinforcing glass substrate 2 is bonded to the TFT glass substrate 1 for a product to form a single substrate.
To satisfy the two conditions. The first is to make the material of the reinforcing glass substrate 2 the same as that of the TFT glass substrate 1 and adjust the expansion coefficient, the dielectric constant, the magnetic permeability, etc., and to make the thermal stress in the manufacturing process and the influence of plasma in the film forming apparatus. To the glass substrate 1
The conditions were made the same as in the case of a single sheet, and scratches were not formed when the glass substrates were rubbed in the manufacturing process. Second, the length and width of the reinforcing glass substrate 2 are aligned with the TFT glass substrate 1 so as to prevent chipping of the glass substrate edge after bonding. In each of the conventional examples, the material of the reinforcing glass substrate is not the same as that of the glass substrate for the product. In the conventional example 1, it is not polished glass but inexpensive glass. In the conventional example 2, soda glass is used. A flat plate material such as a float glass having a shape capable of sufficiently supporting the substrate is used.
【００２４】また、ガラス基板を張り合わせる際の２つ
の条件をも満足する様にした。ＴＦＴ用ガラス基板１と
補強用ガラス基板２を張り合わせる際は、張り合わせる
面に異物が混入しないように洗浄、乾燥しておく。この
ことにより、１つ目は後で張り合わせたガラス基板を剥
がす時に、異物がＴＦＴ用ガラス基板１に付着していな
いようにした。そして、２つ目は真空中の成膜装置内で
混入した異物が不純物ガスを発生させたり、製造工程を
汚染することがないようにした。Further, two conditions for bonding the glass substrates are satisfied. When the glass substrate for TFT 1 and the glass substrate for reinforcement 2 are bonded to each other, they are washed and dried so that foreign matter does not enter the bonding surface. As a result, in the first case, when the laminated glass substrate is peeled off later, foreign substances are prevented from adhering to the TFT glass substrate 1. Second, foreign substances mixed in the film forming apparatus under vacuum do not generate impurity gas or contaminate the manufacturing process.
【００２５】Ｏリング３は、ＴＦＴ用ガラス基板１と補
強用ガラス基板２を張り合わせるために用いるが、Ｏリ
ング３は、ガラス基板と同様に、張り合わせる際の２つ
の条件を満足するものを用いる。１つ目は後で張り合わ
せたガラス基板を剥がす時に、Ｏリング３の粘着剤等の
屑が異物としてＴＦＴ用ガラス基板１に付着しないも
の。２つ目は真空中の成膜装置内でＯリング３が不純物
ガスを発生させたり、製造工程を汚染することがないも
のである。具体的には例えばＯリング３として、真空装
置で使用するバーフロロエラストマー（高分子材料）で
あるデュポン社の商品名カルレッツを用い、厚さは２０
μｍ以下のものを用いる。このカルレッツのＯリング３
は、ＬＣＤの製造工程での成膜やドライエッチングを真
空装置で行う際、スパッタ（ＰＶＤ）やＣＶＤの真空度
０．１Ｐａの装置中で不純物ガスの放出が無いものであ
る。またＯリング３の厚さの２０μｍ以下は、製造工程
内で最も撓みに弱い露光装置が製品基板（ＴＦＴ用ガラ
ス基板１）に要求する最大の撓みが２０μｍであり、そ
こから決めている。尚、Ｏリング３は張り合わせたＴＦ
Ｔ用ガラス基板１と補強用ガラス基板２間に、製造工程
内での不純物ガスや汚染物質やパーティクルが入り込ま
ないようにするためにも用いているものである。The O-ring 3 is used for bonding the TFT glass substrate 1 and the reinforcing glass substrate 2, and the O-ring 3 satisfies the two conditions for bonding like the glass substrate. Used. The first is that the dust such as the adhesive of the O-ring 3 does not adhere to the TFT glass substrate 1 as a foreign substance when the laminated glass substrate is peeled off later. The second is that the O-ring 3 does not generate impurity gas or contaminate the manufacturing process in the vacuum deposition apparatus. Specifically, for example, Kalrez (trade name, manufactured by DuPont), which is a bar fluoroelastomer (polymer material) used in a vacuum apparatus, is used as the O-ring 3 and has a thickness of 20%.
The one having a size of μm or less is used. O-ring 3 of this Kalrez
Is an apparatus which does not emit an impurity gas in a sputtering (PVD) or CVD apparatus having a degree of vacuum of 0.1 Pa when film formation or dry etching is performed in a vacuum apparatus in a manufacturing process of an LCD. When the thickness of the O-ring 3 is 20 μm or less, the maximum deflection required for the product substrate (TFT glass substrate 1) by the exposure apparatus which is the least bent in the manufacturing process is 20 μm, and the thickness is determined from that. The O-ring 3 is attached TF
It is also used to prevent an impurity gas, a contaminant, or particles from entering between the T glass substrate 1 and the reinforcing glass substrate 2 in the manufacturing process.
【００２６】ここで本実施形態のＬＣＤの製造方法は、
まず、図１及び図２に示すように、例えば２酸化硅素で
あるガラス基板を２枚用い、１枚は製品用のＴＦＴ用ガ
ラス基板１、他の１枚はそのＴＦＴ用ガラス基板１の強
度補強用の補強用ガラス基板２である。Here, the method of manufacturing the LCD of this embodiment is as follows.
First, as shown in FIGS. 1 and 2, two glass substrates made of, for example, silicon dioxide are used. One is a glass substrate 1 for a product TFT, and the other is a glass substrate 1 for the TFT. This is a reinforcing glass substrate 2 for reinforcement.
【００２７】そしてまず、ＴＦＴ用ガラス基板１と補強
用ガラス基板２を、張り合わせたガラス基板の間に異物
が付着しないように、洗浄し乾燥する。First, the TFT glass substrate 1 and the reinforcing glass substrate 2 are washed and dried so that foreign matter does not adhere between the laminated glass substrates.
【００２８】そして、（ａ）（ｂ）補強用ガラス基板２
上に、補強用ガラス基板２端に合わせた大きさに加工さ
れたＯリング３を載せる。この時図２の（ｂ）乃至
（ｄ）に示すように、Ｏリング３は補強用ガラス基板２
周辺部に且つ張り合わせ後にはみ出さないように、そし
て且つ捻じれ、弛みが無いように配置する。これは、Ｏ
リング３を補強用ガラス基板２の内側に載せてしまう
と、その分張り合わせたＴＦＴ用ガラス基板１と補強用
ガラス基板２の端部の基板間に隙間ができ、製造工程中
のレジストやエッチング液等といった後工程で他製造装
置を汚染してしまう物質が挟まってしまうからである。
また逆に補強用ガラス基板２からＯリング３がはみ出す
と、Ｏリング３が製造工程内で擦られ、それ自体がパー
ティクルの元になるからである。Then, (a) and (b) the reinforcing glass substrate 2
An O-ring 3 processed to a size corresponding to the end of the reinforcing glass substrate 2 is placed thereon. At this time, as shown in (b) to (d) of FIG.
It is arranged so that it does not protrude to the periphery and after lamination, and that there is no twist or slack. This is O
When the ring 3 is placed inside the reinforcing glass substrate 2, a gap is formed between the bonded TFT glass substrate 1 and the substrate at the end of the reinforcing glass substrate 2. This is because a substance that pollutes another manufacturing apparatus is caught in a post process such as the above.
Conversely, when the O-ring 3 protrudes from the reinforcing glass substrate 2, the O-ring 3 is rubbed in the manufacturing process, and the O-ring 3 itself becomes a source of particles.
【００２９】次に、（ｃ）補強用ガラス基板２に位置を
合わせてＴＦＴ用ガラス基板１を置くと、元々ガラス基
板同士は静電吸着力で引っ付き易いので、この置いただ
けの状態ですぐにガラス基板同士は静電吸着力Ａにより
中央部から次第に張り合さって行き、例えば３０秒ほど
でＯリング３の近傍まで吸着する。この時点で常圧下で
はＴＦＴ用ガラス基板１と補強用ガラス基板２は一体化
して剥がれることは無く、搬送可能な状態になる。Next, (c) when the glass substrate for TFT 1 is placed in alignment with the glass substrate for reinforcement 2, the glass substrates are originally easily attracted to each other due to the electrostatic attraction force. The glass substrates are gradually adhered to each other from the central portion by the electrostatic attraction force A, and adhere to the vicinity of the O-ring 3 in about 30 seconds, for example. At this time, under normal pressure, the glass substrate for TFT 1 and the glass substrate for reinforcement 2 are not integrated and peeled off, and can be transported.
【００３０】そして、張り合わせ一体化したＴＦＴ用ガ
ラス基板１と補強用ガラス基板２の両基板を製造工程に
流す。（ｄ）ＴＦＴ駆動トランジスタ製造工程の第１層
成膜のＣｒスパッタ装置に入ると、１ｘ１０−３Ｐａに
まで減圧された真空状態の装置内で、Ｏリング３内側に
有るガス（空気）の為ＴＦＴ用ガラス基板１と補強用ガ
ラス基板２のガラス基板間が陽圧になり、ガラス基板間
のガスは排気されて行き自然にガラス基板間は高真空状
態になっていく。そして、限りなく２枚のガラス基板は
真空吸着力Ｂにより引っ付き合う。これで、張り合わせ
は更に強固になる。つまりＯリング３は、ガラス基板間
に他製造装置の汚染物質が入り込むのを防止するのみで
なく、ガラス基板間を真空排気しより吸着力を増す効果
も有る。これ以降の製造工程でも同様の効果が有る。Then, both the glass substrate for TFT 1 and the glass substrate for reinforcement 2 which are bonded and integrated are flowed to the manufacturing process. (D) When entering the Cr sputtering device for forming the first layer in the TFT drive transistor manufacturing process, the gas (air) inside the O-ring 3 is used in the vacuum device reduced to 1 × 10 −3 Pa due to the TFT. The pressure between the glass substrates of the glass substrate for reinforcement 1 and the glass substrate for reinforcement 2 becomes positive pressure, and the gas between the glass substrates is exhausted, and the space between the glass substrates naturally becomes a high vacuum state. Infinitely, the two glass substrates are attracted by the vacuum suction force B. This makes the bonding even stronger. That is, the O-ring 3 not only prevents the contaminants of other manufacturing apparatuses from entering between the glass substrates, but also has the effect of increasing the attraction force by evacuating the glass substrates. Similar effects are obtained in the subsequent manufacturing steps.
【００３１】この状態で２枚のＴＦＴ用ガラス基板１と
補強用ガラス基板２は１枚のＴＦＴ用ガラス基板１とし
て扱うことができる。（ｅ）ＴＦＴ駆動トランジスタ製
造工程を流しＴＦＴ用ガラス基板１上にＴＦＴ駆動トラ
ンジスタ７を形成する。（ｆ）ＴＦＴ用ガラス基板１と
カラーフィルター４をＡｇペースト５にて張り合わせ
る。そしてＴＦＴ駆動トランジスタ７が形成されている
ＴＦＴガラス基板１とカラーフィルター４の間に液晶剤
６を注入し挟み込み、Ａｇペースト５にて封止する。In this state, the two glass substrates 1 for TFT and the glass substrate 2 for reinforcement can be handled as one glass substrate 1 for TFT. (E) The TFT driving transistor manufacturing process is performed to form the TFT driving transistor 7 on the TFT glass substrate 1. (F) The TFT glass substrate 1 and the color filter 4 are bonded together with an Ag paste 5. Then, a liquid crystal agent 6 is injected and sandwiched between the TFT glass substrate 1 on which the TFT drive transistor 7 is formed and the color filter 4, and sealed with an Ag paste 5.
【００３２】ここで、ＴＦＴ用ガラス基板１と補強用ガ
ラス基板２は同じ材質であり、互いに同等の硬度を有す
ることで傷つかず、且つ製造工程で同様の膨張係数、誘
電率、透磁率を有することで、製造装置への適応性や製
品デバイス特性への影響は全く問題無い。Here, the glass substrate for TFT 1 and the glass substrate for reinforcement 2 are made of the same material, have the same hardness, are not damaged, and have the same expansion coefficient, dielectric constant, and magnetic permeability in the manufacturing process. Thus, there is no problem at all in adaptability to a manufacturing apparatus and influence on product device characteristics.
【００３３】そしてここで、ＴＦＴ用ガラス基板１にカ
ラーフィルター４を張り合わせると、ＴＦＴ用ガラス基
板１の強度は強化される。ここで補強用ガラス基板２は
不要となるので、（ｇ）ＴＦＴガラス基板１とカラーフ
ィルター４の間に液晶剤６を注入後、製品基板であるＴ
ＦＴ用ガラス基板１の表示特性に影響が無く、且つＯリ
ング３の内側に達するようにＣ部にて一部を切断し、ま
ず真空状態を解除する。そしてＴＦＴ用ガラス基板１と
補強用ガラス基板２の静電吸着を剥がす方向に０．５Ｋ
ｇ／ｃｍ2 程度の弱い力で引きつつ、補強用ガラス基板
２の裏面の上下いずれか片方からドライヤー等で熱を加
えると補強用ガラス基板２の膨張に伴い少しずつ剥がれ
る。When the color filter 4 is attached to the TFT glass substrate 1, the strength of the TFT glass substrate 1 is increased. Here, since the reinforcing glass substrate 2 becomes unnecessary, (g) after injecting the liquid crystal agent 6 between the TFT glass substrate 1 and the color filter 4, the product substrate T
A portion is cut at a portion C so as not to affect the display characteristics of the FT glass substrate 1 and to reach the inside of the O-ring 3, and the vacuum state is first released. Then, 0.5K is applied in a direction in which the electrostatic attraction between the TFT glass substrate 1 and the reinforcing glass substrate 2 is removed.
When heat is applied by a drier or the like from one of the upper and lower surfaces of the reinforcing glass substrate 2 while being pulled with a weak force of about g / cm 2 , the reinforcing glass substrate 2 peels off gradually as it expands.
【００３４】（ｈ）剥がしたＴＦＴ用ガラス基板１等半
製品は次工程に送り、（ｉ）残った補強用ガラス基板２
とＯリング３は製造工程での破損が無ければ再利用す
る。(H) The semi-finished product such as the peeled TFT glass substrate 1 is sent to the next step, and (i) the remaining reinforcing glass substrate 2
The O-ring 3 is reused if it is not damaged in the manufacturing process.
【００３５】そして最後に、従来のＬＣＤの製造方法と
同様に図７に示すように、剥がしたＴＦＴ用ガラス基板
１等半製品に、更に駆動ドライバー８及び蛍光灯９を組
み込み、カラー液晶ディスプレイ１０が完成する。Finally, as shown in FIG. 7, similarly to the conventional LCD manufacturing method, a drive driver 8 and a fluorescent lamp 9 are further incorporated into the peeled TFT glass substrate 1 and other semi-finished products to form a color liquid crystal display 10. Is completed.
【００３６】また、本実施形態では、ＴＦＴ用ガラス基
板１と補強用ガラス基板２の静電吸着を剥がすのに、
０．５Ｋｇ／ｃｍ2 程度の弱い力で引きつつ、補強用ガ
ラス基板２の裏面の上下いずれか片方からドライヤー等
で熱を加え補強用ガラス基板２の膨張に伴い少しずつ剥
がしたが、これに限定されず、静電吸着しているガラス
基板間に乾燥空気や窒素ガスを吹き付けながら、補強用
ガラス基板２を徐々に剥がしても良い。Further, in this embodiment, the electrostatic attraction between the TFT glass substrate 1 and the reinforcing glass substrate 2 is removed.
While pulling with a weak force of about 0.5 kg / cm 2 , heat was applied from one of the upper and lower surfaces of the back surface of the reinforcing glass substrate 2 by a drier or the like, and peeled off little by little as the reinforcing glass substrate 2 expanded. The invention is not limited thereto, and the reinforcing glass substrate 2 may be gradually peeled off while blowing dry air or nitrogen gas between the electrostatically adsorbed glass substrates.
【００３７】図３は、本発明の第２の実施形態を示す工
程図であり、第１の実施形態に於けるＯリング３の代わ
りに、フッ素系高温硬化樹脂１１を補強用ガラス基板２
に印刷あるいはパターンニングして使用するものであ
る。これにより、フッ素系高温硬化樹脂１１をＯリング
３に比べ正確にガラス基板に配置可能であるため、ガラ
ス基板外形に対する吸着した真空領域が増大し、ガラス
基板端部の張り合わせたガラス基板間の隙間が減少す
る。この結果、この箇所に堆積、付着するパーティクル
や不純物は減少する。また、フッ素系高温硬化樹脂１１
の厚さを均一に１〜２μｍでできるので、ガラス基板同
士を張り合わせた後のガラス基板のソリを、Ｏリング３
を使用した場合と比較して、減少させることができる。FIG. 3 is a process chart showing a second embodiment of the present invention. In place of the O-ring 3 in the first embodiment, a fluorine-based high-temperature curing resin 11 is used for reinforcing the glass substrate 2.
It is used after printing or patterning. As a result, the fluorine-based high-temperature curing resin 11 can be disposed on the glass substrate more accurately than the O-ring 3, so that the vacuum area adsorbed to the outer shape of the glass substrate increases, and the gap between the bonded glass substrates at the end of the glass substrate Decrease. As a result, particles and impurities deposited and adhered to this portion are reduced. In addition, fluorine-based high-temperature curing resin 11
Can be uniformly formed to have a thickness of 1 to 2 μm.
Can be reduced as compared with the case of using.
【００３８】ここで、フッ素系高温硬化樹脂１１のパタ
ーンニングによる製造方法は、図３に示すように、補強
用ガラス基板２に液化したフッ素系高温硬化樹脂１１を
滴下し、補強用ガラス基板２を回転させ遠心力を利用し
均一に広げる。そして、補強用ガラス基板２を高温処理
し、フッ素系高温硬化樹脂１１を硬化させる。次に、硬
化したフッ素系高温硬化樹脂１１上に感光性レジスト材
１２を均一に塗布し、パターンマスク（図示せず）を用
いて露光する。そして、感光性レジスト材１２を現像
し、Ｏリング３に対応する部分だけ残す。そして次に、
不要なフッ素系高温硬化樹脂１１をエッチングする。そ
して、最後に残した感光性レジスト材１２を剥離し、Ｏ
リング３に対応する部分に必要なフッ素系高温硬化樹脂
１１だけが残る。この工程以外のＬＣＤの製造方法は第
１の実施形態と同じで有る。Here, as shown in FIG. 3, the manufacturing method of the fluorine-based high-temperature curing resin 11 by patterning is to drop the liquefied fluorine-based high-temperature curing resin 11 onto the reinforcing glass Rotate to spread evenly using centrifugal force. Then, the reinforcing glass substrate 2 is subjected to a high-temperature treatment to cure the fluorine-based high-temperature curing resin 11. Next, a photosensitive resist material 12 is uniformly applied on the cured fluorine-based high-temperature curing resin 11, and is exposed using a pattern mask (not shown). Then, the photosensitive resist material 12 is developed to leave only a portion corresponding to the O-ring 3. And then
Unnecessary fluorine-based high-temperature curing resin 11 is etched. Then, the photosensitive resist material 12 left at the end is peeled off, and O
Only the necessary fluorine-based high-temperature curing resin 11 remains in the portion corresponding to the ring 3. The LCD manufacturing method other than this step is the same as that of the first embodiment.
【００３９】図４は、本発明の第３の実施形態を示す概
略図であり、１度にＴＦＴ用ガラス基板１両面の製造を
行うものである。まず、ガラス基板両面を１度に製造可
能なラインを構築し、補強用ガラス基板２として製品用
のＴＦＴ用ガラス基板１を使用する。そして、第１の実
施形態または第２の実施形態で示した製造方法で張り合
わせたＴＦＴ用ガラス基板１を２枚使用し、張り合わせ
たＴＦＴ用ガラス基板１、２枚の両表面（張り合わせて
いない２つの面）で製品を製造し、１度にＴＦＴ用ガラ
ス基板１両面の製造を行う。FIG. 4 is a schematic view showing a third embodiment of the present invention, in which both surfaces of the TFT glass substrate 1 are manufactured at one time. First, a line capable of manufacturing both sides of a glass substrate at one time is constructed, and a glass substrate for TFT 1 for a product is used as a reinforcing glass substrate 2. Then, two TFT glass substrates 1 bonded by the manufacturing method described in the first embodiment or the second embodiment are used, and both surfaces of the bonded TFT glass substrates 1 and 2 (two unbonded surfaces) are used. Product), and manufacture both sides of the TFT glass substrate 1 at a time.
【００４０】図５は、本発明の第４の実施形態を示す概
略図であり、製品用のＴＦＴ用ガラス基板１の多面取り
（複数取り）を行うものである。新規ラインで大型ガラ
ス基板の多面取りを行う場合、補強用ガラス基板２のみ
大型化し、その基板サイズで製造工程を構築する。そし
て、従来サイズの製品用のＴＦＴ用ガラス基板１を複数
枚補強用ガラス基板２の上に配置し、第１の実施形態ま
たは第２の実施形態で示した製造方法でＴＦＴ用ガラス
基板１を補強用ガラス基板２に各々張り合わせ、製造工
程を流す。これにより、製品用のＴＦＴ用ガラス基板１
の多面取りを行うことができる。そして、製品用のＴＦ
Ｔ用ガラス基板１の大きさまたは厚さ等変化する市場ニ
ーズに対応して、製造工程を新たに構築したりまたは変
更する必要は無くなる。FIG. 5 is a schematic view showing a fourth embodiment of the present invention, in which multiple (multiple) TFT glass substrates 1 for products are formed. When a large-sized glass substrate is to be formed on a new line, only the reinforcing glass substrate 2 is enlarged, and a manufacturing process is constructed with the substrate size. Then, a plurality of TFT glass substrates 1 for a conventional size product are placed on the reinforcing glass substrate 2, and the TFT glass substrate 1 is manufactured by the manufacturing method shown in the first embodiment or the second embodiment. Each is bonded to the reinforcing glass substrate 2, and the manufacturing process is performed. Thereby, the glass substrate for TFT 1 for the product
Can be multi-faceted. And TF for products
There is no need to newly construct or change the manufacturing process in response to changing market needs such as the size or thickness of the glass substrate 1 for T.
【００４１】図６は、本発明の第５の実施形態を示す概
略図であり、補強用ガラス基板２を介して、補強用ガラ
ス基板２両面で製品用のＴＦＴ用ガラス基板１の多面取
り（複数取り）の大量生産を行うものである。これは、
図４に示す第３の実施形態のようなガラス基板両面の製
造工程で、且つ図５に示す第４の実施形態のような補強
用ガラス基板２のみ大型化した製造工程を構築し、製品
用のＴＦＴ用ガラス基板１の多面取りを行うものであ
る。そしてこれは、従来サイズの製品用のＴＦＴ用ガラ
ス基板１を複数枚ずつ、補強用ガラス基板２の両面に各
々の製品の製造面が表になるように配置し、第１の実施
形態または第２の実施形態で示した製造方法で両面のＴ
ＦＴ用ガラス基板１を補強用ガラス基板２に各々張り合
わせ、製造工程を流す。これにより、補強用ガラス基板
２を介して、両面で製品用のＴＦＴ用ガラス基板１の多
面取りの大量生産を行うことができる。FIG. 6 is a schematic view showing a fifth embodiment of the present invention, in which a TFT glass substrate 1 for a product is formed on both sides of a reinforcing glass substrate 2 through a reinforcing glass substrate 2. Mass production). this is,
In the manufacturing process on both sides of the glass substrate as in the third embodiment shown in FIG. 4 and the manufacturing process in which only the reinforcing glass substrate 2 as in the fourth embodiment shown in FIG. Of the TFT glass substrate 1 described above. This is achieved by arranging a plurality of TFT glass substrates 1 for a product of the conventional size on both surfaces of the reinforcing glass substrate 2 such that the production surfaces of the respective products are facing each other. In the manufacturing method shown in the second embodiment, T
The FT glass substrate 1 is bonded to the reinforcing glass substrate 2 and the manufacturing process is performed. Thereby, through the reinforcing glass substrate 2, it is possible to mass-produce a multi-sided TFT glass substrate 1 for a product on both sides.
【００４２】以上、本発明の実施の形態として、ここで
はＬＣＤの製造特にＴＦＴ用ガラス基板の強度を補強し
た製造用治具及びそれを用いた製造方法について説明し
たが、ＬＣＤのカラーフィルター用ガラス基板又はＰＤ
ＰのＰＤＰ用ガラス基板についても、その製造用治具及
びそれを用いた製造方法は同様である。As described above, as the embodiment of the present invention, the manufacturing of the LCD, particularly the manufacturing jig in which the strength of the glass substrate for the TFT is reinforced, and the manufacturing method using the same have been described. Substrate or PD
Regarding the P PDP glass substrate, the manufacturing jig and the manufacturing method using the same are the same.
【００４３】[0043]
【発明の効果】以上述べたように、本発明によれば、従
来例との製造方法の相違点は、まず第１に、これら従来
例は全て製品用のガラス基板と補強用基板との貼り付け
に粘着剤を使用しているのに対し粘着剤等は使用してい
ないことであり、第２に補強用基板は製品と同材質のガ
ラス基板を使用し、ガラス基板同士が引っ付く静電吸着
力及び真空吸着力を利用して張り合わせていることであ
る。このことにより、次の効果が得られる。As described above, according to the present invention, the difference between the manufacturing method and the conventional example is that, first, all of these conventional examples are affixed to a glass substrate for a product and a reinforcing substrate. Second, the adhesive substrate is not used while the adhesive is used. The second is to use a glass substrate made of the same material as the product for the reinforcing substrate, That is, they are stuck together using the suction force and the vacuum suction force. As a result, the following effects can be obtained.
【００４４】第１の効果は、補強用基板を用いることに
より、製品用のガラス基板の強度を補強でき、製造工程
で製品用のガラス基板が撓んだり、割れてしまうことを
防止でき、製品用のガラス基板の薄型化、且つ大型化に
対応できる。The first effect is that by using the reinforcing substrate, the strength of the glass substrate for the product can be reinforced, and the glass substrate for the product can be prevented from being bent or broken in the manufacturing process. Glass substrates can be made thinner and larger.
【００４５】第２の効果は、補強用基板と製品用のガラ
ス基板は同一材質であり、補強用基板を用いても互いに
同等の硬度を有することで傷つかず、且つ製造工程で同
様の膨張係数、誘電率、透磁率を有することで、製造装
置への適応性や製品のデバイス特性への影響は全く問題
無い。The second effect is that the reinforcing substrate and the glass substrate for the product are made of the same material and have the same hardness even when the reinforcing substrate is used. , Dielectric constant, and magnetic permeability, there is no problem at all in adaptability to a manufacturing apparatus and influence on device characteristics of a product.
【００４６】第３の効果は、補強用基板と製品用のガラ
ス基板の張り合わせにＯリングを用い、従来例のように
粘着剤を使用しないので、製造工程内でのパーティクル
発生による不良発生と製造工程内の汚染を防止できる。
また、真空装置内での不純物ガスの放出が無いので、成
膜装置を汚染し膜質を悪化させることを防止できる。The third effect is that the O-ring is used for bonding the reinforcing substrate and the glass substrate for the product, and the adhesive is not used unlike the conventional example. Contamination in the process can be prevented.
Further, since no impurity gas is released in the vacuum apparatus, it is possible to prevent the film forming apparatus from being polluted and the film quality from being deteriorated.
【００４７】第４の効果は、従来例の如く補強用基板と
して製品用のガラス基板と違う材質の基板あるいはフィ
ルムを粘着剤で貼り付けしている場合、熱膨張係数の違
いが生じ、製品用のガラス基板と補強用基板の間に空間
が生じ、熱を加えたり真空中に入れるとこの空間が膨張
し、かえって製品用のガラス基板の割れ欠けや製造工程
内での貼り付けした基板分離の原因となるが、本発明で
は補強用基板と製品用のガラス基板とは同一材質であ
り、且つ真空で吸着しているので、この問題が生じな
い。The fourth effect is that when a substrate or film made of a material different from that of a glass substrate for a product is adhered with an adhesive as a reinforcing substrate as in the conventional example, a difference in thermal expansion coefficient occurs, and A space is created between the glass substrate and the reinforcing substrate, and when heat is applied or placed in a vacuum, this space expands, leading to cracks in the glass substrate for the product and separation of the attached substrate in the manufacturing process. As a cause, in the present invention, this problem does not occur because the reinforcing substrate and the glass substrate for the product are made of the same material and are adsorbed by vacuum.
【００４８】第５の効果は、補強用ガラス基板と製品用
のガラス基板のガラス基板同士を張り合わせているの
で、補強用ガラス基板に製品用のガラス基板を使用すれ
ば、ガラス基板両表面で製品を両面に製造することがで
きる。The fifth effect is that the glass substrates for the reinforcing glass substrate and the glass substrate for the product are bonded to each other. Therefore, if the glass substrate for the product is used as the glass substrate for the reinforcing material, the product surface is formed on both surfaces of the glass substrate. Can be manufactured on both sides.
【００４９】第６の効果は、大型基板で多面取り（複数
取り）の大量生産をする場合、補強用基板のみを大型化
すれば、製品用のガラス基板は従来サイズの基板をその
まま使用し、補強用基板の上に複数枚配置し各々張り合
わせることで生産できる。そして、製品用のガラス基板
の大きさまたは厚さ等変化する市場ニーズに対応して、
製造工程を新たに構築したりまたは変更する必要は無
い。The sixth effect is that, when mass production of multiple substrates (multiple substrates) is performed on a large substrate, if only the reinforcing substrate is enlarged, the conventional glass substrate for the product can be used as it is. It can be produced by arranging a plurality of sheets on a reinforcing substrate and bonding them together. In response to changing market needs such as the size or thickness of glass substrates for products,
There is no need to build or change the manufacturing process.
【００５０】第７の効果は、大型基板で更に両面に製品
を製造する場合、大型化した補強用基板の両面に、従来
サイズの製品用のガラス基板を複数枚ずつ配置し各々張
り合わせることで、多面取り且つ両面の大量生産ができ
る。The seventh effect is that, when a product is manufactured on both sides of a large-sized substrate, a plurality of glass substrates for a product of the conventional size are arranged on both sides of the enlarged reinforcing substrate and bonded to each other. Multi-sided and mass production of both sides is possible.
【００５１】第８の効果は、補強用基板およびＯリング
は再利用できるので、コストは上昇せずコスト的リスク
が無い。The eighth effect is that since the reinforcing substrate and the O-ring can be reused, the cost does not increase and there is no cost risk.
【図１】本発明の第１の実施形態を製造工程順に説明す
る工程図である。FIG. 1 is a process chart for explaining a first embodiment of the present invention in the order of manufacturing steps.
【図２】図１の第１の実施形態の一部製造工程を工程順
に説明する概略図である。FIG. 2 is a schematic diagram illustrating a partial manufacturing process of the first embodiment of FIG. 1 in the order of processes.
【図３】本発明の第２の実施形態を示す工程図である。FIG. 3 is a process chart showing a second embodiment of the present invention.
【図４】本発明の第３の実施形態を示す概略図である。FIG. 4 is a schematic diagram showing a third embodiment of the present invention.
【図５】本発明の第４の実施形態を示す概略図である。FIG. 5 is a schematic diagram showing a fourth embodiment of the present invention.
【図６】本発明の第５の実施形態を示す概略図である。FIG. 6 is a schematic diagram showing a fifth embodiment of the present invention.
【図７】従来技術を説明する工程図である。FIG. 7 is a process diagram illustrating a conventional technique.
【図８】図７の従来技術を説明する説明図である。FIG. 8 is an explanatory diagram for explaining the prior art of FIG. 7;
【図９】他の従来技術を説明する模式図である。FIG. 9 is a schematic diagram illustrating another conventional technique.
１ ＴＦＴ用ガラス基板 ２ 補強用ガラス基板 ３ Ｏリング ４ カラーフィルター ５ Ａｇペースト ６ 液晶剤 ７ ＴＦＴ駆動トランジスタ ８ 駆動ドライバー ９ 蛍光灯 １０ カラー液晶ディスプレイ １１ フッ素系高温硬化樹脂 １２ 感光性レジスト材 Ａ 静電吸着力 Ｂ 真空吸着力 Reference Signs List 1 glass substrate for TFT 2 glass substrate for reinforcement 3 O-ring 4 color filter 5 Ag paste 6 liquid crystal agent 7 TFT drive transistor 8 drive driver 9 fluorescent lamp 10 color liquid crystal display 11 fluorine high temperature curing resin 12 photosensitive resist material A electrostatic Suction force B Vacuum suction force
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) G02F 1/1333 500 G02F 1/13 101 G02F 1/1339 G09F 9/00 H01J 17/16 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) G02F 1/1333 500 G02F 1/13 101 G02F 1/1339 G09F 9/00 H01J 17/16
Claims (9)
ける、前記製品用のガラス基板を張り合わせて一体化
し、前記製品用のガラス基板の強度を補強して、前記表
示装置を製造する治具において、前記製造用治具が前記
製品と同材質のガラス基板を使用した補強用基板と、前
記製品用のガラス基板と前記補強用基板の張り合わせに
用いるＯリングとで構成され、製造後に表示装置から取
り除かれることを特徴とする表示装置製造用治具。1. A jig for manufacturing a display device using a glass substrate, wherein the glass substrate for the product is laminated and integrated to reinforce the strength of the glass substrate for the product in manufacturing the display device using the glass substrate. a reinforcing substrate for the manufacturing jig has a glass substrate of the product the same material, it is constituted by an O-ring used bonding of the reinforcing substrate and a glass substrate for the product, from the display device after manufacturing Taking
A jig for manufacturing a display device, wherein the jig is removed .
である請求項１記載の表示装置製造用治具。2. The display device according to claim 1, wherein the display device is a liquid crystal display or a PDP.
The jig for manufacturing a display device according to claim 1, wherein:
に印刷あるいはパターンニングされたフッ素系高温硬化
樹脂である請求項１記載の表示装置製造用治具。3. The jig for manufacturing a display device according to claim 1, wherein the O-ring is a fluorine-based high-temperature curing resin printed or patterned on the reinforcing glass substrate.
において、前記製品と同材質のガラス基板を使用した補
強用基板と、前記製品用のガラス基板と前記補強用ガラ
ス基板の張り合わせに用いるＯリングとを用い、ガラス
基板同士の静電吸着力を利用して、前記製品用のガラス
基板を前記補強用ガラス基板に張り合わせて一体化し、
前記製品用のガラス基板の強度を補強して、前記製品用
のガラス基板を用いた表示装置を製造することを特徴と
する表示装置の製造方法。4. A method for manufacturing a display device using a glass substrate, comprising: a reinforcing substrate using a glass substrate of the same material as the product; and an O substrate used for bonding the glass substrate for the product and the reinforcing glass substrate. Using a ring, utilizing the electrostatic attraction force between the glass substrates, the glass substrate for the product is bonded to the reinforcing glass substrate and integrated,
A method of manufacturing a display device, comprising manufacturing a display device using the glass substrate for a product by reinforcing the strength of the glass substrate for the product.
において、前記製品と同材質のガラス基板を使用した補
強用基板と、前記製品用のガラス基板と前記補強用ガラ
ス基板の張り合わせに用いるＯリングとを用い、ガラス
基板同士の真空吸着力を利用して、前記製品用のガラス
基板を前記補強用ガラス基板に張り合わせて一体化し、
前記製品用のガラス基板の強度を補強して、前記製品用
のガラス基板を用いた表示装置を製造することを特徴と
する表示装置の製造方法。5. A method for manufacturing a display device using a glass substrate, comprising: a reinforcing substrate using a glass substrate of the same material as the product; and an O substrate used for bonding the glass substrate for the product and the reinforcing glass substrate. Using a ring, utilizing the vacuum suction force between the glass substrates, the glass substrate for the product is bonded to the reinforcing glass substrate and integrated,
A method of manufacturing a display device, comprising manufacturing a display device using the glass substrate for a product by reinforcing the strength of the glass substrate for the product.
である請求項４または５記載の表示装置の製造方法。6. The display device according to claim 1, wherein the display device is a liquid crystal display or a PDP.
The method for manufacturing a display device according to claim 4 or 5, wherein
のガラス基板を使用し、前記製品用のガラス基板同士を
張り合わせ、張り合わせた前記製品用のガラス基板の両
表面で、製品を両面に製造する請求項４または５記載の
表示装置の製造方法。7. A glass substrate for the product is used as the glass substrate for reinforcement, and the glass substrates for the product are bonded to each other, and the product is manufactured on both surfaces on both surfaces of the bonded glass substrate for the product. A method for manufacturing a display device according to claim 4.
補強用ガラス基板の片面に配置し、前記製品用のガラス
基板を前記補強用ガラス基板に各々張り合わせて、複数
の製品を製造する請求項４または５記載の表示装置の製
造方法。8. A plurality of products are manufactured by arranging a plurality of product glass substrates on one side of the reinforcing glass substrate and laminating the product glass substrates to the reinforcing glass substrate, respectively. Item 6. The method for manufacturing a display device according to item 4 or 5.
前記補強用ガラス基板の両面に配置し、前記製品用のガ
ラス基板を前記補強用ガラス基板に各々張り合わせて、
複数の製品を製造する請求項４または５記載の表示装置
の製造方法。9. A plurality of product glass substrates are arranged on both sides of the reinforcing glass substrate, and the product glass substrates are bonded to the reinforcing glass substrate, respectively.
The method for manufacturing a display device according to claim 4, wherein a plurality of products are manufactured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4484899A JP3202718B2 (en) | 1999-02-23 | 1999-02-23 | Display device manufacturing jig and display device manufacturing method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4484899A JP3202718B2 (en) | 1999-02-23 | 1999-02-23 | Display device manufacturing jig and display device manufacturing method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000241804A JP2000241804A (en) | 2000-09-08 |
| JP3202718B2 true JP3202718B2 (en) | 2001-08-27 |
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ID=12702909
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4484899A Expired - Fee Related JP3202718B2 (en) | 1999-02-23 | 1999-02-23 | Display device manufacturing jig and display device manufacturing method using the same |
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| JP (1) | JP3202718B2 (en) |
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1999
- 1999-02-23 JP JP4484899A patent/JP3202718B2/en not_active Expired - Fee Related
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| CN103135276A (en) * | 2011-12-01 | 2013-06-05 | 乐金显示有限公司 | Method of fabricating lightweight and thin liquid crystal display |
| US9033757B2 (en) | 2011-12-01 | 2015-05-19 | Lg Display Co., Ltd. | Method of fabricating lightweight and thin liquid crystal display |
| CN103135276B (en) * | 2011-12-01 | 2016-03-16 | 乐金显示有限公司 | Manufacture the method for frivolous liquid crystal display |
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