JP2003216068A - Display device and substrate for display device, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the thickness of a glass board in order to reduce the weight of a liquid crystal panel. <P>SOLUTION: The board for the display device is obtained by disposing a thin glass sheet opposite to a thick glass plate with substantially no clearances and fusing their peripheral edges, or disposing the thin glass sheet opposite to the thick glass plate across a spacer under reduced pressure, then fusing the peripheral edges thereby forming the laminated glass plate. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device having a color display function, and more particularly to an active type display device.

[0002]

2. Description of the Related Art Recent advances in microfabrication technology, liquid crystal material technology, high-density packaging technology, and the like have provided a large amount of television images and various image display devices on a commercial basis with liquid crystal display devices having a diagonal length of 5 to 50 cm. Has been done. Further, color display is easily realized by forming R, G, and B colored layers on one of the two glass substrates constituting the liquid crystal panel. In particular, in a so-called active type liquid crystal panel in which a switching element is built in for each picture element, an image having a small crosstalk, a high-speed response, and a high contrast ratio is guaranteed.

In these liquid crystal display devices (liquid crystal panels), 200 to 1200 scanning lines and 20 signal lines are used.
A matrix organization of about 0 to 1600 is generally used, but recently, in order to cope with an increase in display capacity, a larger screen and a higher definition have been simultaneously advanced.

FIG. 8 shows a state of mounting on a liquid crystal panel, in which a drive signal is supplied to an electrode terminal group 6 of scanning lines formed on one transparent insulating substrate which constitutes the liquid crystal panel 1, for example, a glass substrate 2. COG (Chip-On-Glass) for connecting the semiconductor integrated circuit chip 3 using a conductive adhesive
s) method or a suitable method in which a TCP film 4 based on a polyimide resin thin film and having gold or solder-plated copper foil terminals (not shown) is included in a signal line electrode terminal group 5 containing a conductive medium. TCP fixed by pressure contact with adhesive
An electric signal is supplied to the image display unit by mounting means such as a (Tape-Carrier-Package) method. Here, for convenience, two mounting methods are shown at the same time, but in practice, either method is appropriately selected.

Reference numeral 8 denotes a wiring path for connecting the image display portion located in the substantially central portion of the liquid crystal panel 1 and the electrode terminal groups 5 and 6 of the signal line and the scanning line, which are not necessarily the same as the electrode terminal groups 5 and 6. Need not be composed of a conductive material. Reference numeral 9 is a counter glass substrate or a color filter which is another transparent insulating substrate having a transparent conductive counter electrode common to all liquid crystal cells on the counter surface.

FIG. 9 shows an equivalent circuit diagram of an active type liquid crystal panel in which an insulated gate transistor 10 is arranged for each picture element as a switching element. 11 (wiring path 8 in FIG. 8) is a scanning line and 12 (in FIG. 8). Wiring path 7) is a signal line, 1
3 is a liquid crystal cell, and the liquid crystal cell 13 is electrically treated as a capacitive element. The elements drawn by the solid line are formed on one glass substrate 2 constituting the liquid crystal panel, and the counter electrode 14 common to all the liquid crystal cells 13 drawn by the dotted line is formed on the other counter glass substrate 9. Has been done. When the OFF resistance of the insulated gate transistor 10 or the resistance of the liquid crystal cell 13 is low, or when the gradation of the display image is emphasized, the auxiliary storage capacitor 15 for increasing the time constant of the liquid crystal cell 13 as a load is used. Is added to the liquid crystal cell 13 in parallel. Incidentally, 16 is a storage capacitor line which is a common bus of the storage capacitor 15.

FIG. 10 is a cross-sectional view of the main part of the image display portion of the liquid crystal panel. The two glass substrates 2 and 9 constituting the liquid crystal panel 1 are made of resinous fibers, beads or columnar spacer materials (not shown). ) Is formed at a predetermined distance of about several μm, and the gap is sealed with a sealing material made of an organic resin and a sealing material (neither is shown) at the peripheral edge of the counter glass substrate 9. The closed space is a closed space, and the closed space is filled with the liquid crystal 17.

In order to realize color display, an organic thin film layer having a thickness of about 1 to 2 μm containing either or both of a dye and a pigment called a coloring layer 18 is deposited on the closed space side of the counter glass substrate 9. The counter glass substrate 9 is also called a color filter (Color Fi).
lter, abbreviated as CF). And liquid crystal 1
Depending on the property of 7, the polarizing plate 19 is attached to either the upper surface of the color filter 9 or the lower surface of the glass substrate 2 or both surfaces, and the liquid crystal panel 1 functions as an electro-optical element. Currently, most liquid crystal panels on the market use TN (twisted nematic) type liquid crystal materials, and normally two polarizing plates 19 are required. Although not shown, a rear surface light source is arranged as a light source in the transmissive liquid crystal panel, and white light is emitted from below.

Two glass substrates 2 and 9 in contact with the liquid crystal 17
The polyimide resin thin film 20 having a thickness of, for example, about 0.1 μm formed thereon is an alignment film for aligning liquid crystal molecules in a predetermined direction. Reference numeral 21 denotes a drain wiring (electrode) that connects the drain of the insulated gate transistor 10 and the transparent conductive pixel electrode 22, and is often formed at the same time as the source wiring (signal line) 12. Source wiring 1
2 is located between the drain wiring 21 and the semiconductor layer 2
It is 3. Adjacent colored layers 18 on the color filter 9
Cr thin film layer 2 having a thickness of about 0.1 μm formed on the boundary of
Reference numeral 4 denotes a light shield for preventing external light from entering the semiconductor layer 23, the scanning line 11 and the signal line 12, which is a so-called black matrix (abbreviation: B).
This is a technology that has become established as M).

Along with the improvement in productivity due to the increase in the size of the glass substrate, the production cost is reduced, and the cost of the parts and materials used is also reduced as the production amount is increased. The market is steadily expanding. The largest markets at the moment are laptops and desktop monitors, but due to the rapid growth of mobile phones,
At the same time, small and medium-sized liquid crystal panels are required for the display part of information mobile terminal equipment, which is expected to grow. In addition to mobile phones, these information terminal equipment, digital home appliances and conventional car navigation applications, small and medium-sized liquid crystal Large growth is expected in the panel market.

[0011]

Among them, mobile phones have become a major core of the liquid crystal panel market, with the production volume expanding explosively in the last few years by providing various information services.
From the beginning when mobile phones were introduced to the market, there were great demands for small size, light weight, thin shape, and low power consumption, and with the latest various technological developments being incorporated, they are being introduced one after another as new products. is there.

The plate thickness of the glass substrate used in the active type liquid crystal display device was initially 1.1 mm. However, in order to reduce the weight of portable notebook computers, the plate thickness is 0.7.
As soon as the mm version was introduced, this became the standard specification. As if countering this, thin type liquid crystal display devices are being further thinned for differentiation.
At present, it is practically used up to a plate thickness of 0.4 mm.

There is a big difference between the active type and the simple type liquid crystal display devices in the length of the manufacturing process and the processing temperature, and the size of the mother glass substrate is relatively small, about 400 × 500 mm. The line was modified to produce a 0.5 mm thick plate, but the demand for smaller and lighter products never stopped, and finally a 0.3 mm thick liquid crystal display device was needed. Came to.

It is clear that the thinner the thickness of the glass substrate is, the weaker the mechanical strength becomes. Therefore, in the line for producing a liquid crystal display device, the use of a thin mother glass substrate is abandoned in response to the demand for a thickness of 0.3 mm. However, we are working on making the glass substrate thinner after it is completed as a liquid crystal panel. As shown in FIG. 11, for example, a glass substrate 2 having a plate thickness of 0.7 mm and a color filter 9 having a plate thickness of 0.7 mm are joined and integrated by using a sealing material (not shown). A suitable protective resin 51 is applied to the periphery of the laminated substrate 50 and cured, and then the glass substrates 2 and 9 on both sides of the laminated substrate 50 are polished and thinned using a polishing liquid containing a hydrofluoric acid-based etching liquid. Further, the protective resin 51 is removed, and thereafter, the individual pieces (for example, 12 pieces in FIG. 11) of the liquid crystal panel are obtained through the normal splitting, filling, and sealing steps. As a result, the liquid crystal having a plate thickness of 0.3 mm is obtained. The panel came to practical use.

In such a manufacturing method, since the active substrate (glass substrate 2) and the color filter (opposite glass substrate 9) are dissolved in a chemical solution, the cost of the industrial waste is not cheap and is not always the best. I can't say. From this point of view, the patent number 32, which is a precedent example
No. 02718 discloses two glass substrates 2a and 2b (or 9a and 9) having different plate thicknesses as shown in FIG.
b) is bonded by a heat-resistant O-ring 52 to form an integrated substrate, an active substrate or a color filter is formed on the thinner glass substrate 2a or 9a, and the integrated substrate is used to form a liquid crystal. A technique for manufacturing a panel and removing the thicker glass substrates 2b and 9b after splitting or cutting is disclosed.

In the prior art example, as shown in FIG.
The glass substrates 2a and 2b are electrostatically adsorbed and integrated, but the sealing of the glass substrates 2a and 2b is easily eliminated by heating or treatment in a chemical solution. Fixing at is virtually impossible. Further, if an organic resin material is used for the sealing material (O-ring 52), it can withstand only a process of about 200 ° C. at most, and it is considered difficult to obtain an active substrate.

Similarly, as shown in FIG. 12 (b) in the prior art, an embodiment in which two glass substrates 2a and 2b are adsorbed and integrated by a vacuum adsorption force is also introduced. If there is no adhesive force on the two glass substrates 2a and 2
b cannot be fixed, and therefore a fluorine-based high temperature curing resin is used for the O-ring 52. However, the fluorine-based high temperature inside the closed space composed of the O-ring 52 and the two glass substrates 2a and 2b is used. There is no escape for solvent vapor generated in the process of thermosetting the cured resin, and there are many doubts about its feasibility.

As described above, the present invention has been made in view of the above situation, and when two glass substrates are bonded and integrated to obtain a laminated glass substrate as in the prior art,
The object is to provide a product that can withstand a process exceeding 300 ° C.

[0019]

In the present invention, when two glass substrates are bonded together, one method uses intermolecular attractive force and the other method uses vacuum pressing.

In the display device substrate according to a third aspect, two glass substrates having substantially the same size but different plate thicknesses are made to face each other without a gap, and at least the vicinity of the end face is joined (fused). Characterize.

A sixth aspect of the present invention is a method of manufacturing a substrate for a display device according to the third aspect, which comprises a step of cleaning two glass substrates having substantially the same size but different plate thicknesses, and the step of reducing the pressure under reduced pressure. Two
The method is characterized by including a step of fixing the two glass substrates so as to face each other with substantially no gap, and a step of irradiating at least the vicinity of the end face of the peripheral portion with laser light to fuse the two glass substrates.

With this structure, it is possible to bond two glass substrates having an active surface after cleaning with an intermolecular attractive force without any gap, and since the peripheral portions are fused under reduced pressure, Even if there is a gap left in the gap, the vacuum force of the gap prevents the two glass substrates from separating under atmospheric pressure. Similarly, even if the pressure in the gap increases due to the heat treatment, the fused peripheral edge portion fixes the two glass substrates, and thus the separation of the two glass substrates is prevented.

In the display device substrate according to a fourth aspect, two glass substrates having substantially the same size but different plate thicknesses are opposed to each other through a spacer, and at least the vicinity of the end face is bonded (fused).
The closed space thus formed is in a reduced pressure state.

A seventh aspect of the present invention is a method for manufacturing a substrate for a display device according to the fourth aspect, wherein one of the two glass substrates having substantially the same size and different plate thicknesses under reduced pressure is placed on one of the glass substrates. A step of spraying a spacer material on the substrate, a step of fixing the two glass substrates so as to face each other, and a step of irradiating a laser beam at least in the vicinity of the end face of the peripheral edge portion to fuse the two glass substrates. It is characterized by

With this structure, since the peripheral portions are fused under reduced pressure, the two glass substrates are prevented from being separated from each other by the vacuum force of the space formed by the two glass substrates via the spacer under atmospheric pressure. To be done. Similarly, even if the pressure in the space is increased by the heat treatment, the fused peripheral edge portion fixes the two glass substrates, and thus the separation of the two glass substrates is prevented.

According to another aspect of the liquid crystal display device of the present invention, at least an insulated gate transistor is provided on one main surface, and a scanning line that also serves as a gate electrode of the insulated gate transistor.
An insulating substrate in which unit picture elements having a source electrode that also serves as a signal line and a drain electrode connected to a picture element electrode are arranged in a two-dimensional matrix; and a colored layer having at least a predetermined spectral characteristic on one main surface. In a liquid crystal display device in which a color filter or a counter substrate formed in a predetermined pattern is opposed and a gap is filled with liquid crystal, one or both of the insulating substrate and the color filter or the counter substrate is thick. It is characterized by being a glass plate of 0.05 to 0.2 mm.

This structure is realized for the first time by using the large-area display device substrate described in claim 3 or 4, and the most significant feature is thinning and weight saving of the liquid crystal display device. There is no prospect at this time to construct a production line for a display device that operates a glass plate with a large area, for example, 400 x 500 mm or 550 x 650 mm or more and a thickness of 0.05 to 0.2 mm with a practical tact, and the existing production line The value to be realized in is great.

According to a second aspect of the present invention, in the light emitting display device, at least a switching insulated gate transistor is provided on one main surface, and a scanning line and a source line that also serve as a gate electrode of the switching insulated gate transistor and a signal line. A unit pixel having a storage capacitor connected to the drain wiring, a driving insulated gate transistor, and a display electrode connected to the drain wiring of the driving insulated gate transistor are arranged in a two-dimensional matrix. In a display device including an insulating substrate, a light emitting display medium, and a mechanism for sealing at least the light emitting display medium, the insulating substrate is a glass plate having a thickness of 0.05 to 0.2 mm.

This structure is first realized by using the large-area display device substrate described in claim 3 or 4, and the most significant feature is thinning and weight reduction of the light emitting display device.

According to a fifth aspect of the present invention, in the color filter according to the third aspect, a coloring layer having at least a predetermined spectral characteristic is formed in a predetermined pattern on one main surface having a smaller thickness.
And a display device substrate according to claim 4 is used.

This structure is also realized only by using the large-area display device substrate described in claim 3 or 4, and the greatest feature is obtained by bonding the color filter and the active substrate together. There is a reduction in the thickness and weight of the liquid crystal display device used.

An eighth aspect of the present invention is a method for manufacturing a liquid crystal display device according to the first aspect, wherein at least two glass substrates having different plate thicknesses are bonded to each other, and one of the display device substrates is the thinner glass substrate. And a step of forming an active matrix on one main surface, and forming a color filter on one main surface of the other glass substrate of the other display device obtained by bonding two glass substrates having different plate thicknesses And a step of adhering the active matrix substrate and the color filter so as to face each other by using a sealing material and a spacer material, and cutting and removing the peripheral portions of the pair of the adhering display device substrates to form a plate. It has a step of removing two thick glass substrates and a step of dividing a bonded mother glass substrate made of two thin glass substrates.

With this configuration, it is possible to manufacture an active substrate and a color filter by using the laminated glass plate according to the present invention on a large area substrate of 400 × 500 mm or more in an existing production line. The liquid crystal panel can be made thinner by combining it with a filter to form a liquid crystal panel.

According to a ninth aspect of the present invention, there is provided a method of manufacturing a light emitting display device according to the second aspect, wherein one of the glass substrates which is the thinner one of the display device substrates formed by bonding two insulating substrates having different plate thicknesses together. At least a switching insulated gate transistor on the main surface, a scanning line also serving as a gate electrode of the switching insulated gate transistor, a signal line also serving as a source wiring, a storage capacitor connected to a drain wiring, and a driving insulated gate -Type transistors and display electrodes connected to the drain wirings of the driving insulated gate transistors are arranged in a two-dimensional matrix and formed, and a light-emitting display medium is formed on the display electrodes. The step of forming a common electrode on the light-emitting display medium, the step of sealing at least the light-emitting region, and the multi-facet of the light-emitting display device. Removing the thick glass substrate of thickness was cut and removed periphery of morning a display device substrate,
And a step of cutting a mother glass substrate made of a thin glass substrate.

With this configuration, it is possible to manufacture a light emitting type active substrate by using the laminated glass plate according to the present invention on a large area substrate of, for example, 400 × 500 mm or more in an existing production line. By dividing the light emitting display device, the light emitting display device can be made thinner.

[0036]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Claims 3 and 4 are a method of bonding two glass substrates, which is the skeleton of the present invention, and the positioning as a component of a display device will be separately described in the embodiments. .

An embodiment of the present invention will be described with reference to the drawings shown in FIGS. A cross-sectional view of the manufacturing process of the display device substrate according to the first embodiment of the present invention is shown in FIG. 1, and similarly, the second embodiment is shown in FIG. The parts having the same functions as those in the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted. Since the method for manufacturing a substrate for a display device according to the present invention requires a process under reduced pressure, a bonding apparatus including a plurality of vacuum standby chambers 82 to 84 adjacent to a process chamber 81 capable of reducing the pressure as shown in FIG. It is preferable to use 80, and FIG. 1 shows a schematic sectional view of the processing chamber 81.

(First Embodiment) In the method for manufacturing a display device substrate according to the first embodiment of the present invention, first, although not shown, two glass substrates 2a having substantially the same size but different plate thicknesses are used. Alternatively, 9a is cleaned by an appropriate means, washed with pure water and dried, and then transferred from the outside of the bonding apparatus 80 into the processing chamber 81 through the vacuum standby chamber 82, the gate valve and the processing chamber 81, as shown in FIG. As shown in a), the thin glass substrate 2a or 9a is transferred onto a flat holding table 85 and fixed on the holding table 85 by an appropriate means. Although electrostatic adsorption or vacuum adsorption is adopted as the fixing means, in the latter case, the pressure is adsorbed by a pressure difference between the electrostatic pressure and the vacuum. The degree of vacuum in the processing chamber 81 may be 1/10 atmospheric pressure or less.

Next, although not shown, two glass substrates 2b or 9b having substantially the same size but different plate thicknesses are cleaned by an appropriate means, washed with pure water and dried, and then bonded. The apparatus 80 is carried into the processing chamber 81 from the outside of the apparatus 80 through the vacuum standby chamber 83 and the gate valve, and as shown in FIG. 1B, the thick glass substrate 2b or 9b is held by an appropriate holding means, For example, it is transferred onto the glass substrate 2a or 9a by using a robot arm or the like that handles the glass substrate 2b or 9b including the end portion. Alternatively, although not shown, a plurality of receiving pins are arranged in a space on the glass substrate 2a or 9a, the glass substrate 2b or 9b is temporarily transferred onto the receiving pin, and then the receiving pin is softly landed on the glass substrate 2a or 9a. May be. At this time, when the degree of vacuum in the processing chamber 81 is 1/100 atm or more, it is preferable to set a stop pin on the holding table 85 so that the glass substrate 2b or 9b does not slip, although not shown. Also, the processing chamber 8
When the degree of vacuum in 1 is 1/100 atm or less, the glass substrate 2b or 9b hardly slips. Then, most of the glass substrate 2b or 9b is pressed against the pressing plate 86.
When lightly pressed with, the surfaces of the glass substrates 2a and 2b (or 9a and 9b, which will be omitted hereinafter) after cleaning are activated, and
der Waals Due to the intermolecular attractive force, the two glass substrates 2a and 2b adhere to each other with substantially no gap even if there is a waviness of about 0.3 mm.

Therefore, as shown in FIG. 1C, the carbon dioxide gas laser beam 87a is irradiated so as to scan along the outer peripheral portion 88 which is located about 0.1 mm inside the end portions of the glass substrates 2a and 2b. At the outer peripheral portion 88, the glass substrates 2a and 2b are fused to have a width of, for example, about 50 μm to form 89. Preferably, after this, the pressing plate 86 is moved to move the glass substrate 2
The back surface of b (or 9b) is exposed, and laser light is also applied to several points on the dividing line or cutting line, which is performed after completing the liquid crystal panel in the case of multi-chambering, and fused to mechanically the laminated glass substrate. Needless to say, it is better to increase the strength, but this is unavoidable as in the case of the photomask used in the production of the active substrate.

In fusing the glass substrates 2a and 2b, it is desirable to maximize the utilization of a technique such as focusing the carbon dioxide laser light 87a on the bonding surface of the glass substrates 2a and 2b, or using excimer laser light in combination. Further, since the cutting accuracy of the glass substrates 2a and 2b is about ± 0.1 mm, it is preferable that the fusion area 89 be the glass substrates 2a and 2b.
The carbon dioxide laser light 87 is formed so as to be formed up to the end of b.
In order to increase the irradiation position accuracy of a, the glass substrates 2a, 2b
It is advisable to take measures to detect the edge of the. Alternatively, the ends of the glass substrates 2a and 2b may be irradiated with excimer laser light 87b to fuse only the ends.

As a thick glass substrate, there is currently a 0.7 mm substrate which is most easily available, and then 0.5 m.
I recommend m. As a thin glass plate, a glass plate with a thickness of 0.05 to 0.2 mm is suitable, and a glass plate with a thickness of 0.2 mm must be recommended at the present time, but it is thin due to improvement in the cutting size of the glass substrate and handling. It is possible to adopt a glass plate in the future.

Finally, as shown in FIG. 1D, the pressing plate 86 is raised to release the fixing of the holding base 85, and although not shown, a mechanism such as a push-up pin provided in the holding base 85 is used. The integrated display device substrate is floated from the holding table 85, and the bonding device 80 is passed through the gate valve and the vacuum standby chamber 84 by a transfer means such as a robot arm.
After that, the display device substrate according to the first embodiment is completed.

The display device substrate according to the first embodiment is 2
The two glass substrates 2a and 2b are in close contact with each other due to the intermolecular attractive force, and in order to peel off the two glass substrates 2a and 2b, simply peel the two glass substrates 2a and 2b from each back surface by vacuum suction. However, it does not peel easily, so 2
An auxiliary means such as heating the glass substrates 2a, 2b or peeling by leaving the glass substrates 2a, 2b in pure water to which carbon dioxide gas is melted and having a suitable conductivity is required. The display device substrate according to the second embodiment has a function for facilitating the peeling.

(Second Embodiment) In a method of manufacturing a display device substrate according to a second embodiment of the present invention, first, although not shown, two glass substrates 2a having substantially the same size but different plate thicknesses are used. Alternatively, 9a is cleaned by an appropriate means, washed with pure water and dried, then transferred from the outside of the bonding apparatus 80 to the processing chamber 81 through the vacuum standby chamber 82, the gate valve, and the processing chamber 81, as shown in FIG. As shown in a), the thin glass substrate 2a or 9a is transferred onto a flat holding table 85 and fixed on the holding table 85 by an appropriate means.

Next, as shown in FIG. 3B, in the processing chamber 81, a ceramic having a diameter of several to several tens of μm, quartz,
A spacer 90 made of bead or fiber having high heat resistance such as sapphire is provided with a supply port 91 together with a small amount of inert gas.
More spread on the glass substrate 2a or 9a. The amount of spray and the density of spray do not have to be as strict as the spacers of the liquid crystal panel, and the plate thickness deviation of the glass substrate 2a or 9a is 20μ.
Since it is about m, a deviation in particle size of the spacer 90 of about several μm is allowed.

Next, as shown in FIG. 3 (c), an appropriate holding means, for example, a robot arm for handling the glass substrate 2b or 9b having a large thickness including the end portion of the glass substrate 2b or 9b is used. It is used and transferred onto the glass substrate 2a or 9a. And the glass substrate 2b or 9b
When most of them are lightly pressed by the pressing plate 86, the two glass substrates 2a and 2b (or 9a and 9b, hereinafter omitted) face each other with a gap corresponding to the spacer 90. Then, the carbon dioxide gas laser beam 87a is applied to, for example, the glass substrates 2a and 2b.
The glass substrate 2a, 2b is irradiated at the outer peripheral portion 88 by irradiating so as to scan along the outer peripheral portion 88 which is about 0.1 mm inside the end portion of the
To be 89 by fusing, for example, with a width of about 50 μm.
Preferably, after this, the pressing plate 86 is moved to expose the back surface of the glass substrate 2b, and in the case of multiple cutting, laser light is also applied to several points on the dividing line or cutting line which is performed after the liquid crystal panel is completed. It is better to fuse them together to increase the mechanical strength of the laminated glass substrate.

In fusing the glass substrates 2a and 2b, it is advisable to utilize the technology such as focusing the carbon dioxide laser light 87a on the bonding surface of the glass substrates 2a and 2b, or using the excimer laser light together. Further, since the cutting accuracy of the glass substrate is about ± 0.1 mm, it is preferable to increase the irradiation position accuracy of the carbon dioxide gas laser beam 87a so that the fusion area 89 is formed even at the end portions of the glass substrates 2a and 2b. It is advisable to provide means for detecting the edges of the glass substrates 2a and 2b. Alternatively, the glass substrate 2a,
It is advisable to irradiate the end of 2b with excimer laser light 87b to fuse the ends.

After the two glass substrates 2a and 2b are adhered and fused, the pressing plate 86 is raised to release the fixing of the holding table 85 as shown in FIG. The integrated display device substrate is floated from the holding table 85 by a mechanism such as a pin, and taken out to the outside of the bonding device 80 by the transfer means such as a robot arm, through the gate valve and the vacuum standby chamber 84, and then the second device is used. The fabrication of the display device substrate according to the embodiment is completed.

(Third Embodiment) The third embodiment relates to a color filter obtained by using the display device substrate (laminated glass substrate) according to the third and fourth aspects.

Although not shown, ТFT (active type)
Color filters used in liquid crystal display devices are mass-produced in the manufacturing process described below. First, a BM pattern made of an opaque material is formed on a glass substrate. As the BM material, a photosensitive black resin having a film thickness of about 1 μm is selectively formed as it is by the photo etching technique, and a Cr (chrome) thin film having a film thickness of about 0.1 μm is used by the photo etching technique. Some are selectively formed. In the latter case, BM
CrOx (chromium oxide) / Cr / CrOx is formed by forming an optical absorption layer on the Cr surface in order to suppress the reflected light from the
It may be a three-layer structure.

Next, colored layers (R, G, B) having a predetermined spectral characteristic are formed in a predetermined pattern so as to include a part of BM. The colored layer is formed for each color (R, G, B), that is, three times. Although there was a time when transparent gelatin was dyed with a dye or a pigment in the coloring layer, most of the present time, a photosensitive pigment resin containing a dispersed organic pigment having a film thickness of about 1 to 2 μm is used. In a liquid crystal display device having a small number of pixels, a Δ (delta) array may be used as a color filter pattern, but most of them have a vertical striped stripe pattern.

Finally, a transparent conductive layer having a film thickness of about 0.1 to 0.2 μm is formed by mask film formation on the colored layers (R, G, B) and substantially on the region corresponding to the image display portion. IТО (I
A counter electrode made of ndium-tin-oxide) is selectively formed. Then, after a protective resin or film is applied to prevent dust adhesion during transportation, it is stored in a dedicated transport container and shipped from the color filter manufacturing company to the liquid crystal panel manufacturing company.

It should be noted that in a horizontal electric field (IPS) liquid crystal display device having a counter electrode formed on the active substrate at a predetermined distance from the pixel electrode, the counter electrode made of a transparent conductive layer is not necessary, and particularly In a high-definition liquid crystal display device of 150 PPI or more, it is possible to incorporate a color filter on the active substrate from the viewpoint of improving the bonding accuracy between the color filter and the active substrate (Color-Filter).
-On-Array, abbreviation COA) has already become established.

The above-mentioned color filter manufacturing process requires at least two film forming steps and four photo-etching steps, but the maximum processing temperature is the formation of the transparent conductive layer on the photosensitive pigment resin. Due to the restriction of formation, the substrate heating temperature is 200 ° C at best
Is the limit. Therefore, the thermal expansion of the glass substrate and the swelling of the laminated glass due to the residual gas in the closed space between the laminated glass substrates do not hinder the production of the color filter at all, and the glass substrate having the conventional plate thickness is used. It is extremely easy to introduce the laminated glass substrate according to the present invention into the production line.

(Fourth Embodiment) A fourth embodiment is a manufacturing method for obtaining a thin liquid crystal panel, which is one display device substrate formed by bonding at least two glass substrates having different plate thicknesses. On the step of forming an active matrix on one main surface of the thinner glass substrate, and on the other main surface of the thinner glass substrate of the other display device substrate formed by bonding two glass substrates having different plate thicknesses A step of forming a color filter on the substrate, a step of sticking the active matrix substrate and the color filter so as to face each other using a sealing material and a spacer material, and a peripheral portion of the pair of display device substrates which are stuck to each other. It consists of a step of cutting and removing two thick glass substrates, and a step of cutting a bonded mother glass substrate consisting of two thin glass substrates. .

The process of forming the active matrix is as follows.
Generally, a step of forming a scanning line that also serves as a gate electrode of an insulated gate transistor, a step of forming a semiconductor layer to be a channel of an insulated gate transistor over the scanning line with a gate insulating layer interposed therebetween, and a step of forming a semiconductor layer on the semiconductor layer. A step of forming a semiconductor layer containing an impurity which becomes a source / drain in contact with or overlapping with each other; a step of forming a pixel electrode including the signal line and the drain wiring also serving as the source wiring of the insulated gate transistor and the drain wiring And a step of forming a passivation insulating layer that protects at least the source / drain wiring (and the channel of the semiconductor layer), and a step of exposing the scanning line and the electrode terminal of the signal line.

A transparent liquid crystal display device can be obtained with transparent conductive pixel electrodes, or a reflective liquid crystal display device with metallic pixel electrodes. Since the transflective liquid crystal display device has both characteristics, it is necessary to partially dispose the transparent electrode and the metal reflective electrode as the pixel electrode in the pixel. Further, as described above, in the horizontal electric field type (IPS) liquid crystal display device, the transparent conductive picture element picture element electrode is unnecessary.

The order of the manufacturing process, the rationalization of the manufacturing process, the difference in the wiring material, and the like are not essential problems. What is important is the formation temperature of the insulating layer including the semiconductor layer and the gate insulating layer.
When a silicon nitride layer (SiNx) is used for the gate insulating layer, the maximum processing temperature is 35 at the time of forming the gate insulating layer.
About 0 ° C is required. When a low-temperature polysilicon thin film is used for the semiconductor layer and a silicon oxide layer (SiOx) is used for the gate insulating layer, recovery of various damages during the manufacturing process,
Alternatively, a maximum treatment temperature of about 600 ° C. is required at the time of ion implantation or activation treatment (heat treatment) of the irradiated impurities. This limit of 600 ° C. is the largest reason why glass substrates can be used. In many cases, heating such as excimer laser annealing or high speed lamp annealing is performed locally and in a short time of several seconds or less, so that even if the temperature exceeds 600 ° C., there is no problem such as melting or deformation of the entire glass substrate. There is no.

In any case, as shown in FIG. 4, the laminated glass substrates 2a and 2b according to the present invention on which active elements are formed and the color filters using separately prepared laminated glass substrates 9a and 9b according to the present invention are shown in FIG. As in the conventional method, a sealing material (not shown) is used for the attachment. If a color filter or a columnar spacer formed on an active substrate is used as a gap control mechanism of a liquid crystal cell, the bead dispersion step is unnecessary. Also, there is no problem even if the liquid crystal panel is formed by simultaneously performing the bonding step and the liquid crystal encapsulation by the liquid crystal dropping method (see Japanese Patent Laid-Open No. 63-179323).

Then, as shown in the drawing, the peripheral portion of the mother glass substrate is divided into one of the glass substrates 9a and 9b along the four cutting lines 95-1 to 95-4 on one side. Although not shown, the other glass substrate 2a, 2b is also divided along the four cutting lines. Since each laminated glass substrate is composed of two thin glass substrates 2a, 2b and 9a, 9b, it is necessary to take care so as not to cause cracking or chipping in the conventional scribe and the subsequent break (generally divided). Therefore, the laser cutting technology which has been recently developed is recommended. For example,
In the DLC-600 manufactured by SCHOTT Co., a carbon dioxide gas laser as a heating means is narrowed down to an irradiation diameter of about 0.01 to 0.1 mm,
It is a technology that causes latent scratches in the glass substrate by blowing cooling gas and rapidly heating and cooling while scanning in the cutting direction. Depending on the conditions, laser cutting is possible if the plate thickness is 0.3 mm or less. , A thicker thickness causes latent scratches, so a much weaker break (press) than conventional scribe
Can be divided by. In the present invention, the thick glass substrate 9b
Not only (2b) but also laser cutting conditions that cause latent scratches on the thin glass substrate 9a (2a) are required.

Desirably, it is necessary to develop laser cutting conditions for cutting the thick glass substrate 9b, the thin glass substrate 9a, and further the thin glass substrate 2a, and causing latent scratches on the last thick glass substrate 2b. Requires the development of laser cutting conditions for cutting all the glass substrates 9b, 9a, 2a and 2b at once.

As described above, in order to increase the strength of the integrated glass substrate, when a part of the dividing line or the dividing line is fused, laser cutting is performed along the dividing line. For example, a mother glass substrate divided into 4 and 6 parts is obtained.

Thus, even if the mother glass substrate is cut by using the laser cutting technique or the like, the unnecessary thicker glass substrate will not be naturally peeled off as long as it is a laminated glass substrate which is bonded with substantially no gap. . In order to remove it, it is necessary to leave it in a heated atmosphere, blow it with ionized air using an ionizer, or dissolve it in pure water that has been made conductive by dissolving carbon dioxide. is there. On the other hand, a laminated glass substrate bonded via a heat resistant spacer can be easily peeled off. Subsequently, although not shown, a pair of mother glass substrates composed of two thin glass substrates 2a and 9a are multi-chambered using the laser cutting technique described above (for example, 12 faces in FIG. 4). To obtain individual empty panels (a liquid crystal panel is obtained at this point by the dropping method). And
The fourth embodiment of the present invention is completed by filling and sealing the liquid crystal in each empty panel.

In the fourth embodiment, both the active substrate and the color filter are made thin by using a laminated glass substrate. However, since the liquid crystal display device is composed of two glass substrates, it is possible to match one of the glass substrates. It is also possible to use a glass substrate. Although the effect of reducing the thickness is reduced, the effect that the manufacturing method and the manufacturing apparatus for the two glass substrates constituting the liquid crystal display device are the same as the conventional ones and there is no change is not small. If a laminated glass substrate is used for either one, considering the process length and the maximum processing temperature, etc., the counter glass substrate having the color filter or the transparent conductive counter electrode is overwhelming as already described. It's easy.

(Fifth Embodiment) The fifth embodiment is a manufacturing method for obtaining a thin light emitting display device, in which a display device substrate formed by bonding two insulating substrates having different plate thicknesses is thin. On one main surface of the other glass substrate, at least a switching insulated gate transistor, a scanning line also serving as a gate electrode of the switching insulated gate transistor, a signal line also serving as a source wiring, and a storage capacitor connected to a drain wiring. A step of forming unit pixels having a driving insulated gate transistor and a display electrode connected to a drain wiring of the driving insulated gate transistor in a two-dimensional matrix, and forming the unit pixel on the display electrode. Forming a light emitting display medium, forming a common electrode on the light emitting display medium, sealing at least a light emitting region, From the step of cutting and removing the thick glass substrate by cutting and removing the peripheral portion of the display device substrate on which the optical display device is multi-faced, and the step of dividing the mother glass substrate made of the thin glass substrate Become.

As shown in the equivalent circuit of FIG. 5, in the process of forming the light emitting active matrix, the thinner glass substrate of the display device substrate formed by bonding two insulating substrates having different plate thicknesses together. A storage connected to at least a switching insulated gate transistor 10, a scanning line 11 also serving as a gate electrode of the switching insulated gate transistor 10, a signal line 12 also serving as a source wiring, and a drain wiring 21 on one main surface of Formed by arranging unit pixels having a capacitor 15, at least one driving insulated gate transistor 40, and a display electrode connected to the drain wiring of the driving insulated gate transistor 40 in a two-dimensional matrix. Common to the step of forming a light emitting display medium (light emitting diode 41) on the display electrode, and And a step of forming a pole 43.
The storage capacitor 15 is necessary for turning on the driving insulated gate transistor 40 during the holding period (Japanese Patent Laid-Open No. 6-3
25869), organic EL as a light emitting display medium
Consisting of a conductive thin film layer formed on a light emitting thin film, or consisting of a conductive thin film layer formed on a light emitting display medium,
A common electrode 43 is a feedback line (ground line, ground line) for a current flowing commonly to all the light emitting elements 41 (Japanese Patent Laid-Open No. 8-2.
34683). Reference numeral 42 denotes a power supply line for supplying electric power for driving the light emitting display medium, which is commonly connected to the sources of all the driving insulated gate transistors 40 and is composed of a conductive path formed on an insulating substrate.

The driving insulated gate transistor 4
If the threshold voltage of 0 varies and the current for driving the light emitting element 41 also varies, the fidelity of the displayed image is lost. Therefore, a plurality of driving insulated gate transistors 40, for example, four are arranged to cancel the offset. This is also applicable from the semiconductor integrated circuit design technology.

In the light emitting element (light emitting diode 41), one conductive thin film is a transparent conductive layer and the other conductive thin film is a metal reflective layer, and an organic EL light emitting thin film is sandwiched between these pair of electrodes. There is. Since the light emitted from the organic EL light emitting thin film is emitted to the outside from the transparent conductive layer side,
When the transparent conductive layer is formed on one main surface of the glass substrate, the light emitted from the other main surface of the glass substrate is emitted to the outside, and the transparent conductive layer is formed on the main surface of the glass substrate. When it is formed on the formed organic EL light emitting thin film, the light emitted from the one main surface of the glass substrate is emitted to the outside. The former configuration is disadvantageous from the viewpoint of the aperture ratio of the pixel. However, it is disadvantageous to form a transparent conductive layer having low resistance and high transparency on the organic EL light emitting thin film in view of damage to the organic EL light emitting thin film, but it is speculated that the latter will be dominant due to technological development. To be done.

The organic EL light emitting thin film has a thickness of 0.1 to 10.
Combined with its thinness of 0.3 μm, a low molecular weight type formed by vacuum vapor deposition requires a strict sealing means to prevent the surrounding moisture from invading and deteriorating. As shown in FIG. 6, the light emitting region is sealed with a cap-shaped aluminum waterproof lid 70 in which a desiccant (not shown) is incorporated using an ultraviolet curable resin or the like. On the contrary,
Since the degree of deterioration of the polymer type that can be formed by coating is relatively weaker than that of the low molecular type, forming a protective insulating layer with an inorganic thin film, an organic thin film or a laminated film of these forms a sealing means. There is.

The order of the manufacturing steps, the rationalization of the manufacturing steps, the difference in the wiring material, and the like are not essential problems. What is important is that the active substrate including the light emitting element is provided with a mechanism / means for preventing the intrusion of moisture or the like in the step of cutting the glass substrate. In any case, a step of forming a light emitting element including a display electrode and a common electrode and an active element on a laminated glass substrate according to the present invention, a step of sealing at least a light emitting region, and the light emitting display device are multi-faced. A light-emitting display device is formed by the steps of cutting and removing the peripheral edge portion of the mother glass substrate to remove the thick glass substrate and the step of dividing the mother glass substrate made of the thin glass substrate.

FIG. 7A shows, for example, a mother glass substrate on which four-sided organic EL display devices are formed.
The semiconductor integrated circuit chips 3a and 3b for driving are mounted. Reference numerals 60 and 61 denote power supply lines on the signal line side and the scanning line side, respectively.
It is a common wiring such as a high-speed clock line. It should be noted that a hat-shaped waterproof lid 70 or a waterproof film 71 made of a multilayer film is formed on the image display portion. Although two types of waterproof means are shown here, either the waterproof lid 70 or the waterproof film 71 is actually selected. In the organic EL display device, it is necessary to flow a large amount of current through the light emitting element, and the switching insulating gate type transistor 10 and the driving insulating gate type transistor 40 have a large current driving capability, for example, an insulating gate using low temperature polysilicon as a semiconductor material. Type transistors are generally used. In this case, it is relatively easy to incorporate a semiconductor integrated circuit for driving. In that case, as shown in FIG. 7B, a power supply line, a high-speed clock line, etc. are provided in the area outside the image display unit. Only by forming the common wirings 60 and 61, the appearance of the device is greatly simplified.

When dividing the light emitting display device which is attached on the laminated glass substrate in multiple directions, the peripheral portion of the mother glass substrate is divided. The glass substrate does not peel off spontaneously. Therefore, the low heat resistance of organic EL materials (up to 100 ° C for low-molecular type and up to 200 for high-molecular type
Considering the temperature (about ° C), leaving it in a heated atmosphere causes serious deterioration of display characteristics. Therefore, leave it while blowing ionized air with an ionizer, or use pure water that has been rendered conductive by dissolving carbon dioxide gas. It is necessary to take measures such as leaving it inside. On the other hand, a laminated glass substrate bonded via a heat resistant spacer can be easily peeled off.
Subsequently, although not shown in the drawing, the multi-chamber light emitting display device is divided by using the laser cutting technique described above for the mother glass substrate composed of a thin glass substrate to obtain individual light emitting display devices to obtain the first invention of the present invention. The fifth embodiment is completed.

[0074]

As described above, when the substrate for a display device according to the present invention is used, it is necessary to introduce a new cutting technique in part of the cutting process for multi-sided attachment, but it is necessary to use it as a base for existing mass production lines. The glass substrate has a thickness of 0.05-0.
It is possible to manufacture a 2 mm display device. The innovation of the present invention is remarkable unless a production facility for processing such a thin glass substrate is put into practical use.

Similarly, the thinning and lightening of the display device have reached almost the ultimate level, which is caused not only by the thinning and lightening effects in a mobile phone, a portable information display terminal device, etc., but also by these. It becomes possible to mount a new functional element, an integrated circuit that realizes the same, or a multilayer wiring board in an empty space, and a side effect that brings about a new creation can be obtained.

Further, as compared with the conventional thinning technique of chemically / mechanically polishing a glass substrate, not only a large amount of chemicals and abrasives are not required, but also drainage treatment related thereto is not required. . Furthermore, since the inorganic and organic materials that make up the display device do not adhere to the thick glass plate that is cut and removed, it is possible to collect it at the display device manufacturing site and provide it to glass makers as good scrap glass. Recycling is easily realized, and at the same time material saving is achieved. In other words, it is a technology that is kind to humanity, taking into consideration the space environment and the global environment.

As is clear from the description of the embodiments, the requirements of the present invention are such that a thin display device is obtained by using a display device substrate obtained by bonding two glass substrates having different plate thicknesses. However, it is clear that the material, manufacturing method, and configuration for manufacturing the display device are not restricted at all. For example, a liquid crystal display device in which a colored layer is formed on an active substrate is also within the scope of the present invention. is there. In addition, it should be supplemented that even devices other than display devices can be applied as long as the insulation and heat resistance meet the requirements.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a manufacturing process of a display device substrate according to a first embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a bonding machine used for manufacturing a display device substrate according to an embodiment of the present invention.

FIG. 3 is a sectional view of a manufacturing process of a display device substrate according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a mother glass substrate for a liquid crystal display device according to a third embodiment of the present invention.

FIG. 5 is an equivalent circuit diagram of a light emitting display device according to a fifth embodiment of the present invention.

FIG. 6 is a diagram showing a light emitting display device according to a fifth embodiment of the present invention.

FIG. 7 is a view showing a mother glass substrate for a light emitting display device according to a fifth embodiment of the present invention.

FIG. 8 is a perspective view showing a mounted state of a liquid crystal panel.

FIG. 9 is an equivalent circuit diagram of a liquid crystal panel.

FIG. 10 is a sectional view of a conventional liquid crystal panel.

FIG. 11 is a diagram showing a mother glass substrate for a liquid crystal display device of a prior art example.

FIG. 12 is a cross-sectional view of a display device substrate disclosed in another prior art example.

[Explanation of symbols]

1 LCD panel 2,2a glass substrate 3 Semiconductor integrated circuit chip 4 TCP film 5, 6 electrode terminal group 9,9a Color filter (opposite glass substrate) 10 Insulated gate type transistor 11 scanning lines (gate wiring, gate electrode) 12 signal lines (source wiring, source electrode) 13 Liquid crystal cell 14 Counter electrode 15 Storage capacity 16 storage capacity line 17 LCD 18 Coloring layer 19 Polarizer 20 Polyimide resin thin film 21 Drain wiring (electrode) 22 (Transparent conductive) picture element electrode 23 Semiconductor layer 24 Cr thin film layer 40 Insulated gate transistor for driving 41 Light emitting element (light emitting diode) 42 power line 43 Common electrode 50 bonded substrates 51 Protective resin 52 O-ring 60, 61 common wiring 70 waterproof lid 71 waterproof membrane 80 (Glass substrate under reduced pressure) Laminating device 81 Processing room 82,83,84 vacuum waiting room 85 holding table 86 Press plate 87 Laser light 88 outer periphery 89 Fusion area 90 Spacer (of laminated glass substrate) 91 Supply port 95 Cutting line (on the periphery of the laminated glass substrate)

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) G02F 1/1339 500 G02F 1/1339 500 3K007 505 505 505 5C094 1/1368 1/1368 5G435 G09F 9/00 338 G09F 9/00 338 9/35 9/35 H05B 33/02 H05B 33/02 33/04 33/04 33/10 33/10 33/14 33/14 AF term (reference) 2H088 FA02 FA03 FA05 FA10 FA21 FA26 HA01 HA08 HA12 HA14 MA02 MA17 2H089 NA09 NA24 NA39 QA06 QA12 QA14 TA01 TA09 TA12 TA13 2H090 JA09 JB02 JC13 JC19 JD17 LA02 LA03 LA05 LA15 2H091 FA02Y FA35Y FC16 GA01 GA08 GA09 GA13 LA04 LA12 LA05 LAJ LAJ LAJ LAB J27 JB22 J51 NA29 PA01 PA03 PA04 PA08 PA09 3K007 AB00 AB18 BA06 BB01 BB07 CA01 DB03 FA01 FA02 5C094 AA15 AA43 AA46 BA03 BA27 BA43 CA19 CA24 DA12 DA13 EA04 EA05 EA07 EB02 FA01 BB07 BB10 BB10 BB10 ABB5A08 BB12 ABB15A08 BB12 ABB15A08 BB12 ABB15A08 BB12 ABB15A08 BB10 ABB15A08 BB12 ABB15A08 BB10 ABB15A08 BB12 ABB15A08 BB10 ABB15A08 BB12 ABB15A08 BB10 ABB15A08 BB10 ABB15A08 BB10 ABB ABBBAA BB15 ABB BBA BBA ABBBA BB AA

Claims (9)

[Claims] 1. A main surface is provided with at least an insulated gate transistor, a scanning line also serving as a gate electrode of the insulated gate transistor, a source electrode also serving as a signal line, and a drain electrode connected to a pixel electrode. The unit substrate having the unit picture elements is arranged in a two-dimensional matrix, and the color filter or the counter substrate on which a colored layer having at least a predetermined spectral characteristic is formed in a predetermined pattern on at least one main surface is made to face each other. In a liquid crystal display device in which the gap is filled with liquid crystal, one or both of the insulating substrate, the color filter and the counter substrate has a thickness of 0.05 to
A liquid crystal display device, which is a 0.2 mm glass plate. 2. A storage capacitor connected to at least a switching insulated gate transistor, a scanning line also serving as a gate electrode of the switching insulated gate transistor and a signal line also serving as a source wiring, and a drain wiring on one main surface. An insulating substrate in which unit pixels having a driving insulated gate transistor and a display electrode connected to a drain wiring of the driving insulated gate transistor are arranged in a two-dimensional matrix; and a light emitting display medium, A display device comprising at least a mechanism for sealing the light emitting display medium, wherein the insulating substrate is a glass plate having a thickness of 0.05 to 0.2 mm. 3. A substrate for a display device, which comprises two glass substrates having substantially the same size and different plate thicknesses, which are opposed to each other with substantially no gap, and at least the vicinity of the end face is bonded. 4. A substrate for a display device in which a closed space formed by joining two glass substrates having substantially the same size but different plate thicknesses with each other through a spacer and bonding at least the vicinity of the end face is in a reduced pressure state. 5. The coloring layer having at least a predetermined spectral characteristic is formed in a predetermined pattern on one main surface having a smaller plate thickness, according to claim 3 or 4. A color filter using the substrate for a display device according to. 6. A step of cleaning two glass substrates having substantially the same size and different plate thicknesses, a step of fixing the two glass substrates so as to face each other under a reduced pressure with substantially no gap, and at least a peripheral edge. Irradiating a laser beam in the vicinity of the end face of the portion to fuse the two glass substrates together. 7. A step of spraying a spacer material on one of the two glass substrates having substantially the same size and different plate thickness under reduced pressure, and the two glass substrates facing each other. A method of manufacturing a substrate for a display device, which comprises a step of fixing and a step of irradiating at least the vicinity of an end face of a peripheral portion with laser light to fuse the two glass substrates. 8. A step of forming an active matrix on one main surface of a glass substrate of one display device, which is formed by bonding at least two glass substrates having different plate thicknesses, and a step of forming the active matrix differently. A step of forming a color filter on one main surface of a thinner glass substrate of the other display device substrate formed by bonding two glass substrates, and the active matrix substrate using a sealant and a spacer material. A step of adhering the color filters to face each other; a step of cutting and removing the peripheral portions of the pair of adhered display device substrates to remove two thick glass substrates; and a thin plate thickness. A method of manufacturing a liquid crystal display device, comprising a step of cutting a bonded mother glass substrate composed of two glass substrates. 9. An insulating gate type transistor for switching at least on one main surface of a glass substrate of a thinner one of a substrate for a display device, which is formed by bonding two insulating substrates having different plate thicknesses, and the insulating gate type for switching. A scanning line that also serves as a gate electrode of a transistor, a signal line that also serves as a source wiring, a storage capacitor connected to a drain wiring, a driving insulated gate transistor, and a display connected to the drain wiring of the driving insulated gate transistor. Forming unit pixel elements having electrodes by arranging them in a two-dimensional matrix, forming a light emitting display medium on the display electrodes, and forming a common electrode on the light emitting display medium,
At least a step of sealing a light emitting region, a step of cutting and removing a thick glass substrate by cutting and removing a peripheral portion of a display device substrate to which the light emitting display device is attached, and a thin glass substrate. And a step of dividing a mother glass substrate made of