KR101279231B1 - Transfer film liquid crystal display device fabricated using the same and fabricating method for the liquid crystal display device - Google Patents

Abstract

 The present invention relates to a liquid crystal display device, and more particularly, A first transfer layer formed on the base layer and transferred to an image receiving substrate; And a second transfer layer formed on the first transfer layer and transferred to the transfer source substrate at the same time as the first transfer layer to improve adhesion between the first transfer layer and the transfer destination substrate, It is possible to simplify the manufacturing process of the liquid crystal display device and improve the productivity.

 Transfer film, alignment film, liquid crystal display device

Description

TECHNICAL FIELD [0001] The present invention relates to a transfer film, a liquid crystal display device using the same, and a manufacturing method thereof,

1A and 1B are diagrams showing a process of forming an alignment film using a printing plate.

2 is a cross-sectional view of a transfer film according to the first embodiment of the present invention.

3A to 3D are process charts illustrating a method of manufacturing a liquid crystal display device using a transfer film according to an embodiment of the present invention.

4 is a cross-sectional view of a liquid crystal display device manufactured using a transfer film according to an embodiment of the present invention.

 DESCRIPTION OF THE REFERENCE NUMERALS (S)

 100: base layer 110: first transfer layer

 120: second transfer layer 130: protective film

 200: an image receiving substrate 300: a first substrate

 400: second substrate 500: sealant

 600: liquid crystal layer

The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device manufactured using a transfer process.

Today, among the flat panel display devices, liquid crystal display devices are becoming popular as next generation display devices which are not only lightweight and thin but also low in power consumption, good in portability, and highly value-added.

Such a liquid crystal display device is formed through a process of forming a first substrate on which a thin film transistor is formed and a second substrate on which a color filter is formed and forming a liquid crystal layer between the first substrate and the second substrate.

Here, a step of forming an alignment film for setting an initial alignment of liquid crystal on at least one of the first substrate and the second substrate is further added.

The alignment layer may be formed using a printing technique using a printing plate.

1A and 1B are diagrams showing a process of forming an alignment film using a printing plate.

Referring to FIG. 1A, a substrate 10 on which an alignment film is to be formed is provided. (20) on which an alignment film (21) is applied onto the substrate (10). The alignment film 21 formed on the printing plate 20 is transferred to the substrate 10. Here, a predetermined pressure is applied to the printing plate 20 in order to transfer the alignment film 21 formed on the printing plate 20 to the substrate 10. At this time, since the alignment film 21 formed on the printing plate 20 has ductility and a certain pressure is applied to the printing plate 20, a mount M, which is convex at the edge of the printing plate 20, Lt; / RTI >

Referring to FIG. 1B, after the printing plate 20 is removed, an alignment film 21 is formed on the substrate 10 through a curing process. At this time, as described above, the mount M is generated at the edge portion of the alignment film 21, and the alignment film is not uniformly formed.

Further, after forming a plurality of cells on a large substrate today, cutting the cells and forming several cells at the same time, the productivity was improved. In recent years, the substrate has become increasingly large. Accordingly, although the printing plate must be made larger, there is a limit in manufacturing a large printing plate. Thus, the large-sized printing plate is formed by bonding several small printing plates and then bonding the small printing plates.

At this time, when an alignment film is formed using a large-sized printing plate produced by joining at least two small printing plates, the alignment film is unevenly formed at the joining portion. As a result, since the cells are designed on the large substrate by avoiding the bonding portion of the printing plate, the space margin between the cells is reduced on the large substrate, and it is difficult to efficiently use the large substrate.

An object of the present invention is to provide a transfer film which can form a uniform alignment film and is used in a transfer process capable of efficiently forming an alignment film on a large substrate.

Another object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which are manufactured using the transfer film.

According to an aspect of the present invention, there is provided a transfer film. The transfer film comprising a substrate layer; A first transfer layer formed on the base layer and transferred to an image receiving substrate; And a second transfer layer formed on the first transfer layer and transferred to the transfer target substrate at the same time as the first transfer layer to improve adhesion between the first transfer layer and the transfer target substrate.

According to another aspect of the present invention, there is provided a liquid crystal display device. The liquid crystal display device includes a substrate; An alignment layer formed on the substrate; And an adhesive layer positioned under the alignment layer and bonding the substrate and the alignment layer.

 The liquid crystal display may further include a thin film transistor formed on the substrate and a pixel electrode electrically connected to the thin film transistor.

Alternatively, the liquid crystal display may further include a color filter formed on the substrate, an overcoat layer formed on the color filter, and a common electrode formed on the overcoat layer.

According to another aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device. The method comprises: providing a substrate; Laminating a transfer film onto the substrate; And transferring the transfer layer of the transfer film to the substrate to form an alignment film.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of an apparatus may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

2 is a cross-sectional view of a transfer film according to an embodiment of the present invention.

Referring to FIG. 2, a substrate layer 100 is located. Here, the base layer 100 may be formed of a material having transparency and having excellent light transmittance. For example, the substrate layer 100 may be formed of at least one selected from the group consisting of glass, polyester, polymethylmethacrylate, polyethylene, polyethylene terephthalate, polycarbonate, polyurethane and polyacrylic.

A first transfer layer 110 is formed on the base layer 100. The first transfer layer 110 is formed of a material to be transferred to an image receiving substrate. That is, the first transfer layer 110 may be formed of a material for forming an alignment layer. Here, the material for forming the alignment film may be a polyimide-based resin. The first transfer layer 110 may be formed of a material for forming an organic pattern that constitutes a liquid crystal display device. Here, the organic pattern may be formed of any one of a color filter and an overcoat layer.

A second transfer layer 120 is formed on the first transfer layer 110. The second transfer layer 120 has adhesiveness to an image receiving substrate to improve adhesion between the transfer film and the image receiving substrate. Thereby, it is possible to prevent the transfer film from moving during the transferring process using the transfer film and deteriorating the transfer characteristics.

At this time, the second transfer layer 120 reacts with light to have adhesiveness. The first transfer layer 110 corresponding to the lower part of the second transfer layer 120 to which the light is irradiated is transferred to the transfer substrate 120 by irradiating light to a certain region of the second transfer layer 120. [ do.

Or the second transfer layer 120 has adhesiveness to an image receiving substrate, and may react with light to deteriorate adhesiveness. The first transfer layer 110 corresponding to the lower part of the second transfer layer 120 to which the light is not irradiated is irradiated to a part of the transfer substrate Transferred.

The second transfer layer 120 may be formed of at least one selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and an imide resin.

That is, the second transfer layer 120 plays an important role in transferring the first transfer layer 110 to the transfer substrate.

Furthermore, the protective film 130 formed on the second transfer layer 120 may be further included. The protective film 130 prevents the second transfer layer 120 from being contaminated. The protective film 130 is desorbed before performing the transfer process using the transfer film. That is, the protective film 130 is adhered to the second transfer layer 120 and can be easily attached and detached.

In addition, a release layer (not shown) interposed between the base layer 100 and the first transfer layer 110 may be further included. Here, the release layer facilitates separation of the base layer 100 and the first transfer layer 120 during a transfer process. The releasing layer has a property of being adhesive in response to light or of decreasing adhesiveness. Here, the release layer may be formed of at least one selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and an imide resin.

At this time, the release layer is formed so as to have characteristics opposite to those of the second transfer layer 120. That is, when the second transfer layer 120 has increased adhesiveness by light, the release layer has the property that adhesiveness is lowered by light. On the other hand, if the second transfer layer 120 is deteriorated in adhesiveness by light, the release layer has a property of increasing adhesiveness by light. Thereby, the second transfer layer and the first transfer layer are easily transferred to the transfer target substrate by the release layer.

3A to 3D are process charts illustrating a method of manufacturing a liquid crystal display device using a transfer film according to an embodiment of the present invention.

Referring to FIG. 3A, a transfer film T is provided. The transfer film T may be wound on the roll 140, and may have a flat substrate shape unlike the drawing.

As described above, the transfer film T includes a base layer 100, a first transfer layer 110 formed on the base layer 100 and transferred to an image receiving substrate, A second transfer layer 110 formed on the first transfer layer 110 and transferred to the transfer source substrate 110 simultaneously with the first transfer layer 110 to improve adhesion between the first transfer layer 110 and the transfer source substrate 200, (120).

The base layer 100 may be transparent plastic or glass with good light transmittance. The first transfer layer 110 is formed with an alignment film forming material formed of a polyimide resin. In addition, the second transfer layer 120 may be formed of a material that reacts with light to have adhesiveness or deteriorates adhesiveness. At this time, the second transfer layer 120 may be formed of at least one selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and an imide resin.

The transfer film T may further include a protective film 130 disposed on the second transfer layer 120 to prevent the second transfer layer 120 from being contaminated. A release layer (not shown) interposed between the base layer 100 and the first transfer layer 110 may be further included to improve transfer characteristics of the first transfer layer 110 have.

As shown in FIG. 3B, the roll 140 on which the transfer film T is wound and the image receiving substrate 200 are provided as lamination equipment. A pixel electrode electrically connected to the thin film transistor and the thin film transistor may be formed on the substrate. Alternatively, a color filter, an overcoat layer formed on the color filter, and a common electrode may be formed on the image-receiving substrate.

After the protective film 130 of the transfer film T is removed, the transfer film T and the image receiving substrate 200 are laminated.

Referring to FIG. 3C, the transfer film T is laminated on the transfer substrate 200, and a mask M is provided on the transfer film T. Then, light is provided on the mask M. As a result, the pattern of the mask M is projected onto the transfer film T. At this time, the second transfer layer 120 of the transfer film T reacts with light and has an adhesive force with respect to the transfer substrate 200. Unlike the drawing, the second transfer layer 120 may be deteriorated in adhesion to the image receiving substrate 200 in response to light.

Referring to FIG. 3D, the transfer film T is separated from the image receiving substrate 200. At this time, the second transfer layer 120 in the region irradiated with the light is formed with an adhesive force to the transfer source substrate 200, and the second transfer layer 120 in the region irradiated with the light, The first transfer layer 110 positioned on the transfer substrate 200 is transferred to the transfer source substrate 200 and the adhesive layer 120 'and the alignment film 110' are formed on the transfer source substrate 200. That is, a part of the second transfer layer 120 of the transfer film T is transferred, and the alignment layer 110 'is transferred to the first transfer layer 110 (110') of the transfer film T, ) Was transferred.

Here, the transfer source substrate 200 may be a large substrate. At this time, even if the transfer source substrate 200 is a large-sized substrate, a large-sized printed substrate is not required, and an alignment film can be easily formed through a transfer process using the transfer film. The transferring process may be an exposure process using a mask of a predetermined size on the transfer film. The transfer film may be formed by a wet process that is easy to process, such as a spray coating process, a dip coating process, a doctor blade process, Can be produced through a die coating method. In addition, since the mask is subjected to the exposure process by shifting the laminated to-be-irradiated substrate and the transfer film several times, there is no need to manufacture a separate large mask. Thus, when a plurality of printing plates are conventionally joined to form an alignment film on a large substrate, it is not necessary to design a cell of the large substrate while avoiding the junction of the printing plate, and the cell is designed considering the cell efficiency of the large substrate first . That is, by forming the alignment film through the transfer process using the transfer film, not only the efficiency of the large substrate can be improved while the alignment film is uniformly formed, and the productivity can be improved.

Here, the formation of the alignment film through the transfer film is described as one embodiment. However, the present invention is not limited to this, and at least one of the color filter and the overcoat layer can be formed through the transfer process.

4 is a cross-sectional view of a liquid crystal display device manufactured using a transfer film according to an embodiment of the present invention.

Referring to FIG. 4, the first substrate 300 and the second substrate 400 are spaced apart from each other with a predetermined gap therebetween. The first substrate 300 and the second substrate 400 are bonded together by a sealant 500. A liquid crystal layer 600 is formed between the first substrate 300 and the second substrate 400, Is formed.

(Not shown in the figure) and a data line (not shown in the figure) are formed on the first substrate 300 so as to intersect with each other and define pixels. A gate insulating layer 310 is formed between the gate line and the data line.

In addition, at least one thin film transistor Tr is formed in the intersection region of the gate wiring and the data wiring. The thin film transistor Tr includes a gate electrode 301 formed by branching from the gate wiring, a semiconductor layer 311 on the gate insulating film 310 corresponding to the gate electrode 301, And source / drain electrodes 312 and 313 which are separately located on both ends of the source / drain electrodes 312 and 313, respectively.

A protective film 320 is formed on the gate insulating film 310 including the thin film transistor Tr. A pixel electrode 321 electrically connected to the thin film transistor is formed on the passivation layer 320 through the contact hole 320. The passivation layer 320 is formed on the passivation layer 320, have.

An alignment layer 340 for initial alignment of liquid crystal is formed on the pixel electrode 321. An adhesive layer 330 is formed under the alignment layer 340 to improve adhesion between the alignment layer 340 and the passivation layer 320 including the pixel electrode 321. Here, the first transfer layer may be formed of a material for forming the alignment layer 340 provided on the transfer film when the alignment layer 340 is formed using a transfer film. The first transfer layer may be formed on the first transfer layer, Since the second transfer layer made of the material for forming the pixel electrode 330 is transferred and formed on the protective layer 320 including the pixel electrode 321, the adhesive layer 330 is positioned under the alignment layer 340.

The alignment layer 340 may be formed of a polyimide resin. The adhesive layer 330 may be formed of at least one selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and an imide resin.

A black matrix 411 is formed in a region corresponding to the blocking region of the second substrate 400. The blocking region may be a region corresponding to a wiring formation region of the first substrate 300 and a region where the thin film transistor Tr is formed.

And a color filter 412 is formed in an area corresponding to the transmissive area of the second substrate 400. [ The transmissive region may be a region corresponding to a pixel region defined by intersecting a gate line and a data line formed on the first substrate 300. Here, the color pillars 412 may be partially overlapped with the black matrix 411.

An overcoat layer 420 may be further formed to overcome a step between the black matrix 411 and the color filter 412.

A common electrode 430 is formed on the overcoat layer 420 and an alignment layer 450 for initial alignment of the liquid crystal may be formed on the common electrode 430.

When the alignment layer 450 is formed using the above-described transfer film, an adhesive layer 440 may be further formed between the common electrode 430 and the alignment layer 450.

At least one of the color filter 412 or the overcoat layer 420 may be formed using the above-described transfer film, and at least one of the color filter 412 or the overcoat layer 420 And an adhesive layer 440 may be formed on the bottom.

As described above, according to the present invention, productivity can be improved by forming an alignment film through a transfer process through a transfer film.

In addition, in forming the alignment film on the large substrate through the transfer process using the transfer film, not only the alignment film can be uniformly formed, but also the efficiency of the large substrate can be improved.

In addition, the transfer process using the transfer film can be applied to other components other than the alignment film of the liquid crystal display device, that is, the color filter or the overcoat layer, thereby further improving the productivity.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. .

Claims (19)

A base layer; A first transfer layer formed on the base layer and transferred to an image receiving substrate; A second transfer layer formed on the first transfer layer and transferred to the transfer target substrate at the same time as the first transfer layer to improve adhesion between the first transfer layer and the transfer target substrate; And And a release layer interposed between the base layer and the first transfer layer to help separate the base layer from the first transfer layer, The second transfer layer reacts with light to lower the adhesiveness, Wherein the releasing layer reacts with light to increase the adhesiveness. The method according to claim 1, Wherein the second transfer layer has adhesiveness or adhesiveness to the image receiving substrate. delete The method according to claim 1, Wherein the second transfer layer is formed of at least one selected from the group consisting of an epoxy resin, an acrylic resin, a urethane resin, and an imide resin. The method according to claim 1, Wherein the first transfer layer is formed of a material for forming any one of an alignment layer, a color filter, and an overcoat layer constituting a liquid crystal display device. The method according to claim 1, Wherein the base layer is formed of at least one selected from the group consisting of polyester, polymethyl methacrylate, polyethylene, polyethylene terephthalate, polycarbonate, polyurethane and polyacryl. The method according to claim 1, Further comprising a protective film adhered to the second transfer layer and protecting the second transfer layer. delete delete Board; An alignment layer formed on the substrate; And And an adhesive layer disposed under the alignment layer and adhering the substrate and the alignment layer, Wherein the adhesive layer reacts with light to lower the adhesiveness. 11. The method of claim 10, A thin film transistor formed on the substrate, and a pixel electrode electrically connected to the thin film transistor. 11. The method of claim 10, A color filter formed on the substrate, an overcoat layer formed on the color filter, and a common electrode formed on the overcoat layer. 13. The method of claim 12, Further comprising an adhesive layer positioned below at least any one of the color filter and the overcoat layer. Providing a substrate; A first transfer layer formed on the base layer and transferred onto the substrate; a second transfer layer formed on the first transfer layer and transferred to the substrate simultaneously with the first transfer layer, A second transfer layer for improving adhesion between the transfer layer and the substrate, and a release layer interposed between the base layer and the first transfer layer to help separate the base layer from the first transfer layer, ; ≪ / RTI > And And transferring the first transfer layer and the second transfer layer onto the substrate by providing light to the transfer film, The second transfer layer reacts with light to lower the adhesiveness, Wherein the release layer reacts with light to increase the adhesiveness. 15. The method of claim 14, Wherein the first transfer layer is a material for forming an alignment film. delete 16. The method of claim 15, And forming a thin film transistor on the substrate and a pixel electrode electrically connected to the thin film transistor. 16. The method of claim 15, And forming a color filter, an overcoat layer formed on the color filter, and a common electrode formed on the overcoat layer on the substrate. 19. The method of claim 18, Wherein the first transfer layer is a material for forming the color filter or the overcoat layer.

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