KR102135913B1 - Clamp and Manufacturing Appratus of Organic Light Emitting Display Device Include the Clamp - Google Patents

Abstract

The present invention provides a clamp that can prevent the lifting of the lower film of the thermal bonding during the peeling process to secure the process yield, and to prevent various defects caused by organic particles originating from the laser thermal transfer film, which includes a first surface; A second surface spaced apart from the first surface; And a third surface connecting the ends of the first and second surfaces.

Description

Clamp and Manufacturing Appratus of Organic Light Emitting Display Device Include the Clamp}

The present invention relates to a clamp and an apparatus for manufacturing an organic light emitting display device including the same.

An organic light emitting device used in an organic light emitting display device is a self-emitting device having a light emitting layer formed between two electrodes positioned on a substrate. The organic light emitting display device includes a top-emission method, a bottom-emission method, or a dual-emission method according to the direction in which light is emitted.

When the scan signal, the data signal, and the power are supplied to a plurality of sub-pixels disposed on the display panel, the organic light emitting display device can display an image by emitting the selected sub-pixels.

The sub-pixel disposed on the display panel includes a transistor unit including a switching transistor, a driving transistor, and a capacitor, and an organic light emitting diode including a lower electrode, an organic emission layer, and an upper electrode connected to the driving transistor included in the transistor unit.

In order to realize a high-resolution organic light emitting display device, research into attempting a laser thermal transfer method in manufacturing a display panel has been conducted. In order to perform laser heat transfer, the lower substrate including the thermal transfer film and the transistor portion on which the organic material is deposited in a vacuum atmosphere is moved to an atmospheric pressure atmosphere and a transfer process is performed.

However, in this process, the thermal transfer film and the lower substrate are exposed to the atmosphere, and oxidation of organic substances occurs. In order to improve this, a process of protecting an organic material by using a heat-bonding lower film and a heat-transfer film is used.

However, in the conventionally proposed method, due to the adhesive force between the heat-bonding lower film and the heat-transfer film, the lift-up phenomenon of the heat-bonding lower film is emerging when peeling the heat-transfer film. In this case, there is a problem in that peeling defects and defects due to organic particles falling off the laser thermal transfer film occur, and there is a problem in that the performance and yield of the organic light emitting display device are reduced, and improvement thereof is required.

The present invention for solving the above-mentioned problems of the background technology is to prevent the lifting of the lower film of the thermal bonding during the peeling process to secure the process yield, and to prevent various defects caused by organic particles resulting from the laser thermal transfer film.

The present invention as a means for solving the problems described above is a first aspect; A second surface spaced apart from the first surface; And a third surface connecting the ends of the first surface and the second surface.

It may include suction portions formed on inner surfaces of the first and second surfaces.

It may include a tube formed inside the first surface and the second surface and communicating with the suction part.

The suction portion may be formed in a funnel shape having a triangular, circular or polygonal shape.

It may include an inclined surface formed on the third surface and inclined in the inner direction.

In another aspect, the present invention is a stage on which the object to be peeled is seated; A robot arm that inserts a clamp between the films included in the peeling object; And a gripper for removing the film located on the top of the films, wherein the clamp is a first surface, a second surface spaced apart from the first surface, and a third connecting the ends of the first surface and the second surface. It includes a surface, the clamp is inserted between the films by the robot arm, and provides an apparatus for manufacturing an organic light emitting display device characterized in that the three surfaces of the film located at the bottom of the film are pressed and fixed at the same time.

The clamp may include suction portions formed on inner surfaces of the first and second surfaces.

The clamp may include tubes formed inside the first surface and the second surface and communicating with the suction part.

The suction portion may be formed in a funnel shape having a triangular, circular or polygonal shape.

It may communicate with the tube of the clamp, and may include an adsorption control unit that generates suction power during the peeling process.

It may include a support roller that rotates and moves while supporting a portion of the film located on the upper portion of the film.

The clamp may include an inclined surface formed on the third surface and inclined in the inner direction.

The present invention prevents the lifting of the thermally bonded lower film during the peeling process, secures the process yield, and prevents various defects caused by organic particles resulting from the laser thermal transfer film, and a clamp and an organic electroluminescent display device including the same. There is an effect of providing a manufacturing apparatus.

1 is a block diagram schematically showing an organic light emitting display device.
FIG. 2 is an exemplary view of the sub-pixel shown in FIG. 1.
3 is a cross-sectional view showing a part of an organic light emitting display device.
4 and 5 are exemplary views showing a cross-sectional structure of a sub-pixel by enlarging the area EA1 of FIG. 3.
6 and 7 are flowcharts for schematically explaining a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.
8 is a plan view showing a clamp and a film according to the first embodiment of the present invention.
9 is a plan view and a side view of a clamp according to the first embodiment of the present invention.
10 is a plan view and a side view of a clamp according to a second embodiment of the present invention.
11 is a view showing the suction direction of the suction unit.
12 is a plan view showing the interior of the clamp according to the second embodiment of the present invention.
13 is an exemplary view showing various structures of the suction unit.
14 is a schematic configuration diagram of an apparatus for manufacturing an organic light emitting display device including a clamp according to a third embodiment of the present invention.
15 is a view showing an example in which the manufacturing apparatus of FIG. 14 is configured in a horizontal peeling method.
FIG. 16 is a view showing an example in which the manufacturing apparatus of FIG. 14 is configured in a vertical peeling method.

Hereinafter, with reference to the accompanying drawings, specific content for the practice of the present invention will be described.

1 is a block diagram schematically showing an organic light emitting display device, and FIG. 2 is an exemplary view of the sub-pixel shown in FIG. 1.

The organic light emitting display device includes a timing control unit 120, a gate driving unit 130, a data driving unit 140, and a display panel 150.

The timing control unit 120 collects device information (Extended Display Identification Data; EDID) including the resolution, frequency, and timing information of the display panel 150 from the external memory unit through an I2C interface, or the like, and compensation data. The timing controller 120 outputs a gate timing control signal GDC for controlling the operation timing of the gate driver 130 and a data timing control signal DDC for controlling the operation timing of the data driver 140. The timing controller 120 supplies the data signal DATA with the data timing control signal DDC to the data driver 140.

The data driver 140 samples, latches, and converts and outputs the data signal DATA to a gamma reference voltage in response to the data timing control signal DDC supplied from the timing controller 120. The data driver 140 may be formed of an integrated circuit (IC) and mounted on the display panel 150 or may be mounted on an external substrate connected to the display panel 150. The data driver 140 supplies the data signal DATA to the sub pixels SP included in the display panel 150 through the data lines DL.

The gate driver 130 outputs a gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC supplied from the timing controller 120. The gate driver 130 may be formed of an integrated circuit and mounted on the display panel 150 or may be mounted on an external substrate connected to the display panel 150. Also, the gate driver 130 may be formed on the display panel 150 in the form of a gate in panel. The gate driver 130 supplies a gate signal to the sub pixels SP included in the display panel 150 through the gate lines GL.

The display panel 150 displays an image corresponding to the gate signal supplied from the gate driver 130 and the data signal DATA supplied from the data driver 140. The display panel 150 includes sub-pixels SP controlling light to display an image.

The subpixels SP included in the display panel 150 include a switching transistor SW, a capacitor Cst, a driving transistor DR, a compensation circuit CC, and an organic light emitting diode OLED, respectively. The switching transistor SW, the capacitor Cst, the driving transistor DR, and the compensation circuit CC are included in the transistor unit, and the organic light emitting diode OLED is included in the light emitting unit.

The switching transistor SW transmits the data signal DATA supplied through the data line DL1 to the capacitor Cst in response to the gate signal supplied through the gate line GL1. The capacitor Cst stores the data signal DATA as a data voltage. The driving transistor DR operates to flow a driving current between the first power supply line VDD and the second power supply line VSS according to the data voltage stored in the capacitor Cst. The organic light emitting diode OLED emits light in response to the driving current supplied through the driving transistor DR. The compensation circuit CC compensates for the threshold voltage of the driving transistor DR. The compensation circuit CC is composed of one or more transistors and capacitors. The configuration of the compensation circuit CC is very diverse, so detailed examples and descriptions thereof are omitted.

Typically, the sub-pixels SP each have a 2T (Transistor) 1C (Capacitor) structure including a switching transistor SW, a driving transistor DR, a capacitor Cst, and an organic light emitting diode OLED as described above. It is composed. However, when the compensation circuit CC is added, the sub-pixels SP are composed of 3T1C, 4T2C, and 5T2C. The sub-pixels SP having the above-described configuration are formed in a top-emission method, a bottom-emission method or a dual-emission method according to the structure.

On the other hand, the sub-pixels SP may be implemented with a structure including a white sub-pixel, a red sub-pixel, a green sub-pixel, and a blue sub-pixel in order to prevent luminance deterioration and color deterioration while increasing light efficiency. In this case, the white sub-pixel, the red sub-pixel, the green sub-pixel, and the blue sub-pixel are implemented by using a white organic light emitting diode and an RGB color filter, or the white, red, green, and blue light emitting materials included in the organic light emitting diode are used. It is implemented in a manner that is formed by dividing.

3 is a cross-sectional view showing a part of an organic light emitting display device, and FIGS. 4 and 5 are exemplary views showing a cross-sectional structure of a sub-pixel by enlarging the area EA1 of FIG. 3.

As shown in FIG. 3, the display panel 150 includes a lower substrate 151 and a protective film 152 (or a protective substrate). The data driving unit 140 is mounted on one lower surface of the lower substrate 151, and a connection substrate 180 is attached to the lower outer surface of the lower substrate 151. Here, the gate driver is not illustrated as it is formed as one example on the left, right, or left and right sides of the lower substrate 151 in the form of a gate-in panel.

The lower substrate 151 imparts glass or ductility and has excellent resilience, such as polyester sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI) and polycarbonate (PC) It may be one selected from, but is not limited thereto.

Sub-pixels are formed on one surface of the lower substrate 151. The elements constituting the sub-pixels are vulnerable to external air such as oxygen or moisture. Therefore, a protective film 152 (or a protective substrate) or the like that can seal the elements constituting the sub-pixels is attached to the lower substrate 151.

When the structure of the sub-pixel is illustrated as an example, it is as shown in FIG. 4 or 5 below.

A buffer layer 161 is formed on one surface of the lower substrate 151. The buffer layer 161 may be formed to protect a thin film transistor or the like formed in a subsequent process from impurities such as alkali ions flowing out of the lower substrate 151. The buffer layer 161 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or the like, and may be omitted.

A driving transistor DR, an organic light emitting diode (OLED), and the like are formed on the buffer layer 161. The driving transistor DR includes a gate electrode 162, a semiconductor layer 164, a source electrode 165a and a drain electrode 165b. The gate electrode 162 is formed on the buffer layer 161. The first insulating layer 163 is formed on the gate electrode 162. The semiconductor layer 164 is formed on the first insulating film 163. The source electrode 165a and the drain electrode 165b are formed to contact one side and the other side of the semiconductor layer 164. A second insulating film 166 is formed on the source electrode 165a and the drain electrode 165b. On the buffer layer 161, as well as the driving transistor DR, a switching transistor (not shown), a capacitor (not shown), and various wirings are formed in the above structure.

The organic light emitting diode (OLED) includes a lower electrode 171, an organic emission layer 173, and an upper electrode 174. The lower electrode 171 is formed on the second insulating film 166. The lower electrode 171 is formed to be connected to the drain electrode 165b of the driving transistor DR exposed through the second insulating layer 166. The lower electrode 171 is formed separately for each sub-pixel. The lower electrode 171 is selected as an anode electrode or a cathode electrode. The bank layer 172 is formed on the lower electrode 171. The bank layer 172 is a layer defining an opening area of a sub-pixel. The organic emission layer 173 is formed on the lower electrode 171.

The organic emission layer 173 includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). At least one functional layer (HIL, HTL, ETL, EIL) other than the emission layer EML of the organic emission layer 173 may be omitted. In addition, the organic emission layer 173 may further include a blocking layer or a barrier layer that controls energy levels of holes and electrons. The upper electrode 174 is formed on the organic emission layer 173. The upper electrode 174 is formed in the form of a face electrode commonly connected to all sub-pixels. The upper electrode 174 is selected as a cathode electrode or an anode electrode.

The protective film 152 is formed on the upper electrode 174. The protective film 152 may be formed in the form of a single layer film as shown in FIG. 4. In this case, the protective film 152 may be formed of a transparent face sealant or a transparent film.

Alternatively, the protective film 152 may be formed in the form of a multilayer film as shown in FIG. 5. In this case, the protective film 152 may be formed of an organic/inorganic composite layer composed of an organic layer 152a, an inorganic layer 152b, an organic layer 152c, and an inorganic layer 152d. Although not shown, the inside of the organic-inorganic composite layer may further include a moisture absorbing layer that absorbs moisture or oxygen.

Meanwhile, in order to realize a high-resolution organic light emitting display device, research into attempting a laser thermal transfer method in manufacturing a display panel has been conducted. In order to perform laser heat transfer, the lower substrate including the thermal transfer film and the transistor portion on which the organic material is deposited in a vacuum atmosphere is moved to an atmospheric pressure atmosphere and a transfer process is performed.

However, in this process, the thermal transfer film and the lower substrate are exposed to the atmosphere, and oxidation of organic substances occurs. In order to improve this, a process of protecting an organic material by using a heat-bonding lower film and a heat-transfer film is used.

However, in the conventionally proposed method, due to the adhesive force between the heat-bonding lower film and the heat-transfer film, the lift-up phenomenon of the heat-bonding lower film is emerging when peeling the heat-transfer film. In this case, there is a problem of peeling defects and defects due to organic particles falling off the laser heat transfer film, and there is a problem in that the performance and yield of the organic light emitting display device are reduced, which is improved as follows.

6 and 7 are flowcharts for schematically explaining a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

As shown in (a) of FIG. 6, a transistor unit TFT is formed on the lower substrate 151. As described above, the transistor unit TFT includes a switching transistor, a capacitor, and a driving transistor. The transistor part TFT also includes a bank layer having an opening exposing a lower electrode and a portion of the lower electrode of the organic light emitting diode.

As shown in FIG. 6B, the lower substrate 151 having the transistor portion TFT is positioned on the thermal bonding lower film 161.

6(c), the thermal transfer film 162 having the organic material layer 163 is placed on the thermal bonding lower film 161, and the lower substrate 151 having a transistor portion (TFT) is embedded between them. Heat bonding. When heat-bonding the heat bonding lower film 161 and the heat transfer film 162, a pressing block such as a heating bar may be used, but is not limited thereto.

As shown in (d) of FIG. 7, the laser irradiation device 180 is placed on the thermally bonded lower film 161 and the thermal transfer film 162, and the laser L is irradiated along the scanning direction x2. . At this time, the organic material layer 163 included in the heat transfer film 162 is transferred on the lower electrode by the irradiated laser L.

As shown in (e) of FIG. 7, when the laser irradiation process is finished, the clamp 190 is inserted between the thermal bonding lower film 161 and the thermal transfer film 162, and the thermal transfer film is transferred from the thermal bonding lower film 161. (162) is peeled off.

As shown in (f) of FIG. 7, the process of peeling the heat transfer film 162 is performed by the support roller 210 and the gripper 220. The gripper 220 moves in the peeling direction (x1) and peels off the heat transfer film 162 from the heat bonding lower film 161. The support roller 210 is a part (or remains) of the heat transfer film 162 so that the gripper 220 is prevented from being peeled off other areas than the peeling area of the heat transfer film 162 in the process of moving in the peeling direction (x1). ) Supports the area and rotates and moves in the rotation direction (R1). In (f) of FIG. 7, the organic material layer 163 formed on the transistor part TFT is transferred from the organic material layer 163 of the heat transfer film 162.

The heat transfer film 162 is divided into a heat transfer film having a red organic material layer, a heat transfer film having a green organic material layer, and a heat transfer film having a blue organic material layer. Therefore, when the process of bonding the thermal transfer film in the above manner, irradiating the laser, and peeling the thermal transfer film is performed, subpixels such as red, green, and blue are formed on the display panel.

On the other hand, in the above process, the clamp 190 inserted between the heat-bonding lower film 161 and the heat-transfer film 162 prevents the lift-up phenomenon of the heat-bonding lower film 161 when the heat-transfer film 162 is peeled off. And, it has the following structure to prevent defects by foreign matter such as organic particles.

8 is a plan view showing a clamp and a film according to the first embodiment of the present invention, and FIG. 9 is a plan view and a side view of the clamp according to the first embodiment of the present invention.

8, the clamp 190 is inserted between the thermal bonding lower film 161 and the thermal transfer film 162, exposing the lower substrate 151_TFT having a transistor portion, and the thermal bonding lower film 161. It is designed to press the three sides of.

The clamp 190 is designed to have a separation distance capable of exposing the bonding region to which the thermal bonding film 161 and the thermal transfer film 162 are bonded. To this end, the clamp 190 includes a first surface, a second surface spaced apart from the first surface, and a third surface connecting the ends of the first surface and the second surface. For reference, the thermal bonding lower film 161 and the thermal transfer film 162 are in a state in which only the bonding area is bonded and the other areas are in a non-bonded state.

In this way, when the clamp 190 presses the three sides of the heat bonding lower film 161, the pressing area and the number of surfaces are increased as compared to the conventional front and rear separation methods. Therefore, it is possible to minimize the lifting phenomenon of the heat bonding lower film 161 during the peeling process. In addition, since the three sides of the heat bonding lower film 161 are pressed with one clamp 190 compared to the conventional one, it is possible to reduce the number of robot arms transporting it, thereby reducing manufacturing costs.

As shown in FIG. 9(a), the clamp 190 according to the first embodiment of the present invention is configured to have three surfaces of the left side 190L, the right side 190R, and one side 190a or more. The left side 190L of the clamp 190 presses the left side of the heat bonding lower film 161, and the right side 190R of the clamp 190 presses the right side of the heat bonding lower film 161, and the clamp 190 ) One side surface 190a is pressed against one side of the heat bonding lower film 161.

As shown in FIG. 9(b), the clamp 190 according to the first embodiment of the present invention has an inclined surface inclined in an internal direction (a direction in which a space is formed) on one side 190a of the clamp 190 ( 190c) is formed. The inclined surface 190c of the clamp 190 serves to lift one side of the heat transfer film 162 from one side of the thermal bonding lower film 161.

Since one side of the heat transfer film 162 is heard, the gripper can more easily hold one side of the heat transfer film 162. The inclined surface 190c of the clamp 190 may be formed at one end surface 190a of the clamp 190 as well as at the ends of the left/right surfaces 190L, 190R of the clamp 190. In this case, the clamp 190 can be easily inserted between the thermal bonding lower film 161 and the thermal transfer film 162.

10 is a plan view and a side view of the clamp according to the second embodiment of the present invention, FIG. 11 is a view showing the suction direction of the suction part, and FIG. 12 is a plan view showing the inside of the clamp according to the second embodiment of the present invention , FIG. 13 is an exemplary view showing various structures of the suction unit.

10(a) and 10(b), the right side surface 190R of the clamp 190 includes a right side suction part 195R. Although not shown, the suction part is also included in the left side 190L of the clamp 190. That is, a plurality of suction units are installed inside the left/right surfaces 190L and 190R of the clamp 190.

As shown in FIG. 11, the suction part sucks particles and the like from the right side 190R of the clamp 190 and the left side 190L of the clamp 190. The suction portion serves to suck and discharge organic particles that are separated from the organic layer of the heat transfer film during the peeling process.

Normally, when a particle or the like remaining after the peeling process adheres to the transistor portion, various defects such as shorts or display defects are caused. However, if the suction part is designed to be included in the clamp 190, particles and the like remaining at the same time as the peeling process can be removed, so that the particle removing process can be omitted later.

12, the left/right suction parts 195L, 195R are designed to communicate with the left/right tubes 196L, 195R installed inside the left/right surfaces 190L, 190R of the clamp 190. . The left tube 196L is designed to communicate with both the left suction part 195L, and the right tube 196R is designed to communicate with both the right suction part 195R. Accordingly, one tube is included in the inside of the left/right sides 190L and 190R of the clamp 190, respectively.

As shown in FIG. 13(a), the left suction part 195L (or the right suction part) is formed in a funnel shape having a triangular shape.

As shown in (b) of FIG. 13, the left suction part 195L (or the right suction part) is formed in a funnel shape in which the suction port has a circular shape.

As shown in FIG. 13(c), the left suction part 195L (or the right suction part) is formed in a funnel shape in which the suction port has a polygonal shape.

When the left suction part 195L (or the right suction part) is formed in the shape as described above, the pressure of the communication part communicating with the tube can be increased, so that the suction power can be improved. In addition, since the intake port has a large area, it is possible to inhale many particles in a wider range.

Hereinafter, an apparatus for manufacturing an organic light emitting display device including a clamp according to the present invention will be described.

14 is a schematic configuration diagram of an apparatus for manufacturing an organic light emitting display device including a clamp according to a third embodiment of the present invention, and FIG. 15 is a view showing an example in which the apparatus of FIG. 14 is configured in a horizontal peeling method , FIG. 16 is a view showing an example in which the manufacturing apparatus of FIG. 14 is configured in a vertical peeling method.

14, the manufacturing apparatus 200 of the organic light emitting display device including the clamp includes a lower supporter 250, a stage 260, an upper supporter 230, a support roller 210, and a gripper 220. ), clamp 190, robot arm 270, gate 280, tube 196 and adsorption control unit 198. The manufacturing apparatus 200 of the organic light emitting display device including the clamp is designed such that the inside is a vacuum or general atmospheric conditions.

The gate 280 is connected to the process chamber, and is a door to which an object to be separated is loaded or unloaded. The exfoliation object refers to a structure in which a thermal bonding lower film 161, a lower substrate 151_TFT having a transistor portion, and a thermal transfer film 162 are bonded.

The stage 260 is positioned above the lower support 250 provided inside the process chamber. Stage 260 has a flat surface. A peeling object loaded through the gate 280 is seated on the flat surface of the stage 260.

The support roller 210 and the gripper 220 are located under the upper support 230 provided inside the process chamber. The support roller 210 is installed on the lower portion of the upper support 230, and the heat transfer film is prevented from being peeled off other areas of the heat transfer film 162 in the process of moving the gripper 220 in the peeling direction. It supports a part (or remaining) area of 162 and rotates and moves in the rotation direction. The gripper 220 is installed on the lower portion of the upper support 230, moves in the peeling direction, and removes the heat transfer film 162 from the thermal bonding lower film 161 and peels them off.

The clamp 190 is held by the robot arm 270 controlled from the outside of the process room and is inserted between the heat bonding lower film 161 and the heat transfer film 162 of the peeling object loaded through the gate 280 to heat. The three sides of the bonding lower film 161 are pressed. The clamp 190 moves left and right before and after the peeling process by the robot arm 270, and moves up and down during the peeling process, and simultaneously fixes the heat bonding lower film 161 while pressing it.

The adsorption control unit 198 is installed outside the process chamber and is connected to the tube 196 formed in the clamp 190. When the separation process is performed by the support roller 210 and the gripper 220, the adsorption control unit 198 generates suction power so that particles and the like are sucked through the tube 196 connected to the suction unit.

When the peeling process is completed by the manufacturing apparatus 200 of the organic light emitting display device including the clamp, the peeling object whose process is completed is unloaded and a new peeling object is loaded.

15 and 16, the manufacturing apparatus 200 of the organic light emitting display device is configured by a horizontal peeling method or a vertical peeling method. The peeling method of the configuration shown in FIGS. 15 and 16 is the same as that described in FIG. 7(f), and thus is omitted to avoid overlapping descriptions.

As described above, the present invention prevents lifting of the thermally bonded lower film during the peeling process, secures the process yield, and clamps for preventing various defects caused by organic particles originating from the laser thermal transfer film, and an organic light emitting display device including the same It has the effect of providing a manufacturing apparatus.

The embodiments of the present invention have been described above with reference to the accompanying drawings, but the technical configuration of the present invention described above is in other specific forms without altering the technical spirit or essential features of the present invention by those skilled in the art to which the present invention pertains. It will be understood that it can be practiced. Therefore, the embodiments described above are to be understood in all respects as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. In addition, all modifications or variations derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present invention.

151: lower substrate TFT: transistor unit
161: thermal bonding lower film 162: thermal transfer film
163: organic layer 210: support roller
220: gripper 190: clamp
195L, 195R: Left/right intake 196L, 195R: Left/right tube
260: stage 270: robot arm
198: adsorption control unit

Claims (12)

Front page;
A second surface spaced apart from the first surface;
A third surface connecting the ends of the first surface and the second surface; And
Clamps formed on the inner surfaces of the first surface and the second surface and including suction parts for sucking and discharging particles. delete According to claim 1,
A clamp formed inside the first surface and the second surface and including a tube communicating with the suction part. According to claim 3,
The suction part
Clamp characterized in that the inlet is formed in a funnel shape having a triangular, circular or polygonal shape. According to claim 1,
A clamp formed on the third surface and including an inclined surface inclined in the inner direction. A stage on which the object to be peeled is seated;
A robot arm for inserting a clamp between the films included in the peeling object; And
A gripper for removing the film located on the top of the film,
The clamp is provided on a first surface, a second surface spaced apart from the first surface, a third surface connecting the ends of the first surface and the second surface, and an inner surface of the first surface and the second surface. It is formed and includes a suction unit for suctioning and discharging particles,
The clamp is inserted between the films by the robot arm, and the apparatus for manufacturing an organic light emitting display device, characterized in that pressing and fixing the three sides of the film positioned below the film. delete The method of claim 6,
The clamp
An apparatus for manufacturing an organic light emitting display device including a tube formed inside the first surface and the second surface and communicating with the suction part. The method of claim 8,
The suction part
A device for manufacturing an organic light emitting display device, characterized in that the suction port is formed in a funnel shape having a triangular, circular or polygonal shape. The method of claim 8,
An apparatus for manufacturing an organic light emitting display device comprising an adsorption control unit that communicates with the tube of the clamp and generates suction power during the peeling process. The method of claim 6,
An apparatus for manufacturing an organic light emitting display device including a support roller which rotates and moves while supporting a partial region of the film located on the upper portion of the films. The method of claim 6,
The clamp
An apparatus for manufacturing an organic light emitting display device including an inclined surface formed on the third surface and inclined in an inner direction.

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