KR20150048549A - Clamp and Manufacturing Appratus of Organic Light Emitting Display Device Include the Clamp - Google Patents

Abstract

The present invention provides a clamp which secures a process yield by preventing the separation of a thermally bonded lower film during an exfoliation process and prevents various defects caused by organic particles from a laser thermal transfer film. The clamp comprises: a first surface; a second surface facing the first surface; and a third surface to connect the tip end of first and second surfaces together.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a clamp, and an apparatus for manufacturing the organic light emitting display including the same.

The present invention relates to a clamp and an apparatus for manufacturing an organic light emitting display including the clamp.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes located on a substrate. The organic light emitting display device may be a top emission type, a bottom emission type or a dual emission type depending on a direction in which light is emitted.

When an organic light emitting display device is supplied with a scan signal, a data signal, a power supply, or the like to a plurality of subpixels disposed on a display panel, the selected subpixel emits light, thereby displaying an image.

The subpixels disposed on the display panel include a transistor portion including a switching transistor, a driving transistor and a capacitor, and an organic light emitting diode including a lower electrode connected to the driving transistor included in the transistor portion, an organic light emitting layer, and an upper electrode.

In recent years, attempts have been made to attempt a laser thermal transfer method in manufacturing a display panel to realize a high-resolution organic light emitting display. In order to transfer the laser beam, the transfer substrate and the lower substrate including the transistor are transferred to the atmospheric pressure atmosphere and the transfer process is performed.

However, in this process, the heat transfer film and the lower substrate are exposed to the atmosphere and oxidation of the organic material occurs. In order to solve this problem, a process of protecting the organic material by using a heat-adhesion lower film and a heat transfer film is used.

However, in the conventionally proposed method, due to the adhesive force between the heat sealable lower film and the heat transfer film, the heat sealable lower film is lifted when the heat transfer film is peeled off. In this case, there is a problem that peeling failure and defects due to organic particles coming off from the laser heat transfer film occur, and the performance and yield of the organic light emitting display device are reduced.

The present invention for solving the above-mentioned problems of the background is to prevent lifting of the heat-sealable lower film during the peeling process to secure process yield and to prevent various defects due to organic particles caused by the laser heat transfer film.

In order to solve the above-mentioned problems, the present invention provides a semiconductor device comprising: a first surface; A second side spaced apart from the first side; And a third surface connecting the first surface and the end of the second surface.

And a suction portion formed on the inner surfaces of the first and second surfaces.

And a tube formed inside the first and second surfaces and communicating with the suction portion.

The suction portion may be formed in a funnel shape in which the suction port has a triangular, circular or polygonal shape.

And may include an inclined surface formed on the third surface and inclined inwardly.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, A robot arm for inserting a clamp between the films included in the peeling object; And a gripper for releasing the film located at the top of the films, wherein the clamp has a first surface, a second surface opposed to the first surface and a second surface opposed to the third surface, Wherein the clamp is inserted between the films by the robot arm, and the three sides of the film located at the bottom of the films are pressed and fixed at the same time.

The clamp may include a suction portion formed on the inner surface of the first surface and the second surface.

The clamp may include a tube formed in the first and second surfaces and communicating with the suction portion.

The suction portion may be formed in a funnel shape in which the suction port has a triangular, circular or polygonal shape.

And an adsorption agent portion communicating with the tube of the clamp and generating a suction force when the peeling process proceeds.

And a supporting roller which rotates and moves and supports a part of the film located on the upper part of the films.

The clamp may include an inclined surface formed on the third surface and inclined inwardly.

The present invention relates to a clamp capable of preventing the heat adhesion bottom film from being lifted during the peeling process to secure process yield and preventing various defects caused by organic particles caused by the laser heat transfer film, and an organic light emitting display device There is an effect of providing a manufacturing apparatus.

1 is a block diagram schematically showing an organic light emitting display device.
Figure 2 is an illustration of the subpixel shown in Figure 1;
3 is a cross-sectional view showing a part of an organic light emitting display device.
FIGS. 4 and 5 are enlarged views of EA1 regions of FIG. 3 to illustrate sectional structures of subpixels. FIG.
6 and 7 are flowcharts schematically illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.
8 is a plan view showing a clamp, a film, and the like according to the first embodiment of the present invention.
9 is a plan view and side view of a clamp according to a first embodiment of the present invention.
10 is a plan view and a side view of a clamp according to a second embodiment of the present invention.
11 is a view showing the suction direction of the suction portion;
12 is a plan view showing the inside of a clamp according to a second embodiment of the present invention.
13 is an exemplary view showing various structures of the suction portion;
FIG. 14 is a schematic structural view of an apparatus for manufacturing an organic light emitting display including a clamp according to a third embodiment of the present invention; FIG.
Fig. 15 is a view showing an example in which the manufacturing apparatus of Fig. 14 is configured as a horizontal peeling method; Fig.
Fig. 16 is a view showing an example in which the manufacturing apparatus of Fig. 14 is configured as a vertical peeling system; Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram schematically showing an organic light emitting display device, and FIG. 2 is an exemplary view of the subpixel shown in FIG. 1. Referring to FIG.

The organic light emitting display includes a timing control unit 120, a gate driving unit 130, a data driving unit 140, and a display panel 150.

The timing controller 120 collects device information (Extended Display Identification Data (EDID), compensation data, etc.) including the resolution, frequency, and timing information of the display panel 150 from an external memory unit through an I2C interface or the like. The timing controller 120 outputs a gate timing control signal GDC for controlling the operation timing of the gate driver 130 and a data timing control signal DDC for controlling the operation timing of the data driver 140. [ The timing controller 120 supplies the data driver 140 with the data signal DATA along with the data timing control signal DDC.

The data driver 140 samples and latches the data signal DATA in response to the data timing control signal DDC supplied from the timing controller 120, and converts the sampled data signal into a gamma reference voltage. The data driver 140 may be implemented as an integrated circuit (IC), mounted on the display panel 150, or mounted on an external substrate connected to the display panel 150. The data driver 140 supplies the data signal DATA to the sub-pixels SP included in the display panel 150 through the data lines DL.

The gate driver 130 outputs a gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC supplied from the timing controller 120. The gate driver 130 may be mounted on the display panel 150 or may be mounted on an external substrate connected to the display panel 150. Also, the gate driver 130 may be formed on the display panel 150 in the form of a gate-in-panel. The gate driver 130 supplies a gate signal to the sub-pixels SP included in the display panel 150 through the gate lines GL.

The display panel 150 displays an image corresponding to the gate signal supplied from the gate driver 130 and the data signal DATA supplied from the data driver 140. The display panel 150 includes sub-pixels SP for controlling light to display an image.

The subpixels SP included in the display panel 150 include a switching transistor SW, a capacitor Cst, a driving transistor DR, a compensation circuit CC and an organic light emitting diode OLED. The switching transistor SW, the capacitor Cst, the driving transistor DR and the compensation circuit CC are included in the transistor portion and the organic light emitting diode OLED is included in the light emitting portion.

The switching transistor SW transfers the data signal DATA supplied through the data line DL1 to the capacitor Cst in response to the gate signal supplied through the gate line GL1. The capacitor Cst stores the data signal DATA as a data voltage. The driving transistor DR operates so that a driving current flows between the first power supply line VDD and the second power supply line VSS in accordance with the data voltage stored in the capacitor Cst. The organic light emitting diode OLED emits light corresponding to the driving current supplied through the driving transistor DR. The compensation circuit CC compensates the threshold voltage of the driving transistor DR and the like. The compensation circuit CC consists of one or more transistors and a capacitor. The configuration of the compensation circuit (CC) is very various, and a detailed illustration and description thereof are omitted.

In general, the subpixels SP are formed by a 2T (Transistor) 1C (Capacitor) structure including a switching transistor SW, a driving transistor DR, a capacitor Cst, and an organic light emitting diode OLED . However, when the compensation circuit CC is added, the subpixels SP consist of 3T1C, 4T2C, 5T2C, and the like. The subpixels SP having the above structure are formed in a top emission mode, a bottom emission mode or a dual emission mode depending on the structure.

On the other hand, the subpixels SP may be implemented with a structure including a white subpixel, a red subpixel, a green subpixel, and a blue subpixel in order to increase the light efficiency and prevent the decline in luminance and color saturation of pure color. In this case, the white subpixel, the red subpixel, the green subpixel, and the blue subpixel may be implemented using a white organic light emitting diode and an RGB color filter, or may be implemented by a method in which a light emitting material included in an organic light emitting diode is formed in white, Or the like.

FIG. 3 is a cross-sectional view illustrating a portion of an organic light emitting display device, and FIGS. 4 and 5 are enlarged views of an EA1 region of FIG. 3 to illustrate sectional structures of subpixels.

As shown in FIG. 3, the display panel 150 is composed of a lower substrate 151, a protective film 152 (or a protective substrate). The data driver 140 is mounted on one side of the lower substrate 151 and the connection substrate 180 is attached on the lower side of the lower substrate 151. Here, the gate driver is not illustrated because it is formed on the left side, the right side, or the left and right sides of the lower surface of the lower substrate 151 in the form of a gate-in-panel.

The lower substrate 151 may be made of glass or a material having excellent restoring force, such as polyester sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI) and polycarbonate (PC) But is not limited thereto.

Subpixels are formed on one surface of the lower substrate 151. The elements constituting subpixels are vulnerable to outside air such as oxygen or moisture. Therefore, on the lower substrate 151, a protective film 152 (or a protective substrate) capable of sealing the elements constituting the sub pixels is attached.

The structure of a subpixel will be described with reference to FIG. 4 or 5.

A buffer layer 161 is formed on one surface of the lower substrate 151. The buffer layer 161 may be formed to protect a thin film transistor or the like formed in a subsequent process from impurities such as alkali ions or the like flowing out from the lower substrate 151. The buffer layer 161 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or the like, which may be omitted.

On the buffer layer 161, a driving transistor DR and an organic light emitting diode OLED are formed. The driving transistor DR includes a gate electrode 162, a semiconductor layer 164, a source electrode 165a, and a drain electrode 165b. A gate electrode 162 is formed on the buffer layer 161. A first insulating film 163 is formed on the gate electrode 162. The semiconductor layer 164 is formed on the first insulating film 163. The source electrode 165a and the drain electrode 165b are formed so as to be in contact with one side and the other side of the semiconductor layer 164, respectively. A second insulating film 166 is formed on the source electrode 165a and the drain electrode 165b. A switching transistor (not shown), a capacitor (not shown), various wirings, and the like are formed on the buffer layer 161 in addition to the driving transistor DR.

The organic light emitting diode OLED includes a lower electrode 171, an organic light emitting layer 173, and an upper electrode 174. The lower electrode 171 is formed on the second insulating film 166. The lower electrode 171 is formed to be connected to the drain electrode 165b of the driving transistor DR exposed through the second insulating film 166. [ The lower electrode 171 is formed separately for each subpixel. The lower electrode 171 is selected as an anode electrode or a cathode electrode. On the lower electrode 171, a bank layer 172 is formed. The bank layer 172 is a layer that defines the opening region of the subpixel. An organic light emitting layer 173 is formed on the lower electrode 171.

The organic light emitting layer 173 includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), an electron transport layer (ETL) and an electron injection layer (EIL). At least one other functional layer (HIL, HTL, ETL, EIL) other than the light emitting layer (EML) of the organic light emitting layer 173 may be omitted. The organic light emitting layer 173 may further include a blocking layer or a barrier layer for adjusting energy levels of holes and electrons. The upper electrode 174 is formed on the organic light emitting layer 173. The upper electrode 174 is formed in the form of a face-to-face electrode that is commonly connected to all the sub-pixels. The upper electrode 174 is selected as a cathode electrode or an anode electrode.

A protective film 152 is formed on the upper electrode 174. The protective film 152 may be formed in the form of a single layer film as shown in FIG. In this case, the protective film 152 may be formed of a transparent face sealant or a transparent film.

Alternatively, the protective film 152 may be formed in the form of a multilayer film as shown in FIG. In this case, the protective film 152 may be formed of an organic-inorganic hybrid layer composed of the organic layer 152a, the inorganic layer 152b, the organic layer 152c, and the inorganic layer 152d. Although not shown, the interior of the organic / inorganic composite layer may further include a moisture absorption layer or the like for absorbing moisture or oxygen.

Meanwhile, in order to realize a high-resolution organic light emitting display device, researches on laser thermal transfer method in the production of a display panel are under way. In order to transfer the laser beam, the transfer substrate and the lower substrate including the transistor are transferred to the atmospheric pressure atmosphere and the transfer process is performed.

However, in this process, the heat transfer film and the lower substrate are exposed to the atmosphere and oxidation of the organic material occurs. In order to solve this problem, a process of protecting the organic material by using a heat-adhesion lower film and a heat transfer film is used.

However, in the conventionally proposed method, due to the adhesive force between the heat sealable lower film and the heat transfer film, the heat sealable lower film is lifted when the heat transfer film is peeled off. In this case, the peeling failure and defects due to the organic particles coming off from the laser heat transfer film occur, and the performance and the yield of the organic light emitting display are reduced.

6 and 7 are flowcharts for schematically explaining a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

As shown in FIG. 6A, a transistor portion (TFT) is formed on the lower substrate 151. As described above, the transistor portion (TFT) includes a switching transistor, a capacitor, a driving transistor, and the like. The transistor portion (TFT) also includes a bank layer having an opening exposing a part of the lower electrode and the lower electrode of the organic light emitting diode.

The lower substrate 151 having the transistor portion (TFT) is placed on the thermally adhered lower film 161 as shown in Fig. 6 (b).

6 (c), a heat transfer film 162 having an organic layer 163 is placed on the thermally adhered lower film 161, and a lower substrate 151 having a transistor portion (TFT) . When the heat-seal lower film 161 and the heat transfer film 162 are thermally adhered to each other, a pressing block such as a heating bar may be used, but the present invention is not limited thereto.

The laser irradiating device 180 is placed on the thermally adhered lower film 161 and the heat transfer film 162 which are joined together and the laser L is irradiated along the scanning direction x2 . At this time, the organic layer 163 included in the heat transfer film 162 is transferred onto the lower electrode by the irradiated laser (L).

7 (e), when the laser irradiation process is completed, the clamp 190 is inserted between the heat-seal lower film 161 and the heat transfer film 162, (162) is peeled off.

7F, the step of peeling the heat transfer film 162 is carried out by the support roller 210 and the gripper 220. As shown in FIG. The gripper 220 moves in the peeling direction x1 and removes the heat transfer film 162 from the heat seal lower film 161 and peels them off. The support roller 210 is formed so that a portion of the heat transfer film 162 (or the remaining portion of the heat transfer film 162) is formed so as to prevent the other region of the heat transfer film 162 from being separated from the peeling region in the process of moving the gripper 220 in the separation direction x1 ) Area and rotates and moves in the rotation direction R1. 7 (f), the organic layer 163 formed on the transistor portion TFT is transferred from the organic layer 163 of the heat transfer film 162. In FIG.

The heat transfer film 162 is divided into a heat transfer film having a red organic layer, a heat transfer film having a green organic layer, and a heat transfer film having a blue organic layer. Therefore, when the process of laminating the heat transfer films in the above manner, irradiating the laser, and peeling off the heat transfer film is performed, subpixels such as red, green and blue are formed on the display panel.

Meanwhile, in the above process, the clamp 190 inserted between the heat-sealable lower film 161 and the heat transfer film 162 prevents lifting of the heat-sealable lower film 161 when the heat transfer film 162 is peeled off. And has the following structure to prevent defects caused by foreign matter such as organic particles.

FIG. 8 is a plan view showing a clamp and a film according to the first embodiment of the present invention, and FIG. 9 is a plan view and a side view of the clamp according to the first embodiment of the present invention.

8, the clamp 190 is inserted between the thermally adhered lower film 161 and the heat transfer film 162, exposing the lower substrate 151_TFT having the transistor portion, As shown in FIG.

The clamp 190 is designed to have a separation distance that can expose a cementation region where the heat-sealable lower film 161 and the heat transfer film 162 are adhered to each other. To this end, the clamp 190 includes a first face, a second face opposing the first face, and a third face connecting the first face and the end of the second face. For reference, the thermally adhered lower film 161 and the heat transfer film 162 are in a state in which only the adhesion region is bonded and the other regions are not bonded.

As described above, when the clamp 190 presses the three sides of the thermally adhered lower film 161, the pressing area and the number of the surfaces are increased compared with the conventional method of dividing the front and back sides. Accordingly, it is possible to minimize the lifting phenomenon in which the heat-sealed lower film 161 is heard during the peeling process. In addition, since the three sides of the thermally bonded lower film 161 are pressed by one clamp 190 compared to the conventional one, the number of robot arms for transporting the three sides of the thermally bonded lower film 161 can be reduced.

9 (a), the clamp 190 according to the first embodiment of the present invention is configured to have three sides over the left side 190L, the right side 190R and one side 190a. The left side 190L of the clamp 190 presses the left side of the thermally bonded lower film 161 and the right side 190R of the clamp 190 presses the right side of the thermally bonded lower film 161 and the clamp 190 Is pressed on one side of the heat-seal lower film 161. The heat-

9 (b), the clamp 190 according to the first embodiment of the present invention is mounted on one side surface 190a of the clamp 190 so as to be inclined in an inner direction (direction in which a space is formed) 190c are formed. The inclined surface 190c of the clamp 190 serves to make one side of the heat transfer film 162 hear from one side of the thermally adhered lower film 161. [

The one side of the heat transfer film 162 can be heard so that the gripper can more easily hold one side of the heat transfer film 162. The inclined surface 190c of the clamp 190 may be formed not only on one side 190a of the clamp 190 but also on the ends of the left and right sides 190L and 190R of the clamp 190. [ In this case, the clamp 190 can be easily inserted between the heat seal adhesion lower film 161 and the heat transfer film 162.

FIG. 10 is a plan view and a side view of a clamp according to a second embodiment of the present invention, FIG. 11 is a view showing the suction direction of the suction part, FIG. 12 is a plan view showing the inside of the clamp according to the second embodiment of the present invention And Fig. 13 is an exemplary view showing various structures of the suction portion.

As shown in Figs. 10A and 10B, the right side surface 190R of the clamp 190 includes a right suction portion 195R. Although not shown, the suction portion is also included in the left side surface 190L of the clamp 190. That is, a plurality of suction portions are provided inside the left and right side surfaces 190L and 190R of the clamp 190.

As shown in Fig. 11, the suction unit sucks particles and the like from the right side surface 190R of the clamp 190 and the left side surface 190L of the clamp 190. As shown in Fig. The suction portion serves to suck and discharge the organic particles separated from the organic material layer of the heat transfer film during the peeling process.

Generally, if particles or the like remaining after the peeling process is adhered to the transistor portion, various defects such as short-circuiting and display failure are caused. However, if the clamp 190 is designed to include the suction part, particles remaining at the time of the peeling process can be removed, so that the particle removing process can be omitted.

The left and right suction portions 195L and 195R are designed to communicate with the left and right tubes 196L and 195R provided inside the left and right side surfaces 190L and 190R of the clamp 190 . The left tube 196L is designed to communicate with the left suction portion 195L and the right tube 196R is designed to communicate with the right suction portion 195R. Therefore, one tube is included in the left and right side surfaces 190L and 190R of the clamp 190, respectively.

As shown in Fig. 13 (a), the left suction portion 195L (or the right suction portion) is formed into a funnel shape having a triangular suction port.

As shown in Fig. 13 (b), the left suction portion 195L (or the right suction portion) is formed in the form of a funnel having a suction port.

As shown in Fig. 13 (c), the left suction portion 195L (or the right suction portion) is formed into a funnel shape having a suction port of a polygonal shape.

When the left suction portion 195L (or the right suction portion) is formed in the shape as described above, the pressure of the communication portion communicating with the tube can be increased, so that the suction force can be improved. Further, since the suction port has a large area, many particles can be sucked in a wider range.

Hereinafter, an apparatus for manufacturing an organic light emitting display device including a clamp according to the present invention will be described.

FIG. 14 is a schematic structural view of an apparatus for manufacturing an organic light emitting display including a clamp according to a third embodiment of the present invention, FIG. 15 is an illustration showing an example in which the manufacturing apparatus of FIG. 14 is configured as a horizontal stripping system And Fig. 16 is a view showing an example in which the manufacturing apparatus of Fig. 14 is configured as a vertical peeling system.

14, an apparatus 200 for manufacturing an organic light emitting display including a clamp includes a lower support 250, a stage 260, an upper support 230, a support roller 210, a gripper 220 A clamp 190, a robot arm 270, a gate 280, a tube 196, and an adsorption control unit 198. [ An apparatus 200 for manufacturing an organic light emitting display including a clamp is designed such that the interior thereof is a vacuum or a general atmospheric condition.

The gate 280 is connected to the processing chamber and is a door through which the object to be peeled is loaded or unloaded. The material to be peeled refers to a structure in which a heat-sealed lower film 161, a lower substrate 151_TFT having a transistor portion, and a heat transfer film 162 are bonded together.

The stage 260 is located above the lower support 250 provided inside the process chamber. The stage 260 has a flat surface. On the flat surface of the stage 260, the peeling object loaded through the gate 280 is seated.

The support roller 210 and the gripper 220 are positioned below the upper support 230 provided inside the process chamber. The support rollers 210 are installed at the lower portion of the upper support 230 and are disposed on the upper surface of the upper support member 230 so as to prevent peeling of the regions other than the peeling region of the heat transfer film 162 in the process of moving the gripper 220 in the peeling direction. (Or remaining) region of the rotor 162 and rotates and moves in the rotating direction. The gripper 220 is installed on the lower part of the upper support 230 and moves in the peeling direction to remove the heat transfer film 162 from the heat adhesion lower film 161 and peel them off.

The clamp 190 is held by a robot arm 270 controlled outside the processing chamber and inserted between the heat adhesion lower film 161 of the peeling object loaded through the gate 280 and the heat transfer film 162, Thereby pressing the three sides of the adhesion lower film 161. The clamp 190 moves left and right before and after the peeling process by the robot arm 270 and moves up and down during the peeling process and fixes the heat-seal lower film 161 at the same time as pressing.

The adsorption control unit 198 is installed outside the process chamber and is connected to a tube 196 formed in the clamp 190. When the peeling process is performed by the support roller 210 and the gripper 220, the adsorption control unit 198 generates a suction force to suck particles through the tube 196 connected to the suction unit.

When the peeling process is completed by the manufacturing apparatus 200 of the organic light emitting display device including the clamp, the peeling object that has been completed is unloaded and the new peeling object is loaded.

As shown in FIGS. 15 and 16, the apparatus 200 for fabricating an organic light emitting display may be configured as a horizontal stripping scheme or a vertical stripping scheme. The peeling system of the configuration shown in Figs. 15 and 16 is the same as that described in Fig. 7 (f), so that duplication of description is omitted in order to avoid duplication.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a clamp capable of preventing the thermal adhesion bottom film from being lifted during the peeling process to secure process yield and preventing various defects due to organic particles caused by the laser heat transfer film, There is provided an effect of providing a manufacturing apparatus of the present invention.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

151: Lower substrate TFT:
161: heat seal bottom film 162: heat transfer film
163: organic layer 210: support roller
220: Gripper 190: Clamp
195L, 195R: left / right suction part 196L, 195R: left / right tube
260: Stage 270: Robot arm
198: adsorbent fisher

Claims (12)

A first side;
A second surface spaced apart from the first surface; And
And a third surface connecting the first surface and the distal end of the second surface. The method according to claim 1,
And a suction portion formed on the inner surface of the first surface and the second surface. 3. The method of claim 2,
And a tube formed in the first surface and the second surface and communicating with the suction portion. The method of claim 3,
The suction portion
And the suction port is formed in a funnel shape having a triangular, circular or polygonal shape. The method according to claim 1,
And an inclined surface formed on the third surface and inclined inwardly. A stage on which the object to be peeled is seated;
A robot arm for inserting a clamp between the films included in the peeling object; And
And a gripper for peeling off the film located at an upper portion of the films,
Wherein the clamp includes a first surface, a second surface facing the first surface, and a third surface connecting the first surface and the end of the second surface,
Wherein the clamp is inserted between the films by the robot arm, and the clamps are pressed and fixed on three sides of the film positioned under the films. The method according to claim 6,
The clamp
And a suction part formed on the first surface and the inner surface of the second surface. 8. The method of claim 7,
The clamp
And a tube formed inside the first surface and the second surface and communicating with the suction portion. 9. The method of claim 8,
The suction portion
Wherein the inlet is formed in a funnel shape having a triangular, circular or polygonal shape. 9. The method of claim 8,
And an adsorption controller communicating with the tube of the clamp and generating a suction force when the peeling process is performed. The method according to claim 6,
And a supporting roller which rotates and moves while supporting a part of the film located at an upper portion of the films. The method according to claim 6,
The clamp
And an inclined surface formed on the third surface and inclined inward.

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