KR20110071646A - Organic light emitting diodde desplay device and fabricating method thereof - Google Patents

Abstract

PURPOSE: An organic light emitting diode display device and a fabricating method thereof are provided to prevent out gassing which is generated in a pigment forming a spacer by forming a bank pattern on the overcoat layer. CONSTITUTION: In an organic light emitting diode display device and a fabricating method thereof, a data line(DL) and a driving current wiring(VDD) defining a pixel region on a substrate(SUB) are arranged. An insulating layer(GI) covers the data line and the driving current wiring. A color filter is formed in a light emission region within the pixel region. An overcoat layer(OC) is coated on the color filter. A spacer(SP) is formed in an non-emitting region excluding a light emitting region.

Description

Organic light emitting diode display device and manufacturing method thereof {ORGANIC LIGHT EMITTING DIODDE DESPLAY DEVICE AND FABRICATING METHOD THEREOF}

The present invention relates to an organic light emitting diode display and a method of manufacturing the same. In particular, the present invention relates to an organic light emitting diode display device and a method of manufacturing the organic light emitting diode display device in which the moisture absorbent and the display device do not contact each other to protect the organic light emitting diode display from external moisture penetration.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays (LCDs), field emission displays (FEDs), plasma display panels (PDPs), and electroluminescence devices (ELs). have.

Electroluminescent devices are classified into inorganic electroluminescent devices and organic light emitting diode devices according to the material of the light emitting layer. The self-emitting devices use self-light emitting devices, which have a fast response speed and high luminous efficiency, luminance, and viewing angle. The organic light emitting diode display has an organic light emitting diode (OLED) as shown in FIG. 1.

The OLED includes an organic electroluminescent compound layer electroluminescent as shown in FIG. 1, and a cathode and an anode facing each other with the organic electroluminescent compound layer interposed therebetween. The organic electroluminescent compound layer includes a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (Electron injection). layer, EIL). The OLED forms an excitation in the excitation process when holes and electrons injected into the cathode electrode and the cathode recombine in the emission layer EML and emit light due to energy from the excitons.

The organic electroluminescent compound layer (EL) forming the OLED, which is a major component of the organic light emitting diode display, is easily degraded by moisture or oxygen. Therefore, the organic light emitting diode display device has an encapsulation structure as shown in FIG. 2 is a cross-sectional view of an organic light emitting diode display having an encapsulation structure according to the related art.

An organic light emitting diode layer (OLEDL) including an EL layer is formed on the substrate SUB. The organic light emitting diode layer OLEDL is mainly formed at a central portion of the substrate SUB, and a pad portion PAD is formed at a peripheral portion for transmitting and receiving electrical signals from an external device for driving the organic light emitting diode display. The encapsulating glass substrate (ENCAP) is attached to the boundary portion of the pad portion PAD using an ultraviolet curable resin material to protect the organic light emitting diode layer (OLEDL) from moisture and oxygen penetration from the outside. do. In addition, since the UV sealing material SEAL alone cannot effectively prevent the penetration of moisture from the outside, an organic light emitting diode is attached to the center of the encapsulating glass substrate ENCAP to absorb moisture and oxygen that penetrates. Disposed on top of the layer (OLEDL).

An organic light emitting diode display having such an encapsulation structure has a problem of causing deterioration of the device when the absorbent material GET disposed at the top of the center touches the organic light emitting diode layer OLEDL. Therefore, a structure is required so that the moisture absorbent material GET does not come into contact with the organic light emitting diode layer OLEDL.

SUMMARY OF THE INVENTION An object of the present invention is an organic light emitting diode display device having a structure in which a moisture absorbent that blocks moisture and oxygen penetration that adversely affects an organic light emitting compound layer is not in contact with an organic light emitting diode layer. And to provide a method of manufacturing the same.

In order to achieve the above object, the organic light emitting diode display device according to the present invention, the substrate; A data line, a gate line, and a driving current line defining a pixel area on the substrate; An insulating layer covering the data line, the gate line and the driving current line; A three-color color filter formed in a light emitting region in the pixel region on the insulating film; An overcoat layer applied on the color filter; A spacer formed in a non-light emitting area that is an area other than the light emitting area, wherein the spacer formed by laminating the three-color color filter and the overcoat layer; An anode formed on the light emitting region over the overcoat layer; An organic light emitting layer formed on the anode electrode; A cathode electrode formed on the organic barrier layer; And a sealing cap attached by the spacer to maintain a predetermined distance from the substrate.

A bank pattern is formed on the anode to define the light emitting region and the non-light emitting region. The spacer further includes a bank pattern further formed on the overcoat layer.

A switching thin film transistor connected to the data line and the gate line under the insulating film on the substrate and formed in the pixel area; And a driving thin film transistor connected to the thin film transistor and the driving current wiring and connected to the anode electrode.

The sealing layer further includes a hygroscopic material disposed at an edge portion thereof, and the spacer is formed at an edge portion of the hygroscopic material.

In addition, the organic light emitting diode display device manufacturing method according to the present invention comprises the steps of: forming a thin film transistor element including a data line, a gate line and a driving current wiring defining a pixel region on the substrate; Forming an insulating film covering the thin film transistor element; Defining a light emitting region in the pixel region on the insulating layer, forming one of three color filters in the light emitting region, and forming a spacer by stacking the three color filters in a non-light emitting region other than the light emitting region Wow; Applying an overcoat layer on the color filter and the spacer; Forming an anode electrode on the overcoat layer to match the color filter; Stacking an organic light emitting layer and a cathode on the anode; And attaching a sealing cap to maintain a predetermined distance from the substrate by the spacer.

After forming the anode electrode, further comprising forming a bank pattern defining the light emitting region and the non-light emitting region on the anode electrode, and further stacking the bank pattern on the overcoat layer formed on the spacer. Characterized in that.

The sealing layer further includes a hygroscopic material disposed at an edge portion thereof, and the spacer is formed to correspond to an edge portion of the hygroscopic material.

The organic light emitting diode display and the method of manufacturing the same according to the present invention form a spacer for maintaining a gap with the sealing layer in the process of forming a color filter. In addition, the overcoat layer further includes a spacer and a bank pattern to solve the outgassing problem occurring in the pigment constituting the spacer, thereby improving reliability of the device, and adjusting the height of the spacer using the overcoat layer and the bank pattern. Can be. Therefore, the spacer may be formed without a separate process for manufacturing the spacer. As a result, the structure is simple, the manufacturing process is simple, and the cost can be obtained.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 6F. 3 is a plan view illustrating an organic light emitting diode display according to the present invention. FIG. 4 is an enlarged view illustrating a portion of the organic light emitting diode display of FIG. 3. 5 is a cross-sectional view taken along the line II ′ of FIG. 3, and is a cross-sectional view illustrating a structure of an organic light emitting diode display according to the present invention.

3 to 5, an organic light emitting diode display according to an exemplary embodiment of the present invention includes a data line DL, a scan line SL, and the data line defining a pixel P formed on a substrate SUB. A switching TFT (SWTFT) connected to the DL and the scan line SL, a driving TFT (DRTFT) connected to the switching TFT (SWTFT), an organic light emitting diode (OLED) connected to the driving TFT (DRTFT), and TFTs (SWTFT, DRTFT) and a sealing cap (CAP) covering the organic light emitting diode (OLED). And the moisture absorbent GET is arrange | positioned at the edge of the sealing cap CAP.

On the substrate SUB, a plurality of pixels P are arranged in a matrix arrangement. On the substrate SUB, a sealing cap CAP having a size corresponding to the size of the substrate SUB at regular intervals is attached by the seal SEAL. The moisture absorbent GET is attached to the edge and the inside of the sealing cap CAP.

The reason why the moisture absorbent GET attached to the inner surface of the sealing cap CAP is disposed on the edge side is that the moisture absorbent GET constitutes the pixel P of the display device even when the sealing cap CAP is bent downward. This is to prevent direct contact with the organic thin film. Thus, even if the moisture absorbent (GET) is attached to the edge of the sealing cap (CAP) it is necessary to maintain the sealing cap (CAP) so as not to bend down. Therefore, it is preferable to form the spacer SP near the pixel P. FIG.

If the spacer SP is manufactured in a separate process after manufacturing all the elements (TFT, OLED) of the organic light emitting diode display device, the spacer process may damage the devices, and additional costs This increases and the manufacturing process becomes complicated. Accordingly, the spacer SP is manufactured while the display device is manufactured without additional processing as follows. The spacers SP are formed only around the moisture absorbent GET by maintaining a gap such that the organic light emitting diode OLED formed on the display substrate SUB and the moisture absorbent GET formed on the sealing cap CAP do not contact each other. It is preferable.

The pixel P, which is a light emitting region, is formed on the display substrate, and a region other than the pixel P is a non-light emitting region. The organic light emitting diode is a self-luminous device, and the emission rate is relatively bright compared to power consumption. Therefore, even if the area ratio of the pixel P to the pixel area is only 30 to 40%, a display device having sufficient brightness can be obtained. That is, the ratio of the non-light emitting area is 50% or more, which occupies a considerable area ratio. The spacer SP may be formed at any position among the non-light emitting regions. Furthermore, as described above, it is more preferable to form around the moisture absorbent material GET.

Hereinafter, a method of manufacturing an organic light emitting diode display device according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 6A to 6F. 6A through 6F are cross-sectional views illustrating a process of manufacturing an organic light emitting diode display device having a spacer according to an exemplary embodiment of the present invention. 6a to 6f show the structure shown in cross section taken along the line II ′ of FIG. 3.

First, an organic light emitting diode display device is formed on a substrate SUB. The gate electrode GSW of the switching TFT SWTFT branched from the scan line SL, the scan line SL, the scan line SL, and the gate electrode GDR of the driving TFT DRTFT are disposed on the substrate SUB. Form. A gate insulating layer GI covering the gate materials SL, GPAD, GSW, and GDR is coated. The semiconductor layer ASW and the driving TFT of the switching TFT SWTFT are respectively disposed on the gate insulating layer GI of the portion overlapping with the gate electrode GSW of the switching TFT SWTFT and the gate electrode GDR of the driving TFT DRTFT. A semiconductor layer ADR of (DRTFT) is formed. The source electrode SSW and the drain electrode DSW of the switching TFT SWT and the source electrode SDR and the drain electrode DDR of the driving TFT DRTFT are disposed on both sides of each of the semiconductor layers ASW and ADR. ). The source electrode SDR of the driving TFT DRTFT is formed to be a part of the driving current wiring VDD running in parallel with the data line DL. At this time, the drain electrode DSW of the switching TFT SWTFT contacts the gate electrode GDR of the driving TFT DRTFT through a contact hole formed in the gate insulating film GT. A passivation layer PASI is coated on the entire surface of the substrate SUB on which the source-drain electrodes SSW, DSW, SDR, and DDR are formed. (FIG. 6A)

The color filter CF is applied to the pixel area on the passivation layer PASI. The color filter CF sequentially forms a red color filter CFR, a green color filter CFG, and a blue color filter CFB. In addition, the red-green-blue color filters CF are formed to have a structure in which they are repeatedly arranged in sequence. At this time, a pattern is formed at a suitable position to form the spacer SP, and the red color filter CFR, the green color filter CFG, and the blue color filter CFB are sequentially stacked to form the spacer SP. do. For example, a red pigment is first applied all over and a red color filter (CFR) is formed. At this time, the spacer SP pattern is formed with a red pigment at a position where the spacer SP is to be formed. (FIG. 6B)

The green pigment is applied all over and patterned to form a green color filter (CFG). Further, a spacer SP pattern made of a green pigment is further formed on the spacer SP pattern made of a red pigment at a position where the spacer SP is to be formed. In the same manner, a blue pigment is applied over the entire surface and patterned to form a blue color filter (CFB). Further, a spacer SP pattern is further formed of a blue pigment on the spacer SP pattern made of a red pigment and a green pigment. (FIG. 6C)

As such, the color filters CF and the spacer SP are formed on the entire surface of the overcoat layer OC on the substrate on which the color filters CF and the spacer SP are simultaneously formed. A contact hole is formed in the overcoat layer OC and the passivation film PASI to expose a part of the drain electrode DDR of the driving TFT DRTFT. ITO is deposited on the overcoat layer OC and patterned to form the anode electrode ANO. (FIG. 6D)

A bank pattern BANK is formed on the anode ANO to define a light emitting area of the pixel. In the bank pattern BANK, when the TFTs SWTFT and DRTFT and the various wirings DL, SL, and VDD are formed, the surface is not smooth, and when the organic layer EL is formed on the surface in which the step is formed unevenly, This is to prevent deterioration of organic matter in the part. That is, a non-light emitting region in which a switching TFT (SWTFT), a driving TFT (DRTFT), and various wirings DL, SL, and VDD are formed, and only thin film layers are stacked on the flat substrate to distinguish the flat light emitting region. The bank pattern BANK is formed. In this case, the bank pattern BANK may also be stacked on the spacer SP to be used to define the height of the spacer SP. (FIG. 6E)

The organic layer EL and the cathode electrode layer CAT are sequentially stacked on the anode ANO exposed to the bank pattern BANK. Then, the sealing cap (CAP) is attached to maintain a constant interval by the spacer (SP). In the drawing of this embodiment, the organic layer EL and the cathode electrode layer CAT are further formed on the bank pattern BANK to form the spacer SP together. However, if necessary, the organic layer EL and the cathode electrode layer CAT may not be formed on the bank pattern BANK. An absorbent material (GET) is attached to the inner surface of the sealing cap (CAP). In particular, the moisture absorbent material GET is arranged on the edge side of the sealing cap CAP so as not to contact the organic light emitting diode constituting the pixel located below. (Fig 6f)

The spacer SP is an essential element for maintaining the gap between the sealing cap CAP and the display substrate, but it is not preferable if too much spacer SP is formed. Therefore, in the organic light emitting diode display according to the present invention, it is preferable that the spacer SP for maintaining the gap between the display substrate and the sealing cap CAP is formed only around the moisture absorbent material GET. In addition, when the spacer SP is made of a pigment constituting the color filter CF, as in the present invention, a problem may occur that the organic material is damaged due to the gas component generated in the pigment. Therefore, it is preferable that the spacer SP formed by laminating the pigment, which is the main component of the color filter CF, is completely covered with the overcoat layer OC to prevent damage due to out gasing. In addition, the bank pattern BANK may be further formed on the overcoat layer OC to further prevent outgassing problems that may occur in the spacer SP.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a view showing an organic light emitting diode device.

2 is a cross-sectional view of an organic light emitting diode display device having an encapsulation structure according to the related art.

3 is a plan view of an organic light emitting diode display according to the present invention;

FIG. 4 is an enlarged view illustrating a portion of the organic light emitting diode display of FIG. 3. FIG.

FIG. 5 is a cross-sectional view taken along the line II ′ of FIG. 3, illustrating a structure of an organic light emitting diode display according to the present invention. FIG.

6A through 6F are cross-sectional views illustrating a process of manufacturing an organic light emitting diode display device having a spacer according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

HIL: Hole injection layer HTL: Hole transport layer

EML: Emission Layer ETL: Electron Transport Layer

EIL: electron injection layer

OLED: organic light emitting diode layer PAD: pad part

SUB: Substrate SEAL: Real

ENCAP: Encapsulating glass substrate GET: Hygroscopic material

DL: data line SL: scan line

SWTFT: Switching TFT DRTFT: Driving TFT

OLED: organic light emitting diode VDD: drive current supply wiring

CAT: cathode electrode ANO: anode electrode

EL: organic layer

GSW, GDR: gate electrode SSW, SDR: source electrode

DSW, DDR: Drain electrode ASW, ADR: Semiconductor layer

GI: gate insulating film PASI: protective film

CAP: Sealing cap BANK: Bank pattern

P: pixel SP: spacer

CF: color filter CFR: red color filter

CFG: Green Color Filter CFB: Blue Color Filter

Claims (12)

Board; A data line, a gate line, and a driving current line defining a pixel area on the substrate; An insulating layer covering the data line, the gate line and the driving current line; A three-color color filter formed in a light emitting region in the pixel region on the insulating film; An overcoat layer applied on the color filter; A spacer formed in a non-light emitting area that is an area other than the light emitting area, wherein the spacer formed by laminating the three-color color filter and the overcoat layer; An anode formed on the light emitting region over the overcoat layer; An organic light emitting layer formed on the anode electrode; A cathode electrode formed on the organic barrier layer; And And a sealing cap attached to the substrate by a spacer to maintain a predetermined distance from the substrate. The method of claim 1, And a bank pattern formed on the anode electrode to define the light emitting region and the non-light emitting region. The method of claim 2, And the spacer further comprises a bank pattern further formed on the overcoat layer. The method of claim 1, A switching thin film transistor connected to the data line and the gate line under the insulating film on the substrate and formed in the pixel area; And And a driving thin film transistor connected to the thin film transistor and the driving current line and connected to the anode electrode. The method of claim 1, And the sealing layer further includes a hygroscopic material disposed at an edge portion thereof. The method of claim 5, And the spacer is formed at an edge portion of the moisture absorbing material. Forming a thin film transistor element including a data line, a gate line, and a driving current line defining a pixel area on the substrate; Forming an insulating film covering the thin film transistor element; Defining a light emitting region in the pixel region on the insulating layer, forming one of three color filters in the light emitting region, and forming a spacer by stacking the three color filters in a non-light emitting region other than the light emitting region Wow; Applying an overcoat layer on the color filter and the spacer; Forming an anode electrode on the overcoat layer to match the color filter; Stacking an organic light emitting layer and a cathode on the anode; And attaching a sealing cap so as to maintain a predetermined distance from the substrate by the spacers. The method of claim 7, wherein After forming the anode electrode, And forming a bank pattern defining the light emitting region and the non-light emitting region on the anode electrode. The method of claim 8, Forming the bank pattern, And stacking the bank pattern on the overcoat layer formed on the spacer. The method of claim 7, wherein Forming the thin film transistor device, A switching thin film transistor connected to the data line and the gate line in the pixel area; And a driving thin film transistor connected to the thin film transistor and the driving current wiring and connected to the anode electrode. The method of claim 7, wherein The sealing layer further comprises a moisture absorbing material disposed on the edge portion of the organic light emitting diode display device manufacturing method. The method of claim 11, And the spacers are formed to correspond to edge portions of the moisture absorbing material.

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