1297321 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種薄膜剝離設備，尤其關於一種藉 由薄膜沾黏部來剝離薄膜之薄膜剝離設備。 【先前技術】 傳統上，為了保護半導體基板上所形成的電路在多 • 重處理程序中不要遭受到污染或損壞，或是為了便於製 程之實施通吊會在基板上黏貼有薄膜。此薄膜只是存 在於中間製程中，並不存在於最終產品中。因此，需要 有一道薄膜剝離的程序，藉以將薄膜予以剝離。 ，傳統的薄膜剝離設備，通f是利用大面積的膠帶貼 在薄膜上，然後將此膠帶與薄膜剝離基板（譬如液晶顯示 面板）。然而，這樣的程序往往會浪費很多膠帶，不但不 環保，更使得製造成本無法有效降低。 *中華民國專利公告第443705號專利揭露了一種電路 ⑩ 冑膜釗離機’其中就是利用滚輪將-整捲膠帶從送料 Z、、、氏輪（55)輸送至通過導板（36)而到達收料膠紙輪⑼）， 443705號專利之圖j_4所示。但因其係以膠帶黏貼薄 膜因此δ亥膠帶將無法被重複使用。 【發明内容】 —因此，本發明之一個目的係提供一種薄膜剝離設備， :薄膜4黏部先將薄膜之_部分撕起，然後將被撕起 '膜剝離基板，藉以避免膠帶之浪費，俾能降低製造 5 I297321 成本。 為達上述目#，本發明提供一種薄膜剝離設備，直 包含-承載台、-具有黏性之薄膜沾黏部及一驅動機構:、 承載台用以承載-基板，基板上黏貼有一薄膜。薄膜占 黏部用以接觸薄膜，以便將薄膜之一部分撕起並黏貼在 薄膜沾黏部上。驅動機構驅動薄膜沾黏部與承載台兩者 之一，藉以將薄膜剝離基板。 口 上述薄膜剝離設備可以更包含一推抵機構，用以將 該薄膜往薄膜沾黏部的方向抵緊。驅動機構可以驅動薄 膜沾黏部及推抵機構移動，或驅動承載台移動。 【實施方式】 圖1至3顯示依據本發明第一實施例之薄膜剝離設 備之第一至第三狀態如圖1至3所示，本實施例之薄膜 剝離設備包含一承載台10、一具有黏性之薄膜沾黏部 20、一驅動機構30及一推抵機構40。 • 承載台10用以承載一基板2，基板2上黏貼有一薄 膜4。承載台10可以具有一個或多個吸盤（未顯示）以透 過真空吸引裝置來固定住基板2。薄膜沾黏部20可以具 有任何之適當構造。於本實施例中，具有黏性之薄膜沾 黏部20係為一薄膜黏取滚輪，用以接觸該薄膜4(圖1)， 然後轉動一個角度（圖2)，以便將該薄膜4之一部分撕起 並黏貼在該薄膜沾黏部20上。值得注意的是，薄膜黏取 滾輪亦可以不用被轉一個角度，只要被往上抬起即可達 成同樣的效果。推抵機構40用以將該薄膜4往該薄膜沾 6 1297321 黏部20的方向抵緊，藉以和薄膜沾黏部2()彡同爽持住 薄膜4。推抵機構40可以是由氣壓缸、油壓缸或導螺桿 等構成。驅動機構30驅動該薄膜沾黏部2〇舆該承載: 1〇兩者之-實質上朝一水平方向與—鉛直方向運動，： 以將該薄膜4剝離該基板2。於本應用中，是先將薄膜 沾黏部20抬起（圖3)，然後再平移薄膜沾黏部2〇:舉例 而言’權動機構30可以驅動該薄膜沾黏音"〇移動或 驅動該承載台10移動。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film peeling apparatus, and more particularly to a film peeling apparatus which peels a film by a film adhering portion. [Prior Art] Conventionally, in order to protect a circuit formed on a semiconductor substrate from being contaminated or damaged in a multi-processing process, or to facilitate the process, a film is adhered to the substrate. This film is only present in the intermediate process and is not present in the final product. Therefore, there is a need for a film peeling procedure whereby the film is peeled off. In the conventional film stripping apparatus, a large area of tape is applied to the film, and then the tape is peeled off from the film (for example, a liquid crystal display panel). However, such a procedure tends to waste a lot of tape, which is not environmentally friendly, and the manufacturing cost cannot be effectively reduced. * Patent No. 443,705 of the Republic of China Patent Publication No. 443,705 discloses a circuit 10 胄 film detaching machine 'where the roller is used to convey the entire roll of tape from the feed Z, the wheel (55) to the passage through the guide (36) The receipt rubber roller (9) is shown in Figure j_4 of the patent No. 443705. However, because it is adhered to the film by tape, the AH tape will not be reused. SUMMARY OF THE INVENTION - Accordingly, it is an object of the present invention to provide a film stripping apparatus in which the adhesive portion of the film 4 is first torn off from the film portion, and then the film is peeled off to peel off the substrate to avoid waste of the tape. Can reduce the cost of manufacturing 5 I297321. In order to achieve the above-mentioned object #, the present invention provides a film stripping apparatus, which comprises a carrying platform, a viscous film adhering portion and a driving mechanism: the carrying platform is used for carrying a substrate, and a film is adhered to the substrate. The film occupies the contact portion to contact the film to tear a portion of the film and adhere it to the film affixed portion. The drive mechanism drives one of the film adhering portion and the carrier to thereby peel the film from the substrate. The above film stripping apparatus may further comprise a pushing mechanism for abutting the film in the direction of the film adhering portion. The drive mechanism can drive the film sticking and pushing mechanism to move, or drive the carrier to move. 1 to 3 show first to third states of a film peeling apparatus according to a first embodiment of the present invention. As shown in FIGS. 1 to 3, the film peeling apparatus of the present embodiment includes a carrier 10 and a The viscous film adhesive portion 20, a driving mechanism 30 and a pushing mechanism 40. • The carrier 10 is used to carry a substrate 2 to which a film 4 is adhered. The carrier 10 can have one or more suction cups (not shown) for holding the substrate 2 through a vacuum suction device. The film adherend 20 can have any suitable configuration. In the present embodiment, the adhesive film adhering portion 20 is a film adhesive roller for contacting the film 4 (Fig. 1), and then rotated by an angle (Fig. 2) so as to be a part of the film 4. It is torn and adhered to the film adhering portion 20. It is worth noting that the film-adhesive roller can also be rotated at an angle, as long as it is lifted up to achieve the same effect. The pushing mechanism 40 is used to abut the film 4 in the direction of the adhesive portion 20 of the film, so as to hold the film 4 together with the film adhering portion 2 (). The pushing mechanism 40 may be constituted by a pneumatic cylinder, a hydraulic cylinder or a lead screw. The driving mechanism 30 drives the film adhering portion 2 to carry the load: 1 - substantially in a horizontal direction and - in the vertical direction, to peel the film 4 from the substrate 2. In this application, the film adhering portion 20 is first lifted (Fig. 3), and then the film adhering portion 2 is translated: for example, the 'weighting mechanism 30 can drive the film to stick to the sound" The carrier 10 is driven to move.
值得注意的是，推抵機構40係可省略的構件。於此 情況下’只要薄膜沾㈣2〇黏取薄膜的黏力夠大（遂如 薄膜4黏取在薄膜沾黏冑2〇的面積夠大），則可將薄膜 沾黏部2G較’並使薄膜沾黏部2()與承載台相對運 動，仍可有效剝離薄膜4。薄膜沾黏冑2()可以被設計成 可以上下移動，或者承載台1G可以被設計成可以上下移 薄膜沾黏部20主要是要將薄膜4局部撕離基板2, 因此薄膜沾黏部20與薄膜4接觸之圓周面不見得要如圖 2所示地那麼大。在有頂推機構4〇存在的情況下，薄膜 沾黏部2G與薄膜4接觸之面積很小，整個薄膜的撕離所 需要的拉力大部分來自於頂推機構與薄膜沾黏部20之間 的夾持力。因此，薄膜沾黏冑20的使用壽命較長。當薄 膜沾黏部20的黏性退化時，可以更換薄膜沾黏部2〇或 重新上膠即可恢復正常運作。 圖4顯示依據本發明第二實施例之薄膜剝離設備之 央持機構之示意圖。如圖4所示，本實施例之薄膜剝離 7 1297321 設備更包含一夾持機構50，用以直接夾持被薄膜沾黏部 20黏取之薄膜4。於此情況下，驅動機構30可以驅動薄 膜沾黏部20及夾持機構50移動，或者驅動承載台10移 動。 圖5至7顯示依據本發明第三實施例之薄膜剝離設 備之脫料機構之動作示意圖。圖8顯示依據本發明第三 實施例之薄膜剝離設備之脫料機構之俯視圖。如圖5至 8所示，本實施例之薄膜剝離設備更包含一脫料機構6〇， 用以使薄膜4脫離薄膜沾黏部20。整個脫料機構60的 動作係依序如圖5至7所示。於圖5中，薄膜4尚未完 全剝離基板2。於圖6中，薄膜4完全剝離基板2而往 下垂。於圖7中，脫料機構60頂推薄膜4使其脫離薄膜 沾黏部20後掉落下來。本實施例中，脫料機構6〇係由 一支或兩支頂桿所構成，藉以將薄膜沾黏部20上之薄膜 4頂開以使其脫離薄膜沾黏部20。或者，脫料機構6〇可 以利用一機械手臂來達成。 藉由本發明之薄膜剝離設備，可以避免習知技術中 需要使用到大量膠帶的缺點，藉以有效降低製造成本。 在較佳實施例之詳細說明中所提出之具體實施例僅 用以方便說明本發明之技術内容，而非將本發明狹義地 限制於上述實施例，在不超出本發明之精神及以下申請 專利範圍之情況，所做之種種變化實施，皆屬於本發明 之範圍。 8 1297321 【圖式簡單說明】 圖1顯示依據本發明第一實施例之薄膜剝離設備之 第一狀態。 圖2顯示依據本發明第一實施例之薄膜剝離設備之 第二狀態。 圖3顯示依據本發明第一實施例之薄膜剝離設備之 第三狀態。 圖4顯示依據本發明第二實施例之薄膜剝離設備之 夾持機構之示意圖。 圖5顯示依據本發明第三實施例之薄膜剝離設備之 脫料機構之動作示意圖之一。 圖6顯示依據本發明第三實施例之薄膜剝離設備之 脫料機構之動作示意圖之二。 圖7顯示依據本發明第三實施例之薄膜剝離設備之 脫料機構之動作示意圖之三。 圖8顯示依據本發明第三實施例之薄膜剝離設備之 脫料機構之俯視圖。 【主要元件符號說明 4〜薄膜 20〜薄膜沾黏部 40〜推抵機構 60〜脫料機構 2〜基板 10〜承載台 30〜驅動機構 5 0〜爽持機構It is worth noting that the pushing mechanism 40 is a member that can be omitted. In this case, as long as the adhesion of the film (4) 2 〇 adhesive film is large enough (for example, if the film 4 is adhered to the area where the film is viscous 2 够), the film viscous portion 2G can be made more than The film adhering portion 2 () moves relative to the stage, and the film 4 can be effectively peeled off. The film adhesive 胄 2 () can be designed to move up and down, or the carrier 1G can be designed to move the film affixing portion 20 up and down mainly to partially peel the film 4 away from the substrate 2, so the film affixing portion 20 and The circumferential surface of the film 4 contact is not necessarily as large as shown in FIG. In the case where the pushing mechanism 4 is present, the area in which the film adhering portion 2G contacts the film 4 is small, and most of the pulling force required for the tearing of the entire film comes from between the pushing mechanism and the film adhering portion 20. The clamping force. Therefore, the film adheres to the crucible 20 for a long service life. When the adhesion of the film-adhesive portion 20 is degraded, the film-adhesive portion 2 can be replaced or re-glued to resume normal operation. Fig. 4 is a view showing a holding mechanism of a film peeling apparatus according to a second embodiment of the present invention. As shown in FIG. 4, the film peeling 7 1297321 device of the present embodiment further includes a clamping mechanism 50 for directly holding the film 4 adhered by the film adhering portion 20. In this case, the drive mechanism 30 can drive the film adhering portion 20 and the chucking mechanism 50 to move, or drive the carrier 10 to move. 5 to 7 are views showing the operation of the stripping mechanism of the film peeling apparatus according to the third embodiment of the present invention. Figure 8 is a plan view showing a stripping mechanism of a film stripping apparatus in accordance with a third embodiment of the present invention. As shown in FIGS. 5 to 8, the film stripping apparatus of the present embodiment further includes a stripping mechanism 6A for releasing the film 4 from the film adhering portion 20. The operation of the entire stripping mechanism 60 is as shown in Figs. 5 to 7. In Fig. 5, the film 4 has not completely peeled off the substrate 2. In Fig. 6, the film 4 completely peels off the substrate 2 and hangs down. In Fig. 7, the stripping mechanism 60 pushes the film 4 out of the film adhering portion 20 and then falls. In the present embodiment, the stripping mechanism 6 is composed of one or two ejector pins, whereby the film 4 on the film adhering portion 20 is opened to be separated from the film adhering portion 20. Alternatively, the stripping mechanism 6 can be achieved using a robotic arm. With the film stripping apparatus of the present invention, the disadvantages of the need to use a large amount of tape in the prior art can be avoided, thereby effectively reducing the manufacturing cost. The specific embodiments of the present invention are intended to be illustrative only and not to limit the invention to the above embodiments, without departing from the spirit of the invention and the following claims. The scope of the invention and the various changes made are within the scope of the invention. 8 1297321 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a first state of a film peeling apparatus according to a first embodiment of the present invention. Fig. 2 shows a second state of the film peeling apparatus according to the first embodiment of the present invention. Fig. 3 shows a third state of the film peeling apparatus according to the first embodiment of the present invention. Fig. 4 is a view showing the holding mechanism of the film peeling apparatus in accordance with the second embodiment of the present invention. Fig. 5 is a view showing the operation of the stripping mechanism of the film stripping apparatus according to the third embodiment of the present invention. Fig. 6 is a view showing the second operation of the stripping mechanism of the film stripping apparatus according to the third embodiment of the present invention. Fig. 7 is a view showing the third operation of the stripping mechanism of the film stripping apparatus according to the third embodiment of the present invention. Fig. 8 is a plan view showing the stripping mechanism of the film stripping apparatus in accordance with the third embodiment of the present invention. [Main component symbol description 4~ Film 20~ Film adhering part 40~ Pushing mechanism 60~Removing mechanism 2~Substrate 10~Loading table 30~Drive mechanism 5 0~Sweet holding mechanism