CN105904831A - Peeling device and peeling method for laminated body and method of manufacturing electronic device - Google Patents

Abstract

The invention relates to a peeling device and a peeling method for a laminated body and a method of manufacturing the electronic device. By means of the peeling device, a first substrate and a second substrate are bonded in a peelable manner to form a laminated body, while the first substrate and the second substrate are sequentially stripped through the interface of the first and second substrates from one ends towards the other ends thereof. The peeling device for the laminated body comprises a bearing part used for bearing the first substrate of the laminated body; a flexible plate used for absorbing the second substrate of the laminated body by means of an absorption surface through the vacuum adsorption process; a movable body bonded to one surface of the flexible plate that is opposite to the absorption surface by means of a connecting member and used for deforming the flexible plate through the movement of the movable body relative to the bearing part so as to sequentially strip the laminated body at the interface thereof. The connecting member passes through the through hole of the flexible plate. A shielding member forms in the through hole to be positioned between the space part of the flexible plate and the second substrate. The flexible plate is therefore blocked by the shielding member based on the vacuum attraction of the flexible plate.

Description

The stripping off device of duplexer and stripping means and the manufacture method of electronic device

Technical field

The present invention relates to the stripping off device of duplexer and stripping means and the manufacture method of electronic device.

Background technology

Slimming, light-duty along with electronic devices such as display floater, solaode, thin-film secondary batteries Change, it is desirable to be applied to the substrates (the 1st substrate) such as the glass plate of these electronic devices, resin plate, metallic plate Thin plate.

But, if the lower thickness of substrate, then the treatability of substrate deteriorates, accordingly, it is difficult at substrate Surface formed electronic device functional layer (thin film transistor (TFT) (TFT:Thin Film Transistor), Color filter (CF:Color Filter)).

Therefore, motion has the manufacture method of following a kind of electronic device: in the back side sticking glass system of substrate Reinforcing plate (the 2nd substrate) thus constitute the duplexer utilizing reinforcing plate to strengthen substrate, and at layer Under the state of stack, the exposure at substrate forms functional layer.In this manufacture method, the treatability of substrate Improve, therefore, it is possible to the exposure at substrate forms functional layer well.And, reinforcing plate is forming merit From strippable substrate after ergosphere.

The stripping means of the reinforcing plate disclosed in patent documentation 1 is by the diagonal angle from the duplexer being positioned at rectangle A corner in two corners on line make towards another corner reinforcing plate or substrate or they Direction flexible deformation successively separated from each other is carried out twocouese.Now, in order to make stripping be smoothed out, Make in a corner of duplexer and peel off beginning portion.Peel off beginning portion be by by hoe scaler from duplexer End face be inserted into scheduled volume to the interface between substrate and reinforcing plate and make.

The stripping off device of patent documentation 1 includes object stage, flex plate, multiple sucker (coupling member), many Individual driving means (movable body) and control device etc..Use the stripping off device of patent documentation 1, utilize Object stage absorption keeps substrate, utilizes flex plate absorption to keep reinforcing plate.The bar of multiple driving means by Multiple suckers are linked to flex plate.Further, the device bar to multiple driving means is controlled relative to object stage Position be controlled in units of each bar.Specifically, object stage flatly supporting substrates is being utilized State under, the position of the bar of multiple driving means is controlled, make reinforcing plate from peel off beginning portion depend on Secondary flexible deformation.Thereby, it is possible to from strippable substrate reinforcing plate.

Patent documentation 1: No. 5155454 publications of Japanese Patent Publication No.

Summary of the invention

The problem that invention is to be solved

In the stripping off device of patent documentation 1, described sucker (coupling member) is fixed on flex plate The face of the side contrary with the side by duplexer, and the top ends of the bar of driving means is pacified by joint It is loaded on this sucker.In such installation form, there are the following problems, i.e. to the fixing suction of flex plate During dish, the bar of driving means and joint become obstacle, thus sucker can not be easily fixed to flex plate.

Therefore, in order to improve the sucker fixed operation relative to flex plate, research has following scheme.

Figure 16 is the main portion representing the 1st conventional form for sucker 100 is fixed on flex plate 102 Position amplification view.

Flex plate 102 shown in Figure 16 specifically includes that flexed plate 104, and it determines the flexibility of flex plate 102； And rubber slab 108, its surface being adhered to flexed plate 104 vac sorb duplexer 106.At rubber Plate 108 and flexed plate 104 are provided with the through hole 110,112 configured to run through for sucker 100.? In 1st form, by chimeric from the stacking side (A) of flex plate 102 for sucker 100 and be fixed on through hole 110, 112.Thereby, it is possible to be prone to sucker 100 is fixed on flex plate 102.It is to say, due to by sucker 100 are fixed on flex plate 102 from the stacking side (A) of flex plate 102, therefore, to flex plate 102 During fixing sucking disk 100, the bar of driving means and joint will not become obstacle.

But, in the 1st form, by duplexer 106 vac sorb in the rubber slab 108 of flex plate 102 Time, under the sucking action of rubber slab 108, the spatial portion 114 of through hole 110,112 is by sucker 100 and Duplexer 106 is inaccessible and becomes vacuum.Therefore, as shown in figure 17, there is following situation, i.e. stacking The a part of 106A being positioned at spatial portion 114 of body 106 is inhaled into spatial portion 114, thus local deformation And crack.

Figure 18 is the main portion representing the 2nd conventional form for sucker 100 is fixed on flex plate 102 Position amplification view.

In the 2nd form shown in Figure 18, in order to not make a part of 106A of duplexer 106 be inhaled into sky Between in portion 114, the block rubber 116 of horizontal aligument is configured at spatial portion 114.

But, in the 2nd form, block rubber 116 will not be followed the flexible deformation of flex plate 102 and be deformed. Therefore, when peeling off, the local 106A contacted with block rubber 116 of duplexer 106 will not be relative to it He partly deforms, i.e. in terms of other parts of deformation, duplexer 106 is locally deformed with, because of This cracks sometimes.

Figure 19 is the main portion representing the 3rd conventional form for sucker 100 is fixed on flex plate 102 Position amplification view.

In the 3rd form shown in Figure 19, in order to prevent spatial portion 114 from becoming vacuum, at flexed plate 104 It is provided with the passage 118 being connected with spatial portion 114, makes spatial portion 114 open to air via passage 118 Put.

When being provided with, at flexed plate 104, the passage 118 being connected with spatial portion 114, due to spatial portion 114 It is connected with air, therefore, it is possible to the problem solving the 1st form.But, due to rubber slab 108 and stacking Vacuum between body 106 is destroyed, and therefore existing can not the such problem of adsorption layer stack 106.

As shown above, in the 1st conventional form～the 3rd form, although sucker 100 can be improved relative In the fixed operation of flex plate 102, but there is the problem damaged for local 106A of duplexer 106 and can not inhale The problem of attached duplexer 106.

Additionally, in Figure 16～Figure 19, reference 120 is between flexed plate 104 and rubber slab 108 Flexed plate, this flexed plate 120 is adhered to flexed plate 104 via double-sided adhesive tape 122.It addition, rubber Plate 108 is adhered to flexed plate 120 via double-sided adhesive tape 124.Further, reference 126 is provided at flexibility The through hole of the attraction of plate 102, the frame-shaped that this through hole 126 is formed with the periphery along rubber slab 108 Attraction groove 128 be connected.That is, by via the air in through hole 126 attraction groove 128, Thus by duplexer 106 vac sorb in rubber slab 108.

The present invention makes in view of such problem, its object is to, it is provided that the stripping dress of duplexer Put the manufacture method with stripping means and electronic device, it is possible to improving coupling member relative to flex plate Prevent the breakage of duplexer while fixed operation, and be able to maintain that the absorption of substrate is protected by flex plate Hold.

For solving the scheme of problem

In order to reach described purpose, the present invention provides the stripping off device of a kind of duplexer, makes have the 1st base Plate and the 2nd substrate and so that described 1st substrate and the layer of described 2nd substrate can be bonded in the way of peeling off Stack interface between described 1st substrate and described 2nd substrate is from end side towards another side successively Peel off, it is characterised in that the stripping off device of this duplexer includes: support, and it is used for supporting described layer Described 1st substrate of stack；Flex plate, it utilizes the described of duplexer described in its adsorption plane vac sorb 2nd substrate；And movable body, it is that be fixed on described flex plate with described adsorption plane by coupling member The face of contrary side, and, move make institute by making movable body be independently relative to described support State flex plate flexible deformation, so that described duplexer is peeled off successively at described interface, described coupling member Configure in the way of in the through hole being had through described flex plate, described through hole be formed at It is configured with between spatial portion and described 2nd substrate being adsorbed in described flex plate of described flex plate and covers structure Part, the described flex plate shielded members interrupt of pull of vacuum to described spatial portion.

In order to reach described purpose, the present invention provides the stripping means of a kind of duplexer, makes have the 1st base Plate and the 2nd substrate and so that described 1st substrate and the layer of described 2nd substrate can be bonded in the way of peeling off Stack interface between described 1st substrate and described 2nd substrate is from end side towards another side successively Peel off, it is characterised in that the stripping means of this duplexer includes: supporting operation, utilize support to support Described 1st substrate of described duplexer；Absorption process, utilizes the adsorption plane of flex plate to adsorb described stacking Described 2nd substrate of body；And stripping process, utilize multiple movable body and make by coupling member described Flex plate flexible deformation and make described 2nd substrate of described duplexer from end side towards another side successively Flexible deformation, so that described duplexer is peeled off successively at described interface.Described coupling member with through Mode in the through hole that described flex plate is had configures, described through hole be formed at described flexibility It is configured with shading member, in institute between spatial portion and described 2nd substrate being adsorbed in described flex plate of plate State in stripping process, the described flex plate shielded members interrupt of pull of vacuum to described spatial portion.

In order to reach described purpose, the present invention provides the manufacture method of a kind of electronic device, this electronic device Manufacture method have: functional layer formation process, for by the 1st substrate and the 2nd substrate peeling off The duplexer that mode is pasted, the exposure at described 1st substrate forms functional layer；And separation work Sequence, self-forming has described 1st substrate of described functional layer to separate described 2nd substrate, it is characterised in that institute State separation circuit to have: supporting operation, utilize support to support described 1st substrate of described duplexer； Absorption process, utilizes the adsorption plane of flex plate to adsorb described 2nd substrate of described duplexer；And peel off Operation, utilizes multiple movable body and makes described flex plate flexible deformation make described stacking by coupling member Described 2nd substrate of body from end side towards another side successively flexible deformation, thus by described 2nd substrate Peeling off successively from described 1st substrate, described coupling member is through with had through described flex plate Mode in hole configures, be formed at the spatial portion of described flex plate by described through hole be adsorbed in described It is configured with shading member between described 2nd substrate of flex plate, in described stripping process, described flexibility The plate shielded members interrupt of pull of vacuum to described spatial portion.

Use the present invention, owing to being provided with through hole at flex plate, therefore, by by coupling member with from Stacking side configures through the mode in through hole, it is possible to improve coupling member consolidating relative to flex plate Determine workability.It addition, be formed at the spatial portion of flex plate by through hole and be adsorbed in the 2nd of flex plate the It is configured with shading member between substrate, utilizes shading member to block the flex plate vacuum attraction to spatial portion Power, therefore, it is possible to prevent the breakage of the duplexer (the 2nd substrate) caused because spatial portion becomes vacuum, And it is able to maintain that the absorption of substrate is kept by flex plate.

In a technical scheme of the present invention, it is preferred that described shading member is resinous sheet material, It fits in described flex plate.

Use the technical program, it is possible to utilize and fit in the resinous sheet materials such as flex plate, plastic tape The blocking-up flex plate pull of vacuum to spatial portion, and it is prevented from the vacuum leak of flex plate, therefore can Enough maintain flex plate that the absorption of substrate is kept.

In another technical scheme of the present invention, it is preferred that described spatial portion is via being located at described flexibility Plate is connected with air with the passage of at least one in described coupling member.

Use the technical program, even if spatial portion effect being had minimum pull of vacuum from flex plate In the case of, owing to spatial portion is to atmosphere opening, therefore it also is able to prevent the local of duplexer from attracteding to sky Between in portion.Even if it addition, make the minimum pull of vacuum acting on spatial portion to atmosphere opening, the most not For the vac sorb of duplexer effect and can keep producing impact on flex plate.

The effect of invention

Use the stripping off device of duplexer of the present invention and stripping means and the manufacture method of electronic device, energy Enough improve coupling member relative to the fixed operation of flex plate while prevent the breakage of duplexer, and And it is able to maintain that the absorption of substrate is kept by flex plate.

Accompanying drawing explanation

Fig. 1 is that the main portions of an example of the duplexer representing the manufacturing process's supply to electronic device is put Big side view.

Fig. 2 is the main portions of the example representing the duplexer made in the midway of the manufacturing process of LCD Enlarged side view.

(A) of Fig. 3～(E) of Fig. 3 are to represent to utilize that peels off that beginning portion producing device carries out to peel away The explanatory diagram of beginning portion's manufacture method.

Fig. 4 is the top view utilizing and peeling off the duplexer that beginning portion manufacture method has made stripping beginning portion.

Fig. 5 is the longitudinal section of the structure of the stripping off device representing embodiment.

Fig. 6 is allocation position, the flex plate top view representing many connecting rods relative to flex plate.

(A) of Fig. 7～(C) of Fig. 7 are the explanatory diagrams of the structure representing flex plate.

Fig. 8 is the longitudinal section of the stripping off device that the interface to duplexer is peeled off.

Fig. 9 is the longitudinal section representing sucker relative to the installation constitution of connecting rod.

(A) of Figure 10 and (B) of Figure 10 are the longitudinal sections of the sucker of the action representing sucker.

Figure 11 is the main portions sectional view representing bolt relative to the flex plate of the installation form of flex plate.

(A) of Figure 12～(C) of Figure 12 are that expression in chronological order will be by peeling off making side of beginning portion Method has made the explanatory diagram of the stripping means of the reinforcing plate stripping of the duplexer peeling off beginning portion.

(A) of Figure 13～(C) of Figure 13 are that (C) of then Figure 12 (A)～Figure 12 is the most suitable Sequence represents the explanatory diagram of the stripping means reinforcing plate of duplexer peeled off.

(A) of Figure 14 and (B) of Figure 14 are the main portions of (C) of Figure 12 (B) and Figure 12 Amplification stereogram.

Figure 15 is the main portions section view of the flex plate of another form representing the passage being located at flex plate Figure.

Figure 16 is to represent for improving the sucker the 1st conventional form relative to the fixed operation of flex plate Main portions amplification view.

Figure 17 is to represent that the main portions that the local of duplexer attracted in the spatial portion of flex plate amplifies Sectional view.

Figure 18 is to represent for improving the sucker the 2nd conventional form relative to the fixed operation of flex plate Main portions amplification view.

Figure 19 is to represent for improving the sucker the 3rd conventional form relative to the fixed operation of flex plate Main portions amplification view.

Detailed description of the invention

Hereinafter, embodiments of the present invention are described with reference to the accompanying drawings.

Hereinafter, illustrate to use the duplexer of the present invention in manufacturing process's (manufacture method) of electronic device Stripping off device and the situation of stripping means.

Electronic device refers to the electronic components such as display floater, solaode, thin-film secondary battery.As Display floater, it is possible to illustrate have liquid crystal display (LCD:Liquid Crystal Display) panel, etc. Ion display panel (PDP:Plasma Display Panel) and organic el display (OELD: Organic Electro Luminescence Display) panel.

The manufacturing process of electronic device

Electronic device forms electronic device by the surface of the substrate at glass system, resin-made, metal etc. Functional layer (if LCD, then for thin film transistor (TFT) (TFT), color filter (CF)) and manufacture.

Before forming functional layer, the back side of described substrate is made to be pasted on reinforcing plate and be configured to duplexer. Afterwards, when duplexer, form functional layer on the surface of substrate.Then, functional layer is being formed After, make reinforcing plate from strippable substrate.

That is, in the manufacturing process of electronic device, including: when duplexer on the surface of substrate The functional layer formation process forming functional layer has the substrate of functional layer to separate the separation of reinforcing plate with self-forming Operation.The stripping off device of the duplexer of this separation circuit application present invention and stripping means.

Duplexer 1

Fig. 1 is the main portions enlarged side view of the example representing duplexer 1.

Duplexer 1 includes the substrate (the 1st substrate) 2 formed for functional layer and for strengthening this substrate 2 Reinforcing plate (the 2nd substrate) 3.It addition, reinforcing plate 3 has the resin bed 4 as adsorption layer at surface 3a, The back side 2b of adhesive base plate 2 on resin bed 4.That is, substrate 2 utilizes effect between itself and resin bed 4 The bonding force of Van der Waals force or resin bed 4 across resin bed 4 so that reinforcing plate can be pasted in the way of peeling off 3。

Substrate 2

Functional layer is formed at surface (exposure) 2a of substrate 2.As substrate 2, it is possible to illustrate glass base Plate, ceramic substrate, resin substrate, metal basal board, semiconductor substrate.Among these substrates, due to The chemical resistance of glass substrate, resistance to excellent moisture permeability and linear expansion coefficient are less, therefore, are suitable as electricity The substrate 2 of sub-device.Further, since linear expansion coefficient diminishes, the most also have and at high temperature formed The pattern of functional layer be difficult to, when cooling, the advantage that offsets.

Glass as glass substrate, it is possible to illustrate have alkali-free glass, pyrex, soda-lime glass, High silica glass, other the oxidation system glass with silicon oxide as main component.Oxidation system glass is preferred The content of the silicon oxide in terms of oxide is 40 mass %～the glass of 90 mass %.

Glass as glass substrate, it is preferred that Select and Apply and be suitable for manufactured electronic device The glass of kind or be suitable for the glass of its manufacturing process.Such as, the glass substrate of liquid crystal board is excellent Choosing, uses the glass (alkali-free glass) being substantially free of alkali metal component.

The thickness of substrate 2 is set according to the kind of substrate 2.Such as, glass substrate is used at substrate 2 In the case of, for lightness, the thin plate of electronic device, the thickness of substrate 2 is preferably set to 0.7mm Hereinafter, more preferably it is set in below 0.3mm, is further preferably set in below 0.1mm.At substrate 2 Thickness in the case of below 0.3mm, it is possible to give glass substrate good flexibility.And, at base The thickness of plate 2 is in the case of below 0.1mm, it is possible to being rolled up by glass substrate is web-like, from glass substrate The viewpoint of manufacture and the process of glass substrate from the viewpoint of, the thickness of preferable substrate 2 is at 0.03mm Above.

Additionally, in FIG, substrate 2 is made up of a substrate, but substrate 2 can also be by multiple substrate structures Become.That is, substrate 2 can also be constituted by by the duplexer that multiple substrates are laminated.In the case of Gai, structure The aggregate thickness becoming all substrates of substrate 2 becomes the thickness of substrate 2.

Reinforcing plate 3

As reinforcing plate 3, it is possible to illustrate have glass substrate, ceramic substrate, resin substrate, metal basal board, Semiconductor substrate.

The thickness of reinforcing plate 3 is set in below 0.7mm, according to the kind of substrate 2 strengthened, thickness etc. It is set.It addition, the thickness of reinforcing plate 3 both can might be less that substrate 2 more than the thickness of substrate 2 Thickness, but in order to strengthen substrate 2, the thickness of reinforcing plate 3 is preferably at more than 0.4mm.

It addition, in the present embodiment, reinforcing plate 3 is made up of a substrate, but reinforcing plate 3 can also be by inciting somebody to action The duplexer that multiple substrates are laminated is constituted.In the case of Gai, constitute the conjunction of all substrates of reinforcing plate 3 Meter thickness becomes the thickness of reinforcing plate 3.

Resin bed 4

In order to prevent duplexer from peeling off between resin bed 4 and reinforcing plate 3, and by resin bed 4 and reinforcing plate 3 Between adhesion be set to higher than the adhesion between resin bed 4 and substrate 2.Thus, at stripping process In, the interface peel between resin bed 4 and substrate 2.

The resin constituting resin bed 4 is not particularly limited, and can there are acrylic resin, polyolefin tree Fat, polyurethane resin, polyimide resin, organic siliconresin and polyimides organic siliconresin. Several resin can also be used in mixed way.Wherein, from the viewpoint of thermostability, fissility, the most organic Silicones, polyimides organic siliconresin.

The thickness of resin bed 4 is not particularly limited, and is preferably set to 1 μm～50 μm, is more preferably set as 4 μm～20 μm.The thickness of resin bed 4 is set in more than 1 μm, thus when between resin bed 4 and substrate 2 When being mixed into bubble, foreign body, it is possible to utilize the deformation of resin bed 4 to absorb bubble, the thickness of foreign body.Separately On the one hand, the thickness of resin bed 4 is located at below 50 μm such that it is able to when shortening the formation of resin bed 4 Between, and need not excessively use the resin of resin bed 4, therefore less expensive.

It addition, in order to make reinforcing plate 3 can support whole resin bed 4, the profile of resin bed 4 be preferably with The profile of reinforcing plate 3 is identical or less than the profile of reinforcing plate 3.It addition, in order to make resin bed 4 and whole base Plate 2 is closely sealed, and the profile of resin bed 4 is preferably identical with the profile of substrate 2 or more than substrate 2 profile.

It addition, in FIG, resin bed 4 is constituted by one layer, but resin bed 4 can also be by the above structure of two-layer Become.In the case of Gai, the thickness of the total constituting all layers of resin bed 4 becomes the thickness of resin bed.Separately Outward, in the case of being somebody's turn to do, the kind of the resin constituting each layer can also be different.

And, in the present embodiment, employ organic membrane i.e. resin bed 4 as adsorption layer, but also may be used To use inorganic layer to replace resin bed 4.The inoranic membrane constituting inorganic layer such as contains from by metal silication At least one selected in the group that thing, nitride, carbide and carbonitride are constituted.

And, the duplexer 1 of Fig. 1 has resin bed 4 as adsorption layer, but duplexer 1 can also be without including Resin bed 4 and include substrate 2 and reinforcing plate 3.In this case, utilize between substrate 2 and reinforcing plate 3 The Van der Waals force etc. of effect makes substrate 2 and reinforcing plate 3 can paste in the way of peeling off.It addition, at substrate 2 and in the case of reinforcing plate 3 is glass substrate, in order to make substrate 2 and reinforcing plate 3 not glue Connecing, the preferably surface 3a in reinforcing plate 3 forms inorganic thin film.

It is formed with the duplexer 6 of the embodiment of functional layer

Via functional layer formation process thus form functional layer at the surface 2a of the substrate 2 of duplexer 1.As The forming method of functional layer, it is possible to (Chemical Vapor Deposition: chemical gaseous phase is sunk to use CVD Long-pending) vapour deposition method of method and PVD (Physical Vapor Deposition: physical vapour deposition (PVD)) method etc., Sputtering method.Functional layer utilizes photoetching process, etching method to be formed as predetermined pattern.

Fig. 2 is the example representing the duplexer 6 at the rectangle made by the midway of the manufacturing process of LCD Main portions enlarged side view.

Duplexer 6 includes reinforcing plate 3A, resin bed 4A, substrate 2A, functional layer 7, substrate 2B, resin Layer 4B and reinforcing plate 3B being laminated with described order.That is, the duplexer 6 of Fig. 2 is equivalent to Fig. 1 institute The duplexer 1 shown duplexer of balanced configuration in the way of clipping functional layer 7.Hereinafter, base will be included The duplexer of plate 2A, resin bed 4A and reinforcing plate 3A is referred to as the 1st duplexer 1A, will include substrate 2B, The duplexer of resin bed 4B and reinforcing plate 3B is referred to as the 2nd duplexer 1B.

The thin film transistor (TFT) as functional layer 7 is formed at the surface 2Aa of the substrate 2A of the 1st duplexer 1A (TFT), the surface 2Ba at the substrate 2B of the 2nd duplexer 1B forms the color filter as functional layer 7 (CF)。

1st duplexer 1A and the 2nd duplexer 1B is by making the surface 2Aa of substrate 2A, the surface of substrate 2B 2Ba coincides and integrated mutually.Thus, the 1st duplexer 1A and the 2nd duplexer 1B is manufactured to clip function The duplexer 6 of the structure of the mode balanced configuration of layer 7.

Utilize cutter to be formed at duplexer 6 in the stripping beginning portion manufacturing process of separation circuit and peel off beginning portion After, the stripping process of separation circuit peels off reinforcing plate 3A, 3B successively, afterwards, install polaroid, Backlight etc., thus create the LCD of product.

Peel off beginning portion producing device 10

(A) of Fig. 3～(E) of Fig. 3 are to represent that use in peeling off beginning portion manufacturing process peels away The explanatory diagram of the structure of beginning portion's producing device 10, (A) of Fig. 3 represents between duplexer 6 and cutter N The explanatory diagram of position relationship, (B) of Fig. 3 is to utilize cutter N to make at interface 24 to peel off saying of beginning portion 26 Bright figure, (C) of Fig. 3 is the explanatory diagram representing and will making the state peeling off beginning portion 30 at interface 28, (D) of Fig. 3 is to utilize cutter N to make the explanatory diagram peeling off beginning portion 30 at interface 28, and (E) of Fig. 3 is Make the explanatory diagram of the duplexer 6 peeling off beginning portion 26,30.It addition, Fig. 4 is to make to have stripping to start The top view of the duplexer 6 in portion 26,30.

When making stripping beginning portion 26,30, as shown in (A) of Fig. 3, duplexer 6 is with reinforcing plate 3B Back side 3Bb absorption be held in the mode of workbench 12 and support along level (X-direction in figure).

Cutter N is kept part 14 with the point of a knife side relative with the end face of the corner of duplexer 6 (end side) 6A Formula flatly supports.It addition, utilize height adjuster 16 to adjust cutter N at short transverse (Z in accompanying drawing Direction of principal axis) on position.It addition, utilize the conveyer devices such as ball-screw apparatus 18 to make cutter N and duplexer 6 Relative movement in the horizontal direction.As long as conveyer device 18 makes at least one edge in cutter N and workbench 12 Horizontal direction moves, and in embodiments, makes cutter N move.It addition, configure above cutter N There is the fluid Supplying apparatus 22 of the upper surface confession liquid 20 for the cutter N before inserting or in insertion.

Peel off beginning portion manufacture method

The feature peeling off the stripping beginning portion manufacture method that beginning portion producing device 10 is carried out is utilized to be: will It is overlapping on the thickness direction of duplexer 6 that the on position of cutter N is set in the corner 6A of duplexer 6 Position, and the insertion of cutter N is set as according to each interface 24,28 different.

The making step in this stripping beginning portion is described.

When original state, the point of a knife of cutter N is located relative to the 1st on position, i.e. substrate 2B and resin The position that interface 24 between layer 4B offset by short transverse (Z-direction).Therefore, first, As shown in (A) of Fig. 3, make cutter N move in the height direction, the height of the point of a knife of cutter N is set in The height at interface 24.

Then, as shown in (B) of Fig. 3, make cutter N move horizontally towards the corner 6A of duplexer 6, will Cutter N inserts scheduled volume to interface 24.It addition, when inserting cutter N or before insertion cutter N, from liquid supply dress Put 22 to the upper surface of cutter N for liquid 20.Thus, the substrate 2B of corner 6A peels off from resin bed 4B, Therefore, as shown in Figure 4, the stripping beginning portion 26 of vertical view triangular shape is produced at interface 24.It addition, Not necessarily must supply liquid 20, if but use liquid 20, even if liquid after cutter N is extracted 20 also can remain in stripping beginning portion 26, therefore, it is possible to make the stripping beginning portion 26 that cannot again adhere to.

Then, cutter N is extracted in the horizontal direction from corner 6A, as shown in (C) of Fig. 3, the cutter of cutter N Point is set in the height at the 2nd on position, i.e. interface 28 between substrate 2A and resin bed 4A.

Then, as shown in (D) of Fig. 3, make cutter N move horizontally towards duplexer 6, by cutter N to interface 28 insert scheduled volume.Similarly, liquid 20 is supplied from fluid Supplying apparatus 22 to the upper surface of cutter N.By This, as shown in (D) of Fig. 3, make at interface 28 and peel off beginning portion 30.Here, cutter N is relative to boundary The insertion in face 28 is set to less than cutter N relative to the insertion at interface 24.More than for peeling off the making of beginning portion Method.Alternatively, it is also possible to cutter N is set to less than cutter N relative to interface relative to the insertion at interface 24 The insertion of 28.

Take off having made the duplexer 6 peeling off beginning portion 26,30 from stripping beginning portion producing device 10, It is delivered to stripping off device described later, utilizes stripping off device to peel off at interface 24,28 successively.

The detailed content of aftermentioned stripping means, as shown in the arrow A of Fig. 4, makes duplexer 6 from corner 6A court To corner (another side) the 6B flexure relative with corner 6A, thus peeling off beginning portion 26 at first The interface 24 that area is bigger is peeled off to peel off beginning portion 26 for starting point.Thus, reinforcing plate 3B is peeled off. Then, make duplexer 6 again bend towards corner 6B from corner 6A, thus peel off the face in beginning portion 30 Long-pending less interface 28 is peeled off to peel off beginning portion 30 for starting point.Thus, reinforcing plate 3A is peeled off.

Additionally, the insertion of cutter N is preferably set to more than 7mm according to the size of duplexer 6, more preferably It is set in about 15mm～20mm.

Stripping off device 40

Fig. 5 is the longitudinal section of the structure of the stripping off device 40 representing embodiment, and Fig. 6 is schematic earth's surface Show many (being 19 in figure 6) connecting rod 44A, 44B, 44C, 44D, 44E, 44F, 44G, 44H, 44I, 44J, 44K, 44L, 44M, 44N, 44O, 44P, 44Q, 44R, 44S and many Platform driving means (movable body) 48A, 48B, 48C, 48D, 48E, 48F, 48G, 48H, 48I, 48J, 48K, 48L, 48M, 48N, 48O, 48P, 48Q, 48R, 48S are relative to stripping off device The allocation position of the flex plate 42 of 40, the top view of flex plate 42.It addition, Fig. 5 is equivalent to along Fig. 6's The sectional view of line B-B, it addition, represent duplexer 6 with solid line in figure 6.

Stripping off device 40 shown in Fig. 5 includes the upside being configured at duplexer 6 in the way of holding sheet stack 6 A pair movable device 46,46 with downside.Movable device 46,46 structure is identical, therefore, and explanation at this It is arranged in the movable device 46 of the downside of Fig. 5, the movable device 46 being arranged in upside is marked identical attached Figure labelling also omits the description.

Movable device 46 includes connecting rod 44A～44S of described many lengthwise shapes, according to every connecting rod 44A～44S and make connecting rod 44A～described multiple stage driving means 48A of 44S lifting moving～48S and The controller 50 of driving means 48A～driving means 48S is controlled according to every driving means 48A～48S Deng.Additionally, connecting rod 44A～44S described below and driving means 48A～48S.

In order to make reinforcing plate 3B flexible deformation, flex plate 42 is by reinforcing plate 3B vac sorb and keeps.

Flex plate 42

(A) of Fig. 7 is the top view of flex plate 42, and (B) of Fig. 7 is along the C of Fig. 7 (A) -C line, flex plate 42 amplification longitudinal section.It addition, (C) of Fig. 7 is to represent composition flex plate The adsorption section 54 of 42 is located at the square being constituted flex plate 42 in the way of handling freely by double-sided adhesive tape 56 The flexed plate 52 of shape, flex plate 42 amplification longitudinal section.

Flex plate 42 is configured to as described, and adsorption section 54 is by double-sided adhesive tape 56 with handling freely Mode is installed on flexed plate 52.

Adsorption section 54 has the flexed plate 58 that thickness is thinner than flexed plate 52.The lower surface of this flexed plate 58 by Double-sided adhesive tape 56 is installed on the upper surface of flexed plate 52 in the way of handling freely.

It addition, be provided with the square of the inner surface of reinforcing plate 3B for adsorbing retaining layer stack 6 in adsorption section 54 The aeration sheet material (adsorption plane) 60 of shape.Should in order to reduce the stretching resulting from reinforcing plate 3B when peeling off Power, the thickness of aeration sheet material 60 is below 2mm, and preferably below 1mm uses in embodiments Thickness is the aeration sheet material 60 of 0.5mm.

Additionally, be additionally provided with encirclement aeration sheet material 60 in adsorption section 54 and abut with the outer peripheral face of reinforcing plate 3B Sealing frame component 62.Sealing frame component 62 and aeration sheet material 60 are adhered to scratch by double-sided adhesive tape 64 The upper surface of bent plate 58.It addition, sealing frame component 62 is more than 20 degree and less than 50 degree for Shore E hardness The spongy body of closed pore, the thickness of sealing frame component 62 is configured to thicker than the thickness of aeration sheet material 60 0.3mm～0.5mm.

The groove 66 of frame-shaped it is provided with between aeration sheet material 60 and sealing frame component 62.It addition, at flexed plate 52 openings have multiple through hole 68, and one end of these through holes 68 connects with groove 66, and the other end is via not scheming The suction pipeline shown is connected with source of suction (such as vacuum pump).

Thus, when driving described source of suction, the sky in described suction pipeline, through hole 68 and groove 66 Gas is attracted, thus the inner surface of reinforcing plate 3B of duplexer 6 by vac sorb and is held in aeration sheet Material 60, and, the outer peripheral face of reinforcing plate 3B is pushed and is connected to sealing frame component 62.Thus, by close The seal of the adsorption space that envelope frame component 62 surrounds improves.

Compared with flexed plate 58, aeration sheet material 60 and sealing frame component 62, the bending of flexed plate 52 is firm Property higher, therefore, the flexural rigidity of flexed plate 52 determines the flexural rigidity of flex plate 42.Preferably flex plate The flexural rigidity of the per unit width (1mm) of 42 is 1000N mm²/ mm～40000N mm²/mm。 Such as, in the part that width is 100mm of flex plate 42, flexural rigidity is 100000N mm²～4000000N mm².By the flexural rigidity of flex plate 42 is set to 1000N mm²/ mm with On, it is possible to prevent from adsorbing the reinforcing plate 3B bending being held in flex plate 42.Further, by by flex plate 42 Flexural rigidity be set to 40000N mm²/ below mm, it is possible to make absorption be held in the reinforcement of flex plate 42 Plate 3B suitably flexible deformation.

Flexed plate 52,58 be Young's modulus be the resinous member of below 10GPa, for example, Merlon The tree of resin, polrvinyl chloride (PVC) resin, acrylic resin, polyacetals (POM) resin etc. Fat component.

Movable device 46

Many connecting rod 44A～44S of the movable device 46 of pie graph 5 are by sucker (coupling member) 82 It is fixed on the lower surface (face of the side contrary with adsorption plane) of flexed plate 52.

Connecting rod 44A～44S

As shown in Figure 6, connecting rod 44A～44S is the such as aluminum that rigidity is higher, connecting rod 44A～44S Major axis along the released part at the interface 24,28 (with reference to Fig. 5) as duplexer 6 and unstripped portion / stripping front L (with reference to Fig. 6, Fig. 8) configuration of boundary line.

On the other hand, flexed plate 52 with corresponding for the corner 6A corner 52A of duplexer 6 relative to stripping Extend round about from the stripping direct of travel A of front L.At this corner 52A, along peeling off traveling side It is configured with two connecting rods 44A, 44B and two driving means 48A, 48B to A.That is, join by making Be placed in two driving means 48A of corner 52A, 48B decline is moved and is peeled off corner 6A.

It addition, connecting rod 44A～44S is along the stripping direct of travel (figure at interface 24,28 (with reference to Fig. 5) The arrow A of 6) configure at spaced intervals.Thus, due to major axis and the stripping of traveling of connecting rod 44A～44S From front, L is consistent, therefore, it is possible to successfully peel off reinforcing plate 3B from substrate 2B.

Further, the length of connecting rod 44C～connecting rod 44Q is respectively structured as and the length phase peeling off front L Corresponding.

It addition, driving means 48A～the 48S that are connected with connecting rod 44A～44S are arranged in connecting rod The position of 44A～the 44S segmentation such as in the longitudinal direction.That is, owing to peeling off front without being configured at stripping The lower section of connecting rod 44A, the 44B in the outside of starting end and be configured at the link peeling off the outside terminating end The lower section of bar 44R, 44S, therefore, driving means 48A, 48B, 48R, 48S connecting rod 44A, Central part on the length direction of 44B, 44R, 44S is each configured with one.Start being configured at stripping The lower section of connecting rod 44C, 44D of end and be configured at the lower section peeling off connecting rod 44P, 44Q of terminating end The stripping front L of process is shorter in length than the length in other parts, therefore driving means 48C, 48D, 48P, 48Q central part on the length direction of connecting rod 44C, 44D, 44P, 44Q is each configured with One.The length of stripping front L in the lower section process of connecting rod 44E in addition～connecting rod 44O Being longer than the length in other parts, therefore, driving means 48E～48O are to grow connecting rod 44E～44O On degree direction, the mode of 3 deciles is each configured with two.Thereby, it is possible in the length of connecting rod 44A～44S On degree direction, Transmit evenly carrys out the power of automatic drive device 48A～48S, therefore, it is possible to enter one from substrate 2B Step successfully peels off reinforcing plate 3B.Additionally, the segmentation number on described length direction be not limited to 2 segmentations, 3 segmentations, it is also possible to be more than 4 segmentations.

These driving means 48A～48S are by controller 50 lifting moving independently.

That is, controller 50 controls driving means 48A～48S so that the angle of the duplexer 6 being certainly positioned in Fig. 6 The connecting rod 44A of the position of 6A side, portion is to being positioned at the 6B side, corner peeling off direct of travel shown in arrow A The connecting rod 44S of position decline movement successively.According to this action, as shown in the longitudinal section of Fig. 8, will Duplexer 6 at interface 24 with peel off beginning portion 26 (with reference to Fig. 4) be that starting point is peeled off.It addition, Fig. 5, Duplexer 6 shown in Fig. 8 is to utilize the stripping beginning portion system of explanation in (A) of Fig. 3～(E) of Fig. 3 The duplexer 6 peeling off beginning portion 26,30 has been made as method.

Driving means 48A～48S such as include revolving servo motor and ball screw framework etc..Servo The rotary motion of motor is converted to linear motion in ball screw framework, is transferred to ball screw framework Bar 70.Top ends at bar 70 has connecting rod by not shown spherojoint and side-slipping mechanism connection 44A～44S.Thereby, it is possible to make connecting rod 44A～44S follow the flexible deformation of flex plate 42 and fascinate. Thus, do not apply excessive power to flex plate 42 and flex plate 42 just can be made towards corner 6B from corner 6A Flexible deformation successively.It addition, as driving means 48A～48S, be not limited to revolving servo horse Reach and ball screw framework, it is also possible to be servo motor or the fluid-pressure cylinder (such as pneumatic cylinder) of orthoscopic.

When reinforcing plate 3B peeled off being taken off from flex plate 42, not shown drive division is utilized to make framework 74 carry out decline moves.

Controller 50 is configured to include the computer of record medium, the CPU etc. such as ROM and RAM.Control Device 50 processed makes CPU perform record program on the recording medium, thus, according to every driving means 48A～48S controls multiple stage driving means 48A～48S, thus controls the liter of many connecting rod 44A～44S Fall is mobile.

Sucker 82

Fig. 9 is the longitudinal section of the installation constitution representing sucker 82 relative to connecting rod 44D.It addition, Figure 10 The longitudinal section of (A) sucker 82 when being uncompressed, (B) of Figure 10 is the sucker 82 during compression Longitudinal section.Additionally, in (A) of Fig. 9 and Figure 10 and (B) of Figure 10, exemplified with installation In the sucker 82 of connecting rod 44D, but it is installed on other connecting rods 44A～44C, connecting rod 44E～44S Sucker 82 is also same structure.Sucker 82 includes bolt 84, spring 86, stop part 88 and nut 90。

Figure 11 is the main portions sectional view representing bolt 84 relative to the installation form of flex plate 42.

Bolt 84 in the through hole 43 being had through flex plate 42 from reinforcing plate 3B side in the way of join Put.Further, at the hexagon ring 85A of the base portion 84A that die nut (not shown) is inserted into bolt 84 After in, by making to threadingly engage in the nut 92 of bolt 84 and bolt 84 relatively rotates, thus by spiral shell Bolt 84 is anchored on flex plate 42.

Returning to (A) of Figure 10, (B) of Figure 10, the threaded portion 84B of bolt 84 is from connecting rod 44D's Through hole 45 is projected into outside.Threaded portion 84B is inserted in spring 86, spring 86 between base portion 84A with Between connecting rod 44D.Additionally, the section constitution of connecting rod 44D is U-shaped.

Nut 90 is utilized to be fixed on by stop part 88 bigger than through hole 45 for diameter prominent from through hole 45 Threaded portion 84B.As shown in (A) of Figure 10, it is connected to the surface of connecting rod 44D at this stop part 88 Under form, spring 86 is retained as precommpression length.Thus, sucker 82 becomes uncompressed form.It addition, In fig .9, when driving means 48D to be utilized makes connecting rod 44D decline, due to the table of connecting rod 44D Face is connected to stop part 88, therefore, it is possible to make flex plate 42 decline by stop part 88 and bolt 84.

It addition, make to be configured at the upper side and lower side in the deviation of the flatness because of the flexed plate 52 of flex plate 42 Paired flex plate 42,42 between interval (interval between support and flex plate) create partially In the case of difference, spring 86 shrinks as shown in (B) of Figure 10 and absorbs this deviation.It addition, In the case of the linearity of connecting rod 44D creates deviation, shunk by spring 86, also can absorb this inclined Difference.Thus, even if described interval and described linearity create deviation, it is also possible to can by connecting rod 44D It is installed on flexed plate 52 by ground.

Stripping off device 40 is utilized to peel off the stripping means of reinforcing plate 3A, 3B

In (C) of (A) of Figure 12～(A) of (C) of Figure 12 and Figure 13～Figure 13, it is shown that Illustrated by (A) of Fig. 3～(E) of Fig. 3, by peeling off beginning portion manufacture method at corner 6A Make the stripping means of the duplexer 6 peeling off beginning portion 26,30.That is, at (A)～Figure 12 of Figure 12 (C) and (A) of Figure 13～Figure 13 (C) in represent the reinforcement of peel ply stack 6 in chronological order The stripping means of plate 3A, 3B.

It addition, to the input operation of stripping off device 40 input layer stack 6, peel off from stripping off device 40 output The output operation of reinforcing plate 3A, 3B and panel P by there is sucker 78 shown in (A) of Figure 12 Conveyer device 80 is carried out.Wherein, at (A)～(C) of Figure 12, (A) of Figure 13～Figure 13 of Figure 12 (C) in, multifarious in order to avoid accompanying drawing, eliminate the diagram of movable device 46.It addition, face Plate P refers to be pasted with removing reinforcing plate 3A, the substrate 2A of 3B and the product of substrate 2B across functional layer 7 Product panel.

(A) of Figure 12 is to be loaded by duplexer 6 by the action shown in arrow E, F of conveyer device 80 Flex plate 42 in downside, the side view of stripping off device 40.In this case, for scratching in downside Property plate 42 and the flex plate 42 of upside between insert conveyer device 80, and make downside flex plate 42 and upside Flex plate 42 relatively move to the position fully kept out of the way in advance.Afterwards, under duplexer 6 is placed in During the flex plate 42 of side, by flex plate 42 vac sorb reinforcing plate 3B of retaining layer stack 6 of downside. That is, (A) of Figure 12 shows that reinforcing plate 3B as the 2nd substrate is adsorbed guarantor by the flex plate 42 of downside The absorption process held.

(B) of Figure 12 is that the flex plate 42 the making downside flex plate 42 with upside is to relatively close direction Mobile and make reinforcing plate 3A of duplexer 6 by flex plate 42 vac sorb of upside the stripping of state that keeps Side view from device 40.That is, (B) of Figure 12 shows that reinforcing plate 3A as the 1st substrate is by upper The supporting operation of flex plate (support) 42 supporting of side.It addition, (A) of Figure 14 and Figure 12 (B) corresponding axonometric chart, is by the axonometric chart of the corner 6A enlarged representation of duplexer 6.

It addition, make the substrate 2 of the duplexer 1 shown in Fig. 1 peel off from reinforcing plate 3 at stripping off device 40 to be utilized In the case of, the flex plate 42 (support) on the upside of utilization support substrate 2 as the 1st substrate ( Hold operation), and utilize the flex plate 42 of downside to adsorb the holding reinforcing plate 3 (absorption as the 2nd substrate Operation).In this case, the support of supporting substrates 2 is not limited to flex plate 42, as long as can The parts of supporting substrates 2 in the way of substrate 2 loads and unloads freely.But, by flex plate 42 is used as Support, it is possible to make substrate 2 bend with reinforcing plate 3 simultaneously and peel off, therefore with only make substrate 2 or strengthen The form of plate 3 bending is compared, and has the advantage that can reduce peeling force.

Returning to (A) of Figure 12～(C) of Figure 12, (C) of Figure 12 is to represent from duplexer 6 Corner 6A towards corner 6B make flex plate 42 flexible deformation downwards of downside on one side at interface 24 to shell Leaving beginning portion 26 (with reference to Fig. 4) is the starting point side view to the state that duplexer 6 is peeled off.That is, exist Many connecting rod 44A～44S of the flex plate 42 of the downside shown in Fig. 8 make from the angle being positioned at duplexer 6 The connecting rod 44A of 6A side, portion to the connecting rod 44S being positioned at 6B side, corner declines movement successively, thus on boundary Face 24 carries out peeling off (stripping process).It addition, (B) of Figure 14 is corresponding with Figure 12 (C) Axonometric chart, it is by the axonometric chart of the corner 6A enlarged representation of duplexer 6.From (B) of Figure 14, Moved by the decline of connecting rod 44A～connecting rod 44E and make flex plate 42 flexible deformation, thus from substrate 2B peels off reinforcing plate 3B.

Alternatively, it is also possible to be, the many connecting rods of flex plate 42 in upside in linkage with described action 44A～44S make the connecting rod 44A from the 6A side, corner being positioned at duplexer 6 to the company being positioned at 6B side, corner Knot bar 44S rises movement successively, thus peels off at interface 24.Thus, with only to make reinforcing plate 3B curved Bent form is compared, it is possible to reduce peeling force.

(A) of Figure 13 is the state that has been completely exfoliated at interface 24 of reinforcing plate 3B, stripping off device 40 Side view.According to (A) of Figure 13, the reinforcing plate 3B vac sorb stripped down also is held in downside Flex plate 42, the duplexer 6 (including reinforcing plate 3A and the duplexer of panel P) removing reinforcing plate 3B is true Suction attached and be held in upside flex plate 42.

It addition, for the conveyer device 80 shown in (A) of insertion Figure 12 between upper and lower flex plate 42, And make the flex plate 42 of downside and the flex plate 42 of upside relatively move to the position fully kept out of the way.

Afterwards, first, the vac sorb of the flex plate 42 on the downside of releasing.Then, conveyer device 80 is utilized Sucker 78 across resin bed 4B adsorb holding reinforcing plate 3B.Then, by the arrow of (A) of Figure 13 The action of head conveyer device 80 shown in G, H, exports reinforcing plate 3B from stripping off device 40.

(B) of Figure 13 is that the duplexer 6 removing reinforcing plate 3B is by the flex plate 42 of downside and scratching of upside Property plate 42 vac sorb the side view kept.That is, flex plate 42 and the flex plate 42 of upside of downside are made Move to relatively close direction, and by downside flex plate 42 vac sorb and keep substrate 2B (supporting Operation).

(C) of Figure 13 is to represent while make the flexibility of upside towards corner 6B from the corner 6A of duplexer 6 Plate 42 flexible deformation upward while at interface 28 with peel off beginning portion 30 (with reference to Fig. 4) be that starting point is to layer Stack 6 carries out the side view of the state peeled off.That is, many companies of the flex plate 42 in the upside shown in Fig. 8 Knot bar 44A～44S make the connecting rod 44A from the 6A side, corner being positioned at duplexer 6 to being positioned at 6B side, corner Connecting rod 44S rise movement successively, thus carry out peeling off (stripping process) at interface 28.It addition, also Can make in many connecting rod 44A～44S of the flex plate 42 of downside in linkage with this action from being positioned at The connecting rod 44A of the 6A side, corner of duplexer 6 to the connecting rod 44S being positioned at 6B side, corner declines shifting successively Dynamic, thus peel off at interface 28.Thus, compared with the form only making reinforcing plate 3A bend, it is possible to Reduce peeling force.

Afterwards, reinforcing plate 3A stripped down from panel P completely is taken out from the flex plate 42 of upside, will Panel P takes out from the flex plate 42 of downside.It is above making to have at corner 6A peeling off beginning portion 26,30 The stripping means of duplexer 6.

The feature of stripping off device 40

As shown in figure 11, stripping off device 40 has the feature that the flexed plate 52 at flex plate 42 is provided with and passes through Through hole 43, by constitute sucker 82 bolt 84 with from duplexer (reinforcing plate 3B) side through through hole 43 In mode configure.Thereby, it is possible to improve the bolt 84 fixed operation relative to flex plate 42.Additionally, After bolt 84 is installed on through hole 43, by double-sided adhesive tape 56, adsorption section 54 is pasted on flexure Plate 52.

Thus, stripping off device 40 has the feature that in the space being formed at flex plate 42 by through hole 43 The double-sided adhesive tape as shading member it is configured with between portion 94 and reinforcing plate 3B being adsorbed in flex plate 42 56, utilize double-sided adhesive tape 56 to block the flex plate 42 pull of vacuum to spatial portion 94.Thus, energy Enough prevent the breakage of reinforcing plate 3B caused because spatial portion 94 becomes vacuum, and be able to maintain that flex plate 42 Absorption to reinforcing plate 3B keeps.

As double-sided adhesive tape 56, it is possible to illustrate plastic tape.

Further, stripping off device 40 has the feature that the spatial portion 94 of flex plate 42 via passage 96 It is connected with air.Passage 96 shown in Figure 11 is located at the flexed plate 52 of flex plate 42, but does not limit In this.Such as, shown in the main portions sectional view of the flex plate 42 of another form as shown in figure 15, also It may be that arrange passage 84C at the base portion 84A of bolt 84, along the bolt embedded hole of flexed plate 52 53 arrange air channel 53A, arrange air channel 92A at nut 92, make passage 84C, air channel 53A, And air channel 92A interconnects and makes spatial portion 94 be connected with air.Alternatively, it is also possible to only at spiral shell Bolt 84 is provided for the passage making spatial portion 94 be connected with air.As long as it is to say, at flexed plate 52 and sucker 82 at least one passage is set.

Thus, even if in the situation that from flex plate 42, spatial portion 94 effect is had minimum pull of vacuum Under, due to spatial portion 94 all the time to atmosphere opening, therefore, it is possible to prevent the local of reinforcing plate 3B from attracteding to In spatial portion 94.Even if it addition, make the minimum pull of vacuum acting on spatial portion 94 to atmosphere opening, Also for the vac sorb of reinforcing plate 3B effect and will not keep producing impact on flex plate 4.

Illustrate the present invention with reference to detailed or specific embodiment, but those skilled in the art are clear and definite It is possible on the premise of without departing from the spirit and scope of the invention, apply various change, correction.

The application goes out to be willing to 2015-032743 and 2015 based on Japanese Patent filed in 23 days February in 2015 Filed in May 15, Japanese Patent goes out to be willing to 2015-099741, and its content is by referring to being programmed into this explanation In book.

Description of reference numerals

N, cutter；P, panel；1, duplexer；1A, the 1st duplexer；1B, the 2nd duplexer；2、 Substrate；2a, the surface of substrate；2b, the back side of substrate；2A, substrate；2Aa, the surface of substrate； 2B, substrate；2Ba, the surface of substrate；3, reinforcing plate；3a, the surface of reinforcing plate；3A, reinforcement Plate；3B, reinforcing plate；3Bb, the back side of reinforcing plate；4, resin bed；4A, resin bed；4B, tree Lipid layer；6, duplexer；6A, 6B, corner；7, functional layer；10, beginning portion producing device is peeled off； 12, workbench；14, keeper；16, height adjuster；18, conveyer device；20, liquid； 22, fluid Supplying apparatus；24, interface；26, beginning portion is peeled off；28, interface；30, stripping starts Portion；40, stripping off device；42, flex plate；43, through hole；44A～44S, connecting rod；46, may be used Dynamic device；48A～48S, driving means；50, controller；52, flexed plate；53, bolt embedded hole； 53A, air channel；54, adsorption section；56, double-sided adhesive tape；58, flexed plate；60, aeration sheet Material；62, sealing frame component；64, double-sided adhesive tape；66, groove；68, through hole；70, bar；74、 Framework；78, sucker；80, conveyer device；82, sucker；84, bolt；84A, base portion；84C、 Passage；85A, hexagon ring；86, spring；88, stop part；90, nut；92, nut；92A、 Air channel；94, spatial portion；96, passage.

Claims (5)

1. a stripping off device for duplexer, makes have the 1st substrate and the 2nd substrate and with the side that can peel off Formula bonds the duplexer of described 1st substrate and described 2nd substrate at described 1st substrate and the described 2nd Interface between substrate is peeled off towards another side successively from end side, wherein,

The stripping off device of this duplexer includes:

Support, it is for supporting described 1st substrate of described duplexer；

Flex plate, it utilizes described 2nd substrate of duplexer described in its adsorption plane vac sorb；And

Movable body, it is fixed on the side contrary with described adsorption plane of described flex plate by coupling member Face, and, move make described flex plate scratch by making movable body be independently relative to described support Property deformation so that described duplexer is peeled off successively at described interface,

Described coupling member in the through hole being had through described flex plate in the way of configure,

It is formed at the spatial portion of described flex plate by described through hole and is adsorbed in the institute of described flex plate State and be configured with shading member between the 2nd substrate,

The described flex plate shielded members interrupt of pull of vacuum to described spatial portion.

The stripping off device of duplexer the most according to claim 1, wherein,

Described shading member is resinous sheet material, and it fits in described flex plate.

The stripping off device of duplexer the most according to claim 1 and 2, wherein,

Described spatial portion is via the ventilation of at least one being located in described flex plate and described coupling member Hole is connected with air.

4. a stripping means for duplexer, makes have the 1st substrate and the 2nd substrate and with the side that can peel off Formula bonds the duplexer of described 1st substrate and described 2nd substrate at described 1st substrate and the described 2nd Interface between substrate is peeled off towards another side successively from end side, wherein,

The stripping means of this duplexer includes:

Supporting operation, utilizes support to support described 1st substrate of described duplexer；

Absorption process, utilizes the adsorption plane of flex plate to adsorb described 2nd substrate of described duplexer；And

Stripping process, utilizes multiple movable body and makes described flex plate flexible deformation make by coupling member Described 2nd substrate of described duplexer from end side towards another side successively flexible deformation so that institute State duplexer to peel off successively at described interface,

Described coupling member in the through hole being had through described flex plate in the way of configure,

It is formed at the spatial portion of described flex plate by described through hole and is adsorbed in the institute of described flex plate State and be configured with shading member between the 2nd substrate,

In described stripping process, the described flex plate shielded component of pull of vacuum to described spatial portion Block.

5. a manufacture method for electronic device, the manufacture method of this electronic device has: functional layer is formed Operation, for by the 1st substrate and the 2nd substrate by the duplexer can pasted in the way of peeling off, in institute The exposure stating the 1st substrate forms functional layer；And separation circuit, self-forming has the institute of described functional layer State the 1st substrate separate described 2nd substrate, wherein,

Described separation circuit has:

Supporting operation, utilizes support to support described 1st substrate of described duplexer；

Absorption process, utilizes the adsorption plane of flex plate to adsorb described 2nd substrate of described duplexer；And

Stripping process, utilizes multiple movable body and makes described flex plate flexible deformation make by coupling member Described 2nd substrate of described duplexer from end side towards another side successively flexible deformation, thus by institute State the 2nd substrate to peel off successively from described 1st substrate,

Described coupling member in the through hole being had through described flex plate in the way of configure,

It is formed at the spatial portion of described flex plate by described through hole and is adsorbed in the institute of described flex plate State and be configured with shading member between the 2nd substrate,

In described stripping process, the described flex plate shielded component of pull of vacuum to described spatial portion Block.