CN1359784A - Method and device for dividing brittle substrate - Google Patents

Method and device for dividing brittle substrate Download PDF

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Publication number
CN1359784A
CN1359784A CN01143756A CN01143756A CN1359784A CN 1359784 A CN1359784 A CN 1359784A CN 01143756 A CN01143756 A CN 01143756A CN 01143756 A CN01143756 A CN 01143756A CN 1359784 A CN1359784 A CN 1359784A
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CN
China
Prior art keywords
groove
brittle base
substrate
segmenting
brittle
Prior art date
Application number
CN01143756A
Other languages
Chinese (zh)
Other versions
CN1231335C (en
Inventor
若山治雄
Original Assignee
三星钻石工业股份有限公司
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Filing date
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Priority to JP2000385140A priority Critical patent/JP3792508B2/en
Priority to JP385140/00 priority
Application filed by 三星钻石工业股份有限公司 filed Critical 三星钻石工业股份有限公司
Publication of CN1359784A publication Critical patent/CN1359784A/en
Application granted granted Critical
Publication of CN1231335C publication Critical patent/CN1231335C/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

Abstract

The present invention relates to a method and a device for dividing brittle substrate. The device comprises a splitting pole for pressing the lineate brittle substrate to execute splitting along the scratch. The device is characterized in that the bottom of the splitting pole is provided with a curved shaped pressing part; a pressing control part is provided for bringing the curved shaped pressing part into contact with the surface of the brittle substrate along the splitting predetermined line with respect to the scratch, at the same time horizontally moving along the long edge direction of the splitting pole. The utility model method and apparatus are used where the undesirable parts on the ends of the cell substrates are retained. After cutting of the laminated glass substrate, another device is used to cut off the undesirable parts. Thus in the process of cutting a laminated glass substrate of a large size into a plurality of cell substrate of a small size while cutting off undesirable parts from the glass substrate, the forming of fragments on the glass ends can be prevented.

Description

The dividing method of brittle base and device thereof
Technical field
The dividing method of the relevant a kind of brittle base of the present invention and the segmenting device of brittle base.
Background technology
Fig. 1 is the segmenting device schematic diagram of general in the past used brittle base.The brittle base 1 that is formed with groove (scribe-line) S is installed on the workbench 3 by the mode across mat (mat) 2.Cut apart bar 4 and be positioned at brittle base 1 top, this cuts apart bar 4 is to engage to have the cross section to be the vulcanie 4b of V word shape below its bar-shaped hardware 4a.This vulcanie 4b bottom and the groove S back that matches is pushed from the top, brittle base 1 just can be on mat 2 slight curvature and separated along groove S.
Fig. 2 is this front view of cutting apart bar 4.This length L of cutting apart bar because of must and the transverse width of brittle base 1 about equally, so when brittle base 1 is large scale, this length L palpus of cutting apart bar is followed amplification.So, have concavo-convex on the vulcanie 4b, have and become phenomenon such as curved and produce and cut apart bar 4, brittle base 1, so existing method is to press on the brittle base 1 after making vulcanie 4b not have gap line ground contact always, cutting apart pressure when cutting apart uniformly will not act on the glass plate 1, and bad cutting apart takes place easily.
Summary of the invention
The purpose of this invention is to provide a kind of dividing method of brittle base and the segmenting device of employing thereof, the brittle base that can the utmost point suppresses effectively to fit is cut apart bad generation.
For achieving the above object, provide a kind of segmenting device of brittle base according to an aspect of the present invention, it comprises that one cuts apart bar to push the brittle base of having rule, to be cut apart along groove; Be characterized in: the bottom of cutting apart bar is provided with the press section of a curve form; Also comprise and push controlling organization, it makes the limit, press section of described curve form be contacted with described brittle base surface in regular turn along the preset lines of cutting apart corresponding to groove, Yi Bian move horizontally along the described long side direction of cutting apart bar.
A kind of dividing method of brittle base is provided according to a further aspect of the invention, use possesses at least one scriber, and the segmenting device of the brittle base of the segmenting device of at least one brittle base using of division processing of at least one Handling device, the line processing usefulness of the brittle base that carrying will process, to carry out division processing along set groove by the adhesive substrates that first, second substrate constitutes, and become the part more than at least two; Be characterized in, may further comprise the steps: (1) forms the groove more than at least two on described first substrate; (2) on described second substrate, form the groove of one or more at least; (3) with first substrate along one of first groove of described first substrate, be divided into first that leaves groove and the second portion that does not have groove; (4) cut apart along first groove of described second substrate; And (5) second groove in the first of described first substrate, first is further cut apart.
Dividing method according to the brittle base of another aspect of the invention, use possesses at least one scriber, and the segmenting device of the brittle base of the segmenting device of at least one brittle base using of division processing of at least one Handling device, the line processing usefulness of the brittle base that carrying will process, to carry out division processing along set groove by the adhesive substrates that first, second substrate constitutes, and become the part more than at least two; Be characterized in, may further comprise the steps: (1) forms the groove more than at least two on described first substrate; (2) with first substrate along one of first groove of described first substrate, be divided into first that leaves groove and the second portion that does not have groove; (3) on described second substrate, form the groove of one or more at least; (4) cut apart along first groove of described second substrate; And (5) second groove in the first of described first substrate, first is further cut apart.
Brittle base dividing method according to a further aspect of the present invention adopts a segmenting device, utilizes it to cut apart bar and pushes the brittle base of having rule, to be cut apart along groove; Be characterized in, comprise: use one to cut apart bar is curve form below it press section, come to make the limit, press section of described curve form be contacted with described brittle base surface in regular turn along the preset lines of cutting apart corresponding to groove, the edge the described long side direction of cutting apart bar and moves horizontally.
For clearer understanding purpose of the present invention, characteristics and advantage, preferred embodiment of the present invention is elaborated below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the schematic diagram of the segmenting device of existing brittle base.
Fig. 2 is a scriber front view among Fig. 1.
Fig. 3 is the front view of segmenting device the 1st preferred embodiment of brittle base of the present invention.
Fig. 4 is the side view of major part among Fig. 3.
Fig. 5 is a formation of cutting apart plate among Fig. 3.
Fig. 6 is to use the fit course of work schematic diagram of glass dividing method of the present invention.
Fig. 7 is the stereogram of the trimming device of the 1st preferred embodiment.
Fig. 8 is the segmenting device schematic diagram of the applying glass brittle base of the present invention's the 1st preferred embodiment.
Fig. 9 is to use the fit workflow diagram of glass dividing method of the present invention.
Figure 10 is the segmenting device schematic diagram of the present invention's the 1st preferred embodiment applying glass brittle base.
The specific embodiment
Fig. 3 is the front view of the segmenting device 10 of the present invention's the 1st embodiment brittle base.Fig. 4 is the side view of the segmenting device 10 of brittle base, and only shows the enlarged drawing of relevant major part of the present invention., install one by a pair of guiding elements 11 and have the groove glass plate 13 down that is marked movably on the workbench 12 in Y direction (vertical direction of paper among Fig. 3).Tabular is cut apart bar supporter 14 and is positioned at this workbench 12 tops with handstand state, is provided with in this bottom of cutting apart bar supporter 14 and cuts apart bar 15.
This cuts apart bar 15 as shown in Figure 5, forms by looking like base portion 15a and following joint one vulcanie 15b thereof crooked as the bow down.
Cut apart at this and to form pin-and-hole m, n on two ends of bar 15, this is cut apart the pin-and-hole n that bar 15 is arranged to any is that fulcrum can be with respect to cutting apart 14 turns of bar supporter freely.In addition, on the specified location of cutting apart bar supporter 14, be provided with by servo motor 16 and rotatable disk 17, a crank 18 is installed between pin 17a set on this disk 17 and described pin-and-hole m.Like this, cutting apart the rotation of bar 15 along with disk 17, is that fulcrum carries out elevating movement with pin-and-hole n.At this moment, cut apart bar 15 pressing of glass plate 13 named a person for a particular job because of folk prescription moves to straight line, and can from one end to the other side cut apart glass plate 13.If adopt this dividing method, then for example when use electropneumatic regulator (electro-pneumatic regulator), can carry out cutting apart the control of pressure separating the top increase.In addition, utilization can change the speed of elevating movement to the control of the rotary speed of servomotor 16.
The described bar supporter 14 of cutting apart itself is arranged to movably up and down with cylinder pressure 19 by pressurization, and can set and cut apart the bar 15 needed pressure of cutting apart.Cut apart bar 15, as shown in Figure 4, be positioned at the groove S top of glass plate 13, in addition, cut apart bar 15 under, the concavity groove 12a of the dark 0.5mm of wide 5mm is formed on the workbench 12 along the bar direction of cutting apart bar 15.The size of this groove 12a itself is little, so use engraving method to process this groove.
Secondly, illustrate that according to Fig. 6 the segmenting device 10 that uses brittle base of the present invention cuts apart the process of applying glass (liquid crystal panel, liquid crystal panel) 21.At this, last processing is shown in G figure (K figure), finishes on the panel sheet of cutting apart Yi Bian end T stayed.
At first, shown in A figure, form 2 groove S on the glass plate of liquid crystal panel 21 upsides, secondly, upset liquid crystal panel 21 forms 1 groove again to exchange in its table.At this, on a glass plate, draw oblique line so that understand the rollover states of liquid crystal panel 21.
Secondly, shown in C figure, use the segmenting device 10 of brittle base of the present invention to come the downside glass plate is carried out cutting apart shown in B1.In the occasion of existing dividing method, then shown in H figure, another groove is carried out cutting apart shown in B2.In addition, the upset liquid crystal panel carries out cutting apart shown in B3 to the groove that is formed at the downside glass plate then to exchange in its table shown in J figure shown in I figure, at last liquid crystal panel 21 is divided into 2 like this shown in K figure.
Among the H figure, when B2 was cut apart, glass plate was cut apart shown in B1 in the left side that is close to B2, therefore must apply the bigger pressure of cutting apart when B2 is cut apart, in case but this pressure is excessive, and connect the side glass plate and all can be cut apart, so be not easy to control the plus-pressure of cutting apart.In addition, when B3 is cut apart, because of the glass plate on B1 plate contact next door, so be easy to generate fragment at glass end face etc.In cutting apart on the engineering of liquid crystal panel, this fragment that produces at the glass end face is used as cuts apart bad or disjunction is bad handles.
So in the present embodiment, as C figure institute be shown in cut apart B1 after, upset liquid crystal panel 21 is cut apart B3 then shown in E figure shown in D figure.This moment, liquid crystal panel 21 was divided into 2 shown in F figure.About the Q of limit portion that must excise, shown in G figure, need only and use the device of side cut usefulness can excise the Q of limit portion easily.
Shown in Figure 7 is a side cut device BQ.Carrying being transported on the workbench 32 of trimming device from 21 isolated liquid crystal cell substrates 31 of liquid crystal panel, makes that outstanding (overhang) workbench of the Q of limit portion was both quantitative with mechanical arm (robot) (not shown).Then, liquid crystal cell substrate 31 is attracted and is fixed on the workbench 32.The cylinder pressure 35 that utilization is arranged at gripper shoe 34 is supported in the top of workbench 32 sides with side cut bar 33 in motion mode freely up and down, and the cylindric guiding elements of growing 36 is installed at the two ends on side cut bar 33.Fig. 7 is the state that shows after side cut bar 33 rises.By the decline of this side cut bar 33, the part of the Q of limit portion can excise from liquid crystal cell substrate 31.
As long as adopt the dividing method of the liquid crystal panel shown in the A figure~G figure of Fig. 6 that has used trimming device, can prevent from very effectively to produce fragment at above-mentioned glass end face.And cut apart and badly can take place hardly.
Shown in Figure 8 is the process that adopts the segmenting device of liquid crystal panel brittle base, the dividing method of the liquid crystal panel of the A figure~G figure of its use present embodiment such as Fig. 6.
Liquid crystal panel 21 is supplied to the workbench of scriber (scriber) SM1 by charging carrying implement FM1, when the one side at liquid crystal panel 21 forms set groove, upset carrying implement FM2 catches the liquid crystal panel 21 on the pen machine SM1 workbench, and liquid crystal panel 21 (substrate is turned over) again overturns.Liquid crystal panel 21 after carrying implement FM3 catches and overturn by upset carrying implement FM2, and be transported on the workbench of scriber SM2.Utilize scriber SM2 to form set groove, be transported on the workbench of segmenting device BM1 of brittle base of the present invention by carrying implement FM4 again, the glass plate of liquid crystal panel 21 is simultaneously cut apart at the another side of liquid crystal panel 21.In addition, upset carrying implement FM5 catches liquid crystal panel 21 from the segmenting device BM1 of brittle base, and the liquid crystal panel 21 that overturns once again.Carrying implement FM6 is transported to this liquid crystal panel that is reversed 21 on the workbench of segmenting device BM2 of brittle base, the glass plate another side of liquid crystal panel is cut apart again.Then, liquid crystal panel 21 is handled upside down machine FM7 and is transported to separation stage BT1, and no part beyond the Q of limit portion of substrate is removed.Use mechanical arm RO1 that the liquid crystal cell substrate of separating 31 is picked up block by block then, be transported on the workbench of trimming device BQ1, excise the part of the no limit Q of portion again.
Said apparatus is a preferred embodiment of the segmenting device of liquid crystal panel brittle base, and it finishes cutting apart of liquid crystal panel with following order: line processing, line processing, division processing, division processing, side cut processing.; also can use the segmenting device of applying glass (liquid crystal panel) brittle base that has trimming device; the segmenting device of this brittle base is on 1 and at least 1 Handling device of segmenting device of 1 of scriber and brittle base; after a series of process engineering (line processing, line processing, division processing, division processing), the processing of cutting edge again.
Secondly, below with the processing sequence of a line processing, line processing, division processing, division processing, side cut processing, be stated as dividing method and the device of finishing cutting apart of liquid crystal panel of required liquid crystal panel.
Fig. 9 shows applying glass (liquid crystal panel) dividing method.The processing sequence of this applying glass is line processing, line processing, division processing, division processing, side cut processing.
At first, as 2 groove S of glass plate formation of the AA figure institute liquid crystal panel that is shown in 21 upsides.At this, on a glass plate, draw oblique line so that understand the rollover states of liquid crystal panel 21.
Secondly shown in BB figure, with liquid crystal panel 21 overturn (turning over).And for example shown in the CC figure, use the segmenting device 10 of brittle base of the present invention to come the downside glass plate is carried out cutting apart shown in B11.Then, form 1 groove at the upside glass plate.And for example shown in the DD figure, once again liquid crystal panel 21 is overturn, secondly shown in DD figure, B13 is cut apart.At this moment, shown in FF figure, liquid crystal panel 21 has been divided into 2.About the Q of limit portion that must excise, as long as the part of using the device of side cut usefulness can shown in GG figure, excise the Q of limit portion easily.
Figure 10 is the process that shows the segmenting device that adopts applying glass (liquid crystal panel) brittle base.The processing sequence of this applying glass is line processing, division processing, line processing, division processing, side cut processing.
Liquid crystal panel 21 is supplied to the workbench of scriber SM11 by charging carrying implement FM11, when the one side at liquid crystal panel 21 forms set groove, upset carrying implement FM12 catches the liquid crystal panel 21 on the pen machine SM11 workbench, and liquid crystal panel 21 (substrate is turned over) again overturns.Liquid crystal panel 21 after carrying implement FM13 catches and overturn by upset carrying implement FM12, and be transported on the workbench of segmenting device BM11 of brittle base.Utilize the segmenting device BM11 of brittle base that the glass plate of liquid crystal panel 21 is simultaneously cut apart.Carrying implement FM14 catches liquid crystal panel 21 from the segmenting device BM11 of brittle base, is transported on the workbench of scriber SM12 again.Utilize scriber SM12 to form set groove at the another side of liquid crystal panel 21, utilize the upset carrying implement FM15 liquid crystal panel 21 that overturns once again again, carrying implement FM16 catches this liquid crystal panel that is reversed 21, be transported to again on the workbench of segmenting device BM12 of brittle base, again the glass plate another side of liquid crystal panel cut apart.Then, liquid crystal panel 21 is handled upside down machine FM17 and is transported to separation stage BT11, and no part beyond the Q of limit portion of substrate is removed.Use mechanical arm RO11 that the liquid crystal cell substrate of separating 31 is picked up block by block then, be transported on the workbench of trimming device BQ11, excise the part of the no limit Q of portion again.
The device of Figure 10 is 2 and several carrying implements of segmenting device and the trimming device that comprises 2 of scribers and brittle base.It utilizes scriber SM2 to form set groove at the another side of liquid crystal panel 21, is transported on the workbench of segmenting device BM1 of brittle base of the present invention by carrying implement FM4 again, and the glass plate of liquid crystal panel 21 is simultaneously cut apart.In addition, upset carrying implement FM5 catches liquid crystal panel 21 from the segmenting device BM1 of brittle base, and the liquid crystal panel 21 that overturns once again.Carrying implement FM6 is transported to this liquid crystal panel that is reversed 21 on the workbench of segmenting device BM2 of brittle base, the glass plate another side of liquid crystal panel is cut apart again.Also can use the segmenting device of applying glass (liquid crystal panel) brittle base that has trimming device, the segmenting device of this brittle base comprises 1 of segmenting device and at least 1 Handling device of 1 of scriber and brittle base, and after a series of process engineering (line processing, division processing, line processing, division processing), the processing of cutting edge again.
Adopt method and apparatus of the present utility model, after another substrate portion towards a substrate end is stayed and separates, excise the remnants of defeated troops of described another substrate, just can finish the engineering of cutting apart of applying brittle base.The dividing method by using this applying brittle base and the segmenting device of brittle base almost can suppress substrate fully and cut apart the generation of back fragment and the generation of chips of glass (cullet).
In addition, need only the segmenting device 10 that uses brittle base of the present invention at segmenting device BM1, BM2, BM11, the BM12 of above-mentioned brittle base, the segmenting device of above-mentioned brittle base can become a kind of segmenting device that can prevent to cut apart bad applying glass (liquid crystal panel) brittle base.
Described when respectively cutting apart, if the workbench 12 under groove is provided with groove 12a, liquid crystal panel 21 can carry out so cut apart effectively because of the meeting bending.In this occasion, can save and use mat 2 shown in Figure 1.At this,, then can easily use the workbench 12 that is formed with corresponding to the groove 12a of line place if utilize magnet or screw fixedly workbench 12 to be made easy pallet exchange from the below.
As mentioned above, the present invention is to use cuts apart the sweeping device in bar press section below, make this cut apart bar at the state that presses on the glass plate press points toward cutting apart the turn of bar long side direction, so that the press points of glass plate moves horizontally, and dividing glass sheets.If adopt this dividing method, can make and cut apart pressure and keep certain, or can make that to cut apart pressure big slightly separating initial point, and can carry out appropriate cutting apart according to processing object.
In addition, the dividing method of the application of the invention adhesive substrates and device contact and can prevent to cut apart each substrate portion of back, produce hardly cutting apart of fragment so may be implemented on the goods end face.

Claims (17)

1. the segmenting device of a brittle base, it comprises that one cuts apart bar to push the brittle base of having rule, to be cut apart along groove; It is characterized in that:
The bottom of cutting apart bar is provided with the press section of a curve form; Also comprise and push controlling organization, it makes the limit, press section of described curve form be contacted with described brittle base surface in regular turn along the preset lines of cutting apart corresponding to groove, Yi Bian move horizontally along the described long side direction of cutting apart bar.
2. the segmenting device of a brittle base, at least one the scriber, and the segmenting device of at least one brittle base using of division processing that comprise at least one Handling device, the line processing usefulness of the brittle base that carrying will be processed, and to brittle base rule in regular turn, division processing; It is characterized in that:
When the adhesive substrates that will constitute by first, second substrate when set groove is divided into part more than at least two,
(1) use described at least one scriber to come at the groove of described first substrate formation more than at least two; After the line,
(2) use described at least one scriber to come to form the groove of one or more at least at described second substrate; After the line,
(3) segmenting device that uses described at least one brittle base along one of first groove of described first substrate, is divided into first that leaves groove and the second portion that does not have groove with first substrate; After the line,
(4) use the segmenting device of described at least one brittle base to cut apart along the groove of described second substrate;
(5) second groove in the first of described first substrate further is divided into part more than two with first.
3. the segmenting device of a brittle base, at least one the scriber, and the segmenting device of at least one brittle base using of division processing that comprise at least one Handling device, the line processing usefulness of the brittle base that carrying will be processed, and to brittle base rule in regular turn, division processing; It is characterized in that:
When the adhesive substrates that will constitute by first, second substrate when set groove is divided into part more than at least two,
(1) use described at least one scriber to come at the groove of described first substrate formation more than at least two; After the line,
(2) segmenting device that uses described at least one brittle base along one of first groove of described first substrate, is divided into first that leaves groove and the second portion that does not have groove with first substrate; After the line,
(3) use described at least one scriber to come to form the groove of one or more at least at described second substrate; After the line,
(4) use the segmenting device of described at least one brittle base to cut apart along the groove of described second substrate;
(5) second groove in the first of described first substrate further is divided into part more than two with first.
4. as the segmenting device of claim 2 or 3 described brittle bases, it is characterized in that the segmenting device of described at least one brittle base is to utilize to cut apart bar and push the brittle base of having rule, to be cut apart along groove; Wherein:
The bottom of cutting apart bar possesses the press section of a curve form, and the segmenting device of this brittle base possesses the controlling organization of pushing, it is along the preset lines of cutting apart corresponding to groove, make the limit, press section of described curve form be contacted with described brittle base surface in regular turn, the edge the described long side direction of cutting apart bar and moves horizontally.
5. as the segmenting device of each described brittle base of claim 1 to 3, it is characterized in that the workbench of brittle base is to be installed along cutting apart the groove that forms set width on the line that bar pushes.
6. as the segmenting device of each described brittle base of claim 1 to 3, it is characterized in that it also includes a maintaining body, in order to keep installing the workbench of brittle base.
7. the segmenting device of brittle base as claimed in claim 4 is characterized in that, it also includes a maintaining body, in order to keep installing the workbench of brittle base.
8. the segmenting device of brittle base as claimed in claim 5 is characterized in that, it also includes a maintaining body, in order to keep installing the workbench of brittle base.
9. as the segmenting device of each described brittle base of claim 1 to 3, it also includes a controlling organization, in order to control the described locational moulding pressure that bar is connected to described brittle base of cutting apart.
10. the segmenting device of brittle base as claimed in claim 4 is characterized in that, also comprises a controlling organization, in order to control the described locational moulding pressure that bar is connected to described brittle base of cutting apart.
11. the segmenting device of brittle base as claimed in claim 5 is characterized in that, also comprises a controlling organization, in order to control the described locational moulding pressure that bar is connected to described brittle base of cutting apart.
12. the segmenting device of brittle base as claimed in claim 6 is characterized in that, also comprises a controlling organization, in order to control the described locational moulding pressure that bar is connected to described brittle base of cutting apart.
13. the segmenting device of brittle base as claimed in claim 7 is characterized in that also comprising a controlling organization, in order to control the described locational moulding pressure that bar is connected to described brittle base of cutting apart.
14. the segmenting device of brittle base as claimed in claim 8 is characterized in that also comprising a controlling organization, in order to control the described locational moulding pressure that bar is connected to described brittle base of cutting apart.
15. the dividing method of a brittle base, use possesses at least one scriber, and the segmenting device of the brittle base of the segmenting device of at least one brittle base using of division processing of at least one Handling device, the line processing usefulness of the brittle base that carrying will process, to carry out division processing along set groove by the adhesive substrates that first, second substrate constitutes, and become the part more than at least two; It is characterized in that, may further comprise the steps:
(1) groove of formation more than at least two on described first substrate;
(2) on described second substrate, form the groove of one or more at least;
(3) with first substrate along one of first groove of described first substrate, be divided into first that leaves groove and the second portion that does not have groove;
(4) cut apart along first groove of described second substrate; And
(5) second groove in the first of described first substrate is further cut apart first.
16. the dividing method of a brittle base, use possesses at least one scriber, and the segmenting device of the brittle base of the segmenting device of at least one brittle base using of division processing of at least one Handling device, the line processing usefulness of the brittle base that carrying will process, to carry out division processing along set groove by the adhesive substrates that first, second substrate constitutes, and become the part more than at least two; It is characterized in that, may further comprise the steps:
(1) groove of formation more than at least two on described first substrate;
(2) with first substrate along one of first groove of described first substrate, be divided into first that leaves groove and the second portion that does not have groove;
(3) on described second substrate, form the groove of one or more at least;
(4) cut apart along first groove of described second substrate; And
(5) second groove in the first of described first substrate is further cut apart first.
17. a brittle base dividing method adopts a segmenting device, utilizes it to cut apart bar and pushes the brittle base of having rule, to be cut apart along groove; It is characterized in that, comprising:
Use one to cut apart bar is curve form below it press section, come to make the limit, press section of described curve form be contacted with described brittle base surface in regular turn along the preset lines of cutting apart corresponding to groove, the edge the described long side direction of cutting apart bar and moves horizontally.
CNB011437561A 2000-12-19 2001-12-19 Method and device for dividing brittle substrate CN1231335C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000385140A JP3792508B2 (en) 2000-12-19 2000-12-19 Method for dividing bonded brittle substrates
JP385140/00 2000-12-19

Publications (2)

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CN1359784A true CN1359784A (en) 2002-07-24
CN1231335C CN1231335C (en) 2005-12-14

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CNB011437561A CN1231335C (en) 2000-12-19 2001-12-19 Method and device for dividing brittle substrate

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JP (1) JP3792508B2 (en)
KR (2) KR20020050116A (en)
CN (1) CN1231335C (en)
HK (1) HK1048454A1 (en)
TW (1) TW561134B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100418718C (en) * 2002-11-22 2008-09-17 三星钻石工业股份有限公司 Method for dividing substrate and method for manufacturing substrate using such method
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CN100418718C (en) * 2002-11-22 2008-09-17 三星钻石工业股份有限公司 Method for dividing substrate and method for manufacturing substrate using such method
CN101823215B (en) * 2004-02-18 2013-02-27 川崎重工业株式会社 Vertical machining production line of sheet material
CN101823215A (en) * 2004-02-18 2010-09-08 川崎成套设备股份有限公司 The vertical machining production line of sheet material
CN101905490A (en) * 2009-06-05 2010-12-08 三星钻石工业股份有限公司 Breaking bar
CN101905490B (en) * 2009-06-05 2013-06-05 三星钻石工业股份有限公司 Breaking bar
CN102219368A (en) * 2011-04-12 2011-10-19 深圳市晶向科技有限公司 System and method for controlling cutting wheel pressure of TFT-LCD (thin film transitor-liquid crystal display) glass cutting machine
US9931757B2 (en) 2012-07-23 2018-04-03 Samsung Display Co., Ltd. Cell cutting device for display devices and method of manufacturing the display device
CN103568043A (en) * 2012-07-23 2014-02-12 三星显示有限公司 Cell cutting apparatus for display device and method for manufacturing display device
US10456939B2 (en) 2012-07-23 2019-10-29 Samsung Display Co., Ltd. Cell cutting device for display devices
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CN105034179B (en) * 2014-04-28 2017-10-20 三星钻石工业股份有限公司 The brisement device of brittle substrate
CN105014793B (en) * 2014-04-28 2018-02-09 三星钻石工业股份有限公司 The end material separation method and end material separator of brittle substrate
CN105034179A (en) * 2014-04-28 2015-11-11 三星钻石工业股份有限公司 Apparatus for breaking brittle material substrate
CN105014793A (en) * 2014-04-28 2015-11-04 三星钻石工业股份有限公司 Method and apparatus for separating end portion of brittle material substrate
CN105538521A (en) * 2016-01-12 2016-05-04 田宇科技股份有限公司 Cutting method for hard and brittle material substrate

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CN1231335C (en) 2005-12-14
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