CN103871931B - Segmenting device and dividing method - Google Patents
Segmenting device and dividing method Download PDFInfo
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- CN103871931B CN103871931B CN201310655965.XA CN201310655965A CN103871931B CN 103871931 B CN103871931 B CN 103871931B CN 201310655965 A CN201310655965 A CN 201310655965A CN 103871931 B CN103871931 B CN 103871931B
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000011218 segmentation Effects 0.000 claims abstract description 184
- 230000009471 action Effects 0.000 claims description 4
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- 238000001514 detection method Methods 0.000 description 6
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The present invention provides a kind of segmenting device and dividing method, can be supported on by bar part to split through band body and chip（Circular plate-like shape thing）The segmentation preset lines of chip on the inside of the ring-shaped frame of corresponding appropriate size, and bar part will not interfere with ring-shaped frame.Bar unit（50）With than chip（1）Segmentation preset lines（2）In most short length and than most long first short part（51）And than most long long Article 2 part（52）, this unit is relatively moved in the state of bar part is parallel with segmentation preset lines along the direction vertical with segmentation preset lines with respect to chip, while pass through first part（51）Carry out the segmentation preset lines of the exterior lateral area of broken wafer, and pass through Article 2 part（52）Carry out the segmentation preset lines of the middle section of broken wafer, so as to which chip be split.By with from split preset lines length corresponding to length different bar parts, prevent bar part and ring-shaped frame（7）Interference.
Description
Technical field
The present invention relates to for carrying out the circular plate-like shape thing such as dividing semiconductor wafer along segmentation preset lines set in advance
Segmenting device and dividing method.
Background technology
In semiconductor devices manufacturing process, made a reservation on the surface of discoideus semiconductor wafer by the segmentation of clathrate
Line division has multiple rectangular areas, and IC is formed on the surface of these rectangular areas（Integrated circuit）And LSI（Large-scale integrated electricity
Road）Deng electronic circuit, then it is ground after grinding has been carried out to the back side and waits necessary processing, then along splits preset lines
Rectangular area one by one is divided the wafer into, so as to obtain multiple semiconductor chips.
As the method for splitting the circular plate-like shape things such as above-mentioned semiconductor wafer, it is proposed that such method：Along segmentation
Preset lines are formed after making the segmentation starting point of intensity decreases, apply external force to circular plate-like shape thing to split.Apply external force
Method is of all kinds, still, such as known such method：In the small chip of chip size, thickness is big or hardness is higher
And be difficult in the case of splitting, circular plate-like shape thing is locally pressed along segmentation starting point, or come to circle along segmentation preset lines
Shape plate object carries out suction and pulled so as to be split（Patent document 1,2）.
Prior art literature
Patent document 1：Japanese Unexamined Patent Publication 2012-146744 publications
Patent document 2：Japanese Unexamined Patent Publication 2006-108273 publications
However, because the circular plate-like shape thing such as semiconductor wafer is flimsy, therefore when carrying out division processing, in order to ensure
Treatability and by circular plate-like shape thing through being supported on the inner side of ring-shaped frame with body, enabling located by ring-shaped frame
Reason.In the part using the strip along segmentation preset lines（Bar part）To apply external force to segmentation preset lines so as to split circle
Plate object（As described above through being supported on the inner side of ring-shaped frame with body）In the case of, bar part needs to have than circular plate-like shape
The length of the diameter length of thing, still, the bar part as making acts on the segmentation preset lines of the exterior lateral area of circular plate-like shape thing
When, bar part is interfered with ring-shaped frame, can not apply external force.Therefore, it is necessary to make the inner side of ring-shaped frame opening size be with
The discontiguous larger size of bar part, so larger ring-shaped frame is excessive relative to circular plate-like shape thing, thus causes to use
The not framework of appropriate size.
If using the oversized ring-shaped frame relative to circular plate-like shape thing, the band body as running stores is also required to
Increase with the size of ring-shaped frame, due to the usage amount increase with body, therefore produce uneconomic problem.In addition, splitting
The processing unit (plant) used in the process such as the pickup process of the chip after segmentation starting point formation process and pickup segmentation in addition,
It is required that using the ring-shaped frame of size corresponding with circular plate-like shape thing, therefore, needed just to segmentation process into being about to justify
Shape plate object turns operation of the note to excessive ring-shaped frame, bothersome in the extreme and cause productivity to reduce.In addition, for example current
Under situation, when circular plate-like shape thing is the chip of maximum gauge, there is a problem in that：Have to be especially tailored the suitable crystalline substance
Piece, larger ring-shaped frame i.e. not with bar component interference.
The content of the invention
The present invention is in view of above-mentioned thing and the invention completed, its main technical task are to provide a kind of segmenting device
And dividing method, circular plate-like shape thing can be split in the case where bar part is not interfered with ring-shaped frame by bar part
All segmentation preset lines, above-mentioned circular plate-like shape thing is through being supported on the ring-shaped frame of appropriate size corresponding with circular plate-like shape thing with body
Inner side.
Segmenting device described in the first aspect of the present invention splits circular plate-like shape thing unit along segmentation preset lines
Circular plate-like shape thing, above-mentioned circular plate-like shape thing unit include above-mentioned circular plate-like shape thing, band body and ring-shaped frame, above-mentioned circular slab
Shape thing has the different above-mentioned segmentation preset lines of a plurality of length, and along above-mentioned segmentation preset lines formed with segmentation starting point；On
State the face that above-mentioned circular plate-like shape thing is pasted on body；The above-mentioned periphery with body is pasted on above-mentioned ring-shaped frame, above-mentioned ring-type
Framework has the opening portion for the size for storing above-mentioned circular plate-like shape thing, and above-mentioned segmenting device is characterised by, above-mentioned segmenting device
Have：Ring-shaped frame holding member, it has the supporting surface for the above-mentioned ring-shaped frame for being used to support above-mentioned circular plate-like shape thing unit,
Above-mentioned ring-shaped frame holding member is kept with following state to above-mentioned ring-shaped frame：Make the circle of above-mentioned circular plate-like shape thing unit
Shape plate object is in upside, the above-mentioned band body in region corresponding with above-mentioned circular plate-like shape thing is in downside, makes above-mentioned circular slab
Shape thing and the above-mentioned band body in region corresponding with above-mentioned circular plate-like shape thing expose；Bar unit, it, which is disposed in, is pasted onto by above-mentioned ring
Shape frame retention member keep above-mentioned ring-shaped frame on the above-mentioned lower section with body, above-mentioned bar unit across above-mentioned band body with it is upper
The bearing of trend for stating the above-mentioned segmentation preset lines of circular plate-like shape thing extends parallel to, and above-mentioned bar unit is pre- for splitting above-mentioned segmentation
Alignment, above-mentioned bar unit have the short length of the diameter of the above-mentioned opening portion than above-mentioned ring-shaped frame；And mobile member, it makes
Above-mentioned bar unit relatively moves relative to the above-mentioned segmentation preset lines to be split on the direction vertical with the segmentation preset lines, on
Stating bar unit at least has：First part, its length is than in the above-mentioned segmentation preset lines to be split of above-mentioned circular plate-like shape thing
The most short predetermined line length of above-mentioned segmentation, and it is most long more above-mentioned than in the above-mentioned segmentation preset lines to be split of above-mentioned circular plate-like shape thing
It is short to split preset lines；And Article 2 part, the above-mentioned segmentation most longer than in the above-mentioned segmentation preset lines to be split of its length are pre-
Alignment is grown, and above-mentioned first part is responsible for above-mentioned segmentation preset lines of the segmentation positioned at the exterior lateral area of above-mentioned circular plate-like shape thing, on
State Article 2 part and be responsible for above-mentioned segmentation preset lines of the segmentation positioned at the middle section of above-mentioned circular plate-like shape thing, above-mentioned first portion
Part and above-mentioned Article 2 part by above-mentioned mobile member be respectively positioned in above-mentioned circular plate-like shape thing above-mentioned exterior lateral area and
Above-mentioned middle section.
In addition, the dividing method described in the second aspect of the present invention, using the segmenting device that first aspect is recorded along
Split preset lines to split the circular plate-like shape thing of circular plate-like shape thing unit, above-mentioned circular plate-like shape thing unit includes above-mentioned circular plate-like shape
Thing, band body and ring-shaped frame, above-mentioned circular plate-like shape thing have a different above-mentioned segmentation preset lines of a plurality of length, and along
Above-mentioned segmentation preset lines are formed with segmentation starting point；The above-mentioned face that above-mentioned circular plate-like shape thing is pasted on body；It is above-mentioned with body
Periphery is pasted on above-mentioned ring-shaped frame, and above-mentioned ring-shaped frame has the opening portion for the size for storing above-mentioned circular plate-like shape thing, above-mentioned
Dividing method is characterised by that above-mentioned dividing method has：Step is kept, is kept by above-mentioned ring-shaped frame holding member
State the above-mentioned ring-shaped frame of circular plate-like shape thing unit；Position alignment step, to being fixed by above-mentioned ring-shaped frame holding member
Above-mentioned circular plate-like shape thing unit circular plate-like shape thing the above-mentioned segmentation preset lines to be split and above-mentioned bar part carry out position
Alignment；First segmentation step, after above-mentioned position alignment step and above-mentioned holding step is implemented, above-mentioned including what is split
In the above-mentioned exterior lateral area for splitting above-mentioned segmentation preset lines most short in preset lines, make above-mentioned first by above-mentioned mobile member
Part relatively moves relative to the above-mentioned segmentation preset lines to be split on the direction vertical with the segmentation preset lines, thus,
Split circular plate-like shape thing along above-mentioned segmentation preset lines in above-mentioned exterior lateral area；And second segmentation step, including to divide
In the above-mentioned segmentation preset lines cut in the above-mentioned middle section of most long above-mentioned segmentation preset lines, made by above-mentioned mobile member
Article 2 part is stated to relatively move on the direction vertical with the segmentation preset lines relative to the above-mentioned segmentation preset lines to be split,
Thus, circular plate-like shape thing is split along above-mentioned segmentation preset lines in above-mentioned middle section.
In the present invention, using respectively with circular plate-like shape thing, the shorter exterior lateral area of segmentation preset lines and segmentation it is pre-
Length corresponding to the long middle section of alignment different bar part splits the segmentation preset lines of circular plate-like shape thing.Therefore,
The length of each bar part can be configured to enough split segmentation preset lines and for the length of required bottom line.Its
As a result it is, can be while using the ring-shaped frame of appropriate size corresponding with circular plate-like shape thing, by bar part in bar portion
Part is reliably split in the case of not interfering with ring-shaped frame to circular plate-like shape thing.
Invention effect
Following effect can be obtained according to the present invention：A kind of segmenting device and dividing method can be provided, can be passed through
Bar part splits all segmentation preset lines of circular plate-like shape thing, wherein institute in the case where bar part is not interfered with ring-shaped frame
Circular plate-like shape thing is stated through being supported on body on the inside of the ring-shaped frame of appropriate size corresponding with circular plate-like shape thing.
Brief description of the drawings
In Fig. 1,（a）It is the semiconductor wafer for implementing division processing by the segmenting device of one embodiment of the present invention
Stereogram,（b）It is that cuing open for the semiconductor wafer of division processing is implemented by the segmenting device of one embodiment of the present invention
View.
Fig. 2 is the stereogram of the segmenting device of an embodiment.
Fig. 3 is the stereogram for the state decomposed to the pedestal and mobile work platform of above-mentioned segmenting device.
Fig. 4 is the sectional view for the ring-shaped frame holding member that above-mentioned segmenting device has.
Fig. 5 is the top view for the relative position for schematically showing bar part that above-mentioned segmenting device has and chip.
Fig. 6 is the figure for representing the side partial cross-sectional of above-mentioned bar part and aspirating the aspiration path on road.
Fig. 7 is the sectional view for the process for representing the dividing method that above-mentioned segmenting device is split to chip.
Fig. 8 is the top view for the process for schematically showing above-mentioned dividing method.
Fig. 9 is the vertical view for schematically showing the dividing method that the other embodiment of bar unit is split to chip
Figure.
Figure 10 is the stereogram of the segmenting device of the other other embodiment with bar unit.
Figure 11 is the stereogram for the state decomposed to the pedestal and mobile work platform of the segmenting device shown in Figure 10.
Figure 12 is that the relative position for schematically showing bar part that the segmenting device shown in Figure 10 has and chip is bowed
View.
Figure 13 is the process for schematically showing the dividing method that the segmenting device shown in Figure 10 is split to chip
Top view.
Figure 14 is the side view of one of the other embodiment for representing bar part.
Label declaration
1 ... chip 1（Circular plate-like shape thing）
2 ... segmentation preset lines
5 ... modified layers（Split starting point）
6 ... band bodies
7 ... ring-shaped frames
The opening portion of 7a ... ring-shaped frames
8 ... wafer cells（Circular plate-like shape thing unit）
10 ... segmenting devices
20 ... mobile members
30 ... ring-shaped frame holding members
35a ... supporting surfaces
50 ... bar units
51 ... first parts
52 ... Article 2 parts
53 ... Article 3 parts
A1 ... first areas（Exterior lateral area）
A2 ... second areas（Middle section）
The regions of A3 ... the 3rd（Exterior lateral area）
Embodiment
Hereinafter, one embodiment of the present invention is illustrated referring to the drawings.
Fig. 1 label 1 represents to implement the chips such as the semiconductor wafer of division processing in one embodiment（Circular plate-like shape
Thing）, segmenting device 10 of Fig. 2 expressions to an embodiment of the implementation division processing of chip 1.
[1] chip
Chip 1 shown in Fig. 1 is formed as discoideus, the part formation in outer peripheral edge that thickness is, for example, hundreds of μm or so
There is the otch 1c for being referred to as directed face for representing crystal orientation.Such as Fig. 1（a）It is shown, pass through a plurality of point of clathrate in chip 1
Cut preset lines 2 and be set with multiple rectangular areas 3, in the positive 1a sides of these rectangular areas 3 such as Fig. 1（b）It is shown formed with device
Part 4, above-mentioned device 4 have the electronic circuit being made up of IC or LSI.Because chip 1 is discoideus, so segmentation preset lines 2
Length is uneven, so as to be set with the different segmentation preset lines of a plurality of length.
As shown in figure 1, on chip 1, at its back side, 1b is pasted with band body 6, and ring-type frame is pasted with the periphery with body 6
Frame 7, so as to turn into wafer cell（Circular plate-like shape thing unit）8 and be moved to segmenting device 10.Ring-shaped frame 7 is by stainless steel etc.
With rigid metallic plate etc. form, ring-shaped frame 7 have storage chip 1 size toroidal opening portion 7a, chip 1 with
It is pasted onto with opening portion 7a in a manner of same heart shaped arranges on band body 6.
The one side in the base material being made up of synthetic resin sheets such as the polyvinyl chloride with retractility or polypropylene is used with body 6
Band body formed with adhesion layer, chip 1 and ring-shaped frame 7 are pasted onto on the adhesion layer of one side, and the positive 1a sides of chip 1 are exposed
State.Ring-shaped frame 7 is the framework of the appropriate size matched with the size of chip 1, by means of ring-shaped frame 7 and with body 6
Chip 1 is handled.
Such as Fig. 1（b）It is shown, it is pre-formed with modified layer 5 along segmentation preset lines 2 in the inside of chip 1.Modified layer 5
The pulse laser that there is radioparent predetermined wavelength relative to chip 1 is irradiated by the way that focal point to be registered to the inside of chip 1
Light beam and formed.Compared with the other parts of chip 1, the intensity decreases of modified layer 5, so as to which modified layer 5 turns into segmentation starting point.
In addition, it is modified layer 5 to make in the present embodiment along the segmentation starting point of the segmentation preset lines 2 of chip 1, but point
Starting point is cut to be not limited to modified layer 5 or cut by cutting tool or the groove that irradiates laser beam and formed etc..
Next, the dividing method of the segmenting device 10 shown in Fig. 2 and the chip 1 for having used the segmenting device 10 is entered
Row explanation.
[2] segmenting device
[2-1] structure
As shown in Fig. 2 segmenting device 10 has：The pedestal 11 of rectangular shape；And the mobile work platform 15 of rectangular shape,
It can movably be loaded on the pedestal 11 in the Y direction.Discretely it is equipped along Y-direction and extends in X-direction on the base 11
A pair of guide rails 12 parallel to each other, X1 sides guide rail 12 upper surface formed with section be V shape guiding groove 12a.Separately
Outside, X described below（X1、X2）、Y（Y1、Y2）And Z-direction and the reference axis X described in Fig. 2（X1、X2）、Y（Y1、Y2）With
And Z-direction is consistent.
As shown in figure 3, on mobile work platform 15, in the central portion formed with circular port 15b, the regulation in its lower surface
Position formed with the raised line 15a that slidably can be engaged with above-mentioned guiding groove 12a.Mobile work platform 15 is by making raised line 15a
Slide, and can move along the Y direction on the base 11 along guiding groove 12a, being moved through of mobile work platform 15 moves structure
Part 20 is completed.
As shown in figure 3, the guide rail 12 of mobile member 20 and X2 sides is closely configured on pedestal 11, the mobile member 20 by
Formed with lower part：External thread rod 21, it extends along Y-direction and the end of Y2 sides can be supported in positive and negative rotation bearing 16；
Impulse motor 22, it is connected with the end of the Y1 sides of the external thread rod 21 and rotation driving external thread rod 21；And internal thread block
23, it is fixed on the lower surface of mobile work platform 15 and screwed togather with external thread rod 21.According to the mobile member 20, pass through pulse horse
Make the positive and negative rotation of external thread rod 21 up to 22, thus, mobile work platform 15 is through internal thread block 23 to the rotation with external thread rod 21
Y-direction corresponding to direction（Y1 directions or Y2 directions）It is mobile.
As shown in Fig. 2 it is equipped in mobile work platform 15：Ring-shaped frame holding member 30, it is used to keep ring-type frame
Wafer cell 8 is simultaneously remained horizontality by frame 7；And bar unit 50, it splits chip 1 along segmentation preset lines 2.
As shown in Fig. 2 and Fig. 4, ring-shaped frame holding member 30 has：Cylinder seat 31, it has the external diameter than chip 1
Bigger internal diameter and the upper edge with horizontal endless；And the frame retention feature 35 for the ring-type that can be lifted, it is disposed in
Around the cylinder seat 31 and surround cylinder seat.In the bottom of cylinder seat 31 as shown in Figure 2 formed with flange part 32.Flange part
32 can rotatably coordinate with the circular port 15b of mobile work platform 15, and cylinder seat 31 passes through the biography including being wound in flange part 32
Move the rotating member 40 of band 43 and be driven in rotation.
Rotating member 40 with lower part by being formed：Impulse motor 41, it is installed on the lower face side of mobile work platform 15；Band
Wheel 42, it is disposed in the upper surface side of mobile work platform 15 and is assemblied in the rotary shaft of impulse motor 41；And transmission belt 43,
It is wound in belt wheel 42 and flange part 32.According to the rotating member 40, by impulse motor 41 and the belt wheel 42 of positive and negative rotation
Rotation is transferred to flange part 32 through transmission belt 43, rotates cylinder seat 31.
It is same heart shaped that the frame retention feature 35 of ring-type, which is arranged to cylinder seat 31, the frame retention feature 35 of the ring-type
The upper surface for being formed as one fixed width is horizontal, and the upper surface turns into the supporting surface of the ring-shaped frame 7 of support wafer cell 8
35a.Multiple clamp systems 36 are equipped with the outer circumferential side of frame retention feature 35, above-mentioned clamp system 36 will be loaded into supporting surface
Ring-shaped frame 7 on 35a is clipped between clamp system 36 and supporting surface 35a to keep ring-shaped frame 7.Frame retention feature 35
Round-shaped opening portion 35b is set as bigger than the external diameter of cylinder seat 31 and more smaller than the internal diameter of ring-shaped frame 7, cylinder seat 31
Opening portion 35b can relatively be passed through.
Frame retention feature 35 is driven by multiple air cylinder devices 37 by lifting, and above-mentioned multiple air cylinder devices 37 are by arranging
The fluid pressure cylinder using air pressure or hydraulic pressure etc. around cylinder seat 31 is formed.Air cylinder device 37 has the work extended upward
Stopper rod 37a, the air cylinder device 37 are fixed on flange part 32 as shown in Figure 2.Frame retention feature 35 is fixed on the upper of piston rod 37a
End.By making the piston rod 37a of air cylinder device 37 synchronously be stretched, lift frame retention feature 35.
As shown in figure 4, in above-mentioned ring-shaped frame holding member 30, wafer cell 8 regard chip 1 as upside, and by band
Body 6 is used as downside, and for chip 1 in being concentrically loaded on cylinder seat 31, ring-shaped frame 7 is loaded on frame retention feature 35
Supporting surface 35a and be clamped mechanism 36 keep.Under the hold mode, chip 1 exposes to upside, with 1 corresponding area of chip
The band body 6 in domain exposes downwards in cylinder seat 31.
In the inside of the cylinder seat 31 of ring-shaped frame holding member 30, in the chip kept by ring-shaped frame holding member 30
The lower section with body 6 of unit 8, is equipped with bar unit 50.
As shown in Figure 3 and 4, bar unit 50 has：It is fixed on the unit seat 59 of the rectangular-shape of pedestal 11；It is and vertical
Act first part 51, Article 2 part 52, the Article 3 part 53 for the rectangular plate-like being arranged on unit seat 59.Each bar part
51st, 52,53 face direction extends in X direction along X-Z faces, upper edge.The length ratio of the X-direction of these parts 51,52,53
The opening portion 7a of ring-shaped frame 7 diameter is short, also, height is set as the upper edge journey consistent with the upper edge of cylinder seat 31
Degree.
Article 2 part 52 erects the central portion for being arranged at unit seat 59, in the Y-direction both sides of the Article 2 part 52 point
Compartment of terrain as defined in not separating, which erects, is provided with first part 51 and Article 3 part 53.Fig. 5 expressions rotate cylinder seat 31,
The segmentation preset lines 2 along direction extension for the chip 1 that will remain on ring-shaped frame holding member 30 are set to parallel with X-direction
State.As shown in the drawing, on X-direction length, first part 51 and Article 3 part 53 are identicals, Article 2 part
52 to the first parts 51 and Article 3 part 53 are long.First part 51 and Article 3 part 53 of equal length have so
Length：Segmentation preset lines 2 than most short i.e. most end side in the segmentation preset lines 2 of chip 1 are long, and than most long i.e. diameter or straight
Segmentation preset lines 2 near footpath are short.The Article 3 part 53 of present embodiment is comparable to be referred to as first portion in the present invention
The part of part.In addition, Article 2 part 52 has the long length of the segmentation preset lines 2 most longer than in segmentation preset lines 2.
By making mobile work platform 15 be moved along Y-direction, each bar part 51,52,53 of bar unit 50 is in cylinder seat 31
Inside relatively moves relative to cylinder seat 31 along Y-direction.Mobile work platform 15 can be at first of the both sides of Article 2 part 52
The X-direction both ends edge of part 51 and Article 3 part 53 will be abutted with the inner peripheral surface of cylinder seat 31 respectively before in the range of move
Dynamic, unit seat 59 is without prejudice to the action.
In addition, Fig. 5 represents right side in figure（Y1 sides）First part 51 will abut it with the inner peripheral surface of cylinder seat 31
Preceding state, i.e. bar part 50 are located at the state of the mobile terminal to Y1 sides.As shown in the drawing, in this condition, first part
51 leave along Y1 sides laterally from the chip 1 being maintained on ring-shaped frame holding member 30, and the length of X-direction is to accommodate
Length in ring-shaped frame 7.In addition, when bar unit 50 is located to the mobile terminal of Y2 sides, each bar part 51,52,53 is in Fig. 5
In be located at symmetrical left side（Shown in double dot dash line）.
Mobile work platform 15 is so set to be moved along Y-direction so that bar unit 50 is along with splitting 2 vertical Y side of preset lines
During being relatively moved relative to segmentation preset lines 2, a plurality of segmentation of first part 51 than the Y1 sides in chip 1 makes a reservation for
The region that line 2 is grown is that the region that first part 51 can cover is set as first area（Exterior lateral area）A1.In addition, Article 3
The region that part 53 can cover a plurality of segmentation preset lines 2 of Y2 sides is set as the 3rd region（Exterior lateral area）A3.Moreover, first
It is that between region A1 and the 3rd region A3, first article of part 51 and Article 3 part 53 can not cover, Article 2 can only be passed through
The region that part 52 covers is set as second area（Middle section）A2.
Each bar part 51,52,53 is as shown in Figure 6 in width（Y-direction）Pars intermedia there is the suction road of slit-shaped
54.Aspirate road 54 to close at X-direction both ends, the length of the X-direction of above-mentioned bar part is essentially the X side on the suction road 54
To length.
As shown in fig. 6, the upper end of each bar part 51,52,53 is formed as aspirating the plate portion 55a of the Y2 sides on road 54 than Y1 side
Plate portion 55b it is high.In addition, high plate portion 55a upper surface is formed as flat, from the upper surface to low plate portion 55b upper surface
Section be formed as rolling oblique and concavely curved flexure plane 56 to Y1.In each bar part 51,52,53, high plate portion 55a's
Upper surface abuts or approached with the lower surface with body 6 for the wafer cell 8 being maintained on ring-shaped frame holding member 30.
In each bar part 51,52,53 independently of one another formed with above-mentioned suction road 54, these suction roads 54 in bar unit 50
Connected respectively with aspiration 62 of the midway equipped with electromagnetic switching valve 61 as shown in Fig. 4 and Fig. 6, by these aspirations 62
Put together and connected with suction source 63.Electromagnetic switching valve 61 is the valve on open and close suction road 54, when what is operated in suction source 63
When being set to " open " by electromagnetic switching valve 61 under state, the air aspirated in road 54 is sucked, and makes suction function on suction road 54
Upper end open, be returned as normal pressure when electromagnetic switching valve 61 is switched into " closing ".Because each suction road 54 is in each suction tube
Road 62 is respectively arranged with electromagnetic switching valve 61, thus for each part 51,52,53 carry out independently of one another negative pressure and often
The switching of pressure.
When by above-mentioned each bar part 51,52,53 to split chip 1, make suction road 54 produce negative pressure and to band body 6
Lower surface aspirated together with chip 1 in the state of, make mobile work platform 15 to Y1 sides movement so that bar unit 50
Relatively moved to Y2 sides.Also, in the way of its movement, as shown in fig. 6, when in the high plate portion 55a of bar part 51,52,53
The edge of the suction side of road 54 of upper surface（Referred to as crack edge）57 is pre- across the segmentation extended in X direction with body 6 and chip 1
When alignment 2 is consistent, the right side of the segmentation preset lines 2 of chip 1（Low plate portion 55b sides）Aspirated downwards.From there through fracture side
Edge 57 and along segmentation preset lines 2 produce bending stress, so as to, with formed with modified layer 5 and intensity decreases correspondingly, chip 1
It is broken along segmentation preset lines 2.
In bar unit 50, first to Article 3 part 51,52,53 be each responsible for chip 1 be located at the first to the 3rd area
The segmentation of domain A1, A2, A3 segmentation preset lines 2, with movement of the mobile work platform 15 to Y-direction, first to Article 3 part
51st, 52,53 it is respectively positioned in first to the 3rd region A1, A2, A3.
In addition, the present apparatus 10 has detection means 60, the detection means 60 are used to detect to be maintained at ring-type frame as shown in Figure 2
The segmentation preset lines 2 of chip 1 on frame holding member 30.Detection means 60 are installed in the end of the pillar 61 of L-shaped, and by
The top of cylinder seat 31 is positioned at, the pillar 61 of above-mentioned L-shaped erects the end for the Y2 sides for being arranged at pedestal 11.Detection means 60
With photographing elements such as CCD, complete to split the detection of preset lines 2 by being shot to the positive 1a of chip 1.
[2-2] dividing method
Above is the structure of the segmenting device 10 of an embodiment, next to point for the chip 1 for having used the device 10
Segmentation method illustrates.
First, as shown in figure 4, being positioned at frame retention feature 35 by air cylinder device 37 makes supporting surface 35a and cylinder
The upper end identical height and position of seat 31, it is in concentrically to remain on ring-shaped frame holding member 30 by wafer cell 8（Keep
Step）.Wafer cell 8 is upside with chip 1, and is downside with band body 6, and ring-shaped frame 7 is loaded into frame retention feature 35
Above and by clamp system 36 clamped, chip 1 is loaded on cylinder seat 31 through band body 6, so as to which wafer cell 8 is by ring
Shape frame retention member 30 is kept.
Next, ring-shaped frame holding member 30 is rotated together with cylinder seat 31, the side that the edge of chip 1 to be split
It is aligned to the segmentation preset lines 2 of extension parallel with the bearing of trend of bar part 51~53 i.e. X-direction（Position alignment step）.Close
In position alignment step, by being imaged by detection means 60 to the front of chip 1 to adjust the anglec of rotation of cylinder seat 31,
So that segmentation preset lines 2 are parallel with X-direction.Next, such as Fig. 7（a）It is shown, keep framework by air cylinder device 37
Part 35 declines, thus spreading belt body 6 and chip 1 is easily split.In addition, the expansion with body 6 is as needed and carried out,
For example, if chip 1 is very thin if it can just split in the state of need not expanding, it can not also especially make band body 6
Expansion.
Next, by making mobile work platform 15 continuously be moved with defined speed to Y1 directions, such as Fig. 8（a）~
（c）It is shown, while bar unit 50 is relatively moved to Y2 directions, in the figure from the lateral Y2 sides of Y1 successively in X direction
All segmentation preset lines 2 of extension are split.
I.e., first, such as Fig. 8（a）It is shown, bar unit 50 is navigated into most Y1 sides, opens the electricity of first side of part 51
Magnetic switching valve 61 and make suction road 54 be negative pressure, make bar unit 50 to the relative movement of Y2 directions so that first part 51 it is upper
Moved along the following table with body 6 towards Y2 directions at end.Thus, the most short segmentation by first part 51 from Y1 side ends is pre-
Alignment 2 starts to be broken first area A1 a plurality of segmentation preset lines 2 successively, and the segmentation of chip 1 is gone down（First segmentation step）.
In the first segmentation step, because Article 3 part 53 is not covered with the total length of segmentation preset lines 2, so Article 3 part 53
Electromagnetic switching valve 61 is closed mode without making suction road 54 be negative pressure.
It is modified layer 5 to split preset lines 2 formed with segmentation starting point, when segmentation preset lines 2 are from first part 51 passed through
During by suction function, segmentation preset lines 2 are broken down successively from the crack edge 57 of first part 51 by bending stress
Go.In addition, Article 2 part 52 and first part 51 make suction road 54 be negative pressure simultaneously, by Article 2 part 52 come successively
A part for Y2 sides in fracture second area A2 splits preset lines 2 and splits chip 1.
After first area A1 all segmentation preset lines 2 are broken off, the electromagnetism switching of first side of part 51 is closed
Valve 61, such as Fig. 7（b）And Fig. 8（b）It is shown, it is only logical while the relative movement to Y2 directions of bar unit 50 is continued
Cross Article 2 part 52 the remaining second area A2 segmentation of segmentation preset lines 2 is gone down（Second segmentation step）.Second
In segmentation step, including it is formed at a plurality of segmentation preset lines 2 of second area A2 most long segmentation preset lines 2 and is broken off.
In the final stage of the second segmentation step, because Article 3 part 53 initially enters the 3rd region A3, so here
Open the electromagnetic switching valve 61 of the side of Article 3 part 53 and make suction road 54 be negative pressure, such as Fig. 8（c）It is shown, pass through Article 3
Part 53 starts to be broken the 3rd region A3 segmentation preset lines 2, and continues segmentation of the Article 2 part 52 to second area A2
The fracture of preset lines 2（3rd segmentation step）.Also, the most short segmentation preset lines 2 in Y2 side ends pass through Article 3 part
After 53 are broken off, all segmentation preset lines 2 extended in X direction are broken off.
Next, such as Fig. 8（d）It is shown, cylinder seat 31 is rotated and is rotated by 90 ° wafer cell 8, by detecting structure
While part 60 images to the positive 1a of chip 1, by unbroken segmentation preset lines 2（Edge makes a reservation for the segmentation being broken
The vertical direction extension of line 2）It is aligned to parallel with X-direction（Position alignment step）.Then, bar unit 50 is made to return to initially
Y1 sides after, above-mentioned first to the 3rd segmentation step is carried out with same to get.Or such as Fig. 8（e）It is shown, also may be used
With from bar unit 50 reach Y2 sides state, divided with the 3rd region A3, second area A2, first area A1 order
Cut.
Handled more than, chip 1 is split along all segmentation preset lines 2 set in clathrate.
The action effect of [2-3] one embodiment
In an above-mentioned embodiment, using respectively with chip 1, the shorter first area A1 of segmentation preset lines 2 and
Length corresponding to the 3rd region A3 and long second area A2 of segmentation preset lines 2 it is different first to Article 3 part
51st, 52,53 split preset lines 2 so as to which chip 1 be split to be broken.Therefore, it is possible to which the length of each bar part 51,52,53 is set
It is set to and segmentation preset lines 2 is split enough and for the length of required bottom line.Its result is, can be in use and crystalline substance
While ring-shaped frame 7 of appropriate size corresponding to piece 1, in the case where bar part 51,52,53 is not interfered with ring-shaped frame 7
Reliably chip 1 is split along segmentation preset lines 2 by bar part 51,52,53.
In addition, in the above-described embodiment, to such as Fig. 7（a）It is shown expanded band body 6 at the time of chip 1 not by
It is illustrated along the segmentation segmentation of preset lines 2, but chip can also be applied to by adjusting the amount of expansion with body 6 to increase
1 external force, chip 1 is carried out prepare segmentation along formed with the segmentation preset lines 2 that segmentation starting point is modified layer 5, as above institute
State by bar part 51~53 to split the undivided part split by preparation without segmentation.
[3] other embodiment of bar unit
[3-1] has the mode of two bar parts
The bar unit 50 of an above-mentioned embodiment is such structure：It is being responsible for the second area A2 of segmentation chip 1（Including
Most long segmentation preset lines 2）Article 2 part 52 both sides, be equipped with the first, the 3rd region for being responsible for segmentation chip 1 both sides
A1、A3（Including most short segmentation preset lines 2）First, Article 3 part 51,53, once just can by being moved along Y-direction
All segmentation preset lines 2 that fracture extends along a direction.But it is a feature of the present invention that at least there is first He of part 51
Article 2 part 52.Therefore, the bar unit 50 of embodiment as shown in Figure 9 is such, and bar part can also be only with above-mentioned
First part 51 and Article 2 part 52 both structure.
According to the bar unit 50 of the embodiment, such as Fig. 9（a）~（b）It is shown, divide in the same manner as above-mentioned embodiment
Be not broken successively by first part 51 and Article 2 part 52 first area A1 and second area A2 segmentation preset lines 2 and
After chip 1 is split, such as Fig. 9（c）It is shown, rotate cylinder seat 31 and wafer cell 8 is rotated 180 °, make to have and do not break
The 3rd region A3 reversions for the segmentation preset lines 2 split are configured to Y1 sides.Then, while bar unit 50 is returned to Y1 sides,
Preset lines 2 are split to be broken with second area A2, the 3rd region A3 order.Thus all segmentations extended in X direction make a reservation for
Line 2 is broken off.
[3-2] has the mode of multiple parts
The bar unit 50 of the respective embodiments described above is such mode：Crystalline substance is substantially broken by a bar part respectively
The first of piece 1 is to the 3rd region A1, A2, A3, i.e. middle section and a plurality of segmentation preset lines of the exterior lateral area positioned at its both sides
2, but may also be multiple parts come concentrate segmentation middle section and exterior lateral area by way of.
Figure 10 and Figure 11 represents the segmenting device 10 of the bar unit 50 with such mode.As shown in figure 12, now
Bar unit 50 have：Multiple Article 2 parts 52, it is located at the central portion of Y-direction, and with than most long segmentation preset lines 2
Long length, and it is responsible for a plurality of segmentation preset lines 2 of the segmentation positioned at the central portion of chip 1；And multiple first part 51,
It is disposed in the Y-direction both sides of these Article 2 parts 52, has longer than most short segmentation preset lines 2 and more pre- than most long segmentation
The short length of alignment 2, and it is responsible for a plurality of segmentation preset lines 2 of the segmentation positioned at the exterior lateral area of chip 1.Each bar part 51,52
It can also be configured to separate and be adjacent to arrangement closely-spacedly, or all parts is merged and is turned into a block, be taken out multiple
Road 54 is inhaled to be formed at block and form bar part 51,52.
According to this unit 50, such as Figure 13（a）~（f）It is shown, make bar unit 50 relative to chip 1 from the lateral Y2 of Y1
While side relatively moves, make the suction road of covering segmentation preset lines 2, the i.e. length bar part 51,52 longer than segmentation preset lines 2
54 be negative pressure, and thereby, it is possible to be continuously broken segmentation preset lines 2 to separate chip 1.By so having multiple portions
Part, all segmentations for splitting preset lines 2 are carried out while the displacement of mobile work platform 15 can be shortened, can be complete in a short time
Into division processing.In addition, by making bar part sectionalization, make bar part be not easy to interfere with ring-shaped frame 7, thus can obtain with
Lower advantage：It can also be split even if the size of ring-shaped frame 7 is small, and the usage amount with body 6 can be suppressed.
[4] other embodiment of bar part
The bar part 51~53 of above-mentioned embodiment is to make suction road 54 be negative pressure, chip 1 is aspirated and along point
The construction for cutting preset lines 2 to be split, as long as but it can be applied as bar part of the invention along segmentation preset lines 2
The part for adding external force to split chip 1, can be any mode.It is for instance possible to use by pressing push type broach shown in Figure 14
The end of tool 70 jacks up segmentation preset lines 2 mode separated to be broken, by chip 1.With multiple pressing cutters 70
So as to the exterior lateral area of broken wafer and the segmentation preset lines of middle section, each pressing cutter 70 is configured to independent
Ground is up and down.
In addition, it is circular slab using the chips such as semiconductor wafer 1 as the machined object of the present invention in the above-described embodiment
Shape thing, but the circular plate-like shape thing of the present invention is not limited to this chip, for example (,) it is various including glass and sapphire substrate, ceramics etc.
Circular plate-like shape thing.
Claims (2)
1. a kind of segmenting device, it splits the circular plate-like shape thing of circular plate-like shape thing unit, above-mentioned circle along segmentation preset lines
Plate-shaped object units include above-mentioned circular plate-like shape thing, band body and ring-shaped frame, and above-mentioned circular plate-like shape thing has a plurality of length different
Above-mentioned segmentation preset lines, and along above-mentioned segmentation preset lines formed with segmentation starting point；Above-mentioned band body is pasted on above-mentioned circle
One face of plate object；The above-mentioned periphery with body is pasted on above-mentioned ring-shaped frame, and above-mentioned ring-shaped frame, which has, stores above-mentioned circle
The opening portion of the size of plate object,
Above-mentioned segmenting device is characterised by,
Above-mentioned segmenting device has：
Ring-shaped frame holding member, it has the supporting surface for the above-mentioned ring-shaped frame for being used to support above-mentioned circular plate-like shape thing unit,
Above-mentioned ring-shaped frame holding member is kept with following state to above-mentioned ring-shaped frame：Make the circle of above-mentioned circular plate-like shape thing unit
Shape plate object is in upside, the above-mentioned band body in region corresponding with above-mentioned circular plate-like shape thing is in downside, makes above-mentioned circular slab
Shape thing and the above-mentioned band body in region corresponding with above-mentioned circular plate-like shape thing expose；
Bar unit, it is disposed in the above-mentioned band body on the above-mentioned ring-shaped frame for being pasted onto and being kept by above-mentioned ring-shaped frame holding member
Lower section, above-mentioned bar unit across the above-mentioned bearing of trend with body and the above-mentioned segmentation preset lines of above-mentioned circular plate-like shape thing abreast
Extension, above-mentioned bar unit are used to split above-mentioned segmentation preset lines, and above-mentioned bar unit has the above-mentioned opening than above-mentioned ring-shaped frame
The short length of the diameter in portion；And
Mobile member, it makes above-mentioned bar unit relative to the above-mentioned segmentation preset lines to be split vertical with the segmentation preset lines
Relatively moved on direction,
Above-mentioned bar unit at least has：
First part, the above-mentioned segmentation most shorter than in the above-mentioned segmentation preset lines to be split of above-mentioned circular plate-like shape thing of its length
Predetermined line length, and the above-mentioned segmentation preset lines most longer than in the above-mentioned segmentation preset lines to be split of above-mentioned circular plate-like shape thing are short；
And
Article 2 part, its length above-mentioned segmentation predetermined line length most longer than in the above-mentioned segmentation preset lines to be split,
Above-mentioned first part is responsible for above-mentioned segmentation preset lines of the segmentation positioned at the exterior lateral area of above-mentioned circular plate-like shape thing, and above-mentioned the
Two parts be responsible for segmentation positioned at above-mentioned circular plate-like shape thing middle section above-mentioned segmentation preset lines, above-mentioned first part and
Above-mentioned Article 2 part is respectively positioned in the above-mentioned exterior lateral area of above-mentioned circular plate-like shape thing and above-mentioned by above-mentioned mobile member
Middle section,
When carrying out segmentation action, first part and the Article 2 part are fixed, pass through above-mentioned circular plate-like shape
Aspirated downwards and above-mentioned circular plate-like shape thing is divided along above-mentioned in the side of the above-mentioned above-mentioned segmentation preset lines to be split of thing
The predetermined thread breakage of above-mentioned segmentation cut.
2. a kind of dividing method, it splits circular plate-like shape using the segmenting device described in claim 1 along segmentation preset lines
The circular plate-like shape thing of thing unit, above-mentioned circular plate-like shape thing unit include above-mentioned circular plate-like shape thing, band body and ring-shaped frame, on
Stating circular plate-like shape thing has the different above-mentioned segmentation preset lines of a plurality of length, and along above-mentioned segmentation preset lines formed with segmentation
Starting point；The above-mentioned face that above-mentioned circular plate-like shape thing is pasted on body；The above-mentioned periphery with body is pasted on above-mentioned ring-shaped frame, on
Stating ring-shaped frame has the opening portion for the size for storing above-mentioned circular plate-like shape thing,
Above-mentioned dividing method is characterised by,
Above-mentioned dividing method has：
Step is kept, the above-mentioned ring-shaped frame of above-mentioned circular plate-like shape thing unit is kept by above-mentioned ring-shaped frame holding member；
Position alignment step, to by above-mentioned ring-shaped frame holding member and the circular slab of the above-mentioned circular plate-like shape thing unit of fixation
The above-mentioned segmentation preset lines to be split of shape thing and above-mentioned bar part carry out position alignment；
First segmentation step, after above-mentioned position alignment step and above-mentioned holding step is implemented, above-mentioned including what is split
In the above-mentioned exterior lateral area for splitting above-mentioned segmentation preset lines most short in preset lines, make above-mentioned first by above-mentioned mobile member
Part relatively moves relative to the above-mentioned segmentation preset lines to be split on the direction vertical with the segmentation preset lines, thus,
Split circular plate-like shape thing along above-mentioned segmentation preset lines in above-mentioned exterior lateral area；And
Second segmentation step, the above-mentioned center of most long above-mentioned segmentation preset lines in including the above-mentioned segmentation preset lines to be split
In region, by above-mentioned mobile member make above-mentioned Article 2 part relative to the above-mentioned segmentation preset lines to be split with the segmentation
Preset lines relatively move on vertical direction, thus, split circle along above-mentioned segmentation preset lines in above-mentioned middle section
Plate object,
When carrying out segmentation action, first part and the Article 2 part are fixed, pass through above-mentioned circular plate-like shape
Aspirated downwards and above-mentioned circular plate-like shape thing is divided along above-mentioned in the side of the above-mentioned above-mentioned segmentation preset lines to be split of thing
The predetermined thread breakage of above-mentioned segmentation cut.
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| JP2012-272203 | 2012-12-13 |
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| CN105140182B (en) * | 2015-04-28 | 2018-10-30 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
| JP2017112265A (en) * | 2015-12-17 | 2017-06-22 | 株式会社ディスコ | Wafer processing method |
| JP7015668B2 (en) * | 2017-10-11 | 2022-02-03 | 株式会社ディスコ | Plate-shaped partitioning device |
| JP7032954B2 (en) | 2018-02-27 | 2022-03-09 | 京セラ株式会社 | heater |
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| JP2006128211A (en) * | 2004-10-26 | 2006-05-18 | Disco Abrasive Syst Ltd | Wafer dividing apparatus |
| JP4721997B2 (en) * | 2006-09-14 | 2011-07-13 | 株式会社ディスコ | Wafer dividing apparatus and wafer dividing method |
| JP5310278B2 (en) * | 2009-06-05 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | Break bar |
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