JP2021095322A - End material parting device and end material parting method - Google Patents

Abstract

To precisely position an adsorption hand to a substrate in an end material parting device.SOLUTION: An end material parting device 1 comprises an adsorption hand 9, a first camera 15, and a controller 31. The adsorption hand 9 is mounted to a robot arm 7. The adsorption hand 9 has an adsorption part main body 9a for adsorbing a mother board M located to a first locating part 2, and a pusher bar 11 that can part a product P1 of the board M from an end material Ma by pushing down the end material Ma of the mother board M adsorbed to the adsorption part main body 9a. The first camera 15 is provided at a tip of the robot arm 7, and can pick up an image of the mother board M located to the first locating part 2 from above. The controller 31 positions the adsorption hand 9 to the mother board M based on the image of the first camera 15.SELECTED DRAWING: Figure 1

Description

The present invention relates to a scrap material dividing device and a scrap material cutting method, particularly one in which a substrate main body is conveyed after separating the scraps of a substrate by a suction hand having a suction portion and a pushing member.

Generally, in the liquid crystal panel manufacturing process, a large-area laminated glass substrate (mother substrate) in which a plurality of unit display panels (unit substrates) as manufacturing units are patterned is manufactured, and then it is divided into unit display panels. To do. Specifically, a pair of upper and lower cutter wheels are used to scribe the mother substrate on two surfaces at the same time from the vertical direction, and then the two surfaces are separated at the same time to divide each unit display panel. Extra parts are provided between the unit display panels, and these are used as scraps after division.

Conventionally, a transport mechanism with a break mechanism for taking out a plurality of strip-shaped substrates from a mother substrate has been known (see, for example, Patent Document 1).
Further, a suction hand is provided at the tip of the robot arm, and a suction / splitting mechanism in which the suction hand has a suction portion and a pusher is also known (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2013-056830 JP-A-2019-107779

In the mechanism of Patent Document 2, the pusher presses the surrounding scraps after the suction portion sucks the substrate. Then, since the pusher holds down the scrap material when the suction portion rises, the main body of the substrate is separated from the scrap material.
However, it is difficult to accurately position the suction hand with respect to the substrate, so that the pusher may not be able to accurately push the scraps. In that case, the accuracy of the cross section of the substrate was lowered.

An object of the present invention is to accurately position the suction hand with respect to the substrate in the scrap cutting device.

Hereinafter, a plurality of aspects will be described as means for solving the problem. These aspects can be arbitrarily combined as needed.

The scrap cutting device according to the seemingly present invention includes a suction hand, a first camera, and a control unit.
The suction hand is attached to the robot arm. The suction hand has a suction part for sucking the substrate placed on the mounting table and a pushing member capable of separating the substrate body from the scraps by pushing down the scraps of the substrate sucked on the suction part. doing.
The first camera is provided at the tip of the robot arm and can photograph the substrate mounted on the mounting table from above.
The control unit positions the suction hand with respect to the substrate based on the image of the first camera.
In this device, a first camera is mounted on the tip of a robot arm for sucking, taking out, and transporting a substrate. By using the image of this camera, the robot arm can accurately arrange the suction hand with respect to the substrate. As a result, when the suction portion of the suction hand sucks the substrate and the pushing member separates the end material, product defects due to misalignment are unlikely to occur.

The scrap cutting device may further include a second camera capable of photographing the substrate sucked by the suction hand from below.
The control unit may confirm the suction state of the substrate by the suction hand based on the image of the second camera.
In this device, the second camera photographs the substrate after suction transfer from below. As a result, the control unit can confirm whether or not the substrate is accurately sucked by the suction hand. As a result, accurate positioning can be performed in the break portion of the next process without a positioning camera, and the break accuracy can be improved.

The scrap cutting method according to another viewpoint of the present invention is carried out in the scrap cutting device. The scrap cutting device includes a suction hand and a first camera. The suction hand has a suction part for sucking the substrate placed on the mounting table and a pushing member capable of separating the substrate body from the scraps by pushing down the scraps of the substrate sucked on the suction part. However, it is attached to the robot arm. The first camera is provided at the tip of the robot arm and can photograph the substrate mounted on the mounting table from above.
The scrap cutting method includes the following steps.
◎ The step of positioning the suction hand on the board on the robot arm based on the image of the first camera.
◎ Step to suck the substrate to the suction part of the suction hand.
◎ A step in which the substrate is separated from the outer portion by causing the pushing member to push down the outer portion of the substrate that is attracted to the suction portion.
In this method, the robot arm can accurately arrange the suction hand with respect to the substrate by using the image of the first camera mounted on the tip of the robot arm for sucking, taking out, and transporting the substrate. As a result, when the suction portion of the suction hand sucks the substrate and the pushing member separates the end material, product defects due to misalignment are unlikely to occur.

The scrap cutting method may further include the following steps.
◎ The step of letting the second camera take a picture of the suction hand after the substrate is sucked from below.
◎ Step to check the suction state of the board by the suction hand based on the image from the second camera.
In this method, the second camera photographs the substrate after suction transfer from below. This makes it possible to confirm whether or not the substrate is accurately sucked by the suction hand. As a result, accurate positioning can be performed in the break portion of the next process without a positioning camera, and the break accuracy can be improved.

In the scrap cutting device and the scrap cutting method according to the present invention, the suction hand can be accurately positioned with respect to the substrate.

The schematic front view of the scrap cutting device of 1st Embodiment. Schematic perspective view of the suction hand. A schematic plan view showing the positional relationship between the mother substrate and the suction hand. The block diagram which shows the control composition of the scrap cutting device. The flowchart which shows the scrap cutting operation of the scrap cutting device. The schematic side view which shows the scrap cutting operation. The schematic side view which shows the scrap cutting operation. The schematic side view which shows the scrap cutting operation. The schematic side view which shows the scrap cutting operation. The schematic side view which shows the scrap cutting operation of 2nd Embodiment. The schematic side view which shows the scrap cutting operation of 2nd Embodiment. The schematic side view which shows the scrap cutting operation of 2nd Embodiment. The schematic side view which shows the scrap cutting operation of 2nd Embodiment.

1. 1. 1st Embodiment (1) Structure of scrap cutting device The structure of the scrap cutting device 1 (an example of the scrap cutting device) will be described with reference to FIGS. 1 to 3. FIG. 1 is a schematic front view of the scrap material dividing device of the first embodiment. FIG. 2 is a schematic perspective view of the suction hand. FIG. 3 is a schematic plan view showing the positional relationship between the mother substrate and the suction hand. In FIG. 1, the left-right direction in the figure is the first direction (arrow X), and the direction orthogonal to the paper surface is the second direction (arrow Y).

In the present embodiment, the object to be divided is the mother substrate M. The mother substrate M is, for example, a laminated glass composed of two substrates. A scribe line S is formed on the two substrates by the upper and lower cutter wheels of the scribe device (not shown).
The scrap material dividing device 1 is a device that cuts out a product P1 (an example of a substrate main body) by separately removing the scrap material Ma from the mother substrate M. Specifically, the scrap material dividing device 1 divides the mother substrate M transferred to the first mounting unit 2 and then conveys it to the second mounting unit 3. The first mounting portion 2 and the second mounting portion 3 are, for example, a conveyor device or a mounting table.

The scrap material dividing device 1 has a robot arm 7. The robot arm 7 is an articulated robot, and can move the suction hand 9 (described later) up and down and sideways. The robot arm 7 has an arm driving device 33 (described later) including a motor or the like.
The scrap material dividing device 1 has a suction hand 9 (an example of a suction hand). The suction hand 9 can suck and convey the mother substrate M. The suction hand 9 is attached to the tip of the robot arm 7.

The suction portion main body 9a (an example of the suction portion) of the suction hand 9 has a horizontal suction surface 9b on the lower side, on which the mother substrate M to be processed is sucked. As shown in FIG. 3, the suction surface 9b is provided with a plurality of air suction holes 9c. The air suction hole 9c communicates with a suction device 35 (described later) such as a vacuum pump via an air duct (not shown).
The suction hand 9 particularly sucks and fixes the portion of the product P1 of the mother substrate M. More specifically, the suction hand 9 has a contour corresponding to the contour of the product P1.

As shown in FIG. 2, the suction hand 9 has a pusher bar 11 (an example of a pushing member). The pusher bar 11 is integrally operably connected to the suction portion main body 9a in the vertical direction. The pusher bar 11 separates the product P1 from the end material Ma by pushing down the end material Ma of the mother substrate M adsorbed on the suction surface 9b.
Specifically, as shown in FIGS. 2 and 3, the pusher bar 11 is provided around the suction portion main body 9a in a state of being held by the suction portion main body 9a so as to press the upper surface of the scrap Ma. There is. The pusher bar 11 is arranged so as to be able to press all the end material regions around the mother substrate M, that is, the upper surface portions of all the end material Ma formed along the X direction and the Y direction.
The suction hand 9 has a plurality of elevating devices 13 (described later). The plurality of elevating devices 13 are devices for elevating and lowering the plurality of pusher bars 11 with respect to the suction unit main body 9a, for example, a cylinder.

(2) First Camera The scrap material dividing device 1 has a first camera 15 (an example of the first camera). The first camera 15 is attached to the suction hand 9 and can photograph the lower part. The first camera 15 is provided at the tip of the robot arm 7 and can photograph the mother substrate M mounted on the first mounting portion 2 from above.

(3) Second Camera The scrap material dividing device 1 has a second camera 17 (an example of the second camera). The second camera 17 is located between the first mounting portion 2 and the second mounting portion 3 in the first direction (even if the second camera 17 is displaced in the second direction with respect to the first mounting portion 2 and the second mounting portion 3). The mother substrate M, which is arranged at a predetermined position and is sucked by the suction hand 9, can be photographed from below.
Specifically, the second camera 17 can take a picture of the mother substrate M being conveyed from the first mounting portion 2 to the second mounting portion 3 from below.

(4) Control Configuration of Scrap Cutting Device The control configuration of the scrap cutting device 1 will be described with reference to FIG. FIG. 4 is a block diagram showing a control configuration of the scrap material dividing device.
The scrap material dividing device 1 has a controller 31. The controller 31 is a computer having a processor (for example, a CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.) and various interfaces (for example, an A / D converter, a D / A converter, a communication interface, etc.). It is a system. The controller 31 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

The controller 31 may be composed of a single processor, or may be composed of a plurality of independent processors for each control.
A part or all of the functions of each element of the controller 31 may be realized as a program that can be executed by the computer system constituting the controller 31. In addition, a part of the function of each element of the controller 31 may be configured by a custom IC.

The controller 31 can control the arm drive device 33, the suction device 35, and the plurality of elevating devices 13.
The captured image signals of the first camera 15 and the second camera 17 are input to the controller 31.
Although not shown, the controller 31 is connected to a sensor that detects the size, shape, and position of the substrate, a sensor and a switch for detecting the state of each device, and an information input device.

(5) Scrap Material Dividing Operation of the Scrap Material Dividing Device The scrap material cutting operation of the scrap material dividing device 1 will be described with reference to FIGS. 5 to 9. FIG. 5 is a flowchart showing the scrap material cutting operation of the scrap material cutting device. 6 to 9 are schematic side views showing the scrap cutting operation.
The control flowchart described below is an example, and each step can be omitted or replaced as necessary. Further, a plurality of steps may be executed at the same time, or some or all of them may be executed in an overlapping manner.
Further, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.
The following control operations are realized by commands to various devices of the controller 31.

In step S1, the suction hand 9 is moved above the mother substrate M in the first mounting portion 2. Specifically, the controller 31 controls the robot arm 7 to execute the above operation.
In step S2, the first camera 15 takes a picture of the mother substrate M. Specifically, the controller 31 takes a picture with the first camera 15 and captures the shot image.

In step S3, the captured image is analyzed. Specifically, the image processing unit of the controller 31 processes the captured image to accurately grasp the position of the mother substrate M.
In step S4, the suction hand 9 is placed on the mother substrate M. Specifically, the controller 31 accurately places the suction hand 9 on the mother substrate M based on the position information of the mother substrate M obtained in step S3. In this way, the controller 31 positions the suction hand 9 with respect to the mother substrate M based on the image of the first camera 15.
In this way, the robot arm 7 can accurately arrange the suction hand 9 with respect to the mother substrate M by the image of the first camera 15. As a result, when the suction portion main body 9a of the suction hand 9 sucks the mother substrate M and the pusher bar 11 separates the scrap Ma, product defects due to misalignment are unlikely to occur.

In step S5, as shown in FIG. 6, the suction portion main body 9a of the suction hand 9 sucks the mother substrate M. Specifically, the controller 31 controls the suction device 35 to execute the above operation.
In step S6, the mother substrate M is divided. Specifically, the controller 31 controls a plurality of elevating devices 13 to move the pusher bar 11 to a lower position with respect to the suction portion main body 9a and collide with the mother substrate M, as shown in FIG. .. Specifically, the pusher bar 11 collides with the upper surface of the scrap Ma. Next, the suction portion main body 9a moves upward, and as shown in FIG. 8, the product P1 of the mother substrate M is lifted from the upper surface of the first mounting portion 2. At this time, the pusher bar 11 keeps pressing the end material Ma of the mother substrate M from above. Therefore, as shown in FIG. 9, the product P1 is surely separated from the scrap Ma. Further, the scrap Ma is surely left on the first mounting portion 2.

Since the pusher bar 11 is a line rather than a point, it is possible to continuously push the scraps, and thus the quality is improved.
After that, the elevating device 13 moves the pusher bar 11 to an upper position with respect to the suction portion main body 9a.

In step S7, the suction hand 9 is conveyed above the second camera 17. Specifically, the controller 31 controls the robot arm 7 to execute the above operation.
In step S8, the second camera 17 takes a picture of the mother substrate M. Specifically, the controller 31 takes a picture with the second camera 17 and captures the shot image.

In step S9, the shooting information is analyzed. Specifically, the controller 31 determines whether or not the mother substrate M is sucked at an accurate position of the suction portion main body 9a of the suction hand 9. That is, the controller 31 confirms the suction state of the mother substrate M by the suction hand 9 based on the image of the second camera 17.
In step S10, based on the above determination result, if there is no abnormality, the process proceeds to step S11, and if there is an abnormality, the process proceeds to step S13.

In step S11, the mother substrate M is mounted on the second mounting portion 3. Specifically, the controller 31 controls the robot arm 7 to execute the above operation.
In step S12, the suction of the mother substrate M by the suction hand 9 is released. Specifically, the controller 31 controls the suction device 35 to execute the above operation.

In step S13, abnormal processing is performed. Specifically, the substrate transfer is interrupted and an alarm is issued.
In this device, since the second camera 17 takes a picture of the mother substrate M after suction transfer from below, the controller 31 can confirm whether or not the mother substrate M is accurately sucked by the suction hand 9. As a result, accurate positioning can be performed in the break portion of the next process without a positioning camera, and the break accuracy can be improved.

2. 2nd Embodiment In the 1st embodiment, as a method of dividing the substrate, the operation is performed in the order of suctioning the substrate, pressing the scraps of the substrate with the pusher bar, and raising the suction portion main body, but other methods. May be adopted.
Such an embodiment will be described as a second embodiment with reference to FIGS. 10 to 13. 10 to 13 are schematic side views showing the scrap cutting operation of the second embodiment.

First, as shown in FIG. 10, the suction portion main body 9a of the suction hand 9 sucks the mother substrate M. Specifically, the controller 31 controls the suction device 35 to execute the above operation.
Next, as shown in FIG. 11, the suction hand 9 is slightly lifted. Specifically, the controller 31 controls the robot arm 7 to execute the above operation.

Next, as shown in FIG. 12, the pusher bar 11 is moved to a lower position with respect to the suction portion main body 9a and collides with the mother substrate M. Specifically, the pusher bar 11 collides with the upper surface of the scrap Ma.
As a result, as shown in FIG. 13, the product P1 is surely separated from the scrap Ma. Further, the scrap Ma is surely left on the first mounting portion 2.

3. 3. Other Embodiments Although the plurality of embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the invention. In particular, the plurality of embodiments and modifications described herein can be arbitrarily combined as needed.
(1) Modification example of camera The second camera may be labor-saving.
The type, number, and position of the first camera are not particularly limited.
The type, number, and position of the second camera are not particularly limited.

(2) Deformation Example of Scrap Cutting Device The number, shape and position of suction holes and the number, shape and position of pusher bars are not limited to the first embodiment.

(3) Deformation example of substrate A bonded brittle material substrate in which two brittle material substrates are bonded together includes a liquid crystal panel in which a glass substrate is bonded, a plasma display panel, a flat display panel such as an organic EL display panel, and silicon. A semiconductor substrate in which a substrate, a sapphire substrate, or the like is bonded to a glass substrate is included.
The type of substrate is not particularly limited. Substrates include veneer glass, semiconductor wafers, and ceramic substrates.

(4) Deformation example of scribe line The shape of the scribe line is not limited. In the above embodiment, the scribe line is a straight line, but it may have a curved line in part or in whole.

The present invention is widely applied to a scrap material dividing device and a scrap material cutting method in which scraps of a substrate are separated by a suction hand having a suction portion and a pushing member and then the substrate main body is conveyed.

1: Scrap cutting device 2: First mounting part 7: Robot arm 9: Suction hand 9a: Suction part body 9b: Suction surface 9c: Air suction hole 11: Pusher bar 13: Lifting device 15: First camera 17: Second camera 31: Controller 33: Arm drive device 35: Suction device M: Mother substrate Ma: Scrap P1: Product S: Scribe line

Claims (4)

A suction portion for sucking the substrate mounted on the mounting table and a pushing member capable of separating the main body of the substrate from the scrap material by pushing down the scrap material of the substrate sucked on the suction portion. With the suction hand attached to the robot arm
A first camera provided at the tip of the robot arm and capable of photographing the substrate placed on the above-mentioned table from above.
A control unit that positions the suction hand with respect to the substrate based on the image of the first camera.
Scrap cutting device equipped with. A second camera capable of photographing the substrate sucked by the suction hand from below is further provided.
The scrap cutting device according to claim 1, wherein the control unit confirms a suction state of the substrate by the suction hand based on an image of the second camera. A suction portion for sucking the substrate mounted on the mounting table and a pushing member capable of separating the main body of the substrate from the scrap material by pushing down the scrap material of the substrate sucked on the suction portion. Fragment division including a suction hand attached to the robot arm and a first camera provided at the tip of the robot arm and capable of photographing the substrate placed on the above-mentioned table from above. In the device
A step of positioning the suction hand on the robot arm with respect to the substrate based on the image of the first camera.
A step of sucking the substrate on the suction portion of the suction hand,
A step of separating the main body of the substrate from the end material by causing the push member to push down the end material of the substrate adsorbed on the suction portion.
A method of dividing scraps with. A step of causing the second camera to take a picture of the suction hand after the substrate is sucked from below.
A step of confirming the suction state of the substrate by the suction hand based on the image from the second camera, and
The scrap cutting method according to claim 3, further comprising.

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