TW201540681A - Method for separating end material of brittle-material substrate and device thereof - Google Patents

Abstract

The present invention provides a method for separating end material and a device thereof, in which the surrounding end material of a brittle-material substrate which has arrays of horizontally and vertically arranged functional zones and is broken except for the resin layer is actually separated. The present invention comprises the steps of: maintaining a substrate 20 on an end material-separating platform 15 in which there are a chamber 52, a bottom plate 53 atop of the chamber 52, and an elastic plate 54, in which a plurality of openings are set on the elastic plate 54 and the bottom plate 53; further, suctioning the air from the openings of the elastic plate 54 to maintain the substrate 20 at its top; descending a frame-like push plate 47, in which the height of the sides opposite to each other and the height of the other two sides vertical to the opposite sides are different, in a direction parallel to the surface of the substrate 20 to separate the surrounding end material of the substrate 20.

Description

End material separation method for brittle material substrate and end material separating device

The present invention relates to an end material separation method and an end material separation device for separating an end material around a substrate, wherein the substrate is coated with a resin layer on a brittle material substrate such as a semiconductor substrate or a ceramic substrate.

Patent Document 1 mentions a substrate breaking device in which a substrate on which a score line is formed is formed by a split bar, from a back surface on which a scored surface is formed, along a score line and perpendicular to a face Pressing to break it. In the case of a substrate-based semiconductor wafer to be cracked, when a plurality of functional regions are formed in an array, first, the substrate is scribed in the longitudinal direction and the lateral direction at equal intervals between the functional regions. . Then, it is necessary to break along the scribe line with the rupture device. Further, since the end material is produced around the substrate, it is necessary to break the cracking device along the scribe line, and the applied resin layer is broken and separated.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-39931

Patent Document 2: Japanese Laid-Open Patent Publication No. 2013-177309

A plurality of functional regions are formed on the brittle material substrate, for example, the ceramic substrate at a certain interval along the x-axis and the y-axis in the manufacturing step, and the substrate on which the resin is filled on the ceramic substrate is cracked using a cracking device. After the substrate is broken into a lattice shape, it is necessary to cut off the end material of the outer periphery of the region in which the functional region is formed. However, it has been conventionally known to have individual sides for each side. The problem of complicating the work steps is complicated by taking out the end materials.

The present invention has been made in view of such a problem, and its object is to separate the end materials of the substrate around which the brittle material substrate has been broken in a short time.

In order to solve the problem, the method for separating the end material of the brittle material substrate of the present invention is to separate the end material around the functional region of the brittle material substrate; the brittle material substrate has a predetermined distance on one side in the longitudinal direction and the lateral direction. Forming a functional region, coated with a resin, and being creased along a scribe line formed in a lattice shape in a manner that the functional region is centered; the brittle material substrate is held thereon with a fully functional region with the brittle material substrate On the end material separation stage of the elastic plate of a comparable shape, an area corresponding to the full functional area of the brittle material substrate is held from the upper portion, and the upper part of the stage is separated from the end material to position the end material of the brittle material substrate The corresponding frame-shaped push plate is lowered while maintaining the state parallel to the brittle material substrate, thereby separating the end materials.

In order to solve the problem, the end material separating device of the brittle material substrate of the present invention separates the end material around the brittle material substrate; the brittle material substrate has a function of forming a predetermined distance in the longitudinal direction and the lateral direction on one side surface. a region, which is coated with a resin, and is cut along a scribe line formed in a lattice shape so that the functional region is located at the center; and is provided with an end material separation stage on which the brittle material substrate is held, and has A frame-shaped push plate corresponding to a portion of the end material around the brittle material substrate, and an elevating mechanism for moving the push plate in parallel with the surface of the brittle material substrate.

Here, the end material separation stage may further include: a chamber having a recess, a bottom plate having a plurality of openings provided in the chamber, and an elastic plate provided on the bottom plate.

Here, it may also be: an elastic plate, which is a relatively separate end material located on the substrate. The inner effective area is narrower and the plate of the flat plate that has the upper edge bent.

Here, it may also be that the opposite sides of the push plate and the heights of the other two sides perpendicular thereto are different from each other.

Here, the push plate may be attached to the transfer head that transports the brittle material substrate in a vertically movable manner.

According to the present invention having such a feature, it is possible to use an unnecessary portion around the brittle material substrate as an end material by lowering the pressing of the brittle material substrate which is broken apart from the resin layer by the push plate. All separated. Therefore, the working time can be shortened, and the structure of the end material separating device can be simplified.

10‧‧‧ Pedestal

11‧‧‧ beams

12‧‧‧Linear sliders

13‧‧‧Transfer head

14‧‧‧Cracking stage

15‧‧‧End material separation stage

16‧‧‧Extended stage

17‧‧‧Extension agency

20‧‧‧Substrate

21‧‧‧Ceramic substrate

22‧‧‧ functional area

23‧‧‧矽 resin

24‧‧‧Linear protrusion

31‧‧‧ hanger base

32‧‧‧ hanger

33, 34‧‧‧ hanger bracket

35‧‧‧Linear slider

40‧‧‧ head

41‧‧‧floor

42‧‧‧Elastic film

43‧‧‧ catheter

44‧‧‧Blowers

46‧‧‧Latch mechanism

47‧‧‧ push board

48‧‧‧ cylinder

51‧‧‧ Arm

52‧‧‧ chamber

53‧‧‧floor

54‧‧‧ elastic board

55‧‧‧Rotary axis

Fig. 1 is a perspective view showing an overall configuration of a conveying mechanism that realizes an embodiment of the present invention.

Fig. 2 is a front elevational view showing a conveying mechanism for realizing an embodiment of the present invention.

Fig. 3 is a front elevational view showing an example of a substrate conveyed by the transfer head of the embodiment, and a partial cross-sectional view taken along line A-A.

Fig. 4 is a perspective view showing a transfer head according to an embodiment of the present invention.

Fig. 5 is a front elevational view of the transfer head of the embodiment.

Fig. 6 is a bottom view of the transfer head of the embodiment.

Fig. 7 is a perspective view showing a part of the transfer head of the embodiment.

Fig. 8 is a perspective view showing an example of a dust collector used in the conveying device of the embodiment.

Fig. 9 is a perspective view showing an example of a push plate used in the end material separating device of the embodiment.

Fig. 10 is a side view showing the end material separation stage and the extension stage according to the embodiment of the present invention.

Fig. 11 is a cross-sectional view showing the transfer head, the end material separation stage, and the extension stage of the embodiment.

Fig. 12 is a cross-sectional view showing a portion of the transfer head and the end material separation stage of the embodiment.

The end material separation stage according to the embodiment of the present invention will be described. Fig. 1 is a perspective view showing an overall configuration of a conveying mechanism of the embodiment, and Fig. 2 is a front view thereof. As shown in these figures, a beam 11 is held on the base 10 by a pillar and parallel to the upper surface of the base 10, and a linear slider 12 is provided on the side of the beam 11. The linear slider 12 causes the transfer head 13 to move freely along the beam 11. As shown in FIG. 1 and FIG. 2, the base 10 is provided with a splitting stage 14 for breaking a brittle material substrate (hereinafter referred to as a substrate), and an end material separating stage 15 for separating the following end materials. And the expansion stage 16 is extended. The transfer head 13 sucks the substrate from the split stage 14 and transports it to the end material separation stage 15 on the right side in the drawing.

A substrate to be transported and separated by the end material in the embodiment of the present invention will be described. The substrate 20 is a front view and a partial cross-sectional view thereof as shown in FIG. 3, and is a substrate on which a plurality of functional regions 22 are formed at a certain interval along the x-axis and the y-axis in the manufacturing process on the ceramic substrate 21. The functional area 22 is, for example, a region having a function as an LED, and a circular crystal for an LED is formed on each surface in each functional region. The base material is filled with the ruthenium resin 23, but in order to leave the ruthenium resin 23 in the range of the functional region 22 in which the LED is formed, a line slightly higher than the surface of the ceramic substrate 21 is formed around the outer side of the functional region 22. Protrusion 24. When the enamel resin 23 is filled, the enamel resin 23 may reach the upper surface or the outer side of the linear protrusions 24.

Further, in order to separate the functional regions to form the LED chips, before the substrate 20 is broken, the respective functional regions are centered by the scribing means, and the longitudinal direction marks S _y1 to _Syn , The scribe lines S _x1 to S _xm are scribed in a manner orthogonal to each other in the lateral direction.

The scribed substrate 20 is formed in the cleavage stage 14 shown in FIG. 2, and the surface on which the crystal is formed is used as the upper surface, and is cut along the scribe line S _x1 to S _xm by a cracking device (not shown). Line S _y1 ~S _{yn is} broken. After the cracked substrate 20, only the ceramic substrate 21 layer is broken along the scribe line, but the enamel resin layer 23 has not been broken. In other words, the substrate 20 is in a state of being connected only by the thin layer of the resin 23, and the inside of the linear protrusion 24 has a portion arranged in a plurality of functional regions of the x and y axes and an unnecessary portion which becomes the outer peripheral material. .

Next, the transfer head 13 for sucking the substrate 20 and transporting it will be described. Fig. 4 is a perspective view showing the transfer head 13, Fig. 5 is a side view thereof, Fig. 6 is a bottom view thereof, and Fig. 7 is a perspective view showing a part of the transfer head.

As shown in FIG. 4, in the transfer head 13, a substantially L-shaped hanger 32 is vertically connected to the hanger base 31 in the horizontal direction of a substantially square shape. A rectangular hanger bracket 33 is connected to the side of the hanger 32, and a rectangular hanger bracket 34 is attached to the hanger bracket 33 so as to overlap the surface thereof, and is disposed on the hanger bracket 34. The linear slider 35 can be moved up and down. A head 40 is disposed below the linear slider 35. The linear slider 35 has an inflow port that flows into the air flow in both the upper direction and the lower direction, and the head 40 is moved up and down by switching the inflow. Further, the linear slider 35 may be any one that can lift the head 40, and may be moved up and down not only by the inflow of the air flow but also by the motor or the like.

The head 40 is a rectangular parallelepiped casing, and the inside of the casing is hollow, and the lower surface is open. Further, as shown in Fig. 7, the bottom plate 41 is provided below. The bottom plate 41 is a flat metal structure below The piece is, for example, made of aluminum. The bottom plate 41 is provided with a plurality of openings arranged in an array in the xy direction at equal intervals so as to correspond to the functional regions 22 of the cracked substrate 20. The openings are set to be larger than the diameter of the crystal, respectively. Further, an opening along the outer circumference is also provided in a portion corresponding to the outer peripheral material of the functional region 22 of the substrate 20.

A thin elastic piece 42 is attached under the bottom plate 41. The elastic piece 42 is a flat rubber flat plate. In addition, as shown in FIG. 6, the elastic piece 42 has an opening at equal intervals in the x direction and the y direction so as to correspond to the respective functional regions 22 of the substrate 20 to be transported, and further has a line shape around it. The portion opposite to the projection 24 has a quadrangular annular recess. Further, in a portion corresponding to the outer peripheral material of the functional region 22 of the substrate 20, an opening along the outer circumference is provided on the outer side of the annular recess. These openings are at the same position when the bottom plate 41 and the elastic piece 42 are overlapped. Here, the opening of the bottom plate 41 and the opening of the elastic piece 42 are set to have a path length slightly larger than the diameter of the crystal of the LED formed in the functional region 22, and are configured as the functional region 22 when the cracked substrate 20 is attracted. The crystal is not in direct contact with the elastic sheet 42.

Next, a duct 43 is attached to one side of the head 40, and a blower 44 of the dust collector shown in Fig. 8 is connected to the front end of the duct 43. Further, although a dust collector is used here, a blower 44 alone may be used. When the air blower 44 is driven and the air is sucked through the duct 43 while the substrate 20 has contacted the elastic sheet 42, air is sucked from the openings of the bottom plate 41 and the elastic piece 42, and the substrate 20 can be attracted. Further, by switching the air flow from the inflow to the outflow by the switching unit (not shown), it is possible to switch the state in which the air is ejected from the opening of the elastic piece 42.

Further, a plurality of latch mechanisms 46 are provided on the side walls of the four sides of the head portion 40. The latch mechanism 46 is configured to integrally and detachably engage the bottom plate 41 and the elastic piece 42 under the head portion 40, and can be easily replaced when the rubber of the elastic piece 42 has deteriorated. change. In addition, the latch mechanism 46 may be formed on at least one of the parallel side walls of the head 40.

A frame-shaped push plate 47 shown in Fig. 9 is provided on the outer circumference of the lower portion of the head portion 40 so as to be movable up and down. In the state where the substrate 20 is held between the head portion 40 and the end material separation stage 15, the push plate 47 is lowered by the push plate 47, and a portion other than the substrate 20 is separated as an end material. The push plate 47 is a frame-shaped member of a size corresponding to the end portion of the periphery of the substrate 20. Further, as shown in the figure, the upper surface is formed to have a constant height, and the pair of opposite sides 47a and 47b are thicker, and the opposite sides of the opposite sides 47c and 47d are thinner.

Next, the lifting mechanism of the push plate 47 will be described. Among the side walls of the head portion 40, a cylinder 48 is provided as a lifting mechanism in two mutually parallel side walls excluding one side wall of the connecting duct 43. As shown in Fig. 5, the air cylinder 48 has a main body portion 48a that is bolted to the side wall of the head portion 40, a flat connecting member 48b that is vertically movable, and a frame-shaped connecting member 48c that is connected thereto. Further, a push plate 47 is movably connected to the lower side of the connecting member 48c.

Next, the description will be given of the end material separation stage 15 used for separation of the end materials. As shown in FIGS. 10 to 12, the end material separating stage 15 has a rectangular chamber 52 having a rectangular bottom portion 52 and an upper bottom plate 53 thereof, and an elastic plate 54 having substantially the same shape.

A large recess is formed in a central portion of the chamber 52, and communicates with a duct 51a formed inside the arm 51. The bottom plate 53 is a rectangular flat plate corresponding to the full functional area of the fractured substrate, but is preferably slightly smaller than the fully functional area. The bottom plate 53 is made of, for example, aluminum. The bottom plate 53 is provided with a plurality of openings arranged in an array in the xy direction so as to correspond to the respective functional regions 22.

An elastic plate 54 is attached to the upper surface of the bottom plate 41. The elastic plate 54 is a flat plate made of rubber or the like corresponding to a rectangular region corresponding to the full functional region of the substrate 20, but is preferably a flat plate. It is slightly smaller than the full function area. In addition to the outer peripheral portions of the four sides, the elastic plate 54 is provided with openings of the bottom plate 53, that is, a plurality of openings arranged in an array in the xy direction so as to correspond to the functional regions of the cracked substrate. It is preferable that the portion of the upper edge of the elastic plate 54 has a slightly curved configuration.

Further, since the openings of the elastic plate 54 and the bottom plate 53 are provided so as to correspond to the respective functional regions 22, external air can be caused to flow through the openings to the recesses of the chamber 52 at the time of overlapping. The duct 51a inside the arm 51 is connected to the vacuum suction device through a pipe (not shown), and by driving the vacuum suction device, air can be ejected or sucked from the opening of the elastic plate 54.

Further, the arm 51 is configured to be rotatable 180° from the state of FIG. 10 to the center of the rotation shaft 55. A rotating mechanism for rotating the arm 51 together with the upper chamber 52, the bottom plate 53, and the elastic plate 54 is provided on the shaft. The rotation mechanism may be any one that can rotate the arm 51 by 180 degrees, and may be a rotary cylinder or a motor and a reduction gear.

Next, a case where the substrate 20 is transported from the rupture stage 14 to the end material separation stage 15 by the transfer device will be described. First, the transfer head 13 of the transfer device is moved right above the substrate 20 on the cleavage stage 14, and the head 40 is lowered to be in contact with the substrate 20. Then, the opening of the elastic piece 42 at the lowermost portion of the head 40 is positioned corresponding to the LED crystal. Then, when the air blower 44 is driven and the air is sucked through the duct 43, air is sucked from the openings of the bottom plate 41 and the elastic piece 42, and the substrate 20 that has been in contact with the elastic piece 42 can be sucked. Here, even when air is sucked from the opening of the elastic piece 42, air leakage occurs, and since the air always flows in from the opening to the inside, the substrate 20 can be attracted. Then, by raising the transfer head 13, the cracked substrate 20 can be raised while maintaining the original state.

In this state, the entire transport head 13 is moved by the linear slider 12, whereby the substrate 20 can be transported to a desired position. In this way, moving the transport head 13 to the end After the material is separated directly above the stage 15, the head 40 is lowered by the linear slider 35. Then, the substrate 20 held under the head portion 40 is in contact with the upper portion of the end material separation stage 15, and is positioned such that its functional region 22 corresponds to the position of the opening of the elastic plate 54, and the lowering is stopped. Then, air is sucked by the transmission arm 51 while the lower surface of the substrate 20 has contacted the elastic plate 54, whereby the substrate 20 can be held on the end material separation stage 15. At this time, the state in which the blower 44 is operated may be maintained or may be stopped.

Next, the operation at the time of separating the end materials of the end material separation device will be described. First, the push plate 47 at the lower portion of the head portion 15 can be lowered by blowing air from the air cylinder 48 of the elevating mechanism of the push plate 47. Once the push plate 47 is lowered in parallel with the substrate 20, first, by the thicker sides 47a, 47b, only the elongated peripheral portion outside the functional region of the substrate 20 is subjected to downward pressure, and is separated into an end material. Further, once it continues to fall, the elongated peripheral portion outside the functional region of the substrate 20 is subjected to the pressure of the lowering by the two sides 47c, 47d having a relatively small thickness, and is separated into an end material. Thus, the end material around the substrate 20 can be completely separated by a single lowering operation such as pressing of the push plate 47. At this time, the adjacent sides around the substrate 20 are not separated at the same time as the end materials. Further, the elastic plate 54 is slightly smaller than the push plate 47, and the upper edge portion thereof is curved. Therefore, the surrounding end materials can be completely separated in a short time without damaging the functional area of the substrate 20.

Thereafter, in a state where air is sucked from the arm 51, air is blown from the blower 44 to raise the head 40. Thereby, the head 40 is separated from the substrate 20. In a state where the head 40 is raised, the transport head 13 is moved to the left in FIG. 2 by the linear slider 12, thereby returning to the original state.

In this embodiment, an example has been described in which the peripheral end material of the LED chip of the LED substrate having the functional region having the crystal thereon is separated, but the present invention It is suitable not only for wafers having crystals on the surface, but also for wafers having functional regions that do not have any protrusions, and also for brittle material substrates having functional regions having protrusions other than crystals.

Further, in this embodiment, the brittle material substrate on which the tantalum resin is applied to the ceramic substrate has been described. However, the substrate may be a substrate of various other material layers. For example, a layer such as a polarizing plate may be laminated on the glass substrate.

Although the cylinder is described as the elevating mechanism of the pusher plate in the above-described end material separation stage, the elevating mechanism may of course be a lifting mechanism of other shapes such as a linear slider.

According to the present invention, it is possible to hold and separate the end material only by the substrate on which the ceramic substrate of the brittle material substrate has been broken, and it is possible to be applied to the end material separating device at the time of substrate production.

10‧‧‧ Pedestal

13‧‧‧Transfer head

15‧‧‧End material separation stage

40‧‧‧ head

51‧‧‧ Arm

52‧‧‧ chamber

53‧‧‧floor

54‧‧‧ elastic board

55‧‧‧Rotary axis

Claims (6)

A method for separating end materials of a brittle material substrate, which is an end material for separating a functional region of a brittle material substrate, wherein the brittle material substrate has a function of forming a longitudinal distance and a lateral direction at a predetermined distance on one side. a region, coated with a resin, and broken along a scribe line formed in a lattice shape such that the functional region is centered; the brittle material substrate is maintained on a shape having a shape corresponding to a full functional region of the brittle material substrate The end plate of the elastic plate is separated from the stage; a region corresponding to the full functional region of the brittle material substrate is held from the upper portion; and a frame corresponding to the position of the end material of the brittle material substrate is separated from the upper portion of the end plate The push plate is lowered while maintaining the state parallel to the brittle material substrate, thereby separating the end materials. An end material separating device for a brittle material substrate, which is an end material for separating a substrate around a brittle material, wherein the brittle material substrate has a functional region formed on a side surface at a predetermined distance in a longitudinal direction and a lateral direction, and a resin coated with a scribe line formed in a lattice shape so that the functional region is located at the center; the end material separating device is provided with an end material separation stage on which the brittle material substrate is held, A frame-shaped push plate that is a side corresponding to a portion of the end material of the brittle material substrate, and an elevating mechanism that moves the push plate in parallel with the surface of the brittle material substrate. An end material separating device for a brittle material substrate according to claim 2, wherein The end material separation stage has a chamber having a recess, a bottom plate provided on the chamber and having a plurality of openings, and an elastic plate disposed on the bottom plate. An end material separating device for a brittle material substrate according to claim 3, wherein the elastic plate is narrower than an effective region located inside the end material of the substrate to be separated, and the upper edge is bent Flat plate. The end material separating device of the brittle material substrate according to claim 2, wherein the opposite sides of the push plate and the heights of the other two sides perpendicular thereto are different from each other. The end material separating device for a brittle material substrate according to the second aspect of the invention, wherein the push plate is movably attached to a transfer head that transports the brittle material substrate.