CN106316089A - Substrate segmentation apparatus and a substrate segmentation method - Google Patents
Substrate segmentation apparatus and a substrate segmentation method Download PDFInfo
- Publication number
- CN106316089A CN106316089A CN201610329130.9A CN201610329130A CN106316089A CN 106316089 A CN106316089 A CN 106316089A CN 201610329130 A CN201610329130 A CN 201610329130A CN 106316089 A CN106316089 A CN 106316089A
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- China
- Prior art keywords
- substrate
- adhesive substrates
- score line
- press section
- section
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Abstract
The present invention relates to a substrate segmentation apparatus and a substrate segmentation method. The problem is that when a bonded substrate is divided, good cracks can be reliably formed via a press-fitting width of an optimum range, and end material can be easily removed. The substrate dividing means is a dividing means for a bonded substrate (G) having a first substrate (G1) and a second substrate (G2), and the surface of the first substrate (G1) has a scribe line for cutting the end portion (S), and the second substrate (G2) is bonded to the back surface of the first substrate (G1). The dividing means has a pressing portion (11) and an attraction portion (12). The pressing portion (11) presses the end portion (GL) from the first substrate (G1) side so as to divide the end portion (GL) along the scribe line (S). The adsorption portion (12) absorbs the end portion (GL) segmented from the pressing portion (11) and removes the end portion (GL) from the first substrate (G1).
Description
Technical field
The present invention relates to a kind of substrate segmenting device, particularly to one, there is the 1st substrate and the 2nd base
The segmenting device of the adhesive substrates of plate, the surface of described 1st substrate is formed with the quarter for cutting away end
Line, described 2nd baseplate-laminating is at the back side of the 1st substrate.Additionally, the present invention relates to substrate segmentation
Method.
Background technology
Liquid-crystal apparatus is consisted of adhesive substrates, and this adhesive substrates is to exist the side of liquid crystal layer betwixt
Formula utilizes encapsulant by the 1st substrate and the 2nd baseplate-laminating.This adhesive substrates is from productive
Viewpoint is set out, and first makes with large-sized state, then obtains by splitting it
Multiple adhesive substrates.This dividing method is described in detail as follows: first at the 1st substrate of adhesive substrates
The face of side forms score line, then makes it bend from the 2nd substrate-side pressing adhesive substrates, makes the 1st
Substrate cuts off along score line.Then the face in the 2nd substrate-side of adhesive substrates forms score line, so
After from the 1st substrate-side pressing adhesive substrates and make it bend, make the 2nd substrate along score line cut off.
In the above methods, need after by the 1st substrate cutting, make the surface of adhesive substrates and back side upset
Cut off the 2nd substrate.Illustrate that the surface that need not make adhesive substrates like this and the back side are turned at patent documentation 1
The device turned.
The device of patent documentation 1 has the 1st cutting unit and the 2nd cutting unit.And, pass through transportation list
The adhesive substrates that unit transports cuts off the 1st substrate first with the 1st cutting unit, then utilizes the 2nd cut-out single
Unit cuts off the 2nd substrate.Like this, by the 1st cutting unit and the 2nd being arranged on carriage direction
Cutting unit, thus in the case of the surface not overturning adhesive substrates and the back side, cut off the 1st substrate and the 2nd
Substrate.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2014-200940 publication.
The problem that invention is to be solved
In the device of patent documentation 1, the 1st cutting unit and the 2nd cutting unit are in the vertical direction
Position in opposite directions has cut-out bar and supports bar.But, cut off bar such use and support bar
In method, cut off bar intrusion be best suitable for narrow range.Such as, it is the glass of 0.2mm for thickness
Glass substrate, optimal intrusion is 0.2mm～0.3mm.And, when intrusion is more shallow than this scope
Shi Buhui forms crackle, on the contrary when intrusion is deeper than this scope, sometimes even the substrate of opposition side also
Form the crackle of unexpected shape.
Summary of the invention
The problem of the present invention be so that split adhesive substrates time, intrusion be best suitable for wide ranges,
Good crackle can be reliably formed, and, particularly can easily remove end material.
For solving the scheme of problem
(1) the substrate segmenting device of one aspect of the present invention has the 1st substrate and the 2nd substrate
The segmenting device of adhesive substrates, the surface of described 1st substrate is formed with the score line for cutting away end,
Described 2nd baseplate-laminating is at the back side of the 1st substrate.This segmenting device has press section and adsorption section.
Press section splits end from the 1st substrate-side pressing end along score line.Adsorption section is to utilizing pressing
End after portion's segmentation carries out adsorbing and taking down end from the 1st substrate.
In the apparatus, unlike prior art, opposition side from the side being formed with score line is carried out
Pressing, substrate is pressed by the side being formed from score line on the contrary.Then, adsorption section is utilized
End after divided through pressing is adsorbed and takes down from substrate.
According to such segmentation, the scope that is best suitable for of intrusion compared with prior art broadens, it is possible to can
Good crackle is formed by ground.Furthermore it is possible to use adsorption section is easily after substrate removes segmentation
End.
(2) preferably this device also has workbench and head, described workbench mounting adhesive substrates, institute
Stating head can be relative to workbench relative movement on horizontal and above-below direction.And, press section and
Adsorption section is arranged in head.Here, owing to press section and adsorption section are as being integrally provided in head, institute
So that device can be made compact.
(3) preferably adhesive substrates is positioned in the way of the outside of the end making score line and being positioned at workbench
On workbench.Here, by utilizing press section that end is pressed such that it is able to along score line
Easily split.
(4) preferably press section has the press surface pressing end, and adsorption section has and is formed as ratio
The adsorption plane that pressing is prominent towards adhesive substrates side, adsorb end.
If here, the press surface of press section and the adsorption plane of adsorption section being set as identical height (i.e.
Same plane), then when the end after segmentation being adsorbed with adsorption section, press section meeting and substrate
Other parts surface contact.Like this, the substrate surface of press section contact has the wind of damage
Danger.
Therefore, adsorption plane is made to highlight than press surface.Thus, utilizing the adsorption plane of adsorption section to end
When adsorbing, it is possible to avoid the press surface of press section to encounter the situation of substrate surface.
(5) preferably press section can the elastic component of elastic deformation be formed by when pressing end.
(6) preferably adsorption section is formed by porous material.
(7) substrate cutting method of one aspect of the present invention has the 1st substrate and the 2nd substrate
The dividing method of adhesive substrates, the surface of described 1st substrate is formed with the score line for cutting away end,
Described 2nd baseplate-laminating is at the back side of the 1st substrate.And, described substrate cutting method includes following
Step.
A: by adhesive substrates so that the 1st substrate is in top and makes score line be positioned at the end of workbench
The mode in outside load step on the table；
B: carry out pressing from top by the end of the 1st substrate and split the step of end along score line；
C: the end after utilizing press section segmentation is adsorbed and takes down the step of end from the 1st substrate.
Invention effect
In invention described above, split adhesive substrates time, intrusion be best suitable for wide ranges,
Good crackle can be reliably formed, further, it is possible to easily remove end material.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the substrate segmenting device of an embodiment of the invention.
Fig. 2 is the schematic diagram of the pressing step for substrate cutting method is described.
Fig. 3 is for illustrating that the substrate of substrate cutting method moves the schematic diagram of step.
Fig. 4 is the schematic diagram of the adsorption step for substrate cutting method is described.
Fig. 5 is the schematic diagram taking down end material step for substrate cutting method is described.
Fig. 6 is the schematic diagram of the outlet side material step for substrate cutting method is described.
Detailed description of the invention
Fig. 1 is the schematic diagram of the substrate segmenting device of an embodiment of the invention.This device is to use
Device in the end material GL of the end removing the surface being positioned at adhesive substrates G.As it is shown in figure 1,
Adhesive substrates G is made up of the 1st substrate G1 and the 2nd substrate G2 being fitted in the 1st substrate G1.?
This, be formed with score line S on the surface of the 1st substrate G1, can remove end material along this score line S
GL。
Segmenting device has multiple head 1 and workbench 2.Multiple heads 1 are vertical at the paper of Fig. 1
Arrange on direction and supported by supporting devices such as not shown stands.Each head 1 passes through drive mechanism
M1 is freely lifted, and has press section 11 and adsorption section 12.Workbench 2 is positioned at the 1st substrate G1
The mode of top loads adhesive substrates G.Additionally, adhesive substrates G is so that end material GL is positioned at workbench
The outside of the end face of 2, the mode of the mounting surface that i.e. there is not workbench 2 in the lower section of end material GL configure.
Workbench 2 can be by comprising drive mechanism M2 driving motor, guiding mechanism etc. on a left side of Fig. 1
Right moves up.
The press section 11 of head 1 is carried out from the 1st opposite end, substrate G1 side material GL for adhesive substrates G
Pressing.Thus, end material GL is split along score line S.Press section 11 by rigidity than the 1st substrate G1
Low resins etc. are formed.Therefore, press section 11 can elastic deformation when opposite end material GL presses.
Adsorption section 12 is arranged in the side (along the side of moving direction of workbench 2) of press section 11.
Adsorption section 12 is formed by porous material, via path etc. and the exterior tube of the inside being arranged on head 1
Road 3 and be connected to vacuum pump P.
The lower surface of press section 11 becomes the press surface 11a contacted and press downwards with end material GL.
Additionally, the lower surface of adsorption section 12 is formed as than press surface 11a (the 1st substrate G1 side) downwards
Prominent, become the adsorption plane 12a that opposite end material GL carries out adsorbing.
Then, for splitting the end material GL of the 1st substrate G1 from adhesive substrates G, from the 1st substrate
The method of end material GL after G1 takes down segmentation illustrates.
First, prepare to have fitted the 1st substrate G1 and the adhesive substrates G of the 2nd substrate G2, utilizes not
The score line of diagram forms device, in (the 2nd substrate G2 side of not fitting, surface of the 1st substrate G1
Surface) form score line S.
Then, adhesive substrates G is positioned in the mounting surface of workbench 2.Here, by adhesive substrates
When G is positioned on workbench 2, load in the following manner.That is, as it is shown in figure 1, with in surface shape
Become to have the 1st substrate G1 of score line S above and score line S and end (become end material
Part) mode in the GL outside that is positioned at the mounting surface of workbench 2 configures adhesive substrates G.And then, end
Material GL in the way of the underface being positioned at the press section 11 of head 1 and adsorption section 12 of staggering (with
Adsorption section 12 and end material GL discontiguous mode when head 1 declines) configuration.
Then, as in figure 2 it is shown, make head 1 decline, utilize press section 11 by end material GL downwards
Pressing.Now, owing to there is not the mounting surface of workbench 2 in the lower section of end material GL, so passing through
Material GL part in opposite end utilizes press section 11 to carry out pressing thus at the 1st substrate G1 with score line S is
Starting point and form crackle, completely cut through end material GL.
Thereafter, as it is shown on figure 3, make head 1 rise, and then make workbench 2 to the left side side of Fig. 3
To movement.Now, workbench 2 is made to move so that the adsorption section 12 of head 1 is just being positioned at end material GL
Top.
Then, as shown in Figure 4, make head 1 decline, make adsorption section 12 abut with end material GL.By
This, end material GL is adsorbed and is maintained at adsorption section 12.As it is shown in figure 5, in this condition, head is made
Portion 1 rises.Thus, end material GL cuts away from the 1st substrate G1.
Thereafter, as shown in Figure 6, make workbench 2 retreat (moving to the right direction of figure), make patch
Close substrate G to withdraw from from the lower section of head 1.Then, as long as desorbing the absorption in portion 12, hold material
GL will drop at end material storage.
In the method for above present embodiment, such as, at the adhesive substrates that thickness is 0.2mm
In the case of, the scope that is best suitable for of intrusion is opened up compared to the most methodical 0.2mm～0.3mm, result
Wide to 0.2mm～0.5mm.
Additionally, due to make press surface 11a and adsorption plane 12a highly difference, make adsorption plane 12a be positioned at
Further below, so when utilizing opposite end, adsorption section 12 material GL to adsorb, it is possible to avoid press surface 11a
Touch the surface of the 1st substrate G1.Therefore, it is possible to avoid the surface pressed portion of the 1st substrate G1
11 damages.
[other embodiment]
The present invention is not limited to above embodiment, without departing from the scope of the invention,
Various deformation or correction can be carried out.
In the above-described embodiment, although press section and adsorption section are arranged on 1 head, but also
Press section and adsorption section can be arranged on different components.
Description of reference numerals
1: head；
2: workbench；
11: press section；
11a: press surface；
12: adsorption section；
12a: adsorption plane；
G: adhesive substrates；
G1: the 1 substrate；
G2: the 2 substrate；
GL: end material；
S: score line.
Claims (7)
1. a substrate segmenting device, it is the segmentation of the adhesive substrates with the 1st substrate and the 2nd substrate
Device, the surface of described 1st substrate is formed with the score line for cutting away end, described 2nd substrate patch
It is combined in the back side of described 1st substrate, wherein,
Described substrate segmenting device has:
Press section, presses described end from described 1st substrate-side and splits along described score line described
End；And
Adsorption section, to utilize described press section segmentation after described end adsorb and from the described 1st
Substrate takes down described end.
2. substrate segmenting device as claimed in claim 1, wherein, also has:
Workbench, loads adhesive substrates；And
Head, it is possible to relative to the relative movement on horizontal and above-below direction of described workbench,
Described press section and described adsorption section are arranged in described head.
3. substrate segmenting device as claimed in claim 1 or 2, wherein,
Described adhesive substrates carries in the way of the outside of the end making described score line and being positioned at described workbench
Put on described workbench.
4. substrate segmenting device as claimed in claim 1 or 2, wherein,
Described press section has the press surface pressing described end,
Described adsorption section has and is formed as more prominent towards described adhesive substrates side than described pressing, to described
End carries out the adsorption plane adsorbed.
5. substrate segmenting device as claimed in claim 1 or 2, wherein,
Described press section can the elastic component of elastic deformation be formed by when pressing described end.
6. substrate segmenting device as claimed in claim 1 or 2, wherein,
Described adsorption section is formed by porous material.
7. a substrate cutting method, it is the segmentation of the adhesive substrates with the 1st substrate and the 2nd substrate
Method, the surface of described 1st substrate is formed with the score line for cutting away end, described 2nd substrate patch
It is combined in the back side of described 1st substrate, wherein,
Described substrate cutting method includes:
By described adhesive substrates so that described 1st substrate is in top and makes described score line be positioned at work
The mode in the outside of the end of station loads step on the table；
Carry out pressing from top by the end of described 1st substrate and split described end along score line
Step；
Described end after utilizing the segmentation of described press section is adsorbed and takes down from described 1st substrate
The step of described end.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015134087A JP6582630B2 (en) | 2015-07-03 | 2015-07-03 | Substrate cutting apparatus and substrate cutting method |
| JP2015-134087 | 2015-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106316089A true CN106316089A (en) | 2017-01-11 |
| CN106316089B CN106316089B (en) | 2021-04-02 |
Family
ID=57726358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610329130.9A Active CN106316089B (en) | 2015-07-03 | 2016-05-18 | Substrate dividing apparatus and substrate dividing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6582630B2 (en) |
| KR (1) | KR20170004841A (en) |
| CN (1) | CN106316089B (en) |
| TW (1) | TWI698319B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773152A (en) * | 2015-11-20 | 2017-05-31 | 三星钻石工业株式会社 | Substrate segmenting device |
| CN109927183A (en) * | 2017-12-15 | 2019-06-25 | 三星钻石工业股份有限公司 | Pickup unit |
| CN110000928A (en) * | 2017-12-15 | 2019-07-12 | 三星钻石工业股份有限公司 | Rim charge removing device and rim charge remove method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102023453B1 (en) * | 2018-03-28 | 2019-09-20 | 주식회사 카이테크 | Apparatus and method for dividing substrate |
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| JPH06305757A (en) * | 1993-04-16 | 1994-11-01 | Citizen Watch Co Ltd | Substrate glass dividing device for display panel |
| JPH10268275A (en) * | 1997-03-24 | 1998-10-09 | Nec Kagoshima Ltd | Glass substrate cutting method |
| US20100011928A1 (en) * | 2008-07-16 | 2010-01-21 | Jae-Pil Lee | Flat display panel cutting apparatus |
| CN104276751A (en) * | 2013-07-08 | 2015-01-14 | 三星钻石工业股份有限公司 | Bonded substrate processing apparatus |
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| JPH06205757A (en) * | 1993-01-07 | 1994-07-26 | Hitachi Ltd | Nuclear magnetic resonance inspecting system device |
| JP2001163642A (en) * | 1999-12-09 | 2001-06-19 | Toyota Autom Loom Works Ltd | Device for taking out laminated glass panel |
| JP2007156310A (en) * | 2005-12-08 | 2007-06-21 | Nec Lcd Technologies Ltd | Method of manufacturing liquid crystal panel |
| JP6205757B2 (en) | 2013-03-07 | 2017-10-04 | オムロン株式会社 | Control system, control apparatus, image processing apparatus, and control method |
| JP6163341B2 (en) | 2013-04-02 | 2017-07-12 | 三星ダイヤモンド工業株式会社 | Break device |
-
2015
- 2015-07-03 JP JP2015134087A patent/JP6582630B2/en active Active
-
2016
- 2016-04-13 TW TW105111475A patent/TWI698319B/en active
- 2016-05-03 KR KR1020160054417A patent/KR20170004841A/en unknown
- 2016-05-18 CN CN201610329130.9A patent/CN106316089B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06305757A (en) * | 1993-04-16 | 1994-11-01 | Citizen Watch Co Ltd | Substrate glass dividing device for display panel |
| JPH10268275A (en) * | 1997-03-24 | 1998-10-09 | Nec Kagoshima Ltd | Glass substrate cutting method |
| US20100011928A1 (en) * | 2008-07-16 | 2010-01-21 | Jae-Pil Lee | Flat display panel cutting apparatus |
| CN104276751A (en) * | 2013-07-08 | 2015-01-14 | 三星钻石工业股份有限公司 | Bonded substrate processing apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773152A (en) * | 2015-11-20 | 2017-05-31 | 三星钻石工业株式会社 | Substrate segmenting device |
| CN109927183A (en) * | 2017-12-15 | 2019-06-25 | 三星钻石工业股份有限公司 | Pickup unit |
| CN110000928A (en) * | 2017-12-15 | 2019-07-12 | 三星钻石工业股份有限公司 | Rim charge removing device and rim charge remove method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017013418A (en) | 2017-01-19 |
| TW201714721A (en) | 2017-05-01 |
| KR20170004841A (en) | 2017-01-11 |
| JP6582630B2 (en) | 2019-10-02 |
| TWI698319B (en) | 2020-07-11 |
| CN106316089B (en) | 2021-04-02 |
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