KR20110067306A - Substrate dividing apparatus and method for dividing substrate using thereof - Google Patents

Abstract

PURPOSE: A substrate cutting device and method capable of smooth cut of motherboard by pressing both side of a scribe line during the breaking of the motherboard is provided to prevent damage to the motherboard by performing breaking the motherboard, right after the formation of a scribe line, without inverting. CONSTITUTION: A substrate cutting device comprises a table(120), a scribing unit(400), and a breaking unit(500). The table has a cut line supporting unit and a breaking groove unit. The cut line supporting unit is formed correspondently to a prearranged cut line. The breaking groove unit is formed on both sides of the cut line supporting unit in recessed groove. The scribing member presses the spot of the motherboard corresponding to the cut line supporting unit in order to form the scribe line on the motherboard. The breaking member pressurizes the spot of the upper side of the motherboard, corresponding to the breaking groove unit, in order to cut the motherboard.

Description

Substrate cutting device and substrate cutting method using same {SUBSTRATE DIVIDING APPARATUS AND METHOD FOR DIVIDING SUBSTRATE USING THEREOF}

The present invention relates to a substrate cutting apparatus and a substrate cutting method using the same, and a substrate cutting apparatus for cutting a bonded substrate bonded to two substrates and a substrate cutting method using the same.

In general, panels used for flat panel displays are usually manufactured using a brittle substrate, and the panel is roughly classified into a single plate substrate composed of one sheet or a bonded substrate bonded to two substrates.

Since the bonded substrate is processed into small and various sizes, such as a panel for a liquid crystal display of a mobile phone, to a large size such as a panel such as a TV or a display, the bonded substrate is cut into a unit substrate having a predetermined size from a large parent substrate, Used as a panel.

As a method of cutting a mother substrate, there is a method of cutting using a laser beam or a method of cutting using a scribe wheel embedded with fine diamond.

In particular, a method of cutting a mother substrate using a scribe wheel includes a scribing process of contacting the scribe wheel with a cutting target line of the mother substrate and forming a scribe line having a predetermined depth along the cutting target line; A cracking process propagates along the scribe line by applying a physical impact to the mother substrate, thereby breaking the mother substrate into a unit substrate.

FIG. 1 is an explanatory view showing a method of cutting a substrate using a scribe wheel in general. As shown in FIG. 1A, a mother substrate 20 having a first substrate 21 and a second substrate 22 bonded thereto is illustrated. The first scribe line 21a is formed on the first substrate 21 by using a scribe wheel 2 in a state of being seated on the table 4. Then, as shown in (b), the parent substrate 20 is inverted by 180 °, and as shown in (c), the second substrate 22 is pressed using the break bar 3. The first substrate 21 is cut while the first crack 21b is generated along the first scribe line 21a formed on the first substrate 21. Then, as shown in (d), the second scribe line 22a is formed on the second substrate 22 using the scribe wheel 2 again. Then, as shown in (e), the parent substrate 20 is inverted by 180 °, and as shown in (f), the first substrate 21 is pressed by using the break bar (Break Bar) 3. As the second crack 22b is generated along the second scribe line 22a formed on the second substrate 22, the second substrate 22 is cut to cut the mother substrate 20 into a plurality of unit substrates.

However, according to the conventional method, as a scribe line is formed on the mother substrate and then the mother substrate is inverted, abnormal cracks are generated in the mother substrate during the inversion process, thereby increasing the defective rate of the cut unit substrate.

In addition, as the process of inverting the substrate is repeated several times during the cutting process of the parent substrate, the cutting process of the substrate becomes cumbersome, and the process speed is delayed, thereby reducing the productivity.

Embodiments of the present invention provide a substrate cutting apparatus and method which can prevent damage to the mother substrate by immediately forming a scribe line on the mother substrate when the bonded substrate is cut and then performing a brake process without inversion.

In addition, embodiments of the present invention provides a substrate cutting apparatus and method that can be cut quickly and smoothly by pressing both sides of the scribe line during the braking process of the parent substrate.

In addition, embodiments of the present invention provide a substrate cutting apparatus and method which can smoothly cut a mother substrate without damage by forming a breaking groove in a table at a point where the brake roller is pressed during the breaking process of the mother substrate.

The substrate cutting device according to an embodiment of the present invention is a substrate cutting device for cutting a parent substrate into a plurality of unit substrates, the mother substrate is seated, the cutting line support portion at a position corresponding to the scheduled cutting line of the parent substrate seated A table having a groove-shaped breaking groove formed side by side on both sides of the cutting line support; Scribing means for forming a scribe line on the mother substrate by pressing a point corresponding to the cutting line support of the table among the upper surfaces of the mother substrate seated on the table; Breaking means for cutting the parent substrate by pressing a point corresponding to the breaking groove of the table of the upper surface of the parent substrate seated on the table.

The scribing means includes a scribe wheel for driving up and down to form a scribe line on the parent substrate.

The width of the cutting line support is characterized in that it is formed equal to or wider than the width of the scribe wheel.

The braking means includes a brake roller for driving up and down to press both sides of the scribe line formed on the mother substrate to cut the mother substrate.

The outer circumferential surface of the brake roller is characterized in that a pair of projection wheels corresponding to the breaking groove is formed.

The width of the protrusion wheel is characterized in that less than the width of the breaking groove.

Substrate cutting device according to an embodiment of the present invention is a substrate cutting device for cutting a parent substrate into a plurality of unit substrates, comprising: a stage unit on which the mother substrate is seated; A Y-axis driving unit provided on the stage unit and moving in the Y-axis direction; At least two Z-axis driving units provided in the Y-axis driving unit and moving in a Z-axis direction; A scribing unit installed in at least one of the Z-axis driving units to form a scribe line on the mother substrate; A braking unit installed on at least one of the Z-axis driving units to cut a mother substrate on which a scribe line is formed by the scribing unit, wherein at least one of the stage unit or the Y-axis driving unit moves in the X-axis direction Characterized in that.

The stage unit includes a table on which a mother substrate is seated; And an X-axis driving unit for moving the table in the X-axis direction.

The stage unit includes a rotation drive that rotates the table on the XY plane.

A cutting line support part is formed at a position corresponding to a line where the mother substrate seated is cut on an upper surface of the table, and a groove-shaped breaking groove part is formed in parallel to both sides of the cutting line support part.

The scribe unit includes a scribe wheel for forming a scribe line on the mother substrate; And a wheel fixture for fixing the scribe wheel to the Z-axis driving unit.

The braking unit may include a brake roller that presses both sides of a scribe line formed on the mother substrate to cut the mother substrate; And a roller fixing member for fixing the brake roller to the Z-axis driving unit.

The outer circumferential surface of the brake roller is characterized in that a pair of projection wheels corresponding to the breaking groove is formed.

The scribing unit and the braking unit may be alternately disposed in the plurality of Z-axis driving units.

A substrate cutting method according to an embodiment of the present invention is a substrate cutting method of cutting a mother substrate bonded to a first substrate and a second substrate into a plurality of unit substrates, the mother substrate to the table so that the first substrate is disposed on the table Seating; Forming a scribe line on the first substrate; Pressing both sides of the scribe line formed on the first substrate to cut the first substrate along the scribe line; Inverting the parent substrate to be seated on the table such that the second substrate is disposed thereon; Forming a scribe line on the second substrate; Pressing both sides of the scribe line formed on the second substrate to cut the second substrate along the scribe line.

In the cutting of the first substrate and the cutting of the second substrate, the pressing direction of both sides of the scribe line is the same direction as the pressing direction of the mother substrate when forming the scribe line.

In the forming of the scribe line on the first substrate and the forming of the scribe line on the second substrate, a cutting line support is formed on the table at a position corresponding to the line where the mother substrate is cut. The substrate is characterized in that the lower portion is supported on the cutting line support of the table.

In the cutting of the first substrate and the cutting of the second substrate, the table is provided with a groove-shaped breaking groove parallel to both sides of the cutting line support part, and among the upper surfaces of the first substrate and the second substrate. The first substrate and the second substrate are cut by pressing a point corresponding to the breaking groove.

According to an exemplary embodiment of the present invention, a break groove is formed in a table on which a bonded substrate is seated, thereby forming a scribe line on the parent substrate when cutting the bonded substrate, and then generating a scribing line on the parent substrate, and then, upon inversion of the parent substrate, as the brake process is performed without inversion. You can prevent the cracks.

In addition, by pressing both sides of the scribe line of the bonded substrate with the brake roller along the breaking groove, it is possible to quickly form the cutting line while cutting the bonded substrate.

In addition, the cutting process of cutting the bonding substrate to reduce the number of processes than the conventional process has the effect of improving the production speed and productivity of the cutting process for cutting the parent substrate into a unit substrate.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

First, the bonded substrate described in the present invention is a brittle material substrate such as a glass substrate, a ceramic, a semiconductor wafer, or the like used for a flat panel display. In the present embodiment, two glass substrates used in a liquid crystal display device are bonded in this embodiment. An apparatus and a method of cutting a parent substrate into a plurality of unit substrates will be described as an example.

Figure 2 is a schematic perspective view showing a substrate cutting apparatus according to an embodiment of the present invention, Figure 3 is a perspective view of the main portion showing a substrate cutting apparatus according to an embodiment of the present invention, Figure 4 is a preferred embodiment of the present invention 5A and 5B are a plan view and a cross-sectional view showing a table according to a preferred embodiment of the present invention.

As shown in the drawings, the substrate cutting apparatus according to an embodiment of the present invention includes a stage unit 100 on which the mother substrate 10 is seated; A Y-axis driver 200 provided on the stage unit 100 and moving in the Y-axis direction; At least two Z-axis driving units 300 provided in the Y-axis driving unit 200 and moving in the Z-axis direction; A scribing unit (400) installed on at least one of the Z-axis driving units (300) to form a scribe line on the mother substrate (10); And a braking unit 500 installed on at least one of the Z-axis driving units 300 to cut the mother substrate 10 on which the scribing line is formed by the scribing unit 400.

The stage unit 100 is a means for moving in the X-axis direction when the mother substrate 10 is seated. The stage unit 100 is provided on an upper surface of the surface plate 110 and a mother substrate 10 to form a flat surface. The seated table 120, and the X-axis drive unit 130 for moving the table 120 in the X-axis direction. In this case, the "X-axis direction" refers to a direction in which the table 120 is moved forward and backward as shown in FIG. 2.

The surface plate 110 is formed in a rectangular shape having a predetermined thickness, and an upper surface thereof is formed with a flat surface whose flatness is adjusted. The surface plate 110 is not limited to the exemplary embodiment, and may be changed and implemented in various ways to provide an installation space of the table 120 and the X-axis driving unit 130.

The table 120 is a means on which the mother substrate 10 is seated and supports the mother substrate 10 during the scribing process and the braking process. The table 120 shown in FIGS. 5A and 5B is a mother substrate. The cutting line support part 121 is elongated in a straight line shape at a position corresponding to the scheduled cutting line of (10), and the recessed groove-shaped breaking groove part 123 is formed in parallel to both sides of the cutting line support part 121.

The cutting line support portion 121 is a portion supporting the mother substrate 10 when pressing the mother substrate 10 with the scribe wheel 420 to be described later in the scribing process, and the mother substrate 10 during the breaking process. It acts as a pedestal when it is bent. Therefore, the width of the cutting line support 121 is preferably formed to have the same or slightly wider width than the scribe wheel 420. If the width of the cutting line support portion 121 is smaller than the scribe wheel 420, the support of the mother substrate 10 is not smoothly made during the scribing process, so that the scribe line will not be preferably formed. If the width of the 121 is much wider than the scribe wheel 420, because the surface of the surface acts as a support when the parent substrate 10 is bent during the braking process may be widened and abnormal cracks may occur.

In addition, the cutting line support part 121 may be formed to have the same height as the upper end of the other area of the table 120 on which the mother substrate 10 is seated.

The breaking groove 123 is a means for providing a space in which the mother substrate 10 is bent when the mother substrate 10 is pressed by the brake roller 520 which will be described later during the braking process. It is preferable that the recess is formed so that its upper height is lower than that of the other regions of the 120. At this time, the width of the breaking groove 123 is preferably formed to the width that the mother substrate 10 can be bent and cut when the brake roller 520 presses the mother substrate 10.

In addition, a plurality of suction holes 125 are formed on the upper surface of the table 120 to fix the mother substrate 10 to the table 120 by an air suction operation when the mother substrate 10 is seated. At this time, the plurality of suction holes 125 is preferably formed to sufficiently fix the parent substrate 10 to the table 120, preferably when the parent substrate 10 is cut into a unit substrate It should be formed sufficiently to firmly fix the unit substrate of the table 120.

In addition, the table 120 may include a rotation driver (not shown) for rotating on the XY plane. Although not shown in the drawing, the rotation driving unit is a means for rotating the table 120 forward or backward by 90 ° on the XY plane. For example, a motor driving method may be applied.

The X-axis driving unit 130 is a means for moving the table 120 in the X-axis direction on the surface plate 110, and a pair of first guide rails 131 elongated in the X-axis direction on the surface plate 110. ) And a plurality of X-axis moving blocks 133 installed on the first guide rail 131 and supporting the table 120. As the movement method of the X-axis moving block 133, various methods of moving in the X-axis direction along the first guide rail 131 may be applied, for example, a linear driving method, a ball screw driving method, a cylinder driving method, and the like. This can be applied.

The Y-axis driver 200 is a means for moving the scribing unit 400 and the braking unit 500 in the Y-axis direction. In this case, the “Y-axis direction” refers to a direction in which the scribing unit 400 and the braking unit 500 are moved in the left and right directions as shown in FIG. 2.

The Y-axis driving unit 200 is a second guide rail 210 is formed long in the Y-axis direction in the upper region of the table 120, and at least one moved in the Y-axis direction from the second guide rail 210 It is preferable to include the above Y-axis moving block 220. At this time, the movement method of the Y-axis moving block 220 may be applied in various ways to move in the Y-axis direction along the second guide rail 210, like the X-axis moving block 133, for example, linear drive Method, ball screw driving method, cylinder driving method and the like can be applied. In the present embodiment, the Y-axis driving unit is illustrated as not driving in the X-axis direction, but the present invention is not limited thereto. It may be provided to drive in the direction of.

The Z-axis driving unit 300 is provided in the Y-axis moving block 220 to move the scribing unit 400 and the braking unit 500 in the Z-axis direction. In this case, "Z-axis direction" refers to a direction in which the scribing unit 400 and the braking unit 500 are moved in the vertical direction as shown in FIG. 2.

The Z-axis driving unit 300 is a third guide rail 310 is formed long in the Z-axis direction in the Y-axis moving block 220, and the Z-axis is moved in the Z-axis direction from the third guide rail 310 It is preferable to include a moving block (320). At this time, the movement method of the Z-axis moving block 320 is applied to various methods of moving in the Z-axis direction along the third guide rail 310 similarly to the X-axis moving block 133 and the Y-axis moving block 220. For example, a linear driving method, a ball screw driving method, a cylinder driving method, or the like may be applied.

The Z-axis driving unit 300 is provided with a plurality is provided with the scribing unit 400 or the braking unit 500, respectively. Preferably, the Z-axis driving unit 300 is provided in even numbers so that the scribing unit 400 and the braking unit 500 are alternately installed. Therefore, when there are ten cutting lines on the mother substrate 10, the scribing unit 400 and the braking unit 500 are positioned at the odd number of cutting lines during the scribing process and the brake process. Work on it. Then, by moving the Y-axis drive unit to place the scribing unit 400 and the braking unit 500 in the even number of cutting schedule line to work on the even number of cutting schedule line Y-axis drive unit 200 between processes It is desirable to minimize the travel distance of.

The scribing unit 400 is a means for forming the scribe lines (11a, 12a) on the mother substrate 10 by pressing the mother substrate 10, the wheel fixing body installed on the Z-axis moving block (320) 410 and the scribe wheel 420 is installed on the wheel fixture 410.

The scribe wheel 420 may be a wheel made of diamond. The edge of the scribe wheel 420 is then sharply provided for the formation of the desired scribe line.

The braking unit 500 is a means for cutting the mother substrate 10 by pressing the mother substrate 10 on which the scribe line is formed on both sides of the scribe line to generate cracks along the scribe line. The roller holder 510 is installed on the 320 and the brake roller 520 is installed on the roller holder 510.

The brake roller 520 preferably has a pair of protrusion wheels 521 corresponding to the breaking groove 123 on an outer circumferential surface thereof. Thus, when the brake roller 520 is lowered in the Z-axis direction, the pair of protrusion wheels 521 respectively press both sides with respect to the scribe line to ensure desirable crack induction of the parent substrate 10. Therefore, the width of the protrusion wheel 521 is preferably smaller than the width of the breaking groove 123. If the width of the protrusion wheel 521 is larger than the width of the breaking groove 123, the mother substrate 10 may not be bent in spite of the pressurization of the brake roller 520, which may cause abnormal cracks in the scribe line. to be.

A method of cutting a substrate using a substrate cutting device according to an embodiment of the present invention configured as described above will be described with reference to the drawings.

6 is an explanatory view showing a substrate cutting method according to an embodiment of the present invention.

As shown in FIG. 6A, the mother substrate 10 having the first substrate 11 and the second substrate 12 bonded to the table 120 is seated. At this time, the mother substrate 10 is fixed to the table 120 by providing suction force through the suction hole 125. In this manner, the scribe process is performed on the first substrate 11 while the first substrate 11 is disposed above and the bottom surface of the second substrate 12 is fixed to the table 120.

At this time, the cutting schedule line is divided into an odd line and an even line. First, the Y-axis moving block 220 is moved to place the scribing unit 400 on the odd line. Thereafter, the Z-axis moving block 320 provided with the scribing unit 400 is lowered to form the first scribe line 11a on the cutting schedule line of the odd lines with the scribe wheel 420. Then, the lowered Z-axis moving block 320 is raised, and then the Y-axis moving block 220 is moved to place the scribe wheel 420 on an even line. Then, the Z-axis moving block 320 provided with the scribing unit 400 is lowered to form the first scribe line 11a on the cutting schedule line of even lines with the scribe wheel 420.

If the first scribe line 11a is formed on all the cutting lines of the first substrate 11 as described above, the scribe wheel 420 is raised as shown in (b), and the Z axis provided with the breaking unit 500 is provided. The moving block 320 is lowered to press both sides of the first scribe line 11a formed on the cutting schedule line of the odd line by the brake roller 520. At this time, since the inversion process of the mother substrate 10 does not occur as in the prior art, the direction in which both sides of the first scribe line 11a are pressed is formed when the first scribe line 11a is formed. The same direction as that in which the pressure is pressed can be advanced, whereby occurrence of abnormal cracks on the first substrate 11 can be prevented.

When both sides of the first scribe line 11a are pressed by the brake roller 520, the protrusion wheel 521 of the brake roller 520 presses the first substrate 11 while the first scribe of the first substrate 11 is performed. The point at which the line 11a is formed is supported by the cutting line support 121 of the table 120 to serve as a pedestal, and both sides thereof are bent, and the first crack 11b along the first scribe line 11a of the odd line is bent. ) Is generated. Then, the lowered brake roller 520 is raised, and then the Y-axis moving block 220 is moved to place the brake roller 520 on an even line. Then, the brake roller 520 is lowered again to generate a first crack 11b on the first substrate 11 along the first scribe line 11a of even lines, thereby cutting the first substrate 11.

When the cutting of the first substrate 11 is completed in this way, as shown in (C), the parent substrate 10 is inverted by 180 ° so that the second substrate 12 is disposed on the upper portion, and the first substrate 11 is disposed. The lower surface of the table 120 is fixed. Thus, since the mother substrate 10 is inverted in the state in which the cutting of the first substrate 11 is completed, the abnormality of the mother substrate 10 is higher than that of the conventional method of inverting the mother substrate 10 in the state where only the first scribe line is formed. Cracks can be prevented.

Then, as shown in (d), the scribe wheel 420 is lowered to form the second scribe line 12a on the second substrate 12. Of course, in this case as well, the scribing process is performed by dividing the odd lines and the even lines as in the scribing process of the first substrate 11.

Then, if the second scribe line 12a is formed on all the cutting lines of the second substrate 12, the second formed on the second substrate 12 using the brake roller 520 as shown in (e). A second crack 12b is generated along the scribe line 12a to cut the second substrate 12. Of course, in this case as well, the breaking process may be performed by dividing the odd lines and the even lines as in the breaking process of the first substrate 11.

As in the above-described embodiment, the scribing process and the breaking process are not limited to proceeding in two stages by dividing the odd lines and the even lines, and depending on the number of cutting lines to be formed on the mother substrate 10. It will be possible to work with various changes.

Although the invention has been described with reference to the accompanying drawings and the preferred embodiments described above, the invention is not limited thereto, but is defined by the claims that follow. Accordingly, one of ordinary skill in the art may variously modify and modify the present invention without departing from the spirit of the following claims.

1 is an explanatory view showing a substrate cutting method using a scribe wheel in general,

2 is a schematic perspective view showing a substrate cutting apparatus according to an embodiment of the present invention,

3 is a perspective view illustrating main parts of a substrate cutting device according to an embodiment of the present invention;

Figure 4 is a front view of the main portion showing a substrate cutting device according to an embodiment of the present invention,

5a and 5b are a plan view and a cross-sectional view showing a table according to an embodiment of the present invention,

6 is an explanatory view showing a substrate cutting method according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: mother substrate 100: stage unit

120: table 121: cutting line support

123: breaking groove 400: scribing unit

420: scribe wheel 500: breaking unit

520: brake roller 521: projection wheel

Claims (18)

A substrate cutting device for cutting a parent substrate into a plurality of unit substrates, A table on which a mother substrate is seated and a cutting line support part is formed at a position corresponding to a cutting schedule line of the mother substrate on which the mother substrate is seated, and a recessed groove having a groove shape is formed in parallel to both sides of the cutting line support part; Scribing means for forming a scribe line on the mother substrate by pressing a point corresponding to the cutting line support of the table among the upper surfaces of the mother substrate seated on the table; Breaking means for cutting the parent substrate by pressing a point corresponding to the breaking groove of the table of the upper surface of the parent substrate seated on the table. The method according to claim 1, wherein the scribing means And a scribe wheel for driving up and down to form a scribe line on the mother substrate. The method according to claim 2, Width of the cutting line support portion substrate cutting apparatus is formed to be equal to or wider than the width of the scribe wheel. The method according to claim 1, wherein the braking means And a brake roller for driving up and down to press both side portions of the scribe line formed on the mother substrate to cut the mother substrate. The method according to claim 4, And a pair of protrusion wheels corresponding to the breaking groove are formed on an outer circumferential surface of the brake roller. The method according to claim 5, And a width of the protrusion wheel is smaller than a width of the breaking groove. A substrate cutting device for cutting a parent substrate into a plurality of unit substrates, A stage unit on which the mother substrate is mounted; A Y-axis driving unit provided on the stage unit and moving in the Y-axis direction; At least two Z-axis driving units provided in the Y-axis driving unit and moving in a Z-axis direction; A scribing unit installed in at least one of the Z-axis driving units to form a scribe line on the mother substrate; A breaking unit installed on at least one of the Z-axis driving units to cut a mother substrate on which a scribe line is formed by the scribing unit, At least one of the stage unit or the Y-axis drive unit is moved in the X-axis direction. The method of claim 7, wherein the stage unit A table on which the mother substrate is seated; And an X-axis driving unit for moving the table in the X-axis direction. The method of claim 8, wherein the stage unit And a rotation driver for rotating the table on the XY plane. The method according to claim 8 or 9, Cutting line support is formed on the upper surface of the table corresponding to the line on which the parent substrate is cut, the substrate cutting device is formed in the groove-shaped breaking groove side by side on both sides of the cutting line support. The method of claim 7, wherein the scribe unit A scribe wheel for forming a scribe line on the mother substrate; And a wheel holder for fixing the scribe wheel to the Z-axis driving unit. The method of claim 7, wherein the breaking unit A brake roller which presses both sides of the scribe line formed on the mother substrate to cut the mother substrate; And a roller holder for fixing the brake roller to the Z-axis driving unit. The method according to claim 12, And a pair of protrusion wheels corresponding to the breaking groove are formed on an outer circumferential surface of the brake roller. The method of claim 7, And the scribe unit and the breaking unit are alternately disposed in the plurality of Z-axis driving units. A substrate cutting method of cutting a parent substrate bonded to a first substrate and a second substrate into a plurality of unit substrates, Mounting a parent substrate on the table such that the first substrate is disposed thereon; Forming a scribe line on the first substrate; Pressing both sides of the scribe line formed on the first substrate to cut the first substrate along the scribe line; Inverting the parent substrate to be seated on the table such that the second substrate is disposed thereon; Forming a scribe line on the second substrate; Pressing both sides of the scribe line formed on the second substrate to cut the second substrate along the scribe line. 16. The method of claim 15, Cutting the first substrate and cutting the second substrate, The direction of pressing both sides of the scribe line is the same direction as the direction of pressing the parent substrate when forming the scribe line substrate cutting method. The method according to claim 15 or 16, Forming a scribe line on the first substrate and forming a scribe line on the second substrate, The table is provided with a cutting line support at a position corresponding to the line on which the seated parent substrate is cut. And a lower portion of the parent substrate is supported at the cutting line support of the table. The method according to claim 17, Cutting the first substrate and cutting the second substrate, The table is provided with a groove-shaped breaking groove side by side on both sides of the cutting line support, And cutting the first substrate and the second substrate by pressing a point corresponding to the breaking groove in the upper surfaces of the first substrate and the second substrate.

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