JPS6368397A - Breaker for substrate - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a circuit board breaking device, and particularly to a circuit board breaking device for breaking a ceramic board such as a thermal head in which a large number of heating resistors are arranged in a row. This relates to dividing the image along the lines with high precision.

[Conventional technology]

As a method of dividing a substrate made of ceramic or the like provided with dividing grooves along the grooves, for example, Japanese Patent Application Laid-Open No. 50-6076
As proposed in 6, for a flat support, an elastic body is placed on a stand, and the dividing groove is brought into contact with the back surface of the elastic body, and the elastic body is placed on the back side of the dividing groove. There was a method to break the board by touching the edge of the board cutter.

However, recently developed A4 size (240 mm) to A3 size (29
'7mm) and the longer break lengths of ceramics, etc. are noticeable, and in the breaking method in the IC manufacturing process as proposed in the above-mentioned Japanese Patent Application Laid-Open No. 50-60'766,
Rather than using a breaking method that provides high precision and high yield, breaking was usually done manually.

To break by hand, bring your fingertips as close as possible to the dividing groove at the edge of a ceramic substrate, and apply pressure to your fingertips to break it at the dividing groove.

It was designed to be divided into pieces in the same way as glass is broken after being processed with a glass cutter.

[Problem that the invention seeks to solve]

In the conventional manual breaking method, it is necessary to apply force with the fingertips near the dividing grooves to break the glass after processing with a glass cutter, which not only limits the number of pieces that can be done but also requires a lot of skill. There was a problem in that it required a lot of work and was not suitable for mass production.

In addition, thermal heads are becoming larger and larger, thermal heads are increasing in resolution, or thermal heads are designed to have higher functionality (higher cost) by mounting drive IO, diode chips, etc. on the board. Breaking work is a work that is located after dozens of work steps, and mistakes in the breaking work (defective products) are the cause of great losses. This invention solves the above problems. This was developed in the 9th edition, and it is possible to reliably divide even a long board along the dividing groove, and it is also possible to mount drive IC chips, diode chips, etc. on the board even if it is mounted on a thermal head etc. [Means for solving the problem] The breaking device of the board related to this F3AK is made to be line symmetrical with respect to the dividing groove. The pedestal is tilted, and its ridge line is placed above the branch line of the inclined surface of the pedestal so that it can rotate freely about an axis perpendicular to the dividing groove at the longitudinal center of the dividing groove. Engage the board cutter and make contact between the branch line on the inclined surface of the pedestal and the ridge line of the board cutter so that the dividing groove is on the branch line side and sandwich the board to break the board, and after the break, the board cutter digs in. [Function] The method of breaking the board in this invention is to push down the back surface of one dividing groove at the ridgeline of the board cutter so that the dividing groove length and direction are uniform. By bringing the back side of the board into contact with the inclined surface of the pedestal and further pushing down the board cutter, the contact area between the inclined surface of the pedestal and the board comes close to the branch line of the inclined surface, and the bending deformation area span becomes narrower. At the same time, bending stress is concentrated and breaks along the dividing groove, and the downward stroke of the board cutter after the break is restricted, thereby eliminating chipping of the board edge.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is a pedestal, which has 7-shaped inclined surfaces (b) and (a), and a linear branch line (la). A sheet (lxa)* (12a) made of an elastic material is attached to the inclined surfaces αη, a2, and a dividing groove (2a) provided on the back surface of the thermal head substrate (2)
) are provided above the branch line (1a).

A plurality of heating resistors (2c) (see Figure 2) are arranged on the surface of the thermal head board (2), and a drive IC is arranged on the surface of the thermal head board (2).
Chip (2b) is installed. (3) is a board cutter, one end of which protrudes into a V-shape, is finished to a predetermined radius, and has a fine ridge line (3a) at the center in the length direction.
A hole (3b) perpendicular to a> is provided. (to) is a guide bin, which is located along the ridge line (3a) of the board cutter (3).
0 (4) is a support shaft that slides and guides the substrate cutter (
3) is rotatably engaged with the hole (3b) of the support shaft (4).
) is installed on the arm block (5)] (6) is a double-axis air cylinder, and the arm block (5) is installed on the lower end.
), and engage screw # (7) at the top end. (8) is a nut, which is threadedly engaged with the threaded rod (7).

Next, we will explain the operation of the board breaking device in such a configuration.0 First, while the thermal head board (2) is brought into contact with the positioning bin C1, 1b>e (no) of the pedestal (1), The branch line (
A dividing m (2a) on the back side of the thermal head substrate (2) is placed above the thermal head substrate (2). Stitched arm block (5)
When the board cutter (3) is operated in the direction of the arrow A by the air cylinders (6) on both axes, its ridge (3a) is guided by the guide pin (toward), and the ridge (3a) is connected to the branch g (
descend from above la), then the ridgeline (3a)
is applied to the opposite surface of the dividing groove (2a), that is, the surface of the thermal head substrate (2), and the branch line (1a), dividing groove (2a), and ridge line (3a) can be set on the same line. 0 When the arm block (5) is further actuated in the direction of arrow A, the thermal head board (2) starts to curve as shown in Fig. 2, and the ridge line (3&) on the surface of the thermal head board (2)
The abutting part is compressed, and the back surface with the dividing # (mu) is pulled, generating so-called bending stress. This bending stress is applied via the companion board cutter (3) that rotatably engages with the support shaft, so it is uniform at the contact area between the ridge line (3a) and the thermal head board. . Note that the deformation range span in this state is 1.

When the arm block is further actuated in the direction of the arrow A, the deformation range span moves to 11 as shown in Figure 3, and due to the notch effect of the dividing groove (2a), the dividing groove (2a)
Bending stress suddenly concentrates at the bottom of the dividing groove (2!L).
) A crack occurs from the bottom of the thermal head substrate (2) in the thickness direction of the thermal head substrate (2), and the thermal head substrate (2) is broken.

Furthermore, the arm block (5) is connected to the air cylinder (6) on both axes.
) in the direction of arrow A, the nut (8) that engages with the threaded shaft (7) attached to the other end of the air cylinder (6) on both shafts will be attached to the air cylinder (6) on both shafts, and the arm Block (5) and substrate cutter (3) stop moving in the direction of arrow A.

In addition, although the above example shows a break using a substrate cutter (31) having continuous edges, a so-called partial cutter shape in which the edges are discontinuous as shown in FIG. 5 has the same effect.

It goes without saying that the present invention can also be applied to a line-type thermal head board in which heat generating resistors are arranged in a row, or to an engineered C board.

Furthermore, by changing the position of the positioning bin (it may be made movable), it is of course possible to break substrates of different shapes.

〔Effect of the invention〕

As mentioned above, according to this plan, the pedestal is configured on an inclined surface, so the deformation area span decreases depending on the amount of descent of the board cutter, and the bending stress is not only concentrated, but also due to the splitting groove. In addition to further enhancing the notching effect, the board cutter has a rotatable pin support structure, which generates uniform bending stress over the entire breaking range, allowing for accurate board breaks along the dividing groove even for long and large objects. Furthermore, by regulating the amount of descent of the substrate cutter after breaking, it is possible to obtain a break without chipping the substrate due to excessive biting of the substrate cutter.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view showing a substrate breaking device according to an embodiment of the present invention, Fig. 2 is an enlarged side view showing the contact state of the substrate cutter and the thermal head, and Fig. 3 is the thermal head on the verge of breaking the substrate. FIG. 4 is an enlarged side view showing the state of the substrate cutter and thermal head substrate after breaking, and FIG. 5 is a perspective view of the substrate cutter in another embodiment of the present invention. In the figure, (1)...The receiver is the stand, (3A)...The branch line, (1m), (2) The inclined surface, (2)...Thermal head board, (2a)...For the division Groove, (3)...Substrate cutter, (3a)...Ridge line, (4)...Support shaft, (
5)...Arm block, (6)...Double shaft air cylinder. (7)...Threaded rod, (8)...Nut. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] In a breaking device for a substrate in which a dividing groove is provided in advance to be divided into a plurality of substrates, the substrate is placed and a V-shaped two
It has a pedestal having two inclined surfaces, and a ridge line arranged above and opposite to a branch line formed by the two inclined surfaces, and the branch line is located at the center in the longitudinal direction of the branch line. A substrate cutter rotatably engaged with an axis perpendicular to the line is provided, and by pressing down the substrate cutter, bending stress is concentrated in the dividing groove of the substrate, dividing the substrate,
A breaking device for a substrate, characterized in that it has a mechanism for regulating the descending stroke of the substrate cutter described above after dividing.