JP2585916B2 - Snap line forming device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a snap line forming apparatus used to provide break lines on a ceramic wiring board including a plurality of board patterns.

[0002]

2. Description of the Related Art Usually, a ceramic wiring substrate is formed by repeatedly printing and firing a plurality of identical wiring patterns on a single substrate at the same time because the size of each substrate is small. Therefore, a snap line for dividing (breaking) the same plurality of substrate patterns separately is formed,
It is general to break on each ceramic wiring board along the snap line to obtain a ceramic wiring board as a final product.

[0003] The snap lines can be handled together without breaking each other during normal handling, and must be easily and accurately split at breaks. Therefore, conventionally, as a processing method for obtaining this snap line, a knife cutting method in which a snap line is formed on a substrate before firing with a knife, and a snapping method in which small holes are continuously formed by laser on a substrate after firing. A laser scribe method for obtaining a line has been used.

[0004]

However, in the above-mentioned knife cutting method, since processing can be performed only before the substrate is fired, there is a problem in dimensional accuracy after a break due to a variation in shrinkage during firing, and a break level is not sufficient. There was also a problem of stability. Also, in the laser scribing method described above, it is difficult to set laser irradiation conditions due to the material of the substrate, and depending on the conditions, it is not always possible to break at a portion that has become a small hole due to melting, so that high dimensional accuracy cannot be achieved, and burrs cannot be achieved. This has caused a problem that the break cannot be made depending on the substrate material. Further, there is another problem that impurities melted and scattered by the laser scribing process adhere to the pattern near the snap line and cause deterioration of characteristics.

An object of the present invention is to solve the above-mentioned problems,
An object of the present invention is to provide a snap line forming apparatus that can easily and accurately form a snap line on a ceramic wiring substrate.

[0006]

According to the present invention, there is provided a snap line forming apparatus comprising: (a) a base; and (b) provided on the base.
A table for mounting a sample, which is movable in the y direction and the θ direction by the first y-direction drive device and the first θ-direction drive device; and (c) a table provided on the base, A first and a second imaging device having separate illumination means for imaging and positioning the sample on the table, each of which is movable in the x direction by the and the second x-direction driving device; d) A cutter provided on the base and provided with a sintered diamond rolling cutter for cutting a sample, the cutter being movable in the x-direction and the z-direction by a third x-direction driving device and a first z-direction driving device. Head and
(e) different position controllers for controlling the first y-direction drive, the first to third x-direction drive, the first z-direction drive and the first θ-direction drive; 1st and 2nd
An image processing unit having separate CRTs for calculating and controlling the movement distances of the table in the y direction and the θ direction from the output of the imaging device, and scribe data storage for reading and rewriting scribe data stored in advance , A central control unit including a keyboard for inputting data and a CRT for displaying data.

[0007]

In the above configuration, since the snap line is formed on the fired substrate by wire processing using a sintered diamond rolling cutter, the snap line can be processed even on a hard substrate fired. In addition, the influence of shrinkage variation during substrate baking as in the conventional knife-cut method can be eliminated, and the scattering of impurities and the occurrence of burrs on the broken end surface as in the conventional laser scribe method can be eliminated. In addition, since the position of the rolling cutter made of sintered diamond with respect to the substrate is controlled using the positioning device utilizing image processing, the positioning of the rolling cutter with respect to the substrate can be performed more accurately.

[0008]

FIG. 1 is a diagram for explaining an example of a snap line in a ceramic wiring substrate to which the present invention is applied. FIG. 1 shows an example in which six ceramic wiring boards 1 having the same wiring pattern are formed on the same substrate at the same time. In FIG. 1, snap lines 2 for breaking each of the six ceramic wiring boards 1 are provided.
Are formed on the surface of the substrate as a continuous line in a range of several tens μm so that each ceramic wiring substrate 1 can be broken into the same size. Further, at least two or more positioning through holes 3 used for mounting the ceramic wiring board 1 on a rolling cutter device (not shown) are formed in the outer peripheral portion of the snap line 2. These through holes 3 can be used as a reference for positioning the snap line 2 when the snap line 2 is formed using image processing. In addition, these through holes 3
In addition, a recognition mark or the like formed by printing or the like can be used as a reference for positioning.

FIG. 2 is a view for explaining the concept of the snap line forming apparatus of the present invention. In the example shown in FIG. 2, the y-direction driving device 11 and θ
A table 14 on which the sample 13 is placed, which is movable in the y direction and the θ direction in the figure by the direction driving device 12, is provided. Also, two x-direction driving devices 15,
16, two imaging devices 17 and 18 are provided so as to be movable in the x direction, respectively, and are configured to image the sample 13 on the table 14. Each of the imaging devices 17 and 18 is provided with separate illumination means 19 and 20, respectively. Further, a cutter head 23 having a sintered diamond rolling cutter 24 is provided on the base so as to be movable in the x direction and the z direction by an x direction driving device 21 and a z direction driving device 22.

In the present invention, the five position control units 30
35, an image processing unit 36, a scribe data storage unit 37, a keyboard 38, and a CRT 39. The position control units 30 to 35 respectively include the y-direction driving device 11 and the x-direction driving device 1 described above.
The positions of the 5, 16, 21, the z-direction drive device 22 and the θ-direction drive device 12 are relatively controlled. Image processing unit 3
Reference numeral 6 has two CRTs 41 and 42 for displaying outputs from the imaging devices 17 and 18, and calculates and controls the moving distance of the table 14 in the y direction and the θ direction based on these outputs. The scribe data storage unit 37 controls reading and rewriting of scribe data stored in advance. The keyboard 38 inputs data, and the CRT 39 outputs data.

FIGS. 3 to 5 are a plan view, a front view and a side view, respectively, showing a specific configuration of an example of the snap line forming apparatus of the present invention. 3 to 5, the same members as those described in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted. In the device having the above-described configuration, on the base 43,
Based on the position of the through hole 3 of the ceramic wiring board 1 as a sample placed on the table 14, the image processing unit 36 calculates the moving distance of the table 14 in the y direction and the θ direction, and The ceramic wiring board 1 is moved to that position by the .theta. In this state, the x-direction driving devices 21 and z
The directional drive device 22 pushes the rolling cutter 24 in the cutter head by a predetermined amount into the ceramic wiring substrate 1 and moves it in the x direction, thereby forming the snap line 2 on the ceramic wiring substrate 1. FIGS. 6A and 6B are a front view and a side view showing a state in which the sintered diamond rolling cutter 24 is in contact with the ceramic wiring board 1. As shown in FIGS. 6A and 6B, a sintered diamond rolling cutter 24 is rotatably mounted on a cutter head 23.

In the present invention, the conditions of the scribe processing for forming the snap line include a cutting speed, a pushing amount,
It is defined by the cutting pressure and the cutting edge angle of the rolling cutter. Among these processing conditions, the optimum value of the blade edge angle differs depending on the thickness of the substrate to be processed.
For a substrate of about 1.0 mm, a blade angle of 130 degrees is optimal. For a substrate having a small thickness (about 0.1 to 0.5 mm), a rolling cutter having a small edge angle (about 100 to 120 degrees) is used, and conversely, for a substrate having a large thickness (1.5 to 2 mm). (Approximately 1.0 mm), it is preferable to use a rolling cutter having a large edge angle (approximately 140 to 150 degrees). If you use a rolling cutter whose cutting edge angle is not suitable for the plate thickness, breakability after processing will be poor, or problems such as chipping and cracking will likely occur on the substrate surface along the scribe line. Become. The cutting speed and the amount of indentation do not affect the breakability after processing, and the cutting speed is 200 to 3
The speed of 00 mm / sec and the pushing amount are 0.06 ~
Work under conditions of 0.12 mm. Also, although the pushing amount does not affect the breakability, the variation in the breaking strength increases as the pushing amount increases. The cutting pressure has the greatest influence on the breakability and the break strength, and it is necessary to apply a pressure at an air pressure of 1.2 to 2.0 kg / cm ² . By appropriately setting the above-mentioned conditions, a stable break property can be obtained.

Specifically, when the thickness of the wiring board made of glass ceramic is 0.635 mm, the cutting speed is 2
Processing may be performed under the conditions of 50 mm / sec, a pushing amount: 0.08 mm, and a cutting pressure: 1.5 kg / cm ² . When snap lines were actually formed under these conditions, the break strength of the low-temperature fired substrate was 2.5 to 4.0 kg / m.
m ² , whereas the conventional laser scribe method was 1.0 kg / mm ² or less, confirming the effectiveness of the method according to the present invention. In addition, the dimensional accuracy of the board obtained by the method of the present invention after the break is determined by using a recognition mark formed simultaneously with the wiring pattern on the board surface, and
A variation accuracy of 0.06 mm or less was obtained.

The present invention is not limited to the above-described embodiment, but can be variously modified and changed. For example,
In the above-described embodiment, the image processing apparatus is used for positioning the rolling cutter made of sintered diamond, but it goes without saying that the positioning may be performed by other positioning means.

[0015]

As is apparent from the above description, according to the present invention, since the snap line is formed on the fired substrate by wire processing using a sintered diamond rolling cutter, Snap lines can be machined even on hard substrates, eliminating the effects of shrinkage variations during substrate firing as in conventional knife-cut methods, as well as scattering and breakage of impurities as in conventional laser scribe methods. It is possible to eliminate the occurrence of burrs on the end face. In addition, the snap line can be easily and accurately formed on the ceramic wiring board, and the device configuration is relatively simple, so that the maintenance becomes easy.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an example of a snap line in a ceramic wiring substrate to which the present invention is applied.

FIG. 2 is a diagram for explaining the concept of the snap line forming device of the present invention.

FIG. 3 is a plan view showing a specific configuration of an example of the snap line forming apparatus of the present invention.

FIG. 4 is a front view showing a specific configuration of an example of the snap line forming apparatus of the present invention.

FIG. 5 is a side view showing a specific configuration of an example of the snap line forming apparatus of the present invention.

6A and 6B are a front view and a side view showing a state in which a sintered diamond rolling cutter abuts on a ceramic wiring board.

[Description of Signs] 1 Ceramic wiring board 2 Snap line 3 Positioning through hole 13 Sample
14 Table 17, 18 Imaging device 23 Cutter head 40 Central control unit 43 Base

Claims (1)

(57) [Claims] (A) a base; and (b) provided on the base and movable in the y-direction and the θ-direction by a first y-direction driving device and a first θ-direction driving device. A table for mounting a sample, and (c) provided on the base, by the first and second x-direction driving devices, each of which is movable in the x direction, and images the sample on the table. First and second imaging devices each having a separate illumination means for positioning; and (d) a third x-direction driving device and a first z-direction driving device provided on the base. a cutter head provided with a sintered diamond rolling cutter for cutting a sample, which is movable in the x-direction and the z-direction; (e) the first y-direction driving device, the first to third x-direction driving devices, Separate position controls for controlling the z-direction drive and the first θ-direction drive And parts, the first and second
An image processing unit having separate CRTs for calculating and controlling the moving distances of the table in the y-direction and the θ-direction from the output of the imaging device; And a central control unit including a keyboard for inputting data and a CRT for displaying data.