JP2580361B2 - Board cutting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] Regarding a method for cutting the outer shape of a ceramic substrate, the purpose is to simplify the procedure and shorten the cutting time, and recognizes the alignment marks of the ceramic substrate set on a table of a slicing machine. Then, after rotating the table to direct the direction of the cutting line of the ceramic substrate to the cutting wheel or the feeding direction of the table, the cutting wheel is moved to the cutting position to cut, and the outer shape cutting method of the ceramic substrate is recognized. The direction of the ceramic substrate and the position of the center of gravity are determined only once based on the alignment mark, and thereafter, the table is rotated based on the recognized alignment mark to change the direction of the cutting line of the ceramic substrate to the cutting wheel or the feed direction of the table. After turning, cutting wheel Is moved to the cutting position with reference to the center of gravity of the ceramic substrate to perform cutting.

[Industrial applications]

 The present invention relates to a method for cutting an outer shape of a ceramic substrate.

[Conventional technology]

In the conventional method for cutting the outer shape of a ceramic substrate, for example, as shown in FIG. 3, after the ceramic substrate is set on a table of a slicing machine (S101), among the alignment marks provided at the four corners of the ceramic substrate, The camera recognizes two alignment marks aligned in the feed direction of the cutting wheel with the camera (S102), and rotates the table with reference to both of the recognized alignment marks (S103), thereby determining the direction of the cutting line of the ceramic substrate with the cutting wheel. In the feed direction. Thereafter, the cutting wheel is moved to the cutting position by moving the cutting wheel in a direction perpendicular to the feed direction with reference to the two recognized alignment marks (S104). Is cut off at the first side (S105). After cutting the first side, the table is rotated 180 ° (S106), and the cutting wheel is moved in the direction perpendicular to the feed direction to move the cutting wheel to the position of the cutting line opposite to the cut side (S106). (S107), the cutting wheel is moved in the feed direction, and the ceramic substrate is cut along this cutting line (S108). After cutting the two sides facing each other in this manner, the table is rotated by 90 ° (S109), and two alignment marks aligned in the feed direction of the cutting wheel are recognized again by the camera (S110). Are sequentially cut (S110 to S116).

After cutting the first side, the table can be rotated 90 ° at a time, and the remaining three sides can be cut in sequence. In this case, every time the table is rotated 90 °, two alignment marks are used. Then, the table is rotated as necessary to correct the direction of the ceramic substrate, and then the position of the cutting wheel is adjusted to the position of the cutting line.

[Problems to be solved by the invention]

Therefore, in the conventional ceramic substrate outer shape cutting method, recognition of a total of four alignment marks is repeated twice for one ceramic substrate set on the table in the conventional example shown in FIG. Further, in the conventional method in which the first side is cut and then the table is rotated by 90 ° and the remaining three sides are sequentially cut, recognition of alignment marks of a total of eight points is repeated four times, which makes the procedure complicated. And the work time tends to be longer.

The present invention has been made in view of the above circumstances,
An object of the present invention is to provide a method for cutting the outer shape of a ceramic substrate, which can cut the outer shape of the ceramic substrate in a short time with a simple procedure.

[Means for solving the problem]

The present invention is carried out using a slicing machine 1 as shown in FIG. 2, for example, and recognizes an alignment mark 4 of a ceramic substrate 3 set on a table 2 of the slicing machine 1 and rotates the table 2 to thereby form a ceramic. In order to achieve the above object, assuming that the cutting line of the substrate 3 is oriented in the feed direction of the cutting wheel 5 and then the cutting wheel 5 is moved to a cutting position and cut, the outer shape of the ceramic substrate is cut. The following measures have been taken.

That is, the direction and the position of the center of gravity of the ceramic substrate 3 are determined only once based on the recognized alignment mark 4, and the direction of the cutting line of the ceramic substrate 3 is cut by rotating the table 2 based on the recognized alignment mark 4. Means is taken to repeat the procedure of moving the cutting wheel 5 to the cutting position with the center of gravity of the ceramic substrate 3 as a reference in the feed direction of the wheel 5 and cutting.

[Action]

In the present invention, the direction and the center of gravity of each cutting line of the ceramic substrate 3 can be obtained by recognizing the alignment mark. The distance from the position of the center of gravity to each cutting line can be easily obtained by calculation.

〔Example〕

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

 FIG. 2 is a plan view of the slicing machine.

The slicing machine 1 includes a table 2 provided on the upper side of a bed 6 so as to be horizontally movable in the left-right direction (horizontal direction in the drawing) and rotatable horizontally, and a column 7 provided on the side of the bed 6. Column 7 front-back direction (vertical direction in the figure)
A slide frame 8 movably supported on the slide frame 8;
The head 9 is supported so as to be able to move up and down, a cutting wheel 5 supported by the head 9, and two cameras 10. The two cameras 10 are arranged on the left side of the cutting wheel 5 at an appropriate interval in the left-right direction.

The ceramic substrate 3 is provided with alignment marks 4 at the four corners inside the four cutting lines, is adhered to the upper surface of, for example, a glass base plate 11, and is then placed on the table 2 and, for example, is vacuum-adsorbed. Is set on the table 2 by fixing the base plate 11.

As shown in FIG.
After that, the alignment mark 4 on the ceramic substrate 3 is recognized using the camera 10 (S2). When the alignment marks 4 are located at the vertices of a square, the number of the alignment marks 4 to be recognized may be two or more. However, in order to facilitate the calculation of the center of gravity of the ceramic substrate 3, All the positions of the alignment marks 4 at the points are recognized.

Thereafter, the direction and the center of gravity of the ceramic substrate 3 are calculated and obtained from the four positions of the recognized alignment marks 4 (S3). Then, the direction of each cutting line and the distance from the center of gravity are calculated from the calculated center of gravity position and the position of the alignment mark 4. Thereafter, based on the calculation result, the table 2 is rotated so that the direction of the first cutting line of the ceramic substrate 3 is directed to the feed direction of the table 2 (S4), and the cutting wheel 5 is moved back and forth at right angles to the feed direction. The cutting wheel 5 is moved to the position of the cutting line obtained from the position of the center of gravity to position the cutting wheel 5 on an extension of the first cutting line (S5). Thereafter, the table 2 and the ceramic substrate 3 are sent from left to right, and after cutting the first side of the outer shape of the ceramic substrate 3 with the cutting wheel 5 (S6), it is confirmed that the cutting is not the fourth line. (S7), the ceramic substrate 3 is rotated 90 ° (S8), and the process returns to the step of S5, and the step of positioning the cutting wheel 5 on the extension of the next cutting line (S5) is repeated four times. Then, after confirming that the cutting is the fourth line (S7), the program ends (S9).

In this method for cutting the outer shape of the ceramic substrate 3, the direction and the position of the ceramic substrate 3 are calculated only once by recognizing the alignment mark 4 as described above.
The procedure is simpler than the conventional method in which the recognition of the alignment mark 4 and the calculation of the direction and position of the ceramic substrate 3 are repeated twice or more, and the work time can be reduced by omitting these processes.

〔The invention's effect〕

As described above, according to the present invention, the recognition of the alignment mark and the calculation of the direction of the ceramic substrate and the position of the center of gravity are performed in one operation.
Since the number of times is only one, the procedure can be simplified and the working time can be reduced.

[Brief description of the drawings]

FIG. 1 is a flow chart showing a procedure of a method of cutting an outer shape of a ceramic substrate according to one embodiment of the present invention, and FIG. 2 is a plan view of a slicing machine used for carrying out one embodiment of the present invention. FIG. 3 is a flowchart showing a procedure of a conventional method of cutting the outer shape of a ceramic substrate. In the figure, 1 ... slicing machine, 2 ... table, 3 ... ceramic substrate, 4 ... alignment mark, 5 ... cutting wheel.

Claims (1)

(57) [Claims] An alignment mark (4) of a substrate (3) set on a table (2) of a slicing machine (1) is recognized, and the direction of a cutting line of the substrate (3) is rotated by rotating the table (2). In the method of cutting the outer shape of the substrate, in which the cutting wheel (5) is directed in the feed direction of the cutting wheel (5) or the table (2), and then the cutting wheel (5) is moved to the cutting position, based on the recognized alignment mark (4). Then, the direction of the cutting line and the position of the center of gravity of the substrate (3) are calculated, and then the table is rotated based on the recognized alignment mark (4) to change the direction of the cutting line of the substrate (3) with the cutting wheel ( 5) Or the procedure for moving the cutting wheel (5) to the cutting position with reference to the center of gravity of the substrate (3) in the feed direction of the table (2). A method of cutting the outer shape of a substrate, which is repeated.