JP2000323811A - Method and unit for cutting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cutting unit which enables to cut each substrate, on which specified patterns are formed, with high accuracy without decreasing the manufacturing efficiency. SOLUTION: This cutting unit cuts a substrate 34, on which two or more patterns P is formed in rows and columns, along the scanning path for each row and each column, which is determined on the basis of specified cutting dimensions, so that two or more cut pieces respectively containing one pattern P. This unit is equipped with a cutting means 35 which cuts the substrate 34, a recognition means 18 which recognizes the image of the substrate 34 containing patterns P before cutting, an image processing means 19 which processes the recognized image, and a data processing means 20 which finds the position of the external form on the basis of the image processed by the image processing means 19, and determines scanning path position for each row and each column, so that the outer forms of patterns P are positioned to allow almost uniform spaces within the cutting dimensions, on the basis of the distance between the outer form and the tracing path for each row and each column.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting method and apparatus suitable for cutting various substrates such as a fired ceramic substrate, a wafer substrate, and a package substrate.

[0002]

2. Description of the Related Art Conventionally, when cutting a fired ceramic substrate made of mullite, alumina, or the like on which components such as semiconductor integrated circuit elements are mounted, first, a fired ceramic substrate in which a plurality of patterns are formed in a matrix on a plate surface in advance. The substrate is bonded and fixed on a glass plate with an adhesive such as a wax for bonding, and is fixed by vacuum suction on a suction table. Next, the cutting blade is rotated at a high speed, and the suction table is moved relative to the cutting blade in two directions of X and Y orthogonal to each other in a horizontal plane, and is rotated around the central axis of the suction table. It is cut into a desired plurality of cut pieces including each of the patterns.

[0003] As a conventional technique relating to such cutting of a fired ceramic substrate, a technique described in Japanese Patent Application Laid-Open No. 05-162112 is known.

In this prior art, an operator manually recognizes two arbitrary points in the same row or column among a plurality of patterns on the surface of a fired ceramic substrate plate on a suction table, and then operates the camera. The captured image is visually observed on the monitor, the pattern in the two-point visual field and the scanning locus of the cutting blade are positioned on the monitor, and the suction table is rotated so that the cutting blade can move according to the positioned scanning locus. -Cutting is performed by moving.

[0005]

The above prior art has the following problems.

That is, the fired ceramic substrate shrinks during sintering, and the degree of shrinkage increases particularly at the outermost periphery of the substrate, which is less constrained. Therefore, when a pattern is formed in advance on the substrate surface, the pattern itself often curves after sintering. For this reason, when the positioning is performed in the two-point visual field, a deviation occurs between the scanning locus and the pattern due to a difference in the recognition position due to a difference in the skill of the operator. , The pattern is cut,
There has been a problem that the pattern is unbalanced in the cut piece after cutting, resulting in poor accuracy.

As a countermeasure against such a problem, it is conceivable that an operator manually scans a scanning locus repeatedly on a pattern recognized in the monitor to confirm the position of the pattern and cut the pattern by a manual operation. In addition, there is a problem that manufacturing efficiency (throughput) is significantly reduced.

Accordingly, an object of the present invention is to provide a substrate cutting method and apparatus capable of cutting a substrate having a predetermined pattern formed on a plate surface with high precision without lowering manufacturing efficiency. It is in.

[0009]

In order to achieve the above-mentioned object, the present invention provides a method of manufacturing a substrate having a plurality of patterns formed in a matrix on a plate surface, by forming each of the rows and the respective rows having a predetermined cutting dimension as an interval. A method of cutting a substrate into a plurality of cut pieces including the respective patterns by a cutting unit in accordance with a scanning trajectory for each row, wherein an image of the substrate including the respective patterns before cutting is recognized at a predetermined recognition position. Means, the outer shape position of each pattern is obtained by an arithmetic processing means based on the recognized image, and based on the distance between the outer shape position and the scanning trajectory for each row and each column, the outermost position within the cutting dimension is determined. The first feature is that the position of the scanning trajectory is determined for each of the rows and columns so that the external positions of the patterns are located substantially equally.

The present invention also relates to a method of cutting a substrate having the first feature, wherein a pair of approximate straight lines for each row and each column based on a plurality of the external positions along the row and the column. , And the inclination of the scanning trajectory based on the inclination of the pair of approximate straight lines is obtained by the arithmetic processing means,
Further, a second feature is that the position of the scanning trajectory is determined so that the sum of squares of the distance difference for each row or column is minimized.

Further, according to the present invention, a substrate formed by forming a plurality of patterns in a matrix on a plate surface is cut in accordance with a scanning locus of each row and each column having a predetermined cutting dimension as an interval. A cutting device for cutting a substrate into a plurality of cutting pieces including a pattern, a cutting unit for cutting the substrate, a recognition unit for recognizing an image of the substrate including each pattern before cutting, and the recognized image Image processing means for performing image processing of; and obtaining an outer shape position based on the processed image processed by the image processing means; further, determining the outer shape position based on a distance between the outer shape position and the scanning trajectory for each row and each column. And a calculation processing means for determining the position of the scanning trajectory for each of the rows and columns so that the outer shape positions of the respective patterns are located substantially evenly.

In the present invention, the outer shape position of a pattern refers to an outer shape position (coordinate) of a pattern on an image coordinate of a plate surface of a substrate including each pattern, which is used in arithmetic processing. It refers to a straight line on the image coordinates having an inclination determined based on the external position of the pattern.

In the present invention, the substrate to be cut is a baked ceramic substrate (printed substrate) made of an insulating ceramic such as mullite or alumina on which components such as semiconductor integrated circuit elements are mounted, silicon, gallium used for IC, LSI and the like. Includes wafer substrates of various semiconductors such as arsenic, magnetic substrates, piezoelectric substrates, as well as various package (mounting) substrates, and the pattern formed on the board surface of the substrate is
It includes a circuit pattern and a cutting guide line.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the accompanying drawings. Note that the present invention is not limited to this embodiment.

FIGS. 1 and 2 show an embodiment of a substrate cutting apparatus according to the present invention. In the figure,
Reference symbol S indicates a substrate cutting device (hereinafter, also simply referred to as a cutting device).

The cutting device S, for example, as shown in FIG. 3, 3 × plurality of patterns P a (P ₁₁ ,,, P ₃₃₎ to the plate surface
Matrix (X (X ₁ , X ₂ , X ₃ ) rows, Y (Y ₁ , Y ₂ ,
Y ₃ ) Fired ceramic substrate 31 formed in a row) shape
Is cut in accordance with a scanning trajectory of each Y row and each X column at intervals of an index (cut size: I _w × I _D ) to form a plurality of cut pieces including each pattern.

As shown in FIG. 1, the cutting device S comprises a cutting device main body 1 and a control device 2 including a control system for controlling the cutting device main body 1.

As shown in FIG. 2, the cutting device main body 1
Glass plate 3 to which fired ceramic substrate 31 is bonded
Suction table 34 for vacuum-suction fixing 3 (see FIG. 4)
And a cutting blade 35 for cutting the ceramic substrate 31
A cutting motor 24 for rotating and driving the cutting blade 35; and an X for moving the cutting blade 35 in the X, Y, and Z directions and rotating in the θ direction relative to the ceramic substrate 31 on the suction table 34. , Y, Z, and θ-direction relative movement mechanisms 4, 10, 15, and 9, and a base 3 on which these mechanisms are installed
It is composed of

The X-direction relative movement mechanism 4 includes a linear guide 5 fixed to the base 3 in parallel with the X-direction, an X-direction movement base 6 moving on the linear guide 5, and a X-direction movement base 6 along the linear guide 5. And a feed screw 8 for rotating the base 6 in the X direction by rotating around the axis by the servo motor 7.

The θ-direction relative movement mechanism 9 is installed on the X-direction movement base 6 and has a θ-direction rotation motor (not shown). The suction table 34 is provided on the rotation shaft of the motor, and the suction table 34 can be rotated in the θ direction by the motor.

The Y-direction relative movement mechanism 10 includes a linear guide 11 installed in parallel with the Y-direction,
1, a Y-direction moving base 12 that moves on the upper side, a Y-direction moving stepping motor 13 that moves the Y-direction moving base 12 along the linear guide 11, and a Y-direction moving base 12 that is rotated around the axis by the stepping motor 13. A feed screw (not shown) for moving in the Y direction.

A CCD for recognizing the external position of each pattern formed on the substrate at predetermined recognition positions in the X and Y directions is provided at the tip of the Y-axis relative movement mechanism 10.
A camera unit (recognition means) 18 is mounted.

The Z-direction relative movement mechanism 15 includes a Z-axis support mechanism 16 for swingably supporting a cutting mechanism provided with a cutting blade 35 and a cutting motor 24, and a Z-mechanism.
And a stepping motor 17 for Z-direction movement for moving in parallel to the direction. The z-axis support mechanism 16 is installed on the base 12 for Y-direction movement.

The control device 2, as shown in FIG.
An image processing circuit (image processing means) 19 for processing images taken by the D camera unit 18, a CPU (arithmetic processing means) 20 for performing various types of arithmetic processing, and a drive for controlling the driving of each of the motors according to instructions from the CPU 20. A circuit 21 and a keyboard 22 are provided.

Next, a procedure for cutting the ceramic substrate 31 shown in FIG. 3 into cut pieces including the respective patterns P _11, ..., P ₃₃ using the cutting apparatus S will be described with reference to a flowchart shown in FIG. .

First, the operator turns on the power and performs initial setting of the cutting device S (see Step 1 in FIG. 5).

Next, an index corresponding to the board to be cut is input from the keyboard 22 (see Step 2 in FIG. 5). At this time, the thickness of the cutting blade 35 is corrected. In addition, the dimensions, interval and number of patterns, the depth of cut of the work, the amount of relief of the cutting blade 35 in the Z direction, and the scanning interval for positioning a scanning locus to be described later are input. Further, the recognition positions C _A , C _B , C _C , C _D , C _E , C of the outer position of the pattern by the CCD camera unit 18 are recognized.
_{As for F} (see FIG. 6), the value of the recognition position in each matrix of X columns and Y rows, which has been previously obtained by the teaching operation using the workpiece, is input.

In this embodiment, as described later,
A predetermined threshold value is set for the distance between the outer shape position of the pattern and the scanning trajectory, and if the distance between the outer shape position of the pattern and the scanning trajectory is less than this threshold value, the cutting is not performed and the monitor 23 is not executed. An arithmetic processing function for displaying a message to that effect and visually recognizing it by an operator is added, and this threshold value is also input.

Next, as shown in FIG. 4, the operator adheres the fired ceramic substrate 31 to the glass plate 33 using the wax 32, and further attaches the fired ceramic substrate 31 to the X direction, the Y direction and the X line. , Y row and the suction table 3
After being placed on the table 4, it is fixed on the table 34 by vacuum suction.

Next, a program adapted to the ceramic substrate 31 input in the above Step 2 is executed, and the outer shape position of the pattern is automatically obtained (see Step 3 in FIG. 5).

First, based on the data input in S2, the outer shape position of the pattern on the ceramic substrate 31 is sequentially obtained at each recognition position. In the present embodiment, the outer positions of the pattern to be obtained are 36 points. The number of outer shape positions to be obtained is appropriately set according to the number of patterns and the degree of irregular shape.

The outline position of each pattern recognized at each recognition position is, specifically, as shown in FIG.
The spot image photographed by the camera unit 18 is binarized by the image processing circuit 19, and the recognition position coordinates of each direction (X, Y direction in the present embodiment) of the binarized image and the pattern The intersection of the outer shape with the binarized portion is obtained by arithmetic processing.

For example, the outer shape position A is obtained as A (X ₁ , Y ₁ ) from the outer shape of the pattern at the recognition position C _A (X ₁ , Y _A ) and the X coordinate of the recognition position C _A (step 4 in FIG. 5). ).

Next, a procedure for determining a scanning locus for actually cutting the ceramic substrate 31 by the cutting blade 35 will be described. For convenience, in the following description, FIG.
Three patterns aligned in Y ₁ line in the (P _11, P _21,
Although only P ₃₁ ) will be described, the actual arithmetic processing is also performed on other patterns arranged on the Y ₂ , Y ₃ row and X column on the substrate 31.

First, as shown in FIG.
Are the external positions A (X ₁ , Y ₁ ) and B obtained as described above.
(X ₂ , Y ₂ ), C (X ₃ , Y ₃ ), D (X ₁ , Y ₁ ′), E
From (X ₂ , Y ₂ ′) and F (X ₃ , Y ₃ ′), a pair of Y 1 rows is determined based on the three external positions of A, B, C and D, E, F along the Y rows. Approximate lines L ₁ and L ₂ (slope θ ₁ and θ
₂ ) Ask for. Then, の of (θ ₁ + θ ₂ ) is defined as the inclination θ of the scanning locus L.

[0036] Next, CPU 20, in order to make uniform in the index pattern, the scanning locus L of inclination θ which is determined as described above, in the index I _D across the three patterns arranged in Y ₁ line Outer positions A, B,
The arithmetic processing is performed so that C, D, E, and F are located substantially equally.

That is, as shown in the following equation, a predetermined value is set such that the sum of squares of the difference between the corresponding distances (M _xn , m _xn ) of the X column in each pattern or the positive square root of this sum of squares is minimized. The arithmetic processing is performed for each position when the scanning trajectory L is scanned at each scanning interval, and the scanning trajectory is positioned. After the calculation of the ^{_{(M X1 -m X1) 2 +}} (M X2 -m X2) 2 + (M X3 -m X3) 2 positioning of the scanning locus, as error processing, CUP20 the variant is very large At least one distance between the positioned upper and lower scanning trajectories L and each outer shape position is less than a predetermined threshold (in the present embodiment, the threshold is 0.02
mm), or when at least one of the external positions is outside the cutting dimension, the operator is prompted for confirmation by a warning display or a warning sound on the monitor 23, and the setting is performed again to perform automatic positioning. Is performed, or the operator is asked to determine whether to position the scanning trajectory manually (Step 5 in FIG. 5). This error processing can be omitted if the influence of the irregular shape on the cutting dimension can be ignored.

The CPU 20 performs the above-described scanning trajectory calculation processing for all the patterns arranged in the rows Y ₂ and Y ₃ and the columns X ₁ , X ₂ and X _{3 in the} same manner. That is, in the present embodiment, positioning of the scanning trajectory with respect to each row and each column is performed three times in the Y row direction and three times in the X column direction, that is, a total of six times. In this manner, the positioning of the scanning trajectory for each pattern in all rows and columns is automatically performed.

When the positioning of all the scanning trajectories is completed, the CPU 20 controls the driving circuit 21 to move the suction table 34 in the X direction by the servo motor 7, rotate the suction table 34 by the motor, and cut the blade 35 by the stepping motor 13. Is moved in the Y direction, the cutting blade 35 is moved according to each scanning trajectory obtained by the above-described arithmetic processing, and the cutting motor 24 is driven to start cutting the ceramic substrate 31 (FIG. 5 Ste).
p6).

The cutting is, for example, cutting piecewise the cut pieces containing one pattern in the order of _{P 11, P 12 ,,, P 33} .

As described above, according to the substrate cutting apparatus S of the present embodiment and the substrate cutting method using the same,
It is possible to prevent the cutting of each pattern after cutting, and it is also possible to automatically cut a cut piece having a pattern at an unbiased position. Therefore, the positioning of the scanning trajectory and the like can be greatly reduced without being affected by the difference in the skill of the operator, so that a highly accurate cut piece can be efficiently manufactured.

In the above embodiment, the method of cutting the ceramic substrate 31 having nine 3 × 3 patterns has been described as an example. However, the number and shape of the substrate and the patterns formed on the substrate are not limited thereto. It goes without saying that it will not be done.

[0043]

According to the substrate cutting method and the substrate cutting apparatus of the present invention, it is possible to prevent the pattern from being cut after cutting, and to automatically cut a piece having a pattern at an unbiased position. It is possible to cut. Therefore, since the positioning of the scanning trajectory is greatly reduced without being affected by the difference in skill among the operators, it is possible to efficiently manufacture cut pieces with high precision.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a main part and a control system in an embodiment of a substrate cutting apparatus according to the present invention.

FIG. 2 is a perspective view of a cutting device main body in the substrate cutting device of the embodiment.

FIG. 3 is a plan view showing an example of a ceramic substrate used in the substrate cutting method according to the present invention.

FIG. 4 is a schematic perspective view showing a state where the ceramic substrate is fixed to a glass plate and a suction table.

FIG. 5 is a flowchart showing a procedure of a method for cutting a substrate using the cutting apparatus of the embodiment.

FIG. 6 is a schematic diagram for explaining a calculation process of an outer shape position of the pattern based on the image of the recognition position in the embodiment.

FIG. 7 is a schematic diagram for explaining a calculation process of the inclination of the scanning trajectory in the embodiment.

FIG. 8 is a schematic diagram for explaining a calculation process of positioning a scanning trajectory in the embodiment.

[Explanation of symbols]

18: CCD camera unit (recognition means), 2: CPU
(Arithmetic processing means), 31: ceramic substrate (substrate), 3
5: Cutting blade (cutting means), A, B, C, D,
E, F: external position, C _A , C _B , C _C , C _D , C _E , C _F : recognition position, L: scanning locus, I _W , I _D : cutting dimension, P,
_{P 11, P 12, P 13} , P 21, P 22, P 23, P 31, P 32, P
₃₃ : pattern, S: cutting device.

Claims (3)

[Claims] 1. A substrate having a plurality of patterns formed in a matrix on a plate surface is cut by cutting means in accordance with a scanning locus of each row and each column having a predetermined cutting dimension as an interval. A method of cutting a substrate into a plurality of cut pieces, comprising: recognizing an image of the substrate including the respective patterns before cutting by a recognition unit at a predetermined recognition position before cutting, and recognizing each pattern based on the recognized image. The outer shape position is obtained by arithmetic processing means, and based on the distance between the outer shape position and the scanning trajectory for each row and each column, the outer shape positions of the respective patterns are located substantially equally within the cutting dimension. Determining the position of the scanning trajectory for each row and each column. 2. The method for cutting a substrate according to claim 1, wherein the pair of approximate straight lines for each row and each column based on the plurality of outer shape positions along the rows and columns, and the pair of approximate straight lines. The inclination of the scanning trajectory based on the inclination of the approximate straight line is obtained by the arithmetic processing means, and further, the sum of squares of the distance difference for each row or column is minimized.
A method of cutting a substrate, comprising determining a position of the scanning trajectory. 3. A substrate, in which a plurality of patterns are formed in a matrix on a plate surface, is cut in accordance with a scanning locus of each row and each column having a predetermined cutting dimension as an interval, and includes each of the patterns. An apparatus for cutting a substrate into a plurality of cut pieces, comprising: cutting means for cutting the substrate; recognition means for recognizing an image of the substrate including the patterns before cutting; and image processing of the recognized image. Image processing means for performing, and determining the outer shape position based on the processed image processed by the image processing means, and further determining each of the patterns within the cutting dimension based on a distance between the outer shape position and the scanning locus for each row and each column. And an arithmetic processing means for determining the position of the scanning trajectory for each of the rows and columns so that the outer shape position is located substantially evenly.