JPH07275770A - Paste applicator - Google Patents

Paste applicator

Info

Publication number
JPH07275770A
JPH07275770A JP6068730A JP6873094A JPH07275770A JP H07275770 A JPH07275770 A JP H07275770A JP 6068730 A JP6068730 A JP 6068730A JP 6873094 A JP6873094 A JP 6873094A JP H07275770 A JPH07275770 A JP H07275770A
Authority
JP
Japan
Prior art keywords
paste
substrate
cross
pattern
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6068730A
Other languages
Japanese (ja)
Other versions
JP2809588B2 (en
Inventor
Shigeru Ishida
茂 石田
Haruo Sankai
春夫 三階
Fukuo Yoneda
福男 米田
Shozo Igarashi
省三 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP6068730A priority Critical patent/JP2809588B2/en
Priority to KR1019950006830A priority patent/KR0159423B1/en
Publication of JPH07275770A publication Critical patent/JPH07275770A/en
Application granted granted Critical
Publication of JP2809588B2 publication Critical patent/JP2809588B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles

Abstract

PURPOSE:To provide a paste applicator capable of easily confirming the cross section shape and cross section area of a pattern drawn on a substrate successively after the paste pattern is drawn and formed on the substrate, thereby efficiently controlling the quality and largely contributing to the improvement of productivity. CONSTITUTION:This paste applicator is constituted so as to display the cross section shape and cross section area of the pattern on a monitor 16 by measuring the height of the surface of the substrate 7 by an optical range finder 3 after forming the paste pattern and calculating the coating height and width of the drawn pattern by using the measured data.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、テーブル上に載置され
た基板上にノズルからペ−ストを吐出させながら該基板
と該ノズルとを相対的に移動させることにより、該基板
上に所望形状のペーストパターンを塗布描画するペース
ト塗布機に係り、特に、描画形成したペーストパターン
の断面形状や断面積の管理に好適なペースト塗布機に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention allows a desired substrate to be placed on a substrate placed on a table by moving the substrate relative to the nozzle while ejecting the paste from the nozzle. The present invention relates to a paste applicator for applying and drawing a shaped paste pattern, and particularly to a paste applicator suitable for managing the cross-sectional shape and cross-sectional area of a drawn and formed paste pattern.

【0002】[0002]

【従来の技術】ペーストが収納されたペースト収納筒の
先端に固定されたノズルに、テーブル上に載置された基
板を対向させ、ノズルのペースト吐出口からペーストを
吐出させながら該ノズルと該基板の少なくともいずれか
一方を水平方向に移動させて相対位置関係を変化させる
ことにより、基板上に所望のパタ−ンでペ−ストを塗布
する吐出描画技術を用いたペースト塗布機の一例が、例
えば特開平2−52742号公報に記載されている。
2. Description of the Related Art A substrate mounted on a table is opposed to a nozzle fixed to the tip of a paste accommodating cylinder in which a paste is accommodated, and the nozzle and the substrate are ejected while ejecting the paste from a paste ejection port of the nozzle. An example of a paste applicator using a discharge drawing technique for applying a paste in a desired pattern on a substrate by moving at least one of the two in the horizontal direction to change the relative positional relationship, It is described in JP-A-2-52742.

【0003】かかるペースト塗布機は、基板として使用
する絶縁基板上にノズル先端のペースト吐出口から抵抗
ペ−ストを吐出させることにより、この絶縁基板上に所
望の抵抗ペーストパタ−ンを形成していくというもので
ある。
Such a paste applicator forms a desired resistance paste pattern on an insulating substrate used as a substrate by discharging a resistance paste from a paste discharge port at the tip of a nozzle. It is going.

【0004】[0004]

【発明が解決しようとする課題】ところで、上述した従
来のペースト塗布機では、描画形成したペーストパター
ンの断面形状が所望のものであるか否かについては検討
されておらず、断面積のばらつきについても特に問題に
はされていなかった。しかしながら、抵抗ペ−ストパタ
ーンを描画する場合、断面積のばらつきはそのまま抵抗
値のばらつきになるし、また、液晶表示装置のガラス基
板にシ−ル剤を描画する場合、該シール剤の断面形状の
ばらつきはシ−ル不足や表示欠陥等を招来する虞があ
る。
By the way, in the above-mentioned conventional paste applicator, whether or not the cross-sectional shape of the drawn and formed paste pattern is a desired one has not been examined. Was not particularly a problem. However, when the resistance paste pattern is drawn, the variation of the cross-sectional area becomes the variation of the resistance value as it is, and when the sealant is drawn on the glass substrate of the liquid crystal display device, the cross-sectional shape of the sealing agent is drawn. Variations may cause a seal shortage, display defects, and the like.

【0005】それゆえ、本発明の目的は、かかる従来技
術の課題を解消し、基板上に描画形成したペーストパタ
ーンの断面形状や断面積が簡単に確認できて効率的な品
質管理が行えるペースト塗布機を提供することにある。
Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art, and to easily confirm the cross-sectional shape and cross-sectional area of a paste pattern drawn and formed on a substrate and to perform efficient quality control. To provide a machine.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、ノズルのペースト吐出口と対向するよう
に基板をテーブル上に載置し、ペースト収納筒に充填し
たペーストを上記吐出口から上記基板上へ吐出させなが
ら該ノズルと該基板との相対位置関係を変化させ、該基
板上に所望形状のペーストパターンを描画形成するペー
スト塗布機において、上記ノズルのペースト吐出口と上
記基板の表面との対向間隔を計測する計測手段と、この
計測手段と上記基板とを該基板の表面に沿って相対的に
移動させる移動手段と、この相対的移動時における上記
計測手段の計測デ−タを用いて描画済みのペーストパタ
ーンの塗布高さおよび塗布幅を算出する断面捕捉手段と
を備える構成とした。
In order to achieve the above object, according to the present invention, a substrate is placed on a table so as to face a paste discharge port of a nozzle, and the paste filled in a paste storage cylinder is discharged. In a paste applicator that changes the relative positional relationship between the nozzle and the substrate while ejecting onto the substrate from an outlet to draw and form a paste pattern of a desired shape on the substrate, the paste ejection port of the nozzle and the substrate Measuring means for measuring the facing distance to the surface of the substrate, moving means for relatively moving the measuring means and the substrate along the surface of the substrate, and measuring data of the measuring means during the relative movement. And a cross-section capturing means for calculating a coating height and a coating width of the drawn paste pattern using a printer.

【0007】[0007]

【作用】上記計測手段は、ノズルのペースト吐出口と基
板表面との対向間隔を計測するというものなので、その
計測データからペーストパターン形成時にノズルの高さ
補正などが行えるが、ペーストパターン形成後に該計測
手段の計測データを演算することにより、描画済みパタ
ーンの塗布高さや塗布幅を求めることができる。したが
って、これら塗布高さや塗布幅を設定許容値と比較すれ
ば、描画形成したペーストパターンが許容できるもので
あるか否かが容易に判断できる。また、塗布高さや塗布
幅がわかれば、描画済みパターンの断面形状や断面積も
簡単に求められる。
Since the measuring means measures the facing distance between the paste ejection port of the nozzle and the surface of the substrate, the height of the nozzle can be corrected from the measured data when the paste pattern is formed. By calculating the measurement data of the measuring means, the coating height and the coating width of the drawn pattern can be obtained. Therefore, by comparing these coating heights and coating widths with the set allowable values, it is possible to easily determine whether the drawn and formed paste pattern is acceptable. Further, if the coating height and the coating width are known, the sectional shape and sectional area of the drawn pattern can be easily obtained.

【0008】[0008]

【実施例】以下、本発明の実施例を図面を用いて説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

【0009】図1は本発明によるペ−スト塗布機の一実
施例を示す概略斜視図であって、1はノズル、2はペ−
スト収納筒(またはシリンジ)、3は光学式距離計、4
はZ軸テ−ブル、5はX軸テーブル、6はY軸テーブ
ル、7は基板、8はθ軸テーブル、9は架台部、10は
Z軸テーブル支持部、11aは画像認識カメラ、11b
はこの画像認識カメラ11aの鏡筒、12はノズル支持
具、13は基板7の吸着台、14は制御装置、15a〜
15cはサーボモータ、16はモニタ、17はキーボー
ドである。
FIG. 1 is a schematic perspective view showing an embodiment of a paste coating machine according to the present invention, in which 1 is a nozzle and 2 is a paste.
Stroke storage cylinder (or syringe), 3 is an optical rangefinder, 4
Is a Z-axis table, 5 is an X-axis table, 6 is a Y-axis table, 7 is a substrate, 8 is a θ-axis table, 9 is a mount part, 10 is a Z-axis table support part, 11a is an image recognition camera, 11b.
Is a lens barrel of the image recognition camera 11a, 12 is a nozzle support, 13 is a suction base of the substrate 7, 14 is a control device, and 15a to 15a.
Reference numeral 15c is a servo motor, 16 is a monitor, and 17 is a keyboard.

【0010】同図において、架台部9上にX軸テーブル
5が固定され、このX軸テーブル5上にX軸方向に移動
可能にY軸テーブル6が搭載されている。そして、この
Y軸テーブル6上にY軸方向に移動可能かつ回動可能に
θ軸テーブル8が搭載され、このθ軸テーブル8上に吸
着台13が固定されている。この吸着台13上に、基板
7が、例えばその各辺がX,Y各軸と平行になるよう
に、吸着されて固定される。
In FIG. 1, an X-axis table 5 is fixed on a gantry 9, and a Y-axis table 6 is mounted on the X-axis table 5 so as to be movable in the X-axis direction. The θ-axis table 8 is mounted on the Y-axis table 6 so as to be movable and rotatable in the Y-axis direction, and the suction table 13 is fixed on the θ-axis table 8. The substrate 7 is sucked and fixed onto the suction table 13 so that, for example, each side thereof is parallel to the X and Y axes.

【0011】吸着台13上に搭載された基板7は、制御
装置14の制御駆動により、X,Y各軸方向に移動させ
ることができる。即ち、サーボモータ15bが制御装置
14によって駆動されると、Y軸テーブル6がX軸方向
に移動して基板7がX軸方向へ移動し、サーボモータ1
5cが駆動されると、θ軸テーブル8がY軸方向に移動
して基板7がY軸方向へ移動する。したがって、制御装
置14によりY軸テーブル6とθ軸テーブル8とをそれ
ぞれ任意の距離だけ移動させると、基板7は架台部9に
平行な面内で任意の方向に任意の距離だけ移動すること
になる。なお、θ軸テーブル8は、図4で示すサーボモ
ータ15dにより、その中心位置を中心にθ方向に任意
量だけ回動させることができる。
The substrate 7 mounted on the suction table 13 can be moved in the X and Y axis directions by the control drive of the controller 14. That is, when the servo motor 15b is driven by the controller 14, the Y-axis table 6 moves in the X-axis direction and the substrate 7 moves in the X-axis direction, and the servo motor 1
When 5c is driven, the θ-axis table 8 moves in the Y-axis direction and the substrate 7 moves in the Y-axis direction. Therefore, when the controller 14 moves the Y-axis table 6 and the θ-axis table 8 respectively by arbitrary distances, the substrate 7 moves by an arbitrary distance in an arbitrary direction within a plane parallel to the pedestal portion 9. Become. It should be noted that the θ-axis table 8 can be rotated by an arbitrary amount in the θ direction about its center position by the servo motor 15d shown in FIG.

【0012】また、架台部9上にはZ軸テーブル支持部
10が設置されており、これにZ軸方向(上下方向)に
移動可能にZ軸テーブル4が取り付けられている。そし
て、このZ軸テーブル4には、ノズル1やペースト収納
筒2,光学式距離計3が載置されている。Z軸テーブル
4のZ軸方向の制御駆動も制御装置14によって行なわ
れる。即ち、サーボモータ15aが制御装置14によっ
て駆動されると、Z軸テーブル4がZ軸方向に移動し、
これに伴ってノズル1やペースト収納筒2,光学式距離
計3がZ軸方向に移動する。なお、ノズル1はペースト
収納筒2の先端に設けられているが、ノズル1とペース
ト収納筒2の下端とは連結部を備えたノズル支持具12
を介して僅かに離れている。
A Z-axis table support portion 10 is installed on the pedestal portion 9, and a Z-axis table 4 is attached to the Z-axis table support portion 10 so as to be movable in the Z-axis direction (vertical direction). Then, on the Z-axis table 4, the nozzle 1, the paste container 2, and the optical distance meter 3 are placed. The control device 14 also controls and drives the Z-axis table 4 in the Z-axis direction. That is, when the servomotor 15a is driven by the controller 14, the Z-axis table 4 moves in the Z-axis direction,
Along with this, the nozzle 1, the paste container 2, and the optical range finder 3 move in the Z-axis direction. The nozzle 1 is provided at the tip of the paste storage cylinder 2, but the nozzle 1 and the lower end of the paste storage cylinder 2 are provided with a nozzle support 12 having a connecting portion.
A little farther through.

【0013】光学式距離計3はノズル1の先端(下端)
であるペースト吐出口と基板7の上面との間の距離を、
非接触な三角測法によって測定する。
The optical rangefinder 3 has a tip (lower end) of the nozzle 1.
The distance between the paste discharge port and the upper surface of the substrate 7 is
It is measured by non-contact triangulation.

【0014】即ち、図2に示すように、光学式距離計3
の下端部は三角状に切り込まれており、この切込み部分
に対向する2つの斜面の一方に発光素子が、他方に受光
素子がそれぞれ設けられている。ノズル支持具12はペ
ースト収納筒2の先端に取り付けられて光学式距離計3
の上記切込み部の下方まで延伸しており、その先端部の
下面にノズル1が取り付けられている。光学式距離計3
の上記切込み部に設けられた発光素子は、一点鎖線で示
すようにペースト吐出口の真下近傍を照射し、そこから
の反射光を上記受光素子が受光するようになっている。
そして、ノズル1のペースト吐出口と該吐出口の下方に
配置された基板7(図1参照)との間の距離が所定の範
囲内である場合、発光素子からの光が受光素子に受光さ
れるように、ノズル1と光学式距離計3との位置関係が
設定されていて、ノズル1のペースト吐出口と基板7と
の間の距離が変化すると、該吐出口の真下近傍におい
て、発光素子からの光の基板7上での照射点(以下、こ
れを計測点という)の位置が変化し、よって受光素子で
の受光状態が変化するので、ノズル1のペースト吐出口
と基板7との間の距離を計測することができる。
That is, as shown in FIG. 2, the optical rangefinder 3
Is cut in a triangular shape, and a light emitting element is provided on one of the two slopes facing the cut portion and a light receiving element is provided on the other. The nozzle support 12 is attached to the tip of the paste storage cylinder 2 and is attached to the optical rangefinder 3
The nozzle 1 is attached to the lower surface of the distal end portion of the nozzle 1 extending below the cut portion. Optical distance meter 3
The light emitting element provided in the notch section irradiates the area immediately below the paste ejection port as indicated by the alternate long and short dash line, and the light receiving element receives the reflected light from the area.
When the distance between the paste ejection port of the nozzle 1 and the substrate 7 (see FIG. 1) arranged below the ejection port is within a predetermined range, the light from the light emitting element is received by the light receiving element. As described above, when the positional relationship between the nozzle 1 and the optical distance meter 3 is set, and the distance between the paste ejection port of the nozzle 1 and the substrate 7 changes, the light emitting element is provided immediately below the ejection port. Since the position of the irradiation point (hereinafter referred to as a measurement point) of the light from the substrate on the substrate 7 is changed, and the light receiving state of the light receiving element is changed, the paste discharge port of the nozzle 1 and the substrate 7 are changed. The distance of can be measured.

【0015】後述するように、基板7がX,Y軸方向に
移動してペーストパターンを形成しているとき、発光素
子からの光の基板7上での照射点(以下、これを計測点
という)が既に形成されたペーストパターンを横切る
と、光学式距離計3によるノズル1のペースト吐出口と
基板7の表面との間の距離の計測値にペーストパターン
の厚み分だけの誤差が生ずる。そこで、計測点がペース
トパターンをできるだけ横切らないようにするため、ノ
ズル1から基板7上へのペースト滴下点(以下、これを
塗布点という)からX,Y軸に対して斜め方向にずれた
位置を計測点とすると良い。
As will be described later, when the substrate 7 moves in the X- and Y-axis directions to form a paste pattern, the irradiation point of light from the light emitting element on the substrate 7 (hereinafter referred to as measurement point). ) Crosses the already formed paste pattern, an error due to the thickness of the paste pattern occurs in the measurement value of the distance between the paste discharge port of the nozzle 1 and the surface of the substrate 7 by the optical distance meter 3. Therefore, in order to prevent the measurement point from crossing the paste pattern as much as possible, a position shifted from the paste dropping point (hereinafter referred to as a coating point) from the nozzle 1 onto the substrate 7 in an oblique direction with respect to the X and Y axes. Should be used as the measurement point.

【0016】図3は光学式距離計3の計測範囲MRとノ
ズル1の取付位置との関係を垂直面で表した説明図であ
る。同図に示すように、ノズル1の先端のペースト吐出
口は光学式距離計3の計測範囲MRの中心Cと上限Uと
の間に配置されており、ペーストパターンPPが描画さ
れる基板7が該吐出口よりも下方で計測範囲MRの下限
Lよりも上方に置かれていれば、ノズル1の真下近傍に
おける該基板7の表面の高さ位置を、該ノズル1を基準
にして、光学式距離計3により非接触に計測することが
できる。
FIG. 3 is an explanatory view showing the relationship between the measurement range MR of the optical range finder 3 and the mounting position of the nozzle 1 on a vertical plane. As shown in the figure, the paste discharge port at the tip of the nozzle 1 is arranged between the center C and the upper limit U of the measurement range MR of the optical rangefinder 3, and the substrate 7 on which the paste pattern PP is drawn is If it is placed below the discharge port and above the lower limit L of the measurement range MR, the height position of the surface of the substrate 7 in the vicinity of directly below the nozzle 1 is determined by an optical method using the nozzle 1 as a reference. The distance meter 3 can make non-contact measurement.

【0017】なお、ペースト収納筒2中のペーストが使
い尽くされると、ノズル交換が行われ、塗布点が基板7
上のペーストを塗布しようとするある設定位置と一致す
るようにノズル1が取り付けられるが、ペースト収納筒
2やノズル支持具12,ノズル1の取付け精度のばらつ
きなどにより、ノズル交換の前と後でノズル1の位置が
変わることがある。しかし、図2に示すように、塗布点
が設定位置を中心に予め設定された大きさの許容範囲
(ΔX,ΔY)内にあるとき、ノズル1は正常に取り付
けられているものとする。但し、ΔXは許容範囲のX軸
方向の幅、ΔYは同じくY軸方向の幅である。
When the paste in the paste accommodating cylinder 2 is used up, the nozzle is replaced and the coating point is applied to the substrate 7.
The nozzle 1 is attached so as to match a certain set position where the above paste is to be applied. However, due to variations in the attachment accuracy of the paste storage cylinder 2, the nozzle support 12, and the nozzle 1, etc., before and after nozzle replacement. The position of the nozzle 1 may change. However, as shown in FIG. 2, when the application point is within an allowable range (ΔX, ΔY) of a preset size centered on the set position, the nozzle 1 is assumed to be normally attached. However, ΔX is the width in the X-axis direction of the allowable range, and ΔY is the width in the Y-axis direction.

【0018】制御装置14は、光学式距離計3や画像認
識カメラ11aからデータが供給されると、これに応じ
てサーボモータ15a,15b,15c,やθ軸テーブ
ル回転用のサーボモータ15d(図4参照)を駆動す
る。また、これらのサーボモータに設けたエンコーダか
ら、各モータの駆動状況についてのデータが制御装置1
4にフィードバックされる。
When data is supplied from the optical rangefinder 3 or the image recognition camera 11a, the control device 14 responds to the data by the servomotors 15a, 15b, 15c and the servomotor 15d for rotating the θ-axis table (see FIG. 4)). In addition, encoders provided in these servo motors provide data on the drive status of each motor to the control device 1.
Feedback to 4.

【0019】かかる構成において、方形状をなす基板7
が吸着台13上に置かれると、吸着台13は基板7を真
空吸着して固定保持する。そして、θ軸テーブル8を回
動させることにより、基板7の各辺がX,Y軸それぞれ
に平行となるように設定される。しかる後、光学式距離
計3の測定結果を基にサーボモータ15aが駆動制御さ
れることにより、Z軸テーブル4が下方に移動し、ノズ
ル1のペースト吐出口と基板7の表面との間の距離が規
定の距離になるまで該ノズル1を基板7の上方から下降
させる。
In such a configuration, the rectangular substrate 7
Is placed on the suction table 13, the suction table 13 holds the substrate 7 by vacuum suction. Then, by rotating the θ-axis table 8, the respective sides of the substrate 7 are set to be parallel to the X and Y axes, respectively. Then, the servo motor 15a is driven and controlled based on the measurement result of the optical distance meter 3, so that the Z-axis table 4 moves downward, and the Z-axis table 4 moves downward between the paste discharge port of the nozzle 1 and the surface of the substrate 7. The nozzle 1 is lowered from above the substrate 7 until the distance reaches a specified distance.

【0020】その後、ペースト収納筒2からノズル支持
具12を介して供給されるペーストがノズル1のペース
ト吐出口から基板7上へ吐出され、これとともに、サー
ボモータ15b,15cの駆動制御によってYテーブル
6とθ軸テーブル8が適宜移動し、これによって基板7
上に所望形状のパターンでペーストが塗布される。形成
しようとするペーストパターンはX,Y各軸方向の距離
で換算できるので、所望形状のパターンを形成するため
のデータをキーボード17から入力すると、制御装置1
4は該データをサーボモータ15b,15cに与えるパ
ルス数に変換して命令を出力し、描画が自動的に行われ
る。
After that, the paste supplied from the paste container 2 through the nozzle support 12 is discharged from the paste discharge port of the nozzle 1 onto the substrate 7, and along with this, the Y table is controlled by the drive control of the servomotors 15b and 15c. 6 and the θ-axis table 8 are appropriately moved, whereby the substrate 7 is moved.
The paste is applied on the pattern of the desired shape. Since the paste pattern to be formed can be converted by the distances in the X and Y axis directions, when the data for forming the pattern of the desired shape is input from the keyboard 17, the control device 1
Reference numeral 4 converts the data into the number of pulses given to the servomotors 15b and 15c, outputs a command, and drawing is automatically performed.

【0021】図4は図1における制御装置14の一具体
例を示すブロック図であって、14aはマイクロコンピ
ュータ、14bはモータコントローラ、14caはZ軸
ドライバ、14cbはX軸ドライバ、14ccはY軸ド
ライバ、14cdはθ軸ドライバ、14dは画像処理装
置、14eは外部インターフェース、15dはθ軸テー
ブル回転用のサーボモータ、18は光学式距離計3の測
定結果(距離)をA−D変換する変換器、Eはエンコー
ダであり、図1と対応する部分には同一符号が付してあ
る。
FIG. 4 is a block diagram showing a specific example of the control device 14 in FIG. 1, in which 14a is a microcomputer, 14b is a motor controller, 14ca is a Z-axis driver, 14cb is an X-axis driver, and 14cc is a Y-axis. A driver, 14 cd is a θ-axis driver, 14 d is an image processing device, 14 e is an external interface, 15 d is a servo motor for θ-axis table rotation, and 18 is a conversion for A-D converting the measurement result (distance) of the optical rangefinder 3. A container and E are encoders, and parts corresponding to those in FIG. 1 are denoted by the same reference numerals.

【0022】詳細に説明するに、制御装置14は、処理
プログラムを格納しているROMや各種データを記憶す
るRAMや各種データの演算を行うCPU等を内蔵した
マイクロコンピュータ14aと、各サーボモータ15a
〜15dのモータコントローラ14bと、各サーボモー
タ15a〜15dのドライバ14ca〜14cdと、画
像認識カメラ11aで読み取った画像を処理する画像処
理装置14dと、この画像処理装置14dやキーボード
17やA−D変換器18等が接続される外部インターフ
ェース14eとを備えている。キ−ボ−ド17からのペ
−スト描画パタ−ンやノズル交換などを示すデ−タや、
光学式距離計3で計測したデ−タや、マイクロコンピュ
−タ14aの処理で生成された各種デ−タなどは、マイ
クロコンピュ−タ14aに内蔵されたRAMに格納され
る。
More specifically, the control device 14 includes a microcomputer 14a containing a ROM storing a processing program, a RAM storing various data, a CPU for calculating various data, and each servo motor 15a.
˜15d motor controller 14b, servomotors 15a to 15d drivers 14ca to 14cd, an image processing device 14d that processes an image read by the image recognition camera 11a, the image processing device 14d, the keyboard 17 and the AD. An external interface 14e to which the converter 18 and the like are connected is provided. Data indicating the paste drawing pattern from the keyboard 17 and nozzle replacement,
The data measured by the optical range finder 3 and various data generated by the processing of the microcomputer 14a are stored in the RAM built in the microcomputer 14a.

【0023】次に、ペ−スト塗布動作と塗布描画したペ
−ストパタ−ンの形状判定に際しての制御装置14の処
理動作について説明する。なお、図5以降のフローチャ
ートにおいて、図中の符号Sはステップを意味してい
る。
Next, the paste coating operation and the processing operation of the control unit 14 in determining the shape of the paste pattern drawn by coating will be described. In the flowcharts of FIG. 5 and subsequent figures, the symbol S in the figure means a step.

【0024】図5において、電源が投入されると(ステ
ップ100)、ペースト塗布機の初期設定が実行される
(ステップ200)。この初期設定は、図6に示すよう
に、Y軸テ−ブル6やθ軸テ−ブル8、Z軸テ−ブル4
等を予め決められた原点位置に位置決めし(ステップ2
01)、ペ−ストパタ−ンのデ−タや基板7の位置デ−
タを設定し(ステップ202),ペ−ストの吐出終了位
置デ−タや形状計測デ−タを設定する(ステップ20
3)というものであり、設定のためのデ−タ入力はキ−
ボ−ド17から行われる。なお、ステップ203にて行
われる形状計測デ−タの設定とは、計測箇所の数、各計
測箇所の開始位置と終了位置、各計測箇所での計測点数
(サンプリング数)などを設定することである。また、
こうしてキ−ボ−ド17から入力されたデ−タは、前述
したように、マイクロコンピュ−タ14aに内蔵のRA
Mに格納される。
In FIG. 5, when the power is turned on (step 100), the initial setting of the paste applicator is executed (step 200). This initial setting is, as shown in FIG. 6, a Y-axis table 6, a θ-axis table 8 and a Z-axis table 4.
Etc. at the predetermined origin position (Step 2
01), paste pattern data and substrate 7 position data
Data is set (step 202), and the ejection end position data of the paste and the shape measurement data are set (step 20).
3) and the data input for setting is key.
It starts from the board 17. The setting of the shape measurement data performed in step 203 is performed by setting the number of measurement points, the start and end positions of each measurement point, the number of measurement points (sampling number) at each measurement point, and the like. is there. Also,
The data thus inputted from the keyboard 17 is the RA built in the microcomputer 14a as described above.
Stored in M.

【0025】以上の初期設定処理が終わると、図5にお
いて、ペーストパターンを描画するための基板7を吸着
台13に搭載して吸着保持させ(ステップ300)、基
板予備位置決め処理を行う(ステップ400)。
After the above initial setting process is completed, in FIG. 5, the substrate 7 for drawing the paste pattern is mounted on the suction table 13 and held by suction (step 300), and the substrate preliminary positioning process is performed (step 400). ).

【0026】以下、図7により、このステップ400に
ついて詳細に説明する。
The step 400 will be described in detail below with reference to FIG.

【0027】図7において、まず、吸着台13に搭載さ
れた基板7に予め付されている位置決め用マ−ク(複
数)を画像認識カメラ11aで撮影し(ステップ40
1)、画像認識カメラ11aの視野内での位置決め用マ
−クの重心位置を画像処理で求める(ステップ40
2)。そして、該視野の中心と位置決め用マークの重心
位置とのずれ量を算出し(ステップ403)、このずれ
量を用いて、基板7を所望位置に移動させるために必要
なY軸テ−ブル6およびθ軸テ−ブル8の移動量を算出
する(ステップ404)。そして、算出されたこれら移
動量をサーボモータ15b〜15dの操作量に換算し
(ステップ405)、かかる操作量に応じてサーボモー
タ15b〜15dを駆動することにより、各テーブル
6,8が移動して基板7が所望位置の方へ移動する(ス
テップ406)。
In FIG. 7, first, the positioning marks (plurality) previously attached to the substrate 7 mounted on the suction table 13 are photographed by the image recognition camera 11a (step 40).
1), the barycentric position of the positioning mark in the visual field of the image recognition camera 11a is obtained by image processing (step 40).
2). Then, the amount of deviation between the center of the field of view and the position of the center of gravity of the positioning mark is calculated (step 403), and this amount of deviation is used to move the Y-axis table 6 required to move the substrate 7 to the desired position. And the amount of movement of the θ-axis table 8 is calculated (step 404). Then, these calculated movement amounts are converted into the operation amounts of the servo motors 15b to 15d (step 405), and the servo motors 15b to 15d are driven according to the operation amounts to move the tables 6 and 8. The substrate 7 moves toward the desired position (step 406).

【0028】この移動とともに、再び基板7上の位置決
め用マ−クを画像認識カメラ11aで撮影して、その視
野内での位置決め用マ−クの中心(重心位置)を計測し
(ステップ407)、視野の中心とマ−クの中心との偏
差を求め、これを基板7の位置ずれ量としてマイクロコ
ンピュータ14aのRAMに格納する(ステップ40
8)。そして、位置ずれ量が図2で説明した許容範囲の
例えば1/2以下の値の範囲内にあるか否か確認する
(ステップ409)。この範囲内にあれば、ステップ4
00の処理が終了したことになる。この範囲外にあれ
ば、ステップ404に戻って以上の一連の処理を再び行
い、基板7の位置ずれ量が上記値の範囲内に入るまで繰
り返す。
Along with this movement, the positioning mark on the substrate 7 is again photographed by the image recognition camera 11a, and the center (center of gravity position) of the positioning mark within the field of view is measured (step 407). , The deviation between the center of the field of view and the center of the mark is obtained, and this deviation is stored in the RAM of the microcomputer 14a as the positional deviation amount of the substrate 7 (step 40).
8). Then, it is confirmed whether or not the positional deviation amount is within a range of, for example, 1/2 or less of the allowable range described in FIG. 2 (step 409). If it is within this range, step 4
This means that the processing of 00 has been completed. If it is out of this range, the process returns to step 404 and the above-mentioned series of processes is performed again, and the process is repeated until the positional deviation amount of the substrate 7 falls within the range of the above value.

【0029】これにより、基板7上のこれから塗布を開
始しようとする塗布点が、ノズル1のペースト吐出口の
真下より所定範囲を越えて外れることのないように、該
基板7が位置決めされたことになる。
As a result, the substrate 7 is positioned so that the coating point on the substrate 7 which is about to start coating does not deviate beyond the predetermined range from directly below the paste discharge port of the nozzle 1. become.

【0030】再び図5において、ステップ400の処理
が終了すると、次に、ステップ500のペ−スト膜形成
工程(処理)に移る。これを、以下、図8で説明する。
Referring again to FIG. 5, when the process of step 400 is completed, the process proceeds to the paste film forming process (process) of step 500. This will be described below with reference to FIG.

【0031】図8において、まず塗布開始位置へ基板7
を移動させ(ステップ501)、次いでノズル1の高さ
を設定する(ステップ502)。即ち、ノズル1の吐出
口から基板7の表面までの間隔が、形成するペ−スト膜
の厚みに等しくなるように設定する。基板7は先に説明
した基板予備位置決め処理(図5のステップ400)で
所望位置に位置決めされているので、上記ステップ50
1では基板7を精度良く塗布開始位置に移動させること
ができ、ステップ503に移ってこの塗布開始位置から
ノズル1がペ−ストの吐出を開始する。
In FIG. 8, first, the substrate 7 is moved to the coating start position.
Is moved (step 501), and then the height of the nozzle 1 is set (step 502). That is, the distance from the discharge port of the nozzle 1 to the surface of the substrate 7 is set to be equal to the thickness of the paste film to be formed. Since the substrate 7 is positioned at the desired position in the substrate preliminary positioning process (step 400 in FIG. 5) described above, the above step 50 is performed.
In No. 1, the substrate 7 can be accurately moved to the coating start position, and the process proceeds to step 503, where the nozzle 1 starts the ejection of the paste from this coating start position.

【0032】そして、光学式距離計3によるノズル1の
ペースト吐出口と基板7との対向間隔の実測デ−タを入
力することにより、該基板7の表面のうねりを測定し
(ステップ504)、また、この実測デ−タにより、光
学式距離計3の前述した計測点がペ−スト膜上を横切っ
ているか否かの判定が行われる(ステップ505)。例
えば、光学式距離計3の実測デ−タが設定した対向間隔
の許容値を外れたような場合には、計測点がペ−スト膜
上にあると判定される。
Then, the undulation of the surface of the substrate 7 is measured by inputting the measured data of the facing distance between the paste discharge port of the nozzle 1 and the substrate 7 by the optical distance meter 3 (step 504). Further, it is judged from this measured data whether or not the above-mentioned measurement point of the optical distance meter 3 crosses over the paste film (step 505). For example, when the measured data of the optical distance meter 3 deviates from the set tolerance value of the facing distance, it is determined that the measurement point is on the paste film.

【0033】光学式距離計3の計測点がペ−スト膜上に
ないときには、実測デ−タを基にZ軸テ−ブル4を移動
させるための補正デ−タを算出する(ステップ50
6)。そして、Z軸テ−ブル4を用いてノズル1の高さ
を補正し、Z軸方向でのノズル1の位置を設定値に維持
する(ステップ507)。これに対し、計測点がペ−ス
ト膜上を通過中と判定された場合には、ノズル1の高さ
補正を行わず、この判定前の高さに保持しておく。な
お、僅かな幅のペ−スト膜上を計測点が通過中のときに
は、基板7のうねりには殆ど変化がないので、ノズル1
の高さ補正を行わなくともペ−ストの吐出形状に変化は
なく、所望の厚さのペ−ストパターンを描くことができ
る。
When the measuring point of the optical range finder 3 is not on the paste film, the correction data for moving the Z-axis table 4 is calculated based on the measured data (step 50).
6). Then, the height of the nozzle 1 is corrected using the Z-axis table 4, and the position of the nozzle 1 in the Z-axis direction is maintained at the set value (step 507). On the other hand, when it is determined that the measurement point is passing over the paste film, the height of the nozzle 1 is not corrected and the height before the determination is maintained. It should be noted that when the measurement point is passing over the paste film having a slight width, the swell of the substrate 7 hardly changes, so the nozzle 1
Even if the height correction is not performed, there is no change in the ejection shape of the paste, and a paste pattern having a desired thickness can be drawn.

【0034】次に、設定されたパタ−ン動作が完了した
かどうかを判定する(ステップ508)。完了ならばペ
−スト吐出を終了し(ステップ509)、完了していな
ければペースト吐出を継続しながら基板表面うねり測定
処理(ステップ504)に戻る。したがって、計測点が
ペ−スト膜上を通過し終わると、上述したノズル1の高
さ補正工程が再開される。なお、ステップ508は、そ
れまで連続して描画していたペーストパタ−ンの終了点
に達したか否かを判定する処理動作であり、この終了点
は必ずしも基板7に描画しようとする所望形状全体のパ
ターンの終了点ではない。即ち、所望形状全体のパター
ンは複数の互いに分かれた部分パターンからなる場合も
あり、それらをすべて含む全パターンの終了点に達した
か否かの判定はステップ511で行われる。なお、ステ
ップ511に移る前にステップ510でZ軸テーブル4
を駆動してノズル1を退避位置まで上昇させておく。ス
テップ511で部分パターンは形成し終えたものの全パ
ターンの描画は完了していないと判定されたときには、
再び塗布開始位置へ基板7を移動させて(ステップ50
1)、以上の一連の工程を繰り返す。
Next, it is judged whether or not the set pattern operation is completed (step 508). If it is completed, the paste ejection is terminated (step 509), and if it is not completed, the paste ejection is continued while returning to the substrate surface waviness measurement processing (step 504). Therefore, when the measurement point has finished passing over the paste film, the height correction process of the nozzle 1 described above is restarted. Note that step 508 is a processing operation for determining whether or not the end point of the paste pattern which has been continuously drawn until then is reached, and this end point is not necessarily the desired shape to be drawn on the substrate 7. It is not the end of the overall pattern. That is, the pattern of the entire desired shape may be composed of a plurality of partial patterns that are separated from each other, and it is determined in step 511 whether or not the end points of all patterns including all of them have been reached. In addition, before moving to step 511, the Z-axis table 4 is read at step 510.
Is driven to raise the nozzle 1 to the retracted position. When it is determined in step 511 that the partial patterns have been formed but the drawing of all the patterns has not been completed,
The substrate 7 is again moved to the coating start position (step 50
1), the above series of steps are repeated.

【0035】このようにして、ペ−スト膜の形成が所望
形状のパターン全体にわたって行われると、ペ−スト膜
形成工程(ステップ500)を終了する。
In this way, when the paste film is formed over the entire pattern of the desired shape, the paste film forming step (step 500) is completed.

【0036】再び図5において、ステップ500の処理
が終了すると、ステップ550に進んで、描画形成した
ペ−スト膜の断面形状を計測するか否かを判定し、計測
を行う場合は断面形状計測工程(ステップ600)に進
み、行わない場合は基板排出工程(ステップ800)に
進む。
Referring again to FIG. 5, when the process of step 500 is completed, the process proceeds to step 550, and it is determined whether or not the cross-sectional shape of the drawn and formed paste film is to be measured. The process proceeds to the process (step 600), and if not performed, the process proceeds to the substrate discharging process (step 800).

【0037】以下、図9を参照しつつ、ペ−スト膜の断
面形状計測工程(ステップ600)について説明する。
The cross-sectional shape measuring step (step 600) of the paste film will be described below with reference to FIG.

【0038】まず、ペ−ストパタ−ンが描かれた基板7
を計測開始位置に移動させ(ステップ601)、光学式
距離計3の高さを設定する(ステップ602)。そし
て、この計測開始位置から、光学式距離計3により基板
表面(ペーストパターン表面)の高さを計測し(ステッ
プ603)、計測結果をマイクロコンピュータ14aの
RAMに格納する(ステップ604)。その後、基板7
を次の計測点にピッチ移動させる(ステップ605)。
かかるピッチ移動の距離は形状計測区間をn等分する設
定デ−タに基づき、nの数値を多くすれば、計測点数
(サンプリング数)は増える。次に、形状計測区間にお
ける高さ計測が終了したか否かを判定し(ステップ60
6)、終了でない場合はステップ603に戻り、新たな
計測点において基板表面の高さを計測する。したがっ
て、ステップ603からステップ606の間をn+1回
行き来すると、この形状計測区間での計測は終了とな
る。なお、光学式距離計3による計測デ−タはピッチ毎
の離散値であり、連続値ではないので、nの数値を多く
すれば計測点数が増えて、計測区間内における描画済み
パターンの断面形状の判定結果は正確になる。
First, the substrate 7 on which the paste pattern is drawn
Is moved to the measurement start position (step 601), and the height of the optical rangefinder 3 is set (step 602). Then, from the measurement start position, the height of the substrate surface (paste pattern surface) is measured by the optical distance meter 3 (step 603), and the measurement result is stored in the RAM of the microcomputer 14a (step 604). Then substrate 7
Is moved to the next measurement point by pitch (step 605).
The distance of such pitch movement is based on setting data that divides the shape measurement section into n equal parts. If the value of n is increased, the number of measurement points (sampling number) increases. Next, it is determined whether or not the height measurement in the shape measurement section is completed (step 60).
6) If not finished, the process returns to step 603, and the height of the substrate surface is measured at a new measurement point. Therefore, when n + 1 times are moved back and forth between step 603 and step 606, the measurement in this shape measurement section ends. Since the measurement data by the optical distance meter 3 is a discrete value for each pitch and is not a continuous value, the number of measurement points increases as the value of n increases, and the cross-sectional shape of the drawn pattern in the measurement section is increased. The judgment result of will be accurate.

【0039】形状計測区間での計測が終了したならば、
光学式距離計3を上昇させ(ステップ607)、予め設
定した全計測箇所について計測が完了したかどうかをス
テップ608で判定し、完了していないときは、計測開
始位置へ基板7を移動させるステップ601に戻って、
上記ステップ607までの一連の処理を繰り返す。そし
て、全計測箇所で計測終了ならば、この断面形状計測工
程(ステップ600)は終了し、図5の断面形状判定工
程(ステップ700)に移る。
When the measurement in the shape measurement section is completed,
The optical distance meter 3 is raised (step 607), and it is determined in step 608 whether or not the measurement is completed for all preset measurement points. If not, the step of moving the substrate 7 to the measurement start position. Back to 601
A series of processes up to step 607 is repeated. Then, if the measurement is completed at all the measurement points, the sectional shape measuring step (step 600) is ended, and the procedure moves to the sectional shape determining step (step 700) in FIG.

【0040】以下、図10を参照しつつ、この断面形状
判定工程(ステップ700)について説明する。
The cross-sectional shape determining step (step 700) will be described below with reference to FIG.

【0041】始めに、ステップ701で計測結果の傾き
補正を行う。即ち、図1の架台部9は本来、吸着台13
が水平となるように設置されているはずなので、基板表
面の高さを計測した光学式距離計3の計測結果は、図1
1の(a)で示すように、ペースト膜不在領域において
基板表面の高さ位置が零レベルを維持するはずである
が、実際には架台部9の傾きなどにより、図11
(b),(c)に示すように計測結果が右上がりもしく
は右下がりとなる場合がある。そこで、形状計測区間M
Aにおける計測開始位置の計測デ−タDsと計測終了位
置の計測デ−タDeの差から、計測結果の補正に必要な
基板表面の傾きを求め、この傾きに起因する計測データ
の誤差を排除すべく、ステップ701で修正処理を行
う。なお、図11では便宜上、計測デ−タを連続値で示
しているが、前述したように計測デ−タは離散値であ
る。
First, in step 701, the inclination of the measurement result is corrected. That is, the gantry unit 9 of FIG.
Is supposed to be installed horizontally, so the measurement result of the optical distance meter 3 measuring the height of the substrate surface is as shown in FIG.
As shown in FIG. 1A, the height position of the substrate surface should be maintained at the zero level in the paste film absent region.
As shown in (b) and (c), the measurement result may rise to the right or fall to the right. Therefore, the shape measurement section M
From the difference between the measurement data Ds at the measurement start position and the measurement data De at the measurement end position in A, the inclination of the substrate surface necessary for correcting the measurement result is obtained, and the error in the measurement data due to this inclination is eliminated. In order to do so, a correction process is performed in step 701. Note that, in FIG. 11, the measurement data are shown as continuous values for the sake of convenience, but the measurement data are discrete values as described above.

【0042】次に、傾きを補正した計測デ−タからゼロ
クロス位置P1,P2を得て、これらゼロクロス位置P
1,P2の間隔を求め、その間隔をペ−ストパタ−ンの
塗布幅とする(ステップ702)。その後、傾きを補正
した計測デ−タ(各離散値)を、計測開始位置の計測デ
−タDsから計測終了位置の計測デ−タDeの間で順次
比較して最大値を求め、その値をペ−ストパタ−ンの塗
布高さDhとする(ステップ703)。
Next, the zero-cross positions P1 and P2 are obtained from the measurement data whose inclination has been corrected, and these zero-cross positions P are obtained.
The interval between 1 and P2 is obtained, and the interval is set as the coating width of the paste pattern (step 702). After that, the inclination-corrected measurement data (each discrete value) is sequentially compared between the measurement start position measurement data Ds and the measurement end position measurement data De to obtain the maximum value. Is the coating height Dh of the paste pattern (step 703).

【0043】次に、ステップ704に進んで、ステップ
702および703の処理で求めたペ−ストパタ−ンの
塗布幅(P2−P1)および塗布高さDhを、予め設定
してあった基準値デ−タと比較し、基準値以内であるか
否かを判定する。もしも基準値を外れている場合には、
ステップ705に進み、図1のモニタ16に異常内容を
表示するなどの異常処理を行う。そして、基準値内の場
合および異常処理が終了した場合には、ステップ706
に進んで全計測箇所の断面形状判定処理が完了したか否
かを判定し、完了でない場合はステップ701に戻って
上述した一連の処理を繰り返し行い、完了した場合には
全計測箇所の形状判定結果を表示し(ステップ70
7)、断面形状判定工程(ステップ700)を終了す
る。
Next, in step 704, the coating width (P2-P1) and the coating height Dh of the paste pattern obtained in the processes of steps 702 and 703 are set to the preset reference value values. -It is determined whether or not it is within the reference value by comparing with If it is out of the standard value,
In step 705, abnormality processing such as displaying the details of the abnormality on the monitor 16 of FIG. 1 is performed. Then, if it is within the reference value or if the abnormality processing is completed, step 706.
To determine whether or not the sectional shape determination processing of all measurement points is completed. If not completed, return to step 701 to repeat the series of processing described above, and if completed, determine the shape of all measurement points. Display the results (step 70
7), the cross-sectional shape determination step (step 700) is completed.

【0044】再び図5において、上述したステップ70
0が終了すると、ステップ800に移って基板排出処理
が行われ、、基板7が吸着台13から外される。しかる
後、以上の全工程を停止するか否かを判定し(ステップ
900)、別の基板に同じパタ−ンでペ−ストを塗布描
画する場合にはステップ300に戻って、該基板に対し
ステップ300〜900の一連の処理を繰り返す。
Referring again to FIG. 5, step 70 described above.
When 0 is completed, the process proceeds to step 800, where the substrate discharge process is performed, and the substrate 7 is removed from the suction table 13. Thereafter, it is determined whether or not all the above steps are stopped (step 900), and when a paste is applied and drawn on another substrate with the same pattern, the process returns to step 300 and the substrate is processed. A series of steps 300 to 900 is repeated.

【0045】このように、上記実施例では、ペースト膜
形成工程(ステップ500)でノズル1の高さ補正に必
要なデータを計測する光学式距離計3を用いて、ペース
ト膜形成後に、描画形成した該ペースト膜の断面形状が
判定できる(ステップ600および700)ようになっ
ているので、効率の良い品質管理が行える。
As described above, in the above embodiment, the optical distance meter 3 for measuring the data necessary for the height correction of the nozzle 1 in the paste film forming step (step 500) is used, and the drawing formation is performed after the paste film formation. Since the sectional shape of the paste film can be determined (steps 600 and 700), efficient quality control can be performed.

【0046】例えば、液晶表示装置を製造する場合、描
画形成したシ−ル剤が図12(a)に示すような所望の
幅および高さを備えた蒲鉾形のペ−ストパタ−ンPPに
なっていれば、ガラス基板どうしを貼り合せたときに充
分なシ−ル効果を期待できるが、図12(b),(c)
に示すようにペ−ストパタ−ンPPの塗布幅と塗布高さ
のいずれかが所望の値でないと、充分なシ−ル効果を期
待できない。即ち、図12(b)に示すように塗布幅が
不所望に小さくなると、パタ−ン切れを引き起こしてシ
−ル不良が発生しやすくなり、ペ−ストパタ−ンPPが
抵抗ペ−ストの場合には高抵抗化や断線の原因になる。
また、図12(c)に示すように中央部に凹みができて
塗布高さが不足していると、2枚のガラス基板を貼り合
せたときに該凹み部分が両ガラス基板の間に閉じ込めら
れてボイドとなり、シ−ル効果を低減させてしまう。さ
らに、図示はしていないがペ−ストパタ−ンの幅や高さ
が所望値よりも大きいと、抵抗ペ−ストでは低抵抗化や
短絡を招来し、液晶表示装置のシール剤の場合は2枚の
ガラス基板を貼り合せたときに余分なシ−ル剤が横には
み出して、ガラス基板上に設けられているTFTを該シ
−ル剤が覆ってしまうなどの表示欠陥を招来しやすい。
For example, in the case of manufacturing a liquid crystal display device, the seal agent formed by drawing is a kamaboko-shaped paste pattern PP having a desired width and height as shown in FIG. 12 (a). If so, a sufficient sealing effect can be expected when the glass substrates are bonded to each other, but FIGS.
As shown in FIG. 7, if either the coating width or the coating height of the paste pattern PP is not a desired value, a sufficient sealing effect cannot be expected. That is, as shown in FIG. 12B, when the coating width is undesirably reduced, pattern breakage is likely to occur and a seal defect is likely to occur, and when the paste pattern PP is a resistance paste. Causes high resistance and disconnection.
Further, as shown in FIG. 12 (c), when a recess is formed in the central portion and the coating height is insufficient, the recess is confined between the two glass substrates when the two glass substrates are bonded together. It becomes voids and reduces the sealing effect. Further, although not shown, if the width or height of the paste pattern is larger than a desired value, the resistance paste causes a reduction in resistance or a short circuit. When the two glass substrates are bonded together, the excess sealant is liable to protrude to the side, which easily causes a display defect such that the TFT provided on the glass substrate is covered with the sealant.

【0047】したがって、描画済みパタ−ンの塗布幅や
塗布高さが許容値から外れているときに、その断面形状
をモニタ16に表示して確認できるようにしておくと、
製作される製品の仕上がり状態が推定でき、製作工程の
途中で良品と不良品とを仕分けることができるので、効
率的な品質管理が行え、生産性向上に大きく寄与でき
る。しかも、ペ−ストパターンを塗布描画した基板を装
置から取り外したり該装置の部品交換を行ったりせず
に、そのまま描画済みパターンの断面形状判定工程へ移
ることができるので、判定のための煩雑な準備作業が不
要で、生産ラインを複雑化させる心配もない。
Therefore, when the coating width and coating height of the drawn pattern deviates from the permissible values, the cross-sectional shape can be displayed on the monitor 16 so as to be confirmed.
The finished state of the product to be manufactured can be estimated, and good products and defective products can be sorted in the middle of the manufacturing process, so that efficient quality control can be performed and the productivity can be greatly improved. Moreover, since it is possible to move directly to the cross-sectional shape determination process of the drawn pattern without removing the substrate on which the paste pattern is applied and drawn from the device or replacing the parts of the device, it is complicated for the judgment. No preparation work is required and there is no need to worry about complicating the production line.

【0048】なお、ペーストパタ−ンの塗布高さが0に
なっていた場合はパタ−ン切れを意味するが、パタ−ン
切れの原因としてペ−スト収納筒2内のペ−ストが消費
されてしまった可能性もあるので、異常な塗布高さをモ
ニタ16に表示して確認すればペ−スト収納筒2内のペ
−スト残量チェックも行える。
When the application height of the paste pattern is 0, it means that the pattern is cut off. As a cause of the pattern cut, the paste in the paste storage cylinder 2 is consumed. Since there is a possibility that it has been done, if the abnormal coating height is displayed on the monitor 16 and confirmed, the remaining amount of the paste in the paste storage cylinder 2 can be checked.

【0049】最後に、図13を参照しつつ、描画済みパ
ターンの断面形状表示のために行われるマイクロコンピ
ュ−タ14a(図4参照)の演算処理について説明す
る。
Finally, with reference to FIG. 13, the arithmetic processing of the microcomputer 14a (see FIG. 4) for displaying the cross-sectional shape of the drawn pattern will be described.

【0050】図13において、黒点で示すMPxは、形
状計測区間をn等分した各ピッチにおける計測点、また
Hxは、各計測点MPxにおいて得られた描画済みパタ
ーンの塗布高さの計測デ−タであり、各計測デ−タHx
はマイクロコンピュ−タ14aのRAMに格納されてい
る。それゆえ、各計測デ−タHxを順次(時系列に)モ
ニタ16に表示していくことにより、描画済みパターン
の断面形状の輪郭を表示することができる。
In FIG. 13, MPx indicated by black dots is a measurement point at each pitch obtained by dividing the shape measurement section into n equal parts, and Hx is a measurement data of the coating height of the drawn pattern obtained at each measurement point MPx. Data and each measurement data Hx
Are stored in the RAM of the microcomputer 14a. Therefore, by sequentially (in time series) displaying each measurement data Hx on the monitor 16, the contour of the cross-sectional shape of the drawn pattern can be displayed.

【0051】また、断面形状の表示に加えて断面積を表
示する場合には、次のような処理を行う。即ち、形状計
測区間をn等分した各ピッチの間隔をWxとすると、各
ピッチ間隔Wxの範囲内で描画済みパターンの塗布高さ
を同等とみなす近時が行えるので、形状計測区間の全部
について、マイクロコンピュ−タ14aのRAMに格納
されている各計測デ−タHxとピッチ間隔Wxとの積を
合算し、Σ(Wx×Hx〕の値を求めれば、図13に破
線で示す描画済みパターンの実際の断面形状の面積に近
似した断面積が得られ、等分数nを大きく設定すること
により近似度を高めることができる。
When the cross-sectional area is displayed in addition to the display of the cross-sectional shape, the following processing is performed. That is, assuming that the interval of each pitch obtained by dividing the shape measurement section into n equal parts is Wx, the application height of the drawn pattern can be regarded as equivalent within the range of each pitch interval Wx. , The product of each measurement data Hx stored in the RAM of the micro computer 14a and the pitch interval Wx is summed up to obtain the value of Σ (Wx × Hx], the drawing shown by the broken line in FIG. A cross-sectional area approximate to the area of the actual cross-sectional shape of the pattern can be obtained, and the approximation degree can be increased by setting the equal fraction n large.

【0052】こうして描画済みパターンの断面積が把握
できるようにしておくと、特に抵抗用ペ−ストを描画す
る場合、所望の抵抗値になっているかどうかを確認する
うえで有効である。つまり、抵抗用ペ−ストの場合に
は、パタ−ンの幅や高さが所望値から外れていても、断
面積が許容値内であれば所望の抵抗値が得られるので、
前述した断面形状判定工程(ステップ700)におい
て、塗布幅や塗布高さが基準値内か否かを判定する代わ
りに、断面積が基準値内か否かを判定するようにしても
良い。
By making it possible to grasp the cross-sectional area of the drawn pattern in this way, it is effective to confirm whether or not the desired resistance value is obtained, especially when the resistance paste is drawn. In other words, in the case of the resistance paste, the desired resistance value can be obtained if the cross-sectional area is within the allowable value even if the width and height of the pattern deviate from the desired values.
In the cross-sectional shape determination step (step 700) described above, instead of determining whether the coating width or coating height is within the reference value, it may be determined whether the cross-sectional area is within the reference value.

【0053】なお、塗布機初期設定処理(ステップ20
0)での所要時間の短縮化を図るため、外部インタ−フ
ェ−ス14e(図4参照)に、ICカ−ドあるいはフロ
ッピディスクやハ−ドディスクなどの外部記憶手段が装
填される記憶読み出し装置を接続し、一方、パ−ソナル
コンピュ−タなどで塗布機初期設定処理に必要なデ−タ
設定を前もって実行しておき、塗布機初期設定処理時
に、外部インタ−フェ−ス14eに接続した記憶読み出
し装置を介して外部記憶手段から各種デ−タをマイクロ
コンピュ−タ14aのRAMに移すようにしても良い。
また、計測したデ−タをICカ−ドあるいはフロッピデ
ィスクやハ−ドディスクなどの外部記憶手段に格納し
て、マイクロコンピュ−タ14aのRAMの記憶容量拡
大化を図ったり、判定結果についてのデ−タを外部記憶
手段に格納して後日利用できるようにしても良い。
The initial setting process of the applicator (step 20)
0) In order to shorten the time required, the external interface 14e (see FIG. 4) is loaded with an IC card or an external storage means such as a floppy disk or a hard disk. Connected to the equipment, on the other hand, previously set the data necessary for the initial setting process of the applicator with a personal computer, and connected to the external interface 14e during the initial setting process of the applicator. Various data may be transferred from the external storage means to the RAM of the microcomputer 14a via the storage / readout device.
Further, the measured data is stored in an IC card or an external storage means such as a floppy disk or a hard disk to enlarge the memory capacity of the RAM of the microcomputer 14a or to judge the judgment result. The data may be stored in an external storage means so that it can be used at a later date.

【0054】[0054]

【発明の効果】以上説明したように、本発明によるペー
スト塗布機は、ノズルのペースト吐出口と基板表面との
対向間隔を計測する計測手段のデータを用いて、該基板
上に描画形成したペ−ストパターンの塗布高さおよび塗
布幅を算出することにより、描画済みパターンが所望の
断面形状や断面積になっているか否かが簡単に判定でき
るので、効率的な品質管理が行え、しかも判定のための
煩雑な準備作業が不要なので、生産性向上に寄与すると
ころ極めて大である。
As described above, the paste applicator according to the present invention uses the data of the measuring means for measuring the facing distance between the paste discharge port of the nozzle and the surface of the substrate to draw and form the pattern on the substrate. -By calculating the coating height and coating width of the strike pattern, it is possible to easily determine whether or not the drawn pattern has a desired cross-sectional shape or cross-sectional area, so efficient quality control can be performed and determination can be performed. Since it does not require complicated preparatory work for, it is extremely important to contribute to productivity improvement.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるペ−スト塗布機の一実施例を示す
概略斜視図である。
FIG. 1 is a schematic perspective view showing an embodiment of a paste applicator according to the present invention.

【図2】同実施例のノズルと光学式距離計との配置関係
を示す斜視図である。
FIG. 2 is a perspective view showing a positional relationship between a nozzle and an optical distance meter of the embodiment.

【図3】同実施例のノズルの取付位置と光学式距離計の
計測範囲との関係を垂直面で表した斜視図である。
FIG. 3 is a perspective view showing a relationship between a mounting position of a nozzle and a measurement range of an optical distance meter in the same embodiment as a vertical plane.

【図4】同実施例の制御装置の一具体例を示すブロック
図である。
FIG. 4 is a block diagram showing a specific example of a control device of the same embodiment.

【図5】同実施例の全体動作を示すフローチャートであ
る。
FIG. 5 is a flowchart showing the overall operation of the same embodiment.

【図6】図5におけるペ−スト塗布機の初期設定工程を
示すフローチャートである。
FIG. 6 is a flowchart showing an initial setting process of the paste applicator in FIG.

【図7】図5における基板予備位置決め工程を示すフロ
ーチャートである。
FIG. 7 is a flowchart showing a substrate preliminary positioning process in FIG.

【図8】図5におけるペ−スト膜形成工程を示すフロー
チャートである。
8 is a flowchart showing a paste film forming process in FIG.

【図9】図5におけるペ−スト膜の断面形状計測工程を
示すフローチャートである。
9 is a flowchart showing a cross-sectional shape measuring process of the paste film in FIG.

【図10】図5におけるペ−スト膜の断面形状判定工程
を示すフローチャートである。
10 is a flowchart showing a cross-sectional shape determination process of the paste film in FIG.

【図11】同実施例で描画済みパターンの塗布高さおよ
び塗布幅を算出するデ−タ処理について説明するための
図である。
FIG. 11 is a view for explaining the data processing for calculating the coating height and coating width of the drawn pattern in the same example.

【図12】描画されたペ−ストパタ−ンの断面形状が所
望の場合や不所望の場合の具体例を示す図である。
FIG. 12 is a diagram showing a specific example of a case where a cross-sectional shape of a drawn paste pattern is desired or undesired.

【図13】同実施例で描画済みパターンの断面形状や断
面積を判定するデ−タ処理について説明するための図で
ある。
FIG. 13 is a diagram for explaining the data processing for determining the cross-sectional shape and cross-sectional area of the drawn pattern in the embodiment.

【符号の説明】[Explanation of symbols]

1 ノズル 2 ペ−スト収納筒 3 光学式距離計 4 Z軸テ−ブル 5 X軸テ−ブル 6 Y軸テ−ブル 7 基板 8 θ軸テ−ブル 9 架台部 10 Z軸テ−ブル支持部 11a 画像認識カメラ 12 ノズル支持具 13 吸着台 14 制御装置 15a〜15d サ−ボモ−タ 16 モニタ 17 キ−ボ−ド 1 Nozzle 2 Paste Storage Cylinder 3 Optical Distance Meter 4 Z-axis Table 5 X-axis Table 6 Y-axis Table 7 Substrate 8 θ-axis Table 9 Stand 10 Z-axis Table Support 11a Image recognition camera 12 Nozzle support 13 Suction table 14 Control device 15a to 15d Servo motor 16 Monitor 17 Key board

───────────────────────────────────────────────────── フロントページの続き (72)発明者 米田 福男 茨城県竜ヶ崎市向陽台5丁目2番 日立テ クノエンジニアリング株式会社開発研究所 内 (72)発明者 五十嵐 省三 茨城県竜ヶ崎市向陽台5丁目2番 日立テ クノエンジニアリング株式会社竜ヶ崎工場 内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fukuo Yoneda 5-2, Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. R & D Laboratory (72) Shozo Igarashi 5-2, Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. Ryugasaki Factory

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 ノズルのペースト吐出口と対向するよう
に基板をテーブル上に載置し、ペースト収納筒に充填し
たペーストを上記吐出口から上記基板上へ吐出させなが
ら該ノズルと該基板との相対位置関係を変化させ、該基
板上に所望形状のペーストパターンを描画形成するペー
スト塗布機において、 上記ノズルのペースト吐出口と上記基板の表面との対向
間隔を計測する計測手段と、この計測手段と上記基板と
を該基板の表面に沿って相対的に移動させる移動手段
と、この相対的移動時における上記計測手段の計測デ−
タを用いて描画済みのペーストパターンの塗布高さおよ
び塗布幅を算出する断面捕捉手段とを備えたことを特徴
とするペースト塗布機。
1. A substrate is placed on a table so as to face a paste discharge port of a nozzle, and the nozzle and the substrate are separated from each other while discharging the paste filled in the paste storage cylinder from the discharge port onto the substrate. In a paste coating machine that changes and forms a relative positional relationship to draw and form a paste pattern of a desired shape on the substrate, a measuring unit that measures a facing distance between the paste discharge port of the nozzle and the surface of the substrate, and the measuring unit. And moving means for relatively moving the substrate along the surface of the substrate, and measurement data of the measuring means during the relative movement.
And a cross-section capturing means for calculating a coating height and a coating width of a drawn paste pattern using a paste coating machine.
【請求項2】請求項1の記載において、上記断面捕捉手
段が、計測開始と計測終了の両時点の計測データを比較
演算して求めた上記基板の表面の傾き分を除去すること
によりデ−タ修正が可能な修正手段を備えていることを
特徴とするペースト塗布機。
2. The data processing apparatus according to claim 1, wherein the cross-section capturing means removes an inclination of the surface of the substrate obtained by comparing and calculating the measurement data at both the measurement start time and the measurement end time. A paste applicator, which is equipped with a correction means capable of correcting data.
【請求項3】請求項2の記載において、上記断面捕捉手
段が、上記修正手段により修正した計測デ−タのうちゼ
ロクロスする2つの計測地点間の距離から描画済みのペ
ーストパターンの塗布幅を求めるものであることを特徴
とするペースト塗布機。
3. The coating width of the drawn paste pattern is obtained from the distance between two zero-cross measurement points of the measurement data corrected by the correction means by the cross-section capturing means. A paste applicator characterized by being a thing.
【請求項4】請求項2の記載において、上記断面捕捉手
段が、上記修正手段により修正した計測デ−タを順次比
較して描画済みのペーストパターンの塗布高さを求める
ものであることを特徴とするペースト塗布機。
4. The cross-section capturing means according to claim 2, wherein the coating height of the drawn paste pattern is determined by sequentially comparing the measurement data corrected by the correction means. And paste applicator.
【請求項5】請求項2の記載において、上記断面捕捉手
段が、上記修正手段により修正した計測デ−タを時系列
に並べて描画済みのペーストパターンの断面形状に近似
した輪郭を求め、かつ該輪郭をモニタに表示する輪郭表
示手段を備えていることを特徴とするペースト塗布機。
5. The cross-section capturing means according to claim 2, wherein the measurement data corrected by the correction means is arranged in time series to obtain a contour approximate to the cross-sectional shape of the drawn paste pattern, and A paste coating machine comprising a contour display means for displaying a contour on a monitor.
【請求項6】請求項1または2の記載において、上記断
面捕捉手段が、描画済みのペーストパターンの塗布幅、
塗布高さ、および断面積のうち少なくともいずれかが設
定許容範囲内にあるか否かを判定する異常判定手段と、
この異常判定手段で許容範囲外と判定されたときに異常
処理を行う異常処理手段とを備えていることを特徴とす
るペースト塗布機。
6. The cross-section capturing means according to claim 1 or 2, wherein the applied width of the drawn paste pattern is
An abnormality determining means for determining whether or not at least one of the coating height and the cross-sectional area is within a setting allowable range,
A paste applicator comprising: an abnormality processing unit that performs abnormality processing when the abnormality determination unit determines that the abnormality is outside the allowable range.
JP6068730A 1994-04-06 1994-04-06 Paste coating machine Expired - Lifetime JP2809588B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6068730A JP2809588B2 (en) 1994-04-06 1994-04-06 Paste coating machine
KR1019950006830A KR0159423B1 (en) 1994-04-06 1995-03-29 Paste applicator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6068730A JP2809588B2 (en) 1994-04-06 1994-04-06 Paste coating machine

Publications (2)

Publication Number Publication Date
JPH07275770A true JPH07275770A (en) 1995-10-24
JP2809588B2 JP2809588B2 (en) 1998-10-08

Family

ID=13382209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6068730A Expired - Lifetime JP2809588B2 (en) 1994-04-06 1994-04-06 Paste coating machine

Country Status (2)

Country Link
JP (1) JP2809588B2 (en)
KR (1) KR0159423B1 (en)

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KR0159423B1 (en) 1998-11-16
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