JP3887614B2 - Cutting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a precision cutting apparatus capable of precisely cutting a workpiece such as a semiconductor wafer or ferrite, and a cutting method using the same.
[0002]
[Prior art]
As a precision cutting apparatus provided with two blades, for example, a dicing apparatus disclosed in Japanese Patent Publication No. 3-11601 is well known as a conventional example. In this dicing apparatus, two spindles are arranged in parallel in the Y-axis direction, and a blade is attached to the tip of each spindle.
[0003]
In this dicing apparatus, for example, when cutting a semiconductor wafer by step cutting, if one blade is a V-groove blade with a V-shaped tip and the other blade is a cutting blade, the V-groove blade will cover the wafer. After forming the V-groove on the surface of the workpiece, the V-groove is further cut with a cutting blade, whereby a chip whose surface is chamfered on a taper can be formed.
[0004]
[Problems to be solved by the invention]
However, since the spindles are arranged in parallel and the blades mounted on the spindle are also arranged in parallel with the cutting direction, the cutting stroke becomes long and there is a problem in productivity.
[0005]
Therefore, the conventional precision cutting apparatus has a problem that must be solved in order to improve productivity.
[0006]
[Means for Solving the Problems]
As a specific means for solving the above problems, the present invention is arranged such that one screw rotating by driving one motor and the other screw rotating by driving the other motor are arranged in the Y-axis direction of the base. The first spindle support member that moves in the Y-axis direction by the rotation of one screw is engaged with one screw, and the second screw moves in the Y-axis direction by the rotation of the other screw. Two spindle support members engage, a first blade is mounted on the tip of the first spindle, a second blade is mounted on the second spindle, the first spindle and the second spindle, Are arranged in a substantially straight line in the Y-axis direction so that the first blade and the second blade face each other, and a chuck table for sucking and holding the semiconductor wafer is arranged to be movable in the X-axis direction. a precision cutting machine are There are, a cutting how to cut the semiconductor wafer exhibiting a circular shape, positioned on both end portions of the first blade and the Y-axis direction of the semiconductor wafer exhibiting a second blade and a circular held on the chuck table The first spindle and the second spindle are lowered and the chuck table is moved in the X-axis direction, so that two streets formed on the outermost side in the Y-axis direction are simultaneously formed by the first blade and the second blade. Provided is a cutting method for cutting two streets in the X-axis direction by moving the chuck table in the X-axis direction while cutting and indexing and feeding a predetermined distance toward the center of the first spindle and the second spindle. .
[0007]
According to the cutting method configured as described above, since the workpiece is a semiconductor wafer having a circular shape, the first blade and the second blade can simultaneously cut the street at the same stroke without waste. .
[0008]
Furthermore, the present invention is a cutting method for cutting a semiconductor wafer having a circular shape using the precision cutting apparatus described above, and the first blade and the second blade are brought close to each other without being collided and held on the chuck table. The first and second spindles are moved downward and the chuck table is moved in the X-axis direction, and is formed at the central part of the semiconductor wafer having a circular shape. Two streets are simultaneously cut, the first spindle and the second spindle are indexed and fed at predetermined intervals in the direction away from the center, and the chuck table is moved in the X-axis direction to make two streets X A cutting method for cutting in an axial direction is provided.
[0009]
Even in the case of the cutting method configured as described above, since the workpiece is a semiconductor wafer having a circular shape, the first blade and the second blade can simultaneously cut the street with the same stroke without waste. .
[0010]
The present invention is also a cutting method for cutting a square or rectangular semiconductor wafer using the precision cutting apparatus described above, wherein the first blade is attached to the end of the square or rectangular work piece held by the chuck table. Positioned, the second blade is positioned at the center of the work piece, lowers the first spindle and the second spindle, and moves the chuck table in the X-axis direction to move the end and center of the work piece Two streets formed in the section are simultaneously cut in the X-axis direction, and the first spindle and the second spindle are oriented in the direction of the other end while maintaining the distance between the first spindle and the second spindle. And a cutting method of cutting streets two by two by moving the chuck table in the X-axis direction.
[0011]
According to the cutting method configured as described above, since the workpiece is square or rectangular, the cutting stroke is completely useless and all the cutting positions can be cut two by two.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
A dicing apparatus shown in FIG. 1 as an example of a precision cutting apparatus will be described. When the workpiece is cut using the dicing apparatus 10 shown in FIG. 1, the workpiece is placed on the chuck table 11 and sucked and held. For example, when the semiconductor wafer is diced, as shown in FIG. 2, the semiconductor wafer 14 held on the frame 13 via the holding tape 12 is placed on the chuck table 11 and sucked and held.
[0013]
On the surface of the semiconductor wafer 14 shown in FIG. 2, there are streets 15 that are linear regions arranged in a grid at predetermined intervals, and a large number of rectangular regions 16 partitioned by the streets 15 have circuit patterns. Is given. When such a semiconductor wafer 14 is cut (diced) on the street 15, the semiconductor wafer 14 is separated for each rectangular region to form a chip.
[0014]
The chuck table 11 is movable in the X-axis direction, and the semiconductor wafer 14 sucked and held by the chuck table 11 is positioned immediately below the alignment means 17 by the movement of the chuck table 11 in the X-axis direction before cutting. . Further, the chuck table 11 can be configured to be movable in the Z-axis direction when necessary.
[0015]
When the semiconductor wafer 14 is positioned directly below the alignment means 17 in this way, the surface of the semiconductor wafer 14 is imaged by an imaging means 18 such as a CCD camera provided below the alignment means 17 to perform processing such as pattern matching. A street 15 to be cut formed on the surface of the semiconductor wafer 14 is detected. Further, when the chuck table 11 moves in the X-axis direction, the semiconductor wafer 14 enters the cutting area 19.
[0016]
In the cutting region 19, a first spindle 20 and a second spindle 21, which are arranged substantially in a straight line in the Y-axis direction and have an axis in the Y-axis direction, the first spindle 20, and the second spindle 21. The first blade 22 and the second blade 23 attached to the tip of the first spindle 20 and the first blade 22 constitute a first cutting means 24, and the second spindle 21. And the second blade 23 constitute a second cutting means 25. Further, the first spindle 20 and the second spindle 21 are arranged on a substantially straight line so that the first blade 22 and the second blade 23 face each other. The two spindles 21 can move independently in the Z-axis direction.
[0017]
In the cutting area 19, for example, as shown in FIG. 3, a first screw 27 that rotates between the ends of the bottom of the cutting area 19 in the Y-axis direction and is driven by the driving of the first motor 26, A first base 28 that engages with the first screw 27 and is movable in the Y-axis direction as the first screw 27 rotates, and is disposed on the first base 28 in the Y-axis direction. The second screw 30 is rotated by driving the second motor 29, the third screw 32 is rotated by driving the third motor 31, and the second screw 30 is engaged to rotate the second screw 30. Accordingly, a second base 33 that is movable in the Y-axis direction and a third base 34 that is engaged with the third screw 32 and is movable in the Y-axis direction as the third screw 32 rotates. And. That is, the first base 28 is a common base for the first spindle 20 and the second spindle 21.
[0018]
A first support member 35 is provided upright from the end of the second base 33, and the fourth support member 35 is rotated along the first support member 35 by the drive of the fourth motor 36. A screw 37 is provided. A second support member 38 is provided upright from the end of the third base 34, and a fifth motor 39 is driven to rotate along the second support member 38 by driving a fifth motor 39. A screw 40 is provided.
[0019]
A first spindle support member 41 that moves up and down in the Z-axis direction as the fourth screw 37 rotates is engaged with the fourth screw 37, and a fifth screw 40 is connected to the fifth screw 40. Is engaged with the second spindle support member 42 that moves up and down in the Z-axis direction. The first spindle support member 41 supports the first spindle 20 provided in the Y-axis direction, and the second spindle support member 42 supports the second spindle 21 in the Y-axis direction.
[0020]
A first blade 22 that is a disk-like blade is provided at the tip of the first spindle 20, and a second blade 23 that is also a disk-like blade is provided at the tip of the second spindle 21. It is mounted so that it can rotate. As the first blade 22 and the second blade 23, blades having various shapes are employed according to the shape of the groove to be formed on the surface of the semiconductor wafer 14. For example, when forming a V-shaped V-shaped groove, a V-shaped blade having a V-shaped tip is mounted on the spindle. Further, the first blade 22 and the second blade 23 may be the same type or different types.
[0021]
When the semiconductor wafer 14 is cut, the second base 33 and the third base 34 are moved in the Y-axis direction to align the cutting position of the semiconductor wafer 14 in the Y-axis direction. Then, the first blade 22 and the second blade 23 rotate, and the first spindle support member 41 and the second spindle support member 42 move along with the rotation of the fourth screw 37 and the fifth screw 40. Descend. Further, the cutting is performed in the X-axis direction by moving the chuck table 11 in the X-axis direction and, if necessary, in the Z-axis direction.
[0022]
The cutting area 19 may be configured as shown in FIG. In the example of FIG. 4, a first screw 44 that rotates by driving the first motor 43 in the Y-axis direction is installed between the upper end portions of the cutting region 19 and engaged with the first screw 44. A first base 45 is provided that moves in the Y-axis direction as the first screw 44 rotates. A second screw 47 that rotates by driving the second motor 46 and a third screw 49 that rotates by driving the third motor 48 are disposed below the first base 45. The second screw 47 and the third screw 49 include a first spindle support member 50 and a second spindle support member that move in the Y-axis direction by the rotation of the second screw 47 and the third screw 49. 51 is engaged. Further, the first spindle 20 and the second spindle 21 are suspended below the first spindle support member 50 and the second spindle support member 51, and the first spindle 20 has a first spindle at the tip. A blade 22 is mounted on the tip of the second spindle 21, and a second blade 23 is mounted on the tip. Thus, the first base 45 is a common base for the first spindle 20 and the second spindle 21.
[0023]
In the case of the example of FIG. 4, the first spindle support member 50 and the second spindle support member 51 have a fourth screw 52 and a fifth screw 53 provided on the top thereof as shown in FIG. The first spindle 20 and the second spindle 21 are moved up and down by being driven and rotated by the motor 54 and the fifth motor 55.
[0024]
When the workpiece, for example, the semiconductor wafer 14 shown in FIG. 2 is cut using the dicing apparatus 10 configured as described above, the first spindle 20 and the second spindle 21 in the Y-axis direction. Cutting can be performed in various ways by appropriately controlling the movement.
[0025]
For example, as shown in FIG. 6A, first the first blade 22 and the second blade 23 are first positioned at both ends in the Y-axis direction of the semiconductor wafer 14 held on the chuck table 11, and the first The spindle 20 and the second spindle 21 are lowered and the chuck table 11 is moved in the X-axis direction, that is, the chuck table 11 and the first cutting means 24 and the second cutting means 25 are moved in the X-axis direction. As a result of relative movement, two streets formed on the outermost surface in the Y-axis direction on the surface of the semiconductor wafer 14 as shown in FIG. 7A are simultaneously moved in the X-axis direction by the first blade 22 and the second blade 23. To cut. In this case, the two streets are cut with the same stroke.
[0026]
Next, the first spindle 20 and the second spindle 21 are indexed and fed toward the center by a predetermined distance, for example, an interval between streets, and the chuck table 11 is similarly moved in the X-axis direction so that the street 15 becomes 2 Cutting is performed with the same stroke in the X-axis direction one by one, and a cutting groove is formed as shown in FIG.
[0027]
Although not shown in FIG. 6, the first blade 22 and the second blade 23 are actually provided with a blade fixing flange or the like at their tips, and the blade is covered with a blade cover. . Therefore, in the central portion of the semiconductor wafer 14 (for example, the portion where the cutting groove is not formed in FIG. 7B), when the first blade 22 and the second blade 23 are indexed and fed at a predetermined interval, the cutting means are connected to each other. There may be a collision. Therefore, when the distance between the two streets to be cut in this way is narrower than the interval at which the blades can approach most, as shown in FIG. 6C, either one of the blades, for example, the first blade Cutting is performed by 22. In this way, all streets are cut as shown in FIG.
[0028]
By cutting the semiconductor wafer 14 having a circular shape as described above, the first blade 22 and the second blade 23 can simultaneously cut each street without waste with the same stroke.
[0029]
In the example shown in FIG. 8, as shown in FIG. 8A, first, the first blade 22 and the second blade 23 are moved as close as possible within the range where the first blade 22 and the second blade 23 do not collide with each other. The first spindle 20 and the second spindle 21 are moved down and the chuck table 11 is moved in the X-axis direction, so that two streets formed in the central portion of the semiconductor wafer 14 are simultaneously formed in the X-axis direction. Cutting is performed to form a cutting groove as shown in FIG. That is, the two streets are cut with the same stroke.
[0030]
Next, as shown in FIG. 8B, the first spindle 20 and the second spindle 21 are indexed and fed at predetermined intervals in a direction away from the central portion, and the chuck table 11 is moved in the X-axis direction. The two streets are moved and cut in the X-axis direction with the same stroke two by two, and a cutting groove is formed as shown in FIG.
[0031]
In addition, about the street of the central part which was not cut because the first blade 22 and the second blade 23 could not be brought close to each other, as shown in FIG. What is necessary is just to cut. In this way, all the streets are finally cut as shown in FIG.
[0032]
By cutting the semiconductor wafer 14 having a circular shape as described above, the first blade 22 and the second blade 23 are simultaneously connected to each street without waste in the same stroke as in the example of FIG. Can be cut.
[0033]
In the example shown in FIG. 10, first, as shown in FIG. 10A, the first blade 22 is positioned at the end of the semiconductor wafer 14, and the second blade 23 is at the center of the semiconductor wafer 14. Positioned, the first spindle 20 and the second spindle 21 are lowered and the chuck table 11 is moved in the X-axis direction, so that the streets formed at the end and the center of the semiconductor wafer 14 are moved 2 in the X-axis direction. Cutting is performed at the same time, and a cutting groove is formed as shown in FIG.
[0034]
Then, as shown in FIGS. 10B and 10C, the first spindle 20 and the second spindle 21 are moved while maintaining the distance between the first spindle 20 and the second spindle 21 at this time. Indexing and feeding in the direction of the other end, moving the chuck table 11 in the X-axis direction, and cutting streets two by two in the X-axis direction as shown in FIGS. .
[0035]
By cutting in this way, although some strokes are wasted compared to the case of FIGS. 6 and 8, all the streets can be cut two at a time. In this case, for example, when the workpiece is square or rectangular, the cutting stroke is completely useless and all the cutting positions can be cut two by two.
[0036]
The example shown in FIG. 12 is a case in which a V-groove is formed on the surface of the semiconductor wafer 14 with a V-groove blade by step cutting and then cutting is performed to form a chip whose surface is chamfered in a tapered shape.
[0037]
In this case, as shown in FIG. 12A, the first blade 22 is a V-groove blade and the second blade 23 is a cutting blade. First, the first blade 22 is positioned on the street of the semiconductor wafer 23 and the chuck table 11 is moved in the X-axis direction to form a V-groove in the X-axis direction on the surface of the semiconductor wafer 14. In FIG. 13A, this V groove is indicated by a bold line.
[0038]
Next, as shown in FIG. 12B, the first blade 22 is moved by a predetermined distance in the Y-axis direction, and the second blade 23 is positioned at the position where the V-groove is formed. In this way, the formation of the V-groove and the cutting of the V-groove are sequentially performed as shown in FIG. 13B, and the last V-groove is formed by the second blade 23 as shown in FIG. When cutting is performed and all the streets are cut as shown in FIG. 13C, finally, a chip whose surface is chamfered in a tapered shape is formed.
[0039]
Note that the use of different types of blades is not limited to the use of V-groove blades and cutting blades as in the example of FIG. 12, and step cutting or the like can be performed by combining blades of various shapes. is there.
[0040]
By cutting in this way, step cutting or the like can be performed without a relatively waste of stroke.
[0041]
【The invention's effect】
As described above, according to the cutting method of the present invention, since the first spindle and the second spindle are arranged substantially in a straight line, the cutting stroke during cutting is one spindle. The cutting stroke is remarkably shortened as compared with the conventional type in which two spindles are arranged in parallel, and the productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a dicing apparatus which is an example of a precision cutting apparatus.
FIG. 2 is a plan view showing a semiconductor wafer as an example of a workpiece to be cut.
FIG. 3 is an explanatory diagram showing an example of a configuration of a cutting region of a dicing apparatus.
FIG. 4 is an explanatory diagram showing an example of a configuration of a cutting region of a dicing apparatus.
FIG. 5 is an explanatory diagram showing an example of a configuration of a cutting area of the dicing apparatus.
FIG. 6 is an explanatory diagram showing an example of a cutting method according to the present invention.
FIG. 7 is an explanatory view showing cutting grooves formed on the semiconductor wafer by the cutting method.
FIG. 8 is an explanatory diagram showing an example of a cutting method according to the present invention.
FIG. 9 is an explanatory diagram showing cutting grooves formed on the semiconductor wafer by the cutting method.
FIG. 10 is an explanatory diagram showing an example of a cutting method according to the present invention.
FIG. 11 is an explanatory diagram showing cutting grooves formed on the semiconductor wafer by the cutting method.
FIG. 12 is an explanatory view showing an example of a cutting method according to the present invention.
FIG. 13 is an explanatory view showing cutting grooves formed on the semiconductor wafer by the cutting method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10: Dicing apparatus 11: Chuck table 12: Holding tape 13: Frame 14: Semiconductor wafer 15: Street 16: Rectangular area 17: Alignment means 18: Imaging means 19: Cutting area 20: First spindle 21: Second spindle 22: first blade 23: second blade 24: first cutting means 25: second cutting means 26: first motor 27: first screw 28: first base 29: second Motor 30: Second screw 31: Third motor 32: Third screw 33: Second base 34: Third base 35: First support member 36: Fourth motor 37: Fourth Screw 38: second support member 39: fifth motor 40: fifth screw 41: first spindle support member 42: second spindle support member 43: first motor 44: One screw 45: First base 46: Second motor 47: Second screw 48: Third motor 49: Third screw 50: First spindle support member 51: Second spindle support member 52: Fourth screw 53: Fifth screw 54: Fourth motor 55: Fifth motor

Claims (3)

One screw that rotates by driving one motor and the other screw that rotates by driving the other motor are arranged in the Y-axis direction of the base,
The first spindle support member that moves in the Y-axis direction by rotation of the one screw is engaged with the one screw, and the other screw moves in the Y-axis direction by the rotation of the other screw. A second spindle support member engaged,
A first blade is attached to the tip of the first spindle, a second blade is attached to the second spindle,
The first spindle and the second spindle are arranged in a substantially straight line in the Y-axis direction so that the first blade and the second blade face each other,
A chuck method for sucking and holding a semiconductor wafer is a cutting method for cutting a semiconductor wafer having a circular shape using a precision cutting device arranged to be movable in the X-axis direction,
The first blade and the second blade are positioned at both ends in the Y-axis direction of a circular semiconductor wafer held by a chuck table, and the first spindle and the second spindle are lowered. The chuck table is moved in the X-axis direction, and two streets formed on the outermost side in the Y-axis direction are simultaneously cut by the first blade and the second blade,
A cutting method of cutting two streets in the X-axis direction by moving the chuck table in the X-axis direction while indexing and feeding the first spindle and the second spindle toward a center at a predetermined distance. One screw that rotates by driving one motor and the other screw that rotates by driving the other motor are arranged in the Y-axis direction of the base,
The first spindle support member that moves in the Y-axis direction by rotation of the one screw is engaged with the one screw, and the other screw moves in the Y-axis direction by the rotation of the other screw. A second spindle support member engaged,
A first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member.
A first blade is attached to the tip of the first spindle, a second blade is attached to the second spindle,
The first spindle and the second spindle are arranged in a substantially straight line in the Y-axis direction so that the first blade and the second blade face each other,
A chuck method for sucking and holding a semiconductor wafer is a cutting method for cutting a semiconductor wafer having a circular shape using a precision cutting device arranged to be movable in the X-axis direction,
The first spindle and the second spindle are positioned at the center of a semiconductor wafer having a circular shape held on the chuck table by bringing the first blade and the second blade close to each other without colliding with each other. And moving the chuck table in the X-axis direction, cutting two streets formed at the center of the circular semiconductor wafer simultaneously,
The first spindle and the second spindle are indexed and fed at predetermined intervals in a direction away from the central portion, and the chuck table is moved in the X-axis direction to cut two streets in the X-axis direction. Cutting method. One screw that rotates by driving one motor and the other screw that rotates by driving the other motor are arranged in the Y-axis direction of the base,
The first spindle support member that moves in the Y-axis direction by rotation of the one screw is engaged with the one screw, and the other screw moves in the Y-axis direction by the rotation of the other screw. A second spindle support member engaged,
A first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member.
A first blade is attached to the tip of the first spindle, a second blade is attached to the second spindle,
The first spindle and the second spindle are arranged in a substantially straight line in the Y-axis direction so that the first blade and the second blade face each other,
A chuck table for sucking and holding a semiconductor wafer is a cutting method for cutting a square or rectangular semiconductor wafer using a precision cutting device arranged to be movable in the X-axis direction,
The first blade is positioned at the end of a square or rectangular workpiece held on a chuck table, the second blade is positioned at the center of the workpiece,
While lowering the first spindle and the second spindle, the chuck table is moved in the X-axis direction, and two streets formed at the end and center of the workpiece are simultaneously formed in the X-axis direction. Cutting and
While maintaining the distance between the first spindle and the second spindle, the first spindle and the second spindle are indexed and fed in the direction of the other end, and the chuck table is moved in the X-axis direction. A cutting method that cuts two streets at a time.

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