JP2004158822A - Precise cutting apparatus and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the productivity of cutting of a work by a precise cutting apparatus having two cutting means each having a blade and a spindle. <P>SOLUTION: The cutting means are constituted by arranging two spindles 20 and 21 nearly on the same straight line and putting blades 22 and 23 mounted on the spindles opposite each other. The work 14 is moved at right angles relative to the spindles and the work is cut with the two blades at the same time to improve productivity. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a precision cutting device capable of precisely cutting a workpiece such as a semiconductor wafer and a ferrite, and a cutting method using the same.
[0002]
[Prior art]
As a precision cutting device provided with two blades, for example, a dicing device disclosed in Japanese Patent Publication No. 3-11601 is well known as a conventional example. In this dicing apparatus, two spindles are arranged in parallel in the Y-axis direction, and a blade is attached to the tip of each spindle.
[0003]
In this dicing apparatus, for example, when cutting a semiconductor wafer by step cutting, if one of the blades is a V-shaped V-groove blade and the other is a cutting blade, the V-groove blade is used. After forming a V-groove on the surface of the workpiece, the V-groove is further cut with a cutting blade, whereby a chip whose surface is chamfered on a taper can be formed.
[0004]
[Problems to be solved by the invention]
However, since the spindles are arranged in parallel and the blades mounted on the spindles are also arranged in parallel with the cutting direction, the cutting stroke becomes longer, and there is a problem in terms of productivity.
[0005]
Therefore, the conventional precision cutting device has a problem that must be solved in order to improve productivity.
[0006]
[Means for Solving the Problems]
As a specific means for solving the above-mentioned problems, the present invention provides one screw rotating by driving one motor and the other screw rotating by driving the other motor in the Y-axis direction of the base. A first spindle support member that moves in the Y-axis direction by rotation of one screw is engaged with one screw, and a first spindle support member that moves in the Y-axis direction by rotation of the other screw is engaged with the other screw. A second spindle support member is engaged, a first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member. The first blade is mounted on the tip of the spindle of the second, the second blade is mounted on the second spindle, the first spindle and the second spindle, the first blade and the second blade Almost one so as to confront Providing a precision cutting device arranged on the line.
[0007]
According to such a precision cutting device, the first spindle and the second spindle are arranged substantially in a straight line, and the cutting stroke at the time of cutting is the same as that of a single spindle.
[0008]
Further, the present invention is a cutting method for cutting a semiconductor wafer having a circular shape using the above-described precision cutting device, wherein the semiconductor having a circular shape in which a first blade and a second blade are held on a chuck table is provided. The first and second spindles are moved down and the chuck table is moved in the X-axis direction while being positioned at both ends of the wafer in the Y-axis direction, and the outermost street formed in the Y-axis direction is moved to the first axis. The chuck table is moved in the X-axis direction by cutting two at the same time by the blade and the second blade, and while indexing and feeding the first spindle and the second spindle toward the center by a predetermined distance, X streets are formed two by two. A cutting method for cutting in an axial direction is provided.
[0009]
According to the cutting method configured as described above, since the workpiece is a semiconductor wafer having a circular shape, the first blade and the second blade can simultaneously cut the street with the same stroke without waste. .
[0010]
Further, the present invention is a cutting method for cutting a circular semiconductor wafer using the above-mentioned precision cutting device, wherein the first blade and the second blade are held close to each other within a range where they do not collide with each other and held on a chuck table. The first spindle and the second spindle are moved down and the chuck table is moved in the X-axis direction while being positioned at the center of the semiconductor wafer having a circular shape, and formed at the center of the semiconductor wafer having a circular shape. Two streets are cut at the same time, the first spindle and the second spindle are indexed and fed at predetermined intervals in a direction away from the center, and the chuck table is moved in the X-axis direction so that two streets are X each. A cutting method for cutting in an axial direction is provided.
[0011]
Even in the case of the cutting method configured as described above, since the workpiece is a semiconductor wafer having a circular shape, the first blade and the second blade can simultaneously cut the street with the same stroke without waste. .
[0012]
Further, the present invention is a cutting method for cutting a square or rectangular semiconductor wafer using the above-described precision cutting device, wherein a first blade is attached to an end of a square or rectangular workpiece held on a chuck table. With the second blade positioned at the center of the workpiece, the first and second spindles are lowered, and the chuck table is moved in the X-axis direction to move the end and center of the workpiece. The two streets formed in the section are simultaneously cut in the X-axis direction, and the first spindle and the second spindle are moved toward the other end while maintaining the distance between the first spindle and the second spindle. And a cutting method for moving the chuck table in the X-axis direction to cut two streets at a time.
[0013]
According to the cutting method configured as described above, since the workpiece is square or rectangular, there is no waste in the cutting stroke, and all the cutting positions can be cut two by two.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
A dicing apparatus shown in FIG. 1 which is an example of a precision cutting apparatus will be described. When cutting a workpiece using the dicing apparatus 10 shown in FIG. 1, the workpiece is placed on the chuck table 11 and held by suction. For example, when dicing a semiconductor wafer, as shown in FIG. 2, a semiconductor wafer 14 held on a frame 13 via a holding tape 12 is placed on a chuck table 11 and held by suction.
[0015]
On the surface of the semiconductor wafer 14 shown in FIG. 2, there are streets 15 which are linear regions arranged in a grid at predetermined intervals, and a large number of rectangular regions 16 defined by the streets 15 have circuit patterns. Is given. When such a semiconductor wafer 14 is cut (diced) in the street 15, chips are formed in each rectangular area.
[0016]
The chuck table 11 is movable in the X-axis direction, and the semiconductor wafer 14 sucked and held by the chuck table 11 is positioned immediately below the alignment means 17 by moving the chuck table 11 in the X-axis direction before cutting. . Further, the chuck table 11 can be configured to be movable in the Z-axis direction when necessary.
[0017]
When the semiconductor wafer 14 is positioned directly below the alignment means 17 in this manner, the surface of the semiconductor wafer 14 is imaged by an imaging means 18 such as a CCD camera provided below the alignment means 17, and processing such as pattern matching is performed. The street 15 to be cut formed on the surface of the semiconductor wafer 14 is detected. When the chuck table 11 further moves in the X-axis direction, the semiconductor wafer 14 enters the cutting area 19.
[0018]
In the cutting area 19, a first spindle 20 and a second spindle 21, which are arranged substantially in a straight line in the Y-axis direction and have an axis in the Y-axis direction, and a first spindle 20, a second spindle 21 A first blade 22 and a second blade 23 mounted on the tip of the first spindle 20 and the first blade 22 to constitute first cutting means 24; And the second blade 23 constitute a second cutting means 25. In addition, the first spindle 20 and the second spindle 21 are disposed substantially on a straight line so that the first blade 22 and the second blade 23 face each other. The two spindles 21 are independently movable in the Z-axis direction.
[0019]
In the cutting area 19, as shown in FIG. 3, for example, a first screw 27 that is laid across the bottom of the cutting area 19 in the Y-axis direction and is rotated by driving a first motor 26, A first base 28 that is engaged with the first screw 27 and is movable in the Y-axis direction with the rotation of the first screw 27; and a first base 28 that is disposed on the first base 28 in the Y-axis direction. The second screw 30 rotated by the drive of the second motor 29 and the third screw 32 rotated by the drive of the third motor 31 engage with the second screw 30 to rotate the second screw 30. Accordingly, a second base 33 movable in the Y-axis direction and a third base 34 engaged with the third screw 32 and movable in the Y-axis direction as the third screw 32 rotates. And That is, the first base 28 is a common base for the first spindle 20 and the second spindle 21.
[0020]
Then, a first support member 35 is provided upright from the end of the second base 33, and a fourth motor 36 is rotated along with the first support member 35 by driving of a fourth motor 36. A screw 37 is provided. A second support member 38 is provided upright from the end of the third base 34, and a fifth support member 38 is rotated along with the second support member 38 by driving a fifth motor 39. A screw 40 is provided.
[0021]
The fourth screw 37 is engaged with a first spindle support member 41 which moves up and down in the Z-axis direction with the rotation of the fourth screw 37, and the fifth screw 40 has a fifth screw 40 A second spindle support member 42 that moves up and down in the Z-axis direction with the rotation of the second spindle is engaged. Further, the first spindle support member 41 supports the first spindle 20 provided in the Y-axis direction, and the second spindle support member 42 supports the second spindle 21 in the Y-axis direction.
[0022]
A first blade 22 which is a disk-shaped blade is provided at a tip of the first spindle 20, and a second blade 23 which is also a disk-shaped blade is also provided at a tip of the second spindle 21. It is rotatably mounted. As the first blade 22 and the second blade 23, blades of various shapes are adopted according to the shape of the groove to be formed on the surface of the semiconductor wafer 14. For example, when forming a V-shaped groove having a V-shaped cross section, a V-shaped blade having a V-shaped tip is mounted on the spindle. Further, the first blade 22 and the second blade 23 may be of the same type or different types.
[0023]
When cutting the semiconductor wafer 14, the cutting position of the semiconductor wafer 14 is aligned in the Y-axis direction by moving the second base 33 and the third base 34 in the Y-axis direction. Then, as the first blade 22 and the second blade 23 rotate, the first spindle support member 41 and the second spindle support member 42 rotate with the rotation of the fourth screw 37 and the fifth screw 40. Descend. Further, the cutting is performed in the X-axis direction by moving the chuck table 11 in the X-axis direction and, if necessary, in the Z-axis direction.
[0024]
The cutting area 19 may be configured as shown in FIG. In the example of FIG. 4, a first screw 44 that is rotated in the Y-axis direction by driving a first motor 43 is provided between the upper end portions of the cutting area 19 and engaged with the first screw 44. A first base 45 that moves in the Y-axis direction with the rotation of the first screw 44 is provided. A second screw 47 that rotates by driving a second motor 46 and a third screw 49 that rotates by driving a third motor 48 are provided below the first base 45. The second screw 47 and the third screw 49 include a first spindle support member 50 and a second spindle support member that move in the Y-axis direction by the rotation of the second screw 47 and the third screw 49. 51 are engaged. Further, a first spindle 20 and a second spindle 21 are suspended below the first spindle support member 50 and the second spindle support member 51, and the first spindle 20 has a first spindle 20 and a second spindle 21. A blade 22 is mounted on a tip of the second spindle 21, and a second blade 23 is mounted on the second spindle 21. Thus, the first base 45 is a common base for the first spindle 20 and the second spindle 21.
[0025]
In the example of FIG. 4, the first spindle support member 50 and the second spindle support member 51 are, as shown in FIG. The first spindle 20 and the second spindle 21 are driven up and down by the motor 54 and the fifth motor 55.
[0026]
When a workpiece, for example, the semiconductor wafer 14 shown in FIG. 2 is cut using the dicing apparatus 10 configured as described above, the first spindle 20 and the second spindle 21 in the Y-axis direction are cut. By appropriately controlling the movement, cutting can be performed in various ways.
[0027]
For example, as shown in FIG. 6A, first, the first blade 22 and the second blade 23 are positioned at both ends in the Y-axis direction of the semiconductor wafer 14 held on the chuck table 11, The spindle 20 and the second spindle 21 are lowered, and the chuck table 11 is moved in the X-axis direction. That is, the chuck table 11 and the first cutting unit 24 and the second cutting unit 25 are moved in the X-axis direction. By the relative movement, two streets formed on the outermost surface in the Y-axis direction on the surface of the semiconductor wafer 14 as shown in FIG. 7A are simultaneously moved by the first blade 22 and the second blade 23 in the X-axis direction. To cut. In this case, the two streets are cut with the same stroke.
[0028]
Then, the first spindle 20 and the second spindle 21 are indexed and fed toward the center by a predetermined distance, for example, an interval between the streets, and similarly, the chuck table 11 is moved in the X-axis direction to move the streets 15 to 2. Cutting is performed by the same stroke in the X-axis direction, one by one, to form a cutting groove as shown in FIG. 7B.
[0029]
Although not shown in FIG. 6, actually, the first blade 22 and the second blade 23 are provided with blade fixing flanges or the like at their tips, and the blades are covered with a blade cover. . Accordingly, when the first blade 22 and the second blade 23 are indexed and fed at a predetermined interval in the central portion of the semiconductor wafer 14 (for example, a portion where no cutting groove is formed in FIG. May collide. Accordingly, when the distance between the two streets to be cut is smaller than the distance at which the blade can be approached most, either one of the blades, for example, the first blade, as shown in FIG. 22 performs cutting. In this way, all the streets are cut as shown in FIG.
[0030]
By cutting the semiconductor wafer 14 having a circular shape as described above, the first blade 22 and the second blade 23 can simultaneously cut each street with the same stroke without waste.
[0031]
In the example shown in FIG. 8, as shown in FIG. 8A, first, the first blade 22 and the second blade 23 are brought as close as possible within a range where they do not collide, and the center of the semiconductor wafer 14 is The first spindle 20 and the second spindle 21 are moved down and the chuck table 11 is moved in the X-axis direction, and two streets formed in the center of the semiconductor wafer 14 are simultaneously formed in the X-axis direction. By cutting, a cutting groove is formed as shown in FIG. That is, these two streets are cut with the same stroke.
[0032]
Next, as shown in FIG. 8B, the first spindle 20 and the second spindle 21 are indexed and fed at predetermined intervals in a direction away from the center, and the chuck table 11 is moved in the X-axis direction. By moving the street, two streets are cut in the X-axis direction with the same stroke, and a cut groove is formed as shown in FIG. 9B.
[0033]
As shown in FIG. 8 (C), the street in the center where the first blade 22 and the second blade 23 could not be brought close to each other and were not cut was used by one of the blades. What is necessary is just to make it cut. Thus, all the streets are finally cut as shown in FIG.
[0034]
By cutting the semiconductor wafer 14 having a circular shape as described above, the first blade 22 and the second blade 23 are simultaneously moved in each street with the same stroke without waste, as in the case of the example of FIG. Can be cut.
[0035]
In the example shown in FIG. 10, first, as shown in FIG. 10A, the first blade 22 is positioned at the end of the semiconductor wafer 14, and the second blade 23 is positioned at the center of the semiconductor wafer 14. After being positioned, the first spindle 20 and the second spindle 21 are lowered and the chuck table 11 is moved in the X-axis direction, and the streets formed at the end and the center of the semiconductor wafer 14 are moved in the X-axis direction by two. This cutting is performed at the same time, and a cutting groove is formed as shown in FIG.
[0036]
Then, as shown in FIGS. 10B and 10C, while maintaining the distance between the first spindle 20 and the second spindle 21 at this time, the first spindle 20 and the second spindle 21 are moved. The feed is indexed in the direction of the other end, the chuck table 11 is moved in the X-axis direction, and two streets are cut in the X-axis direction as shown in FIGS. 11B and 11C. .
[0037]
By cutting in this manner, all the streets can be cut by two at a time, though some stroke is wasted as compared with the case of FIGS. In this case, for example, when the object to be cut is a square or a rectangle, there is no waste in the cutting stroke, and all the cutting positions can be cut two by two.
[0038]
The example shown in FIG. 12 is a case in which a V-groove is formed on the surface of the semiconductor wafer 14 with a V-groove blade by step cutting, and then cutting is performed to form a chip whose surface is tapered.
[0039]
In this case, as shown in FIG. 12A, the first blade 22 is a V-groove blade, and the second blade 23 is a cutting blade. Then, first, the first blade 22 is positioned on the street of the semiconductor wafer 23, and the chuck table 11 is moved in the X-axis direction to form a V-groove on the surface of the semiconductor wafer 14 in the X-axis direction. The V-groove is indicated by a thick line in FIG.
[0040]
Next, as shown in FIG. 12B, the first blade 22 is moved at a predetermined interval in the Y-axis direction, and the second blade 23 is positioned at the position where the V-groove is formed. The formation of the V-groove and the cutting of the V-groove are sequentially performed in this manner, and cutting is performed as shown in FIG. 13B, and as shown in FIG. 12C, the second blade 23 forms the last V-groove. When the cutting is performed and all the streets are cut as shown in FIG. 13C, a chip whose surface is chamfered in a tapered shape is finally formed.
[0041]
In addition, when using different kinds of blades, it is not limited to using a V-groove blade and a cutting blade as in the example of FIG. 12, and step cutting or the like can be performed by combining blades of various shapes. is there.
[0042]
By performing cutting in this manner, step cutting and the like can be performed with relatively little waste of stroke.
[0043]
【The invention's effect】
As described above, according to the precision cutting device according to the present invention and the cutting method using the precision cutting device, since the first spindle and the second spindle are arranged substantially in a straight line, The cutting stroke at the time is the same as when one spindle is used, and the cutting stroke is significantly shorter than that of the conventional type in which two spindles are arranged in parallel, thereby improving productivity. be able to.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a dicing device as an example of a precision cutting device.
FIG. 2 is a plan view showing a semiconductor wafer as an example of a workpiece to be cut;
FIG. 3 is an explanatory diagram illustrating an example of a configuration of a cutting area of a dicing device.
FIG. 4 is an explanatory diagram illustrating an example of a configuration of a cutting area of a dicing device.
FIG. 5 is an explanatory diagram showing an example of a configuration of a cutting area of the dicing device.
FIG. 6 is an explanatory view showing an example of a cutting method according to the present invention.
FIG. 7 is an explanatory view showing cut grooves formed on a semiconductor wafer by the cutting method.
FIG. 8 is an explanatory view showing an example of a cutting method according to the present invention.
FIG. 9 is an explanatory view showing cut grooves formed on a semiconductor wafer by the cutting method.
FIG. 10 is an explanatory view showing an example of a cutting method according to the present invention.
FIG. 11 is an explanatory view showing cut grooves formed on a semiconductor wafer by the cutting method.
FIG. 12 is an explanatory view showing an example of a cutting method according to the present invention.
FIG. 13 is an explanatory view showing cut grooves formed on a semiconductor wafer by the cutting method.
[Explanation of symbols]
10: Dicing device 11: Chuck table 12: Holding tape 13: Frame 14: Semiconductor wafer 15: Street 16: Rectangular area 17: Alignment means 18: Imaging means 19: Cutting area 20: First spindle 21: Second spindle 22: first blade 23: second blade 24: first cutting means 25: second cutting means 26: first motor 27: first screw 28: first base 29: second Motor 30: Second screw 31: Third motor 32: Third screw 33: Second base 34: Third base 35: First support member 36: Fourth motor 37: Fourth Screw 38: second support member 39: fifth motor 40: fifth screw 41: first spindle support member 42: second spindle support member 43: first motor 44: One screw 45: First base 46: Second motor 47: Second screw 48: Third motor 49: Third screw 50: First spindle support member 51: Second spindle support member 52: Fourth screw 53: Fifth screw 54: Fourth motor 55: Fifth motor

Claims (4)

One screw rotating by driving one motor and the other screw rotating by driving the other motor are arranged in the Y-axis direction of the base,
A first spindle support member that moves in the Y-axis direction by rotation of the one screw engages with the one screw, and moves in the Y-axis direction by rotation of the other screw with the other screw. The second spindle support member to engage,
A first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member.
A first blade is mounted on a tip of the first spindle, a second blade is mounted on the second spindle,
A precision cutting device wherein the first spindle and the second spindle are arranged substantially in a straight line such that the first blade and the second blade face each other. One screw rotating by driving one motor and the other screw rotating by driving the other motor are arranged in the Y-axis direction of the base,
A first spindle support member that moves in the Y-axis direction by rotation of the one screw engages with the one screw, and moves in the Y-axis direction by rotation of the other screw with the other screw. The second spindle support member to engage,
A first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member.
A first blade is mounted on a tip of the first spindle, a second blade is mounted on the second spindle,
The first spindle and the second spindle have a circular shape using a precision cutting device that is disposed substantially in a straight line so that the first blade and the second blade face each other. A cutting method for cutting a semiconductor wafer,
Positioning the first blade and the second blade at both ends in the Y-axis direction of a circular semiconductor wafer held by a chuck table, lowering the first spindle and the second spindle, By moving the chuck table in the X-axis direction, two outermost streets formed in the Y-axis direction are simultaneously cut by the first blade and the second blade,
A cutting method in which the chuck table is moved in the X-axis direction while the first spindle and the second spindle are indexed and fed toward the center by a predetermined distance, and two streets are cut in the X-axis direction. One screw rotating by driving one motor and the other screw rotating by driving the other motor are arranged in the Y-axis direction of the base,
A first spindle support member that moves in the Y-axis direction by rotation of the one screw engages with the one screw, and moves in the Y-axis direction by rotation of the other screw with the other screw. The second spindle support member to engage,
A first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member.
A first blade is mounted on a tip of the first spindle, a second blade is mounted on the second spindle,
The first spindle and the second spindle have a circular shape using a precision cutting device that is disposed substantially in a straight line so that the first blade and the second blade face each other. A cutting method for cutting a semiconductor wafer,
The first spindle and the second spindle are located at the center of a circular semiconductor wafer held by a chuck table by approaching the first blade and the second blade within a range where they do not collide with each other. And moving the chuck table in the X-axis direction to simultaneously cut two streets formed in the center of the circular semiconductor wafer,
The first spindle and the second spindle are indexed and fed at predetermined intervals in a direction away from the central portion, and the chuck table is moved in the X-axis direction to cut two streets in the X-axis direction at a time. Cutting method. One screw rotating by driving one motor and the other screw rotating by driving the other motor are arranged in the Y-axis direction of the base,
A first spindle support member that moves in the Y-axis direction by rotation of the one screw engages with the one screw, and moves in the Y-axis direction by rotation of the other screw with the other screw. The second spindle support member to engage,
A first spindle is disposed below the first spindle support member, and a second spindle is disposed below the second spindle support member.
A first blade is mounted on a tip of the first spindle, a second blade is mounted on the second spindle,
The first spindle and the second spindle are square or rectangular using a precision cutting device that is disposed substantially in a straight line so that the first blade and the second blade face each other. A cutting method for cutting a semiconductor wafer,
The first blade is positioned at an end of a square or rectangular workpiece held on a chuck table, the second blade is positioned at a center of the workpiece,
While lowering the first spindle and the second spindle, the chuck table is moved in the X-axis direction, and two streets formed at the end and the center of the workpiece are simultaneously formed in the X-axis direction. Cutting,
While maintaining the distance between the first spindle and the second spindle, the first spindle and the second spindle are indexed and fed toward the other end, and the chuck table is moved in the X-axis direction. A cutting method that cuts two streets at a time by moving to the street.

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