JPS632344A - Detecting method for wafer chip - Google Patents
Detecting method for wafer chipInfo
- Publication number
- JPS632344A JPS632344A JP61144753A JP14475386A JPS632344A JP S632344 A JPS632344 A JP S632344A JP 61144753 A JP61144753 A JP 61144753A JP 14475386 A JP14475386 A JP 14475386A JP S632344 A JPS632344 A JP S632344A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- wafer
- recognition
- recognized
- operator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To recognize an actual array by simultaneously recognizing a plurality of wafer chips by one visual detection, detecting the positional relationship of a plurality of wafer chips of reference and a pitch between the chips, and moving the recognized position while correcting the recognized position to detect it, thereby eliminating the intermediary of an operator.
CONSTITUTION: A wafer ring 14 having aligned wafer chips 11 is secured on an XY table 15, the chips 11 are picked up by an ITV camera 1, the image is processed by the picked image signal by means of a recognition unit 2, the result is transferred by a communication channel 3 to a die bonder controller 4 to control the table 15 to the recognition position and pickup position of the chips 11. Four wafer chips are simultaneously recognized at the recognition position initially given by an operator, the table 15 is moved by the pickup unit of the chips from the recognition result, the chips are mounted, next recognition position is then calculated including a pitch correction, the table 15 is moved, and similarly recognized. These operations are repeated to mount the chips.
COPYRIGHT: (C)1988,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61144753A JPH0569301B2 (en) | 1986-06-23 | 1986-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61144753A JPH0569301B2 (en) | 1986-06-23 | 1986-06-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS632344A true JPS632344A (en) | 1988-01-07 |
| JPH0569301B2 JPH0569301B2 (en) | 1993-09-30 |
Family
ID=15369578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61144753A Expired - Lifetime JPH0569301B2 (en) | 1986-06-23 | 1986-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0569301B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0412549A (en) * | 1990-05-01 | 1992-01-17 | Rohm Co Ltd | Semiconductor pellet pick up device |
| JP2003028812A (en) * | 2001-07-17 | 2003-01-29 | Shimadzu Corp | Radioscopic apparatus |
| JP2006128231A (en) * | 2004-10-27 | 2006-05-18 | Nidec Tosok Corp | Bonding equipment |
| JP2009016455A (en) * | 2007-07-02 | 2009-01-22 | Nec Corp | Substrate position detecting device and substrate position detecting method |
| JP4919240B2 (en) * | 2010-04-13 | 2012-04-18 | パイオニア株式会社 | Parts transfer apparatus and method |
| WO2012132273A1 (en) * | 2011-03-25 | 2012-10-04 | 東レエンジニアリング株式会社 | Exterior inspection method and device for same |
| WO2014143598A1 (en) * | 2013-03-12 | 2014-09-18 | Microchip Technology Incorporated | Wafer mapping process control with indicator line |
-
1986
- 1986-06-23 JP JP61144753A patent/JPH0569301B2/ja not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0412549A (en) * | 1990-05-01 | 1992-01-17 | Rohm Co Ltd | Semiconductor pellet pick up device |
| JP2526301B2 (en) * | 1990-05-01 | 1996-08-21 | ローム株式会社 | Pickup device for semiconductor pellets |
| JP2003028812A (en) * | 2001-07-17 | 2003-01-29 | Shimadzu Corp | Radioscopic apparatus |
| JP2006128231A (en) * | 2004-10-27 | 2006-05-18 | Nidec Tosok Corp | Bonding equipment |
| JP4490786B2 (en) * | 2004-10-27 | 2010-06-30 | 日本電産トーソク株式会社 | Bonding equipment |
| JP2009016455A (en) * | 2007-07-02 | 2009-01-22 | Nec Corp | Substrate position detecting device and substrate position detecting method |
| JP4919240B2 (en) * | 2010-04-13 | 2012-04-18 | パイオニア株式会社 | Parts transfer apparatus and method |
| WO2012132273A1 (en) * | 2011-03-25 | 2012-10-04 | 東レエンジニアリング株式会社 | Exterior inspection method and device for same |
| CN103460029A (en) * | 2011-03-25 | 2013-12-18 | 东丽工程株式会社 | Exterior inspection method and device for same |
| JP5917492B2 (en) * | 2011-03-25 | 2016-05-18 | 東レエンジニアリング株式会社 | Appearance inspection method and apparatus |
| WO2014143598A1 (en) * | 2013-03-12 | 2014-09-18 | Microchip Technology Incorporated | Wafer mapping process control with indicator line |
| CN105009269A (en) * | 2013-03-12 | 2015-10-28 | 密克罗奇普技术公司 | Wafer mapping process control with indicator line |
| TWI645486B (en) * | 2013-03-12 | 2018-12-21 | 微晶片科技公司 | Wafer mapping process control with indicator line |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0569301B2 (en) | 1993-09-30 |
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