JP2856609B2 - Scribe device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scribing apparatus for cutting an insulating substrate.

[0002]

2. Description of the Related Art In the manufacture of a liquid crystal display element, there is a case where only one side of a glass substrate bonded to two sheets is cut, and a method shown in FIG. 3 is conventionally used.

[0003] As shown in FIG. 3 (a), a scribing device is first scribed with a carbide or diamond cutter 1, and a cut 6 is made along a cutting line on a glass substrate.

[0004] Next, as shown in FIG.
Is placed on a table of a breaker with the squeegee 7 dropped from the glass substrate on the opposite side to the notch 6 to apply an impact. As a result, the glass substrate is cut (breaked) from the cut 6 as a starting point, and only one side can be cut.

[0005]

SUMMARY OF THE INVENTION In the conventional method,
In order to achieve a good yield, the depth of the cut 6 by scribe is important. If the cut 6 is too shallow, a break by the breaking device cannot be performed, and if the cut 6 is too deep, chipping (small cracks) occurs along the cut 6 and abnormal break (break does not follow the cut line) during the break. Occur.

FIG. 4 shows a breaking situation under the scribe condition. As shown in the figure, the depth of the cut depends on the pressing pressure 9 of the cutter 1 with respect to the substrate 2. If the pressure is low, the depth becomes shallow and the break becomes impossible.

In the mechanism shown in FIG .
Press-in pressure is applied.
Because it is a mechanism that supports the shaft with less blur,
There is a limit to vertical movement. Therefore, depending on the thickness of the substrate, the cut becomes shallower in the case of a thin substrate and deeper in the case of a thick substrate with respect to the cutter height setting value (distance from the upper surface of the stage to the tip of the cutter) 8. .

[0008] Here, the cutter pushing pressure 9 shown in FIG.
Is 1.0 kg / cm ² , the widest margin for the thickness variation of the substrate (±
0.08 mm).

However, as shown in FIG. 5, the glass substrate used in the liquid crystal display element has a thickness variation within a range of about ± 0.1 mm (2.04 mm to 2.24 mm) for each substrate in a bonded state. is there.

[0010] Since this exceeds the breakable range, a breakable board or a breakage faulty board always occurs.

Normally, based on the data shown in FIG. 5, the cutter height set value is set to 2.16 mm and the breakable range is set to 2.08 mm.
mm to 2.24 mm. Therefore, 2.08 mm
Approximately 3% of the substrates that are less than the maximum are generated as breakable failures.

An object of the present invention is to provide a scribing apparatus which enables scribing without being affected by variations in the thickness of a substrate.

[0013]

In order to achieve the above object, a scribing apparatus according to the present invention has a substrate thickness measuring sensor and a control unit, and uses an insulated substrate on a stage for cutting by using a cutter. A scribing device for scribing lines, the substrate thickness measurement sensor measures the thickness of the insulating substrate on the stage, and the control unit adjusts the distance from the stage to the cutter blade corresponding to the substrate thickness Is what you do.

[0014]

To achieve the above object, a scribing apparatus according to the present invention has a substrate thickness measuring sensor and a control unit, and cuts an insulating substrate on a stage using a cutter. a scribing apparatus for drawing a scribe line, the substrate thickness measurement sensor is for measuring the thickness of the insulating substrate on the stage, the cutter
In front of the cutter in synchronization with the cutter and measure the thickness of the substrate.
The is intended to feedback to the sequential control unit, the system <br/> control section sequentially feedback from the substrate thickness measurement sensor
The distance from the stage to the cutter blade is adjusted based on the measured thickness of the substrate to be cut.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

( Reference Example ) FIG. 1 is a configuration diagram showing a reference example of the present invention.

In FIG. 1, according to the present invention, a substrate thickness measuring sensor 4 for measuring the thickness of a substrate 2 on a stage 3 is provided, and the height 5 of the cutter 1 is adjusted in accordance with the measured value from the sensor 4. The control unit 10 is provided.

Before scribing the substrate 2 with the cutter 1, a substrate thickness measurement sensor 4 is abutted against the substrate at the center of the substrate to measure the substrate thickness. The controller 5 adjusts the height 5 of the cutter 1 in accordance with the measured value, and starts scribing.

Thus, the cutter height 5 can always be set to an optimum value in accordance with the variation in the thickness of the substrate, and the cut by scribing becomes constant.

(Embodiment) FIG. 2 is a block diagram showing an embodiment of the present invention.

In the configuration shown in FIG . 1, there is one measurement position, and there is a large error in thickness variation over the entire surface of the substrate representing the thickness of the entire substrate at this one position.

Therefore , in the embodiment of the present invention, the substrate thickness measuring sensor 4 is moved forward along the scribe line and the cutter 1 is moved backward in synchronization, and the substrate thickness measurement values are sequentially fed back to the control unit 10. Then, the cutter height 5 is automatically adjusted.

As a result, the cutter height 5 can be set to an optimum value for all the scribe locations, the depth of cut is constant, and there is an advantage that break failure can be reduced.

[0024]

As described above, according to the present invention, the thickness of the substrate is measured and the cutter height is automatically set in accordance with the measured value.
The scribe makes the cutting depth constant. As a result, the occurrence of defects during a break can be reduced from 3% to 1% or less.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a reference example of the present invention.

2 is a block diagram showing an embodiment of the present invention.

FIGS. 3A and 3B are configuration diagrams showing a conventional scribe-break method. FIG.

FIG. 4 is a diagram showing a break state according to a scribe condition.

FIG. 5 is a diagram showing a thickness distribution for each substrate.

[Explanation of symbols]

 Reference Signs List 1 cutter 2 substrate 3 stage 4 substrate thickness measurement sensor 5 cutter height 6 cut 7 squeegee 8 cutter height set value 9 cutter pressing pressure

Claims (1)

(57) [Claims] 1. A and substrate thickness measurement sensor, and a control unit, an insulating substrate on the stage a scribing device to draw the scribe line for cutting by a cutter, the substrate thickness measurement sensor, the stage It is for measuring the thickness of the insulating substrate above, mosquito the front of the cutter
Runs synchronously with the cutter and sequentially controls the measured thickness of the substrate
It is intended to feed back to the section, the control unit sequentially fees from the substrate thickness measurement sensor
A scribing apparatus for adjusting a distance from a stage to a cutter blade based on a measured thickness of a substrate to be driven back .