JPWO2007142264A1 - Substrate cleaving device, substrate cleaving method, and cleaving substrate cleaved using this device or method - Google Patents

Abstract

The present invention provides a substrate cleaving apparatus and a substrate cleaving method that can improve production efficiency and can reduce the load on a cleaved substrate. A substrate cleaving apparatus according to the present invention includes a scribe line forming means for forming a scribe line SB on a planned cutting line J on a substrate to be cut K, and a scribe line formed by the scribe line forming means 40, 50. Bending moment applying means 60 and 90 for applying a bending moment to the cut substrate K so that the cut substrate K can be cut with the scribe line SB as a boundary following the formation of the SB. . [Selection] Figure 1

Description

  The present invention relates to a substrate cleaving apparatus for cutting a brittle material (a substrate to be cleaved) such as a glass plate, ceramics or a wafer, a substrate cleaving method, and a cleaving substrate cleaved using this apparatus or method.

  There are various methods for cutting brittle materials such as glass plates, ceramics, and wafers.

  In a general method, for example, as in Patent Document 1, first, a scribe line is formed along a planned cutting line of a substrate to be cut using a mechanical blade such as a carbide tool, and then separately placed around the scribe line. A bending moment is applied by the break device. Note that the scribe line can also be formed by using laser light as in Patent Document 2, for example, instead of the mechanical blade.

On the other hand, as described in Patent Document 3, a cutter roller for forming a scribe line and a break roller for cleaving are arranged in tandem, and the cutter roller is lowered during retraction and the break roller is retracted. In some cases, a scribe line is formed by placing the cutter roller, and the cutter roller is retracted and the break roller is lowered during backward movement. The break roller is cleaved by applying a tensile force in the width direction of the substrate to be cleaved to both sides of the scribe line.
Japanese Patent Laid-Open No. 6-102480 JP-A-7-276174 Republished patent WO2004 / 007164

  In each method of patent document 1, patent document 2, and patent document 3, since scribe line formation and a break were performed in a respectively separate process (time slot | zone), there existed a problem that production efficiency was not good.

  Further, in each method of Patent Document 1, Patent Document 2, and Patent Document 3, after the formation of one long scribe line, an operation for cutting the scribe line at the boundary is given to the substrate to be cut. It was. In this case, since the scribe line is long, the stress concentration that should be directed to the lower side of the scribe line (that is, the thickness direction of the substrate to be cut) at the time of cleaving is dispersed in the longitudinal direction of the scribe line. The stress value applied to the bottom part of the sheet becomes low. For this reason, it is necessary to make the scribe line formed first deep, or to increase the force to be applied at the time of cleaving, and there is a problem that the load on the substrate to be cleaved is large.

  In particular, in the method of Patent Document 3, the substrate is cleaved by the tensile force in the width direction of the substrate to be cleaved. In this case, it is necessary to form a sufficiently deep scribe line. In order to form such a deep scribe line, a special cutter blade capable of applying a relatively large pressing force is required and a large amount of chips are generated. Further, since the scribe line is deep, the substrate may be broken when an operation such as reversal of the substrate to be cut is accompanied in the middle.

  The present invention has been made in view of such problems, and can provide a substrate cleaving apparatus and a substrate cleaving method that can improve production efficiency and can reduce the load on the cleaved substrate. Objective.

  In order to achieve the above object, the substrate cutting apparatus 10 according to the present invention includes a scribe line forming means 40, 50 for forming a scribe line SB on a planned cutting line J in the substrate to be cut K, and a scribe line forming means 40, 50. Bending moment applying means 60 and 90 for applying a bending moment to the cut substrate K so that the cut substrate K can be cut with the scribe line SB as a boundary following the formation of the scribe line SB. Features.

  Further, the substrate cutting method according to the present invention is a bending of a size that enables the cutting substrate K to be cut with the scribe line SB as a boundary following the formation of the scribe line SB on the cutting planned line J in the cutting substrate K. A moment is applied to the substrate K to be cut.

  According to the present invention, the bending moment applying means 60, 90 follows the formation of the scribe line SB by the scribe line forming means 40, 50, and generates a bending moment capable of cleaving the cut substrate K with the scribe line SB as a boundary. Cleaving is performed by applying to the substrate to be cut K. As described above, since the full cut is performed by one pass, that is, one one-way traveling operation, the production efficiency can be improved. Further, the bending moment applying means 60 and 90 press both side portions T around the scribe line SB immediately after the forming operation of the scribe line SB, thereby applying a bending moment and cutting the substrate to be cut K. That is, since the cleaving is performed by applying mechanical stress and no heating means such as a laser beam is used, the present invention can be applied to the cleaving of a substrate such as an organic EL substrate whose heat-resistant temperature is not so high.

  Further, conventionally, after the formation of one long scribe line SB, an action for cleaving with the scribe line SB as a boundary is given to the substrate to be cut K. In this case, since the scribe line SB is long, the stress concentration to be directed below the scribe line SB (that is, the thickness direction of the substrate to be cut K) at the time of cleaving is dispersed in the longitudinal direction of the scribe line, and the scribe line SB is cracked. The stress value applied to the tip is lowered. For this reason, it is necessary to make the scribe line SB formed first deep, or to increase the force applied when cleaving. On the other hand, in the present invention, immediately after the scribe line SB is formed, a bending moment, which is an action for cleaving, is applied around the scribe line SB. The distance D from the starting point SS of the scribe line SB to the full-cut portion SE is constant and short (see FIG. 6B), and the action for cleaving the scribe line SB of this short distance D Therefore, the dispersion of stress concentration is very small, and the stress value applied to the crack tip of the scribe line SB is high. For this reason, the scribe line SB to be formed first can be relatively shallow, and at the same time, a small force can be applied when cleaving. Therefore, a special cutter blade or the like is not necessary as the scribe line forming means, and only a relatively shallow scribe line such as a laser beam may be formed. Therefore, an excessive load is not applied to the substrate to be cut K, which is suitable for cleaving a delicate substrate such as a liquid crystal dropping injection (ODF) substrate.

  In addition, the load to the to-be-cut substrate K can further be reduced by giving a bending moment using compressed air A1. Further, by supporting the central portion U of the both side portions T of the scribe line SB from the side of the non-formation surface of the scribe line SB in the substrate to be cut K, a bending moment necessary for cleaving can be reliably applied.

  According to the substrate cleaving apparatus and the substrate cleaving method according to the present invention, it is possible to improve the production efficiency and reduce the load on the substrate to be cleaved.

[First Embodiment]
A first embodiment for carrying out the present invention will be described with reference to the accompanying drawings. 1 is a schematic front view of a laser cleaving apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view of a movable table, FIG. 3 is a front view of a cleaving unit during cleaving operation, and FIG. 4 is cleaving during cleaving operation. It is a side view of a unit. In each figure, the three axes of the orthogonal coordinate system are X, Y, and Z, the XY plane is the horizontal plane, and the Z direction is the vertical direction.

  As shown in FIG. 1, the laser cleaving apparatus 10 of the first embodiment includes a movable table 20, an initial crack forming mechanism 30, a laser light irradiation unit 40, a cooling unit 50, and a cleaving unit 60. The initial crack forming mechanism 30, the laser light irradiation unit 40, the cooling unit 50, and the cleaving unit 60 are fixed to the base 70 in a tandem arrangement in this order at a position higher than the movable table 20.

  As shown in FIGS. 2 and 4, the movable table 20 includes a table surface 22 that can hold the placed glass plate K by vacuum suction. The table surface 22 includes a long groove 23 formed so as to be parallel to the Y direction. The depth of the long groove 23 is preferably about 1 mm to 3 mm from the table surface 22. A linear convex portion 24 (24a, 24b) is provided at the central portion in the X direction of the long groove 23 so as to be parallel to the Y direction. Two long grooves 23 are formed in this example. The movable table 20 can be driven in each of the XYZ directions by the table driving device 21 and is driven in the Y1 direction during the cleaving operation.

  The initial crack forming mechanism 30 includes a rotary blade unit 32 having a rotary blade 31 at its tip and capable of being driven up and down, and a starting edge JS of the planned cutting line J on the glass plate K placed and held on the movable table 20 (FIG. 6 (A)) is configured so that a very small initial crack can be formed.

  The laser beam irradiation unit 40 is configured to be able to irradiate the laser beam L output from the laser oscillator toward the surface of the glass plate K from the laser irradiation window 41 via an optical system including a reflection mirror and an expanding lens. Is done. The laser light L emitted from the laser irradiation window 41 has an output sufficient to form the scribe line SB (see FIG. 6B) on the glass plate K. The laser irradiation window 41 is provided in the rear part of the rotary blade 31 with reference to the relative movement direction Y2 of the laser light L with respect to the movable table 20 when the scribe line is formed.

  The cooling unit 50 includes an injection nozzle 51 capable of injecting a mist-like cooling mist M. The injection nozzle 51 is arranged at the rear portion of the laser irradiation window 41 with reference to the relative movement direction Y2 of the laser light L with respect to the movable table 20 during scribe line formation so as to follow the laser light L irradiated on the glass plate K. Provided.

  The cleaving unit 60 includes a pressing roller 61, a roller support unit 62, and an air slider table 63. As shown in FIGS. 3 and 4, the pressing roller 61 includes a shaft 611 parallel to the X axis, two rotating disks 612 fitted to the shaft 611 so as to face each other, and two rotating disks in the shaft 611. A plurality of washers 613 inserted between 612 are provided. The diameter of the rotating disk 612 is about 20 mm to 30 mm, and the material thereof is preferably a metal such as aluminum or stainless steel, or a synthetic resin such as MC (monomer cast) nylon. The interval between the two rotating disks 612 is preferably about 4 mm to 12 mm. By changing the number of washers 613, the distance between the two rotating disks 612 can be adjusted. Moreover, it is preferable that the Y direction distance of the press roller 61 and the injection nozzle 51 can be adjusted.

  The roller support unit 62 includes a first block 621, a second block 622, and a third block 623. The first block 621 supports the pressing roller 61 so as to be rotatable around an axis parallel to the X axis. A bearing 61a is used for the shaft support portion. The second block 622 is fixed to the first block 621 with a bolt 626. The third block 623 pivotally supports the second block 622 by a shaft 624 so as to be rotatable around an axis parallel to the Y axis. The third block 623 is fixed to the movable portion of the air slider table 63 by a bolt 625.

  The air slider table 63 can be selectively arranged at the retracted position and the cleaved position by driving the roller support unit 62 in the vertical direction in the Z direction by compressed air supplied by an air compressor. The retracted position is a position where the lowermost end of the rotating disk 612 in the pressing roller 61 is sufficiently higher than the surface of the glass plate K. The cleaving position is a position where the lowermost end of the rotating disk 612 is slightly lower than the surface of the glass plate K. The cleaving position is set in advance, and when the roller support unit 62 is in this position, the glass plate K is placed around the scribe line SB formed by the scribe line forming means (the laser beam irradiation unit 40 and the cooling unit 50). A bending moment large enough to be cleaved can be applied.

  Next, the cleaving operation of the laser cleaving apparatus 10 will be described with reference to FIG. 5, FIG. 6, and FIG. FIG. 5 is a plan view of a glass plate to be cleaved, FIG. 6 is a plan view showing the cleaving operation by the laser cleaving apparatus of the first embodiment according to the present invention, and FIG. 7 is the first embodiment according to the present invention. It is a flowchart of the cleaving operation by the laser cleaving apparatus.

  As shown in FIG. 5, the glass plate K will be described on the assumption that there are two cutting lines J1 and J2 parallel to each other. It is assumed that the interval between the two scheduled cutting lines J1 and J2 is the same as the interval between the two linear protrusions 24a and 24b in the movable table 20.

  First, the operator places the glass plate K to be cleaved on the table surface 22 (step 100). At this time, the cutting lines J1 and J2 of the glass plate K and the linear protrusions 24a and 24b of the movable table 20 are overlapped with each other. In addition, you may make it make a robot perform operation which puts the glass plate K on the table surface 22. FIG. Next, the operator inputs an instruction to start the cleaving operation for the glass plate K from an input unit of a control device (not shown) (step 110). As a result, a vacuum pressure acts on the suction holes of the table surface 22, and the glass plate K is sucked and held on the table surface 22 (step 120).

  Next, as shown in FIG. 6A, the table driving device 21 has a straight line t1 that connects the movable table 20 on which the glass plate K is placed and held to the rotary blade 31 and the starting end JS of the planned cutting line J1 on the glass plate K. Driving arrangement is performed so as to be parallel to the Y direction (step 130). Next, the initial crack forming mechanism 30 lowers the rotary blade 31 and places it at a position where the blade tip is lower than the surface of the glass plate K (step 140). The air slider table 63 lowers the roller support unit 62 to the cleaving position (step 150).

  Next, the table driving device 21 drives the movable table 20 in the Y1 direction as shown in FIG. 6B (step 160). Due to the movement of the movable table 20, the rotary blade 31 collides with the corner of the glass plate K, that is, the starting end JS of the planned cutting line J1. Immediately thereafter, the initial crack formation mechanism 30 raises the rotary blade 31. As a result, a very small initial crack having a predetermined depth and length is formed at the starting end JS of the planned cutting line J1 (step 170).

  When the initial crack is formed, the laser beam irradiation unit 40 irradiates the laser beam L from the laser irradiation window 41 toward the moving glass plate K (step 180). Moreover, the cooling unit 50 injects the cooling mist M from the injection nozzle 51 so as to follow the laser beam L (step 190). Due to the relative movement of the laser beam L and the cooling mist M with respect to the glass plate K, starting from the starting end JS, the laser beam L abruptly heats the planned cutting line J1 and locally thermally expands to generate a compressive stress, Immediately after that, the coolant M is locally contracted by rapidly cooling the heated portion to generate tensile stress. As a result, the initial crack is used as the starting point of crack growth, and the scribe line SB is formed by continuously growing the micro crack along the planned cutting line J1 on the surface of the glass plate K.

  Immediately after the forming operation of the scribe line SB, the pressing roller 61 rotates about the shaft 611 while pressing the both side portions T so as to straddle the scribe line SB as shown in FIG. At this time, the downward pressing force by the rotating disk 612 generates a bending moment around the scribe line SB, and the portion of the scribe line SB from the starting end JS to the Y-direction position where the rotating disk 612 is in contact is cleaved. . By continuing this operation until the scribe line SB reaches the terminal JE (Yes in Step 200), the glass plate K is completely cleaved with the cleave line J1 as a boundary.

  Thus, according to the laser cleaving apparatus 10, the cleaving unit 60 follows the formation of the scribe line SB by the laser light irradiation unit 40 and the cooling unit 50, and bends the glass plate K so as to cleave the scribe line SB as a boundary. Cleaving is performed by applying a moment to the glass plate K. As described above, since the full cut is performed by one pass, that is, one one-way traveling operation, the production efficiency can be improved. Further, the cleaving unit 60 presses both side portions T around the scribe line SB immediately after the forming operation of the scribe line SB, imparts a bending moment, and cleaves the glass plate K. That is, since the cleaving is performed by applying mechanical stress and no heating means such as a laser beam is used, the present invention can be applied to the cleaving of a substrate such as an organic EL substrate whose heat-resistant temperature is not so high.

  Further, conventionally, after the formation of one long scribe line SB, an action for cleaving with the scribe line SB as a boundary has been imparted to the glass plate K. In this case, since the scribe line SB is long, the stress concentration that should be directed to the lower side of the scribe line SB (that is, in the thickness direction of the glass plate K) at the time of cleaving is dispersed in the longitudinal direction of the scribe line SB. The stress value applied to is reduced. For this reason, it is necessary to make the scribe line SB formed first deep, or to increase the force applied when cleaving. On the other hand, the laser cleaving apparatus 10 gives a bending moment, which is an action for cleaving, around the scribe line SB immediately after the scribe line SB is formed. The distance D from the starting point SS of the scribe line SB to the full-cut portion SE is constant and short (see FIG. 6B), and the action for cleaving the scribe line SB of this short distance D Therefore, the dispersion of stress concentration is very small, and the stress value applied to the crack tip of the scribe line SB is high. For this reason, the scribe line SB to be formed first can be relatively shallow, and at the same time, a small force can be applied when cleaving. Therefore, a special cutter blade or the like is not necessary as the scribe line forming means, and only a relatively shallow scribe line such as a laser beam may be formed. Therefore, no extra load is applied to the glass plate K. In addition, the two rotating disks 612 facing each other are cleaved across the scribe line SB, and the interval between the two rotating disks 612 is relatively wide, about 4 mm to 12 mm, so that it is easy to determine the cleaving conditions. .

  In the laser cleaving apparatus 10, for example, when the table surface 22 of the movable table 20 is slightly tilted in the X direction from the horizontal plane, the pressing roller 61 functions as follows. That is, when one rotating disk 612 comes into contact with the glass plate K that is raised, the other rotation is made on the glass plate K that is lowered with the contact point as a fulcrum and the shaft 624 as a rotation axis. The disk 612 rotates in the direction of contact and stops when it contacts the part. For this reason, even when the glass plate K is slightly inclined from the horizontal plane, the two rotating disks 612 can press the both sides of the scribe line SB with equal pressing force, and stable cleaving can be performed.

  When the cleaving for the planned cutting line J1 is completed, the irradiation of the laser beam L and the injection of the cooling mist M are stopped, and the roller support unit 62 is raised to the retracted position (step 210). Then, the table driving unit 21 drives the movable table 20 in the Y2 direction and returns it to the original position (step 220).

Next, the table driving unit 21 drives the movable table 20 in the X1 direction (step 240) to move it to the cleaving start position of the cleaving planned line J2, and then cleaves in the same manner as cleaving for the cleaving planned line J1. The schedule line J2 is cleaved (steps 130 to 210).
[Second Embodiment]
A second embodiment for carrying out the present invention will be described with reference to FIGS. FIG. 8 is a schematic front view of the laser cleaving apparatus 11 according to the second embodiment of the present invention. In addition, in the laser cleaving apparatus 11 of 2nd Embodiment, the same code | symbol is attached | subjected about the component same as the laser cleaving apparatus 10 of 1st Embodiment. Further, in the following description, for easy understanding, each component of the laser cleaving apparatus 11 of the second embodiment has “′” at the end of the reference numeral of the component of the laser cleaving apparatus 10 of the first embodiment. Although symbols are attached, some of these symbols are not particularly specified in the accompanying drawings for the sake of space.

  As shown in FIG. 8, the laser cleaving apparatus 11 of the second embodiment has a configuration in which an initial crack forming mechanism 30 ′, a cooling unit 50 ′, and a cleaving unit 60 ′ are added to the laser cleaving apparatus 10 of the first embodiment. The The initial crack forming mechanism 30 ′, the cooling unit 50 ′, and the cleaving unit 60 ′ have the same structure as the initial crack forming mechanism 30, the cooling unit 50, and the cleaving unit 60, respectively, in the Y direction with respect to the laser light irradiation unit 40. It is attached so that it becomes an object before and after.

  Next, the cleaving operation of the laser cleaving apparatus 11 will be described with reference to FIGS. 9 and 10. 9 and 10 are flowcharts of the cleaving operation performed by the laser cleaving apparatus 11. As in the case of the first embodiment, the description will be made assuming that the glass plate K to be cleaved has two cleaving lines J1 and J2 (see FIG. 5) parallel to each other.

  First, the operator places the glass plate K to be cleaved on the table surface 22 (step 300). At this time, the planned cutting lines J1 and J2 of the glass plate and the linear protrusions 24a and 24b on the movable table 20 are overlapped. In addition, you may make it make a robot perform operation which puts the glass plate K on the table surface 22. FIG. Next, the operator inputs an instruction to start the cleaving operation for the glass plate K from an input unit of a control device (not shown) (step 310). As a result, a vacuum pressure acts on the suction holes of the table surface 22, and the glass plate K is sucked and held on the table surface 22 (step 320).

  Next, the table driving device 21 drives and arranges the movable table 20 on which the glass plate K is placed and held so that the straight line connecting the rotary blade 31 and the start end JS of the planned cutting line J1 on the glass plate K is parallel to the Y direction. (Step 330). Next, the initial crack forming mechanism 30 lowers the rotary blade 31 and places it at a position where the blade tip is lower than the surface of the glass plate K (step 340). Further, the air slider table 63 lowers the roller support unit 62 to the cleaving position (step 350).

  Next, the table driving device 21 drives the movable table 20 in the Y1 direction (step 360). Due to the movement of the movable table 20, the rotary blade 31 collides with the starting end JS of the planned cutting line J <b> 1 in the glass plate K. Immediately thereafter, the initial crack formation mechanism 30 raises the rotary blade 31. As a result, an extremely small initial crack having a predetermined depth and length is formed at the start end JS of the planned cutting line J1 (step 370).

  When the initial crack is formed, the laser beam irradiation unit 40 irradiates the laser beam L from the laser irradiation window 41 toward the moving glass plate K (step 380). Moreover, the cooling unit 50 injects the cooling mist M from the injection nozzle 51 so as to follow the laser beam L (step 390). Due to the relative movement of the laser beam L and the coolant M with respect to the glass plate K, the laser beam L starts from the starting edge JS and rapidly heats the planned cutting line J1 to locally expand, thereby generating a compressive stress. Immediately after that, the coolant M is locally contracted by rapidly cooling the heated portion to generate tensile stress. As a result, the initial crack is used as the starting point of crack growth, and the scribe line SB is formed by continuously growing the micro crack along the planned cutting line J1 on the surface of the glass plate K.

  Immediately after the forming operation of the scribe line SB, the pressing roller 61 rotates about the shaft 611 while pressing the both side portions T so as to straddle the scribe line SB as shown in FIG. At this time, the downward pressing force by the rotating disk 612 generates a bending moment around the scribe line SB, and the portion of the scribe line SB from the starting end JS to the Y-direction position where the rotating disk 612 is in contact is cleaved. . By continuing this operation until the scribe line SB reaches the end JE (Yes in Step 400), the glass plate K is completely cleaved with the cleave line J1 as a boundary.

  When the cleaving for the cleaving planned line J1 is completed, the irradiation of the laser light L and the injection of the cooling mist M are stopped, and the roller support unit 62 'is raised to the retracted position (step 410). Thereafter, unlike the case of the first embodiment, the table driving unit 21 performs the cleaving on the cleaving planned line J2 as follows without driving the movable table 20 in the Y2 direction and returning it to the original position.

  First, the table driving device 21 drives the movable table 20 on which the glass plate K is placed and held in the X direction, so that the rotary blade 31 ′ and the start end of the cutting line J2 on the glass plate K (the end JE of the cutting line J1) Driving is arranged so that the straight line connecting the same side) is parallel to the Y direction (steps 425 and 530). Next, the initial crack forming mechanism 30 ′ lowers the rotary blade 31 ′ and arranges it at a position where the cutting edge is lower than the surface of the glass plate K (step 540). The air slider table 63 'lowers the roller support unit 62' to the cleave position (step 550).

  Next, the table driving device 21 drives the movable table 20 in the Y2 direction (step 560). Due to the movement of the movable table 20, the rotary blade 31 ′ collides with the starting end of the planned cutting line J <b> 2 in the glass plate K. Immediately thereafter, the initial crack formation mechanism 30 'raises the rotary blade 31'. As a result, a very small initial crack having a predetermined depth and length is formed at the starting end of the planned cutting line J2 (step 570).

  When the initial crack is formed, the laser beam irradiation unit 40 irradiates the laser beam L from the laser irradiation window 41 toward the moving glass plate K (step 580). Further, the cooling unit 50 'jets the cooling mist from the jet nozzle 51' so as to follow the laser beam L (step 590). By the relative movement of the laser beam L ′ and the cooling mist M ′ with respect to the glass plate K, the laser beam L rapidly heats and locally expands the planned cutting line J2, starting from the starting end of the planned cutting line J2. A compressive stress is generated, and the coolant is contracted locally by abruptly cooling the heated portion immediately thereafter to generate a tensile stress. Thereby, the initial crack is used as the starting point of crack propagation, and the microcrack along the planned cutting line J2 is continuously grown on the surface of the glass plate K to form a scribe line.

  Immediately after the scribe line forming operation, the pressing roller 61 ′ rotates about the shaft 611 ′ while pressing both side portions T across the scribe line. At this time, the downward pressing force by the rotating disk 612 'causes a bending moment around the scribe line, and the portion of the scribe line from the starting end to the Y-direction position where the rotating disk 612' abuts is cleaved. By continuing this operation until the scribe line reaches the end (Yes in step 600), the glass plate K is completely cleaved at the cleaved line J2.

  When the cleaving line J2 is cleaved, the irradiation of the laser beam L and the cooling mist are stopped, and the pressing roller 61 'of the cleaving unit 60' moves up to the retracted position (step 610).

The cleaving operation of the laser cleaving apparatus 11 of the second embodiment differs from the cleaving operation of the laser cleaving apparatus 10 of the first embodiment in the following points. That is, the table driving unit 21 does not drive the movable table 20 in the Y2 direction to return to the original position and then drive in the Y1 direction again when cleaving the planned cutting line J2 in the glass plate K. On the return after the cleaving for the planned line J1, the cleaving for the cleaved planned line J2 is performed. The same applies when the number of planned cutting lines J is three or more. For this reason, it is possible to cleave a plurality of planned cutting lines J in a short tact time.
[Third Embodiment]
A third embodiment for carrying out the present invention will be described with reference to FIGS. FIG. 11 is a schematic front view showing a main part of a laser cleaving apparatus according to a third embodiment of the present invention, and FIG. 12 is a schematic side view thereof. In addition, in the laser cleaving apparatus 12 of 3rd Embodiment, the same code | symbol is attached | subjected about the component same as the laser cleaving apparatus 10 of 1st Embodiment.

  As shown in FIGS. 11 and 12, the laser cleaving apparatus 12 of the third embodiment includes a movable table 20 </ b> A instead of the movable table 20 of the laser cleaving apparatus 10 of the first embodiment, and a support roller 81. The movable table 20A includes a long hole 20H that penetrates in the thickness direction and is formed along the Y direction. The support roller 81 is disposed in the elongated hole 20H so as to face the position between the two rotating disks 612 in the pressing roller 61, and is connected to the shaft 811 parallel to the X axis and the shaft 811 so as to face each other. And a rotating disk 812 fitted therein. The diameter of the rotating disk 812 is about 20 mm to 30 mm. Like the rotating disk 612, the material is preferably a metal such as aluminum or stainless steel, or a synthetic resin such as MC (monomer cast) nylon.

In the laser cleaving apparatus 12 of the third embodiment, the rotating disk 812 in the support roller 81 functions as the linear protrusion 24 in the laser cleaving apparatus 10 of the first embodiment. That is, when the glass plate K to be cleaved is placed on the table surface 22, the cleaved planned line J of the glass plate K and the tip of the rotating disk 812 are overlapped. Subsequent operations are substantially the same as those described in the first embodiment, and are therefore omitted. In the laser cleaving apparatus 10 according to the first embodiment, it is necessary to process the linear convex portion 24 of the movable table 20 with sufficient accuracy in the parallelism and the tip angle in the Y direction, but the laser cleaving according to the third embodiment. Such a need does not occur in the device 12.
[Fourth Embodiment]
A fourth embodiment for carrying out the present invention will be described with reference to FIGS. 13 and 14. FIG. 13 is a schematic front view showing a main part of a laser cleaving apparatus according to a fourth embodiment of the present invention, and FIG. 14 is a schematic side view thereof. In addition, in the laser cleaving apparatus 13 of 4th Embodiment, the same code | symbol is attached | subjected about the same component as the laser cleaving apparatus 10 of 1st Embodiment, or the laser cleaving apparatus 12 of 3rd Embodiment.

  As shown in FIGS. 13 and 14, the laser cleaving apparatus 13 of the fourth embodiment includes a movable table 20 </ b> A instead of the movable table 20 of the laser cleaving apparatus 10 of the first embodiment, and cleaves instead of the cleaving unit 60. A unit 90 is provided, and a supporting air injection device 100 is further provided. The movable table 20A is the same as that described in the third embodiment.

  The cleaving unit 90 includes two pressed air ejection nozzles 91 disposed at a predetermined interval in the X direction. The pressed air ejection nozzle 91 is configured to be able to eject compressed air A1 toward both side portions T on the surface of the glass plate K that are substantially equidistant from the scribe line SB. The compressed air A1 has such a strength that a bending moment sufficient to break the glass plate K can be applied around the scribe line SB. The support air injection device 100 is disposed in the elongated hole 20H so as to face the position between the two pressed air injection nozzles 91, and includes a support air injection nozzle 101. The support air injection nozzle 101 can inject the compressed air A2 having such a strength that it can support the glass plate K against the compressed air A1 ejected from the pressure air ejection nozzle 91 toward the back surface of the glass plate K. Configured.

  In the laser cleaving apparatus 13 of the fourth embodiment, the compressed air A1 ejected from the two pressing air ejection nozzles 91 of the cleaving unit 90 fulfills the function of the rotating disk 612 in the laser cleaving apparatus 10 of the first embodiment. Further, the compressed air A <b> 2 ejected from the support air ejection nozzle 101 functions as the linear convex portion 24. Therefore, when the glass plate K to be cleaved is placed on the table surface 22, the cleaved planned line J of the glass plate K and the ejection position of the support air ejection nozzle 101 are overlapped. By inputting the cutting operation start command, the compressed air A1 and A2 are ejected from the pressing air ejection nozzle 91 and the support air ejection nozzle 101, respectively. Then, the movable table 20A is moved, the initial crack is formed, and the scribe line SB is sequentially formed. Following the formation of the scribe line SB, the compressed air A1 and A2 are ejected from both the air ejection nozzles 91 and 101. A bending moment sufficient to cleave the glass plate K is applied around the scribe line SB, and the glass plate K is cleaved. In the laser cleaving device 13 of the fourth embodiment, the cleaving unit 90 uses compressed air as a force for pressing and supporting the glass plate K, and can cleave the glass plate K in a non-contact manner. It is suitable for a delicate glass plate K such as an ODF substrate.

  The first to fourth embodiments of the present invention have been described above. However, the embodiment disclosed above is merely an example, and the scope of the present invention is not limited to this embodiment. Absent. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. For example, in the first embodiment and the second embodiment, the scribe line forming means is a laser beam irradiation unit and a cooling unit, but may be a mechanical blade such as a cemented carbide tool instead.

1 is a schematic front view of a laser cleaving apparatus according to a first embodiment of the present invention. It is a top view of a movable table. It is a front view of a cleaving unit. It is a side view of the cleaving unit during cleaving operation. It is a top view of the glass plate used as the cutting object. It is a figure which shows in plan view the cleaving operation by the laser cleaving apparatus of the first embodiment according to the present invention. It is a flowchart of the cleaving operation | movement by the laser cleaving apparatus of 1st Embodiment which concerns on this invention. It is the front schematic of the laser cleaving apparatus of 2nd Embodiment which concerns on this invention. It is a flowchart of the cleaving operation | movement by the laser cleaving apparatus of 2nd Embodiment which concerns on this invention. It is a flowchart of the cleaving operation | movement by the laser cleaving apparatus of 2nd Embodiment which concerns on this invention. It is a front schematic diagram which shows the principal part of the laser cleaving apparatus of 3rd Embodiment which concerns on this invention. It is the side schematic diagram which shows the principal part of the laser cutting apparatus of 3rd Embodiment which concerns on this invention. It is a front schematic diagram which shows the principal part of the laser cleaving apparatus of 4th Embodiment which concerns on this invention. It is the side schematic diagram which shows the principal part of the laser cleaving apparatus of 4th Embodiment which concerns on this invention.

Explanation of symbols

10 Laser cleaving device (substrate cleaving device)
20 Movable table (holding means)
20A movable table (holding means)
24 Linear convex part (support means)
40 Laser light irradiation unit (scribe line forming means)
50 Cooling unit (scribe line forming means)
60 Cleaving unit (means for applying bending moment)
61 Press roller 81 Support roller (support means)
90 Cleaving unit (means for applying bending moment)
91 Pressing air injection nozzle 101 Support air injection device (support means)
101 Support Air Injection Nozzle 612 Rotating Disk A1 Compressed Air A2 Compressed Air J Planned Cutting Line K Glass Plate (Cut Board)
SB scribe line T both sides U center part X direction Y2 direction (relative movement direction)

Claims (17)

A scribe line forming means (40, 50) for forming a scribe line (SB) on the planned cutting line (J) in the substrate to be cut (K);
Following the formation of the scribe line (SB) by the scribe line forming means (40, 50), the substrate to be cut (a bending moment of a size capable of cleaving the cut substrate (K) with the scribe line (SB) as a boundary) And a bending moment applying means (60, 90) to be applied to K).   The substrate cleaving unit according to claim 1, wherein the bending moment applying means (60, 90) is configured to apply a force in a thickness direction of the substrate to be cut (K) to both side portions (T) of the scribe line (SB). apparatus.   The substrate cleaving apparatus according to claim 2, wherein the bending moment applying means (60) includes a pressing roller (61) that presses both side portions (T) of the scribe line (SB).   The substrate according to claim 2, wherein the bending moment applying means (90) includes a pressing air injection nozzle (91) for discharging and pressing the compressed air (A1) toward both side portions (T) of the scribe line (SB). Cleaving device.   The support means (24, 81, 100) for supporting the central part (U) of the both side parts (T) from the side of the non-formation surface of the scribe line (SB) in the substrate to be cut (K). Item 5. The substrate cleaving apparatus according to any one of Items 4 to 5.   The supporting means (100) supports the central portion (U) of the both side portions (T) by jetting compressed air (A2) from the side of the surface to be cut (SB) where the scribe line (SB) is not formed. The board | substrate cleaving apparatus of Claim 5 provided with the support air injection nozzle (101) to perform.   The substrate cleaving apparatus according to any one of claims 1 to 6, wherein the substrate to be cleaved (K) is a brittle material. Substrate holding means (20) for holding the substrate to be cut (K);
The scribe line forming means (40, 50) is provided so as to be relatively movable with respect to the substrate holding means (20), and forms a scribe line (SB) on the planned cutting line (J) of the substrate to be cut (K) by the relative movement. )When,
Provided integrally with the scribe line forming means (40, 50) behind the scribe line forming means (40, 50) with reference to the relative movement direction (Y2) of the scribe line forming means (40, 50) with respect to the substrate to be cut (K) during scribe line formation. Then, following the formation of the scribe line (SB) by the scribe line forming means (40, 50), a force in the thickness direction of the substrate to be cut (K) is applied to both side portions (T) of the scribe line (SB). And a bending moment applying means (60, 90) for applying a bending moment of a magnitude that enables the substrate to be cut (K) to be cut with the scribe line (SB) as a boundary.   A bending moment large enough to break the substrate to be cut (K) with the scribe line (SB) as a boundary following the formation of the scribe line (SB) on the cutting line (J) on the substrate to be cut (K) Is applied to the substrate to be cut (K).   The substrate cutting method according to claim 9, wherein a bending moment is applied by applying a force in a thickness direction of the substrate to be cut (K) to both side portions (T) of the scribe line (SB).   The substrate cleaving method according to claim 10, wherein a bending moment is applied by pressing both side portions (T) of the scribe line (SB) with a pressing roller (61).   The substrate cleaving method according to claim 10, wherein a bending moment is applied by jetting compressed air (A1) toward both side portions (T) of the scribe line (SB).   The board | substrate cleaving in any one of Claims 9-12 which supports the center part (U) of the said both-sides part (T) from the non-formation surface side of the scribe line (SB) in a to-be-cleaved board | substrate (K). Method.   The center part (U) of the said both-sides part (T) is supported by ejecting compressed air (A2) from the side of the non-formation surface of the scribe line (SB) in the substrate to be cut (K). Substrate breaking method.   The substrate cutting method according to claim 9, wherein the substrate to be cut (K) is a brittle material.   A cleaved substrate cleaved using the substrate cleaving apparatus according to claim 1. A cleaved substrate cleaved using the substrate cleaving method according to claim 9.

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