JP2007246298A - Method and apparatus for cutting brittle material - Google Patents

Method and apparatus for cutting brittle material Download PDF

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Publication number
JP2007246298A
JP2007246298A JP2006068233A JP2006068233A JP2007246298A JP 2007246298 A JP2007246298 A JP 2007246298A JP 2006068233 A JP2006068233 A JP 2006068233A JP 2006068233 A JP2006068233 A JP 2006068233A JP 2007246298 A JP2007246298 A JP 2007246298A
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brittle material
support means
cleaving
line
laser light
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Ryoji Koseki
良治 小関
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Shibuya Corp
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Shibuya Kogyo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method efficiently and securely cutting a brittle material 2 by floating the brittle material 2 on a supporting means 3. <P>SOLUTION: The cutting apparatus 1 for cutting the brittle material 2 is provided with: a treatment head 4 for irradiating laser light L; and the supporting means 3 for supporting the thin sheet-shaped brittle material 2. In the supporting means 3, many jetting holes 3B are opened at the upper face 3A thereof. Compressive air is fed from the feed source 25 of the compressive air to an air passage 23, so as to be jetted from the jetting holes 3B toward the upper part, and the brittle material 2 is floated up from the upper face 3A by the compressive air. In the state where the brittle material 2 is floated up in this way, a scribe line is formed at a cutting schedule line 22 by a mechanical cutter 17, and then, the laser light L is irradiated thereto, so as to cut the brittle material 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は脆性材料の割断方法とその装置に関し、より詳しくは、例えばガラスの割断予定線にスクライブ線を形成した後に該スクライブ線に沿ってレーザ光を移動させながら照射して割断するようにした脆性材料の割断方法とその装置に関する。   The present invention relates to a method and apparatus for cleaving a brittle material, and more specifically, for example, after forming a scribe line on a planned cleaving line of glass, it is cleaved by irradiation while moving laser light along the scribe line. The present invention relates to a brittle material cleaving method and apparatus.

従来、ガラス等の脆性材料を所要の大きさに割断する割断装置として、例えば特許文献１が知られている。本願の図９に簡略化して示したように、上記特許文献１においては、メカニカルカッター１７によって脆性材料２（ガラス）の割断予定線にスクライブ線を形成し、そのスクライブ線の箇所にレーザ光Ｌを移動させながら照射することで、上記スクライブ線を形成した箇所の内部に熱応力を生じさせて脆性材料２を割断するようにしている。
特開平１１−３４２４８３号公報 Conventionally, for example, Patent Document 1 is known as a cleaving apparatus that cleaves a brittle material such as glass into a required size. As shown in FIG. 9 of the present application in a simplified manner, in Patent Document 1, a scribe line is formed on the planned cutting line of the brittle material 2 (glass) by the mechanical cutter 17, and the laser beam L is applied to the scribe line. By irradiating while moving, the brittle material 2 is cleaved by generating thermal stress inside the portion where the scribe line is formed.
Japanese Patent Laid-Open No. 11-342483

ところで、従来の割断装置では、図９に示したように、割断加工中において脆性材料２の下面全域が支持手段３上に密着した状態となっている。このように脆性材料２が支持手段３に接触して載置されている場合、レーザ光を照射して脆性材料２の内部に熱応力を発生させても、脆性材料２が効率的に割断されにくいため、加工速度が遅くなるという欠点があった。   By the way, in the conventional cleaving apparatus, as shown in FIG. 9, the entire lower surface of the brittle material 2 is in close contact with the support means 3 during cleaving. When the brittle material 2 is placed in contact with the support means 3 as described above, the brittle material 2 is efficiently cleaved even if thermal stress is generated inside the brittle material 2 by irradiation with laser light. Since it was difficult, there was a drawback that the processing speed was slow.

上述した事情に鑑み、請求項１に記載した本発明は、脆性材料に下方側から気体を吹き付けて浮上させた状態において、上記脆性材料における割断予定線に沿ってレーザ光を移動させながら照射して、脆性材料を上記割断予定線のとおりに割断するようにした脆性材料の割断方法を提供するものである。
また、請求項３に記載した本発明は、脆性材料を支持する支持手段と、支持手段に支持された脆性材料にレーザ光を照射するレーザ光照射手段と、上記支持手段に支持された脆性材料とレーザ光とを相対移動させる相対移動手段とを備え、脆性材料の割断予定線に沿ってレーザ光を移動させながら照射して脆性材料を割断するようにした脆性材料の割断装置において、
上記脆性材料に下方側から気体を吹き付けて支持手段上に脆性材料を浮上させる浮上手段を設けて、該浮上手段によって支持手段上に脆性材料を浮上させた状態で脆性材料を割断するようにしたものである。 In view of the circumstances described above, the present invention described in claim 1 irradiates the brittle material while moving the laser light along the planned cutting line in the brittle material in a state where the gas is blown from the lower side and floated. Thus, the present invention provides a method for cleaving a brittle material, in which the brittle material is cleaved according to the above-mentioned cleaving line.
According to a third aspect of the present invention, there is provided a supporting means for supporting a brittle material, a laser beam irradiation means for irradiating a brittle material supported by the supporting means with a laser beam, and a brittle material supported by the supporting means. And a relative movement means for relatively moving the laser beam, and a brittle material cleaving apparatus that cleaves the brittle material by irradiating the laser beam while moving along the planned fracture line of the brittle material.
A levitation means is provided to float the brittle material on the support means by blowing a gas from below on the brittle material, and the brittle material is cleaved in a state where the brittle material is levitated on the support means by the levitation means. Is.

上述した構成によれば、脆性材料は支持手段から浮上し、非接触の状態で割断されるので、脆性材料を効率的かつ確実に割断することができる。したがって、従来と比較して加工速度が速い脆性材料の割断方法とその装置を提供することができる。   According to the configuration described above, the brittle material floats from the support means and is cleaved in a non-contact state, so that the brittle material can be cleaved efficiently and reliably. Therefore, it is possible to provide a brittle material cleaving method and apparatus that have a higher processing speed than conventional ones.

以下図示実施例について説明すると、図１ないし図２において、１は板状の脆性材料２（ガラス）を所要形状に割断する割断装置である。
割断装置１は、被加工物としての脆性材料２を下方側から水平に支持する支持手段３と、この支持手段３上に支持された脆性材料２にレーザ光Ｌを照射して割断する処理ヘッド４と、脆性材料２としてのガラスに吸収されやすい波長であるＣＯ２レーザ光Ｌを発振するＣＯ２レーザ発振器５と、このＣＯ２レーザ発振器５から発振したレーザ光Ｌを処理ヘッド４へ導光する導光手段６とを備えている。
支持手段３は水平面のＹ方向に設けたガイド部材７に移動可能に取り付けられており、支持手段３は図示しない第１駆動源によってＹ方向に移動されるようになっている。
支持手段３上には、水平面において上記Ｙ方向と直交するＸ方向にガイド部材８を連結してあり、このガイド部材８に上記処理ヘッド４をＸ方向に移動可能に取り付けている。処理ヘッド４は、図示しない第２駆動源によりガイド部材８に沿ってＸ方向に移動されるようになっている。
上記第１駆動源及び第２駆動源は図示しない制御装置によって作動を制御されるようになっている。 1 to 2, reference numeral 1 denotes a cleaving device that cleaves a plate-like brittle material 2 (glass) into a required shape.
The cleaving apparatus 1 includes a supporting means 3 that horizontally supports a brittle material 2 as a workpiece from below, and a processing head that cleaves the brittle material 2 supported on the supporting means 3 by irradiating it with a laser beam L. 4, a CO 2 laser oscillator 5 for oscillating a CO 2 laser beam L is being susceptible wavelength absorption in the glass as a brittle material 2, guiding the laser beam L emitted from the CO 2 laser oscillator 5 to the processing head 4 And a light guide means 6 for carrying out the above.
The support means 3 is movably attached to a guide member 7 provided in the Y direction on the horizontal plane, and the support means 3 is moved in the Y direction by a first drive source (not shown).
On the support means 3, a guide member 8 is connected in the X direction perpendicular to the Y direction on the horizontal plane, and the processing head 4 is attached to the guide member 8 so as to be movable in the X direction. The processing head 4 is moved in the X direction along the guide member 8 by a second driving source (not shown).
The operations of the first drive source and the second drive source are controlled by a control device (not shown).

処理ヘッド４は、上記ガイド部材８にＸ方向に移動可能に取り付けられた上部ケーシング１１と、この上部ケーシング１１の下面に鉛直方向の軸心を中心として回動可能に連結された下部ケーシング１２とを備えている。下部ケーシング１２は上部ケーシング１１に対して図示しない第３駆動源によって水平面のθ方向に回動することができるようになっている。第３駆動源も図示しない制御装置によって作動を制御されるようになっている。
下部ケーシング１２内にはレーザ光Ｌの光軸上に発振器側から順にシリンドリカルレンズ１３、ビームシェイパ１４、シリンドリカルレンズ１５が配置され、レーザ光Ｌを図３に示したような細長い断面形状となるように成形している。
また、上部ケーシング１１内にはベンドミラー２１を配置している。レーザ発振器５から発振されたレーザ光Ｌは、導光手段６を構成するビームホモジナイザ１９およびコリメートレンズ２０を透過した後に、ベンドミラー２１へ導かれて、それに反射されてから下部ケーシング１２へ導かれるようになっている。 The processing head 4 includes an upper casing 11 that is attached to the guide member 8 so as to be movable in the X direction, and a lower casing 12 that is connected to the lower surface of the upper casing 11 so as to be rotatable about a vertical axis. It has. The lower casing 12 can be rotated with respect to the upper casing 11 in the θ direction of the horizontal plane by a third drive source (not shown). The operation of the third drive source is also controlled by a control device (not shown).
In the lower casing 12, a cylindrical lens 13, a beam shaper 14, and a cylindrical lens 15 are arranged in this order from the oscillator side on the optical axis of the laser beam L so that the laser beam L has an elongated cross-sectional shape as shown in FIG. Molding.
A bend mirror 21 is disposed in the upper casing 11. The laser light L oscillated from the laser oscillator 5 passes through the beam homogenizer 19 and the collimating lens 20 constituting the light guiding means 6, is guided to the bend mirror 21, is reflected by it, and then is guided to the lower casing 12. It is like that.

処理ヘッド４は、細長く形成したレーザ光Ｌの長手方向一側の下部ケーシング１２の側部にカッターケーシング１０を備えており、内部にメカニカルカッター１７が回転自在に取り付けられている。
メカニカルカッター１７の刃先はダイヤモンド製であり、割断加工時にはメカニカルカッター１７はレーザ光Ｌの照射位置に先行するように制御される。
前述した３つの駆動源によって処理ヘッド４は脆性材料２に対して水平面において相対移動されることで、図３に示すように、メカニカルカッター１７が先行して脆性材料２の割断予定線２２上を移動して、その割断予定線２２に沿ってスクライブ線を形成し、メカニカルカッター１７の移動に追従してレーザ光Ｌの照射位置が上記スクライブ線の形成された割断予定線２２に照射されて割断されるようになっている。
スクライブ線は上面に微小なＶ溝が形成され、そのＶ溝の底部から下面に向けて微小なクラックが生じており、スクライブ線が形成された割断予定線２２にレーザ光Ｌを照射することでスクライブ線から膨張する方向に熱応力が生じ、上記微小なクラックが下面まで成長することにより上記割断予定線２２で完全に割断されるようになっている。 The processing head 4 includes a cutter casing 10 on the side of the lower casing 12 on one side in the longitudinal direction of the laser beam L formed in an elongated shape, and a mechanical cutter 17 is rotatably mounted therein.
The cutting edge of the mechanical cutter 17 is made of diamond, and the mechanical cutter 17 is controlled to precede the irradiation position of the laser beam L during cleaving.
The processing head 4 is relatively moved in the horizontal plane with respect to the brittle material 2 by the three driving sources described above, so that the mechanical cutter 17 precedes the planned breaking line 22 of the brittle material 2 as shown in FIG. It moves, forms a scribe line along the planned cutting line 22, and follows the movement of the mechanical cutter 17, and the irradiation position of the laser beam L is irradiated to the planned cutting line 22 on which the scribe line is formed. It has come to be.
The scribe line has a minute V-groove formed on the upper surface, and a minute crack is generated from the bottom of the V-groove toward the lower surface. By irradiating the planned cutting line 22 on which the scribe line is formed with the laser beam L, Thermal stress is generated in the direction of expansion from the scribe line, and the minute crack grows up to the lower surface, so that it is completely cleaved by the cleaving line 22.

次に、図４ないし図５に示すように、支持手段３は上記ガイド部材７に水平となるように取り付けられている。
支持手段３の内部には、水平面において網目状のエア通路２３を形成してあり、このエア通路２３から連通させて上方に向けて支持手段３の上面３Ａに開口する噴出孔３Ｂを多数形成している。噴出孔３Ｂは、支持手段３の上面３ＡにおけるＸＹ方向（縦横）に等ピッチで形成されている。
エア通路２３の端部は、支持手段３の一側に開口させてあり、この開口部２３Ａは導管２４を介して圧縮空気の供給源２５に連通させている。導管２４の途中には、図示しない制御装置によって作動を制御される電磁開閉弁２６を設けている。
制御装置が電磁開閉弁２６を開放させると、導管２４を介して供給源２５からエア通路２３内に圧縮空気が導入され、さらにその圧縮空気は支持手段３の上面３Ａに開口する多数の噴出孔３Ｂをから上方に向けて噴出されるようになっている。
本実施例では、このように各噴出孔３Ｂから上方へ向けて圧縮空気を噴出させることにより、支持手段３の上面３Ａに脆性材料２を僅かに浮上させた状態で支持するようにしている。
本実施例においては、圧縮空気の供給源２５、導管２４、エア通路２３および噴出孔３Ｂによって脆性材料を浮上させる浮上手段１８を構成している。 Next, as shown in FIGS. 4 to 5, the support means 3 is attached to the guide member 7 so as to be horizontal.
Inside the support means 3, a mesh-like air passage 23 is formed in a horizontal plane, and a large number of ejection holes 3 B communicating with the air passage 23 and opening upward on the upper surface 3 A of the support means 3 are formed. ing. The ejection holes 3B are formed at an equal pitch in the XY direction (vertical and horizontal) on the upper surface 3A of the support means 3.
An end of the air passage 23 is opened to one side of the support means 3, and the opening 23 </ b> A communicates with a compressed air supply source 25 through a conduit 24. An electromagnetic on-off valve 26 whose operation is controlled by a control device (not shown) is provided in the middle of the conduit 24.
When the control device opens the electromagnetic on-off valve 26, compressed air is introduced from the supply source 25 into the air passage 23 via the conduit 24, and the compressed air is further opened to the upper surface 3 </ b> A of the support means 3. It is ejected from 3B upward.
In the present embodiment, the brittle material 2 is supported in a slightly floated state on the upper surface 3A of the support means 3 by ejecting the compressed air upward from the respective ejection holes 3B in this way.
In the present embodiment, the compressed air supply source 25, the conduit 24, the air passage 23, and the ejection hole 3 </ b> B constitute the levitating means 18 that levitates the brittle material.

さらに、浮上手段１８によって支持手段３上に浮上させた脆性材料２の水平方向の位置決めをする位置決め手段２７を設けてあり、この位置決め手段２７によって支持手段３の上面３Ａ上に浮上させた脆性材料２を図４に示した基準位置に位置決めするようにしている。
位置決め手段２７は、支持手段３の上面３ＡにおけるＸ方向の一方の端部側にＹ方向に離隔して立設した２つの位置決め用のストッパピン２８，２８を備えるとともに、支持手段３の上面３ＡにおけるＹ方向の一方の端部側にＸ方向に離隔して立設した２つの位置決め用のストッパピン２９、２９を備えている。
また、位置決め手段２７は、上記ストッパピン２８、２８のＹ方向ほぼ中間位置でＸ方向の他方の端部側に設けられてピストン３１ＡがＸ方向に進退する第１エアシリンダ３１と、両ストッパピン２９、２９の中間位置でＹ方向の他方の端部側に設けられてピストン３２ＡがＹ方向に進退動される第２エアシリンダ３２とを備え、各エアシリンダ３１，３２のピストン３１Ａ，３２Ａの先端に係合ピン３３を取り付けている。各エアシリンダ３１，３２が制御装置によって作動されると、各ピストン３１Ａ，３２Ａにより係合ピン３３がそれぞれＸＹ方向において対向位置のストッパピン２８，２８、２９，２９側に向けて移動し、脆性材料２を位置決めするようになっている。
なお、ストッパピン２８、２９および係合ピン３３は可撓性を有する合成樹脂によって形成されている。 Further, a positioning means 27 for horizontally positioning the brittle material 2 levitated on the support means 3 by the levitating means 18 is provided, and the brittle material levitated on the upper surface 3A of the support means 3 by the positioning means 27. 2 is positioned at the reference position shown in FIG.
The positioning means 27 includes two positioning stopper pins 28, 28 that are provided upright apart from each other in the Y direction on one end side in the X direction on the upper surface 3 A of the support means 3, and the upper surface 3 A of the support means 3. Are provided with two stopper pins 29, 29 for positioning, which are provided upright apart from each other in the X direction.
The positioning means 27 includes a first air cylinder 31 provided on the other end side in the X direction at a substantially intermediate position in the Y direction of the stopper pins 28, 28, and a piston 31A that advances and retreats in the X direction. And a second air cylinder 32 that is provided on the other end side in the Y direction at a middle position between 29 and 29 and that moves the piston 32A back and forth in the Y direction. The pistons 31A and 32A of the air cylinders 31 and 32 An engagement pin 33 is attached to the tip. When the air cylinders 31 and 32 are actuated by the control device, the engagement pins 33 are moved by the pistons 31A and 32A toward the stopper pins 28, 28, 29, and 29 at the opposite positions in the XY direction, and are brittle. The material 2 is positioned.
The stopper pins 28 and 29 and the engaging pin 33 are made of flexible synthetic resin.

以上のように構成した支持手段３に脆性材料２を載置する場合には、制御装置によって電磁開閉弁２６を開放して支持手段３の噴射孔３Ｂから圧縮空気を噴出させ、その状態において作業者が脆性材料２を支持手段３に搬入する。
脆性材料２は圧縮空気によって上面３Ａから浮上され、その状態において、作業者は脆性材料２の横方向の１辺２Ａを係合ピン２９，２９に当接させるとともに、隣の１辺２Ｂをストッパピン２８，２８に当接させる。
この後、両エアシリンダ３１，３２を作動させと、各ピストン３１Ａ，３２Ａに設けた係合ピン３３，３３が脆性材料２における残りの２辺２Ｃ、２Ｄに当接し、脆性材料２全体をＸＹ方向のストッパピン２８，２８、２９，２９に向けて押圧する。これにより、２組のストッパピン２８，２８、２９，２９と一組の係合ピン３３，３３とによって脆性材料２が挟持されて図４に示す基準位置に位置決めされるようになっている。 When the brittle material 2 is placed on the support means 3 configured as described above, the electromagnetic on-off valve 26 is opened by the control device, and compressed air is ejected from the injection holes 3B of the support means 3, and the work is performed in that state. A person carries the brittle material 2 into the support means 3.
The brittle material 2 is levitated from the upper surface 3A by the compressed air, and in this state, the operator makes one side 2A in the lateral direction of the brittle material 2 abut against the engaging pins 29, 29, and the adjacent one side 2B is a stopper. It abuts on the pins 28 and 28.
Thereafter, when both air cylinders 31 and 32 are operated, the engaging pins 33 and 33 provided on the pistons 31A and 32A come into contact with the remaining two sides 2C and 2D of the brittle material 2, and the entire brittle material 2 is moved to XY. It pushes toward the stopper pin 28, 28, 29, 29 of a direction. Thus, the brittle material 2 is sandwiched between the two sets of stopper pins 28, 28, 29, 29 and the pair of engaging pins 33, 33, and is positioned at the reference position shown in FIG.

以上のように構成した割断装置１による作動を図３、図８により説明すると、支持手段３上に脆性材料２が浮上した状態から、図示しない制御装置によって上述した第１駆動源、第２駆動源、第３駆動源を制御して脆性材料２における割断予定線２２の延長線上で脆性材料２の外方にメカニカルカッター１７が進行方向を向くように処理ヘッド４を位置させ、その位置から処理ヘッド４を割断予定線２２に沿うように相対移動させる。すると、メカニカルカッター１７によって割断予定線２２にスクライブ線を形成しはじめる（図８ａ）。その後、レーザ光Ｌの照射位置が脆性材料２に差し掛かった時にレーザ発振器５からレーザ光Ｌを発振する。
このようにしてスクライブ線上にレーザ光Ｌが照射されると、その照射位置でレーザ光Ｌが吸収されて脆性材料２の内部に熱応力が発生する（図８ｂ）。
この熱応力により、脆性材料２はスクライブ線を基点に曲がるような力が働くが、脆性材料２は圧縮空気によって浮上されて支持手段３の上面３Ａから離隔していることから曲がりが制限されず容易に割断される（図８ｃ）。また、レーザ光Ｌの照射断面形状がスクライブ線に沿う方向に細長くなっていることから照射時間を長くすることができ、脆性材料２の内部に深く熱応力を付与することができるようになっている。そのため、従来と比較して加工速度を速くでき、終端部が切り残ることもなく確実に脆性材料２を割断することができる。 The operation of the cleaving device 1 configured as described above will be described with reference to FIGS. 3 and 8. From the state in which the brittle material 2 floats on the support means 3, the above-described first drive source and second drive are performed by a control device (not shown). The processing head 4 is positioned so that the mechanical cutter 17 faces the direction of travel on the outside of the brittle material 2 on the extension line of the planned cutting line 22 in the brittle material 2 by controlling the power source and the third drive source, and the processing is performed from that position. The head 4 is relatively moved along the planned cutting line 22. Then, a scribe line is started to be formed on the planned cutting line 22 by the mechanical cutter 17 (FIG. 8a). Thereafter, the laser beam L is oscillated from the laser oscillator 5 when the irradiation position of the laser beam L reaches the brittle material 2.
When the laser beam L is irradiated onto the scribe line in this way, the laser beam L is absorbed at the irradiation position and a thermal stress is generated inside the brittle material 2 (FIG. 8b).
Due to this thermal stress, the brittle material 2 has a force that bends around the scribe line. However, since the brittle material 2 is levitated by the compressed air and separated from the upper surface 3A of the support means 3, the bending is not limited. It is easily cleaved (FIG. 8c). Moreover, since the irradiation cross-sectional shape of the laser beam L is elongated in the direction along the scribe line, the irradiation time can be extended, and a deep thermal stress can be applied to the inside of the brittle material 2. Yes. Therefore, the processing speed can be increased as compared with the conventional case, and the brittle material 2 can be reliably cleaved without leaving the end portion uncut.

次に、図６ないし図７は、本発明の第２実施例としての支持手段３を示したものである。上記第１実施例においては、支持手段３の上面３Ａを水平に維持するようにしていたが、この第２実施例においては、支持手段３の上面３Ａを傾斜させたものである。すなわち、支持手段３は、その上面３Ａの一側が他側よりも僅かに高さが高くなるように傾斜させている。そして、高さが高くなる側のエアシリンダと係合ピンは設けておらず、反対側は上記第１実施例と同様の第１エアシリンダ３１と係合ピン３３を設けている。その他の構成は、図４ないし図５に示した第１実施例の支持手段３の構成と同じである。
このような構成の第２実施例の支持手段３によれば、噴出孔３Ｂから圧縮空気を噴出させた状態において脆性材料２を載置すると、脆性材料２は圧縮空気によって上面３Ａから浮上されるとともに、自重によってＸ方向のストッパピン２９、２９に当接する。その後、第１エアシリンダ３１が制御装置によって作動されて、係合ピン３３が脆性材料２の１辺２Ｄと当接して対向する側のストッパピン２８，２８に向けて押圧するので、それらに脆性材料２の１辺２Ｂが当接する。これにより、支持手段３上に浮上された脆性材料２は図６に示した基準位置に位置決めされるようになっている。
以上のように構成した第２実施例であっても、上述した第１実施例と同様の作用・効果を得ることができる。 Next, FIGS. 6 to 7 show a supporting means 3 as a second embodiment of the present invention. In the first embodiment, the upper surface 3A of the support means 3 is kept horizontal, but in the second embodiment, the upper surface 3A of the support means 3 is inclined. That is, the support means 3 is inclined so that one side of the upper surface 3A is slightly higher than the other side. Further, the air cylinder and the engagement pin on the side where the height is increased are not provided, and the first air cylinder 31 and the engagement pin 33 similar to those of the first embodiment are provided on the opposite side. The other configuration is the same as the configuration of the support means 3 of the first embodiment shown in FIGS.
According to the support means 3 of the second embodiment having such a configuration, when the brittle material 2 is placed in a state where the compressed air is ejected from the ejection hole 3B, the brittle material 2 is levitated from the upper surface 3A by the compressed air. At the same time, it abuts against the stopper pins 29, 29 in the X direction by its own weight. Thereafter, the first air cylinder 31 is actuated by the control device, and the engaging pin 33 abuts against one side 2D of the brittle material 2 and presses it toward the stopper pins 28, 28 on the opposite side. One side 2B of the material 2 contacts. Thereby, the brittle material 2 levitated on the support means 3 is positioned at the reference position shown in FIG.
Even in the second embodiment configured as described above, the same operations and effects as those of the first embodiment described above can be obtained.

なお、メカニカルカッター１７によってスクライブ線を形成する際には、浮上手段１８による圧縮空気の噴出を停止して脆性材料２を支持手段から浮上させず、直接載置するようにしてもよい。
また、上述したスクライブ線をメカニカルカッターではなくレーザ光などで形成するようにしても良い。
また、脆性材料２の内部に微小クラックを形成した後にレーザ光による熱応力を付与して割断するようにしても良い。
さらに、加工対象である脆性材料２としてガラスの他にシリコンウエハにも適用できる。この場合には脆性材料２に吸収されやすいＹＡＧレーザ光などを用いるのが良い。 When the scribe line is formed by the mechanical cutter 17, the blowing of the compressed air by the levitation unit 18 may be stopped and the brittle material 2 may be directly placed without floating from the support unit.
Further, the scribe line described above may be formed by a laser beam or the like instead of a mechanical cutter.
Moreover, after forming a micro crack in the inside of the brittle material 2, you may make it cleave by giving the thermal stress by a laser beam.
Further, the brittle material 2 to be processed can be applied to a silicon wafer in addition to glass. In this case, it is preferable to use YAG laser light that is easily absorbed by the brittle material 2.

本発明の一実施例を示す全体の平面図。1 is an overall plan view showing an embodiment of the present invention. 図１のＩＩ―ＩＩ線に沿う要部の断面図。Sectional drawing of the principal part which follows the II-II line | wire of FIG. 図１に示す処理ヘッド４によって脆性材料２を加工中の状態を簡略化して示した斜視図。The perspective view which simplified and showed the state in process of the brittle material 2 by the processing head 4 shown in FIG. 図１の要部の拡大図。The enlarged view of the principal part of FIG. 図４のＶ―Ｖ線に沿う要部の断面図。Sectional drawing of the principal part in alignment with the VV line | wire of FIG. 本発明の第２実施例を示す平面図。The top view which shows 2nd Example of this invention. 図６のＶＩＩ―ＶＩＩ線に沿う断面図。Sectional drawing which follows the VII-VII line of FIG. 本発明の作業工程図。The work process drawing of this invention. 従来技術を示す作業工程図。The operation process figure which shows a prior art.

符号の説明Explanation of symbols

１…割断装置 ２…脆性材料
３…支持手段 ５…ＣＯ２レーザ発振器
１７…メカニカルカッター １８…浮上手段
Ｌ…レーザ光 1 ... fracturing device 2 ... brittle material 3 ... support means 5 ... CO 2 laser oscillator 17 ... mechanical cutter 18 ... floating means L ... laser light

Claims (5)

脆性材料に下方側から気体を吹き付けて浮上させた状態において、上記脆性材料における割断予定線に沿ってレーザ光を移動させながら照射して、脆性材料を上記割断予定線のとおりに割断することを特徴とする脆性材料の割断方法。   In a state where a gas is blown and floated on the brittle material from the lower side, irradiation is performed while moving the laser light along the planned cutting line in the brittle material, and the brittle material is cut according to the planned cutting line. A method for cleaving a brittle material. 上記レーザ光を脆性材料に照射する前に脆性材料の割断予定線にスクライブ線を形成することを特徴とする請求項１に記載の脆性材料の割断方法。   2. The method for cleaving a brittle material according to claim 1, wherein a scribe line is formed on a planned fracture line of the brittle material before irradiating the brittle material with the laser beam. 脆性材料を支持する支持手段と、支持手段に支持された脆性材料にレーザ光を照射するレーザ光照射手段と、上記支持手段に支持された脆性材料とレーザ光とを相対移動させる相対移動手段とを備え、脆性材料の割断予定線に沿ってレーザ光を移動させながら照射して脆性材料を割断するようにした脆性材料の割断装置において、
上記脆性材料に下方側から気体を吹き付けて支持手段上に脆性材料を浮上させる浮上手段を設けて、該浮上手段によって支持手段上に脆性材料を浮上させた状態で脆性材料を割断することを特徴とする脆性材料の割断装置。 Support means for supporting the brittle material, laser light irradiation means for irradiating the brittle material supported by the support means with laser light, and relative movement means for relatively moving the brittle material supported by the support means and the laser light; A brittle material cleaving apparatus that irradiates a laser beam while moving along a planned fracture line of the brittle material to cleave the brittle material.
A levitation unit is provided to float the brittle material on the support means by blowing gas from the lower side to the brittle material, and the brittle material is cleaved in a state where the brittle material is levitated on the support means by the levitation means. A brittle material cleaving device. 上記支持手段上に浮上させた脆性材料の横方向の位置決めを行う位置決め手段を備えることを特徴とする請求項３に記載の脆性材料の割断装置。   4. The brittle material cleaving apparatus according to claim 3, further comprising positioning means for performing lateral positioning of the brittle material levitated on the support means. 上記脆性材料の割断予定線に沿ってスクライブ線を形成するスクライブ線形成手段を備えることを特徴とする請求項３又は請求項４に記載の脆性材料の割断装置。   The brittle material cleaving apparatus according to claim 3 or 4, further comprising scribe line forming means for forming a scribe line along the planned fracture line of the brittle material.
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