KR101211019B1 - Laser processing apparatus - Google Patents

Abstract

Provided is a laser processing apparatus that can carry out simple and reliable double side scribing to double side brake processing. The first beam scanning optical system 22a which is shaped by the first beam made of parallel light beams and guides and scans to the substrate surface side, and the second beam scan which is shaped by the second beam made of parallel light beams and guides and scans to the back surface side of the substrate A table having an optical system 22b and a substrate placing surface 41 divided by a groove 49 serving as an optical path for guiding the second beam to the rear surface of the substrate, and formed of a porous member on the substrate placing surface, Floating mechanisms 41 and 47 are provided to float the gas on the substrate, and contact portions 54 are provided on the substrate mounting surface to contact the substrate side of the injured substrate to limit the horizontal movement of the substrate. Both sides scribe processing is performed in the state, and brake processing is performed for each one side in the state which floated.

Description

Laser processing device {LASER PROCESSING APPARATUS}

TECHNICAL FIELD This invention relates to the laser processing apparatus which performs both sides processing of a board | substrate by scanning a laser beam with respect to the front surface and the back surface of a board | substrate. Specifically, it is related with the laser processing apparatus used for double-sided parting of a bonded substrate like a liquid crystal panel substrate, etc., for example.

The scanning laser processing apparatus which processes by moving the irradiation position of a laser beam with respect to a to-be-processed board | substrate relatively, is used for the processing of brittle material substrates, such as a glass substrate.

In recent years, the bonded substrate which bonded two glass substrates, such as a liquid crystal panel board | substrate, splits the laser beam irradiated from one laser light source with a beam splitter, or irradiates a laser beam independently from two laser light sources. Also, the laser processing apparatus which scribes or divides a laser beam on both surfaces of a board | substrate simultaneously is proposed (refer patent document 1, patent document 2).

In Patent Document 1, scanning is performed by forming a first laser spot, a cooling region, and a second laser spot on each of the front and back sides of the substrate, thereby making the cracks deeper, and in one scribing step (during this time, Laser irradiation is carried out) and the bonding substrate is described.

In such a laser processing apparatus, the cross-sectional shape emitted from the laser light source is circular for the purpose of narrowing the processing width at the time of processing to increase the processing accuracy, or the heating efficiency at the time of heating to improve the scanning speed. The laser beam (circle beam) is adjusted on the optical path, the beam is focused on the processing surface of the substrate (Patent Document 2), or an elliptical beam spot is formed in which the area of the beam spot is changed by the height (distance) to the substrate. (Patent Document 1).

In addition, the shape of the beam spot to be formed is not only a literal "ellipse" but also an elongated beam spot having an ellipse or other major axis direction, so that the processing accuracy and the heating efficiency can be increased in the same way as an ellipse. . Therefore, the term "elliptical" beam spot herein includes beam spots that can define long-axis directions such as beam spots such as elliptic shapes and beam spots in which a plurality of circular beams are arranged in series. .

As a method of forming an elliptic beam spot from a circular beam having a circular cross section emitted from a laser light source, a method of forming a beam spot having a long axis using a lens optical system is practical. For example, by arranging a cylindrical lens and a condenser lens on the optical path of a laser beam, shaping a circular beam of a circular cross section into an elliptical laser beam is disclosed (for example, refer patent document 3).

FIG. 10: is a block diagram which shows the prior art example of the crack forming apparatus 500 (laser scribe apparatus) which is one of a scanning laser processing apparatus. The device is fixed so that the irradiation position of the laser beam does not move, and the table is moved in the two-dimensional direction (XY direction) and the rotation direction (θ direction).

That is, along the pair of guide rails 503 and 504 arranged in parallel on the pedestal 501, a slide table 502 for reciprocating in the front and rear directions (referred to as Y direction) of FIG. 10 is provided. . The screw screw 505 is arrange | positioned along the front-back direction between both guide rails 503 and 504, The stay 506 fixed to the slide table 502 is screwed to this screw screw 505, By rotating the screw screw 505 forward and reverse by a motor (not shown), the slide table 502 is formed to reciprocate along the guide rails 503 and 504 in the Y direction.

On the slide table 502, a horizontal pedestal 507 is disposed along the guide rail 508 to reciprocate in the left and right directions (in the X direction) in FIG. The screw 510 which is rotated by the motor 509 is screwed through the stay 510a fixed to the base 507, and the screw 510 rotates forward and reverse, so that the base 507 Along the guide rail 508, it reciprocates in the X direction.

On the base 507, the rotary table 512 which rotates by the rotating mechanism 511 is provided, and the glass substrate G is attached to this rotary table 512 in a horizontal state. The rotating mechanism 511 rotates the rotary table 512 around the vertical axis | shaft, and is formed so that it may rotate so that it may become arbitrary rotation angle with respect to a reference position. Moreover, the board | substrate G is fixed to the turntable 512 by a suction chuck, for example.

Above the turn table 512, an optical holder 514, which is connected to the laser oscillator 513, is held in the frame 515. As shown in FIG. 6, the optical holder 14 includes a lens optical system 514a for irradiating a laser beam oscillated from the laser oscillator 513 onto the substrate G as an elliptical heating spot HS. (For example, a cylindrical lens) is provided. Further, under the lens optical system 514a, an adjustment lens 514b is provided to enlarge and reduce the area of the heating spot HS by moving the focus position up and down. When the heating spot HS is enlarged or reduced in size, the area irradiated onto the substrate surface and the energy density change. Therefore, for example, when the heating spot HS is enlarged by the adjustment lens 514b, the output of the laser oscillator 513 is increased, and when the heating spot HS is reduced, the output of the laser oscillator 513 is reduced. It is used to adjust to reduce.

Further, in the vicinity of the optical holder 514, a cooling nozzle 516 may be provided for spraying the refrigerant toward the rear side of the heating spot to form a cooling spot, and quenching to promote the generation of thermal stress.

A pair of CCD cameras 520 (521) is fixed to the upper left side of the crack forming apparatus 500. It is used for the position detection of these board | substrates. That is, a pair of markers (alignment marks) serving as processing reference points are attached to the glass substrate G mounted on the rotation table 512, and the pair of CCD cameras 520 (521) is a rotation table. These markers are imaged in a state where 512 is returned to the origin position (a state in which the rotary table 512 of FIG. 10 is moved to the left end). 10, only the CCD camera 520 in front of the paper is shown, and the CCD camera 521 in the paper inside is not shown.

The slide table 502, the pedestal 507, and the rotation table 512 are adjusted while monitoring the image of the substrate G projected by the CCD cameras 520 and 521 on the display unit 557 (described later). Thereby, alignment of the board | substrate G is performed. By ending the alignment, each point of the substrate G corresponds to the coordinate system set in the crack forming apparatus 500.

Above the rotary table 512, a cutter wheel 518 is attached via a shanghai motion adjustment mechanism 517. The cutter wheel 518 only moves the pedestal 507 from the standby position to the X direction at the time of forming the initial crack TR at the edge of the glass substrate G, and temporarily the cutter wheel 518. Use to lower the to return to the standby position.

Next, the control system of the crack forming apparatus 500 will be described with reference to FIG. 11. In the crack forming apparatus 500, a table drive unit 551 for driving a motor (motor 509, etc.) for positioning the slide table 502 and the pedestal 507, a laser oscillator for laser beam irradiation ( 513 and the laser drive unit 552 for driving the adjustment lens 514b of the optical holder 514 and the cooling nozzle drive unit 553 and the cutter wheel 518 for spraying the refrigerant when the cooling nozzle 516 is provided. Each drive system of the cutter drive unit 554 for positioning and adjusting the pressure welding force on the glass substrate G, and the camera drive unit 555 for imaging by the CCD cameras 520 and 521 is composed of a computer (CPU). Controlled by the control unit 550.

The control unit 550 is connected to an input unit 556 made of an input device such as a keyboard or a mouse, and a display unit 557 made up of a display screen for performing various kinds of displays, so that necessary messages are displayed on the display screen, and necessary instructions and Settings can be entered.

Next, the operation of the crack forming apparatus 500 will be described. Glass substrate G is mounted on the turntable 512. At this time, positioning is performed using the cameras 520 and 521. The crack formation apparatus 500 stores the division scheduled line CL.

Then, crack formation is started. When the process starts, the stored position data of the division scheduled line CL is read, and the slide table 502 and the pedestal 507 (rotation table 512) are placed so that the cutter wheel 518 is close to the starting point P ₀ . ) Moves. Further, in the state where the cutter wheel 518 is lowered, the pedestal 507 (the turntable 512) is driven so that the substrate end is close to the cutter wheel 518, whereby an initial crack TR is formed at the end of the substrate.

Subsequently, the slide table 502 and the pedestal 507 (rotation table 512) move so that the beam spot BS may be at a position immediately before the initial crack TR. Thereafter, the laser oscillator 513 is oscillated and the laser beam is irradiated to form a beam spot BS, which is scanned along the division scheduled line CL from the starting point P ₀ to the end point P ₁ ( If necessary, the cooling spot by the cooling nozzle 516 is scanned to follow).

As the above process is executed, a crack along the division scheduled line CL is formed.

Generally, a laser processing apparatus having a table translation mechanism for moving a table on which a substrate is placed in a two-dimensional direction (XY direction) or a one-dimensional direction (X direction) together with the substrate is used to scan a beam spot. The laser processing with excellent stability and good reproducibility can be performed.

However, since the table needs to be moved, the space from the start position of the table to the end position of the table is required, and compared to the apparatus where the table is fixed, the installation space of the entire apparatus is about twice as much (1). In the case of dimensional driving), or 4 times (in the case of two-dimensional driving), it tends to be large.

In particular, in recent years, the area of the substrate to be processed tends to increase as in the case of processing a glass substrate for a liquid crystal panel. Therefore, as the substrate area becomes larger, a larger installation space is required.

There, the laser cutting device (laser processing apparatus) which provided the two-dimensional (XY direction) translation mechanism in the laser beam side is proposed (refer patent document 3).

According to this, the whole laser optical system (refractive lens, focusing lens group) which can adjust a beam spot shape is provided with the drive mechanism which moves to a scanning direction of a laser beam.

Japanese Patent Laid-Open No. 2004-36315 Japanese Patent Application Laid-Open No. 2002-172479 Japanese Patent Laid-Open No. 2000-61677

(Initiation of invention)

(Problems to be Solved by the Invention)

The laser processing apparatus provided with the translation mechanism which moves the whole laser optical system in a scanning direction instead of the translation mechanism which moves a table can make small installation space, and can be made into a compact apparatus structure.

By the way, when applying the compact apparatus structure which moves a laser optical system without having a translation mechanism of a table to a laser processing apparatus which performs double-sided processing of a board | substrate, a table exists on the back surface side of a board | substrate, It is necessary to arrange the optical system and the table structure so that it does not interfere.

Moreover, in the laser processing apparatus which performs the double-sided process of patent document 1, as mentioned above, it performs from 1 time of scanning from a laser scribe to a laser brake, and it divides in one piece (patent document 1). However, in order to perform this processing, adjustment work for setting processing conditions in accordance with the type, thickness, etc. of the substrate to be processed is required, and time is required for making the conditions or adjusting the work. In particular, since the size of the beam spot changes with the plate thickness of the substrate (because the optical path length changes), it is necessary to adjust it to the plate thickness of the substrate.

Accordingly, the present invention provides a laser processing apparatus for double-sided machining that can reduce the restrictions on the processing conditions for the dividing process for a substrate and the like, and can perform scribing and brake processing without depending on the type or thickness of the substrate. It aims to do it.

Moreover, an object of this invention is to provide the laser processing apparatus which can perform from scribing to brake processing easily with one processing apparatus, regardless of board | substrate thickness.

(MEANS FOR SOLVING THE PROBLEMS)

In order to solve the above problems, the laser processing apparatus of the present invention performs scribing on both surfaces simultaneously while placing a substrate on which a double-sided processing is placed on a table, and then performs brake processing one by one in a state where the substrate is raised. I'm making it possible.

That is, the laser processing apparatus of this invention is a laser processing apparatus which scans a laser beam with respect to the front and back of the board | substrate which consists of a brittle material, and processes it, The laser beam radiate | emitted from a laser light source is made into the 1st beam which consists of parallel beams. A first beam scanning optical system for shaping and guiding and scanning to the substrate surface side, a second beam scanning optical system for shaping and guiding the laser beam emitted from the laser light source into a second beam consisting of parallel light beams, and guiding and scanning to the rear surface of the substrate; A table having a substrate placing surface divided by a groove serving as an optical path for guiding the second beam to the rear surface of the substrate, the substrate placing surface being formed of a porous member, and floating to blow a gas onto the substrate through the porous member A mechanism is provided, and the substrate moves in the horizontal direction in contact with the substrate side of the floating substrate. It is intended to provide a contact for limiting the pressure.

Here, as a brittle material board | substrate, although mainly used for the bonding board | substrate of glass, it is not limited to this, Bonding board | substrates, such as a silicon substrate, a sapphire substrate, another semiconductor substrate, a ceramic substrate, may be sufficient.

Moreover, the groove | channel which becomes an optical path for guiding a laser beam to the back surface of a board | substrate may be sufficient as one, and what is necessary is just to determine the position and number of the groove | channel of a table according to a board shape, the position on the board | substrate which you want to divide, and the number of processes.

The contact portion may be fixed on the substrate placing surface when the substrate is shaped. If the substrate is not shaped, movable movable contacts are preferred.

According to this invention, a board | substrate is mounted on a table. When the substrate floating mechanism is operated, the substrate is floated by blowing gas into the substrate. At this time, the contact portion is configured to limit the movement in the horizontal direction of the substrate. On the other hand, the first beam and the second beam irradiated toward the substrate surface side are shaped into parallel light beams and then guided to the substrate surface and the substrate back surface. Moreover, the table is provided with the groove | channel which becomes an optical path for guiding a 2nd beam to the back surface of a board | substrate on the board | substrate mounting surface, and a 2nd beam is irradiated to the back surface of a board | substrate through this groove | channel. Therefore, in a state where the substrate is placed on a table, scribe processing is performed by irradiating a first laser beam on both surfaces, and then, by irradiating a second laser beam to either substrate surface while the substrate is floating, Brake processing is performed. At this time, since the laser beam is irradiated with parallel luminous flux, the relationship between the irradiation position of the beam does not change due to the difference between the height of the substrate placed on the table and the substrate in the floating state, thus adjusting the optical system. There is no need to do it. Subsequently, in a state where the substrate is floated, the second laser beam is irradiated to the opposite substrate surface, and the other substrate surface is braked. At this time, since the parallel beam is irradiated with the laser beam, the difference between the height of the substrate placed on the table and the substrate in the floating state does not change the irradiation position of the laser beam or the shape of the beam spot. There is no need to adjust the optical system. In this way, after scribing, brake processing can be performed on one side, and the brake is applied by irradiating a laser in a floating state (free support state), so that the brake is performed in contact with the substrate placing surface of the table. In comparison with this, it can be divided simply and reliably.

According to the present invention, in the state where the substrate is placed on the substrate placing surface and in the state in which the substrate is floating, the position in the horizontal direction of the substrate can be restricted to be the same, and the laser beam is a parallel light flux. Even if scribing is performed on the substrate placing surface and brake processing is performed in the floating state, the processing can be performed without adjusting the position of the optical system due to the difference in the height direction of the substrate. Moreover, since brake processing is performed in a floating state, it can be segmented easily compared with the case of performing brake processing in a state where it is placed on a table.

Moreover, this invention can carry out from scribing to brake processing easily with one processing apparatus, regardless of board | substrate thickness.

(Means and effects to solve other problems)

In the said invention, the table may further be provided with the adsorption mechanism which adsorb | sucks a board | substrate through a porous member.

According to this, since a board | substrate can be adsorbed and scribed at the time of scribing, the scribing process which is accurate and is reproducible becomes possible. Particularly, in scribing in the case where the board thickness of the substrate is thin, it is necessary to precisely control the depth of the scribe line at the point of performing crosscutting. Becomes possible.

In the above invention, the first beam scanning optical system and the second beam scanning optical system each convert a beam cross section into one of a parallel beam for scribing which has an elliptical cross section and a parallel beam for brake having a larger cross-sectional area than the scribe parallel beam. You may provide a cross-sectional enlargement part.

According to this, at the time of scribing, an elliptical beam and a brake can be made into a beam whose cross-sectional area is larger than the parallel luminous flux for scribing, so that it can be processed into a beam spot shape suitable for each processing.

In the above invention, a substrate guide mechanism for guiding the substrate may be provided by pushing the substrate side in the horizontal direction by horizontally moving the contact portion.

According to this, fine adjustment of the position of a board | substrate on a table, or rotational movement of a board | substrate can be performed.

In the above invention, a groove width adjusting mechanism for adjusting the width of the grooves may be provided.

According to this, the groove width can be adjusted by the position and the number of the division scheduled lines. For example, when there are two dividing scheduled lines approaching, these two dividing scheduled lines can be adjusted to the groove width which can be processed. In addition, when the number of dividing scheduled lines is small, unnecessary grooves can be closed.

BRIEF DESCRIPTION OF THE DRAWINGS The whole block diagram of the laser processing apparatus LM1 which is one Embodiment of this invention.
FIG. 2: is a schematic diagram which shows the cross-sectional structure of the laser processing apparatus LM1 of FIG.
3 is a diagram showing an example of the configuration of a beam shaping portion that emits an elliptical parallel beam;
4 is a diagram illustrating a method for adjusting the long axis length of the beam spot of an ellipsoidal system.
5 shows a cross-sectional structure of a table.
6 is a diagram illustrating a configuration of a substrate guide mechanism.
7 is a block diagram showing a control system of the laser processing apparatus LM1 of FIG. 1.
8 is a flowchart showing an example of operation performed by the laser processing apparatus LM1 in FIG. 1.
9 is a flowchart showing another example of operation by the laser processing apparatus LM1 in FIG. 1.
10 is a diagram illustrating an example of a conventional laser processing apparatus (cracks forming apparatus).
FIG. 11 is a diagram illustrating a control system of the laser processing apparatus of FIG. 10. FIG.

(Best Mode for Carrying Out the Invention)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing mainly using the laser processing apparatus for glass substrate processing as an example.

1 is an overall configuration diagram of a laser processing apparatus LM1 which is one embodiment of the present invention. FIG. 2: is a schematic diagram which shows the cross-sectional structure of laser processing apparatus LM1. The laser processing apparatus LM1 mainly comprises a pair of upper and lower laser light sources 10 (10a, 10b) and a pair of upper and lower laser scanning optical systems 20 (20a, 20b) (where 20b is a table 40). 1, a table 40, a substrate guide mechanism 50, and a trigger mechanism 60, as shown in FIG.

In the following description, when a pair of the same member is formed above and below, a and b are attached to the upper side and the lower side, but the description of the same upper and lower parts is avoided to be a long explanation, so that the description of some Description of a, b is abbreviate | omitted.

(Laser light source)

As the laser light source 10 (10a, 10b), a CO ₂ laser is used. Instead of a CO ₂ laser, a CO laser or an excimer laser may be used. From the laser light source 10, a laser beam (circle beam L0) having a circular cross-sectional shape is emitted.

(Laser scanning optical system)

The laser scanning optical system 20 (20a, 20b) is roughly divided into beam shaping parts 21 (21a, 21b) for adjusting the cross-sectional shape of a laser beam (circle beam) to an elliptical beam of parallel light beam, and a laser beam ( The beam cross-sectional enlargement part 24 (24a, 24b) which expands the cross-sectional shape of a circular beam, and emits it as a circular beam of parallel beams, and moves (scans) a laser beam along a table surface (XY direction). Optical path adjusting portions 23 (23a, 23b) for guiding the laser beams emitted from the scanning mechanisms 22 (22a, 22b), the beam shaping portion 21, and the beam end face expansion portion 24 to the scanning mechanism 22. And beam end face switching mechanisms 29 (29a, 29b) for switching the optical path of the laser beam (circular beam) between the beam shaping section 21 and the beam end face expansion section 24. In the table surface, the X direction is the scanning axis direction (the direction in which scribing or brake processing is performed) and the Y direction is the feeding axis direction.

The beam shaping part 21 (21a, 21b) is demonstrated. The beam shaping portion 21 is formed of a plurality of optical elements for shaping the original beam emitted from the laser light source 10 into a parallel beam having an elliptical cross section, and adjusting the long axis diameter and short axis diameter of the parallel beam. .

Fig. 3A is a diagram showing an example of the configuration of the beam shaping portions 21 (21a, 21b) that emit an elliptical parallel beam. The beam shaping portion 21 includes a first parabolic mirror (concave surface) M1, a second parabolic mirror (convex surface) M2, a third parabolic mirror M3 (convex surface), and a fourth parabolic mirror M4. It consists of four optical elements (). Among them, the first parabolic mirror (concave surface) M1 and the second parabolic mirror (convex surface) M2 are arranged so as to coincide with each other and become a confocal point F ₁₂ . Further, the third parabolic mirror (convex surface) M3 and the fourth parabolic mirror (concave surface) M4 are also arranged so as to coincide with each other and become a confocal point F34.

Then, the traveling direction of the laser beam from the first parabolic mirror (concave surface) M1 to the second parabolic mirror (convex surface) M2 becomes the XY plane direction, and the laser reflected by the second parabolic mirror M2 The beam is directed to the third parabolic mirror M3, so that the traveling direction of the laser beam from the third parabolic mirror (convex surface) M3 to the fourth parabolic mirror (concave surface) M4 becomes the XZ plane, Four parabolic mirrors are arranged in three dimensions.

By this arrangement, the first parabolic mirror M1 reflects the circular beam L0 (see Fig. 3 (b)) having a circular cross section traveling in the X direction in the XY plane direction. At that time, the beam width in the Z direction remains the same, and the beam width in the Y direction proceeds while focusing and enters the second parabolic mirror M2. A second parabolic mirror (M2) is, by being arranged so that the confocal (F _12), when reflected a home laser beams belonging in the Y direction, back parallel to the beam (L1) (see Fig. 3 (c)) is the, Progress toward the X direction. The beam width in the Z direction of the parallel beam L1 is in the state of the original beam L0, and the laser beam has an elliptical cross section in which the beam width in the Y direction is reduced.

Further, when the parallel beam L1 proceeds and is reflected from the third parabolic mirror M3, the beam width in the Y direction remains as it is, and the beam width in the X direction is expanded while the parallel beam L1 travels in the XZ plane, and the fourth parabolic mirror ( Enters M4).

The fourth parabolic mirror (M4) has become a by being arranged such that the confocal (F _34), when reflecting the laser beam to extend in the X direction, and again parallel beam (L2) (see Fig. 3 (d)), Progress toward the X direction. The beam width in the Z direction of the parallel beam L2 is larger than the original beam L0, and the beam width in the Y direction is a laser beam having an elliptic cross section with a long major axis reduced than the original beam.

And the parallel beam L2 of the elliptical cross-sectional shape shape formed by the beam shaping part 21 passes through the optical path adjusting part 23 and the scanning mechanism 22 of the rear end, and has an elliptical beam shape on the board | substrate G. The spot BS is formed. Therefore, by adjusting the optical constants of these four parabolic mirrors M1 (M1a, M1b) to M4 (M4a, M4b), a desired elliptic beam spot can be formed.

Next, the optical path adjusting units 23 (23a, 23b) will be described. As shown in FIG. 1, the optical path adjusting unit 23 includes two flat mirrors M5 (M5a and M5b) and M6 (M6a and M6b). The plane mirror M5 bends the parallel beam L2 traveling in the X direction to form the parallel beam L3 running in the Z direction. The adjustment of the X direction with the scanning mechanism 22 is performed by adjusting the optical path length (distance between M4-M5) of parallel beam L2. Further, the planar mirror M6 bends the parallel beam L3 traveling in the Z direction in the Y direction to form the parallel beam L4 running in the Y direction. By adjusting the optical path length (distance between M5-M6) of parallel beam L3, height (Z direction) adjustment with the scanning mechanism 22 is performed. Moreover, scanning is performed by adjusting the optical path length (distance between M6-M7) of the parallel beam L4 when the plane mirrors M7 (M7a, M7b) of the scanning mechanism mentioned later are in the home position (position closest to M6). The Y direction adjustment with the mechanism 22 is performed.

Next, the beam cross-sectional expansion part 24 (24a, 24b) is demonstrated. The beam cross-sectional enlargement part 24 consists of the combination lens 28 which extends the beam diameter of a raw beam, and emits it as a parallel light beam. For example, it can be set as the parallel light beam extended by the combination of a concave lens and a convex lens. In addition, the cross-sectional area of the enlarged beam cross section is adjusted to be larger than the elliptic beam formed in the beam shaping section 21. This is because, in general, in the case of laser brake processing performed after laser scribing, heating in a wide range is easier to brake. However, the brake processing may be performed in the same beam spot shape as in the scribe processing.

Next, the beam cross section switching mechanism 29 will be described. The beam cross-section switching mechanism 29 (29a, 29b) consists of two reflecting mirrors M11 (M11a, M11b) and M12 (M12a, M12b), and enters and exits an optical path of a laser beam by a drive mechanism not shown. I can do it. When placed on the optical path, the optical path of the laser beam directed to the beam shaping part 21 is switched to face the beam end face expanding part 24, and the circular beam of the parallel light beam enlarged by the combined lens 28 is turned into the optical path. It is supposed to advance to the adjustment part 23.

Therefore, depending on whether the optical path of the laser beam is directed toward the beam shaping section 21 or the beam cross-sectional expansion section 24, either the parallel luminous flux of the elliptic beam or the parallel luminous flux of the enlarged circular beam is the optical path adjusting section 23. ) Is to enter.

Next, the injection mechanism 22 (22a, 22b) is demonstrated. The scanning mechanism 22 is a guide mirror 25 (25a, 25b) with an axis line directed in the Y-direction, and a flat mirror M7 movably attached along the guide rail 25 by a driving mechanism (not shown) ( M7a, M7b, guide rails 26 (26a, 26b) integrally fixed to the flat mirror M7, whose axes are directed in the X direction, and along the guide rails 26 by a driving mechanism (not shown). Angle adjuster 27 (27a) for angle adjustment which adjusts the attachment angle (attachment angle of XZ surface) of the plane mirror M8 (M8a, M8b) which is attached so that a movement is possible, and the plane mirror M8 with respect to the horizontal direction. 27b).

For convenience, the position closest to the plane mirror M6 of the guide rail 25 is the origin position of the plane mirror M7. The plane mirror M7 is angled so as to bend the parallel beam L4 from the plane mirror M6 at the origin position, and guide the parallel beam L5 to the plane mirror M8. At this time, the parallel beam L4 proceeds in the Y direction, and the plane mirror M7 also moves along the guide rail 25 in the Y direction, so that the plane mirror M7 moves to any position of the guide rail 25. Even if it moves, the parallel beam L4 is reflected by the plane mirror M7, and is led to the plane mirror M8.

In front of the flat mirror M8, a difference between the flat mirror M8a and the flat mirror M8b is caused by the presence or absence of a table. The upper planar mirror M8a bends the parallel beam L5 to form a beam spot BS on the surface of the substrate G. As shown in FIG. At this time, the parallel beam L5 proceeds in the X direction, and the plane mirror M8 also moves along the guide rail 26 in the X direction, so that the plane mirror M8 moves to any position of the guide rail 26. Even if it moves, the parallel beam L5 is reflected by the planar mirror M8a, and the beam spot BS of the same shape is formed on the board | substrate G. As shown in FIG. Furthermore, the beam spot to be formed always has an elliptic beam spot with its long axis directed in the X direction.

On the other hand, the flat mirror M7b moves to a position facing the groove 49 of the table 40 to be described later, and the laser beam of the parallel beam reflected by the flat mirror M8b is grooved in the lower flat mirror M8b. When it can pass through 49 and reach | attain the back surface of a board | substrate, the beam spot BS is formed on the back surface of the board | substrate G. As shown in FIG.

Then, by moving the plane mirror M8 in the X direction, the elliptical beam spot BS is scanned in the X direction while the long axis is directed in the X direction.

Next, adjustment of the beam spot BS by the adjuster 27 will be described. The shape of the beam spot BS can be adjusted mainly by changing the optical constants of the optical elements of the beam shaping section 21. However, when changing the long axis length of the beam spot BS, the beam shaping section 21 is left as it is. This can be done by the adjuster 27. 4 is a diagram illustrating an adjustment state of the major axis length by the adjuster 27. By adjusting the attachment angle of the planar mirror M8 by the adjuster 27, and adjusting the incident angle of the parallel beam L5 to the substrate, it is incident obliquely on the substrate. As a result, the long axis length of the beam spot BS can be changed. Therefore, the adjuster 27 can be used as a simple beam length adjustment mechanism.

(table)

Next, the table 40 will be described. As shown in FIG. 1, the table 40 is divided into two parts by the groove | channel 49 into the partial table 40a, 40b. FIG. 5A is a diagram showing a cross-sectional structure of the partial table 40a (also the same as 40b). The table 40a is made of a porous member and adheres around the upper surface member 41 (substrate mounting surface) on which the substrate G (see FIG. 1) is placed, and the upper surface 41, and the bottom surface is A body 42 having a hollow space 42a formed between the upper surface member 41 and a flow path 43 connected to the hollow space 42a, and a plug connected to the external flow path 44. A vacuum pump 46 for depressurizing the hollow space 42a through the passage 45 and the outer passage 44, and the hollow space 42a through the passage 43 and the outer passage 44. It consists of an air source 47 for sending pressurized air.

Among these, the adsorption mechanism which adsorb | sucks the board | substrate G to the upper surface member 41 by the hollow space 42a, the flow path 43, the external flow path 44, and the vacuum pump 46 is formed. Moreover, the floating mechanism which raises the board | substrate G from the upper surface member 41 by the hollow space 42a, the flow path 43, the external flow path 44, and the air source 47 is formed.

The table 40a (40b) is a state in which the substrate G is placed on the upper surface member 41, the vacuum pump 46 is activated to open the on / off valve, so that the hollow space 42a is in a reduced pressure state. The substrate G is adsorbed through the top member 41 of the porous member.

On the other hand, in a state where the substrate G is placed on the upper surface member 41, the open / close valve is opened to send air from the air source 47, whereby the hollow space 42a becomes pressurized, so that the upper surface of the porous member Pressurized air is blown out through the member 41, and the substrate G is floated. In this case, the movement of the substrate G is limited by the substrate guide mechanism 50 described later.

Moreover, the groove | channel width adjustment mechanism 90 (FIG. 1) for adjusting the space | interval of the groove | channel 49 is attached to one table 40b. The groove width adjusting mechanism 90 slides the table 40b in the direction orthogonal to the groove 49 by the motor drive. By driving the groove width adjusting mechanism 90, the desired groove width can be set.

In addition, the table is not limited to two divisions, but may be appropriately determined. The vertical and horizontal four divisions may be used as shown in Fig. 5B. Furthermore, 6 divisions, 8 divisions, etc. may be sufficient.

In addition, when scribing is performed along the Y direction as shown in Fig. 5B, it is necessary to change the major axis direction of the elliptic beam to the Y direction. Although the detailed description is omitted, for example, an optical circuit combining a planar reflector may be attached to the positions of the optical path adjusting units M5 (M5a and M5b) so as to be switchable and rotate in the major axis direction.

(Substrate induction mechanism)

Next, the substrate guide mechanism 50 will be described. 6 is a diagram illustrating the structure of the substrate guide mechanism 50. The substrate guide mechanism 50 is constituted by a pair of movable contact portions 51a and 51b attached to the vicinity of the diagonal corners 48a and 48b of the rectangular tables 40a and 40b.

Each movable contact part 51a, 51b has the articulated arm 53a, 53b by which a translation mechanism and a turning operation are performed centering around the support shaft 52a, 52b by the drive mechanism which is not shown in figure. Metal contact members 54a and 54b to which the pivoting operation is performed by a drive mechanism (not shown) are attached to the tip portions of the articulated arms 53a and 53b. The contact members 54a and 54b are attached so that the front end may branch to the left and right, respectively, and the site | part which contacts the board | substrate G becomes cylindrical. The axial direction of this cylinder is directed in the vertical direction.

Therefore, when the substrate G is to be moved in the X direction, the Y direction, or when it is desired to rotate, the air source 47 (FIG. 5) is operated to raise the substrate G in the state where the substrate G is raised. ) Is pressed against the contact members 54a and 54b, so that the substrate G is brought into light contact with the contact members 54a and 54b and moved to a desired position. Furthermore, when the brake process is performed, the horizontal movement of the substrate G in the floating state can be restricted. In addition, by stopping the positions of the contact members 54a and 54b at a desired position, stopping the air source 47 and operating the vacuum pump 46, the substrate G can be adsorbed at the desired position.

In addition, when the shape of the substrate to be processed is a fixed shape, the substrate can be attached to a fixed position. Therefore, a stationary contact member that does not move may be attached onto the table as a guide for positioning the substrate.

In addition, in the case of the board | substrate G in which the alignment mark is formed, using the cameras 55a and 55b with which the attachment position with respect to the coordinate system defined in the table 40 is measured beforehand, rather than imaging an alignment mark, The position of the substrate G can also be automatically adjusted by requesting the positional deviation amount of the substrate G from the current position of the alignment mark, calculating the movement amount, and moving the substrate G by the substrate guide mechanism 50.

(Trigger mechanism)

Next, a trigger mechanism for initial crack formation will be described. In addition, whether or not a trigger mechanism is attached is arbitrary, and when a trigger mechanism is not attached, it can also substitute by a laser ablation process, for example.

As shown in FIG. 1, the trigger mechanism 60 includes a cutter wheel 61, a lifting mechanism 62, and an articulated arm 63. The articulated arm 63 makes the same movement as the articulated arms 53a and 53b of the substrate guide mechanism 50. The knife tip of the cutter wheel 61 is directed in the X direction.

When forming the initial crack TR, the articulated arm 63 causes the cutter wheel 61 to reach directly above the position at which the initial crack is formed. Then, the elevating mechanism 62 forms the initial crack TR by temporarily lowering and pressing the cutter wheel 61.

(Control system)

Next, the control system of the laser processing apparatus LM1 is demonstrated. 7 is a block diagram showing a control system of the laser processing apparatus LM1. The laser processing apparatus LM1 carries out the adsorption / injury mechanism drive part 81 which drives the adsorption mechanism and the floating mechanism of the table 40, and the board | substrate induction mechanism which drives the movable contact parts 51a and 51b of the board | substrate guide mechanism 50. Scan to move the drive unit 82, the lifting mechanism 62 of the trigger mechanism 60, and the trigger mechanism driver 83 for driving the articulated arm 63, and the planar mirrors M7 and M8 of the injection mechanism 22. When the mechanism drive part 84, the laser drive part 85 which irradiates a laser beam, and a cooling nozzle are provided and the cooling spot which follows a beam spot BS is formed, the cooling nozzle drive part 86 which sprays refrigerant from a cooling nozzle. , Each of the camera driver 87 for imaging by the CCD cameras 55a and 55b, the beam cross-section switching mechanism driver 88 for switching the optical path, and the groove width adjustment mechanism driver 89 for adjusting the width of the groove 49. The drive system is controlled by the controller 80 composed of a computer (CPU).

The control unit 80 is connected to an input unit 91 consisting of an input device such as a keyboard or a mouse, and a display unit 92 consisting of a display screen for performing various types of display, and a necessary message is displayed on the display screen. Settings can be entered.

(Operation Example 1)

Next, an example of typical processing operation by the laser processing apparatus LM1 will be described. Here, the case where the laser scribe process is performed simultaneously with both surfaces with respect to the bonded glass substrate G in which the alignment mark was engraved, and after that, the brake process by laser irradiation is performed one by one is demonstrated.

For convenience of explanation, when the dividing direction is the x direction of the glass substrate and positioning is performed with the alignment mark, the x direction shall coincide with the X direction of the laser scanning optical system.

8 is a flowchart showing an example of operation.

When the glass substrate G is placed on the table 40, first, the substrate G is positioned using the substrate guide mechanism 50 (S101). Positioning detects the alignment mark of the board | substrate G with cameras 55a and 55b, and calculate | requires the position deviation amount. Subsequently, the movable contact portions 51a and 51b are driven to bring the contact members 54a and 54b closer to the substrate side of the substrate G. At the same time, the floating mechanism is operated to float the substrate G from the table surface. At this time, the movement of the glass substrate G is limited at the four contacts with the contact members 54a and 54b. Subsequently, the movable contact portions 51a and 51b are driven to move (translate, rotate) the substrate G in the horizontal direction, and stop at the position where the position deviation amount becomes zero. The substrate G is fixed to the table surface by stopping the floating mechanism and operating the suction mechanism. As a result, positioning is completed in a state where the x direction of the substrate G coincides with the X direction of the laser scanning optical system.

Subsequently, the trigger mechanism 60 is driven to create an initial crack TR at the scribe start position of the glass substrate G (S102).

Subsequently, the scanning mechanism 22 is driven to adjust the positions of the planar mirrors M7 (M7a, M7b) and M8 (M8a, M8b), and the beam spot BS is positioned at the scribe start position of the substrate G. Be on the outside Then, the surface mirrors M8 (M8a, M8b) are moved (scanned) in the X direction while irradiating an oval shaped laser beam by the beam shaping portion 21 to perform scribing in the x direction of the glass substrate (S103). ).

(When a table having a plurality of grooves in the X direction is used, when the scribe is repeated a plurality of times, the movement in the Y direction (laser stop) by the plane mirrors M7 (M7a, M7b) and the plane mirrors M8 (M8a) , M8b) alternately moves (scans) (laser irradiation) in the X direction.)

When the scribing process is finished, the adsorption mechanism is stopped and the floating mechanism is operated to float the substrate G (S104). At this time, the horizontal contact of the substrate G is restricted by the movable contact portions 51a and 51b.

Subsequently, only the upper laser light source 10a is oscillated, the beam cross-section switching mechanism 29a is operated to scan the enlarged beam formed by the beam cross-sectional enlargement section 24a onto the upper surface side (surface side) of the substrate. The upper surface side is braked (S105). At this time, the braking is performed in a state where the substrate is floating, so that the upper surface side of the bonded substrate is easily divided.

Subsequently, only the lower laser light source 10b is oscillated, the beam cross-section switching mechanism 29b is operated to scan the magnified beam by the beam cross-sectional enlargement section 24b on the lower surface side (rear side) of the substrate. The side is braked (S106). At this time, since the braking is performed while the substrate is floating, the lower surface side of the bonded substrate is easily divided. By the above operation | movement, the division process of the x direction of glass substrate G is completed.

(Operation Example 2)

Next, the typical example of the operation | movement operation by the laser processing apparatus LM1 in the case of processing (crosscut) the rectangular bonded glass substrate G in the two directions of the x direction and the y direction orthogonal to each other is demonstrated. In this case, the board | substrate G is rotated 90 degrees using the board | substrate guide mechanism 50, and a bidirectional process is performed. 9 is a flowchart showing an example of operation.

Here, a description will be given of a case where a plurality of double-sided simultaneous laser scribing processing in a plurality of x directions and a plurality of double-sided simultaneous laser scribing processing in a plurality of y directions are performed, and thereafter, brake processing is performed by laser irradiation one side in the y direction. do. In addition, since the glass substrate G turns into a strip | belt shape by the brake process of ay direction, about the brake process of the x direction performed after that, it shall be brake process by brake apparatuses other than this apparatus. In addition, for convenience of description, the direction to be scribed initially is made into the x direction of glass substrate G. As shown in FIG. In addition, in the control part 80 of the laser processing apparatus LM1, the number of processes in the x direction and the number of processes in the y direction are set, and the number of processes is counted for each process.

The substrate G is set on the processing area of the table 40 (S201). The alignment mark of the board | substrate G, the cameras 55a and 55b, and the board | substrate guidance mechanism 50 are used, and the direction adjustment of the x direction of the board | substrate G and the X direction of the table 40 is performed.

A double-sided scribing process is performed along the scribe scheduled line in the x direction (S202). Positioning is performed so that the first machining position is on the groove 49, and then the substrate G is adsorbed. The trigger mechanism 60 is operated to form an initial crack, and then the injection mechanism 22 is driven to adjust the positions of the plane mirrors M7 (M7a, M7b) and M8 (M8a, M8b), and the beam. The spot BS is positioned outside the scribe start position of the substrate G. Then, while irradiating the laser beam shaped in an elliptical shape by the beam shaping portion 21, the plane mirrors M8 (M8a, M8b) are moved (scanned) in the X direction, thereby performing double-sided scribing in the x direction of the substrate G. Do it.

Subsequently, it is determined whether all of the plurality of double-sided scribing operations in the x-direction are finished (S203). When it is not finished yet, the process proceeds to S204. When all are finished, the process proceeds to S206 in order to move to the scribe processing in the y direction.

In S203, when the double-sided scribing in the x-direction is not finished, the substrate is lifted up (S204), and the position of the substrate G using the substrate guide mechanism 50 is positioned so that the next machining position is on the groove 49. Is shifted in the Y direction of the table 40 (S205). Returning to S202, the same double-sided scribe processing is repeated for the next machining position. The same machining is then repeated until all the x-direction machining is complete.

In S203, when both x-direction scribing processes are completed, the board | substrate G is floated (S206), it rotates 90 degrees using the board | substrate guide mechanism 50, and the y direction of the board | substrate G is grooved ( 49). Thereby, the y direction of the board | substrate G is set on the process area | region of the table 40 (S207). The alignment mark of the board | substrate G, the cameras 55a and 55b, and the board | substrate guide | guide mechanism 50 are used, and the direction of the y direction of the board | substrate G and the X direction of the table 40 is performed.

Subsequently, double-sided scribing is performed along the scribe scheduled line in the y-direction of the substrate G (S208). Positioning is performed so that the first machining position in the y direction is above the groove 49, and then the substrate G is adsorbed. The trigger mechanism 60 is operated to form an initial crack, and then the injection mechanism 22 is driven to adjust the positions of the plane mirrors M7 (M7a, M7b) and M8 (M8a, M8b), and the beam. The spot BS is positioned outside the scribe start position of the substrate G. Then, by irradiating (scanning) the planar mirrors M8 (M8a, M8b) in the X direction while irradiating an oval shaped laser beam by the beam shaping portion 21, double-sided scribing is performed in the y direction of the substrate G. Do it.

It is determined whether all of the plurality of double-sided scribing operations in the y-direction are finished (S209). When the entire scribe in the y direction is not finished, the process proceeds to S210. When the entire scribe is finished, the process proceeds to S212 in order to continue to move to the braking process in the y direction.

In S209, when the double-sided scribing in the y-direction is not finished, the substrate is floated (S210), and the position of the substrate G using the substrate guide mechanism 50 is placed so that the next machining position is on the groove 49. Is shifted in the Y direction of the table (S211). Returning to S208, the same double-sided scribe processing is repeated for the next machining position. Thereafter, the same processing is repeated until all the y-direction machining is completed.

In S209, when all the double-sided scribing in the y direction is completed, the substrate G is floated (S212), and among the plurality of scribe lines formed on the substrate G by using the substrate guide mechanism 50, First, the position at which brake processing is performed is positioned in the direction of the groove 49 of the table 40, and the positioning is performed (S213).

Subsequently, only the upper laser light source 10a is oscillated, and the beam cross-section switching mechanism 29a is operated to scan the enlarged beam formed by the beam cross-sectional enlargement section 24a on the upper surface side (surface side) of the substrate. Then, the upper surface side is braked (S214). At this time, the braking is performed in a state where the substrate is floating, so that the upper surface side of the bonded substrate is easily divided.

Subsequently, only the lower laser light source 10b is oscillated, the beam cross-section switching mechanism 29b is operated to scan the enlarged beam by the beam cross-sectional enlargement section 24b on the lower surface side (rear side) of the substrate, The side is braked (S215). At this time, since the braking is performed while the substrate is floating, the lower surface side of the bonded substrate is easily divided.

By the above operation | movement, the 1st 1st brake process of the y direction of glass substrate G is complete | finished.

Subsequently, it is determined whether all the plurality of brake processes in the y-direction are finished (S216). When the entire brake in the y direction is not finished, the substrate is floated (S217), and the position of the substrate G is changed by using the substrate guide mechanism 50 so that the next machining position is on the groove 49 in the Y direction of the table. (S218). Returning to S213, the upper surface brake processing and the lower surface double-sided brake processing are repeated in the same procedure for the next machining position. Thereafter, the same machining is repeated until the brake machining in all y directions is completed.

In S216, when it is determined that all the brakes in the y-direction are completed, the brake processing by the apparatus is terminated.

As a result, a board | substrate divided | segmented into strip | belt shape is obtained, these are moved to another brake apparatus, and it breaks down suitably and a brake is completed.

As described above, from scribing to brake processing can be easily performed, and reliable division can be realized by brake processing in a floating state.

(Industrial availability)

INDUSTRIAL APPLICABILITY The present invention can be used for a laser processing apparatus in which scribing or brake processing is performed by laser irradiation.

10a, 10b laser light source 20a, 20b laser scanning optical system
21a, 21b beam shaping 22a, 22b injection mechanism
23a, 23b optical path adjuster 24a, 24b beam cross section enlarged part
29a, 29b beam section switching mechanism 40 table
40a, 40b part table 41 upper member (porous member)
46 Vacuum pump 47 Air source
49 groove 50 substrate guide mechanism
51a, 51b movable contact 54a, 54b contact member
55a, 55b camera

Claims (5)

A laser processing apparatus for processing by scanning a laser beam on two front and back surfaces of a substrate made of a brittle material,
A first beam scanning optical system for shaping the laser beam emitted from the laser light source into a first beam composed of parallel light beams and guiding and scanning the substrate surface side;
A second beam scanning optical system for shaping the laser beam emitted from the laser light source into a second beam made of parallel light beams and guiding and scanning the substrate back side;
A table having a substrate placing surface divided by a groove serving as an optical path for guiding the second beam to the substrate back surface,
The substrate mounting surface is formed of a porous member, and a floating mechanism is installed to blow air onto the substrate through the porous member.
In addition, a pair of contact portions contacting the substrate side of the floating substrate in an arrangement sandwiching the substrate therebetween to limit the horizontal movement of the substrate;
And a substrate induction mechanism for guiding the substrate by pushing the side surface of the substrate in a horizontal direction by horizontally moving the pair of contact portions. The laser processing apparatus according to claim 1, wherein an adsorption mechanism for adsorbing a substrate through the porous member is further provided on the table. 2. The first beam scanning optical system and the second beam scanning optical system are each one of a beam cross section having one of a parallel beam for scribing having an elliptical cross section and a parallel beam for brake having a larger cross-sectional area than the parallel beam for scribing. The laser processing apparatus provided with the beam cross-section switching mechanism to switch. The laser processing apparatus according to claim 1, further comprising a groove width adjusting mechanism for adjusting a width of the groove.
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