TW200927353A

TW200927353A - Laser processing apparatus

Info

Publication number: TW200927353A
Application number: TW097136422A
Authority: TW
Inventors: Hideki Morita; Norifumi Arima
Original assignee: Mitsuboshi Diamond Ind Co Ltd
Priority date: 2007-12-27
Filing date: 2008-09-23
Publication date: 2009-07-01
Also published as: KR101211019B1; WO2009084276A1; JPWO2009084276A1; TWI413563B; JP5374385B2; KR20100035175A; CN101909806B; CN101909806A

Abstract

Provided is a laser processing apparatus which can easily and surely perform steps from double face scribing to double face breaking. The laser processing apparatus is provided with a first beam scanning optical system (22a), which shapes a beam into a first beam composed of a parallel luminous flux and guides the first beam to a substrate front surface for scanning; a second beam scanning optical system (22b), which shapes a beam into a second beam composed of a parallel luminous flux and guides the second beam to a substrate rear surface for scanning; and a table having a substrate placing surface (41) divided by a groove (49) to be an optical path for guiding the second beam to the substrate rear surface. On the substrate placing surface, floating mechanisms (41, 47) are formed of a porous member for floating the substrate by blowing a gas to the substrate. An abutting section (54) is arranged for limiting movement of the substrate in the horizontal direction by abutting to the side surface of the floated substrate. Double face scribing is performed to the substrate in a state where the substrate is placed on the substrate placing surface, and the substrate is broken from each surface in the floated state.

Description

200927353 九、發明說明：【發明所屬之技術領域】本發明，係關於藉由對基板之表面與背面掃描雷射光束’來進行基板之兩面加工的雷射加工裝置。具體而言，係關於使用在例如液晶面板用基板之貼合基板之兩面分割加工等的雷射加工裝置。【先前技術】將對被加工基板之雷射光束之照射位置相對移動來進行加工之掃描型雷射加工裝置，係使用於玻璃基板等之脆性材料基板之加工。最近亦有提出一種雷射加工裝置，係對如液晶面板用基板之貼合有2片玻璃基板之貼合基板，使從1個雷射光源照射之雷射光束以分光器分岐，或從2個雷射光源獨立照射雷射光束，對基板兩面同時照射雷射光束來劃線或分割（參照專利文獻1、專利文獻2)。且於專利文獻1揭示，藉由進行掃描基板表背各側以形成第一雷射點、冷卻區域、第二雷射點，使裂痕進展更 /木以1 _人之劃線步驟（在此期間進行2次雷射照射）斷開貼合基板。上述之雷射加工裝置，係以使進行加工時之加工寬度狹窄以提南加工精度、或於加熱時提高加熱效率以提高掃描速度為目的，使從雷射光源射出之截面形狀為圓形之雷射光束（原光束）於光路上調整，使光束聚光於基板之加工面 6 200927353 (專利文獻〜或形成藉由至基板之高度（距面積變化之楕圓形之光束點（專利文獻！）。束.、此外’所形成之光束點之形狀不僅有如文字所述之「精 ::接’如長圓、其他具有長轴方向之細長形狀之光束點，亦與楕圓形同樣能提高加工精度或加熱效率。因此，在此處右稱「楕圓形」之光束點時1包含長圓形狀等之光束點、將複數個圓形光而丨士、古# m ❸ 轴方向的光束點㈣成直線狀之光束點等能定義長從雷射光源所射出之圓形截面之原光束形成楕圓形狀之先束點之方丨，目前已實際運用的有使用透鏡光學系統形成具有長軸之光束點的方法。例如藉由於雷射光束之光路上配置圓筒透鏡與聚光透鏡"吏圓形截面之原光束整形為楕圓形之雷射光束（例如參照專利文獻3)。圖10係表示掃描型雷射加工裝置之一之裂痕形成裝置 _(雷射劃線裝置）之習知例的構成圖。該裝置，係將雷射BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for performing both surfaces of a substrate by scanning a laser beam ' on a front surface and a back surface of a substrate. Specifically, it relates to a laser processing apparatus that uses a split film or the like on both surfaces of a bonded substrate such as a liquid crystal panel substrate. [Prior Art] A scanning type laser processing apparatus that relatively moves an irradiation position of a laser beam of a substrate to be processed is used for processing a brittle material substrate such as a glass substrate. Recently, a laser processing apparatus has been proposed which is a laminated substrate in which two glass substrates are bonded to a substrate for a liquid crystal panel, so that a laser beam irradiated from one laser light source is branched by a beam splitter, or from 2 Each of the laser light sources independently illuminates the laser beam, and simultaneously irradiates the laser beam on both sides of the substrate to scribe or divide (see Patent Document 1 and Patent Document 2). Further, in Patent Document 1, it is disclosed that the first surface of the back surface of the substrate is scanned to form a first laser spot, a cooling region, and a second laser spot, so that the crack progresses more/wood step by step. During the period of 2 laser irradiations, the bonded substrate is broken. In the laser processing apparatus described above, the cross-sectional shape emitted from the laser light source is circular for the purpose of narrowing the processing width during processing to improve the processing accuracy of the south or to increase the heating efficiency during heating to increase the scanning speed. The laser beam (original beam) is adjusted on the optical path to converge the beam on the processing surface of the substrate. 6 200927353 (Patent Document ~ or formation by the height to the substrate (the beam point of the circular shape from the change of the area (patent literature! In addition, the shape of the beam spot formed by the beam is not only as described in the text: "fine:: joint" such as a long circle, other beam points with a long axis and a slender shape, and the same as the dome shape can be improved. Accuracy or heating efficiency. Therefore, when the beam point of the "楕 circle" is right here, 1 includes a beam point of a long circular shape, a beam point of a plurality of circular lights, and a beam point in the direction of the gentleman and the ancient # m ( axis (4) A linear beam point or the like can define a square beam of a circular beam having a circular cross section which is emitted from a laser light source, and a lens optical system is currently used. A method of having a long-axis beam spot, for example, by arranging a cylindrical lens and a condenser lens with a circular cross section as a circular laser beam (for example, refer to Patent Document 3) Fig. 10 is a view showing a configuration of a conventional example of a crack forming device _ (laser scribe device) which is one of scanning type laser processing apparatuses.

光束之照射位置固定成不動’而使平台移動於二維方向⑽ 方向）與旋轉方向（0方向）。即’設置有沿平行配置於架台501上之一對導軌503、 =4,往返移動於10之紙面前後方向（設為γ方向）的滑動 σ 502於兩導轨503、504之間沿前後方向配置導螺桿於該導螺桿5〇5螺合有固定於滑動台5〇2之支架π。藉由使導螺桿505以馬達（不圖示）正、反轉，使滑動台如沿導軌503、5〇4往返移動於γ方向。於滑動台502上，將水平之台座5〇7配置成可沿導軌 7 200927353 50 8往返移動於圖10之左右方向（設為χ方向卜於固定在台座507之支架510,貫通螺合藉由馬達5〇9旋轉之導螺桿 510a’藉由導螺桿51〇a正、反轉，使台座5〇7沿導軌5〇8, 往返移動於X方向。於台座507上，設有藉由旋轉機構511旋轉之旋轉台 512,於該旋轉台5 12，以水平狀態安裝玻璃基板旋轉機構511 ’使旋轉台512繞垂直之軸旋轉，以能相對基準位置成為任意之旋轉角度之方式旋轉來形成。又，基板G，例如藉由吸附夹頭固定於旋轉台512。在旋轉台512之上方，連接雷射513之光學夾持具514 保持於機架515 ^如圖6所示，於光學夾持具5M設有透鏡光學系統514a(例如圓柱透鏡），用以使從雷射513發射之雷射光束作為楕圓形之加熱點HS照射於基板G上。又，於透鏡光學系統5 14a下，設有藉由使焦點位置上下移動以使加熱點HS之區域放大、縮小之調整透鏡51朴。若使加熱點 φ HS之區域放大、縮小，照射於基板面之面積、能量密度則會變化’因此’例如藉由調整透鏡514b放大加熱點HS時使田射振盪器5 13之輸出增加，要縮小加熱點HS時使雷射振盈器513之輸出減少，以調整使用。又’於光學失持具514附近，亦可設置冷卻嘴516,係藉由將冷媒朝向加熱點後側之位置噴霧而形成冷卻點來急冷，以促進熱應力之產生。於裂痕形成裝置500之左上方固定有一對CCd攝影機 520(521)。該等攝影機係用於基板之位置檢測。即於載置 8 200927353 於旋轉台512之玻璃基板G附有作為加工基準之一對標記 (對準標記），一對之CCD攝影機520(521)，以旋轉台512 回歸原點位置之狀態（圖10之旋轉台512往左端移動之狀態），拍攝此等標記。又，於圖i 0僅圖示紙面前側之CCD 攝影機520，紙面後侧之CCD攝影機521未圖示。將藉由CCD攝影機520、521拍出之基板g之影像，藉由一邊以顯示部557(後述）監控，一邊進行滑動台5〇2、台座507、旋轉台512之調整，來進行基板G之定位。藉由疋成定位，基板G之各點則與設定於裂痕形成裝置5〇〇之座標系統相對應。於旋轉台512之上方，透過上下移動調節機構517安裝有刀輪518。刀輪518，專用於在破璃基板G之端緣形成初期龜裂TR時’使台座507從待機位置朝χ方向移動且使刀輪518暫時下降，使之回至待機位置。接著，參照圖U說明裂痕形成裝置5〇〇之控制系統。〇於裂痕形成裝置500中，以電腦（cpu)構成之控制部55〇控制如下之各驅動系統：平台驅動部55卜係驅動用以進行滑動台502及台座507之定位之馬達（馬達5()9等）；雷射驅動部552,係驅動雷射513及光學爽持具514之調整透鏡_ 以照射雷射光束；冷卻嘴驅動部553,在設置冷卻嘴MG時進行冷媒之喷霧；刀具驅動部554，進行刀輪518之定位及對玻璃基板G之難力之調整；及攝影機驅㈣…， CCD攝影機520、521之攝影。於控制部550,連接鍵盤、滑鼠等輸入裝置所構成之輸 9 200927353 · 入。卩556,及進行各種顯示之顯示畫面所構成之顯示部 557,以能將必要之訊息顯示於顯示畫面，且輸入必要之指示或設定。曰其次，說明裂痕形成裝置500之動作。將玻璃基板G 載置於旋轉台512上。此時使用攝影機52〇、521定位。使裂痕形成裝置500儲存分割預定線。接者，開始形成裂痕。開始處理後，讀出所儲存之分 •割預定線CL之位置資料，移動滑動台5〇2、台座5〇7(旋轉口 512)’使刀輪518接近起點pQ。進而在刀輪下降之狀態下’藉由㈣台座5G7(旋轉台512)使基板端接近刀輪 5 1 8 ’以於基板端形成初期龜裂TR。接著，移動滑動台502、台座5〇7(旋轉台512)，使光束點BS來至初期龜裂㈣方近處之位置。然後，使雷射 513振盪而使雷射光束照射來形成光束點bs，從起點&至終點P〗沿分割預定線CL掃描（視必要使冷卻噴之冷卻點追隨來掃描）。 ^ 藉由執行以上之處理，形成沿分割預定線CL之裂痕。一般而言，具備平台並進機構（將載置基板之平台，與基板一起朝二維方向（XY方向）移動，或朝一維方向（χσ方向') 移動）之雷射加工裝置，其光束點掃描之穩定性較佳，能進行再現性良好之雷射加工。然而，因需使平台移動，需要從平台之移動開始位置至移動結束位置之空間，較使平台固定之裝置，裝置整體之设備空間可能至少增加2倍程度（一維驅動之情形），或4 10 200927353 •‘ 倍程度（二維驅動之情形）。特別是，最近如加工液晶面板用玻璃基板之情形，加工對象之面積有增大之趨勢。因此隨著基板面積增加，需要更大之設置空間。因此，已提案於雷射光束側設置二維（χγ方向）並進機構之雷射分割跋置（雷射加工裝置）（參照專利文獻3)。根據該文獻’係具備將能調整光束點形狀之雷射光學系統（折射透鏡、調焦透鏡群）整體朝雷射光束之掃描方向移 ® 動的驅動機構。專利文獻1 :日本特開2004- 3 6315號公報專利文獻2:日本特開2002— 172479號公報專利文獻3 :日本特開2000- 61677號公報【發明内容】替代使平台移動之並進機構，具備使雷射光學系統整體朝掃描方向移動之並進機構的雷射加工裝置，因能使設置面積縮小’故能成為簡潔之裝置構成。然而’若要將未具有平台之並進機構而使雷射光學系統移動之簡潔之裝置構成’適用於進行基板之兩面加工之雷射加工裝置時’因在基板背面側存在平台，故需要成為平台不妨礙雷射加工之光學系統之配置或平台構造。又’專利文獻1所記載之進行兩面加工之雷射加工裝置’如上述’揭示以一次之掃描執行雷射劃線至雷射裂斷而一次斷開的方法（專利文獻1)。但是，要進行該加工則需 11 200927353 要依被加工基板之種類、厚度等之狀況設定加工條件之調整作業，而需铯費時間設定其條件或調整作業。特別是，會因依基板之厚度（因光路長度變化）不同使光束點之大小變化，因此需要配合基板之厚度進行調整。因此，本發明之目的在於提供··能對基板等之分割加工所需要之加工條件減少限制，不必取決於基板之種類或厚度，即能進行劃線加工及裂斷加工的兩面加工用之雷射加工裝置。又’本發明之目的在於提供：不必取決於基板之厚度，即能以1個加工裝置簡單地進行劃線加工至裂斷加工之作業的雷射加工裝置。為解決上述課題而完成之本發明之雷射加工裝置，係能在將待進行兩面加工之基板載置於平台之狀態對兩面同時進行劃線加工，其後以使基板懸浮之狀態就各側逐一進行裂斷加工。即’本發明之雷射加工裝置，係對由脆性材料構成之基板之表背兩面掃描雷射光束以進行加工，其特徵在於具備：第一光束掃描光學系統，係將從雷射光源射出之雷射光束整形為平行光束所構成之第一光束，並導至基板表面侧以掃描；第二光束掃描光學系統，係將從雷射光源射出之雷射光束整形為平行光束所構成之第二光束，並導至基板背面側以掃描；及平台，具有基板載置面，該基板載置面係被用以將該第二光束導至基板背面之光路之槽分割；於基板載置面’設置以多孔質構件形成、透過多孔質構件 12 200927353 將乳體吹至基板以使之懸浮之懸浮機構；進一步地設有抵接邠，係抵接於懸浮之基板之基板侧面以限制基板之水平方向之移動。此處之脆性材料基板，雖主要使用於玻璃之貼合基板，但不限於此，亦可係石夕基板、藍寶石基板、其他之半導體基板、陶瓷基板等之貼合基板。又，用以將雷射光束導至基板背面之光路之槽可i ❹條或複數條，可藉由基板形狀、欲分割加工之基板上之位置，加工條數，決定平台之槽之位置、條數。 —又，抵接部，若基板係定型時可固定於基板載置面上。右基板係非定型時較佳為能移動之可動抵接部。根據本發明，基板係載置於平台上。當基板懸浮機構作動時，藉由將氣體吹至基板使基板懸浮。此時，抵接部係限制基板之水平方向之移動。另一方面，照射於基板表面側之第-光束及第二光束係整形為平行光束後導至基板 ❹表面、基板背面。又，平台’係於基板載置面形成用以將第一光束v至基板背面之光路之槽，透過該槽將第二光束射於基板背面。因此’以將基板載置於平台之狀態將第i 次之雷射光束照射於兩面以進行劃線加工，接著，以使基板懸浮之狀態對任-單侧基板面照射第2次之雷射光束以進行單側面之裂斷加工。此時，由於雷射光束係以平行光束…、射，因此會因載置於平台上之狀態之基板與懸浮狀態之基板的高度之差異使光束之照射位置關係不會變化，而不需要進行光學㈣之調整。接著，以使基㈣浮之狀態， 13 200927353 將第2次雷射光束照射於相反侧基板面而進行另一基板面之裂斷加工。此時亦同樣地’由於雷射光束係平行光束照射，因此會因載置於平台上之狀態之基板與懸浮狀態之基板的高度之差異’使雷射光束之照射位置或光束點之形狀不變化’不必調整光學系統。如上述，因先進行劃線加工後’能就各單側面分別進行裂斷加工，並且以懸浮狀態（自由支撐狀態）照射雷射進行裂斷，故相較於以接觸於平台之基板載置面之狀態進行裂斷之情形，能簡單且確實地分割。根據本發明，在使基板載置於基板載置面上之狀態與使基板懸浮之狀態，因能將基板之水平方向之位置限制成相同，且使雷射光束為平行光束，故即使於基板載置面進行劃線加工且以懸浮狀態進行裂斷加工，仍能在不進行基板之高度方向之差距所需之光學系統之位置調整之情況下進行加工。又，因以懸浮狀態進行裂斷加工，故相較於以載置於平台之狀態進行裂斷加工之情形，能簡單地分割。 0 又，本發明，不需取決於基板之厚度即能以^個加工裝置簡單地進行劃線加工至裂斷加工之作業。上述發明中，亦可於平台進一步設置透過多孔質構件吸附基板之吸附機構。藉此，因於劃線加工時能吸附基板劃線，故能作正確且再現性良好之劃線加工。特別是，於基板之板厚較薄時之劃線，雖在進行交又分割時需要將劃線之深度正確地控制，但藉由以吸附機構進行劃線加工，而能於劃線加工作精度良好之深度控制。 14 200927353 上述發明中，第一光束掃描光學系統與第二光束掃描光予系、.克亦可刀別具備光束截面切換機構，該光束截面切換機構係將光束截面切換為截面係楕圓之劃線用平行光束、或截面積較該劃線用平行光束大之裂斷用平行光束的任一種光束。藉此，因於劃線加工時使用楕圓光束’於裂工使用較劃線用平行光束截面積大之光束，&能以適合於各加工之光束點形狀加工。上述發明中，亦可設有藉由使該抵接部水平移動以將土板側面朝水平方向推壓而誘導基板之基板誘導機構。藉此，忐於平台上進行基板位置之微調整，或基板之旋轉移動。上述發明中，亦可具備調整槽寬之槽寬調整機構。藉此，能依照分割預定線之位置或條數調整槽寬。例如有相接近之2條分割預定線之情形，即能將該等2條分 ⑩。/預定線調整為能加卫之槽I又，若分割預定線之條數較v時’能將不要之槽封閉。【實施方式】 ’主要以玻璃基板加工用之雷射加工裝置為例，根據圖式說明本發明之實施形態。圖1係本發明之一實施形態之雷射加工裝置LM1的整體構成圖。圖2係表示雷射加工裝置LM1之截面構成的示意圖〇 f &丄田射加工裝置LM1 ’主要由上下一對之雷射光源 15 200927353 10(10a、10b)、上下一對之雷射掃描光學系統20(20a、20b) (但因20b隔著平台40位於與20a對稱之位置之故，在圖i 未圖示）、平台40、基板誘導機構50、及起始機構60構成。於以下之說明，若同一構件形成一對於上下時，於上侧加a，於下側加b來分別，但對上下同一構件之說明，為避免說明過於冗長，對一部分之說明省略a、b之記載來說明。 (雷射光源）雷射光源10(10a、10b)係使用C02雷射。亦可使用C0 雷射、準分子雷射替代C〇2雷射。從雷射光源1〇射出截面形狀係圓形之雷射光束（原光束L0)。 (雷射掃瞄光學系統）雷射掃描光學系統20(20a、20b)，可大分為由下列構件構成，即：光束整形部21(2 la、21b) ’將雷射光束（原光束）之截面形狀調整為平行光束之楕圓光束；光束截面放大部 24(24a、24b)，使雷射光束（原光束）之截面形狀保持圓形光束放大成平行光束之圓形光束射出；掃描機構22(22a、 22b) ’使雷射光束沿平台面（χγ方向）移動（掃描）；光路調整部.23(23a、23b)，使從光束整形部21及光束截面放大部24 射出之ig射光束導引至掃描機構22;及光束截面切換機構 29(29a、29b)，使雷射光束（原光束）之光路在光束整形部21 與光束截面放大部24之間切換。又，將平台面中之父方向設為掃描軸方向（進行掃描加工或裂斷加工之方向），將Y方向設為進給轴方向。 16 200927353 說明光束整形部21(21a、21b)。光束整形部2ι，係由用以將從雷射光源W射出之原光束整形為截面形狀為楕圓形之平行光束，且調整平行光束之長軸捏、短抽徑的複數個光學元件構成。圖3(a)係表示射出楕圓形之平行光束之光束整形部 21 (21a、21b)之構成例的圖。該光束整形部21，係由第一拋物面鏡（凹面）M1、第二拋物面鏡（凸面）M2、第三拋物面鏡 M3 (凸面）、第四拋物面鏡M4 (凹面）之4個光學元件構成。其中，第一拋物面鏡（凹面）M1與第二拋物面鏡（凸面）M2, 以使彼此之焦點一致而成為共焦點Fa之方式配置。又，第三拋物面鏡（凸面）M3與第四拋物面鏡（凹面）M4，亦以使彼此之焦點一致而成為共焦點f34之方式配置。並且’將該等4個拋物面鏡配置為立體，以使從第一拋物面鏡（凹面）M1射向第二拋物面鏡（凸面）]VI2之雷射光束之行進方向成為χγ方向，使在第二拋物面鏡M2反射之雷 ❹射光束射向第三拋物面鏡M3，使從第三拋物面鏡（凸面）M3 射向第四拋物面鏡（凹面）M4之雷射光束之行進方向成為 XZ面。藉由如上述之配置，第一拋物面鏡河丨，使朝X方向行進之圓形截面之原光束L0(參照圖3 (b))，反射於χγ方向。此時’Z方向之光束寬度係保持不變，γ方向之光束寬度一邊縮小—邊行進，而射入於第二拋物面鏡M2。由於使第二拋物面鏡M2配置成共焦點F1S，當反射聚光於Υ方向之雷射光束時’即再成為平行光束Ll(參照圖3(c))朝向X方向 17 200927353 進行。該平行光束L1之Z方向之光束寬度，係保持原光束 L0之光束寬度’而成為具有縮小γ方向之光束寬度之楕圓形狀截面的雷射光束。再者，當平行光束L1行進而在第三拋物面鏡1^[3反射時，Y方向之光束寬度保持不變而一邊放大χ方向之光束寬度一邊行進於χζ面内，射入於第四拋物面鏡M4。The irradiation position of the light beam is fixed to be stationary, and the platform is moved in the two-dimensional direction (10) direction and the rotation direction (0 direction). That is, 'sliding σ 502 is provided between the two guide rails 503 and 504 in the front-rear direction between the two guide rails 503 and 504, which are provided with a pair of guide rails 503, =4 arranged in parallel on the gantry 501, and a reciprocating movement in the front and rear direction of the paper of 10 (set to the γ direction). The lead screw is disposed on the lead screw 5〇5 to be screwed to the bracket π fixed to the slide table 5〇2. By rotating the lead screw 505 forward and backward by a motor (not shown), the slide table is reciprocated in the γ direction along the guide rails 503 and 5〇4. On the sliding table 502, the horizontal pedestal 5〇7 is arranged to be reciprocally moved along the guide rail 7 200927353 50 8 in the left-right direction of FIG. 10 (the χ direction is set to the bracket 510 fixed to the pedestal 507, and the through-spinning is used The lead screw 510a' of the motor 5〇9 is rotated forward and reverse by the lead screw 51〇a, so that the pedestal 5〇7 moves back and forth in the X direction along the guide rail 5〇8. The pedestal 507 is provided with a rotating mechanism. The rotating table 512 that rotates 511 is mounted on the rotating table 51, and the glass substrate rotating mechanism 511' is mounted in a horizontal state. The rotating table 512 is rotated about a vertical axis, and is rotatable so that the reference position can be rotated at an arbitrary angle. Further, the substrate G is fixed to the rotating table 512 by, for example, an adsorption chuck. Above the rotating table 512, the optical holder 514 to which the laser 513 is attached is held in the frame 515. As shown in FIG. 6, the optical clamping is performed. 5M is provided with a lens optical system 514a (for example, a cylindrical lens) for illuminating the laser beam emitted from the laser 513 as a heating point HS on the substrate G. Further, under the lens optical system 5 14a, Provided by moving the focus position up and down The area of the hot spot HS is enlarged and reduced by the adjustment lens 51. When the area of the heating point φ HS is enlarged or reduced, the area of the substrate surface and the energy density are changed. Therefore, the heating point HS is amplified by, for example, adjusting the lens 514b. When the output of the field oscillator 5 13 is increased, the output of the laser vibrator 513 is reduced when the heating point HS is reduced to adjust the use. Further, a cooling nozzle 516 may be disposed near the optical dislocation device 514. The cooling point is formed by spraying the refrigerant toward the rear side of the heating point to form a cooling point to promote the generation of thermal stress. A pair of CCd cameras 520 (521) are fixed to the upper left of the crack forming apparatus 500. These cameras are used. The position of the substrate is detected. That is, the glass substrate G on the rotating table 512 is placed on the ground plate 8 of 200927353, and a pair of CCD cameras 520 (521) are attached as a processing reference, and the CCD camera 520 (521) is returned by the rotating table 512. The state of the origin position (the state in which the rotary table 512 moves to the left end in Fig. 10) is photographed. Further, only the CCD camera 520 on the front side of the paper is shown in Fig. i 0, and the CCD camera 521 on the rear side of the paper is not The image of the substrate g taken by the CCD cameras 520 and 521 is adjusted by the display unit 557 (described later) while the slide table 5〇2, the pedestal 507, and the rotary table 512 are adjusted. The positioning of the substrate G. By the positioning of the substrate, the points of the substrate G correspond to the coordinate system set in the crack forming device 5A. Above the rotating table 512, the cutter wheel 518 is mounted through the vertical movement adjusting mechanism 517. When the initial crack TR is formed on the edge of the glass substrate G, the cutter wheel 518 is configured to move the pedestal 507 from the standby position in the χ direction and temporarily lower the cutter wheel 518 to return to the standby position. Next, a control system of the crack forming device 5A will be described with reference to FIG. In the crack forming apparatus 500, a control unit 55 configured by a computer (Cpu) controls each of the following drive systems: the platform drive unit 55 drives a motor for positioning the slide table 502 and the pedestal 507 (motor 5 ( a laser driving unit 552 that drives the laser 513 and the adjustment lens _ of the optical cooler 514 to illuminate the laser beam; and the cooling nozzle driving unit 553 to spray the refrigerant when the cooling nozzle MG is disposed; The tool driving unit 554 performs positioning of the cutter wheel 518 and adjustment of the difficulty of the glass substrate G; and photography of the camera drive (4), CCD cameras 520 and 521. The control unit 550 is connected to an input device such as a keyboard or a mouse. The display unit 557, which is configured to display various display screens, displays the necessary information on the display screen and inputs necessary instructions or settings. Next, the action of the crack forming apparatus 500 will be described. The glass substrate G is placed on the rotary table 512. At this time, the cameras 52 〇 and 521 are used for positioning. The crack forming device 500 is caused to store the dividing line. Pick up, began to form cracks. After the start of processing, the position data of the stored minute/cut predetermined line CL is read, and the slide table 5〇2 and the pedestal 5〇7 (rotation port 512)' are moved so that the cutter wheel 518 approaches the starting point pQ. Further, in the state where the cutter wheel is lowered, the base end is brought close to the cutter wheel 5 1 8 ' by the (4) pedestal 5G7 (rotary table 512) to form the initial crack TR at the substrate end. Next, the slide table 502 and the pedestal 5〇7 (rotary table 512) are moved to bring the beam spot BS to a position close to the initial crack (four). Then, the laser beam 513 is oscillated to irradiate the laser beam to form a beam spot bs, and scanning is performed along the dividing line CL from the start point & to the end point P (if necessary, the cooling point of the cooling jet is followed to scan). ^ By performing the above processing, a crack along the dividing line CL is formed. In general, a laser scanning device having a platform parallel mechanism (a platform on which a substrate is placed, moving in a two-dimensional direction (XY direction) together with a substrate, or moving in a one-dimensional direction (χσ direction)) The stability is better, and laser processing with good reproducibility can be performed. However, due to the need to move the platform, it is necessary to move from the mobile start position to the mobile end position. The device space of the device may be increased by at least twice as much as the device fixed by the platform (in the case of a one-dimensional drive), or 4 10 200927353 • 'Multiplier (in the case of two-dimensional drive). In particular, in the case of processing a glass substrate for a liquid crystal panel, the area of the processing object tends to increase. Therefore, as the substrate area increases, a larger setting space is required. Therefore, a laser division device (laser processing device) in which a two-dimensional (χγ direction) parallel mechanism is provided on the side of the laser beam has been proposed (see Patent Document 3). According to this document, there is provided a drive mechanism that moves the entire laser optical system (refractive lens, focus lens group) capable of adjusting the shape of a beam spot toward the scanning direction of the laser beam. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. 2000-61677 (Patent Document No. 2000-61677). The laser processing apparatus for moving the laser optical system to the scanning direction as a whole can reduce the installation area, so that it can be a simple device. However, 'If you want to use a simple device that moves the laser optical system without the parallel mechanism of the platform, it is suitable for a laser processing device that performs two-sided processing of the substrate. 'Because there is a platform on the back side of the substrate, it needs to be a platform. Does not hinder the configuration or platform construction of the optical system for laser processing. Further, the above-described laser processing apparatus for performing double-sided processing described in Patent Document 1 discloses a method of performing laser beam slashing to laser rupture and cutting once in one scan (Patent Document 1). However, it is necessary to set the processing conditions according to the type and thickness of the substrate to be processed, and it is necessary to set the conditions or adjust the operation time. In particular, depending on the thickness of the substrate (due to changes in the length of the optical path), the size of the beam spot changes, so it is necessary to adjust the thickness of the substrate. Therefore, an object of the present invention is to provide a reduction in processing conditions required for a division process of a substrate or the like, and it is possible to perform a double-sided processing for a scribing process and a cracking process without depending on the type or thickness of the substrate. Injection processing device. Further, an object of the present invention is to provide a laser processing apparatus which can easily perform a scribing process to a cracking process by one processing apparatus depending on the thickness of the substrate. The laser processing apparatus of the present invention, which is completed in order to solve the above problems, is capable of simultaneously performing scribing processing on both sides while placing the substrate to be subjected to double-sided processing on a stage, and thereafter suspending the substrate on each side. The cracking process is performed one by one. That is, the laser processing apparatus of the present invention scans a laser beam on both sides of a front and back surface of a substrate made of a brittle material, and is characterized in that: the first beam scanning optical system is emitted from a laser light source. The laser beam is shaped into a first beam composed of parallel beams and guided to the surface side of the substrate for scanning; the second beam scanning optical system is formed by shaping the laser beam emitted from the laser source into a parallel beam. The light beam is guided to the back side of the substrate for scanning; and the platform has a substrate mounting surface that is divided by a groove for guiding the second light beam to the optical path of the back surface of the substrate; Providing a suspension mechanism formed of a porous member and permeating through the porous member 12 200927353 to blow the emulsion onto the substrate to suspend the suspension; further providing an abutting contact to abut the side of the substrate of the suspended substrate to limit the level of the substrate The direction of movement. Here, the brittle material substrate is mainly used for a glass bonding substrate, but is not limited thereto, and may be a bonding substrate such as a stone substrate, a sapphire substrate, another semiconductor substrate, or a ceramic substrate. Moreover, the groove for guiding the laser beam to the optical path on the back surface of the substrate may be a plurality of strips or a plurality of strips, and the position of the groove of the platform may be determined by the shape of the substrate, the position on the substrate to be processed, and the number of processed strips. The number of articles. - Further, the abutting portion may be fixed to the substrate mounting surface when the substrate is fixed. When the right substrate is not shaped, it is preferably a movable movable abutting portion. According to the invention, the substrate is placed on the platform. When the substrate floating mechanism is actuated, the substrate is suspended by blowing a gas onto the substrate. At this time, the abutting portion restricts the movement of the substrate in the horizontal direction. On the other hand, the first beam and the second beam irradiated on the surface side of the substrate are shaped into parallel beams and guided to the surface of the substrate and the back surface of the substrate. Further, the platform is formed on the substrate mounting surface to form a groove for the optical path of the first light beam v to the back surface of the substrate, and the second light beam is incident on the back surface of the substrate through the groove. Therefore, the i-th laser beam is irradiated on both sides to perform scribing processing in a state where the substrate is placed on the stage, and then the second laser is irradiated to the surface of the any-single substrate in a state in which the substrate is suspended. The beam is split for one side. At this time, since the laser beam is a parallel beam, the beam is irradiated, so that the positional relationship of the beam does not change due to the difference in height between the substrate placed on the platform and the substrate in the suspended state, and does not need to be performed. Adjustment of optics (4). Next, in a state where the base (4) is floated, 13 200927353 irradiates the second laser beam to the opposite side substrate surface to perform the cracking process of the other substrate surface. At this time, similarly, 'the laser beam is irradiated by the parallel beam, so the difference between the height of the substrate and the suspended state of the substrate placed on the platform is such that the irradiation position of the laser beam or the shape of the beam spot is not Change 'does not have to adjust the optical system. As described above, since the singulation is performed first, the unilateral side can be subjected to the rupture processing, and the laser is irradiated in a suspended state (freely supported state) to be broken, so that it is placed on the substrate in contact with the platform. In the case where the state of the face is broken, it can be easily and surely divided. According to the present invention, in a state in which the substrate is placed on the substrate mounting surface and a state in which the substrate is suspended, since the position in the horizontal direction of the substrate can be restricted to be the same, and the laser beam is made into a parallel beam, even on the substrate The mounting surface is subjected to scribing processing and is subjected to rupture processing in a suspended state, and processing can be performed without adjusting the position of the optical system required for the difference in the height direction of the substrate. Further, since the cracking process is performed in a suspended state, it can be easily divided as compared with the case where the cracking process is performed in a state of being placed on a platform. Further, according to the present invention, it is possible to easily carry out the scribing process to the cracking process by a single processing apparatus without depending on the thickness of the substrate. In the above invention, an adsorption mechanism that adsorbs the substrate through the porous member may be further provided on the stage. Thereby, since the substrate scribe line can be adsorbed during the scribing process, the scribing process with good reproducibility can be performed. In particular, in the case where the thickness of the substrate is thin, the scribe line needs to accurately control the depth of the scribe line when performing the intersection and division, but the scribe line can be used for the scribing process by the scribing process by the adsorption mechanism. Precision depth control. 14 200927353 In the above invention, the first beam scanning optical system and the second beam scanning optical system may also have a beam section switching mechanism, and the beam section switching mechanism switches the beam section to a section of the section system. The line uses a parallel beam, or a beam of a parallel beam having a larger cross-sectional area than the parallel beam of the scribe line. Thereby, since the round beam is used in the scribing process, the beam having a larger cross-sectional area than the parallel beam for scribing is used for the cracking, and the beam shape can be processed in a shape suitable for each processing. In the above invention, the substrate inducing mechanism for inducing the substrate may be provided by horizontally moving the abutting portion to press the side surface of the earth plate in the horizontal direction. Thereby, the micro-adjustment of the substrate position or the rotational movement of the substrate is performed on the platform. In the above invention, the groove width adjusting mechanism for adjusting the groove width may be provided. Thereby, the groove width can be adjusted in accordance with the position or the number of the lines to be divided. For example, if there are two adjacent lines that are close to each other, the two items can be divided into 10 pieces. / The line is adjusted to be able to be added to the slot I. If the number of lines to be divided is greater than v, the slot can be closed. [Embodiment] The embodiment of the present invention will be described mainly by taking a laser processing apparatus for processing a glass substrate as an example. Fig. 1 is a view showing the entire configuration of a laser processing apparatus LM1 according to an embodiment of the present invention. 2 is a schematic view showing a cross-sectional configuration of the laser processing apparatus LM1. The &f & 丄田射加工 apparatus LM1' is mainly composed of a pair of upper and lower laser light sources 15 200927353 10 (10a, 10b), and a pair of upper and lower laser scans. The optical system 20 (20a, 20b) (but 20b is located at a position symmetrical with 20a via the stage 40, not shown in Fig. i), the stage 40, the substrate induction mechanism 50, and the starting mechanism 60. In the following description, if the same member is formed into a pair of upper and lower sides, a is added to the upper side, and b is added to the lower side. However, for the description of the upper and lower members, in order to avoid the description being too lengthy, a part of the description is omitted a and b. The description is given. (Laser light source) The laser light source 10 (10a, 10b) uses a C02 laser. C0 lasers, excimer lasers can also be used instead of C〇2 lasers. A laser beam (original beam L0) having a circular cross-sectional shape is emitted from the laser light source 1 . (Laser Scanning Optical System) The laser scanning optical system 20 (20a, 20b) can be broadly divided into the following members, that is, the beam shaping portion 21 (2 la, 21b) 'places the laser beam (original beam) The cross-sectional shape is adjusted to a circular beam of parallel beams; the beam section amplifying portion 24 (24a, 24b) causes the cross-sectional shape of the laser beam (original beam) to be a circular beam and a circular beam of the parallel beam is emitted; the scanning mechanism 22 (22a, 22b) 'moving (scanning) the laser beam along the land surface (χγ direction); the optical path adjusting portion .23 (23a, 23b), causing the ig beam emitted from the beam shaping portion 21 and the beam section amplifying portion 24 The scanning mechanism 22 is guided to the scanning unit 22; and the beam section switching mechanism 29 (29a, 29b) switches the optical path of the laser beam (original beam) between the beam shaping unit 21 and the beam section amplifying unit 24. Also, set the parent direction of the deck surface to the scan axis direction (the direction in which scanning or cracking is performed), and set the Y direction to the feed axis direction. 16 200927353 A beam shaping section 21 (21a, 21b) will be described. The beam shaping unit 2i is formed by a plurality of optical elements for shaping the original light beam emitted from the laser light source W into a parallel light beam having a circular cross-sectional shape and adjusting the long-axis pinch and short diameter of the parallel light beam. Fig. 3 (a) is a view showing a configuration example of beam shaping portions 21 (21a, 21b) for emitting a parallel light beam of a circular shape. The beam shaping unit 21 is composed of four optical elements of a first parabolic mirror (concave surface) M1, a second parabolic mirror (convex surface) M2, a third parabolic mirror M3 (convex surface), and a fourth parabolic mirror M4 (concave surface). Among them, the first parabolic mirror (concave surface) M1 and the second parabolic mirror (convex surface) M2 are arranged such that the focal points of each other coincide with each other to become the confocal point Fa. Further, the third parabolic mirror (convex surface) M3 and the fourth parabolic mirror (concave surface) M4 are also arranged such that the focal points of each other coincide with each other to form the confocal point f34. And 'the four parabolic mirrors are arranged in a stereo such that the direction of travel of the laser beam from the first parabolic mirror (concave surface) M1 toward the second parabolic mirror (convex surface) VI2 becomes the χγ direction, so that in the second The laser beam reflected by the parabolic mirror M2 is directed toward the third parabolic mirror M3, so that the traveling direction of the laser beam from the third parabolic mirror (convex surface) M3 toward the fourth parabolic mirror (concave surface) M4 becomes the XZ plane. By the arrangement as described above, the first parabolic mirror ridges cause the original light beam L0 (see Fig. 3 (b)) of a circular cross section which is oriented in the X direction to be reflected in the χ γ direction. At this time, the beam width in the 'Z direction is kept constant, and the beam width in the γ direction is reduced sideways while traveling, and is incident on the second parabolic mirror M2. Since the second parabolic mirror M2 is arranged in the confocal point F1S, when the reflection is concentrated on the laser beam in the x direction, the parallel beam L1 (see Fig. 3(c)) is further moved toward the X direction 17 200927353. The beam width in the Z direction of the parallel light beam L1 maintains the beam width ' of the original beam L0 and becomes a laser beam having a circular cross section which reduces the beam width in the γ direction. Further, when the parallel light beam L1 travels and is reflected by the third parabolic mirror 1^[3, the beam width in the Y direction remains unchanged while the beam width in the x direction is enlarged while traveling in the pupil plane, and the fourth paraboloid is incident. Mirror M4.

第四拋物面鏡M4，藉由配置成共焦點F34，當反射放大於X方向之雷射光束時，即再變成平行光束參照圖 3(d))朝向X方向前進。該平行光束[2之2方向之光束寬度較原光束L0放大，γ方向之光束寬度成為具有較原光束縮小之較長長轴之楕圓形狀截面的雷射光束。 ,〜並且，藉由光束整形部21整形之截面形狀係楕圓形之 w >光束L2經·過後段之光路調整部23及掃描機構22， T基板G上形成楕圓形狀之光束點Bs。因此，藉由調整該等4個拋物面鏡M1(MU、卜數’即能形成所欲之精圓形狀之光束點。)之先學常其次，制光路調整部23(23a、咖）。総調整部Μ， ^所不’由2個平面鏡M5(M5a、刪）、撕(黯、構成。平面鏡MS係、使朝方向行進之平行光束L2彎折，之向行進之平行光束L3。藉由調整平行光束L2 方向之調Γ二5:::)’來進行舆掃描機構22間之父 L3蠻技千面鏡M6係使朝Z方向行進之平行光束 L3彎折於γ方向，丁玎尤果藉由調整平行光束：朝Y方向行進之平行光束“。之光路長度（Μ5〜Μό間距離），進行與 18 200927353 掃描機構22間之高度（z方向）調整。進一步藉由調整後述之掃描機構之平面鏡M7(M7a、M7b)位於原點位置（最接近 M6之位置）時之平行光束L4之光路長度（M6〜M7間距離），進行與掃描機構22間之γ方向之調整。接著說明光束截面放大部24(24a、24b)。光束截面放大 # 24，係由使原光束之光束徑放大且使之成為平行光束射出之組合透鏡28構成。能藉由例如凹透鏡與凸透鏡之組合，使之成為經放大之平行光束。又，所放大之光束截面之截面積，係調整為使之較光束整形部21所形成之楕圓光束大。其理由係一般於雷射劃線加工後進行之雷射裂斷加工夺以廣’乏範圍加熱較容易使之裂斷。不過，亦可以與劃線加工時相同之光束點形狀進行裂斷加工。接著說明光束截面切換機構29。光束截面切換機構 29(29a、29b)，係由 2 個反射鏡 Mll(Mlla、Mllb)、 M 12(M12a、Ml 2b)構成’藉由未圖示之驅動機構，使之能 &進出於雷射光束之光路。當成為進入光路上之狀態時，射向光束整形部21之雷射光束之光路即切換為射向光束截面放大部24,使藉由組合透鏡28放大之並行光束之圓形光束前進至光路調整部23。因此，藉由使雷射光束之光路射向光束整形部21或射向光束截面放大部24,楕圓光束之平行光束或已放大之圓形光束之平行光束中之任一個光束即射入於光路調整部 23 ° 其次，說明掃描機構22(22a、22b)。掃描機構22 ,具 200927353 備：軸線朝向Y方向之導軌25(25a、25b);平面鏡M7( M7a、 M7b)，安裝成可藉由未圖示驅動機構沿導軌25移動；導軌 26(26a、26b)，一體固定於平面鏡M7，軸線朝向X方向；平面鏡M8( M8a、M8b)，安裝成可藉由未圖示驅動機構沿導軌26移動；及角度調整用調整具27(27a、27b)，用以調整平面鏡M8相對水平方向之安裝角度（χζ面之安裝角度）。為了說明方便，將導軌25之最接近平面鏡M6之位置設為平面鏡M7之原點位置。平面鏡M7,其角度調整為可在原點位置使來自平面鏡M6之平行光束L4彎折，以將平行光束L5導引至平面鏡M8。此時因平行光束L4係朝Y方向行進且平面鏡M7亦沿導軌25移動於Y方向，故不論平面鏡M7移動至導軌25上之任一位置，平行光束L4均會被平面鏡M7反射而導引至平面鏡M8。於平面鏡M8之前面’在平面鏡M8a與平面鏡M8b之間會產生因平台之有無所導致之差距。上側之平面鏡M8a， φ 係使平行光束L5彎折，而於基板G之面形成光束點BS。此時’由於平行光束L5朝X方向前進且因平面鏡M8亦沿導軌26移動於X方向’因此即使平面鏡Mg移動至導軌26 上之任一位置，平行光束L5均會再平面鏡M8a反射，而於基板G上形成同一形狀之光束點BS。並且所形成之光束點，係形成為長軸經常朝向χ方向之楕圓形狀之光束點。另一方面’下側之平面鏡M8b，在使平面鏡M7b移動至與後述之平台40之槽49面對之位置，在平面鏡M8b反射之平行光束之雷射光束通過槽49而能到達基板背面時， 20 200927353 係於基板G之背面上形成光束點bs。接著，藉由使平面鏡M8朝X方向移動，楕圓形狀之光束點BS即使長軸一邊朝又方向一邊掃描於X方向。其次說明使用調整具27調整光束點BS。光束點BS之形狀，主要係能藉由變更光束整形部21之光學元件之光學吊數來調整，但當改變光束點BS之長軸長度時，係能保持光束整形部21不變，而藉由調整具27來進行。圖4係表不使用調整具27對長軸長度之調整狀態。藉由調整具27 變更平面鏡M8之安裝角度，以調整平行光束[5對基板之射入角，藉此使之傾斜射入至基板上。其結果，能變更光束點BS之長軸長度。因此，能將調整具27當作簡便之光束長度之調整機構利用。 (平台）其次，說明平台40。如圖i所示平台4〇以槽49分割為2個部分平台4〇a、4〇b。圖5⑷係表示部分平台〇亦同）之截面構造的圖。平台40a，係由下列構件構成，即：上面構件41(基板載置面），由多孔構件構成且載置基板 G(參照圖1);本體42,緊貼於上面構件41之周圍，進一步形成底面，於與上面構件41之間形成中間空間4仏；插栓 45 :形成連接於中間空間42a之流路43，連接於外部流路 44;真空泵46，透過流路43、外部流路44使中間空間4。減壓，及空氣源47，透過流路43、外部流路44送加壓空氣至中間空間42a。該等構件中，藉由中間空帛42a、流路43、外部流路 21 200927353 44、真空泵46 ’形成使基板G吸附於上面構件41之吸附機構。又，藉由中間空間42a、流路43、外部流路44、空氣源47 ’形成使基板G懸浮於上面構件41上之懸浮機構。該平台40a(40b) ’藉由以將基板G載置於上面構件上之狀態，啟動真空泵46而打開開閉閥，使中間空間42& 成為減壓狀態’透過多孔質構件之上面構件41吸附基板另一方面，藉由以將基板G載置於上面構件41上之狀態’打開開閉閥從空氣源47吹送空氣，使中間空間42a成 ® 為加壓狀態，透過多孔質構件之上面構件41喷出加壓空氣使基板G懸浮。又，此時藉由後述之基板誘導機構5〇，限制基板G之移動。又，於另一平台40b，安裝用以調整槽的之間隔^ 寬調整機構90(圖υ。槽寬調整機構90，藉由馬達驅動使平台40b滑動於與槽49正交之方向。藉由驅動槽寬調整機構90 ’使之能設定於所欲之槽寬。The fourth parabolic mirror M4, by being arranged in the confocal point F34, when the reflection is made larger than the laser beam in the X direction, i.e., becomes a parallel beam, and proceeds toward the X direction with reference to Fig. 3(d). The beam width of the parallel beam [2 in both directions is larger than that of the original beam L0, and the beam width in the γ direction becomes a laser beam having a rounded cross section having a longer major axis smaller than the original beam. And, the cross-sectional shape shaped by the beam shaping unit 21 is a circle w > the light beam L2 passes through the optical path adjusting portion 23 and the scanning mechanism 22 in the subsequent stage, and the beam spot Bs is formed on the T substrate G. . Therefore, by adjusting the four parabolic mirrors M1 (MU, the number of dots, the beam spot of the desired round shape can be formed), the optical path adjusting unit 23 (23a, coffee) is prepared. The adjustment unit Μ, ^ is not 'constructed by two plane mirrors M5 (M5a, deleted), torn (黯, frame mirror MS system, the parallel beam L2 traveling in the direction of the direction, the parallel beam L3 to travel. The parental L3 singularity mirror M6 is used to adjust the direction of the parallel beam L2 to adjust the direction of the parallel beam L3. The parallel beam L3 traveling in the Z direction is bent in the γ direction. In particular, the height (z direction) adjustment between the parallel beam and the parallel beam of the laser beam traveling in the Y direction (Μ5 to the inter-turn distance) is performed, and the height (z direction) between the scanning mechanism 22 and the 18200927353 is adjusted. When the plane mirror M7 (M7a, M7b) of the scanning mechanism is located at the origin position (the position closest to M6), the optical path length (distance between M6 and M7) of the parallel light beam L4 is adjusted in the gamma direction with the scanning mechanism 22. The beam cross-section amplifying portion 24 (24a, 24b) will be described. The beam cross-section magnification #24 is composed of a combined lens 28 that amplifies the beam diameter of the original beam and causes it to be a parallel beam. This can be achieved, for example, by a combination of a concave lens and a convex lens. Make it A large parallel beam. Further, the cross-sectional area of the enlarged beam section is adjusted to be larger than the round beam formed by the beam shaping section 21. The reason is generally the laser cracking after the laser scribing process The breaking process can be easily broken by heating in a wide range. However, it is also possible to perform the splitting process in the same beam spot shape as in the scribing process. Next, the beam section switching mechanism 29 will be described. The beam section switching mechanism 29 (29a) 29b) is composed of two mirrors M11 (M11a, M11b) and M12 (M12a, Ml 2b). By means of a drive mechanism (not shown), it is possible to enter and exit the optical path of the laser beam. When it is in the state of entering the optical path, the optical path of the laser beam that is incident on the beam shaping unit 21 is switched to the beam section amplifying section 24, and the circular beam of the parallel beam amplified by the combining lens 28 is advanced to the optical path adjusting section. 23. Therefore, by causing the optical path of the laser beam to be directed toward the beam shaping portion 21 or toward the beam section amplifying portion 24, either one of the parallel beam of the round beam or the parallel beam of the amplified circular beam is shot. Into the light path The entire portion is 23 °. Next, the scanning mechanism 22 (22a, 22b) will be described. The scanning mechanism 22 has a 200927353: a guide rail 25 (25a, 25b) whose axis faces the Y direction; and a plane mirror M7 (M7a, M7b) which can be mounted by The drive mechanism (not shown) moves along the guide rail 25; the guide rails 26 (26a, 26b) are integrally fixed to the plane mirror M7, the axis is oriented in the X direction; the plane mirrors M8 (M8a, M8b) are mounted so as to be along the guide rail 26 by a drive mechanism not shown. The movement and the angle adjustment adjustment tool 27 (27a, 27b) are used to adjust the installation angle of the plane mirror M8 with respect to the horizontal direction (the installation angle of the kneading surface). For convenience of explanation, the position of the guide rail 25 closest to the plane mirror M6 is set to the origin position of the plane mirror M7. The plane mirror M7 is angularly adjusted to bend the parallel beam L4 from the plane mirror M6 at the origin position to guide the parallel beam L5 to the plane mirror M8. At this time, since the parallel beam L4 travels in the Y direction and the plane mirror M7 also moves in the Y direction along the guide rail 25, the parallel beam L4 is reflected by the plane mirror M7 and guided to the plane mirror M7 regardless of any position on the rail 25. Flat mirror M8. A difference between the plane mirror M8a and the plane mirror M8b between the plane mirror M8 and the plane mirror M8b may result from the presence or absence of the platform. The upper plane mirror M8a, φ bends the parallel light beam L5 to form a beam spot BS on the surface of the substrate G. At this time, since the parallel beam L5 advances in the X direction and the plane mirror M8 also moves in the X direction along the guide rail 26, even if the plane mirror Mg moves to any position on the guide rail 26, the parallel beam L5 will be reflected by the plane mirror M8a, and A beam spot BS of the same shape is formed on the substrate G. And the beam spot formed is formed as a beam spot whose long axis is often oriented in a circular direction. On the other hand, the lower plane mirror M8b moves the plane mirror M7b to a position facing the groove 49 of the stage 40 to be described later, and the laser beam of the parallel beam reflected by the plane mirror M8b passes through the groove 49 to reach the back surface of the substrate. 20 200927353 A beam spot bs is formed on the back surface of the substrate G. Then, by moving the plane mirror M8 in the X direction, the rounded beam spot BS is scanned in the X direction in the other direction even with the long axis. Next, the adjustment of the beam spot BS using the adjustment tool 27 will be described. The shape of the beam spot BS can be mainly adjusted by changing the optical number of the optical elements of the beam shaping section 21, but when the length of the long axis of the beam spot BS is changed, the beam shaping section 21 can be kept unchanged. This is performed by the adjustment tool 27. Fig. 4 shows the adjustment state of the long axis length without using the adjustment tool 27. The mounting angle of the plane mirror M8 is changed by the adjustment tool 27 to adjust the incident angle of the parallel light beam [5 pairs of the substrate, thereby obliquely incident on the substrate. As a result, the length of the long axis of the beam spot BS can be changed. Therefore, the adjustment tool 27 can be utilized as a simple adjustment mechanism of the beam length. (Platform) Next, the platform 40 is explained. As shown in Figure i, the platform 4 is divided into two partial platforms 4〇a, 4〇b by slots 49. Fig. 5 (4) is a view showing a sectional structure of a part of the platform 亦. The stage 40a is composed of the upper member 41 (substrate mounting surface), and is composed of a porous member and placed on the substrate G (see FIG. 1); the body 42 is closely attached to the periphery of the upper member 41 to further form The bottom surface forms an intermediate space 4仏 with the upper member 41; the plug 45: forms a flow path 43 connected to the intermediate space 42a, and is connected to the external flow path 44; the vacuum pump 46 passes through the flow path 43 and the external flow path 44. Intermediate space 4. The pressure source and the air source 47 are supplied with pressurized air to the intermediate space 42a through the flow path 43 and the external flow path 44. Among these members, an adsorption mechanism for adsorbing the substrate G to the upper member 41 is formed by the intermediate space 42a, the flow path 43, the external flow path 21 200927353 44, and the vacuum pump 46'. Further, a floating mechanism for suspending the substrate G on the upper member 41 is formed by the intermediate space 42a, the flow path 43, the external flow path 44, and the air source 47'. The platform 40a (40b)' activates the vacuum pump 46 to open the opening and closing valve in a state in which the substrate G is placed on the upper member, and the intermediate space 42& is in a reduced pressure state. The substrate is adsorbed through the upper member 41 of the porous member. On the other hand, the air is blown from the air source 47 by opening the on-off valve in a state where the substrate G is placed on the upper member 41, so that the intermediate space 42a is pressurized, and the upper member 41 of the porous member is sprayed. The pressurized air is used to suspend the substrate G. Further, at this time, the movement of the substrate G is restricted by the substrate inducing mechanism 5A which will be described later. Further, on the other platform 40b, a space width adjusting mechanism 90 for adjusting the groove is mounted (Fig. Width. The groove width adjusting mechanism 90 is driven by the motor to slide the platform 40b in a direction orthogonal to the groove 49. The drive slot width adjustment mechanism 90' is configured to be set to the desired slot width.

又，平台不限於2分割，只要適當設定即可。亦可如圖5(b)縱橫4分割。進一步亦可6分割、8分割。人如圃不沿Y方向進行劃線加工時，需要將楕圓光束之長袖方向切換為Υ方南。々向。雖省略詳細說明，但例如可於光路調整部M5(M5a、Μ5μ> μ m M5b)之位置，以能切換之方式安裝組合有平面反射鏡之光學週故..E ± 路，以使長軸方向旋轉。 (基板誘導機構）圖6係表示基板誘導機 5〇，由安裝於方形平台其次，說明基板誘導機構5〇。構50之構造的圖。基板誘導機構 22 200927353 40a、40b之對角角落48a、48b附近之一對 51b構成。可動抵拯部 5 1 a、各可動抵接部51a、51b，具有可藉由未圖八以支轴52a、52b為中心進行並進動作或旋轉^驅動機構臂53a、53b。於多關節臂53a、53b之前端部分，=多關節由未圖示驅動機構進行旋轉動作之金屬製抵=構女裝可藉 54b。抵接構件54a、54b，分別以前端分開於左右2 54a、Further, the platform is not limited to two divisions, and may be appropriately set. It can also be divided into 4 vertically and horizontally as shown in Fig. 5(b). Further, it is also possible to divide by 6 and divide by 8. If a person does not perform the scribing process in the Y direction, it is necessary to switch the long sleeve direction of the round beam to the square. Awkward. Although the detailed description is omitted, for example, the optical path of the planar mirror can be switched between the positions of the optical path adjusting unit M5 (M5a, Μ5μ > μ m M5b). Direction rotation. (Substrate induction mechanism) Fig. 6 shows a substrate induction machine 5A, which is attached to a square platform. Next, the substrate induction mechanism 5A will be described. A diagram of the construction of structure 50. Substrate induction mechanism 22 200927353 40a, 40b is formed by one pair 51b near the diagonal corners 48a, 48b. The movable abutting portion 51a, each of the movable abutting portions 51a and 51b has a parallel movement or rotation mechanism arm 53a, 53b around the support shafts 52a and 52b. In the front end portion of the multi-joint arms 53a and 53b, the multi-joint is made of metal which is rotated by a driving mechanism (not shown). The abutting members 54a, 54b are respectively separated by the front end from the left and right sides 2 54a,

裝’與基G接觸之部位為圓柱形。該圓桂 =式女 Φ吉古心。軸方向係朝因此，欲將基板G移動於X方向、γ方向或旋轉時，係在使空氣源47(圖5)作動以使基板G懸浮之狀態藉由以抵接構件54a、54b㈣基板G，使基板g—邊“ 接觸於抵接構件54a、54b，一邊移動至所欲之位置。進一步進行裂斷處理時，能限制懸浮狀態之基板g之水平移動。又，若使純構件54a、541)停止於所欲位置並停止空氣源 ❹47,再使真空泵46動作，即能將基板g吸附於所欲位置。此外，當所加工之基板之形狀係定型之情形因只要能將基板安裝於定位置即可’故可使未移動之位置固定之抵接構件當作基板之定位用導件安裝於平台上。又在形成有對準標記之基板G之情形，係使用攝影機55a、55b(已預先測量了相對就平台4〇所定義之座標系統之女裝位置），藉由拍攝對準標記，從對準標記之現在位置求出基板G之偏移量，算出移動量，並以基板誘導機構 5〇使之移動，而亦能自動調整基板^之位置。 23 200927353 (起始機構）又，是否要安，例如，能以其次說明初期龜裂形成用之起始機構。裝起始機構係可任意，若不安裝起始機構時雷射剝餘加工代用。如圖1所示，起始機構60由刀輪61、升降機構，多關節臂63構成。多關料63,進行與基板誘導機構 50之夕關節f 53a、53b同樣之動作。刀輪61之刀尖朝向 ❹ ❹ X方向。當形成初期龜裂TR時，係藉由多關節臂63，使刀輪 61來至形成初期龜裂之位置 Μ /± 上万接者，藉由升降機冓，使刀輪61暫時下降而壓接來形成初期龜裂tr。 (控制系統） ^著’說明雷射加卫裝置LM1之控㈣統。圖7係表加工裝置LM1之控制系統的方塊圖。雷射加工裝置 ’係將下列各驅動系統藉由以電腦（cp仍所構成之控制控制，即.吸附/懸浮機構驅動部8丨，驅動平台之構及料機構；基板誘導機構驅動冑82,驅動基板 §〇構5〇之可動抵接部51a、51b;起始機構驅動部83， =起始機構60之升降機構61及多關節臂64;掃描機構〇 13 4使掃描機構22之平面鏡M7、M8移動；雷射驅動部85，照射f封止 )、 '、、别"无束；冷卻嘴驅動部86，當設置冷卻嘴形成追隨光束點+ ^ ‘，Bs之冷卻點時從冷媒嘴進行冷媒之喷霧； , 進仃CCD攝影機55a、55b之攝影；光 β才奐機構驅動部88，係使光路切換；及槽寬調整機 24 200927353 構驅動部89’係調整槽49之寬度。於控制部80’連接鍵盤、入部91，及進行各錄㈣入裝置所構成之輪使必要之訊"ΓΓ示之顯示晝面所構成之顯示部92, 定。^顯不於顯示畫面，且能輸入必要之指示或設 ©The portion where the 'contact' with the base G is cylindrical. The round gui = female Φ Ji ancient heart. Therefore, when the substrate G is to be moved in the X direction, the γ direction, or rotated, the air source 47 (FIG. 5) is actuated to suspend the substrate G by the abutting members 54a, 54b (four) the substrate G. The substrate g-side is moved to the desired position while being in contact with the contact members 54a and 54b. When the cracking process is further performed, the horizontal movement of the substrate g in the suspended state can be restricted. 541) stopping at the desired position and stopping the air source ❹ 47, and then operating the vacuum pump 46, the substrate g can be adsorbed to the desired position. Further, when the shape of the processed substrate is fixed, the substrate can be mounted as long as it can be mounted on the substrate. Therefore, the positioning member can be used as a positioning guide for the substrate to be mounted on the platform. In the case where the substrate G having the alignment mark is formed, the cameras 55a, 55b are used ( The position of the woman's position relative to the coordinate system defined by the platform 4〇 has been measured in advance, and the offset amount of the substrate G is obtained from the current position of the alignment mark by photographing the alignment mark, and the amount of movement is calculated and the substrate is used. Induction mechanism 5〇 It can be moved, and the position of the substrate can be automatically adjusted. 23 200927353 (Starting mechanism) In addition, whether or not it is necessary, for example, can be used to explain the initial mechanism for initial crack formation. If the starting mechanism is not installed, the laser stripping processing is substituted. As shown in Fig. 1, the starting mechanism 60 is composed of a cutter wheel 61, a lifting mechanism, and a multi-joint arm 63. The multi-feed 63 is used to perform the substrate induction mechanism 50. The joints f 53a and 53b are similarly operated. The blade edge of the cutter wheel 61 is oriented in the direction of ❹ ❹ X. When the initial crack TR is formed, the cutter wheel 61 is brought to the initial crack by the multi-joint arm 63. Position Μ / ± tens of thousands of picks, by the lift 冓, the cutter wheel 61 is temporarily lowered and crimped to form the initial crack tr. (Control system) ^ 'Description of the laser Guard LM1 control (four) system. Block diagram of the control system of the 7-series processing device LM1. The laser processing device's drive the following drive systems by using a computer (cp still controls control, that is, the adsorption/suspension mechanism drive unit 8丨, the drive platform Structure and material mechanism; substrate induction mechanism drives 胄82, The driving substrate § 〇〇 5 可 movable abutting portions 51a, 51b; the starting mechanism driving portion 83, = the starting mechanism 60 lifting mechanism 61 and the multi-joint arm 64; the scanning mechanism 〇 13 4 to make the scanning mechanism 22 plane mirror M7 , M8 moves; laser drive unit 85, illuminates f-blocking), ', and 别; no beam; cooling nozzle drive unit 86, when the cooling nozzle is formed to follow the beam point + ^ ', Bs cooling point from the refrigerant The nozzle is sprayed with a refrigerant; the photographing of the CCD cameras 55a and 55b is performed; the light β is driven by the mechanism driving unit 88 to switch the optical path; and the groove width adjusting machine 24 200927353 is configured to adjust the width of the groove 49 . The control unit 80' is connected to the keyboard, the entrance portion 91, and the display unit 92 formed by the display screens of the respective recordings (four) input devices. ^ Cannot display the screen, and can input the necessary instructions or settings ©

其-人，說明雷達加工裝置LM1之在此處說明對刻右料、* μ 孓的加工動作例。行劃線加貼合玻璃基板G兩面同時進之情形。、後就各單面逐-進行雷射照射之裂斷加工為了使說明易於理解，設分割方向為玻璃基板之向’於以對準標記進行定砗仃疋位時X方向係一致於雷射掃描光予系統之X方向。圖8係表示動作例之流程圖。將玻璃基板G載置於平台40上後，首先，使用基板誘導機構50進打基板G之定位（sl〇1)。定位係藉由攝影機 55a、55b檢測出基板G之對準標記，以求出位置偏移量。接著，驅動可動抵接部51a、51b，使抵接構件54&、5扑接近於基板G之基板側面。同時使懸浮機構作動，使基板g 從平台面懸浮。此時玻璃基板G係於與抵接構件5钧、5仆之接點（4處）被限制移動。接著’驅動可動抵接部5ia、5ib，使基板G移動（並進、旋轉）於水平方向，於位置偏移量為零之位置使之停止。然後藉由停止懸浮機構，使吸附機構作動’固定基板G於平台面。其結果，以基板g之X方向一 25 200927353 致於雷射掃描光學系統之乂方向之狀態結束定位。接著，驅動起始機構6〇,於基板G之劃線開始位置作成初期龜裂TR(S102)。接著，驅動掃描機構部22調整平面鏡M7(M7a、M7b)、 M8(M8a、M8b)之位置’使光束點BS來至基板〇之劃線開始位置之外側。然後藉由光束整形部2丨一邊照射經整形之楕圓形之雷射光束一邊使平面鏡M8(M8a、M8b)朝χ方向移動（掃描），以於玻璃基板之乂方向進行劃線加工（sl〇3)。 ® (當使用形成有複數個χ方向之槽之平台之情形，在重複劃線複數次時，係交替進行平面鏡M7(M7a、γ 方向之移動（雷射停止），與平面鏡M8(M8a、M8b)之X方向之移動（掃描）（雷射照射）。結束劃線加工後，使吸附機構停止，使懸浮機構動作而使基板G懸浮（S104)。此時藉由可動抵接部51a、51b限制基板G之水平方向之移動。 g 接著，僅使上側之雷射光源l〇a振盪，使光束截面切換機構29a作動’以使光束截面放大部24a所形成之放大光束掃描於基板之上面側（表面側），藉以對上面侧進行裂斷加工 (S105)。此時因以使基板懸浮之狀態進行裂斷加工，故貼合基板之上面側可簡單地被分割。接著，僅使下側之雷射光源1 Ob振盪，使光束截面切換機構29b作動，以使光束截面放大部24b所形成之放大光束掃描於基板之下面侧（背面側），藉以對下面侧進行裂斷加工（S 106)。此時亦因以使基板懸浮之狀態進行裂斷加工， 26 200927353 故貼合基板之下面側可簡單地被斷開。藉由以上之動作，完成玻璃基板G之X方向之分割加工。 (動作例2) 其次，說明將方形之貼合玻璃基板G，朝彼此正交之X 方向與y方向之二方向加工（交叉分割）時之雷達加工裝置 LM1之典型的加工動作例。在此情形藉由使用基板誘導機構50使基板旋轉90度，進杆-方— 及進订一方向之加工。圖9係〇動作例的流程圖。此處’說明先進行複數條數吸双俅數之X方向之兩面同時劃線加工，及複數條勒·夕t 數條數之y方向之兩面同時雷射劃線加工， :後’對y方向各單面分別進行雷射照射之裂斷加工之情形。又，因藉由V方白之裂斷加工會使破璃基板G變成帶狀，故對其後要進行之方方向之裂斷加工，係藉由本裝置以外之裂斷裝置進行裂齡^ 本衣直 $仃裂斷加工。χ，為了說明之方便最初劃線加工之方向為玻斑其 οχ 口馮玻璃基板〇之χ方向。又，加工裝置LM1之控制部8() 於雷射士二 ^ °叹定Χ方向之加工條數’與y 方向之加工條數，依各次加工計算加工條數。將基板G固定於拓r少斜淮挪a 、口之加工區域上（s2〇l)。使用基板G之對準己、攝影撼 H始r 先機55a、55b、與基板誘導機構50， =板G之x方向與平台4Q之χ方向之方向調整。 a d sX方向之劃線預定線進行兩面割線加工（S202)。進行弋位使最初之加工位置來始機摄6““ 采至槽49上後’吸附基板G。使起 22 =面Γ形成初期森裂TR，接著驅動掃描機構部調整千面鏡，7a、M7b)、M8(M8a、娜）之位置， 27 200927353 使光束點BS位於基板G之劃線開始位置外側。然後，一邊藉由光束整形部21照射己整形為楕圓形之雷射光束，一邊使平面鏡M8(M8a、M8b)朝X方向移動（掃描），藉以於基板 G之X方向進行兩面劃線加工。接著，判定X方向之複數條數之兩面劃線加工是否全部結束（S203)。若尚未全部結束時即進至S2〇4，若全部結束時則為了要移至y方向之劃線加工，而進至S2〇6。 ❹ ❿ S203中，若尚未完成χ方向之兩面劃線加工時係使基板懸浮（S204)，且使用基板誘導機構5〇將基板g之位置朝平台40之Υ方向位移，以使下一加工位置來至槽49上 (S205)。然後回到_，對下—加工位置，重複同樣之兩面劃線加工。以後’重複同樣之加工直到對所有之χ方向之加工完成為止。 S203中’若χ方向之兩面劃線加工已全部完成時，即使基板懸浮（S206)，並使用基板誘導機構5()旋轉列度，使基板G之y方向朝向槽49。藉此使基板〇之丫方向固定於平台40之加工區域上（S2〇7)。使用基板g之對準標記、攝影機…、別、與基板誘導機構50,進行基板〇之y方向與平台40之X方向之方向調整。接者’ Ά基板G之y方而夕倉丨丨括士 & y万向之劃線預定線，進行兩面劃線加工（S208)。進行定位传古、 1便y方向之最初之加工位置來至槽 49上後，吸附基板G〇传也使起始機構60作動以形成初期龜裂，接著驅動掃描機構部22，嘴軟正&雄 '22調整平面鏡M7(M7a、M7b)、 M8(M8a、M8b)之位置，使災尤果點BS位於基板G之劃線開 28 200927353The person-to-person describes the radar processing apparatus LM1. Here, an example of the processing operation for the right-hand material and *μ 孓 will be described. The line is scribed and the two sides of the glass substrate G are simultaneously joined. After that, the single-sided laser beam is processed in a single-shot manner. In order to make the description easy to understand, the direction of the glass substrate is set to 'the direction of the glass substrate. The X direction is consistent with the laser when the alignment mark is used. Scan the light to the X direction of the system. Fig. 8 is a flow chart showing an example of the operation. After the glass substrate G is placed on the stage 40, first, the positioning of the substrate G (s1〇) is performed using the substrate guiding mechanism 50. The positioning system detects the alignment marks of the substrate G by the cameras 55a and 55b to obtain the positional shift amount. Next, the movable abutting portions 51a and 51b are driven to bring the abutting members 54&5 to the side surface of the substrate of the substrate G. At the same time, the suspension mechanism is actuated to suspend the substrate g from the deck surface. At this time, the glass substrate G is restricted from moving at the contact point (four places) with the contact members 5, 5, and 5. Then, the movable abutting portions 5ia and 5ib are driven to move (join and rotate) the substrate G in the horizontal direction, and stop at a position where the positional shift amount is zero. Then, by stopping the suspension mechanism, the adsorption mechanism is actuated to "fix the substrate G to the land surface. As a result, the position is terminated in the state in which the laser scanning optical system is in the x direction from the X direction of the substrate g to 25 200927353. Next, the start mechanism 6 is driven to form an initial crack TR at the start position of the scribe line of the substrate G (S102). Next, the scanning scanning mechanism unit 22 adjusts the position of the plane mirrors M7 (M7a, M7b) and M8 (M8a, M8b) so that the beam spot BS comes to the outside of the scribe start position of the substrate 〇. Then, the plane mirror M8 (M8a, M8b) is moved (scanned) in the x direction by the beam shaping unit 2 while irradiating the shaped circular laser beam, so as to perform the scribing process in the direction of the glass substrate (sl) 〇 3). ® (When a platform with a plurality of grooves in the direction of the χ is used, the plane mirror M7 is alternately performed in the case of repeated scribing multiple times (M7a, γ direction movement (laser stop), and plane mirror M8 (M8a, M8b) Movement (scanning) in the X direction (laser irradiation). After the end of the scribing process, the suction mechanism is stopped, and the suspension mechanism is operated to suspend the substrate G (S104). At this time, the movable abutting portions 51a, 51b are used. The movement of the substrate G in the horizontal direction is restricted. g Next, only the upper laser light source 10a is oscillated, and the beam section switching mechanism 29a is actuated to scan the enlarged beam formed by the beam section amplifying portion 24a on the upper surface of the substrate. (surface side), the upper side is subjected to a cleavage process (S105). At this time, since the substrate is suspended in a state of being suspended, the upper surface side of the bonded substrate can be easily divided. The laser light source 1 Ob oscillates, and the beam section switching mechanism 29b is actuated so that the amplified beam formed by the beam section amplifying portion 24b is scanned on the lower surface side (back side) of the substrate, thereby cutting the lower side. (S106) At this time, since the substrate is suspended in a state of being suspended, 26 200927353, the lower surface of the bonded substrate can be easily broken. By the above operation, the X direction of the glass substrate G is completed. (Operation example 2) Next, a typical processing operation example of the radar processing apparatus LM1 when the square bonded glass substrate G is processed (cross-divided) in the X direction and the y direction orthogonal to each other will be described. In this case, the substrate is rotated by 90 degrees using the substrate inducing mechanism 50, and the processing is performed in the direction of the rod-square-and the ordering. Figure 9 is a flowchart of the operation example of the system. Both sides of the X-direction of the double-turn number are simultaneously scribing, and the two sides of the y-direction of the number of the number of the plurality of sings are simultaneously laser-scored, and the laser is irradiated to each of the y-directions. In the case of cracking, the glass substrate G is changed into a strip shape by the cracking of the V square, so the cracking process in the direction to be performed later is broken by the device. The device is cracked and the body is straight. χ 为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了为了冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯冯The number of processed strips is the number of processed strips in the y direction, and the number of processed strips is calculated according to each processing. The substrate G is fixed on the processing area of the opening and the oblique processing area (s2〇l). Align, photograph 撼H start r first machine 55a, 55b, and substrate induction mechanism 50, = direction of the x direction of the plate G and the direction of the plane 4Q. Ad sX direction scribe line to perform double secant processing ( S202). Perform the clamping to make the initial processing position to take 6" "taken onto the groove 49" and then adsorb the substrate G. Let 22 = face Γ form the initial crack TR, then drive the scanning mechanism to adjust the position of the mirror, 7a, M7b), M8 (M8a, 娜), 27 200927353 Let the beam spot BS be at the start of the scribe line of the substrate G Outside. Then, while the beam shaping unit 21 irradiates the laser beam that has been shaped into a circular shape, the plane mirror M8 (M8a, M8b) is moved (scanned) in the X direction, thereby performing double-sided scribing processing in the X direction of the substrate G. . Next, it is determined whether or not the double-sided scribing processing of the plurality of plural numbers in the X direction is completed (S203). If it has not been completed, it will advance to S2〇4. If it is finished, it will move to the s-direction slash processing and proceed to S2〇6. In S203, if the two-sided scribing process in the x direction is not completed, the substrate is suspended (S204), and the substrate inducing mechanism 5 is used to displace the position of the substrate g in the direction of the land 40 so as to make the next processing position. It comes to the slot 49 (S205). Then go back to _, repeat the same two-sided line processing for the lower-machining position. In the future, the same processing is repeated until the processing of all the directions is completed. In S203, when the double-sided scribe line processing has been completed, the substrate is suspended (S206), and the substrate induction mechanism 5 () is rotated by the column degree so that the y direction of the substrate G faces the groove 49. Thereby, the direction of the substrate 〇 is fixed to the processing area of the stage 40 (S2〇7). The y direction of the substrate 与 and the direction of the X direction of the stage 40 are adjusted using the alignment marks of the substrate g, the camera, and the substrate induction mechanism 50. The picker Ά y Ά Ά Ά Ά 夕夕 & & & & & & & & 万万万万万万万万万万万万万万万万万万万万万万万After the positioning and transmission, the first processing position in the y direction is applied to the groove 49, the adsorption substrate G is also driven to activate the starting mechanism 60 to form an initial crack, and then the scanning mechanism portion 22 is driven to soften the mouth & The male '22 adjusts the position of the plane mirrors M7 (M7a, M7b) and M8 (M8a, M8b), so that the disaster point GO is located on the base plate G. 28 200927353

、°卜侧然後’-邊藉由以光束整形部21照射已整形為楕圓形之雷射光束邊使平面鏡Μ8(跑、麵）朝X 方向移峨描)，藉以於基板G之y方向進行兩面劃線加工。判疋y方向之複數條之兩面劃線加工是否全部完成 (S2〇9)若y方向之全劃線尚未結束時即進至S210，若全劃線結束時則為了要移至丫方向之裂斷加工，而進至S212。 ❹ S2〇9中，若y方向之兩面劃線加工尚未完成時係使基板慾浮（S210)，且使用基板誘導機構5〇將基板G之位置朝平台之γ方向位移，以使下一加工位置來至槽49上 (S21 1)。然後回到S2〇8，對下一加工位置，重複同樣之兩面劃線加工。以後，重複同樣之加工直到完成全部之丫方向力σ工。 S209中，若y方向之全部之兩面劃線加工已完成時，即使基板懸浮（S212)，並使用基板誘導機構5〇，形成於基板G之複數條劃線中，將最近進行裂斷加工之位置，朝向平台40之槽49之方向，定位（S213)。接著’僅使上側之雷射光源1 〇a振遭，使光束截面切換機構29 a作動’以使光束截面放大部24a所形成之放大光束掃描於基板之上面侧（表面侧），藉以對上面侧進行裂斷加工 (S214)。此時因以使基板懸浮之狀態進行裂斷加工，故貼合基板之上面側可簡單地被斷開。接著’僅使下侧之雷射光源10 b振盘，使光束截面切換機構29b作動，以使光束截面放大部24b所形成之放大光束，掃描於基板之下面側（背面側），藉以對下面侧進行裂 29 200927353 斷加工（S21 5)。此時亦因以使基板懸浮之狀態進行裂斷加工，故貼合基板之下面側可簡單地被斷開。藉由以上之動作，完成玻璃基板Giy方向之最初1 條裂斷加工。接著，判定y方向之複數條之裂斷加工是否全部完成 (S216) $ 丫方向之全裂斷尚未完成時使基板懸浮（j§ 217)，並使用基板誘導機構50將基板G之位置朝平台之γ方向位移，以使下一加工位置來至槽49上（S218)。然後，回到〇 S213,對下一加工位置’以同樣之步驟重複上面裂斷加工、下面兩面裂斷加工。以後，重複同樣之加工直到完成全部之y方向裂斷加工。於S216，當判定丫方向之全裂斷已完成時，即結束本裝置之裂斷加工。其結果’可獲得斷開成帶狀之基板，藉由使該等帶狀之基板移動至另外之裂斷裝置’藉由適當分割，完成裂斷。 ^ 自上述可知，能簡單地進行劃線加工至裂斷加工為止之作業’且藉由懸浮狀態之裂斷加工能實現更確實之分割。本發明，能利用於藉由雷射照射進行劃線加工或裂斷加工之雷射加工裝置。【圖式簡單說明】圖1係本發明之一實施形態之雷射加工裝置LM1的整體構成圖。圖2係表示圖1之雷射加工裝置LM1之截面構成的示 200927353 意圖。圖3係表示射出楕圓形之平行光束之光束整形部之構成例的圖。圖4係表示楕圓形之光束點之長轴長度之調整方法的圖。圖5係表示平台之截面構造的圖。圖6係表示基板誘導機構之構成的圖。圖7係表示圖1之雷射加工裝置LM1之控制系統的方〇塊圖。圖8係表示圖i之雷射加工裝置LM1之動作例的流程圖。圖9係表示圖丨之雷射加工裝置LM1之另一動作例的流程圖。圖10係表示習知雷射加工裝置（裂痕形成裝置）之一例的圖。 β 圖11係表示圖10之雷射加工裝置之控制系統的圖。【主要元件符號說明】 10a ' 10b 雷射光源 20a ' 20b 雷射掃描光學系統 21a、21b 光束整形部 22a、22b 掃描機構部 23a、23b 光路調整部 24a、24b 光束截面放大部 31 200927353 29a、29b 光束截面切換機構 40 平台 40a、40b 部分平台 41 上部構件（多孔質構件） 46 真空泵 47 空氣源 49 槽 50 基板誘導機構Then, the side of the side of the substrate G is y-direction by irradiating the plane beam 8 (running, face) in the X direction with the beam shaping portion 21 irradiating the laser beam that has been shaped into a circular shape. Perform double-sided scribing. It is determined whether the two-sided scribe line processing of the plurality of y directions is completed (S2 〇 9). If the full scribe line in the y direction has not been completed, the process proceeds to S210, and if the full scribe line ends, the hole is moved to the 丫 direction. The machining is interrupted, and the process proceeds to S212. ❹ In S2〇9, if the two-sided scribe line processing in the y direction is not completed, the substrate is caused to float (S210), and the substrate induction mechanism 5 位移 is used to shift the position of the substrate G toward the γ direction of the land to make the next processing. The position comes to the slot 49 (S21 1). Then return to S2〇8 and repeat the same two-sided line processing for the next machining position. In the future, the same processing is repeated until all the directions are completed. In S209, when all the double-sided scribe lines in the y direction have been completed, even if the substrate is suspended (S212), and the substrate inducing mechanism 5 is used, it is formed in a plurality of scribe lines of the substrate G, and the cracking process is recently performed. The position is oriented in the direction of the slot 49 of the platform 40 (S213). Then, only the upper laser light source 1 〇a is excited, and the beam section switching mechanism 29a is activated to scan the enlarged beam formed by the beam section amplifying portion 24a on the upper surface side (surface side) of the substrate, thereby The side is subjected to a splitting process (S214). At this time, since the substrate is suspended in a state in which the substrate is suspended, the upper surface side of the bonded substrate can be easily broken. Then, only the lower laser light source 10b is oscillated, and the beam section switching mechanism 29b is actuated so that the amplified beam formed by the beam section amplifying portion 24b is scanned on the lower surface side (back side) of the substrate, thereby Side cracking 29 200927353 Broken processing (S21 5). At this time, since the substrate is suspended in a state in which the substrate is suspended, the lower surface of the bonded substrate can be easily disconnected. By the above operation, the first cracking process in the Giy direction of the glass substrate is completed. Next, it is determined whether or not the splitting process of the plurality of strips in the y direction is completed (S216). The substrate is suspended when the full crack in the 丫 direction is not completed (j§ 217), and the substrate G is placed toward the platform using the substrate inducing mechanism 50. The gamma direction is displaced so that the next processing position comes to the groove 49 (S218). Then, returning to 〇S213, the above-mentioned splitting process and the following two-side splitting process are repeated for the next processing position' in the same step. Thereafter, the same processing is repeated until all the y-direction splitting processes are completed. At S216, when it is determined that the full splitting of the 丫 direction has been completed, the rupture processing of the apparatus is terminated. As a result, it is possible to obtain a substrate which is broken into a strip shape, and by performing the division by appropriately moving the strip-shaped substrate to another slitting device, the crack is completed. ^ As can be seen from the above, it is possible to easily carry out the work until the slashing process to the rupture process, and the rupture process in the suspended state can achieve more accurate division. The present invention can be utilized in a laser processing apparatus that performs scribing or cracking processing by laser irradiation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the entire configuration of a laser processing apparatus LM1 according to an embodiment of the present invention. Fig. 2 is a view showing the cross-sectional configuration of the laser processing apparatus LM1 of Fig. 1 200927353. Fig. 3 is a view showing an example of a configuration of a beam shaping portion that emits a parallel beam of a circular circle. Fig. 4 is a view showing a method of adjusting the length of the major axis of the beam point of the 楕 circle. Fig. 5 is a view showing a sectional structure of the platform. Fig. 6 is a view showing the configuration of a substrate inducing mechanism. Fig. 7 is a block diagram showing a control system of the laser processing apparatus LM1 of Fig. 1. Fig. 8 is a flow chart showing an operation example of the laser processing apparatus LM1 of Fig. i. Fig. 9 is a flow chart showing another example of the operation of the laser processing apparatus LM1 of the drawing. Fig. 10 is a view showing an example of a conventional laser processing apparatus (crack forming apparatus). β Fig. 11 is a view showing a control system of the laser processing apparatus of Fig. 10. [Description of main component symbols] 10a ' 10b Laser light source 20a ' 20b Laser scanning optical systems 21a and 21b Beam shaping sections 22a and 22b Scanning mechanism sections 23a and 23b Optical path adjusting sections 24a and 24b Beam section amplifying section 31 200927353 29a, 29b Beam section switching mechanism 40 Platform 40a, 40b Part of platform 41 Upper member (porous member) 46 Vacuum pump 47 Air source 49 Slot 50 Substrate induction mechanism

51a、51b 可動抵接部 54a > 54b 抵接構件 55a ' 55b 攝影機51a, 51b movable abutting portion 54a > 54b abutting member 55a ' 55b camera

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Claims

200927353 X. Applying for patents: 1. A laser processing device for scanning a laser beam on both sides of a substrate composed of a brittle material for processing, characterized in that: the first beam scanning optical system is The laser beam emitted from the laser source is shaped into a first beam composed of parallel beams and guided to the surface side of the substrate for scanning; the first beam scanning optical system is configured to shape the laser beam emitted from the laser source into parallel a second light beam formed by the light beam is guided to the back side of the substrate for scanning; and a platform having a substrate mounting surface, the substrate mounting surface being divided by a groove for guiding the second light beam to the optical path of the back surface of the substrate; a suspension mechanism formed of a porous member and blowing a gas through the porous member to the substrate to suspend the substrate is provided on the substrate mounting surface; further, an abutting portion is provided to abut the substrate side of the suspended substrate To limit the movement of the substrate in the horizontal direction. 2. The laser processing apparatus of claim 1, wherein the platform further comprises an adsorption mechanism for adsorbing the substrate through the porous member. The laser processing apparatus of claim 1, wherein the first beam scanning optical system and the second beam scanning optical system respectively have a beam section switching mechanism that switches the beam section to a carrier surface For the groove circle, use + row light [or any of the parallel beams with a cross-sectional area larger than the parallel beam of the scribe line. 4. The laser processing apparatus according to claim 1, wherein the substrate inducing mechanism for inducing the substrate of the substrate is induced by horizontally moving the abutting portion to push the side surface of the substrate in a horizontal direction. 5. The laser processing apparatus according to claim 1, wherein the apparatus has a groove width adjusting mechanism for adjusting a width of the groove. Eleven, circle: as the next page

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